Die Bonding Apparatus and Method of Manufacturing a Semiconductor Device

Abstract

To provide a die bonding device capable of further reducing oscillation.SOLUTION: A die bonding device comprises a driven body and a table driving the driven body. The table comprises: base; a liner motor having a first movable element and a stator which move the driven body; a first direct-acting guide provided between the base and the stator and freely moving the stator; a second direct-acting guide provided between the base and the first movable element and freely moving the first movable element; a second movable element provided so as to be fixed to the base; and a control device that controls the first and second movable elements. The control device is constructed so as to move the stator along the first direct-acting guide by the second movable element.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present disclosure relates to a die bonding apparatus, and is applicable to, for example, a die bonding apparatus provided with a reaction absorption mechanism.

Background Art

[0002] Among semiconductor manufacturing apparatuses, there is a die bonding apparatus such as a die bonder that bonds a semiconductor chip called a die to a substrate such as a wiring board or a lead frame. In a die bonder, a die is vacuum-sucked by a bonding head, raised at high speed, horizontally moved, and lowered to be mounted on a substrate.

[0003] There are high demands for high precision and high speed of die bonders, and particularly high demands for high speed of the bonding head, which is the core of bonding. Generally, when the speed of the apparatus is increased, vibrations caused by high-speed moving objects become large, and it becomes difficult for the apparatus to obtain the desired accuracy due to these vibrations.

[0004] As a reaction absorption device for reducing this vibration, for example, there is one described in Japanese Unexamined Patent Application Publication No. 2013-179206 (Patent Document 1). Patent Document 1 uses a linear motor as a drive shaft of the bonding head of a die bonder, makes a fixed integral part including a fixed magnet part movable freely as a counterweight, and discloses a technique for reducing vibration by causing a movable integral part including the bonding head and the fixed integral part to move synchronously with each other.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] However, in a structure where a fixed integral part (stator) is freely operated by the reaction of a movable integral part (rotor) as in the technology disclosed in Patent Document 1, it is difficult to perform fine motion control for reducing vibration.

[0007] An object of the present disclosure is to provide a die bonding apparatus capable of further reducing vibration.

Means for Solving the Problems

[0008] The outline of typical ones among the present disclosures will be briefly described as follows. That is, the die bonding apparatus includes a driven body and a table for driving the driven body. The table includes a base, a linear motor including a first mover for moving the driven body and a stator, a first linear guide provided between the base and the stator for freely moving the stator, a second linear guide provided between the base and the first mover for freely moving the first mover, a second mover fixedly provided on the base, and a control device for controlling the first mover and the second mover. The control device is configured to move the stator along the first linear guide by the second mover.

Advantages of the Invention

[0009] According to the above die bonding apparatus, it is possible to further reduce vibration.

Brief Description of the Drawings

[0010]

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DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, embodiments, modifications, and examples will be described with reference to the drawings. However, in the following description, the same reference numerals may be assigned to the same components, and repeated descriptions may be omitted. Note that, for the sake of clarity in the description, the drawings may schematically represent the width, thickness, shape, etc. of each part as compared with the actual aspect, but this is merely an example and does not limit the interpretation of the present disclosure.

[0012] The configuration of the table in the embodiment will be described with reference to FIGS. 1 to 5. FIG. 1 is a top view of the table in the embodiment. FIG. 2 is a front view of the table in FIG. 1. FIG. 3 is a cross-sectional view taken along line A-A of FIG. 1. FIG. 4 is a cross-sectional view taken along line B-B of FIG. 1. FIG. 5 is a perspective view of the state before the first mover moves in a die bonding apparatus having the table shown in FIG. 1.

[0013] In the embodiment, a linear motor is used as the drive source for the table 100. The table 100 includes a base 101, a first linear guide 102 installed on the base 101, a second linear guide 103 arranged on the base 101 in parallel with the first linear guide 102, and a stator 104 installed on the first linear guide 102. The base 101 is fixed to a mount (not shown) of the die bonding apparatus 10. The first linear guide 102 and the second linear guide 103 extend in the Y-axis direction. The first linear guide 102 is configured to be longer than the second linear guide 103.

[0014] The stator 104 includes a magnet portion 104a in which a large number of permanent magnets of N poles and S poles are alternately arranged in the Y direction, a flat yoke 104b that couples the magnetic fluxes of adjacent permanent magnets, and a first linear slider 104c that moves on the first linear guide 102. The magnet portion 104a is provided on the upper surface of the yoke 104b, and the first linear slider 104c is provided on the lower surface of the yoke 104b.

[0015] Table 100 further includes a first mover 105 and a second mover 106 provided above the stator 104. The first mover 105 includes a coil portion 105a, a support 105b for supporting the coil portion 105a, and a second linear slider 105c that moves on the second linear guide 103. The coil portion 105a includes a coil that generates magnetic flux by an electric current, a core, and a yoke that couples adjacent magnetic fluxes, and constitutes an electromagnet. The support 105b is provided on the second linear slider 105c. The first mover 105 can move freely on the second linear guide 103.

[0016] The second mover 106 includes a coil portion 106a and a support 106b for supporting the coil portion 106a. The coil portion 106a has the same configuration as the coil portion 105a. The support 106b is provided on the base 101. The second mover 106 is fixed to the base 101 and is stationary.

[0017] The length of the first mover 105 (coil portion 105a) and the second mover 106 (coil portion 106a) in the Y-axis direction is shorter than the length of the stator 104 (magnet portion 104a) in the Y-axis direction. The combined length of the length of the first mover 105 (coil portion 105a) and the length of the second mover 106 (coil portion 106a) in the Y-axis direction is also shorter than the length of the stator 104 (magnet portion 104a) in the Y-axis direction.

[0018] As shown in FIG. 5, a driven body 108 is connected to the first mover 105. The driven body 108 is, for example, a Z drive shaft that drives a bonding head in the vertical direction. The driven body 108 also includes a bonding head.

[0019] Further, the table 100 includes a scale 107 provided substantially over the entire region in the Y-axis direction of the base 101. The scale 107 and a detection sensor (not shown), for example, an optical detection sensor provided on the driven body 108 constitute a linear sensor. The linear sensor detects the position of the driven body 108 in the Y-axis direction, and based on the output of this linear sensor, movement control to a target position such as position control or speed control is performed. Thereby, for example, the first mover 105 can be controlled by the control method described in Japanese Patent Application Laid-Open No. 2015-173551.

