Semiconductor Device

Abstract

To provide a semiconductor device that is excellent in portability and at-a-glance display readability.SOLUTION: A semiconductor device has a display panel having flexibility, a first housing supporting a first area of the display panel, a second housing supporting a second area of the display panel, and a substrate adhered to the first housing and having flexibility. The display panel is deformable to a developed state where the first area and the second area are located on substantially the same plane and a folded state where the first area and the second area are located in an overlapping manner. The second housing has a groove part in which part of the substrate having flexibility can slide. In the developed state, part of the substrate having flexibility is inserted into the groove part. In deformation operations to the folded state, at least part of the substrate having flexibility inserted into the groove part is drawn out.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to an article, a method, or an apparatus for manufacturing. In particular, the present invention relates to a composition of matter. One embodiment is a semiconductor device, a display device, a light-emitting device, a lighting device, a driving method thereof, or a method for driving the same. In particular, one aspect of the present invention relates to a method for manufacturing an electronic device having a display device, an information processing device, The present invention relates to a device, a communication information device, or a manufacturing method thereof. [Background technology]

[0002] Portable information processing devices such as smartphones, tablets, and phablets are being actively developed. For example, electronic devices using flexible display panels are known (see Patent Document 1). In addition, a multi-panel electronic device is known (Patent Document 2). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2012-190794 A [Patent Document 2] JP 2012-502372 A Summary of the Invention [Problem to be solved by the invention]

[0004] The display area of ​​a semiconductor device can be enlarged to increase the amount of information to be displayed. On the other hand, in the case of portable devices, the display area needs to be enlarged. Portability is reduced. In other words, the display is easier to view and the It is difficult to achieve both.

[0005] An object of one embodiment of the present invention is to provide a semiconductor device or the like that has excellent portability. Another object of the present invention is to provide a semiconductor device or the like having excellent display visibility. It is an object of the present invention to provide a semiconductor device or the like having excellent portability and visibility of display. It is an object of the present invention to provide a semiconductor device or the like. One of the challenges we face is to:

[0006] Note that these problems do not preclude the existence of other problems. It is not necessary to solve all of these problems. Problems other than those mentioned above may be solved by the description in the specification, etc. It is not possible to extract problems other than those mentioned above from the description of the specification, etc. It is possible. [Means for solving the problem]

[0007] One aspect of the present invention is a display panel having flexibility and a second support for supporting a first region of the display panel. a first housing, a second housing supporting a second region of the display panel, and a second housing fixed to the first housing. The display panel has a flexible base material, and the first region and the second region are substantially flush with each other. and a folded state in which the first region and the second region are overlapped. The second housing has a groove in which a part of the flexible base material can slide, and the second housing is expandable. In the folded state, a part of the flexible base material is inserted into the groove, and in the deformation operation to the folded state, In the semiconductor device, at least a part of the flexible substrate inserted in the groove is pulled out. It is.

[0008] In the above-mentioned semiconductor device, in the folded state, the flexible base material has a curved surface. The member may be folded so as to be

[0009] Moreover, one aspect of the present invention is a display panel having flexibility and a support for a first region of the display panel. a first housing for supporting the second region of the display panel; and a second housing for supporting the second region of the display panel. a first flexible substrate attached to the first housing and a second flexible substrate attached to the first housing. The display panel has a developed state in which the first area and the second area are positioned substantially on the same plane. , and a folded state in which the first region and the second region are positioned overlapping each other, The flexible substrate is provided on the display surface side of the display panel, and the second flexible substrate is provided on the opposite side of the display surface of the display panel, and the second housing is made of a first flexible base material. A first groove portion in which a part of the substrate is slidable, and a second groove in which a part of the substrate having a second flexibility is slidable. a first groove portion, and in the unfolded state, a portion of the base material having the first flexibility is inserted into the first groove portion; At the same time, a part of the base material having the second flexibility is inserted into the second groove portion, and the base material is deformed into the folded state. In operation, at least a portion of the first flexible substrate inserted into the first groove is pulled. At least a portion of the second flexible substrate is inserted into the second groove. It is a semiconductor device that is drawn out.

[0010] Moreover, one aspect of the present invention is a display panel having flexibility and a display device supporting a first region of the display panel. a first housing for supporting the second region of the display panel; and a second housing for supporting the second region of the display panel. a first flexible substrate attached to the second housing and a second flexible substrate attached to the second housing. The display panel has a developed state in which the first area and the second area are positioned substantially on the same plane. , and a folded state in which the first region and the second region are positioned overlapping each other, The flexible substrate is provided on the display surface side of the display panel, and the second flexible substrate is provided on the opposite side of the display surface of the display panel, and the first housing is made of a second flexible base material. The second housing has a first groove portion in which a part is slidable, and a part of the base material having a first flexibility is In the deployed state, a portion of the base material having the first flexibility is a second groove portion. A portion of the substrate having the second flexibility is inserted into the first groove and folded. In the deformation operation to the folded state, a small amount of the first flexible base material inserted into the second groove portion a second flexible substrate at least partially pulled out and inserted into the first groove; At least a portion of the semiconductor device is exposed.

[0011] In the above-mentioned semiconductor device, in a folded state, the first flexible base material and the second flexible base material are Each of the flexible substrates may be folded to have a curved surface. Effect of the Invention

[0012] According to one embodiment of the present invention, a semiconductor device or the like that has excellent portability can be provided. According to one embodiment of the present invention, a semiconductor device or the like with excellent viewability of a display can be provided. According to one embodiment of the present invention, a highly reliable semiconductor device or the like can be provided. According to one embodiment of the present invention, a semiconductor device or the like that is highly portable and has a highly viewable display is provided. According to one embodiment of the present invention, a novel semiconductor device or the like can be provided. Cut.

[0013] The description of these effects does not preclude the existence of other effects. An embodiment does not necessarily have to have all of these effects. Effects other than these may also be included. The above is self-evident from the description, drawings, claims, etc. Other effects can be extracted from the claims and other descriptions. [Brief description of the drawings]

[0014] [Figure 1] FIG. 1 is a perspective view illustrating a structural example of a semiconductor device of one embodiment of the present invention. [Diagram 2] FIG. 1 is a cross-sectional view illustrating a structural example of a semiconductor device of one embodiment of the present invention. [Diagram 3] 1A and 1B are a cross-sectional view and a perspective view illustrating a structural example of a semiconductor device of one embodiment of the present invention. [Figure 4] 1A and 1B are a perspective view and a cross-sectional view illustrating a structural example of a semiconductor device of one embodiment of the present invention. [Diagram 5] FIG. 1 is a cross-sectional view illustrating a structural example of a semiconductor device of one embodiment of the present invention. [Figure 6] FIG. 1 is a perspective view illustrating a structural example of a semiconductor device of one embodiment of the present invention. [Figure 7] 1A and 1B are diagrams illustrating an example of the configuration of a display panel. [Figure 8] 1A and 1B are diagrams illustrating an example of the configuration of a display panel. [Figure 9] 1A and 1B are diagrams illustrating an example of the configuration of a display panel. [Figure 10] 1A and 1B are diagrams illustrating an example of the configuration of a display panel. [Figure 11] 1A to 1C illustrate one embodiment of a manufacturing method of a display panel. [Figure 12] 1A to 1C illustrate one embodiment of a manufacturing method of a display panel. [Figure 13] 1A to 1C are diagrams illustrating examples of electronic devices. [Figure 14] FIG. 1 is a cross-sectional view illustrating a structural example of a semiconductor device of one embodiment of the present invention. [Figure 15] FIG. 1 is a cross-sectional view illustrating a structural example of a semiconductor device of one embodiment of the present invention. [Figure 16] FIG. 1 is a cross-sectional view illustrating a structural example of a semiconductor device of one embodiment of the present invention. [Figure 17] FIG. 1 is a cross-sectional view illustrating a structural example of a semiconductor device of one embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. The present invention is not limited to the following description, and the scope of the present invention is not limited to the following description. It will be readily understood by those skilled in the art that various changes in form and details may be made. However, the present invention should not be construed as being limited to the description of the following embodiments. In the embodiments described below, the same parts or parts having similar functions are referred to as the same. The same symbols or hatch patterns are used in common between different drawings, and their repeated explanation is omitted. Omitted.

[0016] In each figure described in this specification, the size, thickness, or area of ​​each component is not clearly indicated. The figures may be exaggerated for illustrative purposes and are not necessarily limited to scale.

[0017] In addition, ordinal numbers such as 1st, 2nd, etc., used in this specification are used to avoid confusion of components. Therefore, for example, "the first" can be changed to "the second This can be explained by replacing it with "the" or "the third" etc. as appropriate.

[0018] In addition, in this specification, the terms "above" and "below" mean that the positional relationship of the components is "directly above" or "below". For example, the term "second layer on the first layer" does not necessarily mean "directly below." If the expression is a slang expression, it does not exclude the inclusion of other components between the first and second layers. The same applies to ".

[0019] (Embodiment 1) In this embodiment, a semiconductor device of one embodiment of the present invention will be described with reference to FIGS. A semiconductor device according to one embodiment of the present invention includes a flexible display panel supported by a plurality of housings. In addition, the display panel has a structure in which the areas supported by the different housings are positioned on substantially the same plane. In the unfolded state, the areas supported by different housings overlap each other. In the following, a flexible display panel supported by two housings is The display panel is curved between the two housings, and when the display panel is in an unfolded state (unfolded state), Take as an example a semiconductor device that can be transformed into a folded state (folded state) and a folded state (folded state). I will explain it below.

[0020] 1A, 1B, and 1C are perspective views of a semiconductor device 100 according to one embodiment of the present invention. The semiconductor device 100 includes a flexible display panel 102 and a region of the display panel 102. A housing 104 supports a region 110 of the display panel 102, and a housing 106 supports a region 112 of the display panel 102. A pair of flexible substrates 108a and 108b are provided between the housing 104 and the housing 106. One end of each of the pair of flexible base members 108a and 108b is connected to a housing. It is fixedly attached to the body 104 .

[0021] FIG. 1A shows a region 110 supported by a housing 104 and a region 112 supported by the housing 104 in a display panel 102. 1 shows a deployed state in which the area 112 supported by the support 06 is positioned substantially on the same plane. In the semiconductor device 100, a groove is provided on the surface of the housing 106 facing the housing 104. The other ends of the pair of flexible base members 108a and 108b are fixed to the housing 104. is disposed in a groove in the housing 106.

