Liquid immersion cooling platform and its components

Abstract

An immersion cooling system and method for operating the system are described that may include a vessel configured to hold a thermally conductive and condensable dielectric fluid, a pressure controller for lowering or increasing an internal pressure of the vessel, a computer component configured to be at least partially submerged in the dielectric fluid, and a fluid circulation system configured to draw the dielectric fluid from a reservoir area of ​​the vessel and pass the dielectric fluid through a filter to deliver the dielectric fluid to a bath area of ​​the vessel.

Description

Technical Field

[0001] Cross - Reference to Related Applications This application is related to International Publication No. WO 2020 / 102090, titled "Liquid Immersion Cooling Platform", filed on November 11, 2019, owned by TMGCore, LLC, which is incorporated herein by reference. This application is further related to U.S. Provisional Patent Application No. 63 / 209,258, U.S. Provisional Patent Application No. 63 / 278,223, U.S. Provisional Patent Application No. 63 / 278,175, U.S. Provisional Patent Application No. 63 / 278,178, U.S. Provisional Patent Application No. 63 / 278,167, U.S. Provisional Patent Application No. 63 / 278,312, U.S. Provisional Patent Application No. 63 / 278,358, U.S. Provisional Patent Application No. 63 / 278,365, and U.S. Provisional Patent Application No. 63 / 278,330.

[0002] Field of Disclosure The present disclosure relates to a liquid immersion cooling system adapted to house a computing device, for example, a liquid immersion cooling system including a control system for optimizing the temperature of the system and a computing device therein.

Background Art

[0003] Conventional computing systems and / or server systems utilize air to cool various components of these systems. Conventional liquid - cooled or water - cooled computers utilize flowing liquid to remove heat from computer components, but avoid direct contact between the computer components and the liquid itself. The development of electrically non - conductive fluids and / or dielectric fluids has made it possible to utilize immersion cooling, where computer components and other electronic devices can be submerged in a dielectric liquid or an electrically non - conductive liquid to directly remove heat from the components to the liquid. Immersion cooling can be used to reduce the total energy required to cool computer components and can also reduce the space and equipment size required for sufficient cooling.

Summary of the Invention

[0004] The immersion cooling system is implemented for various computing requirements. Therefore, it is beneficial to describe an immersion cooling system that can be easily adapted for any hardware specifications of power, signals, data, and fluid inputs and outputs.

[0005] Advantageously, the present application relates to an exemplary immersion cooling system and a method for operating the system. In one exemplary embodiment, the system includes a vessel configured to hold a thermally conductive, condensable dielectric fluid, a pressure control device for reducing or increasing the internal pressure of the vessel, a computer component configured to be at least partially immersed in the dielectric fluid, and a fluid circulation system configured to draw the dielectric fluid from a sump area of the vessel, pass the dielectric fluid through a filter, and send the dielectric fluid to a bath area of the vessel.

[0006] In one exemplary embodiment, the system can include an inlet for receiving the dielectric fluid from a source outside the vessel. In one exemplary embodiment, the system can include a valve system for connecting or disconnecting the fluid circulation system to the inlet. In one exemplary embodiment, the fluid circulation system can include a pump. In one exemplary embodiment, the system can include a management system configured to instruct the valve system to operate in a first operating mode in which the pump is connected to the inlet and to instruct the pump to draw the dielectric fluid from the source. In one exemplary embodiment, the system can include a stowable hose including a sensor for detecting whether a stowable hose capable of being connected to the source is connected.

[0007] In one exemplary embodiment, the management system is configured to instruct the pump to draw dielectric fluid from a source only when a stowable hose is connected to the source. In one exemplary embodiment, the system can comprise a management system configured to instruct a valve system to operate in a second operating mode in which a pump is connected to a sump area and to instruct the pump to draw fluid from a source.

[0008] In one exemplary embodiment, the system can comprise a pressure control device including a heat exchanger having a plurality of pipes and at least one box. In one exemplary embodiment, the pressure control device can include a heat exchanger having a plurality of pipes and at least one box. In one exemplary embodiment, at least one of the plurality of pipes or at least one box can include a vibration damper. In one exemplary embodiment, the vibration damper can be a metal weight.

[0009] In one exemplary embodiment, the system can comprise a plurality of sensors and a management system configured to receive sensor data related to the temperature of computer components and to determine a filter failure based on the temperature of the computer components. In one exemplary embodiment, the sensor data can include the temperature of computer components, the power consumption at the vessel, the external temperature, the dielectric fluid temperature, the temperature of the incoming cooling medium, the temperature of the outgoing cooling medium, the flow rate of the cooling medium, the temperature of the area above the solution tank area, the number of computer components present in the vessel, or the location of each computer component within the vessel.

[0010] In one exemplary embodiment, the management system can be configured to determine whether a computer component is overheating using a machine learning model. In one exemplary embodiment, the machine learning model can be trained using sensor data received from the vessel.

[0011] In one exemplary embodiment, the pressure control device includes a bellows configured to receive a dielectric vapor. In one exemplary embodiment, the bellows can include a sensor for determining the volume of the bellows, and the management system can be configured to receive data from the sensor. In one exemplary embodiment, the management system can be configured to receive temperature data. In one exemplary embodiment, the management system can be further configured to determine the operating state of the vessel. In one exemplary embodiment, the operating state can be 1) start-up or shutdown of the heat exchanger, 2) combustion of the dielectric fluid, and 3) leakage of the dielectric fluid. In one exemplary embodiment, the management system can be further configured to use a machine learning model to determine the operating state of the vessel based on the data received from the sensor and the temperature data.

[0012] In one exemplary embodiment, the computer component can include a two-phase heat sink. In one exemplary embodiment, the two-phase heat sink can include a hollow box with a liquid medium and two elongated metal surfaces. In one exemplary embodiment, the vessel can be protected by a secondary layer. In one exemplary embodiment, the secondary layer can be parallel to the inner layer. In one exemplary embodiment, the fluid sensor can be provided between the secondary layer and the inner layer.

[0013] In one exemplary embodiment, the system can include a vessel configured to hold a dielectric fluid that is thermally conductive and condensable, a computer component configured to be at least partially immersed in the dielectric fluid, a chassis configured to hold the computer component and the dielectric fluid, and a fluid circulation system configured to draw the dielectric fluid from the sump area of the vessel, pass the dielectric fluid through a filter, and send the dielectric fluid to the chassis.

[0014] In one embodiment, the chassis can include a fluid connector for receiving a dielectric fluid from a fluid circulation system. In one embodiment, the fluid connector can be configured to open when the chassis is disposed within the vessel. In one embodiment, the fluid connector can be configured to close when the chassis is set to be removed from the vessel.

[0015] In one embodiment, the chassis can include a heat exchanger. In one embodiment, the heat exchanger can be configured to receive a cooling medium from a cooling medium connector. In one embodiment, the heat exchanger can be an electric heat exchanger. In one embodiment, the chassis can be opened such that the chassis is configured to hold the liquid level of the dielectric fluid and such that the vapor of the dielectric fluid can exit the chassis and enter the vessel.

[0016] In one embodiment, the system can include a fluid level sensor for determining the liquid level of the dielectric fluid. In one embodiment, the fluid level sensor can be located within the chassis. In one embodiment, the system can include an inlet for receiving a dielectric fluid from a source outside the vessel.

[0017] In one embodiment, the system can include a valve system for connecting or disconnecting the fluid circulation system to the inlet. In one embodiment, the fluid circulation system can include a pump. In one embodiment, the system can include a management system configured to direct the valve system to operate in a first operating mode when the liquid level of the dielectric fluid drops below a threshold amount and to direct the pump to draw the dielectric fluid from the source.

[0018] In one embodiment, the supply source can include a supply source fluid level sensor. In one embodiment, the management system can be configured to send a signal to the central server when the supply source fluid level drops below a threshold amount. In one embodiment, the threshold amount is a height level for a dielectric fluid. In one embodiment, the threshold amount is the amount of fluid necessary to operate the system over a predetermined period determined by artificial intelligence.

[0019] In one exemplary embodiment, the system can include an inlet for receiving a dielectric fluid from a supply source outside the vessel. In one exemplary embodiment, the system can include a valve system for connecting or disconnecting a fluid circulation system to the inlet. In one exemplary embodiment, the fluid circulation system can include a pump. In one exemplary embodiment, the system can include a management system configured to instruct the valve system to operate in a first operating mode with the pump connected to the inlet and to instruct the pump to draw the dielectric fluid from the supply source. In one exemplary embodiment, the system can include a stowable hose including a sensor for detecting whether a stowable hose is connected to the supply source.

[0020] In one exemplary embodiment, the management system is configured to instruct the pump to draw the dielectric fluid from the supply source only when a stowable hose is connected to the supply source. In one exemplary embodiment, the system can include a management system configured to instruct the valve system to operate in a second operating mode with the pump connected to the sump area and to instruct the pump to draw fluid from the supply source.

[0021] In one exemplary embodiment, the computer component can be connected to one or more adapters that can include releasable rails. In one embodiment, the computer component can slide into the rack using the rails.

[0022] In one embodiment, the system can include a tank for holding a dielectric fluid that is thermally conductive and condensable, a pressure control device for reducing or increasing the internal pressure of the tank, a computer component that can be at least partially immersed in the dielectric fluid, a condenser for condensing the gaseous-phase dielectric fluid, a robot that can pick up the computer component, and a Raman spectrometer operably connected to the control device. In one embodiment, the control device can receive test results from the Raman spectrometer and trigger corrective measures based on the test results.

[0023] In one embodiment, the system can include a tank configured to hold a dielectric fluid that is thermally conductive and condensable, where the tank can be operably connected to a bellows, a rack configured to hold one or more computer components at least partially immersed in the dielectric fluid, a condenser for condensing the gaseous-phase dielectric fluid, a metal holding plate configured to be attached to the bottom of the tank, and a plurality of filler plates configured to be removably attached to the metal holding plate and positioned below one or more computer components within the rack.

[0024] In one embodiment, the system can include a tank configured to hold a dielectric fluid that is thermally conductive and condensable, where the tank is operably connected to a bellows, a rack configured to hold one or more computer components at least partially immersed in the dielectric fluid, a condenser for condensing the gaseous-phase dielectric fluid, a platform configured to be attached to the bottom of the tank using a buffer device, and a vehicle configured to provide power and data connectivity to the tank.

[0025] The exemplary system can further include a battery for providing power and an antenna for providing data connectivity to the tank. In the exemplary system, the buffer device can be a spring. In the exemplary system, the vehicle can include a heat outlet for transferring heat from a condenser outside the tank.

[0026] This summary is provided to introduce a selection of concepts in a simplified form that will be further described in detail in the detailed description. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.

[0027] For the purpose of explaining the manner in which the above-recited or other advantages and features can be achieved, the subject matter briefly described above will be described in more detail with reference to the specific embodiments shown in the accompanying drawings. While these drawings depict only typical embodiments and are not to be considered limiting, the embodiments will be described and explained in more specific and detailed manner using the accompanying drawings.

Brief Description of the Drawings

[0028]

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[0029] Next, exemplary embodiments of the present invention will be described to illustrate various features of the present invention. The embodiments described herein are not intended to limit the scope of the present invention, but rather are intended to provide examples of the components, uses, and operations of the present invention.

