Apparatus, magnet, and method of manufacture

Abstract

Described herein are concepts, systems, and techniques that enable a means to build robust high-field superconducting magnets using simple fabrication techniques, and modular components that scale well toward commercialization. Utilizing uninsulated high-temperature superconducting tapes (HTS) and enabling optimized coolant paths - the resulting magnet assembly is inherently structurally strong, which allows maximum utilization of the high magnetic fields available through HTS technology. In addition, the concepts described herein enable control of quench-induced current distribution within the tape stack and surrounding superstructure to safely dissipate quench energy while simultaneously obtaining acceptable magnet charging times. The end result is a structurally and thermally robust high-field magnet assembly that is passively protected against quench fault conditions.

Description

[Background technology]

[0001]

[0001] As known in the art, existing approaches for the fabrication of high-field superconducting magnetics include (1) low-temperature superconductor (LTS) cable-in-conduit conductor (CICC) designs, such as those used for ITER's toroidal field magnetics, and (2) high-temperature superconductor (HTS) designs based on HTS tapes wound directly into layer-wound coils or spiral-wound "pancake" coil assemblies. CICC-like approaches based on HTS conductors are being further pursued.

[0002] In the CICC approach, the conduit is electrically insulated from the winding pack. The coolant is constrained to flow inside the conduit. The shape of the winding and the external support shell dictates the shape of the current and coolant paths. For the example of the ITER toroidal field coils, the winding and the external support shell are arranged to have a D-shape. The winding and the external shell structure are primarily responsible for containing the Lorentz forces generated by the high field magnets (i.e., the winding and the shell must support the Lorentz loads). In the case of a magnet quench event (which must be detected reliably and with sufficient lead time to reduce damage by the external protection system), the stored magnetic energy is dumped into an external resistor at the magnet terminal. Thus, the current in the CICC avoids the usual areas in the superconductor and instead flows into the copper stabilizer.

[0003]

[0003] The need to have copper stabilizers and coolant channels in the conduit combined with the need for high voltage electrical insulation complicates magnet design because these elements are structurally weak, yet they occupy a significant amount of volume within the windings. In addition, the fabrication process for CICC-based magnetic devices is long and laborious, involving many steps including stranding / tape, wrapping these components together, and bending and inserting the CICC into the windings. Summary of the Invention [Means for solving the problem]

[0004]

[0004] This Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key or essential features or combinations of the claimed subject matter, nor is this Summary intended to be used to limit the scope of the claimed subject matter.

[0005]

[0005] Described herein are concepts, systems, structures, and techniques that provide a means for building robust high field superconducting magnets using fabrication techniques that are relatively simple compared to prior art fabrication techniques, and that enable modular components that scale well towards commercialization. Utilizing non-insulated high temperature superconducting tape (HTS) allows for enhanced (and ideally optimized) coolant paths - the resulting magnet assembly is inherently structurally strong. This allows for a high degree of utilization (and ideally maximum utilization) of the high magnetic fields available through HTS tape technology. Additionally, the concepts described herein provide a means for safely dissipating quench energy while at the same time obtaining acceptable magnet charging times. The present invention provides a method for controlling the quench induced current distribution in the magnet assembly, the tape stack, and the surrounding superstructure. The end result is a structurally and thermally robust high field magnet assembly that is passively protected against quench fault conditions.

[0006] In embodiments, the concepts described may facilitate commercialization of high field magnets for use in fusion power plants (e.g., miniature fusion power plants) and in high energy physics applications. However, after reading the description provided herein, one of ordinary skill in the art will readily appreciate that the concepts disclosed are generally applicable for use in a wide range of other applications in which high field magnets may be used (e.g., a wide range of industrial uses). Such applications include, but are not limited to, applications in the medical and life science fields (e.g., magnetic resonance imaging and spectroscopy); applications in the chemical, biochemical, and biological fields (e.g., nuclear magnetic resonance (NMR), NMR spectroscopy, electron paramagnetic resonance (EPR), and Fourier transform ion cyclotron resonance (FT-ICR)); applications in particle accelerators and detectors (e.g., for use in health care applications, such as in equipment for radiation therapy); applications in devices for the generation and control of high temperature hydrogen plasmas; applications in the transportation field; applications in the power generation and conversion field; applications in heavy industry; applications in weapons and defense; and applications in the high energy particle physics field.

[0007]

[0007] According to one aspect of the concepts described herein, a high field magnet assembly includes a plurality of conductive plates, each having a spiral groove disposed therein, the plurality of conductive plates being arranged (e.g., stacked) to form an integral pancake assembly having a first outermost surface and a second oppositely oriented outermost surface. The high field magnet assembly further includes a non-insulated (NI) HTS tape stack disposed within a channel formed by the grooves of the first and second conductive plates. In an embodiment, the HTS stack may include a co-wind material, which may comprise one or a combination of a non-insulating material, an insulating material, or a semi-conductive material. In an embodiment, the channel may be suitably sized to contain two or more stacks, and optionally a separate structure capable of mechanically engaging the plates is disposed between the stacks. The channel has a first opening on a first outermost surface of the pancake assembly and a second opening on a second opposite outermost surface of the pancake assembly. The NI HTS tape (and co-wound stack, when included) is continuously disposed within the channel such that the NI HTS tape (and co-wound stack) forms a path from the first outermost surface of the pancake assembly to the second opposite outermost surface of the pancake assembly.

[0008] In an embodiment, a pair of spiral grooved plates (eg, an upper plate and a lower plate) are stacked to form an integral double pancake assembly.

[0009] In an embodiment, two identical spiral grooved plates are assembled back to back and insulating material is inserted or otherwise disposed between the plates. One or more HTS tape stacks with co-wraps are disposed into the grooves aligning the inward spiral on the top plate, the spiral to the bottom plate, and the outward spiral on the bottom plate.

[0010] In embodiments, a high field magnet assembly can include co-wound materials and surface coatings selected to provide desired (and ideally optimized) magnet quench behavior.

[0011] In an embodiment, the high field magnet assembly is prepared from a composite of base materials selected to provide the desired (and ideally optimized) magnet quench behavior. The plate may include a spiral grooved plate and a surface coating (electrically insulating, conductive, and / or semi-conductive).

[0012] In embodiments, a bladder element may also be included within the tape stack to preload the stack prior to soldering or to eliminate the need for soldering.

[0013] In an embodiment, the bladder element may be filled with a material that is liquid during assembly but solid at magnet operating temperatures. The heat of fusion associated with this material can act as a large thermal reservoir to protect the HTS during a quench event.

[0014]

[0014] In an embodiment, a copper spiral lid may be soldered or otherwise bonded or affixed to the tape bundle to help facilitate heat removal to a coolant channel plate stacked on top of the spiral.

[0015] In embodiments, grooves may be cut into the copper spiral lid and the upper surface of the base plate along and / or across the path of the spiral winding to facilitate coolant passage.

[0016]

[0016] In an embodiment, a copper interconnect between the inward spiral grooved pancake and the outward spiral grooved pancake may be used. This copper interconnect may be used on both the inside diameter (ID) and the outside diameter (OD) of each spiral groove winding plate. In this case, the magnet assembly may be constructed by simply stacking a series of spiral grooved HTS loaded plates on one another, alternating with coolant channel plates, and / or by simply stacking a series of spiral grooved HTS loaded plates on one another, using coolant channel grooves cut into the surface of the plates as described above.

[0017] In an embodiment, the HTS and co-wound stack are embedded in a matrix of copper or other highly conductive material where it enters and exits the spiral grooved winding plate and where the stack transitions from one spiral grooved winding plate to another. This helps protect against overheating and damage to the HTS during magnet charging and magnet quench conditions.

[0018] In another aspect of the concepts described herein, a stacked plate magnet assembly includes a first plate, a second plate disposed above the first plate, an electrically insulating material disposed between the first plate and the second plate, and one or more HTS tape stacks, each of which may include co-wound material (conductive, electrically insulating, and / or semi-conductive). The first plate is provided with at least one spiral-shaped groove disposed therein. The second plate is further provided with at least one spiral groove disposed therein such that when a first surface of the first plate is disposed above a first surface of the second plate, the groove forms a channel having an inward spiral shape on the first plate, a spiral to the second (or lower) plate, and an outward spiral on the lower plate. An electrically insulating material is disposed between the first plate and the second plate. The HTS tape stack with co-windings is disposed within the channel such that this allows for windings having a spiral shape. It should be appreciated that while the windings will generally be of a spiral shape, the magnet core may be provided having a D-shape, a solenoid shape, a circular shape, or any other shape suitable for the application in which the magnet core will be used. Similarly, the helical channel allows the HTS tape stack to pass from a first plate to a second plate. The magnets may be deformed into the shape required to facilitate a continuous channel that allows After reading the description provided herein, one of ordinary skill in the art will know how to select the appropriate winding and magnet shape for the needs of a particular application.

[0019] In one embodiment, the grooves in the first and second plates are substantially identical. The first and second plates may further have substantially identical spiral shaped grooves and may be assembled back to back.

[0020] The channels form an inward spiral on the top plate, a spiral to the bottom plate, and an outward spiral on the bottom plate. An HTS tape stack, which may include co-wound materials, may be inserted into the grooved channels. The co-wound materials and surface coatings may be selected to optimize magnet quench behavior.

[0021] In embodiments, a bladder element may be included as a co-wound material within the HTS tape stack. The bladder element may be configured within the HTS tape stack to preload the HTS tape stack prior to soldering. In embodiments, the bladder element may even be configured within the HTS tape stack to eliminate the need for soldering. The bladder element may even be configured to pre-compress the HTS tape stack against the load-bearing sidewall of the at least one spiral groove.

[0022] In an embodiment, the bladder element may be filled with a material that is liquid during assembly but solid at magnet operating temperatures. One such material includes, but is not limited to, gallium. The heat of fusion associated with this material can act as a large thermal reservoir to limit the temperature rise of the HTS during a quench event.

[0023]

[0023] In an embodiment, the number, size, and type of HTS tapes in the stack, along with optional co-wound materials, may be varied by location along the spiral path, if desired, to save cost and / or to optimize magnet quench response, etc.

[0024]

[0024] The magnet may further comprise at least one coolant channel. In embodiments, the at least one coolant channel may be provided in one or both of the first and second plates. In embodiments, the coolant channel may comprise one or more coolant paths extending along the HTS tape stack. In other embodiments, the at least one coolant channel may comprise one or more cooling channel plates interleaved with one or both of the first and second plates or interleaved within a stack of such plates that may comprise the magnet assembly. In such embodiments, the coolant channel path need not extend along the HTS tape stack. In some embodiments, the coolant channel is formed by cutting a groove into the surface of the plate, including the copper cap that is disposed above the HTS tape stack. Such coolant channel grooves need not extend along the HTS tape stack.

[0025]

[0025] The magnet may further comprise a conductive plate disposed between the first and second plates, or interleaved within a stack of such plates that may comprise the magnet assembly. The conductive plate may be prepared from any conductive material, including but not limited to copper. The conductive plate may further be prepared from a thermally conductive material and may be configured to provide conductive cooling.

[0026] Additionally, the magnet may include one or more electrical interconnects between the first plate and the second plate, such one or more electrical interconnects being adapted to provide electrical connection between the first plate and the second plate during magnet charging. The winding plates are configured to establish and maintain high electrical resistance in some areas to minimize the flow of bypass current between each of the winding plates.

