Inductor component

Abstract

Provided is an inductor component capable of increasing the efficiency of acquisition of inductance. An inductor component according to the present invention is provided with: an element including a first main surface and a second main surface that oppose each other; a coil, at least portion of which is provided inside the element, and that is wound in a spiral along a shaft; and a first external electrode and a second external electrode that are electrically connected to the coil. The coil shaft is disposed parallel to the first main surface. The coil includes: a plurality of first coil wires that are provided on the first main surface side with respect to the shaft and are arranged along the shaft on a plane parallel to the first main surface; a plurality of second coil wires that are provided on the second main surface side with respect to the shaft and are arranged along the shaft on a plane parallel to the second main surface; a plurality of first through wires that are arranged along the shaft and extend from the first coil wires toward the second coil wires; and a plurality of second through wires that are arranged along the shaft, extend from the first coil wires toward the second coil wires, and are provided on the side opposite the first through wires with respect to the shaft. The first coil wires, first through wires, second coil wires, the second through wires are connected in the stated order to constitute at least a portion of a spiral shape. The plurality of first coil wires include a terminal coil wire located at the terminal on one side in the shaft direction. The terminal coil wire has a top surface located on a first direction side from the second main surface side towards the first main surface side, and a first side surface and a second side surface located on either side sandwiching a central line along the extension direction of the terminal coil wire. The first external electrode includes a first section that is in contact with at least of portion of the first side surface, a second section that is in contact with at least of portion of the top surface, and a third section that is in contact with at least of portion of the second side surface. The first section, second section, and third section are continuous in the stated order and constitute a protruding section that protrudes toward the first direction side.

Description

Technical Field

[0001] The present disclosure relates to an inductor component.

Background Art

[0002] Conventionally, as an inductor component, there is one described in Japanese Patent No. 6652280 (Patent Document 1). The inductor component includes a body, a coil provided in the body and wound along the axial direction, and a first external electrode and a second external electrode provided on the body and electrically connected to the coil.

[0003] The coil has a plurality of coil patterns stacked along the axis. The coil patterns adjacent to each other in the axial direction are connected via conductive vias. The coil pattern has a wiring portion extending in a direction orthogonal to the axis, and a pad portion provided at an end of the wiring portion and connected to the conductive via. The width of the pad portion is wider than the width of the wiring portion in order to improve the connectivity between the pad portion and the conductive via.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] By the way, in the inductor component as described above, since the width of the pad portion is wider than the width of the wiring portion, a part of the pad portion is located inside the coil in the radial direction of the coil more than the wiring portion. For this reason, the inner diameter of the coil becomes small, and it cannot be said that the acquisition efficiency of inductance is necessarily high.

[0006] Therefore, an object of the present disclosure is to provide an inductor component capable of increasing the acquisition efficiency of inductance.

Means for Solving the Problems

[0007] To solve the above problems, an inductor component according to one aspect of the present disclosure includes: a base body including a first main surface and a second main surface facing each other; a coil at least partially provided inside the base body and wound spirally along an axis; a first external electrode and a second external electrode provided outside the base body and electrically connected to the coil; and is provided with: the axis of the coil is arranged parallel to the first main surface; the coil includes: a plurality of first coil wirings provided on the first main surface side with respect to the axis and arranged along the axis on a plane parallel to the first main surface; a plurality of second coil wirings provided on the second main surface side with respect to the axis and arranged along the axis on a plane parallel to the second main surface; a plurality of first through wirings extending from the first coil wiring toward the second coil wiring and arranged along the axis; a plurality of second through wirings extending from the first coil wiring toward the second coil wiring and provided on the side opposite to the first through wiring with respect to the axis and arranged along the axis; and includes: the first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to form at least a part of the spiral shape; the plurality of first coil wirings include an outermost coil wiring located at one end in the axial direction; the outermost coil wiring has an upper surface located on the first direction side from the second main surface side toward the first main surface side, and a first side surface and a second side surface located on both sides sandwiching a center line along the extending direction of the outermost coil wiring when viewed from a direction perpendicular to the first main surface; The first external electrode includes a first portion that contacts at least a part of the first side surface, a second portion that contacts at least a part of the upper surface, and a third portion that contacts at least a part of the second side surface. The first portion, the second portion, and the third portion constitute a convex portion that continuously protrudes toward the first direction side in this order.

[0008] According to the above aspect, the coil includes a first coil wiring, a first through wiring, a second coil wiring, and a second through wiring. The first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to constitute at least a part of a spiral shape. Therefore, the inner diameter of the coil can be increased, and the acquisition efficiency of inductance can be improved. Further, by increasing the inductance acquisition efficiency, the Q value can be increased. Furthermore, since the first external electrode has a convex portion protruding toward the first direction side, the surface area is increased compared to the case where it is flat without a convex portion, and for example, the adhesion strength with a connecting member such as solder can be improved. Also, the convex portion of the first external electrode is in contact with the outermost coil wiring, and the first external electrode and the outermost coil wiring are directly connected. Thereby, the DC resistance (Rdc) can be reduced compared to the case where the first external electrode and the outermost coil wiring are connected by, for example, via wiring.

[0009] Preferably, in one embodiment of the inductor component, The thickness of the first external electrode is thinner than the thickness of the first coil wiring.

[0010] According to the above embodiment, the thickness of the inductor component can be reduced.

[0011] Preferably, in one embodiment of the inductor component, The base body contains SiO 2 and.

[0012] According to the above embodiment, insulation and rigidity can be imparted to the base body.

[0013] Preferably, in one embodiment of the inductor component, The first external electrode is composed of a plurality of conductive layers, and includes a conductive layer having a different material from the conductive layer constituting the outermost coil wiring.

[0014] According to the embodiment, characteristics different from those of the outermost coil wiring can be imparted to the first external electrode.

[0015] Preferably, in one embodiment of the inductor component, the first external electrode is continuously provided on the side opposite to the second portion from the first portion of the convex portion, and includes a bottom portion extending in a direction parallel to the first main surface, and a wall portion continuously provided from the bottom portion and extending in the first direction.

[0016] According to the embodiment, the surface area of the first external electrode is further increased, and for example, the adhesion strength with a connection member such as solder can be further improved.

[0017] Preferably, in one embodiment of the inductor component, the first external electrode further includes a fourth portion that is separated from the second portion and is located on the first direction side of the second portion.

[0018] According to the embodiment, since it further includes a fourth portion located on the first direction side of the second portion, the surface area of the first external electrode is further increased, and for example, the adhesion strength with a connection member such as solder can be further improved.

[0019] Preferably, in one embodiment of the inductor component, the first main surface has a concave portion, the concave portion has a stepped side surface, at least a part of the first external electrode is in contact with the side surface and has a shape along the side surface.

[0020] According to the embodiment, the surface area of the first external electrode is further increased, and for example, the adhesion strength with a connection member such as solder can be further improved.

[0021] Preferably, in one embodiment of the inductor component, further comprising an insulator provided on a part of the first main surface, at least a part of the first external electrode is in continuous contact with the insulator, the first main surface, and the first side surface of the convex portion.

[0022] According to the embodiment, since an uneven shape can be imparted to the first external electrode, for example, the adhesion strength with a connecting member such as solder can be further improved.

[0023] Preferably, in one embodiment of the inductor component, the first coil wiring is provided on the first main surface, further comprising an insulator that covers the first coil wiring and has a shape along the shape of the first coil wiring, at least a part of the first external electrode is in contact with the insulator and has a shape along the shape of the first coil wiring.

[0024] According to the embodiment, since at least a part of the first external electrode has a shape along the shape of the first coil wiring, the surface area of the first external electrode is further increased, and for example, the adhesion strength with a connecting member such as solder can be further improved.

[0025] Preferably, in one embodiment of the inductor component, further comprising an organic insulator provided on the first main surface, the element body is an inorganic insulator, and the organic insulator is located inside the outer surface of the inorganic insulator when viewed from a direction perpendicular to the first main surface.

[0026] According to the embodiment, since it has an organic insulator, the organic insulator is easy to impart fluidity. When the first coil wiring is covered with the organic insulator, the organic insulator can be easily filled between adjacent first coil wirings, and the insulation can be improved. Further, since the organic insulator is not in contact with the outer surface of the inorganic insulator, when individual inductor components are separated into individual pieces, the load on the organic insulator can be reduced, and deformation and peeling of the organic insulator can be suppressed.

[0027] Preferably, in one embodiment of the inductor component, When viewed from a direction parallel to the axis, the first through-wiring and the second through-wiring are not parallel.

[0028] According to the embodiment, the distance between the first through-wiring and the second through-wiring can be increased, the inner diameter of the coil can be increased, and the Q value can be increased.

[0029] Preferably, in one embodiment of the inductor component, The base body contains SiO 2 and the first through-wiring contains SiO 2 and.

[0030] According to the embodiment, the linear expansion coefficient of the first through-wiring can be made to match the linear expansion coefficient of the base body, and cracks between the first through-wiring and the base body can be suppressed.

[0031] Preferably, in one embodiment of the inductor component, The first through-wiring contains a void portion or a resin portion.

[0032] According to the embodiment, the stress due to the difference in linear expansion coefficient between the first through-wiring and the base body can be absorbed by the void portion or the resin portion, thereby relaxing the stress.

[0033] Preferably, in one embodiment of the inductor component, The first through-wiring has a conductive layer located on the outer peripheral side when viewed from the extending direction of the first through-wiring, and a non-conductive layer located inside the conductive layer.

[0034] According to the embodiment, when used in a high-frequency band, since the current mainly flows on the surface of the first through-wiring due to the skin effect, providing a conductive layer on the outer peripheral side does not lower the Q value. Also, by providing a non-conductive layer inside, the stress can be relaxed, and the manufacturing cost can be reduced by not using a conductor.

[0035] Preferably, in one embodiment of the inductor component, The axial length of the coil is shorter than the inner diameter of the coil.

[0036] According to the embodiment, since the coil length is short and the coil inner diameter is large, the Q value can be increased.

[0037] Preferably, in one embodiment of the inductor component, The first through wiring extends in a direction perpendicular to the first main surface, The cross-sectional area of at least one of both ends in the extending direction of the first through wiring is larger than the cross-sectional area of the central portion in the extending direction of the first through wiring.

[0038] According to the embodiment, the cross-sectional area of the end portion of the first through wiring can be increased, and the connectivity between the first through wiring and at least one of the first coil wiring and the second coil wiring can be improved. Also, when forming a hole in the base body and filling this hole with a conductive material by electroplating or the like to form the first through wiring in the hole of the base body, it is easy to fill the conductive material on the opening side of the hole. And since the cross-sectional area of the end portion of the first through wiring is large and the cross-sectional area of the central portion of the first through wiring is small, it is easy to form the first through wiring.

