Form factor and connector structure of an ultra-thin module for top mount connection

Ultra-thin module connectors address EMF discharge issues by providing precise interconnection and reduced z-axis height, enabling thinner computing devices with efficient signal and heat transfer, and ensuring electromagnetic compatibility.

JP7700999B2Active Publication Date: 2025-07-01INTEL CORP
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Patent Information

Application Number
JP2021158534
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2020-12-24
Filing Date
2021-09-28
Publication Date
2025-07-01
Estimated Expiration
2041-09-28

AI Technical Summary

Technical Problem

Conventional methods for connecting expansion boards to motherboards in computing devices cause undesired electromagnetic frequency (EMF) discharge, leading to system compliance issues and limiting the z-direction dimension, which is costly and incompatible with mass production.

Method used

The use of ultra-thin module (USM) connectors, including in-line and top-mount designs, that provide conductive traces and alignment frames for precise interconnection of expansion boards, ensuring electromagnetic compatibility and reducing the z-axis height, allowing for thinner computing devices without increasing development costs.

Benefits of technology

The USM connectors enable efficient signal transmission and heat transfer while maintaining electromagnetic compatibility, allowing for thinner computing devices without the need for additional testing for EMF compliance, thus facilitating mass production.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

To provide an ultra slim board to board connector and a computer system.SOLUTION: A board to board connector includes electrical leads to bridge from one board to another board, to interconnect pads on one surface of each of the boards. The boards can interconnect while one board is vertically offset from the other board with a top mount connector. The connector includes a lead frame having the electrical leads and an alignment frame to hold the lead frame. The lead frame includes leads that have two arched arms that are vertically offset from each other. The connector further includes a conductive case to secure over the alignment frame, and screw holes to allow screws to secure the connector in a predetermine location against the boards and ensure electrical connection between the pads on the two boards through the electrical leads of the connector. The alignment frame includes posts to mate with alignment holes in the boards.SELECTED DRAWING: Figure 3A
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Description

Technical Field

[0001] The description generally relates to interconnections, and the more detailed description relates to the structure of an ultra-thin board-to-board connector.

Background Art

[0002] Consumer demand for smartphones, tablets, and very thin computing devices is increasing. The demand is also driving the design of conventional laptops to adopt a more refined profile. Such devices have been designed using a motherboard or printed circuit board (PCB) of a primary system that includes a host processor and system memory, and an expansion board that provides certain peripheral devices. By using an expansion board, a more modular design is enabled that uses different components for different models of the device (e.g., storage capacity or type of wireless connection function).

[0003] Connecting the expansion board to the motherboard has conventionally caused an undesired system electromagnetic frequency (EMF) discharge, which makes system compliance difficult. Conventional solutions for connecting the expansion board limit the z-direction dimension or height (e.g., thickness) of the computing device. As long as such solutions exist, they tend to be costly to manufacture on a special order basis, which conflicts with the desire for mass production.

Brief Description of the Drawings

[0004] The following description includes descriptions of the figures having the descriptions given as implementation examples. The drawings should be understood as illustrative rather than restrictive. As used herein, referring to one or more examples is understood to describe specific features, structures, or characteristics included in at least one implementation of the present invention. Terms such as "in one example" or "in an alternative example" that appear in this specification provide implementation examples of the present invention, but not necessarily all refer to the same implementation. However, they are also not necessarily mutually exclusive.

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[0043] Specific details and implementations will be described below. The description includes a non-limiting description of the figures that may illustrate some or all of the examples and other potential implementations.

Best Mode for Carrying Out the Invention

[0044] As described herein, in one example, the board-to-board connector is an in-line ultra-thin module connector (USMi) having a Berry rope profile for interconnecting extension substrates within a computing device. The connector includes conductive traces for bridging from one substrate to another and interconnects pads on one surface of the substrate. In one example, the interconnect pads are only on one side of the substrate. The substrates can be interconnected with the in-line USM connector while being substantially coplanarly aligned.

[0045] As described herein, in one example, the board-to-board connector is a top mount ultra-thin module connector (USMt) having a Berry rope profile for interconnecting expansion boards within a computing device. The connector includes conductive traces for bridging from one board to another and interconnects pads on one surface of the board. In one example, the interconnect pads are only on one side of the board. The boards can be interconnected when one board is not in the same plane as the other, but has one surface that is offset from the surface of the board to which it is connected. The offset can be the thickness of the board or the thickness of the board plus a void or additional space for components.

[0046] Both in-line USM connectors and top mount USM connectors include a lead frame having conductive traces and an alignment frame for holding the lead frame. Both connectors include a conductive case for fixing the alignment frame above. The connector includes screw holes for enabling screws to fix the connector in place relative to the board and to ensure an electrical connection between pads on two boards through the conductive traces of the connector. The alignment frame includes posts that fit into alignment holes in the board to conform the connector to the board and ensure proper alignment of the connector leads with the pads on the board.

[0047] FIG. 1A is a block diagram of an example of a computer system having an expansion connector for an ultra-thin module (USM). System 102 represents a computing system or computing device. For example, system 102 can be a laptop computer, a tablet computer, or a two-in-one device. A display for the device is not explicitly shown in system 102, but can be a screen that covers the device, or a display that connects via a hinge built into the top of the housing of system 102, or connects with some other connector.

[0048] In one example, the system 102 has a shell design. Here, the processing element and the keyboard are fixed to the display element. In one example, the system 102 is a removable computer. Here, the processor and the display are part of a common unit having a removable keyboard.

[0049] The system 102 includes a system board 110 representing a primary printed circuit board (PCB) for controlling operations in the system 102. The system board 110 may be referred to as a motherboard in a particular computer configuration. The system board 110 represents a rectangular system board having a length and width (x-axis and y-axis, not specifically labeled with respect to direction in the system 102) where both the length and width are at least twice the dimensions of the width or length of the primary processor or host processor, which is a configuration of a conventional system board.

[0050] The system board 110 includes a processor 112 representing the host processor or main processing unit of the system 102. The processor 112 may be a central processing unit (CPU), or may be a system-on-chip (SOC) including a CPU or other processor. In one example, the processor 112 may be the same as the primary processor and may include a graphics processing unit (GPU) that may be separated from the primary processor.

[0051] The system board 110 includes a memory 114 representing an operable memory for a computing device. The operable memory may be referred to as system memory. The operable memory is generally a volatile memory having an indeterminate state when power to the memory is interrupted, or includes such volatile memory. The processor 112 utilizes the memory 114 to control the operation of the system 102. The system 102 includes a battery 122 for supplying power to the system.

[0052] System 102 includes one or more expansion cards connected to system board 110. References to an expansion board or expansion card refer to a card or board that includes a system processor and provides functionality to the system processor via the card and is connected to a primary board that provides the functionality. The card may alternatively be referred to as an add-on card or add-on board, an expansion module, or some other term.

[0053] System 102 shows four expansion boards: expansion board 132, expansion board 136, expansion board 142, and expansion board 152. System 102 may include a single expansion board or multiple expansion boards. The specifically shown expansion boards indicate expansion connections to different types of system boards 110. Other types of connections are possible, as will be described in more detail below. In one example, System 102 includes an expansion board that is stacked above or on top of another expansion board, neither of which is explicitly shown in System 102.

[0054] The expansion boards may be included in System 102 and provide functions that are user-selectable for different system configurations. For example, a computer system generally provides different amounts of non-volatile storage or hard drive sizes. Non-volatile storage refers to memory that maintains a defined state even when power to the memory is interrupted. Non-volatile memory may be provided as solid-state drives (SSDs) of different sizes depending on the system configuration selected by the user. In one example, one or more expansion boards represent SSDs.

[0055] The expansion board is included in system 102 and can provide a controlled function against electromagnetic frequency (EMF) radiation or noise. In one example, one or more expansion boards represent cards for wireless communication. The cards for wireless communication have compliance requirements and are thus implemented as stand-alone modules to prevent the need to be separately tested for each device design. For example, the expansion board can implement wireless communication such as WiFi, Bluetooth® (BT), WWAN (wireless wide area network) such as cellular, or other wireless communication.

[0056] In one example, expansion board 132 is connected to system board 110 using connector (CONN) 134. Connector 134 represents an in-line USM connector that can provide a wide-bandwidth connection to expansion board 132. In one example, expansion board 136 is indirectly connected to system board 110 via expansion board 132. More specifically, expansion board 136 is connected to expansion board 132 via connector (CONN) 138, which represents a USM connector (which can be either an in-line USM connector or a top-mount USM connector). In one example, connector 138 has a narrower bandwidth than connector 134. Connector 134 can provide a pass-through connection to expansion board 136 via connector 138. The connection of expansion board 136 to system board 110 via expansion board 132 can be referred to as a daisy-chain connection. In one example, expansion board 132 can be connected via top-mount USM connector 134. Thus, the boards can be daisy-chained or extended through in-line or top-mount low-profile connectors.

[0057] The expansion board 152 is connected to the system board 110 via a connector (CONN) 154 representing a top-mounted USM connector. The expansion board 152 indicates that the system 102 may include one or more expansion cards mounted on or above the system board 110 using top-mounted connectors. In addition to providing improved signal transmission and heat transfer to enable faster connections, the top-mounted connection includes a vertical offset for some in-line board connections that may still be lower than conventional connectors.

[0058] The expansion board 142 is connected to the system board 110 via a connector (CONN) 144 and via a cable 148 and a connector 146. The connector 146 is a connector directly on the system board 110, which may be a USM connector but is not necessarily a USM connector. In one example, the connector 146 is not a USM connector. The connector 146 can be a different low-profile connector such as a ribbon connector for mounting where the cable 148 is a ribbon cable. The cable 148 can be a wire cable having a corresponding connector 146. Any number of possible connection configurations for the cable 148 and the expansion board 142 can exist. For example, at the end of the cable 148 facing the expansion card 142, the cable includes a hardware interface for interfacing with the connector 144, which is a USM connector. In other examples, the system 102 may include a small PCB having a connector similar to the connector 146 that is attached to a PCB having signal lines to a USM connector to connect to the connector 144 representing a top-mounted USM connector, whether in-line or top-mounted. The expansion board 142 indicates that the system 102 may include one or more expansion cards attached to a system board 110 having cables in addition to USM connectors.

[0059] System 102 includes a connector 162 that represents an I / O (input / output) connector to a device external to system 102. For example, connector 162 may be a USB (universal serial bus) connector or may include a USB connector. System 102 may also include a display device. System 102 may include a network interface coupled to processor 112.

[0060] FIG. 1B is a block diagram of an example of a computer system having an extended connector of an ultra-thin module (USM) attached to a ruler substrate. System 104 represents a computing system or a computing device. For example, system 104 may be a laptop computer, a tablet computer, or a two-in-one device. A display for the device is not explicitly shown in system 104, but may be a screen that covers the device, or a display that is connected via a hinge built into the top of the housing of system 104 or connected to some other connector.

[0061] In one example, system 104 has a shell design. Here, the processing element and the keyboard are fixed to the display element. In one example, system 104 is a removable computer. Here, the processor and the display are part of a common unit having a removable keyboard. System 104 may be an alternative example of system 102 of FIG. 1A having similar internal components but a different system board design.

