Metal substrate structure, method for manufacturing metal substrate structure for semiconductor power module, and semiconductor power module

Abstract

The metal substrate structure (10) for a semiconductor power module comprises a metal upper layer (11) having at least one through recess (14) formed by stamping, and a metal lower layer (13). The metal substrate structure (10) further comprises a dielectric layer (12) bonded to both the metal upper layer (11) and the metal lower layer (13), the dielectric layer (12) being formed between the metal upper layer (11) and the metal lower layer (13) by molding.

Description

[Technical field]

[0001] The present disclosure relates to a metal substrate structure for a semiconductor power module and a semiconductor power module for a semiconductor device. The present disclosure further relates to a corresponding method for manufacturing the metal substrate structure. [Background technology]

[0002] Conventional insulated metal substrates have formed a technology for low and medium power semiconductor packages with low insulation requirements and low heat resistance at the same time. The document US6570099B1 discloses a thermally conductive substrate with a first sheet-like insulator layer, a second sheet-like insulator layer, and a lead frame that functions as a circuit pattern. The first electrical insulator layer 21 is formed of a thermally conductive resin composition and is bonded to the lead frame.

[0003] The document EP1160861A2 discloses a lead frame provided on the upper side of an electrical insulating sheet. A radiation plate is attached to the lower side of the insulating sheet. The edge of the radiation plate is arranged inside the periphery of the insulating sheet. Further lead frame or package structures are described in the documents EP1909324A1, US6060150A, JP2008210920 and JP2014090103. Summary of the Invention [Problem to be solved by the invention]

[0004] In this regard, it is a challenge to provide metal substrates with reliable performance for high voltage power module applications.

[0005] It is desirable to provide a cost-saving metal substrate structure for a semiconductor power module that allows reliable functioning even in high voltage power module applications. It is a further object to provide a corresponding semiconductor power module for a semiconductor device, and a method for manufacturing such a metal substrate structure. [Means for solving the problem]

[0006] These objects are achieved by the subject matter of the independent claims. Further developments and embodiments are set forth in the dependent claims.

[0007] According to one embodiment, a metal substrate structure for a semiconductor power module comprises a metal upper layer having at least one through recess. The metal substrate structure further comprises a metal lower layer and a dielectric layer bonded to both the metal upper layer and the metal lower layer and formed by molding between the metal upper layer and the metal lower layer. The dielectric layer is molded to form a groove in the at least one through recess and / or a barrier extending through the at least one through recess protruding above an outer surface of the metal upper layer.

[0008] By using the described shaped metal substrate structure, semiconductor power modules are realizable that allow reliable functioning even in high voltage power module applications, for example in the voltage range of 0.5 kV to 10.0 kV. The described metal substrate structure presents a power module insulated metal substrate with a defined metallization structure and a shaped insulating layer.

[0009] The metallization is formed by a metal top layer, which may be a film and / or sheet composed of copper and / or aluminum. This may also apply to a metal bottom layer, which may be formed as a copper and / or aluminum plate. The metal top layer, including the recesses, is formed, for example, by stamping. In the following description, the metal substrate structure is mainly described in terms of stamped and shaped metal substrates and may therefore be written in the abbreviated form "SMMS". However, there are also alternatives for the manufacture of the top metallization. Alternatively or additionally, the metal top layer is formed to have a predetermined structure, for example, by etching and / or laser cutting of a provided metal sheet.

[0010] The at least one recess can provide an opening through a solid piece of metal forming the metallization of the metal overlayer. Alternatively, the at least one recess can form a groove or free volume between two separate metal paths, for example. The metal overlayer can further comprise a plurality of recesses and / or grooves to form a predetermined metal pattern to provide a desired metallization on top of the SMMS.

[0011] The insulating layer between them is realized by a molded dielectric layer. According to one embodiment of the SMMS, the dielectric layer is an epoxy and / or ceramic-based dielectric. For example, the molded dielectric layer comprises a resin-based dielectric material with a ceramic filler material, such as epoxy, Al2O3, AlN, BN, Si3N4 or SiO2. For example, the dielectric layer is a filled epoxy. The dielectric layer can also be based on other materials suitable for transfer molding, injection molding or compression molding, such as bismaleimide, cyanate ester, polyimide and / or silicone. Alternatively or additionally, the dielectric layer can comprise a ceramic material and / or a hydroset material, or a combination of two or more of the aforementioned components.

