Bypass device, laser device, and method for manufacturing electronic device

Abstract

A bypass device according to an aspect of the present disclosure is attachable to and detachable from a laser apparatus for outputting a pulse laser beam, and forms a bypass optical path for bypassing a pulse width elongation device that is provided in the laser apparatus and that elongates the pulse with of a pulse laser beam entered thereto. The bypass device comprises: a plurality of optical elements that form the bypass optical path; and a housing that stores the optical elements. The optical elements include: a first high reflection mirror that reflects the pulse laser beam, entering to the pulse width elongation device, toward the outside of the pulse width elongation device and guides the pulse laser beam to the bypass optical path; and a second high reflection mirror that reflects the pulse laser beam reflected by the first high reflection mirror and entering thereto through the bypass optical path and returns the pulse laser beam to an output optical path of the pulse width elongation device.

Description

[Technical field]

[0001] The present disclosure relates to a bypass apparatus, a laser apparatus, and a method for manufacturing an electronic device. [Background technology]

[0002] In recent years, semiconductor exposure devices are required to improve their resolution as semiconductor integrated circuits become finer and more highly integrated. For this reason, the wavelength of light emitted from exposure light sources is becoming shorter. For example, as gas laser devices for exposure, KrF excimer laser devices that output laser light with a wavelength of about 248 nm and ArF excimer laser devices that output laser light with a wavelength of about 193 nm are used.

[0003] The spectral line width of the spontaneous oscillation light of the KrF excimer laser device and the ArF excimer laser device is as wide as 350 to 400 pm. Therefore, if a projection lens is made of a material that transmits ultraviolet light such as KrF and ArF laser light, chromatic aberration may occur. As a result, the resolution may decrease. Therefore, it is necessary to narrow the spectral line width of the laser light output from the gas laser device to a level where the chromatic aberration can be ignored. Therefore, in order to narrow the spectral line width, a line narrowing module (LNM) including a line narrowing element (such as an etalon or grating) may be provided in the laser resonator of the gas laser device. Hereinafter, a gas laser device in which the spectral line width is narrowed is referred to as a line narrowing gas laser device. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2005-148550 A [Patent Document 2] Summary of JP-A-8-015618

[0005] A bypass device according to one aspect of the present disclosure is detachably attached to a laser device that outputs pulsed laser light, is provided within the laser device, and forms a bypass optical path that bypasses a pulse width stretcher that stretches the pulse width of incident pulsed laser light. The bypass device includes a plurality of optical elements that form the bypass optical path, and a housing that accommodates the plurality of optical elements. The plurality of optical elements include a first high-reflection mirror that reflects the pulsed laser light incident on the pulse width stretcher toward the outside of the pulse width stretcher and guides it to the bypass optical path, and a second high-reflection mirror that reflects the pulsed laser light reflected by the first high-reflection mirror and incident via the bypass optical path, and returns it to the output optical path of the pulse width stretcher.

[0006] A laser device according to one aspect of the present disclosure includes a laser oscillator that outputs a pulsed laser beam and a pulse width stretching device that stretches the pulse width of the incident pulsed laser beam, and has a bypass device that forms a bypass optical path that bypasses the pulse width stretching device removably attached, the bypass device including a plurality of optical elements that form the bypass optical path and a housing that houses the plurality of optical elements, and the plurality of optical elements include a first high-reflection mirror that reflects the pulsed laser beam incident on the pulse width stretching device toward the outside of the pulse width stretching device and guides it to the bypass optical path, and a second high-reflection mirror that reflects the pulsed laser beam reflected by the first high-reflection mirror and incident via the bypass optical path and returns it to the output optical path of the pulse width stretching device.

[0007] According to one aspect of the present disclosure, there is provided a method for manufacturing an electronic device, the method including: outputting the pulsed laser beam output from the laser apparatus, which includes a laser oscillator that outputs a pulsed laser beam and a pulse width stretching device that stretches the pulse width of the incident pulsed laser beam, to an exposure device to which a bypass device that forms a bypass optical path that bypasses the pulse width stretching device is detachably attached; and exposing a photosensitive substrate in the exposure device to the pulsed laser beam to manufacture an electronic device, the bypass device including a plurality of optical elements that form the bypass optical path and a housing that houses the plurality of optical elements, the plurality of optical elements including a first highly reflective mirror that reflects the pulsed laser beam incident on the pulse width stretching device toward outside the pulse width stretching device, thereby guiding the pulsed laser beam to the bypass optical path, and a second highly reflective mirror that reflects the pulsed laser beam reflected by the first highly reflective mirror and incident via the bypass optical path, thereby returning the pulsed laser beam to an output optical path of the pulse width stretching device. [Brief description of the drawings]

[0008] Some embodiments of the present disclosure will now be described, by way of example only, with reference to the accompanying drawings. [Figure 1] FIG. 1 is a front view showing a schematic configuration of a laser device according to a comparative example. [Diagram 2] FIG. 2 is a front view illustrating a schematic configuration example of the laser device according to the first embodiment. [Diagram 3] FIG. 3 is a front view showing a state in which the bypass device is attached to the laser device according to the first embodiment. [Figure 4] FIG. 4 is a top view illustrating a schematic configuration of a laser device according to the second embodiment. [Diagram 5] FIG. 5 is a front view illustrating a schematic configuration of a laser device according to the second embodiment. [Figure 6] FIG. 6 is a top view showing a state in which a bypass device is attached to the laser device according to the second embodiment. [Figure 7] FIG. 7 is a front view showing a state in which a bypass device is attached to the laser device according to the second embodiment. [Figure 8] FIG. 8 is a perspective view showing a state in which the bypass device is removed from the laser device according to the second embodiment. [Figure 9] FIG. 9 is a perspective view showing a state in which a bypass device is attached to the laser device according to the second embodiment. [Figure 10] FIG. 10 is a top view illustrating a schematic configuration of a laser device according to the third embodiment. [Figure 11] FIG. 11 is a front view illustrating a schematic configuration of a laser device according to the third embodiment. [Figure 12] FIG. 12 is a top view showing a state in which a bypass device is attached to the laser device according to the third embodiment. [Figure 13] FIG. 13 is a front view showing a state in which a bypass device is attached to the laser device according to the third embodiment. [Figure 14] FIG. 14 is a perspective view showing a state in which the bypass device is removed from the laser device according to the third embodiment. [Figure 15] FIG. 15 is a perspective view showing a state in which a bypass device is attached to the laser device according to the third embodiment. [Figure 16] FIG. 16 is a diagram illustrating a schematic configuration of a bypass device according to a first modified example of the first embodiment. As shown in FIG. [Figure 17] FIG. 17 is a diagram illustrating a schematic configuration of a bypass device according to a second modified example of the first embodiment. As shown in FIG. [Figure 18] FIG. 18 is a diagram illustrating an example of the configuration of an exposure apparatus. Embodiment

[0009] <Contents> 1. Comparative Example 1.1 Configuration 1.2 Operation 1.3 Challenges 2. First embodiment 2.1 Configuration 2.2 Operation 2.3 Effects 3. Second embodiment 3.1 Configuration 3.2 Operation 3.3 Effects 4. Third embodiment 4.1 Configuration 4.2 Operation 4.3 Effects 5. Modifications of the bypass device 5.1 First modified example 5.2 Second variant 5.3 Other Modifications 6. Manufacturing method of electronic devices

[0010] Hereinafter, the embodiments of the present disclosure will be described in detail with reference to the drawings. The embodiments described below show some examples of the present disclosure, and do not limit the contents of the present disclosure. Furthermore, not all of the configurations and operations described in each embodiment are necessarily essential as the configurations and operations of the present disclosure. Note that the same components are given the same reference symbols, and duplicated explanations will be omitted.

