Imaging device

Abstract

To suppress the occurrence of flare and ghost.SOLUTION: On the peripheral area outside an effective pixel area of a pixel array on a glass substrate that is bonded to a light-receiving surface of a pixel array, which generates pixel signals according to the amount of incident light by photoelectric conversion for each pixel arranged in an array, and on the front side of the pixel array, which is the light source side of the incident light, with respect to the light receiving surface of the pixel array, a light shielding film is formed. The present disclosure can be applied to an imaging apparatus.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present disclosure relates to an imaging device, and more particularly to an imaging device capable of reducing flare and ghost.

Background Art

[0002] As a configuration of a solid-state imaging device (image sensor) typified by a CMOS (Complementary Metal Oxide Semiconductor) having a CSP (Chip Size Package) structure, a technique has been proposed to protect a CSP-structured solid-state imaging device by bonding a glass substrate using a transparent adhesive on an imaging surface (see Patent Documents 1 and 2).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, in the techniques described in Patent Documents 1 and 2, an IRCF (Infrared Cut Filter) is provided at a position separated from the glass substrate with respect to the incident direction of light. This IRCF has a light-shielding film formed in a peripheral portion surrounding the outer periphery to suppress the generation of flare and ghost.

[0005] However, since the IRCF and the glass substrate are separated from each other, the light-shielding film provided in the peripheral portion of the IRCF is not sufficient as a countermeasure against flare and ghost.

[0006] In addition, the light-shielding film is formed by printing on the peripheral portion of the IRCF. The IRCF on which the light-shielding film is formed is disposed in front of the solid-state imaging device. However, in both the case when the light-shielding film is printed and the case when it is disposed in front of the solid-state imaging device, the positional accuracy is not sufficient. Therefore, it is still not sufficient as a countermeasure against flare and ghost.

[0007] Furthermore, the countermeasure against flare caused by stray light reflected from the end face of the glass substrate in the solid-state imaging device in the WCSP (Wafer-level Chip Size Package) structure is also not sufficient.

[0008] The present disclosure has been made in view of such a situation. In particular, by forming a light-shielding film on the peripheral portion of the light-receiving surface of a glass substrate that is attached to the imaging surface of a solid-state imaging device with a transparent adhesive, the occurrence of flare and ghost can be suppressed.

Means for Solving the Problems

[0009] The imaging device according to the first aspect of the present disclosure includes a solid-state imaging device having a chip size package structure, and a lens group including a plurality of lenses that condense incident light onto the light-receiving surface of the solid-state imaging device having the chip size package structure. The solid-state imaging device having the chip size package structure includes a pixel array that generates a pixel signal corresponding to the amount of incident light by photoelectric conversion in pixel units arranged in an array, a glass substrate bonded to the light-receiving surface of the pixel array, and a light-shielding member formed in a peripheral portion outside the effective pixel region of the pixel array. The light-shielding member is formed on the light-receiving surface of the glass substrate, and an infrared cut filter that cuts infrared light among the incident light is formed on the light-receiving surface of the glass substrate. The infrared cut filter is in contact with the glass substrate and the light-shielding member, and a non-flat film composed of a single optical element having a convex or concave surface on the light-receiving surface side, or a combination of a plurality of optical elements having a convex or concave surface on the light-receiving surface side is formed in front of the infrared cut filter.

[0010] In a first aspect of the present disclosure, there is provided a solid-state imaging device having a chip size package structure, and a lens group including a plurality of lenses that condenses incident light onto a light-receiving surface of the solid-state imaging device having the chip size package structure. The solid-state imaging device having the chip size package structure is provided with a pixel array that generates a pixel signal corresponding to the amount of incident light by photoelectric conversion in pixel units arranged in an array, a glass substrate bonded to the light-receiving surface of the pixel array, and a light-shielding member formed in a peripheral portion outside the effective pixel region of the pixel array. The light-shielding member is formed on the light-receiving surface of the glass substrate, and an infrared cut filter that cuts infrared light among the incident light is formed on the light-receiving surface of the glass substrate. The infrared cut filter is in contact with the glass substrate and the light-shielding member, and a non-flat film made of a single optical element having a convex or concave surface on the light-receiving surface side, or an optical element formed by combining a plurality of optical elements having a convex or concave surface on the light-receiving surface side is formed in front of the infrared cut filter.

[0011] An imaging device according to a second aspect of the present disclosure includes a solid-state imaging device having a chip size package structure, and a lens group including a plurality of lenses that condenses incident light onto a light-receiving surface of the solid-state imaging device having the chip size package structure. The solid-state imaging device having the chip size package structure includes a semiconductor substrate in which pixels that generate pixel signals corresponding to the amount of incident light by photoelectric conversion in pixel units arranged in an array are arranged in an array, a glass substrate bonded to the light-receiving surface of the semiconductor substrate via an adhesive, and a light-shielding member formed in a peripheral portion outside the effective pixel region of the semiconductor substrate. The light-shielding member is formed on the light-receiving surface of the glass substrate, the adhesive is in contact with the semiconductor substrate and the glass substrate, the ends of the semiconductor substrate and the ends of the glass substrate are aligned, and an infrared cut filter that cuts infrared light among the incident light is formed on the light-receiving surface of the glass substrate. The infrared cut filter is in contact with the glass substrate and the light-shielding member, and a non-flat film made of a single optical element having a convex or concave surface on the light-receiving surface side, or an optical element formed by combining a plurality of optical elements having a convex or concave surface on the light-receiving surface side is formed in front of the infrared cut filter.

[0012] In a second aspect of the present disclosure, there are provided a solid-state imaging device having a chip size package structure and a lens group including a plurality of lenses that condense incident light onto a light-receiving surface of the solid-state imaging device having the chip size package structure. In the solid-state imaging device having the chip size package structure, there are provided a semiconductor substrate on which pixels that generate pixel signals corresponding to the amount of incident light by photoelectric conversion are arranged in an array in pixel units arranged in an array, a glass substrate bonded to the light-receiving surface of the semiconductor substrate via an adhesive, and a light-shielding member formed in a peripheral portion outside the effective pixel region of the semiconductor substrate. The light-shielding member is formed on the light-receiving surface of the glass substrate, the adhesive is in contact with the semiconductor substrate and the glass substrate, the ends of the semiconductor substrate and the ends of the glass substrate are aligned, and an infrared cut filter that cuts infrared light among the incident light is formed on the light-receiving surface of the glass substrate. The infrared cut filter is in contact with the glass substrate and the light-shielding member, and a non-flat film made of a single optical element having a convex or concave surface on the light-receiving surface side, or an optical element formed by combining a plurality of optical elements having a convex or concave surface on the light-receiving surface side is formed in front of the infrared cut filter.

Brief Description of the Drawings

[0013]

Figure 1

Figure 2

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Figure 8

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Figure 10

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Figure 12

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Figure 14

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Figure 16

Embodiments for Carrying Out the Invention

[0014] Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In this specification and the drawings, components having substantially the same functional configuration are denoted by the same reference numerals, and redundant descriptions are omitted.