[0039] Preferably, in one embodiment of the inductor component, The thickness of the coil component is 200 μm or less.

[0040] According to the embodiment, the inductor component can be made thin.

[0041] Preferably, in one embodiment of the inductor component, When viewed from a direction perpendicular to the first main surface, the first external electrode and the second external electrode are located inside the outer surface of the base body.

[0042] According to the above-described embodiment, since the first external electrode and the second external electrode do not contact the outer surface of the element body, when the individual inductor components are separated into individual pieces, the load applied to the first external electrode and the second external electrode can be reduced, and deformation and peeling of the first external electrode and the second external electrode can be suppressed. Therefore, even if the inductor component is made small, deformation and peeling of the first external electrode and the second external electrode can be prevented.

Effect of the Invention

[0043] According to the inductor component which is one aspect of the present disclosure, the acquisition efficiency of inductance can be increased.

Brief Description of the Drawings

[0044]

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Embodiments for Carrying Out the Invention

[0045] Hereinafter, an inductor component which is an aspect of the present disclosure will be described in detail with reference to the illustrated embodiments. Note that the drawings include some schematic ones and may not reflect actual dimensions and ratios.

[0046] <First Embodiment> The inductor component 1 according to the first embodiment will be described below. FIG. 1 is a schematic bottom view of the inductor component 1 as viewed from the bottom side. FIG. 2 is a cross-sectional view taken along line II-II of FIG. 1. FIG. 3 is a cross-sectional view taken along line III-III of FIG. 1. FIG. 4 is an enlarged view of part A in FIG. 3. In FIG. 1, for convenience, the external electrodes are drawn with a two-dot chain line. Also, in FIG. 1, the element body 10 is drawn transparently so that the structure can be easily understood, but it may be semi-transparent or opaque.

[0047] 1. Outline Configuration The outline configuration of the inductor component 1 will be described. The inductor component 1 is, for example, a surface mount type inductor component used in a high-frequency signal transmission circuit. As shown in FIGS. 1 to 4, the inductor component 1 includes an element body 10, a coil 110 that is at least partially provided inside the element body 10 and wound spirally along the axis AX, and a first external electrode 121 and a second external electrode 122 that are provided outside the element body 10 and electrically connected to the coil 110.

[0048] The base body 10 has a length, a width, and a height. The base body 10 has a first end face 100e1 and a second end face 100e2 at both ends in the length direction, a first side face 100s1 and a second side face 100s2 at both ends in the width direction, and a bottom face 100b and a top face 100t at both ends in the height direction. That is, the outer surface 100 of the base body 10 includes the first end face 100e1 and the second end face 100e2, the first side face 100s1 and the second side face 100s2, and the bottom face 100b and the top face 100t. The bottom face 100b corresponds to an example of the "first main face" described in the claims, and the top face 100t corresponds to an example of the "second main face" described in the claims.

[0049] As shown in the drawings, hereinafter, for convenience of explanation, the length direction (longitudinal direction) of the base body 10 is defined as the X direction. The direction from the first end face 100e1 to the second end face 100e2 is defined as the forward X direction, and the direction opposite to the forward X direction is defined as the reverse X direction. Also, the width direction of the base body 10 is defined as the Y direction. The direction from the first side face 100s1 to the second side face 100s2 is defined as the forward Y direction, and the direction opposite to the forward Y direction is defined as the reverse Y direction. Also, the height direction of the base body 10 is defined as the Z direction. The direction from the bottom face 100b to the top face 100t is defined as the forward Z direction, and the direction opposite to the forward Z direction is defined as the reverse Z direction. The X direction, the Y direction, and the Z direction are mutually orthogonal directions, and when arranged in the order of X, Y, Z, they form a right-handed system. Also, in this specification, the direction from the top face 100t side to the bottom face 100b side is referred to as the first direction D1. The first direction D1 includes not only a direction parallel to the Z direction but also a direction inclined from a direction parallel to the Z direction. In this embodiment, the first direction D1 is the reverse Z direction.

[0050] In this specification, the "outer surface 100 of the base body 10" including the first end surface 100e1, the second end surface 100e2, the first side surface 100s1, the second side surface 100s2, the bottom surface 100b, and the top surface 100t of the base body 10 does not simply mean the surface facing the outer peripheral side of the base body 10, but is the surface that forms the boundary between the outer and inner sides of the base body 10. Also, the "above the outer surface 100 of the base body 10" does not refer to an absolute one-direction such as vertically upward defined by the direction of gravity, but rather, based on the outer surface 100, it refers to the direction towards the outer side among the outer and inner sides with the outer surface 100 as the boundary. Therefore, the "above the outer surface 100" is a relative direction determined by the orientation of the outer surface 100. Further, for a certain element, "above" includes not only the position above the element separated from the element, that is, the upper position via another object on the element or the upper position with a space in between, but also the position directly above in contact with the element (on).

[0051] The axis AX of the coil 110 is arranged parallel to the bottom surface 100b. The coil 110 includes a plurality of bottom wirings 11b provided on the bottom surface 100b side with respect to the axis AX and arranged along the axis AX on a plane parallel to the bottom surface 100b, a plurality of top wirings 11t provided on the top surface 100t side with respect to the axis AX and arranged along the axis AX on a plane parallel to the top surface 100t, a plurality of first through wirings 13 extending from the bottom wirings 11b towards the top wirings 11t and arranged along the axis AX, and a plurality of second through wirings 14 extending from the bottom wirings 11b towards the top wirings 11t, provided on the side opposite to the first through wirings 13 with respect to the axis AX, and arranged along the axis AX. The plurality of bottom wirings 11b includes the outermost coil wiring 11e located on one side in the axis AX direction. In this embodiment, among the plurality of bottom wirings 11b, each of the two bottom wirings 11b located at both ends in the axis AX direction is the outermost coil wiring 11e. The bottom wiring 11b, the first through wiring 13, the top wiring 11t, and the second through wiring 14 are connected in this order to form at least a part of a spiral shape.

[0052] The bottom surface wiring 11b corresponds to an example of the "first coil wiring" described in the claims, and the top surface wiring 11t corresponds to an example of the "second coil wiring" described in the claims. The axis AX refers to the intersection line between a first plane passing through the center between the bottom surface wiring 11b and the top surface wiring 11t and a second plane passing through the center between the first through-wiring 13 and the second through-wiring 14. That is, the axis AX is a straight line passing through the center of the inner diameter portion of the coil 110. The axis AX of the coil 110 has no dimension in the direction orthogonal to the axis AX.

[0053] According to the above configuration, the coil 110 includes the bottom surface wiring 11b, the first through-wiring 13, the top surface wiring 11t, and the second through-wiring 14. The bottom surface wiring 11b, the first through-wiring 13, the top surface wiring 11t, and the second through-wiring 14 are connected in this order to form at least a part of a spiral shape. Therefore, the inner diameter of the coil 110 can be increased, and the acquisition efficiency of inductance can be improved. Also, by increasing the inductance acquisition efficiency, the Q value can be increased.

[0054] Specifically, the pad portion of the conventional inductor component, the bottom surface wiring 11b, and the top surface wiring 11t of the present embodiment are the "receiving portions" of the wiring (the conductive vias of the conventional inductor component and the first through-wiring 13 and the second through-wiring 14 of the present embodiment) penetrating the element body. Therefore, they have a shape that spreads perpendicular to the direction in which the element body is penetrated. Here, in the configuration of the conventional inductor component, since the conductive vias extend in a direction parallel to the axis of the coil, the pad portion spreads in a direction perpendicular to the axis of the coil and is likely to have a structure that blocks the magnetic flux generated in the axial direction of the coil.

[0055] On the other hand, in the present embodiment, since the first through-wiring 13 and the second through-wiring 14 extend in a direction perpendicular to the axis AX of the coil 110, the bottom surface wiring 11b and the top surface wiring 11t spread in a direction parallel to the axis AX of the coil 110. Therefore, the bottom surface wiring 11b and the top surface wiring 11t are less likely to have a structure that blocks the magnetic flux generated in the direction of the axis AX. That is, in the present embodiment, a structure that is less likely to block the magnetic flux can be achieved, and the inductance acquisition efficiency and the Q value can be improved.

[0056] As shown in FIGS. 1 and 4, the outermost coil wiring 11e located on the first end face 100e1 side with respect to the center of the base body 10 in the X direction has an upper surface u located on the first direction D1 side, and a first side surface S1 and a second side surface S2 located on both sides sandwiching a center line CL along the extending direction of the outermost coil wiring 11e when viewed from the direction (Z direction) orthogonal to the bottom surface 100b. The first external electrode 121 includes a first portion P1 that contacts at least a part of the first side surface S1 of the outermost coil wiring 11e, a second portion P2 that contacts at least a part of the upper surface u of the outermost coil wiring 11e, and a third portion P3 that contacts at least a part of the second side surface S2 of the outermost coil wiring 11e. The first portion P1, the second portion P2, and the third portion P3 constitute a convex portion P that continuously protrudes toward the first direction D1 in this order.

[0057] Similarly, the outermost coil wiring 11e located on the second end face 100e2 side with respect to the center of the base body 10 in the X direction has an upper surface u located on the first direction D1 side, and a first side surface S1 and a second side surface S2 located on both sides sandwiching a center line CL along the extending direction of the outermost coil wiring 11e when viewed from the direction (Z direction) orthogonal to the bottom surface 100b. The second external electrode 122 includes a first portion that contacts at least a part of the first side surface S1 of the outermost coil wiring 11e, a second portion that contacts at least a part of the upper surface u of the outermost coil wiring 11e, and a third portion that contacts at least a part of the second side surface S2 of the outermost coil wiring 11e. The first portion, the second portion, and the third portion constitute a convex portion P that continuously protrudes toward the first direction D1 in this order.

[0058] According to the above configuration, since the first external electrode 121 and the second external electrode 122 have the convex portion P protruding toward the first direction D1, the surface area is increased compared to the case where it is flat without the convex portion P, and for example, the adhesion strength with a connecting member such as solder can be improved. Further, the convex portion P of the first external electrode 121 and the second external electrode 122 is in contact with the outermost coil wiring 11e, and each of the first external electrode 121 and the second external electrode 122 and the outermost coil wiring 11e are directly connected. Thereby, the DC resistance (Rdc) can be reduced as compared with the case where each of the first external electrode 121 and the second external electrode 122 and the outermost coil wiring 11e are connected by, for example, via wiring or the like.

[0059] 2. Configuration of each part (Inductor component 1) The volume of the inductor component 1 is preferably 0.08 mm 3 or less, and the size of the long side of the inductor component 1 is 0.65 mm or less. The size of the long side of the inductor component 1 refers to the largest value among the length, width, and height of the inductor component 1, and in this embodiment, it refers to the length in the X direction. According to the above configuration, since the volume of the inductor component 1 is small and the long side of the inductor component 1 is also short, the weight of the inductor component 1 becomes light. Therefore, even if the external electrodes 121 and 122 are small, the required mounting strength can be obtained. Further, the thickness of the inductor component 1 is preferably 200 μm or less. According to this, the inductor component 1 can be made thin.

