Cleaning sheet and conveying member with cleaning function

Abstract

To provide a cleaning sheet having a cleaning layer, which can be suitably used as a conveying member for conveying into a substrate processing apparatus, and which can effectively suppress an adsorption error when the cleaning layer is adsorbed to an adsorption stage or the like, and a conveying member with a cleaning function, which has such a cleaning sheet and conveying member.SOLUTION: A cleaning sheet according to an embodiment of the present invention includes a cleaning layer, when viewed from the normal direction to the surface of the cleaning layer, the direction from the edge of the surface toward the center is defined as the center direction, a region occupied by a width of 10 mm from the end toward the center of the surface is defined as an end region, and the maximum thickness L in the normal direction of the cleaning layer in the end region and the average thickness T in the normal direction of the cleaning layer in the region other than the end region of the cleaning layer have a relationship of L-T≤5 μm.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to a cleaning sheet and a conveying member with a cleaning function. [Background technology]

[0002] In various substrate processing equipment that is sensitive to foreign matter, such as manufacturing equipment and inspection equipment for semiconductors, flat panel displays, and printed circuit boards, the substrate is transported while being in physical contact with a transport device (typically a chuck table, etc.). In this case, if foreign matter adheres to the transport device, it will contaminate the following substrates one after another, so the equipment must be stopped periodically and cleaned. As a result, there are problems such as a decrease in the operating rate of the processing equipment and the need for a great deal of effort to clean the equipment.

[0003] To overcome these problems, a method has been proposed in which foreign matter adhering to the transport device is removed by transporting a plate-like member into the substrate processing apparatus (see Patent Document 1). This method eliminates the need to stop the substrate processing apparatus to perform cleaning, and therefore eliminates the problem of reduced operating rate of the processing apparatus. However, this method is unable to sufficiently remove foreign matter adhering to the transport device.

[0004] Meanwhile, a method has been proposed in which a substrate having an adhesive substance fixed thereto is transported into a substrate processing apparatus as a cleaning member to remove foreign matter adhering to the transport apparatus (see Patent Document 2). This method is superior to the method described in Patent Document 1 in terms of foreign matter removal ability.

[0005] However, in the method described in Patent Document 2, the adhesive substance and the transport device may adhere too strongly to each other at the contact portion, resulting in a problem that the adhesive substance and the transport device cannot be separated. As a result, problems may occur in which the substrate having the adhesive substance adhered thereto cannot be transported reliably, the transport device may be damaged, or the transport device may be contaminated. On the other hand, if the adhesive substance and the transport device are too weak, the cleaning member may be less able to remove foreign matter, resulting in a problem that a sufficient cleaning effect cannot be obtained.

[0006] As a means for solving the above-mentioned various problems, the applicant has reported a cleaning sheet having a cleaning layer that employs a polymer component as the material of the cleaning layer serving as a cleaning member and that can be suitably used as a transport member for transporting the substrate into a substrate processing apparatus (Patent Documents 3 and 4).

[0007] When a polymer component is used as the material for the cleaning layer, typically, a varnish containing the polymer component that will be the material for the cleaning layer is applied by spin coating onto the surface of any suitable substrate (e.g., the mirror surface of a silicon wafer), and then heated or dried as necessary to form a cleaning layer on the substrate.

[0008] However, when using a cleaning sheet or a transport member with cleaning function having the cleaning layer obtained as described above to clean a transport device (typically a chuck table, etc.), it is common to place the cleaning sheet or the transport member with cleaning function on the suction stage of the transport device with the cleaning layer facing the suction stage and perform vacuum suction. However, suction errors can occur during this vacuum suction. [Prior art documents] [Patent documents]

[0009] [Patent Document 1] Japanese Patent Application Publication No. 11-87458 [Patent Document 2] Japanese Patent Application Publication No. 10-154686 [Patent Document 3] JP 2007-307521 A [Patent Document 4] JP 2010-259970 A Summary of the Invention [Problem to be solved by the invention]

[0010] An object of the present invention is to provide a cleaning sheet having a cleaning layer that can be suitably used for a transport member transported into a substrate processing apparatus, and that can effectively suppress suction errors when the cleaning layer is adsorbed onto a suction stage, etc. Another object of the present invention is to provide a transport member with a cleaning function that has such a cleaning sheet and a transport member. [Means for solving the problem]

[0011] The present applicant has studied the cause of the above-mentioned suction error. As a means for vacuum-suctioning the cleaning layer side of the cleaning sheet or the transport member with cleaning function on the suction stage of the transport device, the applicant has conducted a detailed study focusing on the sealing property between the cleaning layer and a contact seal member such as a seal band provided on the suction stage. As a result, it was found that a raised portion (crown) is formed on the peripheral edge of the cleaning layer of the cleaning sheet or the transport member with cleaning function that is vacuum-suctioned on the suction stage, and when this crown has a predetermined size or more, a suction error occurs. Therefore, the applicant has repeatedly studied a method for suppressing the above-mentioned suction error by appropriately adjusting the size of this crown, and has completed the present invention.

[0012] The cleaning sheet according to an embodiment of the present invention comprises: A cleaning sheet comprising a cleaning layer, a central direction is a direction from an end portion of the surface of the cleaning layer toward the center thereof as viewed from a normal direction to the surface of the cleaning layer; An area on the surface having a width of 10 mm from the end toward the center is defined as an end area, The maximum thickness L of the cleaning layer in the normal direction in the end region and the average thickness T of the cleaning layer in the normal direction in the region other than the end region have the relationship LT≦5 μm.

[0013] In one embodiment, a portion of the cleaning layer having a thickness 1 μm or more greater than the average thickness T has a width d in the central direction of 4000 μm or less.

[0014] In one embodiment, the cleaning layer contains at least one selected from the group consisting of polyimide-based resins and polybenzoxazole-based resins.

[0015] In one embodiment, the cleaning layer has a thickness of 1 μm to 100 μm.

[0016] In one embodiment, the cleaning sheet includes an adhesive layer.

[0017] In one embodiment, the cleaning sheet includes a support.

[0018] A transport member with cleaning function according to an embodiment of the present invention includes the above-mentioned cleaning sheet and a transport member. Effect of the Invention

[0019] According to the present invention, it is possible to provide a cleaning sheet having a cleaning layer that can be suitably used for a transport member transported into a substrate processing apparatus, and that can effectively suppress suction errors when the cleaning layer is adsorbed onto a suction stage, etc. It is also possible to provide a transport member with a cleaning function that has such a cleaning sheet and a transport member. [Brief description of the drawings]

[0020] [Figure 1] 1 is a schematic cross-sectional view showing one embodiment of a cleaning sheet of the present invention. [Diagram 2] FIG. 2 is a schematic cross-sectional view showing another embodiment of the cleaning sheet of the present invention. [Diagram 3] FIG. 2 is a schematic cross-sectional view showing another embodiment of the cleaning sheet of the present invention. [Figure 4] FIG. 2 is a schematic cross-sectional view showing another embodiment of the cleaning sheet of the present invention. [Diagram 5] 3A to 3C are schematic explanatory diagrams illustrating the normal direction, the central direction, and end regions of a cleaning sheet according to an embodiment of the present invention. [Figure 6] FIG. 1 is a schematic cross-sectional view illustrating the difference (LT) between the maximum thickness L in the normal direction of the cleaning layer in the end region and the average thickness T in the normal direction of the cleaning layer in regions other than the end region in a cleaning sheet according to an embodiment of the present invention. [Figure 7] FIG. 2 is a schematic cross-sectional view illustrating the width in the central direction of a portion having a thickness 1 μm or more greater than the average thickness T in a cleaning layer in a cleaning sheet according to an embodiment of the present invention. [Figure 8] 1 is a schematic cross-sectional view showing one embodiment of a cleaning function-equipped transport member of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0021] ≪≪1. Cleaning sheet≫≫ The cleaning sheet according to the embodiment of the present invention includes a cleaning layer. The cleaning sheet according to the embodiment of the present invention may be composed of only the cleaning layer, or may include other layers.

