Electronics module and arrangement for a cardiac assist system and method for producing a cardiac assist system - Patents.com

Abstract

The present invention relates to an electronics module (102) for a cardiac assist system, the cardiac assist system having a motor housing for housing a pump motor. The electronics module (102) comprises an electronics section (204) for housing at least one electronics component (206) and / or at least one electrically conductive contact element (208), and a connection section (202) designed as an interface between the motor housing (104) and the electronics section (204) or as a separate component to be joined, the motor housing (104) and the electronics section (204) being or being able to be connected to each other via the connection section (202) to form a fluid-tight module housing (104) that is placed in a blood vessel. [Selected Figure] Figure 2A

Description

Technical Field

[0001] The present invention relates to an electronic device module and arrangement for a heart assist system, and a method for generating a heart assist system.

Background Art

[0002] Larger heart assist systems, such as implantable left heart assist systems, can have sensors, and their electronics can be constructed, for example, on a circuit board and accordingly integrated into a large cavity of the device. Smaller, fully implantable devices, also called percutaneous assist devices, have high requirements with respect to the installation size, and thus, in this case, the integration of additional electronics is generally unnecessary.

[0003] The object of the present invention is to provide an electronic device module and arrangement for a heart assist system, and a generation method for a heart assist system, which enable the integration of electronic device assemblies and sensors into a heart assist system in a small installation space, in particular into a percutaneous left heart assist system.

Summary of the Invention

[0004] This object is achieved by an electronic device module comprising the features according to claim 1, an arrangement according to claim 14, and a generation method according to claim 22. Advantageous embodiments of the invention are defined in the dependent claims.

[0005] The present invention is based on the idea that a sensor and other electronic device components, such as a microcontroller or a conductor structure, can be integrated into a percutaneous left heart assist system by suitably shaped pump housing components. For this purpose, the pump housing component is realized by at least two housing parts such that the electronic device can be constructed in a first housing part, the motor can be constructed in a second housing part, and then the housing parts can be joined together to form a complete motor. The electronic device can be placed inside the pump housing component or in a recess on its outside. The latter is particularly useful for sensors. For example, the pump housing component can be at least partially manufactured from a ceramic with an integrated conductor structure. Such a ceramic component can be constructed with an additional layer structure, for example, as an injection molded part, for example, by 3D printing, or by laminating a two-dimensional ceramic substrate.

[0006] Thus, the approach presented herein enables hermetic closing of the motor by means of a so-called back end, generation of hermetically sealed electrical contacts from the inside to the outside of the motor, joining together of the electrical conductor from the inside of the motor and a sensor cable or connection cable laid outside the motor, integration of the electronic device into the percutaneous left heart assist system as an essential component of the housing component, and integration of sensor technologies at the proximal end of the heart assist system, such as blood pressure, acceleration, vibration, body-derived sound, temperature, Hall, ultrasonic, surface acoustic wave, optical, or biochemical sensors, or microphones.

[0007] Particularly advantageously, integration of a microcontroller as a processing unit at the proximal end is possible for aggregation of sensor data, storage of calibration data, identification by serial number, or realization of a transceiver function.

[0008] The back end can be electrically functionalized, for example, via a 3D-MID ceramic structure.

[0009] The strands of the motor winding can be brought into direct contact with the ceramic by an optional inner contact surface, thereby eliminating the need for additional rewiring.

[0010] In particular, the approach presented herein enables the integration of electronic devices inside a hermetically sealed environment, such that only the sensors that need to be exposed come into contact with the blood in the non-hermetic area, thereby increasing biocompatibility and reliability.

[0011] For example, a sensor hub in the form of a microcontroller for preprocessing sensor data, converting communication protocols, redundancy and error protection of transmission paths, or identification of pumps can be integrated in this way.

[0012] When ceramic is used, the conductor paths and electronic device components can be applied directly to the starting material without an additional insulating layer due to the insulating properties of the ceramic. For example, no short circuit may occur even at the contact sites via pins for connecting sensors or hybrid cables. Furthermore, due to the heat insulating properties of the ceramic, decoupling of the measured ambient temperature from the motor heat is possible.

[0013] An electronic device module for a heart assist system, wherein the heart assist system has a motor housing for accommodating a pump motor, and the electronic device module has the features of an electronic device section for accommodating at least one electronic device component and / or at least one conductive contact element, and the features of a connecting section, the connecting section being designed as a joint between the motor housing and the electronic device section or as a separate component to be joined, and the motor housing and the electronic device section being joined to each other or being joinable via the connecting section so as to form a fluid-tight module housing arranged in a blood vessel, is presented.

