Manufacturing method and device for electronic components

Abstract

To provide a method and a device for cutting a mother block more accurately without causing unexpected cutting frequently.SOLUTION: A method for manufacturing an electronic component has a cutting step of cutting a mother block 1 having an upper main surface MF and a lower main surface MB with an internal electrode buried therein into a plurality of processed products. In the cutting step, the mother block 1 is supported by a curved supporting member 22 from the lower main surface MB side of the mother block 1. The mother block 1 is relatively cut off by a cut knife 12 from the upper main surface MF side of the mother block 1 while being supported by the supporting member 22.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a method and an apparatus for manufacturing electronic components. [Background technology]

[0002] Conventionally, in the manufacture of multilayer ceramic electronic components, methods have been proposed for cutting a green sheet laminate while suppressing the occurrence of delamination. For example, Patent Document 1 proposes a cutting method in which the angle of the blade face and the surface roughness are set within a predetermined range when cutting a mother block into small blocks. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2012-71374 A Summary of the Invention [Problem to be solved by the invention]

[0004] As electronic components such as multilayer ceramic electronic components continue to become smaller, there is a demand for technology to cut mother blocks such as green sheet laminates with greater precision. An object of the present invention is to provide a method and an apparatus for cutting a mother block more accurately, which is less likely to cause unexpected cutting. [Means for solving the problem]

[0005] The method for producing an electronic component of the present invention includes the steps of: A method for manufacturing an electronic component, comprising: a cutting step of cutting a workpiece having upper and lower main surfaces with a plurality of internal electrodes embedded therein into a plurality of processed products, In the cutting step, the workpiece is supported by a curved support member from the lower main surface side of the workpiece, The workpiece is supported by the support member and is relatively pressed and cut by the cutting blade from the upper main surface side of the workpiece.

[0006] The electronic component manufacturing apparatus of the present invention further comprises: A support; A frame body that holds the periphery of the support body, Further comprising: a curved support member that is pressed from one main surface side of the support toward the other main surface side; and a cutting blade that is disposed at a position facing the curved support member on the other main surface side of the support; The support is curved by pressing the curved support member against the support; The cutting blade is pressed relatively against the curved support body to cut a workpiece placed on the other main surface of the support body. Effect of the Invention

[0007] According to the present invention, it is possible to provide a method and an apparatus for cutting a mother block more accurately, with less risk of unexpected cutting. [Brief description of the drawings]

[0008] [Figure 1] FIG. 2 is a perspective view of the cutting device, showing an overview of the cutting device. [Diagram 2] FIG. 2 is a plan view showing an outline of a ceramic green sheet on which electrodes are printed. [Diagram 3] FIG. 2 is a partial perspective view of a mother block showing an overview of the mother block. [Figure 4] 1A to 1C are diagrams illustrating an outline of a cutting method according to an embodiment of the present invention. [Diagram 5] FIG. 13 is an enlarged view of a portion where the mother block is cut. [Figure 6] 13A to 13C are diagrams illustrating an outline of a cutting method according to another embodiment of the present invention. [Figure 7] 13A and 13B are diagrams showing the shape of a support member according to another embodiment. [Figure 8] FIG. 1 is a diagram showing an outline of a conventional cutting method. [Figure 9] FIG. 13 is an enlarged view of a portion where a mother block is cut in a conventional cutting method. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] The method for manufacturing an electronic component of the present invention will be described below. In the following description, a multilayer ceramic capacitor will be taken as an example of an electronic component. However, the electronic component manufactured by the method for manufacturing an electronic component of the present invention is not limited to a multilayer ceramic capacitor. The electronic component may be another component such as a multilayer wiring board.

