Device Temperature Control System and Temperature Control Method

Abstract

The present invention provides a temperature control system and method for a device, the control system including a temperature detection module (1), a temperature control module (2), and a temperature adjustment module (3), wherein the temperature detection module (1) detects and obtains the current temperature of the device, the temperature control module (2) obtains a predicted temperature for the next time based on the current temperature and a temperature prediction model, and outputs a temperature adjustment command to the temperature adjustment module (3) based on the predicted temperature for the next time and a temperature threshold, the temperature adjustment module (3) adjusts the temperature of the device based on the temperature adjustment command, the temperature prediction model being obtained in advance. The temperature control method can improve the temperature stability during operation of the device and ensure the electrical energy conversion efficiency of the device.

Description

Technical Field

[0001] The present invention relates to the technical field of electrical equipment, and more specifically, to a temperature control system and a temperature control method for a device.

Background Art

[0002] As is well known, when a power supply device supplies power to a load, it generates self-heat. In order to avoid abnormal operation of the power supply device due to temperature rise and reduction of the service life of the power supply device, heat dissipation measures are taken for the power supply device.

[0003] In the prior art, after the temperature of the power supply device is acquired by a temperature acquisition device, the power supply device is cooled by a cooling method such as a heat dissipation sheet, air cooling, or liquid cooling heat sink. The sampling circuit of the temperature acquisition device generally uses a thermistor. The thermistor generates different resistance values based on temperature changes, and further the temperature of the power supply device is acquired. However, when the current flowing through the thermistor is large, generally it affects the sampling accuracy of the thermistor, the thermistor cannot quickly sense temperature changes, the acquired temperature of the power supply device is not sufficiently accurate, and it affects the operation and service life of the power supply device.

Summary of the Invention

[0004] In view of the problems in the prior art, embodiments of the present invention provide a temperature control system and a temperature control method for a device that can at least partially solve the problems existing in the prior art.

[0005] In one aspect, the present invention is a temperature control system for a device, comprising a temperature detection module, a temperature control module, and a temperature adjustment module, The temperature detection module detects and obtains the temperature at the current time of the device. The temperature control module obtains the predicted temperature at the next time based on the temperature at the current time and the temperature prediction model, and outputs a temperature adjustment command to the temperature adjustment module based on the predicted temperature at the next time and the temperature threshold. The temperature adjustment module provides a temperature control system for the device to perform temperature adjustment on the device based on the temperature adjustment command.

[0006] In another aspect, the present invention is a temperature control method, comprising: obtaining the temperature at the current time of the device; obtaining the predicted temperature at the next time based on the temperature at the current time and the temperature prediction model; outputting a temperature adjustment command based on the predicted temperature at the next time and the temperature threshold to adjust the temperature of the device; and providing a temperature control method including the above steps.

[0007] In still another aspect, the present invention is an electronic device including a memory, a processor, and a computer program stored in the memory and executable by the processor, wherein when the program is executed by the processor, the steps of the temperature control method described in any of the above embodiments are realized.

[0008] In yet another aspect, the present invention is a computer-readable storage medium storing a computer program, wherein when the computer program is executed by a processor, the steps of the temperature control method described in any of the above embodiments are realized.

[0009] The temperature control system and temperature control method of the device according to the embodiments of the present invention include a temperature detection module, a temperature control module, and a temperature adjustment module. The temperature detection module detects and obtains the temperature of the device at the current time. The temperature control module obtains the predicted temperature at the next time based on the temperature at the current time and the temperature prediction model, and outputs a temperature adjustment command to the temperature adjustment module based on the predicted temperature at the next time and the temperature threshold. The temperature adjustment module improves the stability of the temperature during the operation of the device by performing temperature adjustment on the device based on the temperature adjustment command, thereby ensuring the electrical energy conversion efficiency of the device.

[0010] In the following, in order to more clearly explain the technical solutions in the embodiments of the present invention or the prior art, the drawings necessary for the description of the embodiments or the prior art will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present invention, and those skilled in the art can also obtain other drawings based on these drawings without creative efforts.

Brief Description of the Drawings

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Description of Reference Numerals

[0012] 1 - Temperature detection module, 2 - Temperature control module, 3 - Temperature adjustment module, 11 - Temperature detection unit, 12 - Temperature detection accuracy processing unit, 31 - Heating unit, 32 - Temperature reduction unit, 121 - First comparator, 122 - First capacitor, 123 - Second comparator, 124 - First resistor, 125 - Second resistor, 126 - Third resistor, 127 - Fourth resistor, 128 - Second capacitor, 129 - Inductance, 311 - Heating resistance wire, 312 - First MOS transistor, 313 - Fifth resistor, 314 - Sixth resistor, 321 - Second MOS transistor, 322 - Seventh resistor, 323 - Heat dissipation fan.

Embodiments for Carrying Out the Invention

[0013] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be described in more detail below with reference to the drawings. Here, the exemplary embodiments of the present invention and their descriptions are used to explain the present invention, but do not limit the present invention. Note that, unless there is a contradiction, the embodiments in this application and the features in the embodiments may be arbitrarily combined with each other.

[0014] The device of the embodiment of the present invention includes, but is not limited to, devices such as an AC-DC converter and a DC charger in a DC charging stand.

[0015] FIG. 1 is a schematic structural diagram of a temperature control system of a device according to an embodiment of the present invention. As shown in FIG. 1, the temperature control system of the device according to the embodiment of the present invention includes a temperature detection module 1, a temperature control module 2, and a temperature adjustment module 3. Here, The temperature detection module 1 detects and obtains the temperature of the device at the current time. The temperature control module 2 obtains the predicted temperature at the next time based on the temperature at the current time and a temperature prediction model, and outputs a temperature adjustment command to the temperature adjustment module 3 based on the predicted temperature at the next time and a temperature threshold. The temperature adjustment module 3 performs temperature adjustment on the device based on the temperature adjustment command.