[0014] An electronic device module can be understood to mean a unit designed for electrical contact and / or for accommodating circuitry, control, or sensor technology. A heart assist system, also known as a ventricular assist device (VAD), can be understood to mean a pumping device for increasing the pumping performance of the heart. The heart assist system can be inserted, for example, into a heart chamber or the aorta by means of a catheter. The heart assist system may in particular be a left heart assist system. The module housing may be a housing component of the heart assist system. The connection section can be understood to mean a first housing part of the module housing. The electronics section can be understood to mean a second housing part of the module housing. Alternatively, the connection section may also be a partial area or surface of the electronic device module. The module housing can be connected to or connectable to the motor housing, for example by welding, so as to form a hermetically sealed housing unit. The connection section and the electronics section can be connected to each other in a fluid-tight manner, for example by adhesive bonding or by using additional sealing elements. The connection section may also be designed as a surface coating or a partial section of the surface of the electronics section at the joint, or as an adhesive bead. Electronic device components can be understood to mean, for example, a microcontroller, a sensor element, or another electronic device component, in particular a semiconductor-based component. The contact element can be understood to mean, for example, a conductor path, a conductor path structure, a pin for through-plating, or a pad.

[0015] The electronics section can be made, for example, mainly from an electrically insulating material. In particular, the contact element can be at least partially embedded in the electrically insulating material. A blood vessel can be understood to mean, for example, an artery, a vein, or a heart chamber. The electronic device module is also referred to as the backend of the heart assist system and can be arranged at the proximal end of the heart assist system.

[0016] According to one embodiment, the connecting section can be realized as a titanium part or element, and / or a sintered part or element. Additionally or alternatively, the electronic device section can be realized as a ceramic part or element, and / or a composite layer of at least two layers. Thereby, on the one hand, for example, it is possible to easily couple the module housing and the motor housing by welding, and on the other hand, it is possible to integrate electronic device components or contact elements into the electronic device section in an easy and space-saving manner. This can also improve the material compatibility or biocompatibility of the electronic device module.

[0017] For example, the layers can be alternately stacked in the longitudinal direction of the electronic device section. As a result, the electronic device section can be manufactured particularly efficiently in an additive manufacturing process such as 3D printing.

[0018] According to another embodiment, the connecting section can be a surface layer or a partial section of the electronic device section that generates advantageous properties for joining to the motor housing.

[0019] According to another embodiment, the electronic device module can be directly connectable or connected to the motor housing, for example, by adhesive restraint.

[0020] According to another embodiment, the connecting section can be welded or weldable to the motor housing. Thereby, a particularly reliable hermetic seal of the module housing to the motor housing can be achieved, and established standard manufacturing processes can be used.

[0021] The connecting section can be annular. As a result, the connecting section can be manufactured particularly easily.

[0022] According to another embodiment, the connection section and / or the electronic device section may be cylindrical. As a result, the electronic device module can be realized particularly advantageously with regard to the low risk of thrombosis.

[0023] Depending on the embodiment, the electronic device module may have electronic device components and / or contact elements. In this case, the contact elements may be designed to enable conductive contact between the electronic device modules via the outside of the electronic device section. Additionally or alternatively, the contact elements may be designed as pins, pads, or conductor path structures, or as a combination of at least two of the mentioned designs. The pads may be understood, for example, to mean a contact surface and / or a height, thereby enabling contact not only via a point-shaped contact site but also via a flat contact site for better electrical contact. Additionally or alternatively, the contact elements may be at least partially embedded in the material of the electronic device section. As a result, various electrical or electronic device components can be integrated into the heart assist system with a relatively low manufacturing effort.

[0024] Furthermore, the electronic device section may have a recess for accommodating at least one section of the pump motor. The recess may generally be understood to mean a pocket. For example, the recess may be formed to accurately accommodate the pump motor. This embodiment enables the design of the electronic device module to be maintained particularly compact in the longitudinal direction.

[0025] According to one embodiment, the contact element may extend into the recess to enable electrical contact of the pump motor accommodated in the recess. In this case, the connection section may extend around the recess, for example, annularly, thereby enabling the pump motor to be guided through the connection section into the recess. This embodiment enables particularly simple electrical contact of the pump motor without additional contact elements.

