Display device

Abstract

According to the present invention, a wiring line 31 and a wiring line 32 of a display device DSP2 each comprise: a metal wiring part 30A which is formed of a first metal material that is copper or a copper alloy; and a metal wiring part 30B which is electrically connected to the metal wiring part 30A and is formed of a second metal material that is different from the first metal material. The metal wiring part 30B is arranged but the metal wiring part 30A is not arranged in a region R1 that overlaps with a semiconductor layer 50. The metal wiring part 30A and the metal wiring part 30B are arranged in a region R2 which is arranged so as to surround the region R1 without overlapping with the semiconductor layer 50. The metal wiring part 30B arranged in the region R1 is covered with an organic insulating film 40.

Description

[Technical field]

[0001] The present invention relates to a display device. [Background technology]

[0002] One example of a display device is an LED (Light Emitting Diode) display device in which light-emitting diode elements, which are self-emitting elements, are arranged in a matrix on a substrate (see, for example, Patent Document 1 (US Patent Application Publication No. 2018 / 0033853)). Patent Document 1 describes a display device in which a wiring path connected to an anode and a wiring path connected to a cathode are formed on the same layer, and an electrical jumper is mounted at the point where these wiring paths intersect. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] US Patent Application Publication No. 2018 / 0033853 Summary of the Invention [Problem to be solved by the invention]

[0004] The LED display device has a plurality of LED elements mounted on an array substrate and a plurality of wirings that supply power to each of the plurality of LED elements. The LED display device also has a transistor including a semiconductor layer as a switching element that controls the lighting and non-lighting of the plurality of LEDs. The inventors of the present application have studied a display device using wiring made of copper (Cu) in order to reduce the resistance of the plurality of wirings. When copper is used as the wiring material, a technology is required to suppress the diffusion of copper into the inorganic insulating layer and semiconductor layer contained in the switching element.

[0005] An object of the present invention is to provide a technique for improving the performance of an LED display device. [Means for solving the problem]

[0006] A display device according to one embodiment includes a first pixel, a plurality of pixels arranged in a matrix, a first switching element formed in the first pixel, a first light-emitting element mounted on the first pixel, a first wiring electrically connected to the drain electrode of the first switching element and the anode electrode of the first light-emitting element, and a second wiring connected to the source electrode of the first switching element. The first switching element includes a first inorganic insulating layer formed on a first substrate, a semiconductor layer formed on the first inorganic insulating layer, a drain electrode connected to a drain region of the semiconductor layer, a source electrode connected to a source region of the semiconductor layer, and a second inorganic insulating layer covering the semiconductor layer. Each of the first wiring and the second wiring includes a first metal wiring portion made of a first metal material that is copper or a copper alloy, and a second metal wiring portion electrically connected to the first metal wiring portion and made of a second metal material different from the first metal material. The second metal wiring portion is arranged in a first region overlapping the semiconductor layer, and the first metal wiring portion is not arranged. The first metal wiring portion and the second metal wiring portion extending and overlapping the first metal wiring portion are disposed in a second region that is disposed so as to surround the periphery of the first region and does not overlap the semiconductor layer. The second metal wiring portion disposed in the first region is covered with an organic insulating film. [Brief description of the drawings]

[0007] [Figure 1] FIG. 1 is a plan view illustrating an example of the configuration of a display device according to an embodiment. [Diagram 2] 2 is a circuit diagram showing a configuration example of a circuit in the periphery of the pixel shown in FIG. 1. [Diagram 3] 2 is an enlarged transparent plan view showing an example of a peripheral structure of LED elements arranged in each of a plurality of pixels of the display device shown in FIG. [Figure 4] FIG. 4 is an enlarged cross-sectional view taken along line AA in FIG. [Diagram 5] FIG. 5 is an enlarged cross-sectional view showing a modification of FIG. [Figure 6]6 is an enlarged cross-sectional view showing an example of the configuration of a metal wiring portion shown in FIG. 4 and FIG. 5. [Figure 7] FIG. 7 is an enlarged cross-sectional view showing a modification of FIG. 6. [Figure 8] FIG. 7 is an enlarged cross-sectional view showing another modified example of FIG. 6. [Figure 9] FIG. 4 is an enlarged cross-sectional view taken along line BB in FIG. [Figure 10] FIG. 10 is an enlarged cross-sectional view showing a modification of FIG. [Figure 11] FIG. 4 is a transparent plan view showing a modification of FIG. 3. [Figure 12] FIG. 12 is an enlarged cross-sectional view taken along line CC in FIG. [Figure 13] FIG. 12 is an enlarged cross-sectional view taken along line DD in FIG. [Figure 14] FIG. 14 is an enlarged cross-sectional view showing a modification of FIG. [Figure 15] FIG. 5 is an enlarged cross-sectional view showing another modified example of FIG. [Figure 16] FIG. 5 is an enlarged cross-sectional view showing another modified example of FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, each embodiment of the present invention will be described with reference to the drawings. Note that the disclosure is merely an example, and those who are skilled in the art can easily come up with appropriate modifications while maintaining the gist of the invention, which are naturally included in the scope of the present invention. In addition, in order to make the explanation clearer, the drawings may show the width, thickness, shape, etc. of each part in a schematic manner compared to the actual embodiment, but these are merely examples and do not limit the interpretation of the present invention. In addition, in this specification and each figure, elements similar to those described above with respect to the previous figures may be given the same or related symbols, and detailed explanations may be omitted as appropriate.

