Integrated speaker and mobile terminal

Abstract

The present invention provides an integrated speaker and a mobile terminal. The integrated speaker includes a casing, a heat dissipation assembly, and a sound-producing assembly, the sound-producing assembly includes a sound-producing unit and a cover plate, a rear cavity is formed between the cover plate and the sound-producing unit, a front cavity is formed between the sound-producing unit and the casing, the casing is provided with a sound output hole communicating with the front cavity, a partition plate is provided on the casing, a first through hole and a second through hole are provided on the casing, and the heat dissipation assembly drives air. The heat dissipation assembly dissipates heat from the mobile terminal, the sound-producing assembly improves the acoustic performance of the mobile terminal, the heat dissipation assembly drives air to carry and dissipate heat generated in the mobile terminal, the sound of the sound-producing assembly is emitted through the sound output hole, the rear cavity and the front cavity improve the audio experience effect of the mobile terminal, the casing protects the heat dissipation assembly and the sound-producing assembly, and the heat dissipation assembly and the sound-producing assembly are protected by a common casing, simplifying the overall structure of the speaker.

Description

[Technical field]

[0001] The present invention relates to the field of speaker technology, and more particularly to an integrated speaker and a mobile terminal. [Background technology]

[0002] 2. Description of the Related Art With the development of science and technology, the mobile terminal speaker has developed into a multi-speaker type as an important component of the mobile terminal.

[0003] In the multi-speaker configuration of the mobile terminal of the related art, a speaker module is usually provided at the top and the tail of the mobile terminal to form a speaker acoustic combination. However, the acoustic performance of the speaker installation configuration of the related art is ordinary, and adding a bass module can provide better acoustic performance, but since the bass module and the external heat sink of the mobile terminal are used at the same position, adding a bass module does not allow the external heat sink to be added.

[0004] Therefore, there is a need to provide an integrated speaker and a mobile terminal that can not only improve the audio experience effect of the mobile terminal, but also realize heat dissipation of the mobile terminal. Summary of the Invention [Problem to be solved by the invention]

[0005] SUMMARY OF THE PRESENT DISCLOSURE An object of the present invention is to provide an integrated speaker and a mobile terminal that enable heat dissipation from the mobile terminal. [Means for solving the problem]

[0006] The technical solution of the present invention is as follows: The present invention provides an integrated speaker including a casing having a receiving cavity and a heat dissipation assembly disposed in the receiving cavity, the integrated speaker including a sound-producing assembly disposed in the receiving cavity and spaced apart from the heat dissipation assembly, the sound-producing assembly including a sound-producing unit disposed in the casing and a cover plate at least partially bonded to the casing, a rear cavity is formed between the cover plate and the sound-producing unit, a front cavity is formed between the sound-producing unit and the casing, and the casing includes: An integrated speaker is provided, the integrated speaker having a sound output hole communicating with the front cavity, a partition plate further provided within the casing for separating the accommodating cavity into a first cavity and a second cavity, a first through hole communicating with the first cavity and a second through hole communicating with the second cavity provided on a side wall of the casing, the heat dissipation assembly is provided in the first cavity, and the heat dissipation assembly drives air to flow from the second cavity to the first cavity, or the heat dissipation assembly drives air to flow from the first cavity to the second cavity.

[0007] Further, the heat dissipation assembly includes a heat conduction plate covering the opening portion of the casing, a heat dissipation member provided on the heat conduction plate and located in the first cavity, and a fan assembly provided on the heat dissipation member, the heat dissipation member includes a bottom plate affixed to the heat conduction plate and a heat dissipation structure connected to the bottom plate and surrounding the outside of the fan assembly, a plurality of gaps are provided within the heat dissipation structure, and the fan assembly drives air to flow from the second cavity to the first cavity and pass through the air through the gaps.

[0008] Furthermore, the heat dissipation structure includes at least two spaced-apart first heat dissipation plates surrounding the outside of the fan assembly and at least two spaced-apart second heat dissipation plates, and one end of the first heat dissipation plate and the second heat dissipation plate away from the bottom plate abuts the partition plate.