[0026] This is also advantageous when the electronic device section has a sensor section for accommodating at least one sensor element and / or a connection section for connecting a cable to the electronic device module. The contact elements can be or can be arranged on the sensor section and / or on the connection section. The sensor section can be, for example, a flattened area on the side surface of the electronic device section. The connection section can be understood, for example, to mean the front side of the electronic device module. For example, the connection section can be realized as a connection field having a plurality of contact elements in the form of connector pins or contact grooves for contacting a cable or a plug connector. This enables easy attachment of the sensor element and easy electrical contact of the electronic device module.

[0027] According to one embodiment, the connection section can be arranged on the front side of the electronic device section facing away from the connection section. Additionally or alternatively, the electronic device section can be or can be connected to a protective cap, a stress relief element, a bend protection element, a flex protection element, or a combination of at least two of the aforementioned elements. This prevents damage to the electronic device module. Additionally, this enables easy insertion of the electronic device module into a blood vessel.

[0028] According to another embodiment, the connection section can be formed with a plurality of contact grooves for electrically contacting a cable. The contact grooves can be understood, for example, to mean semi-circular depressions that can be lined with a conductive material. The contact grooves can be arranged, for example, around the central axis of the electronic device section. This enables, for example, electrical contact without a plug of the electronic device module by soldering the individual wires of the cable to the conductive material in the contact grooves.

[0029] The approach presented herein also creates a heart assist system comprising a motor housing for accommodating a pump motor and an electronics module having an electronics section for accommodating at least one electronics component and / or at least one conductive contact element and a connection section, wherein the electronics section and the connection section or the motor housing are joined to one another to form a fluid-tight module housing to be disposed intravascularly, and the electronics section is fluid-tightly connected to the motor housing via the connection section.

[0030] Finally, the approach presented creates a method for generating an electronics module for a heart assist system, the heart assist system having a motor housing for accommodating a pump motor, the method including the step of forming an electronics section for accommodating at least one electronics component and / or at least one conductive contact element on a connection section, the connection section being formed to fluid-tightly connect the electronics module and the motor housing.

[0031] Further, in a particularly preferred embodiment, an optional step of joining an electronics section and a connection section designed as a separate element to fluid-tightly connect the electronics module and the motor housing can be combined to form a fluid-tight module housing to be disposed intravascularly.

[0032] Optional separate elements can be formed as connecting sections, for example, by sintering. In particular, the connecting section can be directly sintered to the electronic device section in the step of joining. The electronic device section can be formed, for example, in an additive manufacturing process, in particular by alternately stacking ceramic layers. Alternatively, the electronic device section can be formed in an injection molding process or a machining process, for example, by milling or turning. In the forming step, the contact element can be directly embedded in the electronic device section, for example, in the form of pins for electroplating through the individual layers of the electronic device section. Additionally or alternatively, the contact element can be applied to the surface of the electronic device section or its individual layers.

[0033] Advantageous exemplary embodiments of the present invention will be described in more detail in the following description with reference to the drawings.

[0034] The drawings show the following.

Brief Description of the Drawings

[0035]

Figure 1

Figure 2A

Figure 2B

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

[0036] In the following description of the preferred exemplary embodiments of the present invention, the same or similar reference numerals are used for the elements shown in the various figures, which have similar effects, and repeated descriptions of these elements are omitted.

[0037] FIG. 1 shows a schematic diagram of a heart assist system 100 according to an exemplary embodiment. The heart assist system 100, here by way of example, a left heart assist system for percutaneous implantation into the left heart cavity, has an electronic device module 102 fluid-tightly connected to a motor housing 104 for accommodating a pump motor. The electronic device module 102 represents the proximal end of the heart assist system 100 and forms a transition between the motor housing 104 and a connection cable 106 for connecting the heart assist system 100 to an external energy source or an external evaluation or control device.

[0038] The heart assist system 100 has a cylindrical elongated structure with a substantially constant outer diameter and a rounded tapered end for easy positioning within a blood vessel, e.g., the left heart cavity or the aorta, by a catheter.

[0039] By way of example, the heart assist system 100 has a tip in the form of, for example, a sensor assembly 110 for pressure measurement.