[0030] Immersion Cooling System In one exemplary embodiment, an immersion cooling system or vessel can include a solution tank area, a reservoir area, a computing device, a robot, a pressure control system, and a management system. The vessel can be a pressure control tank maintained at (or within) atmospheric pressure that can be cooled using a heat exchanger. The computing device can be immersed in a dielectric fluid within the solution tank area of the vessel. The computing device can be connected to a network and can perform various processing and computing tasks while being immersed in the dielectric fluid. The vessel can include a lid for accessing the solution tank area, the computing device, and the reservoir area. The vessel can be fluidly coupled to a pressure control system. The robot can lift the computing device out of the solution tank area of the vessel when the lid is open. The robot can place the lifted computing device in a magazine provided for storage of the computing device or on a vehicle. The robot can further lift the computing device from the magazine (or vehicle) and place the computing device at the location of the computing device lifted from the solution tank area. The robot can be mounted on the vessel, the vehicle, or another location.

[0031] In one embodiment, the management system can be configured with or without software and can be configured to receive any data generated by any of the sensors included in the immersion cooling system. In one embodiment, the management system can make adjustments, provide warnings, and / or take other appropriate actions, for example, based on sensor readings. For example, the management system can adjust or control a heating element, adjust a fluid flow or temperature, adjust a pressure, adjust a fluid level, fluid purity, and / or any number of other system parameters. Such adjustments are often based on one or more sensed parameters of the immersion cooling system.

[0032] FIG. 1 shows an immersion cooling system 100 according to an exemplary embodiment of the present disclosure. In this exemplary embodiment, the immersion cooling system 100 can include a vessel 105 and a vehicle 130. The vessel 105 can comprise a tank 110 including a solution tank area 111, a sump area 112, a fluid 113, computer components 114, a pump 115, a filter 118, a door 116, a management system 117, a heat exchanger 119, and a through-plate 120. The computer components 114 can be submerged in the fluid 113. The vehicle 130 can include a robot 131. The robot 131 can lift the computer components 114 when the door 116 is open and can place the computer components 114 on top of the vehicle 130.

[0033] Fluid Transfer System In one exemplary embodiment, the vessel can include a fluid transfer system for receiving a dielectric fluid from a source outside the tank and / or for removing fluid from the tank for the purpose of discarding the fluid outside the tank. Often, dielectric fluids are delivered in large containers. Transferring the fluid from these containers to the tank of the immersion cooling system can be cumbersome and time consuming. In some cases, external pumps and hoses are used to transfer the fluid from the container to the tank. However, the dielectric fluid can spill or evaporate because these components may not be properly sealed, and thus be wasted. Further, because the pumps and hoses are outside the tank system, these components can collect dust and debris, which are harmful to the dielectric fluid and even to the computing components cooled by the dielectric fluid.

[0034] In one exemplary embodiment, the fluid transfer system can include an inlet, a pump, and various pipes connecting the inlet to the pump and the tank (e.g., a solution tank area or a sump area). In this exemplary embodiment, the inlet can be removably connected to the container using a hose. The pump can draw the dielectric fluid from the container through the inlet using a hose. The pump can then transfer the fluid to the tank (e.g., a solution tank area or a sump area) using a pipe connecting the pump to the tank. In one exemplary embodiment, the pump can be configured to draw fluid from the tank and transfer the fluid outside the tank through the inlet. In one example, the pump can be a bidirectional pump, e.g., in one operating mode, the pump can draw fluid from the container, and in a second operating mode, the pump can draw fluid from the tank.

[0035] In one exemplary embodiment, the fluid transfer system can include a plurality of inlets and / or outlets, with each inlet and / or outlet being connected to a pump. For example, an inlet can be dedicated to drawing fluid from a container. In this example, the pump can draw in the fluid and transfer it to a tank. As another example, an inlet (or an outlet) can be dedicated to transferring fluid out of a tank using a pump. In one embodiment, the transfer system can include a plurality of inlets, and two or more of the inlets can be connected to a pump. In this example, the pump can be fluidly connected to two or more of the inlets through a valve system configured to connect one or more of the inlets to the pump. The pump can be configured to draw fluid from a container or to transfer fluid out of a tank.

[0036] In one exemplary embodiment, the fluid transfer system can include a filter. In this exemplary embodiment, the fluid transfer system can pass a dielectric fluid through the filter before sending the fluid to a tank. As another example, the fluid transfer system can pass a dielectric fluid through the filter when the system transfers fluid outside of a tank.

[0037] In one exemplary embodiment, the fluid transfer system can include a plurality of operating modes. In a first operating mode, the fluid transfer system can draw fluid from a container located outside the tank. The fluid transfer system can optionally pass the fluid through a filter before sending the fluid to the tank. In this example, the filter can be located upstream or downstream of the pump. In a second operating mode, the fluid transfer system can draw fluid from the tank and transfer the fluid outside the tank. The fluid transfer system can optionally pass the fluid through a filter before sending the fluid outside the tank. In this example, the filter can be located upstream or downstream of the pump. In a third operating mode, the fluid transfer system can circulate the fluid within the tank. For example, the pump can draw fluid from the sump area and transfer the fluid to the solution tank area. As another example, the pump can draw fluid from the solution tank area and transfer the fluid to the sump area. The fluid transfer system can optionally pass the fluid through a filter. In this example, the filter can be located upstream or downstream of the pump.

[0038] In one exemplary embodiment, the fluid transfer system can include a plurality of pumps, a valve system, and one or more inlets and / or outlets. In one example, the valve system can use pipes to connect any inlet and / or outlet to any pump. In one example, the valve system can connect any pump to a solution tank area and / or a reservoir area. In this exemplary embodiment, the management system can include a user interface. The user interface can be located on the vessel or can be located remotely from the vessel (e.g., connected through a network such as the Internet). The user interface can be used for the user to give instructions to the fluid transfer system to start or stop any pump, and to give instructions to the valve system to connect the pump to any specific area and / or inlet / outlet.

[0039] FIG. 2 shows a liquid immersion cooling system 200 according to an exemplary embodiment of the present disclosure. In this exemplary embodiment, the liquid immersion cooling system 200 can include an inlet 230, a valve system 240, a pump 215, and a filter 218. The pump 215 and / or the valve system 240 can be in communication with the management system 117, such that the pump 215 and / or the valve system 240 can receive signals and commands from the management system 117. The inlet 230 can be in fluid communication with the valve system 240 using a pipe. The valve system 240 can be connected to the reservoir area 112 and the pump 215 using pipes. The valve system 240 can be a three-way valve that can fluidly connect the pump 215 to the inlet 230 or the reservoir area 112. The inlet 230 can be connected to a container 260 outside the tank 110, for example, using a hose 250.

[0040] In one operating mode, the management system 117 can issue a command to the valve system 240 to connect the inlet 230 to the pump 215. In this operating mode, the pump 215 can draw fluid from the container through the inlet 230 and transfer the fluid to the solution tank area 111. In another operating mode, the management system 117 can issue a command to the valve system 240 to connect the storage tank area 112 to the pump 215. In this operating mode, the pump 215 can draw fluid from the storage tank area 112 and transfer the fluid to the solution tank area 111.

[0041] In this exemplary embodiment, the filter 218 is located upstream of the pump 215. The filter 218 can filter the incoming fluid when the pump 215 draws fluid from the inlet 230 or the storage tank area 112. Other arrangements are possible. For example, the filter 218 can be bypassed in certain operating modes but used in other operating modes. As another example, the filter 218 can be arranged downstream of the pump 215.

[0042] In one exemplary embodiment, the hose 250 can be a stowable hose that can be stored within the vessel 105. In this exemplary embodiment, when it is necessary to draw a dielectric fluid from the container 260, the user can pull the hose 250 out of the vessel 105 and connect the hose 250 to the container 260. In one exemplary embodiment, the hose 260 can include a sensor 255 that can be activated, for example, when the hose 250 is pulled out of the vessel 105 or when the hose 250 is connected to the container 260. In this exemplary embodiment, the sensor can be in communication with the management system 117.

[0043] In one exemplary embodiment, the management system 117 may need to pull the hose 250 out or connect the hose 250 to the container 260 before allowing the pump 215 to draw fluid from the container 260. In this exemplary embodiment, when the valve system 240 is in a mode where the inlet 230 is connected to the pump 215, the management system may need to pull the hose 250 out or connect the hose 250 to the container 260. In one exemplary embodiment, when the valve system 240 is in a mode where the storage tank area 112 is connected to the pump 215, the management system 117 may not interfere with the operation of the pump 215, i.e., the pump 215 can draw fluid from the storage tank area 112.

[0044] In one exemplary embodiment, the management system 17 can issue a command to the valve system 240 to connect the pump 215 to the inlet 230 when a trigger condition is met. An exemplary trigger condition can be a change in the acidity of the dielectric fluid 113. In this exemplary embodiment, the vessel 105 can include a sensor capable of determining the acidity of the dielectric fluid 113. If a change in acidity is detected, there is a risk that the computer component 114 may be damaged. Therefore, the management system 117 can quickly discard the fluid 113, for example, pump the fluid 113 from the solution tank area 111 to the outside of the tank 110.

[0045] In one exemplary embodiment, the trigger condition can be a change in the fluid level within tank 110. In this exemplary embodiment, vessel 105 can include a fluid level sensor. When the fluid level within tank 110 or within sump area 111 drops below a threshold amount, management system 117 can draw in fluid. For example, if there is fluid present in sump area 112 as an example, management system 117 can issue a command to valve system 240 to connect sump area 112 to pump 215. As another example, if hose 250 is connected to container 260 for example, management system 117 can issue a command to inlet 230 for pump 215. Management system 117 can further issue a command to pump 215 to draw in fluid to increase the fluid level within the tank.

[0046] Vibration Control System In one exemplary embodiment, a heat exchanger within an immersion cooling system can include a plurality of pipes that can receive a cooling medium from a source outside of the vessel. The cooling medium can move through the pipes and can condense vapor within the vessel, for example, above the sump area. In one exemplary embodiment, the pipes can be connected to boxes on each side of the pipe. Each box can be fluidly connected to a source of the cooling medium. In some operating modes, the cooling medium can move through the pipes and boxes at a high flow rate that can generate stress on the boxes and / or pipes and can generate vibrations within the boxes and / or pipes. Often, the boxes and / or pipes are connected to each other and to other structures via welding. The stress and vibrations can cause mechanical failures within the system. For example, the welded connection of any one of the pipes and boxes can be severed, thereby allowing the cooling medium to leak into the sump area of the vessel. When the cooling medium is mixed with a dielectric fluid, the quality of the dielectric fluid can degrade and electrical failures can occur subsequently.

[0047] Thus, in one exemplary embodiment, one or more vibration dampers are provided at one or more boxes or pipes to nullify the detrimental effects of stress and vibration on the pipes or boxes. In one exemplary embodiment, the vibration damper can be a mass or a weight, for example, a metallic mass. In one example, the pipe can include a vibration sensor for measuring the vibration of the pipe, and when the vibration exceeds a threshold, the vibration sensor can send a signal to a management system. Upon receiving the signal, the management system can display a warning notification to the operator of the liquid immersion cooling system, or the management system can send a notification to a central server, for example, indicating that the system requires inspection and repair.

[0048] FIG. 3 shows a liquid immersion cooling system 300 according to an exemplary embodiment of the present disclosure. In this exemplary embodiment, the liquid immersion cooling system 300 includes a vessel 305. The vessel 305 can include computer components 314, a robot 331, and a heat exchanger 319. The heat exchanger 319 can include a plurality of pipes (or coils) 361, a box 362, and a damper 363. In this exemplary embodiment, the damper 363 can be a metallic weight. The damper 363 can also be made of other substances, such as, for example, plastic, polycarbonate, or any material compatible with a dielectric fluid. In one exemplary embodiment, the damper 364 can be attached to the pipe. In one exemplary embodiment, the damper can be present inside or outside the pipe or box.

