Photosensitive element and method for forming a resist pattern

Abstract

Disclosed is a photosensitive element which is provided with a supporting film and a photosensitive layer that contains a photosensitive resin composition. The photosensitive resin composition contains the following components: (A) an alkali-soluble polymer; (B) a compound that has an ethylenically unsaturated double bond; and (C) a biimidazole photopolymerization initiator. The component (C) is contained in an amount of 5.0% by mass or more relative to the total mass of solids of the photosensitive resin composition. The absorbance (Y) of the photosensitive layer with a film thickness of 25 µm at the wavelength of 365 nm is 0.35 or less. The contribution (X) of the absorbance of the component (C) in the absorbance (Y) is 40% or more, and the contribution (X) is calculated by formula (1).

Description

Technical Field

[0001] The present invention relates to a photosensitive element and a method for forming a resist pattern.

Background Art

[0002] Printed wiring boards are generally manufactured using a photolithography process. Photolithography is a method of forming a desired wiring pattern on a substrate by the following steps. That is, first, a coating film made of a photosensitive resin composition is formed on the substrate, and the coating film is pattern-exposed and developed to form a resist pattern. Next, a conductor pattern is formed by etching or plating. Thereafter, the desired wiring pattern is formed on the substrate by removing the resist pattern on the substrate.

[0003] In recent years, with the miniaturization and high density of electronic devices, the formation of finer wirings on wiring boards has been required more than ever. In this regard, MSAP (Modified Semi Additive Process) and SAP (Semi Additive Process) have attracted attention as manufacturing methods for wiring boards. In these methods, in order to form fine wirings, for example, it is desired to form a resist pattern with an adhesion and resolution of 7 μm or less. Regarding such a demand, Patent Document 1 discloses a photosensitive resin composition containing an anthracene-based sensitizer and in which a binder polymer has a hydroxyalkyl (meth) acrylate unit and a specific amount of styrene or styrene derivative unit. In the examples of Patent Document 1, a biimidazole photopolymerization initiator is used as the photopolymerization initiator.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, when this type of photosensitive resin composition is exposed with an exposure apparatus having a wavelength of 365 nm and the formed resist pattern is observed, there are problems such as insufficient resolution; difficulty in forming a pattern of 7 μm or less; and room for improvement in adhesion. Conventional photosensitive resin compositions such as those described in Patent Document 1 may contain a relatively large amount of a biimidazole photopolymerization initiator. When such a photosensitive resin composition is stored under yellow light, sensitivity fluctuations occur, and as a result, the storage stability of the photosensitive layer tends to deteriorate. In particular, when the biimidazole photopolymerization initiator is contained in an amount of 5% by mass or more based on the total amount of the total solid content of the photosensitive resin composition, a significant deterioration in storage stability is often observed. That is, in conventional photosensitive elements, it has been difficult to achieve adhesion, resolution, and storage stability.

[0006] The present invention has been proposed in view of the above circumstances. That is, an object of the present invention is to provide a photosensitive element excellent in adhesion, resolution, and storage stability, and a method for forming a resist pattern.

Means for Solving the Problems

[0007] One aspect of the present invention is as follows. [1] A photosensitive element comprising a support film and a photosensitive layer containing a photosensitive resin composition, wherein the photosensitive resin composition contains the following components: (A) An alkali-soluble polymer, (B) A compound having an ethylenically unsaturated double bond, (C) A biimidazole photopolymerization initiator and contains, the component (C) in an amount of 5.0% by mass or more based on the total solid mass of the photosensitive resin composition, the absorbance (Y) at a wavelength of 365 nm at a film thickness of 25 μm of the photosensitive layer is 0.35 or less, The contribution (X) of the absorbance of the component (C) to the absorbance (Y) is 40% or more, and the contribution (X) is represented by the following formula (1): X(%) = 100×εc / absorbance (Y) of the photosensitive layer ··· (1) ε: absorbance change value per 1 mass% of the component (C) c: content (mass%) of the component (C) in the total solid content of the photosensitive resin composition The photosensitive element calculated by the above formula. [2] The photosensitive element according to item 1, wherein the component (C) is contained in an amount of 5.5 mass% or more based on the total solid mass of the photosensitive resin composition. [3] The photosensitive element according to item 1 or 2, wherein the component (C) is contained in an amount of 6.0 mass% or more based on the total solid mass of the photosensitive resin composition. [4] The photosensitive element according to any one of items 1 to 3, wherein the contribution (X) is 55% or more. [5] The photosensitive element according to any one of items 1 to 4, wherein the contribution (X) is 65% or more. [6] The photosensitive element according to any one of items 1 to 5, wherein the contribution (X) is 85% or more. [7] The photosensitive element according to any one of items 1 to 6, wherein the absorbance (Y) is 0.30 or less. [8] The photosensitive element according to any one of items 1 to 7, wherein the absorbance (Y) is 0.25 or less. [9] Furthermore, the photosensitive resin composition further contains (D) other photoinitiators and / or sensitizers and contains at least one selected from the group consisting of benzophenone compounds, pyrazoline compounds, anthracene compounds, and coumarin compounds. The photosensitive element according to any one of items 1 to 8.

[10] Furthermore, the photosensitive resin composition further contains (D) Other photoinitiators and / or sensitizers The photosensitive element according to any one of items 1 to 9, containing at least one selected from the group consisting of benzophenone compounds and pyrazoline compounds.

[11] The component (A) contains styrene as a monomer component, The photosensitive element according to any one of items 1 to 10, wherein the proportion of the structural unit derived from styrene is 35% by mass or more based on the total mass of all monomer components in the component (A).

[12] The component (A) contains styrene as a monomer component, The photosensitive element according to any one of items 1 to 11, wherein the proportion of the structural unit derived from styrene is 50% by mass or more based on the total mass of all monomer components in the component (A).

[13] The component (A) contains styrene as a monomer component, The photosensitive element according to any one of items 1 to 12, wherein the proportion of the structural unit derived from styrene is 60% by mass or more based on the total mass of all monomer components in the component (A).

[14] As the component (B), the following general formula (II):

Chemical formula

[15] Furthermore, the photosensitive resin composition is (E) Polymerization inhibitor The photosensitive element according to any one of items 1 to 14, comprising the same.

[16] The photosensitive element according to any one of items 1 to 15, wherein the absorbance of the support film at 365 nm is 0.1 or less.

[17] The photosensitive element according to any one of items 1 to 16, further comprising a protective film.

[18] A method for forming a resist pattern, using the photosensitive element according to any one of items 1 to 17, comprising: The following steps: A step of laminating the photosensitive element on a substrate; A step of exposing the photosensitive layer of the laminated photosensitive element; and A step of developing the exposed photosensitive layer. A method for forming a resist pattern, comprising the same.

Advantages of the Invention

[0008] According to the present invention, it is possible to provide a photosensitive element excellent in adhesion, resolution, and storage stability, and a method for forming a resist pattern using the same.

Brief Description of the Drawings

[0009]

Figure 1

Modes for Carrying Out the Invention

[0010] Hereinafter, embodiments of the present invention (hereinafter abbreviated as "the present embodiment") will be described. The present invention is not limited to the present embodiment only, and can be variously modified and implemented within the scope of the gist thereof. In this specification, the upper limit value and the lower limit value of each numerical range may be arbitrarily combined, and may be replaced with the values described in the examples. In addition, in this specification, a numerical range indicated by "~" shall include the upper and lower limit numerical values.

[0011] [Embodiment 1] The photosensitive element of this embodiment includes a support film and a photosensitive layer containing a photosensitive resin composition. The photosensitive resin composition contains the following components: (A) An alkali-soluble polymer, (B) A compound having an ethylenically unsaturated double bond, (C) A biimidazole photopolymerization initiator and contains 5.0 mass% or more of the above component (C) based on the total solid mass of the photosensitive resin composition. Hereinafter, in this specification, (A) to (C) may be simply referred to as "(A) component" to "(C) component". The same applies to "(D)" and "(E)" described later.

[0012] In this embodiment, the absorbance (Y) at 365 nm at a film thickness of 25 μm of the photosensitive layer is 0.35 or less, and the contribution (X) of the absorbance of the component (C) to the absorbance (Y) is 40% or more. According to this, the adhesion, resolution, and storage stability are excellent. Here, the contribution (X) is represented by the following formula (1): X(%) = 100×εc / absorbance (Y) of the photosensitive layer ··· (1) ε: Absorbance change value per 1 mass% of the component (C) c: Content (mass%) of the component (C) in the total solid component in the photosensitive resin composition and is calculated by The absorbance (Y) may exceed 0.

[0013] The photosensitive resin composition of this embodiment contains 1 to n kinds of the component (C). n is a positive integer, preferably 5, more preferably 3.

[0014] <Support film> The support film is a layer or film for supporting the photosensitive layer, and is preferably a transparent base film that transmits actinic rays.

[0015] Examples of the transparent base film include films made of synthetic resins such as polyethylene, polypropylene, polycarbonate, and polyethylene terephthalate. Among these, polyethylene terephthalate (PET) is preferably used because it has appropriate flexibility and strength.

[0016] From the viewpoint of improving the adhesion of the resist pattern, the absorbance of the support film at a wavelength of 365 nm is preferably 0.3 or less, more preferably 0.2 or less, still more preferably 0.1 or less, and most preferably 0.08 (for example, 0.080) or less. The above absorbance may be 0 or more.