[0010] <Manufacturing method of multilayer ceramic capacitors> Multilayer ceramic capacitors are generally manufactured through the following steps: a lamination step in which a laminate is obtained by laminating a plurality of ceramic green sheets each having an internal electrode on its surface, a pressure molding step in which the laminate is pressed and bonded to form an unfired mother block, a first cutting step in which the mother block is cut into, for example, four cross-shaped blocks according to the arrangement of the internal electrodes, a pressing step in which each of the cut blocks is placed in a mold and pressed, a second cutting step in which the pressed blocks are cut into individual pieces to obtain chips, a firing step in which the chips are fired, and an external electrode forming step in which external electrodes are formed on the fired chips. The present invention relates to the first and second cutting steps among the above steps.

[0011] <Outline of the cutting device> A cutting device 10 used in the first and second cutting steps will be described with reference to Fig. 1. Fig. 1 is a perspective view of the cutting device 10, showing an overview of the cutting device 10. The cutting device 10 will be described below by taking as an example a case where the cutting device 10 is used in the first cutting step. When the cutting device 10 is used in the first cutting step, a mother block 1 as a workpiece is cut by a cutting blade 12. Then, a block is obtained as a processed product. The cutting device 10 can also be used in the second cutting step. When the cutting device 10 is used in the second cutting step, the workpiece becomes a block obtained by cutting the mother block 1. Then, the block is cut into individual pieces by the cutting device 10, and chips are obtained as the processed product.

[0012] The cutting device 10 includes a cutting blade 12 , a stage 16 and a camera 20 . <Cutting blade> The cutting blade 12 is a part that cuts the mother block 1. The cutting blade 12 is held by a holder 14. The cutting blade 12 is a push-cutting blade. The thickness of the cutting blade 12 is preferably 0.05 mm or more and 0.25 mm or less. The cutting blade 12 is, for example, a rectangular plate. The blade is disposed on one side in the longitudinal direction of the rectangle. The other side is thick, and this portion is held by the holder 14.

[0013] <Stage> The stage 16 is a portion on which the mother block 1 is placed. The mother block 1 is held on the stage 16 via a stacking jig (not shown in FIG. 1) and a holding member (not shown in FIG. 1). The stage 16 can move and rotate the mother block 1 placed on it. In Fig. 1, the direction of movement is indicated by an arrow D1, and the direction of rotation is indicated by an arrow D2. This movement and rotation are performed by a stage driving unit 18.

[0014] <Camera> The camera 20 is a part that photographs the mother block 1. The cutting device 10 performs positioning so that the mother block 1 is cut at an appropriate position based on the image photographed by the camera 20. Specifically, the stage driving unit 18 moves and rotates the stage 16 to perform positioning. Specifically, the camera 20 may be integrated with an illumination device (not shown). The camera 20 may also capture wavelengths other than visible light, such as X-rays. The camera 20 is disposed so as to be able to photograph a reference mark, which will be described later, from the side of the mother block 1. Based on the position of the reference mark photographed by the camera 20, it is determined where in the mother block 1 the cutting blade 12 should be inserted, and the position and orientation of the stage 16 are determined. The stage 16 can be rotated at least 90 degrees in the in-plane direction. For example, a first cutting is performed, and then the stage 16 is rotated 90 degrees. Then, a second cutting is performed in a direction perpendicular to the first cutting direction. This allows the mother block 1 to be divided into small pieces into diced blocks. Note that the mother block 1 does not necessarily have to be divided into small pieces, and may be cut into a square shape. When cutting in this manner, there is no need to provide the mother block 1 with a reference mark 4, which will be described later.

[0015] <Ceramic green sheet> 2 and 3, the mother block 1 cut by the cutting device 10 will be described. Fig. 2 is a plan view showing the appearance of a ceramic green sheet 5 on which internal electrodes 3 are printed. As shown in FIG. 2, a plurality of internal electrodes 3 arranged in a lattice pattern and a plurality of reference marks 4 arranged near the outer periphery of the ceramic green sheet 5 are printed on the ceramic green sheet 5. The ceramic green sheet 5 may have a thickness of, for example, 0.4 μm to 5.0 μm, and the internal electrode 3 may have a thickness of, for example, 0.1 μm to 2.0 μm. The mother block 1 is formed by laminating a plurality of ceramic green sheets 5 on which internal electrodes 3 are printed.

