Sclerotic composition

Abstract

The present application provides a curable composition capable of forming a thick film having excellent curing properties even at a relatively low temperature, having fast curing properties, and being able to ensure not only a desired level of appropriate adhesive strength but also an excellent level of thermal conductivity, a battery pack to which the curable composition is applied, and a device including the battery pack.

Description

Technical Field

[0001] Cross-reference to Related Applications This application claims the benefit of priority based on Korean Patent Application No. 10-2021-0133570 filed on October 8, 2021, and all the contents disclosed in the document of the Korean patent application are included as part of this specification.

[0002] Technical Field This application relates to a curable composition, a battery pack including a cured product of the curable composition, and their applications.

Background Art

[0003] As the treatment of heat generated in batteries such as electrical products, electronic products, or secondary batteries has become an important issue, various heat dissipation measures have been proposed. Among the heat conductive materials used for heat dissipation measures, a resin composition in which a heat conductive filler is blended with a resin is known.

[0004] While dissipating the heat released from the heat generating body, the resin composition can be used to thermally contact the heat generating body and the cooling part to fix the heat generating body. Patent Document 1 (Korean Patent Publication No. 10-2016-0105354) discloses a battery module to which the resin composition is applied.

[0005] Among known resins, silicone resin is a typical resin with excellent heat resistance, and the silicone resin is frequently used as the heat dissipation measure. However, the silicone resin has a problem in that its application is limited because of its poor adhesive force.

[0006] In order to ensure the adhesive force, a heat conductive resin composition to which polyurethane is applied is also known. However, polyurethane has a problem in that its thermal conductivity is low.

[0007] In order to ensure excellent thermal conductivity and excellent adhesion, a thermally conductive resin composition to which an acrylic resin is applied is known. However, when attempting to cure the thermally conductive resin composition to which an acrylic resin is applied by a thermosetting method for rapid curing after injecting it into a battery module, it is necessary to maintain a high temperature of about 100 °C or higher. In this case, thermal damage to the components constituting the battery module may occur.

Prior Art Documents

Patent Documents

[0008]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0009] The present application is an improvement over the conventional problems, and an object thereof is to provide a curable composition capable of rapid curing at a relatively low temperature compared to the conventional case. Another object of the present application is to provide a curable composition that has an excellent heat dissipation effect, has appropriate adhesion performance, and can form a cured product having excellent hardness. Another object of the present application is to provide a battery pack to which the curable composition is applied and an apparatus including the battery pack.

Means for Solving the Problems

[0010] Among the physical properties mentioned in the present application, when the measurement temperature affects the physical properties, unless otherwise specified, the physical properties are the physical properties measured at room temperature. The room temperature, which is a term used in the present application, is the natural temperature without heating or cooling. For example, it can mean any one temperature within the range of 10 °C to 30 °C, for example, about 15 °C or higher, about 18 °C or higher, about 20 °C or higher, about 23 °C or higher, about 27 °C or lower, or a temperature of 25 °C. Unless otherwise specified in the present application, the unit of temperature is degrees Celsius (°C).

[0011] Among the physical properties mentioned in this application, when the measurement pressure affects the physical properties, unless otherwise specified, the physical properties are the physical properties measured at normal pressure. The term "normal pressure" used in this application is the natural pressure without pressurization and depressurization, and the atmospheric pressure usually within the range of about 700 mmHg to 800 mmHg is generally referred to as normal pressure.

[0012] The term "a to b" used in this application includes a and b and means within the range between a and b. For example, "containing a to b parts by weight" means the same as "containing within the range of a to b parts by weight".

[0013] Among the physical properties mentioned in this application, when the measurement humidity affects the physical properties, unless otherwise specified, the physical properties are the physical properties measured in an environment with a relative humidity of about 30 to 70%.

[0014] The term "relative humidity" used in this application is the ratio of the amount of water vapor contained in the current air per unit volume to the saturated water vapor pressure that the air per unit volume can contain at most, expressed as a percentage (%), and can be denoted as RH%.

[0015] The term "weight-average molecular weight (M w )" used in this application can be measured using GPC (Gel permeation chromatography), specifically, it can be measured by the following physical property measurement method. Also, the term "polydispersity index (PDI)" used in this application is the value obtained by dividing the weight-average molecular weight (M w ) by the number-average molecular weight (M n ) (M w / M n ), which means the molecular weight distribution of the polymer. The above-mentioned number-average molecular weight (M n ) can also be measured using GPC (Gel permeation chromatography) as needed.

[0016] As used in this application, the term "excellent thermal conductivity" means that when the curable composition is in a state of being made into a cured product (sample) with a diameter of 2 cm or more and a thickness of 2 mm, and measured along the thickness direction of the sample according to ASTM D5470 standard or ISO22007-2 standard, the measured thermal conductivity is about 2.0 W / mK or more, 2.1 W / mK or more, 2.2 W / mK or more, 2.3 W / mK or more, 2.4 W / mK or more, 2.5 W / mK or more, 2.6 W / mK or more, 2.7 W / mK or more, 2.8 W / mK or more, 2.9 W / mK or more, or about 3.0 W / mK or more.

[0017] As used in this application, the term "substantially free of a specific substance" means that the specific substance is not intentionally included. However, when the specific substance is naturally contained, unless otherwise specified, it can be said to be substantially free of it when it is contained at 1% by weight or less, 0.5% by weight or less, 0.1% by weight or less, 0.05% by weight or less, or 0.01% by weight or less based on the total weight.

[0018] As used in this application, the term "viscosity" may be a value measured at 25°C and 60 rpm, and specifically, it can be measured by the following viscosity measurement method. [Viscosity Measurement Method] The viscosity of the curable composition can be measured using a viscometer (manufacturer: Brookfield, model name: Brookfield LV) and spindle 63 or 64 (selected according to the viscosity measurement range). After adjusting the zero point of the viscometer, spindle 63 or 64 was attached to the spindle connection part of the viscometer. A plate was attached to the plate connection part of the viscometer, and the adjustment lever was used to adjust so that a certain separation space (gap) was generated between the spindle and the plate. The plate was separated, and about 0.5 mL of the curable composition was applied to the center of the separated plate. The plate coated with the curable composition was further attached to the plate connection part of the viscometer, and after waiting until the torque value became 0, the viscosity was measured at a rotation speed of about 25 °C and 60 rpm.

[0019] In the present application, the term substitution used means that a hydrogen atom bonded to a carbon atom of a compound is replaced by another substituent, and the position to be substituted is not particularly limited as long as it is the position where the hydrogen atom is substituted, that is, the position where the substituent can be substituted. When two or more substitutions are made, the substituents may be the same or different from each other.

[0020] In the present application, the term substituent used means an atom or atomic group that replaces one or more hydrogen atoms on the parent chain of a hydrocarbon. In addition, the substituents are described below, but are not limited thereto. The substituents may be further substituted with the substituents described below unless otherwise specified in the present application, or may not be substituted with any substituents.

[0021] The term "alkyl group" or "alkylene group" used in this application, unless otherwise specified, may be a straight-chain or branched-chain alkyl group or alkylene group having 1 to 20 carbon atoms, or 1 to 16 carbon atoms, or 1 to 12 carbon atoms, or 1 to 8 carbon atoms, or 1 to 6 carbon atoms, or may be a cyclic alkyl group or alkylene group having 3 to 20 carbon atoms, or 3 to 16 carbon atoms, or 3 to 12 carbon atoms, or 3 to 8 carbon atoms, or 3 to 6 carbon atoms. Here, the cyclic alkyl group or alkylene group includes both an alkyl group or alkylene group consisting only of a ring structure and an alkyl group or alkylene group containing a ring structure. For example, both the cyclohexyl group and the methylcyclohexyl group correspond to cyclic alkyl groups. Also, for example, the alkyl group or alkylene group specifically includes methyl(ene), ethyl(ene), n-propyl(ene), isopropyl(ene), n-butyl(ene), isobutyl(ene), tert-butyl(ene), sec-butyl(ene), 1-methyl-butyl(ene), 1-ethyl-butyl(ene), n-pentyl(ene), isopentyl(ene), neopentyl(ene), tert-pentyl(ene), n-hexyl(ene), 1-methylpentyl(ene), 2-methylpentyl(ene), 4-methyl-2-pentyl(ene), 3,3-dimethylbutyl(ene), 2-ethylbutyl(ene), n-heptyl(ene), 1-methylhexyl(ene), n-octyl(ene), tert-octyl(ene), 1-methylheptyl(ene), 2-ethylhexyl(ene), 2-propylpentyl(ene), n-nonyl(ene), 2,2-dimethylheptyl(ene), 1-ethylpropyl(ene), 1,1-dimethylpropyl(ene), isohexyl(ene), 2-methylpentyl(ene), 4-methylhexyl(ene), 5-methylhexyl(ene), etc., but is not limited thereto.In addition, specific examples of the cycloalkyl group or cycloalkylene group include, but are not limited to, cyclopropyl(ene), cyclobutyl(ene), cyclopentyl(ene), 3-methylcyclopentyl(ene), 2,3-dimethylcyclopentyl(ene), cyclohexyl(ene), 3-methylcyclohexyl(ene), 4-methylcyclohexyl(ene), 2,3-dimethylcyclohexyl(ene), 3,4,5-trimethylcyclohexyl(ene), 4-tert-butylcyclohexyl(ene), cycloheptyl(ene), cyclooctyl(ene), etc.

[0022] As used in this application, the alkenyl group or alkenylene group, unless otherwise specified, is a linear or branched acyclic alkenyl group or alkenylene group having 2 to 20 carbon atoms, or 2 to 16 carbon atoms, or 2 to 12 carbon atoms, or 2 to 8 carbon atoms, or 2 to 6 carbon atoms; it may also be a cyclic alkenyl group or alkenylene group having 3 to 20 carbon atoms, or 3 to 16 carbon atoms, or 3 to 12 carbon atoms, or 3 to 8 carbon atoms, or 3 to 6 carbon atoms. Here, when including an alkenyl group or alkenylene group in a ring structure, it corresponds to a cyclic alkenyl group or alkenylene group. Also, for example, ethenyl(ene), n-propenyl(ene), isopropenyl(ene), n-butenyl(ene), isobutenyl(ene), tert-butenyl(ene), sec-butenyl(ene), 1-methyl-butenyl(ene), 1-ethyl-butenyl(ene), n-pentenyl(ene), isopentenyl(ene), neopentyl(ene), tert-pentenyl(ene), n-hexenyl(ene), 1-methylpentenyl(ene), 2-methylpentenyl(ene), 4-methyl-2-pentenyl(ene), 3,3-dimethylbutenyl(ene), 2-ethylbutenyl(ene), n-heptenyl(ene), 1-methylhexenyl(ene), n-octenyl(ene), tert-octenyl(ene), 1-methylheptenyl(ene), 2-ethylhexenyl(ene), 2-propylpentenyl(ene), n-nonenyl(ene), 2,2-dimethylheptenyl(ene), 1-ethylpropenyl(ene), 1,1-dimethylpropenyl(ene), isohexenyl(ene), 2-methylpentenyl(ene), 4-methylhexenyl(ene), 5-methylhexenyl(ene), etc. can be exemplified, but are not limited thereto.In addition, specific examples of the cycloalkenyl group or cycloalkenylene group include, but are not limited to, cyclopropenyl(ene), cyclobutenyl(ene), cyclopentenyl(ene), 3-methylcyclopentenyl(ene), 2,3-dimethylcyclopentenyl(ene), cyclohexenyl(ene), 3-methylcyclohexenyl(ene), 4-methylcyclohexenyl(ene), 2,3-dimethylcyclohexenyl(ene), 3,4,5-trimethylcyclohexenyl(ene), 4-tert-butylcyclohexenyl(ene), cycloheptenyl(ene), cyclooctenyl(ene), and the like.

[0023] The term alkynyl group or alkynylene group used in this application, unless otherwise specified, may be a linear or branched acyclic alkynyl group or alkynylene group having 2 to 20 carbon atoms, or 2 to 16 carbon atoms, or 2 to 12 carbon atoms, or 2 to 8 carbon atoms, or 2 to 6 carbon atoms, or may be a cyclic alkynyl group or alkynylene group having 3 to 20 carbon atoms, or 3 to 16 carbon atoms, or 3 to 12 carbon atoms, or 3 to 8 carbon atoms, or 3 to 6 carbon atoms. Here, when an alkynyl group or alkynylene group containing a ring structure is included, it corresponds to a cyclic alkynyl group or alkynylene group. Further, for example, ethynyl(ene), n-propynyl(ene), isopropynyl(ene), n-butynyl(ene), isobutynyl(ene), tert-butynyl(ene), sec-butynyl(ene), 1-methyl-butynyl(ene), 1-ethyl-butynyl(ene), n-pentynyl(ene), isopentynyl(ene), neopentynyl(ene), tert-pentynyl(ene), n-hexynyl(ene), 1-methylpentynyl(ene), 2-methylpentynyl(ene), 4-methyl-2-pentynyl(ene), 3,3-dimethylbutynyl(ene), 2-ethylbutynyl(ene), n-heptynyl(ene), 1-methylhexynyl(ene), n-octynyl(ene), tert-octynyl(ene), 1-methylheptynyl(ene), 2-ethylhexynyl(ene), 2-propylpentynyl(ene), n-nonynyl(ene), 2,2-dimethylheptynyl(ene), 1-ethylpropynyl(ene), 1,1-dimethylpropynyl(ene), isohexynyl(ene), 2-methylpentynyl(ene), 4-methylhexynyl(ene), 5-methylhexynyl(ene), etc. can be exemplified, but are not limited thereto.Also, the cycloalkynyl group or cycloalkynylene group specifically includes, but is not limited to, cyclopropynyl(ene), cyclobutynyl(ene), cyclopentynyl(ene), 3-methylcyclopentynyl(ene), 2,3-dimethylcyclopentynyl(ene), cyclohexynyl(ene), 3-methylcyclohexynyl(ene), 4-methylcyclohexynyl(ene), 2,3-dimethylcyclohexynyl(ene), 3,4,5-trimethylcyclohexynyl(ene), 4-tert-butylcyclohexynyl(ene), cycloheptynyl(ene), cyclooctynyl(ene), etc.

[0024] The alkyl group, alkylene group, alkenyl group, alkenylene group, alkynyl group or alkynylene group may optionally be substituted by one or more substituents. In this case, the substituents may be one or more selected from the group consisting of halogen (chlorine (Cl), iodine (I), bromine (Br), fluorine (F)), aryl group, heteroaryl group, epoxy group, alkoxy group, cyano group, carboxyl group, acryloyl group, methacryloyl group, acryloyloxy group, methacryloyloxy group, carbonyl group and hydroxy group, but are not limited thereto.

[0025] The term "aryl group" used in this application means an aromatic ring from which one hydrogen has been removed from an aromatic hydrocarbon ring, and the aromatic hydrocarbon ring may include a monocyclic or polycyclic ring. The aryl group is not particularly limited in terms of the number of carbon atoms, but unless otherwise stated, it may be an aryl group having 6 to 30 carbon atoms, or 6 to 26 carbon atoms, or 6 to 22 carbon atoms, or 6 to 20 carbon atoms, or 6 to 18 carbon atoms, or 6 to 15 carbon atoms. Further, the term "arylene group" used in this application means a group having two bonding positions to an aryl group, that is, a divalent group. Except that these are each divalent groups, the descriptions of the above-mentioned aryl groups can be applied. Examples of the aryl group include, but are not limited to, a phenyl group, a phenylethyl group, a phenylpropyl group, a benzyl group, a tolyl group, a xylyl group or a naphthyl group, etc.

[0026] The term "heteroaryl group" as used in this application refers to an aromatic ring containing one or more heteroatoms that are not carbon. Specifically, the heteroatoms may include one or more atoms selected from the group consisting of nitrogen (N), oxygen (O), sulfur (S), selenium (Se), and tellurium (Te). In this case, the atoms constituting the ring structure of the heteroaryl group can be referred to as ring atoms. Also, the heteroaryl group may include a monocyclic or polycyclic ring. The heteroaryl group is not particularly limited in terms of the number of carbon atoms, but unless otherwise stated, it may be a heteroaryl group having 2 to 30 carbon atoms, or 2 to 26 carbon atoms, or 2 to 22 carbon atoms, or 2 to 20 carbon atoms, or 2 to 18 carbon atoms, or 2 to 15 carbon atoms. In other examples, the heteroaryl group is not particularly limited in terms of the number of ring atoms, but it may be a heteroaryl group having 5 to 30 ring atoms, 5 to 25 ring atoms, 5 to 20 ring atoms, 5 to 15 ring atoms, 5 to 10 ring atoms, or 5 to 8 ring atoms. Examples of the heteroaryl group include, but are not limited to, thiophene group, furan group, pyrrole group, imidazolyl group, thiazolyl group, oxazolyl group, oxadiazolyl group, triazolyl group, pyridyl group, bipyridyl group, pyrimidyl group, triazinyl group, acridyl group, pyridazinyl group, pyrazinyl group, quinolinyl group, quinazolinyl group, quinoxalinyl group, phthalazinyl group, pyridopyrimidinyl group, pyridopyrazinyl group, pyrazinopyrazinyl group, isoquinolinyl group, indole group, carbazolyl group, benzoxazolyl group, benzimidazolyl group, benzothiazolyl group, benzocarbazolyl group, dibenzocarbazolyl group, benzothiophene group, dibenzothiophene group, benzofuran group, dibenzofuran group, benzosilol group, dibenzosilol group, phenanthrolinyl group, isoxazolyl group, thiadiazolyl group, phenothiazinyl group, phenoxazinyl group, and their condensed structures, etc.

[0027] Also, the term "heteroarylene group" as used in this application refers to a group having two bonding positions on the heteroaryl group, that is, a divalent group. Except that they are divalent groups respectively, the descriptions of the above-mentioned heteroaryl groups can be applied to these.

[0028] The aryl group or heteroaryl group may optionally be substituted with one or more substituents. In this case, the substituents may be one or more selected from the group consisting of halogen (chlorine (Cl), iodine (I), bromine (Br), fluorine (F)), aryl group, heteroaryl group, epoxy group, alkoxy group, cyano group, carboxyl group, acryloyl group, methacryloyl group, acryloyloxy group, methacryloyloxy group, carbonyl group and hydroxy group, but are not limited thereto.

[0029] The term (meth)acrylate used in the present application can be a general term for acrylate and methacrylate. Further, acrylate can be a general term for compounds containing an acryl group, and methacrylate can be a general term for compounds containing a methacryl group.

[0030] The present application relates to a curable composition. The term curable composition used in the present application means a composition that cures by a curing reaction. Whether the curing is appropriately completed by the curing reaction in the present application can be confirmed by FT-IR (Fourier Transform Infrared), DSC (Differential Thermal Analysis) and DMA (Dynamic Mechanical Analysis) measurements. For example, when an acrylic resin is contained in the curable composition, it can be confirmed from the fact that the conversion of the carbon-carbon double bond (C=C) peak near 1640 cm -1 is 80% or more based on the FT-IR analysis. In the present application, curing means not only attempting to carry out the curing reaction, but also having the same meaning as appropriately completing the curing as described above.

[0031] The curable composition according to an example of the present application may be a resin composition. The term "resin composition" used in the present application means a composition containing components known as resins in the art or a composition containing components that do not contain resins but can form resins by a curing reaction or the like. Therefore, in the present application, the scope of the term "resin" or "resin component" includes not only components generally known as resins but also components that can form resins through curing and / or polymerization reactions. Further, the resin component may mean including a polymer component described later, or simultaneously including a polymer component and a monomer component. Further, the resin component may mean including a partial polymer partially polymerized as a monomer component, and in other examples, may mean further including the partial polymer and a further monomer component for dilution.

