Automatic teaching device for robot system and method therefor

Abstract

An automated teaching system for a substrate processing apparatus is provided, the automated teaching system comprising: a frame having a workpiece load station at a predetermined load station reference position; a robotic transport device mounted to the frame and having a movable transport arm with an end effector having a predetermined end effector reference position and a drive section for driving the movable transport arm with at least one degree of freedom of movement relative to the frame; a machine vision system removably connected to the frame and including both at least one fixed imaging sensor and at least one movable imaging sensor configured to image at least one target of the machine vision system; and a load jig arranged to removably engage with the workpiece load station, wherein both the at least one fixed imaging sensor and the at least one movable imaging sensor are mounted to the load jig.

Description

[Technical field]

[0001] [CROSS-REFERENCE TO RELATED APPLICATIONS] This application is a nonprovisional application and claims the benefit of U.S. Provisional Patent Application No. 63 / 046,289, filed June 30, 2020, the entire disclosure of which is incorporated herein by reference.

[0002] [Technical field] FIELD OF THE DISCLOSURE Exemplary embodiments relate generally to semiconductor processing equipment, and more particularly, to automated teaching of semiconductor processing equipment. [Background technology]

[0003] Substrate processing equipment can typically perform multiple operations on a substrate. Substrate processing equipment generally includes a transfer chamber and one or more process modules coupled to the transfer chamber. A substrate transport robot in the transfer chamber moves the substrate between the process modules where various operations such as sputtering, etching, coating, soaking, etc. are performed. For example, manufacturing processes used by semiconductor device manufacturers and material manufacturers often require precise positioning of the substrate in the substrate processing equipment.

[0004] The precise position of the substrate is generally provided via teaching a substrate holding position to the substrate transfer robot. Generally, teaching of the substrate holding position in the transfer robot coordinate system in the substrate processing apparatus is performed manually or automatically. Conventionally, in some aspects, teaching of the substrate holding position is performed by manual control of the robot end effector while observing the position of the end effector directly or remotely (such as via a live camera feed) relative to the substrate holding station. In other aspects, the movement of the end effector may be automated. Conventional methods for teaching a substrate holding position include physically contacting the end effector with a substrate holding station feature and detecting the contact by measuring the torque of the transfer robot motor to detect the substrate holding station feature with a transmitted beam sensor carried by the end effector.

[0005] Generally, teaching a substrate transfer robot includes detecting the position of the robot and / or the substrate carried by the robot with a dedicated teach sensor added to the substrate processing equipment using a mounted substrate (e.g., including an on-board sensor or camera) carried by the substrate transfer robot, using a removable fixture located in a process module or other substrate holding station of the substrate processing equipment, using a wafer centering sensor located in or externally accessible at the process module, using a sensor (e.g., a camera) located outside the process module, or by contacting a target in the process module with the substrate transfer robot or an object carried by the substrate transfer robot. These approaches to teaching positions within the substrate processing equipment may require sensors to be placed in a vacuum, may require modifications to the customer processing equipment and / or tooling, may not be suitable for use in a vacuum environment or at high temperatures, may require mirrors or fixtures to be placed within the processing equipment, and / or may disturb the vacuum environment of the substrate processing equipment. Summary of the Invention

[0006] The foregoing aspects and other features of the present disclosure are explained in the following description taken in conjunction with the accompanying drawings. [Brief description of the drawings]

[0007] [Figure 1A] 1 is a schematic diagram of a substrate processing apparatus incorporating aspects of the present disclosure; [Figure 1B] 1 is a schematic diagram of a substrate processing apparatus incorporating aspects of the present disclosure; [Figure 1C] 1 is a schematic diagram of a substrate processing apparatus incorporating aspects of the present disclosure; [Figure 1D] 1 is a schematic diagram of a substrate processing apparatus incorporating aspects of the present disclosure; [Figure 2A] 1 is a schematic diagram of a substrate processing apparatus incorporating aspects of the present disclosure; [Figure 2B] 1 is a schematic diagram of a substrate processing apparatus incorporating aspects of the present disclosure; [Figure 2C] 1 is a schematic diagram of a substrate processing apparatus incorporating aspects of the present disclosure; [Figure 2D] 1 is a schematic diagram of a substrate processing apparatus incorporating aspects of the present disclosure; [Figure 2E] FIG. 2 is a schematic diagram of an exemplary transfer arm of a substrate transfer robot of the substrate processing apparatus of FIGS. 1A-2D according to an embodiment of the present disclosure. [Figure 2F] FIG. 2 is a schematic diagram of an exemplary transfer arm of a substrate transfer robot of the substrate processing apparatus of FIGS. 1A-2D according to an embodiment of the present disclosure. [Figure 2G] FIG. 2 is a schematic diagram of an exemplary transfer arm of a substrate transfer robot of the substrate processing apparatus of FIGS. 1A-2D according to an embodiment of the present disclosure. [Figure 2H] FIG. 2 is a schematic diagram of an exemplary transfer arm of a substrate transfer robot of the substrate processing apparatus of FIGS. 1A-2D according to an embodiment of the present disclosure. [Diagram 3] FIG. 2 is a schematic diagram of a portion of the substrate processing apparatus of FIGS. 1A-2D incorporating aspects of the present disclosure. [Figure 4A] FIG. 4 is a schematic diagram of a portion of the substrate processing apparatus illustrated in FIG. 3 incorporating aspects of the present disclosure. [Figure 4B] FIG. 4 is a schematic diagram of a portion of the substrate processing apparatus illustrated in FIG. 3 incorporating aspects of the present disclosure. [Figure 5A] 1 is a schematic diagram of an auto-teach apparatus according to an aspect of the present disclosure and for use with the substrate processing apparatus described herein. [Figure 5B] 1 is a schematic diagram of an auto-teach apparatus according to an aspect of the present disclosure and for use with the substrate processing apparatus described herein. [Figure 6A] FIG. 5C is a schematic diagram of a portion of the automated teaching device of FIG. 5B according to an embodiment of the present disclosure. [Figure 6B] FIG. 5C is a schematic diagram of a portion of the automated teaching device of FIG. 5B according to an embodiment of the present disclosure. [Figure 6C] FIG. 5C is a schematic diagram of a portion of the automated teaching device of FIG. 5B according to an embodiment of the present disclosure. [Figure 6D]FIG. 5C is a schematic diagram of a portion of the automated teaching device of FIG. 5B according to an embodiment of the present disclosure. [Figure 6E] FIG. 5C is a schematic diagram of a portion of the automated teaching device of FIG. 5B according to an embodiment of the present disclosure. [Figure 6F] FIG. 5C is a schematic diagram of a portion of the automated teaching device of FIGS. 5A and 5B according to an embodiment of the present disclosure. [Figure 7] 5C is a schematic diagram of an example target of the automated teaching device of FIGS. 5A and 5B according to an embodiment of the present disclosure. FIG. [Figure 7A] 5C is a schematic diagram of an example target of the automated teaching device of FIGS. 5A and 5B according to an embodiment of the present disclosure. FIG. [Figure 7B] 5C is a schematic diagram of an example target of the automated teaching device of FIGS. 5A and 5B according to an embodiment of the present disclosure. FIG. [Figure 8A] FIG. 5C is a schematic diagram of a portion of the automated teaching device of FIGS. 5A and 5B according to an embodiment of the present disclosure. [Figure 8B] FIG. 5C is a schematic diagram of a portion of the automated teaching device of FIGS. 5A and 5B according to an embodiment of the present disclosure. [Figure 8C] FIG. 5C is a schematic diagram of a portion of the automated teaching device of FIGS. 5A and 5B according to an embodiment of the present disclosure. [Figure 8D] FIG. 5C is a schematic diagram of a portion of the automated teaching device of FIGS. 5A and 5B according to an embodiment of the present disclosure. [Figure 8E] FIG. 5C is a schematic diagram of a portion of the automated teaching device of FIGS. 5A and 5B according to an embodiment of the present disclosure. [Figure 8F] FIG. 5C is a schematic diagram of a portion of the automated teaching device of FIGS. 5A and 5B according to an embodiment of the present disclosure. [Figure 9A] FIG. 1 is a flow diagram of a method according to an aspect of the present disclosure. [Figure 9B] FIG. 1 is a flow diagram of a method according to an aspect of the present disclosure. [Figure 10] FIG. 2 is a schematic diagram of a sensor field of view relative to a target according to an aspect of the present disclosure. [Figure 11] 1 is a schematic diagram of a portion of a station fixture of a substrate processing apparatus as described herein incorporating aspects of the present disclosure. [Figure 12A]1 is a schematic diagram of a portion of a station fixture of a substrate processing apparatus as described herein incorporating aspects of the present disclosure. [Figure 12B] 1 is a schematic diagram of a portion of a station fixture of a substrate processing apparatus as described herein incorporating aspects of the present disclosure. [Figure 13] FIG. 5C is a schematic diagram of a portion of the automated teaching device of FIGS. 5A and 5B according to an embodiment of the present disclosure. [Figure 14] FIG. 5C is a schematic diagram of a portion of the automated teaching device of FIGS. 5A and 5B according to an embodiment of the present disclosure. [Figure 15] FIG. 5C is a schematic diagram of a portion of the automated teaching device of FIGS. 5A and 5B according to an embodiment of the present disclosure. [Figure 16] FIG. 5C is a schematic diagram of a portion of the automated teaching device of FIGS. 5A and 5B according to an embodiment of the present disclosure. [Figure 17A] FIG. 5C is a schematic diagram of a portion of the automated teaching device of FIGS. 5A and 5B according to an embodiment of the present disclosure. [Figure 17B] FIG. 5C is a schematic diagram of a portion of the automated teaching device of FIGS. 5A and 5B according to an embodiment of the present disclosure. [Figure 18A] FIG. 5C is a schematic diagram of a portion of the automated teaching device of FIGS. 5A and 5B according to an embodiment of the present disclosure. [Figure 18B] FIG. 5C is a schematic diagram of a portion of the automated teaching device of FIGS. 5A and 5B according to an embodiment of the present disclosure. [Figure 19A] 1 is a schematic diagram of a portion of a substrate processing apparatus as described herein incorporating aspects of the present disclosure. [Figure 19B] 1 is a schematic diagram of a portion of a substrate processing apparatus as described herein incorporating aspects of the present disclosure. [Figure 19C] 1 is a schematic diagram of a portion of a substrate processing apparatus as described herein incorporating aspects of the present disclosure. [Figure 19D] 1 is a schematic diagram of a portion of a substrate processing apparatus as described herein incorporating aspects of the present disclosure. [Figure 19E] 1 is a schematic diagram of a portion of a substrate processing apparatus as described herein incorporating aspects of the present disclosure. [Figure 20] FIG. 1 is a flow diagram of a method according to an aspect of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] 1A-2D illustrate an exemplary substrate processing apparatus according to an embodiment of the present disclosure. Although the embodiment of the present disclosure will be described with reference to the drawings, it should be understood that it can be embodied in many forms. Furthermore, any suitable size, shape, or type of element or material can be used.

[0009] Aspects of the present disclosure provide an automated teach apparatus 500 (see FIGS. 5A and 5B) for use with substrate processing equipment. Aspects of the present disclosure use software and hardware to automate the teaching of a robot to a substrate processing equipment. Aspects of the present disclosure reduce setup / downtime of the substrate processing equipment while minimizing human / operator error and variability due to manual teaching. As described herein, aspects of the present disclosure utilize software with vision system feedback to teach a fixture / jig to automate the teaching process and to validate the results of the teaching process. Aspects of the present disclosure are also utilized to set and validate the leveling of a robot end effector relative to a substrate holding station (also referred to herein as a station fixture). Although aspects of the present disclosure are described herein with respect to semiconductor substrate processing equipment, aspects of the present disclosure may be utilized with any suitable robotic system.

[0010] The substrate processing equipment includes robotic handling equipment for transferring substrates to / from various substrate holding stations (e.g., substrate cassettes, aligners, processing modules, etc.). The automatic teaching apparatus 500 of the present disclosure is utilized in a hybrid teaching system configured to automatically teach the position of a load port module (also referred to herein as a workpiece load station) and one or more positions of a substrate holding station (separate and located away from the load port module) to the robotic handling equipment. As described in more detail herein, with reference to FIGS. 5A, 5B, and 6A, the automatic teaching apparatus 500 includes a dummy (e.g., mock) carrier jig 510A, 510B (also referred to herein as a load jig) and a removable module jig 600, each having a respective sensor forming a machine vision system 530A, 530B. The machine vision system 530A, 530B includes any suitable sensor (as described herein), where each sensor is paired with a respective target. The targets are sensed by respective machine vision systems 530A, 530B such that a controller coupled to the machine vision teach systems heuristically / progressively (e.g., self-teach) learns (as described herein) the position (e.g., taught location / position) of the substrate holding station or load port module, e.g., in six degrees of freedom, where subsequent taught position determinations are informed by information obtained via determination of previously taught taught positions.

[0011] In one embodiment, the simulated carrier jig 510A transports or otherwise carries (e.g., transfers) positioning features (or targets 520-523) that are detected by a portion of a vision system 530A disposed on a substrate transport apparatus 501 (which, for purposes of illustration, is generally similar to a transport robot or any of the other substrate transport apparatuses described herein), where each of the targets 520-523 has a predetermined position relative to a load station reference position 11005L (such as a load port module 11005) and is positioned to be within the field of view of a movable imaging sensor(s) 581-583 (mounted on the substrate transport apparatus 501) of the vision system 530A that comprises a removable module jig 600 engaged to the simulated carrier jig 510A. The positioning features or targets 520-523 are rotatable in six degrees of freedom (X, Y, Z, θ X , θ Y , θ Z 479). In another embodiment, the simulated carrier jig 510B carries or otherwise conveys (e.g., transfers) a portion of a vision system 530B that detects positioning features or targets 540-542 (also referred to herein as arm targets) located on the substrate transport apparatus 501, where each of the targets 540-542 has a predetermined position relative to the end effector reference position 479 and is positioned to be within the field of view of a fixed imaging sensor(s) 581-583 with a removable module jig 600 engaged to the simulated carrier jig 510B. The positioning features or targets 540-542 can be moved in six degrees of freedom (X, Y, Z, θ X , θ Y , θ Z11005) relative to each other on the substrate transport apparatus 501 such that the position of the substrate-holding end effector 502 of the substrate transport apparatus 501 relative to the load port module 11005 is determined (via the vision system 530B) by the automatic teaching apparatus 500 being configured to teach the position of the cassette holding position (such as at the load port module or other suitable position on the substrate processing apparatus).

[0012] 6A and 8A-8C, according to an embodiment of the present disclosure, the removable module jig 600 is carried (e.g., transferred) by and with the mock carrier jigs 510A, 510B. The removable module jig 600 includes imaging sensor(s) 750-752 that form part of the respective machine vision systems 530A, 530B. As described herein, the sensors 750-752 are carried by and move with the removable module jig 600 as a single unit. The removable module jig 600 is rotatable in six degrees of freedom (X, Y, Z, θ) in the coordinate system of the substrate transport apparatus. X , θ Y , θ Z ), the substrate transport apparatus 501 is transported by its end effector 502 to the desired substrate holding station or stations to automatically teach the substrate transport apparatus 501 the substrate station positions, where the substrate holding stations include positioning features (similar to those described above) positioned relative to one another on the substrate holding stations to determine the positions of the substrate holding stations (via sensors 750-752 of the machine vision systems 530A, 530B) in six degrees of freedom.

[0013] As described herein, the vision system(s) 530A, 530B includes any suitable optical sensor, including but not limited to a camera, a through-beam sensor, or a combination thereof, facing at least in each of the X, Y, and Z directions (in the R, θ, Z directions of a Cartesian or polar coordinate system). As described in more detail herein, each of the vision systems 530A, 530B includes a Y or R axis sensor, a Z axis sensor, and a lateral X or θ axis sensor, where sensor data from one sensing operation informs the positioning of subsequent sensing operations in an auto-teach procedure, resulting in heuristic learning of the positions of the load port module and the substrate holding station (e.g., via aggregation and corroboration of sensor data from one axis to another). For example, the forward-looking sensors are paired with respective targets and configured to provide initial alignment of the end effector along the X (or θ) and Z axes relative to the load port module (e.g., cassette holding position) or substrate holding station. The initial alignment along the X (or θ) and Z axes may improve positional accuracy in subsequent sensing operations along the Y (or R) and Z axes. The vertical sensors are paired with respective targets and configured to provide and confirm an initial taught X (or θ) axis position of the load port module and / or substrate holding position as well as an initial alignment of the end effector along the Y (or R) axis relative to the load port module and / or substrate holding position. The initial alignment along the Y (or R) axis may further improve positional accuracy in subsequent sensing operations along the Z axis. The horizontal sensors are paired with respective targets and configured to provide and confirm an initial taught Y (or R) axis position of the load port module and / or substrate holding position as well as an initial taught alignment of the end effector along the Z axis.

[0014] 1A-2D, it is noted that although aspects of the present disclosure are described herein with respect to semiconductor substrate processing equipment, the auto-teach apparatus of the present disclosure may be applied to any suitable environment in which a robotic manipulator is utilized to pick and place objects between predetermined locations. As described herein, the auto-teach apparatus 500 of the present disclosure (see FIGS. 5A and 5B) is utilized in an atmospheric environment, such as in an equipment front-end module (EFEM) (e.g., an enclosure having at least one load port module as a basic configuration) and a wafer sorter, while in other aspects the auto-teach apparatus 500 is utilized in a vacuum environment, such as in a transfer chamber of a cluster tool or a linear transfer chamber of a linear tool, or combinations thereof. In still other aspects, the auto-teach apparatus 500 is utilized in any suitable substrate processing equipment and is compatible with any suitable end effector (e.g., active edge grips, vacuum grips, passive / friction grip supports, etc.) of any suitable substrate transport apparatus (such as those described herein).

[0015] 1A and 1B, a processing device, such as, for example, a semiconductor tool station 11090, is shown in accordance with aspects of the disclosure. Although a semiconductor tool station 11090 is shown in the drawings, aspects of the disclosure described herein may be applied to any tool station or application utilizing a robotic manipulator. In this example, the semiconductor tool station 11090 is shown as a cluster tool, but aspects of the disclosed embodiments may be applied to any suitable tool station, such as, for example, a linear tool station, such as that shown in FIGS. 1C and 1D and described in U.S. Pat. No. 8,398,355, entitled "Linearly Distributed Semiconductor Workpiece Processing Tool," issued March 19, 2013, the entire disclosure of which is incorporated herein by reference. The semiconductor tool station 11090 generally includes an atmospheric front end 11000, a vacuum load lock 11010, and a vacuum back end 11020. In other aspects, the tool station may have any suitable configuration. Each of the components of the front end 11000, the vacuum load lock 11010 and the vacuum back end 11020 may be connected to a controller 11091, which may be part of any suitable control architecture, such as, for example, a clustered architecture control.

[0016] The controller 11091 may be a closed loop controller having a master controller, a cluster controller, and an autonomous remote controller, such as those disclosed in U.S. Patent No. 7,904,182, issued March 8, 2011, entitled "Scalable Motion Control System," the entire disclosure of which is incorporated herein by reference. In other embodiments, any suitable controller and / or control system may be utilized. As described herein, the controller 11091 is communicatively connected to a drive section (e.g., drive section 389, etc. (see FIG. 3)) of a transport robot (such as those described herein) to move a transport arm (such as the transport arm 11013TA (see FIG. 3) or any of the other transport arms described herein). The controller 11091 is also communicatively connected to at least one of the fixed imaging sensors 581-583 (see FIG. 5B) or movable imaging sensors 571-574 (see FIG. 5A) of the machine vision system 530A, 530B described herein.The controller 11091 moves the transport arm 11013TA to a teaching position relative to the simulated carrier jig 510A, 510B, and uses at least one fixed imaging sensor 581-583 (FIG. 5B) (or at least one movable imaging sensor 571-574 (FIG. 5A)) to capture an image of the at least one arm target (or at least one image of the at least one fixed target 520-523) between the end effector reference position 479 (as described herein) and the load station reference position 11005L and between the end effector reference position 479 (as described herein) and the load station reference position 11005L. and a positioning feature 710F (see Figures 8A and 8C) of the base or frame 710 of the at least one movable imaging sensor 750-752, which positions the at least one movable imaging sensor 750-752 at a predetermined position relative to the end effector reference position 479, is configured to image at least one arm target 540-542 (Figure 5B) as described herein (or at least one fixed target 520-523, as described herein with respect to Figure 5A) while the transport arm 11013TA is in a taught position (as described herein) so as to account for an offset between the at least one movable imaging sensor 750-752 and a positioning feature 710F (see Figures 8A and 8C) of the base or frame 710 of the at least one movable imaging sensor 750-752, which positions the at least one movable imaging sensor 750-752 at a predetermined position relative to the end effector reference position 479.

