Method and apparatus for controlling a fluid supply device in a metallurgical sample preparation machine

Abstract

A method and apparatus for controlling a fluid supply in a metallurgical sample preparation machine is disclosed. An exemplary system for supplying fluid to a grinder / polisher includes a fluid supply apparatus having a fluid reservoir for storing fluid and a nozzle for supplying the fluid onto the grinding / polishing surface, a temperature sensor for outputting a temperature signal indicative of the temperature of the grinding / polishing surface during a grinding or polishing operation, and a processor for comparing the temperature signal to a threshold and sending a supply signal to the fluid supply apparatus when the temperature signal meets the predetermined threshold, wherein the fluid supply apparatus supplies fluid in response to the supply signal.

Description

Technical Field

[0001] [Cross - Reference to Related Applications] This application claims priority to U.S. Provisional Patent Application No. 62 / 688,293, filed Jun. 21, 2018, entitled "SYSTEM AND METHOD FOR INFRARED MONITORING AND CONTROL OF FLUID DISPENSING UNITS FOR A GRINDER / POLISHER" and U.S. Patent Application No. 16 / 445,676, filed Jun. 19, 2019, entitled "METHODS AND APPARATUS TO CONTROL A FLUID DISPENSER ON A METALLURGICAL SPECIMEN PREPARATION MACHINE". The entire contents of U.S. Provisional Patent Application No. 62 / 688,293 and U.S. Patent Application No. 16 / 445,676 are hereby incorporated by reference as part of this specification.

[0002] The present disclosure relates to methods and apparatus for controlling a fluid supply device in a metallurgical specimen preparation machine, such as a grinder / polisher. A fluid supply device used in conjunction with a grinder, polisher, etc. for preparing the surface of a metallurgical specimen typically includes a polishing fluid / slurry reservoir and an actuator, such as a pump, siphon, or air source, connected to the reservoir to push the fluid / slurry towards a nozzle. The nozzle is directed in the direction of a rotatable platen or lapping wheel of the machine of the grinder / polisher used in the preparation of the metallurgical specimen.

Background Art

[0003] In the prior art, Patent Document 1 and Patent Document 2, both with the invention name of "Grinder / Polisher", disclose a metal preparation machine in which a fluid supply device is used in both cases. The fluid supply devices known in the prior art usually include a manual mode or a burst mode for supplying (dispensing) fluids such as polishing slurries. In the prior art, Patent Document 3 with the invention name of "Modular fluid-dispensing system" and Patent Document 4 with the invention name of "Abrasive slurry supply system for use in metallographic sample preparation" disclose the configurations of a manual fluid supply device or a burst fluid supply device. In the manual configuration, the fluid is supplied by the operation of the user. In the burst configuration, the fluid is supplied at a predetermined interval, frequency, or rate.

[0004] As can be easily understood, if the rate or arrangement of the lubricant and slurry is not controlled, there is a risk of excessive damage to the grinding / polishing surface and the sample, insufficient quality of the resulting product, variation among operators, and waste of materials. Further, in the burst mode, any settings used need to be changed according to each surface, sample type, number of samples, and the combination of lubricant / slurry used.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

Patent Document 3

Patent Document 4

Summary of the Invention

Problems to be Solved by the Invention

[0006] Therefore, there is a need for an active feedback control of a fluid supply device that brings about improvements in both quality and efficiency in metallurgical sample preparation.

Means for Solving the Problem

[0007] In view of the above, the present disclosure includes a system and method for infrared monitoring and control of a fluid supply device of a grinding / polishing machine. A grinding / polishing machine with active feedback of the fluid supply rate improves the quality of sample preparation and the efficiency of the grinding / polishing machine. A temperature sensor having at least one infrared sensor detects the temperature of the grinding / polishing surface of the grinding / polishing machine. This temperature sensor can be attached to the grinding / polishing machine or to a separate temperature sensing arm extending from either the base or the head of the grinding / polishing machine.

[0008] The temperature sensor detects and monitors the temperature of the grinding / polishing surface during the operation of the grinding / polishing machine. A temperature signal is transmitted from the temperature sensor to a processor (e.g., but not limited to, a processor of the fluid supply device or the grinding / polishing machine). The processor determines whether a temperature change has occurred on the grinding / polishing surface. In some embodiments, the processor compares the temperature signal from the temperature sensor with a predetermined threshold value. This predetermined threshold value is, for example, but not limited to, the maximum temperature, the temperature range, or the rate of temperature change.

[0009] Based on the above determination and / or comparison, the processor transmits a supply signal to the fluid supply device, and the fluid supply device supplies fluid from a reservoir through a nozzle onto the grinding / polishing surface. Therefore, the abrasive fluid and / or the lubricant fluid is applied to the grinding / polishing surface as needed, providing sufficient lubrication to protect the grinding / polishing machine and the sample without using the fluid excessively.

[0010] These and other features and advantages of the present disclosure will become apparent from the following detailed description together with the appended claims.

