Cooler, method for manufacturing cooler, semiconductor device, and method for manufacturing semiconductor device

Abstract

A cooler (1) comprises: a plate (1A) that has one main surface having formed therein a mounting part for mounting a heat-generating element (7) to be cooled, and a plurality of recesses (11) formed in a main surface (20) opposite to the one main surface; and a plate (1B) which has a plurality of recesses (15) formed in a main surface (30) and which is disposed such that the main surface (30) opposes the main surface (20) of the plate (1A). One of the recesses (11) and one of the recesses (15) are arranged such that respective one ends oppose each other whereas the other ends thereof each oppose one end of another one of the recesses (11) or another one of the recesses (15). As a result, the recesses (11) and the recesses (15) are alternately connected to each other, and form one or more cooling flow paths (8) including a flow path extending in a direction toward the mounting part and a flow path extending in a direction away therefrom.

Description

Technical Field

[0001] The present disclosure relates to a cooler, a method for manufacturing a cooler, a semiconductor device, and a method for manufacturing a semiconductor device.

Background Art

[0002] Some coolers are liquid-cooled types that cool a heat-generating body by cooling a portion where the heat-generating body such as a semiconductor or an electronic component contacts with a refrigerant. In a liquid-cooled cooler, a flow path is formed adjacent to a portion where the heat-generating body contacts to allow the refrigerant to flow.

[0003] Patent Document 1 discloses a cooler provided with a plurality of fins that protrude into a coolant flow path and extend in the flow direction of the coolant in the coolant flow path. In this cooler, the shape of the fin cut by a horizontal plane orthogonal to the protruding direction of each fin is wavy, and the wave crest portions and wave bottom portions of the fins are alternately formed. The coolant flows in a meandering manner between two adjacent fins.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In the cooler described in Patent Document 1, since the coolant flows along the fins, it flows substantially parallel to the mounting surface of the heat-generating body. Therefore, the coolant does not mix in the direction approaching or moving away from the mounting surface of the heat-generating body, and the coolant flowing through the region close to the heat-generating body becomes high in temperature, while the coolant flowing through the region far from the heat-generating body becomes low in temperature. For this reason, in the region near the heat-generating body, there is a problem that the heat dissipation efficiency decreases because the temperature of the coolant becomes high, and the heat-generating body cannot be effectively cooled.

[0006] The present disclosure has been made in view of the above circumstances, and an object thereof is to provide a cooler having high heat dissipation efficiency, a method for manufacturing the same, a semiconductor device having high heat dissipation efficiency, and a method for manufacturing the same.

Means for Solving the Problems

[0007] In order to achieve the above object, a cooler according to the present disclosure includes one main surface on which a mounting portion for mounting a heating element to be cooled is formed, and a plurality of first recesses formed on the other main surface facing the one main surface. It is a solid wood material A first plate, and a plurality of second recesses formed on one main surface, and disposed such that one main surface faces the other main surface of the first plate. It is a solid wood material A second plate. The first recess and the second recess are arranged such that one end of each of them faces each other, and the other ends are respectively arranged to face one end of another second recess and another first recess, so as to communicate with each other alternately and form at least one cooling flow path including a flow path extending in a direction approaching the mounting portion and a flow path extending in a direction away from the mounting portion. Therefore, when the coolant flows through the cooling flow path, the coolant can approach the heating element by passing through the first recess and the second recess alternately, and then move away from the heating element.

Advantages of the Invention

[0008] According to the present disclosure, the cooler includes a bent cooling flow path. When the refrigerant flows through the cooling flow path, it is agitated by flowing in a bent manner. Therefore, the temperature unevenness of the refrigerant can be reduced, and the heat dissipation efficiency of the cooler can be improved.

Brief Description of the Drawings

[0009]

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Mode for Carrying Out the Invention

[0010] Hereinafter, the cooler according to the present disclosure will be described with reference to the drawings. In the drawings, the same or equivalent parts are denoted by the same reference numerals. In the orthogonal coordinate system XYZ shown in the figures, the direction in which the coolant flows through the inlet header and the outlet header is the X-axis direction, the thickness direction of the plate is the Y-axis direction, and the direction orthogonal to the X-axis direction and the Y-axis direction is the Z-axis direction. Hereinafter, this coordinate system will be appropriately cited to describe each embodiment

[0011] (Embodiment 1) The cooler 1 according to Embodiment 1 is intended for cooling a semiconductor element to be cooled. FIG. 1 is a perspective view of the cooler 1 according to Embodiment 1 of the present disclosure with the coolant circulation device omitted. FIG. 2 is a cross-sectional perspective view taken along line II-II of FIG. 1 and showing the structure of the cooling flow path 8 described later. FIG. 3 is a plan view of the cooler 1 shown in FIG. 1, FIG. 5 is a side view thereof, and FIG. 6 is a view for explaining the flow of the coolant in FIG. 2. In FIGS. 1, 3, and 5, for easy understanding, the plates 1A and 1B are shown semi-transparent to illustrate the cooling flow path 8 formed inside the cooler 1

[0012] As shown in FIGS. 1, 2, and 5, the cooler 1 includes a plate 1A on which a heating element 7 is mounted, a plate 1B disposed opposite to the plate 1A, and a coolant circulation device (not shown).

[0013] The plate 1A includes a mounting surface 10 which is one of the main surfaces, and a main surface 20 facing the mounting surface 10. A mounting portion is formed substantially at the center of the mounting surface 10. A semiconductor element, which is an example of the heating element 7, is fixed to the mounting portion. A plurality of recesses 11 are regularly formed on the main surface 20.

[0014] The plate 1B includes a main surface 30 and a main surface 40 facing the main surface 30. The main surface 30 is in contact with and joined to the main surface 20 of the plate 1A, and the main surface 40 is fixed to a circuit board, a housing, etc. A plurality of recesses 15 are regularly formed on the main surface 30.

[0015] The main surface 20 of the plate 1A and the main surface 30 of the plate 1B are in contact with and joined to each other so that the plurality of recesses 11 and 15 communicate with each other alternately. As a result, a cooling flow path 8 is formed in the cooler 1, which is composed of the communicating recesses 11 and 15, undulates in the Y-axis direction, and extends in the Z-axis direction as a whole. A plurality of cooling flow paths 8 are formed in a direction intersecting the direction in which the cooling flow path 8 extends when viewed in the X-axis direction, that is, in the direction normal to the main surfaces 20, 30, etc. of the plates 1A and 1B.

