Non-contact dimensional measurement device with micrometer resolution

Abstract

The present invention relates to a non-contact dimension measurement device (1) with micrometer resolution suitable for measuring distances from an object (900) having at least one reflective surface (950). The non-contact dimension measurement device extends along an axis (XX) and includes a light source (2), a light barrier element (3), and a detection group (5). The light source generates a radiated light beam (Le) toward the object (900), causing the reflective surface (950) to generate a reflected light beam (Lr). The light barrier element is positioned opposite the light source and has at least one slit (30) that allows the reflected light beam (Lr) to pass only through the slit. The detection group includes an image sensor (50) that detects a projection (500) of the reflected light beam (Lr) passing through the slit (30), and a processing and control assembly (51) operably connected to the image sensor (50) and suitable for analyzing the projection (500) to determine the distance and characteristics of the reflective surface (950).

Description

Technical Field

[0001] The present invention relates to a non-contact dimensional measurement device having a micrometer resolution. Further, the present invention relates to a dimensional and / or product shape control system comprising a non-contact dimensional measurement device having at least one micrometer resolution.

Background Art

[0002] In particular, a "non-contact dimensional measurement device having a micrometer resolution" means that the device is suitable for measuring the distance between its position and an object, particularly between a reference plane or the surface of the object, with a resolution and accuracy on the order of micrometers over a measurement range from 1 millimeter to 100 millimeters.

[0003] Preferably, a similar definition of a "non-contact dimensional measurement device having a micrometer resolution" is also a "non-contact displacement transducer device having a micrometer resolution".

[0004] In further explaining the present invention, it should be noted that a non-contact dimensional measurement device having a micrometer resolution is related to the technical field of dimensional control devices for precision measurement in the industrial field.

[0005] In this regard, the dimensional control device is classified into a contact device and a non-contact device.

[0006] Both of the above categories are applicable not only to the dimensional measurement of mechanical parts but also to the field of manufacturing glass parts having both flat and curved surfaces. For example, this is applicable to the measurement of glass and other transparent materials and is applicable even for large sizes such as those used in the automotive, railway, or aviation industries. Precise verification of measurement characteristics is required both before being put on the market and during the manufacturing process.

Summary of the Invention

Problems to be Solved by the Invention

[0007] The contact device is characterized by a movable part that comes into contact with the surface of an object whose distance or size is to be measured during measurement.

[0008] Typical limitations of the contact device are inherent in its nature, i.e., its mode of operation.

[0009] In fact, it has been found that the contact between the movable part of the device and the surface can cause displacement and / or deformation of the object to be measured. Therefore, it may not guarantee accurate measurement and / or may damage the object itself.

[0010] Known non-contact devices can be classified into different types according to their operating principles.

[0011] The most important non-contact devices are of the optical type, i.e., those that use light as the measuring means. Such devices measure the distance from the object by analyzing the intensity of the reflected light beam, or by using laser triangulation technology, the confocal (monochromatic or polychromatic) method, or the principle of the interference method.

[0012] Non-contact devices solve the typical problems of the contact devices described above. However, known non-contact devices themselves exhibit a series of problems caused by both the measurement method and the nature and characteristics of the surface of the object on which the measurement is performed.

[0013] In particular, it is very difficult to perform non-contact optical dimensional measurement on an object having a transparent or translucent surface. For example, when the surface is transparent, laser triangulation cannot be used. For example, a detection sensor that analyzes the intensity of the reflected light beam as a useful signal for measuring distance is affected by errors caused by other physical quantities, such as the ambient temperature value and the reflectivity of the surface itself. For example, devices equipped with confocal sensors or interferometers overcome some of the above problems and limitations, but are very complex and expensive, and thus their use is limited for large-scale measurements in the industrial field.

[0014] In view of such a situation in the background art, there is a clear need for a non-contact dimensional measurement device having a micrometer resolution that can perform non-contact measurements and overcome the problems and limitations in known methods.

