Floor material with RFID, its laying structure, and floor material

Abstract

To provide a relatively inexpensive flooring material with RFID that can visually determine the position of RFID and can be applied to various installation locations.SOLUTION: A floor material 1 with an RFID of the present invention has a floor material 2 and an RFID 3 provided on the floor material 2, and the floor material 2 is formed with an open recessed portion 5 on its back surface. The RFID 3 is housed and held in the recessed portion 5 so as not to protrude from the back surface 2a of the flooring material 2.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a flooring material with RFID equipped with RFID.

Background Art

[0002] RFID is a device having an IC chip and a wireless communication unit, capable of exchanging information by wireless communication. By providing such RFID in a flooring material, a system floor structure such as guiding visually impaired persons can be constructed. For example, Patent Document 1 discloses a tile carpet having a pile fabric layer and a resin layer laminated on the lower surface of the pile fabric layer, wherein the resin layer has a glass base fabric layer, an upper resin layer laminated on the upper surface side of the glass base fabric layer, and a lower resin layer laminated on the lower surface side of the glass base fabric layer, and a fiber layer or a sheet-like material containing an RFID tag is interposed between the upper resin layer and the glass base fabric layer or between the glass base fabric layer and the lower resin layer.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

[0004] However, when RFID is interposed inside the resin layer as in Patent Document 1, the position where RFID exists cannot be visually recognized even when viewed from the front and back surfaces of the flooring material. For this reason, when constructing the flooring material, there is a risk of accidentally laying the RFID-equipped flooring material in a place different from the design. In addition, there are various types of RFID depending on the communication distance and the like, and it is desirable to use an appropriate type of RFID according to the laying location. In this regard, when the RFID is embedded in the resin layer as in Patent Document 1, it is necessary to manufacture and store several types of tile carpets in which the desired RFID corresponding to the laying location is embedded in advance. However, as described above, if the number of types (number of items) and the inventory of tile carpets with different RFID increase too much, the product unit price also increases. For this reason, conventionally, the number of items of tile carpets has to be limited, and as a result, there is also a problem that the laying location is limited.

Problems to be Solved by the Invention

[0005] An object of the present invention is to provide a relatively inexpensive flooring material with RFID that can visually recognize the position of the RFID and can be applied to various laying locations.

Means for Solving the Problems

[0006] The flooring material with RFID of the present invention includes an upper resin layer and 、 a lower resin layer disposed on the back side of the upper resin layer and a reinforcing layer containing glass fibers interposed between the upper resin layer and the lower resin layer or inside the lower resin layer; and has a flooring material and an RFID provided in the flooring material. The upper resin layer is a resin layer that is not a synthetic fiber layer and forms the surface of the flooring material. A recess is formed on the back surface of the flooring material and is open. the recess is formed on the back side of the reinforcing layer, and a part of the lower resin layer is interposed in a layered manner between the bottom surface of the recess and the reinforcing layer; The RFID is housed and held in the recess so as not to protrude from the back surface of the flooring material.

[0007] In a preferred flooring material with RFID of the present invention, the upper resin layer is a non-foamed resin layer that is not a synthetic fiber layer. In a preferred flooring material with RFID of the present invention, the upper resin layer has higher strength than the lower resin layer. In a preferred flooring material with RFID of the present invention, the thickness of the layered lower resin layer between the bottom surface of the recess and the reinforcing layer is 0.3 mm or more . Ma However, in the laying structure of the present invention, any of the above-mentioned flooring materials with RFID is attached to the floor under the floor by an attachment portion.

[0008] Moreover, as the flooring material used for the flooring material with RFID described in any of the above, the following flooring materials are preferable. That is, for the flooring material with RFID of the present invention, it is preferable to use a flooring material having a recess formed on the back surface and open so that the RFID does not protrude from the back surface thereof.

Advantages of the Invention

[0009] Since the position of the RFID can be visually recognized from the back side in the flooring material with RFID of the present invention, construction mistakes can be prevented. Further, since the RFID corresponding to the laying location can be easily attached from the back surface side of the flooring material in the flooring material with RFID of the present invention, the number of items does not become excessive and it is inexpensive, and it can be easily applied to various laying locations.

Brief Description of the Drawings

[0010]

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Best Mode for Carrying Out the Invention

[0011] Hereinafter, the present invention will be described with appropriate reference to the drawings. In this specification, the "surface" of the flooring material refers to the side far from the floor base on which the flooring material with RFID is laid, and the "back surface" refers to the opposite side (the side close to the floor base on which the flooring material with RFID is laid). Plan view means viewing the flooring material with RFID from a direction perpendicular to the surface or the back surface of the flooring material with RFID. In this specification, the numerical range represented by "lower limit value X to upper limit value Y" means not less than the lower limit value X and not more than the upper limit value Y. When a plurality of said numerical ranges are separately described, any lower limit value and any upper limit value can be selected and "any lower limit value to any upper limit value" can be set. Also, it should be noted that the dimensions such as thickness and size in each figure are different from the actual ones.

[0012] [Overview of the Flooring Material with RFID] FIG. 1 is a plan view of one floor material 1 with an RFID, and FIG. 2 is a rear view of the same floor material 1 with an RFID. FIG. 3 is a plan view of another floor material 1 with an RFID. The plan view is seen from the surface side of the floor material 1 with an RFID, and the rear view is seen from the back side thereof. FIG. 4 is a schematic enlarged cross-sectional view of the floor material 1 with an RFID cut in the thickness direction. In FIG. 4, the layer structure of the floor material is not shown. In the floor material 1 with an RFID of the present invention, an RFID 3 is provided in a recess 5 formed in the floor material 2. Examples of the type of the floor material 2 of the present invention in which the RFID 3 is provided include resin floor materials such as resin tiles and resin sheets; tile carpets; and the like. Hereinafter, when it is necessary to distinguish between the resin floor material and the tile carpet, they will be described as such, and when collectively describing the floor materials including them, they will be referred to as "floor materials". In the resin floor material (such as resin tiles and resin sheets), the surface of the resin layer forms the surface of the floor material 2, and in the tile carpet, the surface of the pile layer forms the surface of the floor material 2. As shown in FIG. 1, the resin tiles and the tile carpet are formed in a single-leaf shape in plan view. As shown in FIG. 3, the resin sheet is formed in a long strip shape in plan view.