[0032] The curable composition according to an example of the present application may be a one-component type or two-component type composition. The term "one-component type composition" used in the present application means a curable composition in which the components participating in curing are contained in a state where they are physically in contact with each other. Further, the term "two-component type composition" used in the present application may mean a curable composition in which at least a part of the components participating in curing are physically separated and contained separately. Considering the ease of management, the curable composition is more preferably a one-component type composition.

[0033] The curable composition according to an example of the present application may be a room temperature curable type, heat curable type, energy ray curable type, and / or moisture curable type. The term "room temperature curable type" used in the present application refers to a curable composition in which the curing reaction can be started and / or proceed at room temperature. Further, the term "heat curable type" used in the present application refers to a curable composition in which the curing reaction can be started and / or proceed by the addition of heat. Further, the term "energy ray curable type" used in the present application refers to a curable composition in which the curing reaction can be started and / or proceed by irradiation with energy rays (for example, ultraviolet rays, electron beams, etc.). Further, the term "moisture curable type" used in the present application refers to a curable composition in which the curing reaction can be started and / or proceed in the presence of moisture.

[0034] The curable composition according to an example of the present application may be a composite type of energy ray curable type and heat curable type in order to prevent heat damage while ensuring fast curing characteristics.

[0035] The curable composition according to an example of the present application can be secondarily cured by heating after being primarily cured by energy rays. Further, the curable composition can be primarily cured by heating and then secondarily cured by energy rays.

[0036] The curable composition according to an example of the present application may have a relatively low curing temperature when cured by heating (i.e., heat curing). The relatively low curing temperature, which is a term used in the present application, may mean that when a heat initiator is included, the curing temperature is less than about 60°C, 59°C or lower, 58°C or lower, 57°C or lower, 56°C or lower, 55°C or lower, 54°C or lower, 53°C or lower, 52°C or lower, 51°C or lower, or 50°C or lower. The lower limit of the curing temperature is not particularly limited, but considering ensuring fast curing characteristics, it may be about 10°C or higher, 15°C or higher, 20°C or higher, 25°C or higher, 30°C or higher, 35°C or higher, 40°C or higher, or 45°C or higher. The curable composition according to an example of the present application can ensure fast curing characteristics at a curing temperature at a level where heat damage can be prevented through an appropriate combination of a resin component and an initiator.

[0037] In other examples, the relatively low curing temperature is 90% or less, 89% or less, 88% or less, 87% or less, 86% or less, 85% or less, 84% or less, 83% or less, 82% or less, 81% or less, 80% or less, 79% or less, 78% or less, 77% or less, 76% or less, 75% or less, or 74% or less with respect to the 10-hour half-life temperature of the thermal initiator, or the lower limit is not particularly limited, but is 10% or more, 15% or more, 20% or more, 25% or more, 30% or more, 35% or more, 40% or more, 45% or more, 50% or more, 55% or more, or 60% or more, or can be within a range formed by appropriately selecting the upper and lower limits. The curable composition according to an example of the present application can ensure rapid curing characteristics at a curing temperature at a level that can prevent thermal damage through an appropriate combination of a resin component and an initiator.

[0038] The curable composition according to an example of the present application may be a solvent type or a solventless type. Considering viewpoints such as application efficiency and environmental load, it is appropriate to be a solventless type. The curable composition according to an example of the present application can be cured to form a cured product, and may have at least one or more physical properties among the following physical properties. Each of the following physical properties is independent, and any one physical property does not take precedence over other physical properties, and the cured product of the curable composition can satisfy at least one or two or more of the following physical properties. The cured product of the curable composition that satisfies at least one or two or more of the following physical properties is due to the combination of each component contained in the curable composition. The curable composition can be subjected to secondary curing by heating after primary curing with an energy ray. Further, the curable composition can be subjected to primary curing by heating and then secondary curing with an energy ray. As described above, the following physical properties can appear through combined curing.

[0039] The curable composition according to an example of the present application is maintained at 50 °C for a relatively short time, and the Shore A hardness is 70 or more, 72 or more, 74 or more, 76 or more, 78 or more, 80 or more, 82 or more, 84 or more, 86 or more, 88 or more or 90 or more, 100 or less, 99 or less, 98 or less or 97 or less, or can be within a range formed by appropriately selecting the above upper and lower limits. The curable composition contains a thermal initiator and is maintained at 50 °C for 30 minutes, and the Shore A hardness is 70 or more, 72 or more, 74 or more, 76 or more, 78 or more, 80 or more, 82 or more, 84 or more, 86 or more, 88 or more or 90 or more, 100 or less, 99 or less, 98 or less or 97 or less, or can be within a range formed by appropriately selecting the above upper and lower limits.

[0040] In the above, the relatively short time is 50 minutes or less, 49 minutes or less, 48 minutes or less, 47 minutes or less, 46 minutes or less, 45 minutes or less, 44 minutes or less, 43 minutes or less, 42 minutes or less, 41 minutes or less, 40 minutes or less, 39 minutes or less, 38 minutes or less, 37 minutes or less, 36 minutes or less, 35 minutes or less, 34 minutes or less, 33 minutes or less, 32 minutes or less, 31 minutes or less or 30 minutes or less, and the lower limit is not particularly limited, but is 5 minutes or more, 6 minutes or more, 7 minutes or more, 8 minutes or more, 9 minutes or more, 10 minutes or more, 11 minutes or more, 12 minutes or more, 13 minutes or more, 14 minutes or more, 15 minutes or more, 16 minutes or more, 17 minutes or more, 18 minutes or more, 19 minutes or more, 20 minutes or more, 21 minutes or more, 22 minutes or more, 23 minutes or more, 24 minutes or more, 25 minutes or more, 26 minutes or more, 27 minutes or more, 28 minutes or more, 29 minutes or more or 30 minutes or more, or may be within a range formed by appropriately selecting the above upper and lower limits. In the above, the meaning of the relatively short time means that the time required for curing to be completed is shorter compared to the case where the combination method of the initiator described later is not adopted. The curable composition can rapidly (quick curing) ensure excellent curing characteristics even at a relatively low temperature through the combination of the initiators described later.

[0041] The thermal initiator has a 10-hour half-life temperature of 60°C or higher, 61°C or higher, 62°C or higher, 63°C or higher, 64°C or higher, or 65°C or higher. The upper limit is not particularly limited, but it may be 200°C or lower, 180°C or lower, 160°C or lower, 140°C or lower, 120°C or lower, 100°C or lower, or 80°C or lower, or it may be within a range formed by appropriately selecting the above upper and lower limits. Even if the curable composition contains a thermal initiator having the above-described 10-hour half-life temperature, excellent curing characteristics can be quickly (rapid curing) ensured even at a relatively low temperature through the combination method of the present application described below.

[0042] The term "half-life temperature" used in the present application indicates the decomposition rate of a specific substance and may mean the temperature required for 50% of the initial specific substance to decompose in a specific time. For example, the half-life temperature of the initiator may indicate the temperature required for 50% of the initiator to decompose in 10 hours (hr). In this case, the half-life temperature can be referred to as the 10-hour half-life temperature. Also, the half-life temperature of the initiator may be measured in a specific solvent, and the specific solvent may be water, acetone, benzene, or toluene, etc. In one example, the half-life temperature of the initiator may mean the temperature required for 50% of the initiator in toluene to decompose in 10 hours (hr). Also, the half-life temperature is k d =A×e -Ea / RT (k d : reaction rate constant for initiator decomposition, A: Arrhenius frequency factor, Ea: decomposition activation energy of the initiator, R: gas constant (8.3142 J / mol·K), T: absolute temperature (K)), and can be calculated by the Arrhenius equation. Specifically, the half-life temperature (t 1 / 2 ) can be calculated by t 1 / 2 =ln2 / k d . Here, the k dReference can be made to "Polymer Handbook", Eds. Brandrup, J; Immergut, E.H.; Grulke, E.A., 4th Edition, John Wiley, New York, 1999, II / 2-69.

[0043] The curable composition according to an example of the present application contains a cationic initiator without substantially containing a cationic curable component, and can form a cured product having a Shore A hardness of 70 or more, 72 or more, 74 or more, 76 or more, 78 or more, 80 or more, 82 or more, 84 or more, 86 or more, 88 or more, or 90 or more, or 100 or less, 99 or less, 98 or less, or 97 or less, or within a range formed by appropriately selecting the above upper and lower limits. The cationic curable component may have at least one or more cationic curable functional groups, and examples of the cationic curable functional groups include an epoxide group, an oxetane group, a cyclic ether group, a sulfide group, an acetal group, or a lactone group. After the primary curing of the curable composition by energy rays, the secondary curing can be performed by heating. Further, the curable composition can perform the primary curing by heating and then perform the secondary curing by energy rays. As described above, the Shore A hardness can appear through the composite curing.

[0044] The curable composition according to an example of the present application has a viscosity measured at a shear rate of 25°C and 60 rpm of 100,000 cPs or more, 110,000 cPs or more, 120,000 cPs or more, 130,000 cPs or more, 140,000 cPs or more, or 150,000 cPs or more, or 300,000 cPs or less, 290,000 cPs or less, 280,000 cPs or less, 270,000 cPs or less, 260,000 cPs or less, or 250,000 cPs or less, or may be within a range formed by appropriately selecting the above upper and lower limits. When the curable composition has a viscosity within the above range, the spread during the coating operation is reduced, the workability is improved, and the partial separation phenomenon can be reduced.

[0045] The cured product of the curable composition according to an example of the present application has an adhesive strength (or peel strength) measured at 25°C at a peel rate of 0.3 mm / min and a peel angle of 180° with respect to PET (polyethylene terephthalate) of 150 gf / 10 mm or more, 160 gf / 10 mm or more, 170 gf / 10 mm or more, 180 gf / 10 mm or more, 190 gf / 10 mm or more, or 200 gf / 10 mm or more, or 800 gf / 10 mm or less, 750 gf / 10 mm or less, 700 gf / 10 mm or less, 650 gf / 10 mm or less, 600 gf / 10 mm or less, 550 gf / 10 mm or less, 500 gf / 10 mm or less, or 450 gf / 10 mm or less, or can be within a range formed by appropriately selecting the above upper and lower limits. Specifically, the adhesive strength (or peel strength) can be measured by the following physical property measurement method. By the cured product of the curable composition having an adhesive strength within the above range, effective fixation, impact resistance, and vibration resistance of the battery cell can be ensured when applied to the battery module.

[0046] Further, the adhesive strength may be the adhesive strength with respect to any substrate or module case with which the cured product of the curable composition is in contact. If the above adhesive strength can be ensured, an appropriate adhesive strength can appear for various materials, such as the case and battery cell included in the battery module. Also, when such a range of adhesive strength is ensured, peeling due to volume change during charge and discharge of the battery cell, change in the use temperature of the battery module, or curing shrinkage, etc. can be prevented in the battery module, and excellent durability can be ensured.

[0047] The cured product of the curable composition according to an example of the present application is advantageous in exhibiting appropriate hardness. For example, if the hardness of the cured product of the curable composition is too high, the cured product can become brittle and have an adverse effect on reliability. Further, by adjusting the hardness of the curable composition, impact resistance and vibration resistance can be ensured, and the durability of the product can also be ensured. The cured product of the curable composition has, for example, a Shore A hardness of 70 or more, 72 or more, 74 or more, 76 or more, 78 or more, 80 or more, 82 or more, 84 or more, 86 or more, 88 or more, or 90 or more, or 100 or less, 99 or less, 98 or less, or 97 or less, or can be within a range formed by appropriately selecting the above upper and lower limits. The hardness of the cured product of the curable composition is generally determined by the type and content ratio of the filler component contained in the cured product. When an excessive amount of the filler component is contained, the hardness generally increases. However, the resin component contained in the cured product can also affect the hardness. Specifically, the Shore A hardness can be measured by the following physical property measurement method.

[0048] The cured product of the curable composition according to an example of the present application may have a thermal conductivity of 2 W / mK or more. The thermal conductivity may be a value measured according to ASTM D5470 standard or ISO22007-2 standard along the thickness direction of the sample in a state where the curable composition is made into a cured product (sample) with a diameter of 2 cm or more and a thickness of 2 mm. Specifically, the thermal conductivity can be measured by the following physical property measurement method. In other exemplifications, the cured product of the curable composition may have a thermal conductivity measured by the following measurement method of 2.1 W / mK or more, 2.2 W / mK or more, 2.3 W / mK or more, 2.4 W / mK or more, 2.5 W / mK or more, 2.6 W / mK or more, 2.7 W / mK or more, 2.8 W / mK or more, 2.9 W / mK or more, or 3.0 W / mK or more. Since the higher the numerical value of the thermal conductivity, the higher the thermal conductivity, the upper limit thereof is not particularly limited. For example, the thermal conductivity may be 50 W / mK or less, 45 W / mK or less, 40 W / mK or less, 35 W / mK or less, 30 W / mK or less, 25 W / mK or less, 20 W / mK or less, 18 W / mK or less, 16 W / mK or less, 14 W / mK or less, 12 W / mK or less, 10 W / mK or less, 8 W / mK or less, 6 W / mK or less, or 4 W / mK or less.

[0049] The cured product of the curable composition according to an example of the present application may have a thermal resistance of about 5 K / W or less, about 4.5 K / W or less, about 4 K / W or less, about 3.5 K / W or less, about 3 K / W or less, or about 2.8 K / W or less. When adjusting so that the thermal resistance in such a range appears, excellent cooling efficiency and heat dissipation efficiency can be ensured. The thermal resistance may be a numerical value measured according to ASTM D5470 standard or ISO22007-2 standard, and the measurement method is not particularly limited.

[0050] The cured product of the curable composition according to an example of the present application can ensure durability for application to products that require a long warranty period, such as automobiles (in the case of automobiles, about 15 years or more). Durability means that after maintaining at a low temperature of about -40°C for 30 minutes and then further raising the temperature to 80°C and maintaining for 30 minutes as one cycle, after repeating the cycle 100 times in a thermal shock test, it does not detach, peel, or crack from the module case or battery cell of the battery module.

[0051] The cured product of the curable composition according to an example of the present application may have an electrical insulation of about 3 kV / mm or more, about 5 kV / mm or more, about 7 kV / mm or more, 10 kV / mm or more, 15 kV / mm or more, or 20 kV / mm or more. The breakdown voltage is such that the higher the value, the better the insulation performance of the cured product of the curable composition, and it may be about 50 kV / mm or less, 45 kV / mm or less, 40 kV / mm or less, 35 kV / mm or less, 30 kV / mm or less, but is not particularly limited. To achieve the breakdown voltage as described above, insulating filler particles can also be applied to the curable composition. Generally, among the thermally conductive filler particles, ceramic filler particles are known as components that can ensure insulation. The electrical insulation can be measured by the breakdown voltage measured according to ASTM D149 standard. Also, when the cured product of the curable composition can ensure the electrical insulation as described above, stability can be ensured while maintaining performance for various materials, such as the case and battery cells included in the battery module.

[0052] The cured product of the curable composition according to an example of the present application may have a specific gravity of 5 or less. In other examples, the specific gravity may be 4.5 or less, 4 or less, 3.5 or less, or 3 or less. Since the lower the numerical value of the specific gravity of the cured product of the curable composition, the more advantageous it is for weight reduction of the application product, the lower limit thereof is not particularly limited. For example, the specific gravity may be about 1.5 or more, or 2 or more. In order for the cured product of the curable composition to exhibit a specific gravity in the above range, for example, when adding a thermally conductive filler, a filler that can ensure the target thermal conductivity even at a relatively low specific gravity, that is, a filler having a low specific gravity itself, or a method of applying a surface-treated filler can be used.

[0053] It is appropriate that the cured product of the curable composition according to an example of the present application contains as few volatile substances as possible. For example, the cured product of the curable composition may have a non-volatile component ratio of 90% by weight or more, 95% by weight or more, or 98% by weight or more. In the above, the ratio with the non-volatile component can be defined by the following method. That is, the non-volatile content can be defined as the portion remaining after maintaining the cured product of the curable composition at 100 ° C for about 1 hour. Therefore, the ratio can be measured based on the initial weight of the cured product of the curable composition and the ratio after maintaining at 100 ° C for about 1 hour.

[0054] The cured product of the curable composition according to an example of the present application has excellent resistance to deterioration as required, and stability that does not chemically react as much as possible is required. It is advantageous that the cured product of the curable composition according to an example of the present application has a low shrinkage rate during or after the curing process. Through this, it is possible to prevent peeling and generation of voids that may occur during the manufacturing or use process of various materials, such as cases and battery cells included in a battery module. The shrinkage rate can be appropriately adjusted within a range that can exhibit the above-described effects, and may be, for example, less than 5%, less than 3%, or about less than 1%. Since the lower the numerical value of the shrinkage rate, the more advantageous it is, the lower limit thereof is not particularly limited.

[0055] The cured product of the curable composition according to an example of the present application advantageously has a low coefficient of thermal expansion (CTE). Through this, it is possible to prevent peeling, void generation, etc. that may occur during the manufacturing or use process of various materials, such as the cases and battery cells included in battery modules. The coefficient of thermal expansion can be appropriately adjusted within a range capable of exhibiting the above-described effects, and for example, it may be less than 300 ppm / K, less than 250 ppm / K, less than 200 ppm / K, less than 150 ppm / K, or less than 100 ppm / K. Since the lower the value of the coefficient of thermal expansion, the more advantageous it is, the lower limit is not particularly limited.

[0056] The cured product of the curable composition according to an example of the present application can appropriately adjust the tensile strength, and through this, excellent impact resistance, etc. can be ensured. The tensile strength can be adjusted, for example, in the range of about 1.0 MPa or more.

[0057] The cured product of the curable composition according to an example of the present application may have a 5% weight loss temperature in thermogravimetric analysis (TGA) of 400 °C or higher, and the residue at 800 °C may be 70% by weight or higher. Due to such characteristics, the high-temperature stability can be further improved for various materials, such as the cases and battery cells included in battery modules. The residue at 800 °C may be about 75% by weight or higher, about 80% by weight or higher, about 85% by weight or higher, or about 90% by weight or higher in other examples. The residue at 800 °C may be about 99% by weight or lower in other examples. The thermogravimetric analysis (TGA) is 60 cm 3It can be measured within the range of 25°C to 800°C at a heating rate of 20°C per minute under a nitrogen (N2) atmosphere of / minute. The results of the thermogravimetric analysis (TGA) can also be achieved through the adjustment of the composition of the cured product of the curable composition. For example, the residue at 800°C depends on the type and proportion of the thermally conductive filler component contained in the cured product of the curable composition. When an excessive amount of the thermally conductive filler component is included, the residue increases. However, when the polymer and / or monomer used in the curable composition has generally higher heat resistance than other polymers and / or monomers, the residue is even higher. Thus, the polymer and / or monomer component contained in the cured product of the curable composition also affects its hardness.

[0058] The curable composition according to an example of the present application may contain a resin component. As described above, the resin component includes not only components generally known as resins but also components that can form a resin through a curing and / or polymerization reaction.

[0059] The curable composition according to an example of the present application contains a resin component in an amount of 1 part by weight or more, 1.5 parts by weight or more, 2 parts by weight or more, 2.5 parts by weight or more, 3 parts by weight or more, 3.5 parts by weight or more, 4 parts by weight or more, 4.5 parts by weight or more, 5 parts by weight or more, 5.5 parts by weight or more, 6 parts by weight or more, 6.5 parts by weight or more, 7 parts by weight or more, 7.5 parts by weight or more, or 8 parts by weight or more, or 50 parts by weight or less, 45 parts by weight or less, 40 parts by weight or less, 35 parts by weight or less, 30 parts by weight or less, 25 parts by weight or less, 20 parts by weight or less, 15 parts by weight or less, or 10 parts by weight or less, per 100 parts by weight of the filler component described below, or may be included within a range formed by appropriately selecting the above upper and lower limits. By controlling the resin component within the above range, the curable composition can form a thick film having excellent curing characteristics even at a relatively low temperature, and can ensure not only an appropriate adhesion force at the target level but also an excellent level of thermal conductivity.