[0027] In another aspect, a method for constructing a high field magnet includes assembling a series of HTS-loaded spiral grooved plates stacked between coolant channel plates and forming one or more inter-pancake electrical connections, each of the one or more inter-pancake connections having low electrical resistance characteristics. Forming the one or more inter-pancake connections can include automatically forming the one or more inter-pancake connections.

[0028] The method may further include the step of preloading the HTS tape stack in a spiral grooved plate to eliminate the need for soldering.

[0029] In another aspect of the concepts described herein, a magnet assembly includes a first conductive plate having a first surface with a plurality of grooves disposed therein, the grooves being defined by one or more walls, at least two of the plurality of grooves having different widths, and a non-insulated (NI) high temperature superconductor (HTS) tape stack having a predetermined length such that the NI HTS tape stack can be disposed within the plurality of grooves such that the NI HTS tape stack forms a continuous path between an outermost groove in the first conductive plate and an innermost groove of the first conductive plate. In an embodiment, an HTS tape is configured within each groove such that in response to an applied force, the HTS tape stack distributes the force into the first and second conductive plates.

[0030]

[0030] In an embodiment, the magnet assembly further includes a second conductive plate disposed above the first plate such that when the first surface of the first plate is disposed above the first surface of the second plate, the groove forms a channel having an opening at a first end of the channel and the HTS tape forms a continuous path between the first conductive plate and the second conductive plate.

[0031] In an embodiment, the HTS tape stack is disposed in one of a plurality of grooves of varying width and is wound on itself to occupy the width of the groove.

[0032]

[0032] In an embodiment, the walls defining the groove in the first conductive plate are provided with a variable wall thickness such that the thickness of a first portion of the wall is different from the thickness of a second portion of the same wall.

[0033] In an embodiment, the walls defining the groove in the first conductive plate are provided having different wall thicknesses.

[0034]

[0034] In an embodiment, the thickness of a first portion of a first wall in a first radial direction as measured from the center of the first conductive plate is different from the thickness of a first portion of a second, different wall along the same first radial direction.

[0035] In an embodiment, the first and second conductive plates have substantially identical spiral-shaped grooves.

[0036] In an embodiment, the NI HTS tape stack is composed of two or more NI HTS tape stacks joined by low resistance electrical connections.

[0037] In an embodiment, the material comprising the NI HTS tape stack in the first and second plates is continuous across the plates.

[0038]

[0038] In an embodiment, the NI HTS tape stack further comprises a co-wound material disposed within the grooves such that the NI HTS tape and co-wound stack follow a path between a first outermost groove of the first conductive plate and an innermost groove of the first conductive plate, and the HTS tape and co-wound stack are configured within the grooves such that in response to an applied force, the HTS tape and co-wound stack distributes force into the first and second conductive plates.

[0039] In embodiments, the co-wound material is provided as one or more of an electrically conductive material, an electrically insulating material, and / or a semi-conductive material.

[0040] In embodiments, the co-wound materials are selected to optimize magnet quench behavior, or magnet charging behavior, or both.

[0041]

[0041] In an embodiment, the HTS tape and co-wound stack pass between the plates where they are stacked; the HTS tape and co-wound stack enter and exit the magnet assembly; and the HTS tape and co-wound stack are embedded within a matrix of high electrical conductivity material at the points where electrical interconnects are formed between the windings.

[0042] In an embodiment, the co-wound material varies in either composition or thickness along the length of the NI HTS tape stack.

[0043] In an embodiment, an electrically insulating material is placed in selected areas between the stacked plates.

[0044] In an embodiment, an NI HTS tape stack comprises one or more HTS tapes, and the number, size, and type of HTS tapes in the NI HTS tape stack vary along the length of the NI HTS tape stack.

[0045]

[0045] In an embodiment, the groove defines an inward spiral on the first conductive plate, the inward spiral having a first end and a second end, the first electrical plate has a spiral opening formed therein, the spiral opening having a first end and a second end, the first end of the spiral opening being coupled to the second end of the inward spiral, and the second end of the spiral opening leading to the second conductive plate being coupled to the first end of an outward spiral formed in the second conductive plate.

[0046] In an embodiment, a bladder element is included within the HTS tape stack. In an embodiment, the bladder element is configured to pre-compress the HTS tape stack against the load-bearing sidewall of the at least one spiral groove. In an embodiment, the bladder element contains a material that is liquid or gaseous during magnet assembly and is solid, liquid, or gaseous or expelled during magnet operation. In an embodiment, the bladder element contains a material that exhibits a phase change from solid to liquid and / or liquid to gas during magnet operation.

[0047] In an embodiment, the first conductive plate has at least one coolant channel disposed therein. In an embodiment, the coolant channel comprises one or more coolant paths disposed along the HTS tape stack. In an embodiment, the at least one coolant channel is interleaved with one or both of the first plate and the second conductive plate. In an embodiment, the at least one coolant channel includes one or more coolant paths disposed along a path different from the path of the HTS tape stack.

[0048] In an embodiment, a conductive plate may be interposed between the first conductive plate and the second conductive plate.

[0049] In embodiments, a high electrical conductivity coating may be disposed on selected locations of at least one of the first and second conductive plates.

[0050] In an embodiment, the conductive plate comprises, in whole or in part, copper.

[0051] Some embodiments relate to an apparatus that includes a conductive plate having a groove and a high temperature superconductor (HTS) tape stack disposed in the groove, the HTS tape stack having a spiral shape.

[0052]

[0052] The groove may have a spiral shape.

[0053] The conductive plate may comprise a metal or a metal alloy.

[0054]

[0054] The apparatus may further comprise a coolant channel.

[0055] The coolant channels may be disposed within the grooves.

[0056] The coolant channels may be disposed outside the grooves.

[0057] The HTS tape stack can be a non-insulating HTS tape stack.

[0058]

[0058] The HTS tape stack may include multiple turns, with the conductive plate providing electrical connections between each turn of the multiple turns.

[0059]

[0059] The apparatus may further include a shim or bladder within the groove.

[0060]

[0060] The conductive plate may be a first conductive plate, the groove may be a first groove, and the HTS tape stack may be a first HTS tape stack, and the device may further include a second conductive plate having a second groove and a second HTS tape stack disposed in the second groove, the second HTS tape stack having a spiral shape, and the first HTS tape stack is electrically coupled to the second HTS tape stack.

[0061] The first conductive plate may be electrically insulated from the second conductive plate.

[0062]

[0062] The first and / or second conductive plates have one or more alignment structures for aligning the first and second conductive plates when the first and second conductive plates are assembled together.

[0063] The apparatus may further include a conductive connection between the first HTS tape stack and the second HTS tape stack.

[0064] The conductive joint is made of a high temperature superconductor or a material that is It may include metals that are not superconductors.

[0065]

[0065] The conductive connections may include copper.

[0066]

[0066] The conductive connection can be formed between the innermost turns of the first and second HTS tape stacks or between the outermost turns of the first and second HTS tape stacks.

[0067]

[0067] The first HTS tape stack and the second HTS tape stack can be the same HTS tape stack.

[0068]

[0068] The transition between the first and second HTS tape stacks can be formed by a spiral portion of the same HTS tape stack.

[0069]

[0069] The first groove may include at least first and second turns, the first turn having a first width and the second turn having a second width, the second width being greater than the first width.

[0070]

[0070] The second turn of the groove may include multiple turns of the HTS tape stack.

[0071]

[0071] The device may include a magnet.

[0072] The HTS tape stack may include rare earth oxides.

[0073] The HTS tape stack may include rare earth barium copper oxide.

[0074] The apparatus may further include a conductive terminal block electrically coupled to the HTS tape stack.

[0075] Some embodiments relate to a method of fabrication that includes forming a conductive plate having a groove and disposing a high temperature superconductor (HTS) tape stack in a spiral configuration into the groove.

[0076] The foregoing and other objects, features, and advantages will become apparent from the following more particular description of the embodiments, as illustrated in the accompanying drawings, in which like reference characters refer to the same parts throughout the different views. The drawings are not necessarily to scale, emphasis instead being placed upon illustrating the principles of the embodiments. [Brief description of the drawings]

[0077] [Figure 1]

[0077] FIG. 1C is an isometric view of a portion of a spiral grooved stacked plate double pancake magnet assembly, which may be the same as or similar to the spiral grooved stacked plate double pancake magnet assembly shown in FIG. 1C. [Figure 1A]

[0078] FIG. 1D is an isometric view of a portion of a spiral grooved stacked plate double pancake magnet assembly, which may be the same as or similar to the spiral grooved stacked plate double pancake magnet assembly shown in FIG. 1C. [Figure 1B]

[0079] FIG. 1D is an isometric view of a portion of a spiral grooved stacked plate double pancake magnet assembly, which may be the same as or similar to the spiral grooved stacked plate double pancake magnet assembly shown in FIG. 1C. [Figure 1C]

[0080] FIG. 13 is an isometric view of a double pancake magnet assembly of stacked plates with spiral grooves. [Diagram 2]

[0081] 1A-1C are a series of cross-sectional views of a spiral grooved plate showing options for coolant channels running along the HTS tape. [Figure 2A] 1A-1C are a series of cross-sectional views of a spiral grooved plate showing options for coolant channels running along the HTS tape. [Diagram 3]

[0082] FIG. 2 is a cross-sectional view of two plates with spiral grooves formed therein, stacked against a shared coolant channel plate or a conduction cooled plate. [Figure 3A]

[0083] FIG. 1 is a cross-sectional view of two plates with spiral grooves formed therein, stacked against a shared coolant channel plate or a conduction cooled plate, with copper interconnects between the pancakes made in the area of ​​the two plates. [Figure 4]

[0084] FIG. 2 is a cross-sectional view of a magnet having a hydraulic bladder. [Diagram 5]

[0085] FIG. 13 is a series of cross-sectional views of a magnet illustrating the selection of materials, coatings, and insulation in the co-wound tape stack and spiral grooves that can be used to control the heat application area of ​​the magnet quench. [Figure 5A] FIG. 13 is a series of cross-sectional views of a magnet illustrating the selection of materials, coatings, and insulation in the co-wound tape stack and spiral grooves that can be used to control the heat application area of ​​the magnet quench. [Figure 6]

[0086] FIG. 6B is a cross-sectional view of the spiral grooved magnet plate assembly taken in a direction across line 6-6 of the spiral grooved plate shown in FIG. 6A. [Figure 6A]

[0087] FIG. 2 is a top view of a first spiral grooved plate. [Figure 6B]

[0088] FIG. 2 is a top view of a channel plate having insulating radial coolant channels disposed therein. [Figure 6C]

[0089] FIG. 13 is a top view of a second spiral grooved plate. [Figure 7]

[0090] FIG. 13 is a top view of a double pancake magnet assembly of stacked plates with variable width spiral grooves. [Figure 7A]

[0091] FIG. 8 is a cross-sectional view of the variable width spiral grooved stacked plate double pancake magnet assembly of FIG. 7 taken across line AA of FIG. 7. [Figure 7B]

[0092] FIG. 8 is a cross-sectional view of the variable width spiral grooved stacked plate double pancake magnet assembly of FIG. 7 taken across line BB of FIG. 7. [Figure 7C]

[0093] FIG. 8 is a cross-sectional view of the variable width spiral grooved stacked plate double pancake magnet assembly of FIG. 7 taken across line CC in FIG. 7. [Figure 7D]

[0094] FIG. 8 is a perspective view of a portion of a variable width spiral grooved stacked plate double pancake magnet assembly 7 taken across line AA in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0078]

[0095] Described herein are concepts and techniques for making high field magnets possible. Described herein are structures and techniques for the design and construction of high field magnets with relatively compact size and shape. The described concepts, structures, and techniques provide a means for building robust high field superconducting magnets using fabrication techniques that are relatively simple compared to prior art high field magnet fabrication techniques. Furthermore, the described concepts, structures, and techniques can utilize modular components that scale well towards commercialization. The described high field magnet assemblies can utilize spiral grooved stacked plates and non-insulated high temperature superconducting (HTS) tape. The non-insulated tape allows current to flow from the turns to the turns of the tape outside the superconductor, and there can be, but need not be, insulating material. Such an approach can result in an inherently structurally strong magnet assembly, which allows for high (and ideally maximum) utilization of the high magnetic fields available through HTS technology. Furthermore, the use of stacked plates with spiral grooves and non-insulating HTS tape stacks (or HTS tapes and co-wound stacks with conductive, non-conductive, and / or semi-conductive materials) disposed within the spiral grooves can allow for the inclusion of coolant paths, which in some cases can be optimized coolant paths.