[0022] Fig. 1 is a schematic cross-sectional view showing one embodiment of a cleaning sheet according to an embodiment of the present invention. In Fig. 1, a cleaning sheet 100 has a cleaning layer 10 and a protective film 20. The protective film 20 may be provided for the purpose of protecting the cleaning layer 10, and may be omitted depending on the purpose. In other words, the cleaning sheet of the present invention may be composed of only the cleaning layer 10.

[0023] Fig. 2 is a schematic cross-sectional view showing another embodiment of the cleaning sheet according to the present invention. In Fig. 2, the cleaning sheet 100 has a protective film 20, a cleaning layer 10, and an adhesive layer 30. The protective film 20 may be provided for the purpose of protecting the cleaning layer 10, and may be omitted depending on the purpose.

[0024] Fig. 3 is a schematic cross-sectional view showing another embodiment of the cleaning sheet according to the present invention. In Fig. 3, the cleaning sheet 100 has a protective film 20, a cleaning layer 10, and a support 40. The protective film 20 may be provided for the purpose of protecting the cleaning layer 10, and may be omitted depending on the purpose.

[0025] Fig. 4 is a schematic cross-sectional view showing another embodiment of the cleaning sheet according to the present invention. In Fig. 4, the cleaning sheet 100 has a protective film 20, a cleaning layer 10, a support 40, and an adhesive layer 30. The protective film 20 may be provided for the purpose of protecting the cleaning layer 10, etc., and may be omitted depending on the purpose.

[0026] The cleaning sheet according to the embodiment of the present invention may have any appropriate thickness depending on its configuration (particularly, whether or not it has a support or an adhesive layer, and how thick they are, etc.).

[0027] In the cleaning sheet according to the embodiment of the present invention, as shown in FIG. 5, when viewed from a normal direction A to a surface 10a of the cleaning layer 10, a direction from an edge 11 toward a center 12 of the surface 10a is defined as a central direction B.

[0028] In the cleaning sheet according to the embodiment of the present invention, an area having a width of 10 mm from the edge 11 toward the center B on the surface 10a of the cleaning layer 10 is defined as an edge area C, as shown in FIG.

[0029] The cleaning sheet according to the embodiment of the present invention can effectively suppress suction errors when the cleaning layer is suctioned to a suction stage, etc., by appropriately adjusting the size of the raised portion (crown) formed on the peripheral edge of the cleaning layer. In the present invention, as one of the indices for appropriately adjusting the size of this crown, the difference (LT) between the maximum thickness L in the normal direction A of the cleaning layer 10 in the edge region C and the average thickness T in the normal direction A of the cleaning layer 10 in the region other than the edge region C of the cleaning layer 10 is used as an index for appropriately adjusting the size of the crown, as shown in Fig. 6, which is a schematic cross-sectional view passing through the center 12 of the cleaning layer 10. It has been found that when this difference is appropriately set, suction errors when the cleaning layer is suctioned to a suction stage, etc., can be effectively suppressed.

[0030] That is, in the cleaning sheet according to the embodiment of the present invention, the maximum thickness L of the cleaning layer 10 in the normal direction A in the end region C and the average thickness T of the cleaning layer 10 in the normal direction A in the region other than the end region C of the cleaning layer 10 have a relationship of LT≦5 μm, preferably LT≦4.5 μm, more preferably LT≦4.0 μm, even more preferably LT≦3.5 μm, particularly preferably LT≦3.0 μm, and most preferably LT≦2.5 μm. If the LT is within the above range, it is possible to effectively suppress suction errors when the cleaning layer is suctioned to a suction stage or the like. If the LT is larger than the above range, for example, when the cleaning layer is vacuum-suctioned to the suction stage of the conveying device, it is presumed that a small gap will be generated between the cleaning layer and a contact seal member such as a seal band provided on the suction stage, and this gap may cause the sealing property for maintaining a vacuum state to be impaired, resulting in a suction error.

[0031] In the cleaning sheet according to the embodiment of the present invention, the width d in the center direction B of the part having a thickness 1 μm or more larger than the average thickness T of the cleaning layer 10 is preferably 4000 μm or less, as shown in FIG. 7, in order to more effectively exhibit the effects of the present invention. If the width d in the center direction of the part having a thickness 1 μm or more larger than the average thickness T of the cleaning layer is within the above range, it is possible to more effectively suppress suction errors when the cleaning layer is suctioned to a suction stage or the like. If the width d in the center direction of the part having a thickness 1 μm or more larger than the average thickness T of the cleaning layer is larger than the above range, it is presumed that, for example, when the cleaning layer is vacuum-suctioned to the suction stage of the conveying device, a small gap is generated between the cleaning layer and a contact seal member such as a seal band provided on the suction stage, and this gap may cause a loss of sealing ability for maintaining a vacuum state, which may cause a suction error.

[0032] ≪1-1. Cleaning layer≫ The cleaning layer preferably contains at least one resin selected from the group consisting of polyimide-based resins and polybenzoxazole-based resins, in that the effects of the present invention can be exhibited.

[0033] As the polyimide resin, a polyimide resin having a soft segment introduced therein is preferred in that the effects of the present invention can be more effectively exhibited. As the polybenzoxazole resin, a polybenzoxazole resin having a soft segment introduced therein is preferred in that the effects of the present invention can be more effectively exhibited. Therefore, the cleaning layer preferably contains at least one selected from the group consisting of a polyimide resin having a soft segment introduced therein and a polybenzoxazole resin having a soft segment introduced therein in that the effects of the present invention can be more effectively exhibited. As the soft segment, any appropriate soft segment may be adopted as long as it is a so-called "soft segment" that can impart flexibility to a polymer, as long as it does not impair the effects of the present invention.

[0034] The content of at least one resin selected from the group consisting of polyimide-based resins and polybenzoxazole-based resins in the cleaning layer is preferably 50% by weight to 100% by weight, more preferably 70% by weight to 100% by weight, even more preferably 90% by weight to 100% by weight, particularly preferably 95% by weight to 100% by weight, and most preferably 98% by weight to 100% by weight, in order to fully exhibit the effects of the present invention.

[0035] As the polyimide resin, any appropriate polyimide resin can be used as long as it does not impair the effects of the present invention.

[0036] The polyimide resin is preferably a polyimide resin obtained by imidizing a polyamic acid, which can more effectively exert the effects of the present invention. The polyamic acid can be typically obtained by reacting a tetracarboxylic dianhydride component and a diamine component in a substantially equimolar ratio in any suitable organic solvent.