[0060] In a curable composition according to an example of the present application, the resin component has a glass transition temperature of -50°C or higher, -49.5°C or higher, or -49°C or higher, or 0°C or lower, -1°C or lower, -2°C or lower, -3°C or lower, -4°C or lower, -5°C or lower, -6°C or lower, -7°C or lower, -8°C or lower, -9°C or lower, -10°C or lower, -11°C or lower, -12°C or lower, or -13°C or lower, or may be within a range formed by appropriately selecting the above upper and lower limits. When the resin component has a glass transition temperature within the above-described range, it has appropriate fluidity and is advantageous for the process, and it is possible to ensure an appropriate level of adhesion while ensuring high hardness. The glass transition temperature can be measured using a differential scanning calorimeter (DSC), specifically, it can be measured by the following physical property measurement method.

[0061] In a curable composition according to an example of the present application, the resin component may contain a polymer component. Further, the resin component may contain a monomer component. Further, the resin component may contain a polymer component and a monomer component.

[0062] In the curable composition according to an example of the present application, the polymer component contained in the resin component can contain units derived from a compound having a curable functional group. The unit derived from a specific compound, which is a term used in the present application, can be explained as a repeating unit formed by the specific compound in the polymer obtained by polymerizing the specific compound. Further, the curable functional group, which is a term used in the present application, can mean a functional group that induces a curing reaction by heat, energy rays, and / or moisture, etc. The curable functional group may include, for example, one or more functional groups selected from the group consisting of an alkenyl group, an alkynyl group, a (meth)acrylate group, a carboxyl group, an amide group, an amino group, an epoxy group, an isocyanate group, a cyano group, an acid anhydride group, a mercapto group, a silanol group, an alkoxysilane group, a hydroxy group, and an oxazoline group, and preferably, it may be selected from a (meth)acrylate group, an epoxy group, an isocyanate group, and a mercapto group, and more preferably, it may be a (meth)acrylate group. Further, the curable functional group can be classified into a polymerizable functional group and a crosslinkable functional group. Examples of the polymerizable functional group can include an alkenyl group, an alkynyl group, a (meth)acrylic group, etc., and examples of the crosslinkable functional group can include a carboxyl group and a hydroxy group, etc.

[0063] In the curable composition according to an example of the present application, the resin component is 10% by weight or more, 15% by weight or more, 20% by weight or more, 25% by weight or more, 30% by weight or more, 35% by weight or more, or 40% by weight or more, or 70% by weight or less, 65% by weight or less, 60% by weight or less, 55% by weight or less, or 50% by weight or less, based on the total weight of the resin component, of the polymer component, or may be included within a range formed by appropriately selecting the above upper and lower limits. When the resin component in the curable composition contains the polymer component within the above-mentioned range, it can have appropriate adhesion performance and ensure excellent hardness.

[0064] In a curable composition according to an example of the present application, the resin component contains only a monomer component, and the monomer component is 20% by weight or more, 25% by weight or more, 30% by weight or more, 35% by weight or more, 40% by weight or more, or 45% by weight or more based on the total weight of the resin component, or 75% by weight or less, 70% by weight or less, 65% by weight or less, 60% by weight or less, or 55% by weight or less, or may be included within a range formed by appropriately selecting the above upper and lower limits. When the resin component in the curable composition contains only the monomer component within the above-mentioned range, it has appropriate adhesion performance and can ensure excellent hardness.

[0065] In a curable composition according to an example of the present application, the resin component contains a polymer component and a monomer component, and the monomer component is 50 parts by weight or more, 55 parts by weight or more, 60 parts by weight or more, 65 parts by weight or more, 70 parts by weight or more, 75 parts by weight or more, 80 parts by weight or more, 85 parts by weight or more, 90 parts by weight or more, 95 parts by weight or more, or 100 parts by weight or more based on 100 parts by weight of the polymer component, or 500 parts by weight or less, 450 parts by weight or less, 400 parts by weight or less, 350 parts by weight or less, 300 parts by weight or less, 250 parts by weight or less, 200 parts by weight or less, or 150 parts by weight or less, or may be included within a range formed by appropriately selecting the above upper and lower limits. When the resin component in the curable composition contains the polymer component and the monomer component in combination within the above-mentioned range, it has appropriate adhesion performance and can ensure excellent hardness.

[0066] In a curable composition according to an example of the present application, the polymer component of the resin component may contain an acrylic polymer component. The acrylic polymer component, which is a term used in the present application, may mean that units derived from (meth)acrylate are contained at 55% by weight or more, 60% by weight or more, 70% by weight or more, 80% by weight or more, 90% by weight or more, or 100% by weight based on the total weight.

[0067] In the curable composition according to an example of the present application, the acrylic polymer component may include units derived from (meth)acrylate containing an alkyl group and units derived from (meth)acrylate containing a hydroxy group. By simultaneously containing the above units, the acrylic polymer component can ensure not only the adhesive strength at the target level but also excellent hardness.

[0068] In the curable composition according to an example of the present application, the acrylic polymer component contains units derived from (meth)acrylate containing an alkyl group in an amount of 40% by weight or more, 42% by weight or more, 44% by weight or more, 46% by weight or more, 48% by weight or more, 50% by weight or more, 52% by weight or more, 54% by weight or more, 56% by weight or more, 58% by weight or more, or 60% by weight or more, 95% by weight or less, 92.5% by weight or less, 90% by weight or less, or 87.5% by weight or less, based on the total weight of the acrylic polymer component, or may be included within a range formed by appropriately selecting the above upper and lower limits. When the acrylic polymer component contains units derived from (meth)acrylate containing an alkyl group within the above range, it is possible to ensure not only the hardness targeted in the present application but also excellent thermal conductivity.

[0069] In the units derived from (meth)acrylate containing an alkyl group included in the acrylic polymer component, the alkyl group may include one or more selected from the group consisting of a linear alkyl group, a branched-chain alkyl group, and a cyclic alkyl group.

[0070] The acrylic polymer component may contain units derived from (meth)acrylate containing a linear or branched alkyl group. Further, the acrylic polymer component may be 50% by weight or more, 55% by weight or more, or 60% by weight or more, or 100% by weight or less, or 95% by weight or less, based on the total weight, of the units derived from (meth)acrylate containing a linear or branched alkyl group, or may be included within a range formed by appropriately selecting the above upper and lower limits. When the acrylic polymer component contains the units derived from (meth)acrylate containing a linear or branched alkyl group within the above range, excellent thermal conductivity can be ensured as well as the desired hardness in the present application.

[0071] The acrylic polymer component may contain i) units derived from (meth)acrylate containing a linear or branched alkyl group and ii) units derived from (meth)acrylate containing a cyclic alkyl group. At this time, the acrylic polymer component may be 10 parts by weight or more, 15 parts by weight or more, 20 parts by weight or more, 25 parts by weight or more, 30 parts by weight or more, 35 parts by weight or more, or 40 parts by weight or more, or 80 parts by weight or less, 75 parts by weight or less, 70 parts by weight or less, 65 parts by weight or less, 60 parts by weight or less, 55 parts by weight or less, 50 parts by weight or less, or 45 parts by weight or less, based on 100 parts by weight of the units derived from (meth)acrylate containing a linear or branched alkyl group, of the units derived from (meth)acrylate containing a cyclic alkyl group, or may be included within a range formed by appropriately selecting the above upper and lower limits. When the acrylic polymer component appropriately combines the units derived from (meth)acrylate containing a linear or branched alkyl group and the units derived from (meth)acrylate containing a cyclic alkyl group as within the above range, excellent thermal conductivity can be ensured as well as the desired hardness in the present application.

[0072] In the curable composition according to an example of the present application, the acrylic polymer component contains 1 part by weight or more, 3 parts by weight or more, 5 parts by weight or more, 7 parts by weight or more, 9 parts by weight or more, 11 parts by weight or more, 13 parts by weight or more, 15 parts by weight or more, or 17 parts by weight or more of the unit derived from a (meth)acrylate containing a hydroxy group with respect to 100 parts by weight of the unit derived from a (meth)acrylate containing an alkyl group described above, or 100 parts by weight or less, 95 parts by weight or less, 90 parts by weight or less, 85 parts by weight or less, 80 parts by weight or less, 75 parts by weight or less, or 70 parts by weight or less, or may be included within a range formed by appropriately selecting the above upper and lower limits. By combining the unit derived from a (meth)acrylate containing a hydroxy group and the unit derived from a (meth)acrylate containing an alkyl group in the acrylic polymer component as described above within the range, it is possible to ensure wetting characteristics with respect to the adherend surface and to secure not only the target level of adhesive strength but also excellent hardness and thermal conductivity.

[0073] In the curable composition according to an example of the present application, the acrylic polymer component may contain units derived from methacrylate containing a hydroxy group. The acrylic polymer component contains units derived from methacrylate containing a hydroxy group in an amount of 1 part by weight or more, 3 parts by weight or more, 5 parts by weight or more, 7 parts by weight or more, 9 parts by weight or more, 11 parts by weight or more, 13 parts by weight or more, 15 parts by weight or more, or 17 parts by weight or more, relative to 100 parts by weight of the (meth)acrylate-derived units containing the alkyl group described above, or 100 parts by weight or less, 95 parts by weight or less, 90 parts by weight or less, 85 parts by weight or less, 80 parts by weight or less, 75 parts by weight or less, 70 parts by weight or less, 65 parts by weight or less, 60 parts by weight or less, 55 parts by weight or less, 50 parts by weight or less, 45 parts by weight or less, 40 parts by weight or less, 35 parts by weight or less, or 30 parts by weight or less, or may be included within a range formed by appropriately selecting the above upper and lower limits. By combining the units derived from methacrylate containing a hydroxy group and the (meth)acrylate-derived units containing an alkyl group in the acrylic polymer component as described within the above range, wetting characteristics with respect to the adherend surface can be ensured, and not only the adhesive strength at the desired level, but also the glass transition temperature can be controlled to ensure further excellent hardness and thermal conductivity.

[0074] In the curable composition according to an example of the present application, the acrylic polymer component may include i) a unit derived from a methacrylate containing a hydroxy group and ii) a unit derived from an acrylate containing a hydroxy group. The acrylic polymer component contains the acrylate-derived unit containing a hydroxy group in an amount of 100 parts by weight or more, 110 parts by weight or more, 120 parts by weight or more, 130 parts by weight or more, 140 parts by weight or more, 150 parts by weight or more, or 160 parts by weight or more, based on 100 parts by weight of the methacrylate-derived unit containing a hydroxy group, or 200 parts by weight or less, 190 parts by weight or less, 180 parts by weight or less, or 170 parts by weight or less, or may be included within a range formed by appropriately selecting the above upper and lower limits. By combining the methacrylate-derived unit containing a hydroxy group and the acrylate-derived unit containing a hydroxy group within the above range, wetting characteristics with respect to the adherend surface can be ensured, and not only the adhesive strength at the desired level but also more excellent hardness and thermal conductivity can be ensured.

[0075] In the curable composition according to an example of the present application, the acrylic polymer component may include a unit derived from the compound represented by the following Chemical Formula 1.

[0076]

Chemical formula

[0077] In Chemical Formula 1, R1 is hydrogen or a methyl group. Also, in Chemical Formula 1, R2 may be one selected from the group consisting of hydrogen; an alkyl group having 1 to 20 carbon atoms, 1 to 16 carbon atoms, 1 to 12 carbon atoms, or 1 to 8 carbon atoms; a functional group represented by the following Chemical Formula 2; and a functional group represented by the following Chemical Formula 3.

[0078]

Chemical formula

[0079] In Chemical Formula 2, R3 and R4 are each independently hydrogen; or an alkyl group having 1 to 20 carbon atoms, 1 to 16 carbon atoms, 1 to 12 carbon atoms, 1 to 8 carbon atoms, 1 to 4 carbon atoms, or 1 to 3 carbon atoms.

[0080]

Chem.

[0081] In Chemical Formula 3, R5 is hydrogen; or an alkyl group having 1 to 20 carbon atoms, 1 to 16 carbon atoms, 1 to 12 carbon atoms, 1 to 8 carbon atoms, 1 to 4 carbon atoms, or 1 to 3 carbon atoms. In addition, in Chemical Formula 1, L1 may be one selected from the group consisting of a single bond; an alkylene group having 1 to 20 carbon atoms, 1 to 16 carbon atoms, 1 to 8 carbon atoms, or 1 to 4 carbon atoms; and a linking group represented by the following Chemical Formula 4.

[0082]

Chem.

[0083] In Chemical Formula 4, L2 is an alkylene group having 1 to 20 carbon atoms, 1 to 16 carbon atoms, 1 to 12 carbon atoms, 1 to 8 carbon atoms, or 1 to 4 carbon atoms. Also, n is an integer within the range of 1 to 100, 1 to 50, 1 to 25, 1 to 10, or 1 to 5.

[0084] In this application, the * shown in Chemical Formula 2, Chemical Formula 3, and Chemical Formula 4 represents a bond and means the part that is chemically bonded to the main chain. For example, the * shown in the above Chemical Formula 2 and Chemical Formula 3 means the part where a chemical bond is formed with L1 of Chemical Formula 1, and one of the * shown in Chemical Formula 4 means the part where a chemical bond is formed with the oxygen (O) atom bonded to L1 in Chemical Formula 1, and the other one means the part where a chemical bond is formed with R2 in Chemical Formula 1.

[0085] In a curable composition according to an example of the present application, in the acrylic polymer component, the unit derived from the compound represented by the chemical formula 1 is 10 parts by weight or more, 12.5 parts by weight or more, 15 parts by weight or more, 17.5 parts by weight or more, 20 parts by weight or more, 22.5 parts by weight or more, 25 parts by weight or more, 27.5 parts by weight or more, 30 parts by weight or more, 32.5 parts by weight or more, 35 parts by weight or more, 37.5 parts by weight or more, or 40 parts by weight or more, 100 parts by weight or less, 95 parts by weight or less, 90 parts by weight or less, 85 parts by weight or less, 80 parts by weight or less, 75 parts by weight or less, 70 parts by weight or less, 65 parts by weight or less, 60 parts by weight or less, 55 parts by weight or less, 50 parts by weight or less, or 45 parts by weight or less, or may be included within a range formed by appropriately selecting the above upper and lower limits. By controlling the unit derived from the compound represented by the chemical formula 1 to be included within the content ratio in the acrylic polymer component, it is possible to secure not only the adhesive force at the target level but also excellent hardness.

[0086] In a curable composition according to an example of the present application, the acrylic polymer component has a weight average molecular weight (M w) is 30,000 g / mol or more, 32,500 g / mol or more, 35,000 g / mol or more, 37,500 g / mol or more, 40,000 g / mol or more, 42,500 g / mol or more, 45,000 g / mol or more, 47,500 g / mol or more, 50,000 g / mol or more, 52,500 g / mol or more, 55,000 g / mol or more, 57,500 g / mol or more or 60,000 g / mol or more, or 200,000 g / mol or less, 180,000 g / mol or less, 160,000 g / mol or less, 140,000 g / mol or less, 120,000 g / mol or less, 100,000 g / mol or less or 80,000 g / mol or less, or may be within a range formed by appropriately selecting the above upper and lower limits. Further, in the curable composition, the acrylic polymer component may have a polydispersity index (PDI) within the range of 1 to 4, 1 to 3.75, 1 to 3.5, 1 to 3.25, 1 to 3, 1 to 2.75, 1 to 2.5, 1 to 2.25, 1 to 2, 1 to 1.95, 1 to 1.9 or 1 to 1.85. When the acrylic polymer component satisfies the polydispersity index within the above range, of course, it has appropriate hardness and adhesiveness, has excellent volume resistivity, and can ensure a cured product that does not become brittle, and can ensure excellent curing characteristics. w ) Of course, when the polydispersity index is satisfied within the above range, a cured product having appropriate hardness and adhesiveness, having excellent volume resistivity, and not becoming brittle can be ensured, and excellent curing characteristics can be ensured.

[0087] In a curable composition according to an example of the present application, the monomer component contained in the resin component may contain a compound having a curable functional group. As described above, the curable functional group means a functional group that induces a curing reaction by heat, energy rays, and / or moisture, etc., and examples thereof include an alkenyl group, an alkynyl group, a (meth)acrylate group, a carboxyl group, an amide group, an amino group, an epoxy group, an isocyanate group, a cyano group, an acid anhydride group, a mercapto group, a silanol group, an alkoxysilane group, a hydroxy group, and an oxazoline group, and may contain one or more functional groups selected from the group consisting of them. Further, the curable functional group may preferably be selected from a (meth)acrylate group, an epoxy group, an isocyanate group, and a mercapto group, and more preferably may be a (meth)acrylate group. Further, the monomer component may mean a collection of so-called one or more kinds of monomers mixed within the resin component.

[0088] In a curable composition according to an example of the present application, the monomer component of the resin component may contain an acrylic monomer component. The acrylic monomer component, which is a term used in the present application, may mean one containing 55% by weight or more, 60% by weight or more, 70% by weight or more, 80% by weight or more, 90% by weight or more, or 100% by weight of (meth)acrylate based on the total weight.

[0089] In a curable composition according to an example of the present application, the acrylic monomer component may contain a (meth)acrylate containing an alkyl group and a (meth)acrylate containing a hydroxy group. By simultaneously containing the (meth)acrylate, the acrylic monomer component can ensure excellent hardness as well as the desired level of adhesive strength.

[0090] In the curable composition according to an example of the present application, the acrylic monomer component contains 40% by weight or more, 42% by weight or more, 44% by weight or more, 46% by weight or more, 48% by weight or more, 50% by weight or more, 52% by weight or more, 54% by weight or more, 56% by weight or more, or 58% by weight or more, 80% by weight or less, 78% by weight or less, 76% by weight or less, 74% by weight or less, or 72% by weight or less of (meth)acrylate containing an alkyl group, or may be included within a range formed by appropriately selecting the above upper and lower limits. When the acrylic monomer component contains (meth)acrylate containing an alkyl group within the above range, excellent thermal conductivity can be ensured as well as the hardness targeted in the present application.

[0091] In the (meth)acrylate containing an alkyl group contained in the acrylic monomer component, the alkyl group may contain one or more selected from the group consisting of a linear alkyl group, a branched alkyl group, and a cyclic alkyl group.

[0092] The acrylic monomer component may contain (meth)acrylate containing a linear or branched alkyl group. Also, the acrylic monomer component contains 50% by weight or more, 55% by weight or more, or 60% by weight or more, 100% by weight or less, or 95% by weight or less, based on the total weight, of (meth)acrylate containing a linear or branched alkyl group, or may be included within a range formed by appropriately selecting the above upper and lower limits. When the acrylic monomer component contains (meth)acrylate containing a linear or branched alkyl group within the above range, excellent thermal conductivity can be ensured as well as the hardness targeted in the present application.

[0093] The acrylic monomer component may include i) (meth)acrylate containing a linear or branched alkyl group and ii) (meth)acrylate containing a cyclic alkyl group. At this time, the acrylic monomer component is 10 parts by weight or more, 15 parts by weight or more, 20 parts by weight or more, 25 parts by weight or more, 30 parts by weight or more, 35 parts by weight or more, or 40 parts by weight or more with respect to 100 parts by weight of the (meth)acrylate containing a linear or branched alkyl group, or 80 parts by weight or less, 75 parts by weight or less, 70 parts by weight or less, 65 parts by weight or less, 60 parts by weight or less, 55 parts by weight or less, 50 parts by weight or less, or 45 parts by weight or less, or may be included within a range formed by appropriately selecting the above upper and lower limits. When the acrylic monomer component is appropriately combined with the (meth)acrylate containing a linear or branched alkyl group and the (meth)acrylate containing a cyclic alkyl group within the above range, not only the hardness targeted in the present application can be achieved, but also excellent thermal conductivity can be ensured.

