Method for manufacturing a semiconductor module and method for manufacturing an electronic device

Abstract

The method for manufacturing a semiconductor module includes a step of feeding out a release liner (5) with a protective tape (3) attached along a release member (6) that peels the protective tape (3) from the release liner (5), a step of deforming a swing portion (32) while peeling the protective tape (3) from the release liner (5) by the release member (6) to separate the adhesives in the ventilation portion (30), and a step of attaching the protective tape (3) peeled from the release liner (5) to a package.

Description

Technical Field

[0001] The present disclosure relates to a method for manufacturing a semiconductor module and a method for manufacturing an electronic device.

Background Art

[0002] Conventionally, a semiconductor module is known to have a package with a hollow structure and semiconductor device components mounted inside the hollow of the package. A protective tape covering the hollow interior is attached to the package to prevent damage such as scratches on the semiconductor device components or the attachment of floating foreign matter. The protective tape is selected in terms of the material and the adhesive force of the tape in view of the surface state of the package or the reliability of the product. When the air inside the hollow of the package covered with the protective tape expands due to heating or contracts due to cooling, it is necessary to relieve the pressure difference between the hollow interior and the outside. For example, Patent Document 1 discloses a configuration in which a vent cut connecting the hollow interior and the outside of the package is formed.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in a configuration where a cut is formed in the protective tape as in the technique disclosed in Patent Document 1, there is a risk that the adhesive of the cut will self-fuse and remain stuck during manufacturing. If the adhesive of the cut remains self-fused, the hollow interior of the package cannot communicate with the outside, and when the air in the hollow interior of the package covered with the protective tape expands due to heating or contracts due to cooling, the pressure difference between the hollow interior and the outside cannot be relieved. As a result, there is a risk that the protective tape will peel off from the package or that the protective tape will droop into the hollow interior.

[0005] The present disclosure has been made in view of the above, and an object thereof is to obtain a method for manufacturing a semiconductor module that suppresses self-fusion of a ventilation portion formed by cutting in a protective tape and allows ventilation between the hollow interior and the outside of a package.

Means for Solving the Problems

[0006] In order to solve the above-described problems and achieve the object, a method for manufacturing a semiconductor module according to the present disclosure includes a package having a hollow structure and a semiconductor device component mounted in the hollow interior of the package, and a protective tape in which a ventilation portion and a swing portion functioning as a valve of the ventilation portion are formed by a cut is attached so as to cover the hollow interior of the package. The method includes a step of feeding out a release liner to which the protective tape is attached along a release member that peels the protective tape from the release liner, a step of deforming the swing portion while peeling the protective tape from the release liner by the release member to separate the adhesives in the ventilation portion, and a step of attaching the protective tape peeled from the release liner to the package.

Effects of the Invention

[0007] According to the method for manufacturing a semiconductor module according to the present disclosure, there is an effect that self-fusion of a ventilation portion formed by cutting in a protective tape can be suppressed and ventilation between the hollow interior and the outside of a package can be achieved.

Brief Description of the Drawings

[0008]

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Mode for Carrying Out the Invention

[0009] Hereinafter, a method for manufacturing a semiconductor module and a method for manufacturing an electronic device according to an embodiment of the present disclosure will be described in detail with reference to the drawings.

[0010] Embodiment. FIG. 1 is a perspective view showing a state of attaching a protective tape to a semiconductor module according to an embodiment. As shown in FIG. 1, the semiconductor module 100 according to the embodiment includes a package 1 having a hollow structure and a semiconductor device component 2 mounted in a hollow interior 10 of the package 1.

[0011] Package 1 is manufactured, for example, by forming an opening in a laminated glass-epoxy substrate or BT resin substrate with a circuit pattern formed thereon by cutting, creating a resin frame on the substrate by dispensing, adhering a frame 11 of another component to the substrate with an adhesive or the like, or molding the substrate by transfer molding. The material used for dispensing is, for example, silicone, acrylic, epoxy, or the like. The material of the frame 11 is glass, metal, glass-epoxy, BT resin, or other resin components, etc. Silicone, acrylic, epoxy, or the like is used as the adhesive. Note that the frame 11 may be joined using a metal such as solder or Ag instead of the method of adhering it to the substrate with an adhesive or the like. The hollow interior 10 of Package 1 may be a single illustrated space or may be configured to be partitioned into a plurality of spaces. A protective tape 3 covering the hollow interior 10 is attached to the frame 11 forming the outer periphery of Package 1. The protective tape 3 is provided to prevent damage to the semiconductor device component 2 mounted in the hollow interior 10 or contamination by floating foreign matter adhering thereto. The protective tape 3 is peeled off from Package 1 after the semiconductor module 100 is mounted on a circuit board or the like.