[0011] The benefits and advantages of the present disclosure will be readily apparent to those skilled in the art after considering the following detailed description and the accompanying drawings.

Brief Description of the Drawings

[0012]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5A

Figure 5B

Figure 6

Figure 7

Modes for Carrying Out the Invention

[0013] The drawings are not necessarily to scale. Where appropriate, like or identical reference numerals are used to refer to like or identical components.

[0014] Preferred examples of the present disclosure can be described below with reference to the accompanying drawings. In the following description, well-known functions or configurations are not described in detail as they may obscure the present disclosure if described in unnecessary detail.

[0015] A grinding / polishing machine refers to a certain type of metallurgical sample preparation machine and is used in many industries. The grinding / polishing machine is often used to prepare samples of metals, polymers, ceramics, etc. for further inspection by microscopy or the like. As used herein, the term "grinding / polishing machine" can refer to a machine that performs either or both grinding and polishing. In some examples, whether the grinding / polishing machine performs a grinding operation or a polishing operation may depend on the material being prepared, the abrasive used, and / or the speed of the machine.

[0016] In conventional grinding / polishing machines, fluid is supplied according to a burst operation mode or a manual operation mode. In the manual mode, the user manually activates and starts / stops the fluid supply and either starts or stops the supply of the fluid. In the burst operation mode, the memory stores the pump-on time and the pump-off time related to the qualitative settings selected by the user. The fluid is supplied according to the pump-on time and the pump-off time related to the settings selected by the user. As described above, the conventional techniques for fluid supply may have the drawback that the supply is insufficient, which may lead to a decrease in the quality of the grinding / polishing results and / or excessive wear of the components of the grinding / polishing machine.

[0017] The disclosed methods and apparatuses perform infrared monitoring and control of the fluid supply device of a grinding / polishing machine. The disclosed examples improve the consistency and / or control of the supply of abrasive fluid and / or lubricant fluid, improve the preparation rate and / or quality of metallographic samples, improve the usage efficiency of the consumed fluid (thereby reducing waste), reduce or prevent damage to the grinding / polishing surface caused by insufficient lubrication, and / or increase the level of automation within metallographic preparation, thereby improving the quality and / or reproducibility of the preparation process, the test process, and the analysis process.

[0018] As used herein, the terms "about" and / or "approximately" when used to modify or describe a value (or range of values), position, orientation, and / or operation mean reasonably close to that value, range of values, position, orientation, and / or operation. Thus, the examples described herein are not limited to the recited values, ranges of values, positions, orientations, and / or operations, but rather, conversely, will include reasonably achievable deviations.

[0019] As used herein, "and / or" means any one or more of the items in the list connected by "and / or". As an example, "x and / or y" means any element of the three-element set {(x), (y), (x, y)}. In other words, "x and / or y" means "one or both of x and y". As another example, "x, y and / or z" means any element of the seven-element set {(x), (y), (z), (x, y), (x, z), (y, z), (x, y, z)}. In other words, "x, y and / or z" means "one or more of x, y and z".

[0020] As used herein, the term "for example" emphasizes a list of one or more non-limiting examples, instances or illustrations.

[0021] The disclosed system for supplying fluid to a grinding / polishing machine is a fluid supply device comprising a fluid reservoir for storing fluid and a nozzle for supplying fluid onto the grinding / polishing surface, a temperature sensor that outputs a temperature signal indicative of the temperature of the grinding / polishing surface during a grinding or polishing operation, and a processor that compares the temperature signal to a threshold value and transmits a supply signal to the fluid supply device when the temperature signal meets the threshold value, and the fluid supply device supplies fluid in response to the supply signal.

[0022] In some examples, the temperature sensor is a non-contact temperature sensor. In some examples, the non-contact temperature sensor is at least one of an infrared sensor or a thermographic camera. In some examples, the temperature sensor measures the temperature of the grinding / polishing surface at multiple locations on the grinding / polishing surface. In some examples, the temperature sensor outputs a temperature signal representing the highest temperature among the temperatures measured simultaneously at multiple locations. In some exemplary systems, the temperature sensor outputs a temperature signal representing the average temperature of multiple locations.

[0023] In some examples, the fluid supply device outputs a predetermined amount of fluid in response to a supply signal. In some examples, the fluid supply device outputs an amount of fluid based on the value of the supply signal. In some examples, the processor compares the change in temperature with a threshold change and outputs a supply signal in response to the change in temperature satisfying the threshold change.

[0024] In some examples, the fluid supply device includes a plurality of fluid reservoirs, and the fluid supply device supplies fluid based on at least one of the type of grinding or polishing operation, the material of the grinding / polishing surface, or the material of the sample prepared through the grinding / polishing surface. In some examples, the processor determines a threshold based on a reference temperature. In some examples, the reference temperature includes the temperature of the grinding / polishing surface measured before or in response to the start of the grinding or polishing operation.

