Laser Direct Structure (LDS) Antenna Assembly

Abstract

A laser direct structure (LDS) antenna assembly is provided. The LDS antenna assembly includes a carrier having a first portion formed from a first resin and a second portion formed from a second resin different from the first resin. The LDS antenna assembly further includes an LDS antenna disposed on the carrier. The LDS antenna assembly includes a component coupled to the LDS antenna via connection points disposed on a surface of the first portion of the carrier, and electrically communicating with the LDS antenna via the connection points.

Description

[Technical field]

[0001] Priority claim

[0001] This application claims the benefit of priority to U.S. Provisional Patent Application No. 62 / 950,543, entitled "Laser Direct Structure (LDS) Antenna Assembly," filed December 19, 2019, which is incorporated herein by reference.

[0002] The present disclosure relates generally to LDS antenna assemblies, and more particularly to methods of manufacturing LDS antenna assemblies. [Background technology]

[0003]

[0003] The LDS antenna can be placed on a carrier. For example, a laser device can be used to etch a channel into the outer surface of the carrier. The shape of the channel can correspond to the shape of the LDS antenna intended to be placed on the carrier. The carrier is then plated in a metal bath so that the channel becomes filled with the metal required to form the LDS antenna. The LDS antenna can be used in various applications. For example, the LDS antenna can be used in a mobile phone (e.g., a cellular phone). In particular, the LDS antenna can be formed in the housing of the mobile phone. Summary of the Invention [Means for solving the problem]

[0004]

[0004] Aspects and advantages of embodiments of the present disclosure will be set forth in part in the description that follows, or may be learned from the description, or may be learned by practice of the embodiments.

[0005] In one aspect, a laser direct structure (LDS) antenna assembly is provided. The LDS antenna assembly includes a carrier having a first portion formed from a first resin and a second portion formed from a second resin different from the first resin. The LDS antenna assembly further includes an LDS antenna disposed on the carrier. The LDS antenna assembly includes a component coupled to the LDS antenna via a connection point disposed on a surface of the first portion of the carrier such that the component is in electrical communication with the LDS antenna via the connection point.

[0006] In another aspect, a method of manufacturing an LDS antenna assembly is provided. The method includes forming an LDS antenna on a carrier for an LDS antenna assembly. The carrier includes a first portion formed using a first resin and a second portion formed using a second resin different from the first resin. The method includes bonding a component to a connection point disposed on a surface of the first portion of the carrier, such that the component is in electrical communication with the LDS antenna via the connection point.

[0007]

[0007] In yet another aspect, an LDS antenna assembly is provided. The LDS antenna assembly includes a carrier having a first portion, a second portion, and a third portion. The first portion and the third portion each include a first resin. The second portion includes a second resin different from the first resin. The LDS antenna assembly includes a first LDS antenna and a second LDS antenna. The first LDS antenna and the second LDS antenna are each disposed on the carrier. The LDS antenna assembly includes a first component coupled to the first LDS antenna via a first connection point disposed on a surface of the first portion of the carrier and in electrical communication with the first LDS antenna via the connection. The LDS antenna assembly includes a second component coupled to the second LDS antenna via a second connection point disposed on a surface of the third portion of the carrier and in electrical communication with the second LDS antenna via a second connection point disposed on a surface of the third portion of the carrier.

[0008]

[0008] These and other features, aspects, and advantages of various embodiments will become better understood with reference to the following description and appended claims. The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the present disclosure and, together with the description, serve to explain associated principles.

[0009]

[0009] Detailed descriptions of embodiments directed to persons skilled in the art are described herein and refer to the accompanying drawings in which: [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 illustrates an LDS antenna assembly according to an exemplary embodiment of the present disclosure. [Diagram 2]

[0011] FIG. 2 illustrates another view of the LDS antenna assembly of FIG. 1 in accordance with an exemplary embodiment of the present disclosure. [Diagram 3]

[0012] FIG. 2 illustrates components mounted on an LDS antenna assembly according to an exemplary embodiment of the present disclosure. [Figure 4]

[0013] FIG. 4 is an exploded view of a portion of FIG. 3 according to an exemplary embodiment of the present disclosure. [Diagram 5]

[0014] FIG. 1 is a flow diagram of a method for manufacturing an LDS antenna assembly according to an exemplary embodiment of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011]

[0015] Reference will now be made in detail to the embodiments, one or more examples of which are illustrated in the drawings. Each example is provided as an explanation of the embodiment, not as a limitation of the disclosure. Indeed, it will be apparent to those skilled in the art that various modifications and variations can be made to the embodiments without departing from the scope or spirit of the disclosure. For example, features illustrated or described as part of one embodiment can be used with another embodiment to produce yet a further embodiment. Accordingly, it is intended that aspects of the disclosure cover such modifications and variations.