Means for Solving the Problem

[0015] An object of the present invention is to provide a non-contact dimensional measurement device having a micrometer resolution, which is easy to use, has high precision and high reliability, is cost-effective, and can be used in industrial measurement and advanced technology fields.

[0016] The above object is achieved by a non-contact dimensional measurement device having a micrometer resolution having the features described in claim 1. Similarly, such an object is also achieved by a dimension and / or product shape control system comprising a non-contact dimensional measurement device having a micrometer resolution described in claim 12.

[0017] The dependent claims show preferred variants relating to further advantageous aspects.

[0018] Further features and advantages of the present invention will become apparent from the following description of preferred embodiments provided as non-limiting examples with reference to the accompanying drawings.

Brief Description of the Drawings

[0019]

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Best Mode for Carrying Out the Invention

[0020] Referring to the accompanying drawings, a non-contact dimensional measurement apparatus having micrometer resolution according to the present invention is indicated by reference numeral 1.

[0021] The measuring apparatus 1 of the present invention is suitable for measuring the distance to an object 900 having a reflecting surface 950. Preferably, in the following discussion, the terms "object" or "product" are used as substantially synonymous terms.

[0022] Preferably, the object 900 is an object including at least one surface characterized by specular reflection, either wholly or in part.

[0023] Preferably, the object 900 is an object made of glass or other transparent or translucent material.

[0024] Preferably, the object 900 is a glass pane or sheet. In an embodiment where the object 900 is a plate or sheet made of a transparent or translucent material, such as glass, the object 900 has a first reflecting surface 950 on a first side and a second reflecting surface 955 on a second side. Preferably, the two reflecting surfaces represent the outer surfaces of the glass plate. Preferably, the first side is in a proximal position with respect to the non-contact dimensional measurement apparatus 1 having micrometer resolution, and the second side is in a distal position from the non-contact dimensional measurement apparatus 1 having micrometer resolution.

[0025] A further object of the present invention is to provide a dimension and / or product shape control system comprising at least one non-contact dimensional measurement apparatus 1 having micrometer resolution according to the present invention and suitable for verifying the conformity and characteristics of an object 900.

[0026] According to a preferred embodiment, the dimension and / or product shape control system comprises a support frame on which a plurality of dimension measuring devices with micrometer resolution are arranged. Preferably, the support frame is suitable for supporting the dimension measuring device 1 with micrometer resolution at respective preferred predetermined positions. Preferably, the plurality of dimension measuring devices with micrometer resolution can simultaneously detect the features of the object 900 at different locations.

[0027] According to a preferred embodiment, the dimension and / or product shape control system comprises a moving system equipped with one or more dimension measuring devices 1 with micrometer resolution to scan the object 900.

[0028] According to a preferred embodiment, the dimension and / or product shape control system can be particularly applied to the manufacturing industry of glass plate-like products, for example, the manufacturing industry of glass used in the automotive, railway, or aviation industries.

[0029] Preferably, the dimension and / or product shape control system is suitable for checking the characteristics of "glass" products as a whole. Preferably, the performed dimension and / or product shape control is suitable for checking the integrity, thickness, and possibly curvature and / or flatness of the glass.

[0030] According to the present invention, the non-contact dimension measuring device 1 with micrometer resolution extends along the axis X-X.

[0031] Preferably, as will be described in detail below, the axis X-X is also the axis along which the measurement is carried out.

[0032] Exemplarily, the non-contact dimensional measurement device 1 having a micrometer resolution measures the position of the object 900 along the axis X-X, and the object 900 is disposed at a distance included between 1 millimeter and 100 millimeters. Preferably, the object 900 is disposed at a distance included between 1 millimeter and 100 millimeters from the end of the non-contact dimensional measurement device 1 having a micrometer resolution.

[0033] According to the present invention, the non-contact dimensional measurement device 1 having a micrometer resolution includes a light source 2 that emits a radiation light beam "Le" toward the object 900.