[0037] Examples of the tetracarboxylic dianhydride component include 3,3',4,4'-biphenyl tetracarboxylic dianhydride, 2,2',3,3'-biphenyl tetracarboxylic dianhydride, 3,3',4,4'-benzophenone tetracarboxylic dianhydride, 2,2',3,3'-benzophenone tetracarboxylic dianhydride, 4,4'-oxydiphthalic dianhydride, 2,2-bis(2,3-dicarboxyphenyl)hexafluoropropane dianhydride, 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA), bis(2,3-dicarboxyphenyl)methane dianhydride, bis(3,4-dicarboxyphenyl)methane dianhydride, bis(2,3-dicarboxyphenyl)sulfone dianhydride, bis(3,4-dicarboxyphenyl)sulfone dianhydride, pyromellitic dianhydride, and ethylene glycol bistrimellitic dianhydride. These may be one type or two or more types.

[0038] Examples of the diamine component include a diamine compound having at least two terminals with an amine structure and a polyether structure (hereinafter, sometimes referred to as a PE diamine compound), an aliphatic diamine, and an aromatic diamine. Among these, the PE diamine compound is preferable as the diamine component in that it can more effectively exert the effects of the present invention.

[0039] As the PE diamine compound, any suitable compound may be used as long as it has a polyether structure and at least two terminals having an amine structure. Examples of the PE diamine compound include terminal diamines having a polypropylene glycol structure, terminal diamines having a polyethylene glycol structure, terminal diamines having a polytetramethylene glycol structure, and terminal diamines having a plurality of these structures. More specifically, examples of the PE diamine compound include PE diamine compounds having at least two terminals having an amine structure prepared from ethylene oxide, propylene oxide, polytetramethylene glycol, polyamine, or a mixture thereof. Such PE diamine compounds have a polyether structure introduced as a soft segment, and can further exert the effects of the present invention. That is, the PE diamine compound is a polyimide resin into which a soft segment has been introduced.

[0040] Examples of the aliphatic diamine include ethylenediamine, hexamethylenediamine, 1,8-, 1,10-diaminodecane, 1,12-diaminododecane, 4,9-dioxa-1,12-diaminododecane, and 1,3-bis(3-aminopropyl)-1,1,3,3-tetramethyldisiloxane (α,ω-bisaminopropyltetramethyldisiloxane). The molecular weight of the aliphatic diamine is preferably 50 to 1,000,000, and more preferably 100 to 30,000.

[0041] Examples of aromatic diamines include 4,4'-diaminodiphenyl ether, 3,4'-diaminodiphenyl ether, 3,3'-diaminodiphenyl ether, m-phenylenediamine, p-phenylenediamine, 4,4'-diaminodiphenylpropane, 3,3'-diaminodiphenylmethane, 4,4'-diaminodiphenyl sulfide, 3,3'-diaminodiphenyl sulfide, 4,4'-diaminodiphenyl sulfone, 3,3'-diaminodiphenyl sulfone, 1,4-bis(4-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)-2,2-dimethylpropane, and 4,4'-diaminobenzophenone.

[0042] Examples of organic solvents used in the reaction of tetracarboxylic dianhydride with diamine include N,N-dimethylacetamide, N-methyl-2-pyrrolidone, and N,N-dimethylformamide. In order to adjust the solubility of raw materials, etc., a non-polar solvent (e.g., toluene or xylene) may be used in combination.

[0043] The reaction temperature between the tetracarboxylic dianhydride and the diamine is preferably 40°C or higher, and more preferably 50°C to 150°C.

[0044] The imidization of the polyamic acid is typically carried out by heat treatment in an inert atmosphere (typically, a vacuum or nitrogen atmosphere). The heat treatment temperature is preferably 150°C or higher, and more preferably 180°C to 450°C.

[0045] The polybenzoxazole resin is a resin having heat resistance and insulating properties. As the polybenzoxazole resin, a modified polybenzoxazole in which a soft segment is introduced into polybenzoxazole is preferable in terms of being able to exhibit the effects of the present invention. That is, the modified polybenzoxazole is a polybenzoxazole resin in which a soft segment is introduced.

[0046] The soft segment contained in the modified polybenzoxazole may be any suitable soft segment that can impart flexibility to the polymer and is called a "soft segment" as long as the effects of the present invention are not impaired. Among such soft segments, -(OR) is preferable in terms of being able to more effectively exhibit the effects of the present invention. n -and-(O-COO-R) n The soft segment has a repeating skeleton represented by at least one selected from -(OR) n - may be of only one type or of two or more types. -(O-COO-R) which may be contained in the soft segment n - may be only one type, or may be two or more types.

[0047] -(OR) n -and-(O-COO-R) n In the repeating skeleton represented by at least one selected from the group consisting of the above, R represents an alkylene group having 2 to 18 carbon atoms, and n represents a number from 1 to 100. R is preferably an alkylene group having 2 to 12 carbon atoms, more preferably an alkylene group having 3 to 10 carbon atoms, still more preferably an alkylene group having 3 to 6 carbon atoms, and particularly preferably an alkylene group having 3 to 4 carbon atoms. n is preferably a number from 5 to 90, more preferably a number from 10 to 70, and particularly preferably a number from 10 to 50.

[0048] The modified polybenzoxazole is preferably -(OR) n -and-(O-COO-R) n The compound (S) may be produced using a compound having at least one repeating skeleton selected from the group consisting of aryl, ...

[0049] The compound (S) may be, for example, H2N-R 1 -(OR) n -R2 -NH2, H2N-R 1 -(O-COO-R) n -R 2 -NH2, HO-R 1 -(OR) n -R 2 -OH, OR 1 -(O-COO-R) n -R 2 -OH, etc., where R 1 , R 2 may each independently be a single bond or an alkylene group having 1 to 18 carbon atoms (preferably 2 to 12 carbon atoms, more preferably 3 to 10 carbon atoms, further preferably 3 to 6 carbon atoms, and particularly preferably 3 to 4 carbon atoms). As described above, -(OR) n - may be one type or two or more types, -(O-COO-R) n - may be one type or two or more types. That is, for example, H2N-R 1 -(OR) n -R 2 For example, -NH2 is -(OR) n - is -(O-CH2-CH(CH3)) x -(O-CH2-CH2) y -(O-CH2-CH(CH3)) z - (wherein x, y, and z are each independently a number from 1 to 100).

[0050] The molecular weight of the compound (S) is preferably 300 to 3500, more preferably 500 to 3000, further preferably 600 to 2500, and particularly preferably 800 to 2200, in order to further exert the effects of the present invention.

[0051] The blending ratio of compound (S) to the total amount of amine components used to produce a modified polybenzoxazole having a soft segment (sometimes referred to as the "soft segment ratio") is, in terms of a molar ratio, preferably 2 mol% to 40 mol%, more preferably 3 mol% to 35 mol%, even more preferably 5 mol% to 32 mol%, particularly preferably 8 mol% to 31 mol%, and most preferably 10 mol% to 30 mol%, in order to further exhibit the effects of the present invention.

