Intermediate Ring Corrosion Compensation in a Substrate Processing System

JP7698094B2Active Publication Date: 2025-06-24LAM RES CORP
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Patent Information

Application Number
JP2024059272
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2024-04-02
Publication Date
2025-06-24
Estimated Expiration
2040-03-23

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Patent Text Reader

Abstract

To provide a substrate processing system that includes a substrate support assembly for supporting a semiconductor substrate during processing of the semiconductor substrate in the substrate processing system.SOLUTION: A substrate processing system includes: a surrounding top ring 200 of a pedestal in a processing chamber, the top ring arranged around a substrate support assembly 204. The top ring 200 is movable relative to the substrate support assembly. A mid ring 202 is arranged around the substrate support assembly and under a first edge ring. A plurality of lift pins 208 and actuators 209 are controlled by a system controller to compensate a height of the top ring 200 on the basis of corrosion of the top ring 200 and the mid ring 202.SELECTED DRAWING: Figure 2
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Citation Information

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