[0062] System 104 includes a system board 170 that represents a primary printed circuit board (PCB) for controlling operations in system 104. System board 170 may be referred to as a motherboard in a particular computer configuration. System board 170 represents a ruler-shaped board where the length is substantially longer than the width (or the width is substantially longer than the length depending on how the x-axis and y-axis are oriented in system 104). Typically, the ruler-shaped board will have a first dimension that is less than twice the width or length dimension of the primary processor or host processor, and a second dimension that is at least a multiple (e.g., at least 3 or 4 times) of the first dimension.

[0063] System board 170 includes a processor 172 that represents the host processor or main processing unit of system 104. Processor 172 may be a central processing unit (CPU), or may be a system-on-chip (SOC) that includes a CPU or other processor. In one example, processor 172 may be the same as the primary processor and may include a graphics processing unit (GPU) that is either separate from or the same as the primary processor. System board 170 includes a memory 174 that represents the operable memory for the computing device. Processor 172 utilizes memory 174 to control the operation of system 104.

[0064] System 104 includes a battery that supplies power to the system. System 104 is shown as having a plurality of separate battery components that span system board 170. Battery 124 may represent a part or segment of the battery, and battery 126 may represent another part or segment of the battery. Although shown as being of substantially the same shape and size, there are no requirements for the battery segments to be symmetric or symmetrically configured within the housing of system 104. In one example, system 104 may have more than two battery segments.

[0065] System 104 includes one or more expansion cards connected to system board 170. System 104 shows four expansion boards: expansion board 182, expansion board 186, expansion board 192, and expansion board 196. System 104 may include a single expansion board or multiple expansion boards. The specifically shown expansion boards indicate expansion connections to different types of system boards 170. As described throughout, other types of connections are possible. System 104 does not show cable connections to the expansion boards but may include connections similar to those shown in system 102. System 104 also does not show daisy-chain expansion boards that may be implemented in system 104 in various implementations. In one example, system 104 includes an expansion board that is stacked above or on top of other expansion boards, neither of which is explicitly shown in system 104.

[0066] The expansion boards may be included in system 104 and provide functions that are user-selectable for different system configurations. For example, computer systems generally provide different amounts of non-volatile storage or hard drive sizes. Non-volatile storage refers to memory that maintains a defined state even when power to the memory is interrupted. Non-volatile memory may be provided as solid-state drives (SSDs) of different sizes depending on the system configuration selected by the user. In one example, one or more expansion boards represent SSDs.

[0067] The expansion boards may be included in system 104 and provide functions that are controlled with respect to electromagnetic frequency (EMF) radiation or noise. In one example, one or more expansion boards represent cards for wireless communication. Cards for wireless communication have compliance requirements and are thus implemented as stand-alone modules to prevent the need to test them separately for each device design. For example, the expansion board may implement wireless communication such as WiFi, Bluetooth® (BT), WWAN (wireless wide area network) such as cellular, or other wireless communication.

[0068] In one example, the expansion board 182 is connected to the system board 170 using a connector (CONN) 184. The connector 184 represents an in-line USM connector that can extend a ruler board using an expansion module at the edge of the board. Thus, space can be provided for components that can be structured at the long edge of the ruler board, and the components that can be structured are an acceptable configuration of a system having different component mechanisms connected to the connector 184 via the expansion board 182. The expansion board 186 is connected to the system board 170 via a connector (CONN) 188 that represents a top-mounted USM connector. The expansion board 182 indicates that the system 104 can include one or more expansion cards attached on or above the system board 170 using top-mounted connectors.

[0069] The expansion board 192 is connected to the system board 170 via a connector (CONN) 194. The expansion board 196 is connected to the system board 170 via a connector (CONN) 198. The expansion board 192 and the expansion board 196, shown as being across from each other over the system board 170, indicate that the expansion boards can be connected to different ends or other parts of the system board 170. The connector 194 and the connector 198 can be in-line connectors or top-mounted connectors.

[0070] The system 104 includes a connector 164 that represents an I / O (input / output) connector to a device external to the system 104. For example, the connector 164 may be a USB (universal serial bus) connector or may include a USB connector. The system 104 may also include a display device. The system 104 may include a network interface coupled to the processor 172.

[0071] Figures 2A to 2C are block diagrams of an example of connecting an expansion board to a motherboard using a USM connector. The motherboard 210 represents a primary system board including a primary system processor. The expansion board 220 represents an expansion board connected to the system board, identified in the figure as the motherboard 210. The size and scale of the boards are not necessarily to scale. The relative sizes of the system board or motherboard 210 and the expansion board 220 may represent an example implementation.

[0072] Referring to FIG. 2A, the top view 202 shows the top views of the motherboard 210 and the expansion board 220. The motherboard 210 includes pads 212 representing a row of pads between screw holes 214. In one example, the row of pads 212 is a single row of connectors for the motherboard 210. The expansion board 220 includes pads 222 that closely resemble the pads 212 of the motherboard 210. The pads 222 correspond to the pads 212. Here, the signals transmitted to the pads 212 are conveyed to the pads 222 via a USM connector (not explicitly shown).

[0073] The pads 212 and 222 represent exposed connectors on the board. Other connectors are covered by one or more layers of the PCB or by the surface material of the board. The pads enable connection to connectors or chips on the board.

[0074] Similar to the motherboard 210, in one example, the expansion board 220 includes pads 222 arranged between two screw holes 224, one on each side of the row of pads 222. The screw holes 214 include standoffs 216, and the screw holes 224 include standoffs 226. The standoffs 216 and 226 include threads on the inner or inner surface. Thus, as will be described in more detail below, the screw holes provide an opening into the board and accommodate screws for fixing the connectors to the board.

[0075] The motherboard 210 includes alignment holes 218. The extension board 220 includes alignment holes 228. In one example, the alignment holes 218 and the alignment holes 228 are mirror images on the board when they are configured to connect to each other. In one example, the alignment holes 218 of the motherboard 210 and the alignment holes 228 of the extension board 220 are not aligned with each other.

[0076] As shown in the top view 202, the alignment holes 218 and the alignment holes 228 are aligned with each other and have a center offset from the center of the connector. The dashed line 232 (long dashed line) indicates the center line that intersects the center of the connector or the center between the pad 212 and the pad 222. The dashed line 234 (short dashed line) intersects the center of the alignment holes 218 and the alignment holes 228. The offset 230 represents the offset from the center of the alignment hole. In one example, the alignment hole is at the center of the center line 232.

[0077] The extension board 220 is shown as having screw holes 240 that may be the same as the screw holes 224. The screw holes 224 are located on the extension board 220 near the end of the board close to the motherboard 210 when the boards are connected, and the screw holes 240 are located at the opposite end of the extension board 220. Another identifier of the screw holes is that the screw holes 224 are located near the pad 222 where the extension board 220 is connected to the motherboard 210, and the screw holes 240 do not have pads for connecting to the motherboard 210. As described below, the screw holes 240 may include pads for connecting to other boards. Alternatively, the extension board 220 may not have any pads close to the screw holes 240. The screw holes 240 may enable the extension board 220 to be connected to the system housing for additional support for the connection of the extension board.

[0078] The screw hole 240 shows a via 242 representing the connection of a through-hole to the screw hole. It will be understood that the screw holes 224 and 214 also include similar vias that are mostly unclear in the top view 202. A via includes a metal lining for a hole within the substrate. Typically, the alignment holes 218 and 228 are exposed holes within their respective PCBs. The lined holes connect to signal lines on at least two layers of the substrate, or to a ground plane or a power plane.

[0079] Referring to FIG. 2B, the side view 204 shows a side view of the components of the top view 202. Observation of the side view 204 shows the threading of the screw holes 214 in the motherboard 210 and the screw holes 224 in the expansion substrate 220. The side view 204 also shows that the standoffs 216 and 226 provide additional depth to allow the screw holes to accommodate the screws that fix the USM connector to the substrate.

[0080] In one example, the screw holes 214 and 224 are through-holes within the substrate lined with metal. The openings of the metallized through-holes enable each of the standoffs 216 and 226 to be soldered to the screw holes and connect the screw holes to the ground planes in the motherboard 210 and the expansion substrate 220 respectively. Connecting the screw holes to the ground plane, as will be described in more detail below, can be grounding the connector. Using screw-type standoffs enables the expansion card to be assembled to the motherboard in an assembly process after SMT (surface mount technology).

[0081] The alignment holes 218 and 228 provide keying and precise alignment of the USM connector connecting to the substrate. The USM connector includes contacts for electrically connecting the pad 212 to the pad 222 when the connector is fixed to the substrate having the screw holes 214 and 224. Improved accuracy from a pair of keying alignment holes allows for a narrower pitch between pads for the interconnection of conventional expansion substrates.

[0082] Although shown and described as standoffs, standoffs 216 and 226 can alternatively be spacers. By using standoffs 216 and 226, a threading is provided for securing the screws for the connectors that connect motherboard 210 to expansion board 220. Since the screws can extend to threaded posts within the system housing that secure the screws, the spacers may not be required to include threaded spacers with threading. Since the threading of the standoffs may not be perfectly aligned with the threading of the standoffs of the housing, spacers may be preferred when the connector screws are connected to the system housing.

[0083] Referring to FIG. 2C, bottom view 206 shows the bottom view of the components of top view 202. It will be observed from bottom view 206 that motherboard 210 and expansion board 220 do not include pads on the bottom side of the boards. In one example, the interconnection with the USM connector provides a connection on only one side of the board. Thus, the surfaces with pads (the top surfaces shown) may be substantially in the same plane and in-line with each other. Thus, the I / O (input / output) can be on only one side or on one surface of the PCB. The connector can then just connect the pads on one surface to provide an interconnection between the boards, which can improve the utilization of the vertical direction of the board space.

[0084] In bottom view 206, in one example, standoffs 216 and 226 may each extend completely through screw holes 214 and 224, or may only extend part way into the screw holes. A connector (not shown) can include posts or tabs that extend completely into alignment holes 218 and 228, or only part way into the alignment holes, or extend completely through the alignment holes and extend to the bottom side.

[0085] Figures 3A to 3D are block diagrams of an example of an in-line USM connector. The figures show the interconnection of a first PCB to a second PCB. In one example, the first PCB is a motherboard and the second PCB is an expansion module. In one example, both the first PCB and the second PCB are expansion substrates. Different views of the in-line USM connector show the elements of the connector as if looking through the layers of the connector while connecting the two substrates.

[0086] Referring to FIG. 3A, view 302 shows a pin assembly or lead frame that connects pads on the first PCB to pads on the second PCB. Lead frame 320 represents a conductor or electrical connector that makes an electrical connection between pads on the first PCB and pads on the second PCB when the connector is fixed. The leads span two rows of connecting PCBs.

[0087] The conductors may also be referred to as pins or beam contacts. The leads or pins of lead frame 320 are bridges between pads of two devices or two substrates. In one example, the pins are spring contacts that press against an upper plate of the connector (hereinafter described as case or cover 350). Close-up 330 shows the end of lead frame 320. Lead frame 320 is composed of a plurality of individual leads 332 including a plurality of feet 334. One foot contacts a pad on the first PCB and the other foot contacts a corresponding pad on the second PCB. Straight lines and curves are shown and are referred to as curve 336. The straight lines indicate the surface planes of the surfaces of the first PCB and the second PCB. The arc indicates the curvature of one lead 332.