[0017] In one embodiment, the front end 11000 generally includes a load port module (also referred to herein as a workpiece load station) 11005 and a minienvironment 11060, such as, for example, an equipment front end module (EFEM) (including wafer sorting functionality in some embodiments). In other embodiments, the processing station includes a wafer buffer, wafer inverter, and wafer shuffle station (which may be located in the vacuum back end 11020, the front end 11000, and / or connecting the front end 11000 with a vacuum to the vacuum back end 11020 (e.g., in a load lock, etc.). The front end 11000 and the vacuum back end 11020 each include a frame that, when coupled together, forms a frame 11090F of the semiconductor tool station 11090. The load port module 11005 may be an unpacker / loader-tool standard (BOLTS) interface conforming to SEMI standards E15.1, E47.1, E62, E19.5 or E1.9 for 300 mm load ports, front or bottom opening boxes / pods and cassettes. In other embodiments, the load port module may be configured as a 200 mm wafer or 450 mm wafer interface or any other suitable wafer interface, such as, for example, larger or smaller wafers or flat panels for flat panel displays. Although two load port modules 11005 are shown in FIG. 1A, in other embodiments, any suitable number of load port modules may be incorporated into the front end 11000. The load port module 11005 may be configured to receive wafer / substrate carriers or cassettes 11050 from an overhead transport system, an automated guided vehicle, a manned guided vehicle, a tracked automated guided vehicle, or any other suitable transport method. The load port module 11005 may interface with the minienvironment 11060 via the load port 11040 .The substrate cassettes 11050 are received on the respective load port modules 11005 at a predetermined load station home position 11005L that kinematically positions the substrate cassette 11050 on the load port module 11005. In one aspect, the load port 11040 allows for the passage of wafers between the substrate cassette 11050 and the minienvironment 11060.

[0018] In one embodiment, the minienvironment 11060 generally includes any suitable transfer robot 11013 incorporating one or more aspects of the automated teaching apparatus 500 described herein. In one embodiment, the transfer robot 11013 may be a truck-mounted robot such as those described in U.S. Pat. Nos. 6,002,840 and 7,066,707, the disclosures of which are incorporated herein by reference in their entirety, or in other embodiments, any other suitable transfer robot having any suitable configuration. The minienvironment 11060 may provide a controlled, clean area for wafer transfer between multiple load port modules.

[0019] The vacuum load lock 11010 may be disposed between and connected to the mini-environment 11060 and the vacuum back end 11020. As used herein, the term vacuum refers to the area in which the wafers are processed. -5 It is noted that vacuum load lock 11010 generally refers to high vacuum such as below 1000 Torr. The vacuum load lock 11010 generally includes atmospheric pressure and vacuum slot valves. The slot valves may provide environmental isolation utilized to evacuate the load lock after loading wafers from the atmospheric front end and to maintain a vacuum in the transfer chamber when venting the load lock with an inert gas such as nitrogen. In one embodiment, the vacuum load lock 11010 includes an aligner 11011 for aligning a reference wafer to a desired position for processing, while in other embodiments, wafer alignment is effected with a transfer robot as described herein. In other embodiments, the vacuum load lock may be located in any suitable location of the processing equipment and have any suitable configuration and / or metrology.

[0020] The vacuum backend 11020 generally includes a transfer chamber 11025, one or more processing stations or modules 11030, and any suitable transfer robot 11014. The transfer robot 11014, described below, may be disposed within the transfer chamber 11025 to transfer wafers between the vacuum load lock 11010 and the various processing modules 11030. The processing modules 11030 may operate on the wafers through various deposition, etching, or other types of processes to form electrical circuits or other desired structures on the wafers. Exemplary processes include, but are not limited to, thin film processes using vacuum such as plasma etching or other etching processes, chemical vapor deposition (CVD), plasma vapor deposition (PVD), implantation such as ion implantation, metrology, rapid thermal processing (RTP), dry strip atomic layer deposition (ALD), oxidation / diffusion, nitride formation, vacuum lithography, epitaxy (EPI), wire bonder and evaporation, or other thin film processes using vacuum pressure. The processing module 11030 is connected to the transfer chamber 11025 to allow wafers to pass from the transfer chamber 11025 to the processing module 11030 or vice versa. In one embodiment, the load port module 11005 and the load port 11040 are substantially directly coupled to the vacuum back end 11020 such that a substrate cassette 11050 attached to the load port substantially directly interfaces with the vacuum environment of the transfer chamber 11025 and / or the processing vacuum of the process module 11030 (e.g., the processing vacuum and / or the vacuum environment extends between and is common between the process module 11030 and the substrate cassette 11050) (e.g., in one embodiment, at least the mini-environment 11060 is omitted, while in other embodiments, the vacuum load lock 11010 is also omitted and the substrate cassette 11050 is pumped down to vacuum in a manner similar to the vacuum load lock 11010).

[0021] 1C, a schematic plan view of a linear processing system 2099 is shown in which the tool interface section 2012 is mounted to the transfer chamber module 3018 such that it generally faces (e.g., inwardly) toward, but is offset from, a longitudinal axis X of the transfer chamber module 3018. The transfer chamber module 3018 may be extended in any suitable direction by mounting other transfer chamber modules 3018A, 3018I, 3018J to interfaces 2050, 2060, 2070 as described in U.S. Pat. No. 8,398,355, previously incorporated by reference herein. Each transfer chamber module 3018, 3018A, 3018I, 3018J includes any suitable substrate transport apparatus 2080, which may include one or more aspects of the disclosure described herein, for transporting wafers throughout the linear processing system 2099, for example, to and from processing modules PM. As can be appreciated, each chamber module may be capable of holding an isolated or controlled atmosphere (eg, N2, clean air, vacuum).

[0022] Referring to FIG. 1D, a schematic elevational view of a typical processing tool 410, such as may be taken along a longitudinal axis X of a linear transport chamber 416, is shown. In the embodiment of the present disclosure shown in FIG. 1D, the tool interface section 12 may typically be connected to the transport chamber 416. In this embodiment, the interface section 12 may define one end of the tool transport chamber 416. As seen in FIG. 1D, the transport chamber 416 may have another workpiece entry / exit station 412, for example, at an end opposite the interface station 12. In other embodiments, other entry / exit stations for inserting / removing workpieces from the transport chamber may be provided. In one embodiment, the interface section 12 and the entry / exit station 412 may enable loading and unloading of workpieces from the tool. In other embodiments, the workpieces may be loaded into the tool from one end and removed from the other end. In one embodiment, the transport chamber 416 may have one or more transfer chamber modules 18B, 18i. Each chamber module may be capable of holding an isolated or controlled atmosphere (e.g., N2, clean air, vacuum). As previously mentioned, the configuration / arrangement of the transfer chamber modules 18B, 18i, load lock modules 56A, 56, and workpiece stations forming the transfer chamber 416 shown in FIG. 1D is merely exemplary, and in other embodiments, the transfer chamber may have more or less modules arranged in any desired modular arrangement. In the embodiment shown, station 412 may be a load lock. In other embodiments, a load lock module may be located between end entry / exit stations (similar to station 412) or an adjacent transfer chamber module (similar to module 18i) may be configured to operate as a load lock.

[0023] As previously mentioned, the transport chamber modules 18B, 18i have one or more corresponding transport apparatuses 26B, 26i disposed therein, which may include one or more embodiments of the present disclosure described herein. The transport apparatuses 26B, 26i of each transport chamber module 18B, 18i may cooperate to provide a linearly distributed workpiece transport system 400 within the transport chamber. In this embodiment, the transport apparatus 26B may have a typical SCARA arm configuration (although in other embodiments, the transport arm may have any other desired configuration, such as, for example, an arrangement generally similar to the cluster tool transport robots 11013, 11014 illustrated in FIGS. 1A and 1B, a linearly sliding arm 214 as shown in FIG. 2F, or other suitable arms having any suitable arm linkage mechanism). Suitable examples of arm linkage mechanisms are disclosed, for example, in U.S. Pat. No. 7,578,649 issued on August 25, 2009, U.S. Pat. No. 5,794,487 issued on August 18, 1998, U.S. Pat. No. 7,946,800 issued on May 24, 2011, U.S. Pat. No. 6,485,250 issued on November 26, 2002, U.S. Pat. No. 7,891,935 issued on February 22, 2011, U.S. Pat. No. 8,419,341 issued on April 16, 2013, U.S. Pat. No. 13 / 293,717 entitled “Dual Arm Robot” filed on November 10, 2011, and U.S. Pat. No. 6,485,250 issued on November 26, 2002, U.S. Pat. No. 6,485,250 issued on November 26, 2002, U.S. Pat. No. 6,419,341 issued on April 16, 2013, U.S. Pat. No. 6,485,250 issued on November 26, 2002 ... No. 13 / 861,693, entitled "Microchip Technology Arm," the entire disclosures of which are incorporated herein by reference.In aspects of the present disclosure, the at least one transfer arm may be derived from a conventional SCARA (Selectively Compliant Articulated Robot Arm) type design, including an upper arm, a band-driven forearm, and a band-constrained end effector, or from any other suitable arm design, such as a telescoping arm, or a Cartesian linearly sliding arm, where any such design configuration also includes a slide body 420, an alignment system 499, and end effector(s) 420A, 420B...420n as further described herein. For example, in one aspect, the slide body 420 is attached to an arm link of any suitable articulated transport arm. Suitable examples of transport arms can be found, for example, in U.S. Patent Application No. 12 / 117,415, entitled "Substrate Transport Apparatus with Multiple Movable Arms Utilizing a Mechanical Switch Mechanism," filed May 8, 2008, and U.S. Patent No. 7,648,327, issued January 19, 2010, the entire disclosures of which are incorporated herein by reference. Operation of the transport arms can be independent of one another (e.g., extension and retraction of each arm is independent of the other arms), can be via lost motion switches, or can be operably linked in any suitable manner such that the arms share at least one common drive axis. In still other embodiments, the transport arms can have any other desired arrangement, such as a frog-leg arm 216 (FIG. 2E), leap-frog arm 217 (FIG. 2H), bidirectional symmetric arm 218 (FIG. 2G), or the like.Suitable examples of transfer arms include those disclosed in U.S. Pat. No. 6,231,297 issued May 15, 2001, U.S. Pat. No. 5,180,276 issued January 19, 1993, U.S. Pat. No. 6,464,448 issued October 15, 2002, U.S. Pat. No. 6,224,319 issued May 1, 2001, U.S. Pat. No. 5,447,409 issued September 5, 1995, U.S. Pat. No. 6,231,297 issued May 15, 2001, U.S. Pat. No. 6,180,276 issued January 19, 1993, U.S. Pat. No. 6,464,448 issued October 15, 2002, U.S. Pat. No. 6,224,319 issued May 1, 2001, U.S. Pat. No. 6,447,409 issued September 5, 1995, U.S. Pat. No. 6,231,297 issued May 15, 2001, U.S. Pat. No. 6,431,316 issued May 15, 2001, U.S. Pat. No. 7,578,649, issued on May 25, 1998; U.S. Patent No. 5,794,487, issued on August 18, 1998; U.S. Patent No. 7,946,800, issued on May 24, 2011; U.S. Patent No. 6,485,250, issued on November 26, 2002; U.S. Patent No. 7,891,935, issued on February 22, 2011; U.S. Patent Application No. 13 / 293,717 entitled "Dual Arm Robot", filed on November 10, 2011; and U.S. Patent Application No. 13 / 270,844, filed on October 11, 2011, the disclosures of which are all incorporated herein by reference in their entireties.

[0024] In the embodiment of the present disclosure shown in FIG. 1D, the arms and / or end effectors of the transport apparatus 26B may be arranged to provide what is referred to as a fast exchange arrangement that allows the transport apparatus to quickly exchange wafers from the pick / place position. The transport arm 26B may have any suitable drive section (e.g., coaxially arranged drive shafts, side-by-side drive shafts, horizontally adjacent motors, vertically stacked motors, etc.) to provide each arm with any suitable number of degrees of freedom (e.g., independent rotation about shoulder and elbow joints with Z-axis motion). As seen in FIG. 1D, in the present embodiment, the modules 56A, 56, 30i may be arranged in the gaps between the transfer chamber modules 18B, 18i to define suitable processing modules, load lock(s), buffer station(s), metrology station(s), or any other desired station(s). For example, the intervening modules such as load locks 56A, 56 and workpiece station 30i each have a fixed workpiece support / shelf 56S, 56S1, 56S2, 30S1, 30S2 that cooperate with the transport arm to enable transport or workpieces across the length of the transport chamber along the linear axis X of the transport chamber. As an example, the workpiece(s) may be loaded into the transport chamber 416 by the interface section 12. The workpiece(s) may be positioned on the support(s) of the load lock module 56A by the transport arm 15 of the interface section. The workpiece(s) in the load lock module 56A may be moved between the load lock module 56A and the load lock module 56 by the transport arm 26B in the module 18B, and in a similar and sequential manner may be moved between the load lock 56 and the workpiece station 30i by the arm 26i (in the module 18i) and between the station 30i and the station 412 by the arm 26i in the module 18i. This process may be reversed in whole or in part to move the workpiece(s) in the opposite direction.Thus, in one embodiment, the workpiece may be moved along the axis X in any direction to any position along the transport chamber and may be loaded and removed from any desired module (processing module or other module) in communication with the transport chamber. In other embodiments, an intervening transport chamber module with a static workpiece support or shelf may not be provided between the transport chamber modules 18B, 18i. In such embodiments, the transport arms of adjacent transport chamber modules may move the workpiece through the transport chamber, either directly to an end effector or passing the workpiece from one transport arm to an end effector of another transport arm. The processing station modules may operate on the wafer through various deposition, etching, or other types of processes to form electrical circuits or other desired structures on the wafer. The processing station modules are connected to the transport chamber modules to enable passing the wafer from the transport chamber to the processing station and vice versa. Suitable examples of processing tools having general features similar to the processing device shown in FIG. 1D are described in U.S. Pat. No. 8,398,355, previously incorporated by reference in its entirety.

[0025] 2A-2D, the processing tools are illustrated as linear processing tools 3000, 3000A, 3000B, 3000C having multiple cluster workpieces 3010-3013, each having one or more transfer chambers 3001-3003 and multiple processing modules 11030 (e.g., a combinatorial linear cluster tool). In one aspect, the linear processing tools 3000, 3000A, 3000B, 3000C are generally similar to those described in U.S. Patent Application No. 14 / 377,987, entitled "Substrate Processing Apparatus," filed August 11, 2014, the entire disclosure of which is incorporated herein by reference. In one aspect, the cluster workstations 3010-3013 are generally similar to the vacuum backend 11020 described above. The cluster workstations 3010-3013 are connected to one another by one or more transfer chambers 3020, 3021 and one or more linear transfer tunnels (also referred to herein as vacuum tunnels) 3030. As can be appreciated, each of the transfer chambers 3020, 3021 includes a transfer robot 3023. As can also be appreciated, with reference to FIGS. 2E-2G, the linear transfer tunnel 3030, in one embodiment, is formed of tunnel modules connected to one another to form a common tunnel, with one or more transfer robots 3033 disposed therein and configured to traverse the length of the common tunnel. For example, the linear transfer tunnel 3030 is a vacuum tunnel including one or more vacuum tunnel modules 3030A-3030n that can be sealingly coupled together to form a vacuum tunnel having any suitable length. Each vacuum tunnel module 3030A-3030n includes a connection port 3090 at each end of the vacuum tunnel module 3030A-3030n to enable the vacuum tunnel modules to be connected to each other and / or to any other suitable modules of the processing tool described herein.In this embodiment, each vacuum tunnel module 3030A-3030n includes at least one transport cart guide 3080 and at least one motor component 3081 for driving at least one transport cart 2530 (including the embodiments of the present disclosure described herein) through the respective vacuum tunnel module 3030A-3030n. It is noted that the connection port 3090 is sized to allow the passage of the transport cart through the port. As can be understood, when two or more vacuum tunnel modules 3030A-3030n are coupled together, the at least one transport cart guide 3080 of each vacuum tunnel module 3030A-3030n forms a substantially continuous transport cart guide extending through the vacuum tunnel 3030 to allow the passage of the transport cart 2530 between the longitudinal ends 3030E1, 3030E2 of the vacuum tunnel 3030. The at least one motor component 3081 of each of the vacuum tunnel modules 3030A-3030n also forms a substantially continuous motor component that enables substantially continuous drive movement of the transport cart between the ends 3030E1, 3030E2 of the vacuum tunnel 3030.

[0026] Referring now to Figures 3, 4A, 4B, 5A, and 5B, although aspects of the disclosure are described with respect to an atmospheric transfer robot 11013 (such as found in any one or more of the substrate processing systems or tool stations described above, and also referred to herein as a robot transfer apparatus), it should be understood that aspects of the disclosure are equally applicable to vacuum transfer robots 26B, 11014, 11014A, 11014B, 2080, 3023, and 2530, such as those described herein with respect to Figures 1A-2D, where the atmospheric robot and / or vacuum robot have any suitable transfer arm configuration, including, but not limited to, SCARA arms, Cartesian arms, linear slide arms, frog leg arms, leap frog arms, and bilaterally symmetric arms. In some embodiments, the transport robot (such as those described herein) is mounted on a linear slide (see, for example, FIG. 3, the transport robot 11013 in FIG. 1B, and FIG. 2C) or a boom arm BA (see, for example, FIG. 2A-2D as described in patent application Ser. No. 14 / 377,987, previously incorporated herein by reference in its entirety) so as to be movable in at least the X and / or Y directions, while in other embodiments, the transport robot (such as those described herein) is mounted such that the base of the transport robot is fixed from movement in the X and / or Y directions (see, for example, the transport robot 11014 in FIG. 1C, 1D, and FIG. 1B). It should be understood that the configuration of the transport robot and the automated teaching device 500 shown in the drawings is depicted for illustrative purposes only, and that the arrangement, shape, and placement of the illustrated components may be modified as desired without departing from the scope of the present invention.

[0027] 3, in one embodiment, the transfer robot 11013 is movably mounted to the frame 11060F of the mini-environment 11060, or in other embodiments, to the frame of any suitable module of the processing tool, such as the frame of the vacuum tunnel 3030 and / or the transfer chamber modules 3018, 3020, 3021. In this embodiment, the transfer robot 11013 includes a drive section 389 having any suitable number of drive axes to move the wafer or substrate along one or more of the X, Y, Z, θ, and R (end effector extension) axes. For example, the transfer robot 11013 includes, in one embodiment, a movable transfer arm 11013TA that is mounted to the carriage 363 such that the transfer arm 11013TA is movably mounted to the frame 11060F. The carriage 363 is mounted to a slide or carriage 363S in one embodiment so as to be movable in the X direction, while in other embodiments the carriage 363S is mounted to a frame 11060F so as to be fixed in the X (and / or Y) direction. In one embodiment, any suitable drive 367 is mounted to the frame 11060F and drivingly connected to the carriage 363 by any suitable transmission 367T to move the base in the X direction. In this embodiment, the transmission is a belt and pulley transmission and the drive is a rotary drive, while in other embodiments the drive is a linear actuator drivingly connected to the carriage 363 with any suitable transmission or without a transmission (e.g., when the carriage includes a drive portion of a linear actuator). Here, the transport arm 11013TA includes a rotary drive 362, a Z drive column 380, a slide body 420, and one or more end effectors. Rotary drive 362 is any suitable rotary drive mounted to carriage 363, and Z drive column 380 is attached to the output of rotary drive 362 so as to rotate in the direction of arrow T (e.g., the θ direction) about the θ axis.The slide body 420 is movably mounted to a Z drive column 380, where the Z drive column 380 includes any suitable drive motor 380T and / or transmission 380T for moving the slide body 420 in the Z direction. As can be appreciated, the relative position of the Z drive column 380 with respect to the slide body 420 provides sufficient clearance for proper traversal of the end effectors 420A, 420B and the wafer to provide wafer detection by one or more sensors 450, 451, as described further below.