[0022] FIG. 1B shows a folding display panel 102 in which an area 110 and an area 112 of the display panel 102 overlap each other. In the folded state, the display supported by the housing 104 and the housing 106 is The panel 102 is folded to have a curved surface in the area between the housing 104 and the housing 106. In the semiconductor device 100 of the present embodiment, the The groove portion functions as a slide base, and the flexible groove portion is provided between the adjacent housings. The substrates 108a and 108b slide in the grooves. In the folded state shown in FIG. 1, the flexible member 104 is disposed in a groove of the housing 106 in the unfolded state. At least a part of the base members 108a and 108b is pulled out and bent in the same manner as the display panel 102. In the folded state, the semiconductor device 100 is folded so as to have a flat surface. It is highly portable, and when unfolded, the seamless, wide display area allows for easy viewing of the display. An excellent semiconductor device can be obtained.

[0023] FIG. 1C is a development view showing each component of the semiconductor device 100. As shown in FIG.

[0024] FIG. 2A shows a cross-sectional view of the semiconductor device 100 taken along line A1-B1 in FIG. FIG. 2B shows a cross-sectional view of the semiconductor device 100 taken along line A2-B2 of FIG.

[0025] As shown in FIG. 2A, in the unfolded state, the device is fixed to the housing 104 by an adhesive layer 111. The region 160 of the flexible substrate 108a is inserted into the groove 105 of the housing 106. The length of the region 160 located in the groove 105 is set to be equal to the length of the display panel in the folded state. It is possible to appropriately set the radius of curvature of the filter 102. In FIG. 1B, the flexible base material 108a is disposed inside the housing 104 and supports the display panel. The display surface of the display unit 102 or the surface opposite to the display surface (also referred to as the back surface) is provided. However, the embodiment of the present invention is not limited to this. For example, It may be provided on the outside of the housing 104 .

[0026] In addition, in the folded state as shown in FIG. 2B, one side of the housing 104 and the housing 1 The housing 104 and the housing 106 are arranged so as to overlap each other so that one surface of the housing 104 and the other surface of the housing 106 are in contact with each other. A flexible base material 108a is disposed in the groove 105 of the housing 106 in the folded state. The length of the region 170 is a flexible portion disposed in the groove 105 of the housing 106 in the unfolded state. In other words, the length of the region 160 of the substrate 108a from the deployed state is short. In the operation of deforming the semiconductor device 100 into the folded state, A part of the flexible base material 108a is pulled out from the groove portion 105. Also, in the folded state In the cross-sectional view, the display panel 102 is disposed in a region that does not overlap with the housing 104 and the housing 106. and a region protruding from the housing 104 and the housing 106 in the vicinity of the housing 104, and the region has a curved surface. Similarly, in the folded state, the flexible base material 108a is and the area that does not overlap with the housing 106 (the area protruding from the housing 104 and the housing 106 in the cross-sectional view). The base material 108a has a curved surface. The curved surface is located outside the curved surface of the display panel 102. The curved surface of the flexible base material 108a is sandwiched between the curved surface of the display panel 102. The housing 104 and the housing 106 face each other through the respective side surfaces.

[0027] When the display panel 10 is in the folded state and / or when the display panel 10 is in the unfolded state and the folded state, The flexible base material 108a is disposed on the outer side of the curved surface of the base material 2, so that This reduces the load such as stress on the curved area of ​​the display panel 102, and prevents damage to the curved area. It is possible to suppress the occurrence of such a problem.

[0028] The display panel 102 is fixed to at least one of the housing 104 and the housing 106. In FIG. 2, the display panel 102 is fixed to the housing 104. In this example, the semiconductor device is not fixed to the housing 106. When the body device 100 is folded, the display panel 102 can slide within the housing 106. Therefore, it is possible to further reduce the load on the curved surface of the display panel 102. .

[0029] The configuration of the flexible base material 108a is not limited to that shown in FIG. 1 or FIG. 2(A) and (B). For example, as shown in FIG. 2C, an anchor portion 107 is attached to an end portion of a flexible base material 108a. The anchor portion 107 may be provided at the end of the flexible base material 108a. By doing so, the deformation from the unfolded state to the folded state (or the deformation from the folded state to the unfolded state) During deformation, the entire area of ​​the flexible base material 108a is removed from the groove 105 of the housing 106. As shown in FIG. 2(C), the flexible In the case where the base material 108a has an anchor portion 107, the groove portion 105 has at least two types. Specifically, the flexible base material 108a is attached to the outside of the housing 106. The height of the groove 105 in the region where the anchor portion 10 is to be exposed is set to be equal to the height of the anchor portion 10 in the flexible base material 108a. 7 and is lower than the height of the anchor portion 107. The height of the groove 105 in the region where the car portion 107 is located is higher than the height of the anchor portion 107. Alternatively, the flexible base material 108a may be moved away from the area where the base material 108a is pulled out from the housing 106. The height of the groove 105 may be increased stepwise as the anchor portion The shape of the anchor portion 107 is not limited to the configuration shown in FIG. It does not have to be flexible.

[0030] In addition, in the display panel 102 in the folded state, the area hidden by folding is not displayed. For example, the area of ​​the display panel 102 supported by the housing 104 may be The area 110 is a display area, and the area 112 supported by the housing 106 is a non-display area. Therefore, the power consumption of the area not visible to the user (here, area 112) can be reduced. In addition, when the region 112 is a non-display region, the curved region ( The area having a curved surface may be a display area or a non-display area. In this case, the area and the area 110 may be operated separately, or may be operated as a continuous display area. It is also possible to use the following.

[0031] Each component of the semiconductor device 100 will be described in detail below.

[0032] The housing 104 and the housing 106 are only required to support the display panel 102. It is sufficient that the display device 102 is provided on at least one of the display surface side and the back surface side of the panel 102. 2A and 2B, the outer periphery of the display surface side of the display panel 102 ( The display panel 102 is supported by a rear side and a rear surface of the housing. In this way, by using a housing that supports both sides of the display panel 102, This increases the mechanical strength and prevents the semiconductor device 100 from being damaged.

[0033] Each housing may have rigidity. In addition, each housing may have a structure that allows the housing itself to withstand a twisting or bending force. Each housing may be made of a flexible material that is at least more flexible than the display panel 102. It is sufficient to use a material with low elasticity, and an elastic body such as hard rubber may be used for the skeleton. In addition, materials that can be used to construct each housing include plastic, metals such as aluminum, steel, Stainless steel, alloys such as titanium alloys, rubbers such as silicone rubber, etc. can be used.

[0034] In the housing 104 and the housing 106, the area located on the display surface side corresponds to the front surface of the display panel 102. If the display area does not overlap with the display surface, the housings may be made of a material that does not transmit light. If the area located at the position overlaps with at least a part of the display area of ​​the display panel 102, the display It is preferable that each housing is made of a material that transmits light from the display panel 102. A material that does not transmit light may be used in the region located on the opposite side.

[0035] The housing 104 and / or the housing 106 house circuits, electronic components, batteries, etc. In addition, it is possible to prevent the housing 104 and / or the housing 106 from being subjected to shocks, drops, etc. In order to provide a function of protecting the display panel 102 or the circuits and electronic components housed therein from To achieve this, each housing is constructed using materials such as metal, resin, rubber, or a combination of these. You may do so.

[0036] In FIG. 2, the housing 104 and the housing 106 have a space for holding the display panel 102. However, the embodiment of the present invention is not limited to this. 104 and / or the housing 106 are arranged perpendicular or parallel to the display surface of the display panel 102. The housing 104 and / or the housing 106 may have a structure separated in the display panel direction. In the case where the display screen of the display panel 102 is divided into two parts, the display screen of the display panel 102 may be divided into two parts, one for each part. Each of these members is fixed to the housing and the display panel 102 by a fixing means such as an adhesive or a screw. Although not shown, the housing 104 and / or the housing 106 may have an air gap. The control unit, power supply unit, storage battery, antenna, and other circuits and electronic components may be stored within the space. These circuits and electronic components are connected to the display panel 102 using a flexible printed circuit (FPC). ) may also be used.

[0037] When the housing 104 and / or the housing 106 are fixed to the display panel 102, the housing 104 and / or the housing 106 are fixed to the display panel 102 by adhesive or the like. Alternatively, a flexible substrate may be provided between the display panel 102 and the housing. The flexible substrate may have a function as a protective member for the display panel 102, for example. The display panel 10 may have a function for routing wiring. 2. Using a screw that penetrates two or more of the above, or a pin or clip that holds them in place , each component may be fixed.

[0038] When the display panel 102 is fixed to the housing, the F connected to the display panel 102 is The PC is preferably provided in the area where the display panel 102 is fixed to the housing. An example of a semiconductor device having such a structure is shown in FIG. In FIG. 16(A) and FIG. 16(B), the display panel 102 is attached to the housing 1 by the adhesive layer 111a. 1 shows a case where the display panel 102 is fixed to the adhesive layer 111a. In the deployed state, the FPC 132 is provided in the area where the FPC 132 overlaps the (Fig. 16(A)) to the folded state (Fig. 16(B)) or from the folded state to the unfolded state (Fig. 16(C)). When the display panel 102 is transformed into the open state, the positions of the FPC 132 and the connection portion of the display panel 102 change. Therefore, it is possible to prevent defects such as peeling of the connection. The connection between the cable 102 and the FPC 132 is not limited to the configuration shown in FIG.

[0039] The thickness of each of the multiple housings may be approximately the same, or the thickness of each housing may be different. If the thickness of two or more housings, preferably all housings, is approximately the same, This is preferable because it is easy to maintain the horizontality of the display surface when the semiconductor device 100 is in an expanded state. In addition, by disposing the display panel 102 at approximately the center of the semiconductor device 100 in the thickness direction, When the display panel 102 is bent in such a way that the semiconductor device 100 is bent, This allows the stress on the rod 102 to be kept to a minimum.

[0040] In FIG. 2, a part of the thickness of the housing 106 is made to slide on the flexible base material 108a. The thickness of the groove 105 is thicker than the thickness of the housing 104. The embodiment of the present invention is not limited to this. In addition, the above-mentioned various electronic components may be mounted in one of the multiple housings. The whole or most of the components are integrated into one housing, which serves as a relatively thick main body, and the thickness of the other housings is reduced. The thickness of the housing is reduced, and the housing is simply used as a member for supporting the display panel 102. It can also be used.

[0041] The display panel 102 may be a flexible panel having at least a display area. The display elements included in the display panel 102 are appropriately selected from light-emitting elements, liquid crystal elements, electrophoretic elements, etc. It can be used as appropriate.