[0012]

[0016] A typical LDS assembly includes a carrier on which the LDS antenna is placed. The carrier is formed using a resin or material with a thermal resistance to which components (e.g., coaxial cable, passive electrical components) can be soldered. However, the resin adversely affects the performance of the LDS antenna. Furthermore, components are often soldered directly to the LDS antenna, which also adversely affects the performance of the LDS antenna.

[0013]

[0017] An exemplary embodiment of the present disclosure relates to an LDS antenna assembly having a carrier including a first portion and a second portion. The first portion of the carrier and the second portion of the carrier are each formed using a different resin such that the thermal resistance of the first portion is greater than the thermal resistance of the second portion. As discussed in more detail below, one or more components (e.g., coaxial cables, flexible printed circuits, spring contacts, pogo pins, passive electrical components, active electrical components, etc.) can be in electrical communication with the LDS antenna through the first portion of the carrier.

[0014]

[0018] The first portion of the carrier includes one or more connection points. In particular, the one or more connection points can be disposed on an outer surface of the first portion of the carrier. In some implementations, the one or more connection points can include solder points. In such implementations, the LDS antenna and a component of the LDS antenna assembly can each be soldered to the solder points. In this manner, the component can electrically communicate with the LDS antenna without directly contacting the LDS antenna.

[0015]

[0019] The LDS antenna assembly according to the exemplary embodiment of the present disclosure can provide many technical benefits. For example, the second portion of the carrier is made larger than the first portion of the carrier to reduce or eliminate the adverse effects that the high-heat resin used to form the first portion of the carrier has on the LDS antenna disposed on the carrier. Furthermore, the first portion of the carrier includes one or more connection points. In this manner, the performance of the LDS antenna is improved because the components are not soldered directly to the LDS antenna. Instead, the components are soldered to one or more connection points of the first portion of the carrier. In this manner, the performance (e.g., gain) of the LDS antenna disposed on the carrier of the antenna assembly according to the present disclosure can be improved (e.g., about 15%) compared to the performance of the same LDS antenna when disposed on a conventional carrier.

[0016]

[0020] It should be appreciated that an LDS antenna assembly according to exemplary aspects of the present disclosure can be used in a variety of different applications. For example, an LDS antenna assembly can be used in a mobile telephone (e.g., a cellular telephone), a mobile computing device (e.g., a laptop), a video game console, a wireless printer, a wireless router, an inventory tracking system, a medical device, a vehicle tracking system, an unmanned aerial vehicle (UAV), or any other suitable device having one or more LDS antennas.

[0017]

[0021] As used herein, the use of the term "about" in conjunction with a numerical value is intended to refer to within 25% of the stated numerical value. Additionally, the term "resin" is intended to refer to a material or combination of materials.

[0018]

[0022] Referring now to the drawings, Figures 1 and 2 show an antenna assembly 100 according to an exemplary embodiment of the present disclosure. The antenna assembly 100 can include a carrier 110 having a first portion 112 and a second portion 114 that is larger than the first portion 112. More specifically, a surface area of ​​the second portion 114 of the carrier 110 can be larger than a surface area of ​​the first portion 112 of the carrier 110. For example, in some implementations, the surface area of ​​the second portion 114 of the carrier 110 can be greater than about 60% of the total surface area of ​​the carrier 110, such as about 70% of the total surface area, such as about 80% of the total surface area, or such as about 90% of the total surface area.

[0019]

[0023] It should be appreciated that the carrier 110 can include any suitable component configured to house one or more antennas. For example, in some implementations, the carrier 110 can be an enclosure (e.g., a cover, a housing, a radome) for one or more antennas. It should also be appreciated that the first portion 112 of the carrier 110 and the second portion 114 of the carrier 110 are formed using different resins. For example, the first portion 112 of the carrier 110 can be formed using a first resin, while the second portion 114 of the carrier 110 can be formed using a second resin that is different from the first resin. It should also be appreciated that the thermal resistance of the first resin used to form the first portion 112 of the carrier 110 is greater than the thermal resistance of the second resin used to form the second portion 114 of the carrier 110. In this manner, the first portion 112 of the carrier 110 can be more heat resistant than the second portion 114 of the carrier 110.