[0040] FIG. 2A shows a schematic view of the electronic device module 102 of FIG. 1. The electronic device module 102 comprises a cylindrical module housing consisting of an (optional) connection section 202 and an electronic device section 204. The (optional) connection section 202 is used, for example, by welding, to fluid-tightly connect the electronic device module 102 and the motor housing. For adhesive restraint, direct bonding can also be performed. According to a preferred exemplary embodiment, the connection section 202 is realized as a (metal) ring, in particular a titanium ring. The electronic device section 204 is used to accommodate one or more electronic device components 206. Further, the electronic device section 204 according to this exemplary embodiment has a plurality of conductive contact elements 208 that are designed for electrical contact of the electronic device components 206 or the pump motor, or for connecting a cable to the electronic device section 204.

[0041] The two sections 202, 204 (as long as the connection section 202 is formed as a separate element) are fluid-tightly connected to each other, for example, by adhesive restraint. Alternatively, the motor housing can also be directly mounted on the surface portion of the electronic device section 204 that acts as the connection section 202 and thereby can be fluid-tightly closed.

[0042] According to FIG. 2A, a portion of the contact element 208 is disposed on the connection section 210 on the front side of the electronic device section 204 facing away from the connection section 202 and / or the motor housing side, and the end of the contact element 208 protruding from the connection section 210 is designed as a connector pin for connecting a connection cable. Accordingly, the connection cable contacts via a contact sleeve or a direct connection. The connection section 210 may also be referred to as a connection field. The electronic device component 206, here a sensor element, is positioned on the external sensor section 212 of the electronic device section 204. In this case, the sensor section 212 is realized as a flattening of the side surface of the electronic device section 204, and thus forms a platform for the sensor element 206. Some of the contact elements 208 for making contact are also arranged within the sensor section 212 inside the hermetic interior of the electronic device section 204.

[0043] The electronic device module 102, which may also be referred to as the backend of the heart assist system, is realized, for example, by a ceramic component as the electronic device section 204 and a titanium sintered ring as the connection section 202. This two-component structure is advantageous because it simplifies subsequent production steps such as the hermetic welding of the electronic device module 102 to the motor housing. First and foremost, the use of ceramic as the housing material offers the advantage of simple integration of complex conductor structures. On the other hand, the use of a titanium element as the connection section 202 ensures hermetic welding to the motor housing.

[0044] The electronic device section 204 is realized as a ceramic component functionalized by layer-by-layer construction using, for example, co-firing technology.

[0045] According to an exemplary embodiment, the connection section 202 is vitrified in a form-fitting manner to create a hermetic seal connection between the connection section 202 and the electronic device section 204.

[0046] The electronic device section 204 is optionally formed with one or more rounded steps 214 such that a thin film substrate for connecting additional sensors from, for example, the sensor assembly shown in FIG. 1 can be routed without damaging the connection section 210. The connection section 210 serves, for example, to connect hermetic feedthrough pins to a connection cable.

[0047] Optionally, an additional stage 216 is at least partially formed around the connection section 210 to enable connection of a protective cap, a strain relief, or a bend protection grommet.

[0048] FIG. 2B shows a schematic view of an electronic device module 102 according to another exemplary embodiment, for example, for direct connection to a motor housing by adhesive restraint. Here, the electronic device module 102 can be seen to have a connection section 202 that is formed as a surface layer or as a partial section of the electronic device section 204, but not as a separate element as shown in FIG. 2A.

[0049] FIG. 3 shows a schematic view of the layer structure of the electronic device section 204 according to an exemplary embodiment. Shown by way of example is the layer structure of the electronic device section 204 that can be realized by a Low Temperature Cofired Ceramics (LTCC) process. As can be seen, the layer structure comprises a plurality of individual layers 304 stacked alternately along the longitudinal axis 300 of the electronic device section 204, in this case a plurality of disk-shaped ceramic layers.

[0050] The conductor structure of the contact element 208 is realized, for example, by screen printing in the plane of the individual layers 304 and by vias from individual layers to individual layers.

[0051] The electronic device module is constructed step by step, for example, by stacking printed and electro-conductively printed green components. This results in a boundary condition where the upper layer can have only dimensions below those of the lower layer. Different morphological requirements can be realized, for example, by corresponding post-processing of the sintered parts of the electronic device module by milling or turning.

[0052] Alternatively, the electronic device section 204 is produced as a ceramic component functionalized by 3D printing, injection molding, or milling. Electrical functionalization is then carried out by screen printing, dispensing, and glassified feed-throughs.