[0012] The semiconductor device component 2 is, for example, an optical element such as an LED (Light Emitting Diode) or PD (Photo Diode), MEMS (Micro Electro Mechanical Systems), a high-frequency device, or an integrated module, etc. The semiconductor device component 2 is not limited to the one illustrated and a plurality of them may be provided, or there may be a plurality of types.

[0013] The protective tape 3 is an adhesive tape with an adhesive applied to the surface of a base material. The protective tape 3 can be attached to the package 1 and has an adhesiveness such that it can be peeled off from the package 1. The material of the base material is a film such as polyimide, fluororesin or cellophane, a metal foil such as aluminum, or a fiber such as paper or cloth. The material of the adhesive is acrylic, silicone, urethane or rubber, etc. The materials of the base material and the adhesive are determined from the application, the surface state of the adherend such as the package 1, and the processing process. For example, when heat resistance is required and the adhesion of outgas becomes a problem, the base material is made of polyimide and an acrylic-based adhesive is used.

[0014] In addition to the rectangular shape shown in FIG. 1, the protective tape 3 may have a shape such as a circular shape or other polygons. Also, as long as the protective tape 3 can cover the hollow interior 10 of the package 1, it may have a size that protrudes from the frame body 11 of the package 1. Further, the protective tape 3 may have a shape having a knob for peeling it off from the package 1 using tweezers or the like. Also, when the hollow interior 10 of the package 1 is partitioned into a plurality of spaces, only a part of the partitioned hollow interior 10 may be covered with the protective tape 3.

[0015] Further, the protective tape 3 is divided into an adhesion region attached to the frame body 11 and in close contact with the package 1, and a non-adhesion region covering the hollow interior 10 and not in close contact with the package 1. In the non-adhesion region of the protective tape 3, a ventilation portion 30 and a swing portion 32 that functions as a valve for the ventilation portion 30 are formed by a cut. The ventilation portion 30 is formed to relieve the air pressure difference with the outside when the air in the hollow interior 10 of the package 1 covered by the protective tape 3 expands due to heating or contracts due to cooling. As an example, one ventilation portion 30 is formed at the center of the protective tape 3. Note that the number of the ventilation portions 30 is not limited to the one shown in the figure, and two or more may be formed. Also, the position where the ventilation portion 30 is formed is not limited to the center shown in the figure, and it may be formed at other locations such as a position avoiding directly above the semiconductor device component 2.

[0016] FIG. 2 is an explanatory diagram showing the shapes of the ventilation portion and the swing portion formed in the protective tape in the embodiment. As shown in FIG. 2, the ventilation portion 30 is formed by a first line segment 30a consisting of a linear cut, and a pair of second line segments 30b consisting of linear cuts that are bent approximately 90 degrees from both ends of the first line segment 30a and extend in the same direction. Note that the pair of second line segments 30b is not limited to the configuration in which they are bent approximately 90 degrees from both ends of the first line segment 30a, and may be bent at other angles, for example, bent approximately 45 degrees from both ends of the first line segment 30a. The swing portion 32 is formed by a portion surrounded by the first line segment 30a, the second line segments 30b, and the virtual line segment 31 when the line segment connecting the tip portions of the pair of second line segments 30b is defined as the virtual line segment 31. Note that the lengths and numbers of the line segments constituting the ventilation portion 30 are not limited to the illustrated configuration, and may be determined, for example, by the speed of time until a pressure difference occurs between the internal air and the external air in the hollow interior 10. Also, the cut width of the ventilation portion 30 may be determined based on the size of foreign matter to be suppressed and the constraints of the processing process. Further, when the hollow interior 10 of the package 1 is partitioned into a plurality of spaces, the semiconductor module 100 may have a structure in which a specific partitioned hollow interior 10 is covered with the protective tape 3 having the above-described configuration, and the other partitioned hollow interiors 10 are ventilated by different methods.

