Exposure apparatus, method of manufacturing an article, and exposure method

Abstract

To provide an exposure apparatus that can perform exposure processing to a substrate so as to reduce a defective region.SOLUTION: An exposure apparatus according to the present invention projects a pattern image of an original plate onto a substrate, and exposes the substrate, and comprises: a projection optical system which projects an image onto a substrate surface of the substrate by guiding exposure light having passed through the original plate to the substrate; an original plate stage which, in exposing a prescribed shot region on the substrate surface, scans and moves the original plate in a first direction parallel with the substrate surface while holding the plate; a substrate stage which, in exposing the prescribed shot region, scans and moves the substrate in the first direction while holding the substrate; a light shielding part which shields a part of exposure light guided to the substrate; and a control part which, when exposure of the prescribed shot region is interrupted, performs a resumption step of resuming exposure of the prescribed shot region while controlling the light shielding part such that exposure light is not guided to a normal exposure region in the prescribed shot region.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present invention relates to an exposure apparatus, a method for manufacturing an article, and an exposure method.

Background Art

[0002] Conventionally, when performing an exposure process on a predetermined shot area so as to transfer a pattern formed on a reticle to the predetermined shot area in an exposure apparatus, the exposure process may be interrupted due to occurrence of a predetermined abnormality. Patent Document 1 discloses an exposure apparatus that, when the exposure process is interrupted due to an abnormality occurring in the driving of a reticle stage that holds a reticle or a substrate stage that holds a substrate, moves each position to the position at a time before the time when the abnormality occurred and resumes the exposure process.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the exposure apparatus disclosed in Patent Document 1, when the exposure process for a predetermined shot area is interrupted due to occurrence of a predetermined abnormality, after returning the positions of the reticle stage and the substrate stage to the positions at a time before the time when the predetermined abnormality occurred, the exposure process is resumed. In this case, by resuming the exposure process on the predetermined shot area, the area where exposure was performed between the previous time and the time when the abnormality occurred is exposed again, so that the area becomes a defective area where double exposure is performed.

[0005] Therefore, an object of the present invention is to provide an exposure apparatus capable of performing an exposure process on a substrate so as to reduce a defective area.

Means for Solving the Problem

[0006] The exposure apparatus according to the present invention is an exposure apparatus that projects an image of a pattern on a reticle onto a substrate and exposes the substrate, and includes a projection optical system that projects an image onto the substrate surface of the substrate by guiding exposure light that has passed through the reticle to the substrate, a reticle stage that scans and moves in a first direction parallel to the substrate surface while holding the reticle when exposing a predetermined shot area on the substrate surface, a substrate stage that scans and moves in the first direction while holding the substrate when exposing a predetermined shot area, a light shielding unit that shields a part of the exposure light guided to the substrate, and a control unit that performs a restart process of restarting the exposure of a predetermined shot area while controlling the light shielding unit so that the exposure light is not guided to a normal exposure area in the predetermined shot area when the exposure of the predetermined shot area is interrupted.

Effect of the Invention

[0007] According to the present invention, it is possible to provide an exposure apparatus capable of performing an exposure process on a substrate so as to reduce a defective area.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Embodiment for Carrying Out the Invention

[0009] Hereinafter, the exposure apparatus according to the present embodiment will be described in detail with reference to the accompanying drawings. Note that the drawings shown below may be drawn at scales different from the actual ones in order to facilitate understanding of the present embodiment. Also, a direction parallel to the optical axis of the projection optical system 9 (a direction perpendicular to the substrate surface of the substrate 11) is defined as the Z direction.

[0010] Also, in a plane parallel to the substrate surface of the substrate 11, a direction in which the substrate 11 is scanned is defined as the Y direction (the first direction), and a non-scanning direction perpendicular to the Z direction and the Y direction is defined as the X direction (the second direction). Also, rotational directions around the Z direction, the X direction, and the Y direction are defined as the θ direction, the Pitch direction, and the Roll direction, respectively.

[0011] Conventionally, when manufacturing a flat panel display (FPD), a semiconductor device, or the like, in an exposure apparatus, an exposure process is performed in which a pattern formed on a reticle is transferred onto a substrate while the reticle and the substrate are scanned and moved synchronously with each other. When such an exposure process is being performed in an exposure apparatus, for example, due to occurrence of a predetermined abnormality including an abnormality regarding focus, an abnormality in a drive mechanism of a reticle stage that holds the reticle, or a substrate stage that holds the substrate, the exposure process may be interrupted.

[0012] Then, for a substrate on which the exposure process has been interrupted in the exposure apparatus, for example, by performing rework, it becomes unnecessary to handle the substrate as a defective substrate. On the other hand, depending on the product manufactured through the exposure process, there may be a case where the exposure process is performed on a layer on which it is impossible to perform rework on the substrate.

[0013] Conventionally, a method of resuming the exposure process when the exposure process for a layer on which it is impossible to perform rework on the substrate is interrupted is known. For example, each substrate is identified so as to classify a plurality of substrates stored in a cassette into a substrate that has been subjected to an exposure process and a substrate that has not been subjected to an exposure process, and an exposure process is sequentially performed only on the identified substrate that has not been subjected to the exposure process. This method is known.

[0014] On the other hand, when an exposure process is interrupted due to a predetermined abnormality occurring during the exposure process for a plurality of shot areas on a substrate, problems may occur if the next process is entered without performing rework on the plurality of shot areas. That is, a problem occurs in that a shot area where exposure has been performed in a state where a predetermined abnormality has occurred among a plurality of shot areas and a shot area where exposure has not yet been performed are treated as defective shot areas.