[0053] FIG. 4 shows a schematic view of an electronic device module 102 according to an exemplary embodiment. An embodiment of the electronic device module 102 as a ceramic MID part is shown. In contrast to the electronic device module described above with reference to FIGS. 1 - 3, in this case the side surface of the electronic device section 204 has, among other things, a first cavity 400 in which, by way of example, two contact elements 208 extend, and a second cavity 402. The bottom surface of the second cavity 402 forms a sensor section for arranging the component 206. In a third front cavity 404, the contact elements 208 of the connection section 210 are arranged, and the bottom surface of the third cavity 404 forms the connection section 210. Optionally, the electronic device section 204 is conical in the region of the connection section 210.

[0054] By means of the aforementioned manufacturing process, morphological adaptation can be achieved within a limited range without post-processing, such that in addition to the platform for the sensor, cavities can also be realized on the side or front surface of the electronic device section 204 as shown by way of example in FIG. 4. This can, for example, improve the mechanical protection of the external sensor element 206 and the connection section 210.

[0055] FIG. 5 shows a schematic diagram of the electronic device module 102 of FIG. 4. An internal view of the electronic device module 102 with an exemplary conductor structure is shown. The electronic device section 204 can be seen to have an internal recess 500 in which a plurality of contact elements 208 extend. The recess 500 is used, for example, to accommodate the connection side of the pump motor in order to enable direct electrical contact between the pump motor and the contact elements 208. In this case, this is useful when the connection section 202 is realized as a ring.

[0056] The electrical conductor structure formed by the contact elements 208 is generated, for example, externally by screen printing or internally by dispensing. FIG. 5 shows a corresponding exemplary embodiment. During dispensing, the robotic arm guides a thin cannula by means of which a conductive material such as a gold paste or a conductive adhesive is dispensed. The conductive paste is firmly connected to the ceramic by a sintering process in order to realize an electrical conductor path.

[0057] The sensor element 206 is realized, for example, in the form of a microcontroller as a sensor hub according to one exemplary embodiment in order to detect calibration and identification information of the pump motor or the sensor. In this case, the sensor element 206 can be read, for example, by the central control device of the heart assist system via a communication bus in the connection cable. As a result, the control device can be parameterized, for example, with motor data.

[0058] The sensor element 206 is designed, for example, to preprocess the sensor data of the sensor of the pump motor, for example, to aggregate, filter, or calibrate, or to convert the communication protocol of the sensor into a more robust communication protocol, or to be designed as a transceiver for adding artificial redundancy or checksum.

[0059] FIG. 6 shows a schematic diagram of the electronic device module 102 according to an exemplary embodiment. The electronic device module 102 substantially corresponds to the electronic device module described above with reference to FIG. 2, except that the connection section 210 has a plurality of arcuate contact grooves 600 arranged concentrically around the peripheral lines of the electronic device section 204, for example, to electrically contact the connection cable, for example, the individual wires of the connection cable. Each of the contact elements 208 has a conductive contact surface 602, and each of them lines one of the contact grooves 600.

[0060] The contact grooves 600 are used in particular to directly contact the connection cable to the ceramic. In this case, the strands of the connection cable make direct electrical contact with the contact grooves 600 located outside the ceramic. The thin-film substrate is connected to the contact grooves 600, for example, by a blind pin or contact pad in the center of the connection section 210 and by short connection lines. In order to prevent peeling of the mechanically stressed contact surface 602, an insulating ceramic ring is pushed onto the connection section 210, for example, for mechanical stabilization.

[0061] FIG. 7 shows a flowchart as a method 700 for generating an electronic device module according to an exemplary embodiment. In a first step 710, an electronic device section for accommodating at least one electronic device component and / or at least one conductive contact element is formed on a connection section, the connection section being formed to fluid-tightly connect the electronic device module to the motor housing. In a second step 720, the electronic device section may be coupled with the connection section to produce a hermetically sealed module housing.

[0062] According to an exemplary embodiment, the joining at step 720 is performed by sintering the connecting section onto the electronic device section. Alternatively, the joining is performed by bonding the connecting section and the electronic device section. Alternatively, the connecting element can be made of a metal, particularly a titanium film, and the joining step 720 can be performed by diffusion welding of the film-like connecting element to the electronic device element. The connecting element can also be designed as a metal surface coating of the electronic device element so that a hermetic joining to the motor housing becomes possible later, for example, by a laser soldering process.

