Additional processing device, control method for additional processing device, and control program for additional processing device

Abstract

To provide a technique for preventing a window provided on an additive processing device from being damaged.SOLUTION: An additive processing device capable of performing additive processing by supplying a workpiece with a powder material and irradiating the workpiece with a laser beam includes: a cover body that partitions and forms a processing area for performing the additive processing of the workpiece; a window provided in the cover body; and a shutter provided in the processing area side of the window and configured to be opened and closed with respect to the window. A reflective material is provided on a surface of the shutter on the processing area side for reflecting the laser beam.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present disclosure relates to an additive processing apparatus, a control method for the additive processing apparatus, and a control program for the additive processing apparatus.

Background Art

[0002] Japanese Patent Application Laid-Open No. 2018-94689 (Patent Document 1) discloses a machine tool provided with a viewing window. An operator can monitor a machining area inside the machine tool through the viewing window.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, additive processing apparatuses capable of performing additive processing on a workpiece have become widespread. The additive processing apparatus performs additive processing by supplying a powder material to the workpiece and irradiating the workpiece with a laser beam. The machine tool disclosed in Patent Document 1 is for removing a workpiece and does not perform additive processing.

[0005] When the reflectivity of the workpiece is high, the laser beam may be reflected by the workpiece and hit the window of the additive processing apparatus without being sufficiently attenuated. Of course, since the window is designed based on safety standards regarding the use of laser light defined by industrial standards and the like, the laser light does not leak outside and irradiate the operator. However, as a result, the window of the additive processing apparatus may be damaged. Then, until the damaged window is replaced, the additive processing apparatus cannot be operated, and the operation rate and productivity of the additive processing apparatus will decrease. Therefore, a technique for preventing damage to the window provided in the additive processing apparatus is desired.

Means for Solving the Problem

[0006] In an example of the present disclosure, an additive manufacturing apparatus is provided that can perform additive manufacturing by supplying a powder material to a workpiece and irradiating the workpiece with a laser beam. The additive manufacturing apparatus includes a cover body that defines a processing area for performing additive manufacturing on the workpiece, a window provided in the cover body, and a shutter provided on the processing area side of the window and configured to be openable and closable with respect to the window. A reflective material for reflecting the laser beam is provided on the surface of the shutter on the processing area side.

[0007] In an example of the present disclosure, the additive manufacturing apparatus further includes a control unit for controlling the opening and closing of the shutter. The control unit executes a process for closing the shutter before the additive manufacturing of the workpiece is started.

[0008] In an example of the present disclosure, the control unit executes a process for opening the shutter after the additive manufacturing of the workpiece is completed.

[0009] In an example of the present disclosure, the additive manufacturing apparatus further includes a camera for photographing the processing area.

[0010] In an example of the present disclosure, a notch is formed in the reflective material. The camera is arranged so as to fit into the notch when the shutter is closed.

[0011] In an example of the present disclosure, part or all of the reflective material is inclined with respect to the vertical direction.

[0012] In an example of the present disclosure, part or all of the reflective material is inclined so that the laser beam is reflected toward the ceiling side of the cover body.

[0013] In one example of the present disclosure, the additional processing device is further configured to be capable of removing the workpiece. In the processing area, a discharge mechanism for discharging a coolant to the workpiece and a tank into which the coolant discharged to the workpiece flows are provided. Part or all of the reflective material is inclined so that the laser beam is reflected to the floor side of the cover body.

[0014] In one example of the present disclosure, the reflective material is composed of a copper plate.

[0015] In another example of the present disclosure, there is provided a control method for an additive processing device capable of performing additive processing by supplying a powder material to a workpiece and irradiating the workpiece with a laser beam. The additive processing device includes a cover body that defines a processing area for performing additive processing on the workpiece, a window provided in the cover body, and a shutter provided on the processing area side of the window and configured to be openable and closable with respect to the window. A reflective material for reflecting the laser beam is provided on the surface of the shutter on the processing area side. The control method includes a step of closing the shutter before the additive processing of the workpiece is started.

[0016] In another example of the present disclosure, there is provided a control program for an additive processing device capable of performing additive processing by supplying a powder material to a workpiece and irradiating the workpiece with a laser beam. The additive processing device includes a cover body that defines a processing area for performing additive processing on the workpiece, a window provided in the cover body, and a shutter provided on the processing area side of the window and configured to be openable and closable with respect to the window. A reflective material for reflecting the laser beam is provided on the surface of the shutter on the processing area side. The control program causes the additive processing device to execute a step of closing the shutter before the additive processing of the workpiece is started.

[0017] The above and other objects, features, aspects and advantages of the present invention will become apparent from the following detailed description of the invention, which is to be understood in conjunction with the accompanying drawings.

Brief Description of the Drawings

[0018]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Modes for Carrying Out the Invention

[0019] Hereinafter, each embodiment according to the present invention will be described with reference to the drawings. In the following description, the same parts and components are denoted by the same reference numerals. Their names and functions are also the same. Therefore, detailed descriptions thereof will not be repeated. Note that each embodiment and each modification described below may be selectively combined as appropriate.