[0017] Among these, it is preferable to use a film with few internal foreign matters, that is, a high-quality film. Specifically, as the high-quality film, a PET film synthesized using a Ti-based catalyst, a PET film with a small diameter and low content of lubricant, a PET film containing lubricant only on one side of the film, a thin-film PET film, a PET film with a smoothing treatment applied to at least one side, a PET film with a roughening treatment such as plasma treatment applied to at least one side, etc. are more preferably used. Thereby, the light to be exposed can be irradiated onto the photosensitive layer without being blocked by internal foreign matters, and thus the resolution of the photosensitive element can be improved.

[0018] The film thickness of the support film is preferably 5 to 25 μm, more preferably 6 to 20 μm. The thinner the film thickness of the support film, the fewer the number of internal foreign matters tends to be, and therefore, it is easy to prevent a decrease in resolution. On the other hand, when the film thickness is less than 5 μm, elongation deformation in the winding direction due to tension is likely to occur in the coating and winding manufacturing process, and breakage due to minute scratches is also likely to occur. As a result, the strength of the film is likely to be insufficient, and thus wrinkles are likely to occur during lamination.

[0019] Smoothing treatment using a calendar device or the like may be performed on at least one side of the support film. Thereby, the surface roughness of one side of the support film, particularly the surface on the side in contact with the photosensitive layer, can be reduced, and in this case, the effects of the present invention are more likely to be achieved.

[0020] The haze of the support film is preferably 0.01 to 1.5%, more preferably 0.01 to 1.2%, and still more preferably 0.01 to 0.95% from the viewpoint of improving the parallelism of the light rays irradiated onto the photosensitive layer and from the viewpoint of obtaining high resolution.

[0021] <Photosensitive layer> The photosensitive layer contains a photosensitive resin composition. The photosensitive resin composition contains (A) an alkali-soluble polymer, (B) a compound having an ethylenically unsaturated double bond, and (C) a biimidazole photopolymerization initiator. The photosensitive resin composition may contain (D) other photopolymerization initiators and / or (E) polymerization inhibitors.

[0022] (A) Component: Alkali-soluble polymer The (A) component preferably has a repeating unit composed of at least one of the first monomers described later, and more preferably has a repeating unit composed of at least one of the first monomers and at least one of the second monomers described later.

[0023] The first monomer is a monomer having a carboxyl group in the molecule and at least one polymerizable unsaturated group in the molecule. The first monomer may be a monomer having one polymerizable unsaturated group in the molecule, and examples thereof include (meth)acrylic acid, fumaric acid, cinnamic acid, crotonic acid, itaconic acid, 4-vinylbenzoic acid, maleic anhydride, maleic acid semi-ester, and the like. Among them, (meth)acrylic acid is preferable, and methacrylic acid is more preferable from the viewpoints of excellent adhesion and resolution. In this specification, "(meth)acrylic acid" means acrylic acid or methacrylic acid, "(meth)acryloyl group" means acryloyl group or methacryloyl group, and "(meth)acrylate" means "acrylate" or "methacrylate".

[0024] The copolymerization ratio of the first monomer is preferably 10 to 50% by mass based on the total mass of all monomer components. Setting the copolymerization ratio to 10% by mass or more is preferable from the viewpoints of excellent adhesion and resolution, more preferably 15% by mass or more, still more preferably 18% by mass or more, even more preferably 21% by mass or more, particularly preferably 23% by mass or more, and most preferably 25% by mass or more. Setting the copolymerization ratio to 50% by mass or less is preferable from the viewpoints of excellent adhesion and resolution, more preferably 35% by mass or less, still more preferably 30% by mass or less, particularly preferably 29% by mass or less, and most preferably 27% by mass or less. When two or more kinds of the first monomer are used, it is preferable that the total of the respective copolymerization ratios is within the above range.

[0025] The second monomer is a non-acidic monomer having at least one polymerizable unsaturated group in the molecule. The second monomer may be a monomer having one polymerizable unsaturated group in the molecule, and preferably includes a compound having an aromatic structure from the viewpoints of resolution and adhesion. By having a structural unit derived from such a compound, it is easy to suppress the swelling during development of the photosensitive layer, and thus it is easy to obtain a cured film excellent in adhesion, resolution, etc. The copolymerization ratio of the monomer derived from the compound having an aromatic structure is preferably 10 to 90% by mass based on the total mass of all monomer components. Setting the copolymerization ratio to 10% by mass or more is preferable from the viewpoints of excellent adhesion and resolution, more preferably 30% by mass or more, still more preferably 40% by mass or more, even more preferably 50% by mass or more, and particularly preferably 60% by mass or more. Setting the copolymerization ratio to 90% by mass or less is preferable from the viewpoint of excellent developability, and more preferably 80% by mass or less. When two or more compounds having an aromatic structure are used as the second monomer, it is preferable that the total of the copolymerization ratios thereof is within the above range.

[0026] Examples of the compound having an aromatic structure include styrene derivatives such as benzyl (meth) acrylate, styrene, methylstyrene, vinyltoluene, tert-butoxystyrene, acetoxystyrene, styrene dimer, and styrene trimer; 2-[3-(2H-benzotriazol-2-yl)-4-hydroxyphenyl] ethyl (meth) acrylate and the like.

[0027] As the compound having an aromatic structure, benzyl (meth) acrylate or styrene is preferable, and styrene is more preferable. For example, from the viewpoint of excellent adhesiveness and resolution, the copolymerization ratio of styrene is preferably 10 to 90% by mass, more preferably 40 to 80% by mass, and still more preferably 50 to 70% by mass based on the total mass of all monomer components.

[0028] In addition, when an alkali-soluble polymer having a high copolymerization ratio of a compound having an aromatic structure (for example, styrene) is used, the number of foreign matters in the photosensitive element is likely to be reduced. Examples of the foreign matter include deposits having a size of about several to several tens of μm (deposit 11 shown in FIG. 1) or bubbles having a size of about several tens of μm formed around deposits having a size of about several μm as nuclei (bubble 12 shown in FIG. 1); and the like. The foreign matter can be observed visually or with an optical microscope.

[0029] Examples of foreign matters in the photosensitive resin composition are shown in FIG. 1. In the figure, the photosensitive layer is indicated by the number "1", and the foreign matter is indicated by the number "10". Among the foreign matters 10, deposits having a size of about several to several tens of μm are indicated by the symbol "11", and bubbles having a size of about several tens of μm are indicated by the symbol "12". As a development trend, it is conceivable to contain a relatively large amount of component (C) in the photosensitive resin composition. On the other hand, when the content of component (C) is high, the compatibility with other components in the photosensitive resin composition tends to deteriorate. Therefore, it is considered that such foreign matter 10 is generated in the photosensitive layer 1 during film formation. When using an alkali-soluble polymer having a high copolymerization ratio of a compound having an aromatic structure (for example, styrene) and a high aromatic ring ratio, the compatibility between the (C) biimidazole photoinitiator and the photosensitive resin composition is likely to be improved. Thereby, even if the photosensitive resin composition is designed to contain a relatively large amount of component (C), it is easy to prevent the generation of component (C) in the photosensitive resin composition, and therefore, it is considered that the number of foreign matters is easily reduced.

[0030] The compound having an aromatic structure preferably contains both styrene and benzyl (meth) acrylate. The copolymerization ratio of benzyl (meth) acrylate is preferably 1 to 60% by mass, more preferably 1 to 30% by mass, and still more preferably 1 to 20% by mass based on the total mass of all monomer components.

[0031] The second monomer preferably contains a compound having a hydroxy group. By having a structural unit derived from such a compound, it becomes easy to control the developability of the photosensitive layer, and therefore, it becomes easy to obtain a cured film excellent in adhesion, resolution, etc. The second monomer may contain both a compound having an aromatic structure and a compound having a hydroxy group.

[0032] The compound having a hydroxy group is preferably a hydroxyalkyl (meth)acrylate or a dihydroxyalkyl (meth)acrylate. Examples of the hydroxyalkyl (meth)acrylate include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, and the like. Examples of the dihydroxyalkyl (meth)acrylate include glycerin mono (meth)acrylate and the like. The compound having a hydroxy group is more preferably 2-hydroxyethyl methacrylate or glycerin mono (meth)acrylate. These are relatively easy to obtain, and moreover, it is easy to control the developability and easy to realize a resist pattern excellent in adhesion and resolution.

[0033] From the viewpoints of developability and adhesion, the content ratio of the compound having a hydroxy group in the component (A) is preferably 1.0 to 20% by mass, more preferably 1 to 10% by mass, and still more preferably 1 to 6% by mass based on the total mass of all the monomer components. When two or more compounds having a hydroxy group are used, the total of the copolymerization ratios thereof is preferably within the above range.

[0034] The second monomer can further contain a polymerizable compound different from both the compound having an aromatic structure and the compound having a hydroxy group. Examples of polymerizable compounds different from both the compound having an aromatic structure and the compound having a hydroxy group include (meth)acrylates such as methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, cyclohexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, dicyclopentanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyl oxyethyl (meth)acrylate, isobornyl (meth)acrylate, nonylphenoxy polyethylene glycol (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, phenoxyethyl (meth)acrylate, ethyl carbitol (meth)acrylate, methoxyethyl (meth)acrylate, methoxy triethylene glycol (meth)acrylate, methoxy polyethylene glycol (meth)acrylate, (2-methyl-2-ethyl-1,3-dioxolan-4-yl)methyl (meth)acrylate, cyclic trimethylolpropane formal (meth)acrylate, 3,3,5-trimethylcyclohexyl (meth)acrylate; esters of vinyl alcohol such as vinyl acetate; and (meth)acrylonitrile and the like.