[0016] One ends of the plurality of cooling flow paths 8 are commonly connected to an inlet header 5, and the other ends of the plurality of cooling flow paths 8 are commonly connected to an outlet header 6.

[0017] A coolant, which is a refrigerant, is supplied from the coolant circulation device to the cooler 1 through an inlet pipe 3. The coolant branches into the plurality of cooling flow paths 8 at the inlet header 5 and absorbs and cools the heat of the heating element 7 in each cooling flow path 8. After absorbing the heat, the coolant merges at the outlet header 6, is discharged from an outlet pipe 4, is recovered by the coolant circulation device, and is cooled.

[0018] As shown in FIGS. 6, 7, 8(a), and 8(b), the inlet header 5 is formed by opposing the trench 12 formed in the plate 1A and the trench 16 formed in the plate 1B. The inlet header 5 is connected to the recess 11 at the -Z direction end. The inlet header 5 has the inlet pipe 3 connected to its +X direction end.

[0019] The outlet header 6 is formed by opposing the trench 13 formed in the plate 1A and the trench 17 formed in the plate 1B. The outlet header 6 is connected to the recess 15 at the +Z direction end. The outlet header 6 has the outlet pipe 4 connected to its +X direction end.

[0020] As shown in FIGS. 3 - 6, the cooling channel 8 is formed by overlapping and communicating the ends of the recesses 11 and 15 with each other when viewed in plan, that is, in the direction normal to the main surfaces 20 and 30 of the plates 1A and 1B. A plurality of the cooling channels 8 are formed side by side in the X-axis direction between the inlet header 5 and the outlet header 6, and the coolant flowing through the cooling channel 8 absorbs and cools the heat of the heat generating body 7 mounted on the mounting Surface 10.

[0021] As shown in FIGS. 2, 3, and 8(a), a mounting portion for mounting the heat generating body 7 is formed on the mounting surface 10 of the plate 1A. On the other hand, the main surface 20 of the plate 1A has a plurality of recesses 11 that form part of the cooling channel 8, a trench 12 that forms part of the inlet header 5, and a trench 13 that forms part of the outlet header 6. The plate 1A is, for example, a plate-shaped, metal, for example, aluminum member having dimensions of 20 - 300 mm in the X-axis direction, 3 - 50 mm in the Y-axis direction, and 20 - 300 mm in the Z-axis direction.

[0022] The mounting portion is provided in the range of the mounting surface 10 of the plate 1A where the recess 11 is formed on the back surface, and the heat generating body 7 is mounted by fixing means (not shown).

[0023] The recesses 11 are formed in a plurality with the same shape in the portion directly behind the mounting portion of the main surface 20 and in the surrounding area thereof. The recesses 11 are formed in a plurality at regular intervals Dx and Dz in the X-axis direction and the Z-axis direction, respectively. The recesses 11 are oval or elliptical in plan view from the XZ plane, and are recesses in the shape of a half capsule or a cocoon in cross-sectional view by the YZ plane. The depth and width of the recesses 11 are both formed to be 0.5 to 15 mm, and the length is formed to be 2 to 40 mm. Further, on the surface of the recesses 11, similar to the recesses 15, minute protrusions 119 shown in FIGS. 9(a), (b) and FIG. 9(c) which is a cross-sectional view taken along the IXc-IXc cross-section line of FIG. 9(b) when the recesses 15 are seen through from the bottom surface side of the plate 1B are formed in a plurality along the Z-axis direction. By these fins 19 increasing the inner wall surface area of the recesses 11, the heat dissipation performance can be improved, and the agitation of the cooling liquid can be promoted.

[0024] The trench 12 is a groove having a rectangular cross-section in XZ plane view that extends along the X-axis near the -X direction end of the main surface 20. The trench 12 constitutes a part of the inlet header 5 connected to the inlet pipe 3. The trench 12 is connected to the recess 11 formed at the -Z direction end among the recesses 11.

[0025] The trench 13 is a groove having a rectangular cross-section in XZ plane view that extends along the X-axis near the +X direction end of the main surface 20. The trench 13 constitutes a part of the outlet header 6 connected to the outlet pipe 4.

[0026] As shown in FIGS. 2 and 8(b), the plate 1B has recesses 15 that constitute a part of the cooling flow path 8, trenches 16 that constitute a part of the inlet header 5, and trenches 17 that constitute a part of the outlet header 6. The plate 1B is a plate-shaped member made of metal, for example, aluminum, with dimensions of 20 to 300 mm in the X-axis direction, 3 to 50 mm in the Y-axis direction, and 20 to 300 mm in the Z-axis direction.

[0027] The recesses 15 are formed in a plurality on the main surface 30 of the plate 1B with the same shape as each other. The recesses 15 are formed in a plurality at regular intervals Dx and Dz in the X-axis direction and the Z-axis direction. Similar to the recesses 11, the recesses 15 are elliptical in plan view from the XZ plane, and are recesses in the shape of a half capsule or a cocoon that is halved in cross-sectional view in the YZ cross-section. Both the depth and width of the recesses 15 are formed to be 0.5 to 15 mm, and the length is 2 to 40 mm. When the main surface 20 of the plate 1A and the main surface 30 of the plate 1B are brought into contact with each other, the recesses 15 are formed at a position shifted in the Z-axis direction from the recesses 11 in XZ plane view so as to face a part of the recesses 11. Specifically, the center C in the Z-axis direction of the recesses 11 shown in Fig. 8(a) coincides with the position M in the middle between the recesses 15 adjacent to each other in the Z-axis direction of the recesses 15 shown in Fig. 8(b). Also, with respect to the center P1 of the -Z-direction semi-circle of a certain recess 11 of the plate 1A shown in Fig. 8(a) and the center P1 of the +Z-direction semi-circle of the adjacent recess 11, the centers P2, P2 of the two semi-circles of a certain recess 15 of the plate 1B shown in Fig. 8(b) overlap, and the intervals Dz, the widths of the recesses 11, 15, the sizes, etc. are Have set. That is, as shown in Figs. 3 and 4, in plan view, the recesses 15 are arranged such that the ends of the recesses 11 and 15 overlap each other. Also, the surface of the recesses 15 is surface-treated so that a plurality of minute fins 19 shown in Figs. 9(a) and (b) are formed on the surface.

[0028] The trench 16 is a groove with a rectangular cross-section that extends along the X-axis direction near the -X-direction end of the main surface 30. The trench 16 constitutes a part of the inlet header 5 connected to the inlet pipe 3. The trench 16 is formed at a position facing the trench 12 when the main surface 20 of the plate 1A and the main surface 30 of the plate 1B are brought into contact with each other.