[0020] <A. Appearance of the Additional Processing Apparatus 100> First, referring to FIG. 1, the additive processing apparatus 100 according to the embodiment will be described. FIG. 1 is a diagram showing an example of the appearance of the additive processing apparatus 100.

[0021] The additive processing apparatus 100 is a processing machine capable of performing additive processing (AM (Additive manufacturing) processing) on a workpiece. The additive processing apparatus 100 performs additive processing by supplying a powder material to the workpiece and irradiating the workpiece with a laser beam.

[0022] Note that the additive processing apparatus 100 may be a processing machine capable of not only additive processing of the workpiece but also subtractive processing (SM (Subtractive manufacturing)) of the workpiece. Examples of the subtractive processing function include a milling function and a turning function.

[0023] The additive processing apparatus 100 includes, for example, a cover body 130 and an operation panel 200.

[0024] The cover body 130 is a mechanism for protecting the components provided inside the additive processing apparatus 100. A door DR is provided in the cover body 130. The door DR is, for example, a slide-type door. The door DR may be configured to be openable and closable by a drive source such as a motor, or may be configured to be openable and closable manually.

[0025] A window WD is provided in the door DR. An operator can check the state of the processing area inside the additive processing apparatus 100 through the window WD.

[0026] In the example of FIG. 1, an example in which the window WD is provided in the door DR is shown, but the window WD may be provided in a portion other than the door DR. Also, the number of windows WD provided in the cover body 130 may be one or a plurality.

[0027] The operation panel 200 is a general-purpose computer and has a display for displaying various pieces of information related to processing. The display is, for example, a liquid crystal display, an organic EL (Electro Luminescence) display, or other display device. Further, the display is provided with a touch panel and accepts various operations on the additional processing device 100 by touch operations.

[0028] <B. Device Configuration of Additional Processing Device 100> Next, with reference to FIG. 2, the device configuration of the additional processing device 100 will be described. FIG. 2 is a diagram showing an example of the device configuration of the additional processing device 100.

[0029] As described above, the additional processing device 100 includes a cover body 130. The cover body 130 forms the appearance of the additional processing device 100 and partitions and forms a processing area AR for performing additional processing on the workpiece W.

[0030] The additional processing device 100 further includes a bed 11, a workpiece spindle 22, a steady rest 25, a tool spindle 30, and a laser head 140.

[0031] The bed 11 is a base member for supporting various devices provided inside the additional processing device 100. In the example of FIG. 2, the bed 11 supports the workpiece spindle 22, the steady rest 25, and the laser head 140. The bed 11 is installed on the floor surface of a factory or the like. The bed 11 is formed of a metal such as cast iron.

[0032] The workpiece spindle 22 is configured to be rotatable while holding the workpiece W. More specifically, a chuck mechanism 23 is provided on the workpiece spindle 22. The chuck mechanism 23 is a mechanism for fixing the workpiece W to the workpiece spindle 22. Further, the workpiece spindle 22 is configured to be rotatable about an axis AX1 along its axial direction.

[0033] The center rest 25 is configured to be movable along the axis AX2 by various drive mechanisms such as a motor. Thereby, the center rest 25 supports the long workpiece W from the side opposite to the workpiece spindle 22. Typically, the axis AX2 is coaxial with the axis AX1. Further, the center rest 25 is configured to be rotatable about the axis AX2. Instead of the center rest 25, a second workpiece spindle (not shown) may be provided. The second workpiece spindle is provided so as to face the workpiece spindle 22 and is configured to be able to hold the workpiece W from the side opposite to the workpiece spindle 22.

[0034] The tool spindle 30 is provided, for example, at a position higher than the workpiece spindle 22 and the center rest 25. Further, the tool spindle 30 is configured to be able to detachably attach tools and the laser head 140. FIG. 2 shows an example in which the laser head 140 is attached to the tool spindle 30.

[0035] The attachment and detachment of the laser head 140 to and from the tool spindle 30 is realized by a dedicated attachment and detachment mechanism (not shown) for the laser head 140, which is different from, for example, an automatic tool changer (ATC: Automatic Tool Changer) used for automatically exchanging cutting tools. When performing additional processing on the workpiece W, the additive processing apparatus 100 attaches the laser head 140 to the tool spindle 30. On the other hand, when performing removal processing on the workpiece W, the additive processing apparatus 100 attaches a tool to the tool spindle 30.

[0036] As an example of the removal processing, there is milling in which a rotating tool is brought into contact with the workpiece W fixed to the workpiece spindle 22. As another example of the removal processing, there is turning in which a tool is pressed against the workpiece W rotating about the axis AX1.

[0037] The laser head 140 performs additive processing by the DED (Direct Energy Deposition) method while being attached to the tool spindle 30. As a mechanism for realizing the additive processing, the laser head 140 has a head body 142 and a laser nozzle 146.