[0009] Furthermore, the first heat dissipation plate and the second heat dissipation plate are provided in offset positions, and each of the second heat dissipation plates is provided around the outer periphery of each of the first heat dissipation plates.

[0010] Furthermore, the partition plate is provided with a third through-hole that is positioned corresponding to the fan assembly, and the third through-hole communicates with the first cavity and the second cavity.

[0011] Further, the partition plate further includes a flange extending from an edge of the third through hole to a heat dissipation assembly, The outer side of the flange abuts against the inner side of the first heat sink.

[0012] Further, the cover plate has a convex portion that protrudes into the heat dissipation assembly and is positioned corresponding to the third through hole, and a bonding portion that extends outward from the outer edge of the convex portion and is fixed to the casing, and at least a portion of the convex portion extends into the third through hole.

[0013] Furthermore, a heat-conducting member is further provided between the bottom plate and the casing, and the heat-conducting member is a heat-conducting material.

[0014] Furthermore, a first position-limiting groove and a second position-limiting groove surrounding the outside of the first position-limiting groove are provided on the inside of the casing, the sound-producing unit is embedded in the first position-limiting groove, and the cover plate is embedded in the second position-limiting groove. Effect of the Invention

[0015] The effects of the present invention are as follows. An integrated speaker is provided, and a mobile terminal in which the integrated speaker is provided is provided. The integrated speaker of the present invention is provided in a casing having a cavity that accommodates a sound-emitting assembly and a heat-dissipating assembly, and the integrated speaker of the present invention is attached to the mobile terminal, thereby improving the audio effect of the mobile terminal and dissipating heat from the mobile terminal. The heat-dissipating assembly is used for dissipating heat from the mobile terminal, and the sound-emitting assembly is used for improving the acoustic performance of the mobile terminal. The heat-dissipating assembly dissipates heat from the mobile terminal by driving air to pass through the first cavity and the second cavity, and then conveying and dissipating heat generated during operation of the mobile terminal, and when the sound-emitting assembly is operated, sound is emitted through the sound output hole. The rear cavity and the front cavity improve the sound quality of the sound-emitting assembly and improve the audio experience effect of the mobile terminal. In addition, the casing serves to protect the heat-dissipating assembly and the sound-emitting assembly, and the heat-dissipating assembly and the sound-emitting assembly are protected by a common single casing, simplifying the overall structure of the speaker. [Brief description of the drawings]

[0016] [Figure 1] 1 is a conceptual diagram of the overall structure of a mobile terminal using an integrated speaker of the present invention; [Diagram 2] 2 is a cross-sectional view of the integrated speaker of the present invention taken along the line AA. [Diagram 3] 1 is a schematic diagram of an exploded view of the integrated speaker of the present invention; [Figure 4] 4 is a conceptual diagram of a heat dissipation member structure in the integrated speaker of the present invention. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] The present invention will be described in detail below with reference to the drawings and embodiments.

[0018] As shown in FIGS. 1 to 3, the present embodiment provides an integrated speaker 1 and a mobile terminal 2, including the integrated speaker 1 attached to the main body of the mobile terminal 2 and the back cover of the mobile terminal 2. The main body of the mobile terminal 2 is a terminal device such as a mobile phone, a tablet, etc. The integrated speaker 1 further includes a casing 11 having a housing cavity and a heat dissipation assembly 12 provided in the housing cavity. The integrated speaker 1 includes a sound-producing assembly 13 provided in the housing cavity and spaced apart from the heat dissipation assembly 12. The sound-producing assembly 13 includes a sound-producing unit 132 provided in the casing 11 and a cover plate 131 at least partially attached to the casing 11. A rear cavity 112 is formed between the cover plate 131 and the sound-producing unit 132, and a front cavity 111 is formed between the sound-producing unit 132 and the casing 11. The casing 11 is provided with a sound output hole 113 communicating with the front cavity 111. A partition plate 14 is further provided in the casing 11 to separate the accommodating cavity into a first cavity 114 and a second cavity 115, and a side wall of the casing 11 is provided with a first through hole 116 communicating with the first cavity 114 and a second through hole 117 communicating with the second cavity 115. The heat dissipation assembly 12 is provided in the first cavity 114, and drives the air to flow from the second cavity 115 to the first cavity 114, or drives the air to flow from the first cavity 114 to the second cavity 115.

