Production management device, production system

Abstract

To reduce the tuning man-hours for component data.SOLUTION: In a production management device 10 communicatively connected to a plurality of mounting devices 3A to 3D, the plurality of mounting devices 3A to 3D pick up, recognize, and mount a component W on the substrate according to pieces of component data 17A to 17D set for each component type, the production management device 10 compares production performance data 18A to 18D of the plurality of mounting devices 3A to 3D, and updates the pieces of component data 17A, 17C, and 17D of the mounting devices 3A, 3C, and 3D with low production results to the component data 17B of the mounting device 3B with high production results.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a technique for tuning component data for a mounting device. [Background technology]

[0002] The mounting device has a mounting head that picks up components, and picks up, recognizes, and places the components in accordance with component data set for each component type. Patent Document 1 is an example of a document related to mounting devices. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2016-018940 A Summary of the Invention [Problem to be solved by the invention]

[0004] The pickup accuracy, recognition accuracy, and mounting accuracy of components are closely related to the component data, and it is desirable to modify the component data as necessary.

[0005] However, tuning part data requires experience and skill, and inexperienced workers may not be able to tune it well. Also, tuning requires a lot of man-hours, which can make it difficult to start production. [Means for solving the problem]

[0006] A production management device communicably connected to a plurality of mounting devices, the plurality of mounting devices pick up, recognize, and attach components to a board according to component data set for each component type, and the production management device compares the production performance data of the plurality of mounting devices and updates the component data of a mounting device with a low production performance to the component data of a mounting device with a high production performance. With this configuration, it is possible to improve production performance while reducing the amount of work required for tuning the component data.

[0007] The production management device may include a database and a management computer, the database storing component data and production performance data of the plurality of mounting devices, and the management computer may refer to the database to identify a mounting device with a high production performance, and transmit the component data of the mounting device with a low production performance to an instructing the mounting device with a low production performance to update the component data to be used in the next production.

[0008] The part data may be a collection of a first parameter related to pickup, a second parameter related to recognition, and a third parameter related to mounting.

[0009] When there is a difference in production performance data regarding pickup between the plurality of mounting devices, the first parameter of the mounting device with a low production performance may be updated to the first parameter of the mounting device with a high production performance. With this configuration, it is possible to improve the component pickup rate.

[0010] When there is a difference in the production performance data related to recognition between the plurality of mounting devices, the second parameter of the mounting device with a low production performance may be updated to the second parameter of the mounting device with a high production performance. With this configuration, it is possible to improve the recognition rate of components.

[0011] When there is a difference in production performance data regarding placement between the plurality of mounting devices, the third parameter of the mounting device with a low production performance may be updated to the third parameter of the mounting device with a high production performance. With this configuration, it is possible to improve the component placement rate.

[0012] When an inspection device that inspects a produced board detects an error, the production performance data of a mounting device having a check function related to the error among the multiple mounting devices may be adjusted to be higher. In this configuration, component data of a mounting device having a check function is more likely to be selected, so that errors during production can be reduced.

[0013] When there is no difference in component data but there is a difference in production performance data for the multiple mounting devices, the mounting device with the lower production performance may be instructed to check or adjust the device data specific to each mounting device. With this configuration, it is possible to prompt the user to check and adjust the device data, and it is possible to prevent the device data from remaining unchecked and unadjusted.

[0014] The device data may be a collection of a first device parameter related to adsorption and a second device parameter related to recognition.

[0015] When there is no difference in component data for the plurality of mounting devices, but there is a difference in the production performance data related to pickup, the mounting device with the lower production performance related to pickup may be instructed to check or adjust the first device parameters. With this configuration, it is possible to prevent a decrease in production performance due to failure to check or adjust the first device data.

[0016] When there is no difference in component data for the plurality of mounting devices, but there is a difference in the production performance data related to recognition, the mounting device with a lower production performance related to recognition may be instructed to check or adjust the second device parameters. With this configuration, it is possible to prevent a decrease in production performance due to non-checking or non-adjusting the second device data.

[0017] The production system includes a plurality of mounting devices, an inspection device that inspects produced boards, and any one of the production management devices described above.

[0018] When updating component data, the production management device or the mounting device may store the component data before the update, and if the production performance data after the component data update is lower than before the update, the component data of the mounting device may be restored to the data before the update. In this configuration, it is possible to select component data suitable for each mounting device, and it is possible to suppress a decrease in production performance due to individual differences in mounting devices.

[0019] The production management device may have a first display unit. The first display unit may display component data and production performance data history of the multiple mounting devices. In this configuration, it becomes easier to determine whether boards are being produced efficiently from the display of the history.

[0020] In addition to the first display unit, the second display unit of the mounting device may display component data and production performance data history of the mounting device. In this configuration, the component data and production performance history can be checked on either the production management device or the mounting device.

[0021] The production management device may have a first display unit. The first display unit may display a history of device data of the plurality of mounting devices. In this configuration, it becomes easier to determine from the display of the history whether adjustments and maintenance of the devices are being performed appropriately.