[0013] Specifically, as shown in FIG. 1, the single-piece floor material 1 with RFID (resin tile or tile carpet equipped with RFID 3) is formed, for example, in a substantially square shape in plan view. However, the single-piece floor material 1 with RFID may be formed in a substantially rectangular shape or a substantially hexagonal shape in plan view (not shown). Specific dimensions of the substantially square or substantially rectangular floor material 1 with RFID are, for example, length in the first direction × length in the second direction = 300 mm to 1000 mm × 300 mm to 1000 mm, preferably length in the first direction × length in the second direction = 500 mm to 950 mm × 500 mm to 950 mm, more preferably length in the first direction × length in the second direction = 700 mm to 900 mm × 700 mm to 900 mm, etc. In this specification, the "first direction" is a direction orthogonal to the second direction within the plane of the floor material 1 with RFID. Preferably, the single-piece floor material 1 with RFID is substantially square in plan view, that is, the length in the first direction and the length in the second direction are equal. By forming the floor material 1 with RFID in a substantially square shape in plan view, a plurality of floor materials 1 with RFID can be continuously laid side by side without gaps. As shown in FIG. 3, the long-strip-shaped floor material 1 with RFID (resin sheet equipped with RFID 3) is formed in a substantially rectangular shape in plan view where the length in one direction is sufficiently longer than the other direction. The long-strip-shaped floor material 1 with RFID has, for example, a length in the first direction of 1000 mm to 4000 mm and a length in the second direction of 5 m or more, preferably a length in the second direction of 10 m or more. In this specification, "substantially" means the range acceptable in the technical field to which the present invention belongs. "Substantially" in substantially rectangular shape, substantially square shape, substantially rectangular shape, etc. includes, for example, a shape with chamfered corners, a shape where a part of the side bulges or depresses slightly, a shape where the side is slightly curved, etc.

[0014] The floor material 1 with RFID of the present invention may or may not have flexibility. The flexible floor material 1 with RFID can be wound around a core with a diameter of 10 cm in a roll shape, for example, with the back side of the floor material 1 with RFID facing the core. The floor material 1 with RFID without flexibility is so rigid that it is difficult to wind it around the core with a diameter of 10 cm. Due to ease of construction, the flexible floor material 1 with RFID is preferred. In particular, the long strip-shaped floor material 1 with RFID is preferably flexible because it can be wound in a roll for storage and transportation. Note that by appropriately setting the layer structure, the material and thickness of each layer of the floor material 2, a flexible floor material with RFID or a floor material with RFID without flexibility can be produced.

[0015] The thickness of the entire resin floor material is not particularly limited, but is, for example, 0.5 mm to 10 mm, preferably 1.5 mm to 5 mm. The thickness of the entire tile carpet is not particularly limited, but is, for example, 5 mm to 20 mm, preferably 6 mm to 16 mm.

[0016] The floor material 1 with RFID of the present invention has a floor material 2 and an RFID 3 held on the back side of the floor material 2. Note that Fig. 4 is a cross-sectional view taken along line IV-IV of Fig. 1, and the cross-sectional view of the floor material 1 with RFID shown in Fig. 3 is the same as Fig. 4. As shown in Fig. 4, a recess 5 is formed on the back surface 2a of the floor material 2. The recess 5 is open on the back surface 2a of the floor material 2. The recess 5 is formed in a shape such that the RFID 3 does not protrude from the back surface 2a of the floor material 2. The RFID 3 is housed and held in the open recess 5. The RFID 3 is housed in the recess 5 so as not to protrude from the back surface 2a of the floor material 2. The statement that "the RFID 3 is housed in the recess 5 so as not to protrude from the back surface 2a of the floor material 2" means the case where the RFID 3 is housed in the recess 5 such that the back surface of the RFID 3 and the back surface 2a of the floor material 2 are located on substantially the same plane, or the case where the RFID 3 is housed in the recess 5 with the back surface of the RFID 3 slightly inside the back surface 2a of the floor material 2. Preferably, the RFID 3 is housed in the recess 5 such that its back surface is slightly inside the back surface 2a of the floor material 2. The fact that the back surface of the RFID 3 is slightly inside the back surface 2a of the floor material 2 means, for example, a position where the back surface of the RFID 3 is separated from the back surface 2a of the floor material 2 by 0.1 mm to 2.0 mm, preferably 0.2 mm to 1.0 mm. By housing it in this way, regardless of the manufacturing error, the RFID 3 can be prevented from protruding from the back surface 2a of the floor material 2. Further, after the floor material 1 with RFID is laid on the floor base, a slight space is formed between the back surface of the RFID 3 and the floor base, so that the RFID 3 can be appropriately protected against stepping pressure.

[0017] The RFID 3 housed and held in the open recess 5 can be visually recognized from the back surface side of the floor material 2 as shown in FIG. 2. For this reason, the position of the RFID 3 provided in the floor material 2 can be easily recognized visually. In addition, in FIGS. 1 to 3, the RFID 3 is housed and held near the central portion of the floor material 2 (a recess 5 is formed near the central portion of the floor material 2), but the position where the RFID 3 is provided is not limited to this, and the recess 5 may be formed at an appropriate position and the RFID 3 may be housed and held in the recess 5. Also, it is preferable that the recess 5 is not formed including the side end surface 2b of the floor material 2. In particular, it is preferable that the recess 5 is formed at a position separated from the side end surface 2b of the floor material 2 by 10 mm or more. By forming the recess 5 separated by 10 mm or more in this way, it is possible to suppress a decrease in the strength of the recess 5 and prevent sinking at the joint portion (the joint where the side end surfaces of adjacent floor materials 2 contact each other) and in the vicinity thereof that occur after the floor material 1 with RFID is laid on the floor base.

[0018] [RFID] FIG. 5 shows an example of the RFID 3, and FIG. 6 shows a cross-sectional view of the RFID 3. In FIGS. 5 and 6, the RFID 3 includes an IC chip 31, an antenna 32 as a wireless communication unit, and a support substrate 33 that holds the IC chip 31 and the antenna 32. The RFID 3 in the illustrated example is substantially rectangular in plan view, but the plan view shape of the RFID 3 is not limited thereto, and may be substantially square, substantially circular, or the like in plan view. The IC chip 31 includes a memory that stores various information such as ID information. The memory may be of a type that can only be read, or a type that can be written and read. Examples of the support substrate 33 include a flexible resin film, a non-flexible resin film, and ceramic. Also, on the side opposite to the support substrate 33, a covering material 34 that covers the IC chip 31 and the antenna 32 may be provided. Examples of the covering material 34 include a flexible resin film, a non-flexible resin film, ceramic, and a sealing resin.

