RFID Label and Method of Using the RFID Label

Abstract

To provide an RFID label formed by printing information on a body to be stuck, configured to allow the RFID label with updated information to be read while invalidating information before update.SOLUTION: An RFID label includes: a first substrate equipped with an RFID antenna and an IC chip connected to the RFID antenna; a second substrate stuck on one surface of the first substrate with a lamination adhesive layer; and an adhesive layer for a body to be stuck arranged on the other surface of the first substrate. The RFID label includes a non-adhesive section formed in at least a part of the adhesive layer for a body to be stuck, and a pair of cut lines formed from one side to the other side of the RFID label in positions overlapping the non-adhesive section. A part of the RFID antenna including the IC chip is located between the pair of cut lines.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to an RFID label and a method of using the RFID label.

Background Art

[0002] Conventionally, in a label on which information regarding an adherend is pre-printed, when the information is updated or additional information is added, etc., a label on which the updated information is printed is overlaid and pasted on top of the label already attached to the adherend, thereby making the information printed on the label already attached to the adherend unusable. A method of using a label has been proposed (see Patent Document 1).

[0003] In Patent Document 1, a label on which a barcode including updated information is printed is overlaid and pasted so as to cover the barcode printed on the label already attached, thereby making the barcode on the label already attached unreadable. Thereby, the information regarding the adherend can be updated.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In recent years, in fields such as product manufacturing, management, and distribution, so-called RFID media such as RFID tags and RFID labels that support RFID (Radio Frequency Identification) technology for transmitting and receiving information by non-contact communication from an IC chip on which product-related information and identification information are written have become widespread.

[0006] The reading of the RFID label is performed by non-contact communication. Therefore, when the method of using the label described in Patent Document 1 is applied to the RFID label, there are a plurality of RFID labels on the adherend, and any of the RFID labels may not be readable, or information of an undesired RFID label may be read.

[0007] Therefore, an object of the present invention is to make it possible to read an RFID label including updated information by making the information before the update unusable when the information on the RFID label on which information regarding the adherend is printed is updated.

Means for Solving the Problems

[0008] According to an aspect of the present invention, there is provided a first base material having an RFID antenna and an IC chip connected to the RFID antenna. On one side A second base material attached to one surface of the first base material via an adhesive layer for lamination. and An RFID label provided with and The RFID label has a non-adhesive portion and a pair of cut lines formed from one side to the other side of the RFID label at a position overlapping the non-adhesive portion, and a part of the RFID antenna including the IC chip is located between the pair of cut lines. An RFID label is provided. 、 The RFID label an adhesive portion composed of an adhesive layer for an adherend provided on the other side of the first base material, and where the adhesive layer for the adherend is not disposed has a non-adhesive portion and a pair of cut lines formed from one side to the other side of the RFID label at a position overlapping the non-adhesive portion, and a part of the RFID antenna including the IC chip is located between the pair of cut lines. An RFID label is provided.

Effects of the Invention

[0009] According to the present invention, due to a pair of cut lines, as the breakage of the RFID label progresses from one side to the other side of the RFID label, a part of the RFID antenna including the IC chip located between the pair of cut lines is broken, and the non-adhesive portion is cut off. Therefore, in the RFID label on which information regarding the adherend is printed, when the information is updated, the information before the update can be made unusable. Further, even when the RFID label including the updated information is attached to the adherend, it can be made readable.

Brief Description of the Drawings

[0010]

Figure 1

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Figure 11

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Figure 17

Mode for Carrying Out the Invention

[0011] [RFID Label] The RFID label 1 according to the embodiment of the present invention will be described.

[0012] FIG. 1 is a plan view of an RFID label continuum 10 in which the RFID label 1 according to the present embodiment is temporarily attached continuously to a long strip-shaped separator S as seen from the front side. FIG. 2 is a plan view showing one of the RFID labels 1 enlarged. In FIG. 2, a part of the label base material 30 is shown cut out.

[0013] FIG. 3 is a cross-sectional view taken along line III-III shown in FIG. 2. Further, FIG. 4 is a plan view of the state where the RFID label 1 is peeled off from the separator S as seen from the side of the sticking surface to the adherend.

[0014] As shown in FIG. 1, the RFID label continuum 10 is formed by arranging a plurality of RFID labels 1 on a long strip-shaped separator S. The plurality of RFID labels 1 are each arranged in the longitudinal direction (Y direction shown in FIG. 1) of the separator S.