[0079]

[0096] The HTS tape includes HTS materials. As used herein, the phrase "HTS materials" or "HTS superconductors" refers to superconducting materials that have a critical temperature above 30K in their own magnetic field. Examples of HTS superconductors include, but are not limited to, rare earth oxides, such as rare earth barium copper oxide (REBCO).

[0080]

[0097] A pancake assembly is provided in which the HTS is self-wound. The HTS tapes themselves (including optional co-wound) in conjunction with the spiral grooved plate provide the mechanical strength required to generate a high magnetic field. In an embodiment, the spiral is advantageously of course in a circular geometry. As a result of the HTS tapes themselves providing the requisite mechanical strength, such coils are easy to build and mechanically strong. For example, an 8 Tesla double pancake non-insulated (NI) HTS tape coil was designed, built, and successfully operated in less than six months. In some embodiments, the NI HTS tapes (and the co-wound stack when used) form a continuous path from a first outermost surface of the pancake assembly to a second opposite outermost surface of the pancake assembly. However, it should be appreciated that in some embodiments, the path of one material may be interrupted and not continuous. Thus, it should be appreciated that while the grooved pathways may be more or less continuous, the material disposed within the grooved pathways may not be continuous.

[0081]

[0098] NI HTS pancakes are of particular interest because they have unique current shunting characteristics / phenomenon during magnet quench. Specifically, because the HTS tape (or tape stack) is not insulated or is only partially insulated, Joule heating can be distributed more or less uniformly throughout the winding. It is desirable to optimize and take full advantage of this behavior by devising a robust, passively protected magnet design that can operate at high energy densities. The spiral grooved plate assembly configuration described herein can control the distributed quench drive currents within the coil structure, reducing (and ideally minimizing) the magnitude and duration of the current shunting currents and, therefore, the Joule heating and temperature rise of the HTS tape stack itself. Furthermore, the current is electromagnetically coupled to the spiral grooved plate and other surrounding structures, which, by careful selection of the magnet design, can further lead to uniform current distribution and reduced temperature rise due to Joule heating because the magnetic field energy can be dissipated in a much larger volume of material compared to prior art techniques.

[0082]

[0099] Additionally, the described concepts, structures, and techniques enable control of quench-induced current distribution within the HTS tape stack and surrounding superstructure to safely dissipate quench energy while simultaneously obtaining acceptable magnet charging times. The end result is a structurally and thermally robust high-field magnet assembly that is passively protected against quench fault conditions.

[0083]

[0100] Fusion power plants (e.g., small fusion power plants) and fusion research experiments (e.g., Although references are sometimes made herein to the use of such high field magnet assemblies as to, for example, SPARC, such references are not intended to be, and should not be construed as, limiting. High field magnet assemblies enabled by the concepts described herein have numerous applications in the areas of high energy physics, medical and life sciences, chemistry, biochemistry, and biology, particle accelerators and detectors, devices for the generation and control of high temperature hydrogen plasmas, transportation, power generation and conversion, heavy industry, weapons and defense, and the like. It is envisioned that the present invention will find use in a wide variety of applications, including but not limited to applications in the field of high energy particle physics.

[0101] For example, in the medical and life science fields, the concepts described herein High field magnets enabled by the concepts described herein may find use in magnetic resonance imaging (MRI) and spectroscopy. In the chemical, biochemical, and biological fields, high field magnets enabled by the concepts described herein may find use in nuclear magnetic resonance (NMR), NMR spectroscopy, electron paramagnetic resonance (EPR), and Fourier transform ion cyclotron resonance (FT-ICR). In the realm of particle accelerators and detectors, high field magnets enabled by the concepts described herein may find use in health care applications, such as in equipment for radiation therapy and in charged particle beam transmission (e.g., from accelerator to target / patient). In the realm of transportation, high field magnets enabled by the concepts described herein may find use in high power density motors, generators, and MHD propulsion (e.g., electric aircraft, magnetic levitation trains, hyperloop concepts, rail engines and transformers, marine propulsion and generators, and vehicles). In the area of ​​utility and power applications, high field magnets enabled by the concepts described herein may find use in electromechanical machinery, power generation and power conversion systems (e.g., wind turbines, transformers, synchronous modifiers, utility generators such as those producing up to or greater than 300 MW, superconducting energy storage, and MHD energy generation). High field magnets enabled by the concepts described herein may find use in the area of ​​heavy industrial applications (e.g., large industrial motors, magnetic separation, disposable mixing systems, induction heaters). In the area of ​​weapons and defense applications, high field magnets enabled by the concepts described herein may find use in propulsion motors and generators, electromagnetic pulse (EMP) generation, directed energy weapon power supplies, and railguns / coilguns.

[0084]

[0102] One or more HTS tapes disposed within the spiral groove or channel. References are sometimes made herein to HTS tape stacks or HTS stacks and co-wounds. As used herein, it should be appreciated that the term "HTS tape stack" includes "stacks" having multiple layers of HTS tape or only a single layer of HTS tape and including one or more tapes made from non-HTS materials, sometimes referred to herein as "co-wound" tapes. The number, size, and type of tape layers to use in any particular HTS tape stack are selected by the needs of the particular application. For example, in applications that only require low current capability and can accept high inductance characteristics, a single layer tape stack may be used. However, in high current / low inductance applications (e.g., miniature fusion applications), HTS tape stacks prepared from a single layer or multiple individual layers to many individual layers (e.g., in the range of 10-1000 layers or more) of HTS tape may be used. In cases where multiple HTS tape layers are included within the HTS tape stack, the multiple layers of HTS tape are bonded essentially in parallel to enable a structure having increased current carrying properties relative to a single HTS tape layer.

[0085]

[0103] Similar elements are given similar reference designations throughout the several views. 1-1C, a series of views illustrates the use of a spiral grooved stacked plate concept used to form a so-called one-piece "double pancake assembly" 100 (FIG. 1A). It should be appreciated that details of the current lead connections have been omitted for greater clarity in the description and drawings.

[0086]

[0104] In overall overview, Figs. 1-1C show a one-piece so-called "double pancake" Illustrates an example of spiral grooved plates that can be stacked to form assembly 100. In this illustration, two (optionally identical) spiral grooved plates (FIG. 1) are assembled back-to-back and insulating material is inserted or otherwise disposed between them (FIG. 1A). An HTS tape stack, which may include a co-wound material, is inserted into the grooved channel (FIG. 1B) that may arrange an inward spiral on the top plate, a spiral to the bottom plate, and an outward spiral on the bottom plate. In some embodiments, the HTS tape stack is wound continuously (i.e., without interruptions or segmentation) from the top surface to the bottom surface of the pancake assembly. In some embodiments, the NI HTS tape (and the co-wound stack, when used) may be segmented or otherwise have interruptions provided therein (e.g., the path of one material may be interrupted and not continuous). It should thus be appreciated that while the grooved pathway may be described as more or less continuous (even though the cross-sectional shape may vary throughout the length of the grooved pathway), the material packed or otherwise disposed within the grooved pathway may be continuous or may be provided in portions (e.g., segmented). In some embodiments, two or more HTS tape stacks may be disposed within the pathway with material disposed between the stacks, which may mechanically engage the plate, such as by a spiral groove, either separately or in association with the tape stack. In some embodiments, some or all of the co-wound material may be disposed to mechanically engage the plate, such as by a spiral groove, either separately or in association with the tape stack.

[0087]

[0105] The co-wound materials and surface coatings are desired (and ideally optimized) A bladder element may be selected to provide a magnet quench behavior (such as a magnet quenching behavior that is consistent with the magnet quenching behavior of the spiral lid) that is insulated from the tape stack. In embodiments, a bladder element may also be included within the tape stack to preload the stack prior to soldering or to eliminate the need for soldering. A copper (or other high thermal conductivity material) spiral lid (FIG. 1C) may be soldered or otherwise bonded or affixed to the tape stack to help facilitate heat removal to a coolant channel plate stacked on top of the spiral (see FIGS. 3 and 6, which will be described in detail below). Another embodiment uses a copper interconnect between the inward spiral grooved pancake and the outward spiral grooved pancake (see FIG. 3). This copper interconnect may be used on both the inside diameter (ID) and outside diameter (OD) of each spiral grooved winding plate. In this case, the magnet assembly may be constructed by simply stacking a series of spiral grooved HTS packed plates on top of one another, alternating with coolant channel plates (e.g., similar to that shown and described below in connection with FIG. 6, but with the external connections between the double pancakes eliminated). Depending on the application, the coolant channel plates may be replaced by conduction cooled plates or eliminated altogether.

[0088]

[0106] An illustrative stacked plate double pancake magnet assembly 100 (FIG. 1A) is The magnet includes a first plate 105 (FIG. 1) having first and second opposing surfaces 105a, 105b and a groove 125. The first plate 105 may include or be formed of any conductive material, including, for example, a metal or alloy. Such materials include, but are not limited to, one or more of nickel-based superalloys such as Inconel 718 and Hastelloy C276, austenitic stainless steels, and dispersion strengthened copper alloys. Factors influencing material selection include, but are not limited to, mechanical strength, electrical conductivity, thermal conductivity, and coefficient of thermal expansion. Composites of different materials may be used. Materials may be selected to optimize quench energy deposition uniformity, structural integrity under load and under exotic conditions, and to minimize cost. Additive manufacturing techniques may be readily used to fabricate the plate geometries used from which magnets may be constructed.