[0016] <Mother Block> 3 is a partial perspective view of the mother block 1, showing an overview of the mother block 1. The mother block 1 shown in FIG. 3 is the mother block 1 after the excess portion has been cut off so that the reference marks 4 and the internal electrodes 3 are exposed from the side surface of the mother block 1. As described above, the mother block 1 is cut after the camera 20 captures the reference marks 4 and the internal electrodes 3 exposed from the side surface of the mother block 1 and the cutting blade 12 is aligned with the mother block 1. The mother block 1 is cut at, for example, the intended cutting position L shown in FIG. The internal electrodes 3 are arranged at high density in the mother block 1. For example, 50 to 2000 internal electrodes 3 are laminated in the mother block 1. The distance between adjacent internal electrodes 3 in the same layer can be set to a narrow pitch of, for example, 50 μm to 200 μm.

[0017] <Cutting details> 4 is a diagram showing an outline of the cutting method of this embodiment, in which the mother block 1 is cut from its side. As shown in FIG. 4, the mother block 1 is placed on a lamination jig . <Lamination jig> The lamination jig 26 includes a support 26a and a frame 26b. The frame body 26b is a frame having a rectangular or square shape in a plan view and is made of, for example, metal.

[0018] <Support> The support 26a is a member stretched over the portion surrounded by the frame 26b. The support 26a is also called a base member. The support 26a is formed of a relatively thin support. The mother block 1 is placed on and held by the support 26a. There is no limitation on the method for holding the mother block 1 on the support 26a. For example, the mother block 1 may be held on the support 26a via an adhesive sheet whose adhesiveness decreases with increasing temperature. In this case, the adhesiveness of the adhesive sheet is reduced by heating, so that the mother block 1 and the support 26a can be easily separated. The material of the support 26a is preferably a metal such as stainless steel. The thickness of the support 26a may be, for example, 0.2 mm or more and 1.0 mm or less. When the support 26a is made of a metal, it is preferable to coat the surface of the support 26a with an adhesive substance such as a pressure sensitive adhesive, and then place the mother block 1 thereon.

[0019] <Retaining material> The stacking jig 26 is fixed to a stage (not shown in FIG. 4) by the holding members 24. Specifically, the stacking jig 26 is fixed by the holding members 24 sandwiching the frame body 26b. The holding member 24 can be used not only to fix the stacking jig 26 to the stage, but also when transporting the stacking jig 26. That is, the stacking jig 26, and therefore the mother block 1, can be transported by moving the holding member 24 while holding the frame body 26b. Moreover, the above-mentioned alignment of the mother block 1 based on the image captured by the camera 20 can also be performed by moving and rotating the holding member 24. The holding member 24 may be made of separate members for transport and alignment.

[0020] <Disconnect> The mother block 1 is cut as follows. As shown in Fig. 4, the cutting blade 12 is disposed on the upper main surface side SF of the support 26a and fixed at that position. Then, the support member 22 as a push-up member is pressed against the support 26a from the lower main surface side SB of the support 26a. Specifically, the support member 22 is moved in the direction of the arrow A. This causes the cutting blade 12 to relatively enter the mother block 1. As a result, the mother block 1 is cut.

[0021] 5 is an enlarged view of a portion where the mother block 1 is cut. With reference to FIG. 5, the manner in which the mother block 1 is cut will be described in more detail. 5, the tip 22T of the support member 22 has a curved shape. Therefore, when the support member 22 moves in the direction of the arrow A and the tip 22T abuts against the support 26a, the support 26a curves with its upper main surface SF convex. As the support 26a curves, the mother block 1 placed thereon also curves with its upper main surface MF convex. Then, as the support member 22 moves further in the direction of arrow A and the cutting blade 12 enters the mother block 1, the mother block 1 is split open toward both sides of the cutting blade 12 as shown by arrow B. Finally, the mother block 1 is cut by being relatively pushed by the cutting blade 12.