[0015] The RFID label 1 includes a first substrate having an RFID antenna and an IC chip connected to the RFID antenna, a second substrate attached to one surface of the first substrate via an adhesive layer for lamination, and an adhesive layer for an adherend provided on the other surface of the first substrate. As shown in FIG. 3, the RFID label 1 is formed by laminating an RFID inlay 20 as the first substrate and a label substrate 30 as the second substrate with an adhesive layer A1 for lamination. In the RFID label 1, an adhesive layer A2 for an adherend is provided on the side opposite to the side where the label substrate 30 of the RFID inlay 20 is laminated, and it is temporarily attached to a separator S.

[0016] The RFID inlay 20 includes an inlay substrate 21, an antenna pattern 22 which is an RFID antenna formed on the inlay substrate 21, and an IC chip 23 connected to the antenna pattern 22. In the present embodiment, the antenna pattern 22 is formed of a metal foil. The antenna pattern 22 may be formed by printing. FIG. 3 shows an example in which the label substrate 30 is disposed on the surface of the inlay substrate 21 where the antenna pattern 22 is formed. The antenna pattern 22 may be disposed on the surface opposite to the surface where the label substrate 30 is disposed.

[0017] As an example, for the inlay substrate 21, a single resin film such as polyvinyl chloride, polyethylene terephthalate, polypropylene, polyethylene, polyethylene naphthalate, or a multilayer film formed by laminating a plurality of these resin films can be used.

[0018] In the present embodiment, as the inlay substrate 21, in addition to the resin film substrate, a paper substrate such as high-quality paper, medium-quality paper, or coated paper formed using these can be used.

[0019] In the present embodiment, the inlay substrate 21 having a thickness of 10 μm to 200 μm can be used.

[0020] As shown in FIGS. 1 and 2, the antenna pattern 22 includes a loop portion 210 on which an IC chip 23 is mounted, meanders 211 and 212 that extend symmetrically left and right (in the X direction) in the width direction of the RFID label 1 from the loop portion 210, and capacitor hats 213 and 214 connected to the ends of the meanders 211 and 212.

[0021] In this embodiment, the antenna pattern 22 is, as an example, a UHF band RFID antenna designed to have an antenna length and an antenna line width corresponding to the UHF band (300 MHz to 3 GHz, particularly 860 MHz to 960 MHz).

[0022] Also, although not shown, the antenna pattern 22 is adhered to the inlay substrate 21 by a laminate adhesive layer made of an adhesive or an adhesive such as an acrylic-based, urethane-based, silicone-based, or rubber-based adhesive.

[0023] The antenna pattern 22 is formed of a metal foil. Examples of metals applicable to the antenna pattern 22 include copper and aluminum. In this embodiment, aluminum foil is used from the viewpoint of suppressing manufacturing costs.

[0024] The thickness of the metal foil is preferably 3 μm or more and 50 μm or less from the viewpoints of the overall thickness of the RFID inlay 20, or the thickness of the RFID label 1, and manufacturing costs. In this embodiment, as an example, aluminum foil with a thickness of 20 μm is used.

[0025] The IC chip 23 is compatible with the UHF band and is a semiconductor package designed to be communicable with a reader (not shown) that is a reading device for the IC chip 23.

[0026] Also, although not shown, the IC chip 23 is electrically and mechanically connected to a part of the loop portion 210 of the antenna pattern 22 by an anisotropic conductive material such as an anisotropic conductive adhesive or an anisotropic conductive film.

[0027] As shown in FIGS. 2 and 3, in the RFID label 1, on the surface of the inlay substrate 21 on the side of the antenna pattern 22 on which the IC chip 23 is mounted, the label substrate 30 is attached with the laminating adhesive layer A1. The laminating adhesive layer A1 serves to laminate the label substrate 30 to the RFID inlay 20.

[0028] Also, as shown in FIG. 3, the opposite surface of the surface of the inlay substrate 21 on which the IC chip 23 is mounted is temporarily adhered to the separator S by the adherend adhesive layer A2. The RFID label 1 is peeled off from the separator S and adhered to the adherend by the adherend adhesive layer A2.