[0049] Fluid Quality Detection Device In one exemplary embodiment, the immersion cooling system can include a dielectric fluid within a solution tank area. The solution tank area can further include one or more computer components that are submerged within the solution tank area, and other components such as wires, electrical circuits, connectors, etc. These components can contain dust, debris, grease, and other contaminants that can be washed away using the dielectric fluid and thus can contaminate the dielectric fluid. When components that generate heat in the computer components (e.g., CPU, GPU, or RAM) evaporate the contaminated fluid, these contaminants can accumulate as residues on these heat-generating components. However, the residues can reduce the heat transfer of the heat-generating components, i.e., the rate at which heat can be transferred from the heat-generating components to the dielectric fluid can be reduced. Thus, the heat-generating components can potentially overheat.

[0050] Filtration can be used to manage contamination within the tank. However, filters can lose their effectiveness over time. Currently, there are no sensors that can accurately determine whether a filter has developed a defect in its effectiveness and provide live data. Pressure sensors can be used to check for pressure drops within the filter, but these changes are not significant enough to detect even a slight degradation in filtration quality. Periodically analyzing the fluid through testing can indicate whether the fluid has become contaminated (and thus, whether the filter has ceased to operate as intended), but these tests do not provide live data.

[0051] According to an exemplary embodiment, the temperature of a heat-generating component can be used as an indicator of whether the dielectric fluid contains contaminants and whether the filter has become unable to clean the fluid. In one exemplary embodiment, each computer component can determine the temperature for the component (e.g., using a thermometer, sensor, power consumption information, or other device, technique or information). The computer component can send this information to a management system. The management system can receive temperature information from a plurality of computer components.

[0052] In addition, the management system can receive additional information such as, for example, the power consumption at the vessel, the external temperature, the external pressure, the temperature of the dielectric fluid, the temperature of the incoming cooling medium, the temperature of the outgoing cooling medium, the flow rate of the cooling medium, the temperature of the area above the solution tank area, the number of computer components present in the vessel, the location of each computer component within the vessel, etc. Some or all of this information (and / or other information) can be provided to a model to make predictions regarding the temperature of each (or some) computer component. When the temperature of a computer component exceeds a predicted temperature by more than a threshold value, the management system can indicate that the computer component is overheating.

[0053] Depending on the number of overheated computer components, the management system can infer various conclusions. For example, if only one of the computer components is overheated, the management system can infer that the overheated computer component requires manual inspection. On the other hand, if the majority (e.g., more than 50%) of the computer components are overheated, the management system can infer that the dielectric fluid is contaminated and / or the filter needs to be replaced. One skilled in the art will recognize that the management system can draw similar conclusions based on various numbers of overheated computer components. In one embodiment, if the number of overheated components is less than a first threshold, the management system can indicate that the overheated computer component requires manual inspection. In another embodiment, if the number of overheated computer components exceeds a second threshold, the management system can infer that the quality of the dielectric fluid has deteriorated and / or the filter needs to be replaced.

[0054] In one exemplary embodiment, the model can be a machine learning model. The model can be trained using past data received from the vessel or other vessels. The data can include, for example, the temperature of each computing component, the power consumption at the location of the vessel, the external temperature, the temperature of the dielectric fluid, the temperature of the incoming cooling medium, the flow rate of the outgoing cooling medium, the flow rate of the cooling medium, the temperature of the area above the solution tank area, the number of computer components present in the vessel, or the location of each computer component within the vessel. These data (and / or other data) can be used to train the machine learning model to predict the temperature for the computer components.

[0055] In one exemplary embodiment, a sensor can be used to determine whether a fluid is contaminated. For example, the sensor can include a heater, a surface, or a thermometer. The heater can generate a predetermined amount of heat. In one example, the thermometer can provide data regarding the temperature of the surface to the model. Based on the variation in the temperature of the surface at a given amount of heat, the model can predict whether the sensor is overheating and / or whether contaminants are present in the fluid.

[0056] Heat Exchanger Control Device and Detection System In one exemplary embodiment, a immersion cooling system can include a pressure control system. The pressure control system can include a heat exchanger, a bellows, and a vapor - air separator. In one example, when computer components generate heat, the dielectric fluid evaporates and the pressure in the tank increases. The management system can perform one or more procedures in response to the evaporation and the increase in pressure. For example, the management system can direct the heat exchanger to circulate the cooling medium at a higher rate so as to allow the vapor to condense and the pressure to decrease. As another example, the management system can open a valve to the vapor - air separator so that a portion of the air in the tank will be released and thus the pressure will decrease again. As another example, the management system can open a valve so as to allow the excess vapor to be directed to the bellows and the pressure in the tank to decrease.

[0057] In one embodiment, the immersion cooling system can operate at atmospheric pressure. The processing demand for computer components (and thus the power consumed by the computer components) can be unpredictable. When the processing demand for the computer components varies, the computer components can generate dielectric vapor or the dielectric vapor can condense (i.e., become a liquid). Due to the tank having a fixed volume, the bellows can expand or contract its volume to maintain the internal pressure of the tank at atmospheric pressure. Thus, the bellows can be prepared for both receiving dielectric vapor and returning the vapor to the tank. For example, when the processing demand rises sharply, the bellows can receive dielectric vapor, and when the processing demand drops, the bellows can return the vapor to the tank. For optimal performance of the bellows, i.e., to effectively receive vapor from the tank and release the vapor to the tank if necessary, the bellows can be in a positively biased state. For example, the bellows can be filled to about 50% during normal operation. Other biasing states are possible. For example, if a sharp rise in processing demand rather than a drop in processing demand is expected, the bellows can be filled to about 30%, for example, less than half.

[0058] In one exemplary embodiment, the management system can utilize the ideal gas law, i.e., PV = nRT, to make predictions regarding at least one state of the immersion cooling system and / or to implement responsive procedures. For example, the immersion cooling system can include a plurality of sensors, including a temperature sensor located within the tank and a sensor for determining a change in the volume of the bellows (e.g., a sensor for determining a change in the height of the bellows). The management system can receive data from each sensor.

[0059] When the temperature sensor indicates an increase in the temperature of the tank and the volume sensor indicates an increase in the volume of the bellows, the management system can determine that steam has been generated in the tank and that the heat exchanger can be activated (i.e., the flow rate of the cooling medium can be increased). In this exemplary embodiment, the volume of the bellows can be controlled by adjusting the amount of the cooling medium circulating in the heat exchanger. For example, an increase in the flow rate of the cooling medium can condense the steam and reduce the volume of the bellows. Similarly, when the temperature sensor indicates a decrease in the temperature of the tank and the volume sensor indicates a reduction in the volume of the bellows, the management system can determine that steam is condensing in the tank and that the heat exchanger can be deactivated (i.e., the flow rate of the cooling medium can be decreased). In this exemplary embodiment, the volume of the bellows can be controlled by adjusting the amount of the cooling medium circulating in the heat exchanger. For example, a decrease in the flow rate of the cooling medium can allow more steam to be generated and increase the volume of the bellows.

[0060] In one embodiment, the flow rate of the cooling medium can be adjusted based on the volume of the bellows and / or the rate of change of the volume of the bellows. In one embodiment, the flow rate of the cooling medium can be adjusted based on the temperature of the tank and / or the rate of change of the temperature of the tank. The temperature of the tank can be the temperature of the dielectric fluid or the temperature of the steam, and the temperature sensor can be located anywhere within the tank.

[0061] In one exemplary embodiment, based on a change (or lack of change) in the temperature of the tank and / or a change (or lack of change) in the volume of the bellows, the management system can determine if there is a leak within the system or if the dielectric fluid is burning. In one embodiment, when the dielectric fluid or steam leaks from the tank, the pressure of the tank can decrease at any given operating condition of the tank (e.g., temperature, power consumption, etc.). In one embodiment, when the dielectric fluid burns, the pressure of the tank can increase at any given operating condition of the tank.

[0062] In one embodiment, when the temperature of the tank does not change but the volume of the bellows increases, the management system can infer that the dielectric fluid is burning. In one embodiment, when the temperature of the tank does not change but the volume of the bellows decreases, the management system can infer that the dielectric fluid is leaking from the tank.

[0063] In one embodiment, when the temperature of the tank rises but the volume of the bellows increases at a pace higher than a predetermined pace, the management system can infer that the dielectric fluid is burning. In one embodiment, when the temperature of the tank rises but the volume of the bellows increases at a pace lower than a predetermined pace, the management system can infer that the dielectric fluid is leaking. In one embodiment, when the temperature of the tank rises and the volume of the bellows increases at a predetermined pace, the management system can infer that the heat exchanger needs to be activated (or that the flow rate of the cooling medium needs to be increased).

[0064] In one embodiment, when the temperature of the tank drops but the volume of the bellows decreases at a pace lower than a predetermined pace, the management system can infer that the dielectric fluid is burning. In one embodiment, when the temperature of the tank drops but the volume of the bellows decreases at a pace higher than a predetermined pace, the management system can infer that the dielectric fluid is leaking. In one embodiment, when the temperature of the tank drops and the volume of the bellows decreases at a predetermined pace, the management system can infer that the heat exchanger needs to be stopped (or that the flow rate of the cooling medium needs to be reduced).

[0065] In one exemplary embodiment, the predetermined pace can be determined by a machine learning model. The machine learning model can receive data from the management system and various sensors within the immersion cooling tank in previous operating cycles and can determine the predetermined pace based on parameters recorded for previous operating states. The predetermined pace can be, for example, the predicted rate of change of temperature or volume based on the most recent operating state received by the model.

[0066] In one exemplary embodiment, the immersion cooling system can discharge gas. For example, using a vapor - air separator, the system can collect the dielectric vapor and release the air. In one example, the immersion cooling system can perform the procedures described above while the tank has not discharged any gas. In one example, the immersion cooling system can perform the procedures described above while the tank has reached a steady state, such as after the tank has discharged air or after the tank has reached a steady temperature over a predetermined period.

[0067] In one exemplary embodiment, the immersion cooling system can determine the volume of air discharged from the tank. In this exemplary embodiment, the volume change of the bellows can be determined after the air has been discharged from the immersion cooling system. The management system can use the volume change as a benchmark to determine the amount of air released from the system. In particular, the management system can receive sensor data indicating the concentration of vapor in the tank. Using the concentration and the volume change, the management system can consider a portion of the volume change to be due to the air released from the tank and another portion of the volume change to be due to the vapor.

[0068] FIG. 4 shows an immersion cooling system 400 according to an exemplary embodiment of the present disclosure. In this exemplary embodiment, the immersion cooling system 400 can include a vessel 405 that can include a tank 410. The tank 410 can include a sump area 411, a reservoir area 412, a fluid 413, computer components 414, a pump 415, a filter 418, a door 416, a management system 417, a heat exchanger 419, and a through - plate 420. The computer components 414 can be submerged in the fluid 413.

[0069] The tank 410 can be connected to the discharge device 440, the discharge device 440 can be connected to the bellows 430, and further can be connected to the vapor - air separator 460 through the pressure control valve 450. In this exemplary embodiment, the vapor - air separator 460 can be connected to the vapor condenser 470, and the vapor condenser 470 can be connected to the desiccant 480. The desiccant 480 can be connected to the air inlet / outlet 490. The exemplary tank 410 can include one or more of the above - mentioned components.