[0094] In a curable composition according to an example of the present application, the acrylic monomer component contains a (meth)acrylate containing a hydroxy group in an amount of 50 parts by weight or more, 60 parts by weight or more, 70 parts by weight or more, 80 parts by weight or more, 90 parts by weight or more, 100 parts by weight or more, 110 parts by weight or more, 120 parts by weight or more, or 130 parts by weight or more with respect to 100 parts by weight of the (meth)acrylate containing an alkyl group described above, or 500 parts by weight or less, 450 parts by weight or less, 400 parts by weight or less, 350 parts by weight or less, 300 parts by weight or less, or 250 parts by weight or less, or may be included within a range formed by appropriately selecting the above upper and lower limits. By combining the acrylic monomer component containing a (meth)acrylate containing a hydroxy group and a (meth)acrylate containing an alkyl group as described within the above range, wetting characteristics with respect to the adherend surface can be ensured, and not only the adhesive strength at the target level but also excellent hardness and thermal conductivity can be ensured. Further, the curable composition is preferably a solvent-free type, but a (meth)acrylate containing a hydroxy group as a monomer can be used for dilution purposes instead of a generally used solvent. By using the (meth)acrylate containing a hydroxy group for dilution purposes, wetting characteristics with respect to the adherend surface can be ensured, and the adhesive strength at the target level can be ensured. In the curable composition according to an example of the present application, the acrylic monomer component may contain a methacrylate containing a hydroxy group. The acrylic monomer component contains the methacrylate containing a hydroxy group in an amount of 1 part by weight or more, 3 parts by weight or more, 5 parts by weight or more, 7 parts by weight or more, 9 parts by weight or more, 11 parts by weight or more, 13 parts by weight or more, 15 parts by weight or more, or 17 parts by weight or more, based on 100 parts by weight of the (meth)acrylate containing an alkyl group described above, or 100 parts by weight or less, 95 parts by weight or less, 90 parts by weight or less, 85 parts by weight or less, 80 parts by weight or less, 75 parts by weight or less, 70 parts by weight or less, 65 parts by weight or less, 60 parts by weight or less, 55 parts by weight or less, 50 parts by weight or less, 45 parts by weight or less, 40 parts by weight or less, 35 parts by weight or less, or 30 parts by weight or less, or may be included within a range formed by appropriately selecting the above upper and lower limits. By combining the acrylic monomer component containing a methacrylate containing a hydroxy group and a (meth)acrylate containing an alkyl group within the above range, wetting characteristics with respect to the adherend surface can be ensured, and not only the adhesive strength at the desired level but also the glass transition temperature can be controlled to ensure excellent hardness and thermal conductivity.

[0095] In a curable composition according to an example of the present application, the acrylic monomer component may include i) a methacrylate containing a hydroxy group and ii) an acrylate containing a hydroxy group. The acrylic monomer component may contain the acrylate containing a hydroxy group in an amount of 100 parts by weight or more, 150 parts by weight or more, 200 parts by weight or more, 250 parts by weight or more, 300 parts by weight or more, 350 parts by weight or more, 400 parts by weight or more, 450 parts by weight or more, 500 parts by weight or more, 550 parts by weight or more, 600 parts by weight or more, or 650 parts by weight or more, or 2,000 parts by weight or less, 1,800 parts by weight or less, 1,600 parts by weight or less, 1,400 parts by weight or less, 1,200 parts by weight or less, 1,000 parts by weight or less, or 800 parts by weight or less, based on 100 parts by weight of the methacrylate containing a hydroxy group, or may be included within a range formed by appropriately selecting the above upper and lower limits. By combining the methacrylate containing a hydroxy group and the acrylate containing a hydroxy group within the above range, the acrylic monomer component can ensure wetting characteristics with respect to the adherend surface, and can secure not only the adhesive strength at the desired level but also further excellent hardness and thermal conductivity.

[0096] In a curable composition according to an example of the present application, the acrylic monomer component may include a compound represented by the following Chemical Formula 1.

[0097]

Chemical Formula

[0098] In Chemical Formula 1, R1 is hydrogen or a methyl group. Also, in Chemical Formula 1, R2 may be one selected from the group consisting of hydrogen; an alkyl group having 1 to 20 carbon atoms, 1 to 16 carbon atoms, 1 to 12 carbon atoms, or 1 to 8 carbon atoms; a functional group represented by the following Chemical Formula 2; and a functional group represented by the following Chemical Formula 3.

[0099]

Chemical Formula

[0100] In Chemical Formula 2, R3 and R4 are each independently hydrogen; or an alkyl group having 1 to 20 carbon atoms, 1 to 16 carbon atoms, 1 to 12 carbon atoms, 1 to 8 carbon atoms, 1 to 4 carbon atoms, or 1 to 3 carbon atoms.

[0101]

Chem.

[0102] In Chemical Formula 3, R5 is hydrogen; or an alkyl group having 1 to 20 carbon atoms, 1 to 16 carbon atoms, 1 to 12 carbon atoms, 1 to 8 carbon atoms, 1 to 4 carbon atoms, or 1 to 3 carbon atoms. In addition, in Chemical Formula 1, L1 may be one selected from the group consisting of a single bond; an alkylene group having 1 to 20 carbon atoms, 1 to 16 carbon atoms, 1 to 8 carbon atoms, or 1 to 4 carbon atoms; and a linking group represented by the following Chemical Formula 4.

[0103]

Chem.

[0104] In Chemical Formula 4, L2 is an alkylene group having 1 to 20 carbon atoms, 1 to 16 carbon atoms, 1 to 12 carbon atoms, 1 to 8 carbon atoms, or 1 to 4 carbon atoms. Also, n is an integer within the range of 1 to 100, 1 to 50, 1 to 25, 1 to 10, or 1 to 5.

[0105] In the present application, the * shown in Chemical Formula 2, Chemical Formula 3, and Chemical Formula 4 represents a bond and means the part that is chemically bonded to the main chain. For example, the * shown in the above Chemical Formula 2 and Chemical Formula 3 means the part where a chemical bond is formed with L1 of Chemical Formula 1, and one of the * shown in Chemical Formula 4 means the part where a chemical bond is formed with the oxygen (O) atom bonded to L1 in Chemical Formula 1, and the other one means the part where a chemical bond is formed with R2 in Chemical Formula 1.

[0106] In the curable composition according to an example of the present application, the acrylic monomer component contains the compound represented by the chemical formula 1 in an amount of 10 parts by weight or more, 12.5 parts by weight or more, 15 parts by weight or more, 17.5 parts by weight or more, 20 parts by weight or more, 22.5 parts by weight or more, 25 parts by weight or more, 27.5 parts by weight or more, 30 parts by weight or more, 32.5 parts by weight or more, 35 parts by weight or more, 37.5 parts by weight or more, or 40 parts by weight or more, based on 100 parts by weight of the (meth)acrylate containing the alkyl group described above, or 100 parts by weight or less, 95 parts by weight or less, 90 parts by weight or less, 85 parts by weight or less, 80 parts by weight or less, 75 parts by weight or less, 70 parts by weight or less, 65 parts by weight or less, 60 parts by weight or less, 55 parts by weight or less, 50 parts by weight or less, or 45 parts by weight or less, or may be included within a range formed by appropriately selecting the above upper and lower limits. By controlling the acrylic monomer component to contain the compound represented by the chemical formula 1 within the above content ratio, not only the adhesive strength at the target level but also excellent hardness can be ensured.

[0107] The curable composition according to an example of the present application may contain a filler component. The curable composition can achieve the object of the present application through an appropriate combination of the resin component and the filler component.

[0108] In the curable composition according to an example of the present application, the filler component is not particularly limited as long as its type, form, size, etc. are those used in the industry. Also, the filler component may include one or more types of filler particles. Further, the filler component may use the same type of filler particles, or may be a mixture of those with different forms or a mixture of those with different average particle diameters. For example, the filler component may be a mixture of aluminum hydroxide and aluminum oxide (alumina), and the form and average particle diameter of the aluminum hydroxide and aluminum oxide may be different from each other.

[0109] The curable composition according to an example of the present application may contain an excessive amount of a filler component. By containing an excessive amount of the filler component, the curable composition can ensure excellent thermal conductivity. The curable composition contains the filler component in an amount of 60% by weight or more, 62% by weight or more, 64% by weight or more, 66% by weight or more, 68% by weight or more, 70% by weight or more, 72% by weight or more, 74% by weight or more, 76% by weight or more, 78% by weight or more, 80% by weight or more, 82% by weight or more, 84% by weight or more, 86% by weight or more, or 88% by weight or more, 98% by weight or less, 97% by weight or less, 96% by weight or less, or 95% by weight or less, based on the total weight, or may be included within a range formed by appropriately selecting the above upper and lower limits. When the curable composition contains the filler component within the above-described range, it can be said to contain an excessive amount, and through this, excellent thermal conductivity can be ensured.

[0110] In the curable composition according to an example of the present application, the filler component may contain a filler having a particle average particle size of 0.01 μm or more or 1,000 μm or less. The filler component may contain a filler of 70 μm or more. In other examples, the particle average particle size of the filler is 75 μm or more, 80 μm or more, 85 μm or more, 90 μm or more, 95 μm or more, 100 μm or more, 105 μm or more, 110 μm or more, 115 μm or more, or 120 μm or more, 1,000 μm or less or 500 μm or less, or may be within a range formed by appropriately selecting the above upper and lower limits. The filler having the particle average particle size within the above range can be referred to as filler A in the present application, and the filler A is not particularly limited with respect to the type and number as long as the particle average particle size is 70 μm or more.

[0111] The term "average particle size" used in this application refers to the D50 particle size of the filler, which is the particle size measured by the MASTERSIZER 3000 equipment of Malvern in accordance with the ISO-13320 standard. Distilled water was used as the solvent during the measurement. The laser incident on the filler dispersed in the solvent is scattered, and the intensity and directionality values of the scattered laser vary depending on the size of the filler. By analyzing this using Mie theory, the D50 particle size can be obtained. Through the above analysis, the distribution can be obtained by converting it into the diameter of a sphere having the same volume as the dispersed filler, and through this, the D50 value, which is the median value of the distribution, can be obtained to evaluate the particle size.

[0112] The morphology of the A filler particles can be appropriately selected and used as needed, such as spherical and / or non-spherical (e.g., needle-like and plate-like shapes, etc.), and is not limited thereto.

[0113] The term "the morphology of the filler particles is spherical" used in this application may mean that the sphericity is about 0.9 or more, and "non-spherical" may mean that the sphericity is less than about 0.9.

[0114] The sphericity can be confirmed through particle size analysis of the filler particles. Specifically, the sphericity of the filler, which is a three-dimensional particle, can be defined as the ratio (S' / S) of the surface area (S) of the particle and the surface area (S') of a sphere having the same volume as the particle. For actual particles, generally circularity is used. The circularity is shown as the ratio of the boundary of a circle having the same area (A) as the image obtained from the two-dimensional image of the actual particle and the boundary of the image, and is obtained by the following formula.

[0115] <Formula for circularity> Circularity = 4πA / P 2 The circularity is represented by a value from 0 to 1. A perfect circle has a value of 1, and the more irregular the shape of the particles, the lower the value is than 1. The sphericity value in the present application can be measured as the average value of the circularity measured by the particle size analysis equipment (FPIA-3000) of Malvern.

[0116] In the curable composition according to an example of the present application, the filler component is 10 wt% or more, 15 wt% or more, 20 wt% or more, 25 wt% or more, 30 wt% or more, 35 wt% or more, or 40 wt% or more of the total weight of the filler component with respect to the A filler particles, or 100 wt% or less, 99.5 wt% or less, 90 wt% or less, 80 wt% or less, 70 wt% or less, 60 wt% or less, 50 wt% or less, 40 wt% or less, or 30 wt% or less, or may be included within a range formed by appropriately selecting the above upper and lower limits. By including the A filler particles within the above-described range, the filler component can have an appropriate viscosity and thixotropy and ensure excellent thermal conductivity.

[0117] In the curable composition according to an example of the present application, the filler component may include a filler having a particle average particle size of more than 20 μm, 25 μm or more, 30 μm or more, 35 μm or more, 40 μm or more, 45 μm or more, or 50 μm or more, less than 70 μm, 65 μm or less, 60 μm or less, 55 μm or less, or 50 μm or less, or within a range formed by appropriately selecting the above upper and lower limits. Filler particles having the particle average particle size within the above range can be referred to as B filler particles in the present application. The B filler particles are not particularly limited with respect to the type and number as long as the particle average particle size satisfies the above range.

[0118] The morphology of the B filler particles can be appropriately selected and used as needed, such as spherical and / or non-spherical (for example, needle-like and plate-like shapes), and is not limited thereto.

[0119] In a curable composition according to an example of the present application, the filler component contains the B filler particles in an amount of 5% by weight or more, 7.5% by weight or more, 10% by weight or more, 12.5% by weight or more, 15% by weight or more, 17.5% by weight or more, or 20% by weight or more based on the total weight of the filler component, or 100% by weight or less, 90% by weight or less, 80% by weight or less, 70% by weight or less, 60% by weight or less, 50% by weight or less, 40% by weight or less, or 30% by weight or less, or may be included within a range formed by appropriately selecting the above upper and lower limits. By including the B filler particles within the above-described range, the filler component can have an appropriate viscosity and thixotropy, and can ensure excellent thermal conductivity.

[0120] Also, in a curable composition according to an example of the present application, the filler component may contain A filler particles and B filler particles.

[0121] In a curable composition according to an example of the present application, when the filler component contains A filler particles and B filler particles, the curable composition contains the B filler particles in an amount of 10 parts by weight or more, 15 parts by weight or more, 20 parts by weight or more, 25 parts by weight or more, 30 parts by weight or more, 35 parts by weight or more, 40 parts by weight or more, or 45 parts by weight or more per 100 parts by weight of the A filler particles, or 200 parts by weight or less, 180 parts by weight or less, 160 parts by weight or less, 140 parts by weight or less, 120 parts by weight or less, 100 parts by weight or less, 80 parts by weight or less, or 60 parts by weight or less, or may be included within a range formed by appropriately selecting the above upper and lower limits. When the ratio of the contents of the A filler and the B filler particles in the filler component is adjusted as in the above range, a curable composition having an appropriate viscosity can be formed, and a cured product excellent in thermal conductivity can be formed.

[0122] In a curable composition according to an example of the present application, when the filler component contains A filler particles and B filler particles, the diameter (D A ) of the A filler particles and the diameter (D B ) of the B filler particles, the ratio (D A / D B) is 1.05 or more, 1.1 or more, 1.15 or more, 1.2 or more, 1.25 or more, 1.3 or more, 1.35 or more, or 1.4 or more, 2.3 or less, 2.25 or less, 2.2 or less, 2.15 or less, 2.1 or less, 2.0 or less, 1.9 or less, 1.8 or less, 1.7 or less, 1.6 or less, 1.5 or less, or 1.4 or less, or may be within a range formed by appropriately selecting the upper and lower limits. The diameter (D A ) of the A filler particles and the diameter (D B ) of the B filler particles, the ratio (D A / D B ) satisfies the above range, the rapid curability of the curable composition can be ensured.

[0123] In the curable composition according to an example of the present application, the filler component may include a filler having a particle average particle size of 20 μm or less, 18 μm or less, 16 μm or less, 14 μm or less, 12 μm or less, 10 μm or less, or 8 μm or less, 0.01 μm or more, 0.05 μm or more, 0.1 μm or more, 0.2 μm or more, 0.4 μm or more, 0.8 μm or more, 1 μm or more, 2 μm or more, 3 μm or more, 4 μm or more, or 5 μm or more, or within a range formed by appropriately selecting the upper and lower limits. Filler particles having the particle average particle size within the above range can be referred to as C filler particles in the present application. The C filler particles are not particularly limited with respect to the type and number as long as the particle average particle size satisfies the above range.

[0124] The form of the C filler particles can be appropriately selected and used as needed, such as spherical and / or non-spherical (for example, needle-like and plate-like shapes, etc.), and is not limited thereto.

[0125] In the curable composition according to an example of the present application, the filler component is such that the C filler particles are 10% by weight or more, 15% by weight or more, 20% by weight or more, 25% by weight or more, 30% by weight or more, 35% by weight or more, or 40% by weight or more based on the total weight of the filler component, or 100% by weight or less, 99.5% by weight or less, 90% by weight or less, 80% by weight or less, 70% by weight or less, 60% by weight or less, 50% by weight or less, 40% by weight or less, or 30% by weight or less, or may be included within a range formed by appropriately selecting the above upper and lower limits. By including the C filler particles within the above-described range, the filler component can have appropriate viscosity and thixotropy and ensure excellent thermal conductivity.

[0126] In the curable composition according to an example of the present application, the filler component may include one or more selected from the group consisting of A filler particles, B filler particles, and C filler particles. Further, in the curable composition according to an example of the present application, the filler component may include one or more selected from the group consisting of A filler particles and B filler particles and C filler particles. Further, in the curable composition according to an example of the present application, the filler component may include A filler particles and C filler particles.

[0127] In the curable composition according to an example of the present application, when the filler component includes A filler particles and C filler particles, the curable composition has the C filler particles being 50 parts by weight or more, 60 parts by weight or more, 70 parts by weight or more, 80 parts by weight or more, 90 parts by weight or more, 100 parts by weight or more with respect to 100 parts by weight of the A filler particles, or 300 parts by weight or less, 280 parts by weight or less, 260 parts by weight or less, 240 parts by weight or less, 220 parts by weight or less, 200 parts by weight or less, 180 parts by weight or less, 160 parts by weight or less, 140 parts by weight or less, or 120 parts by weight or less, or may be included within a range formed by appropriately selecting the above upper and lower limits. When the ratio of the contents of the A filler and C filler particles in the filler component is adjusted as in the above range, a curable composition having appropriate viscosity can be formed, and a cured product excellent in thermal conductivity can be formed.

[0128] In a curable composition according to an example of the present application, the filler component may contain B filler particles and C filler particles without containing A filler.

[0129] In a curable composition according to an example of the present application, when the filler component contains B filler particles and C filler particles without containing A filler, the curable composition has C filler particles in an amount of 100 parts by weight or more, 120 parts by weight or more, 140 parts by weight or more, 160 parts by weight or more, 180 parts by weight or more, or 200 parts by weight or more, or 500 parts by weight or less, 475 parts by weight or less, 450 parts by weight or less, 425 parts by weight or less, 400 parts by weight or less, 375 parts by weight or less, 350 parts by weight or less, 325 parts by weight or less, 300 parts by weight or less, 275 parts by weight or less, or 250 parts by weight or less, based on 100 parts by weight of B filler particles, or may be included within a range formed by appropriately selecting the upper and lower limits. When the content ratio of the B filler and C filler particles in the filler component is adjusted as in the above range, a curable composition having an appropriate viscosity can be formed, and a cured product excellent in thermal conductivity can be formed.

[0130] In a curable composition according to an example of the present application, the filler component may be a thermally conductive filler component for treating heat generated in a battery or the like, and may contain at least one or more thermally conductive filler particles. The thermally conductive filler particles may have a thermal conductivity of about 1 W / mK or more, 5 W / mK or more, 10 W / mK or more, or 15 W / mK or more, and in other examples, may mean about 400 W / mK or less, about 350 W / mK or less, or about 300 W / mK or less. The thermal conductivity of the thermally conductive filler particles that may be included in the filler component is not particularly limited, but may be a value measured by ASTM E1461. Further, the thermally conductive filler component may have a thermal conductivity of about 1 W / mK or more, 5 W / mK or more, 10 W / mK or more, or 15 W / mK or more, and in other examples, may be about 400 W / mK or less, about 350 W / mK or less, or about 300 W / mK or less, and may be a value measured by ASTM E1461.

[0131] In the curable composition according to an example of the present application, when the thermally conductive filler particles contained in the filler component have a thermal conductivity of their own satisfying the above range, the type thereof is not particularly limited. For example, oxides such as aluminum oxide (alumina), magnesium oxide, beryllium oxide or titanium oxide; nitrides such as boron nitride, silicon nitride or aluminum nitride; carbides such as silicon carbide; hydrated metals such as aluminum hydroxide or magnesium hydroxide; metal fillers such as copper, silver, iron, aluminum or nickel; metal alloy fillers such as titanium; or mixtures thereof may be used.