[0025] The disclosed exemplary grinding / polishing machine includes a platen for grinding or polishing a material sample, a fluid supply device including a fluid reservoir for storing fluid and a nozzle for supplying the fluid onto the grinding / polishing surface of the platen, a temperature sensor for outputting a temperature signal indicating the temperature of the grinding / polishing surface, and a processor for comparing the temperature signal with a threshold and transmitting a supply signal to the fluid supply device when the temperature signal is equal to or higher than a predetermined threshold.

[0026] In some examples, the temperature sensor is a non-contact temperature sensor. In some examples, the non-contact temperature sensor is at least one of an infrared sensor or a thermographic camera. In some examples, the temperature sensor measures the temperature of the grinding / polishing surface at multiple locations on the grinding / polishing surface. In some examples, the temperature sensor outputs a temperature signal representing the highest temperature among the temperatures measured simultaneously at multiple locations. In some exemplary systems, the temperature sensor outputs a temperature signal representing the average temperature of multiple locations.

[0027] In some examples, the fluid supply device outputs a predetermined amount of fluid in response to a supply signal. In some examples, the fluid supply device outputs an amount of fluid based on the value of the supply signal. In some examples, the processor compares the change in temperature with a threshold change and outputs a supply signal in response to the change in temperature satisfying the threshold change.

[0028] In some examples, the fluid supply device includes a plurality of fluid reservoirs, and the fluid supply device supplies fluid based on at least one of the type of grinding or polishing operation, the material of the grinding / polishing surface, or the material of the sample prepared through the grinding / polishing surface. In some examples, the processor determines a threshold based on a reference temperature. In some examples, the reference temperature includes the temperature of the grinding / polishing surface measured before or in response to the start of the grinding or polishing operation.

[0029] The disclosed exemplary method of controlling a fluid supply device includes monitoring the temperature of the grinding / polishing surface using a temperature sensor, comparing the temperature with a threshold temperature in a control unit, transmitting a supply unit from the control unit to the fluid supply device when the temperature signal is above a predetermined threshold, and supplying fluid onto the grinding / polishing surface using a nozzle connected to at least one fluid reservoir of the fluid supply device.

[0030] FIG. 1 shows an exemplary grinding / polishing machine 100 that includes a plurality of fluid supply devices 102. The grinding / polishing machine 100 includes a platen 104. While the material to be ground / polished is disposed within the sample holder 106 and held against the platen 104, the platen 104 is rotated, thereby providing a grinding / polishing surface using a controlled force. In some examples, both the platen 104 and the sample holder 106 rotate during sample preparation. Thus, there are two rotating motions that occur simultaneously.

[0031] A slurry that can include abrasive particles is injected onto the platen 104 to provide an abrasive and / or lubricating medium for grinding or polishing the sample. The surface of the platen 104 is exchangeable among various grinding or polishing surfaces. Exemplary grinding and polishing surfaces include, but are not limited to, diamond grinding disks, polishing cloths, and polishing lapping disks and / or polishing lapping films.

[0032] FIG. 2 shows an exemplary grinding / polishing machine that can be used to implement the grinding / polishing machine 100 of FIG. 1. The grinding / polishing machine 10 generally includes a base 12, a head 14, and a control panel 16. The base 12 houses a platen 22 and a fluid supply and rinse component 26. The base 12 also houses a collection bowl 28. Fluid and debris generated during grinding / polishing are collected in this collection bowl. A splash guard 36 extends upward from the base casing 18 and surrounds the bowl 28. The exemplary platen 22 is driven by a belt from a platen drive, although other techniques may be used. The platen 22 typically rotates at from 10 revolutions per minute (rpm) to about 500 rpm. In some examples, a high torque motor is used to ensure a substantially constant speed and torque of the platen 22 regardless of the applied load.

[0033] During the grinding process, it is desirable to lubricate the surface to control the generation of friction / heat and remove the ground material. During the polishing process, an abrasive and / or lubricant is applied to the polishing surface to lubricate during this process, control friction / heat, and hold a high concentration of abrasive particles. The abrasive and / or lubricant is supplied by at least one fluid supply device (shown in FIGS. 1 and 3). The fluid supply device can be incorporated into the grinding / polishing machine or can be separately mounted. In some examples, the grinding / polishing machine 10 can be configured to use a plurality of fluid supply devices in which different fluid supply devices can store and supply the same or different fluid types. Examples of fluids that can be stored and supplied include, but are not limited to, diamond suspensions, alumina (Al 2 0 3 ) suspensions, silicon carbide (SiC) suspensions, silicon dioxide (Si0 2 ) suspensions, and / or other abrasive suspensions, lubricants, etc.

[0034] FIG. 3 is a block diagram of an exemplary embodiment of the grinding / polishing machine 100 and fluid supply device 102 of FIG. 1. A tube / nozzle 110 provides fluid from a bottle 118 of the fluid supply device 102 to a platen 104 of the grinding / polishing machine 100. In some examples, the fluid supply device 102 includes a pump 108 that draws fluid from the bottle 118 and pumps this fluid through the tube / nozzle 110 into the platen 104. The pump 108 can be, for example, a peristaltic pump. A power supply 112 provides power to the system. The exemplary power supply can include a 12 volt DC transformer that is plugged into a normal 120 volt AC electrical outlet or any other desired voltage.