[0029] The trench 17 is a groove with a rectangular cross-section that extends along the X-axis direction near the +X direction end of the main surface 20. The trench 17 constitutes a part of the outlet header 6 connected to the outlet pipe 4. The trench 17 is connected to the recess 15 formed on the +Z direction end side among the recesses 15. The trench 17 is formed at a position facing the trench 13 when the main surface 20 of the plate 1A and the main surface 30 of the plate 1B are brought into contact with each other.

[0030] Semicircular openings 18 for connecting the inlet pipe 3 or the outlet pipe 4 to the plates 1A and 1B are formed from the outside toward the trenches 12, 13, 16, and 17.

[0031] The plates 1A and 1B having the above-described configuration are joined and integrated with their main surfaces 20 and 30 facing each other such that the center C in the Z-axis direction of the recess 11 shown in FIG. 8(a) coincides with the position M in the middle between the recess 15 shown in FIG. 8(b) and the recess 15 adjacent to the recess 15 in the Z-axis direction. Thereby, the recesses 11 and 15 form the cooling channel 8. The cross-section of the cooling channel 8 on the surface where the recesses 11 and 15 face each other is circular as shown in FIGS. 3 and 4. Also, as shown in FIGS. 5 and 6, the trenches 12 and 16 form the inlet header 5, and the trenches 13 and 17 form the outlet header 6. Thereby, a path is formed in the cooler 1 through which the coolant flows from the inlet header 5 through the cooling channel 8 and is discharged from the outlet header 6.

[0032] The coolant flowing into the inlet header 5 from the inlet pipe 3 flows along the Z-axis direction while approaching and moving away from the mounting surface 10 in the plurality of parallel cooling channels 8 formed by the plurality of recesses 11 and 15 as shown in FIG. 6. Thereby, the coolant efficiently absorbs the heat from the mounting portion of the mounting surface 10 while being agitated. Surface Thereafter, the coolant that has absorbed the heat is discharged to the outlet pipe 4 through the outlet header 6, and the heat is recovered.

[0033] Next, a method for manufacturing the cooler 1 of the present embodiment will be described.

[0034] First, recesses 11 and 15 and trenches 12, 13, 16, and 17 are formed in plates 1A and 1B by pressing. When forming recesses 11 and 15, simultaneously, fins 19 are formed in recesses 11 and 15 by surface treatment. Openings 18 are formed at one end of trenches 12, 13, 16, and 17 in the Z-axis direction.

[0035] Subsequently, plates 1A and 1B are brought into contact with each other such that main surfaces 20 and 30 face each other, and are pressure-bonded and joined to each other so that the center C of recess 11 in the Z-axis direction coincides with the position M that is the middle between recess 15 shown in FIG. 8(b) and the recess 15 adjacent to it in the Z-axis direction. Thereby, an inlet header 5, an outlet header 6, and a cooling channel 8 are formed.

[0036] Thereafter, one end of the inlet pipe 3 is connected to openings 18 and 18 of trenches 12 and 13, and one end of the outlet pipe 4 is connected to openings 18 and 18 of trenches 16 and 17. A coolant circulation device is connected to the other ends of the inlet pipe 3 and the outlet pipe 4, and the cooler 1 shown in FIG. 1 is completed.

[0037] As described above, according to the cooler 1, when the main surface 20 of plate 1A and the main surface 30 of plate 1B are brought into contact with each other, recess 15 is formed such that the center of recess 11 in the Z-axis direction is positioned between recess 15 and the recess 15 adjacent to it in the Z-axis direction. Therefore, recesses 11 and 15 are brought into contact with each other such that a part of them faces each other in the Z-axis direction, and the cooling channel 8 is formed to meander in the Y-axis direction. For this reason, when the coolant flows through the cooling channel 8 in the Z-axis direction, the coolant is stirred in a direction approaching and separating from the heating element. Therefore, the temperature unevenness of the coolant is reduced, and the cooling efficiency of the cooler 1 is improved. Further, fins 19 are formed in recesses 11 and 15 to promote the stirring of the coolant flowing through the cooling channel 8.

[0038] Also, according to the cooler 1, a plurality of recesses 11 and 15 constituting the cooling channel 8 are formed in the Z-axis direction respectively. Therefore, a cooling channel extending in the Z-axis direction with high cooling efficiency can be easily configured to a desired length.

[0039] Furthermore, according to the cooler 1, since the coolant flows in the Z-axis direction while meandering in the Y-axis direction in the cooling flow path 8, a centrifugal force acting toward the inner walls of the recesses 11 and 15 acts on the coolant. Therefore, the flow velocity of the coolant near the inner walls of the recesses 11 and 15 increases, and the thermal boundary layer becomes thinner. As a result, the heat transferred to the inner walls of the recesses 11 and 15 is easily transferred to the coolant, and the heat dissipation performance is improved.

[0040] In addition, the semiconductor device having the cooler 1 can obtain a high cooling effect, improve the heat dissipation performance and reliability, and achieve miniaturization.

[0041] Also, according to the cooler 1, the inlet pipe 3 and the outlet pipe 4 are connected to an opening 18 formed in a direction orthogonal to the cooling flow path 8. When the coolant flows from the inlet pipe 3 into the cooling flow path 8 in parallel with the cooling flow path 8, the flow tends to concentrate in the cooling flow path 8 near the inlet pipe 3. However, according to the cooler 1, the coolant flows into and out of each cooling flow path 8 almost uniformly. Therefore, substantially the same heat dissipation performance can be obtained over the entire mounting surface 10.

[0042] (Embodiment 2) FIG. 10 is a cross-sectional view when the heating elements 7a and 7b are mounted on the mounting portion of the mounting surface 10 of the cooler 1 according to Embodiment 1. FIG. 11(a) is a bottom view of the plate 1A according to Embodiment 2, and FIG. 11(b) is a plan view of the plate 1B according to Embodiment 2. FIG. 13 is a perspective view showing the flow of the coolant inside the cooling flow path 8 in the cooler 1 according to Embodiment 2. In FIG. 13, for easy understanding, the plates 1A and 1B are shown semi-transparent to illustrate the cooling flow path 8 formed inside the cooler 1.