[0019] In this embodiment, an integrated speaker 1 is provided, and a mobile terminal 2 in which the integrated speaker 1 is provided is provided. In the integrated speaker 1 of the present invention, a sound-producing assembly 13 and a heat-dissipating assembly 12 are provided in a casing 11 having a receiving cavity, so that the integrated speaker 1 of the present invention is attached to the mobile terminal 2, thereby improving the audio effect of the mobile terminal and dissipating heat from the mobile terminal 2. The heat-dissipating assembly 12 is used for dissipating heat from the mobile terminal 2, and the sound-producing assembly 13 is used for improving the acoustic performance of the mobile terminal 2. The heat-dissipating assembly 12 drives air to pass through the first cavity 114 and the second cavity 115, and then carries and dissipates heat generated during the operation of the mobile terminal 2, thereby dissipating heat to the mobile terminal 2. When the sound-producing assembly 13 is operated, sound is emitted through the sound output hole 113. The rear cavity 112 and the front cavity 111 improve the sound quality of the sound-producing assembly 13 and improve the audio experience effect of the mobile terminal 2. The casing 11 also serves to protect the heat dissipation assembly 12 and the sound-producing assembly 13. The heat dissipation assembly 12 and the sound-producing assembly 13 are protected by a common casing 11, which simplifies the overall structure of the integrated speaker 1. The first through-holes 116 and the second through-holes 117 are provided in multiple numbers and are provided around the side wall of the casing 11. The first through-holes 116 are actually holes formed by a cutout portion close to the opening of the casing 11 and the heat dissipation assembly 12. The sound output holes 113 are provided in multiple numbers on the top of the casing 11, including a central hole provided at the center of the top of the casing 11 and an auxiliary hole provided around the central hole. Providing multiple sound output holes 113 improves the sound-producing effect of the integrated speaker 1, which is an optimal design in this embodiment. In other embodiments, the heat dissipation assembly 12 may drive air to flow from the first cavity 114 to the second cavity 115. In other embodiments, one first through hole 116, second through hole 117, or sound output hole 113 may be provided. The number of first through holes 116, second through holes 117, or sound output holes 113 is not limited in the present invention. In other embodiments, the first through hole 116 may be a hole close to the opening of the casing 11.

[0020] 2 and 3, the heat dissipation assembly 12 includes a heat conduction plate 121 that covers the opening of the casing 11, a heat dissipation member 122 that is provided on the heat conduction plate 121 and located in the first cavity 114, and a fan assembly 123 that is provided on the heat dissipation member 122. The heat dissipation member 122 includes a bottom plate 1222 that is attached to the heat conduction plate 121, and a heat dissipation structure 1221 that is connected to the bottom plate 1222 and surrounds the outside of the fan assembly 123, and a plurality of gaps are formed in the heat dissipation structure 1221. The fan assembly 123 drives air to flow from the second cavity 115 to the first cavity 114 and pass through the gaps.

[0021] In this embodiment, the heat conductive plate 121 covers the opening of the casing 11, and the heat dissipation assembly 12 is attached to the heat conductive member 15 and located in the receiving cavity of the casing 11. One side of the heat conductive plate 121 away from the casing 11 is attached to the mobile terminal 2, and heat generated during use of the mobile terminal 2 is conducted to the heat dissipation member 122 by the heat conductive plate 121. When the fan assembly 123 is operated, it drives the air flow in the first cavity 114 and the second cavity 115, and the flowing air carries and dissipates the heat generated in the mobile terminal 2, thereby realizing heat dissipation for the mobile terminal 2. In this embodiment, an exhaust path is formed by the first cavity 114 and the first through hole 116, and an inlet path is formed by the second cavity 115 and the second through hole 117. In another embodiment, the first cavity 114 and the first through-hole 116 may form an air inlet path, and the second cavity 115 and the second through-hole 117 may form an exhaust path.

