Sensor module, sensor assembly, and medical device

Abstract

To provide a sensor module capable of downsizing in a radial direction and an axial direction, an assembly using the same and a medical device.SOLUTION: A sensor module 10 includes: a first substrate 5; a second substrate 6 joined to a first surface 50a of a first substrate 50; an image sensor 2 mounted on the first surface 50a of the first substrate 5; and a light source 4 mounted on a first surface 60a of the second substrate 6. The second substrate 6 has thickness corresponding to difference between height of the image sensor 2 and height of the light source 4, forms a second through hole 61 where a conductor 70 of a second cable 7B is inserted and electrically connected to the light source 4. The first substrate 5 forms a first through hole 51 where the conductor 70 of a first cable 7A is inserted and is electrically connected to the image sensor 2.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a sensor module, a sensor assembly, and a medical device.

Background Art

[0002] In recent years, a camera head equipped with a light source and downsized in the radial direction has been proposed (see, for example, Patent Document 1).

[0003] The camera head described in Patent Document 1 includes an upper PCB (printed circuit board) on which an individual sensor chip and an LED (light emitting diode) are mounted, a lower PCB arranged in parallel with the upper PCB on the lower side of the upper PCB, a camera cable electrically connected to a metal coating pattern formed on the lower PCB, a plurality of pins electrically connecting the lower PCB and the upper PCB, and a light guide that guides the light of the LED flush with the lens on the emission side of the individual sensor chip.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] According to the conventional camera head, since it has a structure in which a plurality of PCBs are arranged axially parallel to each other, the axial direction is enlarged, and when incorporated into an endoscope or a catheter, the flexibility of the tip side of the insertion portion inserted into the living body is impaired, and there is a problem that the operability is reduced.

[0006] An object of the present invention is to provide a sensor module capable of reducing the size in the radial and axial directions, and a sensor assembly and a medical device using the same.

Means for Solving the Problems

[0007] [1] An insulating member having a first mounting surface and a second mounting surface at different axial positions, An image sensor mounted on the first mounting surface of the insulating member having a first height and, A light source mounted on the second mounting surface of the insulating member having a second height lower than the first height and, A first tubular connection portion provided along the axial direction from the first mounting surface on the insulating member, into which a conductor of a first cable is inserted and electrically connected to the image sensor; A second tubular connection portion provided along the axial direction from the second mounting surface on the insulating member, into which a conductor of a second cable is inserted and electrically connected to the light source, wherein the insulating member the height of the second mounting surface from the first mounting surface is lower than the first height is configured such that an emission surface that emits light from the light source is flush with a light receiving surface of the image sensor or is at a position lower than the light receiving surface by a predetermined distance, the A sensor module having the first mounting surface and the second mounting surface. [2] The flush position includes a position where a displacement amount between the emission surface and the light receiving surface is 0.05 mm or less, The predetermined distance is 0.3 mm or less, The sensor module according to [1] above. 3 the insulating member A pair of second mounting surface and having The light source is a pair of light sources mounted on the pair of second mounting surface The sensor module according to 2 above. 4 the insulating member uses the upper surfaces of a pair of convex portions protruding from the first mounting surface toward the second mounting surface as the pair of second mounting surfaces the image sensor has a predetermined width The image sensor is the side surfaces of the pair of convex portions corresponding to the predetermined width Positioned at intervals, The sensor module according to 3 above. 5 ​​​​​The insulating member includes a first substrate having a first surface serving as the first mounting surface and a second surface on the side opposite to the first surface, and a second substrate having a second surface joined to the first surface of the first substrate and a first surface serving as the second mounting surface on the side opposite to the second surface. The second substrate smaller than the first height has a thickness, and a second tubular connection portion electrically connected to the light source is formed. The first substrate is the sensor module according to [1], in which a first tubular connection portion electrically connected to the image sensor and a through hole are formed at a position corresponding to the second tubular connection portion of the second substrate. [6] The sensor module according to any one of [1] to [5], and a sensor assembly including the first cable and the second cable. [7] A tubular insertion portion inserted into a living body, and the sensor assembly according to [6], in which the sensor module is disposed at a position eccentric from the central axis on the tip side of the insertion portion. The insulating member is a medical device having a shape in which the shape of a side surface parallel to the central axis follows the tubular shape of the insertion portion. [Advantages of the Invention]