[0038] Powder material is supplied to the head body 142 via a cable (not shown). The powder material to be supplied may be metal powder, resin powder, or other types of powder that melt upon irradiation with laser light.

[0039] The laser nozzle 146 irradiates the workpiece W with laser light and defines the irradiation area of the laser light on the workpiece W. The powder material supplied to the laser head 140 is discharged toward the workpiece W through the laser nozzle 146.

[0040] <C. Additional Processing> Next, with reference to FIG. 3, the additional processing by the laser head 140 will be described in more detail. FIG. 3 shows a cross-sectional view of the laser head 140 during additional processing.

[0041] While at least one of the laser head 140 and the workpiece W is being driven, the laser head 140 irradiates the surface of the workpiece W with the laser light LS. As a result, the workpiece W melts at the irradiated portion of the laser light LS, and a melting pool MP is formed on the surface of the workpiece W.

[0042] In parallel, the laser head 140 supplies the powder material PM to the melting pool MP. The powder material PM is guided to the melting pool MP by the gas GS discharged from the laser head 140. As a result, the powder material PM melts and liquefies in the melting pool MP. Thereafter, as the melting pool MP solidifies, a layer SL is formed on the workpiece W.

[0043] Note that the gas GS also functions as a shielding gas and prevents oxidation of the workpiece W, which is a laminate.

[0044] <D. Shutter Mechanism> Next, with reference to FIG. 4, the shutter mechanism provided in the processing area AR will be described. FIG. 4 is a view showing a part of the cover body 130 from the processing area AR side.

[0045] As described above, the laser head 140 supplies the powder material PM to the workpiece W during the additional processing and irradiates the laser beam LS onto the surface of the workpiece. When the reflectivity of the workpiece W is high, the high-intensity laser beam LS that has not been sufficiently attenuated may be reflected by the workpiece W and hit the window WD provided in the cover body 130. When the laser beam LS hits the window WD, the window WD may be damaged. Note that the window WD is provided with a detection mechanism (not shown) for detecting when the window WD is irradiated with the laser beam LS, and a safety mechanism is configured such that the output of the laser beam LS from the laser head 140 is stopped immediately when it is detected that the window WD has been irradiated with the laser beam LS. In other words, even if the surface on the processing area side of the window WD is irradiated with the laser beam LS and partial damage occurs, the output of the laser beam LS from the laser head 140 is stopped almost immediately, and it is configured to prevent the laser beam LS from being emitted outside the window WD.

[0046] To prevent damage to the window WD, a shutter 150 is provided for the window WD. The shutter 150 is configured to be openable and closable with respect to the window WD. The opening and closing direction of the shutter 150 is arbitrary. In the example of FIG. 4, the shutter 150 is configured to be openable and closable in the vertical direction.

[0047] The shutter 150 is provided on the processing area AR side of the window WD. In other words, the shutter 150 is provided inside the cover body 130.

[0048] In addition, a reflective material RF for reflecting the laser beam LS is provided on the surface of the shutter 150 on the processing area AR side. Thereby, the laser beam LS reflected by the workpiece W is prevented from hitting the window WD, and damage to the window WD is prevented. Further, by providing the reflective material RF on the shutter 150, damage to the shutter 150 itself due to absorption of the energy of the high-intensity laser beam LS is also prevented.

[0049] The reflective material RF is composed of any material capable of reflecting the laser light LS. As an example, the reflective material RF is composed of a metal plate with high reflectivity. Examples of such metals include copper, aluminum, etc. Thereby, the laser light LS is surely reflected by the reflective material RF, and damage to the reflective material RF is prevented. Further, the reflective material RF may be a diffusely reflective material that diffuses and reflects the laser light LS.

[0050] Note that in the example of FIG. 4, an example is shown in which the reflective material RF is provided not only on the shutter 150 but also around the shutter 150. However, the reflective material RF may be provided at least on the shutter 150 portion.

[0051] Preferably, the additional processing apparatus 100 controls the opening and closing of the shutter 150 according to whether the workpiece W is being processed or not.

[0052] As an example, the additional processing apparatus 100 executes a process for closing the shutter 150 before the additional processing of the workpiece W is started. Thereby, before the shutter 150 is closed, the operator can check the state of the processing area AR. On the other hand, after the additional processing of the workpiece is started, damage to the window WD is prevented.

[0053] More preferably, the additional processing apparatus 100 executes a process for opening the shutter 150 after the additional processing of the workpiece W is completed. Thereby, the operator can check the state of the processing area AR after the additional processing is completed and can check the finish of the workpiece W, etc.

[0054] <E. Modified Example 1 of the Additional Processing Apparatus 100> Next, with reference to FIG. 5, a modified example 1 of the additional processing apparatus 100 will be described. FIG. 5 is a view showing a part of the above-described cover body 130 from the processing area AR side.