[0019] For example, the RFID 3 in FIG. 6 includes a resin film 331 (support substrate 33), an IC chip 31 and an antenna 32 fixed to the surface of the resin film, and a resin film 341 (covering material 34) attached via an adhesive layer 35 so as to cover the IC chip 31 and the antenna 32. The RFID 3 is not limited to FIG. 6, and those having various conventionally known structures can be used. For example, the RFID 3 shown in FIG. 7(a) includes a resin film 331 (support substrate 33), an IC chip 31 and an antenna 32 fixed to the surface of the resin film 331, and a sealing resin layer 342 (covering material 34) that seals the resin film 331 so as to cover the IC chip 31 and the antenna 32. The RFID3 shown in Fig. (b) has a ceramic plate 332 (support substrate 33), an IC chip 31 and an antenna 32 fixed to the surface of the ceramic plate 332, and a resin film 341 or a ceramic plate (coating material 34) fixed via an adhesive layer 36 so as to cover the IC chip 31 and the antenna 32. The RFID3 shown in Figs. 6, 7(a) and (b) is in the shape of a flat plate having a substantially uniform thickness. Note that, as shown in Fig. 7(c), an RFID3 without the coating material 34 may be used.

[0020] [Layer structure of the floor material] Next, some layer structures of the floor material 2 provided with the RFID3 will be described. However, in the present invention, the layer structure of the floor material 2 is not limited to the following examples. The floor material 2 has an upper resin layer and a lower resin layer laminated on the back surface side of the upper resin layer. In the resin floor material, the surface of the upper resin layer forms the surface of the floor material 2. In the tile carpet, a pile layer is provided on the upper resin layer, and the surface of the pile layer forms the surface of the floor material 2. Also, in both the resin floor material and the tile carpet, in many cases, the back surface of the lower resin layer forms the back surface 2a of the floor material 2. However, for example, there may be a case where the back surface of the reinforcing layer forms the back surface 2a of the floor material 2. In the floor material 2 in which the back surface 2a of the floor material 2 is composed of the back surface of the lower resin layer, a recessed portion 5 is formed in the lower resin layer by performing processing such as shaving the lower resin layer. The upper resin layer and the lower resin layer may be directly laminated in contact with each other. Usually, however, an intermediate layer composed of one layer or two or more layers is interposed between the upper resin layer and the lower resin layer. The intermediate layer preferably includes at least a reinforcing layer. Examples of the reinforcing layer include a non-woven fabric or a woven fabric containing glass fibers, as will be described in detail below. The reinforcing layer is preferably interposed between the upper resin layer and the lower resin layer, or inside the lower resin layer. In this case, the recess 5 formed in the lower resin layer is located on the back side of the reinforcing layer, and the RFID 3 accommodated in the recess 5 is disposed on the back side of the reinforcing layer. By disposing the RFID 3 on the back side of the reinforcing layer, the RFID 3 can be protected from stepping pressure. Further, when forming the recess 5 in the lower resin layer, by leaving a part of the lower resin layer in a layer form between the recess 5 and the reinforcing layer, it is possible to prevent the reinforcing layer from being exposed from the bottom surface of the recess 5.

[0021] From the viewpoint of strength, the upper resin layer and the lower resin layer of the floor material 2 may have the same degree of strength or one of them may have a higher strength than the other, but preferably, the upper resin layer has a higher strength than the lower resin layer. The higher strength means that the mechanical strength is high. For example, the upper resin layer having a higher strength than the lower resin layer includes a case where when the upper resin layer and the lower resin layer are respectively cut using a cutting tool under the same conditions, the upper resin layer is more difficult to cut than the lower resin layer. An example of the more difficult to cut is that it takes more time for the upper resin layer than the lower resin layer to be cut to the same depth. Since the upper resin layer has a higher strength than the lower resin layer, the RFID 3 disposed on the back side thereof can be protected from impacts from the surface side of the floor material 2. Further, since the upper resin layer has a high strength, it is difficult to wear after laying, and a decrease in the protection effect of the RFID 3 can be prevented.

[0022] Also, each layer constituting the floor material 2 preferably does not substantially contain a metal that inhibits the wireless communication of the RFID 3. The phrase "not substantially containing the metal" means that a trace amount of metal unavoidably contained is allowed, and a significant amount of incorporation is excluded. Figures 8 to 11 are enlarged cross-sectional views of the floor covering 2 with various layer configurations. However, it should be noted that in Figures 8 to 11, the recessed portion 5 is not formed and the floor covering is shown in the state before the RFID 3 is provided. Also, in Figures 8 to 11, the case where it is a resin floor covering is illustrated in each. For the tile carpet, a pile layer is provided on the upper resin layer of these illustrated examples.

[0023] The floor covering 2 of the first example in Figure 8 has, in order from the back side to the front side, a lower resin layer 21, a reinforcing layer 22, a decorative layer 23, a surface layer 24, and a surface protection layer 25. These layers are joined and integrated. In the example shown in Figure 8, either the surface layer 24 or the surface protection layer 25 may be omitted as necessary. In Figure 8, conceptually, the surface protection layer 25 corresponds to the upper resin layer of the floor covering 2, and the reinforcing layer 22, the decorative layer 23, and the surface layer 24 correspond to the intermediate layer of the floor covering 2. However, when the surface protection layer 25 is omitted, the surface layer 24 corresponds to the upper resin layer of the floor covering 2.

[0024] The floor covering 2 of the second example in Figure 9 has, in order from the back side to the front side, a first lower resin layer 211, a second lower resin layer 212, a reinforcing layer 22, a decorative layer 23, a surface layer 24, and a surface protection layer 25. These layers are joined and integrated. In the example shown in Figure 9, either the surface layer 24 or the surface protection layer 25 may be omitted as necessary. The first lower resin layer 211 and the second lower resin layer 212 preferably have different materials for the purpose of strengthening the protection of the RFID 3. In Figure 9, the surface protection layer 25 (or the surface layer 24 when this is omitted) corresponds to the upper resin layer of the floor covering 2, and the reinforcing layer 22, the decorative layer 23, and the surface layer 24 correspond to the intermediate layer of the floor covering 2.