[0035] The weight average molecular weight Mw of component (A) is preferably from 10,000 to 60,000. That the weight average molecular weight Mw is 60,000 or less is preferable from the viewpoint of realizing the flexibility, resolution, and developability of the resist pattern. From the same viewpoint, it is more preferably 55,000 or less, and even more preferably less than 50,000. From the same viewpoint, the weight average molecular weight Mw is preferably 10,000 or more, more preferably 14,000 or more, and even more preferably 25,000 or more.

[0036] The polydispersity of component (A) is preferably from 1.0 to 6.0, more preferably from 1.0 to 5.0, even more preferably from 1.0 to 4.0, and particularly preferably from 1.0 to 3.0.

[0037] From the viewpoints of developability and resolution, the component (A) may be a copolymer composed only of monomers each containing one polymerizable unsaturated group. That is, the component (A) may not contain a polymerizable unsaturated group.

[0038] The component (A) may contain a copolymer containing a polymerizable unsaturated group. The copolymer containing a polymerizable unsaturated group can be obtained, for example, by adding glycidyl (meth) acrylate or the like to a copolymer having a carboxyl group. When the photosensitive resin composition contains a copolymer containing a polymerizable unsaturated group, whether it is the component (A) or the component (B) may be determined, for example, by the following method. A copolymer containing, as a copolymerization component, a monomer having a carboxyl group in the molecule and at least one polymerizable unsaturated group in the molecule may be determined as the component (A). A compound that is not a copolymer and a copolymer that does not contain, as a copolymerization component, a monomer having a carboxyl group in the molecule and at least one polymerizable unsaturated group in the molecule may be determined as the component (B).

[0039] In the present embodiment, the component (A) can be used alone or in combination of two or more. When used in combination of two or more, the monomer content, molecular weight, and polydispersity in the plurality of components (A) are preferably selected such that the weighted average value when the content ratio is treated as a weight falls within the above range.

[0040] The synthesis of the component (A) is preferably carried out by adding an appropriate amount of a radical polymerization initiator such as benzoyl peroxide or azoisobutyronitrile to a solution obtained by diluting the above-described single or plural monomers with a solvent such as acetone, methyl ethyl ketone, or isopropanol, and heating and stirring. In some cases, synthesis may be carried out while dropping a part of the mixture into the reaction solution. After completion of the reaction, the solvent may be further added to adjust to a desired concentration. As the synthesis means, in addition to solution polymerization, bulk polymerization, suspension polymerization, or emulsion polymerization may be used. In some cases, synthesis may be carried out by living radical polymerization.

[0041] (A) The proportion of the content of the component in the total solid mass of the photosensitive resin composition may be 10% by mass or more, may be 20% by mass or more, may be 25% by mass or more, may be 30% by mass or more, may be 35% by mass or more, may be 40% by mass or more, may be 45% by mass or more, may be 50% by mass or more, may be 55% by mass or more, may be 60% by mass or more. Further, it may be 90% by mass or less, may be 80% by mass or less, may be 70% by mass or less, may be 60% by mass or less, may be 50% by mass or less.

[0042] Setting the proportion of the content of the component (A) in the total solid mass of the photosensitive resin composition to 90% by mass or less is preferable from the viewpoint of controlling the development time, and setting it to 10% by mass or more is preferable from the viewpoint of suppressing the bleeding of the photosensitive layer from the film end face.

[0043] (B) Component: A compound having an ethylenically unsaturated double bond (B) The component preferably contains a (meth)acryloyl group, and more preferably contains a bifunctional or higher functional compound (a bifunctional or higher functional compound having an ethylenically unsaturated double bond). The "bifunctional or higher functional compound having an ethylenically unsaturated double bond" means a compound having two or more ethylenically unsaturated double bonds in one molecule.

[0044] As the compound having an ethylenically unsaturated double bond, a (meth)acrylate compound is preferable. As the compound having an ethylenically unsaturated double bond, it may contain only a bifunctional compound having an ethylenically unsaturated double bond, or may contain a bifunctional compound having an ethylenically unsaturated double bond and a trifunctional or higher functional compound having an ethylenically unsaturated double bond. As the compound having an ethylenically unsaturated double bond, for example, it may contain a tetrafunctional, pentafunctional, or hexafunctional compound having an ethylenically unsaturated double bond.

[0045] Examples of the bifunctional compound having an ethylenically unsaturated double bond include alkyldi(meth)acrylate, 1,3-bis(meth)acryloyloxy-2-propanol, and the following general formula (I):

Chemical formula

[0046] General formula (II) [Chemical formula] (In the formula, R 2 is independently a hydrogen atom or a methyl group, X 2 O and Y 2 O are independently an oxyethylene group or an oxypropylene group, m3, m4, n2 and n3 are independently integers from 0 to 40, m3 + m4 is from 1 to 40, and n2 + n3 is from 0 to 20.) Examples thereof include bisphenol A type di(meth)acrylate represented by etc.

[0047] Examples of the polyalkylene glycol di(meth)acrylate represented by the formula (I) include those where R 1 = methyl group, m1 + m2 = 6 (average value), n1 = 12 (average value), X 1 O is an oxyethylene group, Y 1 O is an oxypropylene group, such as a vinyl compound (manufactured by Hitachi Chemical Co., Ltd., product name "FA-024M") etc.

[0048] Examples of the bisphenol A type di(meth)acrylate compound represented by the general formula (II) include BPE-200 (R 2 = methyl group, X 2 O = oxyethylene group, m3 + m4 = 4, n2 = n3 = 0), BPE-500 (R 2 = methyl group, X 2 O = oxyethylene group, m3 + m4 = 10, n2 = n3 = 0), BPE-900 (R 2 = methyl group, X 2 O = oxyethylene group, m3 + m4 = 17, n2 = n3 = 0) (manufactured by Shin-Nakamura Chemical Co., Ltd., product name), FA-321M (R 2 = methyl group, X 2 O = oxyethylene group, m3 + m4 = 10, n2 = n3 = 0), FA-P321M (R 2 = methyl group, X 2 O = oxypropylene group, m3 + m4 = 10, n2 = n3 = 0) (manufactured by Hitachi Chemical Co., Ltd., product name), etc. These can be used alone or in any combination of two or more.

[0049] (Component (B) preferably contains the bisphenol A type di(meth)acrylate compound represented by the general formula (II) from the viewpoints of adhesion, resolution, and reduction in the number of foreign matters. The content of the bisphenol A type di(meth)acrylate compound represented by the general formula (II) is preferably 1% by mass or more, more preferably 20% by mass or more, still more preferably 50% or more, and particularly preferably 80% or more based on the total amount of component (B). When using the bisphenol A type di(meth)acrylate compound represented by the general formula (II) having a high aromatic ring ratio, the compatibility between the photosensitive resin composition and component (C) is likely to be improved. Therefore, it is considered that the generation of component (C) in the photosensitive resin composition is easily prevented, and thus the number of foreign matters is easily reduced.

[0050] In the bisphenol A type di(meth)acrylate compound represented by the general formula (II), the average value of n2 + n3 + m3 + m4 is preferably 20 or less, more preferably 10 or less, from the viewpoints of resolution and adhesion. It is more preferable to include the bisphenol A type di(meth)acrylate in which the average value of n2 + n3 + m3 + m4 exceeds 5 and is 10 or less, and the bisphenol A type di(meth)acrylate in which the average value of n2 + n3 + m3 + m4 is 5 or less. The average value of n2 + n3 + m3 + m4 may be 2 or more. The number of structural units of the oxyethylene group or oxypropylene group represents an integer value in a single molecule and a rational number as an average value in an aggregate of a plurality of molecules.

[0051] Examples of commercially available compounds having two functional groups and ethylenically unsaturated double bonds include, for example, NK Ester (registered trademark) A-HD-N, A-NOD-N, A-DOD-N, A-NPG, 701A, A-200, A-400, A-600, A-1000, APG-200, APG-400, APG-700, A-PTMG65, A-DCP, ABE-300, A-BPE-4, A-BPE-10, A-BPE-20, HD-N, NOD-N, DOD-N, NPG, 701, 2G, 3G, 4G, 9G, 14G, 23G, 9PG, DCP, BPE-80N, BPE-100, BPE-200, BPE-500, BPE-900, BPE-1300N, NK Oligo (registered trademark) UA-4200, UA-160TM, UA-290TM, UA-W2A, UA-4400, UA-122P, U-200PA (manufactured by Shin-Nakamura Chemical Co., Ltd.), Light Acrylate (registered trademark) 3EG-A, 4EG-A, 9EG-A, 14EG-A, PTMGA-250, NP-A, MPD-A, 1.6HX-A, 1.9ND-A, the same as DCP-A, the same as BP-4EAL, the same as BP-4PA, the same as HPP-A, Light Ester G-201P (all manufactured by Kyoeisha Chemical Co., Ltd.), FUNCRYL® FA-124AS, the same FA-023M, the same FA-121M, the same FA-124M, the same FA-125M, the same FA-129AS, the same FA-137M, the same FA-220M, the same FA-222A, the same FA-240A, the same FA-240M, the same FA-320M, the same FA-3218M, the same FA-321A, the same FA-321M, the same FA-324A, the same FA-731A, the same FA-P240A, the same FA-P270A, the same FA-PTG9A, the same FA-PTG9M, the same FA-PTG28A, the same FA-PTG49A (all manufactured by Showa Denko Materials Co., Ltd.), DPGDA, HDDA, TPGDA, EBECRYL 145, EBECRYL 150, PEG400DA, EBECRYL 11, IRR 214-K, EBECRYL 130, EBECRYL PEG200DMA (all manufactured by Daicel Allnex Co., Ltd.), SR212, SR213, SR230, SR238F, SR259, SR268, SR272, SR306H, SR344, SR349, SR508, CD560, CD561, CD564, SR601, SR602, SR610, SR833S, SR9003, SR9045, SR9209, SR205, SR206, SR209, SR210, SR214, SR231, SR239, SR248, SR252, SR297, SR348, SR480, CD540, CD541, CD542, SR603, SR644, SR9036 (all manufactured by Arkema Co., Ltd.), KAYARAD® NPGDA, the same PEG400DA, the same FM-400, the same R-167, the same HX-220, the same HX-620, the same R-551, the same R-712, the same R-604, the same R-684 (all manufactured by Nippon Kayaku Co., Ltd.), etc. can be mentioned.