[0022] In addition to the first display unit, the second display unit of the mounting device may display the history of the device data of the mounting device. In this configuration, the history of the device data can be checked on both the production management device and the mounting device. Effect of the Invention

[0023] According to the present invention, it is possible to reduce the number of tuning steps for component data. [Brief description of the drawings]

[0024] [Figure 1] Production system block diagram [Diagram 2] Parts data illustration [Diagram 3] Flowchart of automatic part data update process [Figure 4] Diagram of automatic part data update process [Diagram 5] Diagram of automatic part data update process [Figure 6] Plan view of mounting device [Figure 7] Diagram showing the mounting head support structure [Figure 8] Block diagram of mounting device [Figure 9] A diagram showing the support structure of the camera unit. [Figure 10] Parts data illustration [Figure 11] Parts data illustration [Figure 12] Flowchart of automatic part data update process [Figure 13] Re-update process flowchart [Figure 14] Example of production results [Figure 15] Parts data display example [Figure 16] Example of device data display [Figure 17] Flowchart of automatic part data update process [Figure 18] Adjustment process subroutine DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0025] <Embodiment 1> 1. Configuration of Production System PS 1 is a system configuration diagram of a production system PS. The production system PS is a system made up of a production management device 10 and multiple production lines L (in this example, two lines, L1 and L2).

[0026] The production line L is composed of, for example, a printing machine 1, multiple mounting devices 3A and 3B, and an inspection device 5. Each of these devices is connected by a conveyor 7, which transports the boards P that have completed processing from the device on the upstream side (the left side of FIG. 1) to the device on the downstream side (the right side of FIG. 1) in sequence.

[0027] The printer 1 is a device that prints solder paste onto a pattern on the substrate P. The mounting device 3 is a device that places components W on the substrate P after the printing process.

[0028] The reason why a plurality of mounting devices 3 are provided on one production line L is that the task of mounting components W on the board P is shared among the plurality of mounting devices 3. The inspection device 5 is a device that inspects the mounting state of the components W on the board P.

[0029] If the inspection finds that there is no abnormality in the mounting state of the components W, the substrate P proceeds to the reflow process, but if there is an abnormality, the substrate P is treated as a defective substrate.

[0030] The production management device 10 is communicably connected to the devices 1, 3, and 5 of the production line L via a wired or wireless communication network 9.

[0031] The production management device 10 is a management device for the production line L, and is composed of a management computer 11 having a first display unit 12, and a database 15. The management computer 11 is equipped with a CPU and a memory. The database 15 stores various data necessary for the production of the substrate P.

[0032] The first display unit 12 is a display device such as a liquid crystal panel or a touch panel, and displays the status of the production line L and the mounting device 3 as well as various data stored in the database 15.

[0033] 2. Part types and part data A large number of components W, including chip resistors, capacitors, ICs, and the like, as well as components of the same component type but with different part numbers, are mounted on the substrate P. As shown in FIG. 2, the database 15 stores initial values ​​of component data 17 for each component type (different product types and part numbers).

[0034] The component data 17 is data for performing the "pickup operation," "recognition operation," and "mounting operation" of the component W in the mounting device 3, and is a collection of the following parameters (A) to (C).

[0035] (A) First parameter 171 regarding the suction of part W (B) Second parameter 172 for recognition of part W (C) Third parameter 173 regarding the installation of part W

[0036] "Suck" means to suck up and remove a component W supplied by component supply device 31 using mounting head 40. "Recognize" means to image-recognize the state of the component W sucked up by mounting head 40 using imaging means such as a camera. "Mount" means to mount a component W removed from component supply device 31 onto board P using mounting head 40.

[0037] 2, each mounting device 3 reads out component data 17 from database 15 before starting production of board P. For example, when two kinds of components, component type A and component type B, are to be mounted on board P, "component data 17" for each component type is read out. Then, for each component type, mounting, recognition, and mounting of components W are performed using the read component data 17.

[0038] 3. Tuning of part data 17 The pickup accuracy, recognition accuracy, and mounting accuracy of the component W are closely related to the component data 17, and it is desirable to correct the component data 17 as necessary.

[0039] For example, if a pickup failure occurs with a component W during production, the worker must improve the pickup accuracy by correcting or changing the component data 17 used in production with that mounting device 3. Also, if the expected pickup accuracy is not achieved at the end of production, it is desirable to correct or change the component data 17. The same applies to recognition accuracy and mounting accuracy.

[0040] However, tuning the part data 17 requires experience and skill, and an inexperienced worker may not be able to tune it well. Also, tuning requires a lot of man-hours, and it may take a long time to start production.

[0041] 4. Automatic updating of parts data based on production results 3 is a flowchart of the automatic update process of component data 17. "X1" is a process executed by mounting apparatus 3 on each production line L during production of board P, and "X2" is a process executed by production management apparatus 10 after production is completed.

[0042] Incidentally, production means manufacturing a component-mounted board P by mounting components W on a board P on which no components are mounted.

[0043] When production starts, each mounting device 3 picks up, recognizes, and places components W on the board P. Then, when the number of boards P produced reaches a predetermined production number (for example, 100 boards in one production run), production ends. Then, when production ends, production performance data 18 is tallied for each component type, and the following data is sent to database 15.

[0044] (a) Production performance data 18 (b) Parts data at the time of end of production17

[0045] 4, "18A" is the production performance data of the mounting apparatus 3A, "18B" is the production performance data of the mounting apparatus 3B, "18C" is the production performance data of the mounting apparatus 3C, and "18D" is the production performance data of the mounting apparatus 3D.

[0046] When the production performance data 18A-18D are transmitted from each of the mounting apparatuses 3A-3D to the database 15, the management computer 11 accesses the database 15 and compares the production performance data 18A-18D of each of the mounting apparatuses 3A-3D, and then identifies the mounting apparatus 3 with the highest production performance (S10, 20).