[0028] 4A and 4B, one or more (e.g., at least one) wafer holders or end effectors 420A, 420B are movably mounted to the slide body 420 in any suitable manner to telescope in the R direction. While two end effectors 420A, 420B are illustrated for illustrative purposes only, it should be understood that any suitable number of end effectors may be mounted to the slide body 420. For example, in one embodiment, a single end effector is mounted to the slide 420 to effect the transport and alignment of the wafer(s) in the manner described herein. In other embodiments, more than two end effectors are mounted to the slide body 420 to effect the transport and alignment of the wafer(s) in the manner described herein. Each end effector has a predetermined end effector reference position 479 (illustrated in FIG. 4A for end effector 420B). The substrate S is carried by the end effectors 420A, 420B with the center of the substrate S coinciding with a predetermined end effector reference position 479.

[0029] As can be seen, the one or more end effectors traverse the transport arm 11013TA as a unit in a first direction (e.g., one or more of X, Y, and Z directions) relative to the frame, and linearly traverse the transport arm 11013TA in a second direction (e.g., R direction) different from the first direction. The slide body includes one or more linear drives 425 configured to move each end effector 420A, 420B independently in the R direction. The one or more linear drives 425 are, in one embodiment, any suitable drive(s) having any suitable transmission, for example, substantially similar to those described in U.S. Provisional Patent Application No. 61 / 917,056, entitled "Substrate Transport Apparatus," filed December 17, 2013, the disclosure of which is incorporated herein by reference in its entirety. The end effectors 420A, 420B are arranged on the slide body 420 so as to be stacked on top of each other to have a common axis R of extension and retraction. The transfer robot 11013 may include one or more sensors 450, 451 (as described in U.S. patent application Ser. No. 14 / 928,352, entitled "Wafer Aligner," filed Oct. 30, 2015, the entire disclosure of which is incorporated herein by reference) attached to the slide body 420 and arranged to measure / detect the edge of the wafer to determine one or more predetermined characteristics of the wafer, such as wafer diameter, wafer circumferential runout, location of alignment fiducial FID (e.g., notch / flat, mark or other feature), location of wafer centerline, location of wafer center, or any other suitable information about the wafer(s) carried by the end effectors 420A, 420B, such as wafer identification. The transfer robot 11013 may also include any suitable rotating chuck or spinner (e.g., aligner, as described above) 460 connected to the slide body 420, such as described in U.S. patent application Ser. No. 14 / 928,352, filed Oct. 30, 2015.

[0030] 5A, 5B, 6A and 6B, as described above, the automated teach apparatus 500 is a combined teaching system configured to automatically teach the position of a load port module 11005 (or any suitable workpiece load station) and the position of a substrate holding station (separate and located away from the workload station) in a vacuum and / or atmospheric environment substrate processing tool. As described above, the automated teach apparatus 500 includes mock carrier jigs 510A, 510B and a removable module jig 600. The mock (i.e. dummy) carrier jigs 510A, 510B mimic (i.e. in shape, size and configuration) any suitable substrate carrier (such as substrate cassette 11050) received at any suitable substrate carrier holding station (such as load port 11040). For example, the mock carrier jig 510A, 510B has a frame 550 forming an internal chamber 551 having an opening 636 in a front wall 637 (see FIG. 6A ), the opening 636 being arranged to allow an end effector to enter the mock carrier jig 510A, 510B's internal chamber 551 through the front wall 637 in a manner generally similar to that of the substrate cassette 11050. In one or more embodiments, the opening 636 is oriented in a vertical plane (e.g., the X (or θ)-Z plane of the transport robot 11013), but in other embodiments, the opening 636 may be located in any suitable plane accessible by the transport robot. Any suitable kinematic linkage 627 is coupled to (or integrally formed with) the frame 550 to couple the mock carrier jig 510A, 510B to the load port module 11005 at a predetermined position thereon. The kinematic linkage 627 is generally similar to that found on the substrate cassette 11050 .In some embodiments, the frame 550 is sealable and the mock carrier jig 510A, 510B includes a removable door 552 (similar to the cassette door of the substrate cassette 11050 (FIG. 6A)) configured to couple with the frame 550 and substantially seal the interior chamber 551, where the door 552 is configured to be removed from the frame by the load port module 11005 in a manner generally similar to the manner in which a cassette door is removed from the substrate cassette 11050 by the load port module. The frame 550 is configured for transport by a human operator (such as with the handle 666) and / or for automated handling using any suitable automated equipment, including, but not limited to, an overhead gantry, a mobile / wheeled transport device, or the like (such as with an automated interface generally similar to that of the substrate cassette 11050).

[0031] Referring to FIG. 5A, in some embodiments, a mock carrier jig 510A contains one or more detection features or targets 520-523 that are sensed by one or more imaging sensors 571-574 of a machine vision system 530A carried by a substrate transport apparatus 501 (substantially similar to the substrate transport apparatus described herein). In a manner similar to that described herein with respect to mock carrier jig 510B, target(s) 520-523 include a plurality of fixed targets 520-523 each having a different pre-determined pose such that the plane of each respective target 520-523 corresponds to a different respective load port module reference plane (e.g., the ZX (or θ) plane, the R (or Y)-X (or θ) plane, and the ZY (or R) plane) (see Figures 5A, 5B, and 10), and one or more sensors 571-574 have an orientation corresponding to each respective fixed target 520-523 such that each fixed target 520-523 forms a different pair, with its respective imaging sensor 571-574, corresponding to and including its respective imaging sensor 571-574 and arm target 520-523.

[0032] In this embodiment, the simulated carrier jig 510A is arranged to removably engage with the load port module 11005, and both the targets 520-523 and at least one movable imaging sensor 750-752 (of the removable module jig 600) are attached to the simulated carrier jig 510A. Here, at least one of the targets 520-523 faces an opening 636 of the simulated carrier jig 510A. In this embodiment, the simulated carrier jig 510A contains at least one rearward (e.g., Y or R direction) oriented target 521, 522, at least one vertical (e.g., Z direction) oriented target 523, and at least one horizontal (e.g., X or θ direction) oriented target 520. Similarly, the machine vision system is attached to the transport arm 11013TA and includes at least one forward (e.g., Y or R direction) orientation sensor 571, 572 (paired with (one or more) rearward facing targets), at least one vertical (e.g., Z direction) orientation sensor 574 (paired with (one or more) vertical orientation targets), and at least one horizontal (e.g., Y or R direction) orientation sensor 573 (paired with (one or more) horizontal orientation targets). Here, at least one of the imaging sensors 571-574 faces the front wall 637 of the simulated carrier jig 5110A upon approach of the transport arm 11013TA to the load port module 11005 along a motion path extending through the opening 636 and entering the simulated carrier jig 510A.

[0033] As can be appreciated, at least one forward-facing sensor 571, 572 is attached to the substrate transport apparatus 501 in any suitable manner, such as sensing rear-facing targets 521, 522 to determine the position of the mock carrier jig 510A relative to the substrate transport apparatus 501 in, for example, the XZ plane, to provide an initial alignment of the end effector 502 for subsequent sensing operations as described above. In this embodiment, two rear-facing targets 521, 522 are provided, which are vertically spaced apart from one another in a specific predetermined relationship. In one or more embodiments, the rear-facing targets 521, 522 are sensed by one or more of the forward-facing sensors 571, 572 to provide both an initial alignment in the XZ plane and tilt 511 (e.g., XY plane) and rotation 512 (e.g., in the XZ plane) of the cassette holding position of the load port module (e.g., via comparison of the sensed position of the rear-facing target with an expected predetermined position of the rear-facing target). At least one vertical sensor 574 is mounted to the substrate transport apparatus 501 in any suitable manner (such as on the end effector 502) to sense a vertical target 523 to determine the position of the simulated carrier jig 510A relative to the substrate transport apparatus 501, for example, in the Y or R direction. In the embodiment illustrated in FIG. 5A, the sensor 574 faces downward and the target 523 faces upward, but in other embodiments, the sensor 574 may face upward and the target 523 may face downward. At least one horizontal sensor 573 is mounted to the substrate transport apparatus 501 in any suitable manner (such as on each end effector 502) to sense a horizontal target 520 to determine the position of the simulated carrier jig 510A relative to each end effector 502, for example, in the Z direction. If the substrate transport apparatus 501 includes multiple end effectors, each end effector may include a respective sensor configured to sense a horizontal target 520.The sensors 571-573 of the machine vision system 530A are coupled to any suitable controller (such as controller 11091) so that when the sensors 571-573 sense their respective targets 520-523, the position of the motor encoder of the substrate transport apparatus 501 is read / determined by the controller 11091 to teach the substrate transport apparatus 501 the position of the mock carrier jig 510A (and the position of the load port module 11005 via the mock carrier jig 510A kinematically positioned on the load port module 11005).

[0034] 5B, in some embodiments, the machine vision system 530B includes at least one fixed imaging sensor 581-583 (fixed to the frame 550) and at least one movable imaging sensor 750-752 (see FIGS. 8A-8C) configured to be removably connected to the frame 11090F and image at least one target of the machine vision system 530B. In one or more embodiments, the at least one fixed imaging sensor 581-583 (such as the fixed imaging sensor 581) is positioned to image at least one arm target 540-542 in a direction extending through the opening 636 of the simulated carrier jig 510B, whereby the resolved offset frees extension of the end effector through the opening 636 into the interior chamber 551 of the simulated carrier jig 510B. In one or more embodiments, at least one fixed imaging sensor 581-583 (such as fixed imaging sensor 581) is positioned to image at least one arm target 540-542 in a direction extending through the opening 636 of the mock carrier jig 510B, whereby the controller 11091 confirms unobstructed arm extension of the end effector 502 into the internal chamber 551 of the mock carrier jig 510B based on the resolved offset.

[0035] In one or more embodiments, at least one fixed imaging sensor 581-583 (e.g., fixed imaging sensor 582, 583) is positioned to image at least one arm target 540-542 in a cross direction (e.g., X (or θ) and / or Z direction) that extends at a cross angle to an extension path 555 of the end effector 502 that extends through the opening 636 into the interior chamber 551 of the simulated carrier jig 510B. As described herein, a resolved offset based on an image of the at least one arm target 540-542 in a direction that extends through the opening 636 (see FIG. 10 ) acts to align the at least one arm target 540-542 to another incremental taught position (e.g., incremental from a previous taught position) such that an offset resolution based on an image of the at least one arm target 540-542 in the cross direction incrementally resolves the resolved offset. In one or more embodiments, at least one fixed imaging sensor 581-583 (e.g., fixed imaging sensors 582, 583) are positioned to image at least one arm target 540-542 in multiple intersecting directions, each of the multiple intersecting directions extending at an intersecting angle relative to the extension path 555 of the end effector 502 (e.g., extending through opening 636 into mock carrier jig 510B) and to each other, each acting to progressively resolve a resolved offset along a respective axis corresponding to each degree of freedom of the at least one degree of freedom of arm movement provided by drive section 389.

[0036] As described herein, in some embodiments, at least one fixed imaging sensor 581-583 includes multiple fixed imaging sensors 581-583 each having a different predefined pose such that the imaging sensor surface of each respective imaging sensor 750-752 corresponds to a different respective load port module reference plane (e.g., the ZX (or θ) plane, the R (or Y)-X (or θ) plane, and the ZY (or R) plane) (see Figures 5A, 5B, and 10), and the arm targets 540-542 have an orientation corresponding to each respective fixed imaging sensor 581-583 such that each fixed imaging sensor 581-583 forms, with the respective arm target(s) 540-542, a different pair corresponding to and including the respective fixed imaging sensor 581-583 and the arm target(s) 540-542. As also described herein, at least one fixed imaging sensor 581-583 is positioned on the end effector 420A, 420B, 502 to image at least one end effector target 540, 541 positioned on a wafer plane WP defined by the end effector 420A, 420B, 502 (and formed by the surface 699S of the verification substrate 699) (see FIG. 5B) and at a predetermined position relative to the end effector reference position 479. Here, the controller 11091 confirms or progressively resolves resolved offsets ΔX, Δθ, ΔY, ΔR, ΔZ (as described herein) based on end effector target images (see FIG. 10) from at least one fixed imaging sensor that captures effector target images with end effectors 420A, 420B, 502 positioning the wafer plane WP within each (or at least one) of at least one simulated workpiece holding slot 610, 611, 612.

[0037] In this embodiment, the mock carrier jig 510B is arranged to removably engage with the load port module 11005, and both the at least one fixed imaging sensor 581-583 and the at least one movable imaging sensor 750-752 are attached to the mock carrier jig 510B as described herein. The mock carrier jig 510B houses the at least one fixed imaging sensor 581-583 of the machine vision system 530B as described herein, while one or more detection features or targets 540-542 (see also FIGS. 6C-6E) of the machine vision system 530B are carried by the substrate transport apparatus 501, and / or one or more detection features or targets 871, 1120, 1201, 1202 (see also FIGS. 11-12B) are carried by the substrate holding station. Here, the field of view of the at least one fixed imaging sensor is directed toward the opening 636 of the mock carrier jig 510B. The at least one fixed imaging sensor has a predetermined pose relative to a predetermined load station reference position 11005L and includes at least one rear (e.g., Y or R direction) orientation sensor 581, at least one vertical (e.g., Z direction) orientation sensor 583, and at least one horizontal (e.g., X or θ direction) orientation sensor 582. The at least one horizontal orientation sensor 582, in one or more embodiments, is positioned within the frame 550 at a Z height position corresponding to the Z height position of workpiece holding slot number 13 of a conventional 25 substrate carrier such as that illustrated in FIG. 1A (or any other suitable predetermined Z height of any suitable workpiece holding slot number).

[0038] In this embodiment, at least one of the arm targets 540-542 is disposed facing the front wall 636 and the opening 636 of the simulated carrier jig 510B when the transport arm 11013TA approaches the load port module 11005 along the movement path extending through the opening 636 and enters the simulated carrier jig 510B. The one or more targets include at least one forward (e.g., Y or R direction) oriented target 542 (paired / formed with (one or more) rearward oriented sensors), at least one vertical (e.g., Z direction) oriented target 540 (paired / formed with (one or more) vertical oriented sensors), and at least one horizontal (e.g., Y or R direction) oriented target 541 (paired / formed with (one or more) horizontal oriented sensors).

[0039] 5B, in one or more embodiments, at least one rearward-facing sensor 581 is mounted to the frame 550 in any suitable manner, such as sensing a forward-facing target 542 to determine the position of the simulated carrier jig 510B relative to the substrate transport apparatus 501 in the XZ plane, to provide an initial alignment of the end effector 502 for subsequent sensing operations as described above. At least one vertical sensor 574 is mounted to the frame in any suitable manner, such as sensing a vertical target 540 to determine the position of the simulated carrier jig 510B relative to the substrate transport apparatus 501 in the Y or R direction. At least one vertical target 540 is mounted to the substrate transport apparatus 501 in any suitable manner, such as being sensed by a vertical sensor 583 to determine the position of the simulated carrier jig 510B relative to the substrate transport apparatus 501 in the Y or R direction. 5B, the sensor 583 faces downward and the target 540 faces upward, although in other embodiments the sensor 583 may face upward and the target 540 may face downward. At least one lateral sensor 582 is mounted to the frame in any suitable manner (such as on each end effector 502) to sense the lateral target 520 to determine the position of the mock carrier jig 510B relative to each end effector 502, for example, in the Z direction. If the substrate transport apparatus 501 includes multiple end effectors, each end effector may include a respective target configured to be sensed by the lateral sensor 582. The sensors 581-583 of the machine vision system 530B are coupled to any suitable controller (such as controller 11091) so that when the sensors 581-583 sense their respective targets 540-542, the position of the motor encoder of the substrate transport apparatus 501 is read / determined by the controller 11091 to teach the substrate transport apparatus 501 the position of the simulated carrier jig 510B (and the position of the load port module 11005 via the simulated carrier jig 510B kinematically positioned on the load port module 11005).

[0040] 6A-6D, the simulated carrier jig is described with respect to the simulated carrier jig 510B, although it should be understood that the simulated carrier jig 510A is generally similar, but for targets rather than sensors to be positioned within the internal chamber 551. The simulated carrier jig 510B, in one embodiment, has the shape and size of a 25 substrate holder carrier (i.e., a substrate cassette having 25 substrate holding positions stacked one on top of the other). The internal chamber 551 of the simulated carrier jig is configured with at least one simulated workpiece holding slot 610, 611, 612, each of which corresponds to and represents a different workpiece holding slot of a workpiece carrier (such as carrier 11050) in the load port module 11005 and defines a different one of the load station reference positions 11005L. For example, at least one simulated workpiece holding slot 610, 611, 612 is positioned adjacent to a top surface 615 of the internal chamber 551 and / or adjacent to a bottom surface 616 of the internal chamber 551. As described in more detail below, at least one simulated workpiece holding slot 610, 611, 612 is configured to hold one or more of a removable module jig 600 and a verification wafer or substrate 699, where each simulated workpiece holding slot 610, 611, 612 holds a respective one of the removable module jig 600 and the verification substrate 699. In some embodiments, the internal chamber 551 of the simulated carrier jig is configured with one simulated workpiece holding slot 610 configured to hold the removable module jig 600 and at least two simulated workpiece holding slots 611, 612 positioned adjacent to one or both of the top surface 615 and the bottom surface 616.The simulated workpiece holding slot 611 corresponds to slot 1 (substrate holding position) of a conventional 25 substrate holder carrier (e.g., has the same height along the Z axis from the kinematic datum of the load port module as slot 1), and the simulated workpiece holding slot 612 corresponds to slot 25 (substrate holding position) of a conventional 25 substrate holder carrier (e.g., has the same height along the Z axis from the kinematic datum of the load port module as slot 25).

[0041] The sensors 581-583 are positioned in at least a central portion of the internal chamber 551 (e.g., between the upper surface 615 and the lower surface 616) such that the simulated workpiece holding slot(s) 610, 611 are positioned above or below one or both of the sensors 581-583. Positioning the sensors 581-583 in the central portion of the internal chamber 551 allows the end effectors 420A, 420B to be inserted between (or above or below) the simulated workpiece holding slot(s) 610, 611, 612. Although the sensors 581-583 are illustrated as being coupled to cantilever mounts extending from a wall of the internal cavity 551, in other embodiments the sensors 581-583 are attached and coupled to a frame within the internal cavity 551 in any suitable manner. In this embodiment, the simulated carrier jig 510B includes at least one substrate placement verification sensor 682, 683 positioned within the internal chamber 551 to sense / detect the position of a verification substrate 699 (held on the end effector 502 or disposed on a substrate support of the frame 550) positioned in a respective one of the simulated workpiece holding slot(s) 610, 611, 612. The field of view of the substrate placement verification sensor(s) 682, 683 extends along the Z-axis. Referring also to FIG. 6F, the verification substrate 699 is otherwise identical to a conventional or teaching substrate and includes one or more targets 698 disposed on at least one of the major surfaces (e.g., top or bottom) of the verification substrate 699, where the target(s) 698 have a known, predetermined relationship to the center of the verification substrate 699 (and in some embodiments, the alignment datum 697 of the verification substrate 699). In one embodiment, the target 698 is located at the center of the authentication substrate 699 .