[0022] In the cutting process, a force that splits the mother block 1 in the direction of the arrow B is applied to the mother block 1, so that the load when the cutting blade 12 enters the ceramic green sheet 5 can be reduced. Furthermore, the mother block 1 is split open toward both sides of the cutting blade 12, which can release compressive stress acting in the in-plane direction of the mother block 1, i.e., in the thickness direction of the mother block 1. This can prevent the shape of the cut surface of the mother block 1 from becoming uneven. Even if a leading crack occurs in the mother block 1, the direction of the leading crack can be guided to a direction perpendicular to the main surface of the mother block 1. This makes it possible to suppress the occurrence of cutting defects caused by the leading crack running in a direction other than the direction perpendicular to the main surface of the mother block 1. <Conventional cutting method>

[0023] A conventional cutting method will now be described with reference to Fig. 8, which is a diagram showing an outline of the conventional cutting method. In the conventional cutting device 100, the mother block 1 is placed on a cutting table 110 via a support 26a. Then, the cutting blade 12 moves in the direction of the arrow D, whereby the mother block 1 is cut.

[0024] Cutting defects that occur in the conventional cutting method will be described with reference to Figures 9(a) and 9(b). Both Figures 9(a) and 9(b) are enlarged views of the part where the mother block is cut in the conventional cutting method. Figure 9(a) shows a cutting defect caused by a leading crack, and Figure 9(b) shows a cutting defect caused by an oblique cut.

[0025] <Pre-crack> The preceding crack will be explained based on FIG. As shown in Fig. 9(a), as the cutting blade 12 moves in the direction of arrow D and enters the mother block 1, a compressive stress is applied in the in-plane direction from the upper main surface MF of the mother block 1. This compressive stress generates a leading crack 120 in the mother block 1. The direction in which this leading crack 120 runs cannot be controlled or predicted. This is because, unlike cutting by the cutting method of this embodiment shown in Fig. 5, no force is acting to determine the direction in which the mother block 1 is split. Thus, in the conventional cutting method, a leading crack 120 whose direction cannot be controlled occurs, which causes an unexpected cut. This results in a cut failure.

[0026] <Diagonal cut> The oblique cut will be described with reference to FIG. As shown in Fig. 9(b), as the cutting blade 12 moves in the direction of arrow D and enters the mother block 1, the tip of the cutting blade 12 may bend. This is because the cutting blade 12 encounters resistance from the mother block 1 when it enters the mother block 1. When the tip of the cutting blade 12 is bent, the cut surface of the mother block 1 becomes slanted. This is a cutting defect of the slanted cut 130.

[0027] In recent years, multilayer ceramic capacitors have become larger in capacity and smaller in size. For this reason, the internal electrodes are embedded at high density inside the mother block 1 and pressed at high pressure. As a result, the mother block 1 has become harder. For this reason, unexpected cutting due to pre-cracks and cutting defects due to diagonal cuts are more likely to occur.

[0028] In the cutting method of the present embodiment, as shown in Fig. 5, the support member 22 comes into contact with the support body 26a, so that a force that splits the mother block 1 toward both sides of the cutting blade 12 can be applied to the mother block 1. Therefore, the splitting direction of the mother block 1 can be determined. Therefore, a leading crack 120 whose direction cannot be controlled as shown in Fig. 9(a) is unlikely to occur. Furthermore, in the cutting method of this embodiment, a force that splits the mother block 1 acts on the mother block 1 toward both sides of the cutting blade 12. This reduces the resistance that the cutting blade 12 receives from the mother block 1 when the cutting blade 12 enters the mother block 1. As a result, oblique cuts 130 as shown in FIG. 9(b) are less likely to occur.