[0047] Management computer 11 then executes (S30A) an automatic update process for component data 17. The automatic update process is made up of two steps, S31 and S33, and is executed for each component type for all mounting devices 3A-3D included in production system PS.

[0048] In S31, the component data 17 of the mounting devices 3A to 3D with the lowest production performance data 18 is compared with the component data 17 of the mounting device 3 with the highest performance.

[0049] If there is a difference in the component data 17 (S31: NO), the process proceeds to S33, and the component data 17 of the best-performing mounting device 3 is transmitted to that mounting device 3, and an instruction is issued to update the component data 17. If the component data 17 matches (S31: YES), S33 is skipped.

[0050] With regard to whether or not there is a difference in the part data 17, it may be determined that there is a difference if there is even a slight difference, or that there is a difference if the difference exceeds a certain range.

[0051] When each mounting device 3 receives an update instruction from the management computer 11 , it rewrites the data in the memory 103 and updates the component data 17 to be used in the next production to the component data 17 received from the management computer 11 .

[0052] In this example, mounting device 3B has the best production performance, and component data 17A, 17C, and 17D of mounting devices 3A, 3C, and 3D, which have low production performance, are automatically updated to component data 17B of mounting device 3B (see FIGS. 4 and 5). Note that the update cycle of component data 17 may be one production cycle (a predetermined number of productions, such as 100 boards) or several production cycles.

[0053] By automatically updating the part data 17, the man-hours required for tuning the part data 17 can be reduced, and production efficiency can be improved.

[0054] Hereinafter, the configurations of the mounting device 3 and the inspection device 5 will be briefly described with reference to FIG. 6, and then the component data 17 and the production performance data 18 will be described.

[0055] 5. Configuration of Mounting Device 3 As shown in FIG. 6, the mounting device 3 includes a base 30, four component supply devices 31, a conveyor 32, a head unit 33, an X-beam 41, a Y-beam 42, a head movement unit 34, a board camera 35, two component cameras 36, a side camera 37, a second display unit 110 (see FIG. 8), and the like.

[0056] The board P is transported from the upstream side (the left side in FIG. 6) by the conveyor 32, and when mounting of the components W is completed at the work position 38, it is transported downstream (the right side in FIG. 6).

[0057] A plurality of feeders 39 are attached to the component supply device 31. Each feeder 39 supplies a component W to be mounted on the board P.

[0058] The head unit 33 supports a plurality of mounting heads 40 so that the mounting heads 40 can move up and down and rotate around an axis.

[0059] The X beam 41 supports the head unit 33 so that it can move back and forth in the X-axis direction. The Y beam 42 supports the X beam 41 so that it can move back and forth in the Y-axis direction.

[0060] Head moving section 34 includes an X-axis servo motor 34X that moves head unit 33 in the X-axis direction relative to X beam 41, and a Y-axis servo motor 34Y that moves X beam 41 in the Y direction relative to Y beam 42.

[0061] The head unit 33 can be moved to any position on the base 30 by being driven by an X-axis servo motor 34X and a Y-axis servo motor 34Y.

[0062] 7, the mounting head 40 includes an axial head shaft 45 and a suction nozzle 46. The head shaft 45 is hollow and has an air supply path provided at its central axis. The suction nozzle 46 is detachably attached to the tip (lower end) of the head shaft 45.

[0063] Negative pressure and positive pressure are supplied to the suction nozzle 46 from an air supply device (not shown) via the head shaft 45. The mounting head 40 can suck up the component W using the suction nozzle 46 by supplying negative pressure, and release the sucked component W by supplying positive pressure.

[0064] The mounting head 40 is equipped with a pressure sensor inside the head shaft 45. When the mounting head 40 is properly suctioning the component W, the inside of the head shaft is at negative pressure, and when the mounting head 40 is not suctioning the component W, the inside of the head shaft is at positive pressure. Therefore, it is possible to determine whether the mounting head 40 has successfully sucked the component W from the pressure measurement value of the pressure sensor.

[0065] The board camera 35 is attached to the side of the head unit 33 and has an imaging element such as an image sensor, lighting such as LEDs, an optical system that forms an image of light reflected from an object to be imaged on the light receiving surface of the imaging element, etc. The component camera 36 and the side camera 37 are also configured in a similar manner.

[0066] The imaging surface of the board camera 35 faces downwards, and captures an image from above of the board P. By recognizing the fiducial marks of the board P from the image of the board camera 35, the position of the board P with respect to the base 30 can be determined.

[0067] The component camera 36 is attached to the base 30 with the imaging surface facing upward, and captures an image of the component W picked up by the mounting head 40 from below. The image of the component W picked up by the component camera 36 is used to determine the pickup state (pickup position and pickup angle) of the component W relative to the mounting head 40, etc.

[0068] The side camera 37 is attached to the X-beam 41 with its imaging surface facing horizontally (see FIG. 7), and captures an image of the component W picked up by the mounting head 40 from the side. The image of the component W picked up by the side camera 37 is used to determine whether the pickup operation was successful (whether or not the component W is held by the mounting head 40), etc.

[0069] 8 is a block diagram showing an electrical configuration of the mounting apparatus 3. The controller 100 is a control device for the mounting apparatus 3. The controller 100 has a CPU 101 and a memory 103.

[0070] The controller 100 is connected to various devices such as the transport conveyor 32, the motor control unit 105, the board camera 35, the component camera 36, ​​the side camera 37, the second display unit 110, and the operation panel 115.

[0071] The memory 103 stores a mounting program for executing the mounting work of components W on the board P, and a transport program for the board P. The memory 103 also stores component data 107, production performance data 108, and device data 109.

