converter

Abstract

The converter includes a housing including a refrigerant flow path; a printed circuit board disposed on top of the housing and having electronic components disposed on its upper surface; and a cover disposed on top of the printed circuit board and covering the upper surfaces of the electronic components. A thermally conductive layer filled with a thermal interface material is disposed on the upper surface of the housing or the lower surface of the cover, which overlaps the electronic components in the vertical direction.

Description

[Technical field]

[0001] The present embodiment relates to a converter. [Background technology]

[0002] The following description is merely intended to provide background information for the present embodiment and is not intended to describe the prior art.

[0003] The most common electrical systems in an automobile are the engine electrical systems (starting system, ignition system, charging system) and lighting systems, but in recent years, as vehicles have become more electronically controlled, there has been a trend toward most systems, including the sash electrical systems, being electric and electronic.

[0004] Various electrical equipment installed in automobiles, such as lamps, audio, heaters, and air conditioners, are powered by the battery when the vehicle is stopped, and by a generator when the vehicle is running; at this time, the generating capacity of the 14V system power supply is used at the normal power supply voltage.

[0005] In recent years, with the development of the information technology industry, various new technologies aimed at increasing the convenience of automobiles (motorized power steering, Internet, etc.) have been incorporated into vehicles, and it is expected that the development of new technologies that can make the most of current automobile systems will continue in the future.

[0006] Regardless of whether they are soft or hard-powered, hybrid electric vehicles (HEVs) are equipped with a low voltage DC-DC converter to supply electric loads (12V).The DC-DC converter, which acts as a generator (alternator) in a normal gasoline vehicle, steps down the high voltage of the main battery (usually a high voltage battery of 144V or more) to supply 12V to the electric load.

[0007] A DC-DC converter is an electronic circuit device that converts a DC power source of one voltage into a DC power source of another voltage, and is used in a variety of fields, including television sets and automotive electrical equipment.

[0008] The converter has an outer shape formed by a housing, and a number of electronic components are arranged inside the housing for operation. The electronic components generate heat when they are operated. To dissipate the heat, the housing is provided with a refrigerant pipe or a refrigerant passage for absorbing the heat generated by the electronic components, but there is a problem that the heat dissipation within the housing is not sufficient with only the refrigerant pipe. Summary of the Invention [Problem to be solved by the invention]

[0009] The present embodiment aims to provide a converter capable of improving heat dissipation efficiency by improving the structure. [Means for solving the problem]

[0010] In one embodiment, the device includes a housing including a refrigerant flow path; a printed circuit board disposed on the upper part of the housing and having electronic components disposed on an upper surface thereof; and a cover disposed on the upper part of the printed circuit board and covering an upper surface of the electronic components; and a thermally conductive layer filled with a thermal interface material is disposed on the upper surface of the housing or the lower surface of the cover, which overlaps with the electronic components in the vertical direction.

[0011] The upper surface of the housing and the lower surface of the cover are provided with the thermally conductive layer. of A receiving groove may be formed.

[0012] A protrusion that protrudes upward higher than other areas is arranged on the upper surface of the housing, the protrusion is arranged so as to overlap the electronic component in the vertical direction, and the thermal conduction layer is arranged on the upper surface of the protrusion.

[0013] The electronic component may include terminals that protrude downwardly through the printed circuit board.

[0014] The housing may have a terminal groove on an upper surface thereof, into which the terminal is coupled, and the thermally conductive layer may be disposed within the terminal groove.

[0015] The electronic components may include an inductor and a transformer.

[0016] The thermally conductive layer may include a first thermally conductive layer disposed under the printed circuit board, and a second thermally conductive layer disposed between the cover and the electronic component.

[0017] The transformer may include a bracket that encases an outer surface of the transformer, the bracket being capable of being coupled at both ends to the printed circuit board.

[0018] The terminal groove may be disposed adjacent to the protrusion.

[0019] In another embodiment, a converter includes a housing, a printed circuit board disposed on one surface of the housing, an electronic component electrically connected to the printed circuit board and including a terminal, and a cover disposed on the printed circuit board, the housing or the cover having a terminal groove for receiving at least a portion of the terminal, and a thermally conductive layer filled with a thermal interface material disposed in the terminal groove. Effect of the Invention

[0020] According to the present invention, a thermally conductive layer is formed so that heat can be transferred in both directions based on an electronic component, thereby improving heat dissipation efficiency.