[0025] In the third example of the flooring material 2 in FIG. 10, from the back side to the front side in order, there are a first lower resin layer 211, a first reinforcing layer 221, a second lower resin layer 212, a second reinforcing layer 222, a decorative layer 23, a surface layer 24, and a surface protection layer 25. These layers are joined and integrated. In the example shown in FIG. 10, either the surface layer 24 or the surface protection layer 25 may be omitted as necessary. In FIG. 10, the surface protection layer 25 (when this is omitted, the surface layer 24) corresponds to the upper resin layer of the flooring material 2, and the first reinforcing layer 221, the second reinforcing layer 222, the decorative layer 23, and the surface layer 24 correspond to the intermediate layer of the flooring material 2.

[0026] In the fourth example of the flooring material 2 in FIG. 11, from the back side to the front side in order, there are a first reinforcing layer 221, a lower resin layer 21, a second reinforcing layer 222, a decorative layer 23, a surface layer 24, and a surface protection layer 25. These layers are joined and integrated. In the example shown in FIG. 11, either the surface layer 24 or the surface protection layer 25 may be omitted as necessary. In FIG. 11, the back surface of the first reinforcing layer 221 constitutes the back surface 2a of the flooring material 2, the surface protection layer 25 (when this is omitted, the surface layer 24) corresponds to the upper resin layer of the flooring material 2, and the second reinforcing layer 222, the decorative layer 23, and the surface layer 24 correspond to the intermediate layer of the flooring material 2.

[0027] Note that in the layer structures shown in FIGS. 8 to 11, the reinforcing layer 22 may be interposed inside the lower resin layer 21 (for example, in the middle part of the lower resin layer 21). Also, when applying the layer structures shown in FIGS. 8 to 11 to a tile carpet, the decorative layer 23 and the surface protection layer 25 are omitted, and the surface layer 24 becomes the upper resin layer.

[0028] <RFID-equipped flooring material with a preferable layer structure> FIG. 12 shows an RFID-equipped flooring material 1 (RFID-equipped resin flooring material) in which an RFID 3 is provided in a resin flooring material with a preferable layer structure. Referring to FIG. 12, the flooring material 1 with RFID (resin flooring material with RFID) includes a resin flooring material 2A (flooring material 2), a recessed portion 5 opened on the back surface of the resin flooring material 2A, and an RFID 3 housed in the recessed portion 5. The resin flooring material 2A has, in order from the back surface side to the front surface side, a lower resin layer 21, a reinforcing layer 22, a decorative layer 23, a surface layer 24, and a surface protection layer 25 which is an upper resin layer.

[0029] FIG. 13 shows a flooring material 1 with RFID (tile carpet with RFID) in which an RFID 3 is provided in a tile carpet having a preferable layer configuration. Referring to FIG. 13, the flooring material 1 with RFID (tile carpet with RFID) includes a tile carpet 2B (flooring material 2), a recessed portion 5 opened on the back surface of the tile carpet 2B, and an RFID 3 housed in the recessed portion 5. The tile carpet 2B has, in order from the back surface side to the front surface side, a lower resin layer 21, a reinforcing layer 22, a surface layer 24 which is an upper resin layer, and a pile layer 26 in which pile yarns 262 are implanted in a base fabric 261.

[0030] Referring to FIGS. 12 and 13, the recessed portion 5 is formed in the lower resin layer 21. Therefore, the recessed portion 5 is formed on the back surface side of the reinforcing layer 22. Between the bottom surface of the recessed portion 5 and the reinforcing layer 22, a resin layer 219 which is a remaining part of the lower resin layer 21 and forms a layer is interposed. The RFID 3 is attached to the bottom surface of the recessed portion 5. The thickness of the resin layer 219 is, for example, 0.3 mm or more, preferably 0.6 mm or more, and more preferably 1.0 mm or more. If the thickness of the resin layer 219 is equal to or greater than the lower limit value, the strength of the recessed portion 5 can be maintained and the RFID 3 can be appropriately protected. The upper limit value of the thickness of the resin layer 219 can be appropriately set within a range smaller than the thickness of the lower resin layer 21.

[0031] The recess 5 as described above can be formed by, for example, scraping off a part of the lower resin layer 21 from the back surface 2a of the floor material 2 (scraping off includes scraping away), or by pressing a hard convex jig against the back surface 2a of the floor material 2 to dent a part of the lower resin layer 21. Since the recess does not return and the recess 5 with a desired size can be easily formed at a desired position, it is preferable to form the recess 5 by scraping off a part of the lower resin layer 21. As a specific example of the processing method, scraping by milling can be mentioned. Examples of the apparatus for performing the milling include a fly cutter, an end mill, a side cutter, etc.

[0032] <lower resin layer> The lower resin layer 21 (including the first lower resin layer 211 and the second lower resin layer 212) is the main resin layer constituting the floor material 2. The lower resin layer 21 may be a foamed layer that is foamed, or a non-foamed layer that is not foamed. When the lower resin layer 21 of the floor material 2 is a foamed layer, cushioning properties can be imparted to the RFID-equipped floor material 1 and the recess 5 is easily formed. For example, in the floor material 2 having the first lower resin layer 211 and the second lower resin layer 212, it is preferable that the first lower resin layer 211 is foamed and the second lower resin layer 212 is non-foamed. The floor material 2 having the foamed first lower resin layer 211 and the non-foamed second lower resin layer 212 has cushioning properties by the first lower resin layer 211 and rigidity by the second lower resin layer 212, and furthermore, the recess 5 can be easily formed at a desired location of the first lower resin layer 211. When the lower resin layer 21 is a foamed layer, its foaming ratio is not particularly limited, but for example, it is 1.1 times to 4 times, preferably 1.1 times to 2 times. If the foaming ratio is too low, cushioning properties cannot be substantially imparted to the RFID-equipped floor material 1, while if the foaming ratio is too high, the RFID-equipped floor material 1 will be deformed too much in the thickness direction. Note that the foaming ratio refers to the value obtained by dividing the density of the material before foaming by the apparent density after foaming. Also, the density of the lower resin layer 21 is 0.5 kg / m3 ~2.5 kg / m 3 is preferable, and 0.65 kg / m 3 ~2.0 kg / m 3 is more preferable. If the density of the lower resin layer 21 is equal to or higher than the lower limit value, the strength of the recessed portion 5 can be maintained, and the RFID 3 can be appropriately protected. If the density of the lower resin layer 21 is equal to or lower than the upper limit value, the risk of interfering with the communication of the RFID 3 can be reduced, and since its density is high, it is difficult to wear, and the protection of the RFID 3 can be maintained over a long period of time.