[0016] Specifically, the temperature detection module 1 detects the temperature of the device in real time, obtains the temperature of the device at the current time, and then transmits the temperature at the current time to the temperature control module 2. After receiving the temperature at the current time, the temperature control module 2 inputs the temperature at the current time into the temperature prediction model to obtain the predicted temperature at the next time. Based on the predicted temperature at the next time and the temperature threshold, the temperature control module 2 obtains a temperature adjustment command. When the first difference obtained by subtracting the temperature threshold from the predicted temperature at the next time is greater than the first threshold, the temperature adjustment command causes the temperature adjustment module 3 to lower the temperature of the device. When the predicted temperature at the next time is lower than the temperature threshold and the second difference obtained by subtracting the predicted temperature at the next time from the temperature threshold is greater than the second threshold, the temperature adjustment command causes the temperature adjustment module 3 to heat the device. The temperature control module 2 transmits the temperature adjustment command to the temperature adjustment module 3. After receiving the temperature adjustment command, the temperature adjustment module 3 performs temperature adjustment on the device based on the temperature adjustment command. Here, the temperature threshold is preset and set according to actual needs, and is not limited in the embodiments of the present invention. The temperature adjustment command is preset. The time interval between the current time and the next time is set according to actual needs and is not limited in the embodiments of the present invention.

[0017] The temperature control system of the device according to the embodiments of the present invention includes a temperature detection module, a temperature control module, and a temperature adjustment module. The temperature detection module detects and obtains the temperature of the device at the current time. The temperature control module obtains the predicted temperature at the next time based on the temperature at the current time and the temperature prediction model, and outputs a temperature adjustment command to the temperature adjustment module based on the predicted temperature at the next time and the temperature threshold. The temperature adjustment module improves the stability of the temperature during the operation of the device by performing temperature adjustment on the device based on the temperature adjustment command, thereby ensuring the electrical energy conversion efficiency of the device. In addition, in order to adjust the temperature of the device according to the predicted temperature at the next time, the predicted temperature can be compensated to realize pre-adjustment control of the temperature of the device.

[0018] Based on the above embodiments, further, the temperature prediction model is pre-acquired.

[0019] Specifically, after collecting and obtaining the historical temperature training data of the device, the temperature control module trains based on the historical temperature training data and the initial model to obtain the temperature prediction model, thereby obtaining the temperature prediction model, and the obtained temperature prediction model may be arranged in the temperature control module. Here, the initial model includes, but is not limited to, a neural network model, and is set according to actual needs, and the embodiments of the present invention do not limit it.

[0020] Based on the above embodiments, further, the temperature prediction model is obtained by self-learning based on historical temperature data.

[0021] Specifically, after the temperature control module collects the historical temperature data of the device, it may self-learn based on the historical temperature data to obtain the temperature prediction model. Here, machine learning models may be used for self-learning, and it is set according to actual needs, and the embodiments of the present invention do not limit it.

[0022] It can also be understood that since the temperature data of the device is continuously updated, the historical temperature data can be updated regularly and self-learned again to obtain the temperature prediction model.

[0023] For example, after using the obtained historical temperature data as historical temperature training data, training is performed based on the historical temperature data and the initial model to obtain the temperature prediction model, and then the historical temperature data is updated regularly to be used as historical temperature training data, and training is performed again based on the historical temperature data and the initial model to obtain the temperature prediction model.

[0024] Based on the above embodiments, further, as shown in FIG. 3, the temperature detection module 1 includes a temperature detection unit 11. The temperature detection unit 11 employs a thermocouple temperature measurement circuit, a thermal resistance temperature measurement circuit, or a temperature acquisition chip, and the temperature of the device can be detected by the thermocouple temperature measurement circuit, the thermal resistance temperature measurement circuit, or the temperature acquisition chip. Here, the temperature acquisition chip is selected according to actual requirements and is not limited in the embodiments of the present invention.

[0025] FIG. 2 is a schematic structural diagram of a thermal resistance temperature measurement circuit according to an embodiment of the present invention. As shown in FIG. 2, based on the above embodiments, further, the thermal resistance temperature measurement circuit according to the embodiment of the present invention includes a resistor R1, a capacitor C1, and a thermistor TH1. The first end of the resistor R1 is connected to the power supply VCC, the second end of the resistor R1 is respectively connected to the first end of the capacitor C1 and the first end of the thermistor TH1, and the second ends of the capacitor C1 and the thermistor TH1 are grounded.

[0026] The thermocouple temperature measurement circuit may adopt a circuit structure similar to that in FIG. 2, and the thermistor TH1 in FIG. 2 may be replaced with a thermocouple.

[0027] FIG. 3 is a schematic structural diagram of a temperature control system of a device according to another embodiment of the present invention, and FIG. 4 is a schematic structural diagram of a temperature detection accuracy processing unit according to an embodiment of the present invention. As shown in FIGS. 3 and 4, based on the above embodiments, further, the temperature detection module 1 further includes a temperature detection accuracy processing unit 12. The temperature detection accuracy processing unit 12 includes a voltage follower circuit, a feedback amplification circuit, and a filter circuit. Here, The voltage follower circuit includes a first comparator 121 and a first capacitor 122. The first end of the first comparator 121 is connected to the temperature detection unit 11, the second end of the first comparator 121 is connected to the output end of the first comparator 121, the third end of the first comparator 121 is connected to the first power supply VCC1, the fourth end of the first comparator 121 is grounded, the first end of the first capacitor 122 is grounded, and the second end of the first capacitor 122 is connected to the first power supply VCC1. The feedback amplification circuit includes a second comparator 123, a first resistor 124, a second resistor 125, and a third resistor 126. The first end of the first resistor 124 is connected to the output end of the first comparator 121. The second end of the first resistor 124 is connected to the second end of the second comparator 123. The first end of the second comparator 123 is respectively connected to the first end of the third resistor 126 and the second end of the second resistor 125. The second end of the third resistor 126 is connected to the output end of the second comparator 123. The first end of the second resistor 125 is grounded. The third end of the second comparator 123 is connected to the first power supply VCC1. The fourth end of the second comparator 123 is grounded. The filter circuit includes a fourth resistor 127, a second capacitor 128, and an inductance 129. The first end of the fourth resistor 127 is connected to the output end of the second comparator 123. The second end of the fourth resistor 127 is respectively connected to the first end of the second capacitor 128 and the first end of the inductance 129. The second end of the second capacitor 128 is grounded. The second end of the inductance 129 is connected to the temperature control module 2.