[0072] The second display unit 110 is a display device such as a liquid crystal panel or a touch panel, and in addition to displaying information related to the operating status of the mounting device 3, displays images captured by a camera, component data 17 and production performance data 18, which will be described later.

[0073] The controller 100 is communicably connected to the production management device 10, and transmits and receives various information required for the production of the substrate P between the production management device 10 and the controller 100.

[0074] After starting production of the board P, the controller 100 controls the transport conveyor 32 and the head unit 33 in accordance with the transport program and the mounting program to send the board P to the work position in the center of the base, and perform the mounting work of the component B.

[0075] 6. Configuration of Inspection Device 5 The inspection device 5 is a device that inspects the mounting state of the component W on the board P. As shown in Fig. 9, the inspection device 5 is equipped with an inspection camera unit 50. The inspection device 5 has a camera moving unit 51 having a configuration similar to that of the head moving unit 34, and moves the camera unit 50 in the X-axis direction and the Y-axis direction within a movable range.

[0076] The camera unit 50 has an inspection camera 52 that captures an image below. The inspection camera 52 has an imaging element such as an image sensor, lighting such as an LED directed toward the substrate P, and an optical system that forms an image of light emitted from the lighting and reflected by the substrate P and the component W on the light receiving surface of the imaging element.

[0077] The inspection device 5 moves the inspection camera 52 above the component W to capture an image, and inspects the mounting state of the component W on the board P based on the captured image.

[0078] The inspection device 5 judges whether the amount of deviation and the rotation angle of the mounting position of the component W relative to the board P are within the allowable range. If the amount of deviation and the rotation angle are within the allowable range, it is judged as "normal", and if they are outside the allowable range, it is judged as "improper mounting". In addition, if the component W is not mounted at the mounting position, it is also judged as "improper mounting".

[0079] 7. Parts Data As shown in FIG. 10, the part data 17 includes a first parameter 171, a second parameter 172, and a third parameter 173.

[0080] The first parameters 171 are parameters related to the "suction operation" of the component W by the mounting head 40, and in this embodiment include information such as "suction speed", "suction height", "nozzle type", and "negative pressure check level".

[0081] "Pickup speed" is the vertical movement speed of mounting head 40 during pick-up. "Pick-up height" is the height (Z coordinate) of the tip of suction nozzle 46 when picking up component W. "Negative pressure check level" is a threshold value for determining whether mounting head 40 is picking up component W.

[0082] In this embodiment, four pieces of information are exemplified as the first parameter 171, but it is not necessary to include all four pieces of information, and only some of the information may be included. Also, the information included in the first parameter 171 may be other information as long as it is information that affects the adsorption operation. The same applies to the second parameter 172 and the third parameter 173 described below.

[0083] The second parameters 172 are parameters related to the "recognition operation" of the part W by the cameras 36, 37. The second parameters 172 include information such as "lighting settings", "threshold", and "part shape". The "lighting settings" are information on the lighting settings at the time of capturing an image. The "threshold" is information used to determine the contour when recognizing the part W in the image.

[0084] The third parameters 173 are parameters related to the "placing operation" of the components W by the mounting head 40, and include information such as "placing height", "placing timer", and "placing speed".

[0085] "Placement height" is the distance from the board P to the suction nozzle 46 when placing the component W. "Placement timer" is the time for which the placement height is maintained when placing the component W. "Placement speed" is the vertical movement speed of the suction nozzle 46 when placing.

[0086] 8. Production performance data The production performance data 18 is recorded for each component type in each mounting device 3, with one production run (e.g., 100 boards) being one cycle. The production performance data 18 is data that records the "number of attempts" and the "number of successes" for each operation of picking up, recognizing, and mounting components W.

[0087] The success or failure of the suction operation (whether the component W was successfully taken out from the component supply device 31) can be determined from the measurement value of the pressure sensor provided on the head shaft 45. The success or failure of the suction operation can also be determined from the recognition result of the component W by the side camera 37.

[0088] The success or failure of the recognition operation (whether an image capable of recognizing the part W has been acquired) can be determined by analyzing the brightness of the images captured by the part camera 36 and the side camera 37.

[0089] During production, each mounting device 3 collects data on the success or failure of the pickup operation and recognition operation, and records the results for each component type in memory 103. Then, after production is completed, the CPU 101 of each mounting device 3 calculates the pickup rate and recognition rate of component W for each component type based on the data stored in memory 103.

[0090] The pickup rate is the success rate [%] of pickup of component W, and can be calculated using the following formula.

[0091] Adsorption rate = (number of successful adsorption attempts) / (number of adsorption attempts) x 100

[0092] For example, in one production run, if there are 10,000 pickup attempts and 9,800 of them are successful, the pickup rate is 9,800 / 10,000×100=98.00[%].

[0093] The recognition rate is the success rate of recognition of part W, and can be calculated by the following formula.

[0094] Recognition rate = (number of successful recognitions) / (number of recognition attempts) x 100

[0095] The pick-up rate and the recognition rate are indices for converting the production performance data 18 into a score.

[0096] When each mounting device 3 completes one production run (for example, 100 boards), it transmits production performance data (including pick-up rate and recognition rate) 18 for each component type to database 15. This allows the production performance data (including data on "pick-up rate" and "recognition rate") 18 of each mounting device 3 to be aggregated in database 15.