[0052] The proportion of the bifunctional compound having an ethylenically unsaturated double bond is preferably 20% by mass or more, more preferably 50% by mass or more, and still more preferably 75% by mass or more from the viewpoints of peelability, resolution, and adhesion, based on the total amount of component (B).

[0053] Examples of compounds having three or more functional groups and ethylenically unsaturated double bonds include trimethylolpropane tri(meth)acrylate, glycerin tri(meth)acrylate, isocyanuric acid tri(meth)acrylate, pentaerythritol (tri / tetra)(meth)acrylate, ditrimethylolpropane (tetra / penta / hexa)(meth)acrylate, dipentaerythritol (tetra / penta / hexa)(meth)acrylate, etc.

[0054] In addition, as a compound having three or more ethylenically unsaturated double bonds, it may be a compound obtained by forming a (meth)acrylate from an alcohol having three or more groups capable of adding an alkylene oxide group in the molecule as a central skeleton and to which an alkylene oxide group such as an ethylene oxide group, a propylene oxide group, or a butylene oxide group is added, and (meth)acrylic acid. For example, alkylene oxide-modified tri(meth)acrylate of trimethylolpropane, alkylene oxide-modified tri(meth)acrylate of glycerin, alkylene oxide-modified pentaerythritol (tri / tetra)(meth)acrylate, alkylene oxide-modified ditrimethylolpropane (tetra / penta / hexa)(meth)acrylate, alkylene oxide-modified dipentaerythritol (tetra / penta / hexa)(meth)acrylate, alkylene oxide-modified isocyanuric acid tri(meth)acrylate, etc. may be mentioned.

[0055] As a compound having three or more ethylenically unsaturated double bonds, it may contain alkylene oxide-modified pentaerythritol (tri / tetra)(meth)acrylate from the viewpoint of developability.

[0056] Examples of commercially available compounds having three or more ethylenically unsaturated double bonds include NK Ester (registered trademark) A-TMPT, A-TMPT-9EO, AT-20E, A-GLY-3E, A-GLY-9E, A-GLY-20E, A-9300, A-9200YN, A-TMM-3, A-TMM-3L, A-TMM-3LM-N, A-TMMT, ATM-35E, AD-TMP, A-DPH, A-9550, A-DPH-12E, TPOA-50, NK Oligo (registered trademark) UA-7100, UA-1100H, U-6LPA, UA-33H, U-10HA, U-10PA, U-15HA (manufactured by Shin-Nakamura Chemical Co., Ltd.), Light Acrylate (registered trademark) TMP-A, cPE-3A, PE-4A, DPE-6A (manufactured by Kyoeisha Chemical Co., Ltd.), FA-731A (manufactured by Showa Denko Materials Co., Ltd.), TMPTA, EBECRYL 160S, OTA 480, PETIA, PETRA, EBECRYL 40, PETA, EBECRYL 140, EBECRYL 1140, EBECRYL 1142, DPHA, EBECRYL 895, EBECRYL 896, EBECRYL TMPTMA (manufactured by Daicel Ornex Co., Ltd.), SR351S, SR368, SR415, SR444, SR454, SR492, SR499, CD501, SR502, SR9020, D9021, SR9035, SR295, SR355, SR399, SR494, SR9041 (manufactured by Arkema Co., Ltd.), KAYARAD (registered trademark) GPO-303, TMPTA, THE-330, TPA-330, PET-30, T-1420(T), RP-1040, DPHA, DPEA-12, D-310, DPCA-20 (manufactured by Nippon Kayaku Co., Ltd.), and the like.

[0057] From the viewpoints of adhesion and developability, the proportion of the compound having three ethylenically unsaturated double bonds may be 1 to 50% by mass, may be 1 to 25% by mass, or may be 1 to 15% by mass based on the total amount of component (B).

[0058] From the viewpoints of sensitivity, tackiness, and followability, the content ratio of component (B) to the total solid mass of the photosensitive resin composition is preferably 30% by mass or more, more preferably 35% by mass or more. Further, from the viewpoints of edge fusion property, tackiness, and resolution, it is preferably 50% by mass or less, more preferably 45% by mass or less, and still more preferably 42% by mass or less.

[0059] From the viewpoints of edge fusion property, tackiness, and resolution, the value of the solid content of component (B) relative to the solid content of component (A) (that is, the value of (solid content of component (B)) / (solid content of component (A))) is preferably 1.4 or less, more preferably 1.3 or less, still more preferably 1.2 or less, and particularly preferably 1.1 or less. The lower limit is preferably 0.7 or more, more preferably 0.8 or more, still more preferably 0.9 or more, and particularly preferably 1.0 or more.

[0060] In this specification, the edge fusion property refers to the tendency of the resist to protrude from the end face of the photosensitive element roll, particularly the tendency of the resist to protrude from the end face during storage of the photosensitive element roll. The smaller the amount of the protruding resist, the more preferable. Further, the tackiness refers to the adhesiveness of the photosensitive resin composition. From the viewpoints of suppressing lamination defects on the substrate and suppressing peeling defects of the protective film and the support film, it is preferable that the adhesiveness of the photosensitive resin composition is appropriate. Conversely, by suitably controlling the adhesiveness of the photosensitive resin composition, it is easy to suppress lamination defects on the substrate and also easy to suppress peeling defects of the protective film and the support film.

[0061] The number of ethylenically unsaturated double bonds per 100 g of the solid content of the photosensitive resin composition is preferably 0.1 to 0.3 mol. By being 0.1 mol or more, it is easy to prevent the photosensitive resin component from eluting from the cured resist pattern in the post-development water washing process, and thus it is easy to prevent the water washing process from being contaminated. By being 0.3 mol or less, in the post-development water washing process, chipping and thus dropping off of the cured resist pattern are less likely to occur, and for this reason, it is easy to prevent the water washing process from being contaminated.

[0062] The number of ethylenically unsaturated double bonds per 100 g of the solid content of the photosensitive resin composition is preferably 0.1 mol or more, more preferably 0.11 mol or more, still more preferably 0.12 mol or more, and particularly preferably 0.13 mol or more. Also, it is preferably 0.3 mol or less, more preferably 0.28 mol or less, still more preferably 0.25 mol or less, particularly preferably 0.22 mol or less, 0.20 mol or less, or 0.18 mol or less, and most preferably 0.15 mol or less. Also, the number of ethylenically unsaturated double bonds per 100 g of the solid content of the photosensitive resin composition is preferably from 0.1 to 0.25 mol, more preferably from 0.1 to 0.2 mol, still more preferably from 0.11 to 0.2 mol, and particularly preferably from 0.11 to 0.15 mol.

[0063] (C) component: Biimidazole photoinitiator (C) component is a photoinitiator having a biimidazole structure. (C) component content is preferably 5.0% by mass or more, preferably 5.25% by mass or more, more preferably 5.5% by mass or more, still more preferably 6.0% by mass or more, and most preferably 7.0% by mass or more, from the viewpoints of sensitivity and adhesion, based on the total solid content mass of the photosensitive resin composition. Also, from the viewpoint of reducing the number of foreign matters, it is preferably 10% by mass or less, more preferably 9.0% by mass or less, and still more preferably 8.0% by mass or less.

[0064] Examples of the (C) component include rofin dimers, that is, dimers of 2,4,5-triarylimidazole. As the rofirin dimer, that is, the dimer of 2,4,5-triarylimidazole, there are dimers of 2-(o-chlorophenyl)-4,5-diphenylbiimidazole (alias: 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole), 2,2',5-tris-(o-chlorophenyl)-4-(3,4-dimethoxyphenyl)-4',5'-diphenylbiimidazole, 2,4-bis-(o-chlorophenyl)-5-(3,4-dimethoxyphenyl)-diphenylbiimidazole, 2,4,5-tris-(o-chlorophenyl)-diphenylbiimidazole, 2-(o-chlorophenyl)-bis-4,5-(3,4-dimethoxyphenyl)-biimidazole, 2,2'-bis-(2-fluorophenyl)-4,4',5,5'-tetrakis-(3-methoxyphenyl)-biimidazole, 2,2'-bis-(2,3-difluoromethylphenyl)-4,4',5,5'-tetrakis-(3-methoxyphenyl)-biimidazole, 2,2'-bis-(2,4-difluorophenyl)-4,4',5,5'-tetrakis-(3-methoxyphenyl)-biimidazole, 2,2'-bis-(2,5-difluorophenyl)-4,4',5,5'-tetrakis-(3-methoxyphenyl)-biimidazole, 2,2'-bis-(2,6-difluorophenyl)-4,4',5,5'-tetrakis-(3-methoxyphenyl)-biimidazole, 2,2'-bis-(2,3,4-trifluorophenyl)-4,4',5,5'-tetrakis-(3-methoxyphenyl)-biimidazole, 2,2'-bis-(2,3,5-trifluorophenyl)-4,4',5,5'-tetrakis-(3-methoxyphenyl)-biimidazole, 2,2'-bis-(2,3,6-trifluorophenyl)-4,4',5,5'-tetrakis-(3-methoxyphenyl)-biimidazole, 2,2'-bis-(2,4,5-trifluorophenyl)-4,4',5,5'-tetrakis-(3-methoxyphenyl)-biimidazole, 2,2'-bis-(2,4,6-trifluorophenyl)-4,4',5,5'-tetrakis-(3-methoxyphenyl)-biimidazole, 2,2'-bis-(2,3,4,5-tetrafluorophenyl)-4,4',5,Examples include 5'-tetrakis-(3-methoxyphenyl)-biimidazole, 2,2'-bis-(2,3,4,6-tetrafluorophenyl)-4,4',5,5'-tetrakis-(3-methoxyphenyl)-biimidazole, and 2,2'-bis-(2,3,4,5,6-pentafluorophenyl)-4,4',5,5'-tetrakis-(3-methoxyphenyl)-biimidazole, etc.

