Chip temperature adjustment method

Abstract

A chip temperature adjustment method, comprising: acquiring temperature data of a reference chip (1031a) multiple times using a temperature sensor (1032); if the temperature data of the reference chip (1031a) is not within a predetermined temperature range, a first temperature compensation value for adjusting the temperature of an adapter (101) and a second temperature compensation value for adjusting the temperature of a test base (102) are identified based on the temperature data of the reference chip (1031a) and the predetermined temperature value; and, when testing a chip (1031) to be tested, controlling a first temperature adjustment unit (104) to adjust the temperature of the adapter (101) and controlling a second temperature adjustment unit (105) to adjust the temperature of the test base (102).

Description

[Technical field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims priority to a Chinese patent application filed on March 11, 2022, bearing application number 202210238853.3, and entitled "Chip temperature control method", the entire contents of which are incorporated herein by reference.

[0002] The present application relates to the field of chip testing, and in particular to a method for adjusting chip temperature. [Background technology]

[0003] When testing a chip, it is necessary to adjust the temperature of the chip to be tested within a predetermined test temperature range and then perform the test.

[0004] In the temperature control method of the test equipment in the related art, the test equipment is provided with at least one adapter on a base, the temperature control device of the adapter includes a heating sheet and a temperature sensor provided on the adapter, and a cooling tip provided on the heating sheet, and a heat sink is provided above the cooling tip, when the adapter is in contact with an electronic device for testing, the heating sheet can be used to heat the electronic device to a test temperature, and when the temperature of the electronic device exceeds the test temperature, the cold end below the cooling tip can be used to rapidly cool the electronic device, so that the electronic device is kept in a predetermined test temperature range for testing, and the test pass rate of the product is ensured. In the above technical solution, the heating sheet and the cold end are used to adjust the temperature of the adapter, and the temperature of the test equipment is also adjusted, but the temperature sensor provided on the adapter only obtains the surface temperature of the electronic device, and is easily affected by environmental temperature changes, so that this temperature control method has a low accuracy. Summary of the Invention

[0005] According to various embodiments of the present application, there is provided a chip temperature adjustment method for use in a test equipment, the test equipment including an adapter and a test base fitted to the adapter, the adapter and the test base being fitted together to form a test chamber for placing a chip to be tested, a temperature sensor being provided within the test chamber, the test equipment further including a first temperature adjustment unit for adjusting a temperature of the adapter and a second temperature adjustment unit for adjusting a temperature of the test base, the method further including a step of acquiring temperature data of a reference chip multiple times using the temperature sensor, the reference chip being selected from the same lot of chips to be tested. When the temperature data of the reference chip is not within a predetermined temperature range, a first temperature compensation value for adjusting the temperature of the adapter and a second temperature compensation value for adjusting the temperature of the test base are identified based on the temperature data of the reference chip and the predetermined temperature value of the reference chip, and when testing a chip to be tested, the first temperature adjustment unit is controlled to adjust the temperature of the adapter based on the first temperature compensation value, and the second temperature adjustment unit is controlled to adjust the temperature of the test base based on the second temperature compensation value so that the temperature of the chip to be tested is within a predetermined temperature range.

[0006] In some embodiments, determining a first temperature compensation value for adjusting the temperature of the adapter based on the temperature data of the reference chip and a predetermined temperature value of the reference chip includes obtaining a corresponding temperature data curve based on the temperature data of the reference chip, obtaining a starting temperature value of the chip to be tested based on the temperature data curve, and determining a first temperature compensation value based on the starting temperature value and the predetermined temperature value.

[0007] In some embodiments, determining a first temperature compensation value based on the starting temperature value and a predetermined temperature value includes determining the first temperature compensation value based on a difference value between the starting temperature value and the predetermined temperature value and a corresponding first proportionality coefficient.

[0008] In some embodiments, in the step of determining the first temperature compensation value based on the difference between the start temperature value and a predetermined temperature value and a corresponding first proportionality coefficient, when the start temperature value is T1, the predetermined temperature value is P, the difference between the start temperature value and the predetermined temperature value is X, and a first proportionality coefficient is M, X, P, and T1 satisfy the following formula, X=P-T1, and the first temperature compensation value A satisfies the following formula: A=X*M.