[0011] 1. Comparative Example 1.1 Configuration 1 is a schematic diagram showing a configuration example of a laser device 2 according to a comparative example. The comparative example of the present disclosure is a configuration that the applicant recognizes as being known only by the applicant, and is not a publicly known example that the applicant acknowledges.

[0012] In Fig. 1, the height direction of the laser device 2 is the V-axis direction, the length direction is the Z-axis direction, and the depth direction is the H-axis direction. The V-axis direction may be parallel to the direction of gravity, and the direction opposite to the direction of gravity is the "+V-axis direction." The emission direction of the pulsed laser light emitted from the laser device 2A is the "+Z-axis direction." The direction toward the front of the paper surface of Fig. 1 is the "+H-axis direction."

[0013] The laser device 2 includes a master oscillator (MO) 10, an MO beam steering unit 20, a power oscillator (PO) 30, a PO beam steering unit 40, and an optical pulse stretcher (OPS) 50.

[0014] The master oscillator 10 includes a line narrowing module (LNM) 11 , a chamber 14 , and an output coupling mirror (Output Coupler: OC) 17 .

[0015] The LNM 11 includes a prism beam expander 12 for narrowing the spectral linewidth, and a grating 13. The prism beam expander 12 and the grating 13 are arranged in a Littrow arrangement so that the angle of incidence and the angle of diffraction match.

[0016] The output coupling mirror 17 is a reflecting mirror with a reflectance in the range of 40% to 60%. The output coupling mirror 17 and the LNM 11 are disposed so as to form an optical resonator.

[0017] The chamber 14 is disposed on the optical path of the optical resonator. The chamber 14 includes a pair of discharge electrodes 15a, 15b and two windows 16a, 16b through which the pulsed laser light passes. The chamber 14 contains an excimer laser gas therein. The excimer laser gas may include, for example, Ar gas or Kr gas as a rare gas, F2 gas as a halogen gas, and Ne gas as a buffer gas.

[0018] The MO beam steering unit 20 includes a high-reflection mirror 21a and a high-reflection mirror 21b. The high-reflection mirror 21a and the high-reflection mirror 21b are arranged so that the pulsed laser light output from the master oscillator 10 is incident on the power oscillator 30. The high-reflection mirror in the present disclosure is a flat mirror in which a high-reflection film is formed on the surface of a substrate made of, for example, synthetic quartz or calcium fluoride (CaF2). The high-reflection film is a dielectric multilayer film, for example, a film containing a fluoride.

[0019] The power oscillator 30 includes a rear mirror 31, a chamber 32, and an output coupling mirror 35. The rear mirror 31 and the output coupling mirror 35 are arranged to form an optical resonator.

[0020] The chamber 32 is disposed on the optical path of the optical resonator. The chamber 32 may have a configuration similar to that of the chamber 14 of the master oscillator 10. That is, the chamber 32 includes a pair of discharge electrodes 33a, 33b and two windows 34a, 34b through which the pulsed laser light passes. The chamber 32 contains an excimer laser gas therein.

[0021] The rear mirror 31 is a reflecting mirror with a reflectance in the range of 50% to 90%. The output coupling mirror 35 is a reflecting mirror with a reflectance in the range of 10% to 30%.

[0022] The PO beam steering unit 40 includes a high-reflection mirror 40a and a high-reflection mirror 40b. The high-reflection mirror 40a and the high-reflection mirror 40b are disposed so that the pulsed laser light output from the power oscillator 30 is incident on the OPS 50.

[0023] The OPS 50 includes a beam splitter 52 and four concave mirrors 54a to 54d. The beam splitter 52 is disposed on the optical path of the pulsed laser light output from the PO beam steering unit 40. The beam splitter 52 is a reflecting mirror that transmits a portion of the incident pulsed laser light and reflects the remaining pulsed laser light. The reflectance of the beam splitter 52 is preferably within a range of 40% to 70%, and more preferably about 60%. The beam splitter 52 outputs the pulsed laser light that has transmitted through the beam splitter 52 from the laser device 2.

[0024] The four concave mirrors 54a to 54d form a delay optical path 56 for the pulsed laser light reflected by the first surface of the beam splitter 52. The pulsed laser light reflected by the first surface of the beam splitter 52 is reflected by the four concave mirrors 54a to 54d, and is arranged so that the beam is imaged by the beam splitter 52 again.

[0025] The four concave mirrors 54a to 54d may all have approximately the same focal length. The focal length f of each of the concave mirrors 54a to 54d may correspond to the distance from the beam splitter 52 to the concave mirror 54a, for example.

[0026] The concave mirrors 54a and 54b are arranged so that the pulsed laser light reflected by the first surface of the beam splitter 52 is reflected by the concave mirror 54a and incident on the concave mirror 54b. The concave mirrors 54a and 54b are arranged so that the pulsed laser light reflected by the first surface of the beam splitter 52 forms an image on the first surface of the beam splitter 52 at the same magnification (1:1) as a first image.

[0027] The concave mirrors 54c and 54d are arranged so that the pulsed laser light reflected by the concave mirror 54b is reflected by the concave mirror 54c and incident on the concave mirror 54d. Furthermore, the concave mirror 54d is arranged so that the pulsed laser light reflected by the concave mirror 54d is incident on a second surface of the beam splitter 52 opposite to the first surface. The concave mirrors 54c and 54d are arranged so that the first image is focused on the second surface of the beam splitter 52 at a 1:1 ratio as a second image.

[0028] The OPS 50 may include a beam splitter and two or more highly reflective mirrors.

[0029] 1.2 Operation When a discharge occurs in the chamber 14 of the master oscillator 10, the laser gas is excited, and a pulsed laser beam narrowed in band by an optical resonator formed by the output coupling mirror 17 and the LNM 11 is output from the output coupling mirror 17. This pulsed laser beam is made incident on the rear mirror 31 of the power oscillator 30 as a seed beam by the MO beam steering unit 20.

