Maintenance method for grinding system and related items

Abstract

The present disclosure relates to a chemical impregnation applicator and an associated application method that can be used to provide a hydrophobic surface to a CMP system component. In one embodiment, a method for forming a hydrophobic coating on a surface of a polishing system component includes cleaning the surface of the polishing system component to remove polishing fluid residue from the surface of the polishing system component and applying a hydrophobizing fluid to the surface of the polishing system component.

Description

[Technical field]

[0001]

[0001] Embodiments of the present disclosure relate generally to chemical mechanical polishing (CMP) systems used in the manufacture of semiconductor devices. In particular, embodiments herein relate to methods for maintaining hydrophobic component surfaces in CMP systems, and associated hydrophobic applicator articles. [Background technology]

[0002]

[0002] In the manufacture of semiconductor devices, chemical mechanical polishing (CMP) is commonly used to planarize or polish a material layer deposited on a substrate surface. In a typical CMP process, a substrate is held in a substrate carrier, which presses the backside of the substrate against a rotating polishing pad in the presence of a polishing fluid. Generally, the polishing fluid includes an aqueous solution of one or more chemical components and nanoscale abrasive particles suspended in the aqueous solution. Through a combination of chemical and mechanical activity imparted by the polishing fluid and the relative motion of the substrate and the polishing pad, material is removed from the entire surface of the material layer of the substrate in contact with the polishing pad.

[0003]

[0003] CMP is generally considered a wet process, and the accumulation of undesirable by-products of abrasive fluids that dry on surfaces within the wet environment of a CMP system is almost inevitable. Typically, this accumulation comprises accumulated abrasive particles that remain after the abrasive fluid spray droplets from the CMP process dry on the system surfaces. Unlike individual nanoscale abrasive particles that remain in suspension in a carefully formulated abrasive fluid, the accumulations of dried abrasive particles can cause severe damage to the substrate surface if they come into contact with the substrate during the CMP process. This damage often manifests itself as scratches (e.g., microscratches) on the substrate surface and can adversely affect the performance of devices formed thereon, or in some cases, can render the device inoperable.

[0004]

[0004] Therefore, there is a need in the art for articles and related methods that solve the above problems. Summary of the Invention

[0005]

[0005] The present disclosure relates generally to chemical impregnation applicators and associated application methods that may be used to provide hydrophobic surfaces on CMP system components.

[0006] In one embodiment, a method for forming a hydrophobic coating on a surface of a polishing system component is provided, the method including cleaning the surface of the polishing system component to remove polishing fluid residue from the surface of the polishing system component and applying a hydrophobizing fluid to the surface of the polishing system component.

[0007] In another embodiment, a method for forming a hydrophobic coating on a surface of a polishing system component is provided. The polishing system component is disposed within a substrate processing environment of the polishing system. The method includes cleaning the surface of the polishing system component to remove polishing fluid residue from the surface of the polishing system component and applying a hydrophobizing fluid to the surface of the polishing system component. In some embodiments, the hydrophobizing fluid is applied to the surface of the polishing system component without moving the polishing system component from the substrate processing environment.

[0008] In another embodiment, a hydrophobic applicator is provided. The hydrophobic applicator generally includes an applicator article formed of an open cell foam material having a porosity of about 60% or greater, and a hydrophobizing liquid. In some embodiments, the applicator and the hydrophobizing liquid are both packaged in a hermetically sealed container.

[0009]

[0009] In order that the above-mentioned features of the present disclosure may be understood in detail, the present disclosure summarized above will now be more particularly described with reference to embodiments, some of which are illustrated in the accompanying drawings. It should be noted, however, that the accompanying drawings merely illustrate exemplary embodiments of the present disclosure, and therefore should not be considered as limiting the scope of the present disclosure, which may admit of other equally effective embodiments. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1A is a schematic side view of an exemplary polishing system that may be used in conjunction with the methods provided herein in accordance with one embodiment, and FIG. 1B is a schematic cross-sectional view of a portion of a substrate carrier used in conjunction with the polishing system of FIG. 1A in accordance with one embodiment. [Diagram 2] FIG. 1 is a schematic isometric view of a hydrophobic applicator according to one embodiment that may be used to perform the methods described herein. [Diagram 3] FIG. 2 is a schematic isometric view of a hydrophobic applicator according to another embodiment that may be used to perform the methods described herein. [Figure 4] FIG. 4A is a schematic isometric view of a hydrophobic applicator according to another embodiment that may be used to perform the methods described herein, and FIG. 4B is a schematic isometric view further showing a clamp that may be used with the hydrophobic applicator shown in FIG. 4A according to one embodiment. [Diagram 5] FIG. 2 is a schematic isometric view of a hydrophobic applicator according to another embodiment that may be used to perform the methods described herein. [Figure 6] 1B is a schematic side view of a portion of the polishing system shown in FIG. 1A and an applicator device that may be used to perform aspects of the methods described herein, according to one embodiment. [Figure 7] 1A-1D illustrate a method of applying a hydrophobic coating to a surface of a polishing system component according to one embodiment. [Figure 8] 8 is a schematic cross-sectional view of a portion of a surface of a polishing system component, further illustrating the contact angle of a water droplet formed according to the method of FIG. 7 and disposed on the surface, according to one embodiment.