[0088] Thus, when engaged with the connector and fixed by screws, the connector presses the lead frame 320 against the PCB pads, bridging between the corresponding pads. Depending on the lead configuration, the assembly of the lead frame can withstand a relatively large force (collectively, several pounds of force can be applied to the connector case and thus to the screws). Such force can provide a good engagement force to hold the first PCB to the second PCB and ensure the electrical connection of the pads. Such a connection enables a low-cost lead frame where the connector design holds an expansion card to another expansion card or holds an expansion card to the edge of the motherboard, and enables high-speed signal transmission.

[0089] The alignment key 312 (or alignment hole) indicates a keying or alignment structure engaged by the alignment frame of the connector. In one example, the standoff 314 is electrically connected to a ground plane within the PCB. In one example, the screw 316 engages the standoff 314. Alternatively, the standoff 314 can be replaced by a spacer that can be electrically connected to the ground plane of the PCB, or alternatively, simply provide a guide for a screw passing through a through-hole exposed in the substrate for the screw 316 to engage the housing. The standoff 314 can include threading for a screw hole, providing a screw-type structure to secure the screw 316.

[0090] In any configuration, the screw 316 can be electrically connected to the ground of the substrate or the system ground, grounding the connector. The screw 316 can also provide a thermal path for the connection, enabling heat transfer that can also allow for a higher signal speed. In one example, the connector includes a ground bar 322 (alternatively, may be referred to as a ground strap). The ground bar 322 can selectively connect the ground pins of the lead frame 320. By connecting the ground bar 322 to the ground pins, it can be ensured that each pin has a strong path to ground. If the connector cover is metallic, the ground bar 322 can physically contact the metal cover, providing a strong ground path to ground through the screw 316 and the standoff 314.

[0091] Referring to FIG. 3B, view 304 shows that alignment frame 324 covers lead frame 320, and thus includes alignment frame 324 above lead frame 320 that is not explicitly visible in view 304. In one example, the alignment frame includes a mechanical support for ground bar 322 included in the connector. The mechanical support may include space and structural features that enable the ground bar 322 to be used. The structural features may include gaps in the frame body or frame molding, enabling the ground bar to extend and physically contact the leads and physically contact the outer cover of the connector.

[0092] Alignment frame 324 fixes lead frame 320 and holds the leads in place. Further, alignment frame 324 includes posts, tabs, or other structures that engage alignment keys within the first PCB and the second PCB. Since the alignment keys are covered by alignment frame 324, the alignment keys are not visible in view 304. In one example, ground bar 322 extends through alignment frame 324 and provides a beam contact for grounding that connects to the cover.

[0093] In one example, alignment frame 324 is a plastic frame. The plastic frame can be a low-cost plastic molded product that can be 3D (three-dimensional) printed, injection molded, or machined. Alignment frame 324 can provide high precision in lead spacing (e.g., the distance between adjacent leads), which supports the lead frame design and enables high-precision alignment of contact to the PCB pads. In addition to the structure of the alignment frame itself that holds the leads, the alignment or keying mechanism that engages alignment holes within the PCB ensures high-precision alignment of the leads with pads.

[0094] Referring to FIG. 3C, view 306 shows the back or bottom side of the first PCB and the second PCB when engaged by the connector. The screw holes 340 can be holes in the PCB that allow the use of screws, which may or may not use spacers or standoffs depending on the system design. In one example, the screw holes 340 are shown as vias 342 lined with metal and connected to the ground plane in the PCB, representing the electrical connection of the screw holes to the ground plane in the substrate.

[0095] Grounding the screw holes to the ground plane of the PCB has the advantages of ensuring good grounding and providing a thermal path for good electrical grounding and heat from the connector. The alignment keys 312 are filled with posts or tabs from the alignment frame 324 that mate and engage with holes in the PCB. As described above, the posts in the connector can be offset with respect to the center of the lead frame or centered on the center of the lead frame. The alignment mechanism of the alignment frame 324 can include a first pair of posts corresponding to a first pair of alignment holes in the first PCB and a second pair of posts corresponding to a second pair of alignment holes in the second PCB.

[0096] Referring to FIG. 3D, view 308 shows a complete connector having a cover 350 that surrounds the alignment frame 324 which in turn surrounds the lead frame 320. The cover 350 includes screw holes 352 for receiving screws 316. The screw holes 352 allow the screws 316 to be inserted through the connector and represent the mechanism within the cover 350 that holds the connector against the first PCB and the second PCB when threaded (e.g., standoffs on the substrate or standoffs on the housing). Holding the connector against the PCB can also function to hold the PCB along with the connector.

[0097] In one example, the cover 350 includes a corrugation mechanism 354. The corrugation mechanism 354 represents alternating peak and recessed mechanisms within the cover and improves structural rigidity. Corrugation reduces the possibility of folding or creasing along an axis orthogonal to the alignment of the corrugation. Thus, the screw 316 on the opposite side of the corrugation mechanism having longitudinal corrugation across the rectangular contour of the connector can increase rigidity across the connection from one pair of screws to the other.

[0098] In one example, the cover 350, which may alternatively be referred to as a case or top shield, is electrically conductive. In one example, the cover 350 is metallic or made of a material selected to provide conductivity and thermal conductivity. Since the cover 350 provides an EMF (electromagnetic frequency) shield over the leads of the signal lines or lead frame 320, grounding the connector through the cover 350 can provide improved signal quality. Grounding the cover 350 with a ground bar 322 and ground pins can improve signal quality and noise suppression.

[0099] In one example, the screws 316 and standoffs 314 are selected from metallic materials that provide high thermal conductivity and high electrical conductivity and can provide good thermal and electrical paths for the connector when engaged with the cover 350.

[0100] A connector including a lead frame 320, an alignment frame 324, and a cover 350 provides a connector structure for connecting expansion cards within a computer system. The PCI-SIG M.2 standard available from the PCI-SIG (Peripheral Component Interconnect Special Interest Group), first published in December 2013, significantly reduces the z-axis or height of the system due to the connection standards of modules that connect to PCI (peripheral component interconnect), mSATA (mini serial advanced technology attachment), and USB (universal serial bus). PCI-SIG M.2 includes contacts or pads on both sides of the substrate, which can be a limiting factor for height in new computing devices. The M.2 standard is limited to a height of 2.4 mm for a high-speed PCIe4 (PCI express generation 4) connector, or alternatively 2.75 mm. A connector according to views 302, 304, 306, and 308 can provide a total connector height of 1.3 mm.

[0101] The ground selection enables maintaining the same height even for high-speed signal connections. Thus, the connector can provide a very low-profile interconnection to a WiFi module, Bluetooth® module, WWAN module, SSD module, or other peripheral modules. By attaching a module having the described connector after simple PCB processing, a computing system with a very thin form factor can be enabled without increasing the total development cost of the system for different system configurations. The connector can enable the use of modules that are already emission compliant, reducing or eliminating the need to test for EMI (electromagnetic interference) noise for different system configurations.

[0102] Figures 4A to 4C are block diagrams of an example of fixing an extension board to a motherboard using an in-line USM connector. These figures show a combination of an example of a connector according to views 302, 304, 306 and 308 and an example of a PCB configuration according to views 202, 204 and 206.

[0103] Referring to FIG. 4A, view 402 shows a motherboard 410 and an extension board 420 representing two connected PCBs. The motherboard 410 includes pads 412, and the extension board 420 includes pads 422. Alignment holes 434 on the motherboard 410 and the extension board 420 provide keying to the connector 430.

[0104] The connector 430 includes screw holes 432 for accommodating screws 440. The connector 430 is placed on or above standoffs 436 on the motherboard 410 and the extension board 420, and the screw holes 432 of the connector 430 are aligned with corresponding screw holes or holes in the motherboard 410 and the extension board 420. The screws 440 fix the connector 430 to the motherboard 410 and the extension board 420, which interfaces the pads 412 and pads 422 to the leads of the connector 430.

[0105] The connector 430 can be regarded as a board-to-board connector. Although not visible in view 402, the connector 430 includes a lead frame that provides electrical contact between the pads 412 and pads 422, an alignment frame that holds the lead frame and aligns with the alignment holes 434, and an external case or cover that houses the screws 440 and fixes the alignment frame and the lead frame.

[0106] Referring to FIG. 4B, view 404 shows a connector 430 engaged with a motherboard 410 and an expansion board 420 using screws 440. More specifically, the screws are identified in view 404 as screws 442 and screws 444. Screw 442 can be referred to as one pair of screws that fix one side of the connector 430. It will be observed that the connector 430 generally has a rectangular contour and has a pair of screws on the short end portion on the opposite side of the connector. Screw 442 is on one short end portion of the connector, and screw 444 is on the other short end portion of the connector 430.

[0107] For screw 442, one screw is connected to the motherboard 410 and the other screw is connected to the expansion board 420. Similarly, for screw 444, one screw is connected to the motherboard 410 and the other screw is connected to the expansion board 420. Screw 442 can be regarded as one pair of screws on one end of the row of leads of the connector 430, and screw 444 will be regarded as the other pair of screws on the other end of the row of leads.

[0108] In one example, the expansion board 420 includes screw holes 424 that accommodate screws (not shown) to fix the expansion board 420 to a system housing (not shown). In view 404, the expansion board 420 includes screw holes that accommodate one screw 442 and one screw 444 in the hole closest to the motherboard 410. The expansion board 420 also includes screw holes 424 on the distal end of the board from the motherboard 410, which accommodate additional screws to fix the rear end of the expansion board 420 to the system housing of an additional structural support.

[0109] Referring to FIG. 4C, view 406 represents a cross-sectional view of the connector 430 showing the connection of the connector to the board. In one example, the motherboard 410 and the expansion board 420 include vias 450 in a board that is lined with conductors and has holes in the board that are electrically connected to the ground planes of the respective boards. In one example, the standoff 436 is soldered to the via 450. Thus, the standoff 436 is grounded to the board.

[0110] The screw 442 fixed to the standoff 436 is shown in cross-section. Screws 444 for fixing the other end of the connector 430 to the motherboard 410 and the extension board 420 can also be seen. View 406 shows the corrugation mechanism 460 within the connector 430 that increases the rigidity of the connector about an axis orthogonal to the lead bridge of the connector 430.

[0111] The screws 442 and 444 can provide a connector that is firmly and securely fixed to the extension board 420 and the motherboard 410. When the standoff 436 is grounded and the screws are electrically and thermally conductive, the screws 442 and 444 add a robust connection for thermal and electrical grounding between the systems of the motherboard 410 and the extension board 420. Since a metal shield, cover, or case surrounding the signal lines of the connector is grounded, grounding the connector 430 can provide improved signal quality, which will suppress EMI.

[0112] Figure 5A is a cross-sectional view of an example of an in-line USM connector. View 500 shows a cross-sectional view of the connector 530 that connects the PCB 510 to the PCB 520. The PCB 510 can be a motherboard or an extension card. The PCB 520 is an extension card.