[0015] Therefore, conventionally, when an exposure process for a plurality of shot areas on a substrate is interrupted due to an abnormality in focus, a method of resuming the exposure process for the plurality of shot areas by continuously measuring the focus is known. However, in such a method, a problem occurs in that a shot area where exposure has already been performed is exposed again, that is, double exposure is performed. In addition, in this method, it is difficult to resume the exposure process when the exposure process for a plurality of shot areas is interrupted due to a predetermined abnormality other than the focus abnormality.

[0016] Conventionally, when an exposure process for transferring a pattern formed on a reticle to a substrate is interrupted due to an abnormality in the drive of the reticle stage that holds the reticle or the substrate stage that holds the substrate, a method of resuming the exposure process for the substrate is known. Specifically, in this method, the positions of the reticle stage and the substrate stage at the time when the abnormality occurs and data indicating the time change of the positions of the reticle stage and the substrate stage are referred to.

[0017] When restarting the exposure process, the positions of the reticle stage and the substrate stage are each moved to the positions they were in at a time before the time when the abnormality occurred. However, in such a method, there is a problem that the shot area where exposure has already been performed is exposed again, that is, double exposure is performed.

[0018] As described above, in a conventional exposure apparatus, when restarting the exposure process for a substrate after the exposure process for the substrate has been interrupted due to the occurrence of a predetermined abnormality, the shot area where exposure has already been performed is exposed again, that is, a problem of double exposure occurs. Therefore, an object of the present embodiment is to provide an exposure apparatus capable of performing an exposure process on a substrate so as to reduce a defective area including an area where double exposure is performed and an area where no exposure is performed.

[0019] FIGS. 1(a) and (b) respectively show a schematic XZ cross-sectional internal projection view and a schematic YZ cross-sectional internal projection view of the exposure apparatus 50 according to the present embodiment. The exposure apparatus 50 according to the present embodiment is a photolithography apparatus used in a photolithography process when manufacturing a flat panel display (FPD), a semiconductor device, or the like. That is, in the exposure apparatus 50 according to the present embodiment, an image of the pattern of the reticle 5 is projected onto the substrate 11, and the substrate 11 is configured to be exposed.

[0020] Specifically, the exposure apparatus 50 according to the present embodiment includes an illumination optical system 1, an alignment measurement unit 4, a reticle stage 6, laser interferometers 7a and 7b, a Y light shield 8a (light shielding portion), and an X light shield 8b (light shielding portion). The exposure apparatus 50 according to the present embodiment further includes a projection optical system 9, a focus measurement unit 10, a substrate stage 12, and a control unit 13.

[0021] The illumination optical system 1 includes an exposure light source (light source) such as a mercury lamp or an LED lamp (not shown), a wavelength selection filter and a lens group, an exposure shutter 2 (shutter member), and a slit 3. And the illumination optical system 1 is configured to emit exposure light having a wavelength suitable for exposing the substrate 11 toward the reticle 5. Specifically, in the illumination optical system 1, by opening the exposure shutter 2, the exposure light emitted from the exposure light source passes through, and the exposure light is irradiated toward the reticle 5.

[0022] In the exposure apparatus 50 according to the present embodiment, by using the exposure shutter 2 provided in the illumination optical system 1 to block the exposure light emitted from the exposure light source, it is possible to interrupt the exposure of the substrate 11 without turning off the exposure light source. And the exposure light emitted from the exposure light source in the illumination optical system 1 is shaped by being cut out by the slit 3 and then irradiated onto the reticle 5.

[0023] The alignment measurement unit 4 has a focus adjustment mechanism and is configured to measure the positions of the marks formed on the reticle surface of the reticle 5 and the substrate surface of the substrate 11 in the XY plane. Specifically, the alignment measurement unit 4 is driven in the XY plane by a driving mechanism (not shown), and in combination with the drive control of the reticle stage 6 and the substrate stage 12, the positions of the marks on the reticle 5 and the substrate 11 in the XY plane can be measured.

[0024] The reticle stage 6 is configured to be movable in the Y direction while holding the reticle 5 so as to adjust the irradiation position of the exposure light from the illumination optical system 1 on the reticle surface of the reticle 5 by a driving mechanism (not shown). And a reflecting surface is provided on the reticle stage 6, the measurement light emitted from the laser interferometer 7a is reflected by the reflecting surface, and the position of the reticle stage 6 is constantly monitored by the laser interferometer 7a receiving the reflected measurement light.

[0025] The Y light shield 8a is formed of two light shields spaced apart from each other so as to face each other in the Y direction, and blocks a part of the exposure light that has passed through the reticle stage 6 so as to adjust the illumination range in the Y direction on the substrate surface of the substrate 11. Specifically, the Y light shield 8a has a drive mechanism, and by moving in the Y direction by the drive mechanism, the projection range in the Y direction of the image of the pattern on the original plate 5 on the substrate surface of the substrate 11 is adjusted. In the exposure apparatus 50 according to the present embodiment, the Y light shield 8a is disposed between the original plate stage 6 and the projection optical system 9 in the Z direction.

[0026] The projection optical system 9 includes lenses, mirrors, etc. including a magnification correction unit. Then, the projection optical system 9 is configured to project the image of the pattern formed on the original plate 5 onto the substrate surface of the substrate 11 by guiding the exposure light that has passed through the original plate 5 held by the original plate stage 6 to the substrate 11 held by the substrate stage 12. By moving the lenses and mirrors provided in the projection optical system 9 in the Z direction, Pitch direction, and Roll direction by a drive mechanism (not shown), the image of the pattern can be projected onto the substrate surface of the substrate 11 while generating an arbitrary magnification, shift, and focus.

[0027] The projection optical system 9 provided in the exposure apparatus 50 according to the present embodiment is an equi-magnification imaging optical system that projects the image of the pattern formed on the original plate 5 onto the substrate surface of the substrate 11 at an equal magnification. However, it is not limited to this, and an enlarged imaging optical system that enlarges and projects the image of the pattern onto the substrate surface of the substrate 11 or a reduced imaging optical system that reduces and projects it may be used. Also, the projection optical system 9 may be a mirror projection system using a huge mirror, or may be a multi-lens system using a plurality of lenses.

