Solvent composition and its use

Abstract

The present invention provides: a solvent composition which exerts no adverse influence on the global environment, exerts little influence on resinous materials, has sufficient dryability, and has excellent solubility in oils, fats, etc.; a method for cleaning an article using the solvent composition; a method for producing a coated article; a heat transfer medium comprising the solvent composition; and a thermal cycle system employing the heat transfer medium.　The solvent composition is characterized by comprising 1-chloro-2,3,3-trifluoro-1-propene and at least one hydrofluoroether selected from the group consisting of nonafluorobutoxymethane and nonafluorobutoxyethane, the proportion of the 1-chloro-2,3,3-trifluoro-1-propene being 25-75 mass% with respect to the total amount of the 1-chloro-2,3,3-trifluoro-1-propene and the hydrofluoroether, the total content of the 1-chloro-2,3,3-trifluoro-1-propene and the hydrofluoroether being 70 mass% or higher.

Description

[Technical field]

[0001] The present invention relates to a solvent composition and its use. [Background technology]

[0002] Conventionally, hydrofluorochlorocarbons (hereinafter referred to as HCFCs), which are non-flammable, low-toxicity, and stable, have been used as dilution solvents for cleaning oil stains, flux cleaning, dust cleaning, moisture removal solvents, dry cleaning solvents, reaction solvents, lubricants, etc. However, because HCFCs have a negative impact on the ozone layer, the production of HCFCs is scheduled to be completely phased out in developed countries by 2020. Perfluorocarbons (hereinafter also referred to as PFCs), hydrofluorocarbons (hereinafter also referred to as HFCs), hydrofluoroethers (hereinafter also referred to as HFEs), and the like are known as solvents that do not adversely affect the ozone layer. However, because of their high global warming potential, HFCs and PFCs are subject to regulation under the Kyoto Protocol. In addition, compared to HCFCs, they have low solubility in oils, so the scope of application of HFCs, HFEs and PFCs is limited.

[0003] 1-Chloro-2,3,3-trifluoro-1-propene (hereinafter, also referred to as HCFO-1233yd) has been proposed as a solvent that does not adversely affect the global environment and has solubility equivalent to that of HCFCs (Patent Documents 1 and 2). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Special Publication No. 2013-504658 [Patent Document 2] Special Publication No. 2013-506731 Summary of the Invention [Problem to be solved by the invention]

[0005] The HCFO-1233yd has a chlorine atom in the molecule, and therefore has the ability to be used as a cleaning agent for oil stains. However, when the HCFO-1233yd alone comes into contact with a resin material, it may affect the resin material, such as causing whitening or cracking of the resin material, or dissolving the resin. Therefore, when cleaning parts containing such resin materials, or when applying a lubricant or the like to parts containing resin materials, there is a problem that the HCFO-1233yd is difficult to use. In order to overcome the above-mentioned problems, a method of adding a chlorine-free fluorine-based solvent such as HFC or HFE has been known, as in Patent Document 1. However, there is a problem in that the solubility of the processing oil decreases when HFC or HFE is added.

[0006] For these reasons, no solvent composition has been found that satisfies the following three conditions: (1) It reduces the effect on resin materials, (2) It has the same solubility as when HCFO-1233yd is used alone, and (3) It has an azeotropic or near-azeotropic composition.

[0007] The present invention aims to provide a solvent composition which does not adversely affect the global environment, has a small effect on resin materials, has sufficient volatility, and has excellent solubility in oils and the like, a cleaning agent, a composition for forming a coating film, an aerosol composition, a method for cleaning an article using the solvent composition, a method for producing a substrate with a coating film, a heat transfer medium containing the solvent composition, and a heat cycle system using the heat transfer medium. [Means for solving the problem]

[0008] The present invention provides a solvent composition having the following configuration and uses thereof. [1] A composition comprising 1-chloro-2,3,3-trifluoro-1-propene and at least one hydrofluoroether selected from the group consisting of nonafluorobutoxymethane and nonafluorobutoxyethane; The ratio of 1-chloro-2,3,3-trifluoro-1-propene to the total amount of 1-chloro-2,3,3-trifluoro-1-propene and the hydrofluoroether is 25 to 75 mass%, The total content of 1-chloro-2,3,3-trifluoro-1-propene and the hydrofluoroether is 70% by mass or more; A solvent composition comprising: [2] The solvent composition according to [1], wherein the total content of the 1-chloro-2,3,3-trifluoro-1-propene and the hydrofluoroether is 90 mass% or more. [3] The solvent composition according to [1] or [2], wherein the 1-chloro-2,3,3-trifluoro-1-propene is at least one selected from the group consisting of Z isomers and E isomers. [4] The solvent composition according to [3], wherein 1-chloro-2,3,3-trifluoro-1-propene contains Z isomer in an amount of 50 mass% or more. [5] The nonafluorobutoxymethane is at least one member selected from the group consisting of 1-methoxy-2-trifluoromethyl-1,1,2,3,3,3-hexafluoropropane and 1-methoxy-1,1,2,2,3,3,4,4,4-nonafluorobutane; The solvent composition according to any one of [1] to [4], wherein the nonafluorobutoxyethane is at least one selected from the group consisting of 1-ethoxy-2-trifluoromethyl-1,1,2,3,3,3-hexafluoropropane and 1-ethoxy-1,1,2,2,3,3,4,4,4-nonafluorobutane. [6] The solvent composition according to any one of [1] to [5], further comprising a stabilizer that suppresses decomposition of 1-chloro-2,3,3-trifluoro-1-propene. [7] The solvent composition according to [6], wherein the content of the stabilizer is 1 ppm by mass to 5% by mass based on the total amount of 1-chloro-2,3,3-trifluoro-1-propene. [8] A cleaning agent comprising the solvent composition according to any one of [1] to [7]. [9] A cleaning method comprising contacting an article with the solvent composition according to any one of [1] to [7] above, thereby removing dirt adhering to the surface of the article.

[10] The cleaning method according to [9], wherein at least a part of the material of the article surface that comes into contact with the solvent composition is a resin material.

[11] A coating forming composition comprising a nonvolatile organic compound and the solvent composition according to any one of [1] to [7].

[12] A method for producing a substrate with a coating film, comprising applying the coating film-forming composition according to

[11] to a surface of a substrate, and then evaporating the solvent composition to form a coating film containing the non-volatile organic compound.

[13] The method for producing a substrate having a coating film according to

[12] , wherein the material of at least a part of the substrate surface that comes into contact with the solvent composition is a resin material.

[14] An aerosol composition comprising a solute, a propellant, and the solvent composition according to any one of [1] to [7].