[0015] Hereinafter, embodiments for carrying out the present disclosure (hereinafter referred to as embodiments) will be described. The description will be made in the following order. 1. Principle of flare and ghost generation 2. First embodiment 3. Second embodiment 4. Third embodiment 5. Fourth embodiment 6. Fifth embodiment 7. Sixth embodiment 8. Seventh embodiment 9. Eighth embodiment 10. Ninth Embodiment 11. Application to Electronic Devices 12. Usage Example of Solid-State Imaging Device 13. Application Example to Endoscopic Surgery System 14. Application Example to Mobile Objects

[0016] <1. Generation Principle of Flare and Ghost>[[]] When explaining the configuration of the imaging device of the present disclosure, the generation principle of flare and ghost will be explained.[[]]

[0017] First, with reference to FIG. 1, a configuration example of the imaging device will be explained. Note that the left part of FIG. 1 is a side cross-sectional view of the imaging device 1, and incident light enters from the top to the bottom direction in the figure. Also, the right part of FIG. 1 is a top view of the IRCF 13 as seen from the position of the light source of the incident light.[[]]

[0018] The imaging device 1 is composed of a case 11, a lens group 12, an IRCF (Infrared Cutoff Filter) 13, and a solid-state imaging device 14.[[]]

[0019] The case 11 has a substantially cylindrical configuration with an opening provided in the optical axis direction, and houses a lens group 12 composed of a plurality of lenses.[[]]

[0020] The lens group 12 is composed of a plurality of lenses, condenses the incident light, and condenses it onto the imaging surface of the solid-state imaging device 14.[[]]

[0021] The IRCF 13 is provided at a position that becomes the bottom with respect to the light incident direction of the case 11, and cuts the infrared light component among the components of the light that is condensed and transmitted onto the imaging surface of the solid-state imaging device 14 by the lens group 12.[[]]

[0022] The solid-state imaging device 14 is an imaging device with a cavity-less CSP (Chip Size Package) structure, and a glass substrate 33 is attached to the imaging surface of the pixel array 31 with a transparent adhesive 32. Cavity-less means that there is no cavity (hollow) between the pixel array 31 and the glass substrate 33. The pixel array 31 is composed of pixels arranged in an array, and in pixel units, by photoelectrically converting the light of the incident light condensed by the lens group 12, a pixel signal corresponding to the amount of received light is generated and output as an image signal to a subsequent device (not shown).

[0023] By the way, as shown in the right part of FIG. 1, the IRCF 13 has a light-shielding film 13a formed on its peripheral part, preventing the intrusion of stray light. Note that in the central part of the IRCF 13 (the white rectangular range in the figure), the light-shielding film 13a is not provided, and the infrared light of the incident light condensed by the lens group 12 is cut and transmitted.

[0024] However, since the IRCF 13 and the glass substrate 33 of the solid-state imaging device 14 are provided separately, there is light that can become stray light, such as the light ray L indicated by the arrow in FIG. 1, in the light transmitted through the lens group 16, and it may not be possible to shield it with the light-shielding film 13a. In the case of FIG. 1, the light ray L passes through the central part of the IRCF 13, is reflected by the end face of the glass substrate 33 of the solid-state imaging device 14, and enters the imaging surface of the pixel array 31, causing flare and ghosting.

[0025] <2. First Embodiment> Next, with reference to FIG. 2, a configuration example of the first embodiment of the imaging device of the present disclosure will be described. Note that FIG. 2 is a side cross-sectional view of the upper part of the imaging device 1 and a top view seen from the incident direction of the incident light of the light-shielding film 34 in the lower part. Also, in the imaging device 1 of FIG. 2, for the configuration having the same functions as the imaging device 1 of FIG. 1, the same reference numerals are given, and the description thereof will be omitted as appropriate.

[0026] That is, in the imaging device 1 of FIG. 2, the difference from the imaging device 1 of FIG. 1 is that an IRCF 13 without a light-shielding film 13a is provided, and further, a light-shielding film 34 is formed on the peripheral portion Z2 on the surface (the upper surface in the figure) of the glass substrate 33 where incident light enters. Note that no light-shielding film 34 is formed in the central portion Z1, and incident light from which infrared light has been cut is transmitted therethrough.

[0027] The light-shielding film 34 is made of a photosensitive black resist and is preferably formed on the glass substrate 33 by photolithography before dicing in the semiconductor process of manufacturing the solid-state imaging device 14. When the light-shielding film 34 is formed on the glass substrate 33 before dicing, the end of the light-shielding film 34 and the end of the solid-state imaging device 14 are on the same plane.

[0028] With such a configuration, the light-shielding film 34 provided on the glass substrate 33 in the imaging device 1 of FIG. 2 is formed closer to the light-receiving surface of the pixel array 31 than the light-shielding film 13a is provided on the IRCF 13 in the imaging device 1 of FIG. 1. Therefore, it is possible to prevent the intrusion of stray light such as the light ray L shown in FIG. 1.

[0029] Also, with such a configuration, since the light-shielding film 34 can be formed on the glass substrate 33 bonded to the pixel array 31 with a transparent adhesive, the light-shielding film 34 can be formed with high positional accuracy up to the range that becomes the boundary of the effective pixel region on the pixel array 31. Therefore, it is possible to suppress the intrusion of stray light with higher accuracy.

[0030] As a result, by preventing the intrusion of stray light, it is possible to suppress the occurrence of flare and ghost.

[0031] <3. Second Embodiment> In the above, an example in which the IRCF 13 is provided directly below the lens group 16 has been described. However, the IRCF may be formed on the light-receiving surface side of the glass substrate 33, and the light-shielding film 34 may be provided below the IRCF.

[0032] FIG. 3 shows a configuration example of an imaging device 1 in which an IRCF 51 corresponding to the IRCF 13 is formed on the light-receiving surface side of a glass substrate 33 and a light-shielding film 34. In the imaging device 1 of FIG. 3, components having the same functions as those of the imaging device 1 in FIG. 2 are denoted by the same reference numerals, and their descriptions are omitted as appropriate.

[0033] That is, in the imaging device 1 of FIG. 3, the difference from the imaging device 1 in FIG. 2 is that the IRCF 51 is formed on the light-receiving surface side of the glass substrate 33 and the light-shielding film 34.

[0034] Also in the imaging device 1 of FIG. 3, the light-shielding film 34 provided on the glass substrate 33 is provided closer to the light-receiving surface of the pixel array 31 than the light-shielding film 13a is provided on the IRCF 13 in the imaging device 1 in FIG. 1. Therefore, it is possible to prevent the intrusion of stray light such as the light beam L shown in FIG. 1.

[0035] Also, even in such a configuration, the light-shielding film 34 can be formed with high positional accuracy up to the range that forms the boundary of the effective pixel region on the pixel array 31. Therefore, it is possible to suppress the intrusion of stray light with higher precision.

[0036] As a result, by preventing the intrusion of stray light, it is possible to suppress the occurrence of flare and ghost.

[0037] <4. Third Embodiment> In the above description, an example in which the light-shielding film 34 is provided on the light-receiving surface side of the incident light of the IRCF 51 has been described. Further, a non-flat film may be formed on the upper surface of the IRCF 51. The non-flat film is an optical element such as a lens, a WLL (Wafer Level Lens), an organic multilayer film having a higher non-flatness than a predetermined value, and examples thereof include a glass lens, a resin lens, a single-layer WLL, a laminated WLL, an optical filter, and an organic multilayer film for protecting the IRCF 51. When a lens or a WLL is used as the non-flat film 71, the height of the camera module to which the solid-state imaging device 14 is attached can be reduced. As the lens or the WLL, a single lens having a convex surface or a concave surface on the light-receiving surface side may be provided, or a lens in which a plurality of these lenses are combined may be provided.

[0038] FIG. 4 shows a configuration example of the imaging device 1 in which a non-flat film is formed on the upper surface of the IRCF 51. In the imaging device 1 of FIG. 4, components having the same functions as those of the imaging device 1 in FIG. 3 are denoted by the same reference numerals, and the description thereof will be omitted as appropriate.

[0039] That is, in the imaging device 1 of FIG. 4, the difference from the imaging device 1 of FIG. 3 is that the non-flat film 71 is formed on the upper surface of the IRCF 51.