[0060] Specifically, the size (length (X direction) × width (Y direction) × height (Z direction)) of the inductor component 1 is 0.6 mm × 0.3 mm × 0.3 mm, 0.4 mm × 0.2 mm × 0.2 mm, 0.25 mm × 0.125 mm × 0.120 mm, etc. Also, the width and height do not have to be equal, and for example, 0.4 mm × 0.2 mm × 0.3 mm, etc. may be used.

[0061] (Base body 10) The base body 10 is preferably SiO 2It includes. According to this, insulation and rigidity can be imparted to the base body 10. The base body 10 is composed of, for example, a glass sintered body. The glass sintered body may contain alumina, and the strength of the base body can be further increased.

[0062] The glass sintered body is formed by laminating, for example, insulating layers containing a plurality of glasses. The lamination direction of the plurality of insulating layers is the Z direction. That is, the insulating layer is in a layered form having a main surface extending in the XY plane. Note that in the base body 10, the interfaces between the plurality of insulating layers may not be clear due to firing or the like.

[0063] Note that the base body 10 may be composed of, for example, a glass substrate. The glass substrate may be a single-layer glass substrate. Since most of the base body is glass, losses such as eddy current loss at high frequencies can be suppressed.

[0064] As shown in FIG. 4, a recess C is provided in the bottom surface 100b of the base body 10. Specifically, in each of the two outermost coil wirings 11e, the recess C is provided so that the connection portion with the first external electrode 121 or the second external electrode 122 is exposed from the base body 10. The shape of the recess C when viewed from the Z direction is not particularly limited as long as the above connection portion is exposed from the base body 10. In this embodiment, it is rectangular.

[0065] (Coil 110) The coil 110 includes a plurality of bottom surface wirings 11b, a plurality of top surface wirings 11t, a plurality of first through wirings 13, and a plurality of second through wirings 14. The bottom surface wiring 11b, the first through wiring 13, the top surface wiring 11t, and the second through wiring 14 are sequentially connected to form at least a part of the coil 110 wound in the axial direction of the axis AX.

[0066] According to the above configuration, since the coil 110 is a so-called helical-shaped coil 110, in a cross-section orthogonal to the axis AX, the region where the bottom surface wiring 11b, the top surface wiring 11t, the first through wiring 13, and the second through wiring 14 run parallel along the winding direction of the coil 110 can be reduced, and the parasitic capacitance in the coil 110 can be reduced.

[0067] Here, the helical shape means a shape in which the total number of turns of the coil is greater than 1 turn, and the number of turns of the coil in a cross-section orthogonal to the axis is less than 1 turn. "One turn or more" means a state in which, in a cross-section orthogonal to the axis, the wiring of the coil has a portion that runs parallel in the winding direction adjacent in the radial direction when viewed from the axial direction, and "less than one turn" means a state in which, in a cross-section orthogonal to the axis, the wiring of the coil does not have a portion that runs parallel in the winding direction adjacent in the radial direction when viewed from the axial direction.

[0068] The bottom surface wiring 11b extends only in one direction. Specifically, the bottom surface wiring 11b extends in the Y direction while being slightly inclined in the X direction. The plurality of bottom surface wirings 11b are arranged in parallel along the X direction. Here, in the photolithography process, when using deformed illumination such as annular illumination or dipole illumination, the pattern resolution in a specific direction can be improved, and a finer pattern can be formed. According to the above configuration, since the bottom surface wiring 11b extends only in one direction, a fine bottom surface wiring 11b can be formed by using, for example, deformed illumination in the photolithography process, and the inductor component 1 can be miniaturized.

[0069] As described above, the plurality of bottom surface wirings 11b includes the outermost coil wiring 11e located at one end on the AX axis direction. In this embodiment, one end on one side in the extending direction of the outermost coil wiring 11e (in other words, the connection portion with the first external electrode 121 or the second external electrode 122) is disposed in the recess C provided in the bottom surface 100b of the element body 10 and is exposed from the element body 10. Specifically speaking, among both ends in the extending direction of the outermost coil wiring 11e, the end on the side connected to the first external electrode 121 or the second external electrode 122 is disposed in the recess C and is exposed from the element body 10. Note that the entire outermost coil wiring 11e may be disposed in the recess C and exposed from the element body 10. In this case, it is preferable that the first external electrode 121 or the second external electrode 122 contacts the entire exposed surface of the outermost coil wiring 11e (in other words, the entire first side surface s1, the entire second side surface s2, and the entire upper surface u).

[0070] The top surface wiring 11t extends only in one direction. Specifically speaking, the top surface wiring 11t has a shape extending in the Y direction. The plurality of top surface wirings 11t are arranged in parallel along the X direction. According to the above configuration, since the top surface wiring 11t extends only in one direction, by using, for example, deformed illumination in the photolithography process, the fine top surface wiring 11t can be formed and the inductor component 1 can be miniaturized.

[0071] The bottom surface wiring 11b and the top surface wiring 11t are made of a good conductor material such as copper, silver, gold, or an alloy thereof. The bottom surface wiring 11b and the top surface wiring 11t may be a metal film formed by plating, vapor deposition, sputtering, etc., or may be a metal sintered body obtained by applying and sintering a conductor paste. Further, the bottom surface wiring 11b and the top surface wiring 11t may have a multilayer structure in which a plurality of metal layers are laminated. The thickness of the bottom surface wiring 11b and the top surface wiring 11t is preferably 5 μm or more and 50 μm or less.

[0072] The first through-wiring 13 is disposed inside the through-hole V of the base body 10 on the first side surface 100s1 side with respect to the axis AX, and the second through-wiring 14 is disposed inside the through-hole V of the base body 10 on the second side surface 100s2 side with respect to the axis AX. The first through-wiring 13 and the second through-wiring 14 each extend in a direction orthogonal to the bottom surface 100b and the top surface 100t. According to this, since the lengths of the first through-wiring 13 and the second through-wiring 14 can be shortened, the DC resistance (Rdc) can be suppressed. The plurality of first through-wirings 13 and the plurality of second through-wirings 14 are each arranged in parallel along the X direction.

[0073] Preferably, the first through-wiring 13 contains SiO 2 . According to this, when the base body 10 contains SiO 2 , the linear expansion coefficient of the first through-wiring 13 can be made to match the linear expansion coefficient of the base body 10, and cracks between the first through-wiring 13 and the base body 10 can be suppressed. The first through-wiring 13 uses, for example, a conductive paste. The conductive material is Ag, Cu, etc. Preferably, similarly, the second through-wiring 14 contains SiO 2 .

[0074] Preferably, at least one of the bottom surface wiring 11b, the top surface wiring 11t, the first through-wiring 13, and the second through-wiring 14 contains a void portion or a resin portion. According to this, the stress due to the difference in the linear expansion coefficient between the wiring and the base body 10 can be absorbed by the void portion or the resin portion, and the stress can be relaxed. As a method of forming the void portion, for example, a member that burns out by sintering is used in the material of the wiring, and the void portion can be formed by sintering the wiring. As a method of forming the resin portion, for example, the resin portion can be formed by using a conductive paste as the material of the wiring.

[0075] Preferably, at least one of the bottom surface wiring 11b and the top surface wiring 11t contains SiO 2 . According to this, when the base body 10 contains SiO 2 , the linear expansion coefficient of the wiring can be made to match the linear expansion coefficient of the base body 10, and cracks between the wiring and the base body 10 can be suppressed.

[0076] (External electrodes 121, 122) The first external electrode 121 is connected to the first end of the coil 110, and the second external electrode 122 is connected to the second end of the coil 110. The first external electrode 121 is provided on the first end face 100e1 side with respect to the center of the element 10 in the X direction so as to be exposed from the outer surface 100 of the element 10. The second external electrode 122 is provided on the second end face 100e2 side with respect to the center of the element 10 in the X direction so as to be exposed from the outer surface 100 of the element 10. When the recess C is provided in the bottom face 100b of the element 10 as in this embodiment, the outer surface 100 of the element 10 includes the inner surface of the recess C. Also, in this specification, when referring to "the outside of the element", this "outside" includes the region inside the recess C. That is, the region inside the recess C is regarded as the outside of the element 10.

[0077] Note that the first external electrode 121 may be continuously provided on the bottom face 100b and the first end face 100e1. According to this, since the first external electrode 121 is a so-called L-shaped electrode, when mounting the inductor component 1 on the mounting substrate, a solder fillet can be formed on the first external electrode 121. Similarly, the second external electrode 122 may be continuously provided on the bottom face 100b and the second end face 100e2.

[0078] The first external electrode 121 has an underlayer 121e1 and a plating layer 121e2 covering the underlayer 121e1. The underlayer 121e1 contains a conductive material such as, for example, Cu, Ni, Ti, and combinations thereof. The plating layer 121e2 contains a conductive material such as, for example, Ni, Au, etc. Similarly, the second external electrode 122 has an underlayer and a plating layer covering the underlayer. Note that the first external electrode 121 and the second external electrode 122 may be composed of a single-layer conductive material.

[0079] The first external electrode 121 is provided so as to cover the entire concave portion C provided on the bottom surface 100b of the element body 10 when viewed from the Z direction. As a result, the first external electrode 121 comes into contact with the entire surface of the first side surface S1 of the outermost coil wiring 11e that is exposed from the element body 10, comes into contact with the entire surface of the upper surface u of the outermost coil wiring 11e that is exposed from the element body 10, and comes into contact with the entire surface of the second side surface S2 of the outermost coil wiring 11e that is exposed from the element body 10. As a result, the first external electrode 121 has a convex portion P at a position corresponding to the exposed portion of the outermost coil wiring 11e from the element body 10. The first external electrode 121 has a step 121s corresponding to the step (the first surface described later) of the concave portion C.

[0080] Similarly, the second external electrode 122 is provided so as to cover the entire concave portion C provided on the bottom surface 100b of the element body 10 when viewed from the Z direction. As a result, the second external electrode 122 comes into contact with the entire surface of the first side surface S1 of the outermost coil wiring 11e that is exposed from the element body 10, comes into contact with the entire surface of the upper surface u of the outermost coil wiring 11e that is exposed from the element body 10, and comes into contact with the entire surface of the second side surface S2 of the outermost coil wiring 11e that is exposed from the element body 10. As a result, the second external electrode 122 has a convex portion P at a position corresponding to the exposed portion of the outermost coil wiring 11e from the element body 10. The second external electrode 122 has a step 122s corresponding to the step of the concave portion C.