[0009] In some embodiments, the step of determining a second temperature compensation value for adjusting the temperature of the test base based on the temperature data of the reference chip and a predetermined temperature value of the reference chip includes the steps of obtaining a corresponding temperature data curve based on the temperature data of the reference chip, obtaining an average temperature value at which the tested chip stabilizes based on the temperature data curve, and determining a second temperature compensation value based on the average temperature value and the predetermined temperature value.

[0010] In some embodiments, determining a second temperature compensation value based on the average temperature value and a predetermined temperature value includes determining the second temperature compensation value based on a difference value between the average temperature value and a predetermined temperature value and a corresponding second proportionality coefficient.

[0011] In some embodiments, in the process of determining the second temperature compensation value based on the difference between the average temperature value and a predetermined temperature value and the corresponding second proportionality coefficient, when the average temperature value is T2, the predetermined temperature value is P, the difference between the average temperature value and the predetermined temperature value is Y, and the second proportionality coefficient is N, Y, P, and T2 satisfy the following formula Y=P-T1, and the second temperature compensation value B satisfies the following formula: B=Y*N.

[0012] In some embodiments, the temperature sensor includes a first temperature sensor provided on an adapter and a second temperature sensor provided on a test base, the first temperature sensor is for acquiring first temperature data of the reference chip multiple times, and the second temperature sensor is for acquiring second temperature data of the reference chip multiple times, and the step of determining a first temperature compensation value for adjusting the temperature of the adapter and a second temperature compensation value for adjusting the temperature of the test base based on the temperature data of the reference chip and a predetermined temperature value of the reference chip includes a step of first determining the first temperature compensation value based on the first temperature data of the reference chip and the predetermined temperature value, and then determining the second temperature compensation value based on the second temperature data of the reference chip and the predetermined temperature value.

[0013] In some embodiments, the process of first determining the first temperature compensation value based on the first temperature data of the reference chip and a predetermined temperature value, and then determining the second temperature compensation value based on the second temperature data of the reference chip and the predetermined temperature value includes the steps of: picking up the reference chip using the adapter, acquiring first temperature data of the reference chip multiple times using the first temperature sensor, and determining the first temperature compensation value based on the temperature data of the reference chip and the predetermined temperature value of the reference chip; and placing the reference chip on the test base using the adapter, and then acquiring second temperature data of the reference chip multiple times using the second temperature sensor, and determining the second temperature compensation value based on the second temperature data of the reference chip and the predetermined temperature value.

[0014] In some embodiments, the temperature sensor includes a first temperature sensor provided on an adapter and a second temperature sensor provided on a test base, the first temperature sensor is for acquiring first temperature data of the reference chip multiple times, and the second temperature sensor is for acquiring second temperature data of the reference chip multiple times, and the step of determining a first temperature compensation value for adjusting the temperature of the adapter and a second temperature compensation value for adjusting the temperature of the test base based on the temperature data of the reference chip and a predetermined temperature value of the reference chip includes a step of determining the first temperature compensation value based on the first temperature data of the reference chip and the predetermined temperature value, and a step of determining the second temperature compensation value based on the second temperature data of the reference chip and the predetermined temperature value.

[0015] In some embodiments, the temperature sensor includes a first temperature sensor provided on an adapter and a second temperature sensor provided on a test base, the first temperature sensor is for acquiring first temperature data of the reference chip multiple times, and the second temperature sensor is for acquiring second temperature data of the reference chip multiple times, and the step of determining a first temperature compensation value for adjusting the temperature of the adapter and a second temperature compensation value for adjusting the temperature of the test base based on the temperature data of the reference chip and a predetermined temperature value of the reference chip includes a step of first determining the second temperature compensation value based on the second temperature data of the reference chip and the predetermined temperature value, and then determining the first temperature compensation value based on the first temperature data of the reference chip and the predetermined temperature value.

[0016] The details of one or more embodiments of the application are set forth in the drawings and description below. Other features, objects, and advantages of the application will become apparent from the description, drawings, and claims. [Brief description of the drawings]

[0017] To better describe and explain the embodiments and / or examples disclosed herein, reference may be made to one or more drawings, in which additional details or examples for illustrating the drawings should not be deemed to limit the scope of the disclosed application, the presently described embodiments and / or examples, or any of the best modes of these applications as currently understood.