[0040] Also in the imaging device 1 of FIG. 4, the light-shielding film 34 provided below the IRCF 51 is provided closer to the light-receiving surface of the pixel array 31 than the light-shielding film 13a is provided on the IRCF 13 in the imaging device 1 of FIG. 1. Therefore, it is possible to prevent the intrusion of stray light such as the light beam L shown in FIG. 1.

[0041] Also, even in such a configuration, the light-shielding film 34 can be formed with high positional accuracy up to the range that forms the boundary of the effective pixel region on the pixel array 31. Therefore, it is possible to suppress the intrusion of stray light with higher accuracy.

[0042] As a result, by preventing the intrusion of stray light, it is possible to suppress the occurrence of flare and ghost.

[0043] <5. Fourth Embodiment> In the above, although the example in which the light shielding film 34 is provided on the glass substrate 33 has been described, the IRCF 51 may be provided on the glass substrate 33, and the light shielding film 34 may be provided on the light receiving surface side of the incident light of the IRCF 51.

[0044] FIG. 5 shows a configuration example of the imaging device 1 in which the IRCF 51 is provided on the glass substrate 33, and further, the light shielding film 34 is provided on the light receiving surface side of the incident light of the IRCF 51. In the imaging device 1 of FIG. 5, the configurations having the same functions as those of the imaging device 1 in FIG. 3 are denoted by the same reference numerals, and the description thereof will be omitted as appropriate.

[0045] That is, in the imaging device 1 of FIG. 5, the difference from the imaging device 1 of FIG. 3 is that the light shielding film 34 is provided not on the glass substrate 33 but on the upper surface of the IRCF 51 in the drawing.

[0046] Also in the imaging device 1 of FIG. 5, the light shielding film 34 provided on the upper surface of the IRCF 51 is provided at a position closer to the light receiving surface of the pixel array 31 than the light shielding film 13a is provided on the IRCF 13 in the imaging device 1 of FIG. 1. Therefore, it is possible to prevent the intrusion of stray light such as the light beam L shown in FIG. 1.

[0047] Further, even in such a configuration, the light shielding film 34 can be formed with high positional accuracy up to the range that becomes the boundary of the effective pixel region on the pixel array 31. Therefore, it is possible to suppress the intrusion of stray light with higher accuracy.

[0048] As a result, by preventing the intrusion of stray light, it is possible to suppress the occurrence of flare and ghost.

[0049] <6. Fifth Embodiment> In the above, although the example in which the light shielding film 34 is provided on the light receiving surface side of the incident light of the IRCF 51 has been described, a non-flat film may be further formed on the upper surface of the IRCF 51.

[0050] FIG. 6 shows a configuration example of the imaging device 1 in which the light-shielding film 34 is provided on the light-receiving surface side of the incident light of the IRCF51, and the uneven film is formed on the upper surface of the IRCF51. In the imaging device 1 of FIG. 6, the same components as those of the imaging device 1 in FIG. 5 are denoted by the same reference numerals, and the description thereof will be omitted as appropriate.

[0051] That is, in the imaging device 1 of FIG. 6, the difference from the imaging device 1 in FIG. 5 is that the uneven film 71 is formed on the upper surface of the IRCF51.

[0052] Also in the imaging device 1 of FIG. 6, the light-shielding film 34 provided on the upper surface of the IRCF51 is provided closer to the light-receiving surface of the pixel array 31 than the light-shielding film 13a is provided on the IRCF13 in the imaging device 1 in FIG. 1. Therefore, it is possible to prevent the intrusion of stray light such as the light beam L shown in FIG. 1.

[0053] Also, even in such a configuration, the light-shielding film 34 can be formed with high positional accuracy up to the range that becomes the boundary of the effective pixel region on the pixel array 31. Therefore, it is possible to suppress the intrusion of stray light with higher accuracy.

[0054] As a result, by preventing the intrusion of stray light, it is possible to suppress the occurrence of flare and ghost.

[0055] <7. Sixth Embodiment> In the above, the example in which the light-shielding film 34 is provided on the glass substrate 33 or the light-receiving surface side of the incident light of the IRCF34, and the uneven film 71 is formed on the upper surface of the IRCF51 has been described. However, the light-shielding film may be formed on the upper surface in the drawing of the uneven film 71 in accordance with the surface shape of the uneven film 71.

[0056] FIG. 7 shows a configuration example of the imaging device 1 in which the IRCF51 is provided on the glass substrate 33, the uneven film 71 is further provided on the IRCF51, and the light-shielding film is formed on the periphery of the upper surfaces of the uneven film 71 and the IRCF51. In the imaging device 1 of FIG. 7, components having the same functions as those of the imaging device 1 in FIG. 6 are denoted by the same reference numerals, and the description thereof will be omitted as appropriate.

[0057] That is, in the imaging device 1 of FIG. 7, the difference from the imaging device 1 in FIG. 6 is that the light-shielding film 34' is formed on the peripheral portion of the upper surface of the uneven film 71 in the drawing.

[0058] Here, the light-shielding film 34' is formed in accordance with the surface shape of the upper surface of the uneven film 71 in the drawing. At this time, the light-shielding film 34' is, for example, a non-photosensitive black material, and is preferably formed by, for example, inkjet. When the light-shielding film 34' is formed on the glass substrate 33 before dicing, the end of the light-shielding film 34 and the end of the solid-state imaging device 14 are on the same plane.

[0059] Also in the imaging device 1 of FIG. 7, the light-shielding film 34' provided on the upper surface of the uneven film 71 is provided closer to the light-receiving surface of the pixel array 31 than the light-shielding film 13a is provided on the IRCF13 in the imaging device 1 in FIG. 1. Therefore, it is possible to prevent the intrusion of stray light such as the light beam L shown in FIG. 1.

[0060] Also, even in such a configuration, the light-shielding film 34 can be formed with high positional accuracy up to the range that becomes the boundary of the effective pixel region on the pixel array 31. Therefore, it is possible to suppress the intrusion of stray light with higher accuracy.

[0061] As a result, by preventing the intrusion of stray light, it is possible to suppress the occurrence of flare and ghost.

[0062] <8. Seventh Embodiment> In the above description, an example in which the solid-state imaging device 14 is a cavity-less CSP structure imaging device has been described, but it may also be a CSP structure imaging device having a cavity.

[0063] FIG. 8 shows a configuration example of the imaging device 1 when the solid-state imaging device 14 has a CSP (Chip Size Package) structure with a cavity. In the imaging device 1 of FIG. 8, components having the same functions as those of the imaging device 1 in FIG. 2 are denoted by the same reference numerals, and the description thereof will be omitted as appropriate.

[0064] That is, in the imaging device 1 of FIG. 8, instead of the cavity-less CSP structure solid-state imaging device 14 in the imaging device 1 of FIG. 2, a solid-state imaging device 14 having a CSP (Chip Size Package) structure with a cavity is provided, and further, a configuration is adopted in which a non-flat film 71 is formed on the glass substrate 33 and the light-shielding film 34.

[0065] More specifically, the peripheral portion between the glass substrate 33 and the pixel array 31 is adhered by an adhesive 32, and a cavity (hollow) 81 is formed between the pixel array 31 and the glass substrate 33 in the effective pixel region of the pixel array 31.

[0066] With such a configuration, the light-shielding film 34 provided on the glass substrate 33 in the imaging device 1 of FIG. 8 is formed closer to the light-receiving surface of the pixel array 31 than the light-shielding film 13a is provided on the IRCF 13 in the imaging device 1 of FIG. 1. Therefore, it is possible to prevent the intrusion of stray light such as the light beam L shown in FIG. 1.