[0009] In the following embodiment, a micro LED display device including a plurality of micro LED elements will be described as an example of a display device using a plurality of light emitting elements (specifically, inorganic light emitting elements). The micro LED element has a smaller element size (outer diameter dimension) than a general LED element, and therefore has the advantage of being able to display high-definition images.

[0010] As a light-emitting diode element that is a self-luminous element, there is an organic light-emitting diode element (OLED: Organic Light-Emitting Diode). The light-emitting diode element (micro LED element) described in the following embodiment is an inorganic light-emitting diode element and is distinguished from the organic light-emitting diode element.

[0011] <Display device> First, a configuration example of a micro LED display device, which is a display device of the present embodiment, will be described. Fig. 1 is a plan view showing a configuration example of a display device according to one embodiment. In Fig. 1, the boundary between the display area DA and the peripheral area PFA, the control circuit 5, the drive circuit 6, and the multiple pixels PIX are each indicated by a two-dot chain line. Fig. 2 is a circuit diagram showing a configuration example of the circuit around the pixel shown in Fig. 1.

[0012] 1, the display device DSP1 of the present embodiment has a display area DA, a peripheral area PFA surrounding the periphery of the display area DA in a frame shape, and a plurality of pixels PIX arranged in a matrix within the display area DA. The display device DSP1 also has a substrate 10, a control circuit 5 formed on the substrate 10, and a drive circuit 6 formed on the substrate 10.

[0013] The control circuit 5 is a control circuit that controls the driving of the display function of the display device DSP1. For example, the control circuit 5 is a driver IC (Integrated Circuit) mounted on the substrate 10. In the example shown in FIG. 1, the control circuit 5 is arranged along one of the four short sides of the substrate 10. In addition, in the example of the present embodiment, the control circuit 5 includes a signal line driving circuit that drives the video signal wiring VL (see FIG. 2) connected to the multiple pixels PIX. However, the position and configuration example of the control circuit 5 are not limited to the example shown in FIG. 1, and there are various modified examples. For example, in FIG. 1, a circuit board such as a flexible board may be connected to the position shown as the control circuit 5, and the above-mentioned driver IC may be mounted on the circuit board. In addition, for example, the signal line driving circuit that drives the video signal wiring VL may be formed separately from the control circuit 5.

[0014] The driving circuit 6 includes a circuit for driving the scanning signal lines GL (see FIG. 2 described later) of the multiple pixels PIX. The driving circuit 6 also includes a circuit for supplying a reference potential to the LED elements mounted on each of the multiple pixels PIX. The driving circuit 6 drives the multiple scanning signal lines GL based on a control signal from the control circuit 5. In the example shown in FIG. 1, the driving circuit 6 is disposed along each of two long sides of the four sides of the substrate 10. However, the position and configuration of the driving circuit 6 are not limited to the example shown in FIG. 1, and there are various modified examples. For example, in FIG. 1, a circuit board such as a flexible board may be connected to the position shown as the control circuit 5, and the above-mentioned driving circuit 6 may be mounted on the circuit board.

[0015] Next, an example of the circuit configuration of the pixel PIX will be described with reference to Fig. 2. Note that Fig. 2 shows four pixels PIX as representatives, but each of the pixels PIX shown in Fig. 1 has a circuit similar to that of the pixel PIX shown in Fig. 2. Hereinafter, the switch and the circuit including the LED element 20 provided in the pixel PIX may be referred to as a pixel circuit. The pixel circuit is a voltage signal type circuit that controls the light emission state of the LED element 20 in response to a video signal Vsg supplied from the control circuit 5 (see Fig. 1).

[0016] As shown in FIG. 2, the pixel PIX includes an LED element 20. The LED element 20 is the above-described micro light-emitting diode. The LED element 20 has an anode electrode 20EA and a cathode electrode 20EK. The cathode electrode 20EK of the LED element 20 is connected to a wiring VSL to which a reference potential (fixed potential) PVS is supplied. The anode electrode 20EA of the LED element 20 is electrically connected to the drain electrode ED of the switching element SW via a wiring 31.

[0017] The pixel PIX includes a switching element SW. The switching element SW is a transistor that controls the connection state (on or off state) between the pixel circuit and the video signal wiring VL in response to a control signal Gs. The switching element SW is, for example, a thin film transistor. When the switching element SW is in the on state, a video signal Vsg is input from the video signal wiring VL to the pixel circuit.

[0018] The drive circuit 6 includes a shift register circuit, an output buffer circuit, etc. (not shown). The drive circuit 6 outputs a pulse based on a horizontal scan start pulse transmitted from the control circuit 5 (see FIG. 1) and outputs a control signal Gs.