[0021] Furthermore, there is an advantage that a thermally conductive layer can be formed in the area where the thermally conductive material is applied, thereby increasing the contact area with the electronic component. [Brief description of the drawings]

[0022] [Figure 1] 1 is a perspective view of a converter according to an embodiment of the present invention; [Diagram 2] FIG. 2 is a plan view illustrating the bottom surface of a converter according to an embodiment of the present invention. [Diagram 3] FIG. 2 is an exploded perspective view of a converter according to an embodiment of the present invention. [Figure 4] FIG. 2 is a plan view illustrating the top surface of a converter according to an embodiment of the present invention. [Diagram 5] FIG. 5 is a cross-sectional view taken along line AA′ of FIG. [Figure 6] 1 is a cross-sectional view of a converter according to an embodiment of the present invention. [Figure 7] FIG. 4 is a plan view illustrating the underside of the cover according to the embodiment of the present invention. [Figure 8] FIG. 2 is a plan view illustrating the top surface of a housing according to an embodiment of the present invention. [Figure 9] FIG. 4 is a cross-sectional view illustrating the arrangement of terminals in terminal grooves according to an embodiment of the present invention. [Figure 10] FIG. 13 is a cross-sectional view illustrating a comparative example when a general heat dissipation pad is disposed in a terminal groove. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0023] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0024] However, the technical concept of the present invention is not limited to the embodiments described and may be embodied in various different forms, and one or more of the components of the embodiments may be selectively combined or substituted within the scope of the technical concept of the present invention.

[0025] Furthermore, unless otherwise clearly and specifically defined, terms (including technical and scientific terms) used in the embodiments of the present invention are to be interpreted as meanings that can be commonly understood by a person having ordinary knowledge in the technical field to which the present invention belongs, and terms commonly used together with predefined terms should be interpreted in light of the contextual meaning of the relevant art.

[0026] In addition, the terms used in the embodiments of the present invention are intended to describe the embodiments and are not intended to limit the present invention. In this specification, the singular form can include the plural form unless otherwise specified in the text, and when it is described as "A and (and) at least one (or more) of B and C", it can include one or more of any combination that can be combined with A, B, and C.

[0027] Additionally, terms such as first, second, A, B, (a), (b), etc. may be used to describe components of embodiments of the present invention.

[0028] Such terms are used only to distinguish one component from another, and are not intended to limit the nature, order, or sequence of the components.

[0029] In addition, when a component is described as being 'coupled', 'coupled' or 'connected' to another component, it includes not only the case where the component is directly coupled, coupled or connected to the other component, but also the case where the component is 'coupled', 'coupled' or 'connected' by another component between the component and the other component.

[0030] In addition, when described as being formed or disposed "above (above) or below (below)" each component, the above (above) or below (below) includes not only the case where two components are in direct contact with each other, but also the case where one or more additional components are formed or disposed between the two components. In addition, when described as "above (above) or below (below)", it can include not only the above direction but also the below direction based on one component.

[0031] The converter according to the present embodiment is an electrical component installed in an automobile, and refers to an electronic circuit device that converts a power source of one voltage into a power source of another voltage. For example, the converter may be a DC-DC converter. However, the configuration according to the present embodiment is not limited thereto, and the connector module according to the present embodiment may be applied to various electrical components.

[0032] FIG. 1 is an oblique view of a converter according to an embodiment of the present invention, FIG. 2 is a plan view illustrating the underside of a converter according to an embodiment of the present invention, FIG. 3 is an exploded oblique view of a converter according to an embodiment of the present invention, FIG. 4 is a plan view illustrating the top of a converter according to an embodiment of the present invention, FIG. 5 is a cross-sectional view showing A-A' of FIG. 4, FIG. 6 is a cross-sectional view of a converter according to an embodiment of the present invention, FIG. 7 is a plan view illustrating the underside of a cover according to an embodiment of the present invention, FIG. 8 is a plan view illustrating the top of a housing according to an embodiment of the present invention, FIG. 9 is a cross-sectional view illustrating the arrangement of terminals in terminal grooves according to an embodiment of the present invention, and FIG. 10 is a cross-sectional view illustrating a comparative example when a general heat dissipation pad is arranged in a terminal groove.