[15] A heat transfer medium for a heat cycle system, comprising the solvent composition according to any one of [1] to [7]. Effect of the Invention

[0009] The solvent composition of the present invention does not adversely affect the global environment, has a reduced effect on resin materials, has sufficient volatility, and is excellent in solubility of hydrophobic solutes such as oils. The method for cleaning an article of the present invention has no adverse effect on the global environment, reduces the impact on resin materials, and can clean dirt adhering to articles. According to the method for producing a coated article of the present invention, a coated article can be produced without adversely affecting the global environment and with reduced impact on the article. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] (Solvent composition) The solvent composition of the present invention contains HCFO-1233yd and at least one HFE selected from the group consisting of nonafluorobutoxymethane (C4F9OCH3, hereinafter also referred to as HFE-449s1) and nonafluorobutoxyethane (C4F9OC2H5, hereinafter also referred to as HFE-569sf). Hereinafter, the specific HFE is also referred to as HFE(A). In the solvent composition of the present invention, the content ratio of HCFO-1233yd to the total amount of HCFO-1233yd and HFE(A) is 25-75 mass%, and the total amount of HCFO-1233yd and HFE(A) to the solvent composition of the present invention is 70 mass% or more. From the viewpoint of the solubility of the solute, the total amount of HCFO-1233yd and HFE(A) in the solvent composition is preferably 90 mass% or more to the total amount of the solvent composition. Furthermore, in the solvent composition of the present invention, the composition ratio of the solvent composition is optimized to reduce the influence on the resin material described below.

[0011] In the solvent composition of the present invention, within the range of 25 to 75 mass% of HCFO-1233yd relative to the total amount of HCFO-1233yd and HFE(A), the mass ratio of HCFO-1233yd to HFE(A) is preferably a mass ratio that forms a pseudo-azeotrope, and more preferably a mass ratio that forms an azeotrope, in terms of there being no compositional change during use and of ease of reuse of the solvent composition. In the present invention, the pseudo-azeotropic mixture refers to a mixture having a relative volatility of 0.5 to 2, as described below, and the azeotropic mixture refers to a mixture having a relative volatility of 1. The relative volatility of a mixture of HCFO-1233yd and HFE(A) varies depending on the type and composition (for example, stereoisomer ratio or structural isomer ratio) of each of the two. However, many mixtures in which the HCFO-1233yd content is in the range of 25 to 75 mass% relative to the total amount of HCFO-1233yd and HFE(A) are pseudo-azeotropic mixtures, and may also be azeotropic mixtures.

[0012] (HCFO-1233yd) HCFO-1233yd is an olefin with double bonds between carbon atoms, which means it has a short atmospheric lifetime and low ozone depletion potential and global warming potential. It is known that HCFO-1233yd has stereoisomers, and the boiling point of the Z isomer of HCFO-1233yd (hereinafter also referred to as HCFO-1233yd(Z)) is 54°C, and the boiling point of the E isomer of HCFO-1233yd (hereinafter also referred to as HCFO-1233yd(E)) is 46°C. HCFO-1233yd(Z), HCFO-1233yd(E) and their mixtures (usually with a high proportion of HCFO-1233yd(Z)) can be obtained by known production methods, and the two can be separated by distillation. The HCFO-1233yd contained in the solvent composition of the present invention may be only one of the two isomers, but in consideration of productivity, it is preferable that the isomer mixture has a high proportion of HCFO-1233yd(Z). In the isomer mixture contained in the solvent composition of the present invention, the content of HCFO-1233yd(Z) is preferably 50% by mass or more, more preferably 75 to 98% by mass, and particularly preferably 90 to 98% by mass. Since HCFO-1233yd has the above boiling point, it has excellent volatility and is easy to handle. HCFO-1233yd does not have a flash point. HCFO-1233yd has low surface tension and viscosity and evaporates easily even at room temperature. HCFO-1233yd is excellent for cleaning and removing processing oil, fluorine oil, silicone oil, synthetic oil, release agent, dust, etc., and also has excellent solubility for lubricants such as fluorine oil and silicone oil.

[0013] As described above, HCFO-1233yd has excellent solubility for various hydrophobic solutes and has sufficient performance as a diluting solvent for cleaning agents and lubricants. In addition, HCFO-1233yd has a boiling point suitable for a solvent, making it easy to handle when in use, and it does not volatilize when used at room temperature, allowing it to be recovered and reused, thereby reducing costs.

[0014] HCFO-1233yd can be produced, for example, by subjecting 1-chloro-2,2,3,3-tetrafluoropropane (CHF2-CF2-CHFCl; hereinafter, also referred to as HCFC-244ca), which is industrially and stably available, to a dehydrofluorination reaction at a temperature of 50 to 80°C using potassium hydroxide or sodium hydroxide as a reactant.

[0015] On the other hand, HCFO-1233yd is not stable enough, and when HCFO-1233yd is stored at room temperature and pressure, it decomposes within a few days and generates chloride ions. Therefore, the solvent composition of the present invention preferably contains a stabilizer that suppresses the decomposition of HCFO-1233yd together with the HCFO-1233yd. As the stabilizer, nitro compounds, amines, phenols, benzotriazoles, epoxide compounds, and hydrocarbons are preferable. By containing such a stabilizer in the solvent composition of the present invention, the solvent composition can be used without decomposition even under harsh conditions such as heating conditions. As the stabilizer, one type may be used, or two or more types may be used. When the solvent composition of the present invention contains such a stabilizer, the amount of the stabilizer is preferably 1 mass ppm or more, more preferably 3 mass ppm or more, and particularly preferably 5 mass ppm or more, based on the total amount of HCFO-1233yd in the solvent composition. The upper limit of the amount of the stabilizer is preferably 5 mass%, and particularly preferably 1 mass%.

[0016] Examples of the stabilizer include nitro compounds such as nitromethane, nitroethane, nitropropane, and nitrobenzene; amines such as diethylamine, triethylamine, isopropylamine, diisopropylamine, butylamine, isobutylamine, tert-butylamine, α-picoline, N-methylbenzylamine, diallylamine, N-methylmorpholine, and N-methylpyrrole; phenol, o-cresol, m-cresol, p-cresol, thymol, p-tert-butylphenol, tert-butylcatechol, catechol, isoeugenol, o-methoxyphenol, 4,4'-dihydroxyphenyl-2,2-propane, isoamyl salicylate, benzyl salicylate, methyl salicylate, Examples of the epoxy compounds include phenols such as 2,6-di-t-butyl-p-cresol, benzotriazoles such as 2-(2'-hydroxy-5'-methylphenyl)benzotriazole, 2-(2'-hydroxy-3'-t-butyl-5'-methylphenyl)-5-chlorobenzotriazole, 1,2,3-benzotriazole, and 1-[(N,N-bis-2-ethylhexyl)aminomethyl]benzotriazole, and epoxy compounds such as 1,2-propylene oxide, 1,2-butylene oxide, 1,4-dioxane, butyl glycidyl ether, and phenyl glycidyl ether, and hydrocarbons such as isoamylene, 2,4,4-trimethyl-1-pentene, 2,4,4-trimethyl-2-pentene, and diisobutylene.