[0022] As shown in Figures 3 and 4, the heat dissipation structure 1221 includes at least two spaced-apart first heat dissipation plates 12211 and at least two spaced-apart second heat dissipation plates 12212 surrounding the outside of the fan assembly 123, and one end of the first heat dissipation plate 12211 and the second heat dissipation plate 12212 away from the bottom plate 1222 abuts the partition plate 14.

[0023] In this embodiment, a plurality of first heat sinks 12211 and second heat sinks 12212 are provided on the outside of the fan assembly 123, and the first heat sinks 12211 and the second heat sinks 12212 are rectangular plates and extend in the radial direction of the fan assembly 123. The partition plate 14 is provided in the receiving cavity and abuts against each of the first heat sinks 12211 and the second heat sinks 12212, and an air flow channel is formed between the adjacent first heat sinks 12211 and the partition plate 14, and an air flow channel is also formed between the adjacent second heat sinks 12212 and the partition plate 14. When the fan assembly 123 is operated, air flows through the channels to carry and dissipate the heat conducted to the heat sink 122 by the thermal conduction plate 121.

[0024] 4, the first heat sink 12211 and the second heat sink 12212 are provided with a staggered position, and each second heat sink 12212 is disposed around the outside of each first heat sink 12211 and is disposed to surround the first heat sink 12211. In this embodiment, the first heat sink 12211 and the second heat sink 12212 are provided with a staggered position, and the second heat sink 12212 is disposed around the outside of the first heat sink 12211, so that after the air enters the first cavity 114, the contact area with the heat sink member 122 is increased, and more heat is absorbed, thereby improving the heat dissipation effect of the heat sink assembly 12.

[0025] 2 and 3, the partition plate 14 is provided with a third through-hole 141 positioned corresponding to the fan assembly 123 and a flange 142 extending from the edge of the third through-hole 141 to the heat dissipation assembly 12, and the flange 142 abuts against the first heat dissipation plate 12211. The third through-hole 141 communicates between the first cavity 114 and the second cavity 115.

[0026] In this embodiment, the first cavity 114 and the second cavity 115 are connected by the third through hole 141, so that air flows between the first cavity 114 and the second cavity 115, and the air carries and dissipates the heat conducted to the heat sink.

[0027] 2 and 3, the partition plate 14 is provided with a flange 142 extending from the edge of the third through hole 141 to the heat dissipation assembly 12, and the flange 142 abuts against the first heat dissipation plate 12211. In this embodiment, by providing the flange 142, it is possible to guide the airflow to the first cavity 114, and also to facilitate assembly of the partition plate 14 and the first heat dissipation plate 12211 and to limit the position relative to the partition plate.

[0028] As shown in FIG. 3, the cover plate 131 has a convex portion 1311 that protrudes into the heat dissipation assembly 12 and is positioned corresponding to the third through hole 141, and a bonding portion 1312 that extends outward from the outer edge of the convex portion 1311 and is fixed to the casing 11, and at least a portion of the convex portion 1311 extends into the third through hole 141.

[0029] In this embodiment, the casing 11 and the bonding part 1312 are partially bonded and fixed, and the rear cavity 112 of the sound-producing assembly 13 is formed between the part of the bonding part 1312 that is not fixed to the casing 11, the protruding part 1311, and the sound-producing unit 132, and the rear cavity 112 improves the sound quality of the sound-producing assembly 13 when the sound-producing assembly 13 is operated. A part of the protruding part 1311 extends into the third through hole 141, so that air can be guided to flow into the first cavity 114 and the volume of the rear cavity 112 is increased, so that the rear cavity 112 can better improve the sound quality of the sound-producing assembly 13.

[0030] 2 and 3, a heat conductive member 15 is further provided between the bottom plate 1222 and the casing 11, and the heat conductive member 15 is a heat conductive material. In this embodiment, the heat conductive member 15 quickly conducts heat generated in the portable terminal 2 to the heat dissipation member 122. The fan base 1231 and the fan blades 1232 of the fan assembly 123 are rotatably connected, and by continuously rotating the fan blades 1232, the air continuously and quickly carries and dissipates the heat, thereby lowering the temperature of the portable terminal 2 itself.