[0043] In Embodiment 1, the recesses 11 and 15 formed in the plates 1A and 1B are arranged at the same positions in the Z-axis direction. Therefore, as shown in FIG. 10, when two heating elements 7a and 7b are arranged on the mounting surface 10, there is a difference in the heat dissipation effect between the heating element 7a and the heating element 7b. Below the heating element 7a, no recess 11 is formed in the plate 1A in the direction along the X-axis, while below the heating element 7b, the recess 11 is formed in the plate 1A. For this reason, since the heat dissipation path of the heating element 7a is longer than that of the heating element 7b, it is considered that the heating element 7a is less likely to dissipate heat than the heating element 7b and may become hotter than the heating element 7b. When the heating element 7a becomes hotter than the heating element 7b, the operating temperature of the heating element 7a increases. Therefore, in Embodiment 2, a cooler 1 is provided in which the difference in the heat dissipation effect due to the position where the heating element is arranged in the mounting portion is small.

[0044] The difference between Embodiment 2 and Embodiment 1 lies in the arrangement pattern of the recesses 11 and 15 in the plates 1A and 1B and the configuration of the overlapping portions between the recesses 11 and 15 and the trenches 12, 13, 16, and 17 at both ends in the Z-axis direction, as shown in FIGS. 11(a) and 11(b).

[0045] As shown in FIGS. 11(a) and 11(b), the recesses 11 formed in the plate 1A and the recesses 15 formed in the plate 1B in the second embodiment are arranged in a staggered manner with respect to the direction in which the cooling channels 8 extend when viewed in the X-axis direction, that is, in the direction normal to the main surfaces 20, 30, etc. of the plates 1A and 1B. In the plate 1A, the center C in the Z-axis direction of the recess 11 constituting a certain cooling channel 8 is configured such that the coordinates in the X-axis direction coincide with the intermediate position Q in the Z-axis direction between the recesses 11 and 11 constituting the adjacent cooling channels 8. The plate 1B also has the same arrangement of the recesses 15 as the plate 1A. As shown in FIG. 12, in a view in the XZ plane, the recess 15 is arranged such that the ends of the recesses 11 and 15 overlap each other. Therefore, as shown in FIG. 13, the recesses 11 are formed directly below any position on the mounting surface 10 or at positions adjacent thereto in the +X direction and the -X direction. For this reason, in the case of the arrangement of the heating element 7a shown in FIG. 10, that is, when the heating element 7a is arranged on the main surface on the back side of the position Q in FIG. 11(a), the heat dissipation paths from the heating element 7a to the adjacent recesses 11 in the +X or -X direction are shorter than those in the case of the first embodiment. Thereby, the heat dissipation effect of the heating element 7a is improved, and the life of the semiconductor device having the cooler 1 can be extended.

[0046] (Embodiment 3) FIG. 14(a) is a bottom view of the plate 1A according to the third embodiment, and FIG. 14(b) is a plan view of the plate 1B according to the third embodiment. FIG. 16 is a perspective view showing the flow of the coolant inside the cooling channels 8 in the cooler 1 according to the third embodiment, and FIG. 17 is a plan view of FIG. 16. In FIGS. 16 to 17, for easy understanding, the plates 1A and 1B are shown semi-transparent to illustrate the cooling channels 8 formed inside the cooler 1.

[0047] In the third embodiment, compared with the first embodiment, only the arrangement of the recesses 11 and 15 in the plates 1A and 1B is different, and the other configurations are the same as those in the first embodiment.

[0048] As shown in Fig. 14(a), the direction in which the major axes of the recesses 11 formed in the plate 1A in the third embodiment are continuously arranged is inclined by α° with respect to the Z-axis direction. As shown in Fig. 14(b), the direction in which the major axes of the recesses 15 formed in the plate 1B in the third embodiment are continuously arranged is also inclined by α° with respect to the Z-axis direction. With respect to the center P1 of the -Z-direction semi-circle of a certain recess 11 of the plate 1A shown in Fig. 14(a) and the center P1 of the +Z-direction semi-circle of the adjacent recess 11, the two semi-circle centers P2, P2 of a certain recess 15 of the plate 1B shown in Fig. 14(b) are overlapped, and the angle α, the widths, sizes, etc. of the recesses 11, 15 are set. The recesses 11 and 15 are formed such that, in a plan view, that is, when viewed in the normal direction of the main surfaces 20, 30, etc. of the plates 1A, 1B, the straight lines connecting one end and the other end of each other intersect. As a result, when the main surface 20 of the plate 1A and the main surface 30 of the plate 1B are opposed and abutted to be joined, as shown in Figs. 15 - 17, a cooling flow path 8 in which the coolant meanders in a plan view and a side view is formed.

[0049] Since the coolant flows through the cooling flow path 8 while meandering in the Y-axis direction and the X-axis or Z-axis direction, centrifugal force acts in the Y-axis direction and the X-axis or Z-axis direction. Therefore, the flow velocity of the coolant not only near the inner wall in the Y-axis direction of the recess 11 but also near the inner wall in the X-axis or Z-axis direction increases, and the thermal boundary layer becomes thinner. As a result, the range in which the heat transmitted to the inner wall of the recess 11 is easily transferred to the coolant expands, and the heat dissipation performance of the cooler 1 is improved.

[0050] According to the cooler 1 according to the third embodiment having such a configuration, the same effects as those of the first embodiment are achieved, and the coolant flows through the cooling flow path 8 while meandering in the Y-axis direction and the X-axis or Z-axis direction, so that the inner wall of the recess 11 can be effectively utilized as a heat dissipation surface, and the heat dissipation performance can be improved.

[0051] (Fourth Embodiment) Fig. 18 is a side view of the cooler 1 according to the fourth embodiment. Also in Fig. 18, for easy understanding, the plates 1A, 1B are shown semi-transparent in the same manner as in Figs. 1, 3, etc.

[0052] In Embodiments 1 to 3, the heat generating element 7 was mounted only on the mounting surface 10 of the two main surfaces of the cooler 1. In Embodiment 4, as shown in FIG. 18, the heat generating elements 7 are mounted on the two mounting surfaces 10 and 41 of the cooler 1, respectively.

[0053] The plate 1B has a mounting portion on the main surface 40 on the side where the recess 15 is not formed, that is, the mounting surface 41, in the same manner as the plate 1A. Other configurations are the same as those in Embodiment 1 or 2, 3.

[0054] According to the cooler 1 according to Embodiment 4 having such a configuration, the same effects as those in Embodiment 1 or 2, 3 can be achieved, and the two heat generating elements 7 can be cooled simultaneously on the two mounting surfaces 10 and 41. Therefore, the mounting density of the heat generating element 7 can be increased, and the size of the cooler 1 can be reduced.