[0028] The X light shield 8b is formed of two light shields spaced apart so as to face each other in the X direction, and blocks a part of the exposure light that has passed through the projection optical system 9 so as to adjust the illumination range in the X direction on the substrate surface of the substrate 11. Specifically, the X light-shielding plate 8b has a drive mechanism, and by moving in the X direction by the drive mechanism, the projection range in the X direction of the image of the pattern of the original plate 5 on the substrate surface of the substrate 11 is adjusted. In the exposure apparatus 50 according to the present embodiment, the X light-shielding plate 8b is disposed between the projection optical system 9 and the substrate stage 12 in the Z direction.

[0029] The focus measurement unit 10 measures the positions in the Z direction, Pitch direction, and Roll direction of the substrate surface of the substrate 11 by using a plurality of units that emit measurement light toward the substrate surface of the substrate 11 and receive the reflected light reflected by the substrate surface. The substrate stage 12 is configured to be movable in the X direction, Y direction, Z direction, θ direction, Pitch direction, and Roll direction while holding the substrate 11 so as to adjust the irradiation position of the exposure light on the substrate surface of the substrate 11 by a drive mechanism (not shown). A reflecting surface is provided on the substrate stage 12, and the measurement light emitted from the laser interferometer 7b is reflected by the reflecting surface, and the position of the substrate stage 12 is constantly monitored by the laser interferometer 7b receiving the reflected measurement light.

[0030] The control unit 13 is configured to control each drive mechanism provided in the exposure apparatus 50 according to the present embodiment. For example, the control unit 13 performs alignment between the original plate 5 and the substrate 11 based on the measurement results of the positions of the marks formed on the original plate surface of the original plate 5 and the substrate surface of the substrate 11 by the alignment measurement unit 4. Then, the control unit 13 can accurately control the synchronous drive between the two by controlling the driving of the original plate stage 6 and the substrate stage 12 according to the result of the alignment.

[0031] In the exposure apparatus 50 according to the present embodiment, the original plate 5 held by the original plate stage 6 and the substrate 11 held by the substrate stage 12 are disposed at positions optically conjugate to each other with respect to the projection optical system 9. Then, while synchronously scanning and moving the original stage 6 and the substrate stage 12 with respect to each other, an image of the pattern formed on the original surface of the original 5 is projected onto the substrate surface of the substrate 11 through the projection optical system 9.

[0032] The pattern formed on the original surface of the original 5 used in the exposure apparatus 50 according to the present embodiment corresponds to the pattern formed on a single layer among the laminated structures when manufacturing an FPD, a semiconductor device, or the like by a photolithography process. Specifically, in the exposure apparatus 50 according to the present embodiment, an image of the pattern is projected onto the substrate surface of the substrate 11 coated with the photosensitive material, whereby a latent image of the pattern of the original 5 is formed on the substrate surface. Then, by performing a development process on the latent image formed on the substrate surface of the substrate 11, it is converted into a physical resist pattern.

[0033] Next, specific control of the exposure process for the substrate 11 in the exposure apparatus 50 according to the present embodiment will be described. FIG. 2 is a flowchart showing the exposure process for the substrate 11 in the exposure apparatus 50 according to the present embodiment. Each step in the flowchart is controlled by the control unit 13.

[0034] In the exposure apparatus 50 according to the present embodiment, the original 5 and the substrate 11 as shown in FIGS. 3(a) and 3(b) are used. Specifically, FIG. 3(a) shows a schematic top view of the original 5. On the original surface of the original 5, a plurality of, specifically 16 panels 21 are provided in a 4×4 grid pattern, and patterns are formed on each of them. That is, in the original 5, four panels 21 are arranged along the Y direction, and four panels 21 are arranged along the X direction.

[0035] The plurality of panels 21 can be defined, for example, as regions where the same pattern is formed with respect to each other within the shot region. In addition, the plurality of panels 21 is not limited to this and may be determined based on, for example, panel layout information input by a user.

[0036] Further, FIG. 3(b) shows a schematic top view of the substrate 11, and a plurality of, specifically, shot regions 20a, 20b, 20c, and 20d are provided on the substrate surface of the substrate 11 in a 2×2 grid pattern. Then, 16 panels 21 formed on the original plate surface of the original plate 5 are transferred in each of the shot regions 20a, 20b, 20c, and 20d.

[0037] Note that the number and layout of the panels 21 provided on the original plate surface of the original plate 5, and the number and layout of the shot regions provided on the substrate surface of the substrate 11 are not limited to the above. The control in the exposure apparatus 50 according to the present embodiment is effective when performing an exposure process of transferring a plurality of panels 21 arranged in two or more in the Y direction in each shot region.

[0038] As shown in FIG. 2, when the exposure process is started in the exposure apparatus 50 according to the present embodiment, first, scanning exposure is started for a predetermined shot region (step S101). Specifically, in step S101, exposure light from the exposure light source in the illumination optical system 1 is cut out by the slit 3, passes through the original plate 5 and the projection optical system 9, and then is irradiated onto the predetermined shot region of the substrate 11.

[0039] Then, based on the alignment result between the original plate 5 and the substrate 11 performed in advance, the original plate stage 6 and the substrate stage 12 are driven in synchronization with each other in the Y direction, so that scanning exposure is performed on a predetermined shot region of the substrate 11. Also in step S101, by driving the Y light shielding plate 8a and the X light shielding plate 8b, a part of the exposure light emitted from the illumination optical system 1 is shielded so that the exposure light is not irradiated onto a predetermined illumination region on the original plate surface of the original plate 5 and a region other than the predetermined shot region on the substrate surface of the substrate 11.