[0029] In the present embodiment, the adherend adhesive layer A2 is a freezing paste that maintains its adhesiveness by maintaining its flexibility even in a low-temperature environment.

[0030] The RFID label 1 has a non-adhesive portion 44 formed in a part of the adherend adhesive layer A2, and a cut line 41 formed from one side to the other side of the RFID label 1 at a position overlapping the non-adhesive portion 44. The cut line 41 has a pair of cut lines 41a, 41b, and a part (loop portion 210) of the RFID antenna including the IC chip 23 is formed to be located between the pair of cut lines 41a, 41b. Further, in the present embodiment, the cut line 41 further has a cut line 41c connecting the ends of the cut lines 41a, 41b on the other side of the RFID label 1, and together with the cut lines 41a, 41b, partitions a part of the RFID label 1 (hereinafter referred to as a separation portion 40) including the entire loop portion 210.

[0031] In this embodiment, the cut line 41 is a so-called perforation process having a cut portion (cut part) of a predetermined length and a non-cut portion (uncut part). FIGS. 1 to 3 clearly show the cut line 41. Although not strictly illustrated in detail, the cut line 41 is formed so that the cut portion does not overlap the antenna pattern 22 so as not to impair the function of the antenna pattern 22. Further, as shown in FIG. 3, the cut line 41 is formed to penetrate the label base material 30, the adhesive layer A1 for lamination, the inlay base material 21, and the adhesive layer A2 for the adherend, and not to penetrate the separator S.

[0032] In this embodiment, the cut line 41 is formed in a U shape that opens to one of a pair of opposing sides in the Y direction that intersects the width direction of the RFID label 1.

[0033] The straight portion of the cut line 41 is formed to pass between the loop portion 210 and the meander 211, and between the loop portion 210 and the meander 212.

[0034] In the separated portion 40 partitioned by the cut line 41, portions constituting the outer edge of the RFID label 1 are formed with recesses 42 and 43 that are recessed inward in the Y direction of the RFID label 1. The recesses 42 and 43 are formed by curves that bulge outward of the RFID label 1.

[0035] As shown in FIG. 4, a non-adhesive portion 44 is formed in a part of the adhesive layer A2 for the adherend in the separated portion 40 partitioned by the cut line 41. In this embodiment, the non-adhesive portion 44 can be formed by printing or coating medium, varnish, etc. on the surface of the adhesive layer A2 for the adherend. Thereby, the adhesiveness of the adhesive layer A2 for the adherend is lost.

[0036] In this embodiment, in the separation portion 40, a part other than the region where the non-adhesive portion 44 is formed is formed such that the adhesive layer A2 for the adherend is exposed. As shown in FIG. 4, by leaving the adhesive region 45 in the separation portion 40, the separation portion 40 separated from the RFID label 1 can be attached to another adherend.

[0037] <Effect> The RFID label 1 having the above configuration has a non-adhesive portion 44 in a part of the adhesive layer A2 for the adherend, and a separation portion 40 partitioned by a cut line 41 is formed in the non-adhesive portion 44 so as to include the entire loop portion 210. Therefore, after being attached to the adherend, the separation portion 40 can be easily separated from the RFID label 1.

[0038] Further, since the separation portion 40 including the entire loop portion 210 is separated by the cut line 41, when the separation portion 40 is separated, the IC chip 23 connected to the loop portion 210 is also separated together with the loop portion 210.

[0039] Therefore, when the RFID label 1 is printed with information about the adherend and used, by separating the separation portion 40, the information cannot be read from the RFID label 1 remaining on the adherend by non-contact communication using RFID.

[0040] Further, in the separation portion 40, recesses 42 and 43 recessed toward the inside of the RFID label 1 are formed in the portion constituting the outer edge of the RFID label 1. Therefore, for the user, the separation portion 40 is easy to pick up, and the separation portion 40 can be easily cut off.

[0041] Also, when a freezing paste is used as the adhesive layer to the adherend as in this embodiment, it is difficult to peel off the RFID label and the peeling operation is complicated. On the other hand, according to the RFID label 1 according to this embodiment, since a part of the separation portion 40 is not attached to the adherend, the separation portion 40 can be easily peeled off from the RFID label 1.