[0052] In a method for producing a modified polybenzoxazole using compound (S), for example, 4,4'-(hexafluoroisopropylidene)bis(2-aminophenol), a soft segment, pyridine, and N-methyl-2-pyrrolidone are charged into a separable flask equipped with a stirrer, and the materials are stirred at room temperature until they are completely dissolved. Then, trimethylchlorosilane is added dropwise over a predetermined time (e.g., 1 minute), and the mixture is stirred for a predetermined time (e.g., 60 minutes) at a predetermined temperature (e.g., room temperature). Then, 4,4'-bis(chlorocarbonyl)diphenyl ether is slowly added over a predetermined time (e.g., 5 minutes), the mixture is stirred at a predetermined temperature (e.g., room temperature) for a predetermined time (e.g., 5 hours), the resulting synthesis liquid is dropped into a predetermined amount (e.g., 2 L) of ion-exchanged water, the resulting precipitate is dried at a predetermined temperature (e.g., 100°C) for a predetermined time (e.g., 24 hours), and a predetermined amount (e.g., 4 times the amount) of N-methyl-2-pyrrolidone is added to the dried precipitate to redissolve it, thereby obtaining a varnish of modified polybenzoxazole. The obtained varnish of modified polybenzoxazole is applied by spin coating onto the mirror surface of a silicon wafer, heated at a predetermined temperature (e.g., 150°C) for a predetermined time (e.g., 30 minutes), N-methyl-2-pyrrolidone is removed, and then heated under vacuum at a predetermined temperature (e.g., 300°C) for a predetermined time (e.g., 2 hours).

[0053] The cleaning layer may contain any other appropriate components within the scope of not impairing the effects of the present invention, such as heat-resistant resins other than polyimide-based resins and polybenzoxazole-based resins, surfactants, plasticizers, antioxidants, conductivity-imparting agents, ultraviolet absorbers, light stabilizers, etc.

[0054] The thickness of the cleaning layer is preferably 1 μm to 100 μm, more preferably 1 μm to 50 μm, even more preferably 1 μm to 30 μm, particularly preferably 1 μm to 20 μm, and most preferably 2 μm to 10 μm. When the thickness of the cleaning layer is within the above range, the effects of the present invention can be more effectively exhibited.

[0055] The cleaning layer preferably does not have substantial adhesive power. That is, for example, a cleaning layer formed from an adhesive substance or a cleaning layer formed by adhering an adhesive tape is excluded from the cleaning layer in the present invention. If the cleaning sheet according to the embodiment of the present invention has a cleaning layer that has substantial adhesive power, the contact portion between the cleaning layer and, for example, a transport device in a substrate processing device may adhere too strongly and may not separate. As a result, there may be a problem that the substrate cannot be transported reliably or that the transport device may be damaged.

[0056] As described above, the cleaning layer preferably has substantially no adhesive force. Specifically, the 180° peel adhesion A of the cleaning layer against the mirror surface of the silicon wafer as specified by JIS-Z-0237 is preferably less than 0.20 N / 10 mm, more preferably 0.01 to 0.10 N / 10 mm. If the 180° peel adhesion A of the cleaning layer against the mirror surface of the silicon wafer as specified by JIS-Z-0237 is within such a range, the cleaning layer has substantially no adhesive force, and the adhesiveness between the cleaning layer and, for example, the contact portion with the transport device in the substrate processing device can be reduced, and as a result, the substrate can be transported reliably and the transport device can be less likely to be damaged.

[0057] The cleaning layer has a 180-degree peel adhesion B, as specified by JIS-Z-0237, against the mirror surface of a dummy wafer of preferably 10 N / 10 mm or more, more preferably 15 N / 10 mm or more, even more preferably 20 N / 10 mm or more, particularly preferably 25 N / 10 mm or more, and most preferably 30 N / 10 mm or more. If the 180-degree peel adhesion B, as specified by JIS-Z-0237, of the cleaning layer against the mirror surface of a dummy wafer is within the above range, for example, the adhesion between the cleaning layer and a transport member such as a dummy wafer is increased, and the cleaning layer is less likely to peel off from the transport member such as a dummy wafer during cleaning.

[0058] The 180-degree peel adhesion B of a cleaning layer to a mirror surface of a dummy wafer, as specified by JIS-Z-0237, can be measured, for example, by forming a cleaning layer on the mirror surface of a silicon wafer as a dummy wafer and measuring the same in accordance with JIS-Z-0237.

[0059] ≪1-2.Support≫ The cleaning sheet of the present invention may have a support, which may be a single layer or a multi-layer body.

[0060] The thickness of the support may be any appropriate thickness as long as it does not impair the effects of the present invention. Such a thickness is preferably 500 μm or less, more preferably 1 μm to 400 μm, even more preferably 1 μm to 300 μm, particularly preferably 1 μm to 200 μm, and most preferably 1 μm to 100 μm.

[0061] The support may be any suitable support as long as it does not impair the effects of the present invention. Examples of such supports include films of plastics, engineering plastics, and super engineering plastics. Specific examples of plastics, engineering plastics, and super engineering plastics include polyimide, polyethylene, polyethylene terephthalate, acetyl cellulose, polycarbonate, polypropylene, and polyamide.

[0062] The physical properties of the support material, such as the molecular weight, can be appropriately selected depending on the purpose.

[0063] The method for forming the support can be appropriately selected depending on the purpose.

[0064] The surface of the support may be subjected to a conventional surface treatment, for example, a chemical or physical treatment such as chromate treatment, ozone exposure, flame exposure, high-voltage shock exposure, or ionizing radiation treatment, or a coating treatment with a primer, in order to improve adhesion and retention between adjacent layers.

[0065] <1-3. Adhesive layer> The cleaning sheet of the present invention may have an adhesive layer. Any suitable material may be used as the material for such an adhesive layer as long as it does not impair the effects of the present invention. For example, an acrylic adhesive, a silicone adhesive, a rubber adhesive, a urethane adhesive, etc. may be used as the material for such an adhesive layer.

[0066] The adhesive layer is provided, for example, for attaching to the mirror surface of a dummy wafer, whereby the cleaning sheet of the present invention is attached to the dummy wafer as a transport member, and can become the transport member with cleaning function of the present invention.

[0067] The adhesive layer has a 180-degree peel adhesion C, as specified by JIS-Z-0237, against the mirror surface of the dummy wafer of preferably 10 N / 10 mm or more, more preferably 15 N / 10 mm or more, even more preferably 20 N / 10 mm or more, particularly preferably 25 N / 10 mm or more, and most preferably 30 N / 10 mm or more. If the 180-degree peel adhesion C, as specified by JIS-Z-0237, of the adhesive layer against the mirror surface of the dummy wafer is within the above range, for example, the adhesive force between the adhesive layer and the dummy wafer is increased, and the cleaning sheet is less likely to peel off from the dummy wafer during cleaning.

[0068] The thickness of the pressure-sensitive adhesive layer is preferably 1 μm to 200 μm, more preferably 2 μm to 100 μm, further preferably 3 μm to 80 μm, particularly preferably 4 μm to 60 μm, and most preferably 5 μm to 50 μm.

[0069] ≪1-4. Protective film≫ The cleaning sheet of the present invention may have a protective film to protect the cleaning layer, the support, the adhesive layer, etc. The protective film can be peeled off at an appropriate stage.

[0070] The protective film may be any suitable film as long as it does not impair the effects of the present invention. Examples of materials for such films include polyolefins such as polyethylene, polypropylene, polybutene, polybutadiene, and polymethylpentene, polyvinyl chloride, vinyl chloride copolymers, polyethylene terephthalate, polybutylene terephthalate, polyurethane, ethylene-vinyl acetate copolymers, ionomer resins, ethylene-(meth)acrylic acid copolymers, ethylene-(meth)acrylic acid ester copolymers, polystyrene, polycarbonate, polyimide, and fluororesins.