[0055] (Embodiment 5) In Embodiment 5, the material of the plate 1B is different from that in Embodiments 1 to 4, and the other configurations are the same. The plate 1A in Embodiment 5 is formed of, for example, a metal material with high thermal conductivity made of aluminum. The plate 1B is made of, for example, polycarbonate of a resin material, which generally has a lower thermal conductivity than metal but is inexpensive and easy to process. By using a material with low thermal conductivity but inexpensive and easy to process for the plate 1B, which contributes less to the absorption of the heat generated by the heat generating element 7, the cost of the cooler 1 can be reduced while maintaining the cooling performance on the plate 1A side.

[0056] (Embodiment 6) FIG. 19(a) is an exploded perspective view of the cooler 1 according to Embodiment 6. FIG. 19(b) is an enlarged perspective view of the vicinity of the plate clamping portion 90, which will be described later, shown in part B of FIG. 19(a). FIG. 20 is a side view of the plates 1A, 1B, and 1C of the cooler 1 according to Embodiment 6, with the plates shown semi-transparent. In Embodiment 1, the cooling channels 8 were formed by the plates 1A and 1B. In Embodiment 6, as shown in FIGS. 19(a) and 20, a plate 1C having a plurality of circular through-holes 50 in the XZ plane view that communicate with the recesses 11 and 15 is disposed between the plate 1A and the plate 1B. The cooling channels 8 are formed by the main surface 20 of the plate 1A and the main surface 60 of the plate 1C facing each other and the main surface 30 of the plate 1B and the main surface 61 of the plate 1C facing each other and abutting and joining so that the opposite ends of the recesses 11 and 15 overlap and communicate with each other in the XZ plane view through the through-holes 50. The plate 1C is in contact with the plates 1A and 1B while being sandwiched between the plate clamping portions 90, 90 formed at the +X direction end and the -X direction end of the plate 1A and the plate clamping portions 91, 91 formed at the +X direction end and the -X direction end of the plate 1B, respectively, at the +Z direction end and the -Z direction end. The plate clamping portions 90, 90 protrude from the main surface 20 of the plate 1A by half of the thickness of the plate 1C in the -Y direction, and the plate clamping portions 91, 91 protrude from the main surface 30 of the plate 1B by half of the thickness of the plate 1C in the +Y direction. Also, the distance between the plate clamping portions 90, 90 and the distance between the plate clamping portions 91, 91 are both equal to the length of the plate 1C in the Z-axis direction. Therefore, as shown in FIG. 19(a), by sandwiching and abutting the plate 1C between the plates 1A and 1B, the plates 1A, 1B, and 1C can be joined without a gap in the Y-axis direction and the Z-axis direction. In the regions where the trenches 12, 13, 16, and 17 are formed, the plate 1A and the plate 1B are in contact with each other.

[0057] In Embodiment 6, the plates 1A and 1B are formed of a metal material with high thermal conductivity, such as aluminum, and the plate 1C is formed of a resin material with relatively low thermal conductivity compared to the metal material, for example.

[0058] According to the cooler 1 according to Embodiment 6, most of the heat of the heat-generating body 7 mounted on the mounting surfaces 10 and 41 is blocked from being conducted by the plate 1C having a lower thermal conductivity than the plates 1A and 1B. Therefore, one heat-generating body 7 is less likely to be affected by the heat generated by the other heat-generating body 7, and an increase in the temperature of both heat-generating bodies 7 can be suppressed. In particular, it is effective when the allowable temperature of either one of the heat-generating bodies 7 is low, or when the amount of heat generated by one heat-generating body 7 is considerably larger than that of the other heat-generating body 7.

[0059] Note that a plurality of plates 1C may be provided. Further, the material of the plate 1C is not limited to a resin material.

[0060] (Embodiment 7) FIG. 21 is a plan view showing the plate 1A of the cooler 1 according to Embodiment 7 in a semi-transparent state. In Embodiment 7, in addition to the heat-generating body 7, a heat-generating body 7c that does not perform cooling using, for example, the cooling flow path 8 is mounted on the general mounting portion 70 of the cooler 1. Two general mounting portions 70 are formed adjacent to the +X direction end and the -X direction end of the mounting portion on the mounting surface 10 with the two-dot chain line L as a boundary. Further, as shown in FIGS. 22(a) and 22(b), the recesses 11 and 15 communicating with the trenches 12 or 17 of the plates 1A and 1B are inclined by α° in the Z-axis direction toward the direction in which the opening 18 is formed, which is the direction in which the inlet pipe 3 or the outlet pipe 4 is connected. Other configurations are the same as those in Embodiment 3.

[0061] As shown in FIGS. 21, 22(a), and 22(b), the recesses 11 and 15 of the plates 1A and 1B in Embodiment 7 are formed in the back portion of the mounting portion and its periphery of the main surfaces 20 and 30, and are not formed in the back portion of the general mounting portion 70 of the main surfaces 20 and 30, that is, in the back portion and its periphery in the direction away from the general mounting portion 70 in the normal direction when viewed in the normal direction of the main surfaces 20 and 30 of the plates 1A and 1B. By forming the cooling flow path 8 in the back portion and its periphery of the main surface 20 on the back side of the heat generating body 7 cooled by the cooler 1, while securing the mounting space for the heat generating body 7c, the total volume of the cooling flow path 8 can be made smaller than when the recesses 11 and 15 are formed over the entire area of the main surface 20 of the plate 1A and the main surface 30 of the plate 1B. Therefore, the cooler 1 can increase the number of circulation times of the coolant per unit time. Accordingly, the heat exchange per unit time between the heat generating body 7 and the coolant can be increased, and the heat dissipation efficiency of the cooler 1 can be improved.

[0062] Also, the recesses 11 and 15 communicating with the inlet header 5 and the outlet header 6 are arranged to be inclined at an angle α° with respect to the Z-axis direction toward the direction in which the inlet pipe 3 or the outlet pipe 4 is connected. Therefore, compared with Embodiment 1 without inclination and Embodiment 3 inclined at an angle α° toward the side opposite to the opening 18 of the outlet header 6, the flow of the coolant can be made smoother, and the pressure loss can be reduced. Furthermore, in the portion where the recesses 11 and 15 are not formed, a large joint surface of the plates 1A and 1B can be secured, so the strength of the joint portion of the plates 1A and 1B of the cooler 1 can be increased.