[0012] It is a recognition associated with the present disclosure that conventional insulated metal substrates have enabled technology for low and medium power semiconductor packages with simultaneously low insulation requirements and low heat resistance. However, these insulated metal substrates generally have dielectric sheet materials that are not suitable for high voltage power module applications. On the one hand, the insulating capabilities of currently available dielectric materials are relatively low, resulting in relatively thick insulating layers being required. On the other hand, the thermal conductivity of the dielectric materials is not high enough to compensate for the thick insulating layers, thus hindering the design and development of thermally efficient high voltage power modules.

[0013] Moreover, traditional insulated metal substrates are usually made of prepreg sheets with two metal plates above and below the insulating layer. Typically, Cu is used for the top surface and Cu for the bottom plate. The metallization sheet or plate is bonded to the insulating layer by a lamination process. The required metallization structure on the top surface of the substrate is then made by subsequent masking and etching process steps to locally remove the conductive Cu metal to create the final metallization structure. Such fabrication requires a lot of labor and cost, and the maximum thickness of the insulating layer is dictated by the prepreg process. Typically, the insulating layer is 100 μm thick with a uniform filler distribution. To achieve a thicker insulating sheet, multiple prepreg layers need to be laminated together.

[0014] With the described SMMS and molded dielectric layers, an insulator is created that has a thickness of 50 μm to 1 mm in the stacking direction from the lower metal layer to the upper metal layer. In this way, the SMMS can be manufactured at reduced cost and with less labor while still allowing beneficial insulating capabilities as well as thermal conductivity. The relatively thick dielectric layer is useful for contributing sufficient insulating capabilities. The thickness of the molded dielectric still provides beneficial thermal conductivity and can be manufactured without the thickness limitations of today's insulating prepreg materials.

[0015] Furthermore, the use of the described SMMS eliminates the need for thick and expensive AlN ceramic layers, for example, to reliably insulate high voltages and transfer heat to the coolers of the semiconductor device. In addition, the SMMS allows for beneficial CTE matching of the dielectric layer with the bonded top and bottom metal layers, where CTE stands for the coefficient of thermal expansion. Furthermore, molding of the dielectric layer in the SMMS can be performed more precisely than traditional masking and etching, in terms of repeatability of the given thickness and sample-to-sample variation. Due to the molded dielectric layer being an epoxy-based material, improved thermal conductivity and insulating capabilities can be realized, reducing the required material thickness and / or reducing the thermal resistance, both of which can contribute to a thermally beneficial semiconductor power module. The tuning of the CTE and the improvement of the thermal conductivity can be controlled, for example, by using filled resins.

[0016] For example, at least one recess is limited by an edge of the metal top layer, and the dielectric layer is molded to cover at least one of the edges. Such edges usually form the critical areas for partial discharge due to the highest electric field concentration. By molding the dielectric layer between the metal top layer and the metal bottom layer and in one or more recesses, such critical areas can be covered by the dielectric material of the molded dielectric layer. In this way, the SMMS can contribute to the safe and reliable functioning of semiconductor power modules by suppressing electric field concentration. The critical areas of the SMMS are already embedded in the final dielectric layer medium, allowing partial discharge testing of the raw board without applying further insulating medium.

[0017] The dielectric layer is molded to form a groove in at least one recess. Alternatively or additionally, in another recess, the dielectric layer can be molded to form a barrier extending through the recess that protrudes onto the outer surface of the metal top layer. Such a barrier can be easily formed during molding of the dielectric layer and can contribute to increasing the creepage distance of the semiconductor power module including the SMMS. The barrier can thus form a protrusion or rib that is configured to improve the creepage behavior. The creepage distance refers to the shortest distance between two conductive objects of the metal top layer along a non-conductive surface.