[0113] Connector 530 is represented by the mechanism enclosed by the dashed line. Connector 530 includes leads 532. Although not specifically labeled, it will be observed that leads 532 include one foot that contacts a pad on PCB 510 and the other foot that contacts a pad on PCB 520. View 500 shows leads 532 having a curved shape, which can provide a spring force when connector 530 is fixed by a screw (not shown). More specifically, lead 532 can be implemented as an arch-shaped spring having some bending due to the force applied from cover 550, where the leads 532 oppose with equal and opposite forces. Thus, by fixing cover 550 to the PCB, when connector 530 is fixed by a screw, a force is applied to leads 532 to press the contact points of the leads against the pads on the PCB. The force applied to leads 532 by the connector can displace the arch shape by approximately 0.15 mm.

[0114] In one example, lead 532 includes arms that extend from a central point to each side of the foot that physically and electrically contacts the signal pad. In one example, lead 532 includes arms that extend vertically upward around the perimeter of the central region. When the spring of lead 532 is engaged, the vertically extending arms will tend to clamp toward the center. In one example, connector 530 includes a ground bar 534 that extends under the center between the vertical arms of lead 532. It will be understood that ground bar 534 includes tabs that extend under the vertical arms so that the leads are selectively contacted, and does not include tabs so that the signal lines are not connected to ground. The spring action of lead 532 can operate to ensure a secure physical and electrical contact between the ground lead and ground bar 534.

[0115] Connector 530 includes a frame 540 shown as two separate parts in the cross-sectional view. Although the frame 540 can be implemented as two separate parts, in reality, the frame 540 can preferably be a single robust part. The frame 540 secures the leads 532. In one example, the frame 540 includes posts 542 and 544 that extend on or through the PCB and represent a post or tab or extension of the frame, which can be referred to as a center post. Post 542 represents a pair of keying mechanisms that align with keying holes within the PCB 510. Post 544 represents a pair of keying mechanisms that align with keying holes within the PCB 520.

[0116] Connector 530 includes a cover 550 that surrounds the leads and the frame 540. The connector 530 includes screw holes (not shown) for securing the connector to the PCBs 510 and 520. In one example, the cover 550 includes a corrugation mechanism 552 as a reinforcement mechanism. The corrugation 552 enables the cover 550 to withstand the pressure of the spring action force of the leads 532.

[0117] View 500 shows via 512 within the PCB 510 and via 522 within the PCB 520. Vias 512 and 522 represent electrical vias that connect signal line pads on the PCB and connect to the ground planes on their respective PCBs. Thus, a ground lead can be connected to the ground plane via a pad on the surface of the PCB, via a via, and can also be connected to the cover 550 that can also be connected to the ground plane via a screw.

[0118] Figure 5B is a diagram of an example of an in-line USM connector that connects to a system housing. View 560 shows a view of the connector 530 having screws 536 for securing the connector to the PCBs 510 and 520.

[0119] In one example, the connector 530 is fixed to the PCBs 510 and 520 via a threaded or threaded standoff that enables the connector to be fixed using screws. View 560 shows a screw 536 that extends through the connector 530 and the PCB 510 and connects to the housing 570. The screw 536 also extends through the connector 530 and the PCB 520 and connects to the housing 570. Although not specified in view 560, the screw 536 may connect to the housing 570 through a spacer.

[0120] The housing 570 represents the housing of a computing system or a system housing in which the PCBs 510 and 520 are incorporated. In one example, the housing 570 includes a post 572 that extends upward from the inner surface of the housing 570 and interconnects with the screw 536. The post 572 is distinguished from a post that extends downward from the frame 540 and keys into an alignment hole. The post 572 is shown as having a thread that matches the screw 536. It will be understood that the threads on the screw 536 and the inside of the post 572 are not necessarily to scale. The relative heights and sizes of the other components are also not necessarily to scale.

[0121] In one example, the post includes a metal ring and extends into the through holes of the PCBs 510 and 520. Thereby, the PCB can be placed on the post with the through holes aligned with the lip around the post 572 and placed on the lip. Next, the screw 536 can fix the connector 530 and fix the PCBs 510 and 520 to the post.

[0122] FIG. 6 is an example of a representation of an in-line USM connector having an offset keying mechanism. The connector 600 is shown from a top view, a side view, and a bottom view.

[0123] Connector 600 includes a screw hole 610 that houses screws for fixing the connector to a PCB. The side view and bottom view show leads 620 that extend below the bottom surface of the connector and are in contact with and connected to pads on the PCB. The side view and bottom view also show posts 630 that represent the alignment mechanism of connector 600. They extend from the bottom of connector 600 and extend into and are connected to alignment holes on the substrate.

[0124] The top view shows dashed lines indicating that substrate 1 is connected to the upper half of connector 600 (as oriented in the figure) and substrate 2 is connected to the lower half. It can be observed from the side view and bottom view of the long end portion of connector 600 that posts 630 can be offset with respect to the center of the conductive line.

[0125] In the side view of the short end portion of connector 600, it can be seen that substrate 1 and substrate 2 are connected at symmetric distances with respect to the electrical pads and alignment holes. Symmetry between the leads is not necessarily required. Symmetry between the alignment mechanisms is not necessarily required. An example of an asymmetric design is provided below with respect to FIG. 8.

[0126] It will be understood that connector 600 is merely an example and that differences in shape, corrugation, shape and size of the corrugation, differences in the contour of the connector case, and other differences are possible. Further, examples of dimensions are provided, which are illustrative and may be changed proportionally or in a way that changes the ratio or proportion of the dimensions of the connector. Thus, there are merely non-limiting examples.

[0127] Consider the dimensions of the 50 - pin connector 600. The dimensions can vary proportionally along the x - axis for a 30 - pin connector, a 40 - pin connector, or a 60 - pin connector. In one example, the dimension in the x - direction (e.g., length) can be about 29 - 30 mm, such as 29.3 mm or 29.8 mm. The dimension in the y - direction (e.g., width) can be about 8 - 10 mm, such as 8.0 mm or 9.5 mm. The dimension in the z - direction (e.g., height) can be about 1 - 1.5 mm, such as 1.2 mm or 1.3 mm. For the 50 - pin configuration, the connector 600 can have a pitch of about 0.4 mm between pins or contacts. The dimension between the points of the leads 620 can be about 5 - 5.5 mm, such as 5.0 mm or 5.3 mm. The dimension between the posts 630 along the y - axis can be about 7 - 7.5 mm, such as 7.1 mm or 7.25 mm. The dimension between the posts 630 along the x - axis can be about 12 mm, such as 11.9 mm. The dimension between the screw holes along the y - axis can be about 4.5 - 5.0 mm, such as 4.5 mm or 4.8 mm, and the dimension between the screw holes along the x - axis can be about 25 - 26 mm, such as 25.1 mm or 25.7 mm.

[0128] Figures 7A - 7B are diagrams of an example of an in - line USM connector that connects to different electrical pads by reversing the USM connector. The connector 700 shows an asymmetric connector. The asymmetry can be useful for applying the connector to different types of expansion substrates.

[0129] Referring to FIG. 7A, the connector 700 is shown and described. The outline of the connector 700 is generally shown as a rectangle with a shorter end and a longer end. Screw holes, an alignment mechanism, and leads are shown for the purpose of explaining the capabilities of the reversibly - usable connector 700. For the purposes of the description herein, the view can be considered as looking at the top of the connector and passing through the connector to the associated mechanisms.

[0130] Connector 700 includes tabs 752 and 754 that extend from the connector and represent an alignment mechanism that is connected to the alignment holes of the substrate in turn. Connector 700 includes screw holes 742 and 744 that accommodate mounting screws for fixing the connector to the substrate. The tabs are labeled in pairs that are vertical or along the long ends of connector 700, and each pair connects to a different substrate. The screw holes are labeled in pairs that are along the short ends of connector 700, and each pair together connects two substrates.

[0131] Referring to FIG. 7B, the central figure shows the substrate layout of PCB 710 and a selective layout of PCB 720. PCB 710 includes two columns of pads, as shown, having one column closer to the end of PCB 710 and the other column further away from the end. PCB 720 includes one column of pads, either the column closer to the end of PCB 720 or the column further away from the end of PCB 720, but not both columns. Thus, PCB 710 includes both columns of pads and PCB 720 includes one or the other.

[0132] In direction 702, connector 700 will connect the column of pads further away from the end of PCB 710 to PCB 720 having the column of pads closer to the end. In direction 704, connector 700 rotates 180 degrees and connects the column of pads closer to the end of PCB 710 to PCB 720 having the column of pads further away from the end.

[0133] The dark dashed lines indicate that in both directions, screw holes 742 and 744 align with the screw holes in PCB 710 and PCB 720 along the long axis of connector 700. For the purpose of explaining the direction of connector 700, the screw holes in PCB 720 and PCB 710 on one side of lead 730 are designated as screw holes 712, and the screw holes on the opposite side of lead 730 are designated as screw holes 714.

[0134] In direction 702, the screw holes 742 of the connector 700 align with the screw holes 712, and the screw holes 744 align with the screw holes 714. In direction 704, the connector 700 rotates such that the screw holes 744 align with the screw holes 712, and the screw holes 742 align with the screw holes 714.

[0135] Furthermore, in direction 702, the tab 752 aligns with the hole 764 in the PCB 710, and the tab 754 aligns with the hole 768 in the PCB 720. In direction 704, the tab 752 aligns with the hole 766 in the PCB 720, and the tab 754 aligns with the hole 762 in the PCB 710. In one example, the tabs 752 and 754 are spaced symmetrically with respect to the center of the lead 730. In an alternative implementation, the tabs may be offset from the center but are not aligned with each other. Thus, if the tab 752 is offset towards the screw hole 742, the tab 754 will be offset by the same amount towards the screw hole 744. The corresponding holes in the PCB will need to be adjusted to align with the tab offset.

[0136] FIG. 8 is an example representation of an in-line USM connector that connects to different rows of electrical pads by reversing the direction of the connector. The connector 800 is shown in perspective, top, and side views.

[0137] The connector 800 includes screw holes 810 that accommodate screws for fixing the connector to the PCB. The side view shows leads 820 that extend below the bottom surface of the connector and are connected in contact with pads on the PCB. The side view also shows posts 830 that represent the alignment mechanism of the connector 800. They extend from the bottom of the connector 800 and extend into and are connected to alignment holes on the substrate.

[0138] The top view shows dashed lines indicating that substrate 1 connects to the upper half of the connector 800 (as oriented in the figure) and substrate 2 connects to the lower half. It will be observed from the side view of the short end of the connector 800 that the posts 830 can be offset with respect to the center of the connector 800 by the offset 840.

[0139] In a side view of the long end portion of the connector 600, it can be seen that the post 830 can be symmetric with respect to the lead 820. As described above, when the connector 800 is rotated 180 degrees, the post 830 does not necessarily have to be symmetric with respect to the lead as long as the post 830 has the same offset.

[0140] It will be understood that the connector 800 is merely an example, and that differences in shape, corrugation, shape and size of the corrugation, differences in the contour of the connector case, and other differences are possible. Further, examples of dimensions are provided, which are illustrative and may be changed proportionally or in a way that changes the size or ratio of the dimensions of the connector. Thus, there are merely non-limiting examples.