[0081] (Other preferred configurations) Preferably, as shown in FIG. 4, the thickness t1 of the first external electrode 121 in the Z direction is thinner than the thickness t2 of the bottom surface wiring 11b in the Z direction. Here, when the first external electrode 121 is composed of a plurality of layers, the thickness of the first external electrode 121 refers to the thickness in all layers. Even if the thickness of the first external electrode 121 is reduced, the influence on the DC resistance (Rdc) is small. Therefore, according to the above configuration, the thickness of the inductor component 1 can be reduced while suppressing an increase in the DC resistance. More preferably, the thickness t1 of the first external electrode 121 is 1 / 2 or less of the thickness t2 of the bottom surface wiring 11b. Thereby, the thickness of the inductor component 1 can be more effectively reduced. Similarly, the thickness of the second external electrode 122 may also be thinner than the thickness of the bottom surface wiring 11b.

[0082] Preferably, the first external electrode 121 is composed of a plurality of conductive layers and includes a conductive layer having a different material from the conductive layer constituting the outermost coil wiring 11e. Specifically speaking, for the outermost coil wiring 11e, a conductive layer with high conductivity such as Cu or Ag may be adopted, for example. For the first external electrode 121, a conductive layer with good adhesion to the outermost coil wiring 11e such as Ti, a conductive layer with high resistance to electromigration such as Ni, a conductive layer with high corrosion resistance such as Au, a conductive layer with high solder wettability, etc. may be adopted. According to this configuration, characteristics different from those of the outermost coil wiring 11e can be imparted to the first external electrode 121. Similarly, the second external electrode 122 may be composed of a plurality of conductive layers and include a conductive layer having a different material from the conductive layer constituting the outermost coil wiring 11e.

[0083] Preferably, the first external electrode 121 is continuously provided on the side opposite to the second portion P2 from the first portion P1 of the convex portion P, and further includes a bottom portion BP1 extending in a direction (Y direction) parallel to the bottom surface 100b, and a wall portion WP1 continuously provided from the bottom portion BP1 and extending in the first direction D1. According to this configuration, the surface area of the first external electrode 121 is further increased, and the adhesion strength with a connection member such as solder can be further improved, for example. Also preferably, the first external electrode 121 is continuously provided on the side opposite to the second portion P2 from the third portion P3 of the convex portion P, and further includes a bottom portion BP2 extending in a direction parallel to the bottom surface 100b, and a wall portion WP2 continuously provided from the bottom portion BP2 and extending in the first direction D1. According to this configuration, the surface area of the first external electrode 121 is further increased, and the adhesion strength with a connection member such as solder can be further improved, for example. Similarly, in the second external electrode 122, it may also be continuously provided on the side opposite to the second portion from at least one of the first portion and the third portion of the convex portion P, and further include a bottom portion extending in a direction parallel to the bottom surface 100b, and a wall portion continuously provided from the bottom portion and extending in the first direction D1.

[0084] Preferably, the first external electrode 121 further includes a fourth portion P4 that is separated from the second portion P2 and is located on the first direction D1 side of the second portion P2. Specifically, the fourth portion P4 is a portion provided on the bottom surface 100b of the first external electrode 121 excluding the concave portion C. According to this configuration, since the fourth portion P4 is further included, the surface area of the first external electrode 121 can be further increased. Also, since the fourth portion P4 is further included, the shape of the first external electrode 121 between the second portion P2 and the fourth portion P4 can be made concave. Furthermore, since the fourth portion P4 is located on the first direction D1 side of the second portion P2, the depth of the concave shape can be made deeper than when the fourth portion P4 is located on the opposite side (the positive Z direction side) of the first direction D1 from the second portion P2. As a result, the surface area of the first external electrode 121 can be increased more effectively, and for example, the adhesion strength with a connecting member such as solder can be further improved. Similarly, the second external electrode 122 may also further include a fourth portion that is separated from the second portion and is located on the first direction D1 side of the second portion.

[0085] Preferably, the bottom surface 100b has a concave portion C, the concave portion C has a stepped side surface CS, and at least a part of the first external electrode 121 is in contact with the side surface CS and has a shape along the side surface CS. Specifically, the side surface CS has a first surface f1 extending along the Z direction, a second surface f2 extending along the Z direction, and a third surface f3 connecting the first surface f1 and the second surface f2 and extending along the XY plane. The first surface f1 is disposed on the opening side of the concave portion C, and the second surface f2 is disposed on the bottom surface side of the concave portion C. The width of the first surface f1 in the Y direction is larger than the width of the second surface f2 in the Y direction. The width of the first surface f1 in the X direction is larger than the width of the second surface f2 in the X direction. The first surface f1, the second surface f2, and the third surface f3 constitute the stepped shape of the side surface CS. The number of steps of the stepped shape is not particularly limited. According to this configuration, the surface area of the first external electrode 121 can be further increased, and for example, the adhesion strength with a connecting member such as solder can be further improved. Similarly, at least a part of the second external electrode 122 may also be in contact with the stepped side surface of the concave portion C and have a shape along the side surface.

[0086] (Method for manufacturing the inductor component 1) Next, the method for manufacturing the inductor component 1 will be described with reference to FIGS. 5A to 5O. FIGS. 5A to 5G, 5I, 5K, and 5M are views corresponding to the II-II cross section of FIG. 1. FIGS. 5H, 5J, 5L, 5N, and 5O are views corresponding to the III-III cross section of FIG. 1.

[0087] As shown in FIG. 5A, a first insulating layer 1011 is provided on the base substrate 1000 by printing. The material of the base substrate 1000 is, for example, a glass substrate, a silicon substrate, an alumina substrate, etc., and the material of the first insulating layer 1011 is, for example, a resin such as epoxy or polyimide, an inorganic insulating film such as SiO or SiN.

[0088] As shown in FIG. 5B, a second insulating layer 1012 is provided on the first insulating layer 1011 by printing. A groove 1012a is provided in the second insulating layer 1012. At this time, for example, the groove 1012a is formed by a photolithography process. Note that the groove may be formed from the beginning as a printing pattern.

[0089] As shown in FIG. 5C, a top surface conductor layer 1011t is provided in the groove 1012a by printing. The material of the top surface conductor layer 1011t is, for example, Ag, Cu, Au, Al, an alloy containing at least one of these elements, solder paste, etc. At this time, for example, the top surface conductor layer 1011t is formed as a printing pattern so as to remain only in the groove 1012a. Note that after printing the top surface conductor layer 1011t on the second insulating layer 1012, the top surface conductor layer 1011t may be made to remain only in the groove 1012a by a photolithography process.

[0090] As shown in FIG. 5D, a third insulating layer 1013 is provided on the second insulating layer 1012 by printing. A first groove 1013a and a second groove 1013b are provided in the third insulating layer 1013. The first groove 1013a and the second groove 1013b are formed in the same manner as in FIG. 5B.

[0091] As shown in FIG. 5E, the first through-conductor layer 1131 of the first layer is provided in the first groove 1013a by printing, and the first through-conductor layer 1141 of the first layer is provided in the second groove 1013b by printing. The first through-conductor layer 1131 of the first layer and the first through-conductor layer 1141 of the first layer are formed in the same manner as in FIG. 5C.

[0092] Repeat the above process. As shown in FIG. 5F, a fourth insulating layer 1014 is provided on the third insulating layer 1013, and a second through-conductor layer 1132 of the second layer and a second through-conductor layer 1142 of the second layer are provided in each of the two grooves provided in the fourth insulating layer 1014. Further, a fifth insulating layer 1015 is provided on the fourth insulating layer 1014, and a third through-conductor layer 1133 of the third layer and a third through-conductor layer 1143 of the third layer are provided in each of the two grooves provided in the fifth insulating layer 1015.

[0093] As shown in FIG. 5G, a sixth insulating layer 1016 is provided on the fifth insulating layer 1015, and a bottom conductor layer 1011b is provided in the groove provided in the sixth insulating layer 1016. The material of the bottom conductor layer 1011b is the same as that of the top conductor layer 1011t. FIG. 5H shows the same process as FIG. 5G. As shown in FIG. 5H, a groove 1016a is provided in the sixth insulating layer 1016, and a bottom conductor layer 1011b is provided in the groove 1016a. The groove 1016a forms a part of the recess C.

[0094] As shown in FIG. 5I, a seventh insulating layer 1017 is provided on the sixth insulating layer 1016. Subsequently, a groove is provided in the seventh insulating layer 1017 so that at least the portions of the bottom conductor layer 1011b connected to the first and second external electrodes are exposed. FIG. 5J shows the same process as FIG. 5I. As shown in FIG. 5J, a groove 1017a is provided in the seventh insulating layer 1017. The groove 1017a forms a part of the recess C. In this embodiment, the size of the opening of the groove 1017a is made larger than the size of the opening of the groove 1016a. Thereby, a stepped shape can be formed on the side surface of the recess C.

[0095] As shown in Fig. 5K, the entire laminate is sintered in a furnace at a high temperature (e.g., 500 °C or higher). The first to seventh insulating layers 1011 to 1017 are sintered to form the element body 10, the top surface conductor layer 1011t is sintered to form the top surface wiring 11t, the bottom surface conductor layer 1011b is sintered to form the bottom surface wiring 11b, the first through-conductor layers 1131 to 1133 from the first layer to the third layer are sintered to form the first through-wiring 13, and the second through-conductor layers 1141 to 1143 from the first layer to the third layer are sintered to form the second through-wiring 14. Therefore, the strength can be improved by sintering the insulating layer, and by sintering the conductor layer, unnecessary resin components contained in the conductor layer are volatilized, and the conductor materials contained in the conductor layer are fused to achieve a high conductivity. The base substrate 1000 may be peeled off by decomposing the surface during sintering, or may be mechanically removed by grinding or the like before and after sintering, or may be chemically removed by etching or the like before and after sintering. Fig. 5L shows the same process as Fig. 5K. As shown in Fig. 5L, by the above sintering, an element body 10 having a recess C provided in the bottom surface 100b is formed.

[0096] As shown in Fig. 5M, for example, a conductive material such as Cu, Ni, Ti, and combinations thereof is formed into a film by a sputtering method and etched into a predetermined shape by a photolithography process to form an underlayer 121e1. The predetermined shape is such that the underlayer 121e1 covers at least the inner surface of the recess C. Subsequently, an electroless plating layer 121e2 is formed so as to cover the underlayer 121e1. The plating layer 121e2 is, for example, Ni / Au. Thus, the external electrodes 121 and 122 are formed. Fig. 5N shows the same process as Fig. 5M. As shown in Fig. 5N, the first external electrode 121 contacts the exposed portion from the element body 10 in the outermost coil wiring 11e, and a convex portion P is formed on the first external electrode 121. Although not shown, the second external electrode 122 contacts the exposed portion from the element body 10 in the outermost coil wiring 11e, and a convex portion P is formed on the second external electrode 122.