[0033] The resin component of the lower resin layer 21 is not particularly limited, and conventionally known ones can be used. Generally, a thermoplastic resin is used, and furthermore, a soft thermoplastic resin is used. Examples of the thermoplastic resin include vinyl chloride resins such as vinyl chloride and vinyl chloride-vinyl acetate copolymers; polyolefin resins; urethane resins; vinyl acetate resins such as ethylene-vinyl acetate copolymers; acrylic resins such as ethylene-methacrylate resins; polyamide resins; ester resins; various elastomers such as olefin elastomers and styrene elastomers; and rubber. These can be used alone or in combination of two or more. From the viewpoints of low cost and excellent flexibility and durability, the lower resin layer 21 is preferably a resin layer mainly composed of a vinyl chloride resin. As the vinyl chloride resin, those produced by an emulsion polymerization method, a suspension polymerization method, a solution polymerization method, a bulk polymerization method, etc. can be used. From the viewpoints of easy processing and easy handling, vinyl chloride resins obtained by an emulsion polymerization method or a suspension polymerization method are preferable. These vinyl chloride resins may be used alone or in combination of two or more. The thickness of the lower resin layer 21 is not particularly limited and can be appropriately set. For example, it is 0.5 mm to 5 mm, preferably 0.7 mm to 2 mm. Note that when the lower resin layer 21 is composed of a plurality of resin layers, the thickness of the lower resin layer corresponds to the total thickness of the plurality of resin layers.

[0034] <Reinforcing layer> The reinforcing layer 22 is not particularly limited, and examples thereof include fiber-containing layers such as non-woven fabrics, woven fabrics, paper, and felt. The material of the fibers constituting the non-woven fabric or woven fabric is not particularly limited, and examples thereof include synthetic resin fibers such as polyester and polyolefin; inorganic fibers such as glass fiber and carbon fiber; and natural fibers. The material of the fibers constituting the felt is not particularly limited, and examples thereof include the hair of animals such as sheep; synthetic resin fibers such as polyester and polyolefin; and the like. As the reinforcing layer 22, commercially available products such as spunbond non-woven fabric, felt, glass mat, and glass net can be preferably used. Further, the reinforcing layer 22 may be one impregnated with a synthetic resin in advance. The thickness of the reinforcing layer 22 can be appropriately set according to the type of the material constituting it, etc., but usually it may be about 0.1 mm to 1 mm. As the reinforcing layer 22 constituting the intermediate layer of the floor material 2, it is preferable to use a non-woven fabric or a woven fabric containing glass fiber. By using a non-woven fabric or a woven fabric containing glass fiber as the reinforcing layer 22 constituting the intermediate layer of the floor material 2, warping of the floor material 1 with RFID can be effectively prevented. The basis weight of the reinforcing layer 22 is not particularly limited, and for example, 30 g / m 2 ~200 g / m 2 is used. In addition, when having the first reinforcing layer 221 and the second reinforcing layer 222 as shown in FIGS. 10 and 11, as the first reinforcing layer 221, a non-woven fabric or a woven fabric such as polyolefin, felt, or the like is used, and as the second reinforcing layer 222, a non-woven fabric containing glass fiber (or a non-woven fabric such as glass fiber impregnated with a synthetic resin) or the like is used. Examples of the non-woven fabric such as glass fiber impregnated with a synthetic resin include a glass fiber non-woven fabric impregnated with a vinyl chloride resin in advance. The reinforcing layer impregnated with the resin has excellent adhesiveness to the layers in contact with the reinforcing layer above and below, and can increase the interlayer peeling strength.

[0035] <Decorative layer> The decorative layer 23 is a layer that imparts color to the floor material 1 with RFID. Examples of the decorative layer 23 include a colored synthetic resin layer, a printed sheet, a transfer sheet, and the like. The colored synthetic resin layer is a layer that exhibits color by itself. The synthetic resin layer includes (1) a resin layer composed of the color of the resin itself, (2) a resin layer in which a colorant is mixed and colored by the colorant, (3) a resin layer in which colored resin chips are mixed and formed into a sheet shape, and the like. The printed sheet is a synthetic resin sheet such as a vinyl chloride resin sheet with a single color printed thereon. The transfer sheet is obtained by printing printing ink on a base material such as release paper and curing it, and then peeling off the cured printing ink. The thickness of the decorative layer 23 is not particularly limited, but for example, it is 0.5 μm to 1 mm, preferably 0.01 mm to 0.8 mm. When the decorative layer 23 is composed of a colored synthetic resin layer, its thickness is, for example, 0.3 mm to 1 mm, and when the decorative layer 23 is composed of a printed sheet or a transfer sheet, its thickness is 0.5 μm to 0.5 mm.

[0036] <Surface layer> The surface layer 24 is a layer provided to easily remove dirt attached to the flooring material 1 with RFID. The surface layer 24 is transparent, preferably colorless and transparent, in order to visually recognize the color of the decorative layer 23 provided below the surface layer 24. Further, the surface layer 24 is non-foamed and preferably does not contain a filler such as calcium carbonate. The surface layer 24 is formed of a resin material. In particular, the surface layer 24 is preferably a non-foamed layer with a relatively high density. Specifically, the density of the surface layer 24 is preferably 0.5 kg / m 3 ~2.5 kg / m 3 and more preferably 0.65 kg / m 3 ~2.0 kg / m 3 As the resin material of the surface layer 24, those exemplified in the column of the <lower resin layer> above can be mentioned. Since it is firmly joined, a resin mainly composed of a vinyl chloride-based resin is preferred. The thickness of the surface layer 24 is not particularly limited and is, for example, 0.03 mm to 1 mm.