[0097] As a result of the above, after production is completed, the management computer 11 becomes able to execute the processes of S20 to S30, and can automatically update the component data 17 of a mounting device 3 with a low production record to the component data 17 of a mounting device 3 with a high production record.

[0098] Specifically, if there is a difference in "pickup rate" among the mounting devices 3A to 3D, the first parameter 171 of the mounting device 3 with the lower pick-up rate is updated to the first parameter 171 of the mounting device 3 with the highest pick-up rate.

[0099] Furthermore, if there is a difference in the "recognition rate," the second parameter 172 of the mounting device 3 with the lower recognition rate is updated to the second parameter 172 of the mounting device 3 with the highest recognition rate.

[0100] By updating the first parameter 171 and the second parameter 172, it is expected that the pick-up rate and the recognition rate will be improved in the next production.

[0101] When the component data 17 is updated, each of the mounting devices 3A to 3D starts tallying up the production performance data 18 anew.

[0102] Then, after production is completed, when the latest production performance data 18 is transmitted from each of the mounting devices 3A-3D to the database 15, the management computer 11 accesses the database 15 and compares the latest production performance data 18. If there is a difference in the production performance data 18, the management computer 11 instructs the mounting device 3 with the lowest production performance to update the component data 17.

[0103] By repeating the cycle of "collecting production performance data" and "updating component data," it is possible to keep the component data 17A to 17D of each mounting device 3A to 3D in an optimal state, making it possible to dramatically improve production performance.

[0104] <Embodiment 2> When the production of the substrates P (for example, 100 substrates) is completed, the inspection device 5 transmits data on the inspection results of the produced substrates P to the database 15.

[0105] The management computer 11 judges, from the inspection results of the inspection device 5, whether or not there is a mounting defect of the component W on the board P for each component type.

[0106] When there is a mounting defect of the component W, the management computer 11 calculates the mounting rate of the component W for each of the mounting devices 3A to 3D from the data collected based on the inspection result of the inspection device 5.

[0107] The mounting rate is the rate at which components W are successfully mounted on a board P, and can be calculated using the following formula:

[0108] Attachment rate = (number of successful attachments) / (number of attachment attempts) x 100 The mounting rate is an index for converting the production performance data 18 into a score.

[0109] If there is a difference in the mounting rates among the mounting devices 3A-3D, the management computer 11 sends a command to each of the mounting devices 3A-3D to update the third parameter of the mounting device 3 with the lower mounting rate to the third parameter 173 of the mounting device 3 with the highest mounting rate. By updating the third parameter 173, an improvement in the mounting rate can be expected in the next production run.

[0110] <Embodiment 3> One of the inspection items of the inspection device 5 is the detection of errors such as "wrong orientation" or "upside down" for the components W mounted on the board P.

[0111] "Wrong orientation" refers to placing the component W in the wrong direction, resulting in incorrect polarity of the terminals or electrodes. "Upside-down" refers to placing the component W upside-down. When these errors occur, the board P is treated as a defective board, resulting in a drop in production performance.

[0112] As shown in FIG. 11, the third parameter 173 of the part data 17 includes the items "direction determination ON / OFF" and "side view determination ON / OFF."

[0113] "Orientation determination" is a function that recognizes the orientation and front and back of the component W from the image taken by the component camera 36 when mounting the component on the board P, and determines whether there are any errors.

[0114] The "side view determination" is a function for determining, from the image from the side camera 37, whether or not a component W held by the mounting head 40 is present, and whether or not it is upside down.

[0115] If these items are ON, the direction, front / back, and presence / absence of the component W are checked before the mounting operation on the board P is executed. These items can be switched ON / OFF for each mounting device 3.

[0116] In embodiment 3, when the inspection device 5 detects an error such as "wrong polarity" or "upside down", the score of the production performance data 18 of the mounting device 3 whose check function is set to ON is adjusted to be higher than the actual score of that mounting device 3.

[0117] For example, in the following case, the production performance (placement rate) of the mounting device 3A is adjusted from 97% (actual score) to 98%, and the production performance (placement rate) of the mounting device 3D is adjusted from 95% (actual score) to 96%.

[0118] Mounting device 3A (with check function): Mounting rate 97% to 98% Mounting device 3B (without checking function): Mounting rate 97% Mounting device 3C (without checking function): Mounting rate 94% Mounting device 3D (with checking function): Mounting rate 95% to 96%

[0119] By adjusting the score of the production performance data 18 of the mounting device 3 whose check function is set to ON higher, the third parameter 173 of the mounting device 3 whose check function is set to ON is more likely to be selected when updating the third parameter 173. This makes it possible to reduce the occurrence of defective boards and improve production performance.

[0120] The adjustment of the production performance may be performed when the scores of the production performance data 18 of the "mounting device 3 with a check function" and the production performance data 18 of the "mounting device 3 without a check function" are the same (when the mounting rates are the same). Also, the adjustment may be performed regardless of whether they are the same or not.

[0121] <Embodiment 4> If there is no difference in the component data 17 of each mounting device 3, there should be no difference in the production performance data 18. However, if the device data 19 of each mounting device 3 is different, there may be a difference in the production performance data 18 even if there is no difference in the component data 17. The device data 19 is setting information specific to the mounting device.

[0122] In this embodiment, when a difference occurs in the production performance data 18 of each mounting device 3 due to a difference in the device data 19, confirmation and updating of the device data 19 is instructed to improve the production performance.

[0123] FIG. 12 is a flowchart of the automatic update process of the part data 17, and two steps S35 and S37 are added to the automatic update process (FIG. 3) of the first embodiment.