[0070] In this exemplary embodiment, the tank 410 can include a volume sensor 431 within the bellows 430 and a temperature sensor 432 within the tank 410. The volume sensor 431 and the temperature sensor 432 can provide data to the management system 417. For example, the data can include the latest volume of the bellows 430 and the temperature of the tank 410. Using the data, the management system 417 can calculate the rate of change of the volume of the bellows 430 and the rate of change of the temperature of the tank 410. If the rate of change of the volume deviates from the expected rate of change of the volume (e.g., a predetermined rate) or conforms to the expected rate (e.g., a predetermined rate), the management system can determine, for example, that the heat exchanger needs to be started or stopped, that the tank is leaking, or that the dielectric fluid is burning. If the tank is leaking or the dielectric fluid is burning, the management system can send a warning signal. As an example, the warning signal can be sent to the user interface of the vessel 405. As another example, the warning signal can be sent to a remote monitoring station.

[0071] Heat Sink Consisting of Two Phases In one exemplary embodiment, the computer components of the immersion cooling system can be attached to a heat sink. The heat sink can assist in transferring heat from the computer components to the dielectric fluid within the tank of the immersion cooling system. In one exemplary embodiment, the heat sink can be a solid copper sheet that can be attached to the computer components. In one exemplary embodiment, the heat sink can be a two-phase heat sink.

[0072] In one example, the two-phase heat sink can be a hollow box that can contain a liquid medium inside. In one example, the hollow box can include two elongated sides, each of which can be made of a metal having high thermal conductivity, such as copper or silver for example. In one example, the two-phase heat sink can receive heat from a computer device on one of the elongated sides. The heat can evaporate the liquid medium inside the heat sink. The vapor can reach the other elongated side and transfer its heat there. Thus, the vapor can be cooled and / or condensed. The two-phase heat sink can enable more effective thermal conductivity across all surfaces of the heat sink. Exemplary liquid media can include water, alcohol, ammonia, or even a dielectric fluid.

[0073] FIG. 5 shows an exemplary two-phase heat sink according to an exemplary embodiment. In this exemplary embodiment, a computer component 520 can be attached to the heat sink 510. The heat sink 510 can include metal plates 512 and 513 on the elongated sides of the heat sink 510. The heat sink 510 can further include a liquid medium 511. On one side, the heat sink 510 can be in thermal contact with the computer component 520 (through the metal plate 513), and on the other side, the heat sink 510 can be in thermal contact with the dielectric fluid 530 provided within the tank of the immersion cooling system (through the metal plate 512).

[0074] The heat generated by the computer component 520 can be transferred to the metal plate 513 and then can be transferred to the liquid medium 511. When the liquid medium 511 contacts the other metal plate 512, the liquid medium 511 can transfer its heat to the metal plate 512. Then, the metal plate 512 can transfer its heat to the dielectric fluid 530. In one embodiment, the heat generated by the computer component 520 may be irregularly dispersed. The heat sink 510 can receive the heat that is irregularly dispersed on one metal plate and can effectively transfer this heat to the other metal plate. The heat conductivity of the heat sink can be increased by the uniform dispersion of heat on the other metal plate.

[0075] Secondary Pollutant System One concern regarding immersion cooling systems is that the fluid may leak from the tank due to a malfunction or accident. In one exemplary embodiment, the immersion cooling system can include a secondary layer over the vessel and / or tank. The secondary layer can provide an additional protective layer for the vessel and / or tank.

[0076] In one exemplary embodiment, the secondary layer can serve as a wall for the vessel and / or tank. A separation region may exist between the secondary layer and the inner layer for the vessel and / or tank. In one exemplary embodiment, a fluid detection sensor can be provided in the separation region between the secondary layer and the inner layer. The fluid detection sensor can be in communication with a management system, and when there is any fluid leakage between the inner layer and the secondary layer, the management layer can send a warning signal to, for example, a user interface or a remote monitoring station. In one embodiment, the secondary layer can be a tab or tray under the tank. In this embodiment, if the fluid leaks from the tank, the fluid can accumulate in the tab or tray.

[0077] FIG. 6 shows an exemplary liquid immersion cooling system including an inner layer and a secondary layer. In this exemplary embodiment, the liquid immersion cooling system 600 can include a vessel 605 that can include a tank 610. The vessel 605 can include a sensor 625 for detecting fluid leakage.

[0078] The vessel 605 can include an inner layer 623, a secondary layer 621, and a separation region 630. The secondary layer can surround the vessel 605 and the inner layer 623. In one embodiment, the secondary layer 621 can cover only one side (or multiple sides) of the vessel 605 and the inner layer 623. In one embodiment, the tank 610 can include an inner layer 624, a secondary layer 622, and a separation region. In this embodiment, the secondary layer 622 can cover only one side (or multiple sides) of the tank 610 and the inner layer 624. In one embodiment, a sensor can be provided in the separation region between the secondary layer 622 and the inner layer 624.

[0079] In one exemplary embodiment, each secondary layer can be parallel to the inner layer. In one embodiment, one or more columns can be present between the inner layer and the secondary layer.

[0080] Chassis Base Cooling System In one exemplary embodiment, the immersion cooling system can be made to utilize less dielectric fluid, for example, by providing the dielectric fluid within the chassis for each computer component. The exemplary immersion cooling system or vessel can include a storage area, a sump area, computer components, a robot, an (optional) pressure control system, and a management system. The vessel can be a pressure control tank maintained at (or within) atmospheric pressure that can be cooled using a (optional) heat exchanger. The computer components can be disposed within the chassis, and the chassis can receive the dielectric fluid through a fluid connector. The computer components can be connected to a network and can perform various processing and computing tasks while the dielectric fluid is present within the chassis. The vessel can include a lid for accessing the storage area, the computer components, and the sump area. The vessel can be (optionally) fluidly coupled to a pressure control system. The robot can lift the computer components from the storage area of the vessel when the lid is open. The robot can place the lifted computer components within a magazine provided for storage of the computer components or on a vehicle. The robot can further lift the computer components from the magazine (or vehicle) and place the computer components at the location of the computer components lifted from the storage area. The robot can be mounted to the vessel, the vehicle, or another location. In one example, the dielectric fluid can be provided within the solution tank area of the vessel.

[0081] FIG. 7 shows a liquid immersion cooling system 700 according to an exemplary embodiment of the present disclosure. In this exemplary embodiment, the liquid immersion cooling system 700 can include a vessel 705 and a vehicle 130. The vessel 705 can include a tank 710 that includes a storage area 711, a sump area 112, a fluid 113, computer components 114, a pump 115, a filter 118, a door 116, a management system 117, a heat exchanger 719, a through-plate 120, a fluid connector 721, a chassis 722, and a vapor 723. The chassis 722 can be disposed within the storage area 711. The chassis 722 can receive a dielectric fluid from the fluid connector 721, and the computer components 114 can be submerged in the fluid 113 within the chassis 722. The vehicle 130 can include a robot 131. The robot 131 can lift the computer components 114 when the door 116 is open and can place the computer components 114 on top of the vehicle 130. In one example, the sump area 112 can be sealed from the tank 710 or other areas of the vessel 105.

[0082] Chassis with Fluid Connector In one exemplary embodiment, the chassis 722 can include a chassis heat exchanger. In this exemplary embodiment, the chassis 722 does not release the vapor 723. Instead, the chassis 722 cools the vapor 723 for condensation. In this exemplary embodiment, the chassis heat exchanger can be an exchanger that receives a cooling medium through, for example, a fluid connector or the like to remove heat from the chassis 722. The cooling medium can be, for example, water. The cooling medium can be cooled within the tank using, for example, the heat exchanger 719 or can be transferred to cooling facilities outside the tank. In this exemplary embodiment, the chassis 722 can be a self-sustaining device that receives a dielectric fluid and a cooling medium from one or more fluid connectors 721 to cool the computer components 114. The chassis 722 can further receive power and data through various connectors.

[0083] FIG. 8 shows an exemplary chassis 722 according to an exemplary embodiment of the present disclosure. In this exemplary embodiment, the chassis 722 can include computer components 114, a chassis heat exchanger 810, a coolant connector 821, a coolant transfer pipe 822, a fluid connector 721, and one or more other connectors 823. Fluid 113 (e.g., a dielectric fluid) can enter the chassis 722 through the fluid connector 721. The computer components 114 can be immersed in the fluid 113 when the chassis has a sufficient amount of the dielectric fluid. In one embodiment, the coolant can enter the chassis 722 through the coolant connector 821 and can be transferred to the chassis heat exchanger 810 through the coolant transfer pipe 822. When the computer components 114 generate heat, the fluid 113 can evaporate and rise within the chassis 722. The vapor 723 can reach the heat exchanger 810 and lose its heat. This enables the vapor 723 to condense, and the heat from the vapor 732 can be transferred to the coolant within the chassis heat exchanger 810. The coolant can transfer heat away from the chassis 722. In one exemplary embodiment, the coolant can be transferred to a heat exchanger 719 within the vessel 705 to be cooled.

[0084] In one embodiment, the heat exchanger can be an electric cooler that releases heat (removes heat from the chassis) within the tank 710. In this exemplary embodiment, the electric cooler may not require a coolant transfer pipe. In one embodiment, the heat exchanger can be a heat sink. In some applications, the heat sink can transfer a sufficient amount of heat away from the chassis 722. In this exemplary embodiment, heat can be released from each chassis 722 within the tank, and the heat exchanger 719 can cool the air within the tank 710.

[0085] In one exemplary embodiment, the dielectric fluid can transfer heat out from the chassis 722. For example, the chassis 722 can receive an inflow of the dielectric fluid through a connector. The dielectric fluid can remove heat from computer components. Through another connector (or the same connector), the dielectric fluid can exit the chassis 722. Thus, the dielectric fluid can function as a cooling medium. In this exemplary embodiment, the chassis 722 may not require a chassis heat exchanger (however, a chassis heat exchanger can be provided optionally). In this exemplary embodiment, the tank 710 can have a heat exchanger 719 for cooling the warm dielectric fluid.

[0086] In one exemplary embodiment, the fluid connector 721 (and / or the cooling medium connector 821) can be a valve (e.g., a mechanical valve or an electric valve). For example, the fluid connector 721 can open when the chassis 722 is disposed within the storage area 711. As another example, the fluid connector 721 can be enabled to raise the fluid level within the chassis 722 only up to a specific level. In this exemplary embodiment, the chassis 722 can include a sensor for determining the fluid level of the fluid within the chassis 722. The fluid connector 721 can close when the fluid within the chassis 722 reaches a threshold height.

[0087] In one embodiment, the chassis can include a control device 830. The control device 830 can provide a set of instructions to the fluid connector 721 and / or the cooling medium connector 821. For example, the control device 830 can provide instructions when the chassis 722 is placed in the storage area 711 by the robot 131. In this embodiment, when the chassis 722 is placed in the storage area 711, there may be no fluid 113 in the chassis 722. The control device 830 can issue an instruction to the fluid connector 721 to open until the fluid 113 can enter the chassis 722. The control device 830 can close the fluid connector 721 when the fluid inside the chassis 722 reaches a threshold level, such as 95% of the height of the chassis. The instructions of the control device 830 can be based on sensor readings that determine the liquid level of the fluid in the chassis 722. In this embodiment, the chassis 722 can optionally include a second fluid connector that can allow the fluid 113 to exit the chassis 722. When the chassis 722 is placed in the storage area 711 (e.g., by the robot 131), the control device 830 can issue an instruction to the second fluid connector to close, so that when the fluid flows into the chassis 722 (e.g., through the fluid connector 721), the fluid 113 may not exit the chassis 722.