[0011]

[0020] To facilitate understanding, wherever possible, the same reference numerals have been used to designate identical elements common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012]

[0021] FIELD OF THE DISCLOSURE Embodiments of the present disclosure relate generally to articles for use in maintaining a chemical mechanical polishing (CMP) system. In particular, embodiments herein relate to a hydrophobic applicator that may be used to provide a hydrophobic surface to a CMP system component, and related methods.

[0013]

[0022] A typical polishing fluid used in a CMP process may include an aqueous solution of one or more chemical components with nanoscale abrasive particles suspended therein. Generally, dried residues of the polishing fluid, such as agglomerates of abrasive particles, accumulate on component surfaces disposed above or otherwise proximate to the polishing pad during the polishing process. For example, dried residues of the polishing fluid often accumulate on surfaces of CMP system components, such as a substrate carrier, pad conditioner assembly, or fluid delivery arm, disposed above the polishing pad as the polishing fluid is dispensed thereon. If the accumulated residues are not removed, the abrasive particle agglomerates may flake off from the component surface onto the polishing pad and cause undesirable damage (e.g., scratches) to the material surface of the substrate that is subsequently polished thereon. Removing the accumulated residues is generally laborious and time-consuming. The accumulated abrasive particles often form a cement-like layer on the component surfaces, which undesirably results in long and frequent downtimes of the polishing system for consumable replacement and preventive maintenance (PM) procedures.

[0014]

[0023] Generally, the surfaces of polishing components exposed to the spray of polishing fluid are formed of materials that are chemically and / or corrosively resistant to the polishing fluid. In some embodiments, the surfaces may be formed of hydrophobic materials and / or have hydrophobic coatings so that the polishing fluid droplets tend to run off the component surfaces before drying and forming undesirable polishing fluid residues thereon. Unfortunately, the delicate liquid-surface interfaces that provide the hydrophobicity of such materials and / or coatings have limited durability. Thus, in a typical CMP processing environment, the hydrophobicity of the surfaces of CMP components may be significantly degraded long before the end of the component's useful life. For example, periodic maintenance procedures to clean polishing fluid residues from CMP components and the materials used therefor, such as polishing cloths, corrosive chemicals, as well as accumulated polishing fluid residue particles, often wear down the component surfaces and thus reduce their hydrophobicity. As the surface of the component wears down, the ability of the surface to repel polishing fluid droplets therefrom decreases, thereby increasing the rate at which polishing fluid residues accumulate thereon. Thus, embodiments herein beneficially provide a method for periodically restoring the hydrophobicity of a CMP component surface, and a hydrophobic applicator that may be used to practice the method, wherein the hydrophobic applicator is packaged to contain both the applicator article and the hydrophobizing solution in a single-use packaging container so as to avoid typical limitations regarding storage and transportation of containers of liquids within the substrate processing portion of a semiconductor device manufacturing facility.

[0015]

[0024] In some embodiments, the method includes treating the component surface during a CMP consumable replacement procedure. CMP consumables generally include items used in CMP processes that have a limited useful life due to wear associated with substrate processing and therefore need to be replaced periodically depending on the number of substrates processed on or with them or the accumulated substrate processing time. Examples of CMP consumables include polishing pads, pad conditioning disks, and some components of substrate carriers. The method generally includes cleaning any accumulated polishing fluid residue from the CMP component surface and then treating the component surface to restore its hydrophobicity. The newly restored hydrophobic surface beneficially reduces the amount of polishing fluid residue that may accumulate on the component surface during a consumable replacement or other maintenance procedure, thereby beneficially reducing the associated cleaning time and labor. An exemplary polishing system that can benefit from the embodiments described herein is shown in FIG. 1A.

[0016]

[0025] FIGURE 1A is a schematic side view of an exemplary polishing system 100 that can benefit from the applicator and related methods provided herein, according to one embodiment. FIGURE 1B is a schematic cross-sectional view of a portion of a substrate carrier assembly 104 used with the polishing system 100 of FIGURE 1A, according to one embodiment.

[0017]

[0026] Generally, the polishing system 100 features a frame (not shown) and a number of panels 101, which together define a substrate processing environment 103. The polishing system 100 includes a number of polishing stations 102 (one shown) and a number of substrate carrier assemblies 104 (one shown) disposed within the substrate processing environment 103.

[0018]

[0027] 1A, the polishing station 102 includes a platen 106, a polishing pad 108 attached to and secured to the platen 106, a pad conditioner assembly 110 for cleaning and / or regenerating the polishing pad, and a fluid delivery arm 112 for dispensing a polishing fluid onto the polishing pad 108. Herein, the platen 106 is disposed above a base plate 114 and circumscribed by a platen shield 120 (both shown in cross section), which collectively define a drainage area 116. The drainage area 116 is used to collect fluid spun radially outward from the platen 106 and drain the fluid through a flow area 118 in fluid communication therewith.