[0017] (HFE(A)) The solvent composition of the present invention contains HFE (A), thereby reducing the effect on resin materials and exhibiting excellent solubility of oils and the like.

[0018] HFE-449s1: HFE-449s1 means a compound represented by C4F9OCH3. HFE-449s1 has four structural isomers, and the HFE-449s1 contained in the solvent composition of the present invention may be only one of them, or a mixture of two or more of them. As the HFE-449s1 contained in the solvent composition of the present invention, a mixture of 1-methoxy-2-trifluoromethyl-1,1,2,3,3,3-hexafluoropropane and 1-methoxy-1,1,2,2,3,3,4,4,4-nonafluorobutane is preferable. As this mixture, for example, the product "Novec7100" (manufactured by 3M) can be mentioned. HFE-449s1 has a boiling point of 61°C, and even when boiled and turned into vapor, it remains at 61°C, so it is unlikely to have a detrimental effect on parts that are easily affected by heat, such as plastic parts. HFE-449s1 does not have a flash point. HFE-449s1 has low surface tension and viscosity and evaporates easily even at room temperature. HFE-449s1 is less affected by resin materials and can be used with resin materials such as acrylic resin, ABS resin, polycarbonate, and polyethylene, where HCFO-1233yd cannot be used. On the other hand, since HFE-449s1 does not have a chlorine atom in the molecule, it does not have sufficient solubility in oils such as processing oils and lubricating oils.

[0019] As described above, HFE-449s1 does not have a flash point, has little effect on resin materials, and is highly volatile, except that it does not sufficiently dissolve oils.

[0020] HFE-449s1 can be produced by known methods. For example, as described in Japanese Patent Publication No. 2908033, they can be prepared by reacting CF3CF2CF2C(O)F, CF3CF(CF3)C(O)F and C2F5C(O)CF3 and mixtures thereof with any suitable source of anhydrous fluoride ion, such as anhydrous alkali metal fluoride (e.g., potassium fluoride or cesium fluoride), or anhydrous silver fluoride, with an alkylating agent, such as dimethyl sulfate, in an anhydrous polar aprotic solvent in the presence of a quaternary ammonium compound, such as ADOGEN464 available from Aldrich Chemical Company.

[0021] HFE-569sf: HFE-569sf means a compound represented by C4F9OC2H5. HFE-569sf has four structural isomers, and the HFE-569sf contained in the solvent composition of the present invention may be only one of them, or a mixture of two or more of them. As the HFE-569sf contained in the solvent composition of the present invention, a mixture of 1-ethoxy-2-trifluoromethyl-1,1,2,3,3,3-hexafluoropropane and 1-ethoxy-1,1,2,2,3,3,4,4,4-nonafluorobutane is preferable. As this mixture, for example, the product "Novec7200" (manufactured by 3M) can be mentioned. HFE-569sf has a boiling point of 76°C, and even when boiled and turned into vapor, it remains at 76°C, so it is unlikely to adversely affect parts that are easily affected by heat, such as plastic parts. HFE-569sf has no flash point. HFE-569sf has low surface tension and viscosity and evaporates easily even at room temperature. HFE-569sf is less affected by resin materials and can be used with resin materials such as acrylic resin, ABS resin, polycarbonate, and polyethylene, where HCFO-1233yd cannot be used. On the other hand, since HFE-569sf does not have a chlorine atom in the molecule, it does not have sufficient solubility in oils such as processing oils and lubricating oils.

[0022] As described above, HFE-569sf does not have a flash point, has little effect on resin materials, and is highly volatile, except that it does not sufficiently dissolve oils.

[0023] HFE-569sf can be produced by known methods. For example, as described in U.S. Patent No. 3,068,199, CFCFCFC(O)F, CFCF(CF)C(O)F, and C2F5C(O)CF3 and mixtures thereof can be prepared by reacting any suitable source of anhydrous fluoride ion, such as anhydrous alkali metal fluoride (e.g., potassium fluoride or cesium fluoride) or anhydrous silver fluoride, with an alkylating agent, such as diethyl sulfate, in an anhydrous polar aprotic solvent in the presence of a quaternary ammonium compound, such as ADOGEN 464 available from Aldrich Chemical Company.

[0024] The solvent composition of the present invention may contain, as necessary, 30 mass % or less, preferably 10 mass % or less, of an organic solvent other than HCFO-1233yd and HFE (A) (hereinafter also referred to as organic solvent (B)) based on the total amount of the solvent composition.

[0025] (Organic solvent (B)) The organic solvent (B) is an organic solvent that is soluble in HCFO-1233yd and HFE (A). The organic solvent (B) is appropriately selected depending on various purposes such as increasing solubility, adjusting the evaporation rate, etc. Examples of the organic solvent (B) include HCFO-1233yd, hydrocarbons soluble in HFE(A), alcohols, ketones, non-fluorinated ethers, esters, chlorocarbons, HFCs, HFEs (excluding HFE(A)), HFOs, and HCFOs other than HCFO-1233yd. In the solvent composition of the present invention, the organic solvent (B) is preferably 10% by mass or less, more preferably 7% by mass or less, particularly preferably 5% by mass or less, based on the total amount of the solvent composition.

[0026] The hydrocarbon is preferably one having a carbon number of at least 5. The hydrocarbon may be linear or cyclic, and may be a saturated or unsaturated hydrocarbon. Preferred hydrocarbons are n-pentane, cyclopentane, n-hexane, cyclohexane and n-heptane.

[0027] The alcohol is preferably an alcohol having a carbon number of 1 to 16. The alcohol may be chain or cyclic, and may be a saturated or unsaturated alcohol. As the alcohol, methanol, ethanol, and isopropyl alcohol are preferred.

[0028] The ketone is preferably a ketone having a carbon number of 3 to 9. The ketone may be a chain or cyclic ketone, and may be a saturated or unsaturated ketone. As the ketone, acetone and methyl ethyl ketone are preferred.

[0029] The non-fluorinated ether is preferably an ether having a carbon number of 2 to 8. The non-fluorinated ether may be linear or cyclic, and may be a saturated or unsaturated ether. As the ether, diethyl ether, diisopropyl ether, and tetrahydrofuran are preferable.

[0030] The ester is preferably an ester having a carbon number of 2 to 19. The ester may be linear or cyclic, and may be a saturated ester or an unsaturated ester. As the ester, methyl acetate and ethyl acetate are preferred.