[0017] FIG. 3 is a perspective view showing a tape material with a protective tape attached to a release liner in the embodiment. As shown in FIG. 3, the protective tape 3 before being attached to the package 1 is supplied in a state of being attached to the release liner 5. The release liner 5 is paper or film having a release coat on its surface. The outer shape and the vent portion 30 of the protective tape 3 are formed by punching using a pinnacle (registered trademark) type or a thomson type or the like, or by laser beams of various wavelengths, with respect to the tape material 200 supplied with the release liner 5 attached thereto in advance. Then, by removing the surplus portion by trimming, a tape material 200 with the protective tape 3 attached to the release liner 5 at a constant pitch is manufactured. The protective tape 3 is attached to the release liner 5 such that the edge of the swing portion 32 along the vent portion 30 faces the direction B in which the protective tape 3 is fed out. The tape material 200 shown in FIG. 3 has a configuration in which the release liner 5 with the protective tape 3 attached in a row is wound in a roll shape. As an example, the protective tape 3 is attached to the release liner 5 such that one of the corners of the rectangular shape faces the direction B in which the protective tape 3 is fed out. Note that the tape material 200 is not limited to the configuration wound in a roll shape, and may have, for example, a configuration in which the protective tape 3 is attached to the sheet-shaped release liner 5 in a lattice pattern, or other configurations.

[0018] FIG. 4 is an explanatory diagram showing Modification Example 1 of the shapes of the ventilation part and the swing part formed in the protective tape in the embodiment. The ventilation part 30A of Modification Example 1 shown in FIG. 4 includes a first line segment 30a composed of a linear cut, a pair of second line segments 30b composed of linear cuts that bend approximately 90 degrees from both ends of the first line segment 30a and extend in the same direction, a pair of third line segments 30c composed of linear cuts that bend approximately 90 degrees from the tips of the respective second line segments 30b and extend in directions away from each other, and a pair of fourth line segments 30d composed of linear cuts that bend approximately 90 degrees from the tips of the respective third line segments 30c and are opposed to the second line segments 30b. Note that the angles at which the pair of second line segments 30b, the pair of third line segments 30c, and the pair of fourth line segments 30d bend from adjacent line segments are not limited to approximately 90 degrees, and other angles may be used. The swing part 32 is formed by the portion surrounded by the first line segment 30a, the second line segment 30b, and the virtual line segment 31 when the line segment connecting the tip portions of the pair of second line segments 30b is defined as the virtual line segment 31. In the ventilation part 30A of Modification Example 1, since the pair of third line segments 30c and the pair of fourth line segments 30d function as returns, it is possible to suppress the situation where the cut tears due to the deformation of the swing part 32.

[0019] FIG. 5 is an explanatory diagram showing Modification Example 2 of the shapes of the ventilation part and the swing part formed in the protective tape in the embodiment. The ventilation part 30B of Modification Example 2 shown in FIG. 5 is formed by a V-shaped cut. The swing part 32 is formed by the portion surrounded by the ventilation part 30B and the virtual line segment 31 when the line segment connecting both ends of the V shape is defined as the virtual line segment 31.

[0020] FIG. 6 is an explanatory diagram showing Modification Example 3 of the shapes of the ventilation part and the swing part formed in the protective tape in the embodiment. The ventilation part 30C of Modification Example 3 shown in FIG. 6 is formed by an arc-shaped cut. The swing part 32 is formed by the portion surrounded by the ventilation part 30C and the virtual line segment 31 when the line segment connecting both ends of the arc is defined as the virtual line segment 31.

[0021] FIG. 7 is an explanatory view showing a fourth modification of the shapes of the ventilation portion and the swing portion formed in the protective tape in the embodiment. The ventilation portion 30D of the fourth modification shown in FIG. 7 is formed by a U-shaped cut including an arc. The swing portion 32 is formed by a portion surrounded by the ventilation portion 30D and a virtual line segment 31 when a line segment connecting both ends of the U-shape is defined as the virtual line segment 31.

[0022] FIG. 8 is an explanatory view showing a fifth modification of the shapes of the ventilation portion and the swing portion formed in the protective tape in the embodiment. The ventilation portion 30E of the fifth modification shown in FIG. 8 is formed by an H-shaped cut. The swing portion 32 is formed by a portion surrounded by the ventilation portion 30E and a virtual line segment 31 when a line segment connecting the ends of two opposing line segments is defined as the virtual line segment 31.