[0019] Each of the plurality of scan signal lines GL extends in the X direction. The scan signal line GL is connected to the gate electrode of the switching element SW. When a control signal Gs is supplied to the scan signal line GL, the switching element SW becomes in the on state, and a video signal Vsg is supplied to the LED element 20.

[0020] <Peripheral Structure of LED Element> Next, the peripheral structure of the LED element disposed in each of the plurality of pixels PIX shown in FIG. 1 will be described. FIG. 3 is a transparent enlarged plan view showing an example of the peripheral structure of the LED element disposed in each of the plurality of pixels of the display device shown in FIG. 1. FIG. 4 is an enlarged cross-sectional view taken along line A-A of FIG. 3. In FIG. 3, the outlines of the semiconductor layer, the electrode, and the scan signal line are shown by dotted lines.

[0021] As shown in FIG. 3, the display device DSP1 has a plurality of pixels PIX including a pixel PIX1 (pixels PIX1, PIX2, and PIX3 in the example shown in FIG. 4). Each of the plurality of pixels PIX has a switching element SW, an LED element (light-emitting element) 20, a wiring 31, and a wiring 32. Each of the pixels PIX1, PIX2, and PIX3 is equipped with an LED element 20 that emits visible light of one color, for example, red, green, or blue, and a switching element SW that drives the LED element 20 is formed. Color display is possible by controlling the output and timing of the visible light emitted from the LED elements of the pixels PIX1, PIX2, and PIX3. When a plurality of pixels PIX that emit visible light of different colors are combined in this way, the pixels PIX for each color may be called sub-pixels, and a set of the plurality of pixels PIX may be called a pixel. In this embodiment, the part corresponding to the sub-pixel is called a pixel PIX.

[0022] The wiring 31 is electrically connected to the drain electrode ED of the switching element SW and the anode electrode 20EA of the LED element 20. The wiring 32 is connected to the source electrode ES of the switching element SW. In the example shown in FIG. 3, the wiring 32 has a bent structure, one end of which is connected to the source electrode ES of the switching element SW, and the other end of which is connected to the video signal wiring VL. The scanning signal line GL is used as the gate electrode EG of the switching element SW. Note that the layout shown in FIG. 3 is an example, and there are various modified examples. For example, as one of the modified examples of FIG. 3, the switching element SW may have a gate electrode (not shown), and the gate electrode may be connected to the scanning signal line GL. In this modified example, the scanning signal line GL may be disposed at a position that does not overlap with the semiconductor layer 50.

[0023] As shown in Fig. 4, the display device DSP1 is a substrate including a substrate 10 and a plurality of insulating layers laminated on the substrate 10. The plurality of insulating layers included in the display device DSP1 include inorganic insulating layer 11, inorganic insulating layer 12, and inorganic insulating layer 13 laminated on the substrate 10. The substrate 10 has a surface 10f and a surface 10b opposite to the surface 10f. Each of the inorganic insulating layers 11, 12, and 13 is laminated on the surface 10f of the substrate 10.

[0024] The switching element SW includes an inorganic insulating layer 12 formed on a substrate 10, a semiconductor layer 50 formed on the inorganic insulating layer 12, a drain electrode ED connected to a drain region of the semiconductor layer 50, a source electrode ES connected to a source region of the semiconductor layer 50, and an inorganic insulating layer 13 covering the semiconductor layer 50. Each of the wiring 31 and the wiring 32 includes a metal wiring part 30A made of a first metal material, which is copper or a copper alloy, and a metal wiring part 30B made of a second metal material different from the first metal material and electrically connected to the wiring part. The second metal material is a metal material that is less likely to diffuse into the semiconductor layer 50 than the first metal material. In addition, in a transparent plan view, the metal wiring part 30B is arranged in a region R1 overlapping with the semiconductor layer 50, and the metal wiring part 30A is not arranged. A metal wiring portion 30A and a metal wiring portion 30B extending and overlapping with the metal wiring portion 30A are arranged in a region R2 that is arranged so as to surround the periphery of the region R1 and does not overlap with the semiconductor layer 50. The metal wiring portion 30B arranged in the region R1 is covered with an organic insulating film 40.

[0025] The example shown in Fig. 4 is an example of a bottom gate type in which the gate electrode GE is between the semiconductor layer 50 and the substrate 10. In the case of the bottom gate type, a portion of the inorganic insulating layer 12 between the gate electrode GE and the semiconductor layer 50 functions as a gate insulating layer. The inorganic insulating layer 12 also functions as a base layer for forming the semiconductor layer 50. The position of the gate electrode GE is not limited to the example shown in Fig. 4, and may be, for example, a top gate type described later as a modified example.

[0026] The material constituting each of the inorganic insulating layers 11, 12, and 13 is not particularly limited. For example, silicon oxide (SiO 2 Examples of the material include silicon nitride (SiN), etc. The semiconductor layer 50 is a semiconductor film in which a silicon film made of silicon is doped with impurities of P-type or N-type conductivity.