[0065] From the viewpoints of high sensitivity, resolution, and adhesion, the (C) biimidazole photoinitiator preferably contains a rofin dimer, and more preferably contains a 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer.

[0066] (D) component: Other photoinitiators and / or sensitizers (D) component is a photoinitiator or a sensitizer other than the (C) component. In this specification, a photoinitiator is a compound that initiates the polymerization of the (B) component by irradiating light of a specific wavelength. The photoinitiator may be, for example, a radical polymerization initiator. In this specification, a sensitizer is a compound that promotes the polymerization of the (B) component by irradiating light of a specific wavelength. A compound that functions as both a photoinitiator and a sensitizer may also be included as the (D) component.

[0067] Here, a compound that can be adopted as the (C) component may have the function of the (D) component, and a compound that can be adopted as the (D) component may also have the function of the (C) component. On the other hand, when a specific photoinitiator is adopted assuming the (C) component, other photoinitiators may be regarded as the (D) component. For example, when the (C) component contains a rofin dimer of 5.0 mass% or more based on the total solid mass of the photosensitive resin composition, photoinitiators other than the rofin dimer may be treated as the (D) component.

[0068] Examples of the component (D) include N-aryl-α-amino acid compounds, quinone compounds, aromatic ketone compounds, anthracene derivatives, acetophenone compounds, acylphosphine oxide compounds, benzoin compounds, benzoin ether compounds, dialkyl ketal compounds, thioxanthone compounds, dialkylaminobenzoic acid ester compounds, oxime ester compounds, acridine compounds, pyrazoline derivatives, ester compounds of N-aryl amino acids, coumarin derivatives, and halogen compounds.

[0069] Examples of the aromatic ketone compound include benzophenone compounds. Examples of the benzophenone compounds include benzophenone, Michler's ketone [4,4'-bis(dimethylamino)benzophenone], 4-methoxy-4'-dimethylaminobenzophenone, 4-(dimethylamino)benzophenone, etc. From the viewpoints of the sensitizing effect and adhesion, 4,4'-bis(diethylamino)benzophenone or 4-(dimethylamino)benzophenone is preferable as the aromatic ketone compound.

[0070] In this specification, the term "anthracene derivative" means both anthracene and compounds derived therefrom. Examples of the anthracene derivatives include anthracene, 9,10-dialkoxyanthracene, 9,10-dimethoxyanthracene, 9,10-diethoxyanthracene, 9,10-dibutoxyanthracene, 9,10-diphenylanthracene, 2-ethylanthraquinone, octaethylanthraquinone, 1,2-benzanthraquinone, 2,3-benzanthraquinone, 2-phenylanthraquinone, 2,3-diphenylanthraquinone, 1-chloroanthraquinone, 10-phenyl-9-anthraceneboronic acid, etc. From the viewpoints of the sensitizing effect and adhesion, 9,10-dibutoxyanthracene, 9,10-diphenylanthracene, 10-phenyl-9-anthraceneboronic acid are preferable, and particularly, 9,10-diphenylanthracene and 10-phenyl-9-anthraceneboronic acid are preferable.

[0071] As pyrazoline derivatives, from the viewpoints of adhesion and rectangularity of the resist pattern, 1-phenyl-3-(4-tert-butyl-styryl)-5-(4-tert-butyl-phenyl)-pyrazoline, 1-phenyl-3-(4-biphenyl)-5-(4-tert-butyl-phenyl)-pyrazoline, 1-phenyl-3-(4-biphenyl)-5-(4-tert-octyl-phenyl)-pyrazoline, and 1-phenyl-3-(4-methoxystyryl)-5-(4-methoxyphenyl)-pyrazoline are preferred.

[0072] When the photosensitive layer contains the component (D), from the viewpoint of storage stability, it is preferably contained at least one of a benzophenone compound, a pyrazoline compound, an anthracene compound, and a coumarin compound, more preferably contains at least one of a benzophenone compound and a pyrazoline compound, and still more preferably contains a benzophenone compound.

[0073] The content of the component (D) is preferably 0 to 0.5% by mass, more preferably 0 to 0.1% by mass, still more preferably 0 to 0.05% by mass, and particularly preferably 0 to 0.025% by mass. By adjusting the content of the component (D) within the above range, it is easy to reduce the absorbance in the region other than the exposure wavelength and easy to improve the storage stability.

[0074] Component (E): Polymerization inhibitor (E) components include, for example, phenothiazine, p-methoxyphenol, hydroquinone, pyrogallol, naphthylamine, tert-butylcatechol, cuprous chloride, 2,6-di-tert-butyl-p-cresol, 2,2'-methylenebis(4-methyl-6-tert-butylphenol), 2,2'-methylenebis(4-ethyl-6-tert-butylphenol), triethylene glycol-bis[3-(3-t-butyl-5-methyl-4-hydroxyphenyl)propionate], nitrosophenylhydroxyamine aluminum salt (for example, aluminum salt with 3 moles of nitrosophenylhydroxylamine added, etc.), diphenylnitrosamine, and the like. Among them, triethylene glycol-bis[3-(3-t-butyl-5-methyl-4-hydroxyphenyl)propionate] or aluminum salt with 3 moles of nitrosophenylhydroxylamine added is preferred. These can be used alone or in combination of two or more.

[0075] (E) component preferably contains any one of phenothiazine, p-methoxyphenol, tert-butylcatechol, and 2,6-di-tert-butyl-p-cresol from the viewpoint of storage stability.

[0076] (E) content is preferably 10 to 5000 ppm, more preferably 50 to 1000 ppm, and still more preferably 50 to 500 ppm based on the total solid mass of the photosensitive resin composition from the viewpoint of resolution.

[0077] Other components The photosensitive resin composition can contain other components (antioxidants, stabilizers, base dyes, plasticizers, etc.) as desired.

[0078] Examples of the base dyes include Basic Green 1 [CAS No. (hereinafter the same): 633-03-4] (e.g., Aizen Diamond Green GH, trade name, manufactured by Hodogaya Chemical Co., Ltd.), Fuchsin [632-99-5], Methyl Violet [603-47-4], Methyl Green [82-94-0], Victoria Blue B [2580-56-5], Basic Blue 7 [2390-60-5] (e.g., Aizen Victoria Pure Blue BOH, trade name, manufactured by Hodogaya Chemical Co., Ltd.), Rhodamine B [81-88-9], Rhodamine 6G [989-38-8], Basic Yellow 2 [2465-27-2], and the like. Among them, Basic Green 1 is preferable from the viewpoints of improving coloring property, hue stability, and exposure contrast. These can be used alone or in combination of two or more.

[0079] The content of the base dye is preferably 0.001 to 3% by mass, more preferably 0.01 to 2% by mass, and still more preferably 0.04 to 1% by mass. From the viewpoint of obtaining good coloring property, the content of the base dye is preferably not less than the above lower limit value, while from the viewpoint of maintaining the sensitivity of the photosensitive layer, it is preferably not more than the above upper limit value.

[0080] Examples of the antioxidant include triphenyl phosphite (e.g., manufactured by ADEKA, trade name: TPP), tris(2,4-di-tert-butylphenyl) phosphite (e.g., manufactured by ADEKA, trade name: 2112), tris(monononylphenyl) phosphite (e.g., manufactured by ADEKA, trade name: 1178), bis(monononylphenyl)-dinonylphenyl phosphite (e.g., manufactured by ADEKA, trade name: 329K), and the like. These can be used alone or in combination of two or more.

[0081] The content of the antioxidant is preferably 0.01 to 0.8% by mass, more preferably 0.01 to 0.3% by mass, based on the total solid mass of the photosensitive resin composition. From the viewpoint of favorably exhibiting the hue stability of the resist pattern and improving the sensitivity of the photosensitive layer, the content of the antioxidant is preferably not less than the above lower limit value. On the other hand, from the viewpoint of favorably exhibiting the hue stability while suppressing the color developability of the resist pattern and improving the adhesion, it is preferably not more than the above upper limit value.

[0082] The stabilizer can be used from the viewpoint of improving the thermal stability of the photosensitive resin composition. Examples of the stabilizer include at least one of an alkylene oxide compound having a glycidyl group and a benzotriazole compound. These can be used alone or in combination of two or more.