[0023] Next, an assembly procedure of the electronic device 300 including the semiconductor module 100 will be described. FIG. 9 is a flowchart showing the assembly procedure of the electronic device having the semiconductor module according to the embodiment. FIG. 10 is a perspective view showing a state in which a protective tape is attached to a package of the electronic device having the semiconductor module according to the embodiment. FIG. 11 is a perspective view showing a state in which the protective tape is peeled off from the package of the electronic device having the semiconductor module according to the embodiment.

[0024] First, as shown in FIG. 1, semiconductor device components 2 are mounted in the hollow interior 10 of the package 1 (step S10), and a protective tape 3 is attached to the frame 11 of the package 1 to cover the hollow interior 10 of the package 1 with the protective tape 3 (step S11). Next, as shown in FIG. 10, the semiconductor module 100 is reflow soldered to the circuit board 4 (step S12). For example, when using Sn-Ag-Cu solder or the like, the reflow temperature is set at 260°C. Finally, as shown in FIG. 11, the protective tape 3 is peeled off from the package 1 of the semiconductor module 100 to create the electronic device 300 (step S13). To peel the protective tape 3 from the package 1, for example, a part of the protective tape 3 may be made to protrude from the frame 11 of the package 1 and grasped with tweezers or the like and turned up, or a peeling tape having an adhesive strength higher than that of the protective tape 3 may be attached from above the protective tape 3 and the protective tape 3 may be turned up together with the peeling tape, or a device for automatically peeling the protective tape 3 may be used. Further, as the protective tape 3, a material formed of a material whose adhesive strength decreases when heat is applied may be used. Examples of the material whose adhesive strength decreases when heat is applied include silicone or acrylic.

[0025] In step S12, instead of reflow soldering, heating using a hot plate, heating using a drying oven, or heating using an induction heating device may be performed. The heating temperature may be determined by the curing temperature of the material used for fixing. Further, in step S12, in addition to the above steps, a step in which an air pressure difference occurs between the hollow interior 10 of the package 1 and the outside may be performed. For example, in step S12, instead of reflow soldering, dehumidification by heating or evacuation, or aging in which a temperature rise occurs may be performed. Further, the step of step S10 may be omitted. Further, in step S12, when dehumidification by heating or evacuation, or aging in which a temperature rise occurs is performed, thereafter, fixing without a temperature rise may be performed on the circuit board 4.

[0026] Incidentally, in the protective tape 3, the material and the tape adhesion are selected in consideration of the surface state of the package 1 or the reliability of the product. For example, when the surface of the adherend such as the package 1 is uneven or has a release property, it is necessary to use an adhesive tape with high adhesion. When a tape with high adhesion is manufactured by punching, in order to form the ventilation part 30 using a thin blade of 10 to 20 microns, the interval between the adhesives is very narrow, and there is a risk that the adhesives will self-fuse. If the adhesives of the ventilation part 30 self-fuse, ventilation cannot be achieved between the hollow interior 10 of the package 1 and the outside. When the air in the hollow interior 10 expands due to heating, it may not be able to withstand the internal air pressure of the hollow interior 10, and there is a risk that the protective tape 3 will peel off from the package 1. Further, when the air in the hollow interior 10 cools and contracts, the protective tape 3 may bend and come into contact with the semiconductor device component 2. Note that even when the ventilation part 30 is formed in the tape by laser processing, there is a risk that the same problem may occur depending on the processing width.

[0027] FIG. 12 is an explanatory view showing a state of peeling the protective tape in the embodiment from the release liner. Therefore, as shown in FIG. 12, in the manufacturing method of the semiconductor module 100 according to the embodiment, while peeling the protective tape 3 from the release liner 5 by the release member 6 formed of a triangular prism-shaped block made of metal or the like, the swing part 32 surrounded by the ventilation part 30 is deformed to separate the adhesives of the ventilation part 30. Hereinafter, the procedure for attaching the protective tape 3 to the package 1 will be specifically described.

[0028] FIG. 13 is a flowchart showing the procedure for attaching the protective tape in the embodiment to the package. FIG. 14 is an explanatory view showing the procedure for peeling the protective tape in the embodiment from the release liner.