[0089]

[0107] A groove 125 is provided which initially forms a spiral as it enters the plate. shaped, and then in the plate, a spiral shape. In this illustrative embodiment, the spiral is provided as a curvilinear spiral (i.e., a substantially continuous and radially widening or tightening curvilinear winding, either about a central point on a flat plane or about an axis to form a cylinder). It should of course be appreciated that in other embodiments, a spiral-like shape may be used (i.e., a generally widening or tightening path winding, either about a central point on a flat plane or about an axis). As used herein, the term "spiral shape" includes "spiral-like" shapes. For example, in some embodiments, it may be desirable or necessary to utilize a rectangular spiral-like shape. In still other embodiments, it may be desirable or necessary to utilize a triangular spiral-like shape. In still other embodiments, it may be desirable or necessary to utilize an oval spiral-like shape. Other spiral-like shapes, including geometrically irregular shapes, may also be used. After reading the disclosure provided herein, one skilled in the art will know how to select a particular spiral or spiral-like geometry / shape for use in a particular application. It should further be appreciated that the spiral or spiral-like grooves may be provided with a constant pitch (i.e., the same pitch) or may be provided with a variable pitch. A variable pitch can provide significant design flexibility, for example, to provide space between turns to accommodate coolant passages between pancake plates and / or to increase pancake strength in certain areas while reducing overall magnet weight and / or allowing for more uniform quench energy deposition.

[0090]

[0108] The first plate 105, in this illustrative embodiment, is Optional interface apertures 120a-N are included to aid in fastening to a plate (e.g., second plate 110 of FIG. 1A). In some embodiments, fastening may be performed by conventional fasteners as are commonly known. In embodiments, other fastening techniques may be used to join or otherwise fasten two or more plates. Such techniques include, but are not limited to, welding, soldering, and brazing. Features may be added to the plates to accommodate fastening techniques used in a commercial production environment, including, but not limited to, weld lips, flanges, weld relief, threaded holes, rivets, and special fastening points.

[0091]

[0109] As will become apparent from the description herein below, groove 125 (FIG. 1) is configured in this embodiment to receive a high temperature superconductor (HTS) tape stack (e.g., HTS tape stack 150 of FIG. 1C). The HTS tape stack may be entirely composed of HTS tapes or may include a "co-wound" tape, i.e., a tape entirely made of a non-HTS material, that is separately interleaved and / or stacked on top of the stack of HTS tapes. The co-wound material may be conductive, insulating, or semiconductive. In some embodiments, the electrical properties of the co-wound material may be selected to be advantageous for optimizing the quench behavior. In other embodiments, two or more stacks may be disposed into a groove, with a separating material disposed between. In this case, the dimensions of the groove may include a secondary groove for engaging the separating material, with appropriate modification. The co-wound tape may further include a "bladder" as further described below. Some factors to consider in selecting the characteristics of the HTS tape include, but are not limited to, the operating current of the individual tapes, the total current desired in the tape stack, the strain characteristics of the tapes, and other mechanical properties. In some applications, it may be desirable to vary the number, size, and / or type of HTS tapes in a stack at different locations along the path for any of a variety of reasons, such as to save cost, size, and / or weight. The current shunting attributes of the edge HTS tapes take this possibility into account. For example, in areas of low magnetic field strength, the number of HTS tapes in the stack can be reduced, taking advantage of the fact that the operating currents in the remaining HTS tapes can be increased. Factors that influence the selection of the HTS tape width include, but are not limited to, Lorentz loads on the tape stack and reaction loads on the sidewalls of the grooved channels. Thus, the dimensions of the spiral grooves in the plate are selected to accommodate the dimensions of the HTS tape stack, which may vary in location.

[0092]

[0110] In an embodiment, the HTS tape stack includes a spiral groove 130 (i.e. 3, is fed or otherwise disposed into the end of a so-called inwardly directed spiral groove 130).

[0093]

[0111] In the embodiment shown here, the alignment pins 115a-N are It is used to connect to an interface (eg, plate 110 in FIG. 1A) and maintain orientation.

[0094]

[0112] Referring briefly to FIG. 1A, a stacked plate double pancake magnet assembly 10 The second plate 110 of FIG. 0 is disposed above the first plate 105 such that the grooves 125 provided in each of the respective plates 105, 110 are aligned.

[0095]

[0113] The mating faces of the two spiral grooved plates are such that plates 105 and 110 are H The TS tape stacks may be partially electrically insulated from one another by the application of an insulating coating and / or insulating plate 140 (further depicted as 440 in FIG. 4) so ​​that they are electrically connected only across the contact area, including where the TS tape stack transitions from one plate to the other, 125.

[0096]

[0114] The second plate 110 has an inwardly directed channel having a generally spiral shape. Formed or otherwise provided is a groove 135 defining a spiral 136. As alluded to above in connection with groove 125, groove 135 is shown here having a generally curved spiral shape, although it should be appreciated that other spiral shapes may also be used, including but not limited to square, rectangular, triangular, or oval shapes. In the embodiment shown here, one end of groove 135 connects to a helical channel 137 that passes between plates 105 and 110.

[0097]

[0115] When the grooves in each plate are paired together, they form an inwardly directed Channels such as the spiral channel 136 can be formed. The inward spiral channel 136 receives the HTS tape and the co-wound laminate (e.g., the HTS tape and the co-wound laminate 150 of FIG. 1C) that is fed into the helical channel 137. The helical channel 137 is coupled to the helical groove 125 of the first plate 105 such that the HTS tape laminate can be fed (or otherwise provided or oriented) through the helical channel 137 into the helical groove 125 of the first plate 105.

[0098]

[0116] In some embodiments, the material surrounding the helical channel is selected to have high thermal and electrical conductivity and can be, for example, copper. It should be appreciated that this concept allows for some flexibility in the selection of the material within this region, as well as the particular procedures by which the geometric form of the helical channel is formed and mechanically and electrically supported.

[0099]

[0117] In some embodiments, the HTS tape and the co-wound laminate include locations where the HTS tape and the co-wound laminate enter and exit the channels on each of the plates with spiral grooves and extend without interruption to the current feeder connection on the outside of the plates with spiral grooves over a wide area that is embedded in copper or other suitable high electrical conductivity material in other cases. This helps to protect the HTS from overheating and damage during magnet charging and magnet quench events.

[0100]

[0118] Referring now to FIG. 1B, the HTS tape laminate 150 that may include co-wound material ​are disposed within the inward spiral groove channel 135. A coolant channel 155 or thermally conductive strip 155 (FIG. 1C) in contact with a separate coolant channel (not shown) is disposed on top of the HTS tape stack. The coolant channel or thermally conductive strip 155 (FIG. 1C) is configured to allow the magnet assembly 100 to be adequately cooled during all stages of magnetic operation, including but not limited to magnet charging, where localized Joule heating will result from bypass current. In some embodiments, the coolant channel 155 or thermally conductive strip 155 is eliminated.

[0101]

[0119] Referring now to FIG. 1C, a second plate 110 is disposed within the HTS tape. First plate 105 has HTS tape stack 150. HTS tape stack 150 is inserted or otherwise disposed within spiral groove channel 135 and spiral groove 137 (most clearly visible in FIG. 1B), which guides or otherwise directs HTS tape stack 150 into spiral groove channel 135 of first plate 105.

[0102]

[0120] In an embodiment, the first and second plies 105, 110 are made of Inconel 7 18, Hastelloy C276, as well as stainless steels such as 316, and dispersion strengthened copper alloys such as GRCop-84. In embodiments, it may be desirable to coat or otherwise dispose a layer of material within the channels 130, 135. Such materials may include, but are not limited to, electrodeposited solder to aid in fabrication, semiconductor coatings of various thicknesses to control quench current distribution, copper plating / coatings, and / or ceramic coatings.

[0103]

[0121] In some embodiments, the channels 130, 135, and / or the entire The plate assemblies 105, 110 may be formed by additive manufacturing techniques such as three-dimensional (3-D) printing. Such techniques have already demonstrated the ability to fabricate structures of the required size and shape using a wide variety of structural materials such as superalloys such as Inconel 718, Inconel 625, as well as 316 stainless steel and the dispersion strengthened copper alloy GRCop-84. Suffice it to say that a wide variety of additive manufacturing techniques may be used for fabrication using a wide variety of different materials.

[0104]

[0122] Significantly, in embodiments, the HTS tape stack and the co-wound 15 0 may be uninsulated, partially insulated, and / or may contain semiconducting material.

[0105]

[0123] HTS tape stacks may be composed entirely of HTS tapes. Alternatively, the HTS tape stack 150 may include a "co-wound" tape, i.e., a tape made entirely of a non-superconducting material, that is separately interleaved and / or stacked on top of the HTS tape stack. The co-wound material may be conductive, insulating, or semi-conductive, with electrical properties selected to be advantageous for optimizing quench behavior. The co-wound tape may even include a "bladder" as described further below. In some embodiments, the HTS tape stack 150 may be formed outside of the channel and then disposed within the channel. In other embodiments, elements of the HTS tape stack 150, including but not limited to the co-wound material, may be printed on the channel 13, such as by 3D printing techniques. 0,155 directly into

[0106]

[0124] In some embodiments, the cross-sectional shape of the grooves in the first and second plates is substantially In other embodiments, the cross-sectional shapes of the grooves in the first and second plates may be different (e.g., to accommodate features such as structural elements that may be unique to the plates).

[0107]

[0125] Further, in some embodiments, the first and second plates further comprise substantially In some embodiments, the plates may have substantially identical spiral shaped grooves and may be assembled back-to-back, i.e., with grooves on both opposing surfaces, such that the grooves form channels when the plates are assembled. In other embodiments, the spiral shapes in each plate may be different.

[0108]

[0126] In an embodiment, the channels are inward spirals on the top plate, The HTS tape stack and co-windings can be inserted into the channels. The co-winding materials and surface coatings can be selected to safely distribute the magnet quench energy within the volume of the structure.

[0109]

[0127] Some applications (e.g., the toroidal field coils for the proposed SPARC experiment) In order to maintain operating temperatures, it may be necessary to remove heat generated from volume sources within the region of the tape stack (e.g., neutron induction heating, copper joints). The spiral grooved stacked plate approach can easily accommodate this in a number of ways. Figures 2 and 2A illustrate two different embodiments with coolant channels disposed along the tape stack. Generally, the coolant channels are placed to the side (e.g., adjacent to, next to, or near) the main load path (e.g., the superconductor). The copper clad HTS tape plane can be oriented perpendicular to the coolant channels, which maximizes heat transfer. Figure 3 illustrates an alternative approach using a coolant channel plate within the stack shared between both opposing pancakes.

[0110]

[0128] 2 and 2A show a cross section of a plate in which the groove is set in a recess in the plate. 1-1C, in which the walls of the groove are above the major surface of the plate. Referring now to FIG. 2, the spiral grooved plate 205a includes grooves or channels 230. In this illustrative embodiment, the channels 230 are provided having a rectangular cross-sectional shape. In other embodiments, the channels 230 may be provided having other cross-sectional shapes (i.e., other than rectangular), including, but not limited to, square, triangular, oval, or rounded, or other regular geometric shapes. The cross-sectional shape of the channel may be selected to be complementary to the shape of the HTS tape, or vice versa. Ideally, but optionally, the HTS tape (or a combination of the HTS tape and co-wound and / or shim and / or bladder device) substantially occupies the cross-section of the channel. In general, it is desirable, but optional, for channels 230 to be filled as much as possible (e.g., to the extent that material properties and / or mechanical and / or manufacturing tolerances and / or manufacturing techniques will allow) with a material that has high mechanical strength, high thermal capacity, high thermal conductivity, and electrical properties that optimize magnet quench response.