[0097] As shown in Fig. 5O, it is singulated along the cut line D. Thereby, as shown in Fig. 3, the inductor component 1 is manufactured.

[0098] 3. Modification Example (First Modification Example) FIG. 6A is a view corresponding to the III-III cross section of FIG. 1 showing a first modification example of the inductor component. As shown in FIG. 6A, in the inductor component 1A of the first modification example, the element body 10 is not provided in the region on the forward Y-direction side and the reverse Y-direction side of the portion exposed from the element body 10 in the outermost coil wiring 11e. According to this, the first external electrode 121 can be easily brought into contact with the bottom surface 100b of the element body 10.

[0099] (Second Modification Example) FIG. 6B is a view corresponding to the II-II cross section of FIG. 1 showing a second modification example of the inductor component. As shown in FIG. 6B, in the inductor component 1B of the second modification example, when viewed from a direction parallel to the axis AX of the coil 110, the first through wiring 13 and the second through wiring 14 are not parallel. According to this, the distance between the first through wiring 13 and the second through wiring 14 can be widened, the inner diameter of the coil 110 can be increased, and the Q value can be improved.

[0100] Specifically, the first through wiring 13 and the second through wiring 14 are bent at the center so that the distance between them becomes wider toward the center in the Z direction. That is, the first through wiring 13 and the second through wiring 14 each have a shape that spreads outward in the radial direction of the coil 110 toward the center in the Z direction. Also, the first through wiring 13 and the second through wiring 14 each have a stepped shape along the Z direction. According to the above configuration, when the first through wiring 13 and the second through wiring 14 are each formed by laminating a plurality of conductor layers, the first through wiring 13 and the second through wiring 14 can be easily formed in a stepped shape by shifting and laminating the conductor layers of each layer.

[0101] (Third Modification Example) FIG. 6C is a view corresponding to the II-II cross section of FIG. 1 showing a third modification of the inductor component. As shown in FIG. 6C, in the inductor component 1C of the third modification, when viewed from a direction parallel to the axis AX of the coil 110, the first through-wiring 13 and the second through-wiring 14 are not parallel. According to this, the distance between the first through-wiring 13 and the second through-wiring 14 can be widened, the inner diameter of the coil 110 can be increased, and the Q value can be improved.

[0102] Specifically, the first through-wiring 13 and the second through-wiring 14 are inclined such that the distance between them becomes wider toward the top surface wiring 11t side in the Z direction. That is, the first through-wiring 13 and the second through-wiring 14 each have a shape that spreads outward in the radial direction of the coil 110 toward the top surface wiring 11t in the Z direction. Thus, the coil 110 has a trapezoidal shape when viewed from the axis AX direction. According to the above configuration, the first through-wiring 13 and the second through-wiring 14 can be formed linearly and shortened, and the DC resistance of the first through-wiring 13 and the second through-wiring 14 can be reduced.

[0103] (Fourth Modification) FIG. 6D is a view corresponding to the II-II cross section of FIG. 1 showing a fourth modification of the inductor component. As shown in FIG. 6D, the inductor component 1D of the fourth modification includes a first coil 110A and a second coil 110B as compared with the inductor component 1B of the second modification shown in FIG. 6B.

[0104] In the first coil 110A, when viewed from a direction parallel to the axis AX, the first through-wiring 13 and the second through-wiring 14 are not parallel. According to this, the distance between the first through-wiring 13 and the second through-wiring 14 can be widened, the inner diameter of the coil 110A can be increased, and the Q value can be improved.

[0105] Specifically, the first through-wiring 13 has the same configuration as the first through-wiring 13 of the inductor component 1B of the second modification. On the other hand, the second through-wiring 14 has a linear shape parallel to the Z direction. That is, the first through-wiring 13 is bent at the center so that the distance between the first through-wiring 13 and the second through-wiring 14 becomes wider toward the center in the Z direction. The first through-wiring 13 has a stepped shape along the Z direction. According to the above configuration, when the first through-wiring 13 is formed by laminating a plurality of conductor layers, the first through-wiring 13 can be easily formed in a stepped shape by shifting and laminating the conductor layers of each layer.

[0106] In the second coil 110B, when viewed from a direction parallel to the axis AX, the first through-wiring 13 and the second through-wiring 14 are not parallel. According to this, the distance between the first through-wiring 13 and the second through-wiring 14 can be widened, the inner diameter of the coil 110B can be increased, and the Q value can be improved.

[0107] Specifically, the second through-wiring 14 has the same configuration as the second through-wiring 14 of the inductor component 1B of the second modification. On the other hand, the first through-wiring 13 has a linear shape parallel to the Z direction. That is, the second through-wiring 14 is bent at the center so that the distance between the first through-wiring 13 and the second through-wiring 14 becomes wider toward the center in the Z direction. The second through-wiring 14 has a stepped shape along the Z direction. According to the above configuration, when the second through-wiring 14 is formed by laminating a plurality of conductor layers, the second through-wiring 14 can be easily formed in a stepped shape by shifting and laminating the conductor layers of each layer.

[0108] (Fifth Modification) FIG. 6E is a view corresponding to the II-II cross section of FIG. 1 showing a fifth modification of the inductor component. As shown in FIG. 6E, in the inductor component 1E of the fifth modification, the first coil 110A and the second coil 110B are included as compared with the inductor component 1C of the third modification shown in FIG. 6C.

[0109] In the first coil 110A, when viewed from a direction parallel to the axis AX, the first through-wiring 13 and the second through-wiring 14 are not parallel. According to this, the distance between the first through-wiring 13 and the second through-wiring 14 can be increased, the inner diameter of the coil 110A can be enlarged, and the Q value can be improved.

[0110] Specifically, the first through-wiring 13 has the same configuration as the first through-wiring 13 of the inductor component 1C of the third modification example. On the other hand, the second through-wiring 14 has a linear shape parallel to the Z direction. That is, the first through-wiring 13 is inclined so that the distance between the first through-wiring 13 and the second through-wiring 14 becomes wider toward the top surface wiring 11t side in the Z direction. According to the above configuration, the first through-wiring 13 and the second through-wiring 14 can be formed linearly and shortened, and the DC resistance of the first through-wiring 13 and the second through-wiring 14 can be reduced.

[0111] In the second coil 110B, when viewed from a direction parallel to the axis AX, the first through-wiring 13 and the second through-wiring 14 are not parallel. According to this, the distance between the first through-wiring 13 and the second through-wiring 14 can be increased, the inner diameter of the coil 110B can be enlarged, and the Q value can be improved.

[0112] Specifically, the second through-wiring 14 has the same configuration as the second through-wiring 14 of the inductor component 1C of the third modification example. On the other hand, the first through-wiring 13 has a linear shape parallel to the Z direction. That is, the second through-wiring 14 is inclined so that the distance between the first through-wiring 13 and the second through-wiring 14 becomes wider toward the top surface wiring 11t side in the Z direction. According to the above configuration, the first through-wiring 13 and the second through-wiring 14 can be formed linearly, and the electrical resistance of the first through-wiring 13 and the second through-wiring 14 can be reduced.

[0113] <Second Embodiment> FIG. 7 is a schematic bottom view of a second embodiment of the inductor component as viewed from the bottom side. FIG. 8 is a cross-sectional view taken along line VIII-VIII of FIG. 7. FIG. 9 is an enlarged view of part A in FIG. 8. In FIG. 7, for the sake of convenience, the insulating layer is omitted and the external electrodes are drawn with a two-dot chain line. Also, in FIG. 7, the body 10 is drawn transparently so that its structure can be easily understood. The second embodiment is mainly different from the first embodiment in the position of the axis of the coil, the direction of the through-wiring, the material of the body, the provision of an insulator, and the configuration of the external electrodes. These different configurations will be described below. Other configurations are the same as those of the first embodiment, and the description thereof will be omitted.

[0114] 1. Configuration of each part (Inductor component 1F) As shown in FIG. 7, in the inductor component 1F, the axis AX of the coil 110 is perpendicular to the X direction. Specifically, the axis AX is parallel to the Y direction and passes through the center of the body 10 in the X direction. According to this, the interference of the magnetic flux of the coil 110 by the first external electrode 121 and the second external electrode 122 can be reduced, and the acquisition efficiency of the inductance can be improved.

[0115] The length of the coil 110 in the direction of the axis AX is shorter than the inner diameter of the coil 110. According to this, since the coil length is short and the coil inner diameter is large, the Q value can be improved. The inner diameter of the coil refers to the equivalent diameter of a circle based on the minimum area of the region surrounded by the coil 110 when viewed through in the direction of the axis AX.

[0116] (Body 10) The body 10 is an inorganic insulator. The material of the body 10 is preferably glass. According to this, since glass has high insulation properties, eddy currents can be suppressed and the Q value can be increased. The body 10 preferably contains Si element. According to this, the thermal stability of the body 10 is high, and thus, variations in the dimensions of the body 10 due to heat and the like can be suppressed, and the variation in electrical characteristics can be reduced.

[0117] The base body 10 is preferably a single-layer glass plate. According to this, the strength of the base body 10 can be ensured. Further, in the case of a single-layer glass plate, since the dielectric loss is small, the Q value at high frequencies can be increased. Further, since there is no sintering process such as a sintered body, deformation of the base body 10 during sintering can be suppressed, so that pattern deviation can be suppressed, and an inductor component with a small inductance tolerance can be provided.

[0118] As the material of the single-layer glass plate, from the viewpoint of the manufacturing method, a photosensitive glass plate typified by Foturan II (registered trademark of Schott AG) is preferable. In particular, the single-layer glass plate preferably contains cerium oxide (ceria: CeO 2 )), and in this case, the cerium oxide serves as a sensitizer, making processing by photolithography easier.

[0119] However, since the single-layer glass plate can be processed by machining such as drilling and sandblasting, dry / wet etching using a photoresist / metal mask, laser processing, etc., it may be a non-photosensitive glass plate. Further, the single-layer glass plate may be obtained by sintering a glass paste, or may be formed by a known method such as the float method.

[0120] (Coil 110) As shown in FIG. 7, the bottom surface wiring 11b extends only in one direction. Specifically, the bottom surface wiring 11b has a shape extending in the X direction. The plurality of bottom surface wirings 11b are arranged in parallel along the Y direction. The plurality of bottom surface wirings 11b include the outermost coil wiring 11e located on one side in the axial direction AX (Y direction). In this embodiment, each of the two bottom surface wirings 11b located at both ends in the axial direction AX among the plurality of bottom surface wirings 11b is the outermost coil wiring 11e. The top surface wiring 11t extends only in one direction. Specifically, the top surface wiring 11t extends in the X direction while being slightly inclined in the Y direction. The plurality of top surface wirings 11t are arranged in parallel along the Y direction.