[0067] Also, with such a configuration, since the light-shielding film 34 can be formed on the glass substrate 33 bonded to the pixel array 31 with a transparent adhesive 32, the light-shielding film 34 can be formed with high positional accuracy up to the range that becomes the boundary of the effective pixel region on the pixel array 31. Therefore, it is possible to suppress the intrusion of stray light with higher accuracy.

[0068] As a result, by preventing the intrusion of stray light, it becomes possible to suppress the occurrence of flare and ghosting.

[0069] <9. Eighth Embodiment> In the above, an example has been described in which the solid-state imaging device 14 has a CSP structure with a cavity, a light-shielding film 34 is provided at the peripheral portion on the glass substrate 33, and a non-flat film 71 is further formed on the glass substrate 33 and the light-shielding film 34. However, instead of the light-shielding film 34, a configuration using the light-shielding film 34' described with reference to FIG. 7 may be adopted.

[0070] FIG. 9 shows a configuration example of the imaging device 1 in which the solid-state imaging device 14 has a CSP (Chip Size Package) structure with a cavity, a non-flat film 71 is formed on the glass substrate 33, and a light-shielding film 34' is further formed on the non-flat film 71.

[0071] In the imaging device 1 of FIG. 9, components having the same functions as those of the imaging device 1 in FIG. 8 are denoted by the same reference numerals, and the description thereof will be omitted as appropriate.

[0072] That is, in the imaging device 1 of FIG. 9, the light-shielding film 34 in the imaging device 1 of FIG. 8 is deleted, and a light-shielding film 34' is formed on the non-flat film 71.

[0073] Also in the imaging device 1 of FIG. 9, the light-shielding film 34' provided on the upper surface of the non-flat film 71 is provided closer to the light-receiving surface of the pixel array 31 than the light-shielding film 13a is provided on the IRCF 13 in the imaging device 1 in FIG. 1. Therefore, it becomes possible to prevent the intrusion of stray light such as the light ray L shown in FIG. 1.

[0074] Further, even in such a configuration, the light-shielding film 34 can be formed with high positional accuracy up to the range that forms the boundary of the effective pixel region on the pixel array 31. Therefore, it becomes possible to suppress the intrusion of stray light with higher precision.

[0075] As a result, the intrusion of stray light is prevented, making it possible to suppress the occurrence of flare and ghosting.

[0076] <10. Ninth Embodiment> In the above, an example of the imaging device 1 using the solid-state imaging device 14 having the cavity 81 between the pixel array 31 and the glass substrate 33 in the effective pixel region has been described, where the outer peripheral portions of the pixel array 31 and the glass substrate 33 are adhered by the adhesive 32.

[0077] However, spacers may be provided at the outer peripheral portions of the pixel array 31 and the glass substrate 33 so that the cavity 81 is formed in the effective pixel region between the pixel array 31 and the glass substrate 33.

[0078] FIG. 10 shows a configuration example of the imaging device 1 in which the cavity 81 is formed in the effective pixel region between the pixel array 31 and the glass substrate 33 by providing spacers 91 at the outer peripheral portions of the pixel array 31 and the glass substrate 33.

[0079] In addition, in the imaging device 1 of FIG. 10, for the configuration having the same functions as the imaging device 1 of FIG. 4, the same reference numerals are used, and the description thereof is omitted as appropriate.

[0080] Also, in the imaging device 1 of FIG. 10, the IRCF 51 provided with the light shielding film 34 at the lower part is formed on the light receiving surface side of the glass substrate 33, and further, the non-flat film 71 provided with the light shielding film 34' on the upper surface is formed on the upper surface of the IRCF 51.

[0081] That is, in the imaging device 1 of FIG. 10, the light shielding film 34 and the light shielding film 34' are respectively provided.

[0082] Also in the imaging device 1 of FIG. 10, the light-shielding film 34' provided on the upper surface of the non-flat film 71 and the light-shielding film 34 provided below the IRCF 51 are both provided closer to the light-receiving surface of the pixel array 31 than the light-shielding film 13a is provided on the IRCF 13 in the imaging device 1 in FIG. 1. Therefore, it is possible to prevent the intrusion of stray light such as the light ray L shown in FIG. 1.

[0083] Also, even in such a configuration, the light-shielding film 34 can be formed with high positional accuracy up to the range that becomes the boundary of the effective pixel region on the pixel array 31. Therefore, it is possible to suppress the intrusion of stray light with higher accuracy.

[0084] As a result, by preventing the intrusion of stray light, it is possible to suppress the occurrence of flare and ghost.

[0085] Note that the solid-state imaging device 14 may have a cavity-less configuration as shown in the imaging device 1 of the first to sixth embodiments described with reference to FIGS. 2 to 7. Further, the solid-state imaging device 14 may have a configuration including a cavity as shown in the imaging device 1 of the seventh to ninth embodiments described with reference to FIGS. 8 to 10.

[0086] Also, in the configuration of the solid-state imaging device 14 including a cavity, it may have a configuration including a spacer 91 as shown in the imaging device 1 of the ninth embodiment described with reference to FIG. 10, or it may have a configuration without a spacer 91 as in the imaging devices 1 of the seventh and eighth embodiments described with reference to FIGS. 8 and 9.

[0087] Further, as shown in the imaging apparatuses 1 of the first embodiment, the seventh embodiment, and the eighth embodiment described with reference to FIGS. 2, 8, and 9, the IRCF may be configured to be provided as the IRCF 13 at the bottom on the case 11 side incorporating the lens group 12. Further, as shown in the imaging apparatuses 1 of the second embodiment to the sixth embodiment, and the ninth embodiment described with reference to FIGS. 3 to 7 and FIG. 10, the IRCF may be configured to be provided as the IRCF 51 on the glass substrate 33.

[0088] Further, as shown in the imaging apparatuses 1 of the first embodiment to the third embodiment, the seventh embodiment, and the ninth embodiment described with reference to FIGS. 2 to 4, 8, and 10, the light shielding film may be configured to be formed as the light shielding film 34 (provided below the IRCF 51) on the glass substrate 33. Further, as shown in the imaging apparatuses 1 of the fourth embodiment and the fifth embodiment described with reference to FIGS. 5 and 6, the light shielding film may be configured to be formed as the light shielding film 34 on the IRCF 51. Further, as shown in the imaging apparatuses 1 of the sixth embodiment, the eighth embodiment, and the ninth embodiment described with reference to FIGS. 7, 9, and 10, the light shielding film may be configured to be formed as the light shielding film 34' on the uneven film 71. Further, as shown in the imaging apparatus 1 of the ninth embodiment described with reference to FIG. 10, the light shielding film may be configured to include both the light shielding films 34 and 34'.

[0089] Further, regarding whether there is a cavity 81 or a spacer 91 in the solid-state imaging device 14, whether it is the IRCF 13 provided at the bottom of the case 11 or the IRCF 51 provided on the glass substrate 33, and whether the light shielding film 34 is formed on the glass substrate 33, on the IRCF 51, or as the light shielding film 34' on the uneven film 71, any of them can be applied and the combinations can be freely selected.

[0090] As described above, according to the imaging device 1 of the present disclosure, by forming the light shielding film 34 in front of the glass substrate 33, which is on the light source side of the incident light with respect to the glass substrate 33, it is possible to prevent the intrusion of stray light. As a result, it is possible to suppress the occurrence of flare and ghost. Here, the closer the light shielding film 34 is to the glass substrate 33, the more accurately the occurrence of flare and ghost can be suppressed.

[0091] <11. Application Examples to Electronic Devices> The imaging device 1 shown in FIGS. 2 to 10 described above can be applied to various electronic devices such as an imaging device such as a digital still camera or a digital video camera, a mobile phone equipped with an imaging function, or other devices equipped with an imaging function.