[0132] In the curable composition according to an example of the present application, the filler component may contain filler particles having a Mohs hardness of 6 or more, 6.5 or more, 7 or more, 7.5 or more, 8 or more or 8.5 or more. The Mohs hardness, which is a term used in the present application, can be measured using a Mohs hardness tester. Further, the filler particles having a Mohs hardness within the above range can be referred to as first filler particles in the present application.

[0133] In the curable composition according to an example of the present application, the filler component is 30% by weight or more, 35% by weight or more, 40% by weight or more, 45% by weight or more, 50% by weight or more, 55% by weight or 60% by weight or more, 100% by weight or less, 97.5% by weight or less, 95% by weight or less or 92.5% by weight or less of the total weight of the filler component with respect to the first filler particles, or may be included within a range formed by appropriately selecting the above upper and lower limits. When the filler component contains the first filler particles satisfying the above range, excellent hardness can be ensured.

[0134] In a curable composition according to an example of the present application, the filler particles having an average particle diameter of the filler component of 70 μm or more (i.e., the aforementioned A filler particles) may contain filler particles having a Mohs hardness of 6 or more, 6.5 or more, 7 or more, 7.5 or more, 8 or more, or 8.5 or more (i.e., the aforementioned first filler particles). At this time, the A filler particles may contain the first filler particles at 55% by weight or more, 75% by weight or more, or 95% by weight or more based on the total weight of the A filler particles.

[0135] In a curable composition according to an example of the present application, the filler particles having an average particle diameter of the filler component exceeding 20 μm and less than 70 μm (i.e., the aforementioned B filler particles) may contain filler particles having a Mohs hardness of 6 or more, 6.5 or more, 7 or more, 7.5 or more, 8 or more, or 8.5 or more (i.e., the aforementioned first filler particles). At this time, the B filler particles may contain the first filler particles at 55% by weight or more, 75% by weight or more, or 95% by weight or more based on the total weight of the B filler particles.

[0136] In a curable composition according to an example of the present application, the filler component may further contain filler particles having a Mohs hardness of less than 6, 5.5 or less, 5 or less, 4.5 or less, 4 or less, 3.5 or less, or 3 or less in order to adjust the viscosity, processibility, and hardness after curing of the curable composition. The filler particles having a Mohs hardness within the above range can be referred to as second filler particles in the present application.

[0137] In a curable composition according to an example of the present application, the filler component is 100 parts by weight or less, 90 parts by weight or less, 80 parts by weight or less, 70 parts by weight or less, or 60 parts by weight or less, or 10 parts by weight or more, 20 parts by weight or more, 30 parts by weight or more, 40 parts by weight or more, or 50 parts by weight or more with respect to 100 parts by weight of the first filler particles, or may be contained within a range formed by appropriately selecting the above upper and lower limits.

[0138] In the curable composition according to an example of the present application, the filler particles having an average particle diameter of the filler component of 0.01 μm or more and 20 μm or less (that is, the C filler particles described above) may contain filler particles having a Mohs hardness of less than 6, 5.5 or less, 5 or less, 4.5 or less, 4 or less, 3.5 or less, or 3 or less (that is, the second filler particles described above). At this time, the C filler particles may contain the second filler particles at 55% by weight or more, 75% by weight or more, or 95% by weight or more based on the total weight of the C filler particles.

[0139] The curable composition according to an example of the present application may contain a thermal initiator. That is, the curable composition can be subjected to a curing reaction by a heat curing method in the presence of a thermal initiator. The thermal initiator can generate radicals by heat and cause the curing reaction to proceed by the radicals.

[0140] In the curable composition according to an example of the present application, the thermal initiator is not particularly limited as long as it is used in the art. For example, azo initiators such as 2,2′-azobis(4-methoxy-2,4-dimethylvaleronitrile) (V-70, manufactured by Wako), 2,2-azobis-2,4-dimethylvaleronitrile (V-65, manufactured by Wako), 2,2-azobisisobutyronitrile (AIBN, V-60, manufactured by Wako) or 2,2-azobis-2-methylbutyronitrile (V-59, manufactured by Wako); peroxydicarbonate compounds such as dipropyl peroxydicarbonate (Peroyl NPP, manufactured by NOF), diisopropyl peroxydicarbonate (Peroyl IPP, manufactured by NOF), bis-4-butylcyclohexyl peroxydicarbonate (Peroyl TCP, manufactured by NOF), diethoxyethyl peroxydicarbonate (Peroyl EEP, manufactured by NOF), diethoxyhexyl peroxydicarbonate (Peroyl OPP, manufactured by NOF), hexyl peroxydicarbonate (Perhexyl ND, manufactured by NOF), dimethoxybutyl peroxydicarbonate (Peroyl MBP, manufactured by NOF), bis(3-methoxy-3-methoxybutyl) peroxydicarbonate (Peroyl SOP, manufactured by NOF), hexyl peroxypivalate (Perhexyl PV, manufactured by NOF), amyl peroxypivalate (Luperox 546M75, manufactured by Atofina), butyl peroxypivalate (Perbutyl, manufactured by NOF) or trimethylhexanoyl peroxide (Peroyl 355, manufactured by NOF); peroxydicarbonate compounds such as dimethylhydroxybutyl peroxyneodecanoate (Luperox 610M75, manufactured by Atofina), amyl peroxyneodecanoate (Luperox 546M75, manufactured by Atofina) or butyl peroxyneodecanoate (Luperox 10M75, manufactured by Atofina); acyl peroxides such as 3,5,5-trimethylhexanoyl peroxide, lauryl peroxide or dibenzoyl peroxide; ketone peroxide; dialkyl peroxide; peroxyketal;One or more peroxide initiators such as peroxide or hydroperoxide can be used. From the viewpoint of ensuring appropriate physical properties targeted in the present application, it is appropriate to apply an azo initiator as described above.;

[0141] In the curable composition according to an example of the present application, the thermal initiator has a 10-hour half-life temperature of 60°C or higher, 61°C or higher, 62°C or higher, 63°C or higher, 64°C or higher, 65°C or higher, 66°C or higher, 67°C or higher, or 68°C or higher, and the upper limit is not particularly limited, but is 200°C or lower, 180°C or lower, 160°C or lower, 140°C or lower, 120°C or lower, 100°C or lower, or 80°C or lower, or can be within a range formed by appropriately selecting the upper and lower limits.

[0142] The curable composition according to an example of the present application may contain a thermal initiator having a 10-hour half-life temperature within the above range, but is maintained at 50°C for a relatively short time, and the Shore A hardness is 70 or higher, 72 or higher, 74 or higher, 76 or higher, 78 or higher, 80 or higher, 82 or higher, 84 or higher, 86 or higher, 88 or higher, or 90 or higher, 100 or lower, 99 or lower, 98 or lower, or 97 or lower, or can be within a range formed by appropriately selecting the upper and lower limits. The curable composition can achieve the above characteristics through an appropriate combination of initiators. The curable composition can be subjected to secondary curing by heating after primary curing with energy rays. Further, the curable composition can be subjected to primary curing by heating and then secondary curing with energy rays. The Shore A hardness can appear through the following combined curing.

[0143] In the above, a relatively short time is 50 minutes or less, 49 minutes or less, 48 minutes or less, 47 minutes or less, 46 minutes or less, 45 minutes or less, 44 minutes or less, 43 minutes or less, 42 minutes or less, 41 minutes or less, 40 minutes or less, 39 minutes or less, 38 minutes or less, 37 minutes or less, 36 minutes or less, 35 minutes or less, 34 minutes or less, 33 minutes or less, 32 minutes or less, 31 minutes or less, or 30 minutes or less. The lower limit is not particularly limited, but is 5 minutes or more, 6 minutes or more, 7 minutes or more, 8 minutes or more, 9 minutes or more, 10 minutes or more, 11 minutes or more, 12 minutes or more, 13 minutes or more, 14 minutes or more, 15 minutes or more, 16 minutes or more, 17 minutes or more, 18 minutes or more, 19 minutes or more, 20 minutes or more, 21 minutes or more, 22 minutes or more, 23 minutes or more, 24 minutes or more, 25 minutes or more, 26 minutes or more, 27 minutes or more, 28 minutes or more, 29 minutes or more, or 30 minutes or more, or may be within a range formed by appropriately selecting the above upper and lower limits. In the above, the meaning of a relatively short time means that the time required for curing to be completed is shorter compared to the case where the combination method of initiators described later is not adopted. The curable composition can quickly (rapid curing) ensure excellent curing characteristics even at a relatively low temperature through the combination of initiators described later.

[0144] The curable composition according to an example of the present application contains a thermal initiator in an amount of 0.1% by weight or more, 0.2% by weight or more, 0.3% by weight or more, 0.4% by weight or more, 0.5% by weight or more, 0.6% by weight or more, 0.7% by weight or more, 0.8% by weight or more, 0.9% by weight or more, or 1% by weight or more based on the total weight, or 3% by weight or less, 2.9% by weight or less, 2.8% by weight or less, 2.7% by weight or less, 2.6% by weight or less, 2.5% by weight or less, 2.4% by weight or less, 2.3% by weight or less, 2.2% by weight or less, 2.1% by weight or less, 2% by weight or less, 1.9% by weight or less, 1.8% by weight or less, 1.7% by weight or less, 1.6% by weight or less, 1.5% by weight or less, 1.4% by weight or less, 1.3% by weight or less, or 1.2% by weight or less, or may be included within a range formed by appropriately selecting the above upper and lower limits. By containing the thermal initiator within the above-described range, the curable composition can ensure rapid curing characteristics and excellent curability.

[0145] The curable composition according to an example of the present application may contain a photoinitiator. That is, the curable composition can undergo a curing reaction by an energy ray curing method in the presence of a photoinitiator.

[0146] The curable composition according to an example of the present application contains the photoinitiator in an amount of 0.1% by weight or more, 0.2% by weight or more, 0.3% by weight or more, 0.4% by weight or more, 0.5% by weight or more, 0.6% by weight or more, 0.7% by weight or more, 0.8% by weight or more, 0.9% by weight or more, 1% by weight or more, 1.1% by weight or more, 1.2% by weight or more, 1.3% by weight or more, 1.4% by weight or more, 1.5% by weight or more, 1.6% by weight or more, or 1.7% by weight or more, or 3% by weight or less, 2.9% by weight or less, 2.8% by weight or less, 2.7% by weight or less, 2.6% by weight or less, 2.5% by weight or less, 2.4% by weight or less, 2.3% by weight or less, 2.2% by weight or less, 2.1% by weight or less, or 2% by weight or less, or may be included within a range formed by appropriately selecting the above upper and lower limits. By containing the photoinitiator within the above-described range, the curable composition can ensure fast curing characteristics and excellent curability.

[0147] Further, the curable composition according to an example of the present application may contain both a photoinitiator and a thermal initiator. That is, the curable composition can undergo a curing reaction by a heat curing method and an energy ray curing method in the presence of a thermal initiator and a photoinitiator.

[0148] The curable composition according to an example of the present application contains a thermal initiator (I H ) and a photoinitiator (I U ) in a weight ratio of (I H / I U) is 0.01 or more, 0.02 or more, 0.03 or more, 0.04 or more, 0.05 or more, 0.06 or more, 0.07 or more, 0.08 or more, 0.09 or more, 0.1 or more, 0.2 or more, 0.3 or more, 0.4 or more, 0.5 or more, 0.6 or more, 0.7 or more, 0.8 or more, 0.9 or more, 1 or more, 1.1 or more, 1.2 or more, 1.3 or more, 1.4 or more, or 1.5 or more, or 5 or less, 4.5 or less, 4 or less, 3.5 or less, 3 or less, 2.5 or less, or 2 or less, or may be included within a range formed by appropriately selecting the upper and lower limits. By controlling the ratio of the contents of the thermal initiator and the photoinitiator within the range described above, the curable composition can form a thick film having excellent curing characteristics even at a relatively low temperature, and can ensure not only an appropriate adhesive strength at the desired level but also an excellent level of thermal conductivity.

[0149] The curable composition according to an example of the present application may contain more photoinitiator than thermal initiator on a weight basis.

[0150] In the curable composition according to an example of the present application, the photoinitiator may include one or more selected from the group consisting of radical initiators and cationic initiators. In another exemplification, in the curable composition, the photoinitiator may simultaneously contain a radical initiator and a cationic initiator. Through such a combination of initiators, the curable composition can form a thick film having excellent curing characteristics even at a relatively low temperature, and can ensure not only an appropriate adhesive strength at the desired level but also an excellent level of thermal conductivity.

[0151] In the curable composition according to an example of the present application, the radical initiator used as a photoinitiator generates radicals upon receiving energy rays, and as the radical initiator, radical initiators generally used in the art may be used without limitation. Specific examples include 1-hydroxy-cyclohexyl-phenyl-ketone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methyl-1-propanone, methylbenzoylformate, oxy-phenyl-acetic acid-2-[2 oxo-2phenyl-acetoxy-ethoxy]-ethyl ester, oxy-phenyl-acetic acid-2-[2-hydroxy-ethoxy]-ethyl ester, alpha-dimethoxy-alpha-phenylacetophenone, 2-benzyl-2-(dimethylamino)-1-[4-(4-morpholinyl)phenyl]-1-butanone, 2-methyl-1-[4-(methylthio)phenyl]-2-(4-morpholinyl)-1-propanone, diphenyl(2,4,6-trimethylbenzoyl)-phosphine oxide (Diphenyl(2,4,One or more selected from the group consisting of 6-trimethylbenzoyl)-phosphine oxide, Phosphine oxide, and phenylbis(2,4,6-trimethylbenzoyl)-phosphine oxide, but not limited thereto.,

[0152] In addition, the cationic initiator used in the photoinitiator is an acid (H) by energy rays +) that generates, and the cationic initiators that can be used in the present invention preferably include those containing, for example, sulfonium salts or iodonium salts. Specific examples include those selected from the group consisting of diphenyl(4-phenylthio)phenylsulfonium hexafluoroantimonate, diphenyl(4-phenylthio)phenylsulfonium hexafluorophosphate, (4-methylphenyl)[4-(2-methylpropyl)phenyl]-iodonium hexafluorophosphate, (phenyl)[4-(2-methylpropyl)phenyl]-iodonium hexafluorophosphate, (thiodi-4,1-phenylene)bis(diphenylsulfonium)dihexafluoroantimonate, and (thiodi-4,1-phenylene)bis(diphenylsulfonium)dihexafluorophosphate, but are not limited thereto.

[0153] In a curable composition according to an example of the present application, the photoinitiator is a radical initiator in an amount of 10% by weight or more, 12% by weight or more, 14% by weight or more, 16% by weight or more, 18% by weight or more, 20% by weight or more, 22% by weight or more, 24% by weight or more, 26% by weight or more, 28% by weight or more, 30% by weight or more, or 32% by weight or more based on the total weight of the photoinitiator, or 95% by weight or less, 90% by weight or less, 85% by weight or less, 80% by weight or less, 75% by weight or less, 70% by weight or less, 65% by weight or less, 60% by weight or less, 55% by weight or less, 50% by weight or less, 45% by weight or less, 40% by weight or less, or 35% by weight or less, or may be included within a range formed by appropriately selecting the above upper and lower limits. The curable composition can form a thick film having excellent curing characteristics even at a relatively low temperature by applying the thermal initiator and the photoinitiator simultaneously and controlling the content of the radical initiator in the photoinitiator within the above-described range, and can ensure an appropriate level of adhesion as well as an excellent level of thermal conductivity as intended.

[0154] In a curable composition according to an example of the present application, the photoinitiator is a radical initiator (I R ) and a cationic initiator (I P ) in a weight ratio of (I R / I P) is 0.01 or more, 0.02 or more, 0.03 or more, 0.04 or more, 0.05 or more, 0.06 or more, 0.07 or more, 0.08 or more, 0.09 or more, 0.1 or more, 0.15 or more, 0.2 or more, 0.25 or more, 0.3 or more, 0.35 or more, 0.4 or more, 0.45 or more, or 0.5 or more, or 2 or less, 1.9 or less, 1.8 or less, 1.7 or less, 1.6 or less, 1.5 or less, 1.4 or less, 1.3 or less, 1.2 or less, 1.1 or less, 1 or less, 0.9 or less, 0.8 or less, 0.7 or less, or 0.6 or less, or it can be controlled within a range formed by appropriately selecting the above upper and lower limits. The curable composition simultaneously applies the thermal initiator and the photoinitiator, and by controlling the ratio of the content of the cationic initiator and the radical initiator in the photoinitiator within the range described above, a thick film having excellent curing characteristics even at a relatively low temperature can be formed, and not only an appropriate adhesive strength at the desired level but also an excellent level of thermal conductivity can be ensured.

[0155] In the curable composition according to an example of the present application, the photoinitiator may further contain a cationic initiator in a larger amount than the radical initiator on a weight basis.

[0156] The curable composition according to an example of the present application may contain a radically curable component. The term "radically curable component" used in the present application may mean a component that can be cured by radical polymerization upon irradiation with energy rays. The radically curable component may have at least one or more radically curable functional groups, and the energy rays may be performed by irradiation with particle beams such as alpha-particle beams, proton beams, neutron beams, and electron beams, as well as electromagnetic waves such as microwaves, infrared rays (IR), ultraviolet rays (UV), X-rays, or gamma rays.

[0157] In a curable composition according to an example of the present application, the radical curable component may contain the acrylic polymer component and the acrylic monomer component described above. The acrylic polymer component and the acrylic monomer component can refer to the above content.

[0158] The curable composition according to an example of the present application may not substantially contain a cationic curable component. That is, the curable composition may contain the cationic curable component at 1% by weight or less, 0.5% by weight or less, 0.1% by weight or less, 0.05% by weight or less, or 0.01% by weight or less based on the total weight, or preferably may not contain it at all (0% by weight). The term cationic curable component used in the present application may mean a component that can be cured by cationic polymerization by irradiation with energy rays. The cationic curable component may have at least one or more cationic curable functional groups, and examples of the cationic curable functional group include an epoxide group, an oxetane group, a cyclic ether group, a sulfide group, an acetal group, or a lactone group. Although the curable composition substantially does not contain a cationic curable component, it can form a thick film having excellent curing characteristics even at a relatively low temperature through an appropriate combination of initiators, and can ensure an appropriate level of adhesion as well as an excellent level of thermal conductivity as intended.

[0159] The curable composition according to an example of the present application contains a photoinitiator simultaneously with the radical curable component, the photoinitiator contains a cationic initiator, and the curable composition may not substantially contain a cationic curable component. Here, the curable composition can form a cured product having a Shore A hardness of 70 or more, 72 or more, 74 or more, 76 or more, 78 or more, 80 or more, 82 or more, 84 or more, 86 or more, 88 or more, or 90 or more, 100 or less, 99 or less, 98 or less, or 97 or less, or within a range formed by appropriately selecting the above upper and lower limits. The curable composition can form a thick film having excellent curing characteristics even at a relatively low temperature through the above-described combination of initiators, and can ensure an appropriate level of adhesion as well as an excellent level of thermal conductivity as intended.

[0160] In an example of the curable composition according to the present application, when it contains a cationic initiator as a photoinitiator without substantially containing a cationic curable component, it may contain a sensitizer. The sensitizer can activate the cationic initiator in the curable composition by receiving long-wavelength light energy. The long-wavelength light energy, which is a term used in the present application, means the energy possessed by light in the wavelength range of approximately 300 to 410 nm.

[0161] The type of the sensitizer is not particularly limited, and examples of the sensitizer include carbonyl compounds, organic sulfur compounds, persulfides, redox compounds, azo and diazo compounds, anthracene compounds, halogen compounds, photoreducible dyes, and the like. More specifically, the sensitizer can be selected from those commonly used in the art, such as 2,4-diethyl-9H-thioxanthen-9-one (DETX) or isopropylthioxanthone (ITX).