[0027] Each of the source electrode ES and the drain electrode ED is a contact plug for making electrical contact with either the source region or the drain region of the semiconductor layer 50. Examples of the material of the contact plug include tungsten. As a modification of FIG. 4, contact holes exposing the source region and the drain region of the semiconductor layer 50 are formed in the inorganic insulating layer 13, and the metal wiring portion 30B is embedded in the contact holes. In this case, the metal wiring portion 30B contacts the semiconductor layer 50, and the contact interface between the metal wiring portion 30B and the semiconductor layer 50 can be regarded as the drain electrode ED and the source electrode ES.

[0028] The metal material constituting the metal wiring portion 30B may be a metal material that is less likely to diffuse into the semiconductor layer 50 than the metal material constituting the metal wiring portion 30A. Examples of such metal materials include aluminum and tantalum.

[0029] The present inventors have investigated the use of a metal material made of copper or a copper alloy as the wiring material in order to reduce the resistance of the wiring. It has been found that if the video signal wiring VL, wiring 31, wiring 32, and wiring VSL shown in FIG. 3 are simply made of copper or a copper alloy, the wiring resistance is reduced, but another problem occurs. That is, the problem is that copper as the wiring material diffuses into the semiconductor layer 50 during the manufacturing process of the display device or due to aging of the finished product. When copper diffuses into the semiconductor layer 50, it deteriorates the electrical characteristics of the semiconductor layer 50. As a result, it causes a malfunction in the electrical switching operation.

[0030] Therefore, the inventors of the present application have studied a technique for increasing the resistance of the wiring and suppressing the deterioration of the characteristics of the semiconductor layer 50 due to the diffusion of copper. As described with reference to Fig. 4, each of the wiring 31 and the wiring 32 of the display device DSP1 includes a metal wiring portion 30A made of a first metal material, which is copper or a copper alloy, and a metal wiring portion 30B electrically connected to the wiring portion and made of a second metal material different from the first metal material. By including the metal wiring portion 30A, the resistance of the wiring 31 and the wiring 32 can be reduced.

[0031] Moreover, in the region R1 overlapping with the semiconductor layer 50, the metal wiring portion 30B is arranged, and the metal wiring portion 30A is not arranged. Furthermore, the metal wiring portion 30B arranged in the region R1 is covered with an organic insulating film 40. The organic insulating film 40 is a film made of an organic material such as an acrylic resin. The organic insulating film 40 has a function of preventing copper contained in the metal wiring portion 30A from leaking onto the semiconductor layer 50 via the organic insulating film 40. Thus, in the case of the present embodiment, the metal wiring portion 30A is not arranged in the region R1, and the region R1 is covered with the organic insulating film 40, so that the diffusion of copper into the semiconductor layer 50 can be suppressed.

[0032] Incidentally, the diffusion of copper occurs, for example, during a heating process in the manufacturing process of a display device. From the viewpoint of preventing the diffusion of copper during the heating process, the diffusion of copper can be prevented at least if the metal wiring portion 30A is not arranged in the region R1 and the region R1 is covered with an organic insulating film 40. For example, as a modification of FIG. 4, as in the display device DSP2 shown in FIG. 5, even if the region R1 and the region R2 are adjacent to each other, the diffusion of copper can be prevented if the metal wiring portion 30A is not arranged in the region R1 and the region R1 is covered with an organic insulating film 40. FIG. 5 is an enlarged cross-sectional view showing a modification of FIG. 4.

[0033] However, copper diffusion may occur during a heating process in the manufacturing process of the display device, and may also gradually diffuse through inorganic insulating layer 13 and inorganic insulating layer 12 shown in Fig. 4 due to aging of the finished product. From the viewpoint of suppressing deterioration of semiconductor layer 50 due to diffusion caused by such aging, it is preferable that there is a region where metal wiring portion 30A is not arranged, in an area wider than region R1 shown in Fig. 5.

[0034] 3 and 4, in a transmission plan view, the region R1 and the region R2 are spaced apart from each other. Between the region R1 and the region R2, there is a region R3 that does not overlap with the semiconductor layer 50 and is in contact with the region R2. In the region R3, the metal wiring portion 30B is arranged, and the metal wiring portion 30A is not arranged. The metal wiring portion 30B arranged in the region R3 is covered with the organic insulating film 40.

[0035] In the case of the display device DSP1, a region R3 where the metal wiring portion 30A is not arranged is provided between the region R1 and the region R2, and the region R3 is covered with the organic insulating film 40. In this case, the distance between the metal wiring portion 30A containing copper and the semiconductor layer 50 can be made larger than in the display device DSP1 shown in Fig. 5. As a result, even when the diffusion of copper due to aging is taken into consideration, the deterioration of the semiconductor layer 50 can be further suppressed.