[0008] According to the inventions according to claims 1, 2、 6, and 7, miniaturization in the radial direction and the axial direction can be achieved. and the image sensor can capture an overall bright image without casting a shadow . According to the invention according to claim 3 , the first substrate and the second substrate can be manufactured using printed circuit board manufacturing technology. 。 Please According to the invention according to claim 4, an even brighter image can be captured. According to the invention according to claim 5, positioning during mounting of the image sensor can be easily performed. [Brief Description of the Drawings]

[0009] [Figure 1] FIG. 1 shows a main part of a sensor assembly according to a first embodiment of the present invention, (a) is a perspective view seen from the tip side, and (b) is a perspective view seen from the base end side. [Figure 2] FIG. 2 is a plan view of the sensor assembly shown in FIG. 1 seen from the tip side. [Figure 3] FIG. 3 shows an example of a first substrate and a second substrate in a joined state, (a) is a plan view seen from the tip side, and (b) is a plan view seen from the base end side. [Figure 4] FIG. 4 is a cross-sectional view taken along line A-A of FIG. 2, showing an example of a cross-sectional structure of a sensor module. [Figure 5] FIG. 5 is an exploded perspective view of the sensor assembly shown in FIG. 1. [Figure 6] FIG. 6 is a plan view of a sensor assembly according to a second embodiment of the present invention seen from the tip side. [Figure 7] FIG. 7 is an exploded perspective view of the sensor assembly shown in FIG. 6. [Figure 8] FIG. 8 is a side view showing a main part of an endoscope according to a third embodiment of the present invention. [Figure 9] FIG. 9 is a view seen from the B direction of FIG. 8.

Embodiments for Carrying Out the Invention

[0010] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In each figure, components having substantially the same function are denoted by the same reference numerals, and redundant descriptions thereof are omitted.

[0011] [First Embodiment] FIG. 1 shows a main part of a sensor assembly according to a first embodiment of the present invention, (a) is a perspective view seen from the tip side, and (b) is a perspective view seen from the base end side. In this specification, the "tip side" refers to the side where the sensor assembly is inserted into the living body, and the "base end side" refers to the side opposite to the tip side. The "axial direction" refers to the direction along the central axis 110a of the insertion portion 110 shown in FIG. 8 described later.

[0012] This sensor assembly 1 includes an image sensor 2 for capturing an image, a sensor cover 3 covering the light-receiving surface 2a of the image sensor 2, a pair of light sources 4A, 4B for illuminating an observation target, a first substrate 5 on which the image sensor 2 is mounted, and a pair of second substrates 6A, 6B on which the pair of light sources 4A, 4B are mounted, and has a sensor module 10. Further, it includes a plurality (for example, four) of first cables 7A electrically connected to the image sensor 2 and a plurality (for example, four) of second cables 7B electrically connected to the pair of light sources 4A, 4B.

[0013] When collectively referring to the pair of light sources 4A, 4B, hereinafter it is referred to as "light source 4". When collectively referring to the pair of second substrates 6A, 6B, hereinafter it is referred to as "second substrate 6". When collectively referring to the first cable 7A and the second cable 7B, hereinafter it is referred to as "cable 7".

[0014] The image sensor 2 is an imaging element such as a CMOS sensor or a CCD sensor, for example. Note that the image sensor 2 may be other sensors such as an infrared sensor. The image sensor 2 is not particularly limited, but a commercially available minute sensor having a square shape in plan view with a side length of about 0.5 mm or about 0.65 mm and a height (axial length) of about 1.0 mm can be used. A plurality (four in this embodiment) of electrodes 20 (see FIG. 4) are formed on the lower surface of the image sensor 2.