[0083] Examples of the alkylene oxide compound having a glycidyl group include neopentyl glycol diglycidyl ether (e.g., Epolite 1500NP manufactured by Kyoeisha Chemical Co., Ltd.), nonaethylene glycol diglycidyl ether (e.g., Epolite 400E manufactured by Kyoeisha Chemical Co., Ltd.), bisphenol A-propylene oxide 2 mol adduct diglycidyl ether (e.g., Epolite 3002 manufactured by Kyoeisha Chemical Co., Ltd.), 1,6-hexanediol diglycidyl ether (e.g., Epolite 1600 manufactured by Kyoeisha Chemical Co., Ltd.), and the like. These can be used alone or in combination of two or more.

[0084] Examples of the benzotriazole compound include carboxybenzotriazole, 1,2,3-benzotriazole, 1-chloro-1,2,3-benzotriazole, 1-(N,N-bis(2-ethylhexyl)aminomethyl)-1,2,3-benzotriazole, 1-(N,N-bis(2-ethylhexyl)aminomethyl)-1,2,3-tolyltriazole, 1-(N,N-bis-2-hydroxyethyl)aminomethyl)-1,2,3-benzotriazole, 1-(N,N-bis(2-ethylhexyl)aminomethyl)-5-carboxy-1,2,3-benzotriazole, and the like.

[0085] In the photosensitive resin composition, the total content of the antioxidant, the alkylene oxide compound having a glycidyl group, and the benzotriazole compound is preferably 0.001 to 3% by mass, more preferably 0.05 to 1% by mass.

[0086] In this embodiment, a color-developing dye that develops color by light irradiation may be contained in the photosensitive layer. As the color-developing dye, for example, a combination of a leuco dye and a halogen compound is known. Examples of the leuco dye include tris(4-dimethylamino-2-methylphenyl)methane [leuco crystal violet], tris(4-dimethylamino-2-methylphenyl)methane [leuco malachite green], and the like. Examples of the halogen compound include amyl bromide, isoamyl bromide, isobutylene bromide, ethylene bromide, diphenylmethyl bromide, benzal bromide, methylene bromide, tribromomethylphenyl sulfone, carbon tetrabromide, tris(2,3-dibromopropyl) phosphate, trichloroacetamide, amyl iodide, isobutyl iodide, 1,1,1-trichloro-2,2-bis(p-chlorophenyl)ethane, hexachloroethane, and the like.

[0087] In this embodiment, additives such as a plasticizer may be contained in the photosensitive layer as necessary. Examples of the additives include phthalic acid esters such as diethyl phthalate, o-toluenesulfonamide, p-toluenesulfonamide, tributyl citrate, triethyl citrate, triethyl acetylcitrate, tri-n-propyl acetylcitrate, tri-n-butyl acetylcitrate, polypropylene glycol, polyethylene glycol, polyethylene glycol alkyl ether, polypropylene glycol alkyl ether, and the like.

[0088] <Configuration of the photosensitive layer> The thickness of the photosensitive layer is preferably 3 to 100 μm, and specifically preferred film thicknesses include 7 μm, 15 μm, 25 μm, 40 μm, 60 μm, etc. A more preferable upper limit is 50 μm. As the thickness approaches 3 μm, the resolution is likely to improve, and as it approaches 100 μm, the film strength is likely to improve, so it can be appropriately selected according to the application. When the formed resist pattern is used in the plating formation process, the film thickness is preferably 10 to 30 μm, more preferably 15 to 25 μm.

[0089] In this embodiment, the absorbance (Y) at a wavelength of 365 nm when the film thickness of the photosensitive layer is 25 μm is 0.35 or less. According to this, it is excellent in storage stability, rectangularity of the resist pattern, and it is easy to achieve good adhesion. From the same viewpoint, such absorbance is preferably 0.3 or less, more preferably 0.2 or less, still more preferably 0.18 or less, and particularly preferably 0.16 or less. Such absorbance may be 0 or more, and from the viewpoint of obtaining a photosensitive layer resin composition with good photoreactivity and excellent sensitivity, 0.11 or more is preferable.

[0090] Generally, the absorbance of the photosensitive layer can be measured with a spectrophotometer by placing the substrate on which the photosensitive layer is formed on the reference side. Also, generally, the absorbance can be measured with reference to JIS K 0115 (2004). When using a spectrophotometer, the absorbance of the photosensitive layer can also be calculated by converting the result measured using only the substrate as a reference. In the case of the photosensitive element described later, a support film can be used as the substrate. The absorbance measured by the above method is a value derived including the amount of light scattered by the photosensitive layer and the substrate. The "absorbance" referred to in this embodiment is a value derived using the method described in the <Absorbance> item in the examples.

[0091] In this embodiment, the contribution (X) is represented by the following formula (1): X (%) = 100 × εc / absorbance (Y) of the photosensitive layer ··· (1) ε: Value of absorbance change per 1 mass% of component (C) c: Content (mass%) of component (C) in the total solid content of the photosensitive resin composition It is calculated by

[0092] ε can be obtained by the following method. (A) A photosensitive resin composition is prepared by adding (C) component in different contents to a total of 100 parts by mass of (A) component and (B) component, and each is coated on a substrate so as to have a film thickness of 25 μm, and the absorbance of the obtained photosensitive layer is measured. With the content (%) of (C) component based on the total solid mass of the photosensitive resin composition as the X-axis and the absorbance (Y) of the photosensitive layer as the Y-axis, the obtained results are plotted. The data thus obtained is linearly approximated to obtain a straight line having a predetermined slope. The slope of this straight line corresponds to the change value ε of the absorbance per 1% by mass of (C) component at this content. As the (A) component used at this time, those containing methacrylic acid, styrene, benzyl methacrylate, 2-hydroxyl methacrylate, and methyl methacrylate in an arbitrary ratio are preferable. As the (B) component, bisphenol A type di(meth)acrylate such as FA-321M is preferable. Since these components have a small absorbance at 365 nm, they are suitable for accurately measuring the absorbance change value ε per 1% by mass of (C) component.

[0093] From the viewpoint of storage stability, the contribution (X) is preferably 45% or more, more preferably 55% or more, still more preferably 65% or more, and particularly preferably 85% or more. The larger the value (X) is, the easier it is to suppress the sensitizing action by additives other than the (C) component. Therefore, it is considered that the reactivity to light with a long wavelength such as yellow light is likely to decrease, and the storage stability tends to be improved.

[0094] As means for increasing the contribution (X), for example, increasing the content of the (C) component, decreasing the content of the (D) component, decreasing the content of other components having absorption at 365 nm, etc. can be mentioned.

[0095] When the photosensitive resin composition contains a plurality of (C) components, the contribution (X) is determined as follows. That is, when the component (C) contains components (C-1) to (C-n) (n is an integer of 2 or more), the change values ε1 to ε of the absorbance per 1% by mass are respectively n , the contents c1 to c of each component (C) n , and thus contributions (X-1) to (X-n) are derived. And the total value of the obtained contributions (X-1) to (X-n) is treated as the contribution (X) in the present embodiment.

[0096] [Protective film] The photosensitive element of the present embodiment may include a protective film. The support film, the photosensitive layer, and the protective film may be laminated in this order. The protective film can be laminated on the photosensitive layer side of the laminate of the support film and the photosensitive layer, and functions as a cover.

[0097] When the adhesion between the photosensitive layer and the protective film is sufficiently smaller than the adhesion between the photosensitive layer and the support film, the protective film can be easily peeled off from the photosensitive layer. For example, a polyethylene film, a polypropylene film, a stretched polypropylene film, a polyester film, etc. can be preferably used as the protective film. Also, a release layer may be provided on the surface of the protective film.

[0098] The film thickness of the protective film is preferably 10 to 100 μm, more preferably 10 to 50 μm. Examples of the protective film include Alpha (registered trademark) EM-501, E-200, E-201F, FG-201, MA-411 (manufactured by Oji F-Tex Co., Ltd. above), Trephan (registered trademark) KW37, 2578, 2548, 2500, YM17S, Serapel (registered trademark) PJ271, PJ111, HP2, PJ101, WZ, MDA, MFA, TK07, BKE, BX8A, SY (manufactured by Toray Industries, Inc. above), GF-18, GF-818, GF-858 (manufactured by Tamapoly Co., Ltd. above), etc.

[0099] [Photosensitive element roll] The photosensitive element may be in a long strip shape, or may be in a roll shape in which the long strip-shaped photosensitive element is wound around a winding core.

[0100] [Method for forming a resist pattern] The method for forming a resist pattern using the photosensitive element according to this embodiment includes the following steps: A step of laminating the photosensitive element on a substrate; A step of exposing the photosensitive layer of the laminated photosensitive element; and A step of developing the photosensitive layer after exposure; preferably in this order.

[0101] (Lamination step) In the lamination step, specifically, when the photosensitive element includes a protective film, after peeling the protective film from the photosensitive element, the photosensitive layer is heat-pressed onto the surface of a support (for example, a substrate) with a laminator and laminated one or more times. Examples of the material of the substrate include copper, stainless steel (SUS), glass, indium tin oxide (ITO), etc. The heating temperature during lamination is generally 40 to 160°C. Heat-pressing can be performed by using a laminator equipped with rolls or by passing the laminate of the substrate and the photosensitive layer through the rolls several times. Heat-pressing can be performed under a reduced pressure environment if desired.