[0019]

[0028] The pad conditioner assembly 110 is used to clean and / or regenerate the polishing pad 108 by sweeping polishing by-products therefrom with a brush (not shown), or the like, and / or by abrading the polishing pad 108 by pressing a polishing pad conditioner disk 124 (e.g., a diamond-impregnated disk) against it. The pad conditioning step can be performed while the substrate is being polished, i.e., ex-situ conditioning, simultaneously with polishing the substrate, i.e., in-situ conditioning, or both.

[0020]

[0029] As used herein, pad conditioner assembly 110 includes a first actuator 126 disposed on base plate 114, a conditioner arm 128 coupled to first actuator 126, and a conditioner mounting plate 130 having a conditioner disk 124 fixedly coupled thereto. A first end of conditioner arm 128 is coupled to first actuator 126, and mounting plate 130 is coupled to a second end of conditioner arm 128 distal from the first end. First actuator 126 is used to sweep conditioner arm 128, and thus conditioner disk 124, about axis C such that conditioner disk 124 oscillates between an inner diameter of polishing pad 108 and an outer diameter of polishing pad 108 while polishing pad 108 rotates therebetween. In some embodiments, pad conditioner assembly 110 further includes a second actuator 132 disposed on and coupled to a second end of conditioner arm 128, where second actuator 132 is used to rotate conditioner disk 124 about axis D. Typically, mounting plate 130 is coupled to second actuator 132 using a shaft 134 disposed therebetween.

[0021]

[0030] Generally, the rotating substrate carrier assembly 104 is swept back and forth from the inner diameter to the outer diameter of the platen 106 while the platen 106, and therefore the polishing pad 108, rotates thereunder about a platen axis B. Polishing fluid is supplied to the polishing pad 108 using a fluid delivery arm 112 positioned above it, and is further supplied to the polishing interface between the polishing pad 108 and the substrate 122 by the rotation of the polishing pad 108 about the platen axis B. Often, the fluid delivery arm 112 also includes a number of nozzles (not shown), which can be used to deliver a relatively high pressure flow of cleaning fluid, such as deionized water, to the polishing pad 108.

[0022]

[0031] 1B, the substrate carrier assembly 104 features a carrier head 140, a carrier ring assembly 142 coupled to the carrier head 140, and a flexible membrane 148 disposed radially inward of the carrier ring assembly 142 to provide a mounting surface for the substrate 122. The carrier ring assembly 142 includes a lower annular portion and an upper annular portion, here a substrate retaining ring 144 and a backing ring 146, respectively. The substrate retaining ring 144 is typically formed of a polymer bonded to the backing ring 146 with a bonding layer (not shown) disposed therebetween. The backing ring 146 is formed of a rigid material, such as a metal or ceramic, and is secured to the carrier head 140 with a number of fasteners (not shown). Examples of suitable materials used to form the substrate retaining ring 144 and the backing ring 146, respectively, include any one or combination of the polishing fluid chemically resistant polymers, metals, and / or ceramics described herein. Flexible membrane 148 is typically coupled to carrier head 140 using one or more annular membrane clamps 150, which collectively define a region 152 therein.

[0023]

[0032] During substrate processing, the substrate retaining ring 144 surrounds the substrate 122 to prevent the substrate 122 from slipping off the substrate carrier assembly 104. Typically, region 152 is pressurized during polishing such that the flexible membrane 148 exerts a downward force on the substrate 122 while the substrate carrier assembly 104 rotates about carrier axis A, thus pressing the substrate 122 against the polishing pad 108. Before and after polishing, a vacuum is applied to region 152 to deflect the flexible membrane 148 upwardly, creating a low pressure pocket between the flexible membrane 148 and the substrate 122, thereby vacuum chucked the substrate 122 to the substrate carrier assembly 104.

[0024]

[0033] Typically, the inner diameter of the substrate retaining ring 144 is larger than the diameter of the substrate 122 to allow some clearance therebetween, e.g., greater than about 2 mm, or greater than about 3 mm, during the polishing process and substrate loading and unloading operations. Similarly, the outer diameter of the substrate mounting surface of the flexible membrane 148 is smaller than the inner diameter of the substrate retaining ring 144 to allow the flexible membrane 148 to move relative thereto. The clearance between the substrate 122 and the substrate retaining ring 144, and between the flexible membrane 148 and the substrate retaining ring 144, creates a gap G. Often, polishing fluid may enter the gap G and polishing fluid residue may form on one or more surfaces therein, such as a radially inward facing surface of one or both of the substrate retaining ring 144 and the backing ring 146, and one or more radially outward facing surfaces of the annular membrane clamp 150. In some embodiments, the substrate carrier assembly 104 further includes a head cover 154 disposed on the carrier head 140.

[0025]

[0034] Herein, one or more surfaces of the polishing system 100, and / or its components, such as the pad conditioner assembly 110, the platen shield 120, and the substrate carrier assembly 104, are treated using the hydrophobic applicators and / or spray methods described herein to prevent and / or significantly reduce the accumulation of polishing fluid residue thereon.