[0042] Further, in the present embodiment, in the separation portion 40, an adhesive region 45 is left on a part other than the region where the non-adhesive portion 44 is formed. Therefore, the separation portion 40 separated from the RFID label 1 can also be attached to another adherend and used. Since the entire loop portion 210 to which the IC chip 23 is connected is included in the separation portion 40, non-contact communication using RFID is possible. Therefore, for example, the separation portion 40 separated from the RFID label 1 can be attached to and stored in a management document or ledger separately from the adherend to which the RFID label 1 is attached, or used for management.

[0043] [Usage method of RFID label] Subsequently, the usage method of the above-described RFID label 1 will be described.

[0044] FIGS. 5 to 8 are diagrams for explaining the usage method of the RFID label 1 when a test tube P is used as an adherend.

[0045] FIG. 5 is a schematic diagram for explaining an operation of cutting out the separation portion 40A of the first RFID label 1A attached to the test tube P, and FIG. 6 is a schematic diagram for explaining a state where the separation portion 40A of the first RFID label 1A attached to the test tube P has been cut out.

[0046] FIG. 7 is a schematic diagram for explaining an operation of attaching a second RFID label 1B to the test tube P to which the first RFID label 1A from which the separation portion 40A has been cut out is attached. Further, FIG. 8 is a schematic diagram for explaining a state where the second RFID label 1B is superposed and attached to the first RFID label 1A from which the separation portion 40A has been cut out.

[0047] Note that both the first RFID label 1A and the second RFID label 1B have the same structure as the above-described RFID label 1.

[0048] In the method of using the RFID label 1 according to this embodiment, as shown in FIGS. 5 and 6, the separation portion 40A of the first RFID label 1A attached to the test tube P is separated.

[0049] Subsequently, as shown in FIG. 7, a second RFID label 1B is attached to the test tube P with the first RFID label 1A from which the separation portion 40A has been separated. Here, as an example, information updated from the information recorded on the IC chip of the first RFID label 1A is written on the second RFID label 1B.

[0050] In this embodiment, as shown in FIG. 8, when the second RFID label 1B is attached to the test tube P, it is attached so that the outer edge of the second RFID label 1B overlaps with the outer edge of the first RFID label 1A.

[0051] In this embodiment, as described above, by overlapping and attaching the first RFID label 1A and the second RFID label 1B, the visibility inside the test tube P is not impaired.

[0052] Also, in the first RFID label 1A and the second RFID label 1B, since the positions of the meanders 211, 212 and the capacitor hats 213, 214 can be overlapped, a boosting effect for amplifying the radio wave sensitivity of the second RFID label 1B may be obtained.

[0053] Also, as another attachment method, when the second RFID label 1B is attached to the test tube P, the second RFID label 1B and the first RFID label 1A may be attached in a state where they are shifted from each other in the longitudinal direction. Thereby, a boosting effect may be obtained.

[0054] Also, the second RFID label 1B and the first RFID label 1A may be attached in a state where they are shifted from each other in the lateral direction. Thereby, a boosting effect may be obtained.

[0055] FIG. 9 is a schematic diagram for explaining an application example of the RFID label 1 according to the present embodiment. In FIG. 9, RFID labels 1A and 1B with information printed thereon for identifying an adherend are shown.

[0056] On the RFID label 1A, a barcode 100A for identifying that it is the RFID label 1A, a two-dimensional code 101A, and character information 102A corresponding to these codes are printed. Further, on the separation part 40A of the RFID label 1A, character information 103A associated with the character information 102A is printed.

[0057] Also, on the RFID label 1B, a barcode 100B for identifying that it is the RFID label 1B, a two-dimensional code 101B, and character information 102B corresponding to these codes are printed. Further, on the separation part 40B of the RFID label 1B, character information 103B associated with the character information 102B is printed.

[0058] As described with reference to FIGS. 5 to 8, such RFID labels 1A and 1B can first be attached to the test tube P. Then, when it becomes necessary to change the information contained in the IC chip 23 of the RFID label 1A, the separation part 40A is cut off, and after making the information recorded in the IC chip 23 before the update unreadable, the second RFID label 1B with the updated information recorded thereon is attached to the test tube P.

[0059] Thereby, even when it becomes necessary to update the information for identifying the test tube P, confusion with the old information does not occur. Also, it is possible to prevent the problem that the IC chip 23 becomes unreadable due to mutual interference caused by attaching a plurality of RFID labels 1A and 1B.