[0015] The sensor cover 3 is formed of a plate-shaped transparent material (for example, glass) that transmits the return light from the observation target of the light emitted from the light source 4, and is adhered to the light-receiving surface 2a of the image sensor 2. Note that the sensor cover 3 may have a function of a lens, or a lens may be disposed outside the sensor cover 3.

[0016] The light source 4 can use, for example, an LED according to the application of observation, such as an infrared LED (light emitting diode) or an ultraviolet LED. From the viewpoint of miniaturization of the sensor module 10, a flip chip type having a pair of electrodes 40 (see FIG. 4) on the lower surface is preferable for the LED. As another example of the LED, for example, a blue LED wavelength-converted by a phosphor to emit white light may be used.

[0017] When the image sensor 2 and the light source 4 are mounted on a single substrate, when the height of the image sensor 2 is larger than the height of the light source 4, the image sensor 2 becomes a shadow of the illumination light from the light source 4, a dark portion is formed at the center of the image of the observation target, and an overall bright image cannot be captured. Therefore, in the present embodiment, for height adjustment, in addition to the first substrate 5 on which the image sensor 2 is mounted, a second substrate 6 on which the light source 4 is mounted is used, and the second substrate 6 is bonded to the tip side of the first substrate 5 with an adhesive or the like.

[0018] The first substrate 5 has a first through hole 51 in the thickness direction, and the second substrate 6 has a second through hole 61 in the thickness direction. The conductor 70 of the first cable 7A is inserted into the first through hole 51 and electrically connected to the image sensor 2 via a conductive adhesive 8 (see FIG. 4). The conductor 70 of the second cable 7B is inserted into the second through hole 61 and electrically connected to the light source 4 via a conductive adhesive 8 (see FIG. 4). By adopting such a configuration, miniaturization in the axial direction of the sensor module 10 can be achieved. The first through hole 51 is an example of a first tubular connection portion. The second through hole 61 is an example of a second tubular connection portion.

[0019] The cable 7 includes a conductor 70 and an insulator 71 that covers the conductor 70. The exposed length of the cable 7 (the exposed length of the conductor 70) may be, for example, about 1.5 mm for the first cable 7A and about 2 mm for the second cable 7B. Note that the exposed length of the cable 7 may be, for example, 0.5 to 0.8 mm for the first cable 7A and about 1.0 to 1.3 mm for the second cable 7B in consideration of the thicknesses of the first substrate 5 and the second substrate 6. Also, instead of the four first cables 7A, a multi-core cable having four electric wires may be used. Also, instead of the two second cables 7B, a multi-core cable having two electric wires may be used. Also, a coaxial cable may be used as the cable 7 or the electric wire, and a multi-core coaxial cable may be used as the multi-core cable. Further, by forming a wiring pattern for the light source 4 on the first surface 50a (see FIG. 3 etc.) of the base material 50 of the first substrate 5, it is also possible to reduce the number of the second cables 7B to at least one.

[0020] FIG. 2 is a plan view of the sensor assembly 1 as viewed from the tip side. The image sensor 2 is positioned at the interval between a pair of second substrates 6A and 6B and mounted on the first substrate 5. The interval between the pair of second substrates 6A and 6B is a length (for example, 0.75 mm) corresponding to the length of one side of the image sensor 2 (for example, 0.5 mm or 0.65 mm). Thereby, the positioning of the image sensor 2 in the longitudinal direction (the left-right direction in FIG. 2) of the first substrate 5 can be easily performed.

[0021] As shown in FIG. 2, by arranging the image sensor 2 and a pair of light sources 4A and 4B closely along the longitudinal direction of the first substrate 5, miniaturization in the radial direction (the longitudinal direction of the first substrate 5) of the sensor module 10 can be achieved. Note that three or more light sources 4 may be used, or one light source 4 may be used.