[0028] Here, the voltage follower circuit plays a role in realizing the isolation between the acquisition circuit and the subsequent processing circuit. The feedback amplification circuit is used to scale up the isolated small signal to achieve the purpose of improving the accuracy. The filter circuit realizes signal filtering and plays a role in eliminating the conduction interference of the line. The temperature detection accuracy processing unit improves the accuracy of the temperature acquisition of the device.

[0029] FIG. 5 is a schematic structural diagram of a voltage follower circuit according to an embodiment of the present invention. As shown in FIGS. 3 and 5, based on the above embodiments, further, the temperature detection module 1 further includes a temperature detection accuracy processing unit 12. The temperature detection accuracy processing unit 12 includes a voltage follower circuit. Here, The voltage follower circuit includes a first comparator 121 and a first capacitor 122. The first terminal of the first comparator 121 is connected to the temperature detection unit 11. The second terminal of the first comparator 121 is connected to the output terminal of the first comparator 121. The third terminal of the first comparator 121 is connected to the first power supply VCC1. The fourth terminal of the first comparator 121 is grounded. The first terminal of the first capacitor 122 is grounded. The second terminal of the first capacitor 122 is connected to the first power supply VCC1. The output terminal of the first comparator 121 may be connected to the temperature control module 2.

[0030] FIG. 6 is a schematic structural diagram of a feedback amplifier circuit according to an embodiment of the present invention. As shown in FIGS. 3 and 6, based on the above embodiments, further, the temperature detection module 1 further includes a temperature detection accuracy processing unit 12, and the temperature detection accuracy processing unit 12 includes a feedback amplifier circuit. Here, The feedback amplifier circuit includes a second comparator 123, a first resistor 124, a second resistor 125, and a third resistor 126. The second terminal of the first resistor 124 is connected to the second terminal of the second comparator 123. The first terminal of the second comparator 123 is connected to the first terminal of the third resistor 126 and the second terminal of the second resistor 125 respectively. The second terminal of the third resistor 126 is connected to the output terminal of the second comparator 123. The first terminal of the second resistor 125 is grounded. The third terminal of the second comparator 123 is connected to the first power supply VCC1. The fourth terminal of the second comparator 123 is grounded. The first terminal of the first resistor 124 may be connected to the temperature detection unit 11, and the output terminal of the second comparator 123 may be connected to the temperature control module 2.

[0031] FIG. 7 is a schematic structural diagram of a filter circuit according to an embodiment of the present invention. As shown in FIGS. 3 and 7, based on the above embodiments, further, the temperature detection module 1 further includes a temperature detection accuracy processing unit 12, and the temperature detection accuracy processing unit 12 includes a filter circuit. Here, The filter circuit includes a fourth resistor 127, a second capacitor 128, and an inductance 129. The second terminal of the fourth resistor 127 is connected to the first terminal of the second capacitor 128 and the first terminal of the inductance 129 respectively. The second terminal of the second capacitor 128 is grounded. The second terminal of the inductance 129 is connected to the temperature control module 2. The first terminal of the fourth resistor 127 may be connected to the temperature detection unit 11.

[0032] FIG. 8 is a schematic structural diagram of a temperature control system of a device according to still another embodiment of the present invention. As shown in FIG. 8, based on each of the above embodiments, further, the temperature adjustment module 3 includes a heating unit 31 and a cooling unit 32. The heating unit 31 is used to heat the device so as to increase the temperature of the device. The cooling unit 32 is used to cool the device so as to decrease the temperature of the device.

[0033] The temperature control system of the device according to the embodiment of the present invention can increase the temperature of the device and also decrease the temperature of the device by the temperature adjustment module, and is applicable and used in various weather conditions. In particular, for a device installed outdoors, it is necessary to cool the device in summer, and in cold winter weather, the temperature of the device is increased to ensure the electrical energy conversion efficiency of the device.

[0034] Based on each of the above embodiments, further, the heating unit 31 may realize heating in such ways as heating by a heating resistance wire, a copper electric heating plate, an aluminum electric heating plate, ceramic electric heating, a stainless steel electric heating tube, heating by controlling a circulating air passage, or heating by controlling a chemical reagent reaction.

[0035] Here, the heating resistance wire, copper electric heating plate, aluminum electric heating plate, ceramic electric heating, and stainless steel electric heating tube cooperate with the MOS transistor to perform temperature adjustment control and heating, and may be blown by a fan. The heating principle of the circulation passage is to control the opening and closing of the heat dissipation air passage. That is, when heating is required, the outlet of the passage is closed, and the hot air around the electronic components is circulated inside the device without being discharged to the outside of the device, replenishing heat to other non-heating electronic components. Chemical reagent heating means installing a sealed and independent chemical reaction unit inside the device, controlling the feeding amount of the chemical reagent to control the reaction temperature, and further circulating it by the blowing of the fan to the location of the electronic components that require temperature compensation inside the device. The chemical reagent is, for example, CaO and H2O. CaO and H2O react to generate CaOH2 and can release heat.

[0036] FIG. 9 is a schematic structural diagram of a heating unit according to an embodiment of the present invention. As shown in FIG. 9, the heating unit 31 includes a heating resistance wire 311, a first MOS transistor 312, a fifth resistor 313, and a sixth resistor 314. Here, The first end of the heating resistance wire 311 is connected to the second power supply VCC2, the second end of the heating resistance wire 311 is connected to the drain of the first MOS transistor 312, the gate of the first MOS transistor 312 is connected to the first end of the fifth resistor 313 and the first end of the sixth resistor 314 respectively, the source of the first MOS transistor 312 and the second end of the fifth resistor 313 are grounded, and the second end of the sixth resistor 314 is connected to the temperature control module 2.