[0020]

[0024] In some implementations, the first resin can be a first polycarbonate and the second resin can be a second polycarbonate different from the first polycarbonate. Alternatively, or in addition, the first resin can include additives such as glass fibers. However, it should be appreciated that the first resin can include any suitable type of additive, so long as the thermal resistance of the first resin is greater than the thermal resistance of the second resin. Exemplary resins can include, for example, acrylonitrile butadiene styrene (ABS), polycarbonate ABS (PC-ABS), polyamide (PA), polyphthalamide (PPA), polycarbonate polyethylene terephthalate (PC / PET), polybutylene terephthalate (PBT), liquid crystal polymer (LCP), and polyphenylene ether (PPE).

[0021]

[0025] In some implementations, the carrier 110 can include a third portion 116 formed using the first resin used to form the first portion 112 of the carrier 110. As shown, the second portion 114 can be disposed between the first portion 112 and the third portion such that the first portion 112 and the third portion 116 do not contact (e.g., do not touch) one another. Additionally, the size of the third portion 116 of the carrier 110 can be smaller than the size of the second portion 114 of the carrier 110. In some implementations, the size of the third portion 116 of the carrier 110 can be the same as the size of the first portion 112 of the carrier 110. In alternative implementations, the size of the third portion 116 of the carrier 110 can be different than the size of the first portion 112 of the carrier 110. For example, in some implementations, the third portion 116 of the carrier 110 can be larger than the first portion 112 of the carrier 110. In an alternative embodiment, the third portion 116 of the carrier 110 may be smaller than the first portion 112 of the carrier 110 .

[0022]

[0026] Although the carrier 110 of the antenna assembly 100 discussed above is described as having two separate portions (e.g., first portion 112 and third portion 116) formed using a first resin, the carrier 110 may include more or fewer portions formed using the first resin. However, in embodiments in which the carrier 110 includes multiple portions formed using the first resin, it should be understood that the surface area of ​​the second portion 114 of the carrier 110 is greater than the combined surface area of ​​the portions (e.g., first portion 112, third portion 116) formed using the first resin.

[0023]

[0027] The antenna assembly 100 may include one or more laser direct structure (LDS) antennas disposed on a carrier 110. For example, as shown in Figures 1 and 2, the carrier 110 may be configured to accommodate a first LDS antenna 120 of the antenna assembly 100 and a second LDS antenna 122 of the antenna assembly 100. However, it should be appreciated that the carrier 110 may be configured to accommodate more or fewer LDS antennas.

[0024]

[0028] In some implementations, the first LDS antenna 120 may be disposed entirely on the second portion 114 of the carrier 110. In alternative implementations, the first LDS antenna 120 may be disposed on both the first portion 112 of the carrier 110 and the second portion 114 of the carrier 110. In such implementations, the majority of the first LDS antenna 120 is disposed on the second portion 114 of the carrier 110 rather than on the first portion 112 of the carrier 110. In this manner, degradation in performance of the first LDS antenna 120 due, at least in part, to the first resin used to form the first portion 112 of the carrier 110 may be reduced.

[0025]

[0029] In some implementations, the second LDS antenna 122 may be disposed entirely on the second portion 114 of the carrier 110. In alternative implementations, the second LDS antenna 122 may be disposed on both the second portion 114 of the carrier 110 and the third portion 116 of the carrier 110. In this manner, degradation in performance of the second LDS antenna 122 due, at least in part, to the first resin used to form the third portion 116 of the carrier 110 may be reduced.

[0026]

[0030] It should be appreciated that the one or more LDS antennas of the antenna assembly 100 can be configured to communicate in any suitable frequency band. For example, in some implementations, the first LDS antenna 120 can be configured to communicate with one or more devices on a Bluetooth network. Alternatively, or in addition, the second LDS antenna 122 can be configured to communicate with one or more devices on a Wifi network. In some implementations, the one or more LDS antennas of the antenna assembly 100 can be configured to communicate with one or more devices on a cellular network.