[0034] Specifically, the light source 2 preferably emits the radiation light beam "Le" in a radiation direction substantially parallel to the axis X-X. In other words, the light source 2 emits a light beam that is incoherent and diverges along the axis X-X.

[0035] According to a preferred embodiment, the light source 2 is disposed on the axis X-X.

[0036] According to a preferred embodiment, the light source 2 is an LED.

[0037] According to a preferred embodiment, the light source 2 is a blue LED.

[0038] According to a preferred embodiment, the light source 2 is a blue LED in the form of a bare die.

[0039] According to the present invention, the light source 2 emits the radiation light beam "Le" toward the reflecting surface 950, whereby the reflecting surface 950 reflects the reflected light beam "Lr" along a reflection direction substantially opposite to the radiation direction.

[0040] Furthermore, according to the present invention, the non-contact dimensional measurement device 1 having a micrometer resolution includes a light barrier element 3 disposed on the side opposite to the radiation direction of the light source 2. In other words, the light barrier element 3 is suitable for preventing the passage of the reflected light beam "Lr".

[0041] Preferably, the light barrier element 3 is substantially flat and orthogonal to the axis X-X.

[0042] According to the present invention, the light barrier element 3 includes at least one slit 30 through which the reflected light beam "Lr" can pass. Preferably, the slit 30 extends through in a direction parallel to the axis X-X.

[0043] In other words, the light barrier element 3 prevents the passage of the reflected light beam "Lr" except for the passage of light, i.e., the space of at least one slit 30.

[0044] According to the present invention, the slit 30 is appropriately shaped.

[0045] According to a preferred embodiment, the slit 30 is substantially circular. In other words, the slit 30 extends substantially 360°. Preferably, the slit 30 is centered on the axis X-X.

[0046] Preferably, the slit 30 includes a first slit edge 31, which is preferably the inner edge, and a second slit edge 32, which is preferably the outer edge, and is defined by the first slit edge 31 and the second slit edge 32.

[0047] According to a preferred embodiment, the slit 30 has a width included between the first slit edge 31 and the second slit edge 32, and has a width between 5 micrometers and 500 micrometers. Preferably, the slit 30 has a width included between the first slit edge 31 and the second slit edge, and has a width between 10 micrometers and 100 micrometers.

[0048] According to the present invention, the non-contact dimensional measurement device 1 having micrometer resolution includes a detection group 5 suitable for detecting and analyzing the light beam passing through the slit 30.

[0049] The detection group 5 includes an image sensor (50), and in the image sensor (50), a projection 500 of the reflected light beam "Lr" passing through the slit 30 is detected.

[0050] According to a preferred embodiment, the projection 500 has a first projection edge 501 and a second projection edge 502 as a function of the shape of the slit 30.

[0051] For example, in a preferred embodiment, when the slit 30 has a substantially circular shape, the projection 500 detected by the image sensor 50 also has a substantially circular shape.

[0052] According to a preferred embodiment, the slit 30 is substantially circular. However, the shape of the slit 30 is not limited in the present invention.

[0053] According to a preferred embodiment, the image sensor 50 is a CMOS sensor.

[0054] According to a preferred embodiment, the CMOS sensor has an active area included between 1×1 square millimeter and 30×30 square millimeters. Preferably, the CMOS sensor has an active area included between 1×1 square millimeter and 10×10 square millimeters. Preferably, the CMOS sensor has an active area included between 1×1 square millimeter and 4×4 square millimeters. Preferably, the CMOS sensor has an active area of about 1.5×1.5 square millimeters.

[0055] According to a preferred embodiment, the image sensor 50 is arranged such that the center of the active area corresponds to the axis X-X.

[0056] Furthermore, the detection group 5 includes a processing and control assembly 51, and the processing and control assembly 51 is operably connected to the image sensor 50 and is suitable for analyzing the shape and position of the projection 500.

[0057] Preferably, the processing and control assembly 51 is suitable for identifying the distance and characteristics of the reflective surface 950 of the object 900 by analyzing the shape and position of the projection 500.