[0026]

[0035] FIG. 2 is a schematic isometric view of a hydrophobic applicator 200 according to one embodiment that may be used with the methods described herein. Herein, the hydrophobic applicator 200 includes an applicator article 202 impregnated with a hydrophobizing liquid 204. In this embodiment, the applicator article 202 is formed of a fiber-free foam material, such as a polyvinyl alcohol (PVA) or polyurethane (PU) foam material suitable for use in a clean room environment in a semiconductor device manufacturing facility. Generally, the foam material used to form the applicator article 202 has an open cell pore structure and a porosity of about 60% or more, e.g., about 65% or more, about 70% or more, about 75% or more, about 80% or more, or about 90% or more. In some embodiments, the foam material used to form the applicator article 202 has a porosity of about 50 kg / m 3 More than, for example, about 60 kg / m 3 Above, about 70kg / m 3 More than, for example, about 80 kg / m 3 In some embodiments, the applicator article 202 is soft and pliable at room temperature, and thus typically has a glass transition temperature (Tg) of about 25° C. or less, e.g., about 20° C. or less, about 15° C. or less, or such as about 10° C. or less. One or both of the pore size and density may vary throughout the applicator article 202 (as shown), or one or both of the pore size and density may be uniformly distributed throughout. In other embodiments, the applicator article 202 may be formed of a suitable fiber-based synthetic material, such as a polyester fabric.

[0027]

[0036] As used herein, the hydrophobizing solution 204 includes one of a solution, a mixture, and / or an emulsion characterized by a solvent and a hydrophobizing agent. In some embodiments, the hydrophobizing solution 204 further includes a surfactant, such as a carboxylic acid-based component. Examples of suitable solvents include a hydrocarbon-based solvent, a fluorine-based solvent, or a combination thereof. In some embodiments, the fluorine-based solvent is a hydrofluoroether (HFE)-based solvent, such as 2-trifluoromethyl-3-ethoxydodecafluorohexane. Examples of suitable hydrophobizing agents include monomers, oligomers, and / or other functional groups of siloxanes, fluoroacrylates, or combinations thereof. Examples of suitable fluorinated acrylic monomers include pentafluorophenyl acrylate, hexafluoroisopropyl methacrylate, 1H,1H,3H-hexafluorobutyl methacrylate, 2,2,2-trifluoroethyl acrylate, 2,2,2-trifluoroethyl methacrylate, 1H,1H,2H,2H-heptadecafluorodecyl methacrylate (HDFDMA), 1H,1H,5H-octafluoropentyl methacrylate, and combinations thereof. The carboxylic acid component may be a carboxylic acid, a carboxylic acid salt, a carboxylic acid derivative, or a combination thereof.

[0028]

[0037] As used herein, the applicator article 202 is impregnated with the hydrophobizing liquid 204 prior to or simultaneously with packaging in a sealed container 206 (shown in partial cross section) to prevent exposure of the hydrophobizing applicator 200 to the atmosphere. The container 206 may be formed of any suitable material generally accepted for use in clean room environments, such as an antistatic polyethylene material. Generally, the packaged applicator article 202 is not completely saturated with the hydrophobizing liquid 204 to provide improved control over the thickness of the hydrophobic coating formed during the application methods described herein. For example, if X represents the maximum amount by weight of the hydrophobizing liquid 204 that can be absorbed by the applicator article 202, the packaged applicator article 202 may have an actual saturation by weight of about 0.9X or less, such as about 0.8X or less, about 0.7X or less, about 0.6X or less, about 0.5X or less, or about 0.4X or less. In some embodiments, the packaged applicator article 202 has an actual saturation by weight of the hydrophobizing liquid 204 in the range of about 0.1X to about 0.5X, such as about 0.2X to about 0.5X, or about 0.3X to about 0.5X, etc. In some embodiments, the packaged applicator article 202 has an actual saturation by weight of the hydrophobizing liquid 204 in the range of about 0.5X to about 0.9X, such as about 0.6X to about 0.9X, or about 0.7X to about 0.9X, In some embodiments, the packaged applicator article 202 has an actual saturation by weight of the hydrophobizing liquid 204 in the range of about 0.2X to about 0.8X, such as about 0.3X to about 0.7X, or about 0.4X to about 0.5X.

[0029]

[0038] 3 is a schematic isometric view of another embodiment of a hydrophobic applicator 300 that may be used with the methods described herein. Herein, the container 306 (shown in partial cross section) is substantially similar to the container 206 described in FIG. 2 and further includes an impermeable membrane 308 that divides the container 306 into a first region 310 and a second region 312. The applicator article 302 and the hydrophobizing liquid 204 are disposed in the first region 310 and the second region 312, respectively, and are thus separated by the membrane 308. Prior to the methods described herein, a user manipulates the container 306 to break the membrane 308, thereby allowing the hydrophobizing liquid 204 to be absorbed by and / or coat the surface of the applicator article 302 to form the hydrophobic applicator 300. Herein, the applicator article 302 is substantially similar or the same as the applicator article 202 described in FIG. 2. Typically, the amount of hydrophobizing solution 204 disposed in second region 312 is selected to provide a desired actual saturation of applicator article 302 with hydrophobizing solution 204 upon rupture of membrane 308. In some embodiments, the desired actual saturation of applicator article 302 is within the same ranges as described for the actual saturation of applicator article 202 depicted in FIG.