[0031] The chlorocarbon is preferably a chlorocarbon having a carbon number of 1 to 3. The chlorocarbon may be chain-like or cyclic, and may be a saturated or unsaturated chlorocarbon. As the chlorocarbon, methylene chloride, trans-1,2-dichloroethylene, and trichloroethylene are more preferable.

[0032] The HFC is preferably a chain or cyclic HFC having 4 to 8 carbon atoms, and more preferably an HFC in which the number of fluorine atoms in one molecule is equal to or greater than the number of hydrogen atoms. Preferred HFCs are 1,1,1,2,2,3,4,5,5,5-decafluoropentane, 1,1,1,2,2,3,3,4,4-nonafluorohexane, and 1,1,1,2,2,3,3,4,4,5,5,6,6-tridecafluorohexane. As the HFE other than HFE(A), 1,1,2,2-tetrafluoroethoxy-1-(2,2,2-trifluoro)ethane (hereinafter also referred to as HFE-347pc-f) and the like are preferable. As the HCFO other than HFO and HCFO-1233yd, a chain HFO having 3 or 4 carbon atoms and an HCFO other than HCFO-1233yd are preferred. As the HFO, the E isomer or Z isomer of 1,1,1,4,4,4-hexafluoro-2-butene is preferred, and as the HCFO other than HCFO-1233yd, the E isomer or Z isomer of 1-chloro-3,3,3-trifluoropropene is preferred.

[0033] The organic solvent (B) may be one type or two or more types. When two or more types of organic solvents (B) are contained, the combination may be a combination of solvents in the same category or a combination of solvents in different categories. For example, it may be a combination of two types selected from hydrocarbons, or a combination of one type selected from hydrocarbons and one type selected from alcohols.

[0034] It is more preferable that the organic solvent (B) is a solvent that does not have a flash point. Examples of organic solvents that do not have a flash point include HFCs such as 1,1,1,2,2,3,4,5,5,5-decafluoropentane, 1,1,1,2,2,3,3,4,4-nonafluorohexane, and 1,1,1,2,2,3,3,4,4,5,5,6,6-tridecafluorohexane, HFEs such as HFE-347pc-f, HFOs such as the E isomer or Z isomer of 1,1,1,4,4,4-hexafluoro-2-butene, and HCFOs such as the E isomer or Z isomer of 1-chloro-3,3,3-trifluoropropene. When using a solvent having a flash point as the organic solvent (B), it is preferable to use it within a range that does not have a flash point as a solvent composition.

[0035] The solvent composition of the present invention has no adverse effect on the global environment, reduces the effect on resin materials, has sufficient volatility, and is excellent in dissolving hydrophobic substances such as oils and mineral oils. The solvent composition of the present invention has excellent solvent performance and can be used as a cleaning agent for removing hydrophobic substances, such as for cleaning oil stains, flux cleaning, precision cleaning, dry cleaning of clothes, and stain removal. The solvent composition of the present invention can be used as a solvent for forming a coating film of a hydrophobic substance, such as a lubricant such as a silicone-based lubricant or a fluorine-based lubricant, a rust inhibitor made of a mineral oil or a synthetic oil, a moisture-proof coating agent for performing a water-repellent treatment, or an antifouling coating agent such as an agent for preventing fingerprint adhesion for performing an antifouling treatment. That is, the hydrophobic substance is dissolved in the solvent composition of the present invention to form a coating film-forming composition, which is applied to the surface of an article, and the solvent is then removed by evaporation to form a coating film of the hydrophobic substance. Additionally, the solvent composition of the present invention is also suitable as a heat transfer medium for heating or cooling articles.

[0036] (Cleaning agents and methods for cleaning items) The cleaning agent of the present invention is characterized by comprising the solvent composition of the present invention. The cleaning method of the present invention is characterized in that the solvent composition of the present invention is brought into contact with an article to remove dirt adhering to the article.

[0037] A specific cleaning method may be to contact the surface of an article with the solvent composition of the present invention. Although not particularly limited, for example, hand wiping, immersion, spraying, shaking, ultrasonic wave, steam cleaning, or a combination of these methods may be adopted. The cleaning device, cleaning conditions, etc. may be appropriately selected from known methods.

[0038] For example, there is a cleaning apparatus and a cleaning method disclosed in International Publication No. 2008 / 149907. When cleaning is performed using the solvent composition of the present invention in the cleaning device shown in International Publication No. 2008 / 149907, it is preferable that the temperature of the solvent composition of the present invention in the first immersion tank is 25°C or higher and lower than the boiling point of the solvent composition. If the temperature is within the above range, cleaning of dirt such as processing oil can be easily performed, and the cleaning effect by ultrasonic waves is high. In addition, it is preferable that the temperature of the solvent composition of the present invention in the second immersion tank is 10 to 35°C. If the temperature is within the above range, the rinsing cleaning effect is high. In addition, from the viewpoint of cleaning properties, it is preferable that the temperature of the solvent composition of the present invention in the first immersion tank is higher than the temperature of the solvent composition in the second immersion tank.

[0039] Materials of articles to which the solvent composition of the present invention can be applied include metals, resins, elastomers, glass, and ceramics. The article may also be an article made of a composite material having two or more of these materials. Examples of composite materials include a laminate of metal and resin. In particular, the solvent composition of the present invention can be used for articles made of materials containing resins such as ABS resin, polycarbonate (PC), polystyrene (PS), and polyethersulfone (PES), for which HCFO-1233yd could not be used. Specific examples of the article include textile products, medical instruments, electrical and electronic equipment, precision machinery, optical equipment, transport machinery, and parts thereof. Specific examples of the electrical and electronic equipment, precision machinery, optical equipment, transport machinery, and parts thereof include electric wires, fuses, current controllers, transformers, electric heaters, capacitors, resistors such as thermistors, transformers, inductors, switches, connectors, acoustic parts such as speakers, sensors for light and heat, actuators such as motors, power supply parts, quartz oscillators, quartz oscillators, filters, antenna parts, printed circuit boards on which these are mounted, relays, optical lenses, glass substrates, bearings, gears, chains, brakes, and the like. In particular, the solvent composition of the present invention can be used for articles in which at least a part of the material of the surface of the article that comes into contact with the solvent composition is a resin material such as the above-mentioned resin.

[0040] The solvent composition of the present invention is characterized by reducing the influence on resin materials. It is preferable to change the content ratio of the composition for each resin material to be cleaned. When the object to be cleaned is an article having a surface made of ABS resin, polycarbonate, or polystyrene, the solvent composition is preferably a composition having a content ratio of HCFO-1233yd of 25 to 50 mass% relative to the total amount of HCFO-1233yd and HFE(A). On the other hand, when the object to be cleaned is an article having a surface made of polyethersulfone, the solvent composition is preferably a composition having a content ratio of HCFO-1233yd of 50 to 75 mass%. These solvent compositions can reduce the influence on each resin material.