[0063] According to another exemplary embodiment, the electronic device section is generated layer by layer as a ceramic component in step 710.

[0064] The hermetic module housing can be joined to the motor housing, for example, by welding an optional connecting element made of titanium. In another embodiment, the joining can be performed by reaction restraint of the module housing (for example, made of oxide ceramic) to the motor housing (for example, made of titanium). Alternatively, it is possible to join, for example, by adhesive restraint of the electronic device section to the motor housing, for example, with an artificial resin.

[0065] When an exemplary embodiment of the present invention includes an "and / or" relationship between a first feature and a second feature, this should be read to mean that an exemplary embodiment according to one embodiment includes both the first feature and the second feature, and according to another embodiment, includes either only the first feature or only the second feature.

[0066] In summary, the following features of the present invention should be particularly noted.

[0067] The present invention relates to an electronic device module (102) for a heart assist system, the heart assist system having a motor housing for accommodating a pump motor. The electronic device module (102) comprises an electronic device section (204) for accommodating at least one electronic device component (206) and / or at least one conductive contact element (208), and a connection section (202) designed as a joint between the motor housing (104) and the electronic device section (204) or as a separate component to be joined, the motor housing (104) and the electronic device section (204) being joined to each other or being joinable to each other via the connection section (202) so as to form a fluid-tight module housing (104) to be disposed within a blood vessel.

[0068] The present invention particularly relates to aspects specified in the following clauses. 1. An electronic device module (102) for a heart assist system (100), the heart assist system (100) having a motor housing (104) for accommodating a pump motor, the electronic device module (102) having the features of an electronic device section (204) for accommodating at least one electronic device component (206) and / or at least one conductive contact element (208), and the features of a connection section (202), the connection section being designed as a joint between the motor housing (104) and the electronic device section (204) or as a separate component to be joined, the motor housing (104) and the electronic device section (204) being joined to each other or being joinable to each other via the connection section (202) so as to form a fluid-tight module housing (104) to be disposed within a blood vessel, the electronic device module (102). 2. The electronic device module (102) according to aspect 1, wherein the connection section (202) is realized as a separate element, in particular a titanium element and / or a sintered element, and / or the electronic device section (204) is realized as a ceramic element and / or a composite layer of at least two layers (304). 3. The electronic device module (102) according to embodiment 2, wherein the layers (304) are alternately stacked in the longitudinal direction of the electronic device section (204). 4. The electronic device module (102) according to embodiment 1, wherein the connection section (202) is formed as a surface layer or a partial section of the electronic device section (204), and / or the electronic device module (102) is directly connectable to the motor housing (104) or is connected, in particular adhesively constrained. 5. The electronic device module (102) according to any one of the preceding embodiments, wherein the connection section (202) is welded or can be welded to the motor housing (104). 6. The electronic device module (102) according to any one of the preceding embodiments, wherein the connection section (202) is annular. 7. The electronic device module (102) according to any one of the preceding embodiments, wherein the connection section (202) and / or the electronic device section (204) is cylindrical. 8. The electronic device module (102) according to any one of the preceding embodiments, comprising an electronic device component (206) and / or a contact element (208), the contact element (208) being designed to enable conductive contact of the electronic device module (102) through the outside of the electronic device section (204), and / or being designed as a pin and / or a pad and / or a conductor path structure, and / or being at least partially embedded in the material of the electronic device section (204). 9. The electronic device module (102) according to any one of the preceding embodiments, wherein the electronic device section (204) has a recess (500) for accommodating at least one section of the pump motor. 10. The electronic device module (102) according to embodiments 8 and 9, wherein the contact element (208) extends into the recess (500) to enable electrical contact of the pump motor accommodated in the recess (500). 11. The electronic device module (102) according to aspect 8 or 10, wherein the electronic device section (204) has a sensor section (212) for accommodating at least one sensor element (206) and / or a connection section (210) for connecting a cable (106) to the electronic device module (102), and the contact element (208) is disposed or can be disposed on the sensor section (212) and / or the connection section (210). 12. The electronic device module (102) according to aspect 11, wherein the connection section (210) is disposed on the front side of the electronic device section (204) facing away from the connection section (202), and / or is connected or can be connected to a protective cap and / or a tension relief element and / or a bending protection element. 13. The electronic device module (102) according to aspect 11 or 12, wherein the connection section (210) is formed with a plurality of contact grooves (600) for electrically contacting the cable (106). 14. A heart assist system (100), characterized by a motor housing (104) for accommodating a pump motor, and characterized by an electronic device module (102) according to any one of the preceding aspects. 15. A method (700) for producing an electronic device module (102) for a heart assist system (100), wherein the heart assist system (100) has a motor housing (104) for accommodating a pump motor, and the method (700) includes a step (710) of forming an electronic device section (204) for accommodating at least one electronic device component (206) and / or at least one conductive contact element (208) on the connection section (202), the connection section (202) being formed for fluid-tightly connecting the electronic device module (102) and the motor housing (104).