[0030] A discharge occurs in the chamber 32 in synchronization with the incidence of the seed light transmitted through the rear mirror 31. As a result, the laser gas is excited, the seed light is amplified by a Fabry-Perot type optical resonator constituted by the output coupling mirror 35 and the rear mirror 31, and the amplified pulsed laser light is output from the output coupling mirror 35. The pulsed laser light output from the output coupling mirror 35 passes through the PO beam steering unit 40 and enters the OPS 50.

[0031] A portion of the pulsed laser light incident on the OPS 50 passes through the beam splitter 52 and is output, and a portion of the pulsed laser light is reflected by the beam splitter 52. The pulsed laser light reflected by the beam splitter 52 travels around a delay optical path 56 formed by the first to fourth concave mirrors 54a to 54d and enters the beam splitter 52 again. Then, a portion of the pulsed laser light incident on the beam splitter 52 is reflected and output from the OPS 50. The pulsed laser light transmitted through the beam splitter 52 travels around the delay optical path 56 again.

[0032] In this way, the pulsed laser light repeatedly circulates through the delay optical path 56, and thus, pulsed laser light of 0 round trip light, 1 round trip light, 2 round trip light, 3 round trip light, etc. is output from the OPS 50. The optical intensity of the pulsed laser light output from the OPS 50 decreases as the number of round trips through the delay optical path 56 increases.

[0033] The pulsed laser light after the first revolution is delayed by an integer multiple of the delay time determined by the optical path length of the delay optical path 56 with respect to the pulsed laser light of the 0th revolution, and is then combined and output. That is, the pulse waveform of the pulsed laser light of the 0th revolution is sequentially superimposed on the pulse waveform of the pulsed laser light of the 1st revolution and thereafter, each delayed by the delay time. In this way, the pulse width of the pulsed laser light is extended by the OPS 50.

[0034] By expanding the pulse width of the pulsed laser light using the OPS50, the coherence is reduced, which in turn suppresses the occurrence of speckle. Speckle is a type of bright and dark speckle that occurs due to interference when laser light is scattered in a random medium.

[0035] 1.3 Challenges The laser device 2 according to the comparative example may have an abnormality in laser performance due to a malfunction or the like. Examples of the abnormality in laser performance include a decrease in the power of the pulsed laser light, a decrease in the beam characteristics of the pulsed laser light, etc. The decrease in the beam characteristics is, for example, an increase in beam divergence.

[0036] When an abnormality occurs in the laser performance, it may be possible to remove the OPS50 and check the laser performance again in order to identify the cause. This is to identify whether the cause is the laser oscillator (master oscillator 10 or power oscillator 30) or the OPS50. For example, when the power of the pulsed laser light decreases, the cause may be a decrease in the output of the laser oscillator or a decrease in the light transmittance of the OPS50. If the laser performance does not improve even after removing the OPS50, it can be determined that the cause is the laser oscillator, and conversely, if the laser performance improves by removing the OPS50, it can be determined that the cause is the OPS50.

[0037] However, the task of removing the OPS 50 from the laser device 2 and then reinstalling it to the laser device 2 can take, for example, half a day or more, during which time the factory production line may have to be stopped. Also, when reinstalling the OPS 50 that has been removed once to the laser device 2, the optical axis that was adjusted before removal may not be restored. In this case, the optical axis must be adjusted again, which can take even more time.

[0038] In this way, when an abnormality occurs in the laser performance, it is required to be able to identify the cause in a short period of time.

[0039] 2. First embodiment 2.1 Configuration Fig. 2 is a schematic diagram showing a configuration example of a laser device 2A according to a first embodiment of the present disclosure. Regarding the laser device 2A shown in Fig. 2, differences from the configuration of the laser device 2 according to the comparative example shown in Fig. 1 will be described. The laser device 2A according to the first embodiment differs from the configuration of the laser device 2 according to the comparative example in that the bypass device 60 is configured to be detachable.

[0040] The laser device 2A includes a master oscillator 10, an MO beam steering unit 20, a power oscillator 30, a PO beam steering unit 40, and an OPS 50. These elements may be similar to the configuration of the laser device 2 shown in FIG. 1. The master oscillator 10, or a combination of the master oscillator 10 and the power oscillator 30, is an example of a "laser oscillator" in this disclosure. The OPS 50 is an example of a "pulse width stretching device" in this disclosure. The PO beam steering unit 40 is an example of a "beam steering device" in this disclosure.

[0041] The bypass device 60 forms a bypass optical path that bypasses the delay optical path 56 included in the OPS 50. The bypass device 60 includes four high-reflection mirrors 61-64. The high-reflection mirrors 61-64 are an example of the "plurality of optical elements" in the present disclosure. The high-reflection mirror 61 is an example of the "first high-reflection mirror" in the present disclosure. The high-reflection mirror 64 is an example of the "second high-reflection mirror" in the present disclosure.

[0042] The high-reflection mirrors 61 to 64 are housed in a housing 65 and held at predetermined positions within the housing 65. The high-reflection mirrors 61 to 64 form a bypass optical path that bypasses the OPS 50.

[0043] In the laser device 2A, a space is provided on the light input side and the light output side of the OPS 50 into which a part of the bypass device 60 can be inserted. A housing 65 of the bypass device 60 is configured to be detachable from the laser device 2A. In FIG. 2, the position where the bypass device 60 is attached to the laser device 2A is shown by a dashed line. The housing 65 is positioned and fixed relative to the OPS 50 when attached to the laser device 2A. In FIG. 2, a solid line shows a state where the bypass device 60 is removed from the laser device 2A.

[0044] 3 shows a state in which the bypass device 60 is attached to the laser device 2A. When the bypass device 60 is attached to the laser device 2A, the high-reflection mirror 61 is arranged so as to reflect the pulsed laser light emitted from the PO beam steering unit 40 and make it incident on the high-reflection mirror 62. For example, the high-reflection mirror 61 is arranged to form an angle of 45° with respect to the incident optical axis of the OPS 50 and to reflect the pulsed laser light traveling along the incident optical axis at a reflection angle of 45°.

[0045] High-reflection mirror 62 and high-reflection mirror 63 are disposed so as to guide the pulsed laser light reflected by high-reflection mirror 61 to high-reflection mirror 64. For example, high-reflection mirror 62 is disposed so as to reflect the pulsed laser light incident from high-reflection mirror 61 at a reflection angle of 45° to make it incident on high-reflection mirror 63. High-reflection mirror 63 is disposed so as to reflect the pulsed laser light incident from high-reflection mirror 62 at a reflection angle of 45° to make it incident on high-reflection mirror 64.