[0035] The exemplary grinding / polishing machine 100 of FIG. 3 includes a control switch 114 and a processor 116. The exemplary processor 116 can include a microprocessor, a microcontroller, a digital signal processor, an application-specific integrated circuit (ASIC), a programmable gate array (e.g., FPGA, etc.), and / or any other type of analog circuitry and / or digital circuitry.

[0036] Using the conventional manual operation mode of a prior art fluid supply device, the user is required to monitor the grinding / polishing machine. Untrained users may not use the abrasive fluid and / or lubricant fluid sufficiently, thereby causing damage to the surface of the grinding / polishing machine and / or spoiling the sample, or may overuse the abrasive fluid and / or lubricant fluid, thereby resulting in overuse of the fluid per sample preparation and additional costs. Using the burst operation mode of a prior art fluid supply device, the user must have accurate knowledge of the sample to be prepared, the settings of the grinding / polishing machine, and the available polishing surfaces and the fluids that can be supplied. The setup may take several minutes or may be done inaccurately, thereby potentially resulting in waste of fluid and working time. Further, the burst mode supplies fluid only at a fixed rate or frequency, for example, drip-feeding the fluid at a set rate. The composition of the sample may require a change in the fluid rate needed to properly grind and polish the sample.

[0037] FIG. 4 is a schematic diagram illustrating one operation of the grinding / polishing machine 100 of FIG. 1 and one of the plurality of fluid supply devices 102. The nozzle 402 from the fluid supply device 102 deposits an abrasive fluid and / or a lubricant fluid onto an exchangeable grinding / polishing surface 404 attached to the rotating platen 104. The abrasive fluid and / or lubricant fluid passes between the grinding / polishing surface 404 and the sample holder 106 to provide grinding and / or lubrication.

[0038] Above the rotating plate and the holder, a temperature sensor 406 such as an infrared (IR) sensor monitors the temperature of the grinding / polishing surface 404 on the platen 104. In some examples, the temperature sensor 406 includes a thermographic camera. FIG. 5A shows an exemplary grinding / polishing machine 100 of FIG. 1 with an exemplary temperature sensor 406 having a corresponding field of view 502. FIG. 5B is a more detailed view of the exemplary temperature sensor 406 and the field of view 502 shown in FIG. 5A. As shown in FIGS. 5A and 5B, the temperature sensor 406 functions as a non-contact thermometer that measures the infrared radiative heat exchange between its radiation detector and the grinding / polishing surface 404 that is its target. The temperature sensor 406 detects the wavelength of the infrared radiation emitted by the grinding / polishing surface 404 and outputs an electrical signal representing the detected temperature to the processor 116. Other contact temperature sensor technologies and / or non-contact temperature sensor technologies can also be used to implement the temperature sensor 406.

[0039] The processor 116 receives a temperature signal indicating the temperature of the grinding / polishing surface 404 from the temperature sensor 406. When the temperature signal indicates that at least one IR sensor has detected a temperature change on the grinding / polishing surface 404, the processor 116 transmits a supply signal to the fluid supply device 102 to release more abrasive fluid and / or lubricant fluid. In some examples, this supply signal causes the fluid supply device 102 to output a predetermined amount of fluid. Additionally or alternatively, the supply signal can have a variable value or magnitude that causes a corresponding amount of fluid to be output to the fluid supply device 102. For example, the higher the detected temperature, the processor 116 can output a supply signal that causes a relatively greater amount of fluid to be supplied to the fluid supply device 102. The fluid supplied generally reduces the temperature of the grinding / polishing surface.

[0040] In some examples, the processor 116 and / or the fluid supply device 102 are rate-limited to suppress the response to the elevated temperature. For example, the processor 116 can limit the number of supply signals per unit time and / or enforce a minimum time between supply signals so that the fluid can have a cooling effect.

[0041] In some examples, the temperature sensor 406 measures a reference temperature prior to the operation of the grinding / polishing machine 100 that prepares the metallurgical sample. In some examples, this reference temperature may be obtained at the start of this operation and / or immediately after the start of this operation. The reference temperature can be, for example, the temperature of the grinding / polishing surface 404 before the operation of the grinding / polishing machine 100 and / or the ambient room temperature. During operation, friction between the grinding / polishing surface 400 and the sample causes frictional heat. The temperature sensor 406 measures the temperature of the grinding / polishing surface 404 at one or more locations. The temperature sensor 406 can be configured to generate a temperature signal, for example, at a rate of every 10 milliseconds of the mechanical operation of the grinding / polishing machine, although this rate can be faster or slower. The temperature signal transmitted from the temperature sensor 406 to the processor 116 can be, for example, the measured temperature and / or the difference between the measured temperature and the reference temperature. The target temperature range of the sample preparation cycle depends on the sample type and the grinding / polishing surface.