[0088] As another example, the control device 830 can provide instructions to the fluid connector 721 when the chassis 722 is set to be lifted by the robot 131. In this embodiment, the control device 830 can issue an instruction to the fluid connector 721 (and / or the second fluid connector) to empty the chassis 722, so that no (or almost no) fluid 113 remains in the chassis.

[0089] In one embodiment, the control device 830 can provide similar instructions to the cooling medium connector 821. For example, the control device 830 can issue an instruction to the cooling medium connector 821 to open (or to enable the circulation of the cooling medium) when the chassis 722 is disposed within the storage area 711. As another example, the control device 830 can issue an instruction to the cooling medium connector 821 to close (or to empty the cooling medium) when the chassis 722 is set to be lifted by the robot 131. As another example, the control device 830 can issue an instruction to the cooling medium connector 821 to open or close according to the temperature of the fluid 113 within the chassis 722. When the temperature is less than the threshold temperature, the control device 830 can close the cooling medium connector 821 (to prevent the circulation of the cooling medium). When the temperature exceeds the threshold temperature, the control device 830 can open the cooling medium connector 821 (to enable the circulation of the cooling medium). In this embodiment, the chassis 722 can include a temperature sensor.

[0090] In one exemplary embodiment, the chassis 722 can include a connector for transferring the vapor 723 out of the chassis 722. In this embodiment, the cooling of the vapor 723 can be performed outside the chassis 722. For example, the vapor 723 can be transferred to the heat exchanger 719 to transfer heat to the outside of the vessel 705. In this embodiment, the transfer of the vapor 723 can be performed through one or more pipes or conduits.

[0091] In one exemplary embodiment, the chassis 772 can be sealed. In this example, the chassis 722 can exchange fluid only through a connector (e.g., fluid connector 721). In another example, the chassis 722 can have an orifice (e.g., to exchange fluid or vapor with a tank). In this exemplary embodiment, when the computer component 114 heats the fluid 113, the fluid 113 can evaporate and exit the chassis 722. The vapor 723 can be cooled, for example, by a heat exchanger 119. The chassis 722 can include a fluid level sensor. When the fluid 113 evaporates, the control device can maintain the level of the fluid 113 within the chassis 722, for example, by adding fluid 113 through the fluid connector 721. FIG. 9 shows a liquid immersion cooling system 900 according to an exemplary embodiment of the present disclosure. In this exemplary embodiment, the chassis 922 can have an orifice 930, and the vapor 723 can exit the chassis through the orifice 930. The vapor can diffuse within the tank 910. The heat exchanger 919 can cool the vapor and return it as the fluid 113, for example, to the reservoir area 112 or the storage area 911. If the fluid 113 is returned to the storage area 111, a pump can return the fluid to the reservoir area 112. In one exemplary embodiment, the liquid immersion cooling system can include a plurality of open chassis 922 and a plurality of sealed chassis 722.

[0092] Configuration of Chassis Arrangement In one exemplary embodiment, one or more of the chassis 722 may be arranged in a particular configuration within the storage area 711 (or solution tank area) to save space. FIG. 10A shows an exemplary top view arrangement configuration of the chassis 722 within the storage area 711 according to an exemplary embodiment. In this exemplary embodiment, each of the one or more chassis 722 may be arranged to be substantially parallel to the walls of the storage area 711. FIG. 10B shows another exemplary top view arrangement configuration of the chassis 722 within the storage area 711 according to an exemplary embodiment. In this exemplary embodiment, one or more of the chassis 722 may be arranged such that they are not substantially parallel to the walls of the storage area 711. In this example, one or more of the chassis 722 can have a relative angle with respect to the walls of the storage area 711. For example, one or more of the chassis 722 can be inclined at 5°, 10°, 15°, 20°, or 25° or more with respect to the walls of the storage area 711. In this exemplary embodiment, a greater number of chassis 722 can be stored within the storage area 711.

[0093] Fluid Transfer System In one exemplary embodiment, the vessel can include a fluid transfer system for receiving a dielectric fluid from a source outside the tank and / or removing fluid from the tank to discard the fluid outside the tank. Often, the level of the dielectric fluid can drop below a safe level, thereby exposing the computer components to an unacceptable risk of overheating. In one exemplary embodiment, the fluid transfer system can include an inlet, a pump, and various pipes connecting the inlet to the pump and the tank (e.g., a solution tank area or a sump area). In this exemplary embodiment, the inlet can be connected to a container using a pipe. The pump can draw the dielectric fluid from the container through the inlet using a pipe. The pump can then transfer the fluid to the tank (e.g., a solution tank area or a sump area) using another pipe connecting the pump to the tank. In one exemplary embodiment, the pump can be configured to draw fluid from the tank and transfer the fluid outside the tank through the inlet. In one example, the pump can be a bidirectional pump, e.g., in one operating mode, the pump can draw fluid from the container, and in a second operating mode, the pump can draw fluid from the tank.

[0094] In one exemplary embodiment, the fluid transfer system can include a plurality of operating modes. In a first operating mode, the fluid transfer system can draw fluid from a container located outside the tank. Optionally, the fluid transfer system can pass the fluid through a filter before sending the fluid to the tank. In this example, the filter can be located upstream or downstream of the pump. In a second operating mode, the fluid transfer system can draw fluid from the tank and transfer the fluid outside the tank. Optionally, the fluid transfer system can pass the fluid through a filter before sending the fluid outside the tank. In this example, the filter can be located upstream or downstream of the pump. In a third operating mode, the fluid transfer system can circulate the fluid within the tank. For example, the pump can draw fluid from the sump area and transfer the fluid to the solution tank area. As another example, the pump can draw fluid from the solution tank area and transfer the fluid to the sump area. Optionally, the fluid transfer system can pass the fluid through a filter. In this example, the filter can be located upstream or downstream of the pump.

[0095] FIG. 11 shows a liquid immersion cooling system 1100 according to an exemplary embodiment of the present disclosure. In this exemplary embodiment, the liquid immersion cooling system 1100 can include an inlet 1130, a valve system 1140, a pump 1115, and a filter 1118. The pump 1115 and / or the valve system 1140 can be in communication with a management system 1117, and as a result, the pump 1115 and / or the valve system 1140 can receive signals and commands from the management system 117. The inlet 1130 can be in fluid communication with the valve system 1140 using a pipe. The valve system 1140 can be connected to a reservoir area 112 and the pump 1115 using pipes. The valve system 1140 can be a three-way valve that can fluidly connect the pump 1115 to the inlet 1130 or the reservoir area 112. The inlet 1130 can be connected to a container 1160 outside the tank 110, for example, using a pipe 1150.

[0096] In one operating mode, the management system 117 can command the valve system 1140 to connect the inlet 1130 to the pump 1115. In this operating mode, the pump 1115 can draw fluid from the container through the inlet 1130 and transfer the fluid to the solution tank area 1111. In another operating mode, the management system 117 can command the valve system 1140 to connect the reservoir area 112 to the pump 1115. In this operating mode, the pump 1115 can draw fluid from the reservoir area 112 and transfer the fluid to the solution tank area 1111.

[0097] In one exemplary embodiment, the management system 117 can issue a command to the valve system 1140 to connect the pump 1115 to the inlet 1130 when the trigger condition is met. In one exemplary embodiment, the trigger condition can be a change in the fluid level in the tank 110. In this exemplary embodiment, the vessel 105 can include a fluid level sensor. If the fluid level in the tank 110 or in the solution tank area 1111 drops below a threshold amount, the management system 117 can draw in fluid. For example, if there is fluid in the storage tank area 112, the management system 117 can issue a command to the valve system 1140 to connect the storage tank area 112 to the pump 1115. The management system 117 can further issue a command to the pump 1115 to draw in fluid to raise the fluid level in the tank.

[0098] In one exemplary embodiment, the container 1160 can include a fluid level sensor 1155. For example, if there is fluid exceeding a threshold amount or if there is sufficient fluid for use over a period exceeding a threshold period, the fluid level sensor 1155 (and / or the management system 117) can determine whether there is a sufficient amount of fluid in the container 11160. If the sensor 1155 determines that there is only an insufficient amount of fluid in the container 1160, the sensor 1155 can send a signal to the management system 117. The management system 117 can send a signal to a central unit (or a central server) to notify the user that there is only an insufficient amount of fluid in the container 1160.

[0099] In one exemplary embodiment, the management system can use an artificial intelligence or machine learning program to determine whether a sufficient amount of dielectric fluid is present within the container. For example, the artificial intelligence program can use data for past use of the liquid immersion cooling system and can determine or predict the amount of liquid required to operate the system over a threshold amount of time. If the liquid level detected by the sensor is less than the predicted amount, the management system can send a signal to a central unit (or, central server).

[0100] In one exemplary embodiment, the management system can determine whether an accident or another event has occurred that requires emptying the fluid in the tank. For example, the management system can detect an accident if the fluid level in the tank drops below a threshold level. As another example, the management system can detect an accident if the fluid level in the tank drops at a rate higher than a threshold rate. As another example, the management system can detect an accident if fluid is present in the secondary layer. In the event of an accident, the management system can command the pump to draw fluid from the tank and transfer the fluid to the container so that the fluid is not wasted. The management system can further send a signal to a central unit (or, central server) to notify the user that an accident has occurred. In one embodiment, the management system can stop the operation of the immersion cooling system in the event of an accident.

[0101] Heat Exchanger System FIG. 12 shows a liquid immersion cooling system 1200 according to an exemplary embodiment of the present disclosure. In this exemplary embodiment, the vessel 105 can include a heat exchanger 119 that can transfer heat from inside the tank 110 to the outside of the vessel 105. The heat exchanger 119 can include, for example, one or more coils 1222, a radiator 1223, and a fan 1221. In one embodiment, the coil 1222 can be fluidly coupled to the radiator 1223 (e.g., using one or more pipes 1224). The coil 1222 and the radiator 1223 can include a cooling medium that moves through both the coil 1222 and the radiator 1223.

[0102] In one exemplary embodiment, the coil 1222 can be present within the tank 110, while the radiator 1223 and the fan 1221 can be present outside the tank. In one exemplary embodiment, the fan 1221, the radiator 1223, and the coil 1222 are located within the vessel 105. In one exemplary embodiment, the heat exchanger 119 can be a self - contained unit within the vessel 105. In this exemplary embodiment, because the heat exchanger 119 can be a self - contained unit within the vessel 105, the vessel 105 does not require a connection to a cooling tower or other cooling equipment to maintain the temperature of the dielectric fluid within the tank 110.

[0103] In one embodiment, the fan 1221 can force ambient air to pass through the radiator 1223. For example, when the computer component 114 generates heat, the fluid 113 can evaporate. The vapor can exchange heat with the coil 1222 and condense. This heat exchange can transfer heat from the vapor to the cooling medium in the coil 1222. The cooling medium can be transferred to the radiator 1223, optionally using a pump, through various pipes 1224, for example. In the radiator 1223, the cooling medium can exchange heat with the ambient air. To assist the heat exchange between the ambient air and the cooling medium in the radiator 1223, in one embodiment, the fan 1221 can force air to pass through the radiator 1223. In one embodiment, the cooling medium can be water or other fluid.

[0104] In one exemplary embodiment, the coil 1222 can be connected to a condenser-based cooling system. The cooling system can cool the working medium in the coil, thereby cooling the tank. In one embodiment, the management system can include a temperature predictor. The management system can adjust the operation of the cooling system based on predictions regarding the temperature of the fluid in the tank or the external temperature. In one embodiment, the cooling system can be a dry cooling system. In one embodiment, the cooling system can cool the tank in addition to heat exchange located remotely from the tank.