[0046] The high-reflection mirror 64 is disposed at an angle of 45° with respect to the emission optical axis of the OPS 50, so as to reflect the pulsed laser light incident from the high-reflection mirror 63 at a reflection angle of 45° and return the pulsed laser light to the emission optical path of the OPS 50. In other words, the high-reflection mirror 64 is disposed so as to emit the pulsed laser light that has traveled through the bypass optical path onto the optical path of the pulsed laser light emitted from the OPS 50 when the bypass device 60 is not attached to the laser device 2A.

[0047] That is, the high reflection mirrors 61 to 64 are arranged so that the angle between the incident light and the reflected light is 90°.

[0048] A light entrance window (not shown) is formed in the housing 65 of the bypass device 60, through which the pulsed laser light emitted from the PO beam steering unit 40 is incident on the high-reflection mirror 61. In addition, a light exit window (not shown) is formed in the housing 65, through which the pulsed laser light reflected by the high-reflection mirror 64 is emitted out of the housing 65.

[0049] The high-reflection mirrors 61 to 64 may be arranged so that the angle between the incident light and the reflected light is an angle other than 90°. The high-reflection mirror 61 as the first high-reflection mirror may be arranged so as to guide the pulsed laser light to the bypass optical path by reflecting the pulsed laser light incident on the OPS 50 outward from the OPS 50. The high-reflection mirror 64 as the second high-reflection mirror may be arranged so as to return the pulsed laser light to the output optical path of the OPS 50 by reflecting the pulsed laser light reflected by the high-reflection mirror 61 and incident via the bypass optical path.

[0050] 2.2 Operation When the bypass device 60 is not attached to the laser device 2A, the pulsed laser light emitted from the power oscillator 30 enters the OPS 50 via the PO beam steering unit 40. The pulsed laser light that enters the OPS 50 has its pulse width expanded by the delay optical path 56, and is then emitted from the laser device 2A.

[0051] The bypass device 60 is attached to the laser device 2A, for example, during an investigation to identify the cause when an abnormality occurs in the laser performance of the pulsed laser light emitted from the laser device 2A. When the bypass device 60 is attached to the laser device 2A, the pulsed laser light emitted from the PO beam steering unit 40 and traveling along the incident optical axis of the OPS 50 enters the bypass device 60, travels through the bypass optical path without passing through the OPS 50, and is then output along the output optical axis of the OPS 50.

[0052] 2.3 Effects According to the laser apparatus 2A and the bypass device 60 according to the first embodiment, by attaching the bypass device 60 to the laser apparatus 2A, it becomes possible to output a pulsed laser beam by bypassing the OPS 50 without removing the OPS 50 from the laser apparatus 2A. Therefore, when an abnormality occurs in the laser performance of the laser apparatus 2A, the bypass device 60 can be attached and detached to easily perform an investigation to identify the cause.

[0053] The mirror angle of the OPS 50 and other components arranged in the optical path does not change when the bypass device 60 is installed, and the optical path returns to its original state when the bypass device 60 is removed, eliminating the need for optical axis adjustment. This makes it possible to shorten the overall work time required to identify the cause.

[0054] Since the bypass device 60 can be easily attached to and detached from the laser device 2A, the pulse width of the pulsed laser light can be switched by attaching and detaching the bypass device 60. In addition, since the output of the pulsed laser light decreases when it passes through the OPS 50, when the bypass device 60 is attached to the laser device 2A, the pulse width of the pulsed laser light becomes shorter while the output increases. Therefore, by attaching and detaching the bypass device 60, it becomes possible to select whether to give priority to the pulse width or the output of the pulsed laser light, and the practical performance of the laser device 2A can be expanded.

[0055] 3. Second embodiment Next, a laser device 2B according to a second embodiment of the present disclosure will be described. Note that, below, differences in configuration from the laser device 2 according to the comparative example will be described.

[0056] 3.1 Configuration Fig. 4 is a top view showing a schematic configuration of a laser device 2B according to the second embodiment. Fig. 5 is a front view showing a schematic configuration of the laser device 2B. Note that the "front" of the laser device 2B refers to the surface of the outer periphery of the laser device 2B on the side where an exterior cover panel (not shown) is widely opened for maintenance of the laser device 2B. When the exterior cover panel of the laser device 2B is opened, the surface on the side where the arrangement structure inside the device as shown in Fig. 5 can be seen is the "front".

[0057] The laser device 2B includes a master oscillator 10, an MO beam steering unit 20, a power oscillator 30, and an OPS 50. These elements may be similar in configuration to the laser device 2 shown in FIG.

[0058] The laser device 2B includes a long optical pulse stretcher 100 (hereinafter referred to as "L-OPS 100") for generating a long-distance optical path difference that stretches the pulse width. The L-OPS 100 is disposed on the rear surface of the laser device 2B. The "rear surface" is the rear side when viewed from the front surface of the laser device 2B, and is the surface opposite to the front surface. The L-OPS 100 is an example of a "pulse width stretching device" in this disclosure.

[0059] The laser device 2B includes a PO beam steering unit 42 instead of the PO beam steering unit 40 shown in Fig. 1. The PO beam steering unit 42 includes a high-reflection mirror 44a, a high-reflection mirror 44b, and a high-reflection mirror 44c for transmitting light to and from the L-OPS 100.

[0060] The high-reflection mirror 44a is disposed so as to reflect the pulsed laser light output from the power oscillator 30 and cause it to be incident on the high-reflection mirror 44b. The high-reflection mirror 44b is disposed so as to reflect the pulsed laser light reflected by the high-reflection mirror 44a and cause it to be incident on the L-OPS 100. The high-reflection mirror 44c is disposed so as to reflect the pulsed laser light output from the L-OPS 100 and cause it to be incident on the OPS 50.

[0061] The L-OPS100 is composed of a plurality of concave mirrors, a plurality of high-reflection mirrors, and a plurality of beam splitters. FIG. 4 shows only a plurality of concave mirrors 102 and one beam splitter 104 among the components of the L-OPS100. The beam splitter 104 is disposed at a position where the pulsed laser light reflected by the high-reflection mirror 44b of the PO beam steering unit 42 is incident. The L-OPS100 has a delay optical path 106 formed by the above components. That is, the laser device 2B according to the second embodiment includes two pulse width expanders, the OPS50 and the L-OPS100. Each of the OPS50 and the L-OPS100 may include a beam splitter and two or more high-reflection mirrors.

[0062] The laser device 2B is configured such that the bypass device 70 is detachable. The bypass device 70 includes two high-reflection mirrors 72 and 74. The high-reflection mirrors 72 and 74 are an example of the "plurality of optical elements" in the present disclosure. The high-reflection mirror 72 is an example of the "first high-reflection mirror" in the present disclosure. The high-reflection mirror 74 is an example of the "second high-reflection mirror" in the present disclosure.