[0092] FIG. 11 is a block diagram showing a configuration example of an imaging device as an electronic device to which the present technology is applied.

[0093] The imaging device 201 shown in FIG. 11 includes an optical system 202, a shutter device 203, a solid-state imaging device 204, a drive circuit 205, a signal processing circuit 206, a monitor 207, and a memory 208, and is configured to be able to capture still images and moving images.

[0094] The optical system 202 includes one or a plurality of lenses, guides light (incident light) from a subject to the solid-state imaging device 204, and forms an image on the light receiving surface of the solid-state imaging device 204.

[0095] The shutter device 203 is disposed between the optical system 202 and the solid-state imaging device 204, and controls the light irradiation period and the light shielding period to the solid-state imaging device 204 according to the control of the drive circuit 205.

[0096] The solid-state imaging device 204 is configured by a package including the solid-state imaging device described above. The solid-state imaging device 204 accumulates signal charges for a certain period in response to the light imaged on the light receiving surface via the optical system 202 and the shutter device 203. The signal charges accumulated in the solid-state imaging device 204 are transferred according to a drive signal (timing signal) supplied from the drive circuit 205.

[0097] The drive circuit 205 outputs drive signals for controlling the transfer operation of the solid-state imaging device 204 and the shutter operation of the shutter device 203, and drives the solid-state imaging device 204 and the shutter device 203.

[0098] The signal processing circuit 206 performs various signal processes on the signal charges output from the solid-state imaging device 204. The image (image data) obtained by the signal processing circuit 206 performing signal processing is supplied to the monitor 207 for display or supplied to the memory 208 for storage (recording).

[0099] Even in the imaging device 201 configured as described above, by applying the lens group 12 and the solid-state imaging device 14 instead of the above-described optical system 202 and the solid-state imaging device 204, it is possible to suppress the occurrence of flare and ghost caused by stray light. <12. Usage example of solid-state imaging device>

[0100] FIG. 12 is a diagram showing a usage example of using the imaging device 1 of FIGS. 2 to 10 described above.

[0101] The above-described imaging device 1 can be used, for example, in various cases of sensing light such as visible light, infrared light, ultraviolet light, X-rays, etc. as follows.

[0102] · Devices for taking pictures of images for appreciation, such as digital cameras and portable devices with camera functions · In-vehicle sensors for taking pictures of the front, rear, surroundings, inside the vehicle, etc. of an automobile for safe driving such as automatic stop and recognition of the driver's state, surveillance cameras for monitoring moving vehicles and roads, ranging sensors for ranging between vehicles, etc., devices for use in traffic · Devices for use in home appliances such as TVs, refrigerators, air conditioners, etc. for taking pictures of a user's gesture and performing device operations according to the gesture · Devices for use in medical and healthcare, such as endoscopes and devices for performing blood vessel imaging by receiving infrared light · Devices used for security purposes, such as surveillance cameras for crime prevention and cameras for person authentication · Devices used for beauty purposes, such as skin measuring devices that photograph the skin and microscopes that photograph the scalp · Devices used for sports purposes, such as action cameras and wearable cameras for sports · Devices used for agricultural purposes, such as cameras for monitoring fields and the condition of crops

[0103] <13. Application Examples to Endoscopic Surgery Systems> The technology according to the present disclosure (this technology) can be applied to various products. For example, the technology according to the present disclosure may be applied to an endoscopic surgery system.

[0104] FIG. 13 is a diagram showing an example of a schematic configuration of an endoscopic surgery system to which the technology according to the present disclosure (this technology) can be applied.

[0105] In FIG. 13, a surgeon (doctor) 11131 is shown performing surgery on a patient 11132 on a patient bed 11133 using an endoscopic surgery system 11000. As shown in the figure, the endoscopic surgery system 11000 includes an endoscope 11100, other surgical instruments 11110 such as a pneumoperitoneum tube 11111 and an energy treatment instrument 11112, a support arm device 11120 that supports the endoscope 11100, and a cart 11200 on which various devices for endoscopic surgery are mounted.

[0106] The endoscope 11100 includes a lens barrel 11101 whose region of a predetermined length from the tip is inserted into the body cavity of the patient 11132, and a camera head 11102 connected to the base end of the lens barrel 11101. In the illustrated example, an endoscope 11100 configured as a so-called rigid endoscope having a rigid lens barrel 11101 is shown, but the endoscope 11100 may be configured as a so-called flexible endoscope having a flexible lens barrel.

[0107] At the tip of the lens barrel 11101, an opening into which an objective lens is fitted is provided. A light source device 11203 is connected to the endoscope 11100, and the light generated by the light source device 11203 is guided by a light guide extending inside the lens barrel 11101 to the tip of the lens barrel and irradiated toward an observation target in the body cavity of the patient 11132 through the objective lens. Note that the endoscope 11100 may be a forward-viewing endoscope, or may be an oblique-viewing endoscope or a side-viewing endoscope.

[0108] An optical system and an imaging element are provided inside the camera head 11102, and the reflected light (observation light) from the observation target is condensed by the optical system onto the imaging element. The observation light is photoelectrically converted by the imaging element, and an electrical signal corresponding to the observation light, that is, an image signal corresponding to the observation image, is generated. The image signal is transmitted as RAW data to a camera control unit (CCU) 11201.

[0109] The CCU 11201 is composed of a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), etc., and comprehensively controls the operations of the endoscope 11100 and the display device 11202. Further, the CCU 11201 receives an image signal from the camera head 11102, and performs various image processes for displaying an image based on the image signal, such as development processing (demosaicing processing), on the image signal.

[0110] The display device 11202 displays an image based on the image signal that has been subjected to image processing by the CCU 11201 under the control of the CCU 11201.

[0111] The light source device 11203 is composed of a light source such as an LED (Light Emitting Diode), and supplies irradiation light for photographing the surgical site or the like to the endoscope 11100.

[0112] The input device 11204 is an input interface for the endoscopic surgery system 11000. The user can input various information and give instructions to the endoscopic surgery system 11000 via the input device 11204. For example, the user inputs an instruction to change the imaging conditions (such as the type of irradiation light, magnification, and focal length) by the endoscope 11100.

[0113] The treatment instrument control device 11205 controls the driving of the energy treatment instrument 11112 for tissue cauterization, incision, or blood vessel sealing, etc. The pneumoperitoneum device 11206 sends gas into the body cavity of the patient 11132 via the pneumoperitoneum tube 11111 to expand the body cavity for the purpose of securing the visual field by the endoscope 11100 and the working space for the surgeon. The recorder 11207 is a device capable of recording various information related to the surgery. The printer 11208 is a device capable of printing various information related to the surgery in various forms such as text, image, or graph.

[0114] Note that the light source device 11203 that supplies irradiation light when photographing the surgical site by the endoscope 11100 can be composed of, for example, an LED, a laser light source, or a white light source composed of a combination thereof. When a white light source is composed of a combination of RGB laser light sources, since the output intensity and output timing of each color (each wavelength) can be controlled with high precision, the white balance of the captured image can be adjusted in the light source device 11203. Also, in this case, it is also possible to irradiate the observation target with the laser light from each of the RGB laser light sources in a time-division manner and control the driving of the imaging element of the camera head 11102 in synchronization with the irradiation timing, thereby capturing images corresponding to each of RGB in a time-division manner. According to this method, a color image can be obtained without providing a color filter on the imaging element.

[0115] Further, the light source device 11203 may be controlled such that the intensity of the output light is changed at predetermined time intervals. In synchronization with the timing of the change in the light intensity, the driving of the imaging element of the camera head 11102 is controlled to acquire images in a time-division manner, and the images are synthesized, whereby a high-dynamic range image without so-called black crush and white dropout can be generated.