[0022] The first substrate 5 and the pair of second substrates 6A and 6B have a shape that follows the tubular shape of the insertion portion 110 of the endoscope 100 shown in FIGS. 8 and 9 described later in terms of the side surface shape. That is, the corner portion 5b of the first substrate 5 and the corner portion 6a of the second substrate 6 are located at positions shifted by a distance L (about 0.1 mm) from the central portion 5a of the first substrate 5 toward the central axis 110a of the insertion portion 110. Thereby, it becomes easy to arrange the sensor module 10 eccentrically at the tip portion 111 of the insertion portion 110.

[0023] (Configuration of the first substrate and the second substrate) FIG. 3 shows an example of the first substrate 5 and the second substrate 6 in a joined state, where (a) is a plan view seen from the tip side and (b) is a plan view seen from the base end side.

[0024] The first substrate 5 includes a base material 50 made of an insulating material having a predetermined thickness (for example, about 0.5 mm) with a first surface 50a and a second surface 50b opposite to the first surface 50a, and a plurality (four in this embodiment) of first through-holes 51 formed in the thickness direction of the base material 50 and electrically connected to the image sensor 2. As shown in FIG. 4 and the like described later, the first through-hole 51 has a conductor film 51b formed in the through-hole 51a. The first surface 50a is an example of the first mounting surface.

[0025] On the first surface 50a of the first substrate 5, as shown in FIG. 3(a), four first through-holes 51 for mounting the image sensor 2, an annular land 52 connected to each first through-hole 51, and a pad 53 connected to a part of each land 52 are formed.

[0026] On the second surface 50b of the first substrate 5, as shown in FIG. 3(b), a plurality (four in this embodiment) of through-holes 51a are formed at positions corresponding to the electrodes 40 of the pair of light sources 4A and 4B. Note that although lands for connecting to the four central first through-holes 51 are not formed on the second surface 50b, they may be formed.

[0027] The second substrate 6 includes a base material 60 made of an insulating material having a first surface 60a and a second surface 60b opposite to the first surface 60a, with a predetermined thickness (for example, about 0.5 mm), and a plurality (two in this embodiment) of second through-holes 61 formed in the thickness direction of the base material 60 and electrically connected to the light source 4. As shown in FIG. 4 and the like described later, the second through-hole 61 has a conductor film 61b formed in the through-hole 61a. The base material 50 of the first substrate 5 and the base material 60 of the second substrate 6 are examples of insulating members. The first surface 60a is an example of a second mounting surface.

[0028] On the first surface 60a of the second substrate 6, as shown in FIG. 3(a), two second through-holes 61 for mounting the light source 4, an annular land 62 connected to each second through-hole 61, and a pad 63 connected to a part of each land 62 are formed. Note that although no land for connecting to the second through-hole 61 is formed on the second surface 60b, it may be formed.

[0029] (Cross-sectional structure of the sensor module) FIG. 4 is a cross-sectional view taken along line A-A of FIG. 2, showing an example of the cross-sectional structure of the sensor module 10. As shown in FIG. 4, the second substrate 6 has a thickness corresponding to the difference in height between the image sensor 2 and the light source 4. That is, when the image sensor 2 is mounted on the first substrate 5 and the light source 4 is mounted on the second substrate 6, the second substrate 6 has a thickness such that the light-emitting surface 4a that emits light from the light source 4 is substantially flush with the light-receiving surface 2a of the image sensor 2. Thereby, it is possible to suppress the image sensor 2 from being in the shadow of the illumination by the light source 4. Here, "substantially flush" does not only mean that the light-receiving surface 2a and the light-emitting surface 4a are exactly on the same plane, but also means allowing a position where the light-emitting surface 4a is displaced up and down by about 0.05 mm due to an error with respect to the light-receiving surface 2a.

[0030] Note that the second substrate 6 may have a thickness such that it is positioned at a predetermined distance (e.g., about 0.3 mm) lower than the light-receiving surface 2a on the side of the first substrate 5. Even in this case, it is possible to suppress the image sensor 2 from being in the shadow of the illumination by the light source 4. In the present embodiment, with respect to the difference Δh (0.7 mm) between the height h1 (1.0 mm) of the image sensor 2 and the height h2 (0.3 mm) of the light source 4, a second substrate 6 having a thickness of 0.5 mm is used, and the emission surface 4a is positioned 0.2 mm lower than the light-receiving surface 2a.