[0037] When the device needs to be heated, the device may be heated up by the heat generation of the heating resistance wire 311. The heating resistance wire may be replaced with a copper heating plate, an aluminum heating plate, a ceramic, or a stainless steel electric heating tube, and cooperate with the MOS transistor to perform temperature adjustment control and heating.

[0038] Based on the above embodiments, further, the temperature reduction unit 32 may achieve cooling and temperature reduction by means such as liquid cooling circulation cooling, metal heat pipe conduction cooling, graphite sheet conduction cooling, semiconductor cooling, chemical reagent cooling, or a heat dissipation fan.

[0039] Here, liquid cooling circulation cooling means using a coolant as a medium, removing heat by a circulation method, and further discharging excess heat from the device by a heat sink and a heat dissipation fan. Metal heat pipe conduction cooling and graphite sheet conduction cooling are to attach a heat conduction member (metal or graphite) to the surface of a component with strong heat generation, and then blow the further conducted excess heat into the exhaust duct by a heat dissipation fan and discharge it from the device. Semiconductor cooling is to energize it by connecting a power supply, bringing its low-temperature end close to the heat-generating component and its high-temperature end close to the heat dissipation fan to discharge heat from the device, achieving the heat dissipation effect inside the device. Chemical reagent cooling means installing a sealed and independent chemical reaction unit inside the device, absorbing the surrounding heat by a chemical reaction to reduce the excess heat around the heat-generating electronic components and achieving the purpose of cooling the device.

[0040] FIG. 10 is a schematic structural diagram of a temperature reduction unit according to an embodiment of the present invention. As shown in FIG. 10, based on the above embodiments, further, the temperature reduction unit 32 includes a second MOS transistor 321, a seventh resistor 322, and a heat dissipation fan 323. Here, The first end of the seventh resistor 322 and the drain of the second MOS transistor 321 are connected to the third power supply VCC3. The gate of the second MOS transistor 321 and the second end of the seventh resistor 322 are connected to the temperature control module 2. The source of the second MOS transistor 321 is connected to the first end of the heat dissipation fan 323, and the second end of the heat dissipation fan 323 is grounded.

[0041] When it is necessary to cool down the device, the device may be cooled down by the heat dissipation fan 323. As can be understood, other methods such as water cooling may be used for cooling, which is selected according to the actual situation and is not limited in the embodiments of the present invention.

[0042] Based on the above embodiments, further, the temperature control module 2 employs a microprocessor, a field programmable gate array (abbreviated as FPGA), or a complex programmable logic device (abbreviated as CPLD).

[0043] For example, the analog quantity acquisition lead of the analog-to-digital converter of the microprocessor is connected to the second end of the inductance 129 of the filter circuit so as to collect the temperature at the current time output by the temperature detection module 1. The first control output lead of the microprocessor is respectively connected to the second end of the seventh resistor 322 and the gate of the second MOS transistor 321 so as to output a temperature adjustment command to control the rotational cooling of the fan 323. The second control output lead of the microprocessor is connected to the second end of the sixth resistor 314 so as to output a temperature adjustment command to control the heating of the heating resistance wire 311.

[0044] An embodiment of the present invention provides a charging system including the temperature control system of the device described in any of the above embodiments.

[0045] Hereinafter, the application scenario of the temperature control system of the device according to the embodiment of the present invention will be described with one specific embodiment. The device is an AC-DC converter installed in a charging stand, and the charging stand charges an electric vehicle. The temperature control system of the device according to the embodiment of the present invention may be arranged in the AC-DC converter in the charging stand.

[0046] When the charging stand is located outdoors in the Northeast region, in winter, the weather is cold and the outdoor temperature is low, while in summer, it is sweltering and the outdoor temperature is high. When the charging stand charges an electric vehicle in winter, due to the low external temperature, it is necessary to heat the AC-DC converter. The temperature detection module 1 collects the current temperature of the AC-DC converter in real time, and the temperature control module 2 obtains the predicted temperature of the AC-DC converter at the next moment based on the current temperature and the temperature prediction model, and outputs a temperature adjustment command to the temperature adjustment module 3 based on the predicted temperature at the next moment and the temperature threshold. The temperature adjustment module 3 may heat the AC-DC converter to operate within a certain range of the temperature threshold. When the charging stand charges an electric vehicle in summer, considering that the external temperature is high and the temperature of the AC-DC converter itself rises when it operates, it is necessary to cool down the AC-DC converter. The temperature detection module 1 collects the current temperature of the AC-DC converter in real time, and the temperature control module 2 obtains the predicted temperature of the AC-DC converter at the next moment based on the current temperature and the temperature prediction model, and outputs a temperature adjustment command to the temperature adjustment module 3 based on the predicted temperature at the next moment and the temperature threshold. The temperature adjustment module 3 may lower the temperature of the AC-DC converter to operate within a certain range of the temperature threshold.

[0047] When the charging stand is located outdoors in the Xinjiang region and in a season with a large temperature difference between day and night, for example, when the charging stand charges an electric vehicle during the day, considering that the external temperature is high and the temperature of the AC-DC converter itself rises when it operates, the temperature control system of the device according to the embodiment of the present invention cools down the AC-DC converter to operate within a certain range of the temperature threshold. When the charging stand charges an electric vehicle at night, since the external temperature is low, the temperature control system of the device according to the embodiment of the present invention heats the AC-DC converter to operate within a certain range of the temperature threshold.

[0048] FIG. 11 is a flowchart of a temperature control method according to an embodiment of the present invention. As shown in FIG. 11, the temperature control method according to the embodiment of the present invention may be applied to the temperature control system of the device described in any of the above embodiments and includes the following steps.

[0049] S801: Obtain the temperature at the current time of the device.

[0050] Specifically, the temperature detection module may detect the temperature of the device in real time, obtain the temperature at the current time of the device, and then transmit the temperature at the current time to the temperature control module. The temperature control module may receive the temperature at the current time.