[0042] The exemplary processor 116 transmits a supply signal when the temperature signal (e.g., indicating the measured temperature of the grinding / polishing surface) is greater than a predetermined threshold (e.g., but not limited to, a temperature 2°C to 5°C higher than the reference temperature). A certain temperature change is allowed and expected during grinding / polishing, but a rapid temperature change can damage the surface 404 and / or the sample. Accordingly, the processor 116 transmits a supply signal to the fluid supply device 102 based on either the measured temperature from the temperature sensor 406 or the rate of temperature change.

[0043] Additionally or alternatively, the processor 116 transmits a supply signal to the fluid supply device 102 based on the rate of change of the temperature signal and a predetermined threshold. For example, the processor 116 can detect a temperature increase exceeding 0.5°C per second and respond thereto by outputting a supply signal. Other rates of temperature change, such as a rate of temperature change exceeding 1°C every 10 seconds (i.e., 0.1°C per second), can also be used to trigger the processor 116 and output a supply signal.

[0044] In some examples, the processor 116 determines a temperature range along the grinding / polishing surface based on the temperature signal from the temperature sensor 406. If this temperature range is greater than a predetermined threshold, such as a 5°C variation along the surface, the processor 116 transmits a supply signal.

[0045] In the examples of FIGS. 5A and 5B, the temperature sensor 406 is positioned above the grinding / polishing surface 404. In some examples, the temperature sensor 406 is attached to the head of the grinding / polishing machine 100. In some examples, the temperature sensor 406 is attached to a separate temperature sensing arm extending from either the base or the head of the grinding / polishing machine 100. In the examples shown in FIGS. 5A and 5B, the temperature sensor 406 includes eight IR sensors. These IR sensors are arranged in a row and are directed towards the platen 104 and the grinding / polishing surface 404. The platen 104 can have, for example, a diameter between 10 inches and 16 inches, but is not limited thereto. The exemplary IR sensors monitor the half-diameter line of the platen 104 and / or the surface 404. Since the platen 104 rotates during the mechanical operation of the grinding / polishing machine, substantially all of the surface of the surface 404 and / or the platen 104 is monitored by the temperature sensor 406 with each rotation.

[0046] Various configurations of the IR sensors within the temperature sensor 406 are possible. Non-contact temperature sensors (i.e., IR sensors) use lenses to achieve their sensitivity characteristics across the object field of view. In some examples, maximum sensitivity is available across half of the lens field of view. For example, the IR sensors of FIGS. 5A and 5B achieve sensitivity characteristics across the object field of view by using silicon lenses and have a field of view (FOV) designated as the area angle of 50% of the highest sensitivity.

[0047] In FIG. 5B, the temperature sensor 406 is approximately 7 to 8 inches above the platen 104 of the grinder / polisher 100. Eight IR sensors detect the temperature in a 1 square inch portion of the platen 104. Depending on the number of IR sensors and / or the diameter of the platen 104, different heights of the temperature sensor 406 may be used. The grinder / polisher 100 can use interchangeable platens 104 of various sizes. In some examples, the temperature sensor 406 has an adjustable height such that it is refocused based on the size of the platen 104 with which the IR sensors are used with the grinder / polisher 100. The height of the temperature sensor 406 can be adjusted, for example, by the movement of a temperature sensing arm along a portion of the grinder / polisher 100 or by the sliding of the temperature sensor 406. In some examples, the positioning of at least one IR sensor within the temperature sensor 406 is adjusted. The positioning of at least one IR sensor can be adjusted, for example, by changing the angle or orientation of this at least one IR sensor.

[0048] The temperature sensor 406 is connected to the exemplary processor 116, for example, by USB, RS-232 serial, Profibus, Ethernet®, and / or any other communication interface. The temperature signal transmitted to the processor 116 by the temperature sensor 406 is based on the temperature measurements of the eight IR sensors. In one embodiment, the processor 116 is a separate circuit board dedicated to the infrared monitoring and control of the fluid supply device 102. This separate circuit board can be disposed, for example, on the head of the grinder / polisher 100, the temperature sensing arm, or the fluid supply device 102.

[0049] FIG. 6 is a graph 600 of test results 602, 604, 606 comparing the platen temperature using the disclosed example of fluid supply technique with the platen temperature using prior art techniques. To obtain test results 602 - 606, similar sample collections were placed in a sample holder for grinding / polishing. Over a 100 - second machine operation for each fluid supply technique, the changes in the temperature and amount of the fluid used were tracked. The right - hand image was taken by a thermographic camera during the test to inspect the process. The high - temperature areas on the grinding / polishing surface indicate insufficient lubrication during sample preparation in the grinder / polisher.