[0042] In some embodiments, the simulated carrier jig 510B includes an inclinometer (or tilt sensor) sensor 681 configured to sense / determine the tilt of the simulated carrier jig 510B kinematically seated / positioned (e.g., see FIG. 1) on the load port module 11005 with respect to one or more of the XY (or θ-R) and XZ (or θ-Z) planes. In the embodiment illustrated in FIGS. 6A-6D, the sensors 581-583, 682, 683 are any suitable cameras configured for image analysis recognition of the targets 540-542, 698 (e.g., via coupling with a suitable controller, such as the controller 11091), although in some embodiments the lateral sensor 582 may be a through beam sensor configured to sense the edge of the end effector 502. The camera may be a charge-coupled device (CCD) camera, a complementary metal-oxide semiconductor (CMOS) camera, a time-of-flight camera, a stereo / binocular camera, or other suitable camera configured to sense / detect the position of the target as described herein.

[0043] The simulated carrier jig 510B includes any suitable power connections 685 for connecting the on-board sensors (and other suitable electronic circuitry) of the simulated carrier jig 510B to any suitable power source (such as the substrate processing tool's power source or the substrate processing facility's mains / line power source), although in other embodiments the on-board sensors (and other suitable electronic circuitry) of the simulated carrier jig 510B may be powered by a battery mounted on the simulated carrier jig 510B and carried by the frame 550. The simulated carrier jig 510B includes any suitable communication connections 686 (e.g., an Ethernet connection, a fiber optic connection, a coaxial connection, or any other suitable physical transmission medium) configured to couple the simulated carrier jig 510B to a controller (such as the controller 11091) to provide reading / detection of a motor encoder position corresponding to a sensed target / substrate, although in other embodiments the communication between the simulated carrier jig 510B and the controller 11091 may be any suitable wireless communication. In one embodiment, for example, cables from the power supply and controller 11091 are manually connected to the communication connection 686 and the power connection 685 to connect the mock carrier jig 510B to the power supply and controller 11091, while in other embodiments, the load port module includes power and communication connections that automatically connect to the communication connection 686 and the power connection 685 upon placement of the mock carrier jig 510B on the load port module 11005.

[0044] It is noted that in some embodiments, the simulated carrier jig 510A does not include on-board sensors / electronics (as the sensors are located on and move with the substrate transport apparatus 501 (see FIG. 5A)). Here, as described above, to determine / sense the tilt of the simulated carrier jig 510A, the targets 521, 522 are positioned one above the other in a common (i.e., same) plane 598 with a known spatial relationship such that the offset (e.g., rotation) of one target 521, 522 relative to the other target 521, 522 is determined by the controller 11091 in each of the XY (or θ-R) and XZ (or θ-Z) planes when sensed by sensors 571, 572 mounted on the substrate transport apparatus 501 to determine the tilt / rotation of the simulated carrier jig 510A kinematically seated on the load port module 11005. In other embodiments, the simulated carrier jig 510A includes infrared communication (coupled to the controller 11091 and powered by a wired or wireless connection in a manner similar to that of the simulated carrier jig 510B) for communication with the removable module jig 600, where the removable module jig 600 (such as one with a tilt sensor) is utilized to determine the tilt of at least the simulated carrier jig 510A.

[0045] For illustrative purposes only, and with reference to FIG. 7, the targets described herein are generally similar to and will be described with reference to target 800. Target 800 (which may be referred to as a teaching feature) is any feature within the substrate transport apparatus workspace that can be identified via imaging by vision systems 530A, 530B. Target 800 is an engineered mark that has been manipulated into a component of the substrate processing apparatus, an image of a physical feature of the substrate processing apparatus, or a combination thereof. For illustrative purposes, target 800 is an engineered mark having a substantially square shape for illustrative purposes only, although in other aspects target 800 may have any suitable geometric configuration (e.g., triangular, rectangular, hexagonal, octagonal, etc.). In one embodiment, the target 800 is flush with the surface on which it is placed, while in other embodiments, the target 800 is or includes one or more of a hole or holes (blind or through holes having any suitable shape, including but not limited to round, circular, and pyramidal, or a series of slots or "pin" holes sized for the appropriate resolution with the imaging sensor described herein), a slot (having any suitable shape, including but not limited to hexahedron), and a similarly configured protruding structure (protruding from a surface) having predetermined features to inform and clarify its location in the target image and the teach image. In one or more embodiments, the features of the target 800 are bossed or formed in calibrated relief in the arm structure, and / or the target 800 (and its features) are integral features of the arm structure, such as a calibrated feature of the end effector structure that also serves as the target(s) (e.g., end effector corners, end effector depth features, etc.).In the example illustrated herein, the target 800 has predetermined indicia embodying predetermined features that describe at least one target plane (e.g., ZX (or θ) plane, R (or Y)-X (or θ) plane, and ZY (or R) plane) imaged by the fixed imaging sensors 581-583 (FIG. 5B), the moving imaging sensors 571-574 (FIG. 5A), or the moving imaging sensors 750-752 (FIGS. 8A-8C) such that the distance offset (s) ΔX, Δθ, ΔY, ΔR, ΔZ (see FIG. 10) partially resolves, based on the image, a reference plane of the load port module 11005 or the station fixture 870, 11010, 11030 (e.g., of the load station reference position 11005L or the station fixture reference position 1199). For illustrative purposes, the target has an outer region 801 and an inner region 802 optically separated from each other by a middle region 803. For example, the outer region 801 and the inner region 802 each have a different color shade (i.e., contrasting colors such as black and white) than the middle region 803 such that the spatial characteristics of each of the inner region 802 and the outer region 801 themselves, in addition to the predetermined spatial relationship between the inner region 802 and the outer region 801, are optically identified / sensed by the sensor of the automated teaching apparatus 500. For example, the outer region 801 of the target has a length 810, a width 811, and a thickness / distance 820, 822 (where the length, width, and thickness have any suitable units of measurement such as inches or millimeters). The inner region 802 has a length 812 and a width / distance 813, and is separated from the outer region 801 by the thickness / distance 821, 823 of the middle region 803. The target 800 is placed on any suitable background 840 such that it is optically separated (i.e., contrasted) from the background. For example, in one embodiment, the middle region 803 and background 840 are white and the inner region 802 and outer region 801 are black, while in another embodiment, the middle region 803 and background 840 are black and the inner region 802 and outer region 801 are white.

[0046] In the example described herein, the transport arm 11013TA has a number of targets 540-542 (referred to herein as arm targets) imaged by the fixed imaging sensors 581-583. Each of the targets 540-542 features a different offset aspect. Each of the different offset aspects (e.g., the target and offset aspects thereby characterized) corresponds, separately from one another, to a different respective pair of drive axes (e.g., X (or θ)-Y (or R) drive axes, ZX (or θ) drive axes, ZY (or R) drive axes) that provide at least one degree of freedom of movement of the transport arm 11013TA. Each of the drive axis pairs corresponds to a different respective plane of the load port module 11005, the ZX (or θ) plane, the R (or Y)-X (or θ) plane, and the ZY (or R) plane, such that each different offset aspect corresponding to a different drive axis pair is resolved by a separate image of the respective target, and the distance offsets ΔX, Δθ, ΔY, ΔR, ΔZ are generally resulting from a combination (or superposition, or sequence) of the resolved different offset aspects as described herein. As can be appreciated, a first drive axis pair of a different drive axis pair (e.g., X(or θ)-Y(or R) drive axis, ZX(or θ) drive axis, ZY(or R) drive axis) corresponding to a first arm target of arm targets 540-542 shares drive axes (X, θ, R, Y, Z) with a second drive axis pair of a different drive axis pair (e.g., X(or θ)-Y(or R) drive axis, ZX(or θ) drive axis, ZY(or R) drive axis) corresponding to a second arm target of arm targets 540-542, where resolution of the second offset aspect of the different offset aspect (at the second arm target) serves to confirm or refine a portion of the first offset aspect with respect to the load station reference axes (X, θ, Y, R, Z) corresponding to the shared drive axis and resolved at the first arm target, as described herein.

[0047] In one or more embodiments, the transport arm 1103TA has a plurality of arm targets 540-542 arranged such that each arm target 540-542 imaged by the fixed imaging sensor 581-583 separately characterizes a different offset aspect, whereby a first arm target of the arm targets 540-542 characterizes a first offset aspect and a second arm target of the arm targets 540-542 characterizes a second offset aspect different from the first offset aspect. The different characterizations determined by the first and second arm targets 540-542, respectively, are adjusted such that the characterization of the second offset aspect of the different offset aspect (separately resolved by the second arm target 540-542) serves to confirm or reconstruct a portion of the first offset aspect relative to the load station reference axes X, θ, Y, R, Z, where the first offset aspect is separately resolved by the first arm target 540-542. In one or more embodiments, the transport arm 11013TA has a plurality of arm targets 540-542, the plurality of arm targets being arranged such that each arm target 540-542 imaged by the fixed imaging sensors 581-583 characterizes a different offset aspect, each of which (e.g., the targets 540-542 and the offset aspect characterized thereby) corresponds (different from one another) to a different respective at least one drive axis X, θ, Y, R, Z that effects at least one degree of freedom of movement of the transport arm 11013TA, where the at least one drive axis X, θ, Y, R, Z corresponds to a different respective reference axis X, θ, Y, R, Z of the load port module 11005, whereby each different offset aspect (corresponding to the different at least one drive axis X, θ, Y, R, Z) is resolved by a separate image of the respective target 540-542, and the offset resolution is generally effected by a combination (or sequence) of the separately resolved different offset aspects.

[0048] Similarly, each station fixture (e.g., station fixtures 870, 11010, 11030) has a plurality of targets 871, 1120, 1201, 1202 (referred to herein as station targets) (see FIGS. 8D and 11-12B) that are imaged by movable imaging sensors 750-752 of removable module jig 600. Each of targets 871, 1120, 1201, 1202 features a different offset aspect. Each of the different offset aspects (e.g., the target and offset aspects thereby characterized) corresponds, separately from one another, to a different respective pair of drive axes (e.g., X(or θ)-Y(or R) drive axis, ZX(or θ) drive axis, ZY(or R) drive axis) that provide at least one degree of freedom of motion of transport arm 11013TA. Each of the drive axis pairs corresponds to a different respective plane of each station fixture, the ZX (or θ) plane, the R (or Y)-X (or θ) plane, and the ZY (or R) plane, such that each different offset aspect corresponding to the different drive axis pairs is resolved by a separate image of the respective target, and the distance offsets ΔX, Δθ, ΔY, ΔR, ΔZ are generally caused by a combination (or superposition, or sequence) of the resolved different offset aspects as described herein.As can be appreciated, a first drive axis pair of a different drive axis pair (e.g., X(or θ)-Y(or R) drive axis, ZX(or θ) drive axis, ZY(or R) drive axis) corresponding to a first station target of station targets 871, 1120, 1201, 1202 shares drive axes (X, θ, R, Y, Z) with a second drive axis pair of a different drive axis pair (e.g., X(or θ)-Y(or R) drive axis, ZX(or θ) drive axis, ZY(or R) drive axis) corresponding to a second station target of station targets 871, 1120, 1201, 1202, where resolution of the second offset aspect of the different offset aspect (at the second station target) serves to confirm or reconstruct a portion of the first offset aspect with respect to the station fixture reference axes (X, θ, Y, R, Z) corresponding to the shared drive axes and resolved at the first station target, as described herein.

[0049] In one or more embodiments, the station fixture 870, 11010, 11030 has multiple station targets 871, 1120, 1201, 1202, and the multiple station targets are positioned such that each station target 871, 1120, 1201, 1202 imaged by the movable imaging sensor(s) 750-752 separately characterizes a different offset aspect, whereby a first station target of the station targets 871, 1120, 1201, 1202 characterizes a first offset aspect and a second station target of the station targets 871, 1120, 1201, 1202 characterizes a second offset aspect that is different from the first offset aspect. The different characterizations defined by the first and second station targets 871, 1120, 1201, 1202, respectively, are coordinated such that the resolution of the second offset aspect of the different offset aspect (separately resolved by the second arm targets 540-542) serves to confirm or reconstruct a portion of the first offset aspect relative to the load station reference axes X, θ, Y, R, Z, where the first offset aspect is resolved separately by the first station targets 871, 1120, 1201, 1202.In one or more embodiments, the station fixture 870, 11010, 11030 has a plurality of station targets 871, 1120, 1201, 1202, where each station target 871, 1120, 1201, 1202 imaged by the fixed imaging sensors 750-752 features a different offset aspect, each of which (e.g., targets 871, 1120, 1201, 1202 and the offset aspects characterized thereby) provides a different respective minor offset that results in at least one degree of freedom of movement of the transport arm 11013TA. The station targets 871, 1120, 1201, 1202 are positioned to correspond (different from one another) to at least one drive axis X, θ, Y, R, Z, where at least one drive axis X, θ, Y, R, Z corresponds to a different respective reference axis X, θ, Y, R, Z of the station fixture 870, 11010, 11030, whereby each different offset aspect (corresponding to a different at least one drive axis X, θ, Y, R, Z) is resolved by a separate image of the respective station target 871, 1120, 1201, 1202, and the offset resolution is generally provided by a combination (or sequence) of the separately resolved different offset aspects.

[0050] 6A, and 8A-8C, a removable module jig 600 transferred by a simulated carrier jig 510A, 510B in one of the simulated workpiece holding slots 610, 611, 612 is utilized within a substrate processing equipment / tool ​​station to facilitate alignment of a substrate holding station (as described above) of the substrate processing equipment / tool ​​station. The removable module jig 600 includes a base or frame 710 and a sensor housing 720. The frame 710 of the removable module jig 600 (and thus at least one movable (via being carried by the removable module jig 600) imaging sensor 750-752) is held in the simulated carrier jig 510A, 510B and positioned for transport and transfer with the end effectors 420A, 420B, 502 to / from the simulated carrier jig 510A, 510B and each station fixture 870, 11010, 11030 of the substrate processing equipment. For example, the frame 710 has a shape and size that corresponds at least in part to the shape and size of a substrate S (illustrated in dashed lines in FIG. 8C for size and shape comparison with the frame 710) that is held in the substrate cassette 11050 and processed by the substrate processing equipment / tool ​​station. In the example shown in FIG. 8A, the frame has a radiused portion 710R and a truncated portion 710T. The radiused portion 710R has a radius that corresponds to the substrate that is held in the substrate cassette 11050 and processed by the substrate processing equipment / tool ​​station. The truncated portion 710T cuts out a disk shape (similar to the disk shape of the substrate S) otherwise formed by the arc portions so that the one or more sensors of the removable module jig 600 are not obstructed by the frame 710, although in other embodiments, the frame 710 may not be cut out and may have a disk shape (similar / the same as the shape of the substrate S) and include appropriate openings (similar to the openings 736 described below) that accommodate the one or more sensors so that the one or more sensors are not obstructed by the frame 710.Frame 710 is constructed of any suitable material, including but not limited to carbon fiber, metal, ceramic, and the like.

[0051] At least one movable imaging sensor 750-752 is mounted on the frame 710 so as to be positioned on the end effector 420A, 420B, 502 at a predetermined position relative to a predetermined end effector reference position 479 using the frame 710 carried by the end effector 420A, 420B, 502. At least one movable imaging sensor 750-752 includes a plurality of movable imaging sensors 750-752, each having a different predetermined pose such that the imaging sensor surface (see Figures 8A-8F) of each respective movable imaging sensor 750-752 corresponds to a different respective holding station reference plane (e.g., the X (or θ)-Z plane, the R (or Y)-X (or θ) plane, and the ZY (or R) plane), and at least one station target 871, 1120, 1201, 1202 has an orientation corresponding to each respective movable imaging sensor 750-752 such that each movable imaging sensor forms a different pair, with its respective station target, corresponding to and including its respective fixed imaging sensor 750-752 and its respective station target 871, 1120, 1201, 1202. For example, the frame 710 has alignment features 710F that align the frame 710 (and components attached to the frame, such as at least one movable imaging sensor 750-752) in a predetermined position relative to the end effector reference position 479 (see FIG. 4A ) with the removable module jig 600 seated on the end effectors 420A, 420B. The alignment features 710F of the frame 710 have engagement features (such as the bottom and / or periphery of the frame 710, alignment datums, kinematic positioning features, etc., or any combination thereof) that engage the end effectors 502, 420A, 420 and align the at least one movable imaging sensor 750-752 of the removable module jig 600 in a predetermined pose relative to the predetermined end effector reference position 479.The positioning feature 710F is aligned relative to the end effector reference position 479 in any suitable manner (e.g., within the simulated carrier jig 510A, 510B, such as by imaging the positioning feature 710F to determine the orientation of the removable module jig 600 relative to the end effector, or mechanically using kinematic positioning features) so that when seated on the end effector, the orientation of at least one movable imaging sensor 750-752 is known relative to the end effector reference position 479 in six degrees of freedom.

[0052] The sensor housing 720 is coupled to the frame 710 in any suitable manner (or is integrally formed with the frame in any suitable manner) such that the sensor housing 720 and the frame 710 are transported as a single unit. The sensor housing 720 has any suitable shape and size for accommodating one or more imaging sensors 750-752 configured to detect one or more respective targets of the substrate holding stations as described herein (i.e., the sensor housing 720 need not be the same shape as the frame 710), where the sensors 750-752 and respective targets for a sensor / target pair are arranged in a manner similar to that described above with respect to the mock cassette jigs 510A-510B. For illustrative purposes, the sensor housing 720 includes a boom, protrusion, or probe portion 720B (referred to herein as probe portion 720B) that protrudes from the front of the frame 710. The probe portion includes one or more sensors 750, 751 (and one or more illumination sources 750L, 751L) as described herein and is configured to be admitted / inserted (e.g., by end effector advancement in the extension direction and / or robot (R, θ, X, Y, Z) motion) into a space of a semiconductor tool station (such as that described herein), including spaces that may not be acceptable for a particular substrate configuration, to detect / sense a target as described herein. The one or more sensors 750-752 are any suitable optical sensor, including but not limited to a camera (such as those described herein), configured for image recognition (by any suitable image processing algorithm / process) of a target as described herein. In the embodiment illustrated in Figures 8A-8C, the one or more sensors 750-752 include a forward-facing sensor 751 and two downward-facing sensors 750, 752 (although in other embodiments, the sensors 750, 752 may face upward to sense targets above the sensors in a manner generally similar to that described herein with respect to targets sensed by downward-facing sensors positioned below the sensors).One of the downward sensors is disposed adjacent an edge of the sensor housing 720 (such as on the probe portion 720B) and may be referred to as an edge sensor 750, while another of the downward sensors is disposed substantially at a center 798 of the frame 710 (e.g., at the center of the arc portion 710R at a location corresponding to the center of the substrate S) and may be referred to as a center sensor 752. The frame 710 includes an opening 736 through which the field of view of the center sensor 752 extends such that the center sensor 752 is not obstructed by the frame 710. In other embodiments, there may be more or less than three sensors. In one or more embodiments, the removable module jig 600 includes an illumination source 750L-752L (e.g., any suitable light) for each sensor 750-752 (or at least one sensor), where the illumination source 750L-752L is configured to illuminate a target being sensed / detected by the respective sensor image 750-752. As can be appreciated, the sensor housing 720 includes any suitable on-board memory 733 and processor 734 coupled to the sensors 750-752 and configured to effect operation of the sensors 750-752 as described herein.