[0102] (Exposure step) In the exposure step, the photosensitive layer is exposed using an exposure machine. Exposure can be performed after peeling the support if desired. When exposing through a photomask, the exposure amount is determined by the illuminance of the light source and the exposure time, and may be measured using a light meter. In the exposure step, direct imaging exposure may be performed. In direct imaging exposure, exposure is performed directly on the substrate by a drawing device without using a photomask. As the light source, a semiconductor laser or an ultra-high pressure mercury lamp with a wavelength of 350 to 410 nm is used. When the drawing pattern is controlled by a computer, the exposure amount is determined by the illuminance of the exposure light source and the moving speed of the substrate.

[0103] The light irradiation method used in the exposure process is preferably at least one method selected from projection exposure method, proximity exposure method, contact exposure method, direct imaging exposure method, and electron beam direct writing method, and more preferably carried out by a projection exposure method or a direct imaging exposure method.

[0104] A heating process may be provided between the exposure process and the development process. The heating temperature is preferably about 30 to about 200 °C, more preferably 30 to 150 °C, and even more preferably 35 to 120 °C. By implementing this heating process, it is possible to improve the resolution and adhesion. For heating, a heating furnace, constant temperature bath, hot plate, hot air dryer, infrared dryer, hot roll, etc. using hot air, infrared rays, or far-infrared rays can be used.

[0105] The elapsed time from the exposure process to the heating process, more precisely the elapsed time from the point when exposure stops to the point when heating starts, is preferably 10 to 600 seconds, and more preferably 20 to 300 seconds. The elapsed time from the start of heating to the point when heating stops is preferably 1 to 120 seconds, and more preferably 5 to 60 seconds.

[0106] (Development process) In the development process, the unexposed part or exposed part in the photosensitive layer after exposure is removed with a developer using a developing device. After exposure, if there is a support film on the photosensitive layer, it is removed. Subsequently, the unexposed part or exposed part is developed and removed using a developer composed of an aqueous alkali solution to obtain a resist image.

[0107] As the aqueous alkali solution, aqueous solutions such as Na2CO3, K2CO3, and tetramethylammonium hydroxide are preferred. The aqueous alkali solution is selected according to the characteristics of the photosensitive layer, but an aqueous Na2CO3 solution with a concentration of 0.2 to 2 mass% is generally used. A surfactant, an antifoaming agent, a small amount of organic solvent for accelerating development, etc. may be added to the aqueous alkali solution. The temperature of the developer in the development process is preferably kept constant within the range of 20 to 40 °C.

[0108] In the development process, it is preferable to have a water washing process for removing the developer contained in the resist pattern after development. As the washing water, in addition to pure water, industrial water, etc., it is selected according to the characteristics of the photosensitive layer, but a polyvalent metal salt such as MgSO4 with a concentration of 0.001 to 1% by mass may be added to improve the resolution and the shape of the resist pattern. The temperature of the washing water in the water washing process is preferably kept constant within the range of 20 to 40°C.

[0109] Although the resist pattern is obtained by the above process, if desired, a heating process can also be carried out at 60 to 300°C. By implementing this heating process, the chemical resistance of the resist pattern can be improved. For the heating process, a heating furnace using a method of using hot air, infrared rays, or far-infrared rays can be used.

[0110] In order to obtain a conductor pattern, after the development process or the heating process, a conductor pattern forming process of etching or plating the substrate on which the resist pattern is formed may be performed.

[0111] The manufacturing method of the conductor pattern is performed, for example, by using a metal plate or a metal film-insulated plate as the substrate, forming a resist pattern by the above-described resist pattern forming method, and then going through the conductor pattern forming process. In the conductor pattern forming process, a conductor pattern is formed on the substrate surface (for example, copper surface) exposed by development using a known etching method or plating method.

[0112] Furthermore, after manufacturing the conductor pattern by the above-described manufacturing method of the conductor pattern, a stripping process of stripping the resist pattern from the substrate using an aqueous solution having a stronger alkalinity than the developer is performed, whereby a wiring board (for example, a printed wiring board) having a desired wiring pattern can be obtained.

[0113] The alkaline aqueous solution for peeling (hereinafter also referred to as "peeling solution") is not particularly limited, but an aqueous solution of NaOH or KOH with a concentration of 2 to 5% by mass, or an organic amine-based peeling solution is generally used. A small amount of a water-soluble solvent may be added to the peeling solution. Examples of the water-soluble solvent include alcohol and the like. The temperature of the peeling solution in the peeling step is preferably in the range of 40 to 70°C.

[0114] In this embodiment, the photosensitive element can be used in the manufacture of printed wiring boards; the manufacture of lead frames for mounting IC chips; the precision processing of metal foils such as the manufacture of metal masks; the manufacture of packages such as ball grid arrays (BGAs) and chip scale packages (CSPs); the manufacture of tape substrates such as chip on film (COF) and tape automated bonding (TAB); the manufacture of semiconductor bumps; and the manufacture of partitions of flat panel displays such as ITO electrodes, address electrodes, and electromagnetic shields. Note that, unless otherwise specified, the values of the above-described parameters are measured in accordance with the measurement methods in the examples described later.

Examples

[0115] Hereinafter, the present embodiment will be described with reference to examples and comparative examples. However, the present embodiment is not limited only to the following examples as long as it does not depart from the gist thereof. The physical properties in the examples were measured by the following methods.

[0116] <Synthesis of Component (A)> The monomers (copolymerization components) shown in the table were mixed together with azobisisobutyronitrile in the blending amounts (unit: parts by mass) shown in the table to prepare solution (a). 200 g of methyl ethyl ketone and 100 g of ethanol were charged into a flask equipped with a stirrer, a reflux condenser, a thermometer, a dropping funnel, and a nitrogen gas introduction tube. Then, while blowing nitrogen gas into the flask, the mixture was stirred and heated to 80°C. 300 g of the above solution (a) was dropped into the above mixture in the flask at a constant dropping rate over 4 hours, and then stirred at 80°C for 2 hours.

[0117] Next, 0.5 parts by mass of azobisisobutyronitrile was dissolved in 50 parts by mass of a mixed solution of 30 parts by mass of methyl ethyl ketone and 20 parts by mass of ethanol to prepare solution (b). 50 g of the above solution (b) was added dropwise to the solution in the flask at a constant dropping rate over 10 minutes, and then the solution in the flask was stirred at 80°C for 3 hours. Further, the temperature of the solution in the flask was raised to 90°C over 30 minutes, kept at 90°C for 2 hours, then stirring was stopped and it was cooled to room temperature (25°C). Thereby, solutions of alkali-soluble polymers A1 to A9 were obtained. The weight average molecular weights (Mw) of alkali-soluble polymers A1 to A9 are shown in the table.

[0118] The weight average molecular weight was measured by gel permeation chromatography (GPC) and derived by conversion using a calibration curve of standard polystyrene. The conditions of GPC are shown below. (GPC conditions) Pump: PU-980 manufactured by JASCO Columns: 2 in total as follows KF-80Y / KF-806M manufactured by Shodex Eluent: Tetrahydrofuran Measurement temperature: 40°C Flow rate: 2.05 mL / min Detector: RI-1530 manufactured by JASCO

[0119] [Preparation of Evaluation Samples] Evaluation samples were prepared as follows.

[0120] [Preparation of Photosensitive Element] The components shown in the table were mixed in the compounding amounts shown in the table (the numbers for each component indicate the compounding amount as solid content (unit: parts by mass)), and methyl ethyl ketone measured so that the solid content concentration became 60% was added, followed by sufficient stirring and mixing to obtain a photosensitive resin composition preparation liquid. The compounding amount (parts by mass) is the mass of the non-volatile matter (solid content amount). As the support film, a 16-μm-thick polyethylene terephthalate film (manufactured by Toray Industries, Inc., QS71) was used, and this preparation liquid was uniformly coated on its surface using a bar coater. Then, this was dried in a dryer at 95°C for 2 minutes and 30 seconds to form a photosensitive layer with a film thickness of 25 μm.

[0121] Next, a 19-μm polyethylene film (protective film, manufactured by Tamapoly Co., Ltd., GF-818) was laminated as a protective film on the surface of the photosensitive layer on the side where the polyethylene terephthalate film was not laminated, thereby obtaining a photosensitive resin element.

[0122] <Entire surface> As an image-forming evaluation substrate, the surface of a 0.4-mm-thick copper-clad laminate laminated with an 18-μm rolled copper foil was washed with a 10 mass% H2SO4 aqueous solution.

[0123] <Lamination> While peeling off the polyethylene film (protective film) of the photosensitive element, a photosensitive resin laminate was laminated on the copper-clad laminate preheated to 50°C by a hot roll laminator (manufactured by Asahi Kasei Corporation, AL-700) at a roll temperature of 105°C. An air pressure of 0.35 MPa and a lamination speed of 1.5 m / min were adopted.

[0124] <Exposure> Two hours after lamination, the evaluation substrate was exposed at a wavelength of 365 nm using a projection exposure machine (UX-2003SM-AGG01 manufactured by Ushio Electric Inc.) with a predetermined projection exposure mask pattern.

[0125] <Heating> The evaluation substrate after 1 minute from exposure was heated for 30 seconds by a forced-air constant temperature thermostat (manufactured by Yamato Scientific Co., Ltd., DKM600) set at 60°C.

[0126] <Development> The polyethylene terephthalate film (support film) was peeled off from the photosensitive layer. Then, using an alkaline developing machine (manufactured by Fuji Kiko Co., Ltd., a developing machine for dry film), with a spray pressure of 0.15 Pa, a 1 mass% Na2CO3 aqueous solution at 30°C was used for development over a predetermined time. As the development spray time, a time twice the shortest development time was adopted, and as the water washing spray time after development, a time twice the shortest development time was adopted. At this time, the shortest time required until the photosensitive layer in the unexposed portion was completely dissolved was treated as the "shortest development time".