[0037] <Surface protection layer> The surface protective layer 25 is a layer provided on the surface of the floor material 1 with RFID to impart abrasion resistance, scratch resistance, and stain resistance. The surface protective layer 25 is transparent (preferably colorless and transparent) for the same reason as the surface layer. Also, the surface protective layer 25 is non-foamed. The resin material forming the surface protective layer 25 is not particularly limited, but it is preferably formed from a relatively hard resin layer. Such a surface protective layer 25 includes those containing a hard synthetic resin as the main component resin. The hard synthetic resin is not particularly limited, but it is preferable to use a curable resin for good processability, and further, since it is difficult to cause thermal damage to the layer (such as the surface layer 24) to which the surface protective layer 25 is laminated, it is more preferable to use an ionizing radiation curable resin, and since it is general-purpose, it is even more preferable to use an ultraviolet curable resin. Examples of the curable resin include ionizing radiation curable resins such as ultraviolet curable resins, thermosetting resins, and resins curable by non-ionizing radiation. By using such a resin material, a surface protective layer 25 with higher strength than the lower resin layer 21 can be formed. The thickness of the surface protective layer 25 is not particularly limited, but for example, it is 1 μm to 100 μm, preferably 5 μm to 70 μm, and more preferably 10 μm to 50 μm.

[0038] [Details of the floor material with RFID] FIG. 14 shows a partially enlarged cross-sectional view of the floor material 2 in which the recessed portion 5 is formed in the lower resin layer 21. FIGS. 14 to 20 show a preferable layer configuration of the resin floor material 2A as the layer configuration of the floor material 2, but it is not necessarily limited thereto. The recessed portion 5 is a space defined by the bottom surface 5a and the peripheral wall surface 5b, and the side opposite to the bottom surface 5a is open. The shape of the recessed portion 5 in plan view is formed to be substantially the same shape and size as the plan view shape of the RFID 3 or a substantially the same shape or a different shape with a larger area than that. The depth of the recessed portion 5 is formed to be substantially the same as or larger than the sum of the thickness of the RFID 3 and the thickness of the holding portion (the holding portion is a means for holding the RFID 3 in the recessed portion 5 by intervening between the RFID 3 and the bottom surface 5a of the recessed portion 5). The recessed portion 5 is formed within the range of the lower resin layer 21. That is, the bottom surface 5a of the recessed portion 5 does not reach the intermediate layer of the floor material 2 and exists within the lower resin layer 21. Note that the recessed portion 5 is not limited to being formed only within the range of the lower resin layer 21, and may be formed so as to straddle a part of the intermediate layer such as the reinforcing layer 22 from the lower resin layer 21. As shown in the figure, the inner corner portion 5c of the recessed portion 5 may be right-angled in cross-section or may be arcuate in cross-section. A right-angled inner corner portion 5c is easy to form. An arcuate inner corner portion 5c is preferable from the viewpoint of pressure resistance. In the recessed portion 5 having an arcuate inner corner portion 5c, the pressure applied from above is less likely to concentrate on the corner portion, so the floor material having such a recessed portion 5 can appropriately protect the RFID 3 against stepping pressure.

[0039] FIG. 15 shows a first example of the housing structure in which the RFID 3 is housed and held in the recessed portion 5. Referring to FIG. 15, the RFID 3 is fixed to the bottom surface 5a of the recessed portion 5 via the holding portion 6. The RFID 3 is housed in the recessed portion 5 so as not to protrude from the back surface 2a of the floor material 2. Not protruding from the back surface 2a of the floor material 2 means that the back surface of the RFID 3 is located on substantially the same plane as the back surface 2a of the floor material 2 or is located above the back surface 2a of the floor material 2 (on the surface side of the floor material 2). In the illustrated example, the RFID 3 is housed and held in the recessed portion 5 so that the back surface of the RFID 3 is located on substantially the same plane as the back surface 2a of the floor material 2. However, since the floor material 2 is not a precision instrument, it should be noted that the back surface of the RFID 3 and the back surface 2a of the floor material 2 are not strictly on the same plane (for this reason, it is described as being located on substantially the same plane). In the illustrated example, an adhesive tape 61 is used as the holding portion 6, and the RFID 3 is adhered to the bottom surface 5a of the recessed portion 5 with the adhesive tape. The adhesive tape 61 (double-sided adhesive tape) has a sheet 611 and adhesive layers 612, 612 provided on both surfaces of the sheet 611. The sheet 611 of the adhesive tape 61 may be non-foamed, but from the viewpoint of protecting the RFID 3, it preferably has a foamed layer, and more preferably, a sheet made of a foamed layer (foamed sheet). In addition, the RFID 3 is accommodated and held in the recess 5 with the circumferential side surface 3b of the RFID 3 being close to the circumferential wall surface 5b of the recess 5.

[0040] FIG. 16 shows a second accommodation structure example in which the RFID 3 is accommodated and held in the recess 5. In FIG. 15, the RFID 3 is close to the circumferential wall surface 5b of the recess 5 and there is almost no gap between the circumferential side surface 3b of the RFID 3 and the circumferential wall surface 5b of the recess 5. However, in FIG. 16, there is a gap between the circumferential side surface 3b of the RFID 3 and the circumferential wall surface 5b of the recess 5. This gap is filled with a filling material 71. Examples of the filling material 71 include caulking materials and adhesives. When there is such a gap, the planar shape of the recess 5 is larger in area than the planar shape of the RFID 3. Therefore, the operation of accommodating the RFID 3 in the recess 5 becomes easy. On the other hand, if there is a gap between the circumferential wall surface 5b of the recess 5 and the RFID 3, there is a risk that the RFID 3 may be partially peeled off from the bottom surface 5a of the recess 5 when the floor material 1 with RFID is stored or transported. By putting the filling material 71 into the gap and sealing it, accidental peeling of the RFID 3 can be prevented.