[0042] In addition, the outer periphery of the display surface side of the display panel 102 (the area on the display surface side other than the display area) It is more preferable to provide a protective layer in the region that supports the back side and the back side. By providing a protective layer, the mechanical strength of the curved portion can be further increased. In this case, a protective layer should be provided at least in the curved area between the two housings. In that case, for example, the substrates 108a and 108b may be flexible in the unfolded state. A protective layer may be selectively provided in the area where the display panel 102 overlaps with the protective layer. When a light-transmitting member is used, the region overlapping the display region of the display panel 102 is A protective layer having the light-transmitting property may be provided. When using such a material, for example, wiring and driving circuits located at the edge of the display panel 102 are A protective layer can be provided to cover the area. In that case, the wiring and the driving circuitry can be physically In addition, by blocking light from the wiring and the drive circuit, deterioration of the wiring and the drive circuit can be prevented. Furthermore, the wiring and the driving circuits are visible, which would spoil the aesthetic appearance of the semiconductor device itself. It is possible to prevent the baby from falling asleep.

[0043] The protective layer may be made of, for example, plastic, rubber, metal, alloy, etc. If plastic, rubber, titanium alloy, etc. are used for the layers and the housing, it will be lightweight and resistant to breakage. This is preferable because it is easy to use.

[0044] It is also preferable to use a highly tough material for the protective layer and the housing. This improves impact resistance. For example, a semiconductor device made of organic resin or thin metal material can be realized. By using such a material or an alloy material, a semiconductor device that is lightweight and resistant to breakage can be realized. For the same reason, the substrate constituting the display panel 102 should be made of a highly tough material. is preferred.

[0045] The flexible base materials 108a and 108b have a thickness of 1 mm or more and 100 mm or more in a folded state. A material that can be bent to a degree that has a radius of curvature of 1 mm or less can be applied. For example, plastic, rubber, metal, alloy, etc. can be used. In the case where the base materials 108a and 108b are provided so as to overlap the display area, at least the display panel The flexible base members 108a and 108b are made of a material that is transparent to the light from the panel 102. However, the flexible substrates 108a and 108b must be applied to the display surface. A flexible base material 108a is provided on the back side or on the periphery of the display area. When the flexible substrates 108a, 108b do not overlap with the display area, The light transmittance of the material is not important. In addition, when a light transmittance material is used for a flexible base material, When a flexible base material is provided on the rear side of the display panel 102, The substrates do not necessarily have to be separated into a pair, but may be one continuous member.

[0046] In order to facilitate bending of the semiconductor device, it is preferable that the display panel 102 has high flexibility. On the other hand, if the flexibility of the display panel 102 is increased too much, the bending movement of the display panel 102 may become difficult. During operation, the stress is not sufficiently distributed by the support substrate used in the display panel 102. In this case, cracks may occur in the curved area of ​​the display panel 102, and the semiconductor device may be damaged. However, in the semiconductor device according to one embodiment of the present invention, the reliability of the display panel may be deteriorated. By providing a flexible base material on the outside of the panel 102, the folding movement is enabled by the base material. This makes it possible to distribute stress to the curved area of ​​the display panel 102 during operation. Even if the display panel 102 has high flexibility, the deterioration of the reliability of the display panel 102 is suppressed. Here, the flexible base materials 108a and 108b are the display panel. It is preferable that the flexible film is less flexible than the display panel 102. In addition, by providing a base material having a lower flexibility than the display panel 102, the semiconductor device can be easily folded. The present invention provides a highly reliable semiconductor device that maintains the ease of use while improving strength against bending. It is possible.

[0047] The flexible base materials 108a and 108b are used regardless of whether the display panel 102 is curved or not. For example, a switch or a MEMS pressure sensor may be provided to determine whether the pressure sensor is in the ON position or the OFF position. Alternatively, the sensor may be formed using a pressure sensor or the like. A metal material is used for the base materials 108a and 108b, and the metal material is detected on the display panel 102. A sensor for detecting the folded or unfolded state of the semiconductor device may be provided to determine whether the semiconductor device is in an unfolded state or a folded state.

[0048] The adhesive layer 111 that bonds the housing 104 and the flexible base materials 108a and 108b is Various adhesives can be used. For example, adhesives that harden at room temperature, such as two-liquid mixed resins, can be used. Resins such as resins, photocurable resins, and thermosetting resins can be used. In addition, the housing 104 and the flexible base materials 108a and 108b may be bonded to each other by an adhesive. For example, a flexible base material 108 may be used for the adhesion to the base material 108. Alternatively, a screw penetrating through 108a and 108b, or a pin or clip for clamping these may be used. Alternatively, in the process of processing the housing, a flexible base material is fixed to the housing so as to be sandwiched therebetween. This is also fine.

[0049] The semiconductor device 100 of the present embodiment is a display panel 102 having a curved region (a curved surface). Deformation to the unfolded or folded state while reducing stress and other loads on the area where the Therefore, the durability of the display panel 102 in the bending region can be improved. This makes it possible to provide a highly reliable semiconductor device. In the bending operation of 00, the flexible base materials 108a and 108b function as auxiliary members. By this, even if a highly tough material is used for the display panel 102, the display panel 102 can be easily folded. Therefore, for example, a film for protecting the display area can be provided. Since the display panel 102 can be applied to the semiconductor device 100, This makes it possible to further improve the reliability of the device.

[0050] In addition, a pair of flexible substrates are provided between the housings, and the pair of flexible substrates slide. By doing so, it is also possible to place two adjacent housings close to each other. For example, As shown in FIG. 3(A) and FIG. 3(B), the semiconductor device 120 is made of a housing 104 and a housing 106. and may be arranged in close proximity to each other or in contact with each other.

[0051] In addition, in the examples shown in FIG. 2 and FIG. 3, the groove portion 105 is provided on one of the adjacent housings. One aspect of the invention is not limited to this, and grooves may be provided in both of the adjacent housings. As an example, in the configuration shown in FIG. 2, a groove 105a is provided in the housing 104. 14, a configuration in which the housing 104 and the housing 106 both have grooves is shown. By providing 105a and 105 in adjacent housings 104 and 106, respectively, As described above, it is easy to make the thickness of the housing the same. By making the thickness of each of the housings approximately the same, the display surface of the semiconductor device in the unfolded state can be This is preferable because it is easy to maintain horizontality. Although the case where the grooves are provided on both sides of the housing has been shown, the grooves are also shown in other drawings disclosed in this specification. It is possible to provide a plurality of sections.

[0052] As shown in FIG. 4, the display panel 102 is made of flexible plastic on both the display surface side and the back surface side. FIG. 4A shows the semiconductor device 140 in an expanded state. 4(B) is a cross-sectional view taken along line A3-B3 of FIG. 4(A). 4(C1) and 4(C2) are cross-sectional views of the semiconductor device 140 in a folded state. be.

[0053] The semiconductor device 140 shown in FIG. 4 is a semiconductor device including a display panel 102 between the housing 104 and the housing 106. The display panel 102 has flexible base materials 108a and 108b facing the display surface side. The display panel 102 has a flexible base material 109a facing the rear surface side. The flexible base material 109a provided on the side facing the display surface is a pair of base materials, similar to the display surface side. Alternatively, the substrate 104 may be formed as a single continuous substrate over at least the area overlapping the display panel 102. In addition, when the flexible base materials 108a and 108b are light-transmitting, The flexible base materials 108a and 108b are provided so as to overlap the display area of ​​the display panel 102. However, if the base material does not have light-transmitting properties, the base material may overlap with areas other than the display area. It is preferable to separate the substrates into pairs so that the substrates can be separated into two pairs.

[0054] As shown in the cross-sectional view of FIG. 4B, in the unfolded state, the flexible The region 172 of the substrate 108a having the property is located in the groove 105 of the housing 106a. The region 174 of the flexible substrate 109a attached to the housing 106b is aligned with the groove 104b. Located at 5b.

[0055] In FIG. 4, the housing 104 is divided into housings 104a, 104b, 104c, 104d, 104e, 104f, 104g, 104h ... 104b are fixed to each other by an adhesive layer 113, and the housing 106 is The display panel 102 is divided into housings 106a and 106b in a direction perpendicular to the display surface of the display panel 102. In this example, the electrodes are fixed to each other by the adhesive layer 113. , 114 may be replaced by screws, pins, clips, etc.

[0056] In addition, in FIG. 4, the adhesive layer 111 is not used to fix the flexible base materials 108a and 108b. In the case where the sensor is sandwiched between the housing 104 (specifically, the housing 104a or 104b), is shown as an example.

[0057] 4(C1) and 4(C2) show the folded state of the semiconductor device 140. 40 is a flexible base material 108a on both the display surface side and the back surface side of the display panel 102. , 108b and 109a are provided, the display surface of the display panel 102 is on the inside. You can fold it so that the display surface is on the outside, or you can fold it so that the display surface is on the outside. (This is called outward bending.)

[0058] FIG. 4(C1) shows the semiconductor device 140 folded so that the display surface faces outward. As described above, in the folded state, the flexible The semiconductor device 140 is then bent outwardly. In this case, the flexible base material 108a is located outside the display panel 102. In this case, the length of the region 176 of the flexible substrate 108a located in the groove 105 is 5b.

[0059] On the other hand, FIG. 4(C2) shows the semiconductor device 140 folded so that the display surface faces inward. When the semiconductor device 140 is bent inward, the flexible base material 108a is In this case, the flexible substrate 105 is located on the inner side of the display panel 102. The length of the region 182 of the flexible substrate 109a located in the groove 105b is It is longer than the length of region 184.

[0060] By making the semiconductor device bendable outward, it becomes possible to diversify the display form. By making the semiconductor device bendable inward, scratches and dirt on the display surface during transportation can be prevented. For example, when carrying a semiconductor device in a pocket or bag, is preferred.