[0055] The additional processing device 100 according to this modification example further includes one or more cameras 152 for photographing the processing area AR. By providing the camera 152 in the additional processing device 100, the operator can check the state inside the processing area AR even when the shutter 150 is closed.

[0056] Note that the number of cameras 152 provided in the processing area AR may be one or a plurality. In the example of FIG. 5, an example in which three cameras 152A to 152C are provided in the processing area AR is shown. Hereinafter, when the cameras 152A to 152C are not particularly distinguished, the cameras 152A to 152C are also referred to as the camera 152.

[0057] The image obtained from the camera 152 is displayed on a display unit provided in the additional processing device 100. Examples of the display unit include a display provided on the operation panel 200 (see FIG. 1) described above. The displayed image may be a moving image or a still image.

[0058] Preferably, the camera 152 is provided inside a protective cover. The protective cover houses the camera 152 so as to cover the parts other than the lens of the camera 152. Thereby, it is possible to prevent the camera 152 from being damaged by the laser light.

[0059] The cameras 152A to 152C are arranged in a row at the same height. Further, the cameras 152A to 152C are arranged such that their respective optical axes are parallel. Thereby, even when the long workpiece W is the object to be processed, the entire workpiece W can be photographed.

[0060] Preferably, the cameras 152A to 152C are provided on the cover body 130 so as to photograph the workpiece W in the processing area AR from the window WD side. More specifically, the camera 152 is arranged such that a part or all of it overlaps with the window WD. Thereby, the camera 152 can photograph the processing area AR from the same viewpoint as when the operator looks through the window WD.

[0061] When the camera 152 is arranged so as to overlap with the window WD, the shutter 150 will cover the camera 152 when it is closed. Therefore, in this example, a notch 154 is formed in the shutter 150. The camera 152 is arranged so as to fit into the notch 154 when the shutter 150 is closed. Thus, even when the shutter 150 is closed, the shutter 150 can cover the window WD without overlapping with the camera 152.

[0062] In addition, in the example of FIG. 5, an example in which one notch 154 is formed in the shutter 150 is shown, but the notch 154 is provided according to the number of cameras 152 provided so as to overlap with the window WD.

[0063] <F. Modification Example 2 of the Additional Processing Device 100> Next, with reference to FIGS. 6 and 7, a modification example 2 of the additional processing device 100 will be described. FIG. 6 is a view showing a part of the cover body 130 from the processing area AR side. FIG. 7 is a view showing a cross section of the additional processing device 100 along a vertical plane orthogonal to the window WD.

[0064] In this modification example, a part or all of the reflective material RF is inclined with respect to the vertical direction. The vertical direction represents a direction orthogonal to the horizontal plane. In the example of FIG. 6, an inclined portion CV is formed in a part of the reflective material RF.

[0065] When the incident angle of the laser beam LS with respect to the reflective material RF becomes 0°, the forward path of the laser beam LS from the laser head 140 to the reflective material RF and the return path after being reflected by the reflective material RF may coincide, and the laser beam LS may return to the laser head 140. As a result, the laser head 140 may be damaged.

[0066] In this example, by forming the inclined portion CV in the reflective material RF, the possibility that the incident angle of the laser beam LS with respect to the reflective material RF becomes 0° can be reduced. As a result, it is possible to prevent the laser head 140 from being damaged.

[0067] In the examples of FIGS. 6 and 7, an example is shown in which one inclined portion CV is formed on the reflective material RF, but a plurality of inclined portions CV may be formed on the reflective material RF. Further, in the examples of FIGS. 6 and 6, the inclined portion CV is formed only on the shutter 150, but the inclined portion CV may be formed on the reflective material RF provided on a portion other than the shutter 150. The vertical range in which the inclined portion CV is formed may be set based on, for example, the size of the work W that can be processed. That is, the vertical range of the inclined portion CV may be determined corresponding to the minimum diameter and the maximum diameter of the cylindrical work W that can be attached to the work spindle 22. The height of the irradiation point on the work W at which the incident angle of the laser beam LS becomes 45° in the work W having the minimum diameter determines the lower end side of the inclined portion CV, and the height of the irradiation point on the work W at which the incident angle of the laser beam LS becomes 45° in the work W having the maximum diameter determines the upper end side of the inclined portion CV.

[0068] The magnitude of the inclination angle formed by the vertical direction and the inclined portion CV is arbitrary. As an example, the inclined portion CV is inclined so that the laser beam LS is reflected to the ceiling side of the cover body 130. As another example, the inclined portion CV is inclined so that the laser beam LS is reflected to the floor side of the cover body 130. As still another example, the inclined portion CV is inclined so that the laser beam LS is reflected to the side surface side of the cover body 130.