[0018] According to a further embodiment of the metal substrate structure, the metal upper layer and / or the metal lower layer are pre-bent. Such a configuration of the SMMS may be useful in certain applications. The dielectric layer molded between the metal upper layer and the metal lower layer is also bowed or bent on the corresponding bent side.

[0019] According to a further embodiment of the metal substrate structure, the metal upper layer comprises a protruding region having a thickness, relative to the stacking direction from the metal lower layer towards the metal upper layer, that is greater than the thickness of the adjacent region of the metal upper layer. The metal upper layer can likewise comprise two or more protruding regions. The thickness of the metal upper layer can have a value between 100 μm and 500 μm, or up to 2000 μm. A thinner metal upper layer contributes to cost reduction. A thicker metal upper layer contributes to beneficial heat dissipation. If the metal upper layer comprises a protruding region, such a region can protrude up to the height of the corresponding semiconductor power module and can have a thickness of, for example, 20 mm, if the application is desired.

[0020] In addition, there are further geometrical and material constraints of the SMMS that can be realized. The metal top layer, the dielectric layer and the metal bottom layer can constitute a rectangle or a square, and according to the structure of the described SMMS, it can be produced even with relatively large side lengths, for example, 100 mm, 120 mm or 140 mm in the x- and / or y-directions. In this respect, the x- and y-directions correspond to the extent of the main plane, and the stacking direction represents the z-direction. Alternatively, the SMMS can be produced with smaller side lengths of 34 mm or 20 mm x 30 mm.

[0021] The metallization on the top surface of the SMMS realizing the metal overlayer can include Cu and / or Al. The metallization on the bottom surface of the SMMS realizing the metal underlayer can likewise include Cu and / or Al. Different top metallization pad thicknesses, for example for USW welding, are feasible. Additionally, the SMMS can include a pre-bowed backside metallization.

[0022] A controllable dielectric layer thickness is provided by the molding process, for example with values ​​ranging from 50 μm to 1000 μm. Furthermore, the material of the dielectric layer can be molded to form trenches or ribs between the top metallization pads. The dielectric layer can be compression molded to the final metal substrate structure in one compression molding step, with no additional masking, etching and cleaning steps required. This allows for greater freedom in semiconductor power module design. Furthermore, the described SMMS allows for reduced substrate costs and the ability to test parameters critical to yield (e.g. partial discharge) prior to chip assembly.

[0023] According to one embodiment, a semiconductor power module for a semiconductor device comprises an embodiment of the described metal substrate structure and electronics coupled to the metal upper layer of the metal substrate structure. The semiconductor power module can further comprise a heat sink coupled to the metal lower layer of the metal substrate structure for dissipating heat during operation of the semiconductor power module. In this way, the semiconductor power module can comprise a separate heat sink. Alternatively or additionally, the metal lower layer of the metal substrate structure can act as a heat sink itself, for example, configured with ribs or protrusions to provide beneficial heat dissipation. The metal lower layer can further act as a base plate of the semiconductor power module.

[0024] Additionally, a semiconductor power module may include two or more of the embodiments of the metal substrate structure described above.Electronic devices may include individual devices such as chips, integrated circuits and / or other devices.

[0025] According to an embodiment, a method for manufacturing an embodiment of the described metal substrate structure for a semiconductor power module comprises providing a metal upper layer having at least one through recess, which may be done for example by stamping, etching and / or cutting. The method further comprises providing a metal underlayer and providing a pumpable substance having predetermined material properties. The pumpable substance is a viscous feedstock of the dielectric layer to be formed. Thus, according to an embodiment, the pumpable substance is an epoxy and / or ceramic based liquid. Alternatively or additionally, the feedstock may comprise inorganic fillers loaded for improving thermal conductivity and / or CTE adjustment with respect to the metal upper layer and / or the metal underlayer.

[0026] The method further includes aligning the upper metal layer and the lower metal layer with respect to one another with a predetermined distance therebetween, which distance substantially predetermines the subsequent thickness of the dielectric layer. For example, this alignment can be achieved by placing the upper metal layer in a release film or liner, or other fixture, such as a mold chase of a molding tool. This allows for precise positioning of the provided metallization structure of the upper metal layer with respect to the lower metal layer, which can be useful, for example, when the upper metal layer is comprised of separate metal pads with different electrical potentials of operation.