[0041] FIG. 17 shows a third accommodation structure example in which the RFID 3 is accommodated and held in the recess 5. In FIG. 17, a spacer 72 is inserted into the gap between the circumferential side surface 3b of the RFID 3 and the circumferential wall surface 5b of the recess 5. The spacer 72 is fixed to the circumferential wall surface 5b and / or the bottom surface of the recess 5, for example, via an adhesive or the like. For example, the spacer 72 is fixed to the circumferential wall surface 5b of the recess 5 via an adhesive. The planar shape of the spacer 72 is a frame shape surrounding the circumferential side surface 3b of the RFID 3. Also, the height of the spacer 72 is approximately equal to the depth of the recess 5. The spacer 72 is preferably formed of a material having excellent compressive strength, for example, a hard synthetic resin, ceramic, rubber, or the like. By putting the spacer 72 into the gap, accidental peeling of the RFID 3 can be prevented. Also, when the spacer 72 is formed of a material having excellent compressive strength, it is possible to prevent the RFID 3 from being damaged by stepping pressure.

[0042] FIG. 18 shows a fourth example of the housing structure in which the RFID 3 is housed and held in the recess 5. In FIG. 18, a frame-shaped spacer 72 is inserted into the gap between the peripheral side surface 3b of the RFID 3 and the peripheral wall surface 5b of the recess 5, and a protective plate 73 is interposed between the RFID 3 and the bottom surface 5a of the recess 5. The RFID 3 is attached to the protective plate 73 via an adhesive layer 62. The spacer 72 and the protective plate 73 may be separate bodies, or may be integrally formed as shown in the figure. The spacer 72 and the protective plate 73 are preferably formed of a material having excellent compressive strength, for example, a hard synthetic resin, ceramic, rubber, or the like. By interposing a protective plate 73 made of a material having excellent compressive strength between the RFID 3 and the bottom surface 5a of the recess 5, it is possible to effectively prevent the RFID 3 from being damaged by stepping pressure in cooperation with the spacer 72.

[0043] FIG. 19 shows a fifth example of the housing structure in which the RFID 3 is housed and held in the recess 5. Referring to FIG. 19, the back surface of the RFID 3 is located above the back surface 2a of the floor material 2 (the surface side of the floor material 2), and the RFID 3 is housed and held in the recess 5. In the illustrated example, an adhesive is used as the holding portion 6, and the RFID 3 is adhered to the bottom surface 5a of the recess 5 via an adhesive layer 62. In order to fill the gap between the back surface of the RFID 3 and the back surface 2a of the floor material 2, a covering member 74 is provided. By providing the covering member 74, the back surface side of the RFID 3 is not exposed, and the RFID 3 can be protected. Examples of the covering member 74 include the filling material 71 as described above and a plate-like member such as the protective plate 73. In the illustrated example, the filling material 71 is used as the covering member 74, and the filling material is filled between the back surface of the RFID 3 and the peripheral side surface 3b of the RFID 3 and the peripheral wall surface 5b of the recess 5. This covering member 74 is preferably colorless and transparent or has a color different from the color of the back surface 2a of the floor material 2. When the covering member 74 is colorless and transparent, the position where the RFID 3 is located can be directly visually recognized when viewed from the back side of the RFID-equipped floor material 1. Alternatively, when the covering member 74 has a different color, the covering member 74 can be visually identified when viewed from the back side of the RFID-equipped floor material 1, and the position where the RFID 3 is located can be recognized.

[0044] FIG. 20 shows a sixth example of the housing structure in which the RFID 3 is housed and held in the recess 5. In FIG. 20, the peripheral wall surface 5b of the recess 5 is formed in a tapered shape (inclined surface shape). By forming the peripheral wall surface 5b of the recess 5 in a tapered shape that inclines outward as it goes toward the back side, the operation of housing the RFID 3 in the recess 5 becomes easier. In this case, since a relatively large gap is generated between the peripheral side surface 3b of the RFID 3 and the peripheral wall surface 5b of the recess 5, it is preferable to insert the above-described filling material 71 and / or the spacer 72 into the gap.

[0045] The floor material 2 of the present invention has an upper resin layer and a lower resin layer 21. Generally, floor materials can be roughly classified into resin floor materials, wooden floor materials, and ceramic floor materials. However, since resin materials have better radio wave transmission than wood and ceramics, a resin floor material (a floor material having an upper resin layer and a lower resin layer) like the present invention is preferable because it is less likely to interfere with RFID communication. On the other hand, depending on the type of resin material, for example, a vinyl chloride-based resin containing a plasticizer is a softer material than wood and ceramics. Therefore, if a recess is formed on the back surface of the lower resin layer using this material, there is a possibility of surface depression. The surface depression means that after the floor material is laid, the surface position corresponding to the recess sinks slightly, and the recess is visually recognized from the surface of the floor material. By making the upper resin layer have higher strength than the lower resin layer 21 as described above, the surface appearance can be effectively prevented. Further, by interposing a reinforcing layer 22 containing glass fibers between the upper resin layer and the lower resin layer 21 or inside the lower resin layer 21, the surface appearance can be more effectively prevented. Also, interposing a resin layer 21 which is a part of the lower resin layer 21 between the bottom surface of the recessed portion 5 and the reinforcing layer 22, and forming the inner corner portion 5c of the recessed portion 5 in an arc shape also contribute to preventing the surface appearance.

[0046] [Use of Floor Material with RFID] The floor material 1 with RFID of the present invention is used by being laid on various floor bases. By laying the floor material 1 with RFID on the floor base, a laying structure of the floor material 1 with RFID can be constructed. The floor base is not particularly limited, and examples include metals such as wood, mortar (including concrete), synthetic resin, and iron plates. Since it does not interfere with the communication of the RFID 3, it is preferable to lay the floor material 1 with RFID on a non-metallic floor base such as wood, mortar, or synthetic resin. The floor material 1 with RFID is laid with its back surface in contact with the floor base. The floor material 1 with RFID may just be placed on the floor base, but usually, it is attached to the floor base by an attachment portion (the attachment portion is a means for attaching the floor material 1 with RFID to the floor base by interposing between the back surface 2a of the floor material 2 including the back surface of the RFID 3 and the floor base) so as not to be accidentally displaced. Examples of the attachment portion include an adhesive, an adhesive agent, an adhesive tape (double-sided adhesive tape), etc. By using an adhesive, an adhesive agent, an adhesive tape, etc., the back surface of the flooring material 1 with RFID can be easily adhesively fixed to the floor substrate. From the viewpoint of adhesive strength, it is preferable that the attachment portion is stronger than the above-described holding portion 6 (means for holding the RFID 3 in the recess 5 by intervening between the RFID 3 and the bottom surface 5a of the recess 5). That the adhesive strength of the attachment portion is stronger than that of the holding portion 6 means, for example, providing the attachment portion only on the back surface of the RFID 3 adhered to the recess 5 via the holding portion 6, and when the flooring material 2 is peeled off in that state, it means peeling between the recess 5 and the RFID 3. With such an attachment portion, when the flooring material 1 with RFID is peeled off from the floor substrate, the RFID 3 remains on the floor substrate. Therefore, the trouble of separating the RFID 3 and the flooring material 2 can be saved, and since there is no risk of forgetting to separate the two, recycling becomes easier. In addition, as the attachment portion having an adhesive strength stronger than that of the holding portion 6, an adhesive agent having a large adhesive force may be selected in consideration of the material of the floor substrate and the adhesive tape used as the holding portion 6.