[0061] In FIG. 4, a flexible base material is fixed to the housing 104, and these are slidably mounted on the housing 106. However, the embodiment of the present invention is not limited to this. For example, As shown in FIG. 5, a flexible film is disposed on one surface (for example, a display surface) of the display panel 102. The base material 108a having the above structure is fixed to the housing 104a, and the groove 105 is provided in the housing 106a. The flexible member is configured to slide and is located on the other surface (for example, the back surface) of the display panel 102. The base material 109a is fixed to the housing 106b and slides in the groove 105c provided in the housing 104b. The configuration may be such that the

[0062] In the above description, the flexible base material is fixed to one of the adjacent housings and fixed to the other. However, one embodiment of the present invention is not limited to this. The base material may have an area bonded to both of the adjacent housings. In this case, An example of the configuration of the semiconductor device is shown in FIG. 15(A). In FIG. 15(A), a flexible substrate 1 The base material 108a is bonded to the housing 104 via the elastic body 130a, and the base material 108 has flexibility. 1 shows a developed state of a semiconductor device in which the housing 106 is bonded to the substrate 102 via an elastic body 130b. When such a semiconductor device is bent, as shown in FIG. 30a and the elastic body 130b stretch, concentrating stress on the curved area of ​​the display panel 102. Since the elasticity can be reduced, the bending operation can be performed with good operability. Examples of the material include springs, rubber, organic resins, etc. In B), an example in which an elastic body is provided in the configuration shown in FIG. 14 is shown, but In the configuration, the elastic body can be applied. FIG. 15C shows an example of a semiconductor device in which an elastic body 130b is provided.

[0063] The display panel 102 may be bonded to the housing via an elastic body. In FIG. 17A, the display panel 102 is bonded to the housing 104 via an elastic body 130c. The semiconductor device is attached to the housing 106 via the elastic body 130d in an expanded state. FIG. 17(B) shows the semiconductor device shown in FIG. 17(A) in a folded state. As shown in FIG. 1, the elastic body 130c and the elastic body 130d are stretched, so that the bending movement of the semiconductor device is This allows operations to be performed with ease.

[0064] In the above description, the housings supporting the display panel 102 are the housing 104 and the housing 106. Although the semiconductor device having two housings and capable of being folded in two has been shown, For example, as shown in FIG. , a flexible substrate 11 is supported by the housing 103 and the housing 106 and is disposed between the adjacent housings. By arranging 7a, 117b, 118a, and 118b, it can be folded into three. It may be a semiconductor device 180.

[0065] FIG. 6(A) shows the semiconductor device 180 in an unfolded state, and FIG. 6(B) shows the semiconductor device 180 in a folded state. FIG. 6C shows the folded state of the semiconductor device 180. In the semiconductor device 180, the flexible base members 117a and 117b are One end is fixed to one of the housing 106 and the housing 103, and the other end is fixed to the other of the housing 106 and the housing 103. The flexible substrates 118a and 118b slide along a groove provided on the other substrate. One end is fixed to one of the housings 103 and 104, and the other end is fixed to the other of the housings 103 and 104. It slides in the groove provided on the side.

[0066] In addition, by setting the number of housings supporting the display panel 102 to n (n is an integer of 2 or more), It is possible to make a semiconductor device that can be folded into n pieces. This is similar to a semiconductor device that can be folded into a single piece.

[0067] As described above, the semiconductor device of this embodiment supports a flexible display panel. A flexible base material is provided between adjacent housings, and the flexible base material is attached to one of the housings. By making one side fixed and the other side slidable, portability, visibility of display, and reliability are improved. It is possible to provide a semiconductor device with high performance.

[0068] Note that the configurations of each drawing shown in this embodiment mode may be appropriately combined with the configurations of other drawings. It can be used.

[0069] The configuration, method, etc. of this embodiment may be appropriately combined with the configurations, methods, etc. of other embodiments. It can be used in combination.

[0070] (Embodiment 2) In this embodiment, a flexible display panel which can be used for the semiconductor device of one embodiment of the present invention will be described. As an example, an active matrix type display panel using an EL element is shown in FIG. 7 to FIG. 12. The display panel is not limited to a display panel having an EL element, but may be any other display panel. A display panel including a display element such as a liquid crystal element or an electrophoretic element may also be used.

[0071] <Example 1> FIG. 7A shows a plan view of a flexible display panel. An example of a cross-sectional view taken along line 4-B4 is shown in FIG.

[0072] The display panel shown in FIG. 7B includes an element layer 1101, an adhesive layer 1105, and a substrate 1103. The element layer 1101 includes a substrate 1201, an adhesive layer 1203, an insulating layer 1205, and a plurality of transistors. A resistor 1240, a conductive layer 1157, an insulating layer 1207, an insulating layer 1209, and a plurality of light-emitting elements 1 230, insulating layer 1211, sealing layer 1213, insulating layer 1261, colored layer 1259, light-shielding layer 1 257 and an insulating layer 1255.

[0073] The conductive layer 1157 is electrically connected to the FPC 1108 via a connector 1215 .

[0074] The light-emitting element 1230 includes a lower electrode 1231, an EL layer 1233, and an upper electrode 1235. The EL layer contains an organic light-emitting material. The lower electrode 1231 is the solenoid of the transistor 1240. The end of the lower electrode 1231 is electrically connected to the insulating layer 12. The light emitting element 1230 is covered with the upper electrode 12. The light-transmitting layer 35 transmits the light emitted by the EL layer 1233 .

[0075] A colored layer 1259 is provided at a position overlapping the light-emitting element 1230, and overlaps the insulating layer 1211. The colored layer 1259 and the light-shielding layer 1257 are disposed at the insulating layer 1259. The space between the light emitting element 1230 and the insulating layer 1261 is filled with a sealing layer 1213. It has been done.

[0076] The display panel has a light extraction section 1104 and a driving circuit section 1106 each having a plurality of transistors. The transistor 1240 is provided over the insulating layer 1205. The substrate 1201 is bonded to the insulating layer 1255 by an adhesive layer 1203. The substrate 1103 is bonded by an adhesive layer 1105. When a film with low water permeability is used for the light emitting element 1230 and the transistor 1240, water and the like can be easily absorbed. This is preferable because it is possible to suppress the intrusion of impurities and to increase the reliability of the display panel. The material 1203 can be the same as that of the adhesive layer 1105 .

[0077] In the first specific example, the insulating layer 1205, the transistor 1240, and the light-emitting element 1204 are formed on a highly heat-resistant substrate. The element 1230 is prepared, the substrate on which the element was prepared is peeled off, and the element is attached to the substrate 1201 using the adhesive layer 1203. It can be fabricated by transposing the insulating layer 1205, the transistor 1240, and the light-emitting element 1230. In the specific example 1, an insulating layer 125 is formed on a substrate having high heat resistance. 5. A colored layer 1259 and a light-shielding layer 1257 are formed, and the formed substrate is peeled off, and an adhesive layer 1105 is formed. The insulating layer 1255, the colored layer 1259, and the light-shielding layer 1257 are transferred onto the substrate 1103 using the method described above. The figure shows a display panel that can be fabricated by

[0078] When using a material with high water permeability and low heat resistance (such as resin) for the substrate, the substrate may be exposed to high temperatures during the manufacturing process. Since it is not possible to apply heat, there are limitations on the conditions for fabricating transistors and insulating films on the substrate. In the manufacturing method of this embodiment, a transistor or the like is manufactured on a manufacturing substrate having high heat resistance. This makes it possible to form highly reliable transistors and insulating films with sufficiently low water permeability. By transferring them to the substrate 1103 or the substrate 1201, a highly reliable As a result, in one embodiment of the present invention, a display panel that is lightweight or thin and It is possible to realize a highly reliable active matrix display panel. Details of the law will be discussed later.

[0079] It is preferable that the substrate 1103 and the substrate 1201 are made of a material having high toughness. This makes it possible to provide a display panel that is highly impact resistant and difficult to break. For example, The substrate 1103 is an organic resin substrate, and the substrate 1201 is made of a thin metal material or alloy material. By using a substrate made of this material, it is lighter and less likely to break than a substrate made of glass. It is possible to construct a display panel with a small size.

[0080] Metallic and alloy materials have high thermal conductivity and can easily conduct heat to the entire substrate, It is preferable to use a substrate made of a metal material or an alloy material because it is possible to suppress a local temperature rise in the substrate. The thickness of the plate is preferably 10 μm or more and 200 μm or less, and more preferably 20 μm or more and 50 μm or less. It is more preferable that

[0081] Furthermore, if a material with high thermal emissivity is used for the substrate 1201, the surface temperature of the display panel becomes high. This can prevent the display panel from being damaged or the reliability from being reduced. The material can be a metal substrate and a layer with high thermal emissivity (e.g., metal oxide or ceramic material). In addition, in each of the following specific examples, the same structure as in specific example 1 is used. In such cases, explanation will be omitted.

[0082] <Example 2> FIG. 8(A) shows another example of the light extraction section 1104 in the display panel. The display panel is a touch-operable display panel.

[0083] The display panel shown in FIG. 8A includes an element layer 1101, an adhesive layer 1105, and a substrate 1103. The element layer 1101 includes a substrate 1201, an adhesive layer 1203, an insulating layer 1205, and a plurality of transistors. A resistor 1240, an insulating layer 1207, an insulating layer 1209, a plurality of light-emitting elements 1230, and an insulating layer 1 211, spacer 1217, sealing layer 1213, insulating layer 1261, colored layer 1259, light shielding layer 1257, a plurality of light receiving elements 1250, a conductive layer 1281, a conductive layer 1283, and an insulating layer 129 1, insulating layer 1293, insulating layer 1295, and insulating layer 1255.

[0084] In the second specific example, a spacer 1217 is provided on the insulating layer 1211. By providing the insulating film, the distance between the substrate 1103 and the substrate 1201 can be adjusted.

[0085] FIG. 8A shows an example in which a light receiving element 1250 is provided between an insulating layer 1255 and a sealing layer 1213. The non-light-emitting region on the substrate 1201 side (e.g., a transistor 1240 and a wiring Since the light receiving element 1250 can be arranged so as to overlap the pixel (light emitting element) aperture, It is possible to provide a touch sensor on the display panel without reducing the display efficiency.

[0086] The light receiving element 1250 of the display panel is, for example, a pn-type or pin-type photodiode. In this embodiment, a p-type semiconductor layer can be used as the light receiving element 1250. 1271, an i-type semiconductor layer 1273, and an n-type semiconductor layer 1275. A diode is used.

[0087] The i-type semiconductor layer 1273 contains impurities that give p-type conductivity and impurities that give n-type conductivity. Each item is 1×10 20 cm -3 The concentration is less than 10 and the photoconductivity is 10 The i-type semiconductor layer 1273 contains impurities of Group 13 or 15 of the periodic table. In other words, i-type semiconductors are those that have valence electron control. When no impurity elements are intentionally added, it exhibits weak n-type electrical conductivity, so it is called an i-type semiconductor. The layer 1273 is formed by intentionally or unintentionally doping with an impurity element that imparts p-type conductivity during or after the film formation. This category includes substances that are intentionally added.