[0063] (Embodiment 8) FIG. 23 is a plan view showing the plate 1A of the cooler 1 according to Embodiment 8 in a semi-transparent state. FIG. 24 is a side view of the sub-mounting portion 80 showing the plates 1A and 1B of the cooler 1 according to Embodiment 8 in a semi-transparent state. For ease of understanding, in FIG. 24, only the outer contour line of the cooling flow path 8 formed behind the sub-cooling flow path 9 is shown by a broken line. The cooler 1 according to Embodiment 8 is different from Embodiment 7 only in the configuration of the sub-mounting portion 80, and the other configurations are the same.

[0064] As shown in FIGS. 23 and 24, the recesses 81 and 82 formed in the plates 1A and 1B on the back side of the sub-mounting portion 80 in the eighth embodiment are formed smaller than the recesses 11 and 15 in the vicinity of and directly behind the main surface 20 on the back side of the sub-mounting portion 80 for mounting a heating element 7d that does not dissipate heat as much as the heating element 7. The sizes of the recesses 81 and 82 are determined according to the heat dissipation performed on the heating element 7d. Since the piping resistance in the sub-cooling channel 9 formed by the recesses 81 and 82 is larger than the piping resistance in the cooling channel 8 formed by the recesses 11 and 15, the flow rate of the coolant flowing through the cooling channel 8 is larger than the flow rate of the coolant flowing through the sub-cooling channel 9. Therefore, the cooler 1 can dissipate more heat from the heating element 7 and dissipate less heat from the heating element 7d than from the heating element 7. Therefore, the heat dissipation capacity of the cooler 1 can be allocated according to the heat dissipation performed on each of the heating elements 7 and 7d, so that the heat dissipation efficiency of the cooler 1 can be improved.

[0065] (Modification example) In each of the above embodiments, a semiconductor element is mounted as a heating element on the mounting surfaces 10 and 41 of the cooler 1, but other heating elements such as integrated circuits and sensors may be mounted.

[0066] In each of the above embodiments, the shape of the recess is a semi-divided capsule type, but other shapes such as hemispherical, rectangular parallelepiped, cubic, etc. may be used, as long as the shape is such that the refrigerant is agitated when flowing through the cooling channel. Also, although all the recesses had the same shape, some or all of them may have different shapes, as long as at least a part of the recesses of the plates 1A and 1B face each other when the plates 1A and 1B or the plates 1A, 1B, and 1C are brought into contact, and a cooling channel is formed. The cross-section of the cooling channel on the surface where the recesses of the plates 1A and 1B face each other is not limited to a circular shape, and may be square, rectangular, elliptical, etc. The dimensions of the recesses are not limited to the ranges of the exemplified values. The dimensions of the plates 1A and 1B are not limited to the exemplified ranges either.

[0067] In addition, in each of the above embodiments, the fins 19 formed on the surface of the concave portion were formed along the direction in which the coolant flows as shown in FIGS. 9(a) and 9(b). However, they may be formed along a direction intersecting the direction in which the coolant flows to promote the absorption and agitation of the heat of the coolant. Alternatively, instead of the fins 19, minute grooves, irregularities, etc. may be formed to promote the absorption and agitation of the heat of the coolant, or the shape of the concave portion may be used to absorb and agitate the heat of the refrigerant without performing any processing on the surface of the concave portion.

[0068] In the above Embodiments 1 and 2, the concave portions 11 and 15 were arranged such that the center C and the position M were aligned and the centers P1 and P2 of the semi-circles were overlapped. However, they may be arranged under either one of the conditions of aligning the center C and the position M or overlapping the centers P1 and P2 of the semi-circles.

[0069] In addition, in each of the above embodiments, the plates 1A and 1B or the plates 1A, 1B, and 1C were joined by pressing and closely adhering them to each other. However, a joint portion by brazing may be formed at the contact portions of the plates 1A and 1B or the plates 1A, 1B, and 1C with each other. Alternatively, a joint portion by diffusion bonding may be formed at the contact portions of the plates 1A and 1B or the plates 1A, 1B, and 1C with each other, or a joint portion by friction stir bonding may be formed. Thereby, the contact thermal resistance can be reduced, and furthermore, the effect of improving the heat dissipation performance can be obtained.

[0070] In each of the above embodiments, the plates 1A and 1B or the plates 1A, 1B, and 1C were joined, but instead of being joined, they may be in contact or close contact with each other to form a flow path. For example, the plates 1A and 1B or the plates 1A, 1B, and 1C may be fixed by bolts, caulking, etc. so as to be in contact or close contact with each other to form a flow path. Alternatively, a hinge or an opening / closing part made of rubber, resin, etc. may be attached to one end of the plate 1A and 1B or the plates 1A, 1B, and 1C, and a snap lock, a drawer catch, etc. may be provided at the other end so that the main surfaces 20 and 30 or the main surfaces 20 and 60, and the main surfaces 30 and 61 are in contact or close contact with each other to form a flow path. Also, packing may be provided around the four circumferences of the main surfaces 20 and 30 or the main surfaces 20, 30, 60, and 61.

[0071] In the above Embodiments 1, 2, and 4, the plates 1A and 1B have different positions of the opening 18, but after manufacturing the plates 1A and 1B in the same shape without providing the opening 18, the plates 1A and 1B can be manufactured from the same mold by forming the opening 18. Alternatively, for both the plates 1A and 1B, openings 18 may be formed at both ends in the X-axis direction of the trenches 12, 13, 16, and 17 during plate manufacturing, and the unused openings 18 may be plugged.

[0072] In each of the above embodiments, the mounting Surface 10 was provided in the range of the main surface 20 of the plate 1A where the recess 11 was formed on the back surface, but it may also be provided in the range where the trenches 12 and 13 are formed on the back surface.

[0073] Also, in each of the above embodiments except for Embodiment 5, the plates 1A and 1B were made of aluminum, but materials with high thermal conductivity such as copper, iron, stainless steel, ceramics, and resin may be used. In Embodiment 5, the plate 1A was made of aluminum, but materials with high thermal conductivity such as copper, iron, and stainless steel may be used. The plate 1B was made of polycarbonate, but a resin material such as nylon or polypropylene may be used as long as it has a lower thermal conductivity than the plate 1A. In Embodiment 6, the plate 1C was made of polycarbonate, but a resin material such as nylon or polypropylene may be used, or other inexpensive materials with a lower thermal conductivity than the plates 1A and 1B may be used.