[0018] [Figure 1] FIG. 1 is a schematic diagram of a test device in accordance with one or more embodiments. [Diagram 2] 1 is a flow diagram of a method for regulating chip temperature according to one or more embodiments. [Diagram 3] FIG. 13 is a schematic flow diagram for determining a first temperature compensation value according to one or more embodiments. [Figure 4] FIG. 1 is a schematic diagram of a starting temperature value in a temperature data curve according to one or more embodiments. [Diagram 5] FIG. 13 is a schematic flow diagram for determining a second temperature compensation value according to one or more embodiments. [Figure 6] FIG. 1 is a schematic diagram of a stable average temperature value in a temperature data curve in accordance with one or more embodiments. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0019] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be described in more detail below with reference to the accompanying drawings and examples. It is understood that the specific examples described herein are only for the purpose of illustrating the present application, and are not intended to limit the present application.

[0020] In addition, the terms "first," "second," etc. in the description, claims, and above drawings of this application are used to distinguish between similar objects and are not necessary to describe a particular order or chronology.

[0021] The method embodiments provided in the embodiments of the present application are applicable to a test equipment. Figure 1 is a schematic diagram of the configuration of the test equipment in the embodiments of the present application. As shown in Figure 1, the test equipment includes an adapter 101 and a test base 102 fitted and installed in the adapter 101, the adapter 101 and the test base 102 are fitted together to form a test chamber 103 for placing a chip 1031 to be tested, a temperature sensor 1032 is provided in the test chamber 103, and the test equipment further includes a first temperature adjustment unit 104 for adjusting the temperature of the adapter 101 and a second temperature adjustment unit 105 for adjusting the temperature of the test base 102.

[0022] In some embodiments, the first temperature adjustment unit 104 includes a heating rod provided in the adapter 101 and a low-temperature flow path for inputting low-temperature gas, and the second temperature adjustment unit 105 includes a flow path for inputting high-temperature or low-temperature gas. Note that, other temperature adjustment structures may be used for the first temperature adjustment unit 104 and the second temperature adjustment unit 105, but this is not limited to this embodiment.

[0023] In some embodiments, as shown in FIG. 2, a chip temperature adjustment method is provided, which is described as an example of applying the method to the test equipment in FIG. 1, and includes the following steps.

[0024] S201: The temperature sensor 1032 obtains temperature data of the reference chip 1031a multiple times. Here, the reference chip 1031a is selected from the chips 1031 to be tested of the same lot, and has approximately the same temperature as the chips 1031 to be tested of the same lot.

[0025] S202: When the temperature data of the reference chip 1031a is not within a predetermined temperature range, a first temperature compensation value for adjusting the temperature of the adapter 101 and a second temperature compensation value for adjusting the temperature of the test base 102 are identified based on the temperature data of the reference chip 1031a and the predetermined temperature value. When testing the chip 1031 to be tested, it is necessary to adjust the temperature of the chip 1031 to be tested to a predetermined temperature range. In this embodiment, when the reference chip 1031a is used as a reference, if the temperature of the reference chip 1031a is within the predetermined temperature range, it is not necessary to adjust the temperature of the chip 1031 to be tested. If the temperature of the reference chip 1031a is not within the predetermined temperature range, it is necessary to specify a first temperature compensation value for adjusting the temperature of the adapter 101 and a second temperature compensation value for adjusting the temperature of the test base 102, and the temperature of the reference chip 1031a can be adjusted to the predetermined temperature range by the first temperature compensation value and the second temperature compensation value. Note that the predetermined temperature range may be set according to actual needs.

[0026] S203: When testing the chip 1031 to be tested, the first temperature adjustment unit 104 is controlled to adjust the temperature of the adapter 101 based on a first temperature compensation value, and the second temperature adjustment unit 105 is controlled to adjust the temperature of the test base 102 based on a second temperature compensation value, so that the temperature of the chip 1031 to be tested is within a predetermined temperature range.