[0105] Heater Element In one exemplary embodiment, the vessel can include a heating element. The heating element can include a plurality of heating rods, and some of the plurality of heating rods are at least partially immersed in the dielectric fluid. The heating rods can provide heat to the vessel as required. For example, when computer components are removed from the tank, the heating element can replace the computer components, for example, to generate the same amount of heat as a computer heating element or to reproduce the heat generation pattern of the computer components. In one exemplary embodiment, the heating element can be disposed within the chassis or housing. The chassis or housing can replace the chassis or housing where the computer components are disposed therein. For example, the heating unit can be removed using a robot.

[0106] In one exemplary embodiment, the heating element can operate independently of the management system 117. In this exemplary embodiment, the heating element can include a power input, a processor, and a memory. The memory can store a heat pattern, and based on the heat pattern, the processor can issue commands to the heating rods to generate heat. In one example, the heating element can reproduce the heating pattern of computer components. In one exemplary embodiment, the heating pattern can include a time function of the amount of heat that will be generated over a certain period, such as 10 watts in 1 minute and 20 watts in 2 minutes. In one exemplary embodiment, the heating element can include a transmitter for receiving commands from a wireless unit outside the vessel, for example, to control the heating element or to store a heating program (or pattern).

[0107] FIG. 13 shows an exemplary heating element 1300 according to an exemplary embodiment. In this exemplary embodiment, the heating element 1300 can include a heating rod 1310 (which can include copper wire), a processor 1320, a memory 1330, a power input 1340, and a chassis 1350. This exemplary heating rod can replace computer components. For example, a robot can lift the heating element and replace computer components. In this exemplary embodiment, the heating element can include an interface for connection to a robot and an optional data input interface.

[0108] Computer Adapter In one exemplary embodiment, computer components that can be configured to operate in a horizontal orientation can be used in a non-horizontal orientation, such as a substantially vertical or vertical orientation, using one or more adapters. In some embodiments, the adapter can be applicable to computer components of any shape and size. The adapter can generally include removable rails configured to be attached to the sides of the computer components, such that the computer components can slide into a rack, where the rack can be designed for a vertical configuration within an immersion cooling tank. In one example, using the rails, the adapter can enable placement of the computer components into the rack and / or removal of the computer components from the rack. The adapter can be capable of connecting computer components of almost any size to the rack.

[0109] FIG. 14A shows an exemplary adapter for the sides of both sides of a computer component in a non-attached position. In this example, each of the adapters 1405 can include rails 1410. FIG. 14B shows an exemplary adapter for the sides of both sides of a computer component in an attached position.

[0110] FIG. 15 shows an exemplary adapter for both side surfaces of a computer component, which is in an attached position on the right side surface of the computer component and in a non-attached position on the left side surface of the computer component. In this embodiment, the adapter 1405 can include rails 1410 and fixtures 1515. The fixtures 1515 can connect the computer component 1414 to the rails 1410.

[0111] FIG. 16 shows a rail assembly for an exemplary adapter of the present application.

[0112] FIG. 17 shows an exemplary carrier bracket assembly. In this embodiment, the carrier bracket assembly can be provided within a rack. The rails 1410 can be connected to the carrier bracket assembly and can enable sliding movement of the rails 1410 with respect to the carrier bracket assembly and the rack.

[0113] FIG. 18 shows an exemplary computer component including an adapter described herein that can be slid into an immersion cooling rack. In this embodiment, the rails of each computer component are connected to a carrier bracket assembly, enabling sliding of the computer components into the rack.

[0114] Monitoring of Dielectric Fluid In immersion cooling of computer components such as servers, halocarbons such as dielectric fluids of liquid perfluorocarbons like NOVEC (trademark) are frequently employed. Unfortunately, under the conditions of use, the halocarbons can degrade into other substances such as acids and bases. These changes and degradations, which can be harmful to the computer components and / or other aspects of the liquid immersion cooling system, are difficult to detect within the fluid. Therefore, it is desirable to determine whether the composition of the fluid within the liquid immersion cooling system has changed. In an exemplary embodiment, a Raman spectrometer can be implemented within the liquid immersion cooling system to detect the composition of the dielectric fluid and / or to detect changes in the composition of the dielectric fluid.

[0115] Figure 19 shows an exemplary immersion cooling system 1900 including a Raman spectrometer and 1931. In this exemplary embodiment, the Raman spectrometer 1931 can be operably connected to the tank area 110 or the reservoir area 112 of the immersion cooling system 1900. The Raman spectrometer 1931 can excite the fluid 113 to an upper excited state and can exhibit radiation at a frequency corresponding to a chemical bond during relaxation, so that impurities in the fluid can be tested. In one example, an optical fiber cable 1932 can connect the Raman spectrometer 1931 to the tank area 110 or the reservoir area 112. Other connections can also be employed to excite the molecules and to analyze the results. In one example, one connection can be employed to excite the molecules and a separate connection can be employed to analyze any results. Additionally, the location of the spectrometer is not particularly critical and can be located within the immersion cooling system, on the immersion cooling system 1900, or at any convenient location. In one example, the use of a Raman spectrometer or another spectrometer or another analysis method helps to understand any contaminant components in the fluid 113, both at their respective concentrations. In this way, corrective measures can be manually or automatically initiated via a control device or by another means, as will be described later.

[0116] In some embodiments, the Raman spectrometer can be operably connected to a management system 117 (or a control device). The management system 117 can receive test results from the Raman spectrometer 1931 and can trigger corrective measures based on the test results. Of course, the test results can also indicate that no corrective measures are needed, and further, the control device can recognize this and / or execute this.

[0117] Fluid Reduction Spacer Immersion cooling consisting of two phases can employ expensive dielectric fluids. Additionally, the vapor of the dielectric fluid may occupy the bellows for pressure management within the immersion cooling tank. The bellows can be very large and thus may require a large installation area for the system. Therefore, it may be desirable to reduce the amount of fluid employed in the liquid immersion cooling system. Additionally, it can be beneficial to reduce the vapor burden of the system to enable reduction of the size of the bellows. Further, it is desirable that such a solution is not particularly costly, is relatively easy to implement, and does not affect the performance of the fluid.

[0118] In one exemplary embodiment, the liquid immersion cooling system can include a metal holding plate configured to be attached to the bottom of the immersion cooling tank. A plurality of filler plates can be removably attached to the metal holding plate and can be configured to come below one or more computer components within the tank.

[0119] In another embodiment, the present application relates to a method involving at least partially submerging computer components in a dielectric fluid that is thermally conductive and condensable. The computer components can be installed within a chassis having a backplane for receiving power from a rack. The computer components can dissipate heat to the dielectric fluid when the computer components are operating. A condenser can be employed to condense the vapor-phase dielectric fluid into the liquid-phase dielectric fluid. The rack is present within a tank operably connected to the bellows. A metal holding plate is configured to be attached to the bottom of the tank. A plurality of filler plates are configured to be removably attached to the metal holding plate and to come below one or more computer components within the rack. The filler plates function to reduce the amount of fluid required and can further reduce the required size of the bellows.

[0120] In one embodiment, a metal holding plate is configured to be attached to the bottom of the immersion cooling tank, a plurality of filler plates are configured to be removably attached to the metal holding plate, and are configured to be below one or more computer components within the tank. By doing so, the filler plates reduce the amount of immersion fluid required.

[0121] The filler plates can be made of any material that does not interfere with the operation of the disclosed immersion cooling system. For example, the plates can be made of materials including, but not limited to, metals, rubbers, silicones, and / or polymers. Suitable materials are not substantially soluble in the dielectric fluid. In some embodiments, one or more of the filler plates, up to all of them, include a material that is less dense than the dielectric fluid. Such materials include, for example, thermoplastics such as polyoxymethylene like DELRIN® available from DuPont.

[0122] In some embodiments, the filler plates can be configured to be selectively attached to and removed from the metal holding plate without the use of tools. This selective attachment mechanism is not particularly important, provided that it does not prevent displacement during operation. For example, the interlock section can be made to have recesses, and / or a rail-slide mechanism can be employed.

[0123] If desired, other filler plates may be employed in addition to the filler plate located below the computer components. For example, a second filler plate may be configured to be removably attached to the metal retaining plate and / or configured to be adjacent to one or more computer components within the tank in the lateral direction. For example, the second filler plate can be adjacent laterally on both sides of a group of vertically arranged servers so as to occupy the space between the server and the side wall of the tank. Of course, the filler plate can also be present in front of or behind the server if necessary. In such cases, the second filler plate can be attached to the side wall of the tank and / or the metal retaining plate in addition to or alternatively.

[0124] A sample system is shown in FIG. 20, although many diverse variations may also be employed. As shown in FIG. 20, a bottom holding plate 10 may be attached to the bottom or floor of the immersion cooling fluid tank. The dielectric fluid 20 can surround computer components, such as a server 30, for example, to cool the computer components during use. As shown in FIG. 20, there may be 14 servers in a horizontally arranged vertical configuration, although any number of servers in any configuration may be employed. Further, as shown in FIG. 20, the servers 30 can vary in size. Thus, a longer filler plate 50 can be inserted between shorter filler plates 60, and typically either type of these is attached to the bottom holding plate 10. If desired, side filler plates 40 can be used on either side and / or the front or rear side of the tank. In such cases, the filler plates 40 can be attached to the bottom holding plate 10 and / or to the tank wall adjacent to the filler plate 40. Advantageously, this selective attachment / detachment mechanism is configured such that the filler plates can be easily attached or detached without using tools when the server configuration within the tank is changed. By using the systems and methods described herein, the use of fluid can be reduced and / or the size of the bellows can be reduced.

[0125] Mobile Immersion Cooling System In one exemplary embodiment, an immersion cooling system can be installed in a mobile body. The mobile body can be a vehicle, automobile, boat, airplane, train, container, or any other transportable body. In this exemplary embodiment, the main part of the operation of the immersion cooling system can be the same as or similar to other immersion cooling systems of the present disclosure. In other exemplary embodiments, the main part of the operation of the immersion cooling system may be different from the immersion cooling system disclosed herein.

[0126] In one embodiment, the immersion cooling system can include a tank, a cooling system, a plurality of computer components, and a dielectric medium. In one embodiment, the immersion cooling system can receive power from a vehicle. In other embodiments, the power can be obtained from, for example, a generator (e.g., gasoline), a battery, a solar panel, a wind turbine, a wave power generator, or any combination thereof.

[0127] In one embodiment, the wall between the solution tank area and the reservoir tank area can be higher in an immersion cooling system installed on a vehicle. In this embodiment, the higher wall ensures that more fluid remains in the solution tank area even when the fluid in the immersion cooling system is subject to turbulent flow or stress. In one embodiment, the solution tank area can be connected to the reservoir tank area only through small holes in the wall between the solution tank area and the reservoir tank area. In one embodiment, a pump can draw fluid from the solution tank area and transfer the fluid to the reservoir tank area. In these embodiments, the turbulent flow caused by the movement of the vehicle may not occur in the solution tank area which has an insufficient level of fluid.