[0121] The first through-wiring 13 is disposed inside the through-hole V of the base body 10, on the side of the first end face 100e1 with respect to the axis AX, and the second through-wiring 14 is disposed inside the through-hole V of the base body 10, on the side of the second end face 100e2 with respect to the axis AX. The first through-wiring 13 and the second through-wiring 14 each extend in a direction orthogonal to the bottom face 100b and the top face 100t. The plurality of first through-wirings 13 and the plurality of second through-wirings 14 are each arranged in parallel along the Y direction.

[0122] (Insulator 22) As shown in FIG. 8, the inductor component 1F has an insulator 22. The insulator 22 covers each of the bottom face 100b and the top face 100t of the base body 10. Note that the insulator 22 may be provided only on the bottom face 100b of the bottom face 100b and the top face 1100t.

[0123] The insulator 22 is a member that covers the wiring (bottom face wiring 11b, top face wiring 11t), protects the wiring from external forces, prevents damage to the wiring, and improves the insulation of the wiring. The insulator 22 is preferably an organic insulator. For example, the insulator 22 may be a resin film such as epoxy or polyimide that is easy to form. In particular, the insulator 22 is preferably composed of a material with a low dielectric constant. Thereby, when the insulator 22 exists between the coil 110 and the external electrodes 121, 122, the parasitic capacitance formed between the coil 110 and the external electrodes 121, 122 can be reduced. The insulator 22 can be formed, for example, by laminating a resin film such as ABF GX-92 (manufactured by Ajinomoto Fine-Techno Co., Ltd.) or by applying and thermosetting a paste-like resin. Note that the insulator 22 may be an inorganic film such as an oxide, nitride, or oxynitride of silicon or hafnium, which is excellent in insulation and thinning.

[0124] In the insulator 22 covering the bottom surface 100b, an opening 22a is provided so that a connection portion connected to the external electrodes 121 and 122 in the outermost coil wiring 11e is exposed. The opening 22a is a through hole that penetrates the insulator 22 in the thickness direction (Z direction). The shape of the opening 22a when viewed from the Z direction is not particularly limited as long as the connection portion of the bottom surface wiring 11b is exposed. In this embodiment, as shown in FIG. 7, the shape of the opening 22a is made sufficiently larger than the shape of the connection portion of the bottom surface wiring 11b when viewed from the Z direction, and is made similar to the shape of the connection portion.

[0125] Specifically, when viewed from the Z direction, in the outermost coil wiring 11e located on the second side surface 100s2 side with respect to the center of the element body 10, the shape of the connection portion connected to the first external electrode 121 (in other words, the portion of the outermost coil wiring 11e exposed from the insulator 22) has a bullet shape with a tip portion whose width in the Y direction narrows as it goes toward the reverse X direction side. And when viewed from the Z direction, the shape of the opening 22a provided on the first external electrode 121 side is made sufficiently larger than the shape of the connection portion, and has a bullet shape with a tip portion whose width in the Y direction narrows as it goes toward the reverse X direction side so as to be similar to the shape of the connection portion.

[0126] Similarly, when viewed from the Z direction, in the outermost coil wiring 11e located on the first side surface 100s1 side with respect to the center of the base body 10, the shape of the connection portion connected to the second external electrode 122 (in other words, the portion of the outermost coil wiring 11e exposed from the insulator 22) is bullet-shaped with a tip portion whose width in the Y direction narrows as it goes toward the forward X direction side. And, when viewed from the Z direction, the shape of the opening 22a provided on the second external electrode 122 side is made sufficiently larger than the shape of the above connection portion, and is made bullet-shaped with a tip portion whose width in the Y direction narrows as it goes toward the forward X direction side so as to be similar to the shape of the above connection portion. By making the shape of the opening 22a sufficiently larger than the shape of the above connection portion, the above connection portion can be more reliably exposed from the insulator 22, and by making the shape of the opening 22a similar to the shape of the above connection portion, the etching amount of the insulator 22 can be minimized to ensure the insulation of the wiring.

[0127] (External electrodes 121, 122) As shown in FIGS. 7, 8, and 9, the first external electrode 121 is provided so as to cover the entire opening 22a located on the first end surface 100e1 side when viewed from the Z direction. Thereby, the first external electrode 121 includes a first portion P1 that contacts at least a part of the first side surface S1 of the outermost coil wiring 11e, a second portion P2 that contacts at least a part of the upper surface u of the outermost coil wiring 11e, and a third portion P3 that contacts at least a part of the second side surface s2 of the outermost coil wiring 11e, and the first portion P1, the second portion P2, and the third portion P3 constitute a convex portion P that continuously protrudes toward the first direction D1 side in this order. Specifically, the first external electrode 121 contacts the entire surface of the first side surface S1 of the outermost coil wiring 11e that is exposed from the insulator 22, contacts the entire surface of the upper surface u of the outermost coil wiring 11e that is exposed from the base body 10, and contacts the entire surface of the second side surface S2 of the outermost coil wiring 11e that is exposed from the base body 10. As a result, the first external electrode 121 has a convex portion P at a position corresponding to the exposed portion of the outermost coil wiring 11e from the base body 10.

[0128] Similarly, the second external electrode 122 is provided so as to cover the entire opening 22a located on the second end face 100e2 side when viewed from the Z direction. As a result, the second external electrode 122 includes a first portion that contacts at least a part of the first side surface S1 of the outermost coil wiring 11e, a second portion that contacts at least a part of the upper surface u of the outermost coil wiring 11e, and a third portion that contacts at least a part of the second side surface s2 of the outermost coil wiring 11e. The first portion, the second portion, and the third portion continuously form a convex portion P that protrudes toward the first direction D1 in this order. Specifically, the second external electrode 122 contacts the entire surface of the first side surface S1 of the outermost coil wiring 11e that is exposed from the insulator 22, the entire surface of the upper surface u of the outermost coil wiring 11e that is exposed from the base body 10, and the entire surface of the second side surface S2 of the outermost coil wiring 11e that is exposed from the base body 10. As a result, the second external electrode 122 has a convex portion P at a position corresponding to the exposed portion of the outermost coil wiring 11e from the base body 10.

[0129] Preferably, when viewed from the direction (Z direction) orthogonal to the bottom face 100b, the first external electrode 121 and the second external electrode 122 are located inside the outer surface 100 of the base body 10. According to this configuration, since the first external electrode 121 and the second external electrode 122 do not contact the outer surface 100 of the base body 10, when separating into individual inductor components 1F, the load applied to the first external electrode 121 and the second external electrode 122 can be reduced, and deformation and peeling of the first external electrode 121 and the second external electrode 122 can be suppressed. Therefore, even if the inductor component 1F is made small, deformation and peeling of the first external electrode 121 and the second external electrode 122 can be prevented.

[0130] According to the inductor component 1F, since the first external electrode 121 and the second external electrode 122 have the convex portion P protruding toward the first direction D1, the surface area is increased compared to the case where it is flat without the convex portion P, and for example, the adhesion strength with a connecting member such as solder can be improved. Further, since the convex portions P of the first external electrode 121 and the second external electrode 122 are in contact with the outermost coil wiring 11e, each of the first external electrode 121 and the second external electrode 122 and the outermost coil wiring 11e can be directly connected. Thereby, the DC resistance (Rdc) can be reduced as compared with the case where each of the first external electrode 121 and the second external electrode 122 and the outermost coil wiring 11e are connected by, for example, via wiring.

[0131] Preferably, as shown in FIG. 9, it further includes an insulator 22 provided on a part of the bottom surface 100b, and at least a part of the first external electrode 121 is in continuous contact with the insulator 22, the bottom surface 100b, and the first side surface S1 of the convex portion P. Specifically, the first external electrode 121 is continuously provided from the first portion P1 of the convex portion P to the side opposite to the second portion P2, and includes a bottom portion BP1 extending in a direction parallel to the bottom surface 100b, and a wall portion WP1 continuously provided from the bottom portion BP1 and extending in the first direction D1. And the wall portion WP1, the bottom portion BP1, and the first portion P1 are in continuous contact with the insulator 22, the bottom surface 100b, and the first side surface S1 of the convex portion P.

[0132] Further, in this embodiment, at least a part of the first external electrode 121 is in continuous contact with the insulator 22, the bottom surface 100b, and the second side surface S2 of the convex portion P. Specifically, the first external electrode 121 is continuously provided from the third portion P3 of the convex portion P to the side opposite to the second portion P2, and includes a bottom portion BP2 extending in a direction parallel to the bottom surface 100b, and a wall portion WP2 continuously provided from the bottom portion BP2 and extending in the first direction D1. And the wall portion WP2, the bottom portion BP2, and the third portion P3 are in continuous contact with the insulator 22, the bottom surface 100b, and the second side surface S2 of the convex portion P.

[0133] According to the above configuration, since at least a part of the first external electrode 121 is in continuous contact with the insulator 22, the bottom surface 100b, and the first side surface S1 of the convex portion P, an uneven shape can be imparted to the first external electrode 121. Therefore, for example, the adhesion strength with a connecting member such as solder can be further improved. Further, since at least a part of the first external electrode 121 is in continuous contact with the insulator 22, the bottom surface 100b, and the second side surface S2 of the convex portion P, an uneven shape can be further imparted to the first external electrode 121. Therefore, for example, the adhesion strength with a connecting member such as solder can be further improved.

[0134] Similarly, at least a part of the second external electrode 122 may be in continuous contact with the insulator 22, the bottom surface 100b, and the first side surface S1 of the convex portion P.

[0135] Preferably, the first external electrode 121 further includes a fourth portion P4 that is separated from the second portion P2 and is located on the first direction D1 side of the second portion P2. Specifically, the fourth portion P4 is a portion provided on the upper surface 22u of the insulator 22 in the first external electrode 121. According to this configuration, since the fourth portion P4 is further included, the surface area of the first external electrode 121 can be further increased. Similarly, the second external electrode 122 may also further include a fourth portion that is separated from the second portion and is located on the first direction D1 side of the second portion.

[0136] (Manufacturing method of the inductor component 1F) Next, a manufacturing method of the inductor component 1F will be described with reference to FIGS. 10A to 10H. FIGS. 10A to 10H are diagrams corresponding to the VIII-VIII cross section of FIG. 7.

[0137] As shown in FIG. 10A, a copper foil 2001 is provided on the base substrate 2000 by printing. The material of the base substrate 2000 is the same as that of the base substrate 1000 in the first embodiment.

[0138] As shown in FIG. 10B, a glass substrate 2010 serving as the element body 10 is provided on the base substrate 2000. For example, a jig such as a conductive tape, a pin, or a frame is used to bring the base substrate 2000 and the glass substrate 2010 into close contact. The glass substrate 2010 has a through hole V. The glass substrate 2010 is, for example, a TGV (Through Glass Via) substrate. The TGV substrate is a substrate on which through holes are formed in advance by a laser, photolithography, or the like. The glass substrate 2010 may be, for example, a TSV (Through Silicon Via) substrate, or may be otherwise. Also, a seed such as Ti / Cu and other necessary conductive materials may be deposited in advance on the surface of the glass substrate 2010 by sputtering or the like.