[0031] The electrode 20 on the lower surface of the image sensor 2 is connected to the pad 53 formed on the first surface 50a of the first substrate 5 by the bump 21. The electrode 40 on the lower surface of the light source 4 is connected to the pad 63 formed on the first surface 60a of the second substrate 6 by the bump 41.

[0032] The conductor 70 of the first cable 7A is inserted into the first through-hole 51, connected to the first through-hole 51 by the conductive adhesive 8, and electrically connected to the image sensor 2 via the land 52, the pad 53, and the bump 21.

[0033] The conductor 70 of the second cable 7B is inserted into the through-hole 51a of the first substrate 5 and the second through-hole 61 of the second substrate, connected to the second through-hole 61 by the conductive adhesive 8, and electrically connected to the light source 4 via the land 62, the pad 63, and the bump 41. Note that instead of the conductive adhesive 8, the conductors 70 of the first cable 7A and the second cable 7B may be electrically connected using a conductive material such as solder.

[0034] (Assembly method) Next, an example of the assembly method of the sensor assembly 1 will be described with reference to FIG. 5. FIG. 5 is an exploded perspective view of the sensor assembly 1. Note that the order of the assembly method is not limited to the following case.

[0035] First, the second surfaces 60b of the second substrates 6A and 6B are joined to the first surface 50a of the first substrate 5 with an adhesive or the like. At this time, the interval between the second substrates 6A and 6B is set to a predetermined length.

[0036] Next, the image sensor 2 is mounted on the first surface 50a of the first substrate 5. Specifically, as shown in FIG. 4, the electrodes 20 on the lower surface of the image sensor 2 are connected to the pads 53 formed on the first surface 50a of the first substrate 5 by bumps 21.

[0037] The light source 4A is mounted on the first surface 60a of the second substrate 6A, and the light source 4B is mounted on the first surface 60a of the second substrate 6B. Specifically, as shown in FIG. 4, the electrodes 40 on the lower surface of the light source 4 are connected to the pads 63 formed on the first surface 60a of the second substrate 6 by bumps 41.

[0038] Next, the conductive adhesive 8 is placed inside the first through-hole 51 of the first substrate 5, the conductor 70 of the first cable 7A is inserted into the first through-hole 51, and the conductive adhesive 8 is cured to electrically connect the conductor 70 of the first cable 7A to the first through-hole 51. Thereby, the first cable 7A is electrically connected to the image sensor 2 via the first through-hole 51, the land 52, the pad 53, and the bump 21.

[0039] Next, the conductive adhesive 8 is placed inside the second through-hole 61 of the second substrate 6, the conductor 70 of the second cable 7B is inserted into the through-hole 51a of the first substrate 5 and the second through-hole 61, and the conductive adhesive 8 is cured to electrically connect the conductor 70 of the second cable 7B to the second through-hole 61. Thereby, the second cable 7B is electrically connected to the light source 4 via the second through-hole 61, the land 62, the pad 63, and the bump 41. The sensor assembly 1 is assembled as described above. Note that the conductor 70 exposed from the insulator 71 of the cable 7 may be molded with resin.

[0040] (Effects of the present embodiment) According to the present embodiment, the following effects can be obtained. (a) By electrically connecting the first cable 7A to the image sensor 2 through the first through hole 51 of the first substrate 5 and electrically connecting the second cable 7B to the light source 4 through the second through hole 61 of the second substrate 6, the axial miniaturization of the sensor module 10 can be achieved. (b) By arranging the image sensor 2 and the pair of light sources 4A and 4B closely along the longitudinal direction of the first substrate 5, the radial (longitudinal direction of the first substrate 5) miniaturization of the sensor module 10 can be achieved. (c) By making the light emitting surface 4a of the light source 4 substantially flush with or slightly lower than the light receiving surface 2a of the image sensor 2, the image sensor 2 can capture an overall bright image without being shaded.