[0124] S35 is executed when it is determined in S31 that there is no difference in the component data 17. When proceeding to S35, the management computer 11 compares the production performance data 18 of the mounting device 3 with the lowest production performance with the production performance data 18 of the mounting device 3 with the highest performance.

[0125] If there is a difference between the two data 18 (S35: NO), the management computer 11 instructs the mounting device 3 with the poor production performance to check and adjust the device data 19 (S37). The specific contents of the device data 19 and the check and adjustment will be described later.

[0126] If there is no difference in the production result data 18 (S35: YES), the flow ends without checking and adjusting the equipment data 19.

[0127] In the fourth embodiment, when a difference occurs in the production performance data 18 due to a difference in the equipment data 19, the equipment data 19 can be confirmed and adjusted in each mounting device 3, so that the number of steps required for tuning the equipment data 19 can be reduced, and production efficiency can be improved.

[0128] The details of the device data 19 and a method for adjusting the same will be briefly described below. The device data 19 includes, for example, the following parameters (A) and (B). (A) First device parameter 19A related to component pickup (B) Second device parameters related to part recognition 19B

[0129] The first device parameters 19A include items such as (1) nozzle check, (2) suction position correction amount, and (3) vacuum pressure check.

[0130] (1) The nozzle check is a check of the shape and dirt, in which the suction nozzle 46 is imaged by the side camera 37, and the shape of the suction nozzle 46 is obtained from the obtained image. If there is an error in the registered shape, the registered shape (length, etc.) of the suction nozzle 46 is updated. In addition, the obtained image is used to check for dirt on the suction nozzle 46. If the suction nozzle 46 is dirty, a notice that the suction nozzle 46 is dirty is sent to the worker, urging them to perform maintenance on the suction nozzle 46.

[0131] (2) The correction amount of the pickup position is the correction amount of the pickup position when the mounting head 40 is used to pick up components W from the feeder 39 (to correct the deviation in the relative position of the mounting head 40 with respect to the feeder 39). The correction amount can be calculated by recognizing the reference mark of the feeder 39 with the board camera 35 and confirming the position deviation of the feeder 39 with respect to the base 30 from the result.

[0132] (3) The vacuum pressure can be checked by suctioning the component W with the mounting head 40 and measuring the vacuum pressure.

[0133] Each of the mounting devices 3A to 3D is configured to be able to automatically check and adjust each of the items (1) to (3) by using an adjustment utility (software).

[0134] In this embodiment, three items are exemplified as the first device parameters 19A, but it is not necessary to include all three items, and only some of the items may be included. Furthermore, the information included in the first device parameters 19A may be other information as long as it is information specific to the device and affects the adsorption operation. The same applies to the second device parameters 19B described below.

[0135] The second device parameters 19B are setting information related to adjustment of the brightness of the lighting of each of the cameras 36 and 37. Specifically, the setting information is the current value and voltage value applied to the lighting.

[0136] The brightness of the lighting can be checked, for example, by photographing a specific object with the cameras 35-37 of each mounting device and checking the brightness of the image. By adjusting the current and voltage applied to the lighting so that a specific brightness is obtained, the brightness of the lighting can be maintained regardless of deterioration over time or use.

[0137] <Embodiment 5> In the first embodiment, component data 17A, 17C, 17D of mounting devices 3A, 3C, 3D with low production records are updated to component data 17B of mounting device 3B with high production record that has recorded the best results (see FIGS. 4 and 5).

[0138] When production is performed using the updated component data 17, the production performance generally improves, but there are cases where the production performance data for some of the mounting devices 3A, 3C, and 3D is lower than the previous data. The reason for the decrease in production performance is thought to be individual differences in the mounting devices 3.

[0139] In the fifth embodiment, if the production performance of some of the mounting devices 3 decreases after updating the component data 17, a process is performed to return the component data 17 to the previous data (component data 17 before the update).

[0140] 13 is a flowchart of the re-update process (processing to restore previous data) of the component data 17. This process is executed by each of the mounting devices 3A, 3C, and 3D that updated the component data 17 in response to a command from the management computer 11.

[0141] When the mounting devices 3A, 3C, and 3D start production after updating the component data 17, they store the production performance data 18 in memory. Then, when the production ends, they totalize the production performance data 18 (S100 to S120).

[0142] Thereafter, the mounting devices 3A, 3C, and 3D compare the latest production performance data 18 with the previous data (the production performance data before the component data was updated) (S130). If the latest production performance data 18 is lower than the production performance data 18 before the update, the mounting devices 3A, 3C, and 3D re-update the component data 17 and return it to the previous data (S140).

[0143] <Examples of production results> 14 is a table showing an example of the transition of the first parameter 171 (part data 17) and the pickup rate (production performance). The value in parentheses is the difference from the pickup rate at the previous production.

[0144] 14, in the first production run, the first parameters 171 set for each mounting apparatus 3A, 3B, 3C, and 3D are 171A, 171B, 171C, and 171D, respectively. When the first production run was performed with each mounting apparatus 3 using these first parameters 171, the pickup rates were 99%, 98%, 97%, and 96%, respectively. The average pickup rate was 97.50%.

[0145] After the first production run is completed, the first parameters 171 of the mounting devices 3B, 3C, and 3D are updated to the first parameters 171A that were used for the best-performing mounting device 3A. In the second production run, the pickup rates of the mounting devices 3C and 3D increased to 99%, and the average pickup rate increased to 98.25%, but the pickup rate of the mounting device 3B decreased from 98% to 96%.