[0020] The operation of the table 100 is controlled by the control device 110. That is, the control device 110 controls the operation of the table 100 by driving, for example, I / O and actuators connected to a network and controlling the current flowing through the coils of the first mover 105 and the second mover 106.

[0021] The reaction absorption operation of the table in the embodiment will be described with reference to FIG. 6. FIG. 6 is a perspective view for explaining the reaction absorption operation of the table shown in FIG. 5.

[0022] The control device 110 virtually moves the second mover 106 in parallel with the movement of the first mover 105 in the same direction (Y-axis direction) as the direction in which the first mover 105 moves. Note that since the second mover 106 is fixed to the base 101, it cannot move. When the second mover 106 is not fixed, flowing a current so that the second mover 106 moves is referred to as virtually moving the second mover 106.

[0023] Here, let the mass of the first mover 105 be m1, the mass of the stator 104 be m2, the acceleration of the first mover 105 be a1, the acceleration of the second mover 106 be a2, the acceleration of the stator 104 be a3, the thrust acting on the first mover 105 be F1, the thrust acting on the second mover 106 be F2, and the thrust acting on the stator 104 be F3. The respective equations of motion are represented by the following formulas.

[0024] F1 = m1 × a1 ···(1) F2 = m2 × a2 ···(2) F3 = m2 × a3 ···(3)

[0025] The reaction absorption (counter) mechanism exerts an effect when the equations of motion of the first mover 105 and the stator 104 are equal. That is, the following equation holds.

[0026] F1 = F3 ···(4)

[0027] Here, let the thrust on the stator 104 when the first mover 105 moves be F', and its acceleration be a'. The acceleration (a3) of the stator 104, which is the counterweight, is the sum of the acceleration (a' < a1) of the thrust (F') on the stator 104 when the first mover 105 moves and the acceleration (a2) of the stationary second mover 106. That is, the following equation holds.

[0028] a3 = a' + a2 ···(5) F3 = F' + F2 ···(6)

[0029] The acceleration required for the second mover 106 at this time is calculated from the above equation. That is, substitute equations (1), (3), and (5) into equation (4).

[0030] m1 × a1 = m2 × a3 = m2(a' + a2) ∴ a2 = (m1 / m2) × a1 - a' ···(7)

[0031] By setting the acceleration of the second mover 106 to a2 calculated by substituting numerical values into the above equation (7), the counter mechanism exerts an effect. However, as described above, since the second mover 106 is fixed to the base 101, instead of the second mover 106, the stator 104 moves in the opposite direction to the first mover 105. Thereby, it becomes possible to achieve vibration suppression of the table 100.

[0032] In this embodiment, a second mover 106 fixed to the base 101 is provided, and the stator 104 is made freely movable. As a result, the stator 104 can be used as a counterweight, so that the counter mechanism can be miniaturized. Further, since the acceleration of the stator 104 is controlled by the stationary second mover 106, it is possible to adjust an appropriate vibration damping movement distance for each table, and a counter mechanism adapted to the machine difference becomes possible.

[0033] Substantially, the calculation of the acceleration and deceleration of the stator 104 in accordance with the acceleration of the first mover 105 is as described above. This will be described using the v-t diagram shown in FIG. 29. FIG. 29 is a diagram showing the relationship between the speed and time of the first mover and the stator. When the acceleration time, constant speed time, and deceleration time of the first mover 105 are ta, tc, and td, respectively, the stator 104 operated by the second mover 106 also establishes a counter by matching the acceleration time, constant speed time, and deceleration time with those of the first mover 105. At this time, the stator 104 moved by the second mover 106 needs to move with the same stroke as the mover. However, when the stator 104 is used, since the acceleration can be changed by the weight ratio, the operating speed of the stator 104 can be freely adjusted accordingly. Therefore, it is also possible to make the stroke range narrower than that of the first mover 105.

[0034] Since the table in this embodiment can freely control the counter operation, when another table different from this table is mounted on the same device, the stator is moved by the second mover of this table, and when the other table operates, it is possible to generate vibrations that cancel out the vibrations. As a result, it is possible to substitute without adding a vibration damping mechanism to the other table, so that enlargement can be prevented and both the space and cost within the device can be suppressed.

[0035] The stroke extension operation of the table in the embodiment will be described with reference to FIGS. 5 to 8. FIG. 7 is a perspective view of the table shown in FIG. 5 when the stator is moved in the direction opposite to that in FIG. 6. FIG. 8 is a perspective view for explaining the stroke of the first mover in the table shown in FIG. 7.

[0036] As described above, when the reaction absorption operation is performed in Table 100, as shown in FIG. 6, the control device 110 virtually moves the second mover 106 that is stationary in the same direction as the moving direction of the first mover 105, so that the stator 104 moves in the direction opposite to the first mover 105, and the counter operation is performed. Here, the stroke (movable range) of the first mover 105 is L1. Further, as shown in FIG. 5, before the first mover 105 and the stator 104 move, the right end of the second mover 106 is fixed at a distance of L2 from the right end of the stator 104.

[0037] As shown in FIG. 7, when the control device 110 virtually moves the second mover 106 in the direction opposite to the moving direction (Y-axis direction) of the first mover 105, the stator 104 moves in the same direction as the moving direction of the first mover 105. Since the stator 104 can move a maximum of L2, as shown in FIG. 8, it is possible to extend the stroke of the first mover 105 from L1 to (L1 + L2). In this way, when extending the stroke, the enlargement of the table can be minimized, and the cost can be suppressed by compact design, reduction of the number of assembly steps, and reduction of the number of parts.

[0038] For example, when this table is provided on the bonding table of a die bonding device, a unit for replacing and cleaning consumables such as collets for handling the die in the extended stroke range can be provided separately from the stroke for performing die bonding, thereby improving the product quality and maintainability. In addition, even in the case of a long stroke drive such as a two-lane device in which two lanes for transporting the substrate are arranged in the extending direction (Y-axis direction) of the bonding table, the stator can be miniaturized and implemented at low cost.