[0060] [Modification example of RFID label] FIG. 10 is a plan view of the RFID label 2 according to the first modified example as viewed from the front side. In the RFID label 2, at the separation portion 51, the end portion 61 that constitutes the outer edge of the RFID label 2 is formed in a triangular shape. As a result, for the user, since the separation portion 51 is easy to grip, the separation portion 51 can be easily cut off.

[0061] FIG. 11 is a plan view of the RFID label 3 according to the second modified example as viewed from the front side. In the RFID label 3, at the separation portion 52, the end portion 62 that constitutes the outer edge of the RFID label 3 is formed in a trapezoidal shape. As a result, for the user, since the separation portion 52 is easy to grip, the separation portion 52 can be easily cut off.

[0062] FIG. 12 is a plan view of the RFID label 4 according to the third modified example as viewed from the front side. In the RFID label 4, at the separation portion 53, the end portion 63 that constitutes the outer edge of the RFID label 4 is formed to protrude outward of the RFID label 4 from one side of the RFID label 4 adjacent to the separation portion 53. As a result, for the user, since the separation portion 53 is even easier to grip, the separation portion 53 can be easily cut off.

[0063] FIG. 13 is a plan view of the RFID label 5 according to the fourth modified example as viewed from the front side. In the RFID label 5, a cut line 64 is formed so as to cross the RFID label 5 in the Y direction. In the RFID label 5, due to such a cut line 64, the separation portion 54 can be easily cut off.

[0064] FIG. 14 is a plan view of the RFID label 6 according to the fifth modified example as viewed from the front side. The RFID label 6 has a pair of cut lines 141 and 142 formed from one side where the recesses 42 and 43 of the RFID label 6 are formed toward the other side. In this modified example, the end points of the pair of cut lines 141 and 142 are located beyond a part of the antenna pattern 22 extending from the loop portion 210 to which the IC chip 23 is connected, and the loop portion 210 to which the IC chip 23 is connected is formed to be located between the pair of cut lines 141 and 142.

[0065] According to the RFID label 6 according to the fifth modification example, even if the separation portion 40 is not partitioned by the cutting line, by the operation of the user to cut out the separation portion 40, the breakage of the RFID label 6 proceeds from the end points of the pair of cutting lines 141 and 142 toward the other side, so that the separation portion 40 can be cut out.

[0066] FIG. 15 is a plan view of the RFID label 7 according to the sixth modification example as viewed from the front side. The RFID label 7 has a pair of cutting lines 241 and 242 formed from one side where the recesses 42 and 43 of the RFID label 7 are formed toward the other side. In this modification example, the end points of the pair of cutting lines 241 and 242 are on the front side of a part of the antenna pattern 22 extending from the loop portion 210 to which the IC chip 23 is connected.

[0067] According to the RFID label 7 according to the sixth modification example, it is not necessary to form the perforated cut portion passing through the antenna pattern 22 so as not to overlap the antenna pattern 22. According to the RFID label 7, by the operation of the user to cut out the separation portion 40, the breakage of the RFID label 7 proceeds from the end points of the pair of cutting lines 241 and 242 toward the other side, so that the antenna pattern 22 can be divided and the separation portion 40 can be cut out.

[0068] FIG. 16 is a cross-sectional view for explaining the RFID label 8 according to another embodiment of the present invention.

[0069] The RFID label 8 shown in FIG. 16 has a different layer structure from the RFID label 1. That is, in the RFID label 8, the inlay base material 21 in the RFID inlay 20 also serves as the label base material 30 in the RFID label 1. In the RFID label 8, the separator S is temporarily adhered via the adhesive layer A2 for the adherend on the surface where the antenna pattern 22 is formed.

[0070] Thus, the layer structure constituting the RFID label can be appropriately changed.

[0071] When the RFID label 8 is applied to a printer using, for example, a thermal head and a platen roller, since the IC chip 23 has a structure facing the platen roller side, it is possible to suppress the impact on the IC chip 23 caused by the thermal head coming into contact with the RFID label 8.

[0072] In addition, since the adhesive layer A2 for the adherend is laminated on the surface where the antenna pattern 22 is formed in the RFID label 8, when used in the usage method described with reference to FIGS. 5 to 8, for example, the IC chip 23 portion of the second RFID label 1B fits within the thickness of the first RFID label 1A. For this reason, in a state where the second RFID label 1B is overlapped and pasted, protrusion by the second RFID label 1B can be suppressed.