[0036] As shown in FIG. 3, in this embodiment, the organic insulating film 40 is partially formed in the region R1 and the region R3. In other words, the region R2 includes a portion where the organic insulating film 40 is not formed. As shown in FIG. 4, in the region R2 where the organic insulating film 40 is not formed, the metal wiring portion 30A and the metal wiring portion 30B are in contact with each other. The region R2 includes a region where the metal wiring portion 30A and the metal wiring portion 30B extend in the same direction (the Y direction in the example shown in FIG. 4) while in contact with each other. This point is also the case with the display device DSP1 shown in FIG. 5.

[0037] As shown in FIG. 6, the metal wiring section 30B is a laminated film of a first film 30B1 made of titanium, a second film 30B2 covering the first film 30B1 and made of aluminum, and a third film 30B3 covering the second film 30B2 and made of titanium. FIG. 6 is an enlarged cross-sectional view showing an example of the configuration of the metal wiring section shown in FIG. 4 and FIG. 5. The metal wiring section 30B illustrated in FIG. 6 has a track record of use as a wiring member of a display device, and it is known that there is no problem such as diffusion of metal components into the semiconductor layer 50. By interposing a conductive member into which metal components are unlikely to diffuse between the metal wiring section 30A and the inorganic insulating layer 13 in this way, it is possible to suppress the diffusion of copper into the inorganic insulating layer 13. As a result, it is possible to reduce the amount of copper that reaches the semiconductor layer 50 shown in FIG. 4 or FIG. 5. In other words, the metal wiring section 30B functions as a diffusion prevention film that prevents the diffusion of copper contained in the metal wiring section 30A.

[0038] From the viewpoint of improving the function of the metal wiring portion 30B as a diffusion prevention film, it is preferable to reduce the contact area between the metal wiring portion 30A and the inorganic insulating layer 13. Also, from the viewpoint of improving the function of the metal wiring portion 30B as a diffusion prevention film, it is particularly preferable that the metal wiring portion 30A and the inorganic insulating layer 13 are not in contact with each other and are spaced apart from each other. As shown in FIG. 6, in the case of this embodiment, in the region where the metal wiring portion 30A and the metal wiring portion 30B are in contact with each other, the wiring width 30AW of the metal wiring portion 30A is equal to or smaller than the wiring width 30BW of the metal wiring portion 30B. Also, the entire lower surface 30Ab of the metal wiring portion 30A is in contact with the metal wiring portion 30B. Note that, although FIG. 6 shows an example in which the wiring width 30AW and the wiring width 30BW are equal, there are also cases in which the wiring width 30AW is narrower than the wiring width 30BW, as shown as a modified example in FIG. 7. FIG. 7 is an enlarged cross-sectional view showing a modified example of FIG. 6.

[0039] On the other hand, there is a structure as shown in FIG. 8 as another modified example. FIG. 8 is an enlarged cross-sectional view showing another modified example of FIG. 6. When the second metal material constituting the metal wiring portion 30B contains aluminum as in the present embodiment, for example, in an etching process for patterning the metal wiring portion 30A containing copper or a copper alloy, the exposed portion of the second film 30B2 made of aluminum may be eroded. From the viewpoint of preventing the erosion of the aluminum film, it is preferable that at least the second film 30B2 is covered by the metal wiring portion 30A as shown in FIG. 8. In the example shown in FIG. 8, the second metal material contains aluminum. In addition, in the region where the metal wiring portion 30A and the metal wiring portion 30B are in contact with each other, the side and upper surface of the metal wiring portion 30B are covered by the metal wiring portion 30A.

[0040] 6 to 8 are enlarged cross-sectional views each showing a part of the region where the metal wiring portion 30A and the metal wiring portion 30B shown in FIG. 4 or 5 are in contact with each other. However, in FIG. 4 and FIG. 5, in the region where the metal wiring portion 30A and the metal wiring portion 30B are in contact with each other, the shapes of the metal wiring portion 30A and the metal wiring portion 30B have the structure shown in FIG. 6, 7, or 8. For example, in FIG. 4 and FIG. 5, when the structure of a part of the region where the metal wiring portion 30A and the metal wiring portion 30B are in contact with each other is the structure shown in FIG. 6, the structure of the region where the metal wiring portion 30A and the metal wiring portion 30B are in contact with each other in the entire range shown in FIG. 4 and FIG. 5 has the structure shown in FIG. 6.

[0041] <Structure of wiring intersection> Next, a structure of a wiring intersection LXP where the video signal wiring VL and the wiring VSL intersect in the example shown in Fig. 3 will be described. Fig. 9 is an enlarged cross-sectional view taken along line BB in Fig. 3. As shown in Fig. 3, the display device DSP1 further includes a video signal wiring VL that extends across a plurality of pixels PIX (see Fig. 2) along the Y direction and is electrically connected to the wiring 32, and a wiring VSL that extends across a plurality of pixels PIX along the X direction intersecting the Y direction (orthogonal in Fig. 3) and is electrically connected to the cathode electrode 20EK of the LED element 20.