[0027] In the related art, the temperature of the chip to be tested is adjusted only by the adapter 101. In this embodiment, when the chip to be tested is tested, the first temperature adjustment unit 104 controls to adjust the temperature of the adapter 101 according to the first temperature compensation value, and the second temperature adjustment unit 105 controls to adjust the temperature of the test base 102 according to the second temperature compensation value, that is, temperature adjustment is performed for two types of the adapter 101 and the test base 102, and in addition to adjusting the temperature of the chip to be tested 1031 by the adapter 101, the test base 102 also adjusts the environmental temperature where the chip to be tested 1031 exists, so that the environmental temperature is closer to the actual temperature of the chip to be tested 1031, and the accuracy of the temperature adjustment of the chip to be tested in this embodiment is higher than that of the related art, which adjusts the temperature of the chip to be tested only by the adapter 101.

[0028] In addition, in the related art, it is necessary to obtain the temperature compensation value of the chip to be tested in each test process before performing temperature adjustment, so the efficiency of temperature adjustment for the chip to be tested is low. In this embodiment, a reference chip 1031a is selected from the chips 1031 to be tested in the same lot. Since the temperatures of the chips 1031 to be tested in the same lot are almost the same, a first temperature compensation value for adjusting the temperature of the adapter 101 and a second temperature compensation value for adjusting the temperature of the test base 102 can be specified based on the temperature data of the reference chip 1031a and a predetermined temperature value. In addition, it is not necessary to re-obtain the temperature adjustment compensation value of the chip 1031 to be tested in each test process, and the first temperature compensation value and the second temperature compensation value are set as the temperature adjustment compensation value of the chip 1031 to be tested, thereby improving the temperature adjustment efficiency of the chip 1031 to be tested and also improving the test efficiency of the chip 1031 to be tested.

[0029] In some embodiments, as shown in FIG. 3, determining a first temperature compensation value for adjusting the temperature of the adapter 101 based on the temperature data of the reference chip 1031a and the predetermined temperature value includes the following steps.

[0030] S301: Based on the temperature data of the reference chip 1031a, obtain a corresponding temperature data curve. The collected temperature data is discrete data and cannot be directly analyzed, so a smoothing algorithm is applied to the temperature data to provide curve characteristics, and a temperature data curve is obtained.

[0031] S302: Obtain the starting temperature value of the chip 1031 to be tested based on the temperature data curve.

[0032] S303: Identify a first temperature compensation value based on the starting temperature value and the predetermined temperature value.

[0033] A first temperature compensation value is determined based on the difference between the start temperature value and the predetermined temperature value and a corresponding first proportionality coefficient, where the first proportionality coefficient is set according to an actual adjustment demand.

[0034] Specifically, as shown in FIG. 4, the start temperature value is defined as T1, the predetermined temperature value is defined as P, the difference between the start temperature value and the predetermined temperature value is defined as X, and the first proportionality coefficient is defined as M. The X, P, and T1 satisfy the following formula, X=P-T1, and the first temperature compensation value is defined as A, which satisfies the following formula: A=X*M.

[0035] A difference value between the start temperature value and the predetermined temperature value is multiplied by a first proportionality coefficient to obtain a first temperature compensation value, and the first temperature compensation value is used to adjust the temperature of the adapter 101 .

[0036] In some embodiments, as shown in FIG. 5, determining the second temperature compensation value for adjusting the temperature of the test base 102 based on the temperature data of the reference chip 1031a and the predetermined temperature value includes the following steps.

[0037] S401: Based on the temperature data of the reference chip 1031a, a corresponding temperature data curve is obtained. The collected temperature data is discrete data and cannot be directly analyzed, so a smoothing algorithm is applied to the temperature data to provide curve characteristics, and a temperature data curve is obtained.

[0038] S402: Based on the temperature data curve, obtain the average temperature value at which the temperature of the tested chip 1031 is stable.

[0039] S403: Identify a second temperature compensation value based on the average temperature value and the predetermined temperature value.

[0040] A second temperature compensation value is determined based on the difference between the average temperature value and the predetermined temperature value and a corresponding second proportionality coefficient, where the second proportionality coefficient is set according to actual regulation demand.

[0041] Specifically, as shown in FIG. 6, the average temperature value at which the temperature of the chip 1031 being tested reaches a stable state is defined as T2, the predetermined temperature value is defined as P, the difference between the average temperature value and the predetermined temperature value is defined as Y, and the second proportionality coefficient is defined as N. The Y, P, and T2 satisfy the following equation Y=P-T2, and the second temperature compensation value is defined as B, which satisfies the following equation: B=Y*N.