[0111]

[0129] In this illustrative embodiment, plate 205a has a width 233 of about 15 mm. The channel 230 has a depth into the plate 205a of about 11 mm. The channel further has a length 234 of about 9 mm. Inserted or otherwise disposed within the channel 230 is an HTS tape stack 250 having a width 231 of about 6 mm and a length 232 of about 8.33 mm. A shim 235, here having a wedge shape, is used to insert the HTS tape stack 250 into the channel 230. The S tape stack 250 is inserted or otherwise arranged into the groove 230 such that it is pressed against the sidewalls of the groove. In this illustrative embodiment, one of the channels is formed or otherwise provided at a distance 239 of about 4.25 mm from the surface of the plate 205a. However, these dimensions are merely illustrative as the structures described herein can have any of a variety of suitable dimensions.

[0112]

[0130] In an embodiment, the magnet assembly further comprises one or more coolant channels. In embodiments, the one or more coolant channels may be provided in one or both of the first and second plates. In embodiments, the one or more coolant channels may include one or more coolant passages disposed proximate to the HTS tape stack. In other embodiments, the one or more coolant channels may include one or more cooling channel plates interleaved or otherwise distributed between the plates that make up the high field magnet assembly.

[0113]

[0131] A coolant channel 215 is provided adjacent the HTS tape stack 250. In this illustrative embodiment, the coolant channel 215 is formed or otherwise defined by a thermally conductive member 210 having a C-shape (e.g., a C-shaped channel member 210) positioned on top of the HTS tape stack 250. In this illustrative embodiment, the coolant channel is approximately 30 mm long. 22. However, this area is merely illustrative as any suitable coolant channel area may be used. Thermally conductive member 210 may include one or more of copper, copper alloys, and high thermal conductivity materials. Coolant channels 215 are covered or otherwise closed (or capped) using a lid 220 that is secured (e.g., welded or otherwise secured) onto plate 205a. Lid 220 is configured to encapsulate HTS tape stack 250 and coolant channels 215 within groove 230. In one embodiment, a tape stack having a length of about 8 mm may be prepared from about 190 HTS tapes, each 6 mm wide. In an embodiment, a superalloy (e.g., Hastelloy) may be used as a co-wound material to achieve the 8 mm length with a reduced number of HTS tapes.

[0114]

[0132] In an embodiment, multiple spiral grooved plates may be used, A method for constructing a field magnet includes assembling a series of HTS-loaded spiral grooved plates stacked between coolant channel plates, and forming one or more inter-pancake electrical connections, each of the one or more inter-pancake connections having low electrical resistance characteristics such that resulting Joule heating can be accommodated by the coolant system. In an embodiment, forming the one or more inter-pancake connections can include automatically forming one or more other inter-pancake connections.

[0115]

[0133] FIG. 2A is a cross-sectional view of the spiral grooved plate 205b. Plate 205b can be substantially similar to plate 205a. In this embodiment, a welded lid is not used to enclose the HTS tape stack 250 and the coolant channels 215. The coolant channels 215 are encapsulated by rectangular coolant tubes 240. The rectangular coolant tubes can include one or more of copper, copper alloys, or any other material having thermal conductivity properties similar to or greater than the previously mentioned materials.

[0116]

[0134] In the example illustrated by FIGS. 2-2A, the HTS tape stack 250 is The nozzles are oriented perpendicular to the nozzle channels 215. This orientation increases heat transfer (and The orientation of the scalar may be selected to maximize the scalar area (and ideally maximize the scalar area). Those skilled in the art will appreciate that other orientations may be used.

[0117]

[0135] As mentioned above, FIGS. 3 and 3A show two opposing pancakes 330. 3 illustrates an alternative approach using a shared coolant channel 340 between the HTS stack and the HTS coil 335. In an embodiment, this can be accomplished by a coolant channel plate in the stack that is shared between both opposing pancakes 330, 335. In some embodiments, grooves are cut into the surface of both opposing pancakes 330 and 335 to form the coolant channels (FIG. 3A). FIGS. 3 and 3A are cross-sectional views showing the option of stacking two spiral grooved plates for shared coolant channels (e.g., by a shared coolant channel plate or a conduction cooled plate, or by cutting matching grooves into the surface of the spiral grooved plate and the copper lid that covers the HTS stack and co-wound). If desired, copper interconnects between the pancakes can be made in this area. It should be noted that like elements in FIGS. 3 and 3A are given with like reference names.

[0118]

[0136] This "coolant channel plate" concept improves the coolant path (and ideally This provides significant flexibility for design (and optimization) of the coolant channel plate, which may be a useful feature in some applications, such as the SPARC toroidal field coils. Alternatively, a conduction-cooled plate may be used in place of the coolant channel plate, or eliminated altogether, accepting designs and applications that have low levels of internal volumetric heating.

[0119]

[0137] To control the quench kinetics and the temperature of the HTS tape during quenching To help reduce the rise, a conductive plate (e.g., copper) can be inserted between the double pancakes; one finding is that quench-induced eddy currents will be preferentially induced in these structures, which localize the magnetic stored energy deposition to areas that are thermally and electrically isolated from the HTS tape. Such structures are naturally accommodated by the spiral grooved stacked plate design concept, and they can be directly incorporated into the coolant channel plate design, electrically isolated from the pancakes and in good thermal contact with the coolant.

[0120]

[0138] To control the quench kinetics and the temperature of the HTS tape during quenching To help reduce the rise, a high electrical conductivity coating (e.g., copper) and / or an insulating coating (e.g., alumina) can be applied to selected areas of the spiral grooved plate, including but not limited to the grooved and non-grooved sides of the plate, with one finding being that quench induced current density, distribution, and resulting Joule heating can be controlled by tailoring the resistance of the main electrical paths within the magnet structure.

[0121]

[0139] This stacked plate geometry is, of course, similar to that shown in FIG. As shown in FIG. 1, the groove plate / coolant channel plate assembly can accommodate copper interconnects between the pancakes, if desired. At the same time, the groove plate / coolant channel plate assembly can be designed, with appropriate selection of materials, to maintain a relatively high resistance electrical connection between adjacent pancake windings, which can be used to reduce magnet charging times in this non-insulated superconducting magnet design.

[0122]

[0140] Preloading the tape stack in the groove prior to soldering or not at all It may be advantageous to use a preloading mechanism that eliminates the need for soldering. Figures 2 and 5 illustrate the use of a "wedge shim" to accommodate this, although the use of a hydraulic bladder is also possible (Figure 4) and is preferred in many cases.

[0123]

[0141] FIG. 3 shows two plates 330, 335 having a spiral groove 320 formed therein. 3 is a cross-sectional view of the spiral groove 320. The plates 330, 335 have a shared coolant assembly 340 between them, which may be a coolant channel (e.g., as provided in a coolant channel plate and / or facilitated by cutting grooves into the top surface of the spiral grooved plate and into the copper covering the HTS stack and co-wrap) or a conduction-cooled plate, as mentioned above. The double pancake structure prepared from the spiral grooved plates 330, 335 and the coolant assembly 340 may have a width 341 of about 20 mm, although this width is merely illustrative. In the illustrative embodiment of FIG. 3, the spiral groove 320 includes the HTS tape stack 305 with optional co-wrap material and a cover plate 310, which may be constructed of copper or other thermally conductive material. In other embodiments, the cover plate 310 may be omitted to expose the HTS stack and co-wounds directly to the coolant or directly to a conductive plate. In this illustrative embodiment, the plate has a length 336 of about 14 mm, the tape and channels 320 are provided having a width 337 of about 4 mm, a length 338 of about 4.5 mm, and one of the channels (illustrated here as channel 320a) is formed or otherwise provided at a distance 339 of about 2.5 mm from the surface of the plate 335. However, these dimensions are merely illustrative, as the structures described herein may have any of a variety of suitable dimensions.

[0124]

[0142] In one embodiment, the coolant assembly 340 is a coolant channel between the plates 330, 335. In this configuration, the coolant paths established by the channels are not constrained to flow along the HTS stack and therefore can be optimized for heat removal. For example, short radial paths across the HTS stack can be used, spreading heat more effectively across the turns. This can be useful for applications where high levels of internal volumetric heating of the magnet windings can occur (e.g., toroidal field magnets for SPARC). In addition, multiple coolant annular tubes can be used, reducing coolant velocity and drive pressure requirements. Finally, the coolant passages can have variable sizes, and more volume can be realized within the windings relative to the structural elements only when those passages are needed. In embodiments with lower levels of internal volumetric heating, a conduction cooling approach may be appropriate. In this case, the coolant channel plate can be replaced by a conduction-cooled plate or even eliminated.

[0125]

[0143] To control the quench kinetics and during quenching of the HTS tape stack To help reduce the temperature rise of 305, a conductive plate (e.g., copper) can be inserted between the plates 330, 335 in the coolant channel region 340. Thus, quench-induced eddy currents will be preferentially induced in the conductive plate, which localizes the magnetic stored energy dissipation to an area that is thermally and electrically isolated from the HTS tape 305.

[0126]

[0144] FIG. 3A shows a cross-sectional view of two plates 330, 335 having a groove 320 formed therein. 6A-6C. Plates 330, 335 are stacked against a shared coolant assembly 340, which may be a coolant channel plate, a groove in the top surface of the plate, or a conduction-cooled plate. An interconnect 350 is disposed in the area between plates 330, 335. This interconnect serves to bridge the current path between the innermost turns of adjacent plates in the magnetic assembly (see 621 in FIG. 6, 621a in FIG. 6A, and 720b in FIG. 6C). In an illustrative embodiment, interconnect 350 may include copper (e.g., high thermal and electrical conductivity copper) soldered to the HTS stack by an interface layer (e.g., using an indium or indium alloy interface layer) to bridge the connection. A suitable low melting temperature soldered connection may also be used. Plate 3 The interconnect 350, in combination with the overall electrical connection between plates 330, 335, is configured to accept bypass current that flows during magnetic charging, while also increasing (and ideally maximizing) the electrical resistance between plates 330, 335, which reduces (and ideally minimizes) the magnet charging time.

[0127]

[0145] FIG. 4 is a cross-sectional view of a magnet 400 comprising a first plate 430 and a second plate 435. 3A ) or in the vicinity of the spiral HTS tape stack interconnects (e.g., groove 125 in FIG. 1 ). Insulator 440 is disposed between plates 430, 445. In this embodiment, insulator 440 inhibits (and ideally prevents) bypass currents resulting from the magnet charging from flowing directly across plates 430 and 435. Instead, such currents are forced to flow along the plates and propagate (or hop) across the plates only in the vicinity of the inter-plate interconnects in that embodiment (e.g., interconnect 350 in FIG. 3A ) or in the vicinity of the spiral HTS tape stack interconnects in that embodiment (e.g., groove 125 in FIG. 1 ). The insulator may be composed of, but is not limited to, a fiberglass composite, a mineral insulator (e.g., mica), alumina, or an insulating coating such as alumina.

[0128]

[0146] A spiral groove 420 is provided in the plates 430, 435. The resulting HTS tape stack 405 is inserted into the groove 420 and a lid assembly 410 (which may be provided, for example, as a copper lid assembly) is disposed on top of the HTS tape stack and co-wrap 405 .