[0071] The protective film may be subjected to any suitable release treatment as long as the effect of the present invention is not impaired. The release treatment is typically performed using a release agent. Examples of the release agent include silicone-based release agents, long-chain alkyl-based release agents, fluorine-based release agents, fatty acid amide-based release agents, and silica-based release agents.

[0072] The thickness of the protective film is preferably 1 μm to 100 μm.

[0073] The method for forming the protective film is appropriately selected depending on the purpose, and the film can be formed by, for example, injection molding, extrusion molding, blow molding, or the like.

[0074] 1-5. Manufacturing method of cleaning sheet As a method for producing the cleaning sheet according to the embodiment of the present invention, any suitable production method can be adopted within the scope of not impairing the effects of the present invention. Examples of such production methods include (1) a method in which a varnish solution of the cleaning layer is cast on a support or a transport member, and a uniform film is formed by a spin coater or the like, and then heated to form a cleaning layer directly on the support or the transport member, and (2) a method in which an adhesive film (a label support having a cleaning layer on one side and a normal adhesive layer on the other side) that is a constituent material of the label and the reinforcing part is attached to a separator to form a laminate consisting of a separator and an adhesive film, and then only the adhesive film of this laminate is punched out into the shapes of the label and / or the reinforcing part simultaneously or separately, and unnecessary adhesive film is peeled off and removed from the separator, etc.

[0075] In terms of being able to more effectively exert the effects of the present invention, a preferred method for producing a cleaning sheet according to an embodiment of the present invention is to apply a varnish solution of the cleaning layer onto a support or a transport member by a spin coater to form a film, and then leave it to stand as necessary, and heat and / or dry it as necessary to form a cleaning layer on the support or the transport member, thereby producing a cleaning sheet according to an embodiment of the present invention.

[0076] In order to further exert the effects of the present invention, the viscosity of the varnish solution in the cleaning layer is preferably 100 mPa·s to 2000 mPa·s, more preferably 300 mPa·s to 1500 mPa·s, and even more preferably 500 mPa·s to 1200 mPa·s.

[0077] The rotation speed when the varnish solution of the cleaning layer is applied to a support or a transport member by a spin coater to form a film is preferably 400 rpm or more, more preferably 600 rpm or more, even more preferably 800 rpm or more, even more preferably 1000 rpm or more, even more preferably 1500 rpm or more, particularly preferably 2000 rpm or more, and most preferably 3000 rpm or more, in order to more effectively exhibit the effects of the present invention. The upper limit of the rotation speed is preferably 6000 rpm or less, in order to more effectively exhibit the effects of the present invention.

[0078] The rotation time when the varnish solution of the cleaning layer is applied to a support or a transport member by a spin coater to form a film is preferably 5 to 200 seconds, more preferably 10 to 150 seconds, and even more preferably 20 to 60 seconds, in order to better exhibit the effects of the present invention.

[0079] In the method for producing a cleaning sheet according to an embodiment of the present invention, the varnish solution of the cleaning layer is applied to a support or a transport member by a spin coater to form a film, and then the varnish solution is allowed to stand to make the varnish solution smoother on the support or transport member. The time for this standing is preferably 5 to 1000 seconds, more preferably 30 to 600 seconds, and even more preferably 100 to 400 seconds, from the viewpoint of further exerting the effects of the present invention.

[0080] In the method for producing the cleaning sheet according to the embodiment of the present invention, the varnish solution of the cleaning layer may be applied to a support or a transport member by a spin coater to form a film, and then heated and / or dried. The heating or drying temperature is preferably 50° C. to 200° C., more preferably 80° C. to 150° C., in order to more effectively exhibit the effects of the present invention. The heating or drying time is preferably 100 seconds to 900 seconds, more preferably 300 seconds to 900 seconds, and even more preferably 600 seconds to 900 seconds, in order to more effectively exhibit the effects of the present invention.

[0081] ≪≪2. Conveying parts with cleaning function≫≫ The cleaning function-equipped transport member of the present invention comprises the cleaning sheet of the present invention and a transport member.

[0082] Fig. 8 is a schematic cross-sectional view showing one embodiment of a cleaning-function-equipped transport member of the present invention. In Fig. 8, a cleaning-function-equipped transport member 300 has a cleaning sheet 100 and a transport member 200. When the cleaning sheet 100 has an adhesive layer, the adhesive layer is preferably the outermost layer of the cleaning sheet 100 on the transport member 200 side.

[0083] As the conveying member, any suitable conveying member may be adopted as long as it does not impair the effects of the present invention. Examples of such conveying members include semiconductor wafers (e.g., silicon wafers), flat panel display substrates such as LCDs and PDPs, compact disks, and MR heads. Among these conveying members, when the purpose is to clean a wafer conveying device in a substrate processing apparatus, a representative example is a semiconductor wafer (e.g., silicon wafer). EXAMPLES

[0084] The present invention will be described in more detail below with reference to examples and comparative examples. However, the present invention is not limited thereto. In the following description, "parts" and "%" are by weight unless otherwise specified.

[0085] <How to measure crown size> The crown height and crown width were measured using a stylus surface roughness measuring device (Dectak8, manufactured by Veeco). The measurement speed was 200 μm / sec, the measurement range was 10 mm, and the measurement was performed by moving a diamond stylus (tip curvature 2.5 μm). The measurement starting point was 10 mm inside from the edge of the resin layer on the wafer, and the maximum height measured within a range of 10 mm toward the outer periphery was defined as the crown height, and the distance from the point +0.5 μm from the starting point to the end of the resin layer was defined as the crown width.

[0086] <Evaluation of Adsorption Error> The vacuum suction stage is circular and 300 mm in diameter, with circular protrusions of 300 μm in diameter and 300 μm in height arranged at equal intervals on its surface, and a seal band 3 mm from the outer edge, 300 μm in height and width. When a conveying member with cleaning function was placed on this vacuum suction stage and the pressure was reduced to -42,000 Pa, those showing an suction pressure of -42,000 Pa or more but less than -35,000 Pa were rated as ◯, those showing an suction pressure of -35,000 Pa or more but less than -30,000 Pa were rated as △, and those showing an suction pressure of -30,000 Pa or more were rated as ×.