[0027] The method includes placing a provided material between the aligned upper and lower metal layers, thereby forming a molded dielectric layer bonded to both the upper and lower metal layers. Molding can be performed, for example, by compression molding, transfer molding, and / or injection molding. If a release film is used for alignment, it can then be removed from the top surface of the metallization.

[0028] The step of placing the provided material includes providing a cavity with a predetermined boundary contour in at least one recess, and placing the provided material in the provided cavity, thereby forming a molded dielectric layer having a groove or barrier extending into the at least one recess. The cavity is formed between a forming tool and the metal overlayer to predetermine the subsequent contour of the groove or barrier. If there is more than one recess in the metal overlayer, a groove may be formed in one recess and a barrier may be formed in another recess. Alternatively, two grooves or two barriers may be formed.

[0029] As the described semiconductor power module and the described method of manufacture include or relate to the manufacture of an embodiment of a stamped and formed metal substrate structure, the described features and characteristics of the SMMS are also disclosed with respect to the semiconductor power module and method of manufacture, and vice versa.

[0030] The SMMS realizes a specific substrate design concept for semiconductor power modules that can operate in the range of insulation capabilities from 0.5 kV to 10.0 kV. The described SMMS can also be used in the low or medium voltage range. The described SMMS can be based on stamping, etching and / or cutting processes, where the metallization structure on the top surface of the substrate is realized before the assembly process of the top metallization to the dielectric layer. The assembly step that connects the top metal layer with the bottom metal layer is molding, which can be done by injection molding, transfer molding and / or compression molding. The molding and shaping of the dielectric layer does not require additional masking and etching processes, and a functional insulated metal substrate is directly obtained.

[0031] The metallization structure of the metal overlayer can be easily realized by a mechanical stamping process instead of time-consuming chemical masking, etching and cleaning steps. The stamping process can realize the steps included in the corresponding manufacturing method. Alternatively, the stamping process is performed at different locations and / or at different times, and the stamped metal overlayer comprises a recess structure. Furthermore, due to the process of molding the dielectric layer, the areas where the highest electric field concentration occurs can be directly covered with the dielectric molding material.

[0032] Stamped and compression molded metal substrate structures may enable at least one of the following advantages: Fewer manufacturing steps compared to traditional manufacturing processes, reducing manufacturing costs - Less metal waste, stamping residue can be reused The stamping process is less expensive than traditional masking / etching processes Stamping rather than etching reduces sample-to-sample variability High degree of freedom in board design: The thickness of the insulating dielectric layer can be easily varied and made thinner or thicker, compared to the traditional limit of 100-200 μm when using prepreg IMS technology. Metallization thickness can be increased (not limited by the etching process) ○ Local thickness variations of the metallization within one substrate are possible Stamping allows greater control of the geometry of the top metallization edges compared to etching, allowing thinner, more repeatable insulation distances to be achieved between different potentials on the top surface of the substrate. Allows partial discharge testing of raw boards without the application of further insulating media, as the critical areas for partial discharge (highest electric field concentration) are already present in the final dielectric medium Creepage distances can be achieved or at least increased directly in the mold tool by grooves and / or barriers in the mold material No adhesive is needed to attach the prepreg to the metallization, which reduces thermal conductivity between the metallization and the dielectric layer · Pre-assembly of die or terminal connections is possible prior to the compression molding process Allows the use of pre-bowed back plates, which is not possible with traditional lamination processes The molding process of forming a dielectric layer between the upper and lower metal layers can be easily detected by the bleed and mold flash at the edges of the metallization pattern. Such molded epoxy-based dielectric layers further comprise different materials than conventional metal substrates.

[0033] The present disclosure includes several embodiments, and all features described with respect to one of the embodiments are also disclosed herein with respect to the other embodiments, even if the respective feature is not explicitly mentioned in the context of a particular embodiment.