[0128] In one embodiment, the immersion cooling system can be wireless. For example, the immersion cooling system can wirelessly send and / or receive data signals. In this embodiment, the immersion cooling system can have wireless connectivity using Wi-Fi, satellite, cellular, other wireless connections, or a combination thereof. In one exemplary embodiment, the immersion cooling system or the vehicle can include an antenna for transmitting or receiving data signals. In one embodiment, the immersion cooling system or the vehicle can include other equipment necessary for implementing wireless data communication. In one embodiment, the immersion cooling system or the vehicle can include an interface for receiving data signals. The interface can provide, for example, Ethernet connectivity or other types of connectivity.

[0129] In one embodiment, when the vehicle is moving, the immersion cooling system and its components can be subject to shocks and vibrations. To minimize such stresses applied to the immersion cooling system, the immersion cooling system can be installed on the platform via damping means. The damping means can be a spring or other similar device that can absorb some or all of the stresses transmitted from the vehicle to the immersion cooling system and / or its components. The platform and the damping means can connect the immersion cooling system to a vehicle, box, or container in which the immersion cooling system is located.

[0130] FIG. 21 shows an exemplary immersion cooling system 2100 installed on a truck 2105. In this embodiment, the truck 2105 can include a power source 2114 for providing power to the immersion cooling system 2100. The truck 2105 can further include an antenna 2113 for receiving data communications and connecting the immersion cooling system 2100 to a network. The truck 2105 can further include a heat outlet 2110 for transferring heat to the outside of the truck 2105 (for example, if the immersion cooling system includes a condenser on the system). The immersion cooling system 2100 can be connected to various springs 2112 located between the platform 2111 and the immersion cooling system 2100. The springs 2112 can absorb some of the shocks transmitted from the truck 2105 to the immersion cooling system 2100.

[0131] In one embodiment, the immersion cooling system can be assembled within a container that can be loaded onto a transport vehicle such as a truck or a boat. The immersion cooling system can be installed on a platform. The container can include the immersion cooling system while it is loaded on the platform.

[0132] In some embodiments, the system can include one or more mechanisms to minimize fluid movement or unwanted movement of other components so as not to significantly adversely affect computing performance or cooling performance due to movement of the system or system components. Such mechanisms can include, for example, gyros. Exemplary System 1. A vessel configured to hold a dielectric fluid that is thermally conductive and condensable, A pressure control device for reducing or increasing the internal pressure of the vessel, A computer component configured to be at least partially immersed in the dielectric fluid, A fluid circulation system configured to draw the dielectric fluid from a sump area of the vessel, pass the dielectric fluid through a filter, and send the dielectric fluid to a solution tank area of the vessel, A system comprising: 2. The system of paragraph 1, further comprising an inlet for receiving the dielectric fluid from a source outside the vessel. 3. The system of paragraph 2, further comprising a valve system for connecting or disconnecting the fluid circulation system to the inlet. 4. The system of paragraph 3, wherein the fluid circulation system includes a pump. 5. The system of paragraph 4, further comprising a management system configured to direct the valve system to operate in a first operating mode with the pump connected to the inlet and to direct the pump to draw the dielectric fluid from the source. 6. The system of paragraph 5, further comprising a stowable hose. 7. The system of paragraph 6, wherein the stowable hose includes a sensor for detecting whether the stowable hose is connected to the source. 8. The system of paragraph 6, wherein the management system is configured to direct the pump to draw the dielectric fluid from the source only if the stowable hose is connected to the source. ​​9. To instruct the valve system to operate in a second operating mode in which a pump is connected to the reservoir area, and To instruct the pump to draw fluid from the source, The system of paragraph 4, further comprising a configured management system. 10. The system of paragraph 1, wherein the pressure control device includes a heat exchanger comprising a plurality of pipes and at least one box. 11. The system of paragraph 1, wherein the pressure control device includes a heat exchanger comprising a plurality of pipes and at least one box. 12. The system of paragraph 11, wherein at least one of the plurality of pipes or the at least one box includes a vibration damper. 13. The system of paragraph 12, wherein the vibration damper is a metal weight. 14. A plurality of sensors, and A management system, To receive sensor data related to the temperature of computer components, and To determine a filter failure based on the temperature of computer components, Configured, the management system, and The system of paragraph 1, further comprising. 15. The system of paragraph 14, wherein the sensor data includes the temperature of computer components, the power consumption at the vessel, the external temperature, the temperature of the dielectric fluid, the temperature of the incoming cooling medium, the temperature of the outgoing cooling medium, the flow rate of the cooling medium, the temperature of the area above the solution tank area, the number of computer components present in the vessel, or the position of each computer component in the vessel. 16. The system of paragraph 14, wherein the management system is configured to determine whether a computer component is overheating using a machine learning model. 17. The system of paragraph 16, wherein the machine learning model is trained using sensor data received from the vessel. 18. The system of paragraph 1, wherein the pressure control device includes a bellows configured to receive dielectric vapor. 19. The system of paragraph 18, wherein the bellows includes a sensor for determining the volume of the bellows, and the management system is configured to receive data from the sensor. 20. The system of paragraph 19, wherein the management system is further configured to receive temperature data. 21. The system of paragraph 20, wherein the management system is further configured to determine the operating state of the vessel. 22. The system of paragraph 21, wherein the operating state is 1) startup or shutdown of the heat exchanger, 2) combustion of the dielectric fluid, and 3) leakage of the dielectric fluid. 23. The system of paragraph 21, wherein the management system is further configured to use a machine learning model to determine the operating state of the vessel based on the data received from the sensor and the temperature data. 24. The system of paragraph 1, wherein the computer component includes a heat sink consisting of two phases. 25. The system of paragraph 24, wherein the heat sink consisting of two phases includes a hollow box with a liquid medium and two elongated metal surfaces. 26. The system of paragraph 1, wherein the vessel is protected by a secondary layer. 27. The system of paragraph 26, wherein the secondary layer is parallel to the inner layer. 28. The system of paragraph 27, wherein a fluid sensor is provided between the secondary layer and the inner layer. 29. A vessel configured to hold a dielectric fluid that is thermally conductive and condensable, a computer component configured to be at least partially immersed in the dielectric fluid, a chassis configured to hold the computer component and the dielectric fluid, and a fluid circulation system configured to draw the dielectric fluid from a sump area of the vessel, pass the dielectric fluid through a filter, and send the dielectric fluid to the chassis. The system comprising. 30. The system of paragraph 29, wherein the chassis includes a fluid connector for receiving the dielectric fluid from the fluid circulation system. 31. The system of paragraph 30, wherein the fluid connector is configured to open when the chassis is disposed within the vessel. 32. The system of paragraph 30, wherein the fluid connector is configured to close when the chassis is set to be removed from the vessel. 33. The system of paragraph 29, wherein the chassis includes a heat exchanger. 34. The system of paragraph 33, wherein the heat exchanger is configured to receive a cooling medium from a cooling medium connector. 35. The system of paragraph 33, wherein the heat exchanger is an electric heat exchanger. 36. The chassis is configured such that the chassis will be configured to hold the level of the dielectric fluid, and such that vapor of the dielectric fluid can exit the chassis and enter the vessel, the system of paragraph 29 that is openable. 37. The system of paragraph 29, further comprising a fluid level sensor for determining the level of the dielectric fluid. 38. The system of paragraph 37, wherein the fluid level sensor is located within the chassis. 39. The system of paragraph 37, further comprising an inlet for receiving a dielectric fluid from a source outside the vessel. 40. The system of paragraph 39, further comprising a valve system for connecting or disconnecting a fluid circulation system to the inlet. 41. The system of paragraph 40, wherein the fluid circulation system includes a pump. 42. When the level of the dielectric fluid drops below a threshold amount, instruct the valve system to operate in a first operating mode, and instruct the pump to draw in the dielectric fluid from the source, the system of paragraph 41, further comprising a configured management system. 43. The system of paragraph 39, wherein the source includes a source fluid level sensor. 44. The system of paragraph 43, further comprising a management system configured to send a signal to a central server when the supply source fluid level drops below a threshold amount. 45. The system of paragraph 44, wherein the threshold amount is a height level for a dielectric fluid. 46. The system of paragraph 44, wherein the threshold amount is the amount of fluid necessary to operate the system over a predetermined period determined by artificial intelligence. 47. A vessel configured to hold a dielectric fluid that is thermally conductive and condensable, a pressure control device for reducing or increasing the internal pressure of the vessel, a computer component configured to be at least partially immersed in the dielectric fluid, and a fluid circulation system configured to draw the dielectric fluid from a sump area of the vessel, pass the dielectric fluid through a filter, and send the dielectric fluid to a solution tank area of the vessel. A system comprising. 48. The system of paragraph 47, wherein the pressure control device is a self - contained heat exchanger. 49. The system of paragraph 48, wherein the self - contained heat exchanger includes a coil, a radiator, and a fan. 50. The system of paragraph 49, wherein the fan is configured to blow forced air through the radiator. 51. The system of paragraph 47, further comprising a heating element. 52. The system of paragraph 51, wherein the heating element includes a processor and a memory. 53. The system of paragraph 52, wherein the processor is configured to issue a command to a heating rod of the heating element to heat the vessel using a program stored in the memory. 54. The system of paragraph 53, further comprising a transmitter for receiving the command wirelessly. A server adapter comprising one or more removable rails configured to be attached to the side of a server such that the server can slide into a server rack by the removable rails, wherein the server rack is designed for a vertical configuration within an immersion cooling tank. 56. A method comprising at least partially submerging computer components in a dielectric fluid that is thermally conductive and condensable within a solution tank area of a vessel, wherein the computer components are installed within a chassis having a backplane for receiving power from a rack, wherein the computer components are configured to dissipate heat to the dielectric fluid when the computer components are operating, the step of submerging, the step of using a condenser to condense the vapor-phase dielectric fluid into a liquid-phase dielectric fluid, and the step of testing the dielectric fluid using a Raman spectrometer and including. 57. The method of paragraph 56, further comprising the step of sending a signal to a control device based on the test. 58. The method of paragraph 57, wherein the control device triggers a corrective action based on the test. 59. A tank configured to hold a dielectric fluid that is thermally conductive and condensable, a pressure control device for reducing or increasing the internal pressure of the tank, computer components at least partially submerged in the dielectric fluid, a condenser for condensing the vapor-phase dielectric fluid, a robot configured to pick up the computer components, a Raman spectrometer operably connected to a control device, wherein the control device is configured to receive test results from the Raman spectrometer and trigger a corrective action based on the test results, and including. 60. A system for reducing the amount of dielectric fluid employed in an immersion cooling tank having a bottom, the tank being configured to cool one or more computer components, the system comprising: A metal retaining plate configured to be attached to the bottom of the immersion cooling tank; A plurality of filler plates configured to be removably attached to the metal retaining plate and configured to be positioned below one or more computer components within the tank; The system comprising. 61. The system of paragraph 60, wherein one or more of the filler plates, all of which are at most, comprise a material that is less dense than the dielectric fluid. 62. The system of paragraph 60, wherein one or more of the filler plates, all of which are at most, comprise a thermoplastic material. 63. The system of paragraph 60, wherein one or more of the filler plates, all of which are at most, comprise polyoxymethylene. 64. The system of paragraph 60, further comprising a second filler plate configured to be removably attached to the metal retaining plate and configured to be positioned adjacent to one or more computer components in the lateral direction within the tank. 65. A tank configured to hold a dielectric fluid that is thermally conductive and condensable, the tank being operably connected to a bellows, a rack configured to hold one or more computer components at least partially submerged in the dielectric fluid, a condenser for condensing the dielectric fluid in the gas phase, a metal retaining plate configured to be attached to the bottom of the tank, and a plurality of filler plates configured to be removably attached to the metal retaining plate and configured to be positioned below one or more computer components within the rack. The system comprising. A condenser for condensing the dielectric fluid in the gas phase; A metal retaining plate configured to be attached to the bottom of the tank; A plurality of filler plates configured to be removably attached to the metal retaining plate and configured to be positioned below one or more computer components within the rack; The system comprising. 66. A step of at least partially submerging computer components in a dielectric fluid that is thermally conductive and condensable, wherein the computer components are installed in a chassis having a backplane for receiving power from a rack, wherein the computer components are configured to dissipate heat to the dielectric fluid when the computer components are operating, the step of submerging, a step of using a condenser to condense the gaseous dielectric fluid into a liquid-phase dielectric fluid, comprising, wherein the rack is in a tank operably connected to bellows, and a metal holding plate is configured to be attached to the bottom of the tank, and a plurality of filler plates are configured to be removably attached to the metal holding plate and are configured to be below one or more computer components in the rack, a method. 67. A tank configured to hold a dielectric fluid that is thermally conductive and condensable, the tank being operably connected to bellows, a tank, and a rack configured to hold one or more computer components at least partially submerged in the dielectric fluid, a condenser for condensing the gaseous dielectric fluid, a platform configured to be attached to the bottom of the tank using a shock absorber, a vehicle configured to provide power and data connectivity to the tank comprising a system. 68. The system of paragraph 67, further comprising a battery for providing power and an antenna for providing data connectivity to the tank. 69. The system of paragraph 67, wherein the shock absorber is a spring. 70. The system of paragraph 67, wherein the vehicle includes a heat outlet for transferring heat from a condenser outside the tank.