[0039] <Modification Example> Hereinafter, several representative modifications of the embodiment will be exemplified. In the description of the following modifications, the same reference numerals as those in the above-described embodiment may be used for parts having the same configuration and function as those described in the above-described embodiment. And, for the description of such parts, the description in the above-described embodiment may be appropriately incorporated within a technically consistent range. Further, a part of the above-described embodiment and all or part of a plurality of modifications may be appropriately and combinatorially applied within a technically consistent range.

[0040] (First Modification Example) The table in the first modification example will be described with reference to FIGS. 9 and 10. FIG. 9 is a perspective view of the table in the first modification example. FIG. 10 is a diagram showing the waveforms of the speed and acceleration of the first mover and the acceleration of the stator.

[0041] As shown in FIG. 9, the table 100 in the first modification example is provided with an acceleration sensor 109 at the tip of a driven body 108 connected to the first mover 105 of the table in the embodiment, and other configurations are the same as those of the table in the embodiment.

[0042] When the first mover 105 performs acceleration and deceleration as shown in FIG. 10, the stator 104 operates with an acceleration-time waveform (FAW) that is out of phase with the acceleration-time waveform (MAW) of the first mover 105, so that a counter is established. As described above, the control device 110 in the embodiment independently controls the first mover 105 and the second mover 106, and moves the second mover 106 asynchronously in the same direction in parallel with the movement of the first mover 105 to perform a counter operation. In the first modification example, during the same counter operation as in the embodiment, the waveform of the bounce-back generated with acceleration is measured by the acceleration sensor 109 and reflected in the standard acceleration waveform in which the second mover 106 operates the stator 104.

[0043] Specifically, by calculating a waveform that is out of phase from the waveform measured by the acceleration sensor 109 by the measurement unit and the calculation unit of the control device 110, the acceleration of the second mover 106 is obtained in real time, and the counter operation is established.

[0044] The counter operation of the embodiment is performed with respect to the optimal operation in which acceleration and the like are measured and evaluated in operations such as bonding performed in advance. For example, a standard value obtained from measurement data accumulated in advance, or a value evaluated by taking the correlation with vibration with a previously calculated acceleration is used. The thrust is calculated from the acceleration of the first mover 105 obtained by calculation and the weight of the first mover 105 with respect to the optimal operation obtained from the evaluation result, and the kinetic energy is calculated. The required acceleration is calculated from the total weight of the stator 104 so as to have the same energy as this kinetic energy. The required acceleration for this stator 104 is input to the second mover 106 for the same time as the acceleration time of the first mover 105 and implemented.

[0045] When the acceleration is measured in real time by the acceleration sensor 109 as in this modified example, the calculation is performed each time by the control device 110 that performs the above calculation, and by correcting in real time, a counter at an appropriate acceleration can be automatically realized. The acceleration of the first mover 105 such as the bonding head of the embodiment is automatically set from the set speed, but this modified example is effective because it may change due to the change over time of the load such as the linear guide.

[0046] (Second Modified Example) The table in the second modified example will be described with reference to FIG. 11. FIG. 11 is a perspective view of the table in the second modified example.

[0047] In the second modification example, the table 100 has two or more weight sensors 201 provided in parallel with the first linear guide 102 or the second linear guide 103 under the common base 101 on which the first linear guide 102 and the second linear guide 103 in the embodiment are mounted. Other configurations are the same as those of the table in the embodiment. If only the counter operation of the Y-axis movement is required, it may be installed at both ends (two places) in the Y-axis direction of the base 101. When considering the center of gravity of the X-axis, as shown in FIG. 11, it is installed at the four corners (four places) of the base 101.

[0048] In the second modification example, in the counter operation in the embodiment, the following control is performed. Before the movement of the first mover 105, for example, the weights of the two weight sensors 201 are memorized, and during the operation of the first mover 105, the movement of the stator 104 is controlled by the second mover 106 so as to maintain the weight balance detected by these weight sensors 201. That is, the stator 104 is given a thrust by the second mover 106 so that the combined center of gravity position of the first mover 105 and the stator 104 is always at the same position as the center of gravity before the start of the operation when the first mover 105 moves, and the operation is controlled in the direction opposite to that of the first mover 105.

[0049] The following is performed manually in advance. Here, the weight balance is, for example, the ratio of the weights detected by the two weight sensors 201 and not the absolute weight. Also, an example in which the driven body 108 is a bonding head will be described.

[0050] (Simple operation) (1-1) Move the first mover 105 that drives the bonding head to the die pick-up position (start position) and measure the weight balance at that position. Here, the stator 104 remains at the start position. (1-2) Move the first mover 105 to the die bonding position (stop position) and measure the weight balance. Here, the stator 104 remains at the start position without being moved. (1-3) With the first mover 105 moved to the bonding position, move the stator 104 until it reaches the weight balance at the pickup position (start position), and memorize that position. (1-4) Move the stator 104 between its start position and the position in (1-3) in the same time as the (Y-axis) operation of the first mover 105 from the pickup position (start position) to the bonding position (stop position).

[0051] (Detailed operation) During the acceleration operation of the bonding head, perform the operation described in the first modification example. During the low-speed movement, operate in such a way as to make the above movement considering the weight balance including the movement amount during acceleration.

[0052] Note that a weight sensor 201 may be installed on the base 101 under both ends of the first linear guide 102 and the second linear guide 103.

[0053] (Third modification example) The table in the third modification example will be described with reference to FIG. 12. FIG. 12 is a perspective view of the table in the third modification example.

[0054] The table 100 in the third modification example is provided with vibration damping members 202 such as vibration damping dampers or balancers (pendulum counters) for absorbing Z-direction vibrations under both ends of the first linear guide 102 and the second linear guide 103 in the embodiment and on the base 101. Other configurations are the same as the table in the embodiment. Note that vibration damping members 202 may be provided under the four corners of the base 101 and on the mount of the device.

[0055] (Fourth modification example) The configuration of the table in the fourth modification example will be described with reference to FIGS. 14 to 17. FIG. 14 is a top view of the table in the fourth modification example. FIG. 15 is a front view of the table in FIG. 14. FIG. 16 is a cross-sectional view taken along line C-C of FIG. 14. FIG. 17 is a cross-sectional view taken along line D-D of FIG. 14.