[0041] [Second Embodiment] FIG. 6 is a plan view of the sensor assembly according to the second embodiment of the present invention as viewed from the tip side. FIG. 7 is an exploded perspective view of the sensor assembly shown in FIG. 6. Hereinafter, the description will focus on the differences from the first embodiment.

[0042] The sensor assembly 1 of the present embodiment includes an image sensor 2, a sensor cover 3, a pair of light sources 4A and 4B, a first substrate 5, a pair of second substrates 6A and 6B, a plurality of first cables 7A, and a plurality of second cables 7B, similar to the first embodiment, but the planar shapes of the first substrate 5 and the pair of second substrates 6A and 6B are different.

[0043] In the first embodiment, the corner portions 5b of the first substrate 5 and the corner portions 6a of the second substrates 6A and 6B are positioned on the central axis 110a side of the insertion portion 110 with respect to the central portion 5a of the first substrate 5. However, in the present embodiment, the first substrate 5 has a rectangular shape in plan view, and the second substrates 6A and 6B have a shape that does not protrude from the first substrate 5.

[0044] According to the second embodiment, since the first substrate 5 to which the pair of second substrates 6A and 6B are joined has a rectangular shape in plan view, the thickness of the sensor module 10 when viewed from the tip side can be reduced. Further, when the tip of the insertion portion of the endoscope does not have a forceps port or the like, the sensor module 10 of the second embodiment can be disposed on the central axis of the insertion portion.

[0045] [Third Embodiment] FIG. 8 is a side view showing a main part of an endoscope according to a third embodiment of the present invention. FIG. 9 is a view seen from the B direction in FIG. 8.

[0046] In the present embodiment, the sensor assembly 1 of the first embodiment is incorporated into the endoscope 100. As shown in FIG. 8, the endoscope 100 includes an insertion portion 110 that is inserted into a living body, an operation portion (not shown) provided at the proximal end of the insertion portion 110, and a universal cord (not shown) led out from the operation portion. The endoscope 100 is an example of a medical device.

[0047] The insertion portion 110 includes a distal end portion 111 in which the sensor module 10 is incorporated, and a flexible tube portion 112 formed of a tubular member that is connected to the distal end portion 111 and has flexibility. The cable 7 extending from the sensor module 10 is led out to the outside through the opening of the flexible tube portion 112.

[0048] As shown in FIG. 9, the sensor module 10 is disposed at a position eccentric from the central axis 110a of the distal end portion 111. The distal end portion 111 has an observation window 111a at a position corresponding to the image sensor 2 of the sensor module 10, a pair of illumination windows 111b and 111c at positions corresponding to the pair of light sources 4A and 4B, and further has a forceps port 111d for inserting and removing forceps.

[0049] According to the third embodiment, since the sensor module 10 that is reduced in size in the radial direction and the axial direction is incorporated into the endoscope 100, the distal end portion 111 can be shortened, the flexibility of the distal end side of the insertion portion 110 is not impaired, and the operability can be improved.

[0050] [Other Embodiments] Although the embodiments of the present invention have been described above, the embodiments of the present invention are not limited to the above-described embodiments, and various modifications and implementations described below are possible without departing from the gist of the present invention.

[0051] [Modification Example 1] In the above embodiment, the first substrate 5 and the pair of second substrates 6A and 6B are used. However, a tubular connection portion may be embedded in a single insulating member in which the base material 50 of the first substrate 5 and the base material 60 of the second substrate 6 are integrated. The insulating member may be formed by resin molding, or the portion where the image sensor 2 is mounted may be formed by machining.

[0052] [Modification Example 2] As the first substrate 5 and the second substrate 6, the manufacturing technology of printed circuit boards may be used. However, if a structure in which a conductive pin having a cavity in the axial direction at the center as an example of the tubular connection portion can be realized in the base materials 50 and 60 made of an insulating material, it is not necessary to use the manufacturing technology of printed circuit boards.