[0042] Each of the video signal wiring VL and the wiring VSL includes a metal wiring portion 30A and a metal wiring portion 30B. In a transmission plan view, at a wiring intersection LXP where the video signal wiring VL and the wiring VSL intersect, as shown in FIG. 9, a metal wiring portion 30B of one of the video signal wiring VL and the wiring VSL (the video signal wiring VL in the example shown in FIG. 9) is formed. At the wiring intersection LXP, a jumper insulating film 41 is formed to cover the metal wiring portion 30B of one of the wirings (the video signal wiring VL in the example shown in FIG. 9). At the wiring intersection LXP, a metal wiring portion 30A of the other of the video signal wiring VL and the wiring VSL (the wiring VSL in the example shown in FIG. 9) formed on the jumper insulating film 41 is formed. At the wiring intersection LXP, the metal wiring portion 30A of one of the wirings (the video signal wiring VL in the example shown in FIG. 9) and the metal wiring portion 30B of the other of the wirings (the wiring VSL in the example shown in FIG. 9) are not formed. The jumper insulating film 41 is made of the same material as the organic insulating film 40 .

[0043] When the jumper insulating film 41 shown in FIG. 9 and the organic insulating film 40 shown in FIG. 4 are formed of the same material (for example, acrylic resin), the jumper insulating film 41 and the organic insulating film 40 are manufactured in the same process in a manufacturing process of the display device DSP1. In this case, it is possible to prevent an increase in the manufacturing process due to the provision of the organic insulating film 40, and therefore it is possible to prevent a decrease in the manufacturing efficiency of the display device DSP1. For example, in the manufacturing method of the display device DSP1 shown in FIG. 4 and the display device DSP2 shown in FIG. 5, after forming the metal wiring part 30B on the inorganic insulating layer 13, an organic film constituting the organic insulating film 40 and the jumper insulating film 41 is applied and patterned. Then, a copper film or a copper alloy film constituting the metal wiring part 30A is formed, and this is patterned by etching or the like to form the metal wiring part 30A. Then, the LED element 20 is mounted.

[0044] 9 has been described in relation to an embodiment in which the wiring VSL is formed on the jumper insulating film 41, but as a modified example, as shown in FIG 10, there is a case in which the metal wiring portion 30A of the video signal wiring VL is formed on the jumper insulating film 41 and the metal wiring portion 30B of the wiring VSL is disposed under the jumper insulating film 41. FIG 10 is an enlarged cross-sectional view showing a modified example of FIG 9. Even in the case of the example shown in FIG 10, if the jumper insulating film 41 and the organic insulating film 40 shown in FIG 4 are formed of the same material (e.g., acrylic resin), it is possible to prevent a decrease in the manufacturing efficiency of the display device DSP1 caused by forming the organic insulating film 40.

[0045] 3 shows an example in which the jumper insulating film 41 is partially formed at each of a plurality of wiring crossing parts LXP. However, there are various modifications to the shape of the jumper insulating film 41. For example, the plurality of jumper insulating films 41 shown in FIG. 3 can be connected to each other to form a strip-shaped jumper insulating film 41 extending in the X direction. Alternatively, the organic insulating film 40 and the jumper insulating film 41 may be connected to form an integrated organic insulating film 40, as in the display device DSP3 shown in FIGS. 11 to 13 described later.

[0046] <Modifications of Organic Insulating Film> Next, modified examples of the organic insulating film shown in Fig. 4 and Fig. 5 will be described. Fig. 11 is a transparent plan view showing a modified example of Fig. 3. Fig. 12 is an enlarged cross-sectional view taken along line CC in Fig. 11. Fig. 13 is an enlarged cross-sectional view taken along line DD in Fig. 11. Fig. 14 is an enlarged cross-sectional view showing a modified example of Fig. 13.

[0047] The display device DSP3 shown in FIGS. 11 to 13 differs from the display device DSP1 shown in FIGS. 3 and 4 in that the entire metal wiring portion 30B is covered with the organic insulating film 40. In the case of the display device DSP1, the entire inorganic insulating layer 13 is covered with the organic insulating film 40. Most of the metal wiring portion 30A is formed on the organic insulating film 40. This reduces the possibility that the same component contained in the metal wiring portion 30A diffuses into the inorganic insulating layer 13. In addition, the planarity of the upper surface of the organic insulating film 40 is improved by increasing the area of ​​the organic insulating film 40. As a result, the planarity of the metal wiring portion 30A formed on the organic insulating film 40 is also improved. For example, the planarity of the metal wiring portion 30A is improved in the portion where the LED element 20 is mounted, so that the mounting process of the LED element 20 can be performed with high accuracy. In addition, the risk of the metal wiring portion 30A being damaged can be reduced by improving the planarity of the organic insulating film 40, which is the base layer of the metal wiring portion 30A.

[0048] The structure of the display device DSP3 shown in Figures 11 to 13 can be expressed as follows. That is, the region R2 includes a region in which the metal wiring portion 30A and the metal wiring portion 30B extend in the same direction while being spaced apart from each other via the organic insulating film 40. However, the metal wiring portion 30A and the metal wiring portion 30B need to be electrically connected. In the case of this modification, the metal wiring portion 30A and the metal wiring portion 30B come into contact with each other and are electrically connected to each other through a contact hole 40H formed in the organic insulating film 40.