[0063] The high-reflection mirrors 72 and 74 are housed in a housing 76 and held at predetermined positions within the housing 76. The high-reflection mirrors 72 and 74 form a bypass optical path that bypasses the L-OPS 100.

[0064] In the laser apparatus 2B, a space is provided between the L-OPS 100 and the PO beam steering unit 42 into which the bypass device 70 can be inserted. The housing 76 of the bypass device 70 is configured to be detachable from the laser apparatus 2B. In FIGS. 4 and 5, the position where the bypass device 70 is attached to the laser apparatus 2B is indicated by a dashed line. When the housing 76 is attached to the laser apparatus 2B, it is positioned and fixed relative to the PO beam steering unit 42. In FIGS. 4 and 5, the solid lines indicate the state where the bypass device 70 is removed from the laser apparatus 2B.

[0065] 6 and 7 show a state in which the bypass device 70 is attached to the laser device 2B. When the bypass device 70 is attached to the laser device 2B, the high-reflection mirror 72 is arranged so as to reflect the pulsed laser light emitted from the PO beam steering unit 42 and make it incident on the high-reflection mirror 74. For example, the high-reflection mirror 72 is arranged to form an angle of 45° with respect to the incident optical axis of the L-OPS 100 and to reflect the pulsed laser light traveling along the incident optical axis at a reflection angle of 45°.

[0066] The high-reflection mirror 74 is disposed so as to reflect the pulsed laser light incident from the high-reflection mirror 72 and make it incident on the high-reflection mirror 44c of the PO beam steering unit 42. For example, the high-reflection mirror 74 is disposed so as to form an angle of 45° with respect to the emission optical axis of the L-OPS 100 and to reflect the pulsed laser light incident from the high-reflection mirror 72 at a reflection angle of 45° and return it to the emission optical path of the L-OPS 100. In other words, the high-reflection mirror 74 is disposed so as to emit the pulsed laser light that has traveled through the bypass optical path onto the optical path of the pulsed laser light emitted from the L-OPS 100 when the bypass device 70 is not attached to the laser device 2B.

[0067] That is, the high reflection mirrors 72 and 74 are arranged so that the angle between the incident light and the reflected light is 90°.

[0068] 8 and 9 are perspective views that show a schematic configuration of the bypass device 70. Fig. 8 shows a state in which the bypass device 70 is removed from the laser device 2B. Fig. 9 shows a state in which the bypass device 70 is attached to the laser device 2B.

[0069] A light entrance window 78A is formed in the housing 76 of the bypass device 70, through which the pulsed laser light emitted from the PO beam steering unit 42 is incident on the high-reflection mirror 72. In addition, a light exit window 78B is formed in the housing 76, through which the pulsed laser light reflected by the high-reflection mirror 74 is emitted out of the housing 76.

[0070] The high-reflection mirrors 72 and 74 may be arranged so that the angle between the incident light and the reflected light is an angle other than 90°. The high-reflection mirror 72 as the first high-reflection mirror may be arranged so as to guide the pulsed laser light incident on the L-OPS 100 to the outside of the L-OPS 100, thereby guiding the pulsed laser light to the bypass optical path. The high-reflection mirror 74 as the second high-reflection mirror may be arranged so as to reflect the pulsed laser light reflected by the high-reflection mirror 72 and incident via the bypass optical path, thereby returning the pulsed laser light to the output optical path of the L-OPS 100.

[0071] 3.2 Operation When the bypass device 70 is not attached to the laser device 2B, the direction of the pulsed laser light emitted from the power oscillator 30 is changed by the high-reflection mirror 44a and the high-reflection mirror 44b of the PO beam steering unit 42. The pulsed laser light whose direction has been changed by the high-reflection mirror 44a and the high-reflection mirror 44b is incident on the L-OPS 100 on the back surface of the laser device 2B.

[0072] The pulsed laser light incident on the L-OPS 100 has its pulse width expanded by the delay optical path 106 and then returns to the PO beam steering unit 42. The pulsed laser light returning to the PO beam steering unit 42 has its direction changed by the high-reflection mirror 44c and is incident on the OPS 50. The pulsed laser light incident on the OPS 50 has its pulse width further expanded by the OPS 50 and is emitted from the laser device 2B.

[0073] The bypass device 70 is attached to the laser device 2B, for example, during an investigation to identify the cause when an abnormality occurs in the laser performance of the pulsed laser light emitted from the laser device 2B. When the bypass device 70 is attached to the laser device 2B, the pulsed laser light emitted from the high-reflection mirror 44b of the PO beam steering unit 42 and traveling along the incident optical axis of the L-OPS 100 is incident on the bypass device 70. The pulsed laser light incident on the bypass device 70 travels along the bypass optical path without passing through the L-OPS 100, and is then output along the output optical axis of the L-OPS 100. The pulsed laser light output from the bypass device 70 returns to the PO beam steering unit 42. The pulsed laser light returned to the PO beam steering unit 42 has its traveling direction changed by the high-reflection mirror 44c and is incident on the OPS 50. The pulsed laser light incident on the OPS 50 has its pulse width expanded by the OPS 50 and is output from the laser device 2B.

[0074] 3.3 Effects According to the laser apparatus 2B and the bypass device 70 of the second embodiment, by attaching the bypass device 70 to the laser apparatus 2B, it becomes possible to output a pulsed laser beam by bypassing the L-OPS 100 without removing the L-OPS 100 from the laser apparatus 2B. Therefore, when an abnormality occurs in the laser performance of the laser apparatus 2B, the bypass device 70 can be attached and detached to easily investigate and identify the cause.

[0075] The mirror angle of the L-OPS 100 and the like arranged in the optical path does not change by installing the bypass device 70, and the optical path returns to its original state by removing the bypass device 70, so there is no need to adjust the optical axis. This makes it possible to shorten the overall work time required for identifying the cause.

[0076] As in the first embodiment, the bypass device 70 can be easily attached and detached to the laser device 2B. Therefore, by attaching and detaching the bypass device 70, it becomes possible to select whether to give priority to the pulse width or the output of the pulsed laser light, thereby enhancing the practical performance of the laser device 2B.

[0077] 4. Third embodiment Next, a laser device 2C according to a third embodiment of the present disclosure will be described. Note that the following describes differences in configuration from the laser device 2B according to the second embodiment.

[0078] 4.1 Configuration FIG. 10 is a top view that shows a schematic configuration of a laser device 2C according to the third embodiment. FIG. 11 is a front view that shows a schematic configuration of the laser device 2C. The laser device 2C is configured such that a bypass device 80 can be detached instead of the bypass device 70 of the second embodiment. The bypass device 80 can be detached from the front of the laser device 2C, i.e., the maintenance surface side. The other configurations of the laser device 2C are similar to those of the laser device 2B according to the second embodiment.