[0033] 1 to 10 , a converter 100 according to an embodiment of the present invention may include a housing 110 , a printed circuit board 120 disposed within the housing 110 , and a cover 180 disposed on the printed circuit board 120 .

[0034] The housing 110 is formed in a plate shape, and a number of electronic components including the printed circuit board 120 may be disposed on the upper part. The housing 110 may be called a base because it supports the printed circuit board 120 and the electronic components from below. Another printed circuit board may be disposed on the upper surface of the housing 110 in addition to the printed circuit board 120. The other printed circuit board may be spaced apart from the printed circuit board 120 in the upward and downward directions and electrically connected to each other.

[0035] A support 111 for separating the printed circuit board 120 upward may be disposed on an upper surface of the housing 110. One end of the support 111 may be coupled to the upper surface of the housing 110 and the other end may be coupled to a lower surface of the printed circuit board 120.

[0036] A refrigerant flow path 102 having an inlet 104 at one end through which the refrigerant flows and an outlet 103 at the other end through which the refrigerant is discharged may be disposed within the housing 110. Thus, the refrigerant that flows in through the inlet 104 may circulate through the refrigerant flow path 102 to exchange heat, and then may be discharged through the outlet 103.

[0037] Alternatively, a refrigerant pipe through which a refrigerant flows may be connected to the lower surface of the housing 110, so that heat generated within the housing 110 can be dissipated through the refrigerant pipe.

[0038] The printed circuit board 120 may be formed in a plate shape and disposed on the upper part of the housing 110. A number of electronic components for driving the converter 100 may be disposed on the printed circuit board 120. For example, a transformer 126 for adjusting voltage and an inductor 122 for obtaining inductance may be disposed on the upper surface of the printed circuit board 120. The transformer 126 and the inductor 122 may be electrically connected to the printed circuit board 120 and disposed spaced apart from each other.

[0039] The transformer 126 may include a first terminal 127 to be electrically connected to the printed circuit board 120. The first terminal 127 may include an input terminal and an output terminal. The first terminal 127 may be disposed to penetrate the printed circuit board 120 and have at least a portion protruding downward from a lower surface of the printed circuit board 120.

[0040] Meanwhile, the transformer 126 may be coupled to the printed circuit board 120 via a bracket. The bracket may be disposed to enclose an outer surface of the transformer 126, and a lower end of the bracket may be physically coupled to the printed circuit board 120 or an upper surface of the housing 110.

[0041] The inductor 122 may include a second terminal 122a to be electrically connected to the printed circuit board 120. The second terminal 122a may include an input terminal and an output terminal. The second terminal 122a may be disposed to penetrate the printed circuit board 120 and have at least a portion protruding downward from a lower surface of the printed circuit board 120.

[0042] The transformer 126 and the inductor 122 may be disposed to be overlapped with the refrigerant passage 102 in the upper and lower directions.

[0043] The cover 180 may be disposed on the printed circuit board 120. The cover 180 may be disposed on the electronic components to cover the electronic components. The cover 180 may be screwed to the printed circuit board 120. A connector 182 for connection to an external terminal may be disposed on an upper surface of the cover 180.

[0044] The housing 110 and the cover 180 may be made of a metal material, for example, aluminum.

[0045] The converter 100 may further include a case for protecting the housing 110, the printed circuit board 120, and the cover 180 from an external environment. A space for receiving the housing 110, the printed circuit board 120, and the cover 180 may be formed inside the case.

[0046] The heat dissipation structure of the converter 100 according to this embodiment will be described below.

[0047] A first protrusion 115 and a second protrusion 116 protruding upward from other regions may be disposed on the upper surface of the housing 110. The first protrusion 115 may be disposed in a region overlapping with the inductor 122 in the vertical direction. The second protrusion 116 may be disposed in a region overlapping with the transformer 126 in the vertical direction.