[0051] S802: Obtain the predicted temperature at the next time based on the temperature at the current time and the temperature prediction model.

[0052] Specifically, after obtaining the temperature at the current time, the temperature control module may input the temperature at the current time into the temperature prediction model to obtain the predicted temperature at the next time of the device. Here, the temperature prediction model may be obtained by training based on historical temperature training data.

[0053] S803: Output a temperature adjustment command based on the predicted temperature at the next time and the temperature threshold to adjust the temperature of the device.

[0054] Specifically, after obtaining the predicted temperature at the next time, the temperature control module obtains a temperature adjustment command based on the predicted temperature at the next time and the temperature threshold, and then transmits the temperature adjustment command to the temperature adjustment module. The temperature adjustment module adjusts the temperature of the device based on the temperature adjustment command.

[0055] For example, after the temperature control module determines that the predicted temperature at the next time is greater than the temperature threshold and the first difference obtained by subtracting the temperature threshold from the predicted temperature at the next time is greater than the first threshold, the temperature control command is output to lower the temperature of the device. After determining that the predicted temperature at the next time is less than the temperature threshold and the second difference obtained by subtracting the predicted temperature at the next time from the temperature threshold is greater than the second threshold, the temperature control command is output to raise the temperature of the device.

[0056] The temperature control method according to the embodiment of the present invention obtains the temperature of the device at the current time, obtains the predicted temperature at the next time based on the temperature at the current time and the temperature prediction model, and outputs a temperature control command based on the predicted temperature at the next time and the temperature threshold to adjust the temperature of the device, thereby improving the stability of the temperature during the operation of the device, and thereby ensuring the electrical energy conversion efficiency of the device. In addition, in order to adjust the temperature of the device according to the predicted temperature at the next time, the predicted temperature can be compensated to realize the pre-adjustment control of the temperature of the device.

[0057] Based on the above embodiments, further, the temperature prediction model is obtained in advance.

[0058] Specifically, after the temperature control module collects and obtains the historical temperature training data of the device, the temperature prediction model is obtained by training based on the historical temperature training data and the initial model, and the obtained temperature prediction model may be arranged in the temperature control module. Here, the initial model includes, but is not limited to, a neural network model, and is set according to actual needs and is not limited in the embodiments of the present invention.

[0059] Based on the above embodiments, further, the temperature prediction model is obtained by self-learning based on historical temperature data.

[0060] Specifically, after collecting the historical temperature data of the device, the temperature control module may perform self-learning based on the historical temperature data to obtain the temperature prediction model. Here, machine learning models may be used for self-learning, which are set according to actual requirements and are not limited in the embodiments of the present invention.

[0061] As can be understood, since the temperature data of the device is constantly updated, the historical temperature data may be updated regularly, and self-learning may be performed again to obtain the temperature prediction model.

[0062] FIG. 12 is a flowchart of a temperature control method according to another embodiment of the present invention. As shown in FIG. 12, the temperature prediction model is obtained by training based on historical temperature training data. The step of training based on the historical temperature training data to obtain the temperature prediction model includes the following.

[0063] S901: Obtaining the historical temperature training data.

[0064] Specifically, when the device operates normally, the temperature of the device may be collected at unit time intervals during a preset time period to obtain the temperature at each moment of the device. The server may obtain the temperature at each moment as the historical temperature training data. The historical temperature training data includes the temperature at the a-th moment and the temperature at the (a + 1)-th moment. The temperature at the a-th moment corresponds to the temperature at the (a + 1)-th moment, where a is a positive integer and a is smaller than the data volume of the historical temperature training data. Here, the data volume of the historical temperature training data is set based on actual experience and is not limited in the embodiments of the present invention. The preset time period is set according to actual requirements and is not limited in the embodiments of the present invention. The unit time interval may be set to 1 to 3 seconds, which is set based on actual experience and is not limited in the embodiments of the present invention.

[0065] S902: Based on the historical temperature training data and the initial model, perform training to obtain the temperature prediction model.

[0066] Specifically, after the server obtains the historical temperature training data, the historical temperature training data may be divided into a training set and a verification set. Use the temperature at the b-th time in the training set as the input data, and the temperature at the (b + 1)-th time as the output data to train the initial model, and perform training to obtain a temperature prediction model to be determined. Here, b is a positive integer, and b is less than or equal to the amount of data in the training set. Use the temperature at the f-th time in the verification set as the input data and input it into the temperature prediction model to be determined, and output the predicted temperature at the (f + 1)-th time. Here, f is a positive integer, and f is less than or equal to the amount of data in the verification set. Compare the temperature at the next time corresponding to each time in the training set with the predicted temperature, and if the absolute value of the difference between the temperature at the next time and the predicted temperature at the next time is less than or equal to the deviation threshold, the prediction of the predicted temperature is accurate. If the absolute value of the difference between the temperature at the next time and the predicted temperature at the next time is greater than the deviation threshold, the predicted temperature is not accurate. Count the number of accurate predictions and the number of inaccurate predictions for the temperature at each time in the verification set, and calculate and obtain the prediction accuracy rate of the temperature prediction model to be determined. When the prediction accuracy rate is greater than the accuracy rate threshold, use the temperature prediction model to be determined as the temperature prediction model. Otherwise, adjust the parameters and / or the historical temperature training data, and perform model training again. Here, the initial model includes, but is not limited to, a neural network model. The deviation threshold is set based on actual experience and is not limited in the embodiments of the present invention. The accuracy rate threshold is set based on actual experience, and the embodiments of the present invention are not limited.

[0067] For example, a three-layer neural network model is used as the initial model, and the three-layer neural network model can be represented as follows.