[0162] The curable composition according to an example of the present application contains the sensitizer in an amount of 0.01 part by weight or more, 0.02 part by weight or more, 0.03 part by weight or more, 0.04 part by weight or more, 0.05 part by weight or more, 0.06 part by weight or more, 0.07 part by weight or more, or 0.08 part by weight or more, or 1 part by weight or less, 0.75 part by weight or less, 0.5 part by weight or less, or 0.1 part by weight or less, based on 100 parts by weight of the filler component, or may be included within a range formed by appropriately selecting the above upper and lower limits. When the content ratio of the sensitizer satisfies the above range, even if the curable composition contains a cationic initiator as a photoinitiator without substantially containing a cationic curable component, the cationic initiator can be appropriately activated to induce a curing reaction.

[0163] The curable composition according to an example of the present application may further contain one or more additives exemplified below in order to ensure further physical properties. However, the additives may be those generally used in the art and are not necessarily limited to the additives exemplified below.

[0164] The curable composition according to an example of the present application may further contain a plasticizer. The type of the plasticizer is not particularly limited. For example, it can be selected from one or more of phthalic acid compounds, phosphoric acid compounds, adipic acid compounds, sebacic acid compounds, citric acid compounds, glycolic acid compounds, trimellitic acid compounds, polyester compounds, epoxidized soybean oil, chlorinated paraffin, chlorinated fatty acid esters, fatty acid compounds, compounds having a saturated aliphatic chain substituted with a sulfonic acid group bonded with a phenyl group (for example, mesamoll of LANXESS), and vegetable oils and used.

[0165] Among the phthalic acid compounds, one or more of dimethyl phthalate, diethyl phthalate, dibutyl phthalate, dihexyl phthalate, di-n-octyl phthalate, di-2-ethylhexyl phthalate, diisooctyl phthalate, dicapryl phthalate, dinonyl phthalate, diisononyl phthalate, didecyl phthalate, diundecyl phthalate, dilauryl phthalate, ditridecyl phthalate, dibenzyl phthalate, dicyclohexyl phthalate, butyl benzyl phthalate, octyl decyl phthalate, butyl octyl phthalate, octyl benzyl phthalate, n-hexyl n-decyl phthalate, n-octyl phthalate and n-decyl phthalate can be used. Among the phosphoric acid compounds, one or more of tricresyl phosphate, trioctyl phosphate, triphenyl phosphate, octyl diphenyl phosphate, cresyl diphenyl phosphate and trichloroethyl phosphate can be used. Among the adipic acid compounds, one or more of dibutoxyethoxyethyl adipate (DBEEA), dioctyl adipate, diisooctyl adipate, di-n-octyl adipate, didecyl adipate, diisononyl adipate (DINA), diisodecyl adipate (DIDP), n-octyl n-decyl adipate, n-heptyl adipate and n-nonyl adipate can be used. Among the sebacic acid compounds, one or more of dibutyl sebacate, dioctyl sebacate, diisooctyl sebacate and butyl benzyl can be used. Among the citric acid compounds, one or more of triethyl citrate, acetyltriethyl citrate, tributyl citrate, acetyltributyl citrate and acetyltrioctyl citrate can be used. Among the glycolic acid compounds, one or more of methyl phthalyl ethyl glycolate, ethyl phthalyl ethyl glycolate and butyl phthalyl ethyl glycolate can be used. Among the trimellitic acid compounds, one or more of trioctyl trimellitate and tri-n-octyl n-decyl trimellitate can be used.The polyester compound may be a reaction product of a diol selected from butanediol, ethylene glycol, propane-1,2-diol, propane-1,3-diol, polyethylene glycol, glycerol, a diacid (selected from adipic acid, succinic acid, succinic anhydride), and a hydroxy acid (e.g., hydroxystearic acid).

[0166] In a curable composition according to an example of the present application, the plasticizer is 0.1 part by weight or more, 0.2 part by weight or more, 0.3 part by weight or more, 0.4 part by weight or more, 0.5 part by weight or more, or 0.6 part by weight or more, or 5 parts by weight or less, 4.5 parts by weight or less, 4 parts by weight or less, 3.5 parts by weight or less, 3 parts by weight or less, 2.5 parts by weight or less, or 2 parts by weight or less with respect to 100 parts by weight of the filler component, or may be included within a range formed by appropriately selecting the above upper and lower limits. When the proportion of the content of the plasticizer satisfies the above range, the compatibility of the curable composition can be improved.

[0167] In a curable composition according to an example of the present application, considering the compatibility between the resin component or the radical curable component applied in the present application and the filler component, the plasticizer is preferably an adipic acid compound.

[0168] A curable composition according to an example of the present application may further contain a dispersant. Examples of the dispersant include polyamide amine and its salts, polycarboxylic acids and their salts, modified polyurethanes, modified polyesters, modified poly(meth)acrylates, (meth)acrylic copolymers, naphthalenesulfonic acid formalin condensates, polyoxyethylene alkyl phosphates, polyoxyethylene alkyl amines, and pigment derivatives. However, any dispersant known in the art can be used without limitation. Preferably, the dispersant may include a modified polyester dispersant, and for example, Disperbyk-111 (BYK) and Solsperse 41000 (Lubrizol) can be used.

[0169] In a curable composition according to an example of the present application, the dispersant is 0.1 part by weight or more, 0.2 part by weight or more, 0.3 part by weight or more, 0.4 part by weight or more, 0.5 part by weight or more, or 0.6 part by weight or more, or 5 parts by weight or less, 4.5 parts by weight or less, 4 parts by weight or less, 3.5 parts by weight or less, 3 parts by weight or less, 2.5 parts by weight or less, or 2 parts by weight or less with respect to 100 parts by weight of the filler component, or may be included within a range formed by appropriately selecting the above upper and lower limits. When the proportion of the content of the dispersant satisfies the above range, excellent dispersibility can be ensured even if the filler component in the curable composition is contained in an excessive amount.

[0170] The curable composition according to an example of the present application may further contain a flame retardant or a flame retardant aid. The curable composition further containing a flame retardant or a flame retardant aid can form a flame-retardant cured product by curing. As the flame retardant, various known flame retardants can be applied without special limitation. For example, a flame retardant in the form of a solid filler or a liquid flame retardant can be applied. Examples of the flame retardant include organic flame retardants such as melamine cynaurate and inorganic flame retardants such as magnesium hydroxide, but are not limited thereto. When the amount of the thermally conductive filler particles contained in the curable composition is large, a liquid type flame retardant material (such as TEP, Triethyl phosphate or TCPP, tris(1,3-chloro-2-propyl)phosphate) may be used. Also, a silane coupling agent that can act as a flame retardant enhancer may be added.

[0171] In a curable composition according to an example of the present application, the flame retardant is 0.5 part by weight or more, 1 part by weight or more, 1.5 part by weight or more, 2 part by weight or more, 2.5 part by weight or more, or 3 part by weight or more, or 10 parts by weight or less, 9 parts by weight or less, 8 parts by weight or less, 7 parts by weight or less, 6 parts by weight or less, 5 parts by weight or less, or 4 parts by weight or less with respect to 100 parts by weight of the filler component, or may be included within a range formed by appropriately selecting the above upper and lower limits. When the proportion of the content of the flame retardant satisfies the above range, excellent thermal conductivity can be ensured and excellent flame retardant performance can be realized.

[0172] The curable composition according to an example of the present application may further contain a reaction accelerator. The reaction accelerator can perform a function of promoting the polymerization reaction of the curable composition. The type of the reaction accelerator is not particularly limited, and for example, dimethyl-p-toluidine (N,N-Dimethyl-p-toluidine; DMPT) and the like can be used.

[0173] The curable composition according to an example of the present application contains the reaction accelerator in an amount of 0.01 part by weight or more, 0.02 part by weight or more, 0.03 part by weight or more, 0.04 part by weight or more, 0.05 part by weight or more, 0.06 part by weight or more, 0.07 part by weight or more, or 0.08 part by weight or more, 1 part by weight or less, 0.75 part by weight or less, 0.5 part by weight or less, or 0.1 part by weight or less, based on 100 parts by weight of the filler component, or may be included within a range formed by appropriately selecting the above upper and lower limits. When the content ratio of the reaction accelerator satisfies the above range, the polymerization reaction can be appropriately promoted.

[0174] The curable composition according to an example of the present application may further contain a metal catalyst as needed. As the metal catalyst, one or more selected from the group consisting of aluminum, bismuth, lead, mercury, tin, zinc, and zirconium may be included as a central metal element. Further, an ester group, an ether group, or a carboxy group may be bonded to the central metal element in the metal catalyst. Examples of the metal catalyst include dibutyltin dilaurate and dimethyltin diacetate, but the metal catalyst is not particularly limited thereto, and any metal catalyst that can be generally used in the art can be used without limitation. Also, one type or two or more types of metal catalysts can be used.

[0175] The curable composition according to an example of the present application may further contain a crosslinking agent as needed. The crosslinking agent can form a cured product having appropriate adhesive strength and hardness by embodying a structure to be crosslinked within the curable composition.

[0176] The crosslinking agent can be, for example, a urethane acrylate crosslinking agent, an aliphatic isocyanate crosslinking agent, an epoxy crosslinking agent, an aziridine crosslinking agent, and a metal chelate crosslinking agent, and is not limited thereto. Also, one or more crosslinking agents can be used. The urethane acrylate crosslinking agent is a compound having a large number of urethane bonds (-NHCOO-) in the molecular chain and an acrylic group capable of reacting with ultraviolet rays at the molecular end, and commercially available products such as PU330 (Miwon Co., Ltd.), PU256 (Miwon Co., Ltd.), PU610 (Miwon Co., Ltd.), and PU340 (Miwon Co., Ltd.) can be used. The aliphatic isocyanate crosslinking agent can use, for example, isocyanate compounds such as isophorone diisocyanate or methylene dicyclohexyl diisocyanate or cyclohexane diisocyanate, and derivatives such as its dimer or trimer. The epoxy crosslinking agent can use, for example, ethylene glycol diglycidyl ether, triglycidyl ether, trimethylolpropane triglycidyl ether, N,N,N′,N′-tetraglycidyl ethylenediamine, or glycerin diglycidyl ether. The aziridine crosslinking agent can use, for example, N,N′-toluene-2,4-bis(1-aziridine carboxamide), N,N′-diphenylmethane-4,4′-bis(1-aziridine carboxamide), triethylenemelamine, bisisophthaloyl-1-(2-methylaziridine), or tri-1-aziridinylphosphine oxide. The metal chelate crosslinking agent can use, for example, a metal chelate component which is a compound in which a polyvalent metal such as aluminum, iron, zinc, tin, titanium, antimony, magnesium, and / or vanadium is coordinated with acetylacetone or ethyl acetoacetate.

[0177] The curable composition according to an example of the present application may further contain a peroxide compound if necessary. The peroxide compound may be a substance that helps the curable composition to undergo a polymerization reaction.

[0178] The peroxide compound may be, for example, a ketone peroxide compound such as methyl ethyl ketone peroxide (MEKP), cyclohexanone peroxide, 3,3,5-trimethylcyclohexanone peroxide, methylcyclohexanone peroxide, methyl acetoacetate peroxide, and acetylacetone peroxide; a hydroperoxide compound such as tert-butyl hydroperoxide, cumene hydroperoxide, diisopropylbenzene hydroperoxide, paramethane hydroperoxide, 2,5-dimethylhexane-2,5-dihydroperoxide, and 1,1,3,3-tetramethylbutyl hydroperoxide; a diacyl peroxide compound such as acetyl peroxide, isobutyl peroxide, octanoyl peroxide, decanoyl peroxide, lauroyl peroxide, 3,3,5-trimethylhexanoyl peroxide, succinic peroxide, benzoyl peroxide, 2,4-dichlorobenzoyl peroxide, and meta-toluoyl peroxide; an acyl peroxide compound such as benzoyl peroxide (BPO); and the like, and is not limited thereto. Also, one or more peroxide compounds can be used.

[0179] The curable composition according to an example of the present application may further contain a viscosity modifier, such as a thixotropic agent, a diluent, a surface treatment agent, or a coupling agent, etc., in order to adjust the viscosity as necessary, for example, to increase or decrease the viscosity, or for viscosity adjustment by shear force. The thixotropic agent can adjust the viscosity of the curable composition by shear force. Examples of the thixotropic agent that can be used include fumed silica. The diluent is usually used to reduce the viscosity of the curable composition, and various types known in the art can be used without limitation as long as they can exhibit the above-described effects. The surface treatment agent is for surface treatment of the filler component introduced into the cured product of the curable composition, and various types known in the art can be used without limitation as long as they can exhibit the above-described effects. In the case of the coupling agent, for example, it can be used to improve the dispersibility of heat-conductive filler particles (such as alumina, etc.), and various types known in the art can be used without limitation as long as they can exhibit the above-described effects.

[0180] The curable composition according to an example of the present application can be formed by mixing each of the above-listed components. Further, when the curable composition contains all the necessary components, it is not particularly limited with respect to the mixing order.

[0181] The curable composition according to an example of the present application can be produced by adding and mixing other components, such as a filler component, to a resin component containing a synthesized polymer component. The resin component containing the polymer component may be a polymer syrup produced by interrupting the polymerization when the solid content is within about 50 to 70% through a heat-curing method. Further, the curable composition can be produced by adding and diluting a monomer component to the produced polymer syrup, and then adding and mixing other components, such as a filler component.

[0182] An apparatus according to an example of the present application includes a heat-generating element and a cooling part, and may include a curable composition according to an example of the present application or a cured product of the curable composition that thermally contacts both between the heat-generating element and the cooling part.

[0183] An apparatus according to an example of the present application includes various electrical products and electronic products such as, for example, an iron, a washing machine, a dryer, a clothing management machine, an electric shaver, a microwave oven, an electric oven, an electric rice cooker, a refrigerator, a dishwasher, an air conditioner, a fan, a humidifier, an air purifier, a mobile phone, a radio, a television, a radio, a computer, a notebook computer, etc., or a battery such as a secondary battery. The cured product of the curable composition can dissipate the heat generated in the apparatus. In particular, in the battery of an electric vehicle manufactured by gathering battery cells to form one battery module and gathering a plurality of battery modules to form one battery pack, the curable composition of the present application can be used as a material for connecting the battery modules. When the curable composition of the present application is used as a material for connecting the battery modules, it can dissipate the heat generated by the battery cells and play a role in fixing the battery cells from external impact and vibration.

[0184] The cured product of the curable composition of the present application can transfer the heat generated by the heat-generating element to the cooling part. That is, the cured product of the curable composition can dissipate the heat generated by the heat-generating element.

[0185] The cured product of the curable composition is located between the heat-generating element and the cooling part and can thermally contact them. The term "thermal contact" means that the cured product of the curable composition physically and directly contacts the heat-generating element and the cooling part to dissipate the heat generated by the heat-generating element to the cooling part, or even if the cured product of the curable composition does not directly contact the heat-generating element and / or the cooling part (that is, there is a separate layer between the cured product of the curable composition and the heat-generating element and / or the cooling part), it means dissipating the heat generated by the heat-generating element to the cooling part.

[0186] This application can provide a battery module. A battery module according to an example of this application includes a module case having a lower plate and side walls that form an internal space; a plurality of battery cells present in the internal space of the module case; and a resin layer present in the internal space of the module case, the resin layer being in contact with the plurality of battery cells and may also be in contact with the lower plate or side walls of the module case. Here, the resin layer may include a curable composition according to an example of this application or a cured product of the curable composition.

[0187] The battery module of this application includes a module case and battery cells. The battery cells may be housed in the module case. One or more battery cells may be present in the module case, and a plurality of battery cells may be housed in the module case. The number of battery cells housed in the module case is adjusted according to applications etc. and is not particularly limited. The battery cells housed in the module case may be electrically connected to each other.

[0188] The module case may at least include side walls and a lower plate that form an internal space in which the battery cells can be housed. The module case may further include an upper plate that seals the internal space. The side walls, lower plate, and upper plate may be integrally formed with each other, or the module case may be formed by assembling separate side walls, lower plate, and / or upper plate respectively. The form and size of such a module case are not particularly limited and can be appropriately selected according to applications, the form and number of battery cells housed in the internal space, etc.

[0189] FIG. 1 is a diagram showing an exemplary module case 10, which is an illustration of a box-shaped case 10 including one lower plate 10a and four side walls 10b. The module case 10 may further include an upper plate 10c that seals the internal space.

[0190] FIG. 2 is a schematic view of the module case 10 of FIG. 1 in which the battery cell 20 is housed, observed from above.

[0191] Holes may be formed in the lower plate, side wall, and / or upper plate of the module case (hereinafter sometimes referred to as the lower plate, etc.). Such holes may be formed in the lower plate, etc. that are in contact with the resin layer described later, or may be formed in the lower plate, etc. that are in contact with the resin layer with a contact area of 80% or more as described later. When the resin layer is formed by an injection process as described later, the hole may be an injection hole for injecting the forming material (resin composition) of the resin layer. At this time, the form, number, and position of the hole can be adjusted in consideration of the injection efficiency of the forming material of the resin layer. In one example, the hole may be formed at least in the lower plate.

[0192] In one example, the hole may be formed at a point of about 1 / 4 to 3 / 4 or about 3 / 8 to 7 / 8 or substantially the middle of the overall length of the side wall, lower plate, or upper plate. By injecting the resin composition through the injection hole formed at this point, the resin layer can be injected so as to have a wide contact area. The points of 1 / 4, 3 / 4, 3 / 8, or 7 / 8 are, for example, the ratio of the distance A to the formation position of the hole with respect to the overall length L measured with respect to any one end face E of the lower plate, etc. as shown in FIG. 3. Also, the end E at which the length L and the distance A are formed may be any arbitrary end E from which the length L and the distance A are measured from the same end E. In FIG. 3, the injection hole 50a is in a form located substantially in the middle of the lower plate 10a.

[0193] The size and shape of the injection holes are not particularly limited and can be formed in consideration of the injection efficiency of the resin layer material described later. For example, the holes may be circular, elliptical, polygonal such as triangular or quadrangular, or amorphous. The number of injection holes and the intervals between them are also not greatly limited, and as described above, they can be adjusted so that the resin layer can have a large contact area with the lower plate or the like.

[0194] Observation holes (for example, 50b in FIG. 3) may be formed at the ends of the lower plate or the like in which the injection holes are formed. Such observation holes may be, for example, for observing whether the injected material is sufficiently injected up to the ends of the side wall, the lower plate, or the upper plate when injecting the resin layer material through the injection holes. The position, form, size, and number of the observation holes are not limited as long as they are formed so that it can be confirmed whether the injected material is properly injected.

[0195] The module case may be a thermally conductive case. The term "thermally conductive case" means a case in which the thermal conductivity of the entire case is 10 W / mk or more, or a case that includes at least a portion having the above-described thermal conductivity. For example, at least one of the side wall, lower plate, and upper plate described above may have the above-described thermal conductivity. In another example, at least one of the side wall, lower plate, and upper plate may include a portion having the above-described thermal conductivity. In the above, the thermal conductivity may be 20 W / mk or more, 30 W / mk or more, 40 W / mk or more, 50 W / mk or more, 60 W / mk or more, 70 W / mk or more, 80 W / mk or more, 90 W / mk or more, 100 W / mk or more, 110 W / mk or more, 120 W / mk or more, 130 W / mk or more, 140 W / mk or more, 150 W / mk or more, 160 W / mk or more, 170 W / mk or more, 180 W / mk or more, 190 W / mk or more, or 195 W / mk or more in another example. Since the higher the numerical value of the thermal conductivity, the more advantageous it is from the viewpoint of heat dissipation of the module, etc., the upper limit thereof is not particularly limited. In one example, the thermal conductivity may be about 1,000 W / mK or less, 900 W / mk or less, 800 W / mk or less, 700 W / mk or less, 600 W / mk or less, 500 W / mk or less, 400 W / mk or less, 300 W / mk or 250 W / mK or less, but is not limited thereto. The type of material showing the above-described thermal conductivity is not particularly limited, and examples include metal materials such as aluminum, gold, pure silver, tungsten, copper, nickel, or platinum. The module case may be entirely made of the above-described thermally conductive material, or at least a part thereof may be a portion made of the above-described thermally conductive material. Thereby, the module case may have the thermal conductivity within the above-mentioned range, or may at least include a portion having the above-mentioned thermal conductivity.