[0027]

[0031] The first portion 112 of the carrier 110 may include one or more connection points 130. More specifically, the one or more connection points 130 may be disposed on a surface 113 of the first portion 112 of the carrier 110. In some implementations, the one or more connection points 130 may be disposed on the surface 113 of the first portion 112 of the carrier 110 such that the one or more connection points 130 are adjacent to the second portion 114 of the carrier 110. The first LDS antenna 120 may be coupled to the first portion 112 of the carrier 110 via the one or more connection points 130. For example, in some implementations, the one or more connection points 130 may include solder points. In such implementations, the first LDS antenna 120 may be soldered to the one or more connection points 130 disposed on the surface 113 of the first portion 112 of the carrier 110.

[0028]

[0032] Further, the third portion 116 of the carrier 110 may include one or more connection points 140. More specifically, the one or more connection points 140 may be disposed on a surface 117 of the third portion 116 of the carrier 110. In some implementations, the one or more connection points 140 may be disposed on the surface 117 of the third portion 116 of the carrier 110 such that the one or more connection points 140 are adjacent to the second portion 114 of the carrier 110. The second LDS antenna 122 may be coupled to the third portion 116 of the carrier 110 via the one or more connection points 140. For example, in some implementations, the one or more connection points 140 may include one or more solder points. In such implementations, the second LDS antenna 122 may be soldered to the one or more connection points 140 disposed on the surface 117 of the third portion 116 of the carrier 110.

[0029]

[0033] Now, as shown with reference to FIG. 3 and FIG. 4, the antenna assembly 100 may include one or more components 150 coupled to the first LDS antenna 120 via one or more connection points 130 of the first portion 112 of the carrier 110. For example, in some implementations, the one or more components 150 may be soldered to the one or more connection points 130. It should be appreciated that if the one or more components 150 are directly connected to the first LDS antenna 120, the performance of the first LDS antenna 120 may be degraded. Thus, the one or more components 150 may improve the performance of the first LDS antenna 120 of the antenna assembly 100 according to the present disclosure because they are not directly connected to the first LDS antenna 120. Instead, the one or more components 150 are coupled to the first LDS antenna 120 via one or more connection points 130 disposed on the surface 113 of the first portion 112 of the carrier 110.

[0030]

[0034] In some implementations, the antenna assembly 100 may include one or more components 150 coupled to the second LDS antenna 122 via one or more connection points 140 of the third portion 116 of the carrier 110. For example, in some implementations, the one or more components 150 may be soldered to the one or more connection points 140. It should be understood that if the one or more components 150 are directly connected to the second LDS antenna 122, the performance of the second LDS antenna 122 may be degraded. Thus, because the one or more components 150 are not directly connected to the second LDS antenna 122, the performance of the second LDS antenna 122 of the antenna assembly 100 according to the present disclosure may be improved. Instead, the one or more components 150 are coupled to the second LDS antenna 122 via one or more connection points 140 defined by the third portion 116 of the carrier 110.

[0031]

[0035] As illustrated, the one or more components 150 may include a coaxial cable. However, it should be appreciated that the one or more components may include any suitable type of electrical component. For example, in some implementations, the one or more components 150 may include passive electrical components. Examples of passive electrical components may include, but are not limited to, resistors, capacitors, and inductors. In alternative implementations, the one or more components 150 may include active electrical components. Examples of active electrical components may include, but are not limited to, transistors (e.g., MOSFETs, BJTs, etc.).

[0032]

[0036] Now referring to FIG. 5, a flow diagram of a method 200 of manufacturing an LDS antenna assembly is provided in accordance with an exemplary embodiment of the present disclosure. FIG. 5 illustrates steps that are performed in a particular order for purposes of illustration and discussion. Those skilled in the art will, using the disclosure provided herein, understand that various steps of any of the methods described herein may be altered, omitted, rearranged, include steps not illustrated, performed simultaneously, and / or modified in various manners without departing from the scope of the present disclosure.

[0033]

[0037] At (202), the method 200 can include forming an LDS antenna on a carrier including a first portion formed from a first resin and a second portion formed from a second resin different from the first resin. In some embodiments, forming the LDS antenna can include, at (204), etching a channel in a surface of the carrier with a laser device. For example, in some embodiments, the surface can include an exterior surface of the carrier. It is understood that the shape of the channel etched using the laser device can correspond to the shape of the LDS antenna formed in the surface of the carrier. Following etching of the channel in the surface of the carrier, forming the LDS antenna can further include, at (206), plating the carrier in a metal bath to fill the channel with metal and form the LDS antenna.