[0088] The light-shielding layer 1257 overlaps the light-receiving element 1250 on the side closer to the substrate 1103. The light-shielding layer 1257 located between the light-emitting element 1230 and the sealing layer 1213 prevents the light from emitting light from the light-emitting element 1230. This can prevent the light receiving element 1250 from being irradiated with the light.

[0089] The conductive layer 1281 and the conductive layer 1283 are each electrically connected to the light receiving element 1250 . The conductive layer 1281 is preferably a conductive layer that transmits light incident on the light receiving element 1250. The conductive layer 1283 is a conductive layer that blocks light incident on the light receiving element 1250. is preferred.

[0090] When the optical touch sensor is disposed between the substrate 1103 and the sealing layer 1213, the light emitting element 1230 This is preferable because it is less susceptible to the effects of light emitted from the other components and can improve the S / N ratio.

[0091] <Example 3> FIG. 8B shows another example of the light extraction section 1104 in the display panel. The display panel is a touch-operable display panel.

[0092] The display panel shown in FIG. 8B includes an element layer 1101, an adhesive layer 1105, and a substrate 1103. The element layer 1101 includes a substrate 1201, an adhesive layer 1203, an insulating layer 1205, and a plurality of transistors. A resistor 1240, an insulating layer 1207, an insulating layer 1209a, an insulating layer 1209b, and a plurality of light-emitting elements 1230, insulating layer 1211, spacer 1217, sealing layer 1213, colored layer 1259, A light shielding layer 1257, a plurality of light receiving elements 1250, a conductive layer 1280, a conductive layer 1281, and an insulating layer It has layer 1255.

[0093] FIG. 8B shows an example in which a light receiving element 1250 is provided between an insulating layer 1205 and a sealing layer 1213. By providing the light receiving element 1250 between the insulating layer 1205 and the sealing layer 1213, The light receiving element is made of the same material and in the same process as the conductive layer and semiconductor layer that make up the transistor 1240. A conductive layer electrically connected to the light receiving element 1250 and a photoelectric conversion layer constituting the light receiving element 1250 can be fabricated. Therefore, a display panel capable of touch operation can be manufactured without significantly increasing the manufacturing process. can be created.

[0094] <Example 4> FIG. 9A shows another example of a display panel. The display panel in FIG. 9A is a touch-operable panel. It is a display panel.

[0095] The display panel shown in FIG. 9A includes an element layer 1101, an adhesive layer 1105, and a substrate 1103. The element layer 1101 includes a substrate 1201, an adhesive layer 1203, an insulating layer 1205, and a plurality of transistors. resistor 1240, conductive layer 1156, conductive layer 1157, insulating layer 1207, insulating layer 1209, A plurality of light emitting elements 1230, an insulating layer 1211, a spacer 1217, a sealing layer 1213, and a coloring layer layer 1259, light shielding layer 1257, insulating layer 1255, conductive layer 1272, conductive layer 1274, insulating layer 1276 , insulating layer 1278 , conductive layer 1294 and conductive layer 1296 .

[0096] In FIG. 9A, a capacitive touch sensor is provided between an insulating layer 1255 and a sealing layer 1213. The capacitive touch sensor has a conductive layer 1272 and a conductive layer 1274. do.

[0097] The conductive layer 1156 and the conductive layer 1157 are electrically connected to the FPC 1108 via the connector 1215. The conductive layer 1294 and the conductive layer 1296 are connected to the conductive layer 1292 via the conductive particles 1292. 1274. Therefore, the capacitive touch is connected via FPC1108. The sensor can be driven.

[0098] <Example 5> FIG. 9B shows another example of a display panel. The display panel in FIG. 9B is a touch-operable panel. It is a display panel.

[0099] The display panel shown in FIG. 9B includes an element layer 1101, an adhesive layer 1105, and a substrate 1103. The element layer 1101 includes a substrate 1201, an adhesive layer 1203, an insulating layer 1205, and a plurality of transistors. resistor 1240, conductive layer 1156, conductive layer 1157, insulating layer 1207, insulating layer 1209, A plurality of light emitting elements 1230, an insulating layer 1211, a spacer 1217, a sealing layer 1213, and a coloring layer layer 1259, light shielding layer 1257, insulating layer 1255, conductive layer 1270, conductive layer 1272, conductive layer 1274 , insulating layer 1276 , and insulating layer 1278 .

[0100] In FIG. 9B, a capacitive touch sensor is provided between the insulating layer 1255 and the sealing layer 1213. The capacitive touch sensor has a conductive layer 1272 and a conductive layer 1274. do.

[0101] The conductive layer 1156 and the conductive layer 1157 are electrically connected to the FPC 1108a via the connector 1215a. The conductive layer 1270 is electrically connected to the FPC 1108b via the connecting member 1215b. Therefore, the light emitting element 1230 and the transistor are connected via the FPC 1108a. 1240 and drive the capacitive touch sensor via FPC1108b. can be done.

[0102] <Example 6> FIG. 10A shows another example of the light extraction portion 1104 in the display panel.

[0103] The light extraction portion 1104 shown in FIG. 10(A) is made up of a substrate 1103, an adhesive layer 1105, and a substrate 12. 02, insulating layer 1205, multiple transistors 1240, insulating layer 1207, conductive layer 1208 , an insulating layer 1209a, an insulating layer 1209b, a plurality of light-emitting elements 1230, an insulating layer 1211, and an encapsulant. The insulating layer 1213 and the colored layer 1259 are also provided.

[0104] The light-emitting element 1230 includes a lower electrode 1231, an EL layer 1233, and an upper electrode 1235. The lower electrode 1231 is connected to a source electrode or a drain electrode of a transistor 1240 through a conductive layer 1208. The end of the lower electrode 1231 is covered with an insulating layer 1211. The light emitting element 1230 has a bottom emission structure. The lower electrode 1231 is a light-transmitting The EL layer 1233 transmits light emitted from the EL layer 1233 .

[0105] A colored layer 1259 is provided at a position overlapping the light-emitting element 1230, and the light emitted by the light-emitting element 1230 The light emitted from the light emitting element 1230 is extracted to the substrate 1103 side through the colored layer 1259. The spaces between the plates 1202 are filled with a sealing layer 1213. The substrate 1202 is the same as the substrate 120 It can be made using the same materials as 1.

[0106] <Example 7> FIG. 10B shows another example of a display panel.

[0107] The display panel shown in FIG. 10B includes an element layer 1101, an adhesive layer 1105, and a substrate 1103. The element layer 1101 includes a substrate 1202, an insulating layer 1205, a conductive layer 1310a, a conductive layer 1310b, and a conductive layer 1310c. 310b, a plurality of light-emitting elements 1230, an insulating layer 1211, a conductive layer 1212, and a sealing layer 12 Has 13.

[0108] The conductive layer 1310a and the conductive layer 1310b are external connection electrodes of the display panel, and are connected to an FPC or the like. The semiconductor device can be electrically connected to the semiconductor device.

[0109] The light-emitting element 1230 includes a lower electrode 1231, an EL layer 1233, and an upper electrode 1235. The end of the lower electrode 1231 is covered with an insulating layer 1211. The lower electrode 1231 is transparent, and the EL layer 1233 emits light. The conductive layer 1212 is electrically connected to the lower electrode 1231 .

[0110] The substrate 1103 has a hemispherical lens, a microlens array, and a concave-convex structure as a light extraction structure. For example, the resin substrate may have a film on which the above-mentioned The lens or film is attached to the substrate or to a bonding agent having a refractive index similar to that of the lens or film. By bonding with an adhesive or the like, a light extraction structure can be formed.

[0111] The conductive layer 1212 is not necessarily provided, but the voltage caused by the resistance of the lower electrode 1231 It is preferable to provide the upper electrode 1235 because it can suppress the drop. A conductive layer that is electrically connected to the insulating layer 1211 may be provided over the insulating layer 1211 .

[0112] The conductive layer 1212 may be made of copper, titanium, tantalum, tungsten, molybdenum, chromium, or neodymium. Materials selected from the group consisting of aluminum, scandium, nickel, and aluminum, or materials containing these as main components The conductive layer 1212 can be formed of a single layer or a stacked layer using an alloy material. , 0.1 μm or more and 3 μm or less, preferably 0.1 μm or more and 0.5 μm or less The following is the result.

[0113] A paste (such as silver paste) is used as the material for the conductive layer electrically connected to the upper electrode 1235. When the conductive layer is heated, the metal constituting the conductive layer becomes granular and aggregates. This results in a structure with many gaps, making it difficult for the EL layer 1233 to completely cover the conductive layer. This is preferable because it makes it easier to electrically connect the electrode and the auxiliary wiring.

[0114] <Examples of materials> Next, materials that can be used for the display panel will be described. The explanation of the configuration will be omitted.

[0115] The element layer 1101 includes at least a display element. A self-luminous element can be used for the LED, and the brightness can be controlled by current or voltage. The category includes elements such as light-emitting diodes (LEDs), organic electroluminescence (EL) elements, and inorganic An EL element or the like can be used.

[0116] The element layer 1101 further includes transistors for driving display elements, touch sensors, etc. It may have.

[0117] The structure of the transistors in the display panel is not particularly limited. For example, The transistor may be a top gate type or an inverted staggered type. The transistor may have either a bottom gate type or a bottom gate type structure. The conductive material is not particularly limited, and examples thereof include silicon and germanium. At least one of indium, gallium, and zinc, such as In-Ga-Zn-based metal oxides An oxide semiconductor including these may be used.

[0118] The crystallinity of the semiconductor material used in the transistor is not particularly limited. A semiconductor having crystallinity (a microcrystalline semiconductor, a polycrystalline semiconductor, a single crystal semiconductor, or a semiconductor having a partially crystalline region If a semiconductor having crystallinity is used, the transistor This is preferable because it can suppress deterioration of the star characteristics.

[0119] The light-emitting element of the display panel has a pair of electrodes (a lower electrode 1231 and an upper electrode 1235). and an EL layer 1233 provided between the pair of electrodes. One of the pair of electrodes is an anode. one serves as a cathode and the other serves as a cathode.

[0120] The light-emitting element is available in top emission structure, bottom emission structure, and dual emission structure. The electrode on the light extraction side is made of a conductive film that transmits visible light. In addition, it is preferable to use a conductive film that reflects visible light for the electrode on the side from which light is not extracted. I wish.