[0141] In one example, the connector 800 shows an example of a 40-pin connector. The dimensions can vary proportionally for other numbers of leads, such as a 30-pin connector, a 50-pin connector, or a 60-pin connector. In one example, the dimension in the x direction (e.g., length) can be about 25 - 30 mm, such as 26.0 mm. The dimension in the y direction (e.g., width) can be about 10 - 12 mm, such as 10.75 mm. The dimension in the z direction (e.g., height) can be about 1 - 1.5 mm, such as 1.2 mm or 1.3 mm. For the 40-pin configuration, the connector 800 can have a pitch of about 0.4 mm between pins or contacts. The dimension between points of the lead 820 can be about 4 - 5 mm, such as 4.3 mm. The dimension between posts 830 along the y-axis can be about 6 - 7 mm, such as 6.5 mm. The dimension between posts 830 along the x-axis can be about 10 - 15 mm, such as 13 mm. The dimension between screw holes along the y-axis can be about 4 - 6 mm, such as 5.0 mm, and the dimension between screw holes along the x-axis can be about 20 - 24 mm, such as 21.25 mm.

[0142] Figure 9 is an example of the layout of a substrate connected by a USM connector. Diagram 900 more specifically shows an overlay of leads or contacts from the connector above the layout of signal pads for a system to use the USM connector. The layout excludes alignment holes that can change the routing of either ground vias or signal lines, or both ground vias and signal lines.

[0143] Diagram 900 shows the connection of 26 signal lines. Some implementations will include more signal lines. Other implementations may have fewer signal lines. Regardless of the number of signal lines, the basic mechanism of the connector does not change. However, the following example provides an example of ground improvement for a system with a large number of signals to connect.

[0144] PCB910 represents a first PCB that is connected to a second PCB, PCB920. The PCBs are connected end-to-end or edge-to-edge. PCB910 includes pads 912 that represent pads connected to signal lines such as TX0, RX0, TX1, RX1, TX2, and RX2. Although the corresponding signal lines of PCB920 are not shown, the signal path-through characteristics will be understood from Diagram 900. PCB920 includes pads 922 that are connected to pads 912 via leads 930 of a connector (not explicitly shown).

[0145] PCB910 includes ground (GND) vias 914 that represent connecting signal lines to the ground plane of PCB910. Similarly, PCB920 includes ground (GND) vias 924 that represent connecting signal lines to the ground plane of PCB920. It will be understood that the signals are represented by differential signal transmission where the signal and its complement are transmitted on parallel wires or signal lines. Differential signals can improve signal quality in high-speed signal transmission. The signal quality can be further improved by using two ground signal lines between each differential pair. Such a layout is not necessary.

[0146] In addition to being grounded via a ground via, in one example, the ground signal line of lead 930 may be grounded to a ground (GND) bar 940, which indicates a ground (GND) contact 942 for the ground signal line. In accordance with what has been described above, the ground bar 940 may be connected to a conductive cover for a connector that is grounded via a mounting screw.

[0147] Figures 10A - 10B illustrate an example of a ruler substrate of a system having an in - line USM connector and a top - mount USM connector. Substrate 1010 represents a system substrate in a ruler substrate configuration. Here, one dimension is significantly longer than the other. Assuming that component 1012 represents a system processor or a system - on - chip (SOC) of a host processor for substrate 1010, it can be observed that one dimension of substrate 1010 is not significantly larger than the dimension of the processor, and the other dimension of substrate 1010 is significantly larger.

[0148] Figure 10A shows view 1002, which is a perspective view of substrate 1010 and components connected to substrate 1010 on substrate 1010. View 1002 represents the relative dimensions of substrate 1010. Substrate 1010 includes component 1014, which is a component other than the system processor. In any configuration for a particular implementation of substrate 1010, any number of components may be present.

[0149] In one example, the system includes a USMi1042, which represents an in - line low - profile connector that connects substrate 1040 to substrate 1010. Substrate 1010 includes one or more components 1044 that provide the functions of an expansion substrate. In the system of view 1002, substrate 1040 is connected to one end of substrate 1010 over a short dimension.

[0150] In one example, the system includes USMi1032, an in-line rope profile connector that connects substrate 1030 to the other end of substrate 1010, on the opposite side of the end to which substrate 1040 is connected. Substrate 1030 includes one or more components 1034 mounted on the substrate that provide functionality to substrate 1010.

[0151] In one example, the system includes USMt1022, a top mount rope profile connector that connects substrate 1020 to substrate 1010. In one example, substrate 1020 is placed on or in contact with substrate 1010. In an alternative example, substrate 1020 can be mounted above the upper portion of substrate 1030 using a connector USMt1022 having a higher vertical offset between the two sides. Substrate 1020 includes one or more components 1024 mounted on substrate 1020. In one example, substrate 1020 is fixed to substrate 1010 via USMt1022 and screw 1026.

[0152] FIG. 10B shows view 1004, a side view of view 1002 that just shows the end of substrate 1010 with substrates 1020 and 1030 connected to substrate 1010. In view 1004, it can be seen that substrate 1020 is supported by substrate 1010 when connected to USMt1022. In contrast to substrate 1020 being supported by substrate 1010, substrate 1030 is in-line or in the same plane as substrate 1010 and is connected to USMi1032.

[0153] The dark regions within USMi1032 represent contacts or leads for the in-line connector. The leads are identified as beam contacts 1050. A beam contact refers to a profile in a side view of a lead that shows one or more supports at the center of the lead and arms that extend outwardly to either side of the central support.

[0154] The dark regions within USMt1022 represent contacts or leads for top mount connectors. The leads are identified as offset beam contacts 1070. The offset beam contacts have a similar side profile as a straight beam contact with one arm offset perpendicular to the other arm. The perpendicular offset of the arms reflects the vertical offset of the top mount connector and the vertical difference between the surfaces of the two substrates being connected. The offset beam contacts 1070 may alternatively be referred to as dual beam contacts, with the different arms being referred to as different beams extending outward from the central support of the contact.

[0155] Figure 10C is an example of a beam contact for an in-line USM connector. The beam contact 1050 is an enlarged view of the contact following the dark region within USMi1032 from view 1004. It can be observed that while the dark region in Figure 10B has two supports in the center, the beam contact 1050 in Figure 10C shows only a single contact. The beam contacts or leads for in-line connectors can include either a single central support or multiple central supports.

[0156] The beam contact 1050 shows a support 1056 at the center of the contact, an arm 1052 having an arch shape and extending in one direction away from the support 1056, and an arm 1054 having an arch shape and extending in the opposite direction away from the support 1056. The arm 1052 includes a foot 1062 which is part of the contact placed on a pad on the surface of the first substrate being connected. The arm 1054 includes a foot 1064 which is part of the contact placed on a pad on the surface of the second substrate being connected. It will be understood that the "first" substrate and the "second" substrate are relative and the designation can be reversed.

[0157] Arms 1052 and 1054 each include an arch type having a curvature from the support 1056 to the foot 1062 and an arch type having a curvature from the support 1056 to the foot 1064. The curvature enables the beam contact 1050 to bend. The bending provides pressure against the feet 1062 and 1064 and maintains the plurality of feet in contact with their respective pads. The bending is created by the downward force applied when the screw secures the connector to the substrate.

[0158] FIG. 10D is an example of a beam contact for a top mount USM connector. The offset beam contact 1070 is an enlarged view of the contact following the dark region within the USMt 1022 from view 1004. As with the offset beam contact 1070 in FIG. 10D, it can be observed that the dark region in FIG. 10B has two supports in the center. The offset beam contact or lead for a top mount connector can include either a single central support or a plurality of central supports.

[0159] The offset beam contact 1070 has an arch type and shows a support 1076 at the center of the contact having an arm 1072 extending away from the support 1076. The shorter support 1076 connects to the arm 1072 that connects to a substrate having a higher vertical position. The offset beam contact 1070 has an arch type and shows a support 1078 at the center of the contact having an arm 1074 extending away from the support 1078. The longer support 1078 connects to the arm 1074 that connects to a substrate having a lower vertical position. In one example, the support 1078 is thicker than the support 1076, which may enable the support to better transmit the force from the connector downward by an additional vertical distance to the arm 1074.

[0160] The arm 1072 includes a leg 1082 that is part of a contact placed on a pad on the surface of a first substrate to be connected. The arm 1074 includes a leg 1084 that is part of a contact placed on a pad on the surface of a second substrate to be connected. It will be understood that the “first” substrate and the “second” substrate are relative and the designations may be reversed.

[0161] The arm 1072 and the arm 1074 each include an arch type having a curvature from the support 1076 to the leg 1082 and an arch type having a curvature from the support 1078 to the leg 1084. The curvature enables the offset beam contact 1070 to bend, and more specifically, enables each arm to bend. The bending provides pressure against the legs 1082 and 1084 and maintains the plurality of legs in contact with their respective pads. The bending is created by a downward force applied when the screw secures the connector to the substrate.

[0162] The offset 1080 represents the vertical offset between the substrates connected to the offset beam contact 1070 by the connector. It will be observed by the dashed lines and the dashed arrows that the offset 1080 with respect to the substrate can match the offset with respect to the arms 1072 and 1074. Maintaining the arms in the same relative shape can maintain the same relative bending characteristics by adjusting the central support or supports to properly direct the force of the connector onto the beam.

[0163] FIG. 11A is an example of an extended substrate having a top mount USM connector. The system 1100 shows an example of an extended substrate that connects to a system substrate or other extended substrate using a top mount, low profile connector. The substrate 1110 represents the extended substrate itself, and the connector 1130 represents the top mount connector.

[0164] The substrate 1110 includes one or more components 1120 mounted on the substrate. In one example, an element within the system 1100 identified as a component 1120 represents a shield or cover for a plurality of components mounted on the substrate 1110. The shield or cover can be a requirement for electromagnetic interference compliance. The presence of such a shield indicates another advantage to the connector described in that the connector can include a grounded conductive shield or case that reduces noise for high-speed signals to and from the daughter board.

[0165] The screw holes 1112 within the substrate 1110 represent holes that accommodate mounting screws that connect to the substrate and do not directly connect to the connector 1130. The screw holes 1132 represent screw holes within the connector 1130 that accommodate screws. Mounting screws for the connector can be referred to as connector screws and specifically fix the connector to a first substrate on one side and to a second substrate on the opposite side. The second substrate is not specifically shown in the system 1100. The screw 1140 represents a screw that fixes the connector to the daughter board 1110. Screw holes for screws to a system board, receiver board, or carrier board are not shown in the system 1100.

[0166] In one example, the mechanism of the connector 1130 will be the same as or almost the same as an equivalent in-line board except for the mechanism that allows for a vertical difference between the two sides of the connector. In one example, the connector 1130 includes a corrugation 1134. The example dimensions provided previously for the connector 600 can provide an example of the dimensions of the connector 1130 except for the dimension along the z-axis. The dimension along the z-axis can vary depending on the configuration of the connector 1130, such as those described in the examples of FIGS. 12-18. In these examples, not all component dimensions are necessarily drawn to scale.

[0167] System 1100 shows an offset 1150 that represents the offset between the expansion board side of connector 1130 and the receiver board side of connector 1130. The offset within system 1100 is simply the thickness of substrate 1110. In other configurations, the offset is higher.