[0056] In the fourth modification example, the table 100 further includes an electromagnetic clutch 111 that enables the stator 104 to be fixed and movable, and a fixing plate 112 that enables the second mover 106 to be fixed, with respect to the table in the embodiment. Also, similar to the first mover 105, the second mover 106 is provided on the second linear guide 103. Therefore, the second linear guide 103 is configured to extend longer in the Y-axis direction than in the embodiment. The second mover 106 in the third modification example includes a support 106b that supports the coil portion 106a, and a second linear slider 106c that moves on the second linear guide 103. The support 106b is provided on the second linear slider 105c, similar to the support 105b. Other configurations of the table 100 in the third modification example are the same as those in the embodiment.

[0057] The electromagnetic clutch 111 is composed of a coil. By energizing the coil, the electromagnetic force generated attracts the yoke 104b formed of a ferromagnetic material of the stator 104 to fix the stator 104. By cutting off the power supply to the coil, the electromagnetic force disappears and the force attracting the yoke 104b disappears, making the stator 104 movable. With the electromagnetic clutch 111, the stator 104 can be fixed at an arbitrary position.

[0058] The fixing plate 112 is formed of a ferromagnetic material and is arranged to extend along the second linear guide 103. The support 106b includes a coil similar to the electromagnetic clutch 111. By energizing the coil, the electromagnetic force generated attracts the fixing plate 112 to fix the second mover 106. By cutting off the power supply to the coil, the electromagnetic force disappears and the force attracting the fixing plate 112 disappears, making the second mover 106 movable. With the electromagnetic clutch function of the support 106b and the fixing plate 112, the second mover 106 can be fixed at an arbitrary position.

[0059] The reaction absorption operation of the table in the fourth modification example will be described with reference to FIGS. 18 and 19. FIG. 18 is a perspective view for explaining the first reaction absorption operation of the table in the fourth modification example. FIG. 19 is a perspective view for explaining the second reaction absorption operation of the table in the fourth modification example.

[0060] When the first mover 105 performs a large movement, as shown in FIG. 18, the second mover 106 is fixed to the fixing plate 112 by the electromagnetic clutch function of the support 106b, and the stator 104 is made movable by the electromagnetic clutch 111. Similar to the embodiment, a counter operation is performed by the stator 104.

[0061] When the first mover 105 performs a small movement, as shown in FIG. 19, the second mover 106 is made movable by the electromagnetic clutch function of the support 106b, and the stator 104 is fixed by the electromagnetic clutch 111. A counter operation is performed by the second mover 106.

[0062] The stroke extension operation of the table in the fourth modification will be described with reference to FIGS. 20 to 22. FIG. 20 is a perspective view showing a state in which the second mover of the table in the fourth modification is moved to a predetermined position. FIG. 21 is a perspective view showing a state in which the stator of the table in the fourth modification is moved in the traveling direction. FIG. 22 is a perspective view showing a state in which the first mover of the table in the fourth modification is moved in the traveling direction.

[0063] The stator 104 is fixed by the electromagnetic clutch 111, and the second mover 106 is made movable by the electromagnetic clutch function of the support 106b. As shown in FIG. 20, after the second mover 106 is moved a predetermined distance in the traveling direction in which the first mover 105 moves, the second mover 106 is fixed by the electromagnetic clutch function of the support 106b. As shown in FIG. 21, when the second mover 106 is virtually moved in the direction opposite to the direction in which the first mover 105 moves, the stator 104 operates in the same direction as the direction in which the first mover 105 moves. Thereby, as shown in FIG. 22, it becomes possible to extend the stroke of the first mover 105 as in the embodiment.

[0064] (Fifth Modification) The configuration of the table in the fifth modification example will be described with reference to FIGS. 13(a) and 13(b). FIG. 13(a) is a diagram corresponding to a cross-sectional view taken along line B-B of FIG. 1 of the table in the fifth modification example. FIG. 13(b) is a diagram corresponding to a cross-sectional view taken along line B-B of FIG. 1 of the table in another example of the fifth modification example.

[0065] The table in the fifth modification example is provided with a linear sensor for detecting the position of the stator 104 in addition to the table in the embodiment.

[0066] As shown in FIG. 13(a), a linear sensor is constituted by a scale 107a installed on the side surface of the stator 104 on the side of the second mover 106 and an optical detection sensor 109a provided on the support 106b of the second mover 106. Thereby, the stator 104 is also subjected to movement control to a target position such as position control or speed control based on the output of the linear sensor. For example, the second mover 106 can be controlled by the control method described in Japanese Patent Application Laid-Open No. 2015-173551.

[0067] Note that, as shown in FIG. 13(b), a linear sensor may be constituted by an optical detection sensor 109b provided on the stator 104 and a scale 107 provided on the base 101.

[0068] (Sixth Modification Example) The configuration of the table in the sixth modification example will be described with reference to FIG. 28. FIG. 28 is a perspective view of the table in the sixth modification example.

[0069] In the embodiment, an example in which the arrangement of the N and S poles of the permanent magnets in the magnet portion 104a of the stator 104 is uniform has been described. However, as shown in FIG. 28, the arrangement of the N and S poles of the permanent magnets in the portion of the magnet portion 104a of the stator 104 that operates facing the second mover 106 may be made denser or the size of the magnets may be changed to increase the thrust. That is, in the sixth modification, by further subdividing the N and S poles of the magnet portion 104a arranged on the yoke 104b without changing the arrangement, detailed operation of the coil portion 106a of the second mover 106 is made possible. Usually, a stator composed of a magnet plate is heavy and the amount of movement is small. A smaller stroke can be accurately moved when the interval between the S pole and the N pole is narrow. Thereby, even when the weights of the first mover 105 and the stator 104 are significantly different or the amounts of movement are different (very small) as a result, they can be operated synchronously with the same accuracy. For example, in a weight ratio of 5 to 1, synchronous control becomes easy when the S and N poles are arranged with a density five times as high.

[0070] (Seventh Modification) The configuration of the table in the seventh modification will be described with reference to FIGS. 30 to 33. FIG. 30 is a top view of the table in the seventh modification. FIG. 31 is a front view of the table shown in FIG. 30. FIG. 32 is a rear view of the table shown in FIG. 30. FIG. 33 is a left side view of the table shown in FIG. 30.