[0034] Exemplary embodiments are described below with the aid of schematic drawings and reference numbers. [Brief description of the drawings]

[0035] [Figure 1] FIG. 1 is a diagram of an embodiment of a semiconductor power module. [Diagram 2] 1 is a diagram of an embodiment of a metal substrate structure for a semiconductor power module. [Diagram 3] 1 is a diagram of an embodiment of a metal substrate structure for a semiconductor power module. [Figure 4] 1 is a diagram of an embodiment of a metal substrate structure for a semiconductor power module. [Diagram 5] 1 is a diagram of an embodiment of a metal substrate structure for a semiconductor power module. [Figure 6] 1 is a diagram of a manufacturing process for one embodiment of a metal substrate structure. [Figure 7] 1 is a flow chart of a method for manufacturing an embodiment of a metal substrate structure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0036] The accompanying drawings are included to provide further understanding. It should be understood that the embodiments shown in the drawings are illustrative representations and are not necessarily drawn to scale. The same reference numbers indicate elements or components having the same function. Insofar as elements or components correspond to each other in terms of their function in different drawings, the description will not be repeated for each of the following figures. For clarity, elements may not be shown with corresponding reference numbers in all figures.

[0037] FIG. 1 shows a side view of one embodiment of a semiconductor power module 1 for a semiconductor device. The semiconductor power module 1 comprises a metal substrate structure 10, an electronic device 2 coupled to the metal substrate structure 10, and a heat sink 3 also coupled to the metal substrate structure 10. With respect to the illustrated stacking direction A, the electronic device 2 is coupled to a stamped metal upper layer 11, and the heat sink 3 is coupled to a metal lower layer 13 of the metal substrate structure 10. The metal substrate structure 10 further comprises a molded dielectric layer 12 formed between the metal upper layer 11 and the metal lower layer 13. The metal substrate structure 10 can be described in the abbreviated form "SMMS" due to the stamped and molded elements.

[0038] The metal top layer 11 and the metal bottom layer 13 are both made of metal or at least include metals such as copper and / or aluminum. Alternative thermally and / or electrically conductive materials or combinations of materials can be used instead. The dielectric layer 12 is for example a filled epoxy. The filler may be ceramic-like or realized with other inorganic fillers. Alternatively or additionally, the dielectric layer 12 constitutes a ceramic-based insulating layer such as Al2O3, AlN, BN, Si3N4, SiO2, etc. The dielectric layer 12 can also be based on other materials suitable for transfer and compression molding such as bismaleimides, cyanate esters, polyimides and silicones, or based on ceramic materials such as hydroset materials. In this way, the SMMS 10 realizes an insulated metal substrate with a structured stamped top metallization, a metal back plate, and a dielectric insulating layer molded in between. The pads of the metal top layer 11 are connected to the components of the electronic device 2 via the leads 4.

[0039] The illustrated semiconductor power module 1 may be implemented as a gel-filled power module, in which the electronics 2, or the entire top surface of the SMMS 10, or more, is embedded in an epoxy and / or gel encapsulation, such as by molding after the SMMS 10 is manufactured.

[0040] 2-5 show, in schematic side view, an embodiment of a SMMS 10. In FIG. 2, a metal substrate structure 10 is shown including a stamped metal top layer 11 with two through recesses 14 that are filled by shaping a dielectric layer 12 in a predetermined manner. The dielectric layer 12 is shaped to extend into the recesses 14, with a dielectric groove 15 formed in one recess 14 and a dielectric barrier 16 formed in the other recess 14. The barrier 16 extends through the corresponding recess 14 and protrudes above the outer surface 111 of the metal top layer 11. The protruding portions of the barrier 16 can be termed ribs.

[0041] The grooves 15 and the barriers 16 are formed integrally with the dielectric layer 12 in one molding process and cover the edges 17 of the metal top layer 11 that limit the corresponding recesses 14. The edges 17 are generally the critical areas for partial discharges that correspond to the highest electric field concentrations (see FIG. 3 and the illustrated lightning symbols). According to the SMMS 10, these areas are already covered by the final medium of the dielectric layer 12. Furthermore, partial discharge testing of the raw substrate is possible without applying further insulating media. In this way, the highest electric field concentrations are already embedded in the material of the dielectric layer 12. Furthermore, the creepage distances in the molding tool can be directly increased by forming the grooves 15 and / or the barriers 16.