[0074] In each of the above embodiments, a coolant was used as the refrigerant of the cooler 1, but a gas may be used as the refrigerant.

[0075] In each of the above embodiments, the recesses 11 and 15, the trenches 12 and 13, etc. were formed in the plates 1A and 1B by pressing, but they may be formed by forging, die casting, casting, 3D printing, etc.

[0076] In the above-described Embodiment 6, the cooling channel was formed by bringing into contact the plate 1C having holes penetrating the plate between the plate 1A and the plate 1B. However, two or more plates each having holes penetrating the plate may be arranged between the plate 1A and the plate 1B. Further, in the above-described Embodiment 6, the cooler 1 had the plate clamping portions 90, 90 formed at the +-X direction ends of the plate 1A and the plate clamping portions 91, 91 formed at the +-X direction ends of the plate 1B. However, for example, it may be configured to have plate clamping portions that protrude by the thickness of the plate 1C at the +X direction end of the plate 1A and protrude by the thickness of the plate 1C at the -X direction end of the plate 1B. Alternatively, no plate clamping portion may be formed in the cooler 1. For example, as shown in FIG. 25, header components 51, 52 may be formed in the plate 1C. The header component 51 having a substantially C shape in the XZ plane view communicates with the trenches 12, 16, and the header component 52 having a substantially C shape in the XZ plane view communicates with the trenches 13, 17. The dimensions of the plates 1A, 1B, 1C in the X-axis direction and the Z-axis direction are the same. Alternatively, as shown in FIGS. 26, 27(a), and 27(b), plate support portions 92 that protrude by the thickness of the plate 1C are formed at the -X direction end of the plate 1A and the -Z direction end of the trench 13, and plate support portions 93 that protrude by the thickness of the plate 1C are formed at the -X direction end of the plate 1B and the +Z direction end of the trench 16. This cooler 1 is configured such that the plate support portions 92, 92, 93, 93 surround the four sides of the plate 1C without a gap in the XZ plane view, sandwich the plate 1C between the plate 1A and the plate 1B, and connect the recesses 11, 15 to the through holes 50. Therefore, in the cooler 1 shown in FIGS. 26, 27(a), and 27(b), while surrounding the four sides of the plate 1C by the plate support portions 92, 93, the main surface 20 of the plate 1A and the main surface 30 of the plate 1B are respectively in contact with the main surfaces 60, 61 of the plate 1C. Thus, the positioning of the plate 1C becomes easy, and the cooler 1 can be assembled easily and quickly.

[0077] In each of the above-described embodiments, the inlet pipe 3 and the outlet pipe 4 were connected in the +X direction, but either one of them may be connected in the -X direction.

[0078] In the above-described Embodiment 8, a large cooling channel 8 was formed at the center of the cooler 1 in a view from the XZ plane, and small sub-cooling channels 9 were formed on the +X-direction end side and the -X-direction end side thereof. In the cooler 1, for example, large cooling channels may be formed on the +X-direction end side and the -X-direction end side, and a small cooling channel may be formed at the center. Alternatively, the central cooling channel, the cooling channel on the +X-direction end side, and the cooling channel on the -X-direction end side may each have a different size, and the position of the boundary at which the size of the cooling channel changes may also be other than the position indicated by the two-dot chain line L. Further, the cooling channel may be smaller than the sub-cooling channel, and the cooling channel and the sub-cooling channel may be distinguished regardless of their sizes. Also in Embodiment 7, the position of the boundary at which the presence or absence of the cooling channel changes may be other than the position indicated by the two-dot chain line L.

[0079] In the above-described Embodiment 7, the heat-generating body 7c that is not cooled was mounted on the general mounting portion 70. However, for example, a heat-generating body that is not cooled may be mounted on the main surface 40 of the plate 1B having a low thermal conductivity.

[0080] The present disclosure can be implemented in various embodiments and modifications without departing from the broad spirit and scope of the present disclosure. Also, the above-described embodiments are for explaining the present disclosure and do not limit the scope of the present disclosure. That is, the scope of the present disclosure is indicated not by the embodiments but by the claims. And various modifications made within the scope of the claims and within the scope of the meaning of the disclosure equivalent thereto are considered to be within the scope of the present disclosure. That is, although the present disclosure describes various exemplary embodiments, the various features, aspects, and functions described in one or more of the embodiments are not limited to the application to a specific embodiment, but can be applied to the embodiments alone or in various combinations. Therefore, countless modifications that are not illustrated are assumed to be within the scope of the technology disclosed in the present specification. For example, it includes the case where at least one component is deformed, added, or omitted, and further, the case where at least one component is extracted and combined with the components of other embodiments.

[0081] This application is based on Japanese Patent Application No. 2022-027798 filed on February 25, 2022. The entire specification, claims, and drawings of Japanese Patent Application No. 2022-027798 are incorporated herein by reference.

Description of Reference Numerals

[0082] 1 Cooler, 1A, 1B, 1C Plates, 3 Inlet Pipe, 4 Outlet Pipe, 5 Inlet Header, 6 Outlet Header, 7, 7a, 7b, 7c, 7d Heating Elements, 8 Cooling Flow Path, 9 Sub-Cooling Flow Path, 10, 41 Mounting Surfaces, 11, 15, 81, 82 Recesses, 12, 13, 16, 17 Trenches, 18 Openings, 19 Fins, 20, 30, 40, 60, 61 Main Surfaces, 50 Through-Holes, 51, 52 Header Components, 70 General Mounting Portion, 80 Sub-Mounting Portion, 90, 91 Plate Clamping Portions, 92, 93 Plate Support Portions.

Claims

1. A first plate, which is a solid material having one main surface formed with a mounting portion on which a heat-generating body to be cooled is mounted, and a plurality of first recesses formed on the other main surface facing the one main surface; A second plate, which is a solid material having a plurality of second recesses formed on one main surface and arranged such that the one main surface faces the other main surface of the first plate; Comprising: One end of each of the first recesses and the second recesses faces the other, and the other ends are respectively arranged to face one ends of other second recesses and first recesses, thereby alternately communicating to form at least one cooling flow path including a flow path extending in a direction approaching the mounting portion and a flow path extending in a direction moving away from the mounting portion; When the coolant flows through the cooling flow path, the coolant can approach the heat-generating body by passing alternately through the first recess and the second recess, and then move away from the heat-generating body; A cooler.