[0129]

[0147] A bladder element 415 (or, more simply, a bladder 415) is disposed on the sidewall of the groove 420. 4 is disposed within a groove (or channel) to compress the HTS tape stack 405 against the sidewall 411. In an embodiment, the bladder 415 may be a hydraulic bladder to which hydraulic fluid may be applied to effect compression. In some embodiments, the bladder 415 is positioned such that the tape stack 405 is compressed against the primary load bearing sidewall. In this example, the tape stack is provided with a width 412 of about 4 mm and a length 413 of about 4.5 mm, and the direction of the primary load (i.e., the primary Lorentz force (IxB) load) in FIG. 4 is designated by reference numeral 416, which consequently indicates that the sidewall 411 corresponds to the primary load bearing sidewall. The bladder 415 compresses the HTS tape stack 405 such that the impact of the cyclic application and release of the Lorentz force (IxB) load may be reduced (and ideally minimized). In this illustrative embodiment, one of the channels (here, channel 420a) is formed or otherwise provided at a distance 439 of about 2.5 mm from the surface of plate 435. However, these dimensions are merely illustrative as the structures described herein can have any of a variety of suitable dimensions.

[0130]

[0148] In an embodiment, the bladder element is wound as a co-wound element within the HTS tape stack. (i.e., as part of the HTS tape stack). The bladder element may be configured within the HTS tape stack to preload the HTS tape stack prior to soldering to facilitate the soldering process by anchoring the HTS tape stack in a desired location. In embodiments, the bladder element may even be configured within the HTS tape stack to eliminate the need for soldering. The bladder element may also be configured to pre-compress the HTS tape stack against the load-bearing sidewall of the at least one spiral groove.

[0131]

[0149] In some instances, after the HTS tape stack 405 is soldered, The fluid may be removed and further replaced with an inert gas. In the case where the bladder 415 is empty, the bladder is preferably in a vacuum relative to the grooved plates 430, 435 during magnet cool-down and warm-up periods to reduce the risk of HTS stack and co-winding delamination damage. It acts as a spring to accommodate the differential thermal contraction of the soldered HTS stack 405 .

[0132]

[0150] In another example, if hydraulic fluid is to be retained on the HTS tape stack 405 The compressive force can be maintained such that the stack is sufficiently immobilized. The hydraulic fluid can be selected such that it freezes at the magnet operating temperature, eliminating the need to actively maintain hydraulic pressure.

[0133]

[0151] In some cases, the bladder element is liquid during assembly but remains liquid at magnet operating temperatures. The tape stack 405 may contain (e.g., be filled with or otherwise have disposed within) a material that is solid at certain temperatures. One such material includes, but is not limited to, gallium. The heat of fusion associated with this material may act as a large thermal reservoir to limit the temperature rise of the tape stack 405 during a quench event, i.e., to limit the HTS stack temperature to be below the melting temperature of 29.8 degrees Celsius in the case of gallium.

[0134]

[0152] In all of these embodiments, the materials, coatings, conductors in the assembly , semiconductors, and insulator selection can be used to improve (and ideally optimize) current shunting and eddy current paths in response to a magnet quench event to safely distribute magnet quench energy over a large volume.

[0135]

[0153] Reference is now made to Figures 5-5A, where like elements are given like reference designations. Shown then are cross-sectional views of magnets illustrating examples of how the selection of materials, coatings, conductors, semiconductors, and insulators in the co-wound tape stack and spiral grooved plate can be used to control the area of ​​magnet quench energy heat application quench according to embodiments described herein. The arrows designated by reference number 510 in FIGS. 5-5A represent current shunt current flow driven by a quench event. In this example, current is driven from a first (or lower) HTS tape stack 505a to a second HTS stack 505b (here, the nearest neighbor 505b of that stack 505a). Taking the configuration of tape stack 505b as illustrative for tape stack 505a, tape stack 505b is disposed in a groove 506 provided in plate 530. A wedge shim 508 (or alternatively, a bladder) is disposed within groove 506 adjacent tape stack 505b. A coolant channel 515 defined by a C-shaped member 520 is disposed in thermal contact with tape stack 505b. A lid 525 is disposed above the coolant channel. Wedge shim 508, coolant channel 515, C-shaped member 520, and lid 525 may be the same as or similar (both in structure and function) to the wedge shim (or bladder), coolant channel, C-shaped member, and lid described herein above in connection with FIGS. 2-4.

[0136]

[0154] The rate of volumetric heat generation in the spiral grooved plate due to the quench current is ηj 25A, where j is the current shunting current density and η is the electrical resistivity of the material through which the current flows. In FIG. 5A, an insulator 540 is inserted as a co-wound material at the base of the HTS stack, whereas in FIG. 5, no such insulator is present. Because an insulator is present in FIG. 5A, the quench current flows deeper and for a longer distance into the backbone of the grooved plate 530 compared to the embodiment in FIG. 5. Thus, the volume in which the quench energy is dissipated is larger in FIG. 5A compared to FIG. 5. Alternatively or additionally, the non-grooved side of the spiral grooved plate can be coated with a high electrical conductivity material (e.g., copper) to encourage the current shunting current to flow deeper into the backbone of the spiral grooved plate, thereby increasing the volume of material in which the quench energy is dissipated. This can be done for the purpose of

[0137]

[0155] In overview, Figures 6-6C show how the spiral grooved HTS is packed. Illustrate how an alternating stack of inlaid plates and coolant channel plates (possibly modified with coolant channel grooves cut into the surface of the spiral groove plate) can be assembled to form a high field magnet. It should be appreciated that in these illustrations, interconnect options between pancakes (such as copper interconnects as illustrated in FIG. 3) are shown. However, it should be understood that a spiral tape interconnect option, as described above in conjunction with FIG. 1, can also be used and may be preferred in some applications (e.g., compact fusion applications). In one embodiment, a magnet with a radial build of H=160 mm, width W=140 mm, and clear bore diameter S=100 mm is expected to produce approximately 20 Tesla on axis using existing commercially available HTS tapes. The spiral grooved plate can be fabricated by additive manufacturing techniques (e.g., 3D printing) using commercially available methods in a superalloy such as Inconel 625. The stresses in the support plate are expected to be well within acceptable limits for a 3D printed part made from Inconel 625.

[0138]

[0156] Figure 6 shows six spiral grooved double pancakes generally designated 605. FIG. 6 is a cross-sectional view of high field coil 600 comprising a stack of double pancakes 605a-605f, each with a coolant channel plate 606a-606f inserted or otherwise disposed therebetween. As mentioned above, in one embodiment, high field coil 600 is expected to achieve approximately 20 Tesla on-axis using existing commercially available HTS tapes according to the embodiments described herein.

[0139]

[0157] In this embodiment, the current is passed through external feed 615 to the top of FIG. Electric current flows into and out of each double pancake 605 in the spiral grooves of each plate. Current alternates between passing through cross-sectional views 635 and 630, wrapping around the spiral grooves of each plate. In this case, an internal interconnect (generally designated 621) is used to connect the electrical path across the innermost turn, the spiral winding, similar to internal interconnect 350 described above in connection with FIG. 3A. Thus, the connected pairs of spiral grooved plates effectively form six double pancake subassemblies 605a-f.

[0140]

[0158] In this embodiment, the infeed section generally designated 620 is a double-pass The coolant channel plates 622a-622f are configured to deliver and receive coolant into the coolant channel plates 622a-622f disposed intermediate the cake assembly.

[0141]

[0159] FIG. 6A illustrates an exemplary magnet assembly 600, a cross-sectional view of which is shown in FIG. 7 is a top view of a first spiral grooved plate 705a of the present invention. The plate 705a may be prepared from any conductive material 706, including metals or alloys. Such materials include, but are not limited to, one or more of nickel-based superalloys such as Inconel 718 and Hastelloy C276, austenitic stainless steels, and dispersion strengthened copper alloys. Factors influencing material selection include, but are not limited to, mechanical strength, electrical conductivity, thermal conductivity, and coefficient of thermal expansion. In an embodiment, the plate material 706 may include a composite of different materials. Materials may be selected to optimize quench energy deposition uniformity, structural integrity under load and under excursions, as well as to minimize cost. As mentioned above, additive manufacturing techniques may be readily used to fabricate the plate geometries used from which magnets may be constructed.

[0142]

[0160] A first plate 705a is configured to receive an HTS tape stack 710a. 6C)。 The HTS tape stack 710a is fed into the groove channel (e.g., groove or channel 130 in FIG. 1) of the first plate 705a. In this embodiment, the first plate 705a includes an electrical interconnect 621a in the innermost turn, similar to 350 illustrated in FIG. 3A. In this case, the electrical interconnect component takes the shape of a circular ring. The first plate 705a is stacked on a second plate (e.g., second plate 705b in FIG. 6C) and a cooling plate 730 (e.g., an insulating radial coolant channel plate shown in FIG. 6B) is inserted between the two spiral grooved plates 705a, 705b. Thus, in this illustrative embodiment, the spiral grooved plates 705a, 705b and the cooling plate 730 form a double pancake structure.

[0143]

[0161] In some embodiments, the HTS tape and the co-wound stack are and the co-wound stack is embedded in copper, or other suitable high electrical conductivity material, over a wide area, including where it enters (715a) and exits (715b) the channels on each of the spiral grooved plates, and extends uninterrupted to the outside of the spiral grooved plates, all the way to the current feed connections. This helps protect the HTS from overheating and damage during magnet charging and magnet quench events.

[0144]

[0162] In some embodiments, two or more HTS tape stacks may include a grooved channel. In some embodiments, the plate may be disposed within a spiral groove, with separate structures and / or co-wrapped materials disposed between the tape stacks, and the channel groove dimensions appropriately modified to receive these materials and / or to mechanically engage them, such as by a secondary spiral groove. In some embodiments, some or all of the co-wrapped materials may be disposed to mechanically engage the plate, such as by a spiral groove.

[0145]

[0163] An internal electrical interconnect, possibly in the form of a circular ring in this example, Furthermore, it should be noted that it may be used on the outermost turns to connect between double pancake assemblies.

[0146]

[0164] If the double pancake embodiment of FIGS. 1-1C is used, as shown here It should be noted that there would be no need to use internal interconnects at the innermost turns. Instead, the HTS tape stack and co-wrap would be continuously connected from spiral groove plate 705a to plate 705c. In this case, the coolant channel plates would be placed beside each double pancake assembly, rather than between the two plates that form the double pancake assembly as depicted here.

[0147]

[0165] FIG. 6B shows a tubular coolant passage 735 having radially insulating coolant channels 735 disposed therein. 7 is a top view of the cooling channel plate 730. The cooling channel plate 730 is configured to receive cooling fluid via the coolant inlet assemblies 745a-N. In this embodiment, four separate flow paths of coolant into and out of the cooling channel plate are depicted by arrows. The cooling channel plate is constructed such that it is electrically isolated from the spiral groove plates 705a and 705b when it is placed in the assembly. This feature prevents bypass currents resulting from magnet charging from flowing through the coolant channel plate between the plates 705a and 705b. This function can be accomplished by fabricating the plate from a non-conductive material, such as, but not limited to, a fiberglass composite; applying an insulating coating to an otherwise conductive base material, or by some other suitable means. In some embodiments, the coolant channel plate forms only the side walls of the coolant channels, with the adjacent HTS stack and spiral groove plate forming the remaining walls. In this case, the coolant is in direct contact with the HTS stack and co-windings. In other embodiments, grooves can be cut into the surfaces of adjacent spiral grooved plates and into the copper lid material to serve as coolant channels. The grooves can extend along or across the HTS stack as needed to facilitate cooling, optimize coolant passage length, and minimize pressure drop.