[0127] [Evaluation] <Sensitivity (Optimal Exposure Amount)> Evaluation was carried out using a mask pattern with a line width (L) / space width (S) (hereinafter referred to as "L / S") of 8 / 8 (unit: μm). That is, on the substrate subjected to the above full-surface lamination, using the mask pattern, the exposure amount (unit: mJ / cm 2 ) at which the line width of the pattern formed on the substrate becomes 8 μm was used to evaluate the sensitivity (optimal exposure amount). The smaller the optimal exposure amount, the higher the sensitivity.

[0128] <Adhesion> Evaluation was carried out using a mask pattern with an L / S of x / 3x (x = 1 to 20 (changing at 1 μm intervals)) (unit: μm). That is, on the substrate subjected to the above full-surface lamination, using the mask pattern, it was exposed at the optimal exposure amount. Then, a resist pattern was formed by performing the above heating and developing processes. This resist pattern was observed under an optical microscope at a magnification of 100 times to obtain an observation image. In the observation image, the adhesion was evaluated based on the minimum line width formed without meandering or chipping in the line portion (exposed portion). The smaller this value, the better the adhesion. An adhesion of 7 μm or less was considered qualified. In one aspect, those with an adhesion of 5 μm or less were particularly good.

[0129] <Resolution> Evaluation was performed using a mask pattern with L / S of x / x (x = 1 to 20, changing at 1-μm intervals) (unit: μm). That is, the substrate subjected to the above full-surface coating and lamination was exposed at the optimum exposure amount using the mask pattern. Thereafter, a resist pattern was formed by performing the above heating and development processes. This resist pattern was observed under an optical microscope at a magnification of 100 times to obtain an observation image. In the observation image, the resolution was evaluated based on the minimum line width at which the line portion (exposed portion) did not meander or chip and the space portion (unexposed portion) was removed without residue. The smaller this value, the better the adhesion. Those with a resolution of 7 μm or less were considered qualified. In one aspect, those with a resolution of 5 μm or less were particularly good.

[0130] <Storage stability> The photosensitive element was laminated on the above full-surface coated substrate, left standing at room temperature, 55% humidity, and under yellow light for 100 hours, and then the optimum exposure amount was evaluated. The difference in the optimum exposure amount before and after standing was regarded as the storage stability. As for the storage stability, those with a small variation in the optimum exposure amount were preferred, and those with a variation of 10 mJ / cm 2 or less were considered qualified. In one aspect, those with a variation of 0 mJ / cm 2 indicated particularly good results.

[0131] <Number of foreign matters> A photosensitive element (test piece) of 2 m × 2 m was prepared. Using an optical microscope, the photosensitive layer was confirmed through a support film, and the number of foreign substances with the longest outer diameter of 50 μm or more was counted. Those with 10 or fewer foreign substances were considered qualified. It is shown that it is particularly good when the number of foreign substances is 3 or less.

[0132] <Absorbance> After peeling off the protective film of the photosensitive element, using a spectrophotometer U-3010 (manufactured by Hitachi High-Technologies Corporation), with a 16-μm-thick polyethylene terephthalate film (support film, manufactured by Toray Industries, Inc., QS71) as a reference, the absorbance of the photosensitive layer at a wavelength of 365 nm was measured. The measurement was performed with the slit set to 4 nm and the scan speed set to 600 nm / min.

[0133] <Contribution of absorbance of component (C-1) (X)> Each component was mixed in the compounding amounts shown in Table 7 to obtain photosensitive resin compositions B1 to B5, respectively. Using the photosensitive resin compositions B1 to B5, photosensitive elements with a photosensitive layer thickness of 25 μm were obtained by the method described above. Then, the absorbance of the photosensitive layer at 365 nm was measured for each of these by the above method. By plotting the obtained results with the content of component (C-1) on the X-axis and the absorbance of the photosensitive layer on the Y-axis, a straight line with a slope of 2.146 was obtained. Therefore, ε (change in absorbance per 1 mass% of component (C)) = 2.146 was obtained. Using the following formula (1), the contribution of the absorbance of component (C-1) (X) was calculated for each photosensitive element. X (%) = 100 × εc / absorbance of the photosensitive layer (Y) ··· (1) ε: change in absorbance value per 1 mass% of component (C) c: content of component (C) in the photosensitive resin composition (mass%) It is calculated by

[0134]

Table 1

Table 2

Table 3

Table 4

Table 5

Table 6

Table 7

[0135] As confirmed from the table, in the examples, the <adhesion>, <resolution>, and <storage stability> were all good.

[0136] As described above, the present embodiment has been described. However, the present invention is not limited to the above only, and can be appropriately changed without departing from the gist of the invention.

Industrial Applicability

[0137] By using the photosensitive element according to the present invention, a resist pattern having good adhesion, resolution, and storage stability can be obtained. Such a photosensitive element can be widely used as a photosensitive element for forming a resist pattern such as a printed wiring board.

Explanation of Reference Numerals

[0138] 1: Photosensitive layer 10: Foreign matter 11: Precipitate 12: Bubble

Claims

1. A photosensitive element comprising a support film and a photosensitive layer containing a photosensitive resin composition, The photosensitive resin composition comprises the following components: (A) an alkali-soluble polymer, (B) a compound having an ethylenically unsaturated double bond, (C) Biimidazole photopolymerization initiator Including, The component (C) is contained in an amount of 5.0 mass% or more based on the total solid content mass of the photosensitive resin composition, the photosensitive layer has an absorbance (Y) of 0.35 or less at a wavelength of 365 nm when the layer thickness is 25 μm; the contribution (X) of the absorbance of the (C) component to the absorbance (Y) is 40% or more; The contribution (X) is expressed by the following formula (1): X(%)=100×εc / absorbance of photosensitive layer (Y) (1) ε: absorbance change per 1 mass% of component (C) c: Content (% by mass) of component (C) in the total solid components in the photosensitive resin composition It is calculated by The component (C) contains a dimer of 2,4,5-triarylimidazole in an amount of 5.0 mass% or more based on the total solid content mass of the photosensitive resin composition, A photosensitive element that is adapted to be exposed by a semiconductor laser or an extra-high pressure mercury lamp having a wavelength of 350 to 410 nm.

2. The photosensitive element according to claim 1 , wherein the component (C) is contained in an amount of 5.5% by mass or more based on the total solid content by mass of the photosensitive resin composition.

3. The photosensitive element according to claim 1 or 2, wherein the component (C) is contained in an amount of 6.0% by mass or more based on the total solid content mass of the photosensitive resin composition.

4. The photosensitive element of claim 1 or 2, wherein the contribution (X) is 55% or greater.

5. The photosensitive element of claim 1 or 2, wherein the contribution (X) is 65% or greater.

6. The photosensitive element of claim 1 or 2, wherein the contribution (X) is 85% or greater.

7. 3. The photosensitive element of claim 1 or 2, wherein the absorbance (Y) is 0.30 or less.

8. The photosensitive element of claim 1 or 2, wherein the absorbance (Y) is 0.25 or less.

9. Furthermore, the photosensitive resin composition is (D) Other photopolymerization initiators and / or sensitizers 3. The photosensitive element of claim 1, further comprising at least one selected from the group consisting of a benzophenone compound, a pyrazoline compound, an anthracene compound, and a coumarin compound as the photosensitive dye.

10. Furthermore, the photosensitive resin composition is (D) Other photopolymerization initiators and / or sensitizers 3. The photosensitive element of claim 1, further comprising at least one selected from the group consisting of a benzophenone compound and a pyrazoline compound as the photosensitive compound.

11. The component (A) contains styrene as a monomer component, 3. The photosensitive element according to claim 1, wherein the proportion of the structural units derived from styrene is 35% by mass or more based on the total mass of all monomer components in the component (A).

12. The component (A) contains styrene as a monomer component, 3. The photosensitive element according to claim 1, wherein the proportion of the structural units derived from styrene is 50% by mass or more based on the total mass of all monomer components in the component (A).

13. The component (A) contains styrene as a monomer component, 3. The photosensitive element according to claim 1, wherein the proportion of the structural units derived from styrene is 60% by mass or more based on the total mass of all monomer components in the component (A).

14. The component (B) is represented by the following general formula (II): 【Chemistry 1】 (In the formula, R ２ are each independently a hydrogen atom or a methyl group; X ２ O and Y ２ Each O is independently an oxyethylene group or an oxypropylene group, m3, m4, n2, and n3 are independently an integer of 0 to 40, m3+m4 is 1 to 40, and n2+n3 is 0 to 20. The compound represented by the formula:

3. The photosensitive element according to claim 1, wherein the content of the compound represented by formula (II) is 50% by mass or more based on the total amount of the component (B).

15. Furthermore, the photosensitive resin composition (E) Polymerization inhibitor The photosensitive element of claim 1 or 2, comprising:

16. 3. The photosensitive element of claim 1 or 2, wherein the support film has an absorbance at 365 nm of 0.1 or less.

17. The photosensitive element of claim 1 or 2, further comprising a protective film.

18. A method for forming a resist pattern using the photosensitive element according to claim 1 or 2, comprising the steps of: The following steps: laminating the photosensitive element to a substrate; exposing the photosensitive layer of the laminated photosensitive element to light; and developing the photosensitive layer after exposure; A method for forming a resist pattern comprising the steps of:

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