[0053] The removable module jig 600 is configured to communicate with the controller 11091 in any suitable manner such that when the sensors 750-752 sense their respective targets on the substrate processing equipment / tool ​​station, the motor encoder position of the substrate transport apparatus 501 is read / determined by the controller 11091 as described herein. In one or more embodiments, the removable module jig 600 includes an infrared transceiver 777 (e.g., transmitter / receiver), and the simulated carrier jigs 510A, 510B include corresponding infrared transceivers (e.g., transmitter / receivers) 647 configured to receive communications from the removable module jig 600 and transmit communications to the removable module jig 600 via the infrared transceiver 777. Here, the sensor data is transferred from the removable module jig 600 to the controller 11091 via the simulated carrier jigs 510A, 510B. In other embodiments, the removable module jig 600 includes any suitable wireless communication module (e.g., Bluetooth®, ZigBee®, or other suitable radio frequency transmitter / receiver / transceiver) for communicating with the simulated carrier jigs 510A, 510B or for communicating substantially directly with the controller 11091.

[0054] The removable module jig 600 includes any suitable on-board battery power source 735 configured to provide power to the sensors 750-752, memory 733, processor 734, and any other on-board electronics of the removable module jig (such as any suitable display 778 and / or tilt sensor 779). In one aspect, the display 778 is provided to present any suitable information to a user of the automated teaching apparatus 500. The display may provide suitable information including, but not limited to, one or more of remaining battery life and a power status (e.g., on / off) of the removable module jig 600. The tilt sensor 779 is provided to sense / detect tilt of a substrate seating surface of the substrate holding station and / or handoff of the removable module jig 600 from the end effector 502 to the substrate seating surface, as described herein, such as when the removable module jig 600 is placed in the substrate holding station.

[0055] 3, 6A-6E, 9A, and 10, an exemplary teaching method utilizing an automated teaching apparatus 500 is described, in which a controller 11091 moves a transport arm 11013TA to transport a frame 710, together with at least one movable imaging sensor 750-752, to a station teaching position relative to a station fixture (e.g., one or more of station fixtures 870, 11010, 11030), and detects at least one movable imaging sensor on an end effector 420A, 420B, 502. The method is configured to image at least one station target 871, 1120, 1201, 1202 having a predetermined pose relative to a predetermined holding station reference position 1199 using at least one movable imaging sensor 750-752 to resolve a station offset between the predetermined end effector reference position 479 and the predetermined holding station reference position 1199 based on the at least one station target 871, 1120, 1201, 1202 imaged by the at least one movable imaging sensor 750, 752. Although the method is described with respect to the mock carrier jig 510B, it should be understood that the method may be utilized with the mock carrier jig 510A in a manner generally similar to the methods described herein with respect to the mock carrier jig 510B. According to an aspect of the present disclosure, the mock carrier jig 510B is coupled to a load port module 11005 (FIG. 9, block 901). The coupling of the mock carrier jig 510B to the load port module 11005 may be performed in any suitable manner, such as manually or by suitable automation as described herein. The mock carrier jig 510B is coupled to the load port module such that it is kinematically positioned on the load port module 11005 and engaged with a BOLTS (Box Opener / Loader-Tool Standard as specified by SEMI Standards) interface in a manner similar to the coupling of the substrate cassette 11050 to the load port module 11005. The power connections 685 and communication connections 686 are manually coupled (or by automation as described herein) to the mock carrier jig 510B.

[0056] As can be understood, the components of the substrate processing apparatus have a baseline spatial relationship determined, for example, from a computer-aided drafting (CAD) model of the substrate processing apparatus. The controller 11091 commands the transport robot 11013 to traverse in one or more of the X, Y, R, θ, and Z directions to the baseline spatial position of the load port module 11005 whose position has been taught to the transport robot 11013. The transport robot 11013 is commanded to move relative to the load port module 11005 to position the target 800 within the field of view FOV, FOV1, or FOV2 of the vision system (see FIG. 10). In the example shown in the drawings, the forward-facing target 542 on the transport arm 11013TA is brought within the field of view FOV of the rear-facing sensor 581 (see FIGS. 6C and 10, where FIG. 10 generally represents an image frame captured by any one of the sensors described herein). The rear-facing sensor 581 may be referred to as a camera / sensor in the XZ or θ-Z plane. The forward-facing target 542 is sensed by a rearward-facing sensor (FIG. 9A, block 905), and the controller 11091 records the position of the sensed forward-facing target 542 based on the encoder data from the motor shaft of the transport robot 11013. The recorded position of the sensed forward-facing target 542 is or is used to determine a teaching point along the robot trajectory or path that the transport robot 11013 traverses (or transitions / moves along) to perform any suitable desired pick and place transfer operation. A teaching point is, for example, a position defined in the reference frame (i.e., the coordinate system of the motor shaft) of the transport robot 11013 that allows the transport robot 11013 to return to a predetermined position to perform a pick and place transfer operation. One or more teaching features / targets may be utilized / sensed to calculate the complex trajectory / path of the transport robot 11013 and navigate the transport robot 11013 around objects in the substrate processing apparatus.

[0057] As can be seen, each image frame acquired by rear-facing sensor 581 (see FIG. 10) uses detected target 542 to set a pixel-to-millimeter (or inch) scale factor, where target 542 (generally represented in FIG. 10 as target 800) has dimensions (e.g., millimeters and / or inches) known to controller 11091. The pixel size of rear-facing sensor 581 is also known to controller 11091, such that controller 11091 determines a relationship between the pixel size and the known dimensions of target 800 to determine the pixel-to-millimeter (or inch) scale factor to effect the teaching operations described herein.

[0058] Sensing the target 542 (generally illustrated as target 800 in FIG. 10) includes moving the transport robot 11013 to a baseline position of the load port module 11005 with the transport robot 11013 at a baseline height of the sensor 581 held on the load port module 11005 (wherein the sensor 581 has a predetermined spatial relationship to the kinematic positioning features of the mock carrier jig 510B to reliably identify the position of the load port module 11005 relative to the transport robot 11013). In one embodiment, the baseline position of the sensor 581 at the load port module is not the same as the actual position of the sensor 581 at the load port module 11005, where the target 800 (for illustrative purposes, referring here to the general target in FIG. 10) is offset in one or more of the Z and X directions from the center of the field of view (see fields of view FOV1, FOV2) (note that FIG. 10 is a general diagram representing the fields of view FOV, FOV1, FOV2 in the XZ (θ-Z), ZY (ZR), and XY (θ-R) planes). Based on the sensed image of the target 800, the controller 11091 determines the distance offset(s) ΔZ and / or ΔX (Δθ) of the target 800 from the center (see the centers of FOV1 and FOV2) in one or more of the Z and X (or θ) directions based on a pixel-to-millimeter (or inch) basis. The controller 11091 commands the transport robot 11013 to move to adjust the position of the target 800 so that the target 800 is located in the center of the field of view (see center FOV) to obtain an initial teaching position of the load port module 11005 relative to the transport robot 11013 in the X (or θ) and / or Z directions. The transport robot 11013 can be commanded to adjust the position of the target 800 any suitable number of times until the distance offset(s) ΔZ and / or ΔX (Δθ) are within a predetermined tolerance range.Here, the at least one taught position (here of the target 542) includes a series of a plurality of positions (e.g., two positions are illustrated in the drawings and described above, but as also described above, any suitable number of positions can be present), each of which is spaced apart from one another by a predetermined distance along the motion path MP (FIG. 10) of the (at least one) target 542 defined by the motion of the transport arm in at least one degree of freedom along which the transport arm 11013TA is moved. For example, in one or more embodiments, the predetermined distance is determined based on a resolved offset between the end effector reference position 479 (see FIG. 4A) and the load station reference position 11005L (or the station fixture reference position 1199 (see FIGS. 11 and 12B)). The predetermined distance, in one embodiment, is a resolved distance offset (or offsets) ΔZ and / or ΔX (Δθ), while in other embodiments, the predetermined distance is a preset amount of movement in one or more degrees of freedom. The (at least one) target 542 is imaged at each position in a sequence of positions, where the images of the (at least one) target 542 include a sequence of images of the (at least one) target 542 along a motion path MP, and the resolution of the offset (in this example the (one or more) distance offsets ΔZ and / or ΔX (Δθ)) is based on the sequence of images (see, e.g., the various fields of view in FIG. 10 ), where the determination of the offset is a heuristic / iterative approach, where each subsequent amount of movement is informed by the previously resolved distance offset.

[0059] The controller 11091 uses the initial X (or θ) and Z taught positions to instruct the transport robot 11013 to heuristically move (e.g., move using the self-taught initial X (or θ) and Z positions) at least in the Z direction to a position suitable for the end effector 420A to extend (for example) into the simulated carrier jig 510B, so that the target 540 placed on the end effector 420A is sensed by the vertical (in this example, downward) sensor 583 (which may be referred to as a camera / sensor in the XY or θ-R plane) (FIG. 9A, block 910). In a manner similar to that described above, each image frame acquired by the downward sensor 583 (see FIG. 10) uses the detected target 540 to set a pixel-to-millimeter (or inch) reference factor. Here, the target 540 (generally represented in FIG. 10 as target 800) has dimensions (e.g., millimeters and / or inches) known to the controller 11091. The pixel size of the downward sensor 583 is also known to the controller 11091 so that the controller 11091 determines the relationship between the pixel size and the known dimensions of the target 800 to determine a pixel to millimeter (or inch) scale factor to effect the teaching operations described herein.

[0060] Sensing the target 540 (generally illustrated as target 800 in FIG. 10) includes heuristically moving the transport robot 11013 (i.e., using knowledge of the (one or more) self-taught initial X (and / or Z) taught positions) to an initial X taught position of the load port module 11005 using the end effector 420A of the transport robot 11013 at a Z height (based on the initial Z taught position) that enables extension of the end effector to a baseline R or Y position of the sensor 583 held on the load port module 11005 (where the sensor 583 has a predetermined spatial relationship to the kinematic positioning features of the mock carrier jig 510B to reliably identify the position of the load port module 11005 relative to the transport robot 11013). In one embodiment, the baseline position of the sensor 583 at the load port module is not the same as the actual position of the sensor 583 at the load port module 11005, where the target 800 is offset in one or more of the R (or Y) and X (or θ) directions from the center of the field of view (see fields of view FOV1, FOV2) (note again that FIG. 10 is a general diagram representing the fields of view FOV, FOV1, FOV2 in the XZ (θ-Z), ZY (ZR), and XY (θ-R) planes). Based on the sensed image of the target 800, the controller 11091 determines the distance offset(s) ΔR (or ΔY) and / or ΔX (Δθ) of the target 800 from the center (see the center of FOV1 and FOV2) in one or more of the Z and X (or θ) directions based on a pixel to millimeter (or inch) basis. It should be understood that any distance offset in the X (or θ) direction is used to confirm or further reconstruct the initial X teaching position.

[0061] The controller 11091 commands the transport robot 11013 to move to adjust the position of the target 800 so that the target 800 is located at the center of the field of view (see center FOV) to obtain the initial teaching position of the transport robot 11013 in the R (or Y) direction and / or to confirm the X teaching position. The transport robot 11013 can be commanded to adjust the position of the target 800 any suitable number of times until the distance offset (one or more) ΔR (ΔY) and / or ΔX (Δθ) is within a predetermined tolerance range. Here, in a manner similar to that described above, at least one teaching position (here of the target 540) includes a series of multiple positions (e.g., two positions are illustrated in the drawings and described above, but as also described above, there can be any suitable number of positions), each position being spaced apart from each other by a predetermined distance along the motion path MP (FIG. 10) of the (at least one) target 540 defined by the movement of the transport arm in at least one degree of freedom in which the transport arm 11013TA is moved. For example, the predetermined distance is in one embodiment the resolved distance offset(s) ΔR(ΔY) and / or ΔX(Δθ), while in other embodiments the predetermined distance is the current amount of movement in one or more degrees of freedom. The (at least one) target 540 is imaged at each position in a series of positions, where the images of the (at least one) target 540 include a series of images of the (at least one) target 540 along the motion path MP, and the resolution of the offset (in this example the (at least one) distance offset ΔR(ΔY) and / or ΔX(Δθ)) is based on the series of images (see, e.g., various fields of view in FIG. 10 ). Here, as above, the determination of the offset is a heuristic / iterative approach, where each subsequent amount of movement is informed by the previously resolved distance offset.

[0062] At this point in the teaching process, the X(θ) position of the load port module 11005 is confirmed, and the R(Y) and Z positions of the load port module 11005 are initially taught but not confirmed. The controller 11091 uses the confirmed X(or θ) position and the initially taught R(y) and Z taught positions to instruct the transport robot 11013 to heuristically move (e.g., move using the self-taught confirmed X(or θ) position and the initially taught R(or Y) and Z positions) to a position suitable for the end effector 420A to extend (for example) into the mock carrier jig 510B, so that the target 541 located on the end effector 420A is sensed by the vertical orientation sensor 582 (which may be referred to as a camera / sensor in the XY or RZ plane) (FIG. 9A, block 915). Here, the target may be generally similar to target 800, but in other embodiments may be a slot or recess of known dimensions formed into the edge of the end effector 420A itself.

[0063] In a manner similar to that described above, each image frame captured by the portrait sensor 582 (see FIG. 10) uses the detected target 541 to set a pixel-to-millimeter (or inch) scale factor, where the target 541 (generally represented in FIG. 10 as target 800) has dimensions (e.g., millimeters and / or inches) known to the controller 11091. The pixel size of the portrait sensor 582 is also known to the controller 11091, such that the controller 11091 determines a relationship between the pixel size and the known dimensions of the target 800 to determine the pixel-to-millimeter (or inch) scale factor to effect the teaching operations described herein.

[0064] Sensing the target 541 (generally illustrated as target 800 in FIG. 10) includes heuristically moving the transport robot 11013 to a confirmed X taught position of the load port module 11005 using the end effector 420A of the transport robot 11013 extended to an initially taught R position at an initially taught Z position of the sensor 581 held by the load port module 11005 (i.e., moving using knowledge of the self-taught confirmed X (or θ) position, initially taught R (or Y) position, and initially taught Z position) (where the sensor 581 has a predetermined spatial relationship to the kinematic positioning features of the simulated carrier jig 510B to reliably identify the position of the load port module 11005 relative to the transport robot 11013). In one embodiment, the baseline position of sensor 582 at load port module 11005 (which in one or more embodiments is located at the same height as simulated workpiece holding slot number 13 of a 25-substrate cassette as described herein) is not the same as the actual position of sensor 581 at load port module 11005, where target 800 is offset in one or more of the R (or Y) and Z directions from the center of the field of view (see fields of view FOV1, FOV2) (note again that FIG. 10 is a general diagram representing fields of view FOV, FOV1, FOV2 in the XZ (θ-Z) plane, ZY (ZR) plane, and XY (θ-R) plane).

[0065] Based on the sensed image of target 800, controller 11091 determines a distance offset(s) ΔR (or ΔY) and / or ΔZ of target 800 from the center (referring to the centers of FOV1 and FOV2) in one or more of the Z and R (or Y) directions based on a pixel to millimeter (or inch) basis. It should be understood that any distance offset in the R (or Y) direction may be used to confirm or further reconstruct the initial Y teach position. In one or more embodiments, the controller 11091 calculates the distance from the top of the end effector 420A (i.e., in the Z direction) to the projected substrate surface 678 of the slot 14 (the substrate surface of the slot 14 corresponds to the 25 substrate holding cassette), the distance from the center of the end effector 420A (i.e., in the Z direction) to the projected center line 679 of the slot 13, and the distance between the bottom of the end effector 420A (i.e., in the Z direction) and the projected substrate surface 678 of the slot 13 based on the Z offset(s) described above. The controller 11091 commands the transport robot 11013 to move to adjust the position of the target 800 so that the target 800 is located at the center of the field of view (see center FOV) to confirm the initial teaching position of the transport robot 11013 in the R (or Y) and Z directions. The transfer robot 11013 may be instructed to adjust the position of the target 800 any suitable number of times until the distance offset(s) ΔR (ΔY) and / or ΔZ are within a predetermined tolerance. In other embodiments, the Z height of the load port module is determined with a through beam sensor (although R or Y may not be ascertainable with a through beam sensor). In one or more embodiments, the movement / stroke of the end effector 420A in the Z direction is verified by moving the end effector 420A a predetermined distance in the negative Z direction (e.g., downward) and verifying that the predetermined distance has been moved using the lateral sensor 582, and moving the end effector 420A a predetermined distance in the positive Z direction (e.g., upward) and verifying that the predetermined distance has been moved using the lateral sensor 582.Here, in a manner similar to that described above, at least one taught position (here of target 541) includes a series of a plurality of positions (e.g., two positions are illustrated in the drawings and described above, but as also described above, any suitable number of positions can be present), each spaced apart from one another by a predetermined distance along a motion path MP (FIG. 10) of the (at least one) target 541 defined by the movement of the transport arm 11013TA in at least one degree of freedom along which the transport arm is moved. For example, the predetermined distance in one aspect is the resolved distance offset(s) ΔR (ΔY) and / or ΔZ, while in other aspects the predetermined distance is the current amount of movement in one or more degrees of freedom. The (at least one) target 541 is imaged at each position in a sequence of positions, where the images of the (at least one) target 541 include a sequence of images of the (at least one) target 541 along a motion path MP, and the resolution of the offset (in this example the distance offset(s) ΔR(ΔY) and / or ΔZ) is based on the sequence of images (see, e.g., the various fields of view in FIG. 10 ), where, as above, the determination of the offset is a heuristic / iterative approach, where each subsequent amount of movement is informed by the previously resolved distance offset.

[0066] In one or more embodiments, the R of the load port module 11005 X(またはθ) , R y(またはR) , R Z The pitch of one or more of the targets 540-542 is determined and / or confirmed by sensing the respective targets 540-542 with the respective sensors 581-583. For example, the lateral sensor 582 images the top and / or bottom of the end effector 420A (e.g., from the side). As described above, the lateral sensor 582 has a known spatial relationship to the kinematic coupling features of the mock carrier jig 510B (and thus to the load port module 11005 on which the mock carrier jig 510B sits). Here, any tilt of the end effector 540A within the fields of view FOV, FOV1, FOV2 (see FIG. 6E) will determine the pitch R of the load port module 11005.X(またはθ) Similarly, since the target 800 has known dimensions and a known spatial relationship to the transport robot 11013, any perceived distortion of the target 800 by the sensors 581-583 corresponds to and determines R X(またはθ) , R y(またはR) , R Z For example, referring to Figures 7A and 7B, Figure 7A is rotated around the Z axis (i.e., R Z 7 illustrates a rotation at 100° rotation (rotation at 100° rotation) target 800, where distances 811′, 822′, 823′, 813′, 822″, 823″ are compared by a controller 11091 to distances 811, 822, 823, 813 (see FIG. 7) to determine the rotation at 100° rotation (rotation at 100° rotation) target 800 for a transport robot 11013. Z Similarly, FIG. 7B is rotated about the X-axis or Y-axis (i.e., R X or R Y 7 illustrates a rotation at 800 target, where distances 810′, 820′, 821′, 812′, 820″, 821″ are compared by a controller 11091 to distances 810, 820, 821, 812 (see FIG. 7) to determine the rotation at 800 for a transport robot 11013. X or R Y In yet another embodiment, the mock carrier jig 510B includes an inclinometer (or tilt sensor) 681 for determining the inclination of the mock carrier jig 510B (and thus the load port module 11005 on which the mock carrier jig 510B sits) relative to the transport robot 11013.

[0067] 6F, in some embodiments, the method includes verifying the verified X (or θ), R (or Y), and Z taught positions of the load port module 11005 (FIG. 9A, block 920) using any suitable verification substrate 699 (see FIG. 6F). For example, the verification substrate 699 is held in the simulated workpiece holding slot 611 (i.e., corresponding to simulated workpiece holding slot 1 of the 25 substrate holding cassette). The verification substrate 699 is removed from the simulated workpiece holding slot 611 by the end effector 420A of the transport robot 11013 and placed in the simulated workpiece holding slot 612 (i.e., corresponding to simulated workpiece holding slot 25 of the 25 substrate holding cassette). The targets 698 on the verification substrate 699 are sensed by the substrate placement verification sensor 683 (FIG. 6B) to verify the placement position of the verification substrate 699 in the simulated workpiece holding slot 612 in the manner described above. The verification substrate 699 is removed from the simulated workpiece holding slot 612 by the end effector 420A of the transfer robot 11013 and returned to the simulated workpiece holding slot 611 (i.e., corresponding to the simulated workpiece holding slot 1 of the 25 substrate holding cassette). The targets 698 on the verification substrate 699 are sensed by the substrate placement verification sensor 682 (FIG. 6B) to verify the placement position of the verification substrate 699 in the simulated workpiece holding slot 611 in the manner described above. As can be appreciated, the taught position of the load port module 11005 relative to the transfer robot 11013 can be further reconfigured / adjusted based on the sensed / detected position of the targets 698 of the verification substrates placed in the holding slots 611, 612.