[0139] As shown in FIG. 10C, a first through-conductor layer 2013 serving as the first through-wiring 13 is formed in the through hole V of the glass substrate 2010. Although not shown, a second through-conductor layer serving as the second through-wiring 14 is similarly formed in the through hole V. Specifically, by supplying power from the copper foil 2001 on the base substrate 2000, electrolytic plating is performed on the through hole V of the glass substrate 2010 to form the first through-conductor layer 2013. Alternatively, a seed layer may be formed on the surface of the glass substrate 2010 or the inner surface of the through hole V by sputtering or the like, and a through-conductor layer may be formed using a known method such as field plating, conformal plating, or a printing and filling method of a conductive paste. If there is unnecessary plating growth on the surface of the glass substrate 2010, the unnecessary portion is removed by polishing, CMP, wet etching (etch back), or dry etching.

[0140] As shown in FIG. 10D, the base substrate 2000 is peeled from the glass substrate 2010. At this time, the base substrate 2000 may be mechanically removed by grinding or the like, or may be chemically removed by etching or the like.

[0141] As shown in FIG. 10E, a bottom conductor layer 2011b serving as the bottom wiring 11b and a top conductor layer 2011t serving as the top wiring 11t are formed on a glass substrate 2010. Specifically, a seed layer (not shown) is provided on the entire surface of the glass substrate 2010, and a patterned photoresist is formed on the seed layer. A copper layer is formed by electrolytic plating on the seed layer in the opening of the photoresist. The photoresist and the seed layer are removed by wet etching or dry etching. Thereby, the bottom conductor layer 2011b and the top conductor layer 2011t patterned in an arbitrary shape are formed. At this time, the bottom conductor layer 2011b and the top conductor layer 2011t may be formed one by one, or both may be formed simultaneously.

[0142] As shown in FIG. 10F, an insulating layer 2022 serving as the insulator 22 is provided so as to cover the conductor layers on the top and bottom surfaces of the glass substrate 2010. At this time, the insulating layer 2022 on the bottom side and the insulating layer 2022 on the top side may be formed one by one, or both may be formed simultaneously. Thereafter, a hole 2022a is provided on the bottom conductor layer 2011b of the insulating layer 2022 on the bottom side using photolithography or laser processing. At this time, a portion of the bottom conductor layer 2011b that is a connection portion connected to the first and second external electrodes is exposed from the insulating layer 2022. The hole 2022a becomes the opening 22a.

[0143] As shown in FIG. 10G, a first external electrode conductor layer 2121 serving as a first external electrode 121 is provided on the bottom surface side insulating layer 2022. At this time, the first external electrode conductor layer 2121 is connected to the bottom surface conductor layer 2011b through the hole 2022a. Further, the first external electrode conductor layer 2121 contacts the bottom surface conductor layer 2011b through the hole 2022a, and a convex portion P is formed. Specifically, a Pd catalyst (not shown) is provided on the bottom surface side insulating layer 2022, and Ni and Au plating layers are formed by electroless plating. A patterned photoresist is formed on the plating layer. The plating layer in the opening of the photoresist is removed by wet etching or dry etching. Thereby, the first external electrode conductor layer 2121 patterned into an arbitrary shape is formed. Alternatively, a seed layer (not shown) is provided on the bottom surface side insulating layer 2022, and a patterned photoresist is formed on the seed layer. Next, the seed layer in the opening of the photoresist is removed by wet etching or dry etching. A Ni or Au plating layer may be formed by electroless plating on the remaining seed layer. Although not shown, a second external electrode conductor layer serving as the second external electrode 122 is similarly provided on the bottom surface side insulating layer 2022.

[0144] As shown in FIG. 10H, it is separated by the cut line D. Thereby, as shown in FIG. 8, the inductor component 1F is manufactured.

[0145] 2. Modification (First Modification) FIG. 11A is a view corresponding to the VIII-VIII cross section of FIG. 7 showing a first modification of the inductor component. As shown in FIG. 11A, in the inductor component 1G of the first modification, the first through wiring 13 extends in a direction orthogonal to the bottom surface wiring 11b, and the cross-sectional area of each of both end portions 13e in the extending direction of the first through wiring 13 is larger than the cross-sectional area of the central portion 13m in the extending direction of the first through wiring 13. That is, in the cross section along the extending direction of the first through wiring 13, the width in the direction orthogonal to the extending direction of the first through wiring 13 continuously increases from the central portion 13m toward both end portions 13e.

[0146] According to this, the cross-sectional area of the end portion 13e of the first through-wiring 13 can be increased, and the connectivity between the first through-wiring 13 and at least one of the bottom surface wiring 11b and the top surface wiring 11t can be improved. Also, when forming a through-hole V as a hole portion in the base body 10 and filling the through-hole V with a conductive material by field plating or the like to form the first through-wiring 13 in the through-hole V, it is easy to fill the conductive material on the opening side of the through-hole V. And since the cross-sectional area of the end portion 13e of the first through-wiring 13 is large and the cross-sectional area of the central portion 13m of the first through-wiring 13 is small, it is easy to form the first through-wiring 13.

[0147] Note that it is only necessary that the cross-sectional area of one end portion 13e of the first through-wiring 13 is larger than the cross-sectional area of the central portion 13m of the first through-wiring 13. Similarly, the cross-sectional area of at least one end portion of the second through-wiring 14 may also be larger than the cross-sectional area of the central portion 13m of the first through-wiring 13.

[0148] Also, in the inductor component 1G of the first modified example, the bottom surface wiring 11b is provided on the bottom surface 100b, and further includes an insulator 22 having a shape that covers the bottom surface wiring 11b and follows the shape of the bottom surface wiring 11b. At least a part of the first external electrode 121 is in contact with the insulator 22 and has a shape that follows the shape of the bottom surface wiring 11b. Specifically speaking, the insulator 22 covers the bottom surface wiring 11b and, when viewed from the Z direction, has a shape extending in the X direction and has a shape that follows the shape of the bottom surface wiring 11b. In short, the insulator 22 is provided so as to cover each of the bottom surface wirings 11b separately. In the region between adjacent bottom surface wirings 11b, the bottom surface 100b is exposed from the insulator 22. And, among the first external electrodes 121, the portion excluding the convex portion P and the portion in contact with the bottom surface 100b is in contact with the insulator 22 and, when viewed from the Z direction, has a shape extending in the X direction and has a shape that follows the shape of the bottom surface wiring 11b.

[0149] Further, the insulator 22 covers the top surface wiring 11t and has a shape that slopes slightly in the Y direction and extends in the X direction when viewed from the Z direction, and is shaped along the shape of the top surface wiring 11t. In short, the insulator 22 is provided so as to cover each of the top surface wirings 11t separately. Thereby, the material cost of the insulator 22 can be reduced.

[0150] As a method for forming the insulator 22 having a shape along the shape of the bottom surface wiring 11b or the top surface wiring 11t, for example, a method of forming an organic resin or an inorganic insulator on the surface of the bottom surface wiring 11b or the top surface wiring 11t using a method such as CVD (Chemical Vapor Deposition), sputtering, or coating can be mentioned.

[0151] According to the above configuration, since at least a part of the first external electrode 121 has a shape along the shape of the bottom surface wiring 11b, the surface area of the first external electrode 121 can be further increased, and for example, the adhesion strength with a connection member such as solder can be further improved.

[0152] Similarly, at least a part of the second external electrode 122 may be in contact with the insulator 22 and have a shape along the shape of the bottom surface wiring 11b.

[0153] (Second Modified Example) FIG. 11B is a view corresponding to the VIII-VIII cross section of FIG. 7 showing a second modified example of the inductor component. As shown in FIG. 11B, in the inductor component 1H of the second modified example, compared with the inductor component 1G of the first modified example, an insulator 22 is further provided on the entire surface of the bottom surface 100b excluding the portion where the bottom surface wiring 11b is provided and the outer peripheral portion. The thickness of the insulator 22 in the Z direction is thinner than the thickness of the bottom surface wiring 11b in the Z direction. According to this configuration, since the area of the portion of the first external electrode 121 facing the bottom surface wiring 11b is smaller than that of the first modified example, the parasitic capacitance that can occur between the first external electrode 121 and the bottom surface wiring 11b can be reduced compared to the first modified example. Further, since the insulator 22 is filled between adjacent bottom surface wirings 11b more than in the first modified example, the insulation between adjacent bottom surface wirings 11b can be ensured more than in the first modified example.

[0154] Also, in the inductor component 1H of the second modified example, when the base body 10 is an inorganic insulator and the insulator 22 is an organic insulator, the organic insulator is located inside the outer surface 100 of the inorganic insulator when viewed from the direction perpendicular to the bottom surface 100b. According to this, since the organic insulator is provided, it is easy to impart fluidity to the organic insulator. When covering the wiring (bottom surface wiring 11b, top surface wiring 11t) with the organic insulator, the organic insulator can be easily filled between adjacent wirings, and the insulation performance can be improved. Further, since the organic insulator is not in contact with the outer surface of the inorganic insulator, when separating into individual inductor components 1H, the load on the organic insulator can be reduced, and deformation and peeling of the organic insulator can be suppressed.

[0155] Also, in the inductor component 1H of the second modified example, compared with the inductor component 1G of the first modified example, an insulator 22 is further provided on the entire surface of the region of the top surface 100t excluding the portion where the top surface wiring 11t is provided and the outer peripheral portion. The thickness of the insulator 22 in the Z direction is thinner than the thickness of the top surface wiring 11t in the Z direction. According to this, the base body 10 can be protected from the external environment.

[0156] (Third Modified Example) FIG. 11C is a schematic cross-sectional view of a first through-wiring showing a third modified example of an inductor component. As shown in FIG. 11C, in the third modified example, the first through-wiring 13 has a conductive layer 13s located on the outer peripheral side when viewed from the extending direction of the first through-wiring 13, and a non-conductive layer 13u located inside the conductive layer 13s. According to this, when used in the high-frequency band, since the current mainly flows on the surface of the first through-wiring 13 due to the skin effect, by providing the conductive layer 13s on the outer peripheral side, the Q value is not decreased. Further, by providing the non-conductive layer 13u inside, the stress can be relaxed, and the manufacturing cost can be reduced by not using a conductor.