[0069] Note that, depending on the additional processing apparatus 100, there are those that can not only perform additional processing on the work but also perform removal processing on the work. Such an additional processing apparatus 100 performs removal processing on the work while discharging coolant onto the work. The discharged coolant flows toward the floor surface side of the cover body 130. Therefore, if the reflective material RF is inclined so that the laser beam LS is reflected to the floor side of the cover body 130, the possibility that the laser beam LS will be directed toward the coolant increases. As a result, the energy of the laser beam LS is absorbed by the coolant, and the laser beam LS is prevented from being reflected multiple times within the processing area AR. As a result, damage to the object within the processing area AR by the laser beam LS is suppressed.

[0070] <G. Coolant mechanism> Next, with reference to FIG. 8, the coolant mechanism provided in the additional processing apparatus 100 will be described. FIG. 8 is a diagram schematically showing an example of the coolant mechanism provided in the additional processing apparatus 100.

[0071] On the ceiling of the cover body 130, a coolant discharge mechanism 234 is provided. Thereby, the discharge mechanism 234 discharges coolant from the ceiling of the cover body 130 to the processing area AR.

[0072] More specifically, the discharge mechanism 234 is connected to the storage portion SU1 through the flow path R1. The storage portion SU1 is a tank for storing coolant. The coolant stored in the storage portion SU1 is pumped into the flow path R1 by the pump P1 and discharged from the discharge mechanism 234 to a workpiece or the like.

[0073] Also, in the processing area AR, a chip conveyor 250 is provided. The coolant discharged from the discharge mechanism 234 is collected by the chip conveyor 250 together with the chips of the workpiece.

[0074] The chip conveyor 250 includes a tank 252, a filtration mechanism 254, and a tank 256. The coolant discharged into the processing area AR flows into the tank 252. The inclined portion CV (see FIGS. 6 and 7) formed on the above-described reflector RF may be inclined so that the laser beam LS is reflected by the coolant in the tank 252.

[0075] The coolant collected in the tank 252 is sent to the filtration mechanism 254 by a transport mechanism such as a conveyor. The filtration mechanism 254 is configured to be able to capture foreign matters such as chips of the workpiece from the coolant. The coolant that has passed through the filtration mechanism 254 is discharged into the tank 256.

[0076] The tank 256 is provided with a pump P2. The pump P2 pumps up the coolant accumulated in the tank 256 and pumps the coolant into the flow path R2. The coolant is sent to the storage section SU1 through the flow path R2.

[0077] As described above, the coolant circulates in the additional processing apparatus 100 in the order of storage section SU1 → flow path R1 → discharge mechanism 234 → processing area AR → chip conveyor 250 → flow path R2 → storage section SU1.

[0078] In the above description, the example in which the discharge mechanism 234 of the coolant is provided on the ceiling of the cover body 130 has been described. However, the discharge mechanism 234 of the coolant may be provided at other locations. As an example, the discharge mechanism 234 of the coolant may be provided on the tool spindle 30. The discharge mechanism 234 may be a side-through specification that discharges the coolant from the end face of the tool spindle 30 through the housing of the tool spindle 30, or may be a center-through specification that discharges the coolant from the cutting edge of the tool through the center of the spindle.

[0079] <H. Drive mechanism of additional processing apparatus 100> Next, with reference to FIG. 9, the drive mechanism in the additional processing apparatus 100 will be described. FIG. 9 is a diagram showing an example of the drive mechanism of the additional processing apparatus 100.

[0080] For convenience of explanation, hereinafter, the axial direction of the above-described work spindle 22 is also referred to as the Z-axis direction. The Z-axis direction corresponds to the direction of the axis AX1 shown in FIG. 2. Also, it is a direction on the horizontal plane, and the direction orthogonal to the Z-axis direction is also referred to as the X-axis direction. The X-axis direction corresponds to the direction from the above-described window WD toward the processing area AR. Further, the direction orthogonal to both the X-axis direction and the Z-axis direction is also referred to as the Y-axis direction. The Y-axis direction corresponds to the vertical direction.

[0081] As shown in FIG. 9, the additional processing apparatus 100 includes a control unit 50 and drive units 210, 220, 230A, 230B, 240.

[0082] The control unit 50 controls various devices within the additional processing apparatus 100. The device configuration of the control unit 50 is arbitrary. The control unit 50 may be composed of a single control unit or a plurality of control units. As an example, the control unit 50 includes at least one of a CNC (Computer Numerical Control) and a PLC (Programmable Logic Controller).

[0083] The drive unit 210 is a drive mechanism for rotationally driving the workpiece spindle 22. The drive unit 210 may be composed of a single drive unit or a plurality of drive units. In the example of FIG. 9, the drive unit 210 is composed of a motor driver 211C and a motor 212C.

[0084] The motor driver 211C sequentially receives an input of a target rotation angle or a target rotation speed from the control unit 50 and outputs a current corresponding to the target rotation angle or the target rotation speed to the motor 212C. Thereby, the workpiece held by the workpiece spindle 22 rotates about the Z-axis direction as the rotation center. The motor 212C may be an AC motor, a stepping motor, a servo motor, or other types of motors.