[0071] In the embodiment, the scale 107 of the linear sensor for detecting the position of the first mover 105 is provided on the base 101. However, in the seventh modification, a scale 213 for detecting the position of the first mover 105 is provided on the stator 104. Also, in the seventh modification, a scale 215 for detecting the position of the stator 104 is also provided on the stator 104. Further, in the seventh modification, since the scales 213 and 215 are provided on the stator 104, the structure of the stator 104 is different from that of the embodiment. The table 100 in the seventh modification has the same configuration as the embodiment except for the configuration related to the linear sensor. Hereinafter, the table 100 in the seventh modification will be described centering on the differences from the embodiment.

[0072] First, the stator 104 in the seventh modification will be described. As shown in FIG. 33, the yoke 104b is U-shaped in a side view. The magnet portion 104a is provided on the lower surface of the upper horizontal portion and the upper surface of the lower horizontal portion of the yoke 104b, and the first linear slider 104c is provided on the lower surface of the lower horizontal portion of the yoke 104b.

[0073] Next, the first mover 105 in the seventh modification will be described. The support 105b is erected on the second linear slider 105c and extends upward beyond the upper surface of the upper horizontal portion of the yoke 104b. The coil portion 105a is supported by the support 105b so as to be located at an intermediate position in the vertical direction between the upper horizontal portion and the lower horizontal portion of the yoke 104b.

[0074] Next, the second mover 106 in the seventh modification will be described. The second mover 106 has the same structure as that of the embodiment, and the coil portion 106a is supported on the upper side of the support 106b so as to be located at an intermediate position in the vertical direction between the upper horizontal portion and the lower horizontal portion of the yoke 104b.

[0075] Next, the linear sensor in the seventh modification will be described. A scanning head 212 for the first mover 105 is connected to the upper surface of the support 105b of the first mover 105. A driven body similar to the driven body 108 shown in the embodiment is connected to the scanning head 212. The scanning head 214 for the stator 104 is supported on the upper surface of a support 216 fixed on the base 101.

[0076] Further, the table 100 includes a scale 213 for the first mover 105 provided to extend in the Y-axis direction on the upper surface of the upper horizontal portion of the yoke 104b, and a scale 215 for the stator 104 provided over substantially the entire region in the Y-axis direction on the side surface of the vertical portion of the yoke 104b. The scale 213 and an optical detection sensor (not shown) provided on the scanning head 212 constitute a first linear sensor. The scale 215 and an optical detection sensor (not shown) provided on the scanning head 214 constitute a second linear sensor.

[0077] The first linear sensor detects the position of the first mover 105 in the Y-axis direction with respect to the stator 104, and the second linear sensor detects the position of the stator 104 in the Y-axis direction with respect to the base 101. Based on the outputs of the first and second linear sensors, movement control to a target position such as position control or speed control is performed.

[0078] Generally, a hall sensor is used in a motor. A hall sensor is a sensor that applies the current-magnetic effect called the hall effect. Its applications are generally rotation detection, position detection, opening / closing detection, current detection, azimuth detection, etc. In the case of a linear motor, it is position detection that converts the strength and direction of a magnetic field into a voltage.

[0079] In order to execute a counter mechanism using a linear motor, when the magnet portion 104a of the stator 104 moves, it is necessary to accurately detect the direction in which the coil portion 105a of the first mover 105 moves and be able to move the indicated distance. If the phases of the first mover 105 and the stator 104 are different, torque shortage or reverse operation may be considered.

[0080] When detecting the position (absolute position) of the first mover 105 with respect to the base 101 using a linear sensor, since the stator 104 moves in the counter operation, the relative position between the first mover 105 and the stator 104 cannot be grasped. Therefore, it is necessary to detect the position of the first mover 105 with respect to the stator 104 using a hall sensor provided in the coil portion 105a of the first mover 105 and perform control so that the phases of the first mover 105 and the stator 104 do not differ (become the same).

[0081] In the seventh modification example, by attaching the scale 215 for the first mover 105 to the stator 104 side, the relative position between the first mover 105 and the stator 104 is grasped. As a result, the position of the scale 215 in the operation of the stator 104 can be made to follow the arrangement of the magnetic poles of the magnet portion 104a. Therefore, even without control, the relative positional relationship between the first mover 105 and the stator 104 can be grasped and current can be passed through at the correct phase (θ), so that thrust can be correctly generated by the linear motor. At this time, in order to move the first mover 105 to the target position, it is necessary to consider the movement amount of the stator 104 in the counter operation control. The movement amount of the stator 104 in the counter operation control is obtained by the time - speed change of the stator 104 based on the weight ratio between the first mover 105 and the stator 104.

[0082] (Eighth Modification Example) The configuration of the table in the eighth modification example will be described with reference to FIGS. 34 and 35. FIG. 34 is a top view of the table in the eighth modification example. FIG. 35 is a rear view of the table shown in FIG. 34.

[0083] In the seventh modification example, separate scales are used for the scale 213 for the first mover 105 and the scale 215 for the stator 104. In the eighth modification example, one scale 213 that covers the entire area of the stator 104 is provided, and different positions of the same scale 213 are detected by the first linear sensor of the first mover 105 and the second linear sensor provided on the second mover 106 fixed to the base 101, respectively.

[0084] Hereinafter, an example in which the table in the embodiment or the modification example is applied to a die bonder, which is an example of a die bonding device, will be described.

Example

[0085] FIG. 23 is a top view showing an outline of the die bonder in the first embodiment. FIG. 24 is a diagram for explaining the operations of the pickup head and the bonding head when viewed from the direction of arrow A in FIG. 23.

[0086] The die bonder 10 generally includes a die supply unit 1 that supplies a die D to be mounted on a substrate S, a pickup unit 2, an intermediate stage unit 3, a bonding unit 4, a transfer unit 5, a substrate supply unit 6, a substrate discharge unit 7, and a control device 8 that monitors and controls the operations of each unit. The Y-axis direction is the front-rear direction of the die bonder 10, and the X-axis direction is the left-right direction. The die supply unit 1 is arranged on the front side of the die bonder 10, and the bonding unit 4 is arranged on the rear side. Here, one or more product areas (hereinafter referred to as package area P), which will be the final one package, are printed on the substrate S.

[0087] First, the die supply unit 1 supplies the die D to be mounted on the package area P of the substrate S. The die supply unit 1 includes a wafer holding stage 12 that holds a wafer 11 and a peeling unit 13 shown by a dotted line that peels the die D from the wafer 11. The die supply unit 1 moves in the XY-axis directions by a driving means (not shown) and moves the die D to be picked up to the position of the peeling unit 13.