[0168] Figure 11B is an example of contacts for a top mount USM connector. The offset beam contact 1070 of Figure 10D provides an example of a USMt contact. View 1102 provides an alternative implementation of the USMt contact in the view of system 1100. View 1102 shows substrate 1110 above system substrate 1160. Connector 1130 connects substrate 1110 to system substrate 1160.

[0169] View 1102 includes contacts 1170 that provide electrical contact between pads on substrate 1110 and pads on system substrate 1160. In one example, contact 1170 includes an arm 1172 that curves upward from the center of connector 1130 to a pad on substrate 1110. In one example, contact 1170 includes an arm 1174 that curves downward from the center of connector 1130 to a pad on system substrate 1160. In one example, the center of connector 1130 includes one or more supports 1176. The supports may connect the arms of contact 1170 to the mechanical structure (e.g., lead frame) of connector 1130.

[0170] Figure 12 is an example of a system configuration having a top mount USM connector that includes an expansion board directly on a system substrate. System 1200 represents an example of a system having a top mount connector. Carrier substrate 1210 represents a substrate, such as a system substrate, motherboard, or other expansion board, to which an expansion board may be connected.

[0171] Module 1220 represents an extension board having one or more components 1230 mounted on a module substrate. USMt1240 represents a top mount connector that connects module 1220 to carrier substrate 1210. Screw 1252 represents a screw at the "rear" end of module 1220, which is the end of module 1220 opposite USMt1240. Screw 1252 has a head that is fixed to the PCB of module 1220 and has a thread that extends through the substrate of module 1220 to carrier substrate 1210.

[0172] Screw 1254 represents a screw that fixes USMt1240 to module 1220. Screw 1256 represents a screw that fixes USMt1240 to carrier substrate 1210. In one example, screw 1254 has a head that is placed within a recess in the connector associated with the screw hole. Screw 1254 extends into module 1220 but does not extend into carrier substrate 1210. In one example, screw 1256 has a head that is placed within a recess in the connector associated with the screw hole.

[0173] The height (identified as the dimension in the z - direction) can be determined by the thickness of the substrate of module 1220. For example, for a 0.6 mm PCB for module 1220, USMt1240 can have a height, z, of about 2.0 mm. As another example, for a 0.8 mm PCB for module 1220, USMt1240 can have a height, z, of about 2.2 mm.

[0174] Figure 13 is an example of a system configuration having a top mount USM connector that includes a height offset to allow spacing for components on an extension board between the extension board and a system board. System 1300 represents an example of a system having a top mount connector. Carrier substrate 1310 represents a substrate, such as a system board, motherboard, or another extension board, to which an extension board can be connected.

[0175] Module 1320 represents an expansion board having one or more components 1330 mounted on a module substrate on a surface including pads or contacts to which USMt1340 is connected. USMt1340 represents a top mount connector that connects module 1320 to carrier substrate 1310. In one example, module 1320 includes one or more components 1370 on the module substrate on a surface opposite the surface including pads or contacts. Considering the surface of module 1320 having pads which is the "upper" surface, the module includes components 1330 on the upper surface and components 1370 on the bottom surface.

[0176] Screw 1352 represents a screw at the "rear" end of module 1320, which is the end of module 1320 opposite USMt1340. Screw 1352 has a head for fixing to the PCB of module 1320 and has a threaded portion extending through the substrate of module 1320 to carrier substrate 1310. In one example, system 1300 includes a spacer or standoff 1360 that bridges the gap between the substrate of module 1320 and carrier substrate 1310. The standoff may be adapted to fit into a threaded hole.

[0177] Screw 1354 represents a screw for fixing USMt1340 to module 1320. Screw 1356 represents a screw for fixing USMt1340 to carrier substrate 1310. In one example, screw 1354 has a head placed within a recess in the connector associated with the threaded hole. Screw 1354 extends into module 1320 but does not extend outside on the opposite side. In one example, screw 1356 has a head placed within a recess in the connector associated with the threaded hole.

[0178] In one example, USMt1340 includes a footing 1342 that may alternatively be referred to as a base or support. The footing 1342 represents the structure of USMt1340 that provides a structural support to module 1320 when connecting module 1320 to carrier substrate 1310. When module 1320 is supported at one end by a screw 1352 fixed to carrier substrate 1310 through a standoff 1360 and at the other end by USMt1340, significant stress may exist on the substrate via screw 1354. The footing 1342 extends USMt1340 under the end or ends of module 1320 that interface with USMt1340. Using the footing 1342, USMt1340 can contact the surface of module 1320 having pads, and the opposite surface, and the end of the module substrate connecting the two surfaces. The footing 1342 may include a ledge or extension that extends under module 1320 that allows the position of the end of the substrate to rest or make contact, which reduces the force applied to the substrate by screw 1354 by transmitting force to the physical contact of the substrate end using a connector.

[0179] In one example, USMt1340 has a height sufficient to leave a gap 1372 between component 1370 attached to module 1320 and carrier substrate 1310. In one example, instead of leaving a gap, the space may be occupied by a material that provides electrical shielding and thermal conductivity. The gap 1372 can be any amount of space that makes sense for the system structure. In one example, the gap 1372 is about 0.3 mm.

[0180] The height of the USMt1340 (identified as the dimension in the z - direction) can be determined by the thickness of the substrate of the module 1320 and how much space is left under the module. For example, for a 0.6 mm PCB for the module 1320, the USMt1340 can have a height z of approximately 3.3 mm, the spacing for components having a height of about 1.0 mm. As another example, for a 0.8 mm PCB for the module 1320, the USMt1340 can have a height z of approximately 3.5 mm, the spacing for components having a height of about 1.0 mm. As another example, for a 0.6 mm PCB for the module 1320, the USMt1340 can have a height z of approximately 3.8 mm, the spacing for components having a height of about 1.5 mm. As another example, for a 0.8 mm PCB for the module 1320, the USMt1340 can have a height z of approximately 4.0 mm, the spacing for components having a height of about 1.5 mm.

[0181] Figure 14A is an example of a system configuration having a top - mount USM connector that includes a height offset enabling spacing for components on a system board between an expansion board and the system board. System 1400 represents an example of a system having a top - mount connector. The carrier substrate 1410 represents a substrate, such as a system board, motherboard, or other expansion board, to which an expansion board can be connected.

[0182] The module 1420 represents an expansion board having one or more components 1430 mounted on a module substrate on a surface that includes pads or contacts to which the USMt1440 connects. The USMt1440 represents a top - mount connector that connects the module 1420 to the carrier substrate 1410. In one example, the carrier substrate 1410 includes one or more components 1480 mounted on the carrier substrate under the module 1420.

[0183] Screw 1452 represents a screw at the "rear" end of module 1420, which is the end of module 1420 opposite to USMt 1440. Screw 1452 has a head for fixing the PCB of module 1420 and has a thread that extends through the substrate of module 1420 to carrier substrate 1410. In one example, system 1400 includes a spacer or standoff 1460 that bridges the gap between the substrate of module 1420 and carrier substrate 1410.

[0184] Screw 1454 represents a screw for fixing USMt 1440 to module 1420. Screw 1456 represents a screw for fixing USMt 1440 to carrier substrate 1410. In one example, screw 1454 has a head placed within a recess in a connector associated with a screw hole. Screw 1454 extends into module 1420 but does not extend to the outer side on the opposite side. In one example, screw 1456 has a head placed within a recess in a connector associated with a screw hole.

[0185] In one example, USMt 1440 includes a footing 1442 that may alternatively be referred to as a base or support. Footing 1442 represents the structure of USMt 1340 that provides a structural support to module 1420 when connecting module 1420 to carrier substrate 1410. When module 1420 is supported at one end by screw 1452 that fixes carrier substrate 1410 through standoff 1460 and is supported at the other end by USMt 1440, significant stress may exist on the substrate via screw 1454. Footing 1442 extends USMt 1440 under the end or ends of module 1420 that interface with USMt 1440. Using footing 1442, USMt 1440 can contact the surface of module 1420 having pads, the opposite surface, and the end of the module substrate connecting the two surfaces. Footing 1442 may include a ledge or extension that extends under module 1420 that allows the position of the end of the substrate to be stationary or in contact, which reduces the force applied to the substrate by screw 1454 by transmitting force to the physical contact of the substrate end using a connector.

[0186] In one example, the footing 1442 extends stepwise within the USMt1440. The footing 1442 can be an alternative footing design to the footing 1342 of the system 1300. The footing 1442 has a portion under a structure that extends from the module substrate and away from the module substrate towards the system substrate. The footing 1342 has a portion under a structure that extends from the module substrate and under the module substrate towards the system substrate. Although the footing 1342 is shown as having angled ends and the footing 1442 is shown as being stepped, in alternative versions of the footing, either footing can be angled and either footing can be stepped.

[0187] In one example, considering the surface of the module 1420 having pads and that the component 1430 is on top of the module, the USMt1440 has a height sufficient to leave a gap 1482 between the component 1480 mounted on the carrier substrate 1410 and the bottom of the module 1420. In one example, instead of leaving a gap, the space can be occupied by a material that provides electrical shielding and thermal conductivity. The gap 1482 can be any amount of space that makes sense for the system structure. In one example, the gap 1482 is about 0.3 mm.

[0188] The height of the USMt1440 (identified as the dimension in the z - direction) can be determined by the thickness of the substrate of the module 1420 and how much space is left under the module. For example, for a 0.6 mm PCB for the module 1420, the USMt1440 can have a height z of about 4.4 mm, providing a spacing for components having a height of about 2.1 mm. As another example, for a 0.8 mm PCB for the module 1420, the USMt1440 can have a height z of about 4.4 mm, providing a spacing for components having a height of about 1.9 mm.

[0189] Figure 14B is a representation of a top mount connector having a stepped footing. View 1402 shows module 1420 connected to USMt1440. Screw 1454 secures module 1420 to USMt1440. Screw 1456 secures USMt1440 to the system board. Footing 1442 represents the structure of USMt1440 that extends under module 1420 and provides additional structural support for module 1420.

[0190] Figure 14C is a perspective view of the top mount connector of Figure 14B. View 1404 shows module 1420 supported on the internal elements of USMt1440. The outer case of USMt1440 has been removed in view 1404. Hole 1474 represents a hole that houses screw 1454 which secures module 1420 to USMt1440. View 1404 shows screw 1456. View 1404 shows footing 1442 that extends under module 1420. View 1404 also shows support 1472 for footing 1442. In one example, footing 1442 extends under USMt1440 away from module 1420. In one example, support 1472 includes multiple steps and provides a physical structure from the system board to the end or ends of module 1420.

[0191] Figure 15 is an example of a system configuration having a top mount USM connector for directly attaching an expansion board above another expansion board to a system board using another top mount USM connector. System 1500 represents an example of a system having a top mount connector. System board 1510 represents a board, such as a primary system board or motherboard, to which an expansion board can be connected. System 1500 represents two expansion boards connected to system board 1510.

[0192] Module 1520 represents a first expansion board having one or more components 1522 mounted on a module substrate. USMt1540 represents a top mount connector that connects module 1520 to system board 1510. Screw 1562 represents a screw at the "rear" end of module 1520, which is the end of module 1520 opposite USMt1540. Screw 1562 has a head that is fixed to the PCB of module 1520 and has a thread that extends through the substrate of module 1520 to system board 1510.