[0041] In the cleaning method of the present invention, the deposits to be cleaned and removed include flux, processing oil, release agent, and dust attached via these substances attached to various objects to be cleaned. Processing oils include cutting oil, quenching oil, rolling oil, lubricating oil, machine oil, press processing oil, punching oil, drawing oil, assembly oil, wire drawing oil, etc. The present solvent composition has superior solubility in these oils compared to conventional solvent compositions such as HFC and HFE, and is therefore preferably used to clean dirt made of these oils.

[0042] (Composition for forming coating film, method for producing substrate with coating film) The solvent composition of the present invention can also be used as a solvent for forming a coating film of a nonvolatile organic compound. The coating forming composition of the present invention is characterized by comprising a non-volatile organic compound and the above-mentioned solvent composition of the present invention. The method for producing a substrate with a coating film of the present invention is characterized in that the coating film-forming composition of the present invention is applied to the surface of a substrate, and then the solvent composition of the present invention is removed by evaporation to form a coating film of the nonvolatile organic compound.

[0043] The coating film-forming composition is usually prepared as a solution-like composition by dissolving a non-volatile organic compound in the solution composition of the present invention. The method for preparing the coating film-forming composition is not particularly limited as long as it is a method that can uniformly dissolve the non-volatile organic compound in the solvent composition of the present invention at a predetermined ratio. The coating film-forming composition is basically composed of only the non-volatile organic compound and the solvent composition of the present invention.

[0044] The content of the nonvolatile organic compound in the coating film forming composition (100% by mass) is preferably 0.01 to 50% by mass, more preferably 0.05 to 30% by mass, and particularly preferably 0.1 to 20% by mass. If the content of the nonvolatile organic compound is within the above range, the thickness of the coating film when the coating film forming composition is applied and the thickness of the nonvolatile organic compound coating film after the solvent composition is evaporated and removed (hereinafter also referred to as drying) can be easily adjusted to an appropriate range.

[0045] Here, the non-volatile organic compound in the present invention refers to a compound whose boiling point is higher than that of the solvent composition of the present invention, and whose organic compound remains on the surface even after the solvent composition evaporates.Specific examples of the non-volatile organic compound include a lubricant for imparting lubricity to an article, a rust inhibitor for imparting rust prevention effect to metal parts, a moisture-proof coating agent for imparting water repellency to an article, and an anti-fouling coating agent such as a fingerprint prevention agent for imparting anti-fouling performance to an article.In the manufacturing method of the substrate with the coating film of the present invention, it is preferable to use a lubricant as the non-volatile organic compound from the viewpoint of solubility.

[0046] A lubricant is a substance used to reduce friction at the contact surfaces and prevent heat generation and friction damage when two components move with their surfaces in contact with each other. Lubricants may be in any form, including liquid (oil), semi-solid (grease), or solid.

[0047] As the lubricant, a mineral oil-based lubricant, a synthetic oil-based lubricant, a fluorine-based lubricant or a silicone-based lubricant is preferred because of its excellent solubility in the solvent composition of the present invention. The fluorine-based lubricant means a lubricant having a fluorine atom in the molecule. The silicone-based lubricant means a lubricant containing silicone. The lubricant contained in the coating film-forming composition may be one type or two or more types. The fluorine-based lubricant and the silicone-based lubricant may be used alone or in combination.

[0048] Examples of fluorine-based lubricants include fluorine-based solid lubricants such as fluorine oil, fluorine grease, and polytetrafluoroethylene resin powder. As fluorine oil, perfluoropolyether and low polymers of chlorotrifluoroethylene are preferable. For example, products with the names "Krytox (registered trademark) GPL102" (manufactured by DuPont Co., Ltd.), "Dafloil #1", "Dafloil #3", "Dafloil #10", "Dafloil #20", "Dafloil #50", "Dafloil #100", and "Demnum S-65" (manufactured by Daikin Industries, Ltd.) are preferable. As fluorine grease, a fluorine oil such as perfluoropolyether or low polymers of chlorotrifluoroethylene is used as a base oil, and polytetrafluoroethylene powder and other thickeners are blended. For example, examples of such products include "Krytox (registered trademark) Grease 240AC" (manufactured by DuPont), "Dafloil Grease DG-203", "Demnum L65", "Demnum L100", and "Demnum L200" (all manufactured by Daikin Industries, Ltd.), "Sumitec F936" (manufactured by Sumitomo Lubricants Co., Ltd.), "Molycoat (registered trademark) HP-300", "Molycoat (registered trademark) HP-500", "Molycoat (registered trademark) HP-870", and "Molycoat (registered trademark) 6169".

[0049] Examples of silicone-based lubricants include silicone oil and silicone grease. Examples of silicone oil include dimethyl silicone, methyl hydrogen silicone, methyl phenyl silicone, cyclic dimethyl silicone, and modified silicone oils with organic groups introduced into the side chain or end. For example, the product names "Shin-Etsu Silicone KF-96", "Shin-Etsu Silicone KF-965", "Shin-Etsu Silicone KF-968", "Shin-Etsu Silicone KF-868", "Shin-Etsu Silicone KF-99", "Shin-Etsu Silicone KF-50", "Shin-Etsu Silicone KF-54", "Shin-Etsu Silicone HIVAC F-4", "Shin-Etsu Silicone HIVAC F-5", "Shin-Etsu Silicone KF-56A", "Shin-Etsu Silicone KF-995", "Shin-Etsu Silicone KF-868", "Shin-Etsu Silicone KF-859" (all manufactured by Shin-Etsu Chemical Co., Ltd.), "SH200", and "MDX4-4159" (all manufactured by Toray Dow Corning Co., Ltd.) can be mentioned. As the silicone grease, products in which the above-mentioned various silicone oils are used as base oils, thickeners such as metal soaps, and various additives are blended are preferred. For example, the product names "Shin-Etsu Silicone G-30 Series", "Shin-Etsu Silicone G-40 Series", "Shin-Etsu Silicone FG-720 Series", "Shin-Etsu Silicone G-411", "Shin-Etsu Silicone G-501", "Shin-Etsu Silicone G-6500", "Shin-Etsu Silicone G-330", "Shin-Etsu Silicone G-340", "Shin-Etsu Silicone G-350", and "Shin-Etsu Silicone G-630" (all manufactured by Shin-Etsu Chemical Co., Ltd.), "Molycoat (registered trademark) SH33L", "Molycoat (registered trademark) 41", "Molycoat (registered trademark) 44", "Molycoat (registered trademark) 822M", "Molycoat (registered trademark) 111", "Molycoat (registered trademark) high vacuum grease", and "Molycoat (registered trademark) heat diffusion compound" (all manufactured by Toray Dow Corning Co., Ltd.) can be mentioned.