[0040] Next, it is determined whether or not a predetermined abnormality has been detected in the exposure apparatus 50 according to the present embodiment (step S102, determination step). The predetermined abnormality referred to here includes, for example, an error in the scanning movement of at least one of the reticle stage 6 and the substrate stage 12, an unexpected extinguishing of the exposure light source provided in the illumination optical system 1, an unexpected closing of the exposure shutter 2 provided in the illumination optical system 1, and the like. If no predetermined abnormality has been detected in the exposure apparatus 50 according to the present embodiment (Yes in step S102), it is determined whether or not the scanning exposure of the substrate 11 with respect to a predetermined shot area has been completed (step S103).

[0041] If the scanning exposure of the substrate 11 with respect to a predetermined shot area has not been completed (No in step S103), the process returns to step S102 and the scanning exposure of the predetermined shot area is continued. On the other hand, if the scanning exposure of the substrate 11 with respect to a predetermined shot area has been completed (Yes in step S103), it is determined whether or not the scanning exposure of the substrate 11 with respect to all shot areas has been completed (step S104).

[0042] If the scanning exposure of the substrate 11 with respect to all shot areas has been completed (Yes in step S104), the exposure process for the substrate 11 is terminated. On the other hand, if the scanning exposure of the substrate 11 with respect to all shot areas has not been completed (No in step S104), the reticle stage 6 and the substrate stage 12 are moved so as to perform the scanning exposure on the next shot area where the scanning exposure has not been performed yet. Then, the scanning exposure is started on the next shot area (step S105), and the process returns to step S102.

[0043] When performing the exposure process on the substrate 11 as shown in FIG. 3(b) in the exposure apparatus 50 according to the present embodiment, for example, the scanning exposure can be performed in the order of the shot areas 20a, 20b, 20c, and 20d. However, the order of the shot areas where scanning exposure is performed on the substrate 11 is not limited to this, and can be arbitrarily set by the control unit 13.

[0044] Also, regarding the scanning direction when performing scanning exposure on each of the shot areas 20a to 20d on the substrate 11, that is, whether to scan in the positive direction of the Y-axis or in the negative direction of the Y-axis, it can also be arbitrarily set by the control unit 13. In addition, in the exposure apparatus 50 according to the present embodiment, although scanning exposure is performed in the Y direction for each shot area, it is not limited to this, and scanning exposure may be performed in the X direction.

[0045] Return to step S102. If a predetermined abnormality is detected in the exposure apparatus 50 according to the present embodiment (No in step S102), the currently ongoing scanning exposure is interrupted (step S106). FIG. 4 shows a partial schematic top view of the exposure apparatus 50 according to the present embodiment when the scanning exposure is interrupted at a predetermined timing in step S106.

[0046] As shown in FIG. 4, when the scanning exposure for a predetermined shot area starts in step S101 or step S105, for example, the scanning exposure is performed from the negative Y-axis side end to the positive Y-axis side end of the predetermined shot area. At this time, the Y light shielding plate 8a is disposed along each of the negative Y-axis side end and the positive Y-axis side end of the predetermined shot area. And in the predetermined shot area, 16 panels 21 formed on the original surface of the original plate 5 are transferred.

[0047] Here, as shown in FIG. 4, assuming that divided exposure areas 30a, 30b, 30c, and 30d are formed in order from the negative Y-axis side to the positive Y-axis side for the 16 panels 21 transferred to the predetermined shot area. That is, each of the plurality of divided exposure regions 30a, 30b, 30c, and 30d arranged along the Y direction has four panels 21 along the X direction. Note that the divided exposure regions 30a, 30b, 30c, and 30d can be determined by the control unit 13 based on the layout of the plurality of panels 21 on the original plate surface of the original plate 5 input by the user.

[0048] Also, as shown in FIG. 4, the position where scanning exposure starts with respect to the minus side end in the Y direction of the divided exposure region 30a, that is, a predetermined shot region, is denoted as 33a. In other words, the position 33a can also be referred to as the scanning start side end of the predetermined shot region.

[0049] Also, the position where scanning exposure ends with respect to the plus side end in the Y direction of the divided exposure region 30d, that is, a predetermined shot region, is denoted as 33e. Then, the central position between the divided exposure region 30a and the divided exposure region 30b in the Y direction is denoted as 33b, and the central position between the divided exposure region 30b and the divided exposure region 30c in the Y direction is denoted as 33c.

[0050] Also, the central position between the divided exposure region 30c and the divided exposure region 30d in the Y direction is denoted as 33d. Note that the positions 33a, 33b, 33c, and 33d can also be referred to as the start positions of scanning exposure for the divided exposure regions 30a, 30b, 30c, and 30d, respectively.

[0051] As shown in FIG. 4, for example, when it is determined that a predetermined abnormality has been detected in the exposure apparatus 50 according to the present embodiment in step S102, it is assumed that scanning exposure is being performed on a predetermined position 31 within the divided exposure region 30b in the Y direction. Specifically, as shown in FIG. 4, the position 31 is determined as the position of the minus side end in the Y direction of the irradiation region 34 of the exposure light on the predetermined shot region when it is determined that a predetermined abnormality has been detected in the exposure apparatus 50 according to the present embodiment in step S102.

[0052] Also, when the scanning exposure for a predetermined shot area is interrupted in step S106, it is assumed that the scanning exposure is being performed on a predetermined position 32 within the divided exposure area 30b in the Y direction. Specifically, as shown in FIG. 4, the position 32 is determined as the position of the plus-side end in the Y direction of the irradiation area 34 of the exposure light on the predetermined shot area when the scanning exposure for the predetermined shot area is interrupted in step S106.

[0053] As a predetermined abnormality in the exposure apparatus 50 according to the present embodiment detected in step S102, for example, an abnormality regarding focus during scanning exposure and an abnormality in the drive mechanism for driving the reticle stage 6 and the substrate stage 12 are included. Also, as the predetermined abnormality, an abnormality in the illumination optical system 1 during scanning exposure, etc., an abnormality that inevitably interrupts the scanning exposure for a predetermined shot area in the exposure apparatus 50 according to the present embodiment is included.