[0085] The drive unit 220 is a drive mechanism for driving the center rest 25. The drive unit 220 may be composed of a single drive unit or a plurality of drive units. In the example of FIG. 9, the drive unit 220 is composed of a motor driver 221Z and a motor 222Z.

[0086] The motor driver 221Z sequentially receives an input of a target position from the control unit 50 and outputs a current corresponding to the target position to the motor 222Z. Thereby, the motor 222Z moves the center rest 25 to an arbitrary position in the Z-axis direction. The motor 222Z may be an AC motor, a stepping motor, a servo motor, or other types of motors.

[0087] The drive unit 230A is a drive mechanism for moving the position of the tool spindle 30. The above-described laser head 140 is driven by being mounted on the tool spindle 30. The drive unit 230A may be composed of a single drive unit or a plurality of drive units. In the example of FIG. 9, the drive unit 230A is composed of motor drivers 231X to 231Z and motors 232X to 232Z.

[0088] The motor driver 231X sequentially receives an input of a target position from the control unit 50 and outputs a current corresponding to the target position to the motor 232X. Thereby, the motor 232X drives the tool spindle 30 to an arbitrary position in the X-axis direction. The motor 232X may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0089] The motor driver 231Y sequentially receives an input of a target position from the control unit 50 and outputs a current corresponding to the target position to the motor 232Y. Thereby, the motor 232Y drives the tool spindle 30 to an arbitrary position in the Y-axis direction. The motor 232Y may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0090] The motor driver 231Z sequentially receives an input of a target position from the control unit 50 and outputs a current corresponding to the target position to the motor 232Z. Thereby, the motor 232Z moves the tool spindle 30 to an arbitrary position in the Z-axis direction. The motor 232Z may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0091] The drive unit 230B is a drive mechanism for rotationally driving the tool spindle 30. The drive unit 230B may be composed of a single drive unit or a plurality of drive units. In the example of FIG. 9, the drive unit 230B is composed of motor drivers 231A, 231B and motors 232A, 232B.

[0092] The motor driver 231A sequentially receives an input of a target rotation angle or a target rotation speed from the control unit 50, and outputs a current corresponding to the target rotation angle or the target rotation speed to the motor 232A. The motor 232A drives the tool spindle 30 to rotate about the X-axis direction. The motor 232A may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0093] The motor driver 231B sequentially receives an input of a target rotation angle or a target rotation speed from the control unit 50, and outputs a current corresponding to the target rotation angle or the target rotation speed to the motor 232B. The motor 232B drives the tool spindle 30 to rotate about the axial direction of the tool spindle 30. The motor 232B may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0094] The drive unit 240 is a drive mechanism for driving the shutter 150. The drive unit 240 may be composed of a single drive unit or a plurality of drive units. In the example of FIG. 9, the drive unit 240 is composed of a motor driver 241Y and a motor 242Y.

[0095] The motor driver 241Y sequentially receives an input of a target position from the control unit 50, and outputs a current corresponding to the target position to the motor 242Y. Thereby, the motor driver 241Y drives the shutter 150 to an arbitrary position in the Y-axis direction and controls the opening and closing of the shutter 150. The motor 242Y may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0096] In the above description, an example in which the shutter 150 is driven by the motor-driven drive unit 240 has been described. However, the shutter 150 may be driven by other drive mechanisms. As an example, an air cylinder may be used as the drive mechanism for the shutter 150.

[0097] <I. Hardware Configuration of Control Unit 50> Next, with reference to FIG. 10, the hardware configuration of the control unit 50 shown in FIG. 9 will be described. FIG. 10 is a diagram showing an example of the hardware configuration of the control unit 50.

[0098] As described above, the control unit 50 may be a CNC or a PLC. FIG. 10 shows the hardware configuration of the control unit 50 as a CNC.

[0099] The control unit 50 includes, for example, a control circuit 101, a ROM (Read Only Memory) 102, a RAM (Random Access Memory) 103, a communication interface 104, and an auxiliary storage device 120. These components are connected to an internal bus 109.

[0100] The control circuit 101 is constituted by, for example, at least one integrated circuit. The integrated circuit may be constituted by, for example, at least one CPU (Central Processing Unit), at least one GPU (Graphics Processing Unit), at least one ASIC (Application Specific Integrated Circuit), at least one FPGA (Field Programmable Gate Array), or a combination thereof.

[0101] The control circuit 101 controls the operation of the control unit 50 by executing various programs such as the control program 122. The control program 122 is a program for realizing the various processes described in this specification. The control circuit 101 reads the control program 122 from the ROM 102 into the RAM 103 based on receiving an execution instruction of the control program 122. The RAM 103 functions as a working memory and temporarily stores various data necessary for the execution of the control program 122.

[0102] The communication interface 104 is an interface for realizing communication with various devices. The additional processing device 100 communicates, for example, with various drive units (such as the above-described drive units 210, 220, 230A, 230B, 240, etc.) for realizing the additional processing of the workpiece via the communication interface 104.