[0058] According to a preferred embodiment, the processing and control assembly 51 comprises a data conversion and transfer unit 51', and the data conversion and transfer unit 51' is operably connected to the detection sensor 50 and is suitable for reading and converting the data generated by the detection sensor 50.

[0059] Furthermore, the processing and control assembly 51 comprises a processing and control unit 51'', and the processing and control unit 51'' is operably connected to the data conversion and transfer unit 51' and is suitable for receiving the data read by the data conversion and transfer unit 51' and analyzing them, thereby verifying the shape and position of the projection 500.

[0060] According to a preferred embodiment, the non-contact dimensional measurement device 1 having micrometer resolution further comprises an optical group 4, and the optical group 4 is suitable for converging the reflected light beam "Lr" passing through the slit 30 towards the image sensor 50.

[0061] A schematic and simulated preferred embodiment of the optical group 4 is shown in the attached table. Except for the features described below, the optical group 4 is not limited to a specific embodiment.

[0062] According to a preferred embodiment, the optical group 4 comprises one or more lenses. Preferably, the lens is a spherical lens or an aspherical lens.

[0063] According to a preferred embodiment, the number of lenses included in the optical group 4 is as limited as possible.

[0064] Preferably, the optical group 4 can be designed to achieve a reasonable balance among the required performance, effect, size, and cost.

[0065] According to a preferred embodiment, the optical group 4 includes two spherical plano-convex lenses arranged axially apart.

[0066] According to a preferred embodiment, the optical group 4 includes a base surface 41 facing the object 900. Preferably, the base surface 41 is axially proximal to the object 900.

[0067] According to a preferred embodiment, the base surface 41 is planar. Preferably, the base surface 41 is perpendicular to the axis X-X.

[0068] According to a preferred embodiment, the light barrier element 30 is disposed on the base surface 41.

[0069] According to a preferred embodiment, the light source 2 and the light barrier element 3 are integrally connected.

[0070] Preferably, both of them are integrally connected to the optical group 4.

[0071] According to a preferred embodiment, the light barrier element 3 is made of metal.

[0072] According to a preferred embodiment, the light barrier element 3 is made of a conductive material. Preferably, the light barrier element 3 is suitable for supplying power to the light source 2 mounted thereon. Preferably, the light barrier element 3 is shaped such that the positive and negative electrodes operably connected to the light source 2 are distinguishable. According to a preferred embodiment, the light barrier element 3 is obtained by depositing at least one film of a material that is impermeable to light on the base surface 41.

[0073] Preferably, the light barrier element 3 includes at least one film of a conductive material. Preferably, the light barrier element 3 includes one or more films of a conductive metal material. Preferably, the operation of depositing at least one film of a material on the base surface 41 is performed by metallization operations.

[0074] Figure 10 shows a non-limiting example of a preferred embodiment of the optical group 4 (shown schematically), where the light barrier element 3 is integrally placed on the base surface 41 of the optical group 4, the LED light source 2 is attached to the light barrier element 3, and is electrically driven by the light barrier element 3. In such a preferred embodiment, the slit 30 is specially formed such that the positive electrode is separated from the negative electrode.

[0075] Furthermore, again in the preferred embodiment, the light source 2 is operably connected to the light barrier element 3 by die bonding and wire bonding techniques.

[0076] According to a preferred embodiment, the non-contact dimensional measurement device 1 having micrometer resolution is also suitable for detecting the thickness of the transparent object 900. In fact, the transparent object 900 has a reflecting surface 950 on the first side and a second reflecting surface 955 on the second side (or the opposite side).

[0077] In particular, the detection group 5 detects and analyzes the projection 500 by the reflecting surface 950 and the auxiliary projection 510 by the second reflecting surface 955 in the image sensor 50.

[0078] In fact, the auxiliary projection 510 preferably has a first auxiliary projection edge 511 and a second auxiliary projection edge 512.