[0048] An upper surface of the first protrusion 115 and an upper surface of the second protrusion 116 may be formed to be lower than an upper surface of the housing 110. An upper surface of the first protrusion 115 and an upper surface of the second protrusion 116 may be formed to have a step on the upper surface of the housing 110. Thus, a region of the upper surface of the housing 110 that vertically overlaps with the inductor 122 or the transformer 126 may be formed to have a step lower than other regions.

[0049] In addition, a terminal groove 118 may be disposed on the upper surface of the housing 110, the terminal groove 118 being recessed from other regions and receiving the first terminal 127 or the second terminal 122a. The terminal groove 118 may be disposed adjacent to the first protruding portion 115 or the second protruding portion 116. The terminal groove 118 may be disposed between the first protruding portion 115 and the second protruding portion 116. For example, when the first terminal 127 is disposed in the terminal groove 118, the terminal groove 118 may be disposed on both sides of the second protruding portion 116. A bottom surface of the terminal groove 118 may be the upper surface of the housing 110.

[0050] The printed circuit board 120 and the upper surface of the housing 110, and the cover 120 and the upper surface of the electronic components may be spaced apart by a predetermined distance. Gaps may be formed between the printed circuit board 120 and the upper surface of the housing 110, and between the cover 120 and the upper surface of the electronic components. A thermally conductive layer 150 may be disposed in the gaps. The thermally conductive layer 150 may be a region filled with a thermal interface material. The thermally conductive layer 150 may be formed by applying the thermally conductive material on the housing 110 and then curing the material. For example, the thermally conductive layer 150 may be a region applied with thermal grease.

[0051] In other words, a groove may be formed on the upper surface of the housing 110 or the lower surface of the cover 180 to accommodate the thermally conductive layers 150 and 160 .

[0052] The thermally conductive layer 150 may have a lower surface disposed on an upper surface of the housing 110 and an upper surface disposed on a lower surface of the printed circuit board 120. Alternatively, the upper surface of the thermally conductive layer 150 may be spaced a predetermined distance from the lower surface of the printed circuit board 120. The thermally conductive layer 150 may transfer heat generated from the electronic components to the coolant passage 102 through the housing 110.

[0053] More specifically, the thermally conductive layer 150 may be disposed on the terminal grooves 118 and upper surfaces of the protrusions 115 and 116. The thermally conductive layer 150 may be disposed in an area that vertically overlaps with the electronic components. The terminal grooves 118 may be filled with the thermally conductive layer 150, and the terminals 122a and 127 may be coupled to the thermally conductive layer 150.

[0054] The terminals 122 a and 127 may be sandwiched between the thermally conductive layer 150 .

[0055] 9, at least a portion of the outer surfaces of the terminals 122a and 127 may be covered by the thermally conductive layer 150. If the thermally conductive layer 150 is embodied as a separate thermal pad (A) instead of the area coated with the heat dissipation material as in Fig. 10, a gap (C) may be formed between the thermal pad (A) and the terminal (B) during the insertion of the terminal (B), and heat may not be smoothly transferred to the thermal pad (A) through the terminal (B).

[0056] However, according to the present embodiment, after filling the terminal groove 118 with a thermally conductive material, the terminal 127 is inserted, thereby preventing a gap from occurring between the terminal and the thermally conductive layer 150, and therefore heat transfer can be performed more smoothly.

[0057] A thermally conductive layer 160 filled with a thermal interface material may also be disposed on a region of the lower surface of the cover 180 facing the electronic components. The thermally conductive layer 160 may be disposed between an upper surface of the electronic components and a lower surface of the cover 180. Thus, heat generated from the electronic components may be transferred to the cover 180 via the thermally conductive layer 160.

[0058] Meanwhile, a thermally conductive layer receiving portion 162 for receiving the thermally conductive layer 160 may be disposed on the lower surface of the cover 180. A groove may be formed inside the thermally conductive layer receiving portion 162 so that the thermally conductive layer 160 is disposed therein. A cross-sectional shape of the groove may correspond to a cross-sectional shape of an upper surface of the electronic component.