[0049] As shown in Figs. 13 and 14, in the case of this modification, the structure of the wiring intersection LXP can be described as follows. In a transmission plan view, at the wiring intersection LXP where the video signal wiring VL and the wiring VSL intersect, a metal wiring portion 30B of one of the video signal wiring VL and the wiring VSL (the video signal wiring VL in the example shown in Fig. 13 and the wiring VSL in the example shown in Fig. 14) is formed. At the wiring intersection LXP, an organic insulating film 40 is formed to cover the metal wiring portion 30B of one of the wirings. At the wiring intersection LXP, a metal wiring portion 30A of the other of the video signal wiring VL and the wiring VSL (the wiring VSL in the example shown in Fig. 13 and the video signal wiring VL in the example shown in Fig. 14) formed on the organic insulating film 40 is formed. At the wiring intersection LXP, the metal wiring portion 30A of one of the wirings and the metal wiring portion 30B of the other wiring are not formed.

[0050] Although the display device DSP3 has been described as a modified example of the display device DSP1 shown in Fig. 3, it may be applied in combination with the display device DSP1 shown in Fig. 5. In addition, the structure of the metal wiring portion 30A and the metal wiring portion 30B may be any of the structural examples shown in Figs. 6 to 8.

[0051] <Other Modifications> Next, a modified example other than the above will be described. FIG. 15 is an enlarged cross-sectional view showing another modified example of FIG. 4. The display device DSP4 shown in FIG. 15 differs from the display device DSP1 shown in FIG. 4 in the structure of the wiring 31 and the wiring 32. In the case of the display device DSP4, in the region R2, the metal wiring portion 30A has a portion formed directly on the inorganic insulating layer 13 without the metal wiring portion 30B. As described above, from the viewpoint of suppressing the diffusion of copper, it is preferable that the area of ​​the portion where the inorganic insulating layer 13 and the metal wiring portion 30A contact each other is as small as possible. However, as shown in FIG. 15, if the metal wiring portion 30A is not arranged at least in the region R1 overlapping with the semiconductor layer 50 and the metal wiring portion 30B is covered with the organic insulating film 40, the diffusion of copper due to the heating process can be suppressed.

[0052] This also applies to the wiring intersections LXP shown in Figures 3 and 11. Although not shown, for example, in the examples shown in Figures 9, 10, 13, and 14, the metal wiring portion 30B may not be formed, and each of the video signal wiring VL and the wiring VSL may be formed only by the metal wiring portion 30A. Even in this case, if the distance between the wiring intersections LXP and the semiconductor layer 50 is large, the diffusion of copper into the semiconductor layer 50 can be suppressed.

[0053] FIG. 16 is an enlarged cross-sectional view showing another modified example of FIG. 4. The display device DSP5 shown in FIG. 16 differs from the display device DSP1 shown in FIG. 4 in that the structure of the switching element SW is a so-called top gate type. In the case of the top gate type, the semiconductor layer 50 is formed on the inorganic insulating layer 11. Moreover, the gate electrode GE is formed on the semiconductor layer 50 via the inorganic insulating layer 12. In this case, the part of the inorganic insulating layer 12 that is disposed between the gate electrode GE and the semiconductor layer 50 functions as a gate insulating film. Moreover, each of the source electrode SE and the drain electrode DE extends in the thickness direction of the display device DSP5 (Z direction shown in FIG. 16) so as to connect the metal wiring part 30B formed on the inorganic insulating layer 13 and the semiconductor layer 50.

[0054] In the case of the top gate type, the distance between the metal wiring portion 30A and the semiconductor layer 50 becomes greater than in the bottom gate type shown in Fig. 4. This is preferable from the viewpoint of preventing copper diffusion from reaching the semiconductor layer 50. Note that Fig. 16 has been described as a representative modified example of Fig. 4, but it goes without saying that the top gate type may be applied to other modified examples.

[0055] Although the embodiment and the representative modified examples have been described above, the above-described technology can be applied to various modified examples other than the modified examples exemplified. For example, the modified examples described above may be combined with each other.

[0056] Within the scope of the concept of the present invention, a person skilled in the art may conceive of various modifications and alterations, and it is understood that such modifications and alterations also fall within the scope of the present invention. For example, those in which a person skilled in the art appropriately adds, deletes, or modifies the design of the above-mentioned embodiments, or adds, omits, or modifies the conditions of steps, are also included in the scope of the present invention as long as they include the gist of the present invention. [Industrial Applicability]

[0057] The present invention can be used in display devices and electronic devices incorporating display devices. [Explanation of symbols]