[0079] In other words, when the emitted light beam "Le" is irradiated towards the transparent object 900, the non-contact dimensional measurement device 1 having micrometer resolution receives two reflected light beams "Lr", "Lr'". Among them, one reflected light beam "Lr" is due to the first reflecting surface 950, and the second reflected light beam "Lr'" is due to the second reflecting surface 955.

[0080] Several measurement situations are shown schematically in FIGS. 3 to 9 and represented graphically. In particular, these figures show the measurements by the non-contact dimensional measurement device 1 having micrometer resolution with a substantially circular slit 30.

[0081] Specifically, FIGS. 3 and 3A show a first measurement, in which the object 900, in particular its reflective surface 950, is located at a distance "d".

[0082] Regarding the first measurement situation, FIG. 7 shows the outline of the projection 500 in the image sensor 50. In particular, by a data processing and control assembly 51 that utilizes a specially configured image processing algorithm, the value of the radius of the projection 500 indicated by "R" is read, and this value correlates with the distance "d". Therefore, the required value of the distance "d" is determined by measuring the radius of the projection 500. In other words, the signals generated by the image sensor 50 are transmitted to the processing and control unit via a data conversion and transfer unit. Using these signals, the shape of the projection 500 can be reconstructed using an appropriate image processing algorithm, and the radius indicated by "R" can be identified.

[0083] FIGS. 4 and 4A show a second measurement situation, in which the object 900, in particular its reflective surface 950, is located at a distance "d'" that is different from the distance "d" in the previous figure. Referring to FIG. 4A, the difference between the first measurement situation shown in FIG. 3A and the second measurement situation is quite obvious.

[0084] FIGS. 5 and 5A show a third measurement situation, in which the object 900 is a transparent or translucent foil having a thickness "s" and is included between a first reflective surface 950 and a second reflective surface 955. The first reflective surface 950 is located at a distance "d" from the non-contact dimensional measurement device 1 with micrometer resolution, and the second reflective surface 955 is separated from the first reflective surface 950 by a thickness "s".

[0085] Regarding the third measurement situation, FIG. 8 shows images of the projection 500 and the auxiliary projection 510 in the image sensor 50. In particular, by the data processing and control assembly 51 that utilizes a specially configured image processing algorithm, the value of the distance existing between the two projections indicated by "S" is read, and this value correlates with the thickness "s" of the transparent type object 900. Therefore, the value of the required thickness "s" is specified by measuring the distance between the two projections. In other words, the signals generated by the image sensor 50 are transmitted to the processing and control unit via the data conversion and transfer unit. Using these signals, the shapes of the projection 500 and the auxiliary projection 510 can be reconstructed and the distance "S" can be calculated by utilizing a specially configured image processing algorithm.

[0086] Furthermore, FIGS. 6 and 6A show a fourth measurement situation, in which the object 900 is inclined with respect to the axis X-X or has a reflecting surface 950 inclined with respect to the axis X-X. In particular, the inclination angle is indicated by the angle "α".

[0087] Regarding the fourth measurement situation, FIG. 9 shows an image of the projection 500 obtained by the image sensor 50. The processing and control assembly 51 calculates the offset value "D" by utilizing a specially configured image processing algorithm. The offset value "D" is the difference between the position of the center of the projection 500 obtained from the object 900 inclined by the inclination angle "α" and the center of the projection 500 obtained without an inclination angle (i.e., "α" equal to zero). And the value of the required angle "α" is found by measuring the offset "D".

[0088] According to a preferred embodiment, the non-contact dimension measuring device 1 having a micrometer resolution includes a device body 6 extending along the axis X-X.

[0089] Preferably, the device body 6 defines a measurement end 60, and through the measurement end 60, the radiation light beam "Le" is emitted and the reflected light beam "Lr" is received.

[0090] According to a preferred embodiment, the apparatus main body 6 has a radial dimension included between 6 millimeters and 60 millimeters. Preferably, the apparatus main body 6 has a radial dimension included between 6 millimeters and 15 millimeters. Preferably, the apparatus main body 6 has a radial dimension of 8 millimeters.