[0050] The term "rust inhibitor" refers to a substance used to prevent rusting of metal materials by covering the surface of metals that are easily oxidized by oxygen in the air and causing rust, and blocking the metal surface from oxygen. Examples of rust inhibitors include mineral oils, synthetic oils such as polyol esters, polyalkylene glycols, and polyvinyl ethers.

[0051] Examples of moisture-proof coating agents include Topas 5013, Topas 6013, Topas 8007 (all manufactured by Polyplastics Co., Ltd.), Zeonor 1020R, Zeonor 1060R (all manufactured by Zeon Corporation), Apel 6011T, Apel 8008T (all manufactured by Mitsui Chemicals, Inc.), SFE-DP02H, SNF-DP20H (all manufactured by AGC Seimi Chemical Co., Ltd.). Examples of antifouling coating agents such as fingerprint prevention agents include Optool DSX, Optool DAC (all manufactured by Daikin Industries, Ltd.), Fluorosearch FG-5000 (all manufactured by Fluorotechnology Co., Ltd.), and SR-4000A (all manufactured by AGC Seimi Chemical Co., Ltd.).

[0052] The coating film-forming composition is applied to a surface of a substrate to form a film of the coating film-forming composition on the surface of the substrate, and then the solvent composition is removed by evaporation from the film of the coating film-forming composition formed on the surface of the substrate, thereby forming a coating film made of a non-volatile organic compound on the surface of the substrate.

[0053] Examples of methods for applying the coating composition include coating with a brush, coating with a spray, coating by immersing an article in the coating composition, and coating methods in which the coating composition is brought into contact with the inner wall of a tube or syringe needle by sucking up the coating composition.

[0054] The method for removing the solvent composition from the coating film-forming composition by evaporation includes a known drying method, such as air drying, drying by heating, etc. The drying temperature is preferably 20 to 100°C.

[0055] By the method for producing a substrate with a coating film of the present invention, a substrate with a coating film can be produced on the substrate surface by forming a coating film containing a lubricant, an anti-rust agent, a moisture-proof coating agent, an antifouling coating agent, etc. That is, substrates made of various materials such as metal, resin, rubber, glass, ceramics, etc. can be used as substrates to which the coating film-forming composition is applied. In addition, the coating film-forming composition of the present invention can be applied to articles containing resin materials without affecting them.

[0056] Specific examples of substrates with coatings include industrial equipment, CD and DVD tray parts in personal computers and audio equipment, printers, copy machines, flux machines, and other household or office equipment, in which fluorine-based lubricants are used. Examples of equipment using silicone-based lubricants include syringes, cylinders, medical tube parts, metal blades, catheters, and the like. Examples of equipment using moisture-proof coating agents and dirt-proof coating agents include equipment used to impart moisture-proofness and dirt-proofness to plastic materials, rubber materials, metal materials, glass materials, and mounting recovery boards.

[0057] The solvent composition of the present invention is characterized by reducing the influence on resin materials. When at least a part of the material of the substrate surface that comes into contact with the solvent composition is a resin material, it is preferable to change the content ratio of the composition for each resin material. When the substrate has a surface made of ABS resin, polycarbonate, or polystyrene, the solvent composition is preferably a composition in which the content ratio of HCFO-1233yd is 25 to 50 mass% relative to the total amount of HCFO-1233yd and HFE(A). On the other hand, when the substrate has a surface made of polyethersulfone, the solvent composition is preferably a composition in which the content ratio of HCFO-1233yd is 50 to 75 mass%. These solvent compositions can reduce the influence on each resin material.

[0058] The solvent composition of the present invention can also be used as an aerosol composition containing a propellant and a solute dissolved in the solvent composition. The propellant can be a liquefied gas or a compressed gas. The liquefied gas in the aerosol composition can be dimethyl ether (DME), liquefied petroleum gas (LPG), propane, butane, isobutane, 1,1-difluoroethane (HFC-152a), 1,1,1,2-tetrafluoroethane (HFC-134a), 2,3,3,3-tetrafluoropropene (HFO-1234yf), 1,3,3,3-tetrafluoropropene (HFO-1234ze), etc. On the other hand, the compressed gas can be nitrogen, carbon dioxide, nitrous oxide, etc.

[0059] (Heat Transfer Media and Heat Cycle Systems) The solvent composition of the present invention can be used as a working medium (heat transfer medium) for a heat cycle system. That is, the present invention provides a heat transfer medium containing the solvent composition of the present invention. The heat transfer medium of the present invention can be applied to a heat cycle system for heating or cooling a substance.

[0060] Examples of the heat cycle system include a Rankine cycle system, a heat pump cycle system, a refrigeration cycle system, a heat transport system, and a secondary refrigerant cooling system. Hereinafter, a refrigeration cycle system will be described as an example of a heat cycle system.

[0061] A refrigeration cycle system is a system in which a working refrigerant cools a load fluid to a lower temperature by removing heat energy from the load fluid in an evaporator. The refrigeration cycle system is a system consisting of a compressor that compresses working medium vapor A to produce high-temperature, high-pressure working medium vapor B, a condenser that cools the compressed working medium vapor B and liquefies it to produce low-temperature, high-pressure working medium C, an expansion valve that expands the working medium C discharged from the condenser to produce low-temperature, low-pressure working medium D, an evaporator that heats the working medium D discharged from the expansion valve to produce high-temperature, high-pressure working medium vapor A, a pump that supplies load fluid E to the evaporator, and a pump that supplies fluid F to the condenser.