[0068] The above load port module teaching method is repeated as necessary for other load port modules of the substrate processing apparatus, and is also repeated as necessary for other end effectors (such as the end effector 420B) of the transport robot 11013.

[0069] 3, 8A-8F, 9B, 10, 11, 12A, 12B, the location of any suitable substrate holding station / station fixture is taught to the transport robot 11013 using the removable module jig 600, either in accordance with teaching the load port module 11005 to the transport robot 11013 or independent of teaching the load port module 11005 to the transport robot 11013. For illustrative purposes only, the station fixture 870 is a substrate aligner, but aspects of the present disclosure may be equally applicable to any suitable station fixture. The removable module jig 600 is picked from the mock carrier jig using, for example, the end effector 420A of the transport robot 11013 (FIG. 9B, block 930). The controller 11091 commands the transport robot 11013 to transport the removable module jig to the station fixture 870 for sensing the target 871 on the station fixture using a forward-facing sensor 751, which may be referred to as a camera / sensor in the XZ or θ-Z plane (FIG. 9, block 935).

[0070] It is noted that the station fixture 870, 11010, 11030 has an opening 888 in a front wall of the station fixture 870, 11010, 11030 through which the end effector 420A, 420B, 502 is positioned to enter the station fixture through the front wall, and the field of view FOV of the at least one movable imaging sensor 750-752 faces the opening 888 in the front wall of the station fixture 870, 11010, 11030. In one or more embodiments, at least one station target (e.g., station target 871, 1201) is positioned facing the front wall and opening 888 upon approach of the movable transport arm 11013TA to the station fixture along a path of motion that extends through the opening 888. As described herein, at least one movable imaging sensor 750-752 (such as sensor 751) is positioned to image at least one station target (such as station target 871, 1201) in a direction extending through an opening 888 in the station fixture 870, 11010, 11030 such that the resolved offset frees extension of the end effector 420A, 420B, 502 through the opening 888 into the station fixture 870, 11010, 11030 (e.g., positions the end effector to pass through the opening 888). At least one movable imaging sensor 750-752 (such as sensor 751) is positioned to image at least one station target (such as station targets 870, 1201) in a direction extending through the opening 888 of the station fixture such that the controller 11091 confirms unobstructed arm extension of the end effectors 420A, 420B, 502 into the station fixture based on the resolved offset.As can be understood, the resolved offset operates to align at least one station target (such as targets 871, 1201) to another incremental teaching position based on an image of at least one station target image in a direction extending through opening 888 (as described below with respect to targets 1120, 1202), whereby the offset resolution incrementally resolves the resolved offset based on an image of at least one station target (such as targets 1120, 1202) in a direction intersecting the direction extending through opening 888.

[0071] Here, the target 871 is positioned in the XZ or θ-Z plane and is utilized to obtain an initial position of the station fixture 870 in the X (or θ) and Z directions in a manner generally similar to that described above with respect to the target 542 and the rear-facing sensor 581 of the simulated cassette jig 510B. For example, the controller 11091 commands the transfer robot 11013 to traverse one or more of the X, Y, R, θ, and Z directions to position the removable module jig 600 relative to a baseline spatial position of the station fixture 870 whose position has been taught to the transfer robot 11013. The transfer robot 11013 is commanded to move relative to the station fixture 870 to position the target 871 within the field of view FOV, FOV1, or FOV2 of the vision system (see FIG. 10). In the example shown in the drawings, a rear-facing target 871 on the station fixture 570 is brought within the field of view FOV of the forward-facing sensor 751 (see FIGS. 8A, 8B, 8D, and 10, noting again that FIG. 10 generally represents an image frame captured by any one of the sensors described herein). The rear-facing target 871 is sensed by the forward-facing sensor 751, and the controller 11091 records the position of the sensed rear-facing target 871 based on encoder data from the motor shafts of the transport robot 11013. The recorded position of the sensed rear-facing target 871 is, or is used to determine, a taught point along a robot trajectory or path that the transport robot 11013 traverses (or transitions / moves along) to perform any suitable desired pick and place transfer operation, as described above.

[0072] In a manner similar to that described above, each image frame acquired by the forward-looking sensor 751 (see FIG. 10) establishes a pixel-to-millimeter (or inch) reference coefficient using a detected target 871 in a manner generally similar to that described above. Sensing the target 871 (illustrated generally as target 800 in FIG. 10) includes moving the transfer robot 11013 to a baseline position of the station fixture 870 with the forward-looking sensor 751 held by the transfer robot 11013 at a baseline height of the target 871 positioned on the station fixture 870 (where the target 871 has a predetermined spatial relationship to a substrate-holding feature of the station fixture 870 (e.g., a passive or active grip of the rotatable chuck 1121) to positively identify the substrate-holding position of the station fixture 870 relative to the transfer robot 11013). In one embodiment, the baseline position of the target 871 at the load port module is not the same as the actual position of the target 871 at the station fixture, where the target 800 (for illustrative purposes, referring here to the general target in FIG. 10) is offset in one or more of the Z and X directions from the center of the field of view (see fields of view FOV1, FOV2). Based on the sensed image of the target 800, the controller 11091 determines the distance offset(s) ΔZ and / or ΔX (Δθ) of the target 800 from the center (see the center of FOV1 and FOV2) in one or more of the Z and X (or θ) directions based on a pixel to millimeter (or inch) basis. The controller 11091 commands the transfer robot 11013 to move to adjust the position of the end effector 420A so that the target 800 is located in the center of the field of view (see center FOV) to obtain an initial taught position of the station fixture 870 relative to the transfer robot 11013 in the X (or θ) and / or Z directions. The transport robot 11013 may be instructed to adjust the position of the target 800 any suitable number of times until the distance offset(s) ΔZ and / or ΔX (Δθ) are within a predetermined tolerance.In one or more embodiments, the Z position of the transport robot 11013 is established by teaching the load port module 11005, where both the Z position of the station fixture 870 and the established Z position of the transport robot 11013 are known relative to the substrate transport plane of the substrate transport apparatus such that further teaching of the Z position of the station fixture 870 may not be desired. Here, the at least one taught position includes a series of taught positions, each taught position being spaced apart from one another by a predetermined distance along a motion path MP1 (FIG. 8D) of at least one station target 871 (as seen in the field of view FOV, e.g., at least one station target moves across the field of view as the movable transport arm 11013TA moves along the motion path MP1) defined by the motion of the movable transport arm 11013TA (e.g., relative to the station fixture 870) in at least one degree of freedom. The predetermined distance is determined based on a resolved offset between the predetermined end effector reference position 479 and the predetermined holding station reference position 1199. At least one station target 871 is imaged at each teaching position of the series of teaching positions, where the images of the at least one station target 871 include a series of images of the at least one station target 871 along the motion path MP1 (see FIG. 10), where offset resolution is based on the series of images.

[0073] The controller 11091 instructs the transport robot 11013 using the initial X (or θ) and Z taught positions to heuristically move (e.g., move using a self-taught initial X (or θ) and Z position) in at least the Z direction to a position suitable for the end effector 420A to extend into a substrate holding position (e.g., the rotatable chuck 1121) of the station fixture 870 (for example) so that the target 1120 positioned on the rotatable chuck 1121 is sensed by the edge sensor 750 (which may be referred to as a camera / sensor in the XY or θ-R plane) (FIG. 9B, block 940). Here, at least one movable imaging sensor 750-752 is positioned to image at least one station target (such as station target 1120, 1202) in a transverse direction extending at a transverse angle to an extension path of end effector 420A, 420B, 502 extending through opening 888 of station fixture 870, 11010, 11030 into station fixture 870, 11010, 11030. For example, target 1120 is positioned on the rotatable chuck at a predetermined holding station fixture reference position 1199 such that target 1120 (and station fixture reference position 1199) has a predetermined spatial relationship with substrate holding features (passive or active grips) 1100-1102 of rotatable chuck 1121. In a manner similar to that described above, each image frame captured by edge sensor 750 (see FIG. 10) uses a detected target 1120 to set a pixel-to-millimeter (or inch) scale factor, where target 1120 (generally represented in FIG. 10 as target 800) has dimensions (e.g., millimeters and / or inches) known to controller 11091. The pixel size of downward sensor 583 is also known to controller 11091, such that controller 11091 determines a relationship between the pixel size and the known dimensions of target 800 to determine the pixel-to-millimeter (or inch) scale factor to effect the teaching operations described herein.

[0074] Sensing the target 1120 (generally illustrated as target 800 in FIG. 10) includes heuristically moving (i.e., using knowledge of the self-taught initial X and Z taught positions) the transport robot 11013 to an initial X taught position of the load port module 11005 using the end effector 420A of the transport robot 11013 at a Z height (based on the initial Z taught position) that enables extension of the end effector to a baseline R or Y position of the target 1120 on the rotatable chuck 1121 (where the target 1120 has a predetermined spatial relationship to the kinematic positioning features of the rotatable chuck 1121 to reliably identify the position of the station fixture 870 relative to the transport robot 11013). In one embodiment, the baseline position of the target 1120 at the station fixture 870 is not the same as the actual position of the target 1120 at the station fixture 870, where the target 1120 is offset in one or more of the R (or Y) and X (or θ) directions from the center of the field of view (see fields of view FOV1, FOV2). Based on the sensed image of the target 1120, the controller 11091 determines the distance offset(s) ΔR (or ΔY) and / or ΔX (Δθ) of the target 1120 from the center (see centers of FOV1 and FOV2) in one or more of the Z and X (or θ) directions based on a pixel to millimeter (or inch) basis. It should be understood that any distance offset in the X (or θ) direction is used to confirm or further reconstruct the initial X taught position. The controller 11091 commands the transport robot 11013 to move to adjust the position of the end effector 420A so that the target 1120 is located in the center of the field of view (see center FOV) to obtain an initial taught position of the station fixture 870 relative to the transport robot 11013 in the R (or Y) direction and / or to confirm the X taught position. The transport robot 11013 may be commanded to adjust the position of the target 800 any suitable number of times until the distance offset(s) ΔR (ΔY) and / or ΔX (Δθ) are within a predetermined tolerance.As can be seen, the target 1120 is positioned by the rotating chuck 1121 in a predetermined rotational orientation (eg, in the home position of the rotating chuck 1121) to perform an automatic station fixture position teaching procedure.

[0075] At this point in the teaching process, the X(θ) position of the station fixture 870 and the Z position of the station fixture 870 are confirmed, and the R(Y) position of the station fixture 870 is initially taught but not confirmed. The controller 11091 uses the confirmed X(or θ) and Z positions and the initially taught R(or Y) position to command the transfer robot 11013 to heuristically move (e.g., move using the self-taught confirmed X(or θ) and Z positions and the initially taught R(or Y) position) to a position suitable for the end effector 420A to (for example) extend into the station fixture 870 such that the central sensor 752 of the removable module jig 600 is positioned to sense the target 1120 (FIG. 9A, block 945). The controller 11091 determines the distance offset(s) ΔR (or ΔY) and / or ΔX (Δθ) of the target 1120 from the center (referring to the centers of FOV1 and FOV2) in one or more of the R (or Y) and X (or θ) directions on a pixel to millimeter (or inch) basis in a manner generally similar to that described above. It should be understood that any distance offset in the R (or Y) and / or X (or θ) directions may be used to confirm or further reconstruct the initial R (or Y) position and / or to further reconstruct the confirmed X (or θ) taught position.

[0076] The controller 11091 uses the confirmed X (or θ) and Z positions and the confirmed R (or Y) positions to command the transfer robot 11013 to heuristically move (e.g., move using the self-taught confirmed X (or θ), R (or Y), and Z positions) to a position suitable for the end effector 420A to extend (for example) into the station fixture 870 so that the removable module jig 600 can be placed on the rotatable chuck 1121 where the tilt sensor 779 of the removable module jig 600 senses a handoff of the removable module jig 600 from the end effector 420A to the rotatable chuck 1121 (FIG. 9B, block 950). The relative tilt (R) between the end effector 420A and the substrate holding station (e.g., rotatable chuck 1121) of the station fixture 870 is used to teach the tilt of the station fixture 870. X(またはθ) , R y(またはR) ) is transmitted from the tilt sensor 799 to the controller 11091. Z The rotation of the station fixture 870 about the target 1120 is determined from the vision system as described above using the perceived distortion of the targets 871, 1120 and / or the rotational deviation of the target 1120, from the expected rotational orientation of the target 1120, or in any other suitable manner. In other embodiments, the verification substrate 699 may be transferred from the simulated carrier jig 510A, 510B by the transfer robot 11013 and placed in the station fixture. The transfer robot 11013 may then pick the removable module jig 600 from the simulated carrier jig 510A, 510B to image the verification substrate 699 seated in the station fixture and determine the tilt of the station fixture via image analysis of at least one image of the verification substrate 699 seated in the station fixture.

[0077] 12A and 12B illustrate an exemplary processing module 11030 (or vacuum load lock 11010) having a target 1201 (similar to target 871) and a target 1202 (similar to target 1120), where target 1202 is positioned in a predetermined holding station reference position 1299 such that target 1202 (and station reference position 1299) has a predetermined spatial relationship with a substrate holding feature (e.g., pins 1260-1262, although in other embodiments any suitable holding feature such as a slot may be utilized) of processing module 11030 (or vacuum load lock 11010). The position of the processing module 11030 (or vacuum load lock 11010) is taught using the removable module jig 600 in a manner generally similar to that described above with respect to the station fixture 870, it being noted that the target 1202 has a known spatial relationship with the substrate holding features 1260-1262 of the processing module 11030 (or vacuum load lock 11010).

[0078] In embodiments described herein, the controller 11091 commands the transport robot 11013 to return the removable module jig 600 to the simulated carrier jig 510A, 510B after sensing each target 871, 1120 such that sensor data is transmitted from the removable module jig 600 to the controller 11091 via infrared communication as described herein. In other embodiments, the removable module jig 600 does not need to be returned to the simulated carrier jig 510A, 510B after sensing each target 871, 1120, such as when radio frequency communication is used between the removable module jig 600 and the controller 11091 and / or the simulated carrier jig 510A, 510B.

[0079] The accuracy of the taught positions acquired by the automatic teaching device 500 described herein can be made as desired by increasing or decreasing the resolution of the vision systems 530A, 530B. The more the resolution of the vision systems 530A, 530B is increased and the image processing algorithms are adjusted, the smaller the tolerance in determining the taught positions. The taught positions are stored in any suitable database accessible (or included) by the controller 11091 and accessed by the controller 11091 to command the picking and placing operations of the transport robot. As can be understood, the taught positions can be the start or end points of the robot trajectory or waypoints within the trajectory (wherein the waypoints are introduced to route the end effector around obstacles or for other suitable reasons). As seen above, the inclinometer sensors of the mock carrier jig 510A, 510B and the removable module jig 600 provide automatic confirmation of planarity between the components of the substrate processing device.

[0080] 13-16, another exemplary removable module jig 1300 is illustrated. The removable module jig 1300 may be generally similar to the removable module jig 600 described above, but in this embodiment, the removable module jig includes a vision system 1301 and any suitable motion sensor system 1310. Here, the vision system 1301 includes forward-facing sensors 1302, 1303 and a downward-facing sensor 1304 (generally similar to sensors 571-574 and 581-583 described above). The downward-facing sensor 1304 may be disposed on the frame 710 at a location similar to that of sensor 752. The sensor 1302 is disposed at or adjacent to the leading edge of the frame 710, while the sensor 1303 is disposed at or adjacent to the trailing edge of the frame 710. The motion sensor system 1310 includes any suitable motion sensors configured to determine one or more of vibration, acceleration, and angular momentum of the removable module jig 1300 (and the object on which the removable module jig 1300 sits, such as an end effector or station fixture). The operation of the removable module jig 1300 is generally similar to the removable module jig 600 described above, where a sensor 1302 at the leading edge of the frame 710 is utilized to orient the transport robot 11013 to a taught position in at least the XZ or θ-Z plane (see FIG. 14), and a sensor 1304 orients the transport robot 11013 to a taught position in the XY or θ-R plane (see FIG. 15), but in this embodiment, a sensor 1303 at the trailing edge of the frame 710 provides confirmation of placement of the removable module jig 1300 on the station fixture (illustrated as processing module 11030 (see FIG. 16)) via a comparison (e.g., by controller 11091) of the structure of the removable module jig 1300 with the structure of the station fixture. Once the removable module jig 1300 is transported and placed at the teach position, the motion sensor system 1310 provides corroborative feedback of motion data (eg, vibration, acceleration, and angular momentum) to the controller 11091 for movement of the transport robot 11013.

[0081] In one or more embodiments of the present disclosure, the mock carrier jigs 510A, 510B are configured as drop-in modules that are inserted into and removed from a load lock of a substrate processing apparatus. A suitable example of a drop-in module can be found in U.S. Patent Application No. 16 / 899,151, entitled "Substrate Process Apparatus," filed June 11, 2020, the entire disclosure of which is incorporated herein by reference. Here, the mock carrier jigs 510A, 510B are configured as drop-in modules such that the position of the load lock is automatically taught to a vacuum substrate transport apparatus disposed in a vacuum section of the substrate processing apparatus (as described herein) in a manner substantially similar to that described above. Also, the mock carrier jigs 510A, 510B are configured as drop-in modules such that the position of a process module coupled to the vacuum section is automatically taught to a vacuum substrate transport apparatus in a manner substantially similar to that described above.

[0082] In the embodiments of the disclosure described herein, one target is illustrated in each of the XY (or θ-R), XZ (or θ-Z), and Y (or R)-Z planes for each transport arm 11013TA and each station fixture, however, in other embodiments, any suitable number of targets are provided in one or more of the XY (or θ-R), XZ (or θ-Z), and Y (or R)-Z planes, where multiple targets in each plane are used to corroborate the positions of previously sensed targets and increase the accuracy of the auto-teaching process.

[0083] 17A-19E, according to one or more embodiments of the present disclosure, a vision system, such as vision system 530A (see FIG. 5A), 530B (see FIG. 5B), includes at least one distance measuring sensor 1700. Although distance measuring sensor 1700 is described with respect to vision system 530A, it should be understood that at least one distance measuring sensor 1700 and additional imaging sensor(s) can be mounted to transport arm 11013TA for utilization with vision system 530B, such that the additional imaging sensor and distance measuring sensor 1700 form part of vision system 530B. In yet other embodiments, at least one distance measuring sensor is mounted to frame 710 of removable module jig 600 to be carried and transported by end effectors 420A, 420B, 502 holding frame 710. At least one distance measuring sensor 1700 senses distance in a distance sensing direction 1777 substantially aligned with the field of view FOV of at least one movable imaging sensor 571-574, 750-752 such that the field of view FOV and the distance sensing direction are substantially collimated with respect to one another (see FIGS. 17A-19E), where in one or more embodiments the field of view FOV and the distance sensing direction 1777 are substantially collimated with respect to one another to see and sense in a vertical plane VP (FIGS. 18A, 18B) in front of the end effector 420A, 420B, 502. In one or more embodiments, the field of view FOV' and distance sensing direction 1777' (see FIG. 19D) are substantially collimated with respect to one another and view and sense in a direction tangent to the arm motion path that extends the movable transport arm along the workpiece transport path from the load port module 11005 toward the station fixtures 870, 11010, 11030 (e.g., see FIG. 19D where the tangent direction is the X direction).