[0054] Then, when the control unit 13 determines in step S102 that such an abnormality has been detected, it stops the driving of the reticle stage 6 and the substrate stage 12 respectively in step S106, and closes the exposure shutter 2 in the illumination optical system 1 to interrupt the scanning exposure. In step S106, instead of closing the exposure shutter 2 in the illumination optical system 1, the exposure light source may be turned off by controlling the voltage applied to the exposure light source.

[0055] Even when the control unit 13 determines in step S102 that an abnormality has been detected, it cannot immediately stop the driving of the reticle stage 6 and the substrate stage 12 respectively in step S106, or immediately close the exposure shutter 2. Therefore, the position 31 (hereinafter referred to as the abnormality occurrence position 31) when it is determined in step S102 that an abnormality has been detected as described above, and the position 32 (hereinafter referred to as the exposure interruption position 32) when the scanning exposure is interrupted in step S106 will be shifted from each other.

[0056] Next, the abnormal occurrence position 31 and the exposure interruption position 32 on the shot area where the scanning exposure is being performed are each determined (step S107). Specifically, in step S107, the positions in the XY planes of the reticle stage 6 and the substrate stage 12 respectively measured by the laser interferometers 7a and 7b recorded by the control unit 13 when scanning and exposing the abnormal occurrence position 31 are referred to.

[0057] Next, the illumination range in the Y direction on the shot area where the scanning exposure is being performed is calculated from the width in the Y direction of the exposure light determined by the slit 3 at the positions in the XY planes of the referred reticle stage 6 and substrate stage 12 respectively. Then, the position of the minus side end in the Y direction of the calculated illumination range is determined as the abnormal occurrence position 31.

[0058] Also in step S107, the positions in the XY planes of the reticle stage 6 and the substrate stage 12 respectively measured by the laser interferometers 7a and 7b recorded by the control unit 13 when scanning and exposing the exposure interruption position 32 are referred to. Next, the illumination range in the Y direction on the shot area where the scanning exposure is being performed is calculated from the width in the Y direction of the exposure light determined by the slit 3 at the positions in the XY planes of the referred reticle stage 6 and substrate stage 12 respectively. Then, the position of the plus side end in the Y direction of the calculated illumination range is determined as the exposure interruption position 32.

[0059] The area between the abnormal occurrence position 31 and the exposure interruption position 32 determined in this way can be referred to as an abnormal exposure area where the scanning exposure is being performed in a state where a predetermined abnormality has occurred in the exposure apparatus 50 according to the present embodiment. That is, the abnormal exposure area can be defined as the area between the abnormality occurrence position 31 at the time when a predetermined abnormality is detected in the exposure apparatus 50 according to the present embodiment, and the exposure interruption position 32 at the time when the scanning exposure is interrupted. In FIG. 4, the area where the scanning exposure is performed after a predetermined abnormality occurs in the exposure apparatus 50 according to the present embodiment, that is, the area between the exposure start position 33a and the exposure interruption position 32, is shown in gray.

[0060] Next, it is determined which of the divided exposure areas 30a to 30d the abnormality occurrence position 31 and the exposure interruption position 32 determined in step S107 are included in (step S108). Specifically, in step S108, by comparing the determined abnormality occurrence position 31 and exposure interruption position 32 with the positions 33a, 33b, 33c, 33d, and 33e, it is determined which of the divided exposure areas 30a to 30d each is included in.

[0061] Next, an abnormal exposure area where the scanning exposure is being performed in a state where a predetermined abnormality has occurred in the exposure apparatus 50 according to the present embodiment is determined (step S109, determination step). As described above, the abnormal exposure area is the area between the abnormality occurrence position 31 and the exposure interruption position 32.

[0062] Therefore, in step S109, at least one of the divided exposure areas between the divided exposure area including the abnormality occurrence position 31 and the divided exposure area including the exposure interruption position 32 in the Y direction is determined as the abnormal exposure area. In the example shown in FIG. 4, since both the abnormality occurrence position 31 and the exposure interruption position 32 are included in the divided exposure area 30b, the divided exposure area 30b is determined as the abnormal exposure area.

[0063] Next, it is notified to the user that there may be a defect in the panel 21 included in the abnormal exposure area determined in step S109 (step S110). Next, a normal exposure area where no predetermined abnormality has occurred in the exposure apparatus 50 according to the present embodiment, that is, a state where scanning exposure is being performed in a normal state, is determined in a predetermined shot area (step S111).

[0064] Specifically, in step S111, an area that was exposed within the time (period) before the time when a predetermined abnormality occurred in the exposure apparatus 50 according to the present embodiment during the scanning exposure for a predetermined shot area is determined. For example, in FIG. 4, the area shown in black is determined. Then, at least one divided exposure area among the divided exposure areas 30a to 30d where scanning exposure is being performed in a normal state for all areas is determined as the normal exposure area.

[0065] In other words, at least one divided exposure area among the divided exposure areas 30a to 30d that is arranged on the minus Y direction side, that is, the scanning start side, of the abnormal exposure area is determined as the normal exposure area. In the example shown in FIG. 4, since the divided exposure area 30b is determined as the abnormal exposure area, the divided exposure area 30a arranged on the minus Y direction side of the divided exposure area 30b is determined as the normal exposure area.

[0066] Also, in step S111, an unexposed area where scanning exposure has not yet been performed in a predetermined shot area is determined. That is, an area where scanning exposure has not yet been performed in a predetermined shot area, for example, the area shown in white in FIG. 4, is determined. Then, at least one divided exposure area among the divided exposure areas 30a to 30d where scanning exposure has not yet been performed for all areas is determined as the unexposed area.