2. A first plate having one main surface formed with a mounting portion on which a heat-generating body to be cooled is mounted, and a plurality of first recesses formed on the other main surface facing the one main surface; A second plate having a plurality of second recesses formed on one main surface and arranged such that the one main surface faces the other main surface of the first plate; Comprising: One end of each of the first recesses and the second recesses faces the other, and the other ends are respectively arranged to face one ends of other second recesses and first recesses, thereby alternately communicating to form at least one cooling flow path including a flow path extending in a direction approaching the mounting portion and a flow path extending in a direction moving away from the mounting portion; The plurality of first recesses and the plurality of second recesses are arranged in a staggered manner with respect to a direction intersecting the direction in which the cooling flow path extends when viewed in the normal direction of the main surface of each plate; A cooler.

3. A first plate having one main surface formed with a mounting portion on which a heat-generating body to be cooled is mounted, and a plurality of first recesses formed on the other main surface facing the one main surface; A second plate having a plurality of second recesses formed on one main surface and arranged such that the one main surface faces the other main surface of the first plate; Comprising: The first concave portion and the second concave portion are arranged such that one end of each faces the other, and the other ends face one end of another second concave portion and a first concave portion, respectively, thereby forming at least one cooling channel including a channel extending in a direction approaching the mounting portion and a channel extending in a direction away from the mounting portion, which communicate alternately. The plurality of first concave portions and the plurality of second concave portions are formed such that, when viewed in the normal direction of the main surface of each plate, the straight lines connecting the one ends and the other ends of each other intersect, and the cooling channels are formed to meander when viewed in the normal direction. Cooler.

4. The cooling channels are arranged in parallel in a direction intersecting the direction in which the cooling channels extend when viewed in the normal direction of the main surface of each plate. The cooler according to claim 1.

5. On the other main surface of the second plate, a mounting portion on which another heat generating body can be mounted is further formed. The heat generating body or the other heat generating body can be mounted on the first plate and the second plate simultaneously. The cooler according to claim 1.

6. The plurality of first concave portions and the plurality of second concave portions have the same shape as each other. The cooler according to claim 1.

7. The first plate and the second plate have the same shape as each other. The cooler according to claim 1.

8. A first plate having a mounting portion on one main surface where a heat generating body to be cooled is mounted, and a plurality of first concave portions formed on the other main surface facing the one main surface. A second plate having a plurality of second concave portions formed on one main surface, and arranged such that the one main surface faces the other main surface of the first plate. Comprising The first concave portion and the second concave portion are arranged such that one end of each faces the other, and the other ends face one end of another second concave portion and a first concave portion, respectively, thereby forming at least one cooling channel including a channel extending in a direction approaching the mounting portion and a channel extending in a direction away from the mounting portion, which communicate alternately. The second plate is formed of a material having a lower thermal conductivity than the first plate. Cooler.

9. A first plate having a mounting portion on one main surface where a heat generating body to be cooled is mounted, and a plurality of first concave portions formed on the other main surface facing the one main surface. A second plate having a plurality of second recesses formed on one main surface, the second plate being arranged such that the one main surface faces the other main surface of the first plate; A third plate having a plurality of through holes and having a lower thermal conductivity than the first plate and the second plate; Comprising: One end of the first recess and the second recess face each other, and the other ends are respectively arranged to face one end of the other second recess and the first recess, so as to be alternately communicated to form at least one cooling channel including a channel extending in a direction approaching the mounting portion and a channel extending in a direction away from the mounting portion; The other main surface of the first plate and the one main surface of the second plate are close to each other and are respectively in contact with the main surface of the third plate; One end of the first recess and the second recess face each other through the through hole, and the other ends are arranged to face one end of the other first recess or second recess through the other through hole, so as to be alternately communicated to form the cooling channel; A cooler.

10. The other main surface of the first plate and the one main surface of the second plate are arranged in contact with each other. The cooler according to Claim 1.

11. On at least one of the first plate and the second plate, a general mounting portion is formed on which a heating element that is not cooled by a refrigerant is mounted. When viewed in the normal direction of the main surface of each plate, in the direction away from the normal direction from the general mounting portion, the plurality of first recesses and the plurality of second recesses are not formed on the first plate and the second plate. The cooler according to Claim 1.

12. On at least one of the first plate and the second plate, a sub-mounting portion is formed on which a heating element that performs less or more cooling than the mounting portion is mounted. On the first plate, a plurality of third recesses having different sizes from the plurality of first recesses are further formed. On the second plate, a plurality of fourth recesses having the same size as the third recesses are further formed. One end of the third recess and the fourth recess face each other, and the other ends are arranged to face one end of the other third recess or the other fourth recess, so as to be alternately communicated to form a plurality of sub-cooling channels including a channel extending in a direction approaching the sub-mounting portion and a channel extending in a direction away from the sub-mounting portion. The cooler according to Claim 1.

13. A first plate which is a solid material having a mounting portion of a heating element formed on one main surface and a plurality of first recesses formed on the other main surface, and a second plate which is a solid material having a plurality of second recesses on one main surface are prepared; The other main surface of the first plate and one main surface of the second plate are arranged such that the first recesses and the second recesses face each other at one end, and the plurality of first recesses and the plurality of second recesses are communicated to form a plurality of cooling channels; including; When the coolant flows through the plurality of cooling channels, the coolant can approach the heating element by passing through the first recesses and the second recesses alternately, and then move away from the heating element; A method for manufacturing a cooler.

14. After the arranging step, a pressing step of pressing and adhering the first plate and the second plate to each other is provided; The method for manufacturing a cooler according to claim 13.

15. After the arranging step, a step of brazing, diffusion bonding, or friction stir bonding the first plate and the second plate to each other is provided; The method for manufacturing a cooler according to claim 13.

16. A first plate which is a solid material having a mounting portion of a heating element formed on one main surface and a plurality of first recesses formed on the other main surface, and a second plate which is a solid material having a plurality of second recesses on one main surface are prepared; The other main surface of the first plate and one main surface of the second plate are arranged such that the first recesses and the second recesses face each other at one end, and the plurality of first recesses and the plurality of second recesses are communicated to form a plurality of cooling channels, including; The arranging step includes sandwiching one or more third plates having through holes between the first plate and the second plate, and communicating the first recesses and the second recesses through the through holes; A method for manufacturing a cooler.

17. A semiconductor device comprising the cooler according to any one of claims 1 to 12 and a semiconductor element mounted on the mounting portion; and.

18. A method for manufacturing a semiconductor device, comprising manufacturing a cooler by the method for manufacturing a cooler according to any one of claims 13 to 16, and mounting the heating element on the mounting portion.

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