[0079] The bypass device 80 includes five high-reflection mirrors 81-85. The high-reflection mirrors 81-85 are an example of the "multiple optical elements" in this disclosure. The high-reflection mirror 81 is an example of the "first high-reflection mirror" in this disclosure. The high-reflection mirror 85 is an example of the "second high-reflection mirror" in this disclosure.

[0080] The high-reflection mirrors 81 to 85 are housed in a housing 86 and held at predetermined positions within the housing 86. The high-reflection mirrors 81 to 85 form a bypass optical path that bypasses the L-OPS 100.

[0081] In the laser apparatus 2C, a space is provided in the PO beam steering unit 42 such that a portion of the bypass device 80 can be inserted therein. The housing 86 of the bypass device 80 is configured to be detachable from the laser apparatus 2C. In Figs. 10 and 11, the position where the bypass device 80 is attached to the laser apparatus 2C is indicated by a dashed line. When the housing 86 is attached to the laser apparatus 2C, it is positioned and fixed relative to the PO beam steering unit 42. In Figs. 10 and 11, the solid lines indicate the state where the bypass device 80 is removed from the laser apparatus 2C.

[0082] 12 and 13 show a state in which the bypass device 80 is attached to the laser device 2C. The high-reflection mirrors 81 to 84 are disposed at positions where the pulsed laser light reflected by the high-reflection mirror 44a of the PO beam steering unit 42 is sequentially incident when the bypass device 80 is attached to the laser device 2C.

[0083] The high-reflection mirror 85 is disposed so as to reflect the pulsed laser beam incident from the high-reflection mirror 84 and cause the pulsed laser beam to enter the OPS 50. That is, the high-reflection mirror 85 is disposed so as to output the pulsed laser beam along the output optical axis of the PO beam steering unit 42.

[0084] 14 and 15 are perspective views that show a schematic configuration of the bypass device 80. Fig. 14 shows a state in which the bypass device 80 is removed from the laser device 2C. Fig. 15 shows a state in which the bypass device 80 is attached to the laser device 2C.

[0085] A light entrance window 87A is formed in a housing 86 of the bypass device 80, through which the pulsed laser light reflected by the high reflection mirror 44a of the PO beam steering unit 42 is made incident on the high reflection mirror 81. In addition, a light exit window 87B is formed in the housing 86, through which the pulsed laser light reflected by the high reflection mirror 85 is made to exit the housing 86.

[0086] As shown in FIG. 15, the high-reflection mirror 81 is arranged to reflect the pulsed laser light reflected by the high-reflection mirror 44a of the PO beam steering unit 42 and traveling in the -V-axis direction, and to cause it to travel in the +H-axis direction. The high-reflection mirror 82 is arranged to reflect the pulsed laser light traveling in the +H-axis direction, and to cause it to travel in the +Z-axis direction. The high-reflection mirror 83 is arranged to reflect the pulsed laser light traveling in the +Z-axis direction, and to cause it to travel in the -V-axis direction. The high-reflection mirror 84 is arranged to reflect the pulsed laser light traveling in the -V-axis direction, and to cause it to travel in the -H-axis direction. The high-reflection mirror 85 is arranged to reflect the pulsed laser light traveling in the -H-axis direction, and to cause it to travel in the +Z-axis direction. That is, the high-reflection mirrors 81 to 85 are arranged such that the angle between the incident light and the reflected light is 90°.

[0087] The high-reflection mirrors 81 to 85 may be arranged so that the angle between the incident light and the reflected light is an angle other than 90°. The high-reflection mirror 81 as the first high-reflection mirror may be arranged so as to guide the pulsed laser light incident on the L-OPS100 to the outside of the L-OPS100, thereby guiding the pulsed laser light to the bypass optical path. The high-reflection mirror 85 as the second high-reflection mirror may be arranged so as to return the pulsed laser light to the emission optical path of the L-OPS100 by reflecting the pulsed laser light reflected by the high-reflection mirror 81 and incident via the bypass optical path. The emission optical path of the L-OPS100 refers to the optical path from the pulsed laser light emitted from the L-OPS100 to the OPS50.

[0088] 4.2 Operation The operation of the laser device 2C when the bypass device 80 is not attached is the same as that of the laser device 2B according to the second embodiment. The pulsed laser light emitted from the power oscillator 30 has its traveling direction changed by the PO beam steering unit 42 and enters the L-OPS 100 on the rear surface of the laser device 2C. The pulsed laser light that enters the L-OPS 100 has its pulse width extended by the L-OPS 100, returns to the PO beam steering unit 42, and has its traveling direction changed by the PO beam steering unit 42 and enters the OPS 50. The pulsed laser light that enters the OPS 50 has its pulse width further extended by the OPS 50 and is emitted from the laser device 2C.

[0089] The bypass device 80 is attached to the laser device 2C, for example, during an investigation to identify the cause when an abnormality occurs in the laser performance of the pulsed laser light emitted from the laser device 2C. When the bypass device 80 is attached to the laser device 2C, the pulsed laser light emitted from the power oscillator 30 is incident on the bypass device 80 after the traveling direction is changed by the high-reflection mirror 44a of the PO beam steering unit 42. The pulsed laser light incident on the bypass device 80 travels through the bypass optical path without passing through the L-OPS 100, and is output along the emission optical axis of the PO beam steering unit 42. The pulsed laser light output from the bypass device 80 is incident on the OPS 50, and the pulse width is expanded by the OPS 50 and output from the laser device 2C.

[0090] 4.3 Effects According to the laser apparatus 2C and bypass device 80 of the third embodiment, by attaching the bypass device 80 to the laser apparatus 2C, it becomes possible to output pulsed laser light by bypassing the L-OPS 100 without removing the L-OPS 100 from the laser apparatus 2C. In particular, the bypass device 80 of the third embodiment can be attached and detached from the front side of the laser apparatus 2C, i.e., the maintenance side, and therefore the attachment work is easy.

[0091] In addition, the laser device 2C and the bypass device 80 according to the third embodiment have the same effects as the laser device 2B and the bypass device 70 according to the second embodiment.

[0092] 5. Modifications of the bypass device Next, a modified example of the bypass device will be described. The bypass device according to the modified example enables adjustment of the optical axis of the bypass optical path.

[0093] 5.1 First modified example 16 shows a schematic configuration of a bypass device 60A according to a first modified example of the first embodiment. The bypass device 60A includes four highly reflective mirrors 61-64 for forming a bypass optical path, similar to the bypass device 60 according to the first embodiment.

[0094] Of the high-reflection mirrors 61-64, the high-reflection mirror 62 is held by a first actuator-equipped holder 90A, and the high-reflection mirror 63 is held by a second actuator-equipped holder 90B. The first and second actuator-equipped holders 90A, 90B are housed in a housing 65 together with the high-reflection mirrors 61-64. The first and second actuator-equipped holders 90A, 90B are an example of an "optical axis adjustment mechanism" in the present disclosure. The high-reflection mirror 62 is an example of a "first optical element" in the present disclosure. The high-reflection mirror 63 is an example of a "second optical element" in the present disclosure.