[0088] The pickup unit 2 includes a pickup head 21 that picks up the die D, a Y driving unit 23 of the pickup head that moves the pickup head 21 in the Y-axis direction, and various driving units (not shown) that move a collet 22 up and down, rotate it, and move it in the X-axis direction. The pickup head 21 has a collet 22 (see also FIG. 24) that sucks and holds the peeled die D at its tip, picks up the die D from the die supply unit 1, and places it on the intermediate stage 31. The pickup head 21 has various driving units (not shown) that move the collet 22 up and down, rotate it, and move it in the X-axis direction.

[0089] The intermediate stage unit 3 includes an intermediate stage 31 that temporarily places the die D and a stage recognition camera 32 for recognizing the die D on the intermediate stage 31.

[0090] The bonding unit 4 picks up the die D from the intermediate stage 31 and bonds it onto the package area P of the substrate S being conveyed, or bonds it in a form of laminating on the die that has already been bonded onto the package area P of the substrate S. The bonding unit 4 includes a bonding head 41 that holds and adsorbs the die D at its tip in the same manner as the pickup head 21 (see also Fig. 24), a Y drive unit 43 that moves the bonding head 41 in the Y-axis direction, and a substrate recognition camera 44 that images the position recognition mark (not shown) of the package area P of the substrate S and recognizes the bonding position. The Y-axis drive unit 43 is configured by a table according to any one of the embodiment and the first to fourth modification examples or a combination thereof. The bonding head 41 is the driven body 108 in the embodiment. With such a configuration, the bonding head 41 corrects the pickup position and posture based on the imaging data of the stage recognition camera 32, picks up the die D from the intermediate stage 31, and bonds the die D onto the substrate based on the imaging data of the substrate recognition camera 44.

[0091] The transfer unit 5 has a substrate transfer claw 51 that grips and transfers the substrate S, and a transfer lane 52 along which the substrate S moves. The substrate S is moved by driving a nut (not shown) of the substrate transfer claw 51 provided on the transfer lane 52 with a ball screw (not shown) provided along the transfer lane 52. With such a configuration, the substrate S moves from the substrate supply unit 6 along the transfer lane 52 to the bonding position, and after bonding, moves to the substrate discharge unit 7 and delivers the substrate S to the substrate discharge unit 7.

[0092] The control device 8 corresponds to the control device 110 in the embodiment, and includes a memory that stores a program (software) for monitoring and controlling the operations of each part of the die bonder 10, and a central processing unit (CPU) that executes the program stored in the memory.

[0093] Next, the configuration of the die supply unit 1 will be described with reference to Fig. 25. Fig. 25 is a schematic cross-sectional view showing the main part of the die supply unit in Fig. 23.

[0094] The die supply unit 1 includes a wafer holding stage 12 that moves in the horizontal direction (XY-axis direction), and a peeling unit 13 that moves in the vertical direction. The wafer holding stage 12 has an expand ring 15 that holds a wafer ring 14, and a support ring 17 that horizontally positions a dicing tape 16 to which a plurality of dice D are adhered and that is held by the wafer ring 14. The peeling unit 13 is disposed inside the support ring 17.

[0095] When pushing up the die D, the die supply unit 1 lowers the expand ring 15 that holds the wafer ring 14. As a result, the dicing tape 16 held by the wafer ring 14 is stretched and the interval between the dice D is widened, and the peeling unit 13 peels the die D from the dicing tape 16, improving the pick-up property of the die D. Note that the adhesive for adhering the die to the substrate changes from a liquid state to a film state, and a film-like adhesive material called a die attach film (DAF) 18 is pasted between the wafer 11 and the dicing tape 16. In the wafer 11 having the die attach film 18, dicing is performed on the wafer 11 and the die attach film 18. Therefore, in the peeling step, the wafer 11 and the die attach film 18 are peeled from the dicing tape 16.

[0096] Next, a method for manufacturing a semiconductor device using the die bonder in the first embodiment will be described with reference to FIG. 26. FIG. 26 is a flowchart showing a method for manufacturing a semiconductor device using the die bonder of FIG. 23.

[0097] (Wafer / Substrate Loading Step: Step S11) A wafer ring 14 holding a dicing tape 16 to which dice D divided from a wafer 11 are attached is stored in a wafer cassette (not shown) and carried into the die bonder 10. The control device 8 supplies the wafer ring 14 from the wafer cassette filled with the wafer rings 14 to the die supply unit 1. Also, a substrate S is prepared and carried into the die bonder 10. The control device 8 attaches the substrate S to the substrate transfer claws 51 at the substrate supply unit 6.

[0098] (Pickup process: Step S12) As described above, the control device 8 peels off the die D and picks up the peeled die D from the wafer 11. In this way, the die D peeled from the dicing tape 16 together with the die attach film 18 is adsorbed and held by the collet 22 and conveyed to the next process (Step S13). Then, when the collet 22 that has conveyed the die D to the next process returns to the die supply unit 1, the next die D is peeled from the dicing tape 16 according to the above-described procedure, and thereafter, the die D is peeled one by one from the dicing tape 16 according to the same procedure.

[0099] (Bonding process: Step S13) The control device 8 mounts the picked-up die on the substrate S or stacks it on a die that has already been bonded. The control device 8 places the die D picked up from the wafer 11 on the intermediate stage 31, picks up the die D again from the intermediate stage 31 with the bonding head 41, and bonds it to the conveyed substrate S.

[0100] (Substrate unloading process: Step S14) The control device 8 takes out the substrate S to which the die D is bonded from the substrate transfer claw 51 at the substrate unloading unit 7. The substrate S is unloaded from the die bonder 10.

[0101] As described above, the die D is mounted on the substrate S via the die attach film 18 and carried out from the die bonder. Thereafter, it is electrically connected to the electrodes of the substrate S via Au wires in the wire bonding process. Subsequently, the substrate S on which the die D is mounted is carried into the die bonder, and the second die D is laminated via the die attach film 18 on the die D mounted on the substrate S. After being carried out from the die bonder, it is electrically connected to the electrodes of the substrate S via Au wires in the wire bonding process. The second die D is peeled from the dicing tape 16 by the method described above, and then conveyed to the pelletizing process and laminated on the die D. After the above process is repeated a predetermined number of times, the substrate S is conveyed to the molding process, and the laminated package is completed by sealing the plurality of dies D and Au wires with a molding resin (not shown).