[0087] [Example 1] (Production of modified polybenzoxazole varnish) In a separable flask equipped with a stirrer, 43.8 g of 4,4'-(hexafluoroisopropylidene)bis(2-aminophenol), 64.4 g of H2N-CH(CH3)-CH2-(O-CH(CH3)-CH2)2-(O-CH2CH2CH2CH2)9-(O-CH2-CH(CH3))3-NH2 (trade name "Elastamine RT-1000", manufactured by HUNTSMAN, molecular weight 1000), 47.0 g of pyridine, and 600 g of N-methyl-2-pyrrolidone were charged, and the mixture was stirred at room temperature until 4,4'-(hexafluoroisopropylidene)bis(2-aminophenol) and Elastamine RT-1000 were completely dissolved. Then, 32.6 g of trimethylchlorosilane was added dropwise over 10 minutes, and the mixture was stirred at room temperature for 60 minutes. Thereafter, 54.3 g of 4,4'-bis(chlorocarbonyl)diphenyl ether was slowly added over 10 minutes, and the mixture was stirred at room temperature for 1 hour. The obtained synthesis liquid was dropped into 10 L of ion-exchanged water, and the obtained precipitate was dried at 120°C for 4 hours. The dried precipitate was redissolved in 4 times the amount of N-methyl-2-pyrrolidone to obtain a varnish of modified polybenzoxazole (1). The viscosity of the obtained varnish of modified polybenzoxazole (1) was 540 mPa s. (Production and evaluation of a delivery member with a cleaning function having a cleaning layer) The resulting varnish of modified polybenzoxazole (1) was applied onto the mirror surface of a 12-inch silicon wafer using a spin coater (Tokyo Electron, ACT-12, rotation speed = 4000 rpm, rotation time = 30 seconds), left to stand for 300 seconds, heated at 100°C for 10 minutes, N-methyl-2-pyrrolidone was removed, and then heated at 280°C for 2 hours under vacuum to obtain a cleaning function-equipped transport member (1) having a cleaning layer (1) with a thickness of 2.8 μm. The cleaning function-equipped transport member (1) has a cleaning sheet (1) made of the cleaning layer (1) and a silicon wafer as a transport member. The results are shown in Table 1.

[0088] [Example 2] (Production of modified polybenzoxazole varnish) In a separable flask equipped with a stirrer, add 54.0 g of 4,4'-(hexafluoroisopropylidene)bis(2-aminophenol), H2N-CH(CH3)-(O-CH2-CH(CH3)) n -NH2 (trade name "JEFFAMINE D-2000", manufactured by HUNTSMAN, molecular weight 2000, n = approx. 33): 66 g, pyridine: 47.0 g, N-methyl-2-pyrrolidone: 600 g were charged, and the mixture was stirred at room temperature until 4,4'-(hexafluoroisopropylidene)bis(2-aminophenol) and Jeffamine D-2000 were completely dissolved. Then, trimethylchlorosilane: 48.0 g was added dropwise over 10 minutes, and the mixture was stirred at room temperature for 60 minutes. Then, 4,4'-bis(chlorocarbonyl)diphenyl ether: 55.2 g was slowly added over 10 minutes, and the mixture was stirred at room temperature for 1 hour. The obtained synthesis liquid was dropped into 10 L of ion-exchanged water, and the obtained precipitate was dried at 120°C for 4 hours. The dried precipitate was redissolved in 4 times the amount of N-methyl-2-pyrrolidone to obtain a varnish of modified polybenzoxazole (2). The viscosity of the obtained varnish of modified polybenzoxazole (2) was 580 mPa s. (Production and evaluation of a delivery member with a cleaning function having a cleaning layer) The resulting varnish of modified polybenzoxazole (2) was applied onto the mirror surface of a 12-inch silicon wafer using a spin coater (Tokyo Electron, ACT-12, rotation speed = 1000 rpm, rotation time = 30 seconds), and after leaving it to stand for 300 seconds, it was heated at 100°C for 10 minutes to remove N-methyl-2-pyrrolidone, and then heated at 280°C for 2 hours under vacuum to obtain a cleaning function-added transport member (2) having a cleaning layer (2) with a thickness of 2.2 μm. The cleaning function-added transport member (2) has a cleaning sheet (2) made of the cleaning layer (2) and a silicon wafer as a transport member. The results are shown in Table 1.

[0089] [Example 3] (Production of modified polybenzoxazole varnish) In a separable flask equipped with a stirrer, 43.8 g of 4,4'-(hexafluoroisopropylidene)bis(2-aminophenol), 64.4 g of H2N-CH(CH3)-CH2-(O-CH(CH3)-CH2)2-(O-CH2CH2CH2CH2)9-(O-CH2-CH(CH3))3-NH2 (trade name "Elastamine RT-1000", manufactured by HUNTSMAN, molecular weight 1000), 47.0 g of pyridine, and 600 g of N-methyl-2-pyrrolidone were charged, and the mixture was stirred at room temperature until 4,4'-(hexafluoroisopropylidene)bis(2-aminophenol) and Elastamine RT-1000 were completely dissolved. Then, 32.6 g of trimethylchlorosilane was added dropwise over 10 minutes, and the mixture was stirred at room temperature for 60 minutes. Thereafter, 54.3 g of 4,4'-bis(chlorocarbonyl)diphenyl ether was slowly added over 10 minutes, and the mixture was stirred at room temperature for 2 hours. The obtained synthesis liquid was dropped into 10 L of ion-exchanged water, and the obtained precipitate was dried at 120 °C for 4 hours. The dried precipitate was redissolved in 4 times the amount of N-methyl-2-pyrrolidone to obtain a varnish of modified polybenzoxazole (3). The viscosity of the obtained varnish of modified polybenzoxazole (3) was 980 mPa s. (Production and evaluation of a delivery member with a cleaning function having a cleaning layer) The resulting varnish of modified polybenzoxazole (3) was applied onto the mirror surface of a 12-inch silicon wafer using a spin coater (Tokyo Electron, ACT-12, rotation speed = 2000 rpm, rotation time = 30 seconds), left to stand for 300 seconds, heated at 100°C for 10 minutes, N-methyl-2-pyrrolidone was removed, and then heated at 280°C for 2 hours under vacuum to obtain a cleaning function-equipped transport member (3) having a cleaning layer (3) with a thickness of 5.4 μm. The cleaning function-equipped transport member (3) has a cleaning sheet (3) made of the cleaning layer (3) and a silicon wafer as a transport member. The results are shown in Table 1.

[0090] [Example 4] (Production of modified polybenzoxazole varnish) In a separable flask equipped with a stirrer, 43.8 g of 4,4'-(hexafluoroisopropylidene)bis(2-aminophenol), 64.4 g of H2N-CH(CH3)-CH2-(O-CH(CH3)-CH2)2-(O-CH2CH2CH2CH2)9-(O-CH2-CH(CH3))3-NH2 (trade name "Elastamine RT-1000", manufactured by HUNTSMAN, molecular weight 1000), 47.0 g of pyridine, and 600 g of N-methyl-2-pyrrolidone were charged, and the mixture was stirred at room temperature until 4,4'-(hexafluoroisopropylidene)bis(2-aminophenol) and Elastamine RT-1000 were completely dissolved. Then, 32.6 g of trimethylchlorosilane was added dropwise over 10 minutes, and the mixture was stirred at room temperature for 60 minutes. Thereafter, 54.3 g of 4,4'-bis(chlorocarbonyl)diphenyl ether was slowly added over 10 minutes, and the mixture was stirred at room temperature for 2 hours. The obtained synthesis liquid was dropped into 10 L of ion-exchanged water, and the obtained precipitate was dried at 120 °C for 4 hours. The dried precipitate was redissolved in 4 times the amount of N-methyl-2-pyrrolidone to obtain a varnish of modified polybenzoxazole (4). The viscosity of the obtained varnish of modified polybenzoxazole (4) was 780 mPa s. (Production and evaluation of a delivery member with a cleaning function having a cleaning layer) The resulting varnish of modified polybenzoxazole (4) was applied onto the mirror surface of a 12-inch silicon wafer using a spin coater (Tokyo Electron, ACT-12, rotation speed = 1000 rpm, rotation time = 30 seconds), left to stand for 300 seconds, heated at 100°C for 10 minutes, N-methyl-2-pyrrolidone was removed, and then heated at 280°C for 2 hours under vacuum to obtain a cleaning function-equipped transport member (4) having a cleaning layer (4) with a thickness of 5.0 μm. The cleaning function-equipped transport member (4) has a cleaning sheet (4) made of the cleaning layer (4) and a silicon wafer as a transport member. The results are shown in Table 1.