[0030]

[0039] 4A is a schematic isometric view of another embodiment of a hydrophobic applicator 400 that may be used with the methods described herein. Hydrophobic applicator 400 includes an applicator article 402 impregnated with hydrophobizing liquid 204. As used herein, applicator article 402 is sized and shaped to apply hydrophobizing liquid 204 to a surface of pad conditioner assembly 110, such as the surfaces of conditioner mounting plate 130 and second actuator 132 of FIG. 1A, and surfaces disposed therebetween.

[0031]

[0040] The applicator article 402 comprises a cylindrical disk having a diameter about the same as or greater than the diameter of the conditioner mounting plate 130, a thickness about the same as or less than the distance between the mounting plate 130 and the second actuator 132, and an opening 406 sized to fit around the shaft 134. For example, in some embodiments, the applicator article 402 has a diameter of about 100 mm or more, e.g., about 150 mm or more, or about 200 mm or more, or about 100 mm to about 300 mm, and a thickness of about 50 mm or less, e.g., about 40 mm or less, or about 30 mm or less, or about 10 mm to about 50 mm. The generally circular opening 406 is disposed through (or adjacent to) the center of the cylindrical disk and has a diameter about the same as or slightly less than the diameter of the shaft 134. For example, in some embodiments, the diameter of the opening 406 is about 10 mm to about 30 mm, e.g., about 10 mm to about 20 mm. A slit 408 connects opening 406 with the outer periphery of applicator article 402 such that applicator article 402 can be positioned about shaft 134 without removing mounting plate 130 from pad conditioner assembly 110 .

[0032]

[0041] In some embodiments, the materials used to form the applicator article 402 are substantially similar or the same as the materials used to form the applicator article 202 depicted in Figure 2. The applicator article 402 and the hydrophobizing solution 204 may be packaged using any of the containers 206 and 306 depicted in Figures 2 and 3, respectively. In some embodiments, the actual or desired actual saturation of the applicator article 402 is within the same ranges as described for the actual saturation of the applicator article 202 depicted in Figure 2.

[0033]

[0042] 4B is a schematic isometric view further illustrating a clamp 412 that may be used with the hydrophobic applicator 400, according to some embodiments. As shown in FIG. 4B, the clamp 412 secures the edge of the hydrophobic applicator 400 and provides an ergonomic handle for a user to facilitate the methods described herein. The clamp is typically formed of a non-rigid or semi-rigid material, such as a non-rigid or semi-rigid polymer, rubber, or synthetic rubber material, that has suitable chemical resistance to the abrasive fluid and allows for gripping strength to hold the hydrophobic applicator 400 in place during the methods described herein. In some embodiments, the material used to form the clamp 412 has a Shore A hardness ranging from about 60 to about 85.

[0034]

[0043] 5 is a schematic isometric view of another embodiment of a hydrophobic applicator 500 that may be used with the methods described herein. The hydrophobic applicator 500 includes an applicator article 502 impregnated with a hydrophobizing liquid 204. In some embodiments, the materials used to form the applicator article 502 are substantially similar or the same as the materials used to form the applicator article 202 described in FIG. 2. In some embodiments, the actual or desired actual saturation of the applicator article 502 with the hydrophobizing liquid 204 is equal to or within the same range as described for the actual saturation of the applicator article 202 described in FIG. 2.

[0035]

[0044] Herein, applicator article 502 is secured to a fastener layer, such as first fastener layer 508, through the use of adhesive 506. In some embodiments, first fastener layer 508 comprises part of a hook-and-loop fastener system, which may be used to attach hydrophobic applicator 500 to applicator device 600 described in Figure 6. Applicator article 502, with first fastener layer 508 secured thereto, and hydrophobizing solution 204 may be packaged using either container 206 or 306 described in Figures 2 and 3, respectively.

[0036]

[0045] 6 is a schematic side view of a portion of the polishing system 100 showing an applicator device 600 that may be used in conjunction with the methods described herein to apply the hydrophobizing liquid 204 to a portion of the platen shield 120, according to one embodiment. Typically, the applicator device 600 is used during a polishing pad exchange procedure to press the hydrophobizing applicator 500 against the radially inward surface of the platen shield 120, thus applying a layer of the hydrophobizing liquid 204 thereto. For example, in FIG. 6, the applicator device 600 is temporarily coupled to the peripheral edge of the platen 106 using a clamp 602 disposed thereon and / or a fastener 604 (shown in dotted lines) disposed in a corresponding opening in the radially outward surface of the platen 106.