[0148]

[0166] Please note that the coolant paths shown in FIG. 6B are for illustration only. It should be understood that these paths can be tailored by the needs and constraints in magnet design, such as heat removal and structural integrity considerations of the magnet assembly. The coolant channel plate can be replaced by a conductively cooled plate, or eliminated altogether, replaced by a simple insulating material. In the latter case, the coolant channel passages can be formed by cutting grooves into the surface of the spiral grooved plate and into the copper lid material.

[0149]

[0167] FIG. 6C is a top view of the second spiral grooved plate 705b. 1A )。 In this embodiment, the second plate 705b includes an inlet 715b configured to receive an HTS tape stack 710b. The HTS tape stack 710b is fed into the groove channel (e.g., groove channel 135 of FIG. 1A ) of the second plate 705b. The HTS tape stack 710a is fed into the groove channel (e.g., groove channel 135 of FIG. 1A ) of the second plate 705b. In this embodiment, the second plate 705b includes electrical interconnects 720b that align with and mate with the electrical interconnects 720a of the first plate 715a.

[0150]

[0168] In overview, Figures 7-7D show that the HTS tape stack is directly FIG. 7 illustrates an alternative embodiment of a double pancake assembly of spirally grooved stacked plates, in which the HTS stack is wound in some sections or grooves on the stack itself. FIGS. 7-7D further illustrate conductive terminal blocks spanning a portion of the circumference of the outer diameter of the coil and the entire circumference of the inner diameter of the coil. In some embodiments, the inner and outer conductive terminal blocks span only a portion of their respective circumferences or span their entire circumference of the coil. In an embodiment, the conductive terminal blocks are provided as copper terminal blocks, but any material having suitable electrical conductivity may be used. The spirally grooved plates may be fabricated by the techniques described above. In the embodiment of FIGS. 7-7D, it is envisioned that the HTS stack may include co-wound materials as described above, and may vary in thickness and composition along the length of the stack to optimize for current density, magnetic field concentration, and quench behavior.

[0151]

[0169] It has been realized that the use of variable width spiral grooves has several advantages. By varying the width of the groove, the HTS stack (and co-windings) can be wound directly on itself a given number of times within each radial groove. Doing so allows fine control over the current density distribution within the winding, which can be used to reduce magnetic field strength variations and concentrations within the HTS tape due to self-magnetic fields. With the assumption that the magnetic field will decrease in magnitude with increasing distance from the center of the assembly 800, it is realized that the HTS stack will be able to withstand a greater number of self-windings within each groove with increasing radial distance from the center of the assembly.

[0152]

[0170] In addition, the use of variable width spiral grooves allows for a greater degree of freedom in determining the overall length of the HTS tape stack. This eliminates the need to cut (or otherwise form or provide) "thin grooves" in the plate. For purposes of this disclosure, a groove is considered "thin" when its depth is more than twice its width. Thus, using plates with variable width spiral grooves provided therein allows for the production of thin HTS tape stacks without the need for using thin grooves. The design further allows the coil and its structure to be separately optimized with respect to magnetic field generation, self-field experienced by the HTS tape, and mechanical loading, i.e., structural stiffness, location for welds and fasteners, location for coolant channels including channels between plates.

[0153]

[0171] Similar elements are given similar reference designations throughout the several views. 7-7D, in which a variable width spiral grooved stacked plate double pancake magnet assembly 800 includes a plate 802 and disposed within the plate is a conductive (e.g., copper) terminal block 804 and an HTS tape stack 806 that is contained within several grooves of varying widths and wound on itself to occupy (and ideally completely occupy - i.e., "fill") the space of each such groove. In particular, magnet assembly 800 includes walls 810, 812, 814, 816, and 818 that define various grooves that are filled by HTS stack 806 (and any co-windings). Magnet assembly 800 further includes a second optional copper terminal block 820 along an inner diameter of the assembly. The magnet assembly 800 further includes an outer structural member 822 and an inner structural member 824, which may be made from the same material as the stacked plates 802.

[0154]

[0172] Grooves in a Double Pancake Magnet Assembly of Stacked Plates with Variable Width Spiral Grooves It is appreciated that the number of HTS tape stacks (and therefore the number of walls) may vary depending on the intended use. It is further appreciated that the number of HTS tape stacks and / or co-wound turns in each groove may likewise vary depending on the intended use. Thus, Figure 7 is merely illustrative, and after reading the description provided herein, those of ordinary skill in the art will appreciate how to adapt the concepts, techniques, and structures described herein to form other embodiments.

[0155]

[0173] Each of the walls 810, 812, 814, 816, and 818 has the same structure as described above. 8. The magnetic tape stack 806 may include cooling means such as those described above, and / or may provide structural support for the magnetic forces experienced by the HTS tape stack 806.

[0156]

[0174] Each of the walls 810, 812, 814, 816, and 818 is connected to a magnet assembly 80. 7D , some (or even all) of the walls have varying (i.e., tapering) thicknesses at different angular positions (see, e.g., wall 818, including wall portions 818a, 818b). Thus, the same continuous wall may appear to have several portions of varying wall thickness at any given cross-section.

[0157]

[0175] The overall width of a given wall along a given cross section is the total width of that wall as it appears in the cross section. This overall width may be calculated as the sum of the radial extents of each of the portions. This overall width may or may not be equal for different walls in different embodiments, and the overall width of a given wall may vary as a function of the angular position of the respective cross-section.

[0158]

[0176] 7A-7C are diagrams showing the magnet assembly 800 of FIG. 7 along lines AA, BB, and CC, while FIG. 7D shows a perspective view of a portion of magnet assembly 800.

[0159]

[0177] Referring now to FIG. 7A, a plate 802 is attached to the magnet assembly 800 on the lower left side. The outer diameter of the magnet assembly 800 (adjacent reference number 822) is shown at the top right, and the inner diameter of the magnet assembly 800 (adjacent reference number 824) is shown at the bottom left. 8, is shown surrounding on two sides a portion 806a of HTS tape stack 806. A third, inner side of tape stack portion 806a abuts wall 810, while a fourth side of tape stack portion 806a may abut another spiral grooved magnet assembly (not shown) that is stacked against the fourth side, in accordance with the concepts, techniques, and structures disclosed herein.

[0160]

[0178] 7 and 7A, at individual cross section AA of magnet assembly 800, 7A. Four layers of HTS tape stack 806 are wound on themselves within a groove defined by wall 810 and portion 812a of wall 812 and running between the walls 810 and portion 812a. Two such layers 806b and 806c of HTS tape stack 806 are displayed in FIG. 7A. It is appreciated that layering the HTS tape stack 806 on itself (e.g., in the form of layers 806b and 806c) may advantageously distribute the self-magnetic field strength within magnet assembly 800 as desired by a particular application.

[0161]

[0179] A layer of HTS tape stack 806 is formed on portion 812a and portion 812b of wall 812. 2b. As noted above, wall 812 wraps around magnet assembly 800 two or more times, such that two portions 812a and 812b of the wall appear at separate cross sections AA. A channel between these portions 812a and 812b is provided to permit adjacent winding of a single HTS tape stack 806 between the larger groove defined by walls 810 and 812a and the larger groove defined by walls 812b and 814a. Thus, it is seen that an embodiment of magnet assembly 800 may include a single thin stack and still permit high inductance windings.

[0162]

[0180] According to the pattern described above, a portion 812b of the wall 812 is HT 8. The six layers of the stack are wound relative to one another in a groove defined by the portion 812b and a portion 814a of the wall 814. A channel is provided between the portion 814a and a portion 814b of the same wall 814, through which a layer of the HTS tape stack 806 emerges on the other side of the wall 814 as layer 806e. The three layers of the stack are wound relative to one another in a groove defined by the portion 814b of the wall 814 and a portion 816a of the wall 816. A channel is provided between the portion 816a and a portion 816b of the same wall 816, through which a layer of the HTS tape stack 806 emerges on the other side of the wall 816 as layer 806f. The three layers of the stack are wound relative to one another within a groove defined by a portion 816b of wall 816 and a portion 818a of wall 818. A channel is provided between portion 818a and a portion 818b of the same wall 818, and wound through the channel is a layer of HTS tape stack 806.

[0163]

[0181] The innermost portion of the magnet assembly 800, as shown in FIG. 8. The second, optional, copper terminal block 820 may be occupied by a non-superconducting terminal block 820, which may be used in some embodiments to transfer electrical current out of (or into) the superconducting HTS tape stack 806. Note that the terminal block 820 may extend completely through the plate 802 to provide an external point of electrical contact. Alternatively, the HTS tape stack 806 may continue its stack windings from the innermost layer 806g into the adjacent stacked magnet assembly, according to the concepts, techniques, and structures described above. It is envisioned that other configurations of the space between the inner wall (e.g., wall 818) and the inner diameter (e.g., member 824) may be used in various embodiments.

[0164]

[0182] FIG. 7B is a cross-section of FIG. 7 taken along line BB, showing magnet assembly 80 on the left. 8 shows a similar pattern with an outer diameter of 0 and an inner diameter at the right. Thus, as described above, outer member 822 is shown, then terminal block 804 above plate 802, then layer 806a of HTS tape stack 806 is shown winding through the channel between terminal block 804 and wall 810. Next shown are four layers of stack in the groove between wall 810 and outer portion 812a of wall 812, then a layer of stack in the channel between portions 812a and 812b of wall 812.

[0165]

[0183] Of particular note is that the portion 812a shown in FIG. 7B is 7B is radially thicker than the corresponding portion 812a of the same wall 812 as shown in FIG. 7B. Thus, the difference between the cross sections of these figures illustrates how the wall 812 has a thickness that varies with different angular orientations around the magnet assembly 800, and in particular illustrates the tapered shape of the wall 812. Conversely, the portion 812b as shown in FIG. 7B is radially thinner than the corresponding portion 812b of the same wall 812 as shown in FIG. 7A. However, the sum of the radial thicknesses of portions 812a and 812b - i.e., the "total thickness" of the wall 812 along this cross section - is the same in both figures and does not vary with the angular orientation of the cross section.

[0166]

[0184] Having a consistent overall thickness can be advantageous in some embodiments For example, to the extent that each portion 812a and 812b provides some structural support against which the magnetic force is directed, this structural support is uniform and does not vary with angular orientation. However, as discussed above, in some embodiments, the overall thickness of wall 812 may vary with angular orientation. Moreover, in some embodiments, the width of the tape stack may vary with distance along the stack, which requires the wall thickness to be adjusted accordingly.

[0167]

[0185] Continuing radially inward with respect to the illustration of FIG. 7B, a portion 81 of wall 812 8B than in FIG. 7A , while portion 814b is thinner in FIG. 7B than in FIG. 7A , the overall thickness of the portions is the same, although portion 814a is thicker in FIG. 7B than in FIG. 7A , and portion 814b is thinner in FIG. 7B than in FIG. 7A , for the very reasons explained above.