[0103] The auxiliary storage device 120 is a storage medium such as a hard disk or a flash memory, for example. The auxiliary storage device 120 stores the control program 122 and the like. The storage location of the control program 122 is not limited to the auxiliary storage device 120 and may be stored in the storage area of the control circuit 101 (such as a cache memory), the ROM 102, the RAM 103, an external device (such as a server), etc.

[0104] Also, the control program 122 may be provided incorporated into a part of an arbitrary program instead of as a single program. In this case, the various processes according to this embodiment are realized in cooperation with an arbitrary program. Even a program that does not include such a part of the module does not deviate from the gist of the control program 122 according to this embodiment. Furthermore, part or all of the functions provided by the control program 122 may be realized by dedicated hardware. Furthermore, the control unit 50 may be configured in a form such as a so-called cloud service in which at least one server executes a part of the processing of the control program 122.

[0105] <J. Control Flow> Next, referring to FIG. 11, the control flow of the additional processing apparatus 100 will be described. FIG. 11 is a flowchart showing the flow of the additional processing step by the additional processing apparatus 100.

[0106] The processes shown in FIG. 11 are realized by the control unit 50 of the additional processing apparatus 100 executing the above-described control program 122. In other aspects, part or all of the processes may be executed by circuit elements or other hardware.

[0107] In step S110, the control unit 50 determines whether an execution instruction for additional processing has been received. The execution instruction for additional processing is, for example, a command to attach the laser head 140 to the tool spindle 30, or a command to move the tool spindle 30 to which the laser head 140 is attached before the laser beam LS is emitted. When the control unit 50 determines that an execution instruction for additional processing has been received (YES in step S110), the control is switched to step S112. Otherwise (NO in step S110), the control unit 50 repeats the process of step S110.

[0108] In step S112, the control unit 50 outputs an instruction to close the above-described shutter 150 to the drive unit 240 (see FIG. 9). As a result, the shutter 150 is driven by the drive unit 240 and enters the closed state covering the above-described window WD.

[0109] In step S114, the control unit 50 starts imaging by the above-described camera 152 (see FIG. 5) and displays an image representing the processing area AR on the display unit of the additional processing apparatus 100.

[0110] In step S120, the control unit 50 determines whether or not the additional processing has been completed. As an example, based on the completion of the execution of the additional processing program, the control unit 50 determines that the additional processing of the workpiece has been completed. When the control unit 50 determines that the additional processing has been completed (YES in step S120), it switches the control to step S122. Otherwise (NO in step S120), the control unit 50 returns the control to step S120.

[0111] In step S122, the control unit 50 outputs an instruction to open the shutter 150 described above to the drive unit 240 (see FIG. 9). As a result, the shutter 150 is driven by the drive unit 240 and assumes an open state that does not cover the window WD described above.

[0112] In step S124, the control unit 50 stops the imaging by the camera 152 described above.

[0113] Note that in the above description, an example in which the imaging process of the processing area AR by the camera 152 is executed only during the additional processing has been described, but the imaging process may be executed not only during the additional processing but also at other times outside the additional processing.

[0114] The embodiments disclosed this time should be considered to be illustrative in all respects and not restrictive. The scope of the present invention is shown not by the above description but by the claims, and it is intended that all modifications within the meaning and scope equivalent to the claims are included.

Explanation of Reference Numerals

[0115] 11 Bed, 22 Work spindle, 23 Chuck mechanism, 25 Center rest, 30 Tool spindle, 50 Control unit, 100 Additional processing device, 101 Control circuit, 102 ROM, 103 RAM, 104 Communication interface, 109 Internal bus, 120 Auxiliary storage device, 122 Control program, 130 Cover body, 140 Laser head, 142 Head body, 146 Laser nozzle, 150 Shutter, 152 Camera, 152A Camera, 152B Camera, 152C Camera, 154 Notch, 200 Operation panel, 210 Drive unit, 211C Motor driver, 212C Motor, 220 Drive unit, 221Z Motor driver, 222Z Motor, 230A Drive unit, 230B Drive unit, 231A Motor driver, 231B Motor driver, 231X Motor driver, 231Y Motor driver, 231Z Motor driver, 232A Motor, 232B Motor, 232X Motor, 232Y Motor, 232Z Motor, 234 Discharge mechanism, 240 Drive unit, 241Y Motor driver, 242Y Motor, 250 Chip conveyor, 252 Tank, 254 Filtration mechanism, 256 Tank, AR processing area, AX1 axis, AX2 axis, CV Inclined part, DR Door, GS Gas, LS Laser beam, MP Molten pool, P1 Pump, P2 Pump, PM Powder material, R1 Flow path, R2 Flow path, RF Reflective material, SL Layer, SU1 Storage part, W Workpiece, WD Window.