[0095] The first and second actuator-equipped holders 90A and 90B each include, for example, a holder, a PZT (lead zirconate titanate) actuator, and an automatic micrometer.

[0096] The first actuator-equipped holder 90A holds the high-reflection mirror 62 and changes the attitude angle of the high-reflection mirror 62 about two orthogonal axes. For example, the first actuator-equipped holder 90A rotates the high-reflection mirror 62 about the H-axis and about an axis that is parallel to the surface of the high-reflection mirror 62 and orthogonal to the H-axis.

[0097] Similarly, the second actuator-equipped holder 90B holds the high-reflection mirror 63 and changes the attitude angle of the high-reflection mirror 63 about two orthogonal axes. For example, the second actuator-equipped holder 90B rotates the high-reflection mirror 63 about the H-axis and about an axis that is parallel to the surface of the high-reflection mirror 63 and orthogonal to the H-axis. The first and second actuator-equipped holders 90A and 90B are controlled by a controller (not shown).

[0098] The optical axis of the bypass optical path can be adjusted by changing the attitude angles of the high reflection mirrors 62 and 63 about two axes. Specifically, the traveling direction and position of the pulsed laser light traveling through the bypass optical path can be adjusted.

[0099] When the bypass device 60A is attached to the laser device 2A according to the first embodiment, there is a possibility that the emission optical axis of the OPS 50 may be misaligned with the emission optical axis of the bypass device 60A. Even if such a misalignment occurs, the emission optical axis of the bypass device 60A can be aligned with the emission optical axis of the OPS 50 by controlling the first and second actuator-equipped holders 90A and 90B.

[0100] It should be noted that the present invention is not limited to the example shown in FIG. 16, and any two of the high reflection mirrors 61 to 64 may be held by the first and second actuator holders 90A and 90B.

[0101] 5.2 Second variant 17 is a schematic diagram showing a configuration of a bypass device 60B according to a second modified example of the first embodiment. The bypass device 60B includes four highly reflective mirrors 61-64 and a light-transmitting parallel plate substrate 66. The parallel plate substrate 66 is made of, for example, synthetic quartz or calcium fluoride (CaF2). The highly reflective mirrors 61-64 and the parallel plate substrate 66 are an example of the "plurality of optical elements" in this disclosure.

[0102] Of the high-reflection mirrors 61 to 64, the high-reflection mirror 62 is held by a first actuator-attached holder 90C. The first actuator-attached holder 90C has the same configuration as the first actuator-attached holder 90A described in the first modified example, and holds the high-reflection mirror 62 and changes the attitude angle of the high-reflection mirror 62 about two orthogonal axes. The first and second actuator-attached holders 90C and 90D are housed in a housing 65 together with the high-reflection mirrors 61 to 64 and the parallel plate substrate 66. The first and second actuator-attached holders 90C and 90D are an example of an "optical axis adjustment mechanism" in the present disclosure. The high-reflection mirror 62 is an example of a "first optical element" in the present disclosure.

[0103] The parallel plate substrate 66 is disposed at an angle on the optical path along which the pulsed laser light reflected by the high reflection mirror 62 travels toward the high reflection mirror 63. The parallel plate substrate 66 transmits the pulsed laser light incident from the high reflection mirror 62 and causes the pulsed laser light to be incident on the high reflection mirror 63. The parallel plate substrate 66 is an example of a "second optical element" in this disclosure.

[0104] The parallel plate substrate 66 is held by a second actuator-attached holder 90D. The second actuator-attached holder 90D has the same configuration as the first actuator-attached holder 90A described in the first modified example, and holds the parallel plate substrate 66 and changes the attitude angle of the parallel plate substrate 66 about two orthogonal axes. For example, the second actuator-attached holder 90D rotates the parallel plate substrate 66 around the H-axis and around an axis that is parallel to the surface of the parallel plate substrate 66 and orthogonal to the H-axis. The first and second actuator-attached holders 90C and 90D are controlled by a controller (not shown).

[0105] The optical axis of the bypass optical path can be adjusted by changing the attitude angles of the high reflection mirror 62 and the parallel plate substrate 66 about two axes. Specifically, the traveling direction of the pulsed laser light traveling through the bypass optical path can be adjusted by changing the attitude angle of the high reflection mirror 62.

[0106] Moreover, the position of the pulsed laser light can be adjusted by changing the attitude angle of the parallel plate substrate 66. The amount of change in position of the pulsed laser light passing through the parallel plate substrate 66 depends on the angle of incidence on the parallel plate substrate 66, the thickness of the parallel plate substrate 66, and the refractive index of the parallel plate substrate 66. By changing the attitude angle of the parallel plate substrate 66, the angle of incidence of the pulsed laser light on the parallel plate substrate 66 changes, and the position of the pulsed laser light changes accordingly.

[0107] In the example shown in FIG. 17, the high reflection mirror 62 is held by a first actuator holder 90C serving as an optical axis adjustment mechanism, but any of the high reflection mirrors 61 to 64 may be held by the first actuator holder 90C.

[0108] 17, the parallel plate substrate 66 is disposed between the high reflection mirror 62 and the high reflection mirror 63. Alternatively, the parallel plate substrate 66 may be disposed between the high reflection mirror 61 and the high reflection mirror 62, or between the high reflection mirror 63 and the high reflection mirror 64. The parallel plate substrate 66 may be disposed on the light incident side of the high reflection mirror 61 or on the light exit side of the high reflection mirror 64.

[0109] 5.3 Other Modifications Each of the high-reflection mirrors 72, 74 included in the bypass device 70 according to the second embodiment may be provided with a holder with an actuator as an optical axis adjustment mechanism. Alternatively, one of the high-reflection mirrors 72, 74 may be provided with a holder with an actuator, and a parallel plate substrate held by the holder with an actuator may be disposed between the high-reflection mirror 72 and the high-reflection mirror 74. Alternatively, a parallel plate substrate held by a holder with an actuator may be disposed on the light entrance side of the high-reflection mirror 72 or on the light exit side of the high-reflection mirror 74. Furthermore, the light entrance window 78A and the light exit window 78B are not essential and may simply be openings through which light passes.

[0110] Moreover, any two of the high-reflection mirrors selected from the high-reflection mirrors 81 to 85 included in the bypass device 80 according to the third embodiment may be provided with a holder with an actuator. Alternatively, one of the high-reflection mirrors selected from the high-reflection mirrors 81 to 85 may be provided with a holder with an actuator, and a parallel plate substrate held by the holder with an actuator may be disposed between the two high-reflection mirrors selected from the high-reflection mirrors 81 to 85. Alternatively, a parallel plate substrate held by a holder with an actuator may be disposed on the light entrance side of the high-reflection mirror 81 or on the light exit side of the high-reflection mirror 85. Furthermore, the light entrance window 78A and the light exit window 78B are not essential and may simply be openings through which light passes.