[0029] <Cutting process> A typical operation in the cutting process will now be described. The mother block 1 is taken in from the take-in section while being held by the support 26a, and is transported to the processing section, in which a cutting device 10 is installed. In the processing section, the mother block 1 is cut by a cutting blade 12 . In the processing area, the following steps (1) to (7) are carried out. (1) The camera 20 reads the reference mark 4 from the side of the mother block 1 transported to the processing section. (2) By finely adjusting the stage 16 in accordance with the reference marks 4, the mother block 1 is positioned in accordance with the arrangement of the cutting blades 12. (3) The mother block 1 together with the support body 26a is pushed up relative to the cutting blade 12 by the supporting member 22, and is cut by the cutting blade 12. (4) The support member 22 returns to its original position, returning to (1). (5) Repeat steps (1) to (5) to cut mother block 1. (6) The stage 16, and therefore the holding member 24, rotates, thereby rotating the mother block 1 by 90 degrees within a plane. (7) Repeat (1) to (5). After the cutting is completed, the cut mother block 1 is transported to a removal section while being held by the support 26a, and is removed.

[0030] <Another action> Another operation in the cutting process will now be described. FIG. 6 is a diagram showing an outline of a cutting method involving different operations in the cutting process. In the cutting method described based on Fig. 4, the cutting blade 12 is fixed. In contrast, in the cutting method shown in Fig. 6, the cutting blade 12 is configured to move. 6, the cutting blade 12 moves in conjunction with the movement of the support member 22 in the direction of arrow A. That is, the cutting blade 12 moves in a direction approaching the support member 22 in accordance with the movement of the support member 22. This allows the mother block 1 to be cut while the degree of curvature of the support body 26a and the mother block 1 is small.

[0031] 4, the cutting blade 12 was fixed, and the mother block 1 was cut only by pushing up the support member 22. Therefore, it was necessary to bend the support member 26a and the mother block 1 to an extent that the mother block 1 was completely cut. 5, the cutting blade 12 moves to enter the mother block 1 from the upper main surface MF side of the mother block 1. Therefore, the mother block 1 is cut not only by pushing up the support member 22 but also by the entry of the cutting blade 12. This makes it possible to cut the mother block 1 even if the degree of curvature of the support body 26a and the mother block 1 caused by pushing up the support member 22 is reduced. As a result, the cutting method shown in Fig. 6 can extend the service life of the support 26a, because deformation of the support 26a each time it is cut can be suppressed. Moreover, it is possible to suppress the force that would warp the mother block 1 from being applied to the mother block 1. This makes it possible to suppress the accumulation of internal stress in the mother block 1.

[0032] <Shape of support member, etc.> The support member 22 will now be described in more detail. It is preferable that the material of the support member 22 has high hardness. For example, it is preferable that the support member 22 is formed of a material having a Rockwell hardness (HRC) of 50 or more. The hardness of the support member 22 must be higher than the hardness of the support body 26a, so that the support member 22 can be pushed up from below to curve the support body 26a. The support member 22 is disposed opposite the cutting blade 12 with the support 26a sandwiched between them. The support member 22 is configured to be able to approach the cutting blade 12 relatively, and moves to hold the support 26a together with the cutting blade 12. The distance of movement at that time, i.e., the stroke of the support member 22, is preferably within 1 mm. This allows the cutting process to be performed at a high speed.

[0033] The shape of the support member 22 will be described with reference to Figs. 7(a) and 7(b). Each view in Fig. 7 is a diagram showing the shape of the support member 22. Each view in Fig. 7 is a diagram showing the support member 22 as viewed from the side. "Viewed from the side" here means viewed in the longitudinal direction of the cutting edge of the cutting blade 12. Fig. 7(a) shows the support member 22 previously described in Fig. 4 etc. In this support member 22, the tip portion 22T has a curved shape, i.e., a curved surface. The radius of curvature of this curved surface is preferably 1 mm or more and 2.5 mm or less.

[0034] In the support member 22 shown in FIG. 7(b), the tip 22T has a triangular shape, particularly an acute angle shape. When the tip 22T has a triangular shape, the support 26a is curved to a smaller diameter when the tip 22T abuts against the support 26a. This makes it possible to shorten the distance over which the tip 22T is moved to cut the mother block 1. This makes it possible to speed up the cutting process.