[0037]

[0046] As used herein, the applicator apparatus 600 includes an applicator attachment portion 606 and a fastener layer, such as a second fastener layer 608, that includes a second portion of a hook-and-loop fastener system. The second fastener layer 608 is secured to a surface of the applicator attachment portion 606 by use of an adhesive, and the hydrophobic applicator 500 is temporarily secured to the applicator attachment portion 606 by use of a hook-and-loop fastener system. Generally, the applicator apparatus 600 further includes a resilient member 610, such as a spring, that is used to press the hydrophobic applicator 500 against a radially inward surface of the platen shield 120 as the platen 106 rotates about the platen axis B (shown in FIG. 1A ). The applicator apparatus 600 advantageously enables the methods described herein without requiring the time-consuming procedure of removing the platen shield 120 from the polishing system 100, thereby reducing undesired downtime of the system for routine maintenance.

[0038]

[0047] 7 illustrates a method 700 for applying a hydrophobic coating to a surface of a polishing system component, such as a component of the polishing system 100 of FIG. 1A, according to one embodiment. Typically, method 700 is performed during polishing system downtime during a regularly scheduled maintenance procedure, such as a consumable replacement procedure or a preventive maintenance (PM) procedure.

[0039]

[0048] FIG. 8 is a schematic cross-sectional view of a portion of a polishing system component 800 used to illustrate various aspects of the method 700. As used herein, the polishing system component 800 represents any component and / or other surface of the polishing system 100 that may be exposed to aerosol droplets of polishing fluid during a substrate polishing process. For example, the polishing system component 800 may be any one of the panel 101, the substrate carrier assembly 104, components of the pad conditioner assembly 110, the fluid delivery arm 112, the platen 106 and / or its surrounding surface, the platen shield 120, or any other surface or component used with and / or disposed within the substrate processing environment 103 of the polishing system 100. In general, the system component 800 and / or its pre-application surface 802 are formed of a polishing fluid chemically resistant material. Examples of suitable materials include silica glass, quartz, ceramics such as alumina, polishing fluid chemically resistant metals, and polishing fluid chemically resistant polymers. Examples of suitable metals include stainless steel alloys, nickel-chromium alloys, nickel-chromium-molybdenum alloys, nickel-iron-chromium-molybdenum alloys, cobalt-nickel-chromium-molybdenum alloys, and titanium alloys. Examples of suitable polymers include polyphenylsulfide (PPS), polyethylene terephthalate (PET), polyetheretherketone (PEEK), polyimide (PI) and polybutylene terephthalate (PBT), acetal polyoxymethylene (POM), polyamideimide (PAI), polytetrafluoroethylene (PTFE), polybenzimidazole (PBI), polyetheramine (PEI), and composites thereof.

[0040]

[0049] In step 705, the method 700 includes removing polishing fluid residue from a surface of the polishing system component, such as the pre-application surface 802. Typically, removing polishing fluid residue from the component includes pressing a cleaning article, such as a sponge or cloth, against the pre-application surface 802 in the presence of a cleaning fluid. In some embodiments, the cleaning article may have an abrasive surface. In general, the cleaning fluid is selected based on the type of polishing fluid used with the exemplary polishing system 100 and the suitability of the cleaning fluid for dissolving the polishing fluid residue deposits. Examples of suitable cleaning fluids include dilute solutions of hydrogen peroxide, ammonium hydroxide, and various acids, such as citric acid. In some embodiments, the cleaning fluid may include a dilute aqueous solution having at least some of the same components used in the polishing fluid. For example, if the polishing fluid includes potassium hydroxide, the cleaning fluid may include an aqueous solution of potassium hydroxide. In some embodiments, the cleaning fluid is deionized water. In some embodiments, the cleaning fluid includes a surfactant. In some embodiments, removing the polishing fluid residue also removes a portion of the hydrophobic coating applied during a previous consumable replacement or preventive maintenance procedure. Typically, after polishing system component 800 has been cleaned of polishing fluid residue, pre-coated surface 802 is rinsed with deionized water and dried, for example, by blowing clean dry air (CDA) over the surface.

[0041]

[0050] In step 710, the method 700 includes applying a hydrophobizing solution, such as the hydrophobizing solution 204 described herein, to a pre-application surface 802 of a polishing system component. Herein, applying the hydrophobizing solution 204 to the pre-application surface 802 forms a hydrophobic coating 804 having a post-application surface 806. Herein, a water droplet 808 disposed on the system component forms a contact angle θ with the post-application surface 806 of about 60° or more, about 65° or more, about 70° or more, about 75° or more, about 80° or more, about 85° or more, about 90° or more, about 95° or more, about 100° or more, about 105° or more, or, for example, about 110° or more. In some embodiments, the hydrophobic coating 804 has a thickness T of about 100 μm or less, e.g., about 85 μm or less, about 80 μm or less, about 75 μm or less, about 70 μm or less, about 65 μm or less, about 60 μm or less, about 55 μm or less, or about 50 μm or less.

[0042]

[0051] As described herein, wear and corrosion of the pre-coated surface 802 due to repeated exposure to and cleaning of polishing fluid residue therefrom tends to decrease the hydrophobicity of the pre-coated surface 802 over the useful life of the system component 800. Thus, in some embodiments, the pre-coated surface 802 may have a water contact angle of about 100° or less, e.g., about 95° or less, about 90° or less, about 85° or less, about 80° or less, about 75° or less, about 70° or less, about 65° or less, about 60° or less, about 55° or less, or about 50° or less. In some embodiments, application of the hydrophobizing solution 204 beneficially results in an increase in hydrophobicity of about 10% or more, e.g., about 15% or more, about 20% or more, about 25% or more, about 30% or more, about 35% or more, about 40% or more, about 45% or more, about 50% or more, about 65% or more, about 70% or more, e.g., about 75% or more. As used herein, the increase in hydrophobicity is determined using the difference in water droplet contact angle θ between the pre-coated surface 802 and the post-coated surface 806 .