[0031] 2, a first position limiting groove 118 and a second position limiting groove 119 surrounding the outside of the first position limiting groove 118 are provided on the inside of the casing 11. The sound generating unit 132 is embedded in the first position limiting groove 118, and the cover plate 131 is embedded in the second position limiting groove 119. In this embodiment, the first position limiting groove 118 limits the position of the sound generating unit 132, and the second position limiting groove 119 limits the position of the cover plate 131, thereby avoiding the influence on the use of the whole integrated speaker 1 caused by the displacement of the sound generating unit 132 and the cover plate 131.

[0032] The above is only an embodiment of the present invention, and those skilled in the art may make improvements thereto without departing from the creative concept of the present invention, all of which still fall within the protection scope of the present invention.

Claims

1. An integrated speaker comprising: a casing having a receiving cavity; and a heat dissipation assembly disposed within the receiving cavity, The integrated speaker includes a sound-producing assembly disposed within the receiving cavity and spaced apart from the heat dissipation assembly; The sound-producing assembly includes a sound-producing unit disposed in the casing and a cover plate at least partially bonded to the casing; A rear cavity is formed between the cover plate and the sound generating unit, and a front cavity is formed between the sound generating unit and the casing; The casing is provided with a sound output hole communicating with the front cavity, A partition plate is further provided in the casing to separate the accommodating cavity into a first cavity and a second cavity, a first through hole communicating with the first cavity and a second through hole communicating with the second cavity are provided on a side wall of the casing; the heat dissipation assembly is disposed in the first cavity, and the heat dissipation assembly drives air to flow from the second cavity to the first cavity, or the heat dissipation assembly drives air to flow from the first cavity to the second cavity; the heat dissipation assembly includes a heat conduction plate covering an opening of the casing, a heat dissipation member provided on the heat conduction plate and positioned within the first cavity, and a fan assembly provided on the heat dissipation member; the heat dissipation member includes a bottom plate attached to the thermally conductive plate and a heat dissipation structure connected to the bottom plate and surrounding an outside of the fan assembly, the heat dissipation structure having a plurality of gaps; The fan assembly drives air from the second cavity to the first cavity and through the gap.

2. The integrated speaker of claim 1, characterized in that the heat dissipation structure comprises at least two spaced-apart first heat dissipation plates surrounding the outside of the fan assembly and at least two spaced-apart second heat dissipation plates, and one end of the first heat dissipation plate and the second heat dissipation plate away from the bottom plate abuts the partition plate.

3. The integrated speaker according to claim 2 , wherein the first heat sink and the second heat sink are offset from each other, and each of the second heat sinks is disposed around the outside of each of the first heat sinks.

4. The integrated speaker according to claim 2 , wherein the partition plate is provided with a third through-hole positioned corresponding to the fan assembly, the third through-hole communicating with the first cavity and the second cavity.

5. The partition plate further includes a flange extending from an edge of the third through hole to a heat dissipation assembly. The integrated speaker according to claim 4 , wherein an outer side of the flange abuts against an inner side of the first heat sink.

6. the cover plate has a protrusion that protrudes from the heat dissipation assembly and is positioned to correspond to the third through hole, and a bonding portion that extends outward from an outer edge of the protrusion and is fixed to the casing; The integrated speaker according to claim 4 , wherein at least a portion of the protrusion extends into the third through hole.

7. 3. The integrated speaker according to claim 2, further comprising a heat-conducting member between the bottom plate and the casing, the heat-conducting member being a heat-conducting material.

8. A first position limiting groove and a second position limiting groove surrounding the outside of the first position limiting groove are provided on the inside of the casing, The integrated speaker according to claim 1 , wherein the sound-producing unit is embedded in the first position-defining groove, and the cover plate is embedded in the second position-defining groove.

9. A mobile terminal, A speaker system comprising the integrated speaker according to any one of claims 1 to 8, The mobile terminal, wherein the integrated speaker is attached to a back cover of the mobile terminal.

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