[0047] Since the floor material 1 with RFID of the present invention allows visual recognition of the position of the RFID 3 from the back side, construction mistakes can be prevented. Further, in the floor material 1 with RFID of the present invention, the RFID 3 is provided in the recessed portion 5 opened on the back surface. When the recessed portion 5 is open on the back surface, the RFID 3 can be easily accommodated in the recessed portion 5. For this reason, for example, a floor material 2 having the recessed portion 5 formed therein can be prepared, and the RFID 3 corresponding to the laying location can be accommodated in the floor material 2 to produce the floor material 1 with RFID. Thus, according to the floor material 1 with RFID of the present invention, production suitable for the laying location can be carried out immediately after receiving an order. For this reason, it is not necessary to prepare in advance the floor material 1 with RFID having each of various types of RFID 3 as in the prior art. According to the present invention, the number of items and the inventory are reduced, and as a result, a floor material 1 with RFID applicable to various laying locations and having a low product unit price can be provided. In particular, when the recessed portion 5 is formed by a method of scraping off the lower resin layer 21 of the floor material 2, the recessed portion 5 is formed at an appropriate position in the floor material 2 stored as inventory according to the order (laying location), and the RFID 3 is accommodated and held in the recessed portion 5, thereby providing a floor material 1 with RFID that is cheaper and applicable to various laying locations. Such an effect is brought about by a novel idea of accommodating and holding the RFID 3 in the recessed portion 5 opened on the back surface. In another aspect of the present invention, a method for providing a floor material 1 with RFID according to a laying location is provided. That is, as described above, a step of manufacturing and storing several types of floor materials 2 (resin floor materials or tile carpets), a step of forming a recessed portion 5 in the lower resin layer 21 of the floor material 2 according to the construction location, and a step of accommodating and holding the RFID 3 in the recessed portion 5 via a holding portion 6, whereby the floor material 1 with RFID according to various construction locations can be easily produced. In this method, several types of RFID 3 having different communication distances and the like may be stored in advance, or the RFID 3 corresponding to the laying location may be obtained from an RFID manufacturer at the time of receiving an order.

[0048] In addition, the floor material 1 with RFID of the present invention may be either a resin floor material or a tile carpet. However, when a resin floor material is used, it has the following advantages. Since the pile layer constitutes the surface of the tile carpet, there is no problem even if there are some irregularities (concavities and convexities) on the surface. On the other hand, since the resin layer constitutes the surface of the resin floor material, for example, as in Patent Document 1, when the RFID 3 is interposed inside the resin layer, the surface of the floor material 2 slightly swells according to the thickness of the RFID 3. This swelling is hardly noticeable visually, but there is a problem that dirt easily adheres to and stays around the swelling while walking on the floor material 2 after it is laid. In this regard, as in the present invention, by accommodating the RFID 3 in the recess 5, no swelling caused by the RFID 3 occurs on the surface of the resin floor material, and it becomes difficult for dirt to adhere and stay. Further, since no swelling caused by the RFID 3 occurs on the surface of the resin floor material, even if dirt adheres, it is easy to clean.

[0049] Regarding a floor material having a recess formed on the back surface and open so that the RFID does not protrude from the back surface, the laying structure of the floor material with RFID can also be constructed by the following procedure. That is, after preparing a floor material having a recess that is open on the back surface (of the floor material) and is formed in a shape such that the RFID does not protrude from the back surface, and a floor material having no such recess (ordinary floor material), they are laid on the floor base of the construction site. When laying the floor material having the recess, while accommodating the RFID at the construction site in the recess of the floor material appropriately selected according to the construction site, the floor material is attached to the floor base by the attachment portion. Also, the floor material having no recess appropriately selected according to the construction site is similarly attached to the floor base by the attachment portion. The laying structure of the floor material with RFID may be constructed by such a laying method.

Explanation of Reference Numerals

[0050] 1 Floor material with RFID 2 Floor material 2a Back surface of the floor material 2A Resin floor material 2B Tile Carpet 21 Lower Resin Layer 22 Reinforcement Layer 25 Surface Protection Layer (Upper Resin Layer) 3 RFID 5 Concave Portion 61 Adhesive Tape

Claims

1. A floor material having an upper resin layer, a lower resin layer disposed on the back side of the upper resin layer, and a reinforcing layer containing glass fibers interposed between the upper resin layer and the lower resin layer or inside the lower resin layer, and an RFID provided on the floor material. The upper resin layer is a resin layer that is not a synthetic fiber layer and forms the surface of the floor material. A recess is formed on the back surface of the floor material. The recess is formed on the back side of the reinforcing layer, and a part of the lower resin layer is interposed in a layered form between the bottom surface of the recess and the reinforcing layer. The RFID is housed and held in the recess so as not to protrude from the back surface of the floor material. A floor material with an RFID.

2. The floor material with an RFID according to claim 1, wherein the upper resin layer is a non-foamed resin layer that is not a synthetic fiber layer.

3. The floor material with an RFID according to claim 1 or 2, wherein the upper resin layer has higher strength than the lower resin layer.

4. The floor material with an RFID according to any one of claims 1 to 3, wherein the thickness of the layered lower resin layer between the bottom surface of the recess and the reinforcing layer is 0.3 mm or more.

5. A laying structure of a floor material with an RFID, wherein the floor material with an RFID according to any one of claims 1 to 4 is mounted on the floor under the floor by a mounting portion.

6. A floor material used for the floor material with an RFID according to any one of claims 1 to 4, having a recess formed on the back surface and formed so that the RFID does not protrude from the back surface thereof.

Images