[0067] In other words, at least one divided exposure area among the divided exposure areas 30a to 30d that is arranged on the plus Y direction side of the abnormal exposure area is determined as the unexposed area. In the example shown in FIG. 4, the divided exposure areas 30c and 30d arranged on the plus Y direction side of the divided exposure area 30b are determined as the unexposed areas.

[0068] Next, the Y light shielding plate 8a is arranged so that the exposure light is not irradiated to the normal exposure area determined in step S111 and the abnormal exposure area determined in step S109 (step S112). Thereby, it is possible to suppress the re-exposure of the already exposed divided exposure area including the normal exposure area and the abnormal exposure area, that is, double exposure.

[0069] FIG. 5(a) shows a partial schematic top view of the exposure apparatus 50 according to the present embodiment when the Y light shielding plate 8a is arranged in step S112. In the example shown in FIG. 4 as described above, the divided exposure areas 30a and 30b are determined as the normal exposure area and the abnormal exposure area, respectively. Therefore, in this case, as shown in FIG. 5(a), the Y light shielding plate 8a is arranged so that the exposure light is not irradiated to the divided exposure areas 30a and 30b in step S112.

[0070] Next, after a predetermined abnormality occurring in the exposure apparatus 50 according to the present embodiment is resolved, the scanning exposure is restarted (step S113, restart process), and the process returns to step S102. In step S113, the scanning exposure may be restarted from the position where the scanning exposure to the predetermined shot area starts, that is, from position 33a shown in FIG. 4 for the predetermined shot area.

[0071] Moreover, not limited to this, in step S113, the scanning exposure to the predetermined shot area may be restarted from the position closest to the minus side in the Y direction of the unexposed area among the central positions between the adjacent divided exposure areas. That is, in the example shown in FIG. 4, the scanning exposure to the predetermined shot area may be restarted from position 33c, which is the closest to the minus side in the Y direction of the unexposed area among the central positions 33b to 33d between the adjacent divided exposure areas.

[0072] As described above, in the exposure apparatus 50 according to the present embodiment, when the exposure of a predetermined shot area on the substrate 11 is interrupted, the control unit 13 controls the Y shutter 8a so that exposure light is not guided to the normal exposure area in the predetermined shot area, and resumes the exposure of the predetermined shot area. Thereby, even if an abnormality occurs in the exposure apparatus 50 when exposing a predetermined shot area including a plurality of panels 21 and the exposure is interrupted, the number of defective panels 21 in the predetermined shot area can be reduced.

[0073] In the exposure apparatus 50 according to the present embodiment, the Y shutter 8a is arranged so that exposure light is not irradiated to the normal exposure area and the abnormal exposure area in step S112. However, the present invention is not limited to this, and the Y shutter 8a may be arranged so that exposure light is not irradiated only to the normal exposure area or only to the divided exposure area 30a in the partial schematic top view of the exposure apparatus 50 according to the present embodiment shown in FIG. 5(b). In this case, scanning exposure can be performed on the predetermined shot area so that no completely unexposed area is formed.

[0074] In the exposure apparatus 50 according to the present embodiment, the Y shutter 8a is arranged so that exposure light is not irradiated to the normal exposure area and the abnormal exposure area in step S112. However, the present invention is not limited to this, and without moving the Y shutter 8a, that is, while maintaining the arrangement of the Y shutter 8a along the minus-side end and the plus-side end in the Y direction of the predetermined shot area, the irradiation timing of the exposure light from the illumination optical system 1 may be adjusted.

[0075] That is, in this case, step S112 is not performed. Then, when resuming the scanning exposure of the predetermined shot area in step S113, the exposure shutter 2 is closed when scanning the normal exposure area and the abnormal exposure area, while the exposure shutter 2 is opened when scanning the unexposed area. In the example specifically shown in FIG. 4, the exposure shutter 2 is closed when scanning the divided exposure areas 30a and 30b. Then, the exposure shutter 2 may be opened when scanning the position 33c which is the start position of the scanning exposure for the divided exposure area 30c, that is, when scanning the start-side end of the divided exposure area 30c. Also in this case, instead of closing or opening the exposure shutter 2, the exposure light source provided in the illumination optical system 1 may be turned off or on by controlling the voltage applied to the exposure light source.

[0076] Also, while maintaining the arrangement of the Y light-shielding plate 8a along the minus-side end and the plus-side end in the Y direction of a predetermined shot area respectively, the start position of the scanning when restarting the exposure for the predetermined shot area may be changed. That is, in this case, step S112 is not performed, and the scanning exposure for the unexposed area may be started at the position in step S113, that is, the scanning exposure for the predetermined shot area may be restarted from the start-side end of the unexposed area. Specifically, in the example shown in FIG. 4, the scanning exposure may be restarted from the position 33c which is the start position of the scanning exposure for the divided exposure area 30c.

[0077] Also in the above, among the plurality of divided exposure areas provided in the shot area, the divided exposure areas included in the normal exposure area, the abnormal exposure area, and the unexposed area respectively have been determined, but it is not limited to this. That is, in the exposure apparatus 50 according to the present embodiment, the shot area may be defined as a single continuous exposure area, and the partial areas included in the normal exposure area, the abnormal exposure area, and the unexposed area respectively in the single exposure area may be determined.

[0078] [Method for manufacturing an article] The method for manufacturing an article according to the present embodiment includes a step of exposing a substrate such as a wafer or a glass substrate coated with a photosensitive agent using the exposure apparatus 50 according to the present embodiment. The article includes semiconductor integrated circuit (IC) elements, liquid crystal display elements, microelectromechanical systems (MEMS), and the like.

[0079] The manufacturing method of the article according to this embodiment includes a step of developing the exposed substrate (photosensitive agent) and other well-known steps of processing the developed substrate. The other well-known steps include etching, photosensitive agent stripping, dicing, bonding, packaging, and the like.