[0084] In one embodiment, the distance measurement sensor 1700 is integral with at least one of the sensors 571, 572, 751, such as when at least one of the sensors 571, 572, 751 is a time-of-flight camera, while in other embodiments the distance measurement sensor 1700 is separate from the sensors 571, 572, 751 and includes any suitable laser and / or ultrasonic (sound wave) ranging system, or any other suitable ranging system, including but not limited to ultrasonic sensors, infrared sensors, time-of-flight sensors, and LIDAR sensors. The distance measurement sensor 1700 is utilized to establish the location of at least the station fixtures 870, 11010, 11030 at the time of locating the station fixtures 870, 11010, 11030. The distance measurement sensor 1700 is also utilized in one or more embodiments to account for obstacles in the trajectory / path planning of the transport arm 11013TA so that the transport arm 11013TA can move around any obstacles in the transport robot workspace. This embodiment of the disclosure provides feedback to the controller 11091 and / or an operator of the substrate processing equipment regarding the transport robot workspace and any transport robot 11013 movements and / or transport robot 11013 commands therein.

[0085] In this embodiment, the vision system 530B having the distance measuring sensor 1700 (only a portion of which is illustrated in FIGS. 17A-19E) forms a wayfinding system 1710 that can be used in combination with the sensor-target pairs described above or independently of the sensor-target pairs. The wayfinding system 1710 is configured to guide the transport robot 11013 from one teaching position to another teaching position within the transport robot workspace using the controller 11091. As illustrated in FIGS. 17A-18B, the distance measuring sensor 1700 is paired with one or more of the forward-facing sensors 571, 572, while in other embodiments, the distance measuring sensor 1700 (there may be more than one) is paired with one or more of the imaging sensors 571-574, 750-752 to provide sensor feedback in one or more of the ZX (or θ) plane, the R (or Y)-X (or θ) plane, and the ZY (or R) plane. The wayfinding system 1710 can be mounted to the transport robot 11013 and / or the removable module jig 600 in any suitable location. For example, as illustrated in FIG. 18A, the wayfinding system 1710 is mounted to the transport arm 11013TA in any suitable manner so as to face forward (e.g., along the extension axis of the transport arm 11013TA), while in other embodiments the wayfinding system 1710 is mounted to the Z drive column 380 in any suitable manner so as to face forward (e.g., along the extension axis Y or R of the transport arm 11013TA). As mentioned above, in other embodiments, additional distance measuring devices and imaging sensor pairs / pairs can be provided along other axes of motion of the transport robot 11013.

[0086] In one aspect, the controller 11091 provides for operator selection of one or more regions of interest 1800 (e.g., within the field of view FOV) of the wayfinding system 1710. The regions of interest 1800 may be selected in any suitable manner, for example, to correspond to an area of ​​the field of view FOV that is not obstructed by the transport arm 11013TA, a Z height that corresponds to a slot valve of a processing station to which the end effector extends, etc. Selection of the regions of interest may also reduce image processing time.

[0087] 20, the controller 11091 is communicatively connected to at least one distance measurement sensor 1700 and configured to detect an opening 888 in the station fixture 870, 11010, 11030 with the movable transport arm 11013TA in motion via distance measurements from the at least one distance measurement sensor 1700 to enable controller movement of the end effector 420A, 420B, 502 to a station taught position relative to the opening 888 or to detect an obstacle in the motion path of the end effector 420A, 420B, 502. In operation, the transport robot 11013 is informed of the baseline positions of features / components of the substrate processing apparatus (e.g., stored in a memory 1915 of or accessible by the controller 11091 and obtained from a CAD model(s) of the substrate processing system). The controller 11091 commands the movement of the transport robot 11013 within the transport robot workspace 1900 (FIG. 20, block 2000) such that the transport robot 11013 scans the transport robot workspace 1900 using the wayfinding system 1710 to create a map 1910 (FIG. 19A) of the transport robot workspace 1900. Any suitable image recognition algorithm(s) are then utilized by the controller 11091 to determine the spatial positions of processing equipment features / components (such as the load port module 11005, the vacuum load lock 11010, and the process module 11030) relative to the encoder (e.g., see FIG. 3) positions of the drives 367, 362, 380D, 425 of the transport robot 11013. In one embodiment, the station fixtures 870, 11010, 11030 and / or the load port modules 11005 are verified by a scan of the transport robot workspace 1900 (FIG. 20, block 2010).A map 1910 of the spatial location of each processing device feature / component is stored in a memory 1915 of or accessible to the controller 11091, where the map 1910 can be retrieved by the controller 11091, such as when the controller 11091 issues a movement command to the transport robot 11013 (e.g., for path / trajectory planning). The accuracy of the map 1910 can be increased as desired by increasing the resolution and calibration of the distance measuring sensor 1700, where the more the resolution of the wayfinding system 1710 is increased, the smaller the margin of error in calculating the map 1910.

[0088] In one or more embodiments, the map 1910 is used to at least partially teach the location of processing equipment features / components to the transport robot 11013. For example, the transport robot 11013 is instructed by the controller 11091 to move to a baseline location (as described herein) or a mapped location (as included in the map 1910) of a desired processing equipment feature / component, such as a station fixture (vacuum load lock) 11010 illustrated in FIG. 19A, to establish the location of the station fixture 11010 relative to the baseline location of the station fixture 11010 and / or the location of the station fixture 11010 in the map 1910 ( FIG. 20 , block 2020). If the commanded position of the transfer robot 11013 does not correspond to the actual position of the station fixture 11010, as determined by information from the wayfinding system 1710, the controller commands movement of the transfer robot 11013 such that the wayfinding system 1710 scans the transfer robot workspace 11010 in the vicinity of the commanded position to detect the actual position of the station fixture. Information from the wayfinding system 1710 is, in one or more embodiments, processed by the controller 11091 in substantially real-time (e.g., processed in 30 milliseconds or less). For example, with reference to FIGS. 19A and 19B, the controller 11091 commands the transfer robot 11013 to move in the X direction to scan for an opening (or door / slit valve) 888 of the station fixture 11010 that may be partially detected within the field of view of the wayfinding system 1710 at the commanded position (see FIG. 19A) (and may be identified as a "potential station" in FIG. 19A). The transport robot 11013 moves in the X direction until the opening 888 of the station fixture 11010 is substantially within the field of view FOV (or target area 1800) as shown in FIG. 19B in the X direction to provide updated (corrected) X position information of the station fixture 11010.The transfer robot 11013 is also commanded in the Z direction such that the opening 888 of the station fixture 11010 in the Z direction is within the field of view FOV (or region of interest 1800) to provide updated (corrected) Z position information of the station fixture 11010 (see FIGS. 19C and 19D). The corrected X and Z positions are used by the controller 11091 to update the map 1910.

[0089] In one or more embodiments, one or more of the mock carrier jigs 510A, 510B and the removable module jig 600 are utilized to utilize the mapped positions of the station fixtures 11010 to further teach the positions of the station fixtures 11010 to the transport robot 11013 and to further reconfigure the map 1910. In this example, the mock carrier jigs 510A, 510B are utilized with one or more load port modules 11005 to reconfigure the mapped positions of the respective load ports in a manner generally similar to the methods described herein (see at least FIG. 9A) (FIG. 20, block 2030). The removable module jig 600 is removed from the mock carrier jigs 510A, 510B and utilized to further reconfigure the mapped positions of the station fixtures 11010 (or any other station fixture of the substrate processing tool) in a manner generally similar to the methods described herein (see at least FIG. 9B) (FIG. 20, block 2030).

[0090] As seen in FIGS. 19A-19E, the wayfinding system 1710 provides real-time sensor feedback for the movement of the transfer robot 11013, such as when the transfer robot 11013 picks and places substrates to / from processing equipment features / components (FIG. 20, block 2040). For example, the wayfinding system 1710 operates while the transfer robot 11013 is moving to detect obstacles that may be in the planned path / trajectory. When an obstacle is detected, the controller 11091 modifies the path / trajectory to avoid the obstacle. In the example shown in FIGS. 19A-19E, the obstacle is a wall of the mini-environment 11060. As can be seen from the progression of robot movement from Figure 19A to 19E, the transfer robot 11013 moves along a robot path / trajectory established by the wayfinding system (at least in the Y (or R) direction) to a taught position (Figure 19E) that provides extension of the end effectors 420A, 420B through the openings 888 in the station fixture 11010 for picking or placing a substrate. Corrections to the robot path / trajectory to the taught position can be made by the controller 11091 on the fly based on objects / obstacles detected by the wayfinding system 1710.

[0091] According to one or more aspects of the present disclosure, an auto-teach system for a substrate processing apparatus is provided, the auto-teach system comprising: a frame having a workpiece load station with a predetermined load station reference position; a robotic transport apparatus mounted on the frame, the robotic transport apparatus having a movable transport arm with an end effector having a predetermined end effector reference position and a drive section for driving the movable transport arm with at least one degree of freedom of motion relative to the frame; a machine vision system including both at least one fixed imaging sensor and at least one movable imaging sensor removably connected to the frame and configured to image at least one target of the machine vision system; and a loading jig arranged for removably engaging with the workpiece load station, wherein both at least one fixed imaging sensor and at least one movable imaging sensor are attached to the loading jig, the fixed imaging sensor having a predetermined pose relative to a predetermined load station reference position, the movable transport arm having at least one arm target of the at least one target within a field of view of the fixed imaging sensor when the loading jig is engaged with the workpiece load station at a predetermined position relative to the predetermined end effector reference position, and the movable imaging sensor having an alignment feature on a base of the movable imaging sensor that aligns the movable imaging sensor to a predetermined position relative to the predetermined end effector reference position.

[0092] According to one or more aspects of the present disclosure, the frame has a separate workpiece holding station, separate from the load station for holding a workpiece thereon, the separate workpiece holding station having a predetermined holding station reference position.

[0093] According to one or more aspects of the present disclosure, the automatic teaching system further includes a controller communicatively connected to the drive section for moving the movable transport arm and communicatively connected to the at least one fixed imaging sensor, the controller being configured to move the movable transport arm to at least one teaching position relative to the load jig and image the at least one arm target with the movable transport arm in the at least one teaching position using the at least one fixed imaging sensor to resolve offsets between a predetermined end effector reference position and a predetermined load station reference position and between the predetermined end effector reference positions based on images of the at least one arm target.

[0094] According to one or more aspects of the present disclosure, the at least one teaching position includes a series of teaching positions, each teaching position spaced apart from one another by a predetermined distance along a motion path of the at least one arm target defined by movement of the movable transport arm in at least one degree of freedom.

[0095] According to one or more aspects of the present disclosure, the predetermined distance is determined based on a resolved offset between the predetermined end effector reference position and the predetermined load station reference position.

[0096] According to one or more aspects of the present disclosure, at least one arm target is imaged at each taught position of a series of taught positions, the images of the at least one arm target include a series of images of the at least one arm target along a motion path, and the offset resolution is based on the series of images.

[0097] According to one or more aspects of the present disclosure, at least one arm target has predetermined indicia embodying predetermined characteristics and describing at least the target surface, and the predetermined indicia is imaged by at least one fixed imaging sensor such that an offset is resolved, in part, to a reference surface of the workpiece loading station based on an image of the at least one arm target.

[0098] In accordance with one or more aspects of the present disclosure, the movable transport arm has a plurality of arm targets arranged such that each arm target imaged by at least one fixed imaging sensor characterizes a different offset aspect, each of the different offset aspects corresponding to a different respective pair of drive axes of the drive section that provide at least one degree of freedom of movement of the movable transport arm corresponding to a different respective reference plane of the workpiece loading station, whereby each different offset aspect is resolved by a separate image of the respective arm target, and the offset resolution is provided overall by a combination of the resolved different offset aspects.

[0099] According to one or more aspects of the present disclosure, a first drive axis pair of the different respective drive axis pairs corresponding to a first arm target of the at least one arm target shares a drive axis with a second drive axis pair of the different respective drive axis pairs corresponding to a second arm target of the at least one arm target, and resolution of a second offset aspect of the different offset aspect serves to confirm or reconstruct a portion of the first offset aspect resolved with respect to a load station reference axis corresponding to the shared drive axis and with the first arm target of the at least one arm target.

[0100] According to one or more aspects of the present disclosure, the movable transport arm has a plurality of arm targets of at least one arm target, where the plurality of arm targets are arranged such that each arm target imaged by the at least one fixed imaging sensor separately characterizes a different offset aspect, whereby a first arm target of the at least one arm target characterizes a first offset aspect and a second arm target of the at least one arm target characterizes a second offset aspect different from the first offset aspect, whereby the different characterizations defined by the first arm target of the at least one arm target and the second arm target of the at least one arm target, respectively, are adjusted relative to a load station reference axis such that resolution of the second offset aspect serves to confirm or reconstruct a portion of the first offset aspect, whereby the first offset aspect is separately resolved in the first arm target of the at least one arm target.

[0101] In accordance with one or more aspects of the present disclosure, the movable transport arm has a plurality of arm targets of at least one arm target, the plurality of arm targets being arranged such that each arm target imaged by the at least one fixed imaging sensor characterizes a different offset aspect, each of the different offset aspects corresponding to a different respective at least one drive axis that provides at least one degree of freedom of movement of the movable transport arm corresponding to a different respective reference axis of the workpiece loading station, whereby each different offset aspect is resolved by a separate image of the respective arm target, and the offset resolution is provided overall by a combination of the separately resolved different offset aspects.

[0102] In accordance with one or more aspects of the present disclosure, the at least one fixed imaging sensor includes a plurality of fixed imaging sensors, each of the plurality of fixed imaging sensors having a different predetermined pose such that an imaging sensor surface of each respective fixed imaging sensor corresponds to a different respective load station reference surface, and the at least one arm target has an orientation corresponding to each respective fixed imaging sensor such that each fixed imaging sensor forms, with its respective arm target, a different pair corresponding to and including a respective fixed imaging sensor and a respective arm target.

[0103] According to one or more aspects of the present disclosure, the load jig is configured as a simulated substrate carrier, an opening is disposed in a front wall of the simulated substrate carrier such that an end effector enters the simulated substrate carrier through the front wall, and the field of view of at least one fixed imaging sensor faces the opening in the front wall of the load jig.

[0104] According to one or more aspects of the present disclosure, at least one arm target is positioned facing the front wall and the opening upon approach of the movable transport arm to the workpiece loading station along a motion path extending through the opening and upon entry into the simulated substrate carrier.

[0105] According to one or more embodiments of the present disclosure, the opening of the load jig is oriented in a vertical plane.

[0106] According to one or more aspects of the present disclosure, at least one fixed imaging sensor is positioned to image at least one arm target in a direction extending through an opening in the loading jig such that the resolved offset frees extension of the end effector through the opening into the interior of the loading jig.

[0107] According to one or more aspects of the present disclosure, at least one fixed imaging sensor is positioned to image at least one arm target in a direction extending through an opening of the loading jig such that the controller confirms unimpeded arm extension of the end effector into the interior of the loading jig based on the resolved offset.

[0108] According to one or more aspects of the present disclosure, at least one fixed imaging sensor is positioned to image at least one arm target in a cross direction extending at a cross angle relative to an extension path of the end effector extending through an opening into the interior of the load jig.

[0109] According to one or more aspects of the present disclosure, a resolved offset based on an image of the at least one arm target image in a direction extending through the opening acts to align the at least one arm target to another incremental taught position such that an offset resolution based on an image of the at least one arm target in a cross direction incrementally resolves the resolved offset.

[0110] In accordance with one or more aspects of the present disclosure, at least one fixed imaging sensor is positioned to image at least one arm target in multiple intersecting directions, each of the multiple intersecting directions extending at an intersecting angle relative to the extension path of the end effector and to each other, each acting to progressively resolve a resolved offset along a respective axis corresponding to each degree of freedom of the at least one degree of freedom of arm motion provided by the drive section.

[0111] According to one or more aspects of the present disclosure, the positioning features of the base have engagement features that engage the end effector and position the at least one movable imaging sensor at a predetermined pose relative to a predetermined end effector reference position.

[0112] According to one or more aspects of the present disclosure, the load jig has at least one simulated workpiece holding slot, each of which corresponds to and represents a different workpiece holding slot of the workpiece carrier at the workpiece loading station and defines a different one of the predetermined load station reference positions.

[0113] In accordance with one or more aspects of the present disclosure, at least one fixed imaging sensor is positioned to image at least one end effector target disposed on the end effector, on a wafer plane defined by the end effector, and at a predetermined position relative to a predetermined end effector reference position.

[0114] According to one or more aspects of the present disclosure, the controller confirms or progressively resolves the resolved offset based on end effector target images from at least one fixed imaging sensor that captures the effector target images with the end effector positioned with the wafer plane within each of the at least one simulated workpiece holding slot.

[0115] According to one or more aspects of the present disclosure, a base of the at least one movable imaging sensor is held in a loading jig and positioned for transport and transfer to / from each holding station of the loading jig and frame using an end effector, and the at least one movable imaging sensor has at least one movable imaging sensor attached to a base such that it is positioned on the end effector with the base carried by the end effector at a predetermined position relative to a predetermined end effector reference position.

[0116] According to one or more aspects of the present disclosure, the controller is configured to move the movable transport arm to transport the base together with the at least one movable imaging sensor to a station teaching position relative to another workpiece holding station, and image at least one station target having a predetermined pose relative to the predetermined holding station reference position using the at least one movable imaging sensor on the end effector to resolve a station offset between the predetermined end effector reference position and the predetermined holding station reference position based on the at least one station target imaged by the at least one movable imaging sensor.

[0117] According to one or more aspects of the present disclosure, the at least one teaching position includes a series of teaching positions, each teaching position spaced apart from one another by a predetermined distance along a motion path of the at least one station target defined by movement of the movable transport arm in at least one degree of freedom.

[0118] According to one or more aspects of the present disclosure, the predetermined distance is determined based on a resolved offset between the predetermined end effector reference position and the predetermined holding station reference position.

[0119] According to one or more aspects of the present disclosure, the at least one station target is imaged at each teaching position of a series of teaching positions, the images of the at least one station target include a series of images of the at least one station target along a motion path, and the offset resolution is based on the series of images.

[0120] According to one or more aspects of the present disclosure, at least one station target has predetermined indicia embodying predetermined characteristics and describing at least the target surface, and the predetermined indicia is imaged by at least one movable imaging sensor such that an offset is resolved in part to a reference surface of another workpiece holding station based on an image of the at least one station target.

[0121] According to one or more aspects of the present disclosure, the another workpiece holding station has a plurality of station targets arranged such that each station target imaged by at least one movable imaging sensor characterizes a different offset aspect, each of the different offset aspects corresponding to a different respective pair of drive axes of the drive section that provides at least one degree of freedom of movement of the movable transport arm corresponding to a different respective reference plane of the another workpiece holding station, each different offset aspect being resolved by a separate image of the respective station target, and the offset resolution is provided overall by a combination of the resolved different offset aspects.

[0122] According to one or more aspects of the present disclosure, a first drive axis pair of the different respective drive axis pairs corresponding to a first station target of the at least one station target shares a drive axis with a second drive axis pair of the different respective drive axis pairs corresponding to a second station target of the at least one station target, and resolution of a second offset aspect of the different offset aspect serves to confirm or reconstruct a portion of the first offset aspect resolved with respect to a holding station reference axis corresponding to the shared drive axis and with the first station target of the at least one station target.

[0123] According to one or more aspects of the present disclosure, another workpiece holding station has a plurality of station targets of the at least one station target arranged such that each station target imaged by the at least one movable imaging sensor separately characterizes a different offset aspect, whereby a first station target of the at least one station target characterizes a first offset aspect and a second station target of the at least one station target characterizes a second offset aspect different from the first offset aspect, where the different characterizations defined by the first station target of the at least one station target and the second station target of the at least one station target, respectively, are arranged such that resolution of the second offset aspect serves to confirm or reconstruct a portion of the first offset aspect relative to a holding station reference axis, and where the first offset aspect is resolved separately in the first station target of the at least one station target.