[0196] In the module case, the portion having the thermal conductivity within the above range may be a portion in contact with the resin layer and / or the insulating layer described later. Further, the portion having the thermal conductivity may be a portion in contact with a cooling medium such as cooling water. According to such a structure, a structure capable of effectively discharging the heat generated from the battery cell to the outside can be realized.

[0197] The type of the battery cell housed in the module case is not particularly limited, and various known battery cells can be applied. In one example, the battery cell may be a pouch type. Referring to FIG. 4 for explanation, the pouch type battery cell 100 may usually include an electrode assembly, an electrolyte, and a pouch exterior material.

[0198] FIG. 4 is a separated perspective view schematically showing the configuration of an exemplary pouch type cell, and FIG. 5 is a combined perspective view of the configuration of FIG. 4.

[0199] The electrode assembly 110 included in the pouch type cell 100 may be arranged in a form in which one or more positive electrode plates and one or more negative electrode plates are arranged with a separator interposed therebetween. The electrode assembly 110 can be classified into a wound type in which one positive electrode plate and one negative electrode plate are wound together with a separator, a stacked type in which a large number of positive electrode plates and a large number of negative electrode plates are alternately laminated with a separator interposed therebetween, and the like.

[0200] The pouch exterior material 120 may be configured, for example, in a form including an external insulating layer, a metal layer, and an internal adhesive layer. Such an exterior material 120 protects internal elements such as the electrode assembly 110 and the electrolyte, and may include a metal thin film such as aluminum in consideration of complementing the electrochemical properties of the electrode assembly 110 and the electrolyte and heat dissipation. Such a metal thin film may be interposed between insulating layers formed of an insulating material in order to ensure electrical insulation between elements such as the electrode assembly 110 and the electrolyte and other elements outside the battery 100.

[0201] In one example, the exterior member 120 may include an upper port 121 and a lower port 122, and an internally hollow space I in a pitted form may be formed in at least one of the upper port 121 and the lower port 122. The electrode assembly 110 may be housed in such an internal space I of the port. A seal portion S is provided on the outer peripheral surfaces of the upper port 121 and the lower port 122, and such seal portions S may adhere to each other to seal the internal space in which the electrode assembly 110 is housed.

[0202] Each electrode plate of the electrode assembly 110 may be provided with an electrode tap, and one or more electrode taps may be connected to an electrode lead. The electrode lead is interposed between the seal portions S of the upper port 121 and the lower port 122 and can function as an electrode terminal of the secondary battery 100 by being exposed to the outside of the exterior member 120.

[0203] The form of the port type cell is one example, and the battery cells applied in the present application are not limited to the above types. In the present application, various known forms of port type cells or other forms of batteries can all be applied as battery cells.

[0204] The battery module of the present application may include a resin layer. In the present application, the term resin layer is a layer containing a resin component, and in one example, the resin layer may be an adhesive layer. In one example, the battery module includes the case and the battery cell and may be in contact with any one of the side wall, the lower plate, or the upper plate of the case. Here, the resin layer may include a curable composition according to an example of the present application or a cured product of the curable composition.

[0205] At this time, the side wall, lower plate, or upper plate in contact with the resin layer may be the heat-conductive side wall, lower plate, or upper plate described above. Note that in the above, "contact" means thermal contact. For the above contact, the resin layer may be in direct contact with the lower plate or the like, or there may be other elements, such as an insulating layer described later, between the resin layer and the lower plate or the like, but it means a state where the other elements do not impede the heat transfer from the resin layer to the lower plate or the like. "Not impeding heat transfer" in the above means that even when there are other elements (e.g., an insulating layer or a guide portion described later) between the resin layer and the lower plate or the like, the overall thermal conductivity of the other element and the resin layer is about 2 W / mK or more, 2.5 W / mK or more, 3 W / mK or more, 3.5 W / mK or more, or 4 W / mK or more, or the overall thermal conductivity of the resin layer and the lower plate or the like in contact therewith is within the above range even when there are the other elements. The thermal conductivity of the above thermal contact may be 50 W / mK or less, 45 W / mk or less, 40 W / mk or less, 35 W / mk or less, 30 W / mk or less, 25 W / mk or less, 20 W / mk or less, 15 W / mk or less, 10 W / mK or less, 5 W / mK or less, 4.5 W / mK or less, or about 4.0 W / mK or less. Such thermal contact can be achieved by controlling the thermal conductivity and / or thickness of the other element when the other element exists.

[0206] The resin layer is in contact with the lower plate or the like, and may also be in contact with the battery cell. The contact between the battery cell and the resin layer is also the thermal contact described above. In the present application, by adopting the above structure, while significantly reducing various fastening parts and module cooling equipment already required during the configuration of a general battery module or a battery pack which is an assembly of such modules, it is possible to embody a module that ensures heat dissipation while accommodating more battery cells per unit volume. Thereby, in the present application, it is possible to provide a battery module that is smaller, lighter, and has high output.

[0207] Figs. 6 and 7 are exemplary cross-sectional views of the battery module. For example, the module may include a case 10 including a side wall 10b and a lower plate 10a as shown in Figs. 6 and 7; a plurality of battery cells 20 housed inside the case; and a resin layer 30 in contact (thermal contact) with all of the battery cells 20 and the case 10.

[0208] In the above structure, the lower plate or the like in contact with the resin layer 30 may be a lower plate or the like with thermal conductivity as described above.

[0209] The contact area between the resin layer and the lower plate or the like may be about 70% or more, about 75% or more, about 80% or more, about 85% or more, about 90% or more, or about 95% or more with respect to the total area of the lower plate or the like. The upper limit of the contact area is not particularly limited and may be, for example, 100% or less or about less than 100%. When the lower plate or the like includes a thermally conductive portion, the contact area may be the contact area with respect to the thermally conductive portion, that is, the ratio with respect to the total area of the thermally conductive portion.

[0210] As described above, the thermally conductive portion or the thermally conductive lower plate or the like may be a portion in contact with a cooling medium such as cooling water. That is, as schematically shown in Fig. 6, heat H can be easily discharged to the lower plate or the like by the above structure, and heat can be easily released even with a simpler structure by bringing such a lower plate or the like into contact with the cooling medium CW.

[0211] As shown in FIG. 6, the resin layer 30 may be in the form of a relatively thin layer, or may fill the internal space of the case 10 as shown in FIG. 7. In the latter case, the battery cell 20 may be present in a state of being inserted into the resin layer. When the structure is as shown in FIG. 6, the thickness of the resin layer may be, for example, within the range of about 100 μm to 5 mm or within the range of about 200 μm to 5 mm. In the structure of the present application, if the resin layer is thin, it is advantageous in terms of heat dissipation, and if it is thick, it is advantageous in terms of the insulation properties described later. Therefore, an appropriate thickness can be set in consideration of such points. The thickness may be the thickness of the thinnest part of the resin layer, the thickness of the thickest part, or the average thickness.

[0212] As shown in FIG. 6 or FIG. 7, on at least one surface inside the module case 10, for example, on the surface 10a in contact with the resin layer 30, a guide portion 10d capable of guiding the battery cell 20 to be housed may also be present. At this time, the shape of the guide portion 10d is not particularly limited, and an appropriate shape can be adopted in consideration of the form of the battery cell to be applied. The guide portion 10d may be integrally formed with the lower plate or the like, or may be separately attached. The guide portion 10d can be formed using a heat-conductive material, for example, a metal material such as aluminum, gold, pure silver, tungsten, copper, nickel, or platinum, in consideration of the thermal contact described above. Also, although not shown, an insulating paper or an adhesive layer may be present between the battery cells 20 to be housed. In the above, the insulating paper can play a buffering role during the charge and discharge of the battery cell.

[0213] The resin layer or the battery module to which the resin layer is applied may have the characteristics due to the physical properties of the curable composition of the present application described above and the cured product of the curable composition. In particular, the resin layer of the battery module may be the same as the physical properties of the curable composition of the present application and the cured product of the curable composition.

[0214] In one example, the battery module may further include an insulating layer between the module case and the battery cell or between the resin layer and the module case. FIG. 8 is an example in which an insulating layer 40 is formed between the resin layer 30 and the guide portion 10d formed on the lower plate 10c of the case. By adding the insulating layer, problems such as electrical short - circuit phenomena and fire caused by contact between the cell and the case due to impacts that may occur during use can be prevented. The insulating layer can be formed using an insulating sheet having high insulation and thermal conductivity, or can be formed by coating or injecting a substance exhibiting insulation. For example, in the manufacturing method of the battery module described later, a process of forming the insulating layer can be performed before injecting the resin composition. For forming the insulating layer, so - called TIM (Thermal Interface Material) etc. can also be applied. In other methods, the insulating layer can be formed of an adhesive substance. For example, the insulating layer can also be formed using a resin layer with a low or no content of fillers such as thermally conductive fillers. Examples of the resin components that can be used for forming the insulating layer include acrylic resins, olefin resins such as PVC (poly(vinyl chloride)) and PE (polyethylene), epoxy resins, silicone, and rubber components such as EPDM rubber ((ethylene propylene diene monomer rubber)), but are not limited thereto. The insulating layer may have a dielectric breakdown voltage of about 5 kV / mm or more, about 10 kV / mm or more, about 15 kV / mm or more, 20 kV / mm or more, 25 kV / mm or more, or 30 kV / mm or more as measured in accordance with ASTM D149. The higher the value of the dielectric breakdown voltage, the better the insulation performance, and it is not particularly limited. For example, the dielectric breakdown voltage of the insulating layer may be about 100 kV / mm or less, 90 kV / mm or less, 80 kV / mm or less, 70 kV / mm or less, or 60 kV / mm or less.The thickness of the insulating layer can be set within an appropriate range in consideration of the insulation and thermal conductivity of the insulating layer. For example, it may be about 5 μm or more, about 10 μm or more, 20 μm or more, 30 μm or more, 40 μm or more, 50 μm or more, 60 μm or more, 70 μm or more, 80 μm or more, or 90 μm or more. Also, the upper limit of the thickness is not particularly limited, and for example, it may be about 1 mm or less, about 200 μm or less, 190 μm or less, 180 μm or less, 170 μm or less, 160 μm or less, or 150 μm or less.

[0215] This application also relates to a battery module, for example, a method for manufacturing the battery module mentioned above.

[0216] The manufacturing method of this application may include the step of injecting the resin composition into the module case described above; the step of housing the battery cell in the module case; and the step of curing the resin composition to form the resin layer. Here, the resin composition means a composition for forming the resin layer of the battery module, and may be a curable composition according to an example of this application.

[0217] The order of the step of injecting the resin composition into the module case and the step of housing the battery cell in the module case is not particularly limited. For example, the resin composition can be first injected into the module case and the battery cell can be housed in that state, or the battery cell can be first housed inside the module case and then the resin composition can be injected.

[0218] The method of injecting the resin composition into the module case is not particularly limited, and a known method can be applied. For example, the resin composition can be poured into the opening of the module case to inject the resin composition, or the resin composition can be injected by the injection port formed in the module case described above, or a method of applying the resin composition to both the battery cell and the battery module can be applied. For appropriate fixation, the injection process can also be performed while vibrating the battery module or the battery cell constantly.

[0219] The method of housing the battery cells in the module case into which the resin composition has been injected or the module case before the composition is injected is not particularly limited.

[0220] The housing of the battery cells can be performed by arranging the battery cells at appropriate positions within the module case in consideration of the intended arrangement and the like. Further, when a cartridge structure is present, the battery cells can be arranged at the appropriate positions of the cartridge structure, or the cartridge structure in which the battery cells are located can be inserted into the module case to perform the above step.

[0221] After housing the battery cells, the adhesion between the battery cells or the adhesion between the battery cells and the module case can be formed by curing the injected resin composition. The method of curing the resin composition is not particularly limited, but can follow the curing method of the curable composition according to an example of the present application.

[0222] The present application also relates to a battery pack, for example, a battery pack including two or more of the above-described battery modules. In the battery pack, the battery modules may be electrically connected to each other. The method of electrically connecting two or more battery modules to form a battery pack is not particularly limited, and all known methods can be applied.

[0223] The present application also relates to an apparatus provided with the battery module or the battery pack. Examples of the apparatus include automobiles such as electric vehicles, but are not limited thereto, and may include all applications that require the output of a secondary battery. For example, the method of configuring the automobile using the battery module or the battery pack is not particularly limited, and a general method can be applied.

Advantages of the Invention

[0224] This application is an improvement over the conventional problems and can provide a curable composition capable of rapid curing at a relatively low temperature compared to the prior art. In addition, this application can provide a curable composition that has an excellent heat dissipation effect, has appropriate adhesion performance, and can form a cured product with excellent hardness. In addition, this application can provide a battery pack to which the curable composition is applied and an apparatus including the battery pack.

Brief Description of the Drawings

[0225]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Modes for Carrying Out the Invention

[0226] Hereinafter, the present invention will be described based on examples and comparative examples, but the scope of the present invention is not limited by the following presented content.

[0227] Example 1. 2-Ethylhexyl acrylate (2-EHA), isobornyl acrylate (IBoA), and 2-hydroxyethyl methacrylate (2-HEMA) were added to a flask equipped with a mechanical stirrer in a weight ratio of 60:25:15 (2-EHA:IBoA:2-HEMA). After further adding about 0.03 wt% of 2,2-azobisisobutyronitrile (AIBN) to the total weight of the compounds added to the flask, the temperature was raised to about 80 °C under normal pressure conditions, and then stirred at 80 °C for about 4 hours for partial polymerization to obtain a partially polymerized reaction product (R1) containing an acrylic polymer component (A P ). (Solid content: about 61 wt%). At this time, the produced acrylic polymer component (A P ) had a weight average molecular weight (M w ) of about 62,500 g / mol and a polydispersity index (PDI) of about 1.42.

[0228] 2-Hydroxyethyl acrylate (2-HEA) was added to the partially polymerized reaction product (R1) for dilution to produce a diluted product (Di). At this time, the 2-hydroxyethyl acrylate (2-HEA) was added so as to be about 40 parts by weight with respect to 100 parts by weight of the reaction product (R1).

[0229] Thereafter, the produced diluted product (Di), filler component (F), dispersant (D), plasticizer (P), flame retardant (N), photoinitiator (I U ), thermal initiator (I H ), sensitizer (S e ) and accelerator (A c ) were mixed in a ratio of 14:158.7:1:1:5:0.38:0.25:0.13:0.13 (Di:F:D:P:N:I U :I H :S e :A c) was added to a paste mixer at the weight ratio and stirred to produce a curable composition having a viscosity of about 150,000 to 200,000 cPs measured at 25°C and 60 rpm.

[0230] Here, as the filler component (F), a mixture of spherical alumina (F11) with an average particle size of 70 μm, plate-like alumina (F12) with an average particle size of 50 μm, and aluminum hydroxide (F13) with an average particle size of 8 μm in a weight ratio of 4:2:4 (F11:F12:F13) was used.

[0231] Also, the photoinitiator (I U ) is a mixture of a cationic initiator (I P ) and a radical initiator (I R ) in a weight ratio of 1:0.52 (I P :I R ). As the cationic initiator (I P ), Irgacure-250 (I-250) commercially available from BASF was used, and as the radical initiator (I R ), Irgacure-819 (I-819) commercially available from BASF was used. Specifically, the I-250 is (4-methylphenyl)[4-(2-methylpropyl)phenyl]iodonium hexafluorophosphate, and the I-819 is diphenyl(2,4,6-trimethylbenzoyl)-phosphine oxide.

[0232] As the thermal initiator (I H ), 2,2-azobisisobutyronitrile (2,2-Azobisisobutyronitrile, AIBN) was used. The thermal initiator used had a half-life temperature (solvent: toluene) of about 65°C for 10 hours.

[0233] As the dispersant (D), Disperbyk-111, a modified polyester dispersant commercially available from BYK, was used. As the plasticizer (P), diisononyl adipate (DINA) commercially available from Aching Chemical was used. As the flame retardant (N), FR-119L, a phosphorus-based flame retardant commercially available from CHEMPIA, was used. As the sensitizer (S e ), 2,4-diethyl-9H-thioxanthen-9-one (DETX) was used. As the accelerator (A c ), N,N-dimethyl-p-toluidine (DMPT) was used.

[0234] Example 2. 2-Ethylhexyl acrylate (2-EHA), ethoxyethylene glycol acrylate (EOEOEA), and 2-hydroxyethyl methacrylate (2-HEMA) were added to a flask equipped with a mechanical stirrer at a weight ratio of 60:25:15 (2-EHA: EOEOEA: 2-HEMA). After further adding about 0.03% by weight of 2,2-azobisisobutyronitrile (AIBN) to the total weight of the compounds added to the flask, the temperature was raised to about 80 °C under normal pressure conditions, and then stirred at 80 °C for about 4 hours for partial polymerization to obtain a partially polymerized reactant (R1) containing an acrylic polymer component (A P )(solid content: about 65% by weight). At this time, the acrylic polymer component (A P ) produced had a weight average molecular weight (M w ) of about 60,500 g / mol and a polydispersity index (PDI) of about 1.32.

[0235] 2-Hydroxyethyl acrylate (2-HEA) was added to the partially polymerized reactant (R1) and diluted to produce a diluent (Di). At this time, the 2-hydroxyethyl acrylate (2-HEA) was added so as to be about 40 parts by weight with respect to 100 parts by weight of the reactant (R1).

[0236] Thereafter, the produced diluent (Di), filler component (F), dispersant (D), plasticizer (P), flame retardant (N), photoinitiator (I U ), thermal initiator (I H ), sensitizer (S e ) and accelerator (A c ) were added to a paste mixer in a weight ratio of 14:158.7:1:1:5:0.38:0.25:0.13:0.13 (Di:F:D:P:N:I U :I H :S e :A c ) and stirred to produce a curable composition having a viscosity of about 150,000 to 200,000 cPs measured at 25 °C and 60 rpm. Here, the filler component (F), dispersant (D), plasticizer (P), flame retardant (N), photoinitiator (I U ), thermal initiator (I H ), sensitizer (S e ) and accelerator (A c ) were the same as those used in Example 1 above.

[0237] Example 3. 2-Ethylhexyl acrylate (2-EHA), 2-hydroxyethyl acrylate (2-HEA), and 2-hydroxyethyl methacrylate (2-HEMA) were added to a flask equipped with a mechanical stirrer in a weight ratio of 60:25:15 (2-EHA:2-HEA:2-HEMA). After further adding about 0.03 wt% of 2,2-azobisisobutyronitrile (AIBN) to the total weight of the compounds added to the flask, the temperature was raised to about 80 °C under normal pressure conditions and then maintained at 80 °C and stirred for about 4 hours for partial polymerization to obtain a partially polymerized reaction product (R1) containing an acrylic polymer component (AP) (solid content: about 63 wt%). At this time, the produced acrylic polymer component (A P ) had a weight average molecular weight (M w ) of about 71,500 g / mol and a polydispersity index (PDI) of about 1.54.

[0238] 2-Hydroxyethyl acrylate (2-HEA) was added to the partially polymerized reaction product (R1) for dilution to produce a diluent (Di). At this time, the 2-hydroxyethyl acrylate (2-HEA) was added so as to be about 40 parts by weight with respect to 100 parts by weight of the reactant (R1).