Embodiment

[0102] FIG. 27 is a top view showing an outline of a die bonder in the second embodiment.

[0103] The die bonder 10 in the second embodiment is roughly composed of a wafer supply unit 301, a work supply / conveyance unit 305, a preform unit 302, a die bonding unit 304, and a control device 308 that monitors and controls the operations of each unit.

[0104] The wafer supply unit 301 includes a wafer cassette lifter 311 and a wafer ring holder 312. The work supply / conveyance unit 305 includes a frame pusher 353, a loader lifter 354, a frame feeder 355, a loader 356, and an unloader 357. The die bonding unit 304 includes a bonding head 341 and a bonding table 343. The preform unit 302 includes a preform head 321 and a preform table 323.

[0105] Set a wafer cassette filled with a wafer ring 14 on the wafer cassette lifter 311, and supply the wafer ring 14 to the wafer ring holder 312. In parallel with this, the workpiece supplied from the frame pusher 353 or the loader lifter 354 of the loader 356 is coated or cleaned with a die adhesive by the preform unit 302 and conveyed on the frame feeder 355 to the bonding point.

[0106] In the wafer ring holder 312, similar to the first embodiment, a dicing tape (not shown) is stretched downward (expanded) to widen the interval between the dies (not shown) and improve the die pickup property. Then, the die is pushed up from below the die through the dicing tape by the pushing-up portion 313, picked up by the bonding head 341, and further die bonding is performed on a workpiece (not shown) such as a lead frame. The wafer ring holder 312 is arranged on an XY linear motion table, and after pickup, it linearly moves to the next die position and repeats the die bonding operation.

[0107] The bonding head 341 is installed on the bonding table 343. The bonding table 343 is one of any one or a combination of the embodiments and the first to fourth modification examples. The preform table 323 that drives the preform head 321, the XY table that drives the wafer ring holder 312, and the XY table that drives the pushing-up portion 313 may be one of any one or a combination of the embodiments and the first to fourth modification examples.

[0108] As described above, the disclosure made by the present inventors has been specifically described based on the embodiments, modification examples, and examples. However, it goes without saying that the present disclosure is not limited to the above embodiments, modification examples, and examples, and can be variously changed.

[0109] For example, in the embodiment, an example of a table for moving the driving body in the horizontal direction has been described, but it may also be applied to a table for moving the driving body in the vertical direction.

[0110] In the embodiment, an example of a bonding head is described as the driven body, but it may be an optical unit used in a die bonding mechanism such as a substrate recognition camera in the first embodiment.

[0111] In the first modification example, an example of measuring acceleration to suppress vibration is described. However, vibration suppression within the apparatus may be performed by picking up and feedbacking the vibration of a table or the like of another unit by a sensor that senses vibration. That is, using a sensor that senses vibration, pick up the vibration when another unit is operating, convert it to the opposite phase as it is, and send a command to the second mover 106 that moves the stator 104 which is a counter, thereby suppressing the vibration. For example, provide a similar structure for all three axes of XYZ, and operate the stator of the axis that is not actually operated so as to cancel the composite waveform of the acceleration calculated from a three-dimensional acceleration sensor or a linear sensor to suppress the vibration. Here, the first mover of the axis that is not operated is operated so as to maintain the original position.

[0112] Further, the Y-axis drive unit 23 in the first embodiment may be configured by a table according to any one of the embodiment and the first to sixth modification examples or a combination thereof.

[0113] Also, in the first embodiment, a die bonder that picks up a die from a die supply unit with a pickup head, places it on an intermediate stage, and bonds the die placed on the intermediate stage to a substrate with a bonding head is described. However, it is applicable to a flip chip bonder that picks up a die from a die supply unit, rotates the die pickup head upward, delivers the die to a transfer head or a bonding head, and bonds it to a substrate with a bonding head.

Explanation of Reference Numerals

[0114] 10... Die bonder (die bonding apparatus) 101... Base 102... First linear guide 103... Second linear guide 104... Stator 105 ··· First movable element 106 ··· Second movable element 108 ··· Driven body 110 ··· Control device

Claims

1. A driven body, a table for driving the driven body, comprising: the table includes a base, a linear motor including a first mover and a stator for moving the driven body, a first linear guide provided between the base and the stator for freely moving the stator, a second linear guide provided between the base and the first mover for freely moving the first mover, a second mover fixedly provided on the base, a control device for controlling the first mover and the second mover, comprising: the control device is configured to move the first mover in a first direction along the second linear guide and move the stator in a second direction opposite to the first direction by the second mover along the first linear guide, so as to suppress vibration during the operation of the driven body, a die bonding device.

2. In the die bonding device according to Claim 1, comprising a first linear sensor for detecting the position of the first mover, the control device is configured to perform position control or speed control or movement control to a target position of the first mover based on the output of the first linear sensor, a die bonding device.

3. In the die bonding device according to Claim 2, comprising a second linear sensor for detecting the position of the stator, the control device is configured to perform position control or speed control or movement control to the stator based on the output of the second linear sensor, a die bonding device.

4. A driven body, a table for driving the driven body, comprising: the table includes a base, a linear motor including a first mover and a stator for moving the driven body, a first linear guide provided between the base and the stator for moving the stator, a second mover, a second linear guide provided between the base and the first mover and the second mover for moving the first mover and the second mover, a first fixing portion for fixing and releasing the fixing of the stator, a second fixing portion for fixing and releasing the fixing of the second mover, a control device for controlling the first mover, the second mover, the first fixing portion and the second fixing portion, comprising: the control device enables the stator to be movable by the first fixing portion and fixes the second mover by the second fixing portion, The first mover is moved in a first direction along the second linear guide, and the stator is moved in a second direction, which is opposite to the first direction, along the first linear guide by the second mover, so as to suppress vibration during the operation of the driven body. A die bonding apparatus configured as such.