[0121] The conductive film that transmits visible light is, for example, indium oxide, indium tin oxide (ITO). Indium Tin Oxide, Indium Zinc Oxide, Zinc Oxide, Gallium Doped It can be formed using zinc oxide, etc. Also, gold, silver, platinum, magnesium, Nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, or Metallic materials such as titanium, alloys containing these metallic materials, or nitrides of these metallic materials (e.g. For example, titanium nitride or the like can be used by forming it thin enough to have light transmitting properties. A laminated film of the above materials can also be used as the conductive layer. For example, silver and magnesium It is preferable to use a laminated film of an alloy of this material and ITO, since the electrical conductivity can be increased. Graphene and the like may also be used.

[0122] The conductive film that reflects visible light is made of, for example, aluminum, gold, platinum, silver, nickel, tungsten, etc. Metallic materials such as zinc, chromium, molybdenum, iron, cobalt, copper, or palladium; An alloy containing these metal materials can be used. In addition, aluminum and titanium may be added. Aluminum alloys such as aluminum-nickel alloys, aluminum-neodymium alloys, etc. Alloys containing palladium (aluminum alloys), silver-copper alloys, silver-palladium-copper alloys, silver The electrode can be formed using an alloy containing silver, such as an alloy of silver and magnesium. Gold is preferred because of its high heat resistance. By laminating the oxide film, the oxidation of the aluminum alloy film can be suppressed. Examples of materials for the metal oxide film include titanium and titanium oxide. A conductive film that transmits visible light and a film made of a metal material may be laminated. For example, a film made of silver and ITO may be laminated. A laminated film, a laminated film of an alloy of silver and magnesium and ITO, etc. can be used.

[0123] The electrodes may be formed by vapor deposition or sputtering. Formed using a discharge method such as the jet method, a printing method such as the screen printing method, or a plating method. It is possible.

[0124] A voltage higher than the threshold voltage of the light-emitting element is applied between the lower electrode 1231 and the upper electrode 1235. Then, holes are injected into the EL layer 1233 from the anode side, and electrons are injected from the cathode side. The injected electrons and holes recombine in the EL layer 1233 to form luminescent The substance emits light.

[0125] The EL layer 1233 has at least a light-emitting layer. The EL layer 1233 has a layer other than the light-emitting layer. , a material with high hole injection properties, a material with high hole transport properties, a material with hole blocking properties, A material with high electron transporting properties, a material with high electron injecting properties, or a bipolar material (electron transporting and hole transporting properties) The semiconductor device may further include a layer containing a substance having high transport properties.

[0126] The EL layer 1233 can be made of either a low molecular weight compound or a high molecular weight compound. The layers constituting the EL layer 1233 may each be formed by deposition (vacuum deposition). It can be formed by methods such as deposition method, transfer method, printing method, inkjet method, coating method, etc. can.

[0127] In the element layer 1101, the light-emitting element is provided between a pair of insulating films having low water permeability. This makes it possible to prevent impurities such as water from entering the light emitting element, and the light emitting This makes it possible to suppress deterioration in the reliability of the device.

[0128] Insulating films with low water permeability include those containing nitrogen and silicon, such as silicon nitride film and silicon oxynitride film. Examples of the film include a film containing nitrogen and aluminum, such as an aluminum nitride film. Alternatively, a silicon nitride film, a silicon oxynitride film, an aluminum oxide film, or the like may be used.

[0129] For example, the water vapor permeability of a low-permeability insulating film is 1×10 -5 g / m 2 ·day or less, good Preferably 1×10 -6 g / m 2 ·day or less, preferably 1×10 -7 g / m 2 d ay or less, more preferably 1×10 -8 g / m 2 ·day or less.

[0130] The substrate 1103 has a light-transmitting property and transmits at least the light emitted by the light-emitting element of the element layer 1101. The substrate 1103 may be flexible. However, a substrate with a higher refractive index than the air is used. Organic resin is lighter than glass. Therefore, when a substrate using an organic resin is used as the substrate 1103, the This is preferable because it allows the semiconductor device to be lighter in weight.

[0131] Examples of materials having flexibility and transparency to visible light include flexible materials. Thick glass, polyethylene terephthalate (PET), polyethylene naphthalate ( PEN) and other polyester resins, polyacrylonitrile resins, polyimide resins, polymethyl methacrylate resin, polycarbonate (PC) resin, polyethersulfone (PES ) resin, polyamide resin, cycloolefin resin, polystyrene resin, polyamide-imide Resin, polyvinyl chloride resin, etc. In particular, it is preferable to use materials with a low thermal expansion coefficient. For example, polyamide-imide resin, polyimide resin, PET, etc. are preferably used. In addition, it is possible to use a substrate in which glass fibers are impregnated with organic resin, or an inorganic filler is impregnated with organic resin. It is also possible to use a substrate with a mixed material to reduce the thermal expansion coefficient.

[0132] The substrate 1103 is a layer made of the above-mentioned material, which protects the surface of the display panel from scratches. Hard coat layers (e.g., silicon nitride layers, etc.) and layers of materials that can disperse pressure (e.g., The light-emitting layer may be laminated with a layer of a polyester resin, an aramid resin layer, etc. In order to prevent a decrease in the life span of the element, the element may have the insulating film having low water permeability as described above.

[0133] The adhesive layer 1105 has a light-transmitting property and transmits light emitted from at least the light-emitting element of the element layer 1101. The adhesive layer 1105 transmits light and has a refractive index higher than that of the air.

[0134] The adhesive layer 1105 is made of a resin that hardens at room temperature, such as a two-liquid mixed resin, or a photocurable resin. Resins such as thermosetting resins can be used. For example, epoxy resins, acrylic resins, etc. Examples of resins that can be used include epoxy resins, silicone resins, and phenol resins. Low temperature materials are preferred.

[0135] The resin may contain a desiccant. For example, an oxide of an alkaline earth metal (oxide Use substances that adsorb moisture by chemical adsorption, such as calcium oxide or barium oxide. Alternatively, materials such as zeolite and silica gel can absorb moisture by physical adsorption. If a desiccant is included, impurities such as moisture may penetrate into the light emitting element. This is preferable because it can suppress the intrusion of foreign matter and improve the reliability of the light emitting device.

[0136] In addition, by mixing the above resin with a filler having a high refractive index (such as titanium oxide), the luminescent element This is preferable because it can improve the light extraction efficiency from the element.

[0137] The adhesive layer 1105 may also have a scattering member that scatters light. Layer 1105 may be made of a mixture of the above resin and particles having a different refractive index than the above resin. The particles function as light scattering members.

[0138] The difference in refractive index between the resin and the particles having a refractive index different from that of the resin is preferably 0.1 or more. It is more preferable that the ratio is 0.3 or more. Specifically, the resin is an epoxy resin, an acrylic resin, or the like. Resins, imide resins, silicones, etc. can be used. Titanium oxide particles can also be used. , barium oxide, zeolite, etc. can be used.

[0139] Titanium oxide and barium oxide particles are preferred because they have a strong light scattering property. By using light, water contained in resin etc. can be absorbed, improving the reliability of the light-emitting element. It is possible to do so.

[0140] The insulating layer 1205 and the insulating layer 1255 can be made of an inorganic insulating material. It is preferable to use an insulating film having low water permeability because it is possible to realize a highly reliable display panel.

[0141] The insulating layer 1207 has an effect of suppressing the diffusion of impurities into the semiconductor that constitutes the transistor. The insulating layer 1207 may be a silicon oxide film, a silicon oxynitride film, an aluminum oxide film, or the like. For example, an inorganic insulating film such as a rubber film can be used.

[0142] The insulating layer 1209, the insulating layer 1209a, and the insulating layer 1209b are each made of a transistor. It is preferable to select an insulating film with a planarizing function to reduce surface irregularities caused by transistors, etc. For example, organic materials such as polyimide, acrylic, and benzocyclobutene resins are used. In addition to the above organic materials, low-dielectric constant materials (low-k materials) can also be used. In addition, it is possible to laminate multiple insulating films or inorganic insulating films made of these materials. Good too.

[0143] The insulating layer 1211 is provided to cover the end of the lower electrode 1231. In order to improve the coverage of the EL layer 1233 and the upper electrode 1235 formed on the upper layer, It is preferable that the sidewall of the insulating layer 1211 be an inclined surface formed with a continuous curvature.

[0144] The material of the insulating layer 1211 may be a resin or an inorganic insulating material. Examples of the resin include polyimide resin, polyamide resin, acrylic resin, siloxane resin, and epoxy resin. In particular, the insulating layer 1211 can be formed by using a resin such as an epoxy resin or a phenol resin. It is preferable to use a negative photosensitive resin or a positive photosensitive resin because it is easy to It is.

[0145] The method for forming the insulating layer 1211 is not particularly limited, but may be a photolithography method, a sputtering method, or the like. , deposition method, droplet ejection method (inkjet method, etc.), printing method (screen printing, offset printing It is advisable to use a printing method, etc.

[0146] The spacer 1217 is formed using an inorganic insulating material, an organic insulating material, a metal material, or the like. For example, organic insulating materials include negative or positive photosensitive resins, non-photosensitive Resins and the like can be used. Metal materials include titanium and aluminum. A conductive material is used for the spacer 1217, and the spacer 1217 and the upper By electrically connecting the upper electrode 1235, the resistance of the upper electrode 1235 is reduced. In addition, the spacer 1217 can be tapered or reverse tapered. It may be in the shape of a hole.

[0147] The insulating layer 1276, the insulating layer 1278, the insulating layer 1291, the insulating layer 1293, and the insulating layer 1295 are The insulating layer 1278 and the insulating layer 1279 can be formed using an inorganic insulating material or an organic insulating material. The insulating layer 1295 is an insulating layer having a planarizing function to reduce surface irregularities caused by the sensor element. It is preferred to use layers.

[0148] The sealing layer 1213 is made of a resin that hardens at room temperature, such as a two-liquid mixed resin, or a photocurable resin. Resins such as thermosetting resins can be used. For example, PVC (polyvinyl chloride) ide) resin, acrylic resin, polyimide resin, epoxy resin, silicone resin, PVB( Polyvinyl butyral (PVB) resin, EVA (ethylene vinyl acetate) resin, etc. can be used. The sealing layer 1213 may contain a desiccant. When the light from the light emitting element 1230 is extracted to the outside of the display panel, the light is refracted by the sealing layer 1213. It is preferable that the material contains a desiccant, a filler with a high refractive index, or a scattering material. The materials for the disturbance member may be the same as those that can be used for the adhesive layer 1105. .