[0034]

[0038] At (208), the method 200 may include coupling the component to a connection point on the first portion of the carrier such that the component is in electrical communication with the LDS antenna via the connection point. In some implementations, coupling the component to the connection point may include soldering the component to the connection point. It should be appreciated that the component may include any suitable type of electrical component. For example, in some implementations, the electrical component may include a passive electrical component (e.g., a capacitor, a resistor, an inductor). In alternative implementations, the electrical component may include an active electrical component (e.g., a transistor).

[0035]

[0039] While the present subject matter has been described in detail with respect to certain exemplary embodiments thereof, it will be recognized that those skilled in the art, upon gaining an understanding of the foregoing, may readily produce alterations, variations, and equivalents to such embodiments. Accordingly, the scope of the present disclosure is by way of example rather than limitation, and the disclosure of the subject matter is not intended to exclude inclusion of such modifications, variations, and / or additions to the present subject matter as would be readily apparent to those skilled in the art.

Claims

1. 1. A laser direct structure (LDS) antenna assembly comprising: a carrier having a first portion and a second portion, the first portion being formed from a first resin and the second portion being formed from a second resin different from the first resin; an LDS antenna disposed on the carrier, the entirety of the LDS antenna being disposed on the second portion of the carrier; and a component coupled to the LDS antenna via a connection point disposed on a surface of the first portion of the carrier and in electrical communication with the LDS antenna via the connection point.

2. 2. The LDS antenna assembly of claim 1, wherein a surface area of ​​the second portion of the carrier is greater than a surface area of ​​the first portion of the carrier.

3. 3. The LDS antenna assembly of claim 2, wherein the LDS antenna is disposed entirely on the second portion of the carrier and not on the first portion of the carrier.

4. the first resin comprises a first polycarbonate; The LDS antenna assembly of claim 3 , wherein the second resin comprises a second polycarbonate different from the first polycarbonate.

5. The LDS antenna assembly of claim 4 , wherein the first resin further comprises fiberglass.

6. 2. The LDS antenna assembly of claim 1, wherein the connection point is disposed on the first portion of the carrier such that the connection point is adjacent to the second portion of the carrier.

7. The LDS antenna assembly of claim 1 , wherein the second portion of the carrier defines a channel configured to accommodate the LDS antenna.

8. The LDS antenna assembly of claim 1 , wherein the component comprises a coaxial cable.

9. The LDS antenna assembly of claim 1 , wherein the components comprise passive electrical components.

10. The LDS antenna assembly of claim 1 , wherein the components comprise active electrical components.

11. The LDS antenna assembly of claim 10 , wherein the active electrical component comprises a transistor.

12. 1. A method of manufacturing a laser direct structure (LDS) antenna assembly, comprising: forming an LDS antenna on a carrier of the LDS antenna assembly, the carrier having a first portion formed using a first resin and a second portion formed using a second resin different from the first resin, the entire LDS antenna being disposed on the second portion of the carrier; and coupling a component to a connection point disposed on a surface of the first portion of the carrier, such that the component is in electrical communication with the LDS antenna via the connection point.

13. 13. The method of claim 12, wherein coupling a component to a connection point formed on the first portion of the carrier comprises soldering the component to the connection point, such that the component is in electrical communication with the LDS antenna via the connection point.

14. The step of forming the LDS antenna includes: Etching a channel into a surface of the carrier by a laser device; 13. The method of claim 12, further comprising the step of: following the etching of the channel, plating the carrier in a metal bath such that the channel is filled with metal to form a laser direct structure (LDS) antenna.

15. The method of claim 12 , wherein the components comprise active or passive electrical components.

16. 1. A laser direct structure (LDS) antenna assembly comprising: a carrier comprising a first portion, a second portion, and a third portion, the first portion and the third portion each comprising a first resin, and the second portion comprising a second resin different from the first resin; a first LDS antenna disposed on the first portion of the carrier, the first LDS antenna being entirely disposed on the second portion of the carrier; a second LDS antenna disposed on the third portion of the carrier; and a first component coupled to the first LDS antenna via a first connection point disposed on a surface of the first portion of the carrier so as to be in electrical communication with the first LDS antenna via the first connection point; a second component coupled to the second LDS antenna via a second connection point disposed on a surface of the third portion of the carrier so as to be in electrical communication with the second LDS antenna via the second connection point disposed on the surface of the third portion of the carrier.

17. 17. The LDS antenna assembly of claim 16, wherein the first portion of the carrier and the third portion of the carrier are separated from each other via the second portion of the carrier.

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