[0124] According to one or more aspects of the present disclosure, the another workpiece holding station has a plurality of station targets of at least one station target, the plurality of station targets being arranged such that each station target imaged by the at least one movable imaging sensor characterizes a different offset aspect, each of the different offset aspects corresponding to a different respective at least one drive axis providing at least one degree of freedom of movement of the movable transport arm corresponding to a different respective reference axis of the another workpiece holding station, whereby each different offset aspect is resolved by a separate image of the respective station target, and the offset resolution is provided overall by a combination of the separately resolved different offset aspects.

[0125] In accordance with one or more aspects of the present disclosure, the at least one movable imaging sensor includes a plurality of movable imaging sensors, each of the plurality of movable imaging sensors having a different predetermined pose such that an imaging sensor surface of each respective movable imaging sensor corresponds to a different respective holding station reference surface, and the at least one station target has an orientation corresponding to each respective movable imaging sensor such that each movable imaging sensor forms, with its respective station target, a different pair corresponding to and including a respective fixed imaging sensor and a respective station target.

[0126] According to one or more aspects of the present disclosure, the another workpiece holding station has an opening in a front wall of the another workpiece holding station, the opening is positioned such that the end effector enters the another workpiece holding station through the front wall, and the field of view of the at least one movable imaging sensor faces the opening in the front wall of the another workpiece holding station.

[0127] According to one or more aspects of the present disclosure, at least one station target is positioned facing the front wall and the opening upon approach of the movable transport arm to another workpiece holding station along a motion path that extends through the opening.

[0128] According to one or more aspects of the present disclosure, at least one movable imaging sensor is positioned to image at least one station target in a direction extending through an opening of another workpiece holding station such that the resolved offset frees extension of the end effector through the opening into the interior of the other workpiece holding station.

[0129] According to one or more aspects of the present disclosure, at least one movable imaging sensor is positioned to image at least one station target in a direction extending through an opening of the other workpiece holding station such that the controller confirms unimpeded arm extension of the end effector into the interior of the other workpiece holding station based on the resolved offset.

[0130] According to one or more aspects of the present disclosure, at least one movable imaging sensor is positioned to image at least one station target in a cross direction extending at a cross angle relative to an extension path of the end effector extending through an opening into the interior of another workpiece holding station.

[0131] According to one or more aspects of the present disclosure, a resolved offset based on an image of the at least one station target image in a direction extending through the opening acts to align the at least one station target to another incremental teach position such that an offset resolution based on an image of the at least one station target in a cross direction incrementally resolves the resolved offset.

[0132] According to one or more aspects of the disclosure, the automated teaching system further includes at least one distance measuring sensor mounted on the base to be carried and transported by an end effector holding the base, the at least one distance measuring sensor sensing distance in a distance sensing direction substantially aligned with a field of view of the at least one movable imaging sensor such that the field of view and the distance sensing direction are substantially collimated with respect to one another.

[0133] According to one or more aspects of the present disclosure, the field of view and distance sensing directions are substantially collimated with respect to one another to see and sense in a vertical plane in front of the end effector.

[0134] According to one or more aspects of the present disclosure, the field of view and distance sensing direction are substantially collimated with respect to one another to view and sense in a direction tangent to an arm motion path that extends the movable transport arm along a workpiece transport path from a load station toward another workpiece holding station.

[0135] According to one or more aspects of the present disclosure, the controller is communicatively connected to at least one distance measurement sensor and configured to detect, via distance measurements from the at least one distance measurement sensor, an opening of another workpiece holding station that enables controller movement of the end effector relative to the opening to a station teaching position or detect an obstacle in the motion path of the end effector during operation of the movable transport arm.

[0136] According to one or more aspects of the present disclosure, the distance measurement sensor is at least one of an ultrasonic sensor, an infrared sensor, a time-of-flight sensor, and a LIDAR sensor.

[0137] It should be understood that the foregoing description is merely illustrative of aspects of the present disclosure. Various alternatives and modifications may be contemplated by those skilled in the art without departing from the aspects of the present disclosure. Accordingly, the aspects of the present disclosure are intended to embrace all such alternatives, modifications, and variations that are within the scope of any claims appended hereto. Moreover, the mere fact that different features are recited in mutually different dependent or independent claims does not indicate that a combination of these features cannot be used to advantage and that such combination remains within the scope of the aspects of the present disclosure.

Claims

1. An automatic teaching system for a substrate processing apparatus, comprising: a frame having a workpiece load station with a predetermined load station reference position; A robot transport device attached to the frame, a movable transport arm having an end effector with a predetermined end effector reference position; a drive section for driving the movable transport arm with at least one degree of freedom of motion relative to the frame; a machine vision system including both at least one fixed and at least one movable imaging sensor removably connected to the frame and configured to image at least one target of the machine vision system; a load jig arranged for removably engaging said workpiece load station, wherein both said at least one fixed image sensor and said at least one movable image sensor are attached to said load jig, said fixed image sensor having a predetermined pose relative to said predetermined load station reference position; the movable transport arm having at least one arm target of the at least one target within a field of view of the fixed imaging sensor with the load jig engaged with the workpiece load station at a predetermined position relative to the predetermined end effector reference position; The movable imaging sensor includes an alignment feature on a base of the movable imaging sensor that aligns the movable imaging sensor to a predetermined position relative to the predetermined end effector reference position.

2. 2. The automated teaching system of claim 1, wherein said frame has a separate workpiece holding station, separate from a load station for holding a workpiece thereon, said separate workpiece holding station having a predetermined holding station reference position.

3. 2. The automated teaching system of claim 1, further comprising a controller communicatively connected to the drive section for moving the movable transport arm and communicatively connected to the at least one fixed imaging sensor, wherein the controller is configured to move the movable transport arm to at least one taught position relative to the load jig and image the at least one arm target with the movable transport arm in the at least one taught position using the at least one fixed imaging sensor to resolve offsets between the predetermined end effector reference position and the predetermined load station reference position and between the predetermined end effector reference position and the position adjustment feature of the base of the movable imaging sensor based on images of the at least one arm target.

4. 4. The automated teaching system of claim 3, wherein the loading jig is configured as a simulated substrate carrier, an opening is disposed in a front wall of the simulated substrate carrier such that an end effector can enter the simulated substrate carrier through the front wall, and a field of view of the at least one fixed imaging sensor faces the opening in the front wall of the loading jig.

5. The automated teaching system of claim 4 , wherein the at least one arm target is positioned facing the front wall and the opening upon approach of the movable transport arm to the workpiece load station along a motion path extending through the opening and into the mock substrate carrier.

6. The auto-teach system of claim 4 , wherein the opening of the load jig is oriented in a vertical plane.

7. 5. The automated teaching system of claim 4, wherein the at least one fixed imaging sensor is positioned to image the at least one arm target in a direction extending through the opening in the loading jig such that the resolved offset frees extension of an end effector through the opening into the interior of the loading jig.

8. 5. The automated teaching system of claim 4, wherein the at least one fixed imaging sensor is positioned to image the at least one arm target in a direction extending through the opening of the loading jig such that the controller confirms unimpeded arm extension of the end effector into the loading jig based on the resolved offset.

9. 5. The automated teaching system of claim 4, wherein the at least one fixed imaging sensor is positioned to image the at least one arm target in a cross direction extending at a cross angle relative to an extension path of the end effector extending through the opening into the interior of the load jig.

10. 5. The automated teaching system of claim 4, wherein the resolved offset based on an image of at least one arm target image in a direction extending through the opening acts to align the at least one arm target to another incremental teaching position such that an offset resolution based on an image of the at least one arm target in a cross direction incrementally resolves the resolved offset.

11. 4. The automated teaching system of claim 3, wherein the at least one fixed imaging sensor is positioned to image at least one end effector target disposed on the end effector on a wafer plane defined by the end effector and at a predetermined position relative to the predetermined end effector reference position.

12. 12. The automated teaching system of claim 11, wherein the controller confirms or incrementally resolves the resolved offset based on the end effector target images from the at least one fixed imaging sensor that captures end effector target images with the end effector positioned with the wafer plane within each of the at least one simulated workpiece holding slots.

13. The frame having a separate workpiece holding station, separate from the load station for holding a workpiece thereon, the separate workpiece holding station having a predetermined holding station reference position; 4. The automated teaching system of claim 3, wherein the controller is configured to move the movable transport arm to transport the base together with the at least one movable imaging sensor to a station teaching position relative to another workpiece holding station, and image the at least one station target having a predetermined pose relative to the predetermined holding station reference position using the at least one movable imaging sensor on the end effector to resolve a station offset between the predetermined end effector reference position and the predetermined holding station reference position based on at least one station target imaged by the at least one movable imaging sensor.

14. 14. The automated teaching system of claim 13, wherein the at least one teaching position comprises a series of teaching positions, each teaching position spaced apart from one another by a predetermined distance along a motion path of the at least one station target defined by movement of the movable transport arm in the at least one degree of freedom.

15. The automated teach system of claim 14 , wherein the predetermined distance is determined based on the resolved offset between the predetermined end effector reference position and the predetermined holding station reference position.

16. 15. The automated teaching system of claim 14, wherein the at least one station target is imaged at each taught position in the series of taught positions, the images of the at least one station target include a series of images of the at least one station target along the motion path, and the offset resolution is based on the series of images.

17. 14. The automated teaching system of claim 13, wherein the at least one station target has predetermined indicia embodying predetermined characteristics and describing at least a target surface, the predetermined indicia being imaged by the at least one movable imaging sensor such that the offset is resolved in part to a reference surface of the other workpiece holding station based on an image of the at least one station target.

18. 14. The automated teaching system of claim 13, wherein the another workpiece holding station has a plurality of station targets of the station targets, the plurality of station targets being arranged such that each station target imaged by the at least one movable imaging sensor characterizes a different offset aspect, each of the different offset aspects corresponding to a different respective pair of drive axes of the drive section that provides the at least one degree of freedom of movement of the movable transport arm corresponding to a different respective reference plane of the another workpiece holding station, each different offset aspect being resolved by a separate image of a respective station target, and the offset resolution being provided overall by a combination of the resolved different offset aspects.

19. 20. The automated teaching system of claim 18, wherein a first drive axis pair of the different respective drive axis pairs corresponding to a first station target of the at least one station target shares a drive axis with a second drive axis pair of the different respective drive axis pairs corresponding to a second station target of the at least one station target, and the resolution of a second offset aspect of the different offset aspect serves to confirm or reconstruct a portion of a first offset aspect resolved with respect to a holding station reference axis corresponding to the shared drive axis and with the first station target of the at least one station target.

20. 14. The automated teaching system of claim 13, wherein the another workpiece holding station has a plurality of station targets of the at least one station target, the plurality of station targets being arranged such that each station target imaged by the at least one movable imaging sensor separately characterizes a different offset aspect, whereby a first station target of the at least one station target characterizes a first offset aspect and a second station target of the at least one station target characterizes a second offset aspect different from the first offset aspect, the different characterizations defined by the first station target of the at least one station target and the second station target of the at least one station target, respectively, are adjusted relative to a holding station reference axis such that a resolution of the second offset aspect serves to confirm or reconstruct a portion of the first offset aspect, and the first offset aspect is resolved separately at the first station target of the at least one station target.

21. 14. The automated teaching system of claim 13, wherein the another workpiece holding station has a plurality of station targets of the at least one station target, the plurality of station targets being arranged such that each station target imaged by the at least one movable imaging sensor characterizes a different offset aspect, each of the different offset aspects corresponding to a different respective at least one drive axis providing the at least one degree of freedom of movement of the movable transport arm corresponding to a different respective reference axis of the another workpiece holding station, whereby each different offset aspect is resolved by a separate image of a respective station target, and the offset resolution is generally provided by a combination of the separately resolved different offset aspects.

22. 14. The automated teaching system of claim 13, wherein the at least one movable imaging sensor includes a plurality of movable imaging sensors, each of the plurality of movable imaging sensors having a different predetermined pose such that an imaging sensor face of each respective movable imaging sensor corresponds to a different respective holding station reference plane, and the at least one station target has an orientation corresponding to each respective movable imaging sensor such that each movable imaging sensor forms, with its respective station target, a different pair corresponding to and including a respective fixed imaging sensor and a respective station target.

23. 14. The automated teaching system of claim 13, wherein the other workpiece holding station has an opening in a front wall of the other workpiece holding station, the opening positioned such that an end effector enters the other workpiece holding station through the front wall, and a field of view of the at least one movable imaging sensor faces the opening in the front wall of the other workpiece holding station.

24. 24. The automated teaching system of claim 23, wherein the at least one station target is positioned facing the front wall and the opening upon approach of the movable transport arm to the other workpiece holding station along a motion path that extends through the opening.

25. 24. The automated teaching system of claim 23, wherein the at least one movable imaging sensor is positioned to image the at least one station target in a direction extending through the opening of the other workpiece holding station such that the resolved offset frees extension of an end effector through the opening into the interior of the other workpiece holding station.

26. 24. The automated teaching system of claim 23, wherein the at least one movable imaging sensor is positioned to image the at least one station target in a direction extending through the opening of the other workpiece holding station such that the controller confirms unimpeded arm extension of the end effector into the other workpiece holding station based on the resolved offset.

27. 24. The automated teaching system of claim 23, wherein the at least one movable imaging sensor is positioned to image the at least one station target in a cross direction extending at a cross angle relative to an extension path of the end effector extending through the opening into the interior of the another workpiece holding station.

28. 24. The automated teaching system of claim 23, wherein the resolved offset based on an image of at least one station target image in a direction extending through the opening acts to align the at least one station target to another incremental teaching position such that an offset resolution based on an image of the at least one station target in a cross direction incrementally resolves the resolved offset.

29. 2. The automatic teaching system of claim 1, wherein the at least one teaching position comprises a series of teaching positions, each teaching position being spaced apart from one another by a predetermined distance along a motion path of the at least one arm target defined by movement of the movable transport arm in the at least one degree of freedom.

30. 30. The automated teach system of claim 29, wherein the predetermined distance is determined based on a resolved offset between the predetermined end effector reference position and the predetermined load station reference position.

31. 30. The automated teaching system of claim 29, wherein the at least one arm target is imaged at each taught position in the series of taught positions, the images of the at least one arm target include a series of images of the at least one arm target along the motion path, and the offset resolution is based on the series of images.

32. 2. The automated teaching system of claim 1, wherein the at least one arm target has predetermined indicia embodying predetermined characteristics and describing at least a target surface, the predetermined indicia being imaged by the at least one fixed imaging sensor such that an offset is resolved in part to a reference surface of the workpiece loading station based on an image of the at least one arm target.

33. 2. The automated teaching system of claim 1, wherein the movable transport arm has a plurality of arm targets of the arm targets arranged such that each arm target imaged by the at least one fixed imaging sensor characterizes a different offset aspect, each different offset aspect corresponding to a different respective pair of drive axes of the drive section that provides the at least one degree of freedom of movement of the movable transport arm corresponding to a different respective reference plane of the workpiece loading station, whereby each different offset aspect is resolved by a separate image of a respective arm target, and the offset resolution is provided overall by a combination of the resolved different offset aspects.

34. 34. The automated teaching system of claim 33, wherein a first drive axis pair of different respective drive axis pairs corresponding to a first arm target of the at least one arm target shares a drive axis with a second drive axis pair of different respective drive axis pairs corresponding to a second arm target of the at least one arm target, and the resolution of a second offset aspect of the different offset aspect serves to confirm or reconstruct a portion of a first offset aspect resolved with respect to a load station reference axis corresponding to the shared drive axis and with the first arm target of the at least one arm target.

35. 2. The automated teaching system of claim 1, wherein the movable transport arm has a plurality of arm targets of the at least one arm target, the plurality of arm targets being arranged such that each arm target imaged by the at least one fixed imaging sensor separately characterizes a different offset aspect, whereby a first arm target of the at least one arm target characterizes a first offset aspect and a second arm target of the at least one arm target characterizes a second offset aspect different from the first offset aspect, the different characterizations defined by the first arm target of the at least one arm target and the second arm target of the at least one arm target, respectively, are adjusted relative to a load station reference axis such that a resolution of the second offset aspect serves to confirm or reconstruct a portion of the first offset aspect, and the first offset aspect is resolved separately at the first arm target of the at least one arm target.

36. 2. The automated teaching system of claim 1, wherein the movable transport arm has a plurality of arm targets of the at least one arm target, the plurality of arm targets being arranged such that each arm target imaged by the at least one fixed imaging sensor characterizes a different offset aspect, each of the different offset aspects corresponding to a different respective at least one drive axis that effects movement of the at least one degree of freedom of the movable transport arm corresponding to a different respective reference axis of the workpiece loading station, whereby each different offset aspect is resolved by a separate image of a respective arm target, and the offset resolution is generally provided by a combination of the separately resolved different offset aspects.

37. 2. The automated teaching system of claim 1, wherein the at least one fixed imaging sensor includes a plurality of fixed imaging sensors, each of the plurality of fixed imaging sensors having a different predetermined pose such that an imaging sensor surface of each respective fixed imaging sensor corresponds to a different respective load station reference surface, and the at least one arm target has an orientation corresponding to each respective fixed imaging sensor such that each fixed imaging sensor forms, with its respective arm target, a different pair corresponding to and including a respective fixed imaging sensor and a respective arm target.

38. 2. The automated teaching system of claim 1, wherein the at least one fixed imaging sensor is positioned to image the at least one arm target in a plurality of intersecting directions, each of the plurality of intersecting directions extending at a cross angle relative to an extension path of the end effector and relative to each other, each operative to progressively resolve a resolved offset along a respective axis corresponding to a respective degree of freedom of the at least one degree of freedom of arm motion provided by the drive section.

39. The automated teaching system of claim 1 , wherein the alignment features of the base include an engagement feature that engages the end effector and aligns the at least one movable imaging sensor at a predetermined pose relative to the predetermined end effector reference position.

40. 2. The automated teaching system of claim 1, wherein the load jig has at least one simulated workpiece holding slot, each of the simulated workpiece holding slots corresponding to and representing a different workpiece holding slot of a workpiece carrier at the workpiece load station and defining a different one of the predetermined load station reference positions.

41. 2. The automatic teaching system of claim 1, wherein the base of the at least one movable imaging sensor is held in the load jig and arranged for transport and transfer to / from each holding station of the load jig and the frame using the end effector, and the at least one movable imaging sensor has at least one movable imaging sensor attached to the base so as to be positioned on the end effector with the base carried by the end effector at a predetermined position relative to the predetermined end effector reference position.

42. 2. The automated teaching system of claim 1, further comprising at least one distance measuring sensor mounted on the base for being carried and transported by the end effector holding the base, the at least one distance measuring sensor sensing distance with a distance sensing direction substantially aligned with a field of view of the at least one movable imaging sensor such that the field of view and the distance sensing direction are substantially collimated with respect to one another.

43. 43. The automated teach system of claim 42, wherein the field of view and the distance sensing direction are substantially collimated with respect to one another and view and sense in a vertical plane in front of the end effector.

44. 43. The automated teaching system of claim 42, wherein the field of view and the distance sensing direction are substantially collimated with respect to one another and view and sense in a direction tangent to an arm motion path that extends the movable transport arm along a workpiece transport path from a load station toward another workpiece holding station.

45. 43. The automated teaching system of claim 42, further comprising a controller, the controller communicatively connected to the at least one distance measuring sensor and configured to detect an opening of another workpiece holding station that enables controller movement of the end effector relative to an opening to a station teaching position during operation of the movable transport arm, or detect an obstacle in the motion path of the end effector via distance measurements from the at least one distance measuring sensor.

46. 43. The auto-teach system of claim 42, wherein the distance measurement sensor is at least one of an ultrasonic sensor, an infrared sensor, a time-of-flight sensor, and a LIDAR sensor.

Images