[0239] Thereafter, the produced diluent (Di), filler component (F), dispersant (D), plasticizer (P), flame retardant (N), photoinitiator (I U ), thermal initiator (I H ), sensitizer (S e ) and accelerator (A c ) were mixed in a ratio of 14:158.7:1:1:5:0.38:0.25:0.13:0.13 (Di:F:D:P:N:I U :I H :S e :A c) was added to a paste mixer in the weight ratio and stirred to produce a curable composition having a viscosity of about 150,000 to 200,000 cPs measured at 25 °C and 60 rpm. Here, the filler component (F), dispersant (D), plasticizer (P), flame retardant (N), photoinitiator (I U ) and thermal initiator (I H ) and sensitizer (S e ) and accelerator (A c ) were the same as those used in Example 1 above.

[0240] Example 4. 2-Ethylhexyl acrylate (2-EHA), acrylamide (AAM) and 2-hydroxyethyl methacrylate (2-HEMA) were added to a flask equipped with a mechanical stirrer in a weight ratio of 60:25:15 (2-EHA: AAM: 2-HEMA). After further adding about 0.03% by weight of 2,2-azobisisobutyronitrile (AIBN) to the total weight of the compounds added to the flask, the temperature was raised to about 80 °C under normal pressure conditions and then maintained at 80 °C and stirred for about 4 hours for partial polymerization to obtain a partially polymerized reaction product (R1) containing an acrylic polymer component (A P ) (solid content: about 63% by weight). At this time, the acrylic polymer component (A P ) produced had a weight average molecular weight (M w ) of about 75,200 g / mol and a polydispersity index (PDI) of about 1.21.

[0241] 2-Hydroxyethyl acrylate (2-HEA) was added to the partially polymerized reaction product (R1) for dilution to produce a diluent (Di). At this time, the 2-hydroxyethyl acrylate (2-HEA) was added so as to be about 40 parts by weight with respect to 100 parts by weight of the reaction product (R1).

[0242] Thereafter, the manufactured diluent (Di), filler component (F), dispersant (D), plasticizer (P), flame retardant (N), photoinitiator (I U ), thermal initiator (I H ), sensitizer (S e ) and accelerator (A c ) were added to a paste mixer at a weight ratio of 14:158.7:1:1:5:0.38:0.25:0.13:0.13 (Di:F:D:P:N:I U :I H :S e :A c ) and stirred to produce a curable composition having a viscosity of about 150,000 to 200,000 cPs as measured at 25°C and 60 rpm. Here, the filler component (F), dispersant (D), plasticizer (P), flame retardant (N), photoinitiator (I U ), thermal initiator (I H ), sensitizer (S e ) and accelerator (A c ) were the same as those used in Example 1 above.

[0243] Example 5. 2-Ethylhexyl acrylate (2-EHA), acrylic acid (AA) and 2-hydroxyethyl methacrylate (2-HEMA) were added to a flask equipped with a mechanical stirrer at a weight ratio of 60:25:15 (2-EHA:AA:2-HEMA). After further adding about 0.03% by weight of 2,2-azobisisobutyronitrile (AIBN) to the total weight of the compounds added to the flask, the temperature was raised to about 80°C under normal pressure conditions, and then stirred at 80°C for about 4 hours to effect partial polymerization to obtain a partially polymerized reaction product (R1) containing an acrylic polymer component (A P ) (solid content: about 69% by weight). At this time, the manufactured acrylic polymer component (A P ) had a weight average molecular weight (M w) was about 69,000 g / mol, and the polydispersity index (PDI) was about 1.85.

[0244] 2-Hydroxyethyl acrylate (2-HEA) was added to the partially polymerized reactant (R1) for dilution to produce a diluent (Di). At this time, the 2-hydroxyethyl acrylate (2-HEA) was added so as to be about 40 parts by weight with respect to 100 parts by weight of the reactant (R1).

[0245] Thereafter, the produced diluent (Di), filler component (F), dispersant (D), plasticizer (P), flame retardant (N), photoinitiator (I U )), thermal initiator (I H ), sensitizer (S e ) and accelerator (A c ) were added to a paste mixer at a weight ratio of 14:158.7:1:1:5:0.38:0.25:0.13:0.13 (Di:F:D:P:N:I U :I H :S e :A c ) and stirred to produce a curable composition having a viscosity of about 150,000 to 200,000 cPs measured at 25 °C and 60 rpm. Here, the filler component (F), dispersant (D), plasticizer (P), flame retardant (N), photoinitiator (I U ), thermal initiator (I H ), sensitizer (S e ) and accelerator (A c ) were the same as those used in Example 1.

[0246] Comparative Example 1. 2-Ethylhexyl acrylate (2-EHA), isobornyl acrylate (IBoA), and 2-hydroxyethyl methacrylate (2-HEMA) were added to a flask equipped with a mechanical stirrer in a weight ratio of 60:25:15 (2-EHA:IBoA:2-HEMA). After further adding about 0.03% by weight of 2,2-Azobisisobutyronitrile (AIBN) to the total weight of the compounds added to the flask, the temperature was raised to about 80 °C under normal pressure conditions and then maintained at 80 °C and stirred for about 4 hours for partial polymerization to obtain a partially polymerized reaction product (R1) containing an acrylic polymer component (A P ). (Solid content: about 61% by weight). At this time, the acrylic polymer component (A P ) produced had a weight average molecular weight (M w ) of about 65,500 g / mol and a polydispersity index (PDI) of about 1.51.

[0247] 2-Hydroxyethyl acrylate (2-HEA) was added to the partially polymerized reaction product (R1) for dilution to produce a diluent (Di). At this time, the 2-hydroxyethyl acrylate (2-HEA) was added so as to be about 40 parts by weight with respect to 100 parts by weight of the reaction product (R1).

[0248] Thereafter, the produced diluent (Di), filler component (F), dispersant (D), plasticizer (P), flame retardant (N), photoinitiator (I U ), thermal initiator (I H ), sensitizer (S e ) and accelerator (A c ) were mixed in a ratio of 14:21.64:1:1:5:0.38:0.25:0.13:0.13 (Di:F:D:P:N:I U :I H :S e :A cIt was added to a paste mixer at a weight ratio of ()) and stirred to produce a curable composition having a viscosity of about 70,000 cPs measured at 25 °C and 60 rpm. Here, the filler component (F), dispersant (D), plasticizer (P), flame retardant (N), photoinitiator (I U ), thermal initiator (I H ), sensitizer (S e ) and accelerator (A c ) were the same as those used in Example 1 above.

[0249] Comparative Example 2. 2-Hydroxyethyl acrylate (2-HEA) was added to the reactant (R1) produced in Example 1 above and diluted to produce a diluent (Di). At this time, the 2-hydroxyethyl acrylate (2-HEA) was added so as to be about 40 parts by weight with respect to 100 parts by weight of the reactant (R1).

[0250] Thereafter, the produced diluent (Di), filler component (F), dispersant (D), plasticizer (P), flame retardant (N), photoinitiator (I U ), sensitizer (S e ) and accelerator (A c ) were added to a paste mixer at a weight ratio of 14:158.7:1:1:5:0.38:0.13:0.13 (Di:F:D:P:N:I U :S e :A c ) and stirred to produce a composition. Here, the filler component (F), dispersant (D), plasticizer (P), flame retardant (N), sensitizer (S e ) and accelerator (A c ) were the same as those used in Example 1 above. Also, the photoinitiator (I U ) applied only a cationic initiator (I P ), and the cationic initiator (I P) As Irgacure-250 (I-250) commercially available from BASF was used. The I-250 is (4-methylphenyl)[4-(2-methylpropyl)phenyl]iodonium hexafluorophosphate.

[0251] Comparative Example 3. 2-Hydroxyethyl acrylate (2-HEA) was added to and diluted with the reactant (R1) produced in Example 1 to produce a diluent (Di). At this time, the 2-hydroxyethyl acrylate (2-HEA) was added so as to be about 40 parts by weight with respect to 100 parts by weight of the reactant (R1).

[0252] Thereafter, the produced diluent (Di), filler component (F), dispersant (D), plasticizer (P), flame retardant (N), photoinitiator (I U ) and sensitizer (S e ) and accelerator (A c ) were added to a paste mixer at a weight ratio of 14:158.7:1:1:5:0.38:0.13:0.13 (Di:F:D:P:N:I U :S e :A c ) and stirred to produce a composition. Here, the same filler component (F), dispersant (D), plasticizer (P), flame retardant (N), sensitizer (S e ) and accelerator (A c ) as those in Example 1 were used. Also, as the photoinitiator (I U ), only a radical initiator (I R ) was applied, and as the radical initiator (I R ), Irgacure-819 (I-819) commercially available from BASF was used. The I-819 is diphenyl(2,4,6-trimethylbenzoyl)-phosphine oxide.

[0253] Comparative Example 4. 2-Hydroxyethyl acrylate (2-HEA) was added to the reactant (R1) produced in Example 1 and diluted to produce a diluent (Di). At this time, the 2-hydroxyethyl acrylate (2-HEA) was added so as to be about 40 parts by weight with respect to 100 parts by weight of the reactant (R1).

[0254] Thereafter, the produced diluent (Di), filler component (F), dispersant (D), plasticizer (P), flame retardant (N), thermal initiator (I H ), sensitizer (S e ) and accelerator (A c ) were added to a paste mixer in a weight ratio of 14:158.7:1:1:5:0.25:0.13:0.13 (Di:F:D:P:N:I H :S e :A c ) and stirred to produce a composition. Here, the same filler component (F), dispersant (D), plasticizer (P), flame retardant (N), sensitizer (S e ) and accelerator (A c ) as those in Example 1 were used. Also, as the thermal initiator (I H ), 2,2-azobisisobutyronitrile (AIBN) was used. The thermal initiator used had a half-life temperature of about 65 °C for 10 hours (solvent: toluene).

[0255] The physical properties presented in this specification can specifically be measured or evaluated in the following manner. Also, the data regarding the following physical properties were measured or evaluated in the following manner.

[0256] <Physical Property Measurement Method> 1. Shore A Hardness The curable composition was applied onto a glass surface to a thickness of about 2 mm, and then irradiated with ultraviolet rays for about 3 minutes using a UV curing machine (Black light, 1.5 J / cm 2 ), and then left at about 50 °C for 30 minutes to form a cured product.

[0257] The hardness of the surface of the cured product was measured at 25 °C according to ASTM D2240 standard using a hardness tester. Specifically, the flat surface of the cured product was indented with an indenter capable of measuring Shore A hardness of the hardness tester (manufacturer: TQC Sheen, product name: LD0550), and when the indented force was maintained, the hardness value indicated on the hardness tester was measured.

[0258] 2. Adhesive strength After applying a curable composition on a glass plate so that the horizontal dimension is about 5 cm, the vertical dimension is about 10 cm, and the thickness is about 2 mm, an aluminum port having a PET (poly(ethylene terephthalate)) interface with a horizontal dimension of 1 cm, a vertical dimension of 20 cm, and a thickness of about 150 μm was adhered thereon. The aluminum port is used in the production of battery cells and was adhered so that the PET interface contacts the applied curable composition. Then, after irradiating the applied curable composition with ultraviolet rays for about 3 minutes using a UV curing machine (Black light, 1.5 J / cm 2 ), it was left to cure at about 50 °C for 30 minutes, and then the aluminum port was peeled off at 25 °C at a peeling rate of about 0.3 mm / s and a peeling angle of 180 degrees using a physical property tester (manufacturer: stable micro systems, Taxture analyzer) to measure the adhesive strength.

[0259] 3. Thermal conductivity The thermal conductivity was measured using the Hot disk method. Specifically, the curable composition was charged into a disk-shaped mold with a diameter of 2 cm and a thickness of 2 mm, and after irradiating the curable composition with ultraviolet rays for about 3 minutes using a UV curing machine (Black light, 1.5 J / cm 2 ), it was left to stand at about 50 °C for 30 minutes to form a cured product in disk form, and then it was measured with a thermal constant analyzer according to ISO22007-2 standard along the thickness direction of the cured product.

[0260] 4. Glass transition temperature The glass transition temperature (T g ) was measured using a differential scanning calorimeter (DSC) in accordance with ISO1135762. Specifically, the temperature of the sample was gradually increased at a constant rate using a differential scanning calorimeter to obtain a graph regarding the relationship between the temperature of the sample and the supplied heat flow. After connecting extension lines to the graphs before and after the portion where the slope of the graph changes abruptly, the glass transition temperature can be determined through the portion where the graph intersects when connecting the two extension lines. Here, the sample is the reactant (R1).

[0261] 5. Particle average particle size The particle average particle size of each filler contained in the filler component is the D50 particle size of the filler, which is the particle size measured using a Malvern MASTERSIZER 3000 instrument in accordance with the ISO-13320 standard. Distilled water was used as the solvent during measurement. The laser incident on the filler dispersed in the solvent is scattered, and the values of the intensity and directionality of the scattered laser change depending on the size of the filler. The D50 particle size can be determined by analyzing this using Mie theory. Through the above analysis, the distribution can be obtained by converting to the diameter of a sphere having the same volume as the dispersed filler, and through this, the D50 value, which is the median of the distribution, can be determined to evaluate the particle size.

[0262] 6. Weight average molecular weight and polydispersity index (PDI) The weight average molecular weight (Mw) was measured using GPC (Gel permeation chromatography). Specifically, the analysis target sample was placed in a 20 mL vial, diluted with a THF (tetrahydrofuran) solvent to a concentration of approximately 20 mg / mL, and then the calibration standard sample and the analysis sample were filtered through a syringe filter (pore size: 0.2 μm) and measured. As the analysis program, ChemStation of Agilent technologies was used, and the weight average molecular weight (Mw) could be determined by comparing the elution time of the sample with the calibration curve. The number average molecular weight (Mn) could also be determined in the same manner as the above-mentioned weight average molecular weight (Mw), and the polydispersity index (PDI) could be determined by dividing the measured weight average molecular weight (M w ) by the number average molecular weight (M n ).

[0263] <GPC Measurement Conditions> Equipment: 1200 series of Agilent technologies Column: TL Mix.A&B of Agilent technologies was used Solvent: THF Column temperature: 40 °C Sample concentration: 20 mg / mL, 10 μl injection MP: 364000, 91450, 17970, 4910, 1300 were used as standard samples The results of the measured test data were tabulated in Table 1 below.

[0264]

Table 1

[0265] Referring to Table 1 above, in Examples 1 to 5, by appropriately combining a photoinitiator and a thermal initiator and applying a cationic initiator and a radical initiator simultaneously as the photoinitiator, rapid curing can be achieved even at a relatively low temperature (fast curing), and a thick film having excellent curing properties can be formed. Also, referring to Table 1 above, it can be seen that Examples 1 to 5 ensure the target levels of adhesion and hardness by including an acrylic component containing an acrylic polymer component having an appropriate glass transition temperature.

[0266] Also, referring to Table 1 above, it can be seen that Examples 1 to 5 ensure an excellent level of thermal conductivity, rapid curing even at a relatively low temperature (fast curing), excellent curing properties, and at the same time ensure an excellent adhesion at the target level by appropriately controlling the ratio of the contents of the acrylic component and the filler component.

[0267] On the other hand, referring to Table 1 above, in Comparative Example 1, the proportion of the acrylic component content was high and the curing was incomplete. As a result, it has a relatively low hardness, the adhesion is lower than that of the examples, and it can be seen that an excellent level of thermal conductivity is not ensured because the ratio of the contents of the acrylic component and the filler component is not appropriately controlled.

[0268] Also, referring to Table 1 above, in Comparative Examples 2 to 4 where the photoinitiator and the thermal initiator were not appropriately combined, the curing reaction was induced under the same conditions as in the examples, but the curing was not completed. Specifically, the same conditions as in the examples mean the conditions of irradiating with UV (Ultra violet) light and then leaving it to stand at about 50°C for 30 minutes as described in the physical property measurement method.

[0269] Although not shown in Table 1 above, the composition produced by Comparative Example 4 was left to stand at about 50°C for 30 minutes without irradiating with UV light, but the curing was not completed. Although not shown in Table 1 above, when the composition produced by Comparative Example 4 was left at about 50°C for 60 minutes without irradiating it with UV light, curing was completed for the first time. The adhesive strength measured with reference to the adhesive strength measurement method in the physical property measurement method for the cured product was about 180 gf / 10 mm. Also, the thermal conductivity measured with reference to the thermal conductivity measurement method in the physical property measurement method for the cured product was about 3.050 W / mK.

[0270] In the case of Comparative Example 4, it can be seen that it takes some time until curing is completed. That is, when the initiator combination method of the present application is not applied, it can be seen that it is difficult to ensure excellent curing characteristics by curing rapidly at a relatively low temperature (fast curing).

Explanation of Signs

[0271] 10 Module case 10a Lower plate 10b Side wall 10c Upper plate 10d Guide part 20 Battery cell 30 Resin layer 50a Injection hole 50b Observation hole 40 Insulation layer 100 Pouch-type cell 110 Electrode assembly 120 Exterior material 121 Upper port 122 Lower port S Seal part

Claims

1. A curable composition comprising a resin component, a filler component, a photoinitiator, and a thermal initiator, wherein the resin component includes an acrylic polymer component containing units derived from a compound having a curable functional group, the resin component includes an acrylic monomer component containing a compound having a curable functional group, the acrylic monomer component includes a (meth)acrylate containing a hydroxy group, the filler component is present in the range of 60% to 98% by weight based on the total weight of the curable composition, the photoinitiator includes a radical initiator and a cationic initiator, The radical initiator (I Ｒ ), and the weight ratio of the cationic initiator (I Ｐ ), (I Ｒ / I Ｐ ) is in the range of 0.01 to 2, the thermal initiator has a half-life temperature of 60°C or higher for 10 hours, The curable composition is irradiated with ultraviolet rays for 3 minutes using a UV curing machine (Black light, 1.5 J / cm ２ ), maintained at 50 °C or lower for 50 minutes or less, and shows a Shore A hardness of 70 or more.

2. The curable composition according to claim 1, wherein the curable functional group includes one or more functional groups selected from the group consisting of an alkenyl group, an alkynyl group, a (meth)acrylate group, a carboxyl group, an amide group, an amino group, an epoxy group, an isocyanate group, a cyano group, an acid anhydride group, a mercapto group, a silanol group, an alkoxysilane group, a hydroxy group, and an oxazoline group.

3. The curable composition according to claim 1, wherein the acrylic polymer component includes units derived from a (meth)acrylate containing an alkyl group and units derived from a (meth)acrylate containing a hydroxy group.

4. The acrylic polymer component has a weight average molecular weight (M ｗ ) in the range of 30,000 to 200,000 g / mol and a polydispersity index (PDI) in the range of 1 to 4. The curable composition according to claim 3.

5. The curable composition according to claim 1, wherein the acrylic monomer component includes a (meth)acrylate containing an alkyl group.

6. The curable composition according to claim 1, wherein the glass transition temperature (Tg) of the partial polymer containing the acrylic polymer component is in the range of -50°C to 0°C.

7. The curable composition according to claim 1, which forms a cured product having a thermal conductivity of 2 W / mK or more.

8. Thermal initiator (I Ｈ ) and photoinitiator (I Ｕ ), the weight ratio (I Ｈ / I Ｕ ) is within the range of 0.01 to 5. The curable composition according to claim 1.

9. The curable composition according to claim 1, wherein the cationic curable component is 1% by weight or less based on the total weight.

10. A battery module including a module case having a lower plate and side walls forming an internal space, a plurality of battery cells present in the internal space of the module case, and a resin layer present in the internal space of the module case, wherein the resin layer is in contact with the plurality of battery cells and is also in contact with the lower plate or side walls of the module case, and the resin layer contains the curable composition according to claim 1.

11. Including two or more of the battery modules according to claim 10, The at least two or more battery modules are a battery pack that is electrically connected to each other.

12. An apparatus comprising the battery module according to claim 10.

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