[0029] As shown in FIG. 14(a), first, the release liner 5 on which the protective tape 3 is mounted is pulled out along the surface of the release member 6 in the pulling direction A 1 from the pulling direction A bent at an acute angle 2Feed it toward (Step S20). The feeding of the release liner 5 is performed by a take-up machine (not shown) located at the tip in the pulling-out direction A. 2 The release liner 5 is bent at an acute angle as the direction in which it is pulled out is switched by the edge portion 60 which is the apex angle of the peeling member 6. Further, as shown in FIG. 12, the protective tape 3 is fed out so that the first line segment 30a of the ventilation portion 30 is parallel to the edge of the edge portion 60 of the peeling member 6. The acute angle of the peeling member 6 is selected so that the swing portion 32 of the ventilation portion 30 can be slightly deformed. For example, when the adhesive force between the release liner 5 and the protective tape 3 is high, the angle of the edge portion 60 may be made smaller.

[0030] Next, as shown in FIG. 14(b), peel one end of the protective tape 3 from the release liner 5 with the edge portion 60 of the peeling member 6 (Step S21). The release liner 5 is bent at an acute angle while being pressed against the peeling member 6 and is fed out toward the pulling-out direction A. 2 As a result, the elastic force of the protective tape 3 becomes greater than the adhesive force of the protective tape 3 at the edge portion 60, and one end of the protective tape 3 can be peeled off at the edge portion 60. As a result, the protective tape 3 is fed out toward the pulling-out direction B in front of the peeling member 6.

[0031] When feeding the protective tape 3 in the pulling-out direction B, one end portion of the protective tape 3 may be chucked and supported so that the protective tape 3 does not droop due to its own weight. When chucking one end portion of the protective tape 3, the chucking is performed while matching the speed at which the release liner 5 is fed out so that the protective tape 3 does not bend or tear.

[0032] Next, as shown in FIG. 14(c), separate the adhesives of the protective tape 3 that were self-bonded in the ventilation portion 30 (Step S22). The release liner 5 is further fed out toward the pulling-out direction A, and from the point where the first line segment 30a of the protective tape 3 reaches the edge portion 60, the swing portion 32 follows the release liner 5 and the pulling-out direction A. 2 2 ​It is sent out toward [direction]. On the other hand, among the protective tape 3, other regions than the swing part 32 are sent out toward the drawing direction B. At this time, the adhesives of the protective tape 3 that were self - adhered at the ventilation part 30 are separated by the edge part 60 of the peeling member 6.

[0033] Next, as shown in Fig. 14(d), the release liner 5 is further sent out toward the drawing direction A 2 and the swing part 32 is peeled off from the release liner 5 (step S23). At the location of the edge part 60, the adhesive force of the protective tape 3 in the swing part 32 becomes smaller than the elastic force of the protective tape 3, and one end of the swing part 32 can be peeled off from the edge part 60. At this time, the swing part 32 generates spring - back due to the elastic force and moves in the direction to close the ventilation part 30. However, due to the plastic deformation occurring in the swing part 32, it does not return to the state where the adhesives adhere to each other in all regions of the first line segment 30a and the second line segment 30b that constitute the ventilation part 30, and the edge of the swing part 32 is caught on the adhesive surface of the protective tape 3 facing each other across the first line segment 30a. That is, the ventilation part 30 does not return to the state before starting step S22. In addition, in the first line segment 30a of the ventilation part 30, there may be a state where the adhesive and the base material are partially adhered. However, the adhesive force between the adhesive and the base material is very small compared to the adhesive force between the adhesives. Therefore, even if the adhesive and the base material are partially adhered in the first line segment 30a of the ventilation part 30, it does not prevent ventilation in the ventilation part 30.

[0034] Next, as shown in Fig. 14(e), the release liner 5 is sent out toward the drawing direction A 2Feed it further towards [the destination] to pick up the protective tape 3 (step S24). At this time, pick up the protective tape 3 so that no creases are formed. As the means for picking up the protective tape 3, the protective tape 3 may be adsorbed using a suction nozzle, or the end of the protective tape 3 may be gripped. When adsorbing the protective tape 3, be careful not to touch the ventilation part 30 and not to suck in the swing part 32. Note that the protective tape 3 does not necessarily have to be picked up, and it may be fed out towards the pulling direction B and directly pasted onto the frame 11 of the package 1.

[0035] Next, paste the protective tape 3 onto the frame 11 of the package 1 (step S25). The protective tape 3 is pasted onto the frame 11 of the package 1 so as to cover the hollow interior 10 of the package 1. When accuracy of the pasting position of the protective tape 3 is required, for example, relative alignment by image recognition or the like may be performed.