[0042] The difference between the average temperature value and the predetermined temperature value is multiplied by a second proportionality factor to determine a second temperature compensation value, and the second temperature compensation value is used to adjust the temperature of the test base 102 .

[0043] In some embodiments, the temperature sensor 1032 includes a first temperature sensor 1032a provided on the adapter 101 and a second temperature sensor 1032b provided on the test base 102, the first temperature sensor 1032a is for acquiring the first temperature data of the reference chip 1031a multiple times, and the second temperature sensor 1032b is for acquiring the second temperature data of the reference chip 1031a multiple times. In the method for determining the first temperature compensation value for adjusting the temperature of the adapter 101 and the second temperature compensation value for adjusting the temperature of the test base 102 based on the temperature data of the reference chip 1031a and the predetermined temperature value, first, the first temperature compensation value is determined based on the first temperature data of the reference chip 1031a and the predetermined temperature value, and then the second temperature compensation value is determined based on the second temperature data of the reference chip 1031a and the predetermined temperature value.

[0044] Specifically, the adapter 101 picks up the reference chip 1031a, obtains the first temperature data of the reference chip 1031a multiple times during the pick-up using the first temperature sensor 1032a, determines the first temperature compensation value based on the first temperature data of the reference chip 1031a and a predetermined temperature value, and adjusts the temperature of the adapter 101 using the first temperature compensation value. The method of determining the first temperature compensation value has been described in the above embodiment, and will not be described again here. The adapter 101 places the reference chip 1031a behind the test base 102, obtains the second temperature data of the reference chip 1031a using the second temperature sensor 1032b, determines the second temperature compensation value based on the second temperature data of the reference chip 1031a and a predetermined temperature value, and then adjusts the temperature of the test base 102 using the second temperature compensation value. The method of determining the second temperature compensation value has been described in the above embodiment, and will not be described again here.

[0045] In the above embodiment, the adapter 101 adjusts the temperature of the adapter 101 using the first temperature compensation value in the process of picking up the reference chip 1031a, and adjusts the temperature of the test base 102 using the second temperature compensation value after the chip 1031 to be tested is placed in the test chamber 103, which can adjust the temperature of the chip 1031 to be tested faster than adjusting the temperature of the adapter 101 and the test base 102 after the chip 1031 to be tested is placed in the test chamber 103. Next, the temperature of the adapter 101 is initially adjusted using the first temperature compensation value, and then the temperature of the test base 102 is finely adjusted using the second temperature compensation value, thereby making the temperature adjustment more accurate.

[0046] In some embodiments, the temperature sensor 1032 includes a first temperature sensor 1032a provided on the adapter 101 and a second temperature sensor 1032b provided on the test base 102, the first temperature sensor 1032a is for acquiring the first temperature data of the reference chip 1031a multiple times, and the second temperature sensor 1032b is for acquiring the second temperature data of the reference chip 1031a multiple times. In the method for determining a first temperature compensation value for adjusting the temperature of the adapter 101 and a second temperature compensation value for adjusting the temperature of the test base 102 based on the temperature data of the reference chip 1031a and a predetermined temperature value, the first temperature compensation value is determined based on the first temperature data of the reference chip 1031a and the predetermined temperature value, and the second temperature compensation value is determined based on the second temperature data of the reference chip 1031a and the predetermined temperature value.

[0047] In the above embodiment, the adapter 101 obtains the first temperature data after placing the reference chip 1031a on the test base 102, and the test base 102 obtains the second temperature data at the same time. The first temperature compensation value and the second temperature compensation value are simultaneously used to adjust the temperatures of the adapter 101 and the test base 102 respectively, so that the adjustment time is short.

[0048] In some embodiments, the temperature sensor 1032 includes a first temperature sensor 1032a provided on the adapter 101 and a second temperature sensor 1032b provided on the test base 102, the first temperature sensor 1032a is for acquiring the first temperature data of the reference chip 1031a multiple times, and the second temperature sensor 1032b is for acquiring the second temperature data of the reference chip 1031a multiple times. In the method for determining the first temperature compensation value for adjusting the temperature of the adapter 101 and the second temperature compensation value for adjusting the temperature of the test base 102 based on the temperature data of the reference chip 1031a and the predetermined temperature value, first, the second temperature compensation value is determined based on the second temperature data of the reference chip 1031a and the predetermined temperature value, and then the first temperature compensation value is determined based on the first temperature data of the reference chip 1031a and the predetermined temperature value.