[0133] Various embodiments have been described so far in this specification with reference to the accompanying drawings. However, it will be apparent that various modifications and changes can be made to these various embodiments without departing from the broad scope of the invention as set forth in the following claims, and additional embodiments can be implemented. Therefore, this specification and the drawings are to be regarded as illustrative and not restrictive.

Explanation of Reference Numerals

[0134] 100 Immersion cooling system 105 Vessel 110 Tank 111 Solution tank area 112 Storage tank area 113 Fluid 114 Computer components 115 Pump 116 Door 117 Management system 118 Filter 119 Heat exchanger 120 Penetration plate 130 Vehicle 131 Robot 200 Immersion cooling system 215 Pump 218 Filter 230 Inlet 240 Valve system 250 Hose 255 Sensor 260 Container 300 Immersion cooling system 305 Vessel 314 Computer components 319 Heat exchanger 331 Robot 361 Pipe 362 Box 363 Damper 364 Damper 400 Immersion cooling system 405 Vessel 410 Tank 411 Solution Tank Area 412 Storage Tank Area 413 Fluid 414 Computer Components 415 Pump 416 Door 417 Management System 418 Filter 419 Heat Exchanger 420 Through Plate 430 Bellows 431 Volume Sensor 432 Temperature Sensor 440 Discharge Device 450 Pressure Control Valve 460 Steam / Air Separator 470 Steam Condenser 480 Desiccant 490 Air Inlet / Outlet 510 Heat Sink 511 Liquid Medium 512 Metal Plate 513 Metal Plate 520 Computer Components 530 Dielectric Fluid 600 Immersion Cooling System 605 Vessel 610 Tank 621 Secondary Layer - Vessel 622 Secondary Layer - Tank 623 Inner Layer - Vessel 624 Inner Layer - Tank 625 Sensor 630 Separation Region 700 Immersion Cooling System 705 Vessel 710 Tank 711 Storage Area 719 Heat Exchanger 721 Fluid Connector 722 Chassis 723 Steam 741 Second Heat Exchanger 810 Chassis Heat Exchanger 821 Cooling medium connector 822 Cooling medium transfer pipe 823 Other connectors 830 Control device 900 Immersion cooling system 905 Vessel 910 Tank 911 Storage area 919 Heat exchanger 922 Chassis 930 Orifice 1100 Immersion cooling system 1111 Solution tank area 1115 Pump 1118 Filter 1130 Inlet 1140 Valve system 1150 Pipe 1155 Sensor 1160 Container 1200 Immersion cooling system 1221 Fan 1222 Coil 1223 Radiator 1224 Pipe 1300 Heating element 1310 Heating rod 1320 Processor 1330 Memory 1340 Power input 1350 Chassis 1405 Adapter 1410 Rail 1414 Computer components 1515 Fixture 1900 Immersion cooling system 1931 Raman spectrometer 1932 Optical fiber cable 2100 Immersion cooling system 2105 Truck 2110 Heat jet outlet 2111 Platform 2112 Spring 2113 Antenna 2114 Power Supply

Claims

1. A vessel configured to hold a dielectric fluid that is thermally conductive and condensable, a pressure control device for reducing or increasing the internal pressure of the vessel, a computer component configured to be at least partially immersed in the dielectric fluid, a fluid circulation system configured to draw the dielectric fluid from a storage tank area of the vessel, pass the dielectric fluid through a filter, and send the dielectric fluid to a solution tank area of the vessel, comprising: A system further comprising an inlet for receiving the dielectric fluid from a source outside the vessel.

2. The system according to claim 1, further comprising a valve system for connecting or disconnecting the fluid circulation system to the inlet.

3. The system according to claim 2, wherein the fluid circulation system includes a pump.

4. configured to direct the valve system to operate in a first operating mode in which the pump is connected to the inlet, and configured to direct the pump to draw the dielectric fluid from the source, The system according to claim 3, further comprising a management system.

5. The system according to claim 4, further comprising a stowable hose.

6. The system according to claim 5, wherein the stowable hose includes a sensor for detecting whether the stowable hose is connected to the source.

7. The system according to claim 5, wherein the management system is configured to direct the pump to draw the dielectric fluid from the source only when the stowable hose is connected to the source.

8. configured to direct the valve system to operate in a second operating mode in which the pump is connected to the storage tank area, and configured to direct the pump to draw fluid from the source, The system according to claim 3, further comprising a management system.

9. The system according to claim 1, wherein the pressure control device includes a heat exchanger comprising a plurality of pipes and at least one box.

10. The system according to claim 1, wherein the pressure control device includes a heat exchanger comprising a plurality of pipes and at least one box.

11. The system according to claim 10, wherein at least one of the plurality of pipes or the at least one box includes a vibration damper.

12. The system according to claim 11, wherein the vibration damper is a metal weight.

13. A plurality of sensors, A management system, configured to receive sensor data related to the temperature of the computer components and, configured to determine a failure of the filter based on the temperature of the computer components, A management system, The system according to claim 1, further comprising.

14. The system according to claim 13, wherein the sensor data includes the temperature of the computer components, the power consumption at the vessel, the external temperature, the temperature of the dielectric fluid, the temperature of the incoming cooling medium, the temperature of the outgoing cooling medium, the flow rate of the cooling medium, the temperature of the area above the solution tank area, the number of computer components present in the vessel, or the position of each computer component in the vessel.

15. The system according to claim 13, wherein the management system is configured to determine whether the computer components are overheating using a machine learning model.

16. The system according to claim 15, wherein the machine learning model is trained using the sensor data received from the vessel.

17. The system according to claim 1, wherein the pressure control device includes a bellows configured to receive dielectric vapor.

18. The system according to claim 17, wherein the bellows includes a sensor for determining the volume of the bellows, and the management system is configured to receive data from the sensor.

19. The system according to claim 18, wherein the management system is further configured to receive temperature data.

20. The system according to claim 19, wherein the management system is further configured to determine the operating state of the vessel.

21. The system according to claim 20, wherein the operating state is 1) startup or stop of the heat exchanger, 2) combustion of the dielectric fluid, and 3) leakage of the dielectric fluid.

22. The system according to claim 20, wherein the management system is further configured to determine the operating state of the vessel using a machine learning model based on the data received from the sensor and the temperature data.

23. The system according to claim 1, wherein the computer component includes a heat sink consisting of two phases.

24. The system according to claim 23, wherein the heat sink consisting of two phases includes a hollow box having a liquid medium and two elongated metal surfaces.

25. The system according to claim 1, wherein the vessel is protected by a secondary layer.

26. The system according to claim 25, wherein the secondary layer is parallel to the inner layer.

27. The system according to claim 26, wherein a fluid sensor is provided between the secondary layer and the inner layer.

28. A vessel configured to hold a dielectric fluid that is thermally conductive and condensable, a computer component configured to be at least partially immersed in the dielectric fluid, a chassis configured to hold the computer component and the dielectric fluid, and a fluid circulation system configured to draw the dielectric fluid from a sump area of the vessel, pass the dielectric fluid through a filter, and send the dielectric fluid to the chassis. comprising The system further comprising an inlet for receiving the dielectric fluid from a source outside the vessel.

29. The system according to claim 28, wherein the chassis includes a fluid connector for receiving the dielectric fluid from the fluid circulation system.

30. The system according to claim 29, wherein the fluid connector is configured to open when the chassis is disposed within the vessel.

31. The system according to claim 29, wherein the fluid connector is configured to close when the chassis is set to be removed from the vessel.

32. The system according to claim 28, wherein the chassis includes a heat exchanger.

33. The system according to claim 32, wherein the heat exchanger is configured to receive a cooling medium from a cooling medium connector.

34. The system according to claim 32, wherein the heat exchanger is an electric heat exchanger.

35. The chassis is configured such that the chassis is configured to hold a liquid level of the dielectric fluid, and configured such that vapor of the dielectric fluid can exit the chassis and enter the vessel. openable, the system according to claim 28.

36. The system according to claim 28, further comprising a fluid level sensor for determining the level of the dielectric fluid.

37. The system according to claim 36, wherein the fluid level sensor is located within the chassis.

38. The system according to claim 36, further comprising a valve system for connecting or disconnecting a fluid circulation system to the inlet.

39. The system according to claim 38, wherein the fluid circulation system includes a pump.

40. When the level of the dielectric fluid drops below a threshold amount, to instruct the valve system to operate in a first mode of operation, and to instruct the pump to draw dielectric fluid from the source, The system according to claim 39, further comprising a configured management system.

41. The system according to claim 36, wherein the source includes a source fluid level sensor.

42. The system according to claim 41, further comprising a management system, the management system being configured to transmit a signal to a central server when the source fluid level drops below a threshold amount.

43. The system according to claim 42, wherein the threshold amount is a height level for the dielectric fluid.

44. The system according to claim 42, wherein the threshold amount is the amount of fluid required to operate the system over a predetermined period determined by artificial intelligence.

45. A vessel configured to hold a dielectric fluid that is thermally conductive and condensable, A pressure control device for reducing or increasing the internal pressure of the vessel, A computer component configured to be at least partially immersed in the dielectric fluid, A fluid circulation system configured to draw the dielectric fluid from a sump area of the vessel, pass the dielectric fluid through a filter, and send the dielectric fluid to a solution tank area of the vessel Comprising A system further comprising an inlet for receiving the dielectric fluid from a source outside the vessel.

46. The system according to claim 45, wherein the pressure control device is a self - contained heat exchanger.

47. The system according to claim 46, wherein the self - contained heat exchanger includes a coil, a radiator, and a fan.

48. The system according to claim 47, wherein the fan is configured to send forced air through the radiator. **Claim 49** The system according to claim 45, further comprising a heating element. **Claim 50** The system according to claim 49, wherein the heating element includes a processor and a memory. **Claim 51** The system according to claim 50, wherein the processor is configured to issue a command to a heating rod of the heating element to heat the vessel using a program stored in the memory. **Claim 52** The system according to claim 51, further comprising a transmitter for wirelessly receiving a command.

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