[0042] The multiple layers 11, 12 and 13 of the SMMS 10 have respective thicknesses D1, D2 and D3 with respect to the stacking direction A. The metallization metal top layer 11 can have a thickness D1 within a range of values ​​from 100 to 500 μm, or up to 2000 μm if improved heat dissipation is desired. Furthermore, the metal top layer 11 can have different thicknesses as well (see FIG. 4). For example, the metal top layer 11 comprises a protruding region 18 having a thickness of 500 μm, while a thinner adjacent region of the metal top layer 11 has a thickness of 100 μm.

[0043] The thickness D2 of the dielectric layer 12 may have a value in the range of 50 μm to 1000 μm, which may be predetermined simply by a given distance between the upper metal layer 11 and the lower metal layer 13 before molding the dielectric therebetween.

[0044] The thickness D3 of the metal underlayer 13 may have a predetermined value to enable reliable heat dissipation to the heat sink 3 of the semiconductor power module 1. The metal underlayer 13 realizes a base plate of the SMMS 10 and may have a thickness D3 of, for example, 0.5 mm to 5.0 mm.

[0045] Furthermore, with respect to the lateral direction B, the width of the recess 14 and therefore the maximum width of the groove 15 and / or the barrier 16 can be predetermined by a given stamping tool and corresponding protrusions forming the respective dimensions of the edges 17 and the recess 14. For example, the width or thickness of the trench in the groove 15 or the recess 14 can have a relative value of 0.1 to 0.9 times the distance between the opposing edges 17 limiting the corresponding recess 14, which corresponds to the distance between two adjacent metal pads of the metal top layer 11. The depth of the groove 15 can be equal to the thickness D1 of the metal top layer 11. Alternatively, the depth of the groove 15 can be even greater and can further partially include the thickness D2 of the dielectric layer 12.

[0046] For example, the width or thickness of the barrier 16 or rib in the recess 14 may have a relative value of 0.1 to 1.0 times the distance between the opposing edges 17 limiting the corresponding recess 14. Also, between the metallization pads of the metal upper layer 11, there may be one or several grooves / trenches and / or barriers / ribs. The ribs of the barrier 16 may have a height of, for example, 0.1 to 5.0 mm. Similarly, the depth of the grooves 15 may have a value of, for example, 0.1 to 5.0 mm. The ribs and / or grooves 15 may constitute a rectangular, hemispherical or triangular shape. Alternatively or additionally, the edge regions of the upper metallization pads of the metal upper layer 11 may in particular be overmolded with the material of the dielectric layer 12.

[0047] According to a further embodiment, the SMMS 10 can be formed by bending by providing a pre-bent upper metal layer 11 and / or lower metal layer 13 (see FIG. 5). By forming, the dielectric layer 12 is formed in a given free volume between the upper metal layer 11 and the lower metal layer 13.

[0048] Figure 6 shows three manufacturing states for manufacturing one embodiment of the SMMS 10. The corresponding manufacturing method steps can follow the flow chart shown in Figure 7. In step S1, a green sheet 19 is provided for forming the subsequent metallic top layer 11. Furthermore, the metallic bottom layer 13 can be provided as well as a pumpable substance with predetermined material properties realizing a liquid or viscous feedstock for the subsequent dielectric layer 12.

[0049] In step S2, the green sheet is stamped, for example, using a stamping tool having protrusions arranged to form recesses 14 and protruding areas 18. Alternatively or additionally, separate metal pads may also be stamped in such a stamping process.

[0050] In step S3, the stamped upper metal layer 11 and the provided lower metal layer 13 are aligned with respect to each other with a predetermined distance therebetween. This can be done, for example, by using a release film, to which the provided metallization structure of the upper metal layer 11 is assembled. Such a metal upper layer release film unit can then be placed relative to the provided lower metal layer 13, for example with the upper metal layer 11 facing the lower metal layer 13.