5. A driven body, A table for driving the driven body, Comprising: The table A base, A linear motor including a first mover for moving the driven body and a stator, A first linear guide provided between the base and the stator for moving the stator, A second mover, A second linear guide provided between the base and the first mover and the second mover for moving the first mover and the second mover, A first fixing portion for fixing and releasing the fixing of the stator, A second fixing portion for fixing and releasing the fixing of the second mover, A control device for controlling the first mover, the second mover, the first fixing portion, and the second fixing portion, Comprising: The control device Fixes the stator by the first fixing portion and makes the second mover movable by the second fixing portion, Moves the first mover in a first direction along the second linear guide and moves the second mover in a second direction, which is opposite to the first direction, along the second linear guide, so as to suppress vibration during the operation of the driven body. A die bonding apparatus configured as such.

6. In the die bonding apparatus according to claim 4, The control device Fixes the stator by the first fixing portion and makes the second mover movable by the second fixing portion, and moves the second mover a predetermined distance in the first direction along the second linear guide, Makes the stator movable by the first fixing portion and fixes the second mover by the second fixing portion, and moves the stator in a second direction, which is opposite to the first direction, along the first linear guide by the second mover, so as to expand the movable range of the first mover in the first direction. A die bonding apparatus configured as such.

7. In the die bonding apparatus according to claim 5, The control device Fixes the stator by the first fixing portion and makes the second mover movable by the second fixing portion, and moves the second mover a predetermined distance in the first direction along the second linear guide, The first fixing portion enables the stator to be movable, the second fixing portion fixes the second movable element, and the second movable element moves the stator along the first linear guide in a second direction opposite to the first direction, thereby expanding the movable range of the first movable element in the first direction. A die bonding apparatus configured as such.

8. In the die bonding apparatus according to any one of Claims 1 to 3, the control device is configured to expand the movable range of the first movable element in the first direction by moving the stator along the first linear guide in the first direction by the second movable element. A die bonding apparatus configured as such.

9. In the die bonding apparatus according to any one of Claims 1 to 3, the stator includes a plurality of permanent magnets and a yoke that couples the magnetic fluxes of the adjacent permanent magnets. The first movable element is disposed above the stator, and includes a first coil portion that forms an electromagnet, and a support body that is disposed on the second linear guide and supports the first coil portion. The second movable element is disposed above the stator, and includes a second coil portion that forms an electromagnet, and a support body that is disposed on the base and supports the second coil portion. A die bonding apparatus configured as such.

10. In the die bonding apparatus according to any one of Claims 4 to 7, the stator includes a plurality of permanent magnets and a yoke that couples the magnetic fluxes of the adjacent permanent magnets. The first movable element and the second movable element are each disposed above the stator, and include a coil portion that forms an electromagnet, and a support body that is disposed on the second linear guide and supports the coil portion. The first fixing portion is disposed close to the stator and is composed of an electromagnet. The second fixing portion is an electromagnet provided on the support body of the second movable element. A die bonding apparatus configured as such.

11. In the die bonding apparatus according to any one of Claims 1, 4, and 5, when the control device accelerates and decelerates the first movable element, the stator is configured to control the second movable element based on a waveform having a phase opposite to that of the acceleration time waveform of the first movable element to move the stator. A die bonding apparatus configured as such.

12. In the die bonding apparatus according to Claim 11, The control device is a die bonding apparatus configured to independently control the first mover and the second mover via a network, and to move the stator in the same direction in parallel with the operation of the first mover.

13. In the die bonding apparatus according to claim 12, the driven body is provided with an acceleration sensor at its tip, the control device is configured to measure, when accelerating or decelerating the first mover, a waveform of the bounce generated due to the acceleration by the acceleration sensor, and to reflect it on a standard acceleration waveform in which the stator is operated by the second mover.

14. In the die bonding apparatus according to any one of claims 1, 4, and 5, the control device is configured to apply a thrust to the stator by the second mover so that the center of gravity position of the combination of the first mover and the stator always remains at the same position as the center of gravity before the start of operation even when the first mover moves.

15. In the die bonding apparatus according to claim 14, furthermore, it is provided with two or more weight sensors, the weight sensors are provided under the base in parallel with the first linear guide or the second linear guide, or above the base under both ends of the first linear guide and the second linear guide, the control device is configured to store the weight detected by the weight sensor before the movement of the first mover, and to move the stator by the second mover so as to maintain a weight balance based on the stored weight during the operation of the first mover.

16. In the die bonding apparatus according to any one of claims 1, 4, and 5, furthermore, it is provided with another table different from the table and a sensor for detecting vibration of the other table, the control device is configured to move the stator by the second mover based on the detected vibration.

17. In the die bonding apparatus according to any one of claims 1 to 7, the stator includes a plurality of permanent magnets and a yoke that couples magnetic fluxes of the adjacent permanent magnets, a portion of the stator that overlaps the second mover in a top view is configured to have a denser arrangement of the permanent magnets than other portions of the stator.

18. In the die bonding apparatus according to any one of claims 1, 4, and 5, A die bonding apparatus provided with a balancer or a damper for absorbing vertical vibration below both ends of the first linear guide.

19. In the die bonding apparatus according to any one of claims 1 to 7, A die bonding apparatus in which the driven body is a bonding head that picks up a die and bonds it to a substrate.

20. In the die bonding apparatus according to any one of claims 1 to 7, A die bonding apparatus in which the driven body is a preform head that applies a die adhesive to a substrate or cleans the substrate.

21. A substrate loading step of loading a substrate into a die bonding apparatus including a bonding head, a table for driving the bonding head, a base, a linear motor including a first mover and a stator for horizontally moving the bonding head, a first linear guide provided between the base and the stator for freely moving the stator, a second linear guide provided between the base and the first mover for freely moving the first mover, and a second mover fixedly provided on the base; A bonding step of picking up a die and bonding it to the substrate; Comprising, In the bonding step, the first mover is moved in a first direction along the second linear guide, and the second mover moves the stator in a second direction opposite to the first direction along the first linear guide, so as to suppress vibration during operation of the bonding head. A method for manufacturing a semiconductor device.

22. In the die bonding apparatus according to claim 1, A first linear sensor for detecting the position of the first mover with respect to the stator; A second linear sensor for detecting the position of the stator with respect to the base; Comprising, The control device is configured to perform position control, speed control, or movement control to a target position of the first mover based on outputs of the first linear sensor and the second linear sensor. A die bonding apparatus.

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