[0073] [Other Embodiments] As described above, the embodiments of the present invention have been explained. However, the above embodiments merely show a part of the application examples of the present invention, and are not intended to limit the technical scope of the present invention to the specific configurations of the above embodiments.

[0074] In the present embodiment, the entire separation portion 40 may be a non-adhesive portion 44. The non-adhesive portion 44 can also be realized by a so-called "non-pasting process" in which the adhesive layer A2 for the adherend is not applied to the corresponding region on the back side of the inlay base material 21.

[0075] In the present embodiment, it is assumed that the first RFID label 1A and the second RFID label 1B are overlapped and pasted at the same position on the test tube P. However, when visibility inside the test tube P is required, they may be pasted at positions shifted from each other as long as the visibility is not impaired.

[0076] Also, in the present embodiment, when visibility inside the test tube P is not required, they may be pasted at non-overlapping positions within the same test tube P.

[0077] Also, in the present embodiment, marks for guiding the attachment positions when the RFID labels 1 to 8 are attached in layers may be printed on the surfaces of the RFID labels 1 to 8.

[0078] In the present embodiment, the case where the antenna pattern 22 is an RFID antenna for a UHF band inlet has been described, but it may be an RFID antenna in the microwave band.

[0079] In the present embodiment, the case where the adherend is the test tube P has been described, but the adherend is not limited to the test tube P. It may be a bag body, a box body, etc. other than the test tube.

[0080] The RFID label 1 may be a label without a backing paper in which a release agent layer is provided on the surface of the label base material 30. In this case, the separator S can be made unnecessary.

[0081] The RFID label 9 shown in FIG. 17 is a cross-sectional view for explaining a further modification example of the RFID label 8 shown in FIG. 16. In the modification example shown in FIG. 17, an adhesive paper composed of a label base material 70 as a second base material and a laminating adhesive layer A3 is laminated on the surface opposite to the surface on which the antenna pattern 22 of the RFID label 8 shown in FIG. 16 is formed. After the RFID label 9 is attached to the adherend, the separation portion 40 can be easily separated from the RFID label 9.

Explanation of Signs

[0082] 1, 1A, 1B, 2, 3, 4, 5, 6, 7, 8, 9 RFID labels 10 RFID label continuum 20 RFID inlay 21 Inlay base material 22 Antenna pattern 23 IC chip 30, 70 Label base material 40, 40A, 40B Separation portion 41, 41a, 41b, 41c Cutting line 42, 43 Recess 44 Non-adhesive portion 45 Adhesive area 50 Separation part 51, 52, 53, 54 Separation parts 61, 62, 63 Ends 64 Cutting line 100A, 100B Barcodes 101A, 101B Two-dimensional codes 102A, 102B, 103A, 103B Character information 141, 142 Cutting lines 210 Loop part 211, 212 Meanders 213, 214 Capacitor hats 241, 242 Cutting lines A1, A3 Adhesive layers for lamination A2 Adhesive layer for adherend

Claims

1. An RFID label comprising: a first substrate having an RFID antenna and an IC chip connected to the RFID antenna on one surface thereof; and a second substrate attached to one surface of the first substrate via an adhesive layer for lamination, wherein the RFID label has an adhesive portion composed of an adhesive layer for an adherend provided on the other surface of the first substrate, and a non-adhesive portion where the adhesive layer for an adherend is not provided, and has a pair of cut lines formed from one side to the other side of the RFID label at a position overlapping the non-adhesive portion, wherein a part of the RFID antenna including the IC chip is located between the pair of cut lines, RFID label.

2. The RFID label according to claim 1, wherein the RFID antenna has a loop portion to which the IC chip is connected, and the pair of cut lines partition a part of the RFID label including the entire loop portion together with a cut line connecting the respective ends on the other side, RFID label.

3. The RFID label according to claim 1 or 2, wherein the cut line is a perforation having a cut portion of a predetermined length and a non-cut portion, and the cut portion is formed so as not to overlap the RFID antenna, RFID label.

4. The RFID label according to any one of claims 1 to 3, wherein an adhesive layer for an adherend and a separator are laminated in this order on the surface of the first substrate on the RFID antenna side, RFID label.