[0080] According to the manufacturing method of the article according to this embodiment, an article of higher quality than before can be manufactured. As described above, the preferred embodiments have been explained, but the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist.

[0081] The disclosure of this embodiment includes the following configurations and methods. (Configuration 1) An exposure apparatus that projects an image of a pattern on a reticle onto a substrate to expose the substrate, including a projection optical system that projects the image onto the substrate surface by guiding the exposure light that has passed through the reticle to the substrate, a reticle stage that scans and moves in a first direction parallel to the substrate surface while holding the reticle when exposing a predetermined shot area on the substrate surface, a substrate stage that scans and moves in the first direction while holding the substrate when exposing a predetermined shot area, a light-shielding portion that blocks a part of the exposure light guided to the substrate, and a control unit that performs a restart process of restarting the exposure of the predetermined shot area while controlling the light-shielding portion so that the exposure light is not guided to the normal exposure area in the predetermined shot area when the exposure of the predetermined shot area is interrupted. (Configuration 2) The restart process according to Configuration 1, characterized in that it includes a step of restarting the exposure of the predetermined shot area while controlling the light-shielding portion so that the exposure light is not guided to the normal exposure area and the abnormal exposure area in the predetermined shot area. (Configuration 3) The restart process includes a determination step of determining an abnormal exposure area from the area exposed between the time when a predetermined abnormality occurred during the exposure of a predetermined shot area and the time when the exposure of the predetermined shot area was interrupted. The exposure apparatus according to Configuration 1 or 2, characterized in that. (Configuration 4) The control unit performs a step of notifying that there may be a defect in the abnormal exposure area. The exposure apparatus according to Configuration 3, characterized in that. (Configuration 5) The restart process includes a step of determining a normal exposure area from the area exposed within a time before the time when a predetermined abnormality occurred during the exposure of a predetermined shot area. The exposure apparatus according to any one of Configurations 1 to 4, characterized in that. (Configuration 6) The restart process includes a determination step of determining whether a predetermined abnormality has occurred during the exposure of a predetermined shot area. The exposure apparatus according to any one of Configurations 1 to 5, characterized in that. (Configuration 7) When it is determined in the determination step that a predetermined abnormality has occurred, the control unit performs a step of interrupting the exposure of a predetermined shot area. The exposure apparatus according to Configuration 6, characterized in that. (Configuration 8) An illumination optical system for irradiating an original plate with exposure light, having a light source for emitting exposure light and a shutter member that allows the exposure light from the light source to pass through when opened. The predetermined abnormality includes an error in the scanning movement of at least one of the original plate stage and the substrate stage, an unexpected turn-off of the light source, and an unexpected closing of the shutter member. The exposure apparatus according to any one of Configurations 3 to 7, characterized in that. (Configuration 9) The predetermined shot area has a plurality of divided exposure areas arranged along a first direction. The restart process includes a step of determining an abnormal exposure area from at least one divided exposure area including the area exposed between the time when a predetermined abnormality occurred during the exposure of the predetermined shot area and the time when the exposure of the predetermined shot area was interrupted. The exposure apparatus according to any one of Configurations 1 to 8, characterized in that. (Configuration 10) The restart process includes a step of determining a normal exposure area from at least one divided exposure area arranged on the scanning start side of the abnormal exposure area in the predetermined shot area. The exposure apparatus according to Configuration 9, characterized in that. (Configuration 11) The exposure apparatus according to Configuration 9 or 10, characterized in that a plurality of divided exposure regions are arranged along a first direction on a reticle and are determined based on a plurality of panels in which the same pattern is formed for each other. (Configuration 12) The exposure apparatus according to Configuration 11, characterized in that a plurality of panels are arranged in a second direction perpendicular to the first direction within a substrate plane. (Configuration 13) The exposure apparatus according to any one of Configurations 1 to 12, characterized in that the restart process includes a process of restarting exposure of a predetermined shot region from a scanning start side end portion of the predetermined shot region. (Configuration 14) The exposure apparatus according to any one of Configurations 1 to 12, characterized in that the restart process includes a process of determining an unexposed region that was not exposed when the exposure of a predetermined shot region was interrupted, and a process of restarting exposure of the predetermined shot region from a scanning start side end portion of the unexposed region. (Configuration 15) The exposure apparatus according to any one of Configurations 1 to 12, characterized in that it includes an illumination optical system that irradiates a reticle with exposure light and has a shutter member that allows exposure light to pass through by opening, and the restart process includes a process of opening the shutter member when scanning a scanning start side end portion of a predetermined shot region. (Configuration 16) The exposure apparatus according to any one of Configurations 1 to 12, characterized in that it includes an illumination optical system that irradiates a reticle with exposure light and has a shutter member that allows exposure light to pass through by opening, and the restart process includes a process of determining an unexposed region that was not exposed when the exposure of a predetermined shot region was interrupted, and a process of opening the shutter member when scanning a scanning start side end portion of the unexposed region. (Configuration 17) The exposure apparatus according to any one of Configurations 1 to 16, characterized in that the light shielding portion includes two light shielding plates that are spaced apart from each other so as to face each other in a first direction and are each movable in the first direction. (Method 1) A method for manufacturing an article, characterized by including a process of exposing a substrate by the exposure apparatus according to any one of Configurations 1 to 17, and a process of developing the exposed substrate. (Method 2) An exposure method of projecting an image of a pattern of a master onto a substrate surface of a substrate by guiding exposure light that has passed through the master to the substrate, including a projection optical system; a master stage that scans and moves in a first direction parallel to the substrate surface while holding the master when exposing a predetermined shot area on the substrate surface; a substrate stage that scans and moves in the first direction while holding the substrate when exposing the predetermined shot area; and a light-shielding unit that shields a part of the exposure light guided to the substrate. The method is characterized by including a restart step of restarting the exposure of the predetermined shot area while controlling the light-shielding unit so that the exposure light is not guided to a normal exposure area in the predetermined shot area when the exposure of the predetermined shot area is interrupted.