[0043]

[0052] In some embodiments, the hydrophobic coating 804 formed on the surface of the system component 800 exhibits oleophobic surface properties, e.g., has high resistance to non-aqueous contaminants such as dust, oil, and / or other particulates. Thus, in some embodiments, the hydrophobic coating 804 has an oil contact angle, herein an n-hexadecane droplet contact angle, of about 50° or more, e.g., about 55° or more, about 60° or more, about 65° or more, e.g., about 70° or more. The n-hexadecane droplet contact angle is measured relative to the applied surface 806, as shown by the water droplet contact angle θ in FIG. 8.

[0044]

[0053] In some embodiments, applying the hydrophobizing solution 204 to the system component 800 includes rubbing or pressing an applicator article impregnated with the hydrophobizing solution 204 against the pre-application surface 802. For example, in some embodiments, the method 700 may be performed using any one of the hydrophobizing applicators 200, 300, 400, and / or 500 described herein.

[0045]

[0054] In some embodiments of the method 700, the hydrophobizing chemical liquid is applied to a surface of the polishing system component without removing the polishing system component from the substrate processing environment. For example, in some embodiments, the system component 800 includes a platen shield 120, and the hydrophobizing chemical liquid 204 is applied to the radially inward surface of the platen shield 120 using the applicator device 600 described in FIG. 6. In those embodiments, applying the hydrophobizing chemical liquid 204 may include rotating the polishing platen 106, and thus the applicator device 600 coupled thereto, to press the hydrophobizing applicator 500 against the radially inward surface of the platen shield 120.

[0046]

[0055] In other embodiments, system component 800 comprises components of pad conditioner assembly 110, such as first actuator 126, conditioner arm 128, conditioner mounting plate 130, second actuator 132, shaft 134, or combinations thereof. In those embodiments, applying hydrophobizing solution 204 may include sliding hydrophobic applicator 400 into a gap disposed between conditioner mounting plate 130 and second actuator 132 such that shaft 134 is disposed through opening 406 prior to moving hydrophobic applicator 400 around shaft 134.

[0047]

[0056] In another embodiment, the hydrophobic coating 804 may be applied to the surface of the system component 800 after the system component 800 has been removed from the substrate processing environment 103. In some embodiments, the hydrophobic coating 804 is applied to the pre-coated surface 802 of the system component 800 using a spraying method, herein a "spray process," which generates droplets of the hydrophobizing solution 204 and exposes the pre-coated surface 802 thereto. Examples of suitable spray processes include ultrasonic spraying using an ultrasonic nozzle, pressurized spraying, and electrospraying.

[0048]

[0057] A typical ultrasonic spraying process involves operating an ultrasonic nozzle to convert high frequency sound waves into mechanical energy that is transferred to a liquid, e.g., hydrophobizing chemical solution 204, causing the liquid to atomize as it exits the orifice of the nozzle. The ultrasonic nozzle is configured to operate at a resonant frequency that determines the median droplet size of the droplets provided therefrom. Typically, ultrasonic nozzles operating at high frequencies provide a relatively smaller median droplet size compared to ultrasonic nozzles operating at lower frequencies. In one embodiment, the hydrophobizing solution 204 is applied using an ultrasonic nozzle operating at a frequency in the range of 10 kHz to about 200 kHz, for example, about 200 kHz or less, about 190 kHz or less, about 180 kHz or less, about 170 kHz or less, about 160 kHz or less, about 150 kHz or less, about 140 kHz or less, about 130 kHz or less, about 120 kHz or less, about 110 kHz or less, about 100 kHz or less, about 90 kHz or less, about 80 kHz or less, about 70 kHz or less, about 60 kHz or less, about 50 kHz or less, about 40 kHz or less, for example about 30 kHz or less. In some embodiments, the ultrasonic nozzle operates at a frequency of about 10 kHz or greater, such as about 20 kHz or greater, about 30 kHz or greater, about 40 kHz or greater, about 50 kHz or greater, about 60 kHz or greater, about 70 kHz or greater, about 80 kHz or greater, about 90 kHz or greater, about 100 kHz or greater, about 110 kHz or greater, about 120 kHz or greater, about 130 kHz or greater, about 140 kHz or greater, such as about 150 kHz or greater.

[0049]

[0058] The pressurized spray process generally involves using a propellant under pressure to provide an aerosol mist of the hydrophobizing solution 204 to which the pre-coated surface 802 of the system component 800 is exposed.