[0091] According to a preferred embodiment, the apparatus main body 6 has an axially symmetric shape.

[0092] Preferably, the apparatus main body 6 has a cylindrical shape.

[0093] Preferably, the apparatus main body 6 has a tapered shape in a region near the measurement end 60 and spreads in a region axially distal from the measurement end.

[0094] According to a preferred embodiment, all of the aforementioned components are accommodated within the apparatus main body 6.

[0095] According to an alternative embodiment, all of the aforementioned components are accommodated within the apparatus main body 6, except for the processing and control unit 51'' which is arranged separately from the data conversion and transfer unit 51'. In such an embodiment, all of the aforementioned components suitable for performing detection are accommodated within the apparatus main body 6. The necessary analysis is performed by the remote processing and control unit 51, and the desired measurement is realized by a specially configured image processing algorithm.

[0096] According to a preferred embodiment, the apparatus main body 50 has an axial dimension included between 6 millimeters and 200 millimeters. According to a preferred embodiment, the axial distance between the optical barrier element 3 and the image sensor 50 is between 5 millimeters and 100 millimeters.

[0097] Innovatively, the non-contact dimension measurement apparatus having micrometer resolution according to the present invention, as well as the dimension and / or product shape control system, mainly satisfy the intended purpose by solving the problems encountered in typical state-of-the-art solutions.

[0098] Advantageously, the non-contact dimensional measurement device with micrometer resolution of the present invention is positioned as an alternative to the prior art contact or non-contact detection devices.

[0099] Advantageously, the non-contact dimensional measurement device with micrometer resolution is suitable for easily and reliably detecting the distance between itself and an object.

[0100] Advantageously, the non-contact dimensional measurement device with micrometer resolution is also suitable for easily and reliably detecting other characteristics of an object, such as the inclination of the object, particularly the inclination of a reflective surface.

[0101] Advantageously, the non-contact dimensional measurement device with micrometer resolution is suitable for detecting the thickness of a transparent or translucent object.

[0102] Advantageously, the non-contact dimensional measurement device with micrometer resolution is widely spread in the industrial field and is suitable for wide use.

[0103] Advantageously, a number of dimensional measurement devices with micrometer resolution are arranged at predetermined positions relative to each other or are moved by a special movement and scanning system, and are low-cost, but can be used to verify the size and shape of an object such as glass.

[0104] Advantageously, the non-contact dimensional measurement device with micrometer resolution has a limited number of components.

[0105] Advantageously, the non-contact dimensional measurement device with micrometer resolution has a very compact size. Advantageously, in a preferred embodiment, the light barrier element and the optical group are integrally connected.

[0106] Advantageously, in a preferred embodiment, the light barrier element is suitable for supplying power to the light source in addition to functioning as a barrier to reflected light.

[0107] It is obvious that those skilled in the art can make changes to the purpose of the present invention, and all of them are included within the scope of protection defined in the following claims in order to meet various needs.

Claims

1. A non-contact dimensional measurement device (1) having a micrometer resolution configured to measure the distance from an object (900) having at least one reflecting surface (950), The non-contact dimensional measurement device (1) having the micrometer resolution extends along an axis (X-X), (1) A light source (2) that generates a radiation light beam (Le) that is incoherent and diverges toward the object (900), thereby generating a reflected light beam (Lr) in a reflection direction substantially opposite to the radiation direction on the reflecting surface (950) of the object, the light source (2); (2) An optical barrier element (3) disposed on the side opposite to the radiation direction of the light source (2), the optical barrier element (3) having at least one formed slit (30), and the optical barrier element (3) allowing the reflected light beam (Lr) to pass only through the slit (30), the optical barrier element (3); (3) A detection group (5), An image sensor (50) that detects a projection (500) of the reflected light beam (Lr) passing through the slit (30), A processing and control assembly (51) operably connected to the image sensor (50) and configured to analyze the shape and position of the projection (500) to identify the distance and characteristics of the reflecting surface (950) of the object (900), Including the detection group (5), Comprising A non-contact dimensional measurement device (1) having a micrometer resolution.