[0068] [Number]

[0069] Here, TIFF0007696428000002.tif1531 represents the predicted temperature at the (t + 1)-th time, m represents the number of hidden layer nodes, v i represents the connection weight value from the i-th hidden layer node to the output node, g represents the trimming coefficient, ω i (t) represents the connection weight function corresponding to the i-th hidden layer node, TIFF0007696428000003.tif2360 is such that x(t) represents the temperature at time t, T represents the number of samples, TIFF0007696428000004.tif34108 is such that x t represents the temperature at time t, θ i represents the threshold of the i-th hidden layer neuron, θ represents the threshold of the output layer neuron, i is a positive integer and i is less than or equal to m. Here, m is set according to actual demand, for example, set to 5 or 6, and the embodiments of the present invention are not limited. g is set according to actual demand, for example, set to 1, and the embodiments of the present invention are not limited.

[0070] For example, set the number of hidden layer nodes m to 6, the initial value of the connection weight value v i from the hidden layer node to the output node to 0.01, the initial value of the threshold θ i of the hidden layer neuron to 0.002, the initial value of the threshold θ of the output layer neuron to 0.03, the learning rate to 0.07 - 0.22, and the number of samples of the historical temperature training data to 49 - 130.

[0071] The temperature prediction model obtained by training the three-layer neural network model has high temperature prediction efficiency and high accuracy.

[0072] FIG. 13 is a flowchart of a temperature control method according to still another embodiment of the present invention. As shown in FIG. 13, based on each of the above embodiments, further, based on the predicted temperature and the temperature threshold at the next time, the step of outputting a temperature adjustment command to adjust the temperature of the device includes the following.

[0073] S8031: When it is determined that the predicted temperature at the next time is greater than the temperature threshold and a first difference obtained by subtracting the temperature threshold from the predicted temperature at the next time is greater than a first threshold, output the temperature adjustment command to lower the temperature of the device.

[0074] Specifically, the temperature control module compares the predicted temperature at the next time with the temperature threshold. When the predicted temperature at the next time is greater than the temperature threshold, after calculating a first difference obtained by subtracting the temperature threshold from the predicted temperature at the next time, compare the first difference with the first threshold. When the first difference is greater than the first threshold, it indicates that the predicted temperature at the next time is too high and it is necessary to lower the temperature. Output the temperature adjustment command to lower the temperature of the device, and early control for the temperature at the next time may be realized.

[0075] For example, the temperature control module transmits a temperature adjustment command to a temperature reduction unit of the temperature adjustment module to lower the temperature of the device, make the actual temperature at the next time lower than the predicted temperature at the next time, meet the operating temperature requirement of the device, and achieve the purpose of pre-adjusting the temperature of the device.

[0076] S8032: When it is determined that the predicted temperature at the next time is less than the temperature threshold and a second difference obtained by subtracting the predicted temperature at the next time from the temperature threshold is greater than a second threshold, output the temperature adjustment command to raise the temperature of the device.

[0077] Specifically, the temperature control module compares the predicted temperature at the next time with the temperature threshold. When the predicted temperature at the next time is lower than the temperature threshold, after calculating a second difference obtained by subtracting the temperature threshold from the predicted temperature at the next time, the second difference is compared with a second threshold. When the second difference is greater than the second threshold, it indicates that the predicted temperature at the next time is too low and it is necessary to increase the temperature. The temperature adjustment command may be output to increase the temperature of the device, thereby realizing early control for the temperature at the next time.

[0078] For example, the temperature control module may increase the temperature of the device by sending a temperature adjustment command to the heating unit of the temperature adjustment module, making the actual temperature at the next time higher than the predicted temperature at the next time, meeting the operating temperature requirements of the device, and achieving the purpose of pre-adjusting the temperature of the device.

[0079] FIG. 14 is a temperature graph of a device according to an embodiment of the present invention. As shown in FIG. 14, in the temperature control method according to the embodiment of the present invention, when controlling the temperature of a device, 65° C. is the temperature threshold of the device, that is, the ideal operating temperature. As can be seen from FIG. 14, the range in which the actual temperature fluctuates up and down around 65° C. after being adjusted at time t+1 is significantly smaller than the range in which the predicted temperature at time t+1 fluctuates up and down around 65° C., clearly improving the stability of the temperature during the operation of the device.

[0080] FIG. 15 is a schematic diagram of the entity structure of an electronic device according to an embodiment of the present invention. As shown in FIG. 15, the electronic device 600 may include a processor 100 and a memory 140. The memory 140 is coupled to the processor 100. The processor 100 may execute methods such as obtaining the current temperature of the device by calling logical instructions in the memory 140, obtaining the predicted temperature at the next time based on the current temperature of the device and the temperature prediction model, where the temperature prediction model is obtained by training based on historical temperature training data, and outputting a temperature adjustment command to adjust the temperature of the device based on the predicted temperature at the next time and the temperature threshold.

[0081] This embodiment discloses a computer program product, which includes a computer program stored in a non-transitory computer-readable storage medium. The computer program includes program instructions. When the program instructions are executed by a computer, the computer can, for example, obtain the temperature of the device at the current time, obtain the predicted temperature at the next time based on the temperature at the current time and a temperature prediction model, where the temperature prediction model is obtained by training based on historical temperature training data, and output a temperature adjustment command to adjust the temperature of the device based on the predicted temperature at the next time and a temperature threshold, and execute the method according to the embodiments of the above-mentioned each method.

[0082] This embodiment provides a computer-readable storage medium storing a computer program, and the computer program causes the computer to, for example, obtain the temperature of the device at the current time, obtain the predicted temperature at the next time based on the temperature at the current time and a temperature prediction model, where the temperature prediction model is obtained by training based on historical temperature training data, and output a temperature adjustment command to adjust the temperature of the device based on the predicted temperature at the next time and a temperature threshold, and execute the method according to the embodiments of the above-mentioned each method.

[0083] As shown in FIG. 15, the electronic device 600 may further include a communication module 110, an input unit 120, an audio processor 130, a monitor 160, and a power supply 170. It should be noted that the electronic device 600 does not necessarily include all the components shown in FIG. 15. In addition, the electronic device 600 may further include components not shown in FIG. 15, and reference may also be made to the prior art. It should be noted that this figure is illustrative, and other types of structures may be used to supplement or replace this structure to realize further telecommunication functions or other functions.