[0062] Furthermore, the heat transfer medium of the present invention can also be applied to a secondary circulation cooling system. The secondary circulation cooling system is a system having a primary cooling means for cooling a primary refrigerant consisting of ammonia or a hydrocarbon refrigerant, a secondary circulation cooling means for circulating a secondary refrigerant for the secondary cooling means system (hereinafter referred to as "secondary refrigerant") to cool an object to be cooled, and a heat exchanger for exchanging heat between the primary refrigerant and the secondary refrigerant to cool the secondary refrigerant. The object to be cooled can be cooled by this secondary circulation cooling system. The heat transfer medium of the present invention is preferable for use as a secondary refrigerant. EXAMPLES

[0063] The present invention will be described in detail below with reference to examples. The present invention is not limited to these examples. Examples 1 to 24 are examples of the solvent composition of the present invention, and Examples 25 to 34 are comparative examples. The HFE used in preparing the solvent composition is as shown below. HFE-449s1: 3M, Novec7100 HFE-569sf: 3M, Novec7200 HFE-347pc-f: AGC Corporation, AE-3000

[0064] (Production example: Production of HCFC-244ca) 1204g (9.12 mol) of 2,3,3-tetrafluoropropanol (TFPO) and 12g (0.17 mol) of N,N-dimethylformamide (DMF) were added to a 2-liter four-neck flask equipped with a glass distillation column (measured plate number: 5) filled with a stirrer, a Dimroth filter, a condenser, and Raschig rings. 1078g (9.12 mol) of thionyl chloride was added dropwise and stirred at room temperature for 12 hours. The reactor was heated to 100°C, and reactive distillation was performed with a reflux time / distillation time ratio of 5 / 1 using a reflux timer. The distilled HCFC-244ca was neutralized with a 20% by mass potassium hydroxide aqueous solution. The recovered HCFC-244ca (purity 100% by mass) was 979g (6.50 mol).

[0065] (Production example: Production of HCFO-1233yd) Using 2000g of HCFC-244ca as the raw material, 19.9g of tetra-n-butylammonium chloride was added, the reaction temperature was kept at 50°C, and 2792g of 40% by mass potassium hydroxide aqueous solution was added dropwise over 30 minutes. The reaction was then continued for 52 hours, and the organic layer was recovered. The recovered organic layer was purified to obtain 1520g of HCFO-1233yd(Z) with a purity of 100% by mass, and 140g of HCFO-1233yd(E) with a purity of 100% by mass.

[0066] (Preparation of HCFO-1233yd) The HCFO-1233yd used in the examples was mixed so that the mass ratios of HCFO-1233yd(Z) to HCFO-1233yd(E) (1233yd(Z) / 1233yd(E)) were 95 / 5, 80 / 20, and 55 / 45, and p-methoxyphenol was added to the mixture so that the amount was 0.01 mass%.

[0067] (Azeotropic and pseudo-azeotropic solvent compositions) 300 g of each of compositions 1 to 11 obtained by mixing HCFO-1233yd (Z / E=95 / 5) and HFE-449s1 in the mass ratios shown in Table 1 was placed in an Othmer gas-liquid equilibrium distillation apparatus (manufactured by Shibata Chemical Co., Ltd.) and distilled. The pressure inside the apparatus was atmospheric pressure (1.0×10 5 The relative volatility was calculated from the mass ratio of HCFO-1233yd to HFE-449s1 in the gas and liquid phases according to the formula shown below. As shown in Table 1, the composition of HCFO-1233yd and HFE-449s1 is an azeotropic or pseudo-azeotropic composition. (Formula for calculating relative volatility) Relative volatility = (mass% of HCFO-1233yd in the liquid phase / mass% of HFE in the liquid phase) / (mass% of HCFO-1233yd in the gas phase / mass% of HFE in the gas phase)

[0068] [Table 1]

[0069] The relative volatility of the HCFO-1233yd (Z / E=95 / 5) and HFE-569sf compositions was calculated as described above. The results are shown in Table 2. As shown in Table 2, compositions of HCFO-1233yd and HFE-449s1 with a mass ratio of 25 / 75 to 75 / 25 are also pseudoazeotropic compositions.

[0070] [Table 2]

[0071] (Preparation of Solvent Composition) The HCFO-1233yd and the components shown in Table 3 were mixed in the mass ratios shown in Table 3 to prepare the solvent compositions of Examples 1 to 34.

[0072] (Evaluation of solubility in oil) (Examples 1-12, 25, 26, 32-34) HCFO-1233yd and the HFE were prepared in the amounts shown in Table 3 so that the total amount of the solvent composition in a collection vial was 4.5 g, and 0.5 g of lubricating oil (Shin-Etsu Silicone KF-96-500cs and MDX4-4159, manufactured by Shin-Etsu Chemical Co., Ltd.) was added to the collection vial. The solvent composition and the lubricating oil were mixed, and the state of the solution (solubility) after standing at 40° C. for 10 minutes was evaluated according to the following criteria. The results are shown in Table 3. In Table 3, "MDX" refers to the above-mentioned MDX4-4159, and "KF" refers to KF-96-500cs. A: Uniformly dissolved. B: Slight cloudiness is observed, but this does not pose a problem for practical use. C: Obvious cloudiness or separation into two layers.

[0073] (Examples 11-24, 27-34) HCFO-1233yd and the HFE were prepared in the amounts shown in Table 3 so that the total amount of the solvent composition in a collection vial was 4.5 g, and 0.5 g of metal processing oil (Dafnimag Plus LA-5, manufactured by Idemitsu Kosan Co., Ltd.) was added to the collection vial. The solvent composition and the metal processing oil were mixed, and the state of the solution after standing at 40° C. for 10 minutes was evaluated for solubility according to the above criteria. The results are shown in Table 3. In addition, "LA-5" in Table 3 refers to the above-mentioned Daphnimag Plus LA-5.

[0074] (Evaluation of impact on resin materials) (Examples 1-12, 25, 26, 32-34) HCFO-1233yd and the HFE were prepared in the amounts shown in Table 3 so that the total amount of the solvent composition was 80 g in a 100 ml DURAN heat-resistant screw-top bottle, and one test piece each of ABS resin (ABS), polycarbonate (PC), and polystyrene (PS) (20 mm x 30 mm x 3 mm thick) was placed in the bottle. The screw-top heat-resistant bottle was left to stand at 54°C for one day, after which the test pieces were removed and the appearance was evaluated according to the following criteria. The results are shown in Table 3. A: No change in appearance was observed on the test piece. B: Slight discoloration and surface changes were observed on the test piece, but no practical problems were observed. C: The test piece shows obvious discoloration and surface dissolution.

[0075] (Examples 11-24, 27-34) In a 100 ml DURAN heat-resistant screw-top bottle, HCFO-1233yd and the above HFE were prepared in the amounts shown in Table 3 so that the total amount of the solvent composition was 80 g, and one polyethersulfone (PES) test piece (20 mm x 30 mm x 3 mm thick) was placed in each bottle. The screw-top heat-resistant bottle was left to stand at 54°C for one day, after which the test piece was removed and the appearance was evaluated according to the above criteria. The results are shown in Table 3.

[0076] [Table 3]

[0077] As can be seen from Table 3, the solvent compositions of Examples 1 to 24, in which the ratio of HCFO-1233yd to the total amount of HCFO-1233yd and HFE is 25 to 75 mass% and the total amount of HCFO-1233yd and HFE is 70 mass% or more, all have excellent solubility of oils and have reduced effects on resin materials.