[0116] Further, the light source device 11203 may be configured to be capable of supplying light in a predetermined wavelength band corresponding to special light observation. In special light observation, for example, by utilizing the wavelength dependence of light absorption in body tissue and irradiating narrow-band light as compared with the irradiation light (i.e., white light) during normal observation, so-called narrow-band imaging for photographing a predetermined tissue such as blood vessels in the mucosal surface layer with high contrast is performed. Alternatively, in special light observation, fluorescence observation for obtaining an image by fluorescence generated by irradiating excitation light may be performed. In fluorescence observation, irradiating the body tissue with excitation light and observing the fluorescence from the body tissue (autofluorescence observation), or injecting a reagent such as indocyanine green (ICG) locally into the body tissue and irradiating the body tissue with excitation light corresponding to the fluorescence wavelength of the reagent to obtain a fluorescence image, etc. can be performed. The light source device 11203 can be configured to be capable of supplying narrow-band light and / or excitation light corresponding to such special light observation.

[0117] FIG. 14 is a block diagram showing an example of the functional configuration of the camera head 11102 and the CCU 11201 shown in FIG. 13.

[0118] The camera head 11102 includes a lens unit 11401, an imaging unit 11402, a driving unit 11403, a communication unit 11404, and a camera head control unit 11405. The CCU 11201 includes a communication unit 11411, an image processing unit 11412, and a control unit 11413. The camera head 11102 and the CCU 11201 are communicably connected to each other by a transmission cable 11400.

[0119] The lens unit 11401 is an optical system provided at the connection part with the lens barrel 11101. The observation light taken in from the tip of the lens barrel 11101 is guided to the camera head 11102 and enters the lens unit 11401. The lens unit 11401 is configured by combining a plurality of lenses including a zoom lens and a focus lens.

[0120] The imaging unit 11402 is composed of an imaging element. The imaging element constituting the imaging unit 11402 may be one (so-called single-plate type) or a plurality (so-called multi-plate type). When the imaging unit 11402 is configured in a multi-plate type, for example, image signals corresponding to RGB respectively may be generated by each imaging element, and a color image may be obtained by synthesizing them. Alternatively, the imaging unit 11402 may be configured to have a pair of imaging elements for respectively acquiring right-eye and left-eye image signals corresponding to 3D (Dimensional) display. By performing 3D display, the surgeon 11131 can more accurately grasp the depth of the biological tissue in the surgical site. When the imaging unit 11402 is configured in a multi-plate type, a plurality of systems of the lens unit 11401 may be provided corresponding to each imaging element.

[0121] Also, the imaging unit 11402 does not necessarily have to be provided in the camera head 11102. For example, the imaging unit 11402 may be provided immediately behind the objective lens inside the lens barrel 11101.

[0122] The drive unit 11403 is composed of an actuator and moves the zoom lens and the focus lens of the lens unit 11401 along the optical axis by a predetermined distance under the control from the camera head control unit 11405. Thereby, the magnification and focus of the captured image by the imaging unit 11402 can be appropriately adjusted.

[0123] The communication unit 11404 is composed of a communication device for transmitting and receiving various types of information to and from the CCU 11201. The communication unit 11404 transmits the image signal obtained from the imaging unit 11402 as RAW data to the CCU 11201 via the transmission cable 11400.

[0124] Also, the communication unit 11404 receives a control signal for controlling the drive of the camera head 11102 from the CCU 11201 and supplies it to the camera head control unit 11405. The control signal includes information related to imaging conditions, such as information specifying the frame rate of the captured image, information specifying the exposure value at the time of imaging, and / or information specifying the magnification and focus of the captured image.

[0125] Note that the imaging conditions such as the above frame rate, exposure value, magnification, and focus may be appropriately specified by the user, or may be automatically set by the control unit 11413 of the CCU 11201 based on the acquired image signal. In the latter case, so-called AE (Auto Exposure) function, AF (Auto Focus) function, and AWB (Auto White Balance) function are installed in the endoscope 11100.

[0126] The camera head control unit 11405 controls the drive of the camera head 11102 based on the control signal from the CCU 11201 received via the communication unit 11404.

[0127] The communication unit 11411 is composed of a communication device for transmitting and receiving various types of information to and from the camera head 11102. The communication unit 11411 receives the image signal transmitted from the camera head 11102 via the transmission cable 11400.

[0128] Also, the communication unit 11411 transmits a control signal for controlling the drive of the camera head 11102 to the camera head 11102. The image signal and the control signal can be transmitted by telecommunication, optical communication, etc.

[0129] The image processing unit 11412 performs various image processes on the image signal, which is RAW data transmitted from the camera head 11102.

[0130] The control unit 11413 performs various controls related to imaging of the surgical site and the like by the endoscope 11100 and display of the captured image obtained by imaging the surgical site and the like. For example, the control unit 11413 generates a control signal for controlling the drive of the camera head 11102.

[0131] In addition, the control unit 11413 causes the display device 11202 to display the captured image in which the surgical site and the like are reflected, based on the image signal that has been subjected to image processing by the image processing unit 11412. At this time, the control unit 11413 may recognize various objects in the captured image using various image recognition techniques. For example, the control unit 11413 can recognize surgical instruments such as forceps, specific biological sites, bleeding, mist during use of the energy treatment instrument 11112, etc., by detecting the shape, color, etc. of the edges of the objects included in the captured image. When causing the display device 11202 to display the captured image, the control unit 11413 may use the recognition result to superimpose and display various surgical support information on the image of the surgical site. By superimposing and displaying the surgical support information and presenting it to the surgeon 11131, the burden on the surgeon 11131 can be reduced and the surgeon 11131 can surely proceed with the surgery.

[0132] The transmission cable 11400 that connects the camera head 11102 and the CCU 11201 is an electrical signal cable corresponding to electrical signal communication, an optical fiber corresponding to optical communication, or a composite cable thereof.

[0133] Here, in the illustrated example, communication was performed wired using the transmission cable 11400, but communication between the camera head 11102 and the CCU 11201 may be performed wirelessly.

[0134] The above has described an example of an endoscopic surgical system to which the technology according to the present disclosure can be applied. The technology according to the present disclosure can be applied to, for example, the endoscope 11100, the camera head 11102 (imaging unit 11402 thereof), the CCU 11201 (image processing unit 11412 thereof), etc. among the configurations described above. Specifically, for example, the imaging device 1 in FIGS. 2 to 10 can be applied to the lens unit 11401 and the imaging unit 10402. By applying the technology according to the present disclosure to the lens unit 11401 and the imaging unit 10402, it becomes possible to suppress the occurrence of flare and ghost.

[0135] Here, although an endoscopic surgical system has been described as an example, the technology according to the present disclosure may also be applied to, for example, a microsurgical system or the like.

[0136] <11. Application Examples to Mobile Bodies> The technology (this technology) according to the present disclosure can be applied to various products. For example, the technology according to the present disclosure may be realized as a device mounted on any type of mobile body such as an automobile, an electric vehicle, a hybrid electric vehicle, a motorcycle, a bicycle, a personal mobility device, an airplane, a drone, a ship, a robot, etc.

[0137] FIG. 15 is a block diagram showing a schematic configuration example of a vehicle control system which is an example of a mobile body control system to which the technology according to the present disclosure can be applied.

[0138] The vehicle control system 12000 includes a plurality of electronic control units connected via a communication network 12001. In the example shown in FIG. 15, the vehicle control system 12000 includes a drive system control unit 12010, a body system control unit 12020, an outside vehicle information detection unit 12030, an inside vehicle information detection unit 12040, and an integrated control unit 12050. Further, as the functional configuration of the integrated control unit 12050, a microcomputer 12051, an audio-video output unit 12052, and an in-vehicle network I / F (interface) 12053 are shown.