[0051] In step S4, the provided material is placed into the free volume between the aligned upper and lower metal layers 11, 13, thereby processing the shaping of the dielectric layer 12. The shaping of the dielectric layer 12 can be performed by injection molding, transfer molding, and / or compression molding, and can include the formation of one or more grooves 15 and / or barriers 16 extending through the corresponding recesses 14. For example, this is done by providing a respective cavity limited by a molding tool and the upper metal layer 11 in the region of the recesses 14. The provided material is then placed into such cavities to form the trenches, grooves 15, barriers 16 and / or ribs.

[0052] Thus, an embodiment of a metal substrate structure 10 for a semiconductor power module 1 can be manufactured such that it consists of a stamped metal plate upper surface realizing a metal upper layer 11, an epoxy-based insulator realizing a dielectric layer 12, and a metal plate lower surface realizing a metal lower layer 13. The metal upper layer 11 comprises at least one recess 14 and an upper metallization comprising a number of pads. Spaces between such metal pads can be filled with a dielectric material of the dielectric layer 12. The dielectric material filling the space is the same insulating material as one of the dielectric layers 12 between the upper and lower metallizations. According to an embodiment, the dielectric layer 12 can be molded and structured with bumps or trenches. The manufacture of the metal substrate structure 10 can be manufactured in a single step by molding the stamped upper metallization on the lower metal plate without additional masking and etching processes.

[0053] Thus, the design of the semiconductor power module 1 can include one or more of the following: Insulating substrate: ○ One large SMMS10 with a side length in the transverse direction B (corresponding to the x-direction and / or y-direction) of up to 100 mm, 120 mm or 140 mm Dielectric molding material having integrated circuit metallization on top ○ Metal plates containing inorganic filled resin insulating material and circuit metallization Chip bonded to the SMMS10 by diffusion soldering, sintering, or other suitable bonding methods such as adhesives · Main terminals joined to the SMMS10 by soldering, ultrasonic welding, or other suitable joining method Auxiliary terminals joined to the SMMS10 by soldering, ultrasonic welding, wire bonding, or other suitable joining method Backside Metallization: Metallic underlayer 13 of SMMS 10 made from copper, aluminum, or corresponding alloys or composites Metal underlayer 13 of SMMS 10 with flat or pre-bowed backside The realization of the described SMMS 10 and semiconductor power module 1 for the medium to high voltage regime (e.g., 0.5-10.0 kV insulation capability) with a substrate based on stamped top metallization, compression molded to a dielectric layer 12 and a metal back plate, all in one process, offers several potential product improvements compared to conventional substrate designs. In addition, the above-mentioned features enable the following advantages, among others: Optimization of the thickness D2 of the insulating dielectric layer 12 based on voltage class and application The semiconductor power module 1 has improved power cycling capability since the CTE (coefficient of thermal expansion) of the compression mold material can be tailored to match the Cu / Al of the top metal layer 11 and / or bottom metal layer 13, reducing the CTE mismatch.

[0054] The thin dielectric layer 12 allows the SMMS 10 to be realized in larger sizes and with fewer manufacturing steps, at reduced cost, compared to conventional designs that include, for example, expensive AlN layers, which are difficult to achieve given uniform quality.

[0055] Possible pre-assembly of the die and / or terminals before the compression molding process allows the chips and chip assemblies to be pre-tested and pre-screened "individually" or at least in smaller assemblies as whole power modules.

[0056] The highest electric field concentration in the epoxy material of the dielectric layer 12 allows the SMMS 10 to be pre-tested in terms of partial discharge before the die is attached, without special environments such as CO2, making it comparable to the final partial discharge testing of the semiconductor power module 1 (in view of conventional designs, partial discharge is measured at board level in a 6 bar CO2 environment that "simulates" the future silicone gel).