[0078] (Evaluation of oil cleaning performance) (Examples 11-24, 27-34) A test piece of SUS304 (25mm x 30mm x 2mm thick) was immersed in metal processing oil (Dafnimag Plus LA-5, manufactured by Idemitsu Kosan Co., Ltd.) for 1 minute, and then left to stand overnight after being pulled out, to prepare a test piece. HCFO-1233yd and the HFE were prepared in the amounts shown in Table 3 so that the total amount of the solvent composition was 500ml in a 1L tall beaker, and the test piece was washed at 40°C for 30 seconds with an ultrasonic cleaner (UT-307M, manufactured by Sharp Corporation, ultrasonic output 200W, frequency 35kHz). Then, in Examples 11 to 24, the metal processing oil could be removed from the test piece. In addition, the solvent composition attached to the test piece was immediately dried. In Examples 27 to 34, the metal processing oil remained on the test piece after the test.

[0079] (Flux cleaning performance evaluation) (Examples 11-24, 27-34) A cleaning post flux (JS-15CAT, manufactured by Kokisha) was applied to a comb-shaped substrate (conductor width: 0.40 mm, conductor spacing: 0.19 mm, overlap: 15.87 mm, overall substrate dimensions: 50 × 50 mm), dried at 100°C for 10 minutes, soldered in a lead soldering bath at 260°C, and then left to stand overnight to produce a soldered substrate. The substrates obtained as above were subjected to cleaning tests using the solvent compositions of Examples 11 to 24 and 27 to 34 shown in Table 3 according to the methods described below.

[0080] The cleaning process consisted of immersion cleaning for 3 minutes in a 500 ml glass beaker containing 500 ml of the solvent composition, irradiating ultrasonic waves with an output of 200 W and a frequency of 35 kHz at a liquid temperature of 45°C, followed by immersion cleaning for 3 minutes in a 500 ml glass beaker containing 500 ml of the solvent composition and rinsing cleaning for 3 minutes, and finally performing the above cleaning for 3 minutes in a 2000 ml beaker equipped with a cooling coil. As a result, in Examples 11 to 24, residues could be removed from the substrate. Also, the solvent composition attached to the test piece was immediately dried. In Examples 27 to 34, residues were found on the substrate after cleaning.

[0081] (Lubricant coating performance evaluation) (Examples 1-12, 25, 26, 32-34) In the solvent compositions of Examples 1 to 12, 25, 26, and 32 to 34, lubricating oil (Shin-Etsu Silicone KF-96-500cs and MDX4-4159, manufactured by Shin-Etsu Chemical Co., Ltd.) was dissolved to a concentration of 0.5% by mass relative to the total amount of the solvent composition and the silicone-based lubricant. Furthermore, the composition for forming a coating film obtained above was applied to the surface of a SUS304 test piece (25 mm x 30 mm x thickness 2 mm), and the surface was air-dried at 19 to 21 ° C. to form a lubricant coating film on the surface of the SUS304. In all of the examples in which the solvent compositions of Examples 1 to 12 were used as coating solvents, a uniform coating film was formed by visual evaluation. In Examples 25, 26, and 32 to 34, the lubricating oil did not dissolve, and the test could not be performed. [Industrial Applicability]

[0082] The solvent composition of the present invention has excellent solvent performance and is therefore useful as a cleaning solvent for removing dirt such as oils, dust, etc., and as a coating film-forming solvent, and is particularly useful for removing dirt such as dust, oil, etc., adhering to articles having a surface made of a resin material. The entire contents of the specification, claims, drawings and abstract of Japanese Patent Application No. 2019-233168, filed on December 24, 2019, are hereby incorporated by reference as the disclosure of the specification of the present invention.

Claims

1. Contains 1-chloro-2,3,3-trifluoro-1-propene and at least one hydrofluoroether selected from the group consisting of nonafluorobutoxymethane and nonafluorobutoxyethane; The ratio of 1-chloro-2,3,3-trifluoro-1-propene to the total amount of 1-chloro-2,3,3-trifluoro-1-propene and the hydrofluoroether is 25 to 75 mass%, A solvent composition comprising 1-chloro-2,3,3-trifluoro-1-propene and the hydrofluoroether in a total content of 90 mass % or more.

2. The solvent composition according to claim 1, wherein the 1-chloro-2,3,3-trifluoro-1-propene is at least one selected from the group consisting of Z isomers and E isomers.

3. The solvent composition according to claim 2, wherein 1-chloro-2,3,3-trifluoro-1-propene contains 50% by mass or more of Z isomer.

4. nonafluorobutoxymethane is at least one member selected from the group consisting of 1-methoxy-2-trifluoromethyl-1,1,2,3,3,3-hexafluoropropane and 1-methoxy-1,1,2,2,3,3,4,4,4-nonafluorobutane; The solvent composition according to any one of claims 1 to 3, wherein the nonafluorobutoxyethane comprises at least one member selected from the group consisting of 1-ethoxy-2-trifluoromethyl-1,1,2,3,3,3-hexafluoropropane and 1-ethoxy-1,1,2,2,3,3,4,4,4-nonafluorobutane.

5. The solvent composition according to claim 1, consisting essentially of 1-chloro-2,3,3-trifluoro-1-propene, the hydrofluoroether, and, as an optional component, a stabilizer for suppressing decomposition of 1-chloro-2,3,3-trifluoro-1-propene.

6. The solvent composition according to any one of claims 1 to 4, further comprising a stabilizer that inhibits decomposition of 1-chloro-2,3,3-trifluoro-1-propene.

7. The solvent composition according to claim 6, wherein the content of the stabilizer is 1 ppm by mass to 5% by mass based on the total amount of 1-chloro-2,3,3-trifluoro-1-propene.

8. A cleaning agent comprising the solvent composition according to any one of claims 1 to 7.

9. A cleaning method comprising contacting an article with the solvent composition according to any one of claims 1 to 7 to remove dirt adhering to the surface of the article.

10. The cleaning method according to claim 9 , wherein at least a part of the material of the article surface that comes into contact with the solvent composition is a resin material.

11. A coating forming composition comprising a nonvolatile organic compound and the solvent composition according to any one of claims 1 to 7.

12. A method for producing a substrate with a coating film, comprising applying the coating film-forming composition according to claim 11 to a surface of a substrate, and then evaporating the solvent composition to form a coating film containing the nonvolatile organic compound.

13. The method for producing a coated substrate according to claim 12, wherein at least a part of the material of the substrate surface that comes into contact with the solvent composition is a resin material.

14. An aerosol composition comprising a solute, a propellant and the solvent composition of any one of claims 1 to 7.

15. A heat transfer medium for a heat cycle system, comprising the solvent composition according to any one of claims 1 to 7.

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