Claims

1. 1. A cardiac assist system comprising: a longitudinally extending cylindrical housing including an outer surface having an outer diameter extending from a proximal end of the cylindrical housing to a distal end of the cylindrical housing, the cylindrical housing configured for insertion into an aorta or a heart chamber by a catheter; The cylindrical housing includes: a pump motor disposed within the cylindrical housing; and an electronics module having an electronics section and a coupling section housing at least one section of the pump motor, the coupling section having electrically conductive contact elements disposed therein for electrical contact with the pump motor; the contact elements are embedded in the body of the electronics section and guided to pads or conductor path structures on the outside of the body of the electronics section; The cardiac assist system, wherein the connection section includes an exterior surface that forms at least a portion of the exterior surface of the longitudinally extending cylindrical housing.

2. A cardiac assist system that is inserted into the aorta or into a heart chamber by a catheter. a longitudinally extending cylindrical structure configured as follows: The cylindrical structure is External surfaces exposed to the external environment, A pump motor disposed within the motor housing; and an electronics module located at a proximal end of a longitudinally extending cylindrical structure, the electronics module having an electronics section and a coupling section housing at least one section of the pump motor, the coupling section having conductive contact elements disposed therein for electrical contact of the pump motor; the contact elements are embedded in the body of the electronics section and guided to pads or conductor path structures on the outside of the body of the electronics section; The connector section forms a portion of the exterior surface.

3. 3. The cardiac assist system of claim 1 or 2, wherein the linking section comprises at least one of a titanium element, a titanium part, a sintered element, and a ceramic element.

4. The cardiac assist system according to any one of claims 1 to 3, characterized in that the electronics section includes ceramic elements.

5. The cardiac assist system of any one of claims 1 to 4, wherein the electronics section comprises at least two layers.

6. 6. The cardiac assist system of claim 5, wherein each of the at least two layers are stacked above or below one another longitudinally of the electronics section.

7. The cardiac assist system of any one of claims 1 to 6, wherein the electronics module is adhesively constrained to the motor housing.

8. 4. The method of claim 3, wherein the connecting section is welded to the motor housing.

8. A cardiac assist system as described in any one of claims 1 to 7.

9. Cardiac assist system according to any one of claims 1 to 8, characterized in that the electronics section comprises a sensor section for housing at least one sensor element.

10. The cardiac assist system of any one of claims 1 to 9, wherein the electronics module includes a connection section for connecting a cable to the electronics module, and the contact element is disposed on the connection section.

11. 11. The cardiac assist system of claim 10, wherein the connection section includes a plurality of contact grooves for electrically contacting the cables.

12. 12. The cardiac assist system of claim 10 or 11, characterized in that the connection section faces away from the coupling section, and the cylindrical housing includes at least one of a protective cap, a strain relief element, or a bend protection element configured to prevent damage to the electronics module.

13. 12. The cardiac assist system of claim 11, wherein the plurality of contact grooves are disposed along an outer edge of the electronics section.

14. 12. The system of claim 11, wherein the plurality of contact grooves are configured to contact individual wires of the cable.

15. 12. The cardiac assist system of claim 10 or 11, characterized in that the connection section faces away from the coupling section, and the cylindrical structure includes at least one of a protective cap, a strain relief element, or a bend protection element configured to prevent damage to the electronics module.

16. The cardiac assist system of any one of claims 1 to 15, wherein the electronics module comprises a continuous radial body.

17. 17. The cardiac assist system of claim 1, wherein the connection section extends annularly from the electronics section defining a recess configured to receive at least one section of the pump motor.

18. The cardiac assist system according to any one of claims 1 to 17, characterized in that the pump motor is in contact with the electronics module.

19. Cardiac assist system according to any one of claims 1 to 18, characterized in that the electronics module is connected in a fluid-tight manner to the motor housing.

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