[0036] Finally, press the protective tape 3 against the frame 11 using a roller, a stamp, or the like so that the protective tape 3 adheres closely to the frame 11 (step S26). Thereby, air bubbles trapped between the surfaces of the protective tape 3 and the package 1 can be removed. The component for pressing the protective tape 3 is an elastic member such as urethane or silicone, plastic, metal, or the like. When the frame 11 is soft, a stamp with a shape that penetrates to form a hollow state may be used to press the entire surface of the frame 11 all at once. Also, as the component for pressing the protective tape 3, a rectangular stamp and an L-shaped stamp may be used to sequentially press the protective tape 3 pasted on each part of the frame 11. Note that in the process of step S25, the process of step S26 may also be combined.

[0037] FIG. 15 is an explanatory diagram showing a modified example of a tape material with a protective tape attached to a release liner in the embodiment. The protective tape 3 is not limited to the configuration in which one of the corner portions of the rectangular shape faces the feeding direction B as shown in FIG. 12 and is attached to the release liner 5. As shown in FIG. 15, the protective tape 3 may be attached to the release liner 5 such that one side of the rectangular shape is parallel to the edge of the edge portion 60 of the peeling member 6. At this time, the ventilation portion 30 is formed such that the first line segment 30a is parallel to the edge of the edge portion 60 of the peeling member 6.

[0038] FIG. 16 is an explanatory diagram showing a state in which the protective tape in the embodiment is peeled off from the release liner and showing a form different from that in FIG. 12. As shown in FIG. 16, the peeling member 6 may be installed at an inclination with respect to the feeding direction B in which the protective tape 3 is fed. Also in this case, the ventilation portion 30 is formed such that the first line segment 30a is parallel to the edge of the edge portion 60 of the peeling member 6.

[0039] FIG. 17 is an explanatory diagram showing a modified example of the peeling member in the embodiment. As shown in FIG. 17, in the manufacturing method of the semiconductor module 100 according to the embodiment, the peeling member 6A made of a roller formed of metal or the like peels the protective tape 3 from the release liner 5 while deforming the swing portion 32 surrounded by the ventilation portion 30, and the adhesives of the ventilation portion 30 may be separated from each other. Also in this case, the release liner 5 is bent at an acute angle by the peeling member 6A and fed toward the pulling direction A 2 and is sent out.

[0040] FIG. 18 is an explanatory diagram showing a modification of the position of the ventilation portion formed in the protective tape in the embodiment. The white arrow shown in FIG. 18 indicates the direction in which the protective tape 3 is pulled. The size of the white arrow represents the strength with which the protective tape 3 is pulled. Also, the square dashed line indicates the boundary between the adhesion region and the non-adhesion region. The outside of the dashed line is the adhesion region, and the inside of the dashed line is the non-adhesion region. The ventilation portion 30 shown in FIG. 18 is formed at a position closer to the adhesion region where the protective tape 3 is attached to the frame body 11 of the package 1. For example, when the air in the hollow interior 10 of the package 1 expands due to heating, as indicated by the white arrow, the protective tape 3 in the non-adhesion region that is not in close contact with the package 1 is pulled toward the outer periphery. At this time, the protective tape 3 in the adhesion region hardly deforms. Also, at the center of the protective tape 3, since the force pulling the protective tape 3 by the adhesion region is canceled out, the force pulling the swing portion 32 becomes weaker. That is, by forming the ventilation portion 30 at a position closer to the adhesion region, the force pulling the swing portion 32 toward the outer periphery is suppressed, so the ventilation portion 30 does not expand, and the state where the swing portion 32 is caught by the protective tape 3 facing each other across the first line segment 30a is maintained. If, when the air inside the package 1 expands due to heating, the deformation of the swing portion 32 is large, the ventilation portion 30 may expand and the state where the swing portion 32 is caught by the protective tape 3 may be released, and the swing portion 32 may return to the position before separating the adhesives. Thereafter, when cooling, there is a possibility that the adhesives of the ventilation portion 30 self-fuse and the ventilation portion 30 closes. Note that this configuration is particularly effective when the linear expansion coefficient of the protective tape 3 is larger than the linear expansion coefficient of the package 1.