[0139] The drive system control unit 12010 controls the operations of devices related to the vehicle's drive system according to various programs. For example, the drive system control unit 12010 functions as a control device for a driving force generation device for generating the driving force of the vehicle, such as an internal combustion engine or a driving motor, a driving force transmission mechanism for transmitting the driving force to the wheels, a steering mechanism for adjusting the steering angle of the vehicle, and a braking device for generating the braking force of the vehicle.

[0140] The body system control unit 12020 controls the operations of various devices installed in the vehicle body according to various programs. For example, the body system control unit 12020 functions as a control device for a keyless entry system, a smart key system, a power window device, or various lamps such as a headlamp, a backlamp, a brake lamp, a turn signal, or a fog lamp. In this case, radio waves transmitted from a portable device that substitutes for a key or signals from various switches can be input to the body system control unit 12020. The body system control unit 12020 receives these inputs of radio waves or signals and controls the vehicle's door lock device, power window device, lamps, etc.

[0141] The vehicle exterior information detection unit 12030 detects information outside the vehicle equipped with the vehicle control system 12000. For example, an imaging unit 12031 is connected to the vehicle exterior information detection unit 12030. The vehicle exterior information detection unit 12030 causes the imaging unit 12031 to capture an image outside the vehicle and receives the captured image. The vehicle exterior information detection unit 12030 may perform object detection processing or distance detection processing on objects such as people, vehicles, obstacles, signs, or characters on the road surface based on the received image.

[0142] The imaging unit 12031 is an optical sensor that receives light and outputs an electrical signal according to the amount of received light. The imaging unit 12031 can output the electrical signal as an image or as distance measurement information. Also, the light received by the imaging unit 12031 may be visible light or non-visible light such as infrared light.

[0143] The in-vehicle information detection unit 12040 detects information inside the vehicle. For example, a driver state detection unit 12041 that detects the state of the driver is connected to the in-vehicle information detection unit 12040. The driver state detection unit 12041 includes, for example, a camera that images the driver, and the in-vehicle information detection unit 12040 may calculate the degree of driver fatigue or concentration based on the detection information input from the driver state detection unit 12041, or may determine whether the driver is dozing off.

[0144] Based on the information inside and outside the vehicle acquired by the out-vehicle information detection unit 12030 or the in-vehicle information detection unit 12040, the microcomputer 12051 can calculate the control target values of the driving force generation device, the steering mechanism, or the braking device, and output a control command to the drive system control unit 12010. For example, the microcomputer 12051 can perform cooperative control for realizing functions of an ADAS (Advanced Driver Assistance System) including collision avoidance or shock mitigation of the vehicle, following driving based on the inter-vehicle distance, vehicle speed maintenance driving, collision warning of the vehicle, or lane departure warning of the vehicle.

[0145] In addition, based on the information around the vehicle acquired by the out-vehicle information detection unit 12030 or the in-vehicle information detection unit 12040, the microcomputer 12051 can perform cooperative control for the purpose of autonomous driving, etc., which controls the driving force generation device, the steering mechanism, or the braking device, etc., to drive autonomously regardless of the driver's operation.

[0146] Also, based on the out-vehicle information acquired by the out-vehicle information detection unit 12030, the microcomputer 12051 can output a control command to the body system control unit 12020. For example, the microcomputer 12051 can perform cooperative control for the purpose of anti-glare, such as controlling the headlamp according to the position of the preceding vehicle or oncoming vehicle detected by the out-vehicle information detection unit 12030 and switching the high beam to the low beam.

[0147] The audio-visual output unit 12052 transmits an output signal of at least one of audio and video to an output device capable of notifying information visually or auditorily to the vehicle occupants or outside the vehicle. In the example of FIG. 15, as the output devices, an audio speaker 12061, a display unit 12062, and an instrument panel 12063 are illustrated. The display unit 12062 may include, for example, at least one of an on-board display and a head-up display.

[0148] FIG. 16 is a diagram showing an example of the installation position of the imaging unit 12031.

[0149] In FIG. 16, the vehicle 12100 has imaging units 12101, 12102, 12103, 12104, and 12105 as the imaging unit 12031.

[0150] The imaging units 12101, 12102, 12103, 12104, and 12105 are provided, for example, at positions such as the front nose of the vehicle 12100, the side mirrors, the rear bumper, the back door, and the upper part of the front windshield inside the vehicle cabin. The imaging unit 12101 provided at the front nose and the imaging unit 12105 provided at the upper part of the front windshield inside the vehicle cabin mainly acquire images in front of the vehicle 12100. The imaging units 12102 and 12103 provided at the side mirrors mainly acquire images on the sides of the vehicle 12100. The imaging unit 12104 provided at the rear bumper or the back door mainly acquires images behind the vehicle 12100. The front images acquired by the imaging units 12101 and 12105 are mainly used for detecting a preceding vehicle or a pedestrian, an obstacle, a traffic signal, a traffic sign, or a lane.

[0151] Note that FIG. 16 shows an example of the shooting ranges of imaging units 12101 to 12104. The shooting range 12111 indicates the shooting range of the imaging unit 12101 provided on the front nose, and the shooting ranges 12112 and 12113 indicate the shooting ranges of the imaging units 12102 and 12103 provided on the side mirrors, respectively. The shooting range 12114 indicates the shooting range of the imaging unit 12104 provided on the rear bumper or the back door. For example, by overlapping the image data captured by the imaging units 12101 to 12104, an overhead image of the vehicle 12100 viewed from above can be obtained.

[0152] At least one of the imaging units 12101 to 12104 may have a function of acquiring distance information. For example, at least one of the imaging units 12101 to 12104 may be a stereo camera composed of a plurality of imaging elements, or may be an imaging element having pixels for phase difference detection.

[0153] For example, based on the distance information obtained from the imaging units 12101 to 12104, the microcomputer 12051 obtains the distance to each solid object within the shooting ranges 12111 to 12114 and the temporal change of this distance (relative speed with respect to the vehicle 12100), and thus can extract, as the preceding vehicle, the closest solid object on the traveling path of the vehicle 12100 that travels at a predetermined speed (for example, 0 km / h or more) in substantially the same direction as the vehicle 12100. Further, the microcomputer 12051 can set the inter-vehicle distance to be secured in advance in front of the preceding vehicle and perform automatic brake control (including follow-up stop control) and automatic acceleration control (including follow-up start control), etc. In this way, cooperative control for the purpose of autonomous driving, etc., which runs autonomously without relying on the driver's operation, can be performed.

[0154] For example, based on the distance information obtained from imaging units 12101 to 12104, the microcomputer 12051 classifies and extracts solid object data regarding solid objects into categories such as two-wheeled vehicles, ordinary vehicles, large vehicles, pedestrians, utility poles, and other solid objects, and can use it for automatic avoidance of obstacles. For example, the microcomputer 12051 discriminates obstacles around the vehicle 12100 into obstacles visible to the driver of the vehicle 12100 and obstacles difficult to visually recognize. Then, the microcomputer 12051 determines a collision risk indicating the degree of risk of collision with each obstacle, and when the collision risk is equal to or higher than a set value and there is a possibility of collision, it outputs an alarm to the driver via the audio speaker 12061 or the display unit 12062, or performs forced deceleration or avoidance steering via the drive system control unit 12010, thereby providing driving assistance for collision avoidance.