[0193] Screw 1564 represents a screw that fixes USMt1540 to module 1520. Screw 1566 represents a screw that fixes USMt1540 to system board 1510. In one example, screw 1564 has a head that is placed within a recess in a connector associated with a screw hole. Screw 1564 extends into module 1520 but does not extend into system board 1510. In one example, screw 1566 has a head that is placed within a recess in a connector associated with a screw hole.

[0194] The height of USMt1540 (identified as the z1 dimension) can be determined by the thickness of the substrate of module 1520. For example, for a 0.6 mm PCB for module 1520, USMt1540 can have a height, z1, of approximately 2.0 mm. As another example, for a 0.8 mm PCB for module 1520, USMt1540 can have a height, z1, of approximately 2.2 mm.

[0195] Module 1530 represents a second expansion board having one or more components 1532 mounted on a module substrate on a surface that includes pads or contacts to which USMt1550 is connected. Module 1530 is mounted above module 1520. USMt1550 represents a top mount connector that connects module 1530 to system board 1510 above module 1520.

[0196] Screw 1572 represents a screw at the "rear" end of module 1530, which is the end of module 1530 opposite to USMt 1550. Screw 1572 has a head for fixing to the PCB of module 1530 and has a thread that extends through the substrate of module 1530 to system board 1510. In one example, system 1500 includes a spacer or standoff 1512 that bridges the gap between the substrate of module 1530 and system board 1510.

[0197] Screw 1574 represents a screw for fixing USMt 1550 to module 1530. Screw 1576 represents a screw for fixing USMt 1550 to system board 1510. In one example, screw 1574 has a head placed within a recess in a connector associated with a screw hole. Screw 1574 extends into module 1530 but does not extend to the outer side on the opposite side. In one example, screw 1576 has a head placed within a recess in a connector associated with a screw hole.

[0198] In one example, USMt 1550 includes a footing 1552 that may alternatively be referred to as a base or support. Footing 1552 represents the structure of USMt 1550 that provides a structural support to module 1530 when connecting module 1530 to system board 1510. When module 1530 is supported at one end by screw 1572 fixed to system board 1510 through standoff 1512 and at the other end by USMt 1550, significant stress may exist on the substrate via screw 1574. Footing 1552 extends USMt 1550 under the end or ends of module 1530 that interface with USMt 1550. Using footing 1552, USMt 1550 can contact the surface of module 1530 having pads, and the opposite surface, and the end of the module substrate connecting the two surfaces. Footing 1552 may include a ledge or extension that extends under module 1530 allowing the position of the end of the substrate to be stationary or in contact, which reduces the force applied to the substrate by screw 1574 by transmitting force to the physical contact of the substrate end using a connector.

[0199] In one example, considering the surface of module 1530 having pads and that component 1532 is on top of the module, USMt1550 has a height sufficient to leave a gap 1580 between component 1522 and USMt1540 and the bottom of module 1530. In one example, instead of leaving a gap, the space can be occupied by a material that provides electrical shielding and thermal conductivity. Gap 1580 can be any amount of space that makes sense for the system structure. In one example, gap 1580 is about 0.4 mm.

[0200] The height of USMt1550 (identified as the z2 dimension) can be determined by the thickness of the module substrate and how much space to leave under module 1530. For example, for a 0.6 mm PCB for module 1530, USMt1550 can have a height, z2, of about 4.4 mm that provides a spacing between module 1520 having a substrate thickness of 0.6 mm and a component having a height of about 1.4 mm.

[0201] FIG. 16 is an example of a system configuration having a top mount USM connector that attaches an expansion substrate directly above another expansion substrate to a system substrate using another top mount USM connector. Here, both expansion substrates are fixed using common mounting screws. System 1600 provides an example of system 1500 of FIG. 15. Here, the two expansion substrates share screws on the back side of the substrate. Such a configuration may require extending the substrate dimensions of the upper expansion substrate and, more desirably, may be suitable for different sized modules that can naturally and advantageously utilize sharing the screws. Sharing the screws can be beneficial not only to reduce the number of parts in the system but also to reduce the screw holes to allow for more board space for signal routing on the system board. An explanation of system 1600 is provided below for completeness.

[0202] System 1600 represents an example of a system having a top mount connector. System board 1610 represents a board, such as a primary system board or motherboard, to which an expansion board can be connected. System 1600 represents two expansion boards connected to system board 1610. Module 1620 represents a first expansion board having one or more components 1622 mounted on a module board. USMt1640 represents a top mount connector that connects module 1620 to system board 1610. Module 1620 does not have separate screws on the back of the module, but shares screw 1672 with module 1630.

[0203] Screw 1664 represents a screw that fixes USMt1640 to module 1620. Screw 1666 represents a screw that fixes USMt1640 to system board 1610. In one example, screw 1664 has a head placed within a recess in a connector associated with a screw hole. Screw 1664 extends into module 1620 but does not extend into system board 1610. In one example, screw 1666 has a head placed within a recess in a connector associated with a screw hole.

[0204] The height of USMt1640 (identified as the z1 dimension) can be determined by the thickness of the board of module 1620. For example, for a 0.6 mm PCB of module 1620, USMt1640 can have a height, z1, of approximately 2.0 mm. As another example, for a 0.8 mm PCB of module 1620, USMt1640 can have a height, z1, of approximately 2.2 mm.

[0205] Module 1630 represents a second expansion board having one or more components 1632 mounted on a module board on a surface that includes pads or contacts to which USMt1650 connects. Module 1630 is mounted above module 1620. USMt1650 represents a top mount connector that connects module 1630 to system board 1610 above module 1620.

[0206] Screw 1672 represents a screw at the "rear" end of module 1630, which is the end of module 1630 opposite to USMt 1650. Screw 1672 has a head for fixing module 1630 to the PCB and has threads that extend through the substrate of module 1630, through the substrate of module 1620, and to system board 1610. In one example, system 1600 includes a standoff or spacer 1624 that bridges the gap between the substrate of module 1630 and the substrate of module 1620.

[0207] Screw 1674 represents a screw for fixing USMt 1650 to module 1630. Screw 1676 represents a screw for fixing USMt 1650 to system board 1610. In one example, screw 1674 has a head that is placed within a recess in a connector associated with a screw hole. Screw 1674 extends into module 1630 but does not extend to the outer side on the opposite side. In one example, screw 1676 has a head that is placed within a recess in a connector associated with a screw hole.

[0208] In one example, the USMt1650 includes a footing 1652 that may alternatively be referred to as a base or support. The footing 1652 represents the structure of the USMt1650 that provides structural support to the module 1630 when connecting the module 1630 to the system board 1610. When the module 1630 is supported at one end by a screw 1672 fixed to the system board 1610 through a standoff 1612 and at the other end by the USMt1650, significant stress may exist on the board via the screw 1674. The footing 1652 extends the USMt1650 under the end or ends of the module 1630 that interfaces with the USMt1650. Using the footing 1652, the USMt1650 can contact the surface of the module 1630 having pads, the opposite surface, and the ends of the module substrate connecting the two surfaces. The footing 1652 may include a ledge or extension that extends under the module 1630 that allows the position of the end of the substrate to rest or make contact, which reduces the force on the substrate by the screw 1674 by transmitting force to the physical contact of the substrate end using a connector.

[0209] In one example, considering that the surface of the module 1630 having pads and the component 1632 are at the top of the module, the USMt1650 has a height sufficient to leave a gap 1680 between the component 1622 and the USMt1640 and the bottom of the module 1630. In one example, instead of leaving a gap, the space may be occupied by a material that provides electrical shielding and thermal conductivity. The gap 1680 can be any amount of space that makes sense for the system structure. In one example, the gap 1680 is about 0.4 mm.

[0210] In one example, by moving module 1620 back to share screw 1672 with module 1630, a margin between USMt1640 and USMt1650 of one or more components 1622 can be left. In one example, component 1622 can have a height of about 2.0 mm. Although there is no requirement for component 1622 to be mounted on system board 1610, the additional space can enable the space to be used for mounting components of an additional system board under module 1630.

[0211] The height of USMt1650 (identified as the z2 dimension) can be determined by the thickness of the module substrate and how much space is left under module 1630. For example, for a 0.6 mm PCB for module 1630, USMt1650 can have a height, z2, of about 4.4 mm, providing a spacing for module 1620 with a substrate thickness of 0.6 mm and components having a height of about 1.4 mm.

[0212] FIG. 17 is an example of a system configuration having an expansion board attached to another expansion board using a top mount USM connector, and the expansion board is then connected to the system board using a top mount USM connector. System 1700 represents an example of a system having a top mount connector. System board 1710 represents a board, such as a primary system board or a motherboard, to which an expansion board can be connected. System 1700 represents two expansion boards connected to system board 1710.

[0213] Module 1720 represents a first extension board having one or more components 1722 mounted on a module substrate. USMt1740 represents a top mount connector that connects module 1720 to module 1730 and is connected to system board 1710. Thus, in system 1700, one module substrate (module 1730) is directly connected to system board 1710 via a USM connector, and the other module substrate (module 1720) is indirectly connected to system board 1710 via module 1730. Thus, system 1700 can be considered an example of a daisy chain where the daisy chain substrate is attached "under" another module substrate.

[0214] Screw 1762 represents a screw at the "rear" end of module 1720, which is the end of module 1720 opposite to USMt1740. Screw 1762 has a head that is fixed to the PCB of module 1720 and has a thread that extends through the substrate of module 1720 to carrier substrate module 1730.

[0215] Screw 1764 represents a screw that fixes USMt1740 to module 1720. Screw 1766 represents a screw that fixes USMt1740 to module 1730. In one example, screw 1764 has a head that is placed within a recess in the connector associated with the screw hole. Screw 1764 extends to module 1720 but does not extend to module 1730. In one example, screw 1766 has a head that is placed within a recess in the connector associated with the screw hole.

[0216] The height of USMt1740 (identified as the z1 dimension) can be determined by the thickness of the substrate of module 1720. For example, for a 0.6 mm PCB for module 1720, USMt1740 can have a height, z1, of approximately 2.0 mm. As another example, for a 0.8 mm PCB for module 1720, USMt1740 can have a height, z1, of approximately 2.2 mm.

[0217] Module 1730 represents a second extension substrate having one or more components 1732 mounted on a module substrate on a surface including pads or contacts to which USMt1750 is connected. USMt1750 represents a top mount connector that connects module 1730 and the combination of module 1730 and module 1720 to system board 1710.

[0218] Screw 1772 represents a screw at the "rear" end of module 1730, which is the end of module 1730 opposite to USMt1750. Screw 1772 has a head that is fixed to the PCB of module 1730 and has a threaded portion that extends through the substrate of module 1730 to system board 1710. In one example, system 1700 includes a standoff or spacer 1712 that bridges the gap between the substrate of module 1730 and system board 1710.

[0219] Screw 1774 represents a screw that fixes USMt1750 to module 1730. Screw 1776 represents a screw that fixes USMt1750 to system board 1710. In one example, screw 1774 has a head that is placed within a recess in a connector associated with a threaded hole. Screw 1774 extends into module 1730 but does not extend outside to the opposite side. In one example, screw 1776 has a head that is placed within a recess in a connector associated with a threaded hole.