[0059] In summary, the thermally conductive layer may include a first thermally conductive layer 150 disposed between the printed circuit board 120 and the upper surface of the housing 110, and a second thermally conductive layer 160 disposed between the electronic components and the lower surface of the cover 180.

[0060] According to the above-mentioned structure, a thermally conductive layer is formed so that heat can be transferred in both directions based on the electronic component, thereby improving heat dissipation efficiency.

[0061] Furthermore, since the thermally conductive layer is formed in the area where the thermally conductive material is applied, the contact area with the electronic component can be increased.

[0062] Although it has been described above that any of the components constituting the embodiments of the present invention are combined or operated in combination, the present invention is not necessarily limited to such an embodiment. That is, any of the components may be selectively combined and operated in combination within the scope of the present invention. In addition, the terms 'comprise', 'comprise', 'have', etc. described above mean that the relevant component may be present, unless otherwise specified to the contrary, and therefore should be interpreted as including other components, not excluding other components. All terms, including technical and scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the present invention belongs, unless otherwise defined. Terms commonly used together with predefined terms should be interpreted as consistent with the contextual meaning of the relevant art, and should not be interpreted as idealized or overly formal unless expressly defined in the present invention.

[0063] The above description is merely illustrative of the technical idea of ​​the present invention, and various modifications and variations may be made by those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are for illustrative purposes only and are not intended to limit the technology and ideas of the present invention, and the scope of the technical ideas of the present invention is not limited by such embodiments. The scope of protection of the present invention should be interpreted according to the following claims, and all technical ideas within the scope equivalent thereto should be interpreted as being included in the scope of the present invention.

Claims

1. a housing containing a coolant flow path; a printed circuit board disposed on the upper portion of the housing and having electronic components disposed on an upper surface thereof; and a cover disposed on the printed circuit board and covering a top surface of the electronic component; a thermally conductive layer filled with a thermal interface material is disposed on an upper surface of the housing or a lower surface of the cover that vertically overlaps with the electronic component; A groove for receiving a thermally conductive layer is formed on the upper surface of the housing or the lower surface of the cover, A protrusion is disposed on the upper surface of the housing, the protrusion protruding above other regions, The protrusion is disposed so as to overlap the electronic component in a vertical direction, the thermally conductive layer being an area to which thermal grease is applied; The electronic component includes a terminal; The terminals extend downward through the printed circuit board; At least a portion of the terminal is disposed within the groove; The housing has an upper surface provided with terminal grooves to which the terminals are coupled, The thermally conductive layer is disposed within the terminal groove; The terminal groove is a plurality of grooves. The plurality of terminal grooves are disposed on both sides of the protrusion, respectively.

2. The converter of claim 1 , wherein the thermally conductive layer is disposed on an upper surface of the protrusion.

3. 3. The converter according to claim 1, wherein the electronic components include an inductor and a transformer.

4. The thermally conductive layer is 4. The converter according to claim 1, further comprising a first thermally conductive layer disposed on a lower portion of the printed circuit board, and a second thermally conductive layer disposed between the cover and the electronic component.

5. a bracket that encases an outer surface of the transformer; The converter of claim 3 , wherein the bracket is coupled to the printed circuit board at both ends.

6. housing; a printed circuit board disposed on one side of the housing; an electronic component electrically connected to the printed circuit board, the electronic component including a terminal; a cover disposed on top of the printed circuit board; The housing or the cover has a terminal groove for receiving at least a part of the terminal, A thermally conductive layer filled with a thermal interface material is disposed in the terminal groove, A groove is disposed on the upper surface of the housing to accommodate a thermally conductive layer; A protrusion is disposed on the upper surface of the housing, the protrusion protruding above other regions, The protrusion is disposed so as to overlap the electronic component in a vertical direction, the thermally conductive layer being an area to which thermal grease is applied; The electronic component includes a terminal; The terminals extend downward through the printed circuit board; At least a portion of the terminal is disposed within the groove; The housing has an upper surface provided with terminal grooves to which the terminals are coupled, The thermally conductive layer is disposed in the terminal groove, The terminal groove is a plurality of grooves. The plurality of terminal grooves are disposed on both sides of the protrusion, respectively.

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