[0050] Fluid supply in burst mode (shown as result 602) where the supply was made at pre - set intervals used 38 mL of abrasive fluid and / or lubricant fluid and allowed for a change in the maximum temperature on the grinding / polishing surface of approximately 6 °C. Fluid supply in manual mode (shown as result 604) where the fluid supply was controlled by the user used approximately 20 mL of abrasive fluid and / or lubricant fluid and allowed for a change in the maximum temperature of approximately 4 °C. Fluid supply in IR monitoring mode (shown as result 606) performed in accordance with aspects of the present disclosure used 13 mL of abrasive fluid and / or lubricant fluid and allowed for a change in the maximum temperature of approximately 3 °C. At least one infrared sensor, which is a temperature sensor, monitored the temperature of the grinding / polishing surface to control the fluid supply device. The IR monitoring disclosed above achieved a lower maximum temperature on the grinding / polishing surface after 100 seconds of use while using less abrasive fluid and / or lubricant fluid.

[0051] FIG. 7 is a flowchart representing an exemplary method 700 of controlling the exemplary fluid supply device 102 of FIG. 1 to supply fluid to the grinder / polisher 100. The exemplary method 700 can be executed by executing machine-readable instructions stored on a non-transitory machine-readable medium by the processor 116 and the temperature sensor 406 and / or, more generally, by the grinder / polisher 100. Multiple portions of the exemplary method 700 can be executed simultaneously, in parallel, or in an order different from the illustrated sequential execution method. The method 700 can also be executed using fewer steps than shown in the illustrated embodiments.

[0052] The method 700 is used to control the fluid supply during operation of the grinder / polisher. In block 702, the temperature sensor 406 measures the surface temperature of the grinding / polishing surface 404. A signal indicating the temperature of the grinding / polishing surface 404 is transmitted by the temperature sensor 406 to the processor 116. In some examples, the temperature signal transmitted to the processor 116 is the highest temperature among a plurality of temperatures detected substantially simultaneously by the temperature sensor 406.

[0053] In block 704, the processor 116 determines whether the surface temperature meets a threshold temperature. In some examples, when the measured temperature of the grinding / polishing surface 400 is greater than a predetermined threshold, the processor 116 transmits a supply signal. The predetermined threshold can be, for example, a value 2°C to 5°C higher than a reference temperature. The reference temperature can be the temperature of the grinding / polishing surface 404 before operation of the grinder / polisher 100 or the ambient room temperature. The various surfaces used with the grinder / polisher 100 can have different predetermined thresholds used with the fluid supply device 102.

[0054] In some examples, the processor 116 is coupled to a memory storing predetermined thresholds for a plurality of surfaces. The user can select the grinding / polishing surface to be used and the type of sample to be prepared via a user interface (e.g., the control panel 16 of FIG. 2) on the grinding / polishing machine 100 or the fluid supply device 102. The selection of the surface and sample type by the user changes the predetermined threshold (e.g., the temperature change from the ambient temperature) used by the processor 116 for comparing temperature signals and determining whether to send a supply signal to the fluid supply device 102.

[0055] In some examples, the processor 116 determines whether the rate of change of temperature is greater than a predetermined threshold (e.g., but not limited to 0.5 °C per second) to determine whether to send a supply signal to the fluid supply device 102. In some examples, the processor 116 determines a temperature range along the grinding / polishing surface based on the temperature signal from the temperature sensor. If the temperature range is greater than a predetermined threshold (e.g., but not limited to a 5 °C variation along the surface), the processor 116 sends a supply signal to the fluid supply device.

[0056] Accordingly, in block 704, the processor 116 compares the temperature signal from the temperature sensor 406 with a predetermined threshold regarding temperature. In some examples, the processor 116 refers to one of a plurality of predetermined thresholds stored in a memory or a look-up table. In other embodiments, two or more predetermined thresholds are used to determine whether to send a supply signal to the fluid supply device.

[0057] If the surface temperature meets the threshold temperature (block 704), then at block 706, the processor 116 controls the fluid supply device 102 to supply fluid to the surface. In some examples, the processor 116 selects one or more fluid supply devices 102 to supply fluid and transmits a supply signal to the selected supply device 102. For example, if it is determined that the temperature change is above a predetermined threshold, the processor 116 transmits a supply signal. The fluid supply device 102 receives the supply signal and discharges abrasive fluid and / or lubricant fluid onto the grinding / polishing surface 404. The fluid supply device 102 activates an actuator such as a pump, siphon, or air source connected to at least one fluid reservoir to push the fluid / slurry out through the nozzle. The nozzle is directed towards the direction of the rotating grinding / polishing surface 404.

[0058] In some examples, when the fluid supply device 102 receives a supply signal from the processor 116, it discharges a pre-set amount of abrasive fluid and / or lubricant fluid. The pre-set amount can be stored in the memory, and the user can select the pre-set fluid amount using a user interface (e.g., the control panel 16 in FIG. 2). A subsequent supply signal from the processor 116 is required for the fluid supply device 102 to discharge the next fluid of the pre-set amount. In some examples, the fluid supply device 102 discharges abrasive fluid and / or lubricant fluid until the processor 116 determines that the temperature signal from the temperature sensor is less than a predetermined threshold.