Explanation of Reference Numerals

[0082] 5 Master 6 Master stage 8a Y light-shielding plate (light-shielding unit) 8b X light-shielding plate (light-shielding unit) 9 Projection optical system 11 Substrate 12 Substrate stage 13 Control unit 20a, 20b, 20c, 20d Shot area 34 Exposure light 50 Exposure apparatus

Claims

1. An exposure apparatus that projects an image of an original pattern onto a substrate and exposes the substrate, comprising: a projection optical system that projects the image onto the substrate surface of the substrate by guiding the exposure light that has passed through the original to the substrate; an original stage that scans and moves in a first direction parallel to the substrate surface while holding the original when exposing a predetermined shot area on the substrate surface; a substrate stage that scans and moves in the first direction while holding the substrate when exposing the predetermined shot area; a light-shielding portion that shields a part of the exposure light guided to the substrate; a control unit that performs a restart process of restarting the exposure of the predetermined shot area while controlling the light-shielding portion so that the exposure light is not guided to the normal exposure area in the predetermined shot area when the exposure of the predetermined shot area is interrupted; An exposure apparatus characterized by comprising the above.

2. The exposure apparatus according to claim 1, wherein the restart process includes a process of restarting the exposure of the predetermined shot area while controlling the light-shielding portion so that the exposure light is not guided to the normal exposure area and the abnormal exposure area in the predetermined shot area, respectively.

3. The exposure apparatus according to claim 1, wherein the restart process includes a determination process of determining an abnormal exposure area from an area exposed between the time when a predetermined abnormality occurred during the exposure of the predetermined shot area and the time when the exposure of the predetermined shot area was interrupted.

4. The exposure apparatus according to claim 3, wherein the control unit performs a process of notifying that there is a possibility that a defect has occurred in the abnormal exposure area.

5. The exposure apparatus according to claim 1, wherein the restart process includes a process of determining the normal exposure area from an area exposed within a time before the time when a predetermined abnormality occurred during the exposure of the predetermined shot area.

6. The exposure apparatus according to claim 1, wherein the restart process includes a determination process of determining whether a predetermined abnormality has occurred during the exposure of the predetermined shot area.

7. The exposure apparatus according to claim 6, wherein the control unit performs a process of interrupting the exposure of the predetermined shot area when it is determined in the determination process that the predetermined abnormality has occurred.

8. The exposure apparatus includes an illumination optical system that irradiates the reticle with the exposure light, the illumination optical system having a light source that emits the exposure light and a shutter member that allows the exposure light from the light source to pass through by being opened. The predetermined abnormality includes an error in the scanning movement of at least one of the reticle stage and the substrate stage, an unexpected turn-off of the light source, and an unexpected closing of the shutter member, according to claim 3.

9. The predetermined shot area has a plurality of divided exposure areas arranged along the first direction. The restart process includes a process of determining an abnormal exposure area from at least one of the divided exposure areas including an area exposed between the time when a predetermined abnormality occurred during the exposure of the predetermined shot area and the time when the exposure of the predetermined shot area was interrupted, according to claim 1.

10. The restart process includes a process of determining a normal exposure area from at least one of the divided exposure areas arranged on the scanning start side of the abnormal exposure area in the predetermined shot area, according to claim 9.

11. The plurality of divided exposure areas are arranged along the first direction on the reticle and are determined based on a plurality of panels in which the same pattern is formed with each other, according to claim 9.

12. The exposure apparatus according to claim 11, wherein the plurality of panels are arranged in a second direction perpendicular to the first direction in the substrate plane.

13. The exposure apparatus according to claim 1, wherein the restart process includes a process of restarting the exposure of the predetermined shot area from a scanning start side end of the predetermined shot area.

14. The restart process includes a process of determining an unexposed area that was not exposed when the exposure of the predetermined shot area was interrupted, and a process of restarting the exposure of the predetermined shot area from a scanning start side end of the unexposed area. The exposure apparatus according to claim 1, characterized by including the above.

15. An illumination optical system for irradiating the reticle with the exposure light, having a shutter member that allows the exposure light to pass through by being opened, The exposure apparatus according to claim 1, wherein the restart process includes a process of opening the shutter member when scanning a scanning start side end of the predetermined shot area.

16. An illumination optical system for irradiating the reticle with the exposure light, having a shutter member that allows the exposure light to pass through by being opened, The restart process includes a process of determining an unexposed area that was not exposed when the exposure of the predetermined shot area was interrupted, and a process of opening the shutter member when scanning a scanning start side end of the unexposed area. The exposure apparatus according to claim 1, characterized by including the above.

17. The light shielding portion includes two light shielding plates that are separated from each other so as to face each other in the first direction and are each movable in the first direction. The exposure apparatus according to claim 1, characterized by including the above.

18. A process of exposing a substrate with the exposure apparatus according to any one of claims 1 to 17, The step of developing the exposed substrate; A method for manufacturing an article, characterized by including the above.

19. A projection optical system that projects an image of the pattern of the original plate onto the substrate surface of the substrate by guiding the exposure light that has passed through the original plate to the substrate, an original plate stage that scans and moves in a first direction parallel to the substrate surface while holding the original plate when exposing a predetermined shot area on the substrate surface, a substrate stage that scans and moves in the first direction while holding the substrate when exposing the predetermined shot area, and a light shielding part that shields a part of the exposure light guided to the substrate. An exposure method for projecting the image onto the substrate and exposing the substrate using an exposure apparatus, comprising: A restart step of restarting the exposure of the predetermined shot area while controlling the light shielding part so that the exposure light is not guided to the normal exposure area in the predetermined shot area when the exposure of the predetermined shot area is interrupted.

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