[0111] The actuator holder as the optical axis adjustment mechanism may be provided for three or more of the optical elements forming the bypass optical path. Furthermore, two or more of the optical elements forming the bypass optical path may be parallel plate substrates, and each of the parallel plate substrates may be provided with the actuator holder.

[0112] 6. Manufacturing method of electronic devices 18 shows a schematic configuration example of an exposure apparatus 200. The exposure apparatus 200 includes an illumination optical system 204 and a projection optical system 206. The illumination optical system 204 illuminates a reticle pattern of a reticle (not shown) arranged on a reticle stage RT with a pulsed laser beam incident from, for example, the laser apparatus 2A according to the first embodiment. The projection optical system 206 reduces and projects the pulsed laser beam transmitted through the reticle to form an image on a workpiece (not shown) arranged on a workpiece table WT. The workpiece is a photosensitive substrate such as a semiconductor wafer coated with photoresist.

[0113] Exposure apparatus 200 exposes a workpiece to a pulsed laser beam reflecting a reticle pattern by synchronously translating reticle stage RT and workpiece table WT. After transferring the reticle pattern to a semiconductor wafer by the above-described exposure process, a semiconductor device can be manufactured through multiple processes. A semiconductor device is an example of an "electronic device" in this disclosure.

[0114] Moreover, the laser device 2A that causes the pulsed laser light to enter the exposure device 200 may be equipped with a bypass device 60 or the bypass device 60 may be removed. When exposing a wafer, it is possible to select whether to give priority to the pulse width or the output of the pulsed laser light by attaching or detaching the bypass device 60. Note that the laser device is not limited to the laser device 2A, and the above-mentioned laser device 2B or laser device 2C may also be used.

[0115] The above description is intended to be illustrative rather than limiting. Thus, it will be apparent to those skilled in the art that modifications may be made to the embodiments of the present disclosure without departing from the scope of the appended claims.

[0116] Terms used throughout this specification and the appended claims should be construed as "open ended" terms. For example, the terms "including" or "including" should be construed as "not limited to what is described as including." The term "having" should be construed as "not limited to what is described as having." Additionally, the modifier "a" and "an" used throughout this specification and the appended claims should be construed as meaning "at least one" or "one or more."

Claims

1. A bypass device which is detachably attached to a laser device which outputs a pulsed laser beam, is provided in the laser device, and forms a bypass optical path which bypasses a pulse width expander which expands a pulse width of an incident pulsed laser beam, A plurality of optical elements forming the bypass optical path; A housing that houses the plurality of optical elements; Equipped with The plurality of optical elements include a first highly reflective mirror that reflects the pulsed laser light incident on the pulse width stretcher out of the pulse width stretcher and guides the pulsed laser light to the bypass optical path; a second high-reflection mirror that reflects the pulsed laser beam reflected by the first high-reflection mirror and incident via the bypass optical path back to an output optical path of the pulse width expander; Contains Bypass device.

2. 2. The bypass device of claim 1, The bypass optical path may further include an optical axis adjustment mechanism for adjusting the optical axis of the bypass optical path. Bypass device.

3. 3. The bypass device of claim 2, The optical axis adjustment mechanism includes a first actuator holder that holds a first optical element of the plurality of optical elements and changes an attitude angle of the first optical element, and a second actuator holder that holds a second optical element and changes an attitude angle of the second optical element. Bypass device.

4. 4. The bypass device of claim 3, The first optical element and the second optical element are high-reflection mirrors. Bypass device.

5. 4. The bypass device of claim 3, the first optical element is a highly reflective mirror; The second optical element is a light-transmitting parallel plate substrate. Bypass device.

6. 2. The bypass device of claim 1, the first high-reflection mirror reflects the pulsed laser beam output from a beam steering device that changes the traveling direction of the incident pulsed laser beam, The second high-reflection mirror outputs the pulsed laser light incident via the bypass optical path along the output optical axis of the pulse width expander and returns the pulsed laser light to the output optical path. Bypass device.

7. 2. The bypass device of claim 1, the first high-reflection mirror reflects the pulsed laser beam output from one high-reflection mirror included in a beam steering device that changes the traveling direction of the incident pulsed laser beam; The second high-reflection mirror outputs the pulsed laser light incident via the bypass optical path along the output optical axis of the pulse width stretching device and returns it to the beam steering device. Bypass device.

8. 2. The bypass device of claim 1, the first high-reflection mirror reflects the pulsed laser beam output from one high-reflection mirror included in a beam steering device that changes the traveling direction of the incident pulsed laser beam; The second high-reflection mirror outputs the pulsed laser light incident via the bypass optical path along the output optical axis of the beam steering device and returns the pulsed laser light to the output optical path. Bypass device.

9. A laser device comprising: a laser oscillator for outputting a pulsed laser beam; and a pulse width expander for expanding a pulse width of the incident pulsed laser beam, the laser device being provided with a bypass device for forming a bypass optical path for bypassing the pulse width expander, the bypass device being detachably attached to the laser oscillator, The bypass device comprises: A plurality of optical elements forming the bypass optical path; A housing that houses the plurality of optical elements; Equipped with The plurality of optical elements include a first high reflection mirror that reflects the pulsed laser light incident on the pulse width stretcher out of the pulse width stretcher and guides the pulsed laser light to the bypass optical path; a second high-reflection mirror that reflects the pulsed laser beam reflected by the first high-reflection mirror and incident via the bypass optical path back to an output optical path of the pulse width expander; Contains Laser device.

10. a pulse laser beam output from a laser device including a laser oscillator for outputting a pulse laser beam and a pulse width expander for expanding a pulse width of the incident pulse laser beam, the pulse laser beam being output from a laser device having a bypass device detachably attached thereto, the bypass device forming a bypass optical path for bypassing the pulse width expander, the pulse laser beam being output from the laser device to an exposure device; 1. A method for manufacturing an electronic device, comprising exposing a photosensitive substrate to the pulsed laser light in the exposure apparatus to manufacture an electronic device, The bypass device comprises: A plurality of optical elements forming the bypass optical path; A housing that houses the plurality of optical elements; Equipped with The plurality of optical elements include a first high reflection mirror that reflects the pulsed laser light incident on the pulse width stretcher out of the pulse width stretcher and guides the pulsed laser light to the bypass optical path; a second high-reflection mirror that reflects the pulsed laser light reflected by the first high-reflection mirror and incident via the bypass optical path back to an output optical path of the pulse width stretching device; Contains A method for manufacturing an electronic device.

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