[0059] The exemplary fluid supply device 102 can be incorporated into the grinding / polishing machine or can be a separate device. In some examples, multiple fluid supply devices 102 are used with one grinding / polishing machine 100, and each fluid supply device 102 contains a different fluid type. The term "fluid" includes various diamond suspensions, alumina (Al 2 0 3 ) suspensions, silicon carbide (SiC) suspensions, silicon dioxide (Si0 2)It includes a suspension, and / or other abrasive suspensions, lubricants, etc., but is not limited thereto. Several fluids and surfaces may be used during the preparation of one sample.

[0060] After supplying the fluid (block 706), or when the temperature signal does not meet the threshold (block 704), the control returns to block 702, and the temperature sensor 406 continues to monitor the temperature of the grinding / polishing surface and transmit the temperature signal to the processor 116. Thus, the method 700 can continuously monitor the temperature of the grinding / polishing surface during the operation of the grinding / polishing machine 100 and supply the fluid based on the monitored temperature.

[0061] Although the present device, system and / or method have been described with reference to certain specific embodiments, those skilled in the art will understand that various changes can be made and equivalents can be substituted without departing from the scope of the present device, system and / or method. In addition, many modifications can be made to adapt the teachings of the present disclosure to specific situations or materials without departing from the scope of the present disclosure. Therefore, the present device, system and / or method are not limited to the specific embodiments disclosed, and the present device, system and / or method are intended to include all embodiments falling within the scope of the appended claims. Some aspects of the present invention are described below. [Aspect 1] A fluid supply device, A fluid reservoir for storing the fluid, A nozzle for supplying the fluid onto the grinding / polishing surface, A fluid supply device comprising: A temperature sensor that outputs a temperature signal indicating the temperature of the grinding / polishing surface during a grinding operation or a polishing operation, A processor, Comparing the temperature signal with a threshold, Transmitting a supply signal to the fluid supply device when the temperature signal meets the threshold, And a processor that performs the above, A system for supplying fluid to a grinding / polishing machine that supplies the fluid in response to the supply signal. [Aspect 2] The system according to Aspect 1, wherein the temperature sensor includes a non-contact temperature sensor. [Aspect 3] The system according to Aspect 2, wherein the non-contact temperature sensor is at least one of an infrared sensor or a thermographic camera. [Aspect 4] The system according to Aspect 1, wherein the temperature sensor measures the temperature of the grinding / polishing surface at a plurality of locations on the grinding / polishing surface. [Aspect 5] The system according to Aspect 4, wherein the temperature sensor outputs the temperature signal representing the highest temperature among the temperatures measured simultaneously at the plurality of locations. [Aspect 6] The system according to Aspect 4, wherein the temperature sensor outputs the temperature signal representing the average temperature of the plurality of locations. [Aspect 7] The system according to Aspect 1, wherein the fluid supply device outputs a predetermined amount of the fluid in response to the supply signal. [Aspect 8] The system according to Aspect 1, wherein the fluid supply device outputs an amount of the fluid based on the value of the supply signal. [Aspect 9] The system according to Aspect 1, wherein the processor compares the change in the temperature with a threshold change and outputs the supply signal in response to the change in the temperature satisfying the threshold change. [Aspect 10] The system according to Aspect 1, wherein the fluid supply device includes a plurality of fluid reservoirs, and the fluid supply device supplies the fluid based on at least one of the type of the grinding operation or the polishing operation, the material of the grinding / polishing surface, or the material of the sample prepared through the grinding / polishing surface. [Aspect 11] The system according to Aspect 1, wherein the processor determines the threshold based on a reference temperature. [Aspect 12] The system according to aspect 11, wherein the reference temperature includes the temperature of the grinding / polishing surface measured before the grinding operation or the polishing operation or in response to the start of the grinding operation or the polishing operation. [Aspect 13] A platen for grinding or polishing a material sample, A fluid supply device, A fluid reservoir for storing the fluid, A nozzle for supplying the fluid onto the grinding / polishing surface of the platen, A fluid supply device comprising: A temperature sensor that outputs a temperature signal indicating the temperature of the grinding / polishing surface, A processor, Comparing the temperature signal with a threshold value, Transmitting a supply signal to the fluid supply device when the temperature signal is equal to or higher than a predetermined threshold value, A grinding machine / polishing machine comprising a processor that performs the above operations. [Aspect 14] The grinding machine / polishing machine according to aspect 13, wherein the temperature sensor includes a non-contact temperature sensor. [Aspect 15] The grinding machine / polishing machine according to aspect 14, wherein the non-contact temperature sensor is at least one of an infrared sensor or a thermographic camera. [Aspect 16] The grinding machine / polishing machine according to aspect 13, wherein the temperature sensor measures the temperature of the grinding / polishing surface at a plurality of locations on the grinding / polishing surface. [Aspect 17] The grinding machine / polishing machine according to aspect 13, wherein the processor determines the threshold value based on a reference temperature. [Aspect 18] The grinding machine / polishing machine according to aspect 17, wherein the reference temperature includes the temperature of the grinding / polishing surface measured before the grinding operation or the polishing operation. [Aspect 19] The grinding machine / polishing machine according to aspect 13, wherein the processor compares the change in temperature with a threshold change and outputs the supply signal in response to the change in temperature satisfying the threshold change. [Aspect 20] A method for controlling a fluid supply device, comprising: monitoring the temperature of a grinding / polishing surface using a temperature sensor; comparing the temperature with a threshold temperature in a control unit; when the temperature signal is equal to or higher than a predetermined threshold, transmitting a supply signal from the control unit to the fluid supply device; signal and supplying fluid onto the grinding / polishing surface using a nozzle connected to at least one fluid reservoir of the fluid supply device.