[0035] 7(c), the tip 22T is flat and approximately parallel to the lower main surface MB of the mother block 1 before cutting. When the tip 22T is flat, i.e., a plane, and approximately parallel to the lower main surface MB of the mother block 1 before cutting, it becomes easy to distribute the stress that the support 26a receives when the tip 22T abuts against the support 26a in the plane. As a result, the service life of the support 26a can be extended. As described above, the shape of the tip 22T of the support member 22 can be various shapes such as a curved shape, an acute angle shape, a flat shape, etc., but a curved shape is preferable because it achieves a good balance of various requirements such as the degree of curvature of the support body 26a and the mother block 1, and the time required for cutting.

[0036] <1> A method for manufacturing an electronic component, comprising: a cutting step of cutting a workpiece having upper and lower main surfaces with a plurality of internal electrodes embedded therein into a plurality of processed products, In the cutting step, the workpiece is supported by a curved support member from the lower main surface side of the workpiece, The workpiece is supported by the support member and is relatively pressed and cut by the cutting blade from the upper main surface side of the workpiece. A method for manufacturing electronic components.

[0037] <2> The workpiece is a mother block, The process further comprises the steps of: <1> A method for manufacturing an electronic component according to claim 1.

[0038] <3> The workpiece is a mother block, The processed product is a block, The method further includes a pressing step of pressing each of the blocks into a mold. <1> A method for manufacturing an electronic component according to claim 1.

[0039] <4> The cutting blade is fixed and the workpiece is cut only by the pressing force from the support member. <1> from <3> 13. A method for producing an electronic component according to any one of claims 1 to 12.

[0040] <5> The workpiece is supported by a bendable support; The curved support member presses the workpiece against the blade via the support. <1> from <4> 13. A method for producing an electronic component according to any one of claims 1 to 12.

[0041] Although the embodiment of the present invention has been described above, the present invention is not limited to the above-described embodiment, and various changes and modifications are possible. [Explanation of symbols]

[0042] 1. Mother Block 2. Dielectrics 3 Internal electrode 4 Reference Marks 5 Ceramic green sheet 10 Cutting device 12 Cutting blade (push cutting blade) 14 Holder 16 Stages 18 Stage drive unit 20 Camera 22 Support member (push-up member) 22T tip 24 Retaining member 26 Stacking fixture 26a Support (base member) 26b Frame 100 cutting equipment 110 Cutting Table 120 Pre-crack 130 Diagonal Cut MF Mother block upper main surface MB: Lower main surface of mother block SF Upper main surface of support SB Lower main surface of support L Cutting position

Claims

1. A method for manufacturing an electronic component, comprising: a cutting step of cutting a workpiece having upper and lower main surfaces with a plurality of internal electrodes embedded therein into a plurality of processed products, In the cutting step, the workpiece is supported by a curved support member from the lower main surface side of the workpiece, The workpiece is supported by the support member, and the workpiece is relatively pushed and cut by the cutting blade from the upper main surface side of the workpiece, The workpiece is supported by a bendable support; The curved support member presses the workpiece against the blade via the support. A method for manufacturing electronic components.

2. The workpiece is a mother block, The process further comprises the steps of: The method for manufacturing an electronic component according to claim 1 .

3. The workpiece is a mother block, The processed product is a block, The method further includes a pressing step of pressing each of the blocks into a mold. The method for manufacturing an electronic component according to claim 1 .

4. The cutting blade is fixed and the workpiece is cut only by the pressing force from the support member. The method for manufacturing an electronic component according to claim 1 .

5. A support; A frame body that holds the periphery of the support body, Further comprising: a curved support member that is pressed from one main surface side of the support toward the other main surface side; and a cutting blade that is disposed at a position facing the curved support member on the other main surface side of the support; The support is curved by pressing the curved support member against the support; The cutting blade is pressed relatively against the curved support, thereby cutting the workpiece placed on the other main surface of the support; The workpiece is supported by a bendable support; The curved support member presses the workpiece against the blade via the support. Electronic component manufacturing equipment.

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