[0149] The conductive layer 1156, the conductive layer 1157, the conductive layer 1294, and the conductive layer 1296 are each The conductive layer can be formed of the same material and in the same process as the conductive layer constituting the transistor or light-emitting element. In addition, the conductive layer 1280 is formed of the same material and in the same process as the conductive layers constituting the transistors. can.

[0150] For example, the conductive layers may be made of molybdenum, titanium, chromium, tantalum, or tungsten. Metallic materials such as tin, aluminum, copper, neodymium, scandium, etc., or alloys containing these elements The conductive layer can be formed of a single layer or a multilayer structure using a gold material. Each of the electrodes may be formed using a conductive metal oxide. Indium (In2O3, etc.), tin oxide (SnO2, etc.), zinc oxide (ZnO), ITO, Indium zinc oxide (In2O3-ZnO, etc.) or these metal oxide materials with silicon oxide It is possible to use a material containing

[0151] In addition, the conductive layer 1208, the conductive layer 1212, the conductive layer 1283, and the conductive layer 1310a and The conductive layer 1310b is also made of the above-mentioned metal material, alloy material, conductive metal oxide, etc. It can be formed using:

[0152] The conductive layer 1272, the conductive layer 1274, and the conductive layer 1281 are light-transmitting conductive layers. For example, indium oxide, ITO, indium zinc oxide, zinc oxide, gallium-added The conductive layer 1270 may be made of the same material as the conductive layer 1272. The above materials can be formed in the same process.

[0153] The conductive particles 1292 are particles of organic resin or silica coated with a metal material. Nickel or gold is preferable as the metal material because it can reduce the contact resistance. In addition, there are particles that are coated with layers of two or more metal materials, such as nickel coated with gold. It is preferable to use a child.

[0154] The connector 1215 is a paste or sheet made of a thermosetting resin mixed with metal particles. A material that exhibits anisotropic conductivity when bonded by thermocompression can be used. Metal particles are composed of layers of two or more metals, such as nickel particles coated with gold. It is preferable to use particles in which

[0155] The colored layer 1259 is a colored layer that transmits light of a specific wavelength band. For example, the red wavelength band A red (R) color filter transmits light in the red wavelength range, and a green (G) color filter transmits light in the green wavelength range. A color filter that transmits light in the blue wavelength band, and a blue (B) color filter that transmits light in the blue wavelength band are used. Each color layer can be formed by using various materials, by printing, inkjet printing, photolithography, etc. They are formed at desired positions by an etching method using lithography or the like.

[0156] In addition, a light-shielding layer 1257 is provided between adjacent colored layers 1259. 7 blocks light from the neighboring light emitting elements and suppresses color mixing between neighboring pixels. Here, by providing the end of the colored layer 1259 so as to overlap the light-shielding layer 1257, light leakage is prevented. The light-shielding layer 1257 is made of a material that blocks light emitted from the light-emitting element. The insulating layer 11 can be formed by using a metal material or a resin material containing a pigment or dye. As shown in FIG. 7A, the light shielding layer 1257 is disposed in the light extraction section of the driving circuit section 1106, etc. If the light emitting diode is provided in an area other than the portion 1104, unintended light leakage due to guided light or the like can be suppressed. preferable.

[0157] In addition, when an insulating layer 1261 is provided to cover the colored layer 1259 and the light-shielding layer 1257, the colored layer 125 Impurities such as pigments contained in the light-shielding layer 1257 can be prevented from diffusing into the light-emitting element, etc. The insulating layer 1261 is preferably made of a light-transmitting material such as an inorganic insulating material or an organic insulating material. The insulating layer 1261 may be formed using the above-mentioned insulating film having low water permeability.

[0158] <How to manufacture the display panel> A method for manufacturing a display panel will be illustrated with reference to FIGS. 11 and 12. Here, specific example 1 (FIG. 7) The display panel having the configuration (B) will be described as an example.

[0159] First, a peeling layer 1303 is formed on a production substrate 1301, and an insulating layer 120 is formed on the peeling layer 1303. Next, a plurality of transistors 1240 and a conductive layer 1157 are formed on the insulating layer 1205. 12, an insulating layer 1207, an insulating layer 1209, a plurality of light emitting elements 1230, and an insulating layer 1211 are formed. In addition, the insulating layer 1211, the insulating layer 1209, and the conductive layer 1157 are formed so as to be exposed. In addition, the insulating layer 1207 is opened (FIG. 11(A)).

[0160] In addition, a peeling layer 1307 is formed over the formation substrate 1305, and an insulating layer 125 is formed over the peeling layer 1307. Next, a light-shielding layer 1257, a coloring layer 1259, and an insulating layer 5 are formed on the insulating layer 1255. 1261 is formed (FIG. 11(B)).

[0161] The substrates 1301 and 1305 are made of a glass substrate, a quartz substrate, and a silicon substrate, respectively. A ceramic substrate, a metal substrate, or the like can be used.

[0162] The glass substrate may be made of, for example, aluminosilicate glass or aluminoborosilicate glass. For example, a glass material such as barium borosilicate glass can be used. If the strain point is high, it is advisable to use a material with a strain point of 730°C or higher.

[0163] When a glass substrate is used as the substrate, a silicon oxide film or an oxide When an insulating film such as a silicon nitride film, a silicon nitride film, or a silicon oxynitride film is formed, the glass This is preferable since it can prevent contamination from the substrate.

[0164] The peeling layers 1303 and 1307 are made of tungsten, molybdenum, and titanium, respectively. Tantalum, niobium, nickel, cobalt, zirconium, zinc, ruthenium, rhodium an element selected from the group consisting of tungsten, palladium, osmium, iridium, and silicon; It is made of an alloy material containing the element, or a compound material containing the element, and is a single layer or a laminated layer. The crystal structure of the layer containing silicon may be any of amorphous, microcrystalline, and polycrystalline.

[0165] The release layer can be formed by a sputtering method, a plasma CVD method, a coating method, a printing method, or the like. The coating method includes a spin coating method, a droplet discharging method, and a dispensing method.

[0166] When the peeling layer has a single layer structure, it is made of a tungsten layer, a molybdenum layer, or a combination of tungsten and molybdenum. It is preferable to form a layer containing a mixture of tungsten oxide or oxide. a layer containing an oxynitride of molybdenum, a layer containing an oxide or oxynitride of molybdenum, or a layer containing tungsten Alternatively, a layer containing an oxide or oxynitride of a mixture of tantalum and molybdenum may be formed. A mixture of tungsten and molybdenum corresponds to, for example, an alloy of tungsten and molybdenum. do.

[0167] In addition, a laminated structure of a layer containing tungsten and a layer containing an oxide of tungsten may be used as the peeling layer. In the case of forming a tungsten-containing layer, an insulating film made of oxide is formed on the tungsten-containing layer. By forming the insulating film, a layer containing tungsten oxide is formed at the interface between the tungsten layer and the insulating film. In addition, the surface of the layer containing tungsten may be subjected to a thermal oxidation treatment. , oxygen plasma treatment, nitrous oxide (N2O) plasma treatment, ozone water, and other highly oxidizing solvents Alternatively, a layer containing tungsten oxide may be formed by performing a treatment with a liquid or the like. The treatment and heating process may be carried out using oxygen, nitrogen, or nitrous oxide, either alone or in combination with other gases. The above plasma treatment or heat treatment may be performed under a gas atmosphere. By changing the temperature, it is possible to control the adhesion between the release layer and the insulating film that is formed later. do.

[0168] Each insulating layer is formed using a method such as sputtering, plasma CVD, coating, or printing. For example, the film formation temperature can be increased to 250°C or higher, up to 400°C, using the plasma CVD method. By forming the membrane as described below, it is possible to obtain a dense membrane with extremely low water permeability.

[0169] Thereafter, the surface of the preparation substrate 1305 on which the colored layer 1259 and the like are provided or the surface of the preparation substrate 1301 is A material for forming the sealing layer 1213 is applied to the surface on which the optical element 1230 and the like are provided. The surfaces are then attached together via an adhesive (FIG. 11(C)).

[0170] Then, the manufacturing substrate 1301 is peeled off, and the exposed insulating layer 1205 and the substrate 1201 are bonded to each other by an adhesive layer. The substrate 1305 is peeled off to expose the insulating layer 12. 55 and a substrate 1103 are bonded together using an adhesive layer 1105. In FIG. The conductive layer 1157 and the substrate 1103 are not overlapped with each other. They may overlap.

[0171] For example, a peeling layer may be formed by a method using a film to be peeled off. When a layer containing a metal oxide film is formed on the side in contact with the peeled layer, the metal oxide film is crystallized. The layer to be peeled off can be peeled off from the substrate by weakening the layer. When an amorphous silicon film containing hydrogen is formed as a peeling layer between the plate and the peeled layer, the laser beam The amorphous silicon film is removed by irradiation or etching, so that the layer to be peeled off is separated from the production substrate. In addition, the peeling layer may include a layer including a metal oxide film on the side in contact with the layer to be peeled. The metal oxide film is weakened by crystallization, and a part of the peeling layer is dissolved in a solution or NF3 After removing the gold by etching using fluoride gas such as BrF3 or ClF3, the weakened gold Furthermore, nitrogen, oxygen, hydrogen, etc. can be used as a peeling layer. A film containing hydrogen (e.g., an amorphous silicon film containing hydrogen, a hydrogen-containing alloy film, an oxygen-containing alloy film, etc.) is used. The peeling layer is irradiated with laser light to release nitrogen, oxygen, and hydrogen contained in the peeling layer as gas. A method of accelerating the peeling between the peeled layer and the substrate may be used. The substrate was mechanically removed or etched with a solution or a fluoride gas such as NF3, BrF3, or ClF3. A method of removing the film by etching or the like can be used. In this case, it is not necessary to provide a peeling layer. stomach.

[0172] Moreover, by combining a plurality of the above-mentioned peeling methods, the peeling step can be carried out more easily. That is, irradiation with laser light, etching of the peeling layer with gas or solution, or using a sharp knife or knife Mechanical removal is performed using a tool such as a brush to make the peeling layer and the layer to be peeled easier to peel off, and then Peeling can also be achieved by physical force (mechanically, etc.).

[0173] In addition, the layer to be peeled off can be peeled off from the substrate by penetrating a liquid into the interface between the peeling layer and the layer to be peeled off. Also, during the peeling, liquid such as water may be poured onto the film.