Description of reference numerals

[0062] 10 Grinding machine 12 Base 14 Head 16 Control panel 18 Casing 22 Platen 28 Collection bowl 28 Bowl 36 Splash guard 100 Grinding machine 102 Fluid supply device 104 Platen 106 Sample holder 108 Pump 110 Nozzle 112 Power supply device 114 Control switch 116 Processor 118 Bottle 400 Grinding surface 402 Nozzle 404 Grinding surface 406 Temperature sensor 502 Field of view 600 Graph 602 Test results 603 Test results 604 Test results 605 Test results 606 Test results​

Claims

1. A system for supplying fluid to a grinding machine / polishing machine, comprising: A fluid supply device, comprising: A fluid reservoir for storing the fluid; A nozzle for supplying the fluid onto a grinding / polishing surface; A fluid supply device; A temperature sensor that outputs a temperature signal indicating the temperature of the grinding / polishing surface during a grinding operation or a polishing operation; A processor configured to: Compare the temperature signal with a threshold value; Transmit a supply signal to the fluid supply device when the temperature signal is greater than or equal to the threshold value; A processor; And wherein: The processor determines the threshold value based on a reference temperature including the temperature of the grinding / polishing surface measured before a grinding operation or a polishing operation, or in response to the start of the grinding operation or the polishing operation; The fluid supply device is configured to supply the fluid in response to the supply signal. A system.

2. The system according to claim 1, wherein the temperature sensor includes a non-contact temperature sensor.

3. The system according to claim 2, wherein the non-contact temperature sensor is at least one of an infrared sensor or a thermographic camera.

4. The system according to claim 1, wherein the temperature sensor is configured to measure the temperature of the grinding / polishing surface at a plurality of locations on the grinding / polishing surface.

5. The system according to claim 4, wherein the temperature sensor is configured to output the temperature signal representing the highest temperature among the temperatures measured simultaneously at the plurality of locations.

6. The system according to claim 4, wherein the temperature sensor is configured to output the temperature signal representing the average temperature of the plurality of locations.

7. The system according to claim 1, wherein the fluid supply device is configured to output a predetermined amount of the fluid in response to the supply signal.

8. The system according to claim 1, wherein the fluid supply device is configured to output an amount of the fluid based on the value of the supply signal.

9. The system according to claim 1, wherein the processor is configured to compare a rate of change of the temperature with a predetermined rate-of-change threshold value, and output the supply signal when the rate of change of the temperature exceeds the rate-of-change threshold value.

10. The fluid supply device includes a plurality of fluid reservoirs, and the fluid supply device is configured to supply the fluid based on at least one of the type of grinding operation or polishing operation, the material of the grinding / polishing surface, or the material of the sample prepared through the grinding / polishing surface. The system according to claim 1.

11. A grinding machine / polishing machine, A platen configured to perform grinding or polishing on a material sample, A fluid supply device, A fluid reservoir for storing the fluid, A nozzle configured to supply the fluid onto the grinding / polishing surface of the platen, A fluid supply device comprising, A temperature sensor configured to output a temperature signal indicating the temperature of the grinding / polishing surface, A processor, Before a grinding operation or a polishing operation, or based on a reference temperature including the temperature of the grinding / polishing surface measured in response to the start of the grinding operation or the polishing operation, determining a threshold value, Comparing the temperature signal with the threshold value, When the temperature signal is equal to or greater than the threshold value, transmitting a supply signal to the fluid supply device, A processor configured to perform, A grinding machine / polishing machine comprising.

12. The grinding machine / polishing machine according to claim 11, wherein the temperature sensor includes a non-contact temperature sensor.

13. The grinding machine / polishing machine according to claim 12, wherein the non-contact temperature sensor is at least one of an infrared sensor or a thermographic camera.

14. The grinding machine / polishing machine according to claim 11, wherein the temperature sensor is configured to measure the temperature of the grinding / polishing surface at a plurality of locations on the grinding / polishing surface.

15. The grinding machine / polishing machine according to claim 11, wherein the reference temperature includes the temperature of the grinding / polishing surface measured before a grinding operation or a polishing operation.

16. The grinding machine / polishing machine according to claim 11, wherein the processor is configured to compare the rate of change of the temperature with a predetermined rate-of-change threshold value and output the supply signal when the rate of change of the temperature exceeds the rate-of-change threshold value.

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