[0053] [Modification Example 3] In the above embodiment, the case where the image sensor 2 is higher than the light source 4 has been described. However, the present invention can also be applied when the image sensor 2 is lower than the light source 4. That is, according to the difference in height between the image sensor and the light source, the position of the first mounting surface on which the image sensor 2 is mounted may be set on the tip side in the optical axis direction with respect to the position of the second mounting surface on which the light source 4 is mounted.

[0054] [Modification Example 4] In the above embodiment, the case of applying to an endoscope as a medical device has been described. However, it may also be applied to other medical devices such as a catheter or an intravascular endoscope catheter. [Description of Reference Numerals]

[0055] 1…Sensor assembly, 2…Image sensor, 2a…Light-receiving surface, 3…Sensor cover, 4, 4A, 4B…Light source, 4a…Emitting surface, 5…First substrate, 5a…Central portion, 5b…Corner portion, 6, 6A, 6B…Second substrate, 6a…Corner portion, 7…Cable, 7A…First cable, 7B…Second cable, 8…Conductive adhesive, 10…Sensor module, 20…Electrode, 21…Bump, 40…Electrode, 41…Bump, 50…Base material, 50a…First surface, 50b…Second surface, 51…First through hole, 51a…Through hole, 51b…Conductor film, 52…Land, 53…Pad, 60…Base material, 60a…First surface, 60b…Second surface, 61…Second through hole, 61a…Through hole, 61b…Conductor film, 62…Land, 63…Pad, 70…Conductor, 71…Insulator, 100…Endoscope, 110…Insertion portion, 110a…Central axis, 111…Tip portion, 111a…Observation window, 111b, 111c…Illumination window, 111d…Forceps opening, L…Distance

Claims

1. An insulating member having a first mounting surface and a second mounting surface at different axial positions; An image sensor mounted on the first mounting surface of the insulating member and having a first height; A light source mounted on the second mounting surface of the insulating member and having a second height lower than the first height; A first tubular connection portion provided on the insulating member along the axial direction from the first mounting surface, into which a conductor of a first cable is inserted and electrically connected to the image sensor; A second tubular connection portion provided on the insulating member along the axial direction from the second mounting surface, into which a conductor of a second cable is inserted and electrically connected to the light source, comprising: The insulating member has a height of the second mounting surface from the first mounting surface lower than the first height, and an emission surface for emitting light from the light source is flush with a light receiving surface of the image sensor, or is at a position lower than the light receiving surface by a predetermined distance, having the first mounting surface and the second mounting surface; A sensor module.

2. The flush position includes a position where the displacement amount between the emission surface and the light receiving surface is 0.05 mm or less, The predetermined distance exceeds 0.05 mm and is 0.3 mm or less, The sensor module according to claim 1.

3. The insulating member has a pair of second mounting surfaces, The light source is a pair of light sources mounted on the pair of second mounting surfaces, The sensor module according to claim 2.

4. The insulating member has upper surfaces of a pair of convex portions protruding from the first mounting surface toward the second mounting surface as the pair of second mounting surfaces, The image sensor has a predetermined width, and the image sensor is positioned by an interval between side surfaces of the pair of convex portions corresponding to the predetermined width, The sensor module according to claim 3.

5. The insulating member includes a first substrate having a first surface serving as the first mounting surface and a second surface opposite to the first surface, and a second substrate having a second surface joined to the first surface of the first substrate and a first surface serving as the second mounting surface opposite to the second surface, The second substrate has a thickness smaller than the first height, and the second tubular connection portion electrically connected to the light source is formed, The first substrate has a through hole formed at a position corresponding to the first tubular connection portion electrically connected to the image sensor and the second tubular connection portion of the second substrate, The sensor module according to claim 1.

6. The sensor module according to any one of claims 1 to 5, the first cable and the second cable, and a sensor assembly comprising the same.

7. A tubular insertion portion to be inserted into a living body, and the sensor assembly according to claim 6, wherein the sensor module is disposed at a position eccentric from the central axis on the distal end side of the insertion portion. The insulating member has a shape in which the shape of the side surface parallel to the central axis follows the tubular shape of the insertion portion. A medical device.

Images