5. The RFID label according to claim 2, wherein the RFID antenna comprises the loop portion, a meander having one end connected to the loop portion and extending from the loop portion, and capacitor hats respectively connected to the meander, RFID label.

6. The RFID label according to claim 5, wherein the cut line is formed between the loop portion and the meander, RFID label.

7. The RFID label according to any one of claims 1 to 6, wherein a concave portion recessed inward of the RFID label is formed at the position of the cut line on the one side, RFID label.

8. The RFID label according to any one of claims 1 to 7, wherein the adhesive layer for an adherend is formed of a freezing paste corresponding to a low-temperature environment, RFID label.

9. The RFID label according to any one of claims 1 to 8, wherein the RFID antenna is a UHF band RFID antenna, RFID label.

10. An RFID label comprising a first substrate having an RFID antenna and an IC chip connected to the RFID antenna, and having an adhesive layer for an adherend on a surface of the first substrate on the RFID antenna side, wherein the RFID label has an adhesive portion composed of the adhesive layer for an adherend provided on the surface of the first substrate on the RFID antenna side, and a non-adhesive portion where the adhesive layer for an adherend is not provided, and has a pair of cut lines formed from one side to the other side of the RFID label at a position overlapping the non-adhesive portion, a part of the RFID antenna including the IC chip is located between the pair of cut lines, RFID label.

11. The RFID label according to claim 10, wherein the RFID antenna has a loop portion to which the IC chip is connected, the pair of cut lines partition a part of the RFID label including the entire loop portion together with a cut line connecting the respective ends on the other side, RFID label.

12. The RFID label according to claim 10 or 11, wherein the cut line is a perforation having a cut portion of a predetermined length and a non-cut portion, and the cut portion is formed so as not to overlap the RFID antenna, RFID label.

13. The RFID label according to claim 11, wherein the RFID antenna comprises the loop portion, a meander having one end connected to the loop portion and extending from the loop portion, and capacitor hats respectively connected to the meander, RFID label.

14. The RFID label according to claim 13, wherein the cut line is formed between the loop portion and the meander, RFID label.

15. The RFID label according to any one of claims 10 to 14, wherein a recess recessed inward of the RFID label is formed at a position of the cut line on the one side, RFID label.

16. The RFID label according to any one of claims 10 to 15, wherein the adhesive layer for an adherend is formed of a freezing paste corresponding to a low temperature environment, RFID label.

17. An RFID label according to any one of claims 10 to 16, wherein the RFID antenna is a UHF band RFID antenna, RFID label.

18. A method of using an RFID label, wherein the RFID label comprises a first base material having an RFID antenna and an IC chip connected to the RFID antenna, an adhesive layer for an adherend provided on the first base material, a non-adhesive portion formed on at least a part of the adhesive layer for an adherend, and a pair of cut lines formed from one side to the other side of the RFID label at a position overlapping the non-adhesive portion, and a part of the RFID antenna including the IC chip is located between the pair of cut lines, separating a part of the first RFID label cut off by the pair of cut lines from the first RFID label attached to the adherend, superposing and attaching a second RFID label to the first RFID label from which the part has been separated. A method of using an RFID label.

19. A method of using an RFID label according to claim 18, wherein when attaching the second RFID label to the adherend, the outer edge of the second RFID label and the outer edge of the first RFID label are attached so as to overlap. A method of using an RFID label.

20. An RFID label according to any one of claims 1 to 9, wherein it comprises a separated portion partitioned by the pair of cut lines and a cut line connecting the ends of the pair of cut lines, and the adhesive layer for an adherend is disposed on a part of the separated portion on the side of the cut line connecting the ends of the pair of cut lines. RFID label.

21. An RFID label according to claim 20, wherein the non-adhesive portion is formed extending outside the pair of cut lines in the separated portion. RFID label.

22. An RFID label according to any one of claims 10 to 17, wherein it comprises a separated portion partitioned by the pair of cut lines and a cut line connecting the ends of the pair of cut lines, and the adhesive layer for an adherend is disposed on a part of the separated portion on the side of the cut line connecting the ends of the pair of cut lines. RFID label.

23. An RFID label according to claim 22, wherein The non-adhesive portion is formed so as to extend outside the pair of the cut lines in the separation portion. RFID label.

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