[0049] In the above embodiment, the reference chip 1031a is placed in the test chamber 103, a second temperature compensation value is determined based on the second temperature data of the reference chip 1031a, and the temperature of the test base 102 is adjusted using the second temperature compensation value; then, the adapter 101 is pressed down to obtain the first temperature data, a first temperature compensation value is determined, and the temperature of the adapter 101 is adjusted using the first temperature compensation value, thereby accurately adjusting the temperature of the chip 1031 to be tested.

[0050] It should be understood that although the various steps in the above flow chart are shown in the order indicated by the arrows, the steps are not necessarily performed in the order indicated by the arrows. Unless otherwise expressly stated herein, the order of the steps is not strictly limited, and the steps may be performed in other orders. In addition, at least some of the steps in the above flow chart may include multiple steps or stages, which are not necessarily performed simultaneously, but may be performed at different times, and the order of the steps or stages is not necessarily performed sequentially, but may be performed sequentially or alternately with other steps or at least some steps or stages in other steps.

[0051] The technical features of the above embodiments can be combined in any combination, and for the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, any combination should be considered to be within the scope described in this specification.

[0052] The above examples only show some embodiments of the present invention, and the description is specific and detailed, but it should not be understood as limiting the scope of the patent of the present invention. It should be noted that those skilled in the art can make some modifications and improvements without departing from the concept of the present application, all of which are within the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of the attached claims.

Claims

1. A chip temperature adjustment method for a test device, the test device including an adapter, a test base fitted to the adapter, a test chamber for placing a chip to be tested, the test chamber being configured by fitting the adapter and the test base, a first temperature adjustment unit for adjusting the temperature of the adapter, and a second temperature adjustment unit for adjusting the temperature of the test base, the method comprising the steps of: acquiring temperature data of a reference chip multiple times using the temperature sensor, the reference chip being selected from the same lot of chips to be tested; determining a first temperature compensation value for adjusting the temperature of the adapter and a second temperature compensation value for adjusting the temperature of the test base based on the temperature data of the reference chip and a predetermined temperature value when the temperature data of the reference chip is not within a predetermined temperature range; When testing the chip to be tested, controlling the first temperature adjustment unit to adjust the temperature of the adapter based on the first temperature compensation value, and controlling the second temperature adjustment unit to adjust the temperature of the test base based on the second temperature compensation value, so that the temperature of the chip to be tested is within the predetermined temperature range; In the step of determining a first temperature compensation value for adjusting the temperature of the adapter based on the temperature data of the reference chip and a predetermined temperature value of the reference chip, obtaining a corresponding temperature data curve based on the temperature data of the reference chip; obtaining a starting temperature value of the chip to be tested based on the temperature data curve; determining a first temperature compensation value based on the starting temperature value and the predetermined temperature value; A chip temperature adjustment method comprising:

2. In the step of identifying a first temperature compensation value based on the start temperature value and the predetermined temperature value, determining the first temperature compensation value based on a difference between the start temperature value and the predetermined temperature value and a corresponding first proportionality coefficient; 2. The method of claim 1 .

3. In the step of determining the first temperature compensation value based on a difference value between the start temperature value and the predetermined temperature value and a corresponding first proportionality coefficient, When the start temperature value is T1, the predetermined temperature value is P, the difference between the start temperature value and the predetermined temperature value is X, and a first proportionality coefficient is M, X, P, and T1 satisfy the following formula: X=P-T1, and the first temperature compensation value satisfies the following formula:

3. The method of claim 2 . A=X*M.

4. A chip temperature adjustment method applicable to a test equipment, the test equipment including an adapter, a test base fitted to the adapter, a test chamber for placing a chip to be tested formed by fitting the adapter and the test base, a first temperature adjustment unit for adjusting the temperature of the adapter, and a second temperature adjustment unit for adjusting the temperature of the test base, the method comprising the steps of: acquiring temperature data of a reference chip multiple times using the temperature sensor, the reference chip being selected from the same lot of chips to be tested; determining a first temperature compensation value for adjusting the temperature of the adapter and a second temperature compensation value for adjusting the temperature of the test base based on the temperature data of the reference chip and a predetermined temperature value when the temperature data of the reference chip is not within a predetermined temperature range; When testing the chip to be tested, controlling the first temperature adjustment unit to adjust the temperature of the adapter based on the first temperature compensation value, and controlling the second temperature adjustment unit to adjust the temperature of the test base based on the second temperature compensation value, so that the temperature of the chip to be tested is within the predetermined temperature range; determining a second temperature compensation value for adjusting the temperature of the test base based on the temperature data of the reference chip and a predetermined temperature value of the reference chip, obtaining a corresponding temperature data curve based on the temperature data of the reference chip; obtaining an average temperature value at which the tested chip temperature reaches a steady state based on the temperature data curve; determining a second temperature compensation value based on the average temperature value and a predetermined temperature value. A chip temperature adjustment method comprising:

5. In the step of determining a second temperature compensation value based on the average temperature value and the predetermined temperature value, determining the second temperature compensation value based on a difference between the average temperature value and the predetermined temperature value and a corresponding second proportionality coefficient; 5. The method of claim 4.

6. In the step of determining the second temperature compensation value based on a difference between the average temperature value and the predetermined temperature value and a corresponding second proportionality coefficient, When the average temperature value is T2, the predetermined temperature value is P, the difference between the average temperature value and the predetermined temperature value is Y, and a second proportionality coefficient is N, the Y, P, and T2 satisfy the following formula Y=P-T2, and the second temperature compensation value B satisfies the following formula:

6. The method of claim 5 . B=Y*N.

7. The temperature sensor includes a first temperature sensor provided on the adapter and a second temperature sensor provided on the test base, the first temperature sensor is for acquiring first temperature data of the reference chip a plurality of times, and the second temperature sensor is for acquiring second temperature data of the reference chip a plurality of times, and in the step of specifying the first temperature compensation value for adjusting the temperature of the adapter and the second temperature compensation value for adjusting the temperature of the test base based on the temperature data of the reference chip and a predetermined temperature value of the reference chip, First, the first temperature compensation value is determined based on a first temperature data of the reference chip and the predetermined temperature value, and then the second temperature compensation value is determined based on a second temperature data of the reference chip and the predetermined temperature value.

7. The method according to any one of claims 1 to 6.

8. In the step of firstly determining the first temperature compensation value based on the first temperature data of the reference chip and the predetermined temperature value, and then determining the second temperature compensation value based on the second temperature data of the reference chip and the predetermined temperature value, picking up the reference chip using the adapter, acquiring first temperature data of the reference chip multiple times using the first temperature sensor, and determining the first temperature compensation value based on the first temperature data of the reference chip and the predetermined temperature value; and after placing the reference chip on the test base using the adapter, acquiring second temperature data of the reference chip multiple times using the second temperature sensor, and determining the second temperature compensation value based on the second temperature data of the reference chip and the predetermined temperature value.

8. The method of claim 7.

9. The temperature sensor includes a first temperature sensor provided on the adapter and a second temperature sensor provided on the test base, the first temperature sensor is for acquiring first temperature data of the reference chip a plurality of times, and the second temperature sensor is for acquiring second temperature data of the reference chip a plurality of times, and in the step of specifying the first temperature compensation value for adjusting the temperature of the adapter and the second temperature compensation value for adjusting the temperature of the test base based on the temperature data of the reference chip and a predetermined temperature value of the reference chip, determining the first temperature compensation value based on first temperature data of the reference chip and a predetermined temperature value, and determining the second temperature compensation value based on second temperature data of the reference chip and a predetermined temperature value; 7. The method according to any one of claims 1 to 6.

10. The temperature sensor includes a first temperature sensor provided on the adapter and a second temperature sensor provided on the test base, the first temperature sensor is for acquiring first temperature data of the reference chip a plurality of times, and the second temperature sensor is for acquiring second temperature data of the reference chip a plurality of times, and in the step of specifying the first temperature compensation value for adjusting the temperature of the adapter and the second temperature compensation value for adjusting the temperature of the test base based on the temperature data of the reference chip and a predetermined temperature value of the reference chip, First, the second temperature compensation value is determined based on the second temperature data of the reference chip and a predetermined temperature value, and then the first temperature compensation value is determined based on the first temperature data of the reference chip and the predetermined temperature value.

7. The method according to any one of claims 1 to 6.

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