[0155] At least one of the imaging units 12101 to 12104 may be an infrared camera that detects infrared rays. For example, the microcomputer 12051 can recognize a pedestrian by determining whether a pedestrian exists in the captured image of the imaging units 12101 to 12104. Such recognition of a pedestrian is performed, for example, by a procedure of extracting feature points in the captured image of the imaging units 12101 to 12104 as infrared cameras and a procedure of performing pattern matching processing on a series of feature points indicating the outline of an object to discriminate whether it is a pedestrian. When the microcomputer 12051 determines that a pedestrian exists in the captured image of the imaging units 12101 to 12104 and recognizes the pedestrian, the audio and image output unit 12052 controls the display unit 12062 to superimpose and display a rectangular contour line for emphasis on the recognized pedestrian. Further, the audio and image output unit 12052 may control the display unit 12062 to display an icon or the like indicating a pedestrian at a desired position.

[0156] The above has described an example of a vehicle control system to which the technology according to the present disclosure can be applied. The technology according to the present disclosure can be applied to, for example, the imaging unit 12031 among the configurations described above. Specifically, for example, the imaging devices 1 in FIGS. 2 to 10 can be applied to the imaging unit 12031. By applying the technology according to the present disclosure to the imaging unit 12031, it becomes possible to suppress the occurrence of flare and ghost.

[0157] In addition, the present disclosure can also adopt the following configurations. <1> A solid-state imaging device having a chip size package structure, and a lens group including a plurality of lenses that condenses incident light onto a light receiving surface of the solid-state imaging device having the chip size package structure. The solid-state imaging device having the chip size package structure includes a pixel array that generates a pixel signal corresponding to the amount of incident light by photoelectric conversion in pixel units arranged in an array, a glass substrate bonded to a light receiving surface of the pixel array, and a light shielding member formed in a peripheral portion outside the effective pixel region of the pixel array. The light shielding member is formed on a light receiving surface of the glass substrate, an infrared cut filter that cuts infrared light among the incident light is formed on the light receiving surface of the glass substrate, the infrared cut filter is in contact with the glass substrate and the light shielding member, a non-flat film made of a single optical element having a convex surface or a concave surface on the light receiving surface side, or a combination of a plurality of optical elements having a convex surface or a concave surface on the light receiving surface side is formed in front of the infrared cut filter. Imaging device. <2> The non-flat film is formed on the infrared cut filter. The imaging device according to <1>. <3> The light shielding member is a photosensitive black resist and is formed on the light receiving surface of the glass substrate by photolithography. The imaging device according to <1>. <4> The light-shielding member is formed in front of the infrared light cut filter. <1> The imaging device according to <1>. <5> The light-shielding member is formed on the infrared light cut filter. <4> The imaging device according to <4>. <6> The light-shielding member is a photosensitive black resist and is formed on the infrared light cut filter by photolithography. <4> The imaging device according to <4>. <7> The light-shielding member is formed on the non-flat film. <1> The imaging device according to <1>. <8> The light-shielding member is a non-photosensitive black resist and is formed on the non-flat film by inkjet. <7> The imaging device according to <7>. <9> The glass substrate is bonded to the light-receiving surface of the pixel array by a transparent adhesive. <1> The imaging device according to <1>. <10> A solid-state imaging device having a chip size package structure, A lens group including a plurality of lenses for condensing incident light onto the light-receiving surface of the solid-state imaging device having the chip size package structure. The solid-state imaging device having the chip size package structure, A semiconductor substrate on which pixels for generating pixel signals corresponding to the amount of incident light by photoelectric conversion are arranged in an array in pixel units arranged in an array, A glass substrate bonded to the light-receiving surface of the semiconductor substrate via an adhesive, A light-shielding member formed in a peripheral portion outside the effective pixel region of the semiconductor substrate, The light-shielding member is formed on the light-receiving surface of the glass substrate, The adhesive is in contact with the semiconductor substrate and the glass substrate, The ends of the semiconductor substrate and the ends of the glass substrate are aligned, An infrared light cut filter for cutting infrared light among the incident light is formed on the light-receiving surface of the glass substrate, The infrared cut filter is in contact with the glass substrate and the light-shielding member, A non-flat film composed of a single optical element having a convex or concave surface on the light-receiving surface side, or a plurality of optical elements having a convex or concave surface on the light-receiving surface side, is formed in front of the infrared cut filter. An imaging device.

Description of Reference Numerals

[0158] 1 Imaging device, 11 Case, 12 Lens group, 13 IRCF, 13a Light-shielding film, 14 Solid-state imaging device, 31 Pixel array, 32 Adhesive, 33 Glass substrate, 34 Light-shielding film, 51 IRCF, 71 Non-flat film, 81 Cavity, 91 Spacer

Claims

1. A solid-state imaging element having a chip size package structure; a lens group including a plurality of lenses for concentrating incident light onto a light receiving surface of the solid-state image pickup device having the chip size package structure; The solid-state imaging device having the chip size package structure includes: a pixel array that generates a pixel signal corresponding to the amount of the incident light by photoelectric conversion on a pixel-by-pixel basis arranged in an array; a glass substrate bonded to a light receiving surface of the pixel array; a light blocking member formed in a peripheral portion outside an effective pixel area of ​​the pixel array, the light blocking member is formed on the light receiving surface of the glass substrate, an infrared light cut filter that cuts infrared light out of the incident light is formed on the light receiving surface of the glass substrate; the infrared light cut filter is in contact with the glass substrate and the light shielding member, a non-flat film made of a single optical element having a convex or concave surface on the light receiving surface side, or a combination of a plurality of optical elements having a convex or concave surface on the light receiving surface side, is formed in front of the infrared light cut filter; The light blocking member is formed on a side surface of the non-flat film that is outside an effective pixel region of the pixel array and is formed on an outer periphery of the non-flat film with respect to a center position of the non-flat film when the non-flat film is viewed from the incident direction of the incident light, and on the infrared light cut filter. Imaging device.

2. The non-flat film is formed on the infrared light cut filter. The imaging device according to claim 1 .

3. The light shielding member is a non-photosensitive black resist, and is formed by inkjet on the side surface formed on the outer periphery of the non-flat film and on the infrared light cut filter. The imaging device according to claim 1 .

4. The glass substrate is attached to the light receiving surface of the pixel array with a transparent adhesive. The imaging device according to claim 1 .

5. A solid-state imaging element having a chip size package structure; a lens group including a plurality of lenses for concentrating incident light onto a light receiving surface of the solid-state image pickup device having the chip size package structure; The solid-state imaging device having the chip size package structure includes: a semiconductor substrate on which pixels are arranged in an array, the pixels generating pixel signals corresponding to the amount of incident light by photoelectric conversion on a pixel-by-pixel basis; a glass substrate bonded to a light receiving surface of the semiconductor substrate via an adhesive; a light blocking member formed in a peripheral portion of the semiconductor substrate, the peripheral portion being outside an effective pixel area; the light blocking member is formed on the light receiving surface of the glass substrate, the adhesive is in contact with the semiconductor substrate and the glass substrate; an edge of the semiconductor substrate and an edge of the glass substrate are aligned; an infrared light cut filter that cuts infrared light out of the incident light is formed on the light receiving surface of the glass substrate; the infrared light cut filter is in contact with the glass substrate and the light shielding member, a non-flat film made of a single optical element having a convex or concave surface on the light receiving surface side, or a combination of a plurality of optical elements having a convex or concave surface on the light receiving surface side, is formed in front of the infrared light cut filter; The light blocking member is formed on a side surface of the non-flat film that is outside an effective pixel region of the semiconductor substrate and is formed on an outer periphery of the non-flat film with respect to a center position of the non-flat film when the non-flat film is viewed from the incident direction of the incident light, and on the infrared light cut filter. Imaging device.

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