[0050]

[0059] In the electrospray process, a liquid, e.g., hydrophobic chemical solution 204, is electrostatically charged by application of a relatively high voltage, such as about 1000V or more, to an electrospray nozzle. This electrostatic charge causes the fluid to spray into a fine mist due to electrostatic repulsion. Typically, the system component 800 to be coated is placed on a grounded stage, which attracts the charged droplets to its surface. Advantageously, the electrostatic spray process can be used to obtain a substantially uniform hydrophobic coating 804 across a system component 800 having a relatively uneven surface.

[0051]

[0060] In some embodiments, various steps of method 700 may be used during refurbishment of system components 800, such as during refurbishment of substrate carrier assembly 104. In one embodiment, method 700 includes removing substrate carrier assembly 104, removing polishing fluid residues accumulated on its component surfaces, and applying a coating of hydrophobic coating 804 thereto using one or a combination of hydrophobic applicators 200, 300, 400, or 500 and / or a spray process. Thus, in some embodiments, hydrophobic coating 804 is applied to surfaces of carrier ring assembly 142, such as inner and outer diameters, carrier head 140, head cover 154, and surfaces of one or more annular membrane clamps 150 that may be exposed to polishing fluid during the polishing process. In some embodiments, at least some of the system components are new, and thus method 700 may not include removing polishing fluid residues therefrom.

[0052]

[0061] Beneficially, the method 700 and / or hydrophobic applicator 200, 300, 400, and / or 500 described herein facilitate the application of a hydrophobic coating 804 onto the surface of the system component 800. The hydrophobic coating 804 reduces the amount of polishing fluid residue that may accumulate on the component surface during consumable replacement and other maintenance procedures, providing a generally cleaner system and reducing substrate processing defects, such as surface scratches, associated with excessive residue accumulation. By reducing the amount of polishing fluid residue accumulation on the component surface, the methods and articles provided herein beneficially reduce the labor and time required to clean those residues and beneficially extend the useful life of the system components. In some embodiments, the method may be performed at a location remote from the polishing system 100, such as during refurbishment (refurbishment) of the substrate carrier assembly 104. In other embodiments, the method 700 may be performed without moving the polishing system component 800 from the substrate processing environment 103. Applying a hydrophobic coating on a system component without removing and / or moving the component from the substrate processing environment can also beneficially reduce the labor, time, and cost that may be incurred when removing the system component from the polishing system.

[0053]

[0062] While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the present disclosure may be devised without departing from the basic scope thereof, as determined by the following claims.

Claims

1. 1. A method for forming a hydrophobic coating on a surface of a polishing system component, comprising: cleaning the surface of the polishing system component to remove polishing fluid residue from the surface of the polishing system component; applying a hydrophobizing agent to the surface of the polishing system component; The method includes:

2. The method of claim 1 , wherein the polishing system component is part of a substrate carrier assembly and the hydrophobizing chemical solution is applied using a spray process.

3. The hydrophobizing solution is applied using a hydrophobic applicator, the hydrophobic applicator comprising: an applicator article formed of an open cell foam material having a porosity of 60% or greater; Hydrophobizing solution and The method of claim 1 , comprising:

4. The method of claim 3 , wherein the applicator article and the hydrophobizing solution are packaged in a hermetically sealed container.

5. The method of claim 4 , wherein the applicator article disposed in the closed container is impregnated with the hydrophobizing liquid chemical.

6. The method of claim 4 , wherein the enclosed container includes a membrane layer separating the applicator article from the hydrophobizing liquid, and further comprising breaking the membrane to allow the applicator article to be saturated with the hydrophobizing liquid.

7. the polishing system component includes a platen shield; the hydrophobic applicator is coupled to a polishing platen; applying the hydrophobizing solution includes rotating the polishing platen to press the hydrophobizing applicator against a radially inward surface of the platen shield.

7. The method according to any one of claims 3 to 6.

8. The polishing system component is disposed within a substrate processing environment of a polishing system; The method of claim 3 , wherein the hydrophobizing chemical solution is applied to the surface of the polishing system component without moving the polishing system component from the substrate processing environment.

9. the polishing system component includes a conditioner mounting plate having a first surface for mounting a polishing pad conditioning disk and a second surface opposite the first surface; The method of claim 8 , wherein the hydrophobizing solution is applied to the second surface without removing the conditioner mounting plate from a pad conditioner assembly.

10. The method of claim 3, wherein the open cell foam material has a density of 50 kg / m 3 or more.

11. The method of claim 3, wherein the open cell foam material has a glass transition temperature (Tg) of 25°C or less.

12. 1. A method for forming a hydrophobic coating on a surface of a polishing system component, comprising: cleaning the surface of the polishing system component to remove polishing fluid residue from the surface of the polishing system component; Applying a hydrophobizing chemical solution to the surface of the polishing system component, the polishing system component being disposed within a substrate processing environment of a polishing system, and the hydrophobizing chemical solution being applied to the surface of the polishing system component without moving the polishing system component from the substrate processing environment. The method includes:

13. The hydrophobizing solution is applied using a hydrophobic applicator, the hydrophobic applicator comprising: an applicator article formed of an open cell foam material having a porosity of 60% or greater; The hydrophobizing chemical solution; The method of claim 12, comprising:

Images