[0091] [Example 5] (Production of modified polybenzoxazole varnish) In a separable flask equipped with a stirrer, 43.8 g of 4,4'-(hexafluoroisopropylidene)bis(2-aminophenol), 64.4 g of H2N-CH(CH3)-CH2-(O-CH(CH3)-CH2)2-(O-CH2CH2CH2CH2)9-(O-CH2-CH(CH3))3-NH2 (trade name "Elastamine RT-1000", manufactured by HUNTSMAN, molecular weight 1000), 47.0 g of pyridine, and 600 g of N-methyl-2-pyrrolidone were charged, and the mixture was stirred at room temperature until 4,4'-(hexafluoroisopropylidene)bis(2-aminophenol) and Elastamine RT-1000 were completely dissolved. Then, 32.6 g of trimethylchlorosilane was added dropwise over 10 minutes, and the mixture was stirred at room temperature for 60 minutes. Thereafter, 54.3 g of 4,4'-bis(chlorocarbonyl)diphenyl ether was slowly added over 10 minutes, and the mixture was stirred at room temperature for 2 hours. The obtained synthesis liquid was dropped into 10 L of ion-exchanged water, and the obtained precipitate was dried at 120 °C for 4 hours. The dried precipitate was redissolved in 4 times the amount of N-methyl-2-pyrrolidone to obtain a varnish of modified polybenzoxazole (5). The viscosity of the obtained varnish of modified polybenzoxazole (5) was 840 mPa s. (Production and evaluation of a delivery member with a cleaning function having a cleaning layer) The resulting varnish of modified polybenzoxazole (5) was applied onto the mirror surface of a 12-inch silicon wafer using a spin coater (Tokyo Electron, ACT-12, rotation speed = 1000 rpm, rotation time = 30 seconds), left to stand for 300 seconds, heated at 100°C for 10 minutes, N-methyl-2-pyrrolidone was removed, and then heated at 280°C for 2 hours under vacuum to obtain a cleaning function-equipped transport member (5) having a cleaning layer (5) with a thickness of 6.2 μm. The cleaning function-equipped transport member (5) has a cleaning sheet (5) made of the cleaning layer (5) and a silicon wafer as a transport member. The results are shown in Table 1.

[0092] [Example 6] (Production of modified polybenzoxazole varnish) In a separable flask equipped with a stirrer, 43.8 g of 4,4'-(hexafluoroisopropylidene)bis(2-aminophenol), 64.4 g of H2N-CH(CH3)-CH2-(O-CH(CH3)-CH2)2-(O-CH2CH2CH2CH2)9-(O-CH2-CH(CH3))3-NH2 (trade name "Elastamine RT-1000", manufactured by HUNTSMAN, molecular weight 1000), 47.0 g of pyridine, and 600 g of N-methyl-2-pyrrolidone were charged, and the mixture was stirred at room temperature until 4,4'-(hexafluoroisopropylidene)bis(2-aminophenol) and Elastamine RT-1000 were completely dissolved. Then, 32.6 g of trimethylchlorosilane was added dropwise over 10 minutes, and the mixture was stirred at room temperature for 60 minutes. Thereafter, 54.3 g of 4,4'-bis(chlorocarbonyl)diphenyl ether was slowly added over 10 minutes, and the mixture was stirred at room temperature for 3 hours. The obtained synthesis liquid was dropped into 10 L of ion-exchanged water, and the obtained precipitate was dried at 120 °C for 4 hours. The dried precipitate was redissolved in 4 times the amount of N-methyl-2-pyrrolidone to obtain a varnish of modified polybenzoxazole (6). The viscosity of the obtained varnish of modified polybenzoxazole (6) was 1230 mPa s. (Production and evaluation of a delivery member with a cleaning function having a cleaning layer) The resulting varnish of modified polybenzoxazole (6) was applied onto the mirror surface of a 12-inch silicon wafer using a spin coater (Tokyo Electron, ACT-12, rotation speed = 1000 rpm, rotation time = 30 seconds), left to stand for 300 seconds, heated at 100°C for 10 minutes, N-methyl-2-pyrrolidone was removed, and then heated at 280°C for 2 hours under vacuum to obtain a cleaning function-equipped transport member (6) having a cleaning layer (6) with a thickness of 5.8 μm. The cleaning function-equipped transport member (6) has a cleaning sheet (6) made of the cleaning layer (6) and a silicon wafer as a transport member. The results are shown in Table 1.

[0093] [Example 7] (Production of polyimide varnish) In a separable flask equipped with a stirrer, add 51.0 g of 4,4'-diaminediphenyl ether, H2N-CH(CH3)-(O-CH2-CH(CH3)) n 89 g of -NH2 (trade name "JEFFAMINE D-4000", manufactured by HUNTSMAN, molecular weight 4000, n = approximately 68) and 1000 g of N-methyl-2-pyrrolidone were charged and stirred at room temperature until 4,4'-diaminediphenyl ether and JEFFAMINE D-4000 were completely dissolved. Then, 60 g of pyromellitic anhydride was slowly added over 10 minutes, stirred at room temperature for 1 hour, heated to 70°C, and stirred for 4 hours to obtain a varnish of polyimide (7). The viscosity of the obtained varnish of polyimide (7) was 1000 mPa s. (Production and evaluation of a delivery member with a cleaning function having a cleaning layer) The obtained polyimide (7) varnish was applied onto the mirror surface of a 12-inch silicon wafer using a spin coater (Tokyo Electron, ACT-12, rotation speed = 1000 rpm, rotation time = 30 seconds), and after leaving it to stand for 300 seconds, it was heated at 100°C for 2 minutes to remove N-methyl-2-pyrrolidone, and then heated at 280°C for 2 hours under vacuum to obtain a cleaning function-equipped transport member (7) equipped with a cleaning layer (7) having a thickness of 7.0 μm. The cleaning function-equipped transport member (7) has a cleaning sheet (7) consisting of the cleaning layer (7) and a silicon wafer as a transport member. The results are shown in Table 1.