Claims

1. An additive manufacturing apparatus capable of performing additive manufacturing by supplying a powder material to a workpiece and irradiating the workpiece with a laser beam, comprising: a cover body that defines a processing area for performing additive manufacturing on the workpiece; a window provided in the cover body; a shutter provided on the processing area side of the window and configured to be openable and closable with respect to the window; in a state where the shutter is closed, the inside of the processing area cannot be viewed through the window from the outside of the processing area; an additive manufacturing apparatus, wherein a reflective material for reflecting the laser beam is provided on the surface of the shutter on the processing area side.

2. The additive manufacturing apparatus further includes a control unit for controlling the opening and closing of the shutter, The control unit executes a process for closing the shutter before the additive manufacturing of the workpiece is started. The additive manufacturing apparatus according to claim 1.

3. The control unit executes a process for opening the shutter after the additive manufacturing of the workpiece is completed. The additive manufacturing apparatus according to claim 2.

4. The additive manufacturing apparatus further includes a camera for photographing the processing area. The additive manufacturing apparatus according to any one of claims 1 to 3.

5. A part or all of the reflective material is inclined with respect to the vertical direction. The additive manufacturing apparatus according to any one of claims 1 to 3.

6. The reflective material is made of a metal material. The additive manufacturing apparatus according to any one of claims 1 to 3.

7. The reflective material is made of a metal plate. The additive manufacturing apparatus according to any one of claims 1 to 3.

8. An additive manufacturing apparatus capable of performing additive manufacturing by supplying a powder material to a workpiece and irradiating the workpiece with a laser beam, comprising: a cover body that defines a processing area for performing additive manufacturing on the workpiece; a window provided in the cover body; a shutter provided on the processing area side of the window and configured to be openable and closable with respect to the window; a camera for photographing the processing area; a reflective material for reflecting the laser beam is provided on the surface of the shutter on the processing area side; a notch is formed in the reflective material. The additional processing device is configured such that the camera is arranged to fit into the notch when the shutter is closed. **Claim 9** An additional processing device capable of performing additional processing by supplying a powder material to a workpiece and irradiating the workpiece with a laser beam, a cover body that defines a processing area for performing additional processing on the workpiece, a window provided in the cover body, a shutter provided on the processing area side of the window and configured to be openable and closable with respect to the window, a reflective material for reflecting the laser beam is provided on the surface of the shutter on the processing area side, An additional processing device, wherein part or all of the reflective material is inclined with respect to the vertical direction so that the laser beam is reflected toward the ceiling side of the cover body. **Claim 10** An additional processing device capable of performing additional processing by supplying a powder material to a workpiece and irradiating the workpiece with a laser beam, a cover body that defines a processing area for performing additional processing on the workpiece, a window provided in the cover body, a shutter provided on the processing area side of the window and configured to be openable and closable with respect to the window, a reflective material for reflecting the laser beam is provided on the surface of the shutter on the processing area side, The additional processing device is further configured to be capable of removing the workpiece, In the processing area, a discharge mechanism for discharging a coolant to the workpiece, a tank into which the coolant discharged to the workpiece flows, are provided, An additional processing device, wherein part or all of the reflective material is inclined with respect to the vertical direction so that the laser beam is reflected toward the floor side of the cover body. **Claim 11** An additional processing device capable of performing additional processing by supplying a powder material to a workpiece and irradiating the workpiece with a laser beam, a cover body that defines a processing area for performing additional processing on the workpiece, a window provided in the cover body, a shutter provided on the processing area side of the window and configured to be openable and closable with respect to the window, a reflective material for reflecting the laser beam is provided on the surface of the shutter on the processing area side, An additional processing device, wherein the reflective material is made of a copper plate. **Claim 12** A control method for an additive manufacturing apparatus capable of performing additive manufacturing by supplying a powder material to a workpiece and irradiating the workpiece with a laser beam, wherein the additive manufacturing apparatus includes a cover body that defines a processing area for performing additive manufacturing on the workpiece, a window provided in the cover body, and a shutter provided on the processing area side of the window and configured to be openable and closable with respect to the window, wherein in a state where the shutter is closed, it is configured such that the inside of the processing area cannot be viewed through the window from the outside of the processing area, and a reflective material for reflecting the laser beam is provided on the surface of the shutter on the processing area side, the control method including a step of closing the shutter before the additive manufacturing of the workpiece is started.

13. A control program for an additive manufacturing apparatus capable of performing additive manufacturing by supplying a powder material to a workpiece and irradiating the workpiece with a laser beam, wherein the additive manufacturing apparatus includes a cover body that defines a processing area for performing additive manufacturing on the workpiece, a window provided in the cover body, and a shutter provided on the processing area side of the window and configured to be openable and closable with respect to the window, wherein in a state where the shutter is closed, it is configured such that the inside of the processing area cannot be viewed through the window from the outside of the processing area, and a reflective material for reflecting the laser beam is provided on the surface of the shutter on the processing area side, the control program causing the additive manufacturing apparatus to execute a step of closing the shutter before the additive manufacturing of the workpiece is started.

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