[0146] After the second production run is completed, only the mounting device 3B whose pickup rate has decreased compared to the first production run is returned to the first parameters 171B before the update (the first time in this embodiment).

[0147] In the other mounting devices 3A, 3C, and 3D, the pickup rate for the second time is the same as or has increased from the first time, so the first parameter 171 is not updated after the second production run is completed.

[0148] In the third production run, the pickup rate of the mounting device 3B returns to the first value (98%), which is higher than the pickup rate in the second run. In this example, the average pickup rate in the third run is 98.75%, which is higher than the second run (98.25%).

[0149] In this embodiment, it becomes possible for each mounting device 3 to always reflect component data 17 suited to that machine, and this is expected to lead to improved production results.

[0150] Although an example has been described in which the re-update process of component data 17 (FIG. 13) is executed by each mounting device 3, it may also be executed by management computer 11. In other words, when component data 17 is updated, management computer 11 may compare production performance data 18 before and after the component data update and determine whether component data 17 of each mounting device 3 needs to be restored to the previous data.

[0151] <Embodiment 6> In this embodiment, the management computer 11 refers to the database 15 and displays the parts data 17 and production performance data 18 on the first display unit 12. Fig. 15 is an example of a display screen 60, in which the histories of the parts data 17 and production performance data 18 are displayed together.

[0152] In FIG. 15, information relating to the mounting apparatus 3A is displayed, but by switching the tab 61, information relating to the other mounting apparatuses 3B to 3D can be displayed.

[0153] In this configuration, changes in production results that accompany updates to the parts data 17 can be easily visually recognized.

[0154] Furthermore, the history of the component data 17 and the history of the production performance data 18 may be displayed on the second display unit 110 of the mounting device 3 in addition to the first display unit 12 of the management computer 11. In this way, the worker can check the history of these data 17, 18 at either the production management device 10 or the mounting device 3.

[0155] When displaying the component data 17 and production performance data 18 on the second display unit 110 of the mounting device 3, it is possible to display only the history of the component data 17 and the history of the production performance data 18 of that mounting device 3, or it is possible to display the history of the component data 17 and the history of the production performance data 18 of other mounting devices 3 by switching tabs, etc.

[0156] In this way, it is possible to compare the component data 17A-17D and the production performance data 18A-18D of each of the mounting devices 3A-3D from the display contents of the second display section 110.

[0157] Furthermore, in response to a request from an operator, the management computer 11 refers to the database 15 and displays the history of the device data 19 on the first display section 12. FIG.

[0158] By switching the switching tabs 71 in the display screen 70, it is possible to check the history of the equipment data 19 for each mounting equipment 3. From the comparison results of the equipment data 19, the worker can know which items require confirmation or adjustment.

[0159] If there is a difference in the device data 19 between the mounting devices 3, the management computer 11 displays a message saying "There is a difference in the device data 19" on the first display unit 12. This makes it possible to prompt the worker to check and adjust the device data 19.

[0160] Furthermore, the history of the device data 19 may be displayed on the second display unit 110 of the mounting device 3 in addition to the first display unit 12 of the management computer 11. In this way, the worker can check the history of the device data 19 at either the production management device 10 or the mounting device 3.

[0161] When displaying device data 19 on the second display unit 110 of the mounting device 3, only the history of the device data 19 of that mounting device 3 may be displayed, or the history of the device data 19 of other mounting devices 3 may be displayed by switching tabs, etc.

[0162] In this way, the mounting apparatuses 3A to 3D can compare the apparatus data 19 of each of the mounting apparatuses 3A to 3D from the display contents of the second display unit 110.

[0163] <Embodiment 7> In this embodiment, when updating the parts data 17, a process is performed to adjust the parts data 17 depending on the achievement status of the production results.

[0164] FIG. 17 is a flowchart of the automatic update process of the part data 17, and a step S32 is added to the automatic update process (FIG. 3) of the first embodiment.

[0165] S33 is executed when it is determined in S31 that there is a difference in the part data 17. S32, as shown in Fig. 18, is composed of two steps, S321 and S325.

[0166] In S321, the production performance data 18 of the mounting device 3 identified in S20 is compared with the target value. If the production performance data 18 is equal to or less than the target value, the management computer 11 adjusts the component data 17 of the mounting device 3 identified in S20 in S325 so that the production performance approaches the target value.

[0167] For example, if the target value for the pickup rate is 99.9%, and the highest pickup rate of 3B among the mounting devices 3A to 3D is 99.7%, the first parameter (pickup speed, pick-up height, etc.) 171 of the mounting device 3B is adjusted within the allowable range so that the pickup rate approaches the target value. The amount of adjustment may be determined based on past performance and experience, or may be determined by actual trials.

[0168] For example, if the target value for the recognition rate is 100% and the highest recognition rate of 3B among the mounting devices 3A to 3D is 99%, the second parameter (e.g., threshold) 172 of the mounting device 3B is adjusted within an allowable range so that the recognition rate approaches the target value. The adjustment amount may be determined by changing the threshold and re-recognizing the recognition error image, thereby determining the threshold (adjustment amount) at which recognition is successful.

[0169] Thereafter, the process proceeds to S33, where management computer 11 transmits the component data 17 adjusted in S32 to each of mounting devices 3A-3D, and instructs them to update the component data 17 to be used in the next production. In this way, it is possible to bring production performance data 18 of each of mounting devices 3A-3D closer to the target value.