[0057] The described embodiments shown in Figures 1-7 represent exemplary embodiments of the improved metal substrate structure 10, semiconductor power module 1, and manufacturing method thereof, and therefore do not constitute an exhaustive list of all embodiments. The actual arrangements and methods may differ from the embodiments shown, for example, for the metal substrate structure and power module. [Explanation of symbols]

[0058] Explanation of symbols 1. Semiconductor power module 2 Electronic equipment 3. Heat sink 4 Lead 10 Metal Substrate 11 Metallic top layer of metal substrate 111 Outer surface of metal upper layer 12 Dielectric layer of metal substrate 13 Metallic underlayer of metal substrate 14 Stamped recesses 15 Molded groove 16 Molded Barrier 17 Metallic upper edge 18 Protruding areas on the metal top layer 19 Raw Sheets A Stacking direction B. Horizontal D1 Thickness of the metal top layer D2 thickness of the dielectric layer D3 Thickness of metal underlayer S(i) Steps of a method for manufacturing a metal substrate structure for a semiconductor power module

Claims

1. A metal substrate structure (10) for a semiconductor power module comprising: a metal upper layer (11) having at least one through recess (14), a metal underlayer (13), a dielectric layer (12) bonded to both said upper metal layer (11) and said lower metal layer (13) and formed by molding between said upper metal layer (11) and said lower metal layer (13); The dielectric layer (12) is shaped to extend into at least one through recess (14); the dielectric layer (12) is shaped to form a groove (15) in at least one through-hole (14) and / or a barrier (16) extending through the at least one through-hole (14) protruding above an outer surface (111) of the metal overlayer (11); A metal substrate structure (10), wherein the width of the barrier (16) in a direction perpendicular to a surface where the at least one through-hole (14) contacts the metal upper layer (11) is smaller than the width of the at least one through-hole (14).

2. 2. The metal substrate structure (10) of claim 1, wherein the metal overlayer (11) including the at least one through recess (14) is formed by stamping.

3. The metal substrate structure (10) of claim 1 or 2, wherein said dielectric layer (12) is an epoxy and / or ceramic based dielectric.

4. The metal substrate structure (10) of any one of claims 1 to 3, wherein the at least one through recess (14) is limited by edges (17) of the metal overlayer (11), and the dielectric layer (12) is molded to cover at least one of the edges (17).

5. The metal substrate structure (10) of any one of claims 1 to 4, wherein at least one of the metal upper layer (11) and the metal lower layer (13) is pre-curved.

6. The metal substrate structure (10) according to any one of claims 1 to 5, wherein the dielectric layer (12) is formed to have a thickness (D2) of 50 μm to 1000 μm in a stacking direction (A) from the lower metal layer (13) to the upper metal layer (11).

7. The metal substrate structure (10) according to any one of claims 1 to 6, wherein the metal upper layer (11) is provided with a protruding region (18) having a thickness (D1) greater than a thickness of an adjacent region of the metal upper layer (11) in a stacking direction (A) from the metal lower layer (13) toward the metal upper layer (11).

8. A metal substrate structure (10) described in any one of claims 1 to 7, wherein the depth of the groove (15) is shallower than the depth of the at least one through recess (14).

9. A semiconductor power module (1) for a semiconductor device, comprising: - a metal substrate structure (10) according to any one of claims 1 to 8, an electronic device (2) coupled to the metal upper layer (11) of said metal substrate structure (10); A semiconductor power module (1) comprising:

10. A method for producing a metal substrate structure (10) for a semiconductor power module according to any one of claims 1 to 8, comprising the steps of: - providing a metallic upper layer (11) having at least one through recess (14); providing a metal underlayer (13); - providing a pumpable substance; - aligning said upper metal layer (11) and said lower metal layer (13) with respect to each other with a predetermined gap therebetween; - placing the provided material between the aligned upper metal layer (11) and lower metal layer (13), thereby forming a shaped dielectric layer (12) bonded to both the upper metal layer (11) and the lower metal layer (13), the step of placing the provided material comprising: providing a cavity in said at least one through recess (14) with a predetermined boundary contour; and placing the provided material into the provided cavity to form the shaped dielectric layer (12) having a groove (15) or barrier (16) extending into the at least one through recess (14).

11. 11. The method according to claim 10, wherein the metal top layer (11) having at least one through recess (14) is formed by stamping.

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