[0094] [Comparative Example 1] (Production of modified polybenzoxazole varnish) In a separable flask equipped with a stirrer, 43.8 g of 4,4'-(hexafluoroisopropylidene)bis(2-aminophenol), 64.4 g of H2N-CH(CH3)-CH2-(O-CH(CH3)-CH2)2-(O-CH2CH2CH2CH2)9-(O-CH2-CH(CH3))3-NH2 (trade name "Elastamine RT-1000", manufactured by HUNTSMAN, molecular weight 1000), 47.0 g of pyridine, and 600 g of N-methyl-2-pyrrolidone were charged, and the mixture was stirred at room temperature until 4,4'-(hexafluoroisopropylidene)bis(2-aminophenol) and Elastamine RT-1000 were completely dissolved. Then, 32.6 g of trimethylchlorosilane was added dropwise over 10 minutes, and the mixture was stirred at room temperature for 60 minutes. Thereafter, 54.3 g of 4,4'-bis(chlorocarbonyl)diphenyl ether was slowly added over 10 minutes, and the mixture was stirred at room temperature for 6 hours. The obtained synthesis liquid was dropped into 10 L of ion-exchanged water, and the obtained precipitate was dried at 120°C for 4 hours. The dried precipitate was redissolved in 4 times the amount of N-methyl-2-pyrrolidone to obtain a varnish of modified polybenzoxazole (C1). The viscosity of the obtained varnish of modified polybenzoxazole (C1) was 1740 mPa s. (Production and evaluation of a delivery member with a cleaning function having a cleaning layer) The resulting varnish of modified polybenzoxazole (C1) was applied to the mirror surface of a 12-inch silicon wafer using a spin coater (Tokyo Electron, ACT-12, rotation speed = 1000 rpm, rotation time = 30 seconds), and after leaving it to stand for 300 seconds, it was heated at 100°C for 10 minutes to remove N-methyl-2-pyrrolidone, and then heated at 280°C for 2 hours under vacuum to obtain a cleaning function-equipped transport member (C1) equipped with a cleaning layer (C1) having a thickness of 9.0 μm. The cleaning function-equipped transport member (C1) has a cleaning sheet (C1) made of the cleaning layer (C1) and a silicon wafer as a transport member. The results are shown in Table 1.

[0095] [Comparative Example 2] (Production of modified polybenzoxazole varnish) In a separable flask equipped with a stirrer, 43.8 g of 4,4'-(hexafluoroisopropylidene)bis(2-aminophenol), 64.4 g of H2N-CH(CH3)-CH2-(O-CH(CH3)-CH2)2-(O-CH2CH2CH2CH2)9-(O-CH2-CH(CH3))3-NH2 (trade name "Elastamine RT-1000", manufactured by HUNTSMAN, molecular weight 1000), 47.0 g of pyridine, and 600 g of N-methyl-2-pyrrolidone were charged, and the mixture was stirred at room temperature until 4,4'-(hexafluoroisopropylidene)bis(2-aminophenol) and Elastamine RT-1000 were completely dissolved. Then, 32.6 g of trimethylchlorosilane was added dropwise over 10 minutes, and the mixture was stirred at room temperature for 60 minutes. Thereafter, 54.3 g of 4,4'-bis(chlorocarbonyl)diphenyl ether was slowly added over 10 minutes, and the mixture was stirred at room temperature for 2 hours. The obtained synthesis liquid was dropped into 10 L of ion-exchanged water, and the obtained precipitate was dried at 120°C for 4 hours. The dried precipitate was redissolved in 4 times the amount of N-methyl-2-pyrrolidone to obtain a varnish of modified polybenzoxazole (C2). The viscosity of the obtained varnish of modified polybenzoxazole (C2) was 880 mPa s. (Production and evaluation of a delivery member with a cleaning function having a cleaning layer) The resulting varnish of modified polybenzoxazole (C2) was applied to the mirror surface of a 12-inch silicon wafer using a spin coater (Tokyo Electron, ACT-12, rotation speed = 800 rpm, rotation time = 30 seconds), and after leaving it to stand for 300 seconds, it was heated at 100°C for 10 minutes to remove N-methyl-2-pyrrolidone, and then heated at 280°C for 2 hours under vacuum to obtain a cleaning function-added transport member (C2) equipped with a cleaning layer (C2) having a thickness of 7.2 μm. The cleaning function-added transport member (C2) has a cleaning sheet (C2) made of the cleaning layer (C2) and a silicon wafer as a transport member. The results are shown in Table 1.

[0096] [Comparative Example 3] (Production of modified polybenzoxazole varnish) In a separable flask equipped with a stirrer, 43.8 g of 4,4'-(hexafluoroisopropylidene)bis(2-aminophenol), 64.4 g of H2N-CH(CH3)-CH2-(O-CH(CH3)-CH2)2-(O-CH2CH2CH2CH2)9-(O-CH2-CH(CH3))3-NH2 (trade name "Elastamine RT-1000", manufactured by HUNTSMAN, molecular weight 1000), 47.0 g of pyridine, and 600 g of N-methyl-2-pyrrolidone were charged, and the mixture was stirred at room temperature until 4,4'-(hexafluoroisopropylidene)bis(2-aminophenol) and Elastamine RT-1000 were completely dissolved. Then, 32.6 g of trimethylchlorosilane was added dropwise over 10 minutes, and the mixture was stirred at room temperature for 60 minutes. Thereafter, 54.3 g of 4,4'-bis(chlorocarbonyl)diphenyl ether was slowly added over 10 minutes, and the mixture was stirred at room temperature for 2 hours. The obtained synthesis liquid was dropped into 10 L of ion-exchanged water, and the obtained precipitate was dried at 120°C for 4 hours. The dried precipitate was redissolved in 4 times the amount of N-methyl-2-pyrrolidone to obtain a varnish of modified polybenzoxazole (C3). The viscosity of the obtained varnish of modified polybenzoxazole (C3) was 880 mPa s. (Production and evaluation of a delivery member with a cleaning function having a cleaning layer) The resulting varnish of modified polybenzoxazole (C3) was applied to the mirror surface of a 12-inch silicon wafer using a spin coater (Tokyo Electron, ACT-12, rotation speed = 1000 rpm, rotation time = 30 seconds), and after leaving it to stand for 999 seconds, it was heated at 100°C for 10 minutes to remove N-methyl-2-pyrrolidone, and then heated at 280°C for 2 hours under vacuum to obtain a cleaning function-added transport member (C3) equipped with a cleaning layer (C3) having a thickness of 6.9 μm. The cleaning function-added transport member (C3) has a cleaning sheet (C3) made of the cleaning layer (C3) and a silicon wafer as a transport member. The results are shown in Table 1.

[0097] [Table 1] [Industrial Applicability]

[0098] The cleaning sheet and the transport member with cleaning function of the present invention are suitably used for cleaning substrate processing equipment such as various manufacturing equipment and inspection equipment. [Explanation of symbols]

[0099] 100 cleaning sheets 10 Cleaning Layer 10a Surface of cleaning layer 11 End 12 center 20 Protective Film 30 Adhesive layer 40 Support 300 Cleaning function equipped transport member 200 Transport member

Claims

1. A cleaning sheet comprising a cleaning layer, a central direction is a direction from an end portion of the surface of the cleaning layer toward the center thereof as viewed from a normal direction to the surface of the cleaning layer; An area on the surface having a width of 10 mm from the end toward the center is defined as an end area, a maximum thickness L of the cleaning layer in the end region in the normal direction and an average thickness T of the cleaning layer in the normal direction in the region other than the end region satisfy a relationship of 0 μm<L−T≦5 μm; a width d in the central direction of a portion of the cleaning layer having a thickness 1 μm or more larger than the average thickness T is 4000 μm or less; Cleaning sheet.

2. 2. The cleaning sheet according to claim 1, wherein the cleaning layer comprises at least one resin selected from the group consisting of polyimide-based resins and polybenzoxazole-based resins.

3. 3. The cleaning sheet according to claim 1, wherein the cleaning layer has a thickness of 1 μm to 100 μm.

4. The cleaning sheet according to claim 1 , further comprising an adhesive layer.

5. 5. The cleaning sheet of claim 1, comprising a support.

6. A conveying member with a cleaning function, comprising the cleaning sheet according to any one of claims 1 to 5 and a conveying member.

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