[0170] <Other embodiments> The present invention is not limited to the embodiments described above and illustrated in the drawings, and the following embodiments, for example, are also included within the technical scope of the present invention.

[0171] (1) In the first to seventh embodiments, the production line L is configured with the printing machine 1, a plurality of mounting devices 3, and an inspection device 5. The production line L may have any configuration as long as it is configured to include at least a plurality of mounting devices 3. For example, the inspection device 5 may be located outside the line.

[0172] (2) In the first to seventh embodiments, the production management device 10 is configured from the management computer 11 and the database 15. The production management device 10 may be configured from one or more computers, and the database 15 may be substituted by the memory or hard disk of the computer.

[0173] (3) In the first to seventh embodiments, the component data 17A-17D are managed individually in each of the mounting devices 3A-3D. The component data 17A-17D of each of the mounting devices 3A-3D may be managed centrally in the database 15. That is, all updates, changes, and modifications of the component data 17A-17D may be performed by the management computer 11, and the data may be stored and managed in the database 15. In this case, each of the mounting devices 3A-3D does not have a function for editing or managing the "component data," but instead reads out the stored component data 17A-17D from the database 15 and uses it as is.

[0174] (4) In the first to seventh embodiments, the component data 17A, 17C, and 17D of the mounting devices 3A, 3C, and 3D with low production records among the mounting devices 3A to 3D are updated to the component data 17B of the mounting device 3B with the highest production record. It is not necessarily required to update to the component data 17 with the highest record, and it is acceptable to update to the component data of the mounting device 3 with a relatively high production record.

[0175] (5) The success or failure of the mounting operation can also be judged from the image of the board camera 35. In this case, the board P on which the components W are mounted is photographed by the board camera 35, and the success or failure is judged from the obtained image.

Claims

1. A production management device communicably connected to a plurality of mounting devices, wherein the plurality of mounting devices perform suction, recognition, and mounting on a substrate according to component data set for each component type, and the production management device compares the production performance data of the plurality of mounting devices and updates the component data of the mounting device with low production performance to the component data of the mounting device with high production performance.

2. The production management device according to Claim 1, comprising a database and a management computer, wherein the database stores the component data and production performance data of the plurality of mounting devices, and the management computer identifies a mounting device with high production performance by referring to the database, and transmits the component data of the mounting device with high production performance to the mounting device with low production performance to instruct an update of the component data to be used in the next production.

3. The production management device according to Claim 1 or Claim 2, wherein the component data is an aggregate of a first parameter related to suction, a second parameter related to recognition, and a third parameter related to mounting, and when there is a difference in the production performance data related to suction among the plurality of mounting devices, the production management device updates the first parameter of the mounting device with low production performance to the first parameter of the mounting device with high production performance.

4. The production management device according to Claim 1 or Claim 2, wherein the component data is an aggregate of a first parameter related to suction, a second parameter related to recognition, and a third parameter related to mounting, and when there is a difference in the production performance data related to recognition among the plurality of mounting devices, the production management device updates the second parameter of the mounting device with low production performance to the second parameter of the mounting device with high production performance.

5. The production management device according to Claim 1 or Claim 2, wherein the component data is an aggregate of a first parameter related to suction, a second parameter related to recognition, and a third parameter related to mounting, and when there is a difference in the production performance data related to mounting among the plurality of mounting devices, the production management device updates the third parameter of the mounting device with low production performance to the third parameter of the mounting device with high production performance.

6. The production management device according to any one of Claims 1 to 5, When an inspection device for inspecting a produced substrate detects an error, a production management device that increases the production record data of a mounting device having a check function related to the error among the plurality of mounting devices.

7. The production management device according to any one of claims 1 to 6, Regarding the plurality of mounting devices, when there is no difference in component data but there is a difference in production record data, A production management device that instructs the confirmation or adjustment of device data unique to each mounting device for a mounting device with low production performance.

8. The production management device according to claim 7, The device data is an aggregate of first device parameters related to suction and second device parameters related to recognition, Regarding the plurality of mounting devices, when there is no difference in component data but there is a difference in production record data related to suction, the production management device instructs the confirmation or adjustment of the first device parameters for a mounting device with low production performance related to suction.

9. The production management device according to claim 7, The device data is an aggregate of first device parameters related to suction and second device parameters related to recognition, Regarding the plurality of mounting devices, when there is no difference in component data but there is a difference in production record data related to recognition, the production management device instructs the confirmation or adjustment of the second device parameters for a mounting device with low production performance related to recognition.

10. A production system, A plurality of mounting devices, An inspection device for inspecting a produced substrate, A production system including the production management device according to any one of claims 1 to 9.

11. The production system according to claim 10, The production management device or the mounting device, When updating component data, stores the component data before the update, After the component data is updated, if the production record data decreases compared to before the update, the component data of the mounting device is reverted to the data before the update. A production system.

12. The production system according to claim 10 or claim 11, The production management device has a first display unit, The first display unit displays the history of component data and production record data of the plurality of mounting devices. A production system.

13. The production system according to claim 12, Each of the plurality of mounting devices is provided with a second display unit, In addition to the first display unit, the second display unit also displays the history of component data and production record data of the mounting device. A production system.

14. The production system according to any one of claims 10 to 13, wherein the production management device has a first display unit, the first display unit displays the history of the device data of the plurality of mounting devices, the production system.

15. The production system according to claim 14, wherein each of the plurality of mounting devices includes a second display unit, in addition to the first display unit, the second display unit also displays the history of the device data of the mounting device, the production system.

Images