[0157] An example of a method for forming the conductive layer 13s and the non-conductive layer 13u will be described. A seed layer is provided on the inner surface of the through-hole V of the base body 10 by sputtering or electroless plating. Then, an electroplated layer is formed on the seed layer by electroplating. By doing so, for example, a plurality of conductive layers 13s such as Ti / Cu / electrolytic Cu or Pd / electroless Cu / electrolytic Cu can be formed on the outer peripheral side of the first through-wiring 13. Thereafter, the inside of the conductive layer 13s is sealed with resin by printing, hot pressing, or the like to form a non-conductive layer 13u made of resin. By doing so, while flowing current through the surface (conductive layer 13s) of the first through-wiring 13, the stress can be relaxed by the non-conductive layer 13u inside the first through-wiring 13.

[0158] Similarly, the second through-wiring 14 may have a conductive layer located on the outer peripheral side as viewed from the direction in which the second through-wiring 14 extends, and a non-conductive layer located inside the conductive layer.

[0159] Note that the present disclosure is not limited to the above-described embodiments, and design changes can be made without departing from the gist of the present disclosure. For example, the respective characteristic points of the first embodiment and the second embodiment may be combined in various ways.

[0160] In the above embodiment, both the first external electrode and the second external electrode had convex portions, but only one of the first external electrode and the second external electrode may have a convex portion. In this case, the external electrode having no convex portion may be connected to the bottom surface wiring via, for example, a via wiring provided in the base body.

[0161] The present disclosure includes the following aspects. <1> A base body including a first main surface and a second main surface facing each other, A coil at least partially provided inside the base body and wound spirally along an axis, A first external electrode and a second external electrode provided outside the base body and electrically connected to the coil, Comprising, The axis of the coil is arranged parallel to the first main surface, The coil is, A plurality of first coil wirings provided on the first main surface side with respect to the axis and arranged along the axis on a plane parallel to the first main surface, a plurality of second coil wirings provided on the second main surface side with respect to the axis and arranged along the axis on a plane parallel to the second main surface, a plurality of first through wirings extending from the first coil wiring toward the second coil wiring and arranged along the axis, a plurality of second through wirings extending from the first coil wiring toward the second coil wiring and provided on the side opposite to the first through wiring with respect to the axis and arranged along the axis including, the first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to constitute at least a part of the spiral shape, the plurality of first coil wirings include an outermost coil wiring located at one end on the axial direction side, the outermost coil wiring has an upper surface located on the first direction side from the second main surface side toward the first main surface side, and first side surfaces and second side surfaces located on both sides sandwiching a center line along the extending direction of the outermost coil wiring when viewed from a direction orthogonal to the first main surface, the first external electrode includes a first portion in contact with at least a part of the first side surface, a second portion in contact with at least a part of the upper surface, and a third portion in contact with at least a part of the second side surface, and the first portion, the second portion, and the third portion constitute a convex portion that continuously protrudes in the first direction side in this order, an inductor component. <2> The thickness of the first external electrode is thinner than the thickness of the first coil wiring, the inductor component according to <1>. <3> The base body contains SiO 2 The inductor component according to <1> or <2>. <4> The first external electrode is composed of a plurality of conductive layers and includes a conductive layer having a different material from the conductive layer constituting the outermost coil wiring, the inductor component according to any one of <1> to <3>. <5> The first external electrode is continuously provided from the first portion of the convex portion to the side opposite to the second portion, and includes a bottom portion extending in a direction parallel to the first main surface, and a wall portion continuously provided from the bottom portion and extending in the first direction. The inductor component according to any one of <1> to <4>. <6> The first external electrode further includes a fourth portion that is separated from the second portion and is located on the first direction side of the second portion. The inductor component according to any one of <1> to <5>. <7> The first main surface has a concave portion. The concave portion has a stepped side surface. At least a part of the first external electrode is in contact with the side surface and has a shape along the side surface. The inductor component according to any one of <1> to <6>. <8> The inductor component further includes an insulator provided on a part of the first main surface. At least a part of the first external electrode is in continuous contact with the insulator, the first main surface, and the first side surface of the convex portion. The inductor component according to any one of <1> to <7>. <9> The first coil wiring is provided on the first main surface. The inductor component further includes an insulator that covers the first coil wiring and has a shape along the shape of the first coil wiring. At least a part of the first external electrode is in contact with the insulator and has a shape along the shape of the first coil wiring. The inductor component according to any one of <1> to <8>. <10> The inductor component further includes an organic insulator provided on the first main surface. The element body is an inorganic insulator, and the organic insulator is located inside the outer surface of the inorganic insulator when viewed from a direction perpendicular to the first main surface. The inductor component according to any one of <1> to <9>. <11> When viewed from a direction parallel to the axis, the first through-wiring and the second through-wiring are not parallel, and the inductor component according to any one of <1> to <10>. <12> The base body contains SiO 2 and The first through-wiring contains SiO 2 and is the inductor component according to any one of <1> to <11>. <13> The first through-wiring contains a void portion or a resin portion, and is the inductor component according to any one of <1> to <12>. <14> The first through-wiring has a conductive layer located on the outer peripheral side when viewed from the direction in which the first through-wiring extends, and a non-conductive layer located inside the conductive layer, and is the inductor component according to any one of <1> to <13>. <15> The axial length of the coil is shorter than the inner diameter of the coil, and is the inductor component according to any one of <1> to <14>. <16> The first through-wiring extends in a direction perpendicular to the first main surface, The cross-sectional area of at least one of both ends in the extending direction of the first through-wiring is larger than the cross-sectional area of the central portion in the extending direction of the first through-wiring, and is the inductor component according to any one of <1> to <15>. <17> The thickness of the inductor component is 200 μm or less, and is the inductor component according to any one of <1> to <16>. <18> When viewed from a direction perpendicular to the first main surface, the first external electrode and the second external electrode are located inside the outer surface of the base body, and are the inductor component according to any one of <1> to <17>.

Explanation of Signs

[0162] 1, 1A - 1H inductor component 10 base body 11b bottom surface wiring (first coil wiring) 11t top surface wiring (second coil wiring) 11e outermost coil wiring 13 first through-wiring 13e end part 13m central part 13s conductive layer 13u non-conductive layer 14 second through-wiring 22 insulator 22a opening 22u upper surface 100b bottom surface (first main surface) 100t top surface (second main surface) 100e1 first end face 100e2 second end face 100s1 first side face 100s2 second side face 110 coil 121 first external electrode 121e1 underlayer 121e2 plating layer 122 second external electrode 121s, 122s step AX axis BP1, BP2 bottom part WP1, WP2 wall part CL center line C recess CS side face of recess D1 first direction f1~f3 first~third faces s1, s2 first, second side faces u upper surface t1, t2 thickness P protrusion P1~P4 first~fourth parts V through-hole

Claims

1. A base body including a first main surface and a second main surface facing each other, A coil at least partially provided inside the base body and wound spirally along an axis, A first external electrode and a second external electrode provided outside the base body and electrically connected to the coil, Comprising, The axis of the coil is arranged parallel to the first main surface, The coil, A plurality of first coil wirings provided on the first main surface side with respect to the axis and arranged along the axis on a plane parallel to the first main surface, A plurality of second coil wirings provided on the second main surface side with respect to the axis and arranged along the axis on a plane parallel to the second main surface, A plurality of first through wirings extending from the first coil wiring toward the second coil wiring and arranged along the axis, A plurality of second through wirings extending from the first coil wiring toward the second coil wiring and provided on the side opposite to the first through wiring with respect to the axis and arranged along the axis Including, The first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to constitute at least a part of the spiral shape, The plurality of first coil wirings include an outermost coil wiring located at one end on the axial direction side, The outermost coil wiring has an upper surface located on the first direction side from the second main surface side toward the first main surface side, and a first side surface and a second side surface located on both sides sandwiching a center line along the extending direction of the outermost coil wiring when viewed from a direction orthogonal to the first main surface, The first external electrode includes a first portion in contact with at least a part of the first side surface, a second portion in contact with at least a part of the upper surface, and a third portion in contact with at least a part of the second side surface, and the first portion, the second portion, and the third portion constitute a convex portion continuously protruding in the first direction side in this order. An inductor component.

2. The thickness of the first external electrode is thinner than the thickness of the first coil wiring. The inductor component according to claim 1.

3. The base body contains SiO ２ The inductor component according to claim 1 or 2, which contains ２ .

4. The first external electrode is composed of a plurality of conductive layers and includes a conductive layer having a different material from the conductive layer constituting the outermost coil wiring. The inductor component according to claim 1 or 2.

5. The first external electrode is continuously provided from the first portion of the convex portion to the side opposite to the second portion, and includes a bottom portion extending in a direction parallel to the first main surface, and a wall portion continuously provided from the bottom portion and extending in the first direction. The inductor component according to claim 1 or 2.

6. The first external electrode further includes a fourth portion that is separated from the second portion and is located on the first direction side of the second portion. The inductor component according to claim 1 or 2.

7. The first main surface has a concave portion. The concave portion has a stepped side surface. At least a part of the first external electrode is in contact with the side surface and has a shape along the side surface. The inductor component according to claim 1 or 2.

8. The inductor component further includes an insulator provided on a part of the first main surface. At least a part of the first external electrode is in continuous contact with the insulator, the first main surface, and the first side surface of the convex portion. The inductor component according to claim 1 or 2.

9. The first coil wiring is provided on the first main surface. The inductor component further includes an insulator that covers the first coil wiring and has a shape along the shape of the first coil wiring. At least a part of the first external electrode is in contact with the insulator and has a shape along the shape of the first coil wiring. The inductor component according to claim 1 or 2.

10. The inductor component further includes an organic insulator provided on the first main surface. The element body is an inorganic insulator, and the organic insulator is located inside the outer surface of the inorganic insulator when viewed from a direction perpendicular to the first main surface. The inductor component according to claim 1 or 2.

11. When viewed from a direction parallel to the axis, the first through wiring and the second through wiring are not parallel. The inductor component according to claim 1 or 2.

12. The base body contains SiO ２ and The first through-wiring is SiO ２ The inductor component according to claim 1 or 2, including

13. The first through wiring includes a void portion or a resin portion. The inductor component according to claim 1 or 2.

14. The first through wiring has a conductive layer located on the outer peripheral side when viewed from the extending direction of the first through wiring, and a non-conductive layer located inside the conductive layer. The inductor component according to claim 1 or 2.

15. The axial length of the coil is shorter than the inner diameter of the coil. The inductor component according to claim 1 or 2.

16. The first through wiring extends in a direction perpendicular to the first main surface. The inductor component according to claim 1 or 2, wherein at least one of the cross-sectional areas of both end portions in the extending direction of the first through wiring is larger than the cross-sectional area of the central portion in the extending direction of the first through wiring.

17. The inductor component according to claim 1 or 2, wherein the thickness of the inductor component is 200 μm or less.

18. The inductor component according to claim 1 or 2, wherein the first external electrode and the second external electrode are located inside the outer surface of the element body when viewed from a direction perpendicular to the first main surface.

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