[0168]

[0186] The three layers of the stack are a portion 814b of the wall 814 and a portion 816 of the wall 816. 7A , while portion 816b is thinner in FIG. 7B than in FIG. 7A , the overall thickness of the portions is the same, although portion 816a is thicker in FIG. 7B than in FIG. 7A , while portion 816b is thinner in FIG. 7B than in FIG. 7A .

[0169]

[0187] The three layers of the stack are a portion 816b of the wall 816 and a portion 818 of the wall 818. 7B. The layers of HTS tape stack 806 are wound against each other within a groove defined by portion 818a. A channel is provided between portion 818a and a copper terminal block 820, through which a layer of HTS tape stack 806 is wound. Note that terminal block 820 may extend completely through plate 802 to provide an external point of electrical contact. Also note that wall 818 only contains a single portion 818a at cross section BB illustrated in FIG. 7B. Finally, material 824 is disposed at the very end of magnet assembly 800. Occurs along the inner diameter.

[0170]

[0188] FIG. 7C is a cross-section of FIG. 7 taken along line CC, showing magnet assembly 8 at the top. 8. The cross section of the wall 810 shows a similar pattern with an outer diameter of 00 and an inner diameter at the bottom. Thus, outer member 822 is shown, followed by a portion 810a of wall 810. Note that terminal block 804 is not present in this cross section, for reasons discussed below. Next, layer 806a of HTS tape stack 806 wraps through the channel between portion 810a and portion 810b of the same wall 810.

[0171]

[0189] Next shown is wall 810, including layers 806b and 806c, and wall 812. Shown below are the layers of the stack in the channel between portions 812a and 812b of wall 812.

[0172]

[0190] The portion 812a as shown in FIG. 7C is 7C is radially thicker than the corresponding portion 812a of the same wall 812 as shown in FIG. 7C. Thus, the differences between the cross sections of these figures illustrate how the wall 812 has a varying thickness with different angular orientations around the magnet assembly 800, and in particular illustrates the tapered shape of the wall 812. Conversely, the portion 812b as shown in FIG. 7C is radially thinner than the corresponding portion 812b of the same wall 812 as shown in FIG. 7A and 7B. However, the overall thickness of the wall 812 along cross section CC is the same in all three figures and does not vary with the angular orientation of the cross section.

[0173]

[0191] Continuing radially inward (i.e., downward) with respect to the illustration of FIG. 7C 7A and 7B, portion 812b of wall 812 abuts layer 806d of HTS tape stack 806. The six layers of the stack are wound relative to one another within a groove defined by portion 812b and portion 814a of wall 814. A channel is provided between portion 814a and portion 814b of the same wall 814, and wound through that channel is a layer of HTS tape stack 806, emerging on the other side of wall 814 as layer 806e. Note again that, as discussed above, portion 814a is thicker in Figures 7A and 7B, while portion 814b is thinner in Figures 7A and 7B, but the overall thickness of these portions is the same.

[0174]

[0192] The three layers of the stack are a portion 814b of the wall 814 and a portion 816 of the wall 816. 7A and 7B, while portion 816b is thinner in FIG. 7C than in FIG. 7A and 7B, although the overall thickness of the portions is the same.

[0175]

[0193] The three layers of the stack are a portion 816b of the wall 816 and a portion 818 of the wall 818. 7C. 7B. 818a are wound against each other within a groove defined by portion 818a. A fitted channel is provided between portion 818a and copper terminal block 820 (by material removed from copper terminal block 820) and wound through the channel is a layer of HTS tape stack 806. Note that terminal block 820 may extend completely through plate 802 to provide an external point of electrical contact. Also note that wall 818 only contains a single portion 818a at cross section CC illustrated in FIG. 7C. Finally, material 824 emerges along the innermost diameter of magnet assembly 800.

[0176]

[0194] The inlaid conductive strip or plate 804 includes, among other things, a conductive terminal and a backing. This provides a large contact area between the relatively low conductivity material that comprises the plate 802 and between the HTS tape stack 806 and the conductive terminals. In an embodiment, the conductive terminals are provided as copper terminals and the inlaid conductive strips 804 are provided as inlaid copper strips 804. The use of such conductive strips facilitates achieving low joint resistance between the HTS stack tape 806 and the copper terminals.

[0177]

[0195] This feature occurs when the magnet is being charged and during unusual events. It may be useful to have the contact area be large enough to ensure that the current density at the interface between the copper and backplate material 802 is within acceptable limits (e.g., acceptable Joule heating), both for the materials themselves and for the contact resistance between the materials. This includes design considerations of potential damage from overheating during out-of-the-ordinary events, as well as consideration of the Joule heating distribution within the backplate 802 during charging and the impact of that Joule heating distribution on cooling requirements.

[0178]

[0196] Copper plate 804 is an additional plate for receiving the stack and distributing localized heating effects along it. 7A, portion 806a contacts copper plate 804 along two of its sides, and in FIG.

[0179]

[0197] Various embodiments of the concepts disclosed herein are illustrated in the accompanying drawings. It should be understood that the present invention is described with reference to the above. Alternative embodiments may be devised without departing from the scope of the broad concepts described herein. It is noted that various connections and positional relationships (e.g., above, below, adjacent, etc.) are discussed between elements in the following description and in the drawings. These connections and / or positional relationships may be direct or indirect unless otherwise specified, and the present invention is not intended to be limited in this respect. Thus, the connection of entities may refer to either direct connection or indirect connection, and the positional relationship between entities may be a direct positional relationship or an indirect positional relationship. As an example of an indirect positional relationship, a reference in this description to disposing a layer or element "A" above a layer or element "B" includes the situation where one or more intermediate layers or elements (e.g., layer or element "C") are between layer / element "A" and layer / element "B," so long as the significant properties and functionality of layer / element "A" and layer / element "B" are not substantially altered by said intermediate layers.

[0180]

[0198] The following definitions and abbreviations are to be used for the interpretation of the claims and this specification. As used herein, the terms "comprise (third person singular present tense)", "comprise (present participle)", "include (third person singular present tense)", "include (present participle)", "have (third person singular present tense)", "have (present participle)", "include (third person singular present tense)", or "include (present participle)", or any other variations thereof, are intended to cover a non-exclusive inclusion. For example, a composition, mixture, process, method, article, or device that comprises recited elements is not necessarily limited to only those elements, but can include other elements not expressly recited or inherent to such composition, mixture, process, method, article, or device.

[0181]

[0199] Additionally, the word "exemplary" means "serving as an example, instance, or illustration." Any embodiment or design described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments or designs. The terms "one or more" and "one or more" are used herein to refer to any embodiment or design. The term "or a plurality" is understood to include any integer number greater than or equal to 1, i.e., 1, 2, 3, 4, etc. The term "plurality" is understood to include any integer number greater than or equal to 2, i.e., 2, 3, 4, 5, etc. The term "connected" can include indirect "connected" and direct "connected."

[0182]

[0200] The present disclosure relates to "one embodiment," "one embodiment," "example embodiment," etc. References in the specification imply that the described embodiment may include a particular feature, structure, or characteristic, but that any and all embodiments may include that particular feature, structure, or characteristic. Moreover, such phrases do not necessarily refer to the same embodiment. Furthermore, when a particular feature, structure, or characteristic is described as being related to one embodiment, it is submitted that it is within the knowledge of one of ordinary skill in the art to preferentially use such feature, structure, or characteristic as being related to other embodiments, whether or not expressly described.

[0183]

[0201] For purposes of the description provided herein, the terms "upper," "lower," The terms "right", "left", "vertical", "horizontal", "top", "bottom" and their derivatives shall refer to the structures and methods described as oriented in the drawing figures. The terms "above", "atop", "on top", "located on" or "located on" mean that a first element, such as a first structure, is on a second element, such as a second structure, where an intervening element, such as an interface structure, may be between the first and second elements. The term "direct contact" means that a first element, such as a first structure, and a second element, such as a second structure, are connected at the interface of the two elements without any intermediate conductive, insulating, or semiconducting layers.

[0184]

[0202] Those skilled in the art will appreciate that the concepts, structures, devices, and techniques described herein It will be appreciated that the present invention may be embodied in other specific forms without departing from their spirit or essential concept or characteristics. The foregoing embodiments are therefore to be considered in all respects as illustrative rather than restrictive of the broad concepts sought to be protected. The scope of the concepts is thus indicated by the appended claims, rather than by the foregoing description, and all changes that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Claims

1. a first conductive plate having a first groove; a first high temperature superconductor (HTS) tape stack disposed within the first groove, the first HTS tape stack having a first plurality of turns; a second conductive plate having a second groove; a second HTS tape stack disposed in the second groove, the second HTS tape stack having a second plurality of turns; a conductive connection between the first HTS tape stack and the second HTS tape stack; at least one coolant channel cut into a surface of the first conductive plate and / or the second conductive plate; An apparatus comprising:

2. 10. The apparatus of claim 1, further comprising an insulator for electrically insulating the first conductive plate from the second conductive plate.

3. 2. The apparatus of claim 1, wherein the conductive connection is formed between an innermost turn of the first HTS tape stack and an innermost turn of the second HTS tape stack.

4. 2. The apparatus of claim 1, wherein the conductive connection is formed between an outermost turn of the first HTS tape stack and an outermost turn of the second HTS tape stack.

5. The apparatus of claim 1 , wherein the conductive connections comprise a metal that is not a superconductor at temperatures above 30 Kelvin.

6. The apparatus of claim 5 , wherein the metal comprises copper.

7. The apparatus of claim 6 , wherein the first conductive plate provides an electrical connection between each turn of the first plurality of turns.

8. The apparatus of claim 1 , wherein the first conductive plate comprises a metal or a metal alloy.

9. The apparatus of claim 8 , wherein the first conductive plate comprises steel.

10. The apparatus of claim 1 , wherein the first HTS tape stack comprises rare earth barium copper oxide.

11. 2. The apparatus of claim 1, wherein the first groove includes at least first and second turns, the first turn having a first width and the second turn having a second width, the second width being greater than the first width.

12. 12. The apparatus of claim 11, wherein the second turn of the first groove comprises a plurality of turns of the first HTS tape stack.

13. a first conductive plate having a first groove; a first high temperature superconductor (HTS) tape stack disposed within the first groove, the first HTS tape stack having a first plurality of turns; a second conductive plate having a second groove; a second HTS tape stack disposed in the second groove, the second HTS tape stack having a second plurality of turns; a conductive connection between the first HTS tape stack and the second HTS tape stack; at least one coolant channel cut into a surface of the first conductive plate and / or the second conductive plate; Equipped with the first conductive plate providing an electrical connection between each turn of the first plurality of turns; the second conductive plate providing an electrical connection between each turn of the second plurality of turns. magnet.

14. 14. The apparatus of claim 13, further comprising an insulator for electrically insulating the first conductive plate from the second conductive plate.

15. forming a first conductive plate having a first groove; disposing a first high temperature superconductor (HTS) tape stack into the first groove; forming a second conductive plate having a second groove; disposing a second HTS tape stack into the second groove; forming at least one coolant channel within a surface of the first conductive plate and / or the second conductive plate; electrically connecting the first HTS tape stack and the second HTS tape stack; A manufacturing method including:

16. The method of claim 15 , wherein forming the at least one coolant channel comprises cutting at least one coolant channel into the surface.

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