[0041] As described above, the method for manufacturing the semiconductor module 100 according to the embodiment includes a step of feeding out the release liner 5 with the protective tape 3 attached thereto along the release member 6 that peels the protective tape 3 from the release liner 5; a step of deforming the swing portion 32 while peeling the protective tape 3 from the release liner 5 by the release member 6 to separate the adhesives in the ventilation portion 30; and a step of attaching the protective tape 3 peeled from the release liner 5 to the package 1. Therefore, in the method for manufacturing the semiconductor module 100 according to the embodiment, the swing portion 32 is deformed to previously separate the adhesives in the ventilation portion 30, so that self-fusion of the ventilation portion 30 can be suppressed, and the hollow interior 10 of the package 1 can be ventilated to the outside. As a result, when the air in the hollow interior 10 of the package 1 covered with the protective tape 3 expands due to heating or contracts due to cooling, the air pressure difference with the outside can be alleviated.

[0042] That is, even when the air in the hollow interior 10 of the package 1 covered with the protective tape 3 expands due to heating, it is possible to suppress a situation where the protective tape 3 partially floats or peels off. In addition, since the contraction of the air in the hollow interior 10 of the package 1 can be suppressed, it is possible to suppress a situation where the protective tape 3 bends toward the hollow interior 10 and contact with the semiconductor device component 2 can be suppressed. As a result, for example, the depth of the hollow interior 10 of the package 1 can be made shallow, so that, for example, the semiconductor module 100 can be miniaturized and the material cost can be reduced. In addition, since it is possible to use the protective tape 3 with weak adhesive force, the operation of peeling the protective tape 3 in the manufacturing process of the electronic device 300 becomes easy, and the adhesive residue caused by using the protective tape 3 with high adhesive force can also be reduced. Further, by manufacturing the protective tape 3 by punching process, which is less expensive than laser processing, the manufacturing cost can be reduced.

[0043] The configuration shown in the above embodiment is an example, and it is possible to combine it with another known technique, and it is also possible to omit or change a part of the configuration without departing from the gist.

Explanation of Reference Numerals

[0044] 1 Package, 2 Semiconductor device components, 3 Protective tape, 4 Circuit board, 5 Release liner, 6, 6A Release member, 10 Hollow interior, 11 Frame body, 30, 30A, 30B, 30C, 30D, 30E Ventilation parts, 30a First line segment, 30b Second line segment, 30c Third line segment, 30d Fourth line segment, 31 Virtual line segment, 32 Swing part, 60 Edge part, 100 Semiconductor module, 200 Tape material, 300 Electronic device.

Claims

1. A hollow structure package; a semiconductor device component mounted within the hollow interior of the package; A method for manufacturing a semiconductor module, in which a protective tape having a ventilation portion and a swing portion functioning as a valve for the ventilation portion formed by a cut is attached to cover a hollow interior of the package, a step of feeding the release liner to which the protective tape has been attached along a peeling member that peels the protective tape from the release liner; a step of deforming the swing portion while peeling the protective tape from the release liner with the peeling member to separate the adhesives in the ventilation portion; applying the protective tape, removed from the release liner, to the package; 2. A method for manufacturing a semiconductor module comprising the steps of:

2. In the step of separating the adhesives from each other in the ventilation portion, the protective tape is peeled off from the release liner by the peeling member while an end of the peeled protective tape is chucked.

2. The method for manufacturing a semiconductor module according to claim 1.

3. In the step of feeding the release liner along the peeling member, the release liner to which the protective tape has been attached is bent at an acute angle by the peeling member that peels the protective tape from the release liner and fed out; In the step of separating the adhesives from each other in the ventilation section, the protective tape is peeled off at a portion where the release liner is bent at an acute angle by the peeling member while deforming the swing section, thereby separating the adhesives from each other in the ventilation section.

3. The method for manufacturing a semiconductor module according to claim 1 or 2.

4. The ventilation portion is formed by a cut including at least two line segments or at least a circular arc.

3. The method for manufacturing a semiconductor module according to claim 1 or 2.

5. the ventilation portion is formed at a position close to a portion where the protective tape is attached to the package when the protective tape is attached to the package.

3. The method for manufacturing a semiconductor module according to claim 1 or 2.

6. a step of mounting the semiconductor module manufactured by the method for manufacturing a semiconductor module according to claim 1 or 2 on a circuit board; and removing the protective tape from the package after mounting the semiconductor module on the circuit board.

2. A method for manufacturing an electronic device comprising the steps of:

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