2. Further comprising an optical group (4), The optical group (4) includes at least one spherical lens or aspherical lens, The optical group (4) is configured to propagate the reflected light beam (Lr) passing through the slit (30) toward the image sensor (50). The non-contact dimensional measurement device (1) having a micrometer resolution according to Claim 1.

3. The optical group (4) has a base surface (41), The base surface (41) is a plane and is disposed at a position close to the object (900), The optical barrier element (3) is disposed on the base surface (41). The non-contact dimensional measurement device (1) having a micrometer resolution according to Claim 2.

4. The light source (2) is disposed on the optical barrier element (3), The optical barrier element (3) is made of a conductive material and is configured to supply power to the light source (2). The non-contact dimensional measurement device (1) having a micrometer resolution according to any one of claims 1 to 3.

5. The light barrier element (3) is composed of at least one metal film material, The metal film material is deposited on the base surface (41) by a metal coating method, The non-contact dimensional measurement device (1) having a micrometer resolution according to claim 3.

6. The slit (30) includes a first slit edge (31) and a second slit edge (32), and the projection (500) of the reflected light has a first projection edge (501) and a second projection edge (502). The non-contact dimensional measurement device (1) having a micrometer resolution according to any one of claims 1 to 5.

7. Configured to detect the thickness of a transparent or translucent object (900), The object (900) has a reflecting surface (950) on a first side and a second reflecting surface (955) on a second side, In the image sensor (50), the thickness is detected by detecting a projection (500) generated by the reflecting surface (950) and an auxiliary projection (510) generated by the second reflecting surface (955). The non-contact dimensional measurement device (1) having a micrometer resolution according to any one of claims 1 to 6.

8. The auxiliary projection (510) by the reflecting surface has a first auxiliary projection edge (511) and a second auxiliary projection edge (512). The non-contact dimensional measurement device (1) having a micrometer resolution according to claim 7.

9. The light source (2), the light barrier element (3), and the image sensor (50) are arranged around the axis (X-X), The slit (30) is shaped symmetrically with respect to the axis (X-X). The non-contact dimensional measurement device (1) having a micrometer resolution according to any one of claims 1 to 8.

10. By detecting an offset value (D) that is the difference between the position of the center of the projection (500) obtained with the object (900) tilted at an inclination angle (α) and the position of the center of the projection (500) obtained with the inclination angle (α) set to zero. The non-contact dimensional measurement device (1) having micrometer resolution according to any one of claims 1 to 9, configured to detect the inclination angle (α) of the object (900) or the reflecting surface (950) of the object (900) with respect to the axis (X-X).

11. The image sensor (50) is a CMOS image sensor. The non-contact dimensional measurement device (1) having micrometer resolution according to any one of claims 1 to 10.

12. Comprising a device main body (6). The device main body (6) extends along the axis (X-X) and defines a measurement end (60). Through the measurement end (60), the emitted light beam (Le) is emitted and the reflected light beam (Lr) is received. The non-contact dimensional measurement device (1) having micrometer resolution according to any one of claims 1 to 11.

13. The device main body (6) has a radial dimension between 6 millimeters and 60 millimeters. The non-contact dimensional measurement device (1) having micrometer resolution according to claim 12.

14. A dimension and / or product shape control system configured to verify the conformity and characteristics of an object (900) having a reflecting surface (950), wherein the object (900) is a product made of a transparent or translucent material. Comprising at least one of the non-contact dimensional measurement devices (1) having the micrometer resolution according to any one of claims 1 to 13. Dimension and / or product shape control system.

15. Comprising a support frame. On the support frame, a plurality of the dimensional measurement devices (1) having micrometer resolution are arranged to simultaneously detect a plurality of characteristics of the object (900) at different locations. The dimension and / or product shape control system according to claim 14.

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