[0084] As shown in FIG. 15, the processor 100, which may also be referred to as a controller or an operation controller, may include a microprocessor or other processor device and / or a logic device. The processor 100 receives inputs and controls the operation of each part of the electronic device 600.

[0085] Here, the memory 140 may be one or more of, for example, a buffer, a flash memory, a hard drive, a removable medium, a volatile memory, a non-volatile memory, or other suitable devices. Information regarding the above failure may be stored, and further, a program for executing related information may be stored. And the processor 100 may realize storage or processing of information by executing the program stored in the memory 140.

[0086] The input unit 120 provides inputs to the processor 100. The input unit 120 is, for example, a key or a touch input device. The power supply 170 is for supplying power to the electronic device 600. The monitor 160 is for displaying display targets such as images and characters. The monitor 160 may be, for example, an LCD monitor, but is not limited thereto.

[0087] The memory 140 may be, for example, a solid-state memory such as a read-only memory (ROM), a random access memory (RAM), a SIM card, etc. Further, it may be a memory that stores information even when the power supply is cut off, is selectively erasable, and has more data set, and the example of the memory 140 may be referred to as an EPROM or the like. The memory 140 may be still another type of device. The memory 140 includes a buffer 141 (which may be referred to as a buffer memory). The memory 140 may include an application / function storage unit 142, and the application / function storage unit 142 is used to store an application program and a function program, or a flow for executing the operation of the electronic device 600 by the processor 100.

[0088] The memory 140 may further include a data storage unit 143 for storing data, such as contacts, digital data, images, audio, and / or any other data used in an electronic device. The driver storage unit 144 of the memory 140 may include various drivers for executing the communication function of the electronic device and / or other functions of the electronic device (e.g., message transmission applications, address book applications, etc.).

[0089] The communication module 110 includes a transmitter / receiver that transmits and receives signals via the antenna 111. The communication module 110 is coupled to the processor 100 to provide an input signal and receive an output signal, which may be the same as in a normal mobile communication terminal.

[0090] Based on different communication technologies, a plurality of communication modules 110, such as a cellular network module, a Bluetooth (registered trademark) module, and / or a wireless local area network module, etc., may be installed in the same electronic device. The communication module 110 is further coupled to the speaker 131 and the microphone 132 via the audio processor 130 to provide audio output via the speaker 131 and receive audio input from the microphone 132, thereby realizing a normal telecommunication function. The audio processor 130 may include any suitable buffer, decoder, amplifier, etc. Also, the audio processor 130 is further coupled to the processor 100 to enable the device to record audio with the microphone 132 and play back the audio stored in the device with the speaker 131.

[0091] It is obvious to those skilled in the art that embodiments of the present invention can be provided as a method, a system, or a computer program product. Therefore, the present invention may adopt the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. And the present invention may also adopt the form of a computer program product implemented on one or more computer-readable storage media (including but not limited to magnetic disk memory, CD-ROM, optical memory, etc.) having computer-usable program code.

[0092] The present invention has been described with reference to the flowcharts and / or block diagrams of methods, apparatuses (systems), and computer program products according to embodiments of the present invention. It should be understood that each flow and / or each block in the flowcharts and / or block diagrams, and combinations of flows and / or blocks in the flowcharts and / or block diagrams, can be realized by computer program instructions. These computer program instructions can be provided to the processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing apparatuses to create a machine, so that the processor of the computer or other programmable data processing apparatuses executes the instructions to create an apparatus for realizing the functions specified in one or more flows of the flowchart and / or one or more blocks of the block diagram.

[0093] These computer program instructions can be stored in a computer-readable memory capable of guiding a computer or other programmable data processing apparatuses to operate in a specific manner. By the instructions stored in the computer-readable memory, a manufactured product including an instruction device for realizing the functions specified in one or more flows of the flowchart and / or one or more blocks of the block diagram can be created.

[0094] These computer program instructions, when loaded into a computer or other programmable data processing apparatus, cause the apparatus to perform a series of operations and steps to generate a process implemented by the computer, thereby providing steps for implementing the functions specified by one or more flows of the flowchart and / or one or more blocks of the block diagram by instructions executed on the computer or other programmable apparatus.

[0095] In the description of this specification, the description of reference terms such as "one embodiment", "one specific embodiment", "several embodiments", "for example", "illustration", "specific illustration" or "several illustrations" means that the specific features, structures, materials or characteristics described with reference to the embodiment or illustration are included in at least one embodiment or illustration of the present invention. In this specification, the general expressions for the above terms do not necessarily refer to the same embodiment or illustration. And the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or illustrations in a suitable manner.

[0096] The above specific embodiments further elaborate on the objectives, technical solutions and beneficial effects of the present invention. However, the above description is only specific embodiments of the present invention and does not limit the protection scope of the present invention. It should be understood that any modifications, equivalent replacements, improvements, etc. made within the technical ideas and principles of the present invention should all be included in the protection scope of the present invention.

Claims

1. A temperature control system for a device, comprising a temperature detection module, a temperature control module, and a temperature adjustment module, the temperature detection module detects and obtains the temperature of the device at the current time, the temperature control module obtains the predicted temperature at the next time based on the temperature at the current time and a temperature prediction model, and outputs a temperature adjustment command to the temperature adjustment module based on the predicted temperature at the next time and a temperature threshold value which is a preset operating temperature, the temperature adjustment module performs temperature adjustment on the device based on the temperature adjustment command, and operates the device within a certain range related to the temperature threshold value, when the obtained predicted temperature at the next time is greater than the temperature threshold value and a first difference obtained by subtracting the temperature threshold value from the predicted temperature at the next time is greater than a first threshold value, the temperature control module outputs the temperature adjustment command to lower the temperature of the device, when the obtained predicted temperature at the next time is less than the temperature threshold value and a second difference obtained by subtracting the predicted temperature at the next time from the temperature threshold value is greater than a second threshold value, the temperature control module outputs the temperature adjustment command to raise the temperature of the device A temperature control system for a device, characterized in that.