[0058] 5 Control circuit 6 Drive circuit 10 Substrate 10b,10f side 11, 12, 13 Inorganic insulating layer 20 LED element (light emitting element) 20EA Anode Electrode 20EK Cathode electrode 30A,30B Metal wiring section 30Ab bottom side 30AW, 30BW Wiring width 30B1 1st membrane 30B2 2nd membrane 30B3 Third membrane 31,32,VSL wiring 40 Organic insulating film 40H Contact Hole 41 Jumper insulating film 50 Semiconductor layer DA display area DE Drain electrode DSP1,DSP2,DSP3,DSP4,DSP5 Display device ED drain electrode EG Gate electrode ES source electrode GE gate electrode GL scanning signal line Gs control signal LXP Wire Crossover PFA surrounding area PIX, PIX1, PIX2 pixels PVS reference potential (fixed potential) R1,R2,R3 area SE source electrode SW Switching element VL Video signal wiring Vsg Video signal

Claims

1. A plurality of pixels including a first pixel and arranged in a matrix; a first switching element formed in the first pixel; A first light emitting element mounted on the first pixel; a first wiring electrically connected to a drain electrode of the first switching element and an anode electrode of the first light emitting element; A second wiring connected to a source electrode of the first switching element; having The first switching element is a first inorganic insulating layer formed on a first substrate; A semiconductor layer formed on the first inorganic insulating layer; a drain electrode connected to a drain region of the semiconductor layer; a source electrode connected to a source region of the semiconductor layer; A second inorganic insulating layer covering the semiconductor layer; Including, Each of the first wiring and the second wiring is a first metal wiring portion made of a first metal material which is copper or a copper alloy; a second metal wiring portion electrically connected to the first metal wiring portion and made of a second metal material different from the first metal material; Including, In a planar transmission view, the second metal wiring portion is disposed in a first region overlapping the semiconductor layer, and the first metal wiring portion is not disposed in the first region; the first metal wiring portion and the second metal wiring portion extending and overlapping the first metal wiring portion are disposed in a second region that is disposed so as to surround the periphery of the first region and does not overlap the semiconductor layer; the second metal wiring portion disposed in the first region is covered with an organic insulating film; the second region includes a region in which the first metal wiring portion and the second metal wiring portion extend in the same direction while being in contact with each other; the second metallic material comprises aluminum; In a region where the first metal wiring portion and the second metal wiring portion are in contact with each other, A display device, wherein a side surface and an upper surface of the second metal wiring portion are covered by the first metal wiring portion.

2. In claim 1, In a planar transmission view, The first region and the second region are spaced apart from each other, a third region is provided between the first region and the second region, does not overlap the semiconductor layer, and is in contact with the first region; the second metal wiring portion is disposed in the third region, and the first metal wiring portion is not disposed in the third region; the second metal wiring portion disposed in the third region is covered with the organic insulating film, The second metal material is a metal material that is less likely to diffuse into the semiconductor layer than the first metal material.

3. In claim 1 or 2, the second region includes a region in which the first metal wiring portion and the second metal wiring portion extend in the same direction while being spaced apart from each other via the organic insulating film.

4. In claim 3, the first metal wiring portion and the second metal wiring portion are in contact with each other and electrically connected to each other through a contact hole formed in the organic insulating film.

5. A plurality of pixels including a first pixel and arranged in a matrix; a first switching element formed in the first pixel; A first light emitting element mounted on the first pixel; a first wiring electrically connected to a drain electrode of the first switching element and an anode electrode of the first light emitting element; A second wiring connected to a source electrode of the first switching element; a video signal line extending across a plurality of pixels along a first direction and electrically connected to the second line; a third wiring extending across a plurality of pixels along a second direction intersecting the first direction and electrically connected to a cathode electrode of the first light-emitting element; having The first switching element is a first inorganic insulating layer formed on a first substrate; A semiconductor layer formed on the first inorganic insulating layer; a drain electrode connected to a drain region of the semiconductor layer; a source electrode connected to a source region of the semiconductor layer; A second inorganic insulating layer covering the semiconductor layer; Including, Each of the first wiring and the second wiring is a first metal wiring portion made of a first metal material which is copper or a copper alloy; a second metal wiring portion electrically connected to the first metal wiring portion and made of a second metal material different from the first metal material; Including, In a planar transmission view, the second metal wiring portion is disposed in a first region overlapping the semiconductor layer, and the first metal wiring portion is not disposed in the first region; the first metal wiring portion and the second metal wiring portion extending and overlapping the first metal wiring portion are disposed in a second region that is disposed so as to surround the periphery of the first region and does not overlap the semiconductor layer; the second metal wiring portion disposed in the first region is covered with an organic insulating film; each of the video signal wiring and the third wiring includes the first metal wiring portion and the second metal wiring portion; In a transparent plan view, at a wiring intersection portion where the video signal wiring and the third wiring intersect, a second metal wiring portion of one of the video signal wiring and the third wiring; a jumper insulating film covering a second metal wiring portion of the one of the wirings; a first metal wiring portion of the other of the video signal wiring and the third wiring formed on the jumper insulating film; is formed, a first metal wiring portion of the one wiring and a second metal wiring portion of the other wiring are not formed at the wiring intersection portion, The jumper insulating film is formed of the same material as the organic insulating film.

6. In claim 1 or 2, a second metal wiring portion which is a laminated film including a first film made of titanium, a second film which covers the first film and is made of aluminum, and a third film which covers the second film and is made of titanium.

Images