[0174] As for other peeling methods, when the peeling layer is made of tungsten, it is possible to use ammonia water and perchloric acid. The peeling layer may be etched with a mixed solution of hydrogen oxide and water to perform the peeling.

[0175] Note that when separation is possible at the interface between the formation substrate and the layer to be peeled off, a peeling layer does not have to be provided. For example, glass is used as a substrate, and an organic resin such as polyimide is formed in contact with the glass. In this case, an insulating film, a transistor, etc. are formed on the organic resin. In this case, the organic resin is heated. By this, it is possible to peel off the substrate at the interface between the substrate and the organic resin. A metal layer is provided between the organic resin and the metal layer, and a current is passed through the metal layer to heat the metal layer. The peeling may occur at the interface.

[0176] Finally, the insulating layer 1255 and the sealing layer 1213 are opened to expose the conductive layer 1157. In addition, in the case where the substrate 1103 overlaps with the conductive layer 1157, The plate 1103 and the adhesive layer 1105 are also opened (FIG. 12(C)). The means of opening is not particularly limited. For example, laser ablation, etching, ion beam sputtering, etc. Alternatively, a cut may be made in the film on the conductive layer 1157 using a sharp blade or the like. Part of the membrane may be peeled off using physical force.

[0177] In this manner, a display panel can be manufactured.

[0178] The display panel of this embodiment has two substrates: a substrate 1103 and a substrate 1201 or a substrate 1202. Even if the touch sensor is included, it is possible to use two boards. By minimizing the number of substrates, light extraction efficiency and display clarity can be improved. It becomes easy.

[0179] The configuration, method, etc. of this embodiment may be appropriately combined with the configurations, methods, etc. of other embodiments. It can be used in combination.

[0180] (Embodiment 3) In this embodiment, examples of electronic devices to which the display device of one embodiment of the present invention is applied are shown in FIG. This will be described with reference to the following.

[0181] As an example of an electronic device to which a display device having a flexible shape is applied, a television Equipment (also called television or television receiver), monitors for computers, digital digital cameras, digital video cameras, digital photo frames, mobile phones (mobile phones, (also called mobile phone devices), portable game machines, portable information terminals, audio playback devices, large game machines etc.

[0182] 13(A) and 13(B) show an example of a tablet terminal 9600 that can be folded in half. In addition, although an example of folding in two is shown here, it is also possible to fold in three or four, etc. FIG. 13A shows a tablet terminal 9600 in an open state. The tablet terminal 9600 includes a housing 9630, a display unit 9631, and a display mode switch. Switch 9626, power switch 9627, power saving mode switch 962 5, fastener 9629, and operating switch 9628.

[0183] The housing 9630 includes a housing 9630a and a housing 9630b. 0b is connected by a flexible base material 9639. The flexible base material 9639 allows it to be folded in two.

[0184] In addition, a flexible display panel supported by the housings 9630a and 9630b The display unit 9631 is configured by the above. The display panel shown in FIG. 1 can be used. A curved surface can be provided on the outside of the curved portion of the display panel. By arranging the flexible substrate 9639 so as to have a flexible shape, the change to the folded state can be prevented. This reduces the load on the curved portion of the display panel when it is shaped, and prevents cracks in that area. Therefore, it is possible to prevent damage such as the above from occurring. It is possible to provide the terminal.

[0185] A part of the display unit 9631 can be a touch sensor area 9632. Data can be input by touching the keys 9638. For example, half of the area may have a display function only, and the other half may be a touch sensor. In addition, the entire area of ​​the display portion 9631 can be configured to have a touch sensor function. For example, a keyboard button display may be provided on the entire surface of the display portion 9631. It can also be used as a data entry terminal.

[0186] A display mode changeover switch 9626 is used to change the display orientation between portrait and landscape. You can switch between black and white and color display. The Touch 9625 uses a light sensor built into the tablet device to detect external light during use. The display brightness can be optimized according to the amount of light. In addition, it also incorporates other detection devices such as gyros, acceleration sensors, and other sensors that detect tilt. It may be stored.

[0187] FIG. 13B shows the tablet terminal 9600 in a closed state. The battery 9600 includes a housing 9630, a solar cell 9633, and a charge / discharge control circuit 9634. In FIG. 13(B), a battery 9635 and a DC / DC converter are shown as an example of a charge / discharge control circuit 9634. The configuration shown has a converter 9636.

[0188] By using the display panel described in the above embodiment as the display portion 9631, 1 can be folded. For example, the tablet device 9600 can be folded in half. When not in use, the housing 9630 can be closed. In addition, since the display portion 9631 can be protected by closing the housing 9630, the display portion 9631 can be protected from damage due to its excellent durability and long life. From the viewpoint of usage, the tablet terminal can be made highly reliable.

[0189] In addition, the tablet terminals shown in Figs. 13(A) and 13(B) can store various information. Functions for displaying information (still images, videos, text images, etc.), calendars, dates, or times, etc. A function to display information on the display unit, and a function to operate or edit the information displayed on the display unit by touch input. It has the function of inputting information, the function of controlling processing by various software (programs), etc. This can be done.

[0190] The solar cell 9633 attached to the surface of the tablet device supplies power to the touch panel, The solar cell 9633 can be provided to a display unit, a video signal processor, or the like. The battery 9635 can be efficiently charged by providing a light emitting diode (LED) on one or both sides of the body 9630. The battery 9635 may be a lithium-ion battery. The use of such a structure has the advantage of enabling miniaturization.

[0191] The configuration and operation of the charge / discharge control circuit 9634 shown in FIG. ) shows a block diagram and explains. In FIG. 13(C), a solar cell 9633, a battery 96 35, DC-DC converter 9636, converter 9637, switches SW1 to SW3, The figure shows a display unit 9631, a battery 9635, and a DC-DC converter 9636. The converter 9637 and the switches SW1 to SW3 constitute a charge / discharge control circuit shown in FIG. This corresponds to route 9634.

[0192] First, an example of operation in which power is generated by the solar cell 9633 using external light will be described. The power generated by the solar cell is converted to a DCD voltage to charge the Battery 9635. The voltage is increased or decreased by the C converter 9636. When power is being used from the battery 9633, the switch SW1 is turned on and the converter 96 37 increases or decreases the voltage to a voltage required for the display unit 9631. When not displaying the 31, turn SW1 off and SW2 on to charge the battery 96 The configuration may be such that charging is performed at 35.

[0193] The solar cell 9633 is shown as an example of a power generating means, but is not limited thereto. Batteries using other power generation methods such as piezoelectric elements and thermoelectric conversion elements For example, the device may be configured to transmit and receive power wirelessly (contactlessly). A configuration that combines a non-contact power transmission module that charges by connecting the device to the power source and other charging methods. It is also possible to use the following.

[0194] Note that the electronic devices are not particularly limited to the above-described electronic devices as long as they include a display device according to one embodiment of the present invention. Needless to say, this is not possible.

[0195] The configuration, method, etc. of this embodiment may be appropriately combined with the configurations, methods, etc. of other embodiments. It can be used in combination. [Explanation of symbols]

[0196] 100 Semiconductor device 102 Display Panel 103 Case 104 Case 104a Case 104b Case 105 Groove 105a Groove 105b Groove 105c Groove 106 Case 106a Case 106b Case 107 Anchor part 108a Base material 108b Base material 109a Base material 110 areas 111 Adhesive layer 111a Adhesive layer 112 areas 113 Adhesive layer 114 Adhesive layer 117a Base material 117b Base material 118a Base material 118b Base material 120 Semiconductor device 130a Elastic body 130b Elastic body 130c Elastic 130d Elastic body 132 FPC 140 Semiconductor devices 160 areas 170 areas 172 areas 174 areas 176 areas 178 areas 180 Semiconductor Devices 182 areas 184 areas 1101 Element layer 1103 Substrate 1104 Light extraction section 1105 Adhesive layer 1106 Drive circuit section 1108 FPC 1108a FPC 1108b FPC 1156 Conductive layer 1157 Conductive layer 1201 Board 1202 Board 1203 Adhesive layer 1205 Insulation layer 1207 Insulating layer 1208 Conductive layer 1209 Insulating layer 1209a Insulating layer 1209b Insulating layer 1211 Insulating layer 1212 Conductive layer 1213 Sealing layer 1215 Connector 1215a Connector 1215b Connection 1217 Spacer 1230 Light emitting element 1231 Lower electrode 1233 EL layer 1235 Upper electrode 1240 Transistor 1250 Photodetector 1255 Insulation layer 1257 Light blocking layer 1259 Colored layer 1261 Insulating layer 1270 Conductive layer 1271 p-type semiconductor layer 1272 Conductive layer 1273 i-type semiconductor layer 1274 Conductive layer 1275 n-type semiconductor layer 1276 Insulating layer 1278 Insulating layer 1280 Conductive layer 1281 Conductive layer 1283 Conductive layer 1291 Insulation layer 1292 Conductive particles 1293 Insulation layer 1294 Conductive layer 1295 Insulation Layer 1296 Conductive layer 1301 Preparation board 1303 Peeling layer 1305 Preparation Board 1307 Peeling layer 1310a conductive layer 1310b Conductive layer 9600 Tablet PC 9625 Switch 9626 Switch 9627 Power Switch 9628 Operation Switch 9629 Fastener 9630 Case 9630a Case 9630b Case 9631 Display section 9632 Touch Sensor Area 9633 Solar Cells 9634 Charge / discharge control circuit 9635 Battery 9636 DC-DC Converter 9637 Converter 9638 Operation key 9639 Base material

Claims

[Claim 1] a display panel having flexibility and including a first region and a second region; a first housing and a second housing arranged on an outer periphery of a display surface side of the display panel; a flexible base material fixed to the first housing, the display panel is deformable between an unfolded state in which the first region and the second region are located on substantially the same plane and a folded state in which the first region and the second region are located overlapping each other; in the unfolded state, the flexible base material has a third region overlapping with a part of the outer periphery of the display panel on which the first housing is disposed, and a fourth region overlapping with a part of the outer periphery of the display panel on which the second housing is disposed, and does not overlap with any region of the display panel other than the outer periphery; in the unfolded state, the flexible base material is located below a first bottom surface of the first housing, the flexible base material is located below a second bottom surface of the second housing, and the display panel is located below the flexible base material; the second housing has a groove in which a part of the flexible base material can slide, In the deployed state, a portion of the flexible base material is inserted into the groove portion, During the deformation operation into the folded state, at least a portion of the flexible base material inserted into the groove is pulled out.

Images