2. the temperature adjustment module is configured such that a range in which the actual temperature after adjustment fluctuates up and down around the temperature threshold value is smaller than a range in which the predicted temperature at the next time fluctuates up and down around the temperature threshold value The temperature control system according to claim 1, characterized in that.

3. The temperature control system according to claim 1, characterized in that the temperature prediction model is obtained by self-learning based on historical temperature data.

4. The temperature control system according to claim 1, characterized in that the temperature prediction model is obtained in advance.

5. The temperature detection module includes a temperature detection unit, and the temperature detection unit is characterized in that a thermocouple temperature measurement circuit, a thermal resistance temperature measurement circuit or a temperature acquisition chip is adopted. The temperature control system according to claim 1.

6. The temperature detection module further includes a temperature detection accuracy processing unit, and the temperature detection accuracy processing unit includes a voltage follower circuit. The voltage follower circuit includes a first comparator and a first capacitor. The first terminal of the first comparator is connected to the temperature detection unit. The second terminal of the first comparator is connected to the output terminal of the first comparator. The third terminal of the first comparator is connected to a first power supply. The fourth terminal of the first comparator is grounded. The first terminal of the first capacitor is grounded. The second terminal of the first capacitor is connected to the first power supply. The temperature control system according to claim 5, characterized in that.

7. The temperature detection module further includes a temperature detection accuracy processing unit, and the temperature detection accuracy processing unit includes a feedback amplification circuit. The feedback amplification circuit includes a second comparator, a first resistor, a second resistor and a third resistor. The second terminal of the first resistor is connected to the second terminal of the second comparator. The first terminal of the second comparator is connected to the first terminal of the third resistor and the second terminal of the second resistor respectively. The second terminal of the third resistor is connected to the output terminal of the second comparator. The first terminal of the second resistor is grounded. The third terminal of the second comparator is connected to a first power supply. The fourth terminal of the second comparator is grounded. The temperature control system according to claim 5, characterized in that.

8. The temperature detection module further includes a temperature detection accuracy processing unit, and the temperature detection accuracy processing unit includes a filter circuit. The filter circuit includes a fourth resistor, a second capacitor, and an inductance. A second end of the fourth resistor is connected to a first end of the second capacitor and a first end of the inductance respectively. A second end of the second capacitor is grounded. A second end of the inductance is connected to the temperature control module. The temperature control system according to claim 5 is characterized in that.

9. The temperature adjustment module includes a heating unit and a cooling unit. The temperature control system according to claim 1 is characterized in that.

10. The heating unit realizes heating by heating resistance wire, copper electric heating plate, aluminum electric heating plate, ceramic electric heating, stainless steel electric heating tube, heating by control of a circulating air passage, or heating by control of a chemical reagent reaction. The temperature control system according to claim 9 is characterized in that.

11. The heating unit includes a heating resistance wire, a first MOS transistor, a fifth resistor, and a sixth resistor. A first end of the heating resistance wire is connected to a second power supply. A second end of the heating resistance wire is connected to a drain of the first MOS transistor. A gate of the first MOS transistor is connected to a first end of the fifth resistor and a first end of the sixth resistor respectively. A source of the first MOS transistor and a second end of the fifth resistor are grounded. A second end of the sixth resistor is connected to the temperature control module. The temperature control system according to claim 9 is characterized in that.

12. The cooling unit realizes cooling and temperature reduction by liquid cooling circulation cooling, metal heat pipe conduction cooling, graphite sheet conduction cooling, semiconductor cooling, chemical reagent cooling, or a heat dissipation fan. The temperature control system according to claim 9 is characterized in that.

13. The cooling unit includes a second MOS transistor, a seventh resistor, and a heat dissipation fan. The first end of the seventh resistor and the drain of the second MOS transistor are connected to a third power supply, the gate of the second MOS transistor and the second end of the seventh resistor are connected to the temperature control module, the source of the second MOS transistor is connected to the first end of the heat dissipation fan, and the second end of the heat dissipation fan is grounded. The temperature control system according to claim 9, characterized in that.

14. The temperature control module is characterized in that a microprocessor, a field programmable gate array or a complex programmable logic device is adopted. The temperature control system according to any one of claims 1 to 12.

15. A charging system characterized by including the temperature control system of the device according to any one of claims 1 to 13.

16. Steps to obtain the temperature of the current time of the device, Steps to obtain the predicted temperature of the next time based on the temperature of the current time and the temperature prediction model, Steps to output a temperature adjustment command based on the predicted temperature of the next time and a temperature threshold value which is a preset operating temperature, adjust the temperature of the device, and operate the device within a certain range related to the temperature threshold value, Including, The step of outputting a temperature adjustment command based on the predicted temperature of the next time and the temperature threshold value to adjust the temperature of the device is, When it is determined that the predicted temperature of the next time is greater than the temperature threshold value and a first difference obtained by subtracting the temperature threshold value from the predicted temperature of the next time is greater than a first threshold value, output the temperature adjustment command to lower the temperature of the device, When it is determined that the predicted temperature of the next time is less than the temperature threshold value and a second difference obtained by subtracting the predicted temperature of the next time from the temperature threshold value is greater than a second threshold value, output the temperature adjustment command to raise the temperature of the device, A temperature control method characterized by including.

17. The method according to claim 16, wherein the temperature prediction model is obtained by self-learning based on historical temperature data.

18. The method according to claim 16, wherein the temperature prediction model is obtained in advance.

19. The temperature prediction model is obtained by training based on historical temperature training data, obtaining the historical temperature training data, training based on the historical temperature training data and an initial model to obtain the temperature prediction model, The method according to claim 16, characterized by including the above.

20. An electronic device including a memory, a processor, and a computer program stored in the memory and executable by the processor, When the computer program is executed by the processor, the steps of the method according to any one of claims 16 to 19 are realized. An electronic device characterized by this.

21. A computer-readable storage medium storing a computer program, When the computer program is executed by a processor, the steps of the method according to any one of claims 16 to 19 are realized. A computer-readable storage medium characterized by this.

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