[0220] In one example, USMt1750 includes a footing 1752 that may alternatively be referred to as a base or support. Footing 1752 represents the structure of USMt1750 that provides structural support to module 1730 when connecting module 1730 to system board 1710. The structure and purpose of footing 1752 may be the same as or similar to those described above.

[0221] In one example, USMt1750 has a height sufficient to leave a gap 1780 between component 1722 and system board 1710. In one example, instead of leaving a gap, the space can be occupied by a material that provides electrical shielding and thermal conductivity. Gap 1780 can be any amount of space that makes sense for the system structure. In one example, if module 1720 has a 0.8 mm substrate with a component 1722 having a height of about 1.4 mm, gap 1780 is about 0.3 mm, or, if module 1720 has a 0.6 mm substrate with a component 1722 having a height of about 1.4 mm, gap 1780 is about 0.5 mm.

[0222] The height of USMt1750 (identified as the z2 dimension) can be determined by the thickness of the module substrate and how much space to leave under module 1730. In one example, USMt1750 has a height, z2, of about 4.4 mm that provides spacing and a gap for module 1720.

[0223] FIG. 18 is an example of a system configuration having a top mount USM connector for attaching an expansion board above another expansion board connected to a system board using an in-line USM connector. System 1800 represents an example of a system having a top mount connector and an in-line connector. System board 1810 represents a board, such as a primary system board or motherboard, to which an expansion board can be connected. System 1800 represents two expansion boards connected to system board 1810.

[0224] Module 1820 represents a first expansion board having one or more components 1822 mounted on a module substrate. USMi1840 represents an in-line connector that connects module 1820 to system board 1810. Screw 1862 represents a screw at the "rear" end of module 1820, which is the end of module 1820 opposite USMi1840. Screw 1862 has a head that secures to the PCB of module 1820 and has a threaded portion that extends through the substrate of module 1820 to housing 1890. Housing 1890 represents the case or cover of the system in which the computing components of system 1800 are mounted as a system.

[0225] Screw 1864 represents a screw that secures USMi1840 to module 1820. Screw 1866 represents a screw that secures USMi1840 to system board 1810. In one example, screw 1864 has a head that is placed within a recess in the connector associated with the screw hole. Screw 1864 extends into module 1820 but does not extend outside to the opposite side. In one example, screw 1866 has a head that is placed within a recess in the connector associated with the screw hole. Screw 1866 extends into system board 1810 but does not extend outside to the opposite side.

[0226] Module 1830 represents a second expansion board having one or more components 1832 mounted on a module substrate on a surface that includes pads or contacts to which USMt1850 connects. Module 1830 is mounted above module 1820. USMt1850 represents a top-mount connector that connects module 1830 to system board 1810 above module 1820.

[0227] Screw 1872 represents a screw at the "rear" end of module 1830, which is the end of module 1830 opposite to USMt 1850. Screw 1872 has a head for fixing to the PCB of module 1830 and has a threaded portion that extends through the substrate of module 1830 into housing 1890. In one example, system 1800 includes a spacer or standoff 1812 that bridges the gap between the substrate of module 1830 and housing 1890. As an alternative to using standoff 1812, housing 1890 may have a standoff portion that extends to reach module 1830.

[0228] Screw 1874 represents a screw for fixing USMt 1850 to module 1830. Screw 1876 represents a screw for fixing USMt 1850 to system substrate 1810. In one example, screw 1874 has a head placed within a recess in a connector associated with a screw hole. Screw 1874 extends into module 1830 but does not extend to the outer side on the opposite side. In one example, screw 1876 has a head placed within a recess in a connector associated with a screw hole.

[0229] In one example, USMt 1850 includes a footing 1852 that may alternatively be referred to as a base or support. Footing 1852 represents the structure of USMt 1850 that provides a structural support to module 1830 when connecting module 1830 to system substrate 1810. The structure and operation of footing 1852 may follow what has been described above.

[0230] In one example, considering the surface of module 1830 having pads and that component 1832 is at the top of the module, USMt 1850 has a height sufficient to leave a void 1880 between component 1822 and USMi 1840 and the bottom of module 1830. In one example, instead of leaving a void, the space may be occupied by a material that provides electrical shielding and thermal conductivity. Void 1880 can be any amount of space that makes sense for the system structure. In one example, void 1880 is about 0.4 mm.

[0231] The height of USMt1850 (identified as the z2 dimension) can be determined by the thickness of the module substrate and how much space to leave under module 1830. For example, for a 0.6 mm PCB for module 1830, USMt1850 can have a height, z2, of about 3.8 mm, providing a module 1820 with a substrate thickness of 0.6 mm and a component spacing with a height of about 1.4 mm.

[0232] In system 1800, module 1820 is represented in the figure as being thinner than system substrate 1810. In one example, module 1820 and system substrate 1810 have the same thickness. In one example, module 1820 has a substrate thickness different from that of system substrate 1810. Whether the substrates have the same thickness or different thicknesses, the in-line connector can connect the substrates in-line.

[0233] Figures 19A - 19B show an example of a system configuration having two n top-mounted USM connectors for attaching an expansion substrate above another expansion substrate.

[0234] Figure 19A shows a side view of system 1900. System 1900 represents an example of a system having multiple top-mounted connectors on the same substrate. System substrate 1910 represents a substrate to which an expansion substrate can be connected, such as a primary system substrate or a motherboard. System 1900 represents two expansion substrates connected to system substrate 1910.

[0235] Module 1920 represents a first expansion board having one or more components 1922 mounted on a module substrate. USMt1940 represents a top mount connector that connects module 1920 to system board 1910. Screw 1962 represents a screw at the "rear" end of module 1920, which is the end of module 1920 opposite USMt1940. Screw 1962 has a head that is fixed to the PCB of module 1920 and has a thread that extends through the substrate of module 1920 to system board 1910.

[0236] Screw 1964 represents a screw that fixes USMt1940 to module 1920. Screw 1966 represents a screw that fixes USMt1940 to system board 1910. In one example, screw 1964 has a head that is placed within a recess in the connector associated with the screw hole. Screw 1964 extends into module 1920 but does not extend into system board 1910. In one example, screw 1966 has a head that is placed within a recess in the connector associated with the screw hole.

[0237] The height of USMt1940 (identified as dimension z1) can be determined by the thickness of the substrate of module 1920. For example, for a 0.6 mm PCB for module 1920, USMt1940 can have a height, z1, of approximately 2.0 mm. As another example, for a 0.8 mm PCB for module 1920, USMt1940 can have a height, z1, of approximately 2.2 mm.

[0238] Module 1930 represents a second expansion substrate having one or more components 1932 mounted on a module substrate on a surface including pads or contacts to which a USM connector is connected. Module 1930 is mounted above the upper part of module 1920. USMt1950 represents a top - mount connector that connects module 1930 to system substrate 1910 above module 1920 from one side of module 1920. USMt1970 represents a top - mount connector that connects module 1930 to system substrate 1910 above module 1920 from the opposite side of module 1920 where USMt1950 is connected. Module 1920 includes pads for both USMt1950 and USMt1970.

[0239] Screw 1954 represents a screw that fixes USMt1950 to module 1930. Screw 1956 represents a screw that fixes USMt1950 to system substrate 1910. In one example, screw 1954 has a head placed within a recess in the connector associated with the screw hole. Screw 1954 extends into module 1930 but does not extend outside to the opposite side. In one example, screw 1966 has a head placed within a recess in the connector associated with the screw hole.

[0240] Screw 1974 represents a screw that fixes USMt1970 to module 1930. Screw 1976 represents a screw that fixes USMt1970 to system substrate 1910. In one example, screw 1974 has a head placed within a recess in the connector associated with the screw hole. Screw 1974 extends into module 1930 but does not extend outside to the opposite side. In one example, screw 1976 has a head placed within a recess in the connector associated with the screw hole.

[0241] In one example, USMt1950 includes a footing 1952 that may alternatively be referred to as a base or support. The footing 1952 represents the structure of USMt1950 that provides a structural support to module 1930 when connecting module 1930 to system substrate 1910. The footing 1952 extends USMt1950 under an end or ends of module 1930 that interfaces with USMt1950. Using the footing 1952, USMt1950 may contact a surface of module 1930 having pads, and an opposite surface, and an end of a module substrate that connects the two surfaces. The footing 1952 may include a ledge or extension that extends under module 1930 that enables the position of the end of the substrate to rest or contact, which reduces the force applied to the substrate by screw 1974 by transmitting force to the physical contact of the substrate end using a connector.

[0242] In one example, USMt1970 includes a footing 1972 that may alternatively be referred to as a base or support. The footing 1972 represents the structure of USMt1970 that provides a structural support to module 1930 when connecting module 1930 to system substrate 1910. The footing 1972 extends USMt1970 under an end or ends of module 1930 that interfaces with USMt1970. Using the footing 1972, USMt1970 may contact a surface of module 1930 having pads, and an opposite surface, and an end of a module substrate that connects the two surfaces. The footing 1972 may include a ledge or extension that extends under module 1930 that enables the position of the end of the substrate to rest or contact, which reduces the force applied to the substrate by screw 1974 by transmitting force to the physical contact of the substrate end using a connector.

[0243] In one example, considering that the surface of module 1930 has pads and component 1932 is on top of the module, USMt1950 and USMt1970 have a height sufficient to leave a gap 1980 between component 1922 and USMt1940 and the bottom of module 1930. Instead of leaving a gap in one example, the space can be occupied by a material that provides electrical shielding and thermal conductivity. Gap 1980 can be any amount of space that makes sense for the system structure. In one example, gap 1980 can be about 0.4 mm.

[0244] The height of USMt1950 and USMt1970 (identified as the z2 dimension) can be determined by the thickness of the module substrate and how much space is left under module 1930. For example, for a 0.6 mm PCB for module 1930, USMt1950 and USMt1970 can have a height, z2, of about 4.4 mm, which provides a spacing for a component having a height of about 1.4 mm and a module 1920 having a substrate thickness of 0.6 mm.

[0245] Figure 19B shows a top view of system 1900. View 1902 is from the top of system 1900, and the components are not necessarily shown to scale. The scale of view 1902 does not match the side view of system 1900 shown in Figure 19A.

[0246] View 1902 shows one or more components 1932 directly attached to module 1930, which are then attached to system substrate 1910 through two top mount connectors. USMt1970 connects between system substrate 1910 and module 1930 on one side, and USMt1950 connects between system substrate 1910 and module 1930 on the opposite side.

[0247] View 1902 shows the screws 1974 that fix USMt 1970 to module 1930 and the screws 1976 that fix USMt 1970 to system board 1910. View 1902 shows the screws 1954 that fix USMt 1950 to module 1930 and the screws 1956 that fix USMt 1950 to system board 1910.

[0248] Figure 20 shows an example of a system configuration having four top-mounted USM connectors for attaching an expansion board above another expansion board. System 2000 represents a system similar to system 1900 where various elements are not necessarily shown to scale. While system 1900 shows two connectors that connect a module board to a system board, system 2000 includes a module board connected to the system board via four connectors.

[0249] View 2002 shows a side view of system 2000. View 2004 shows a top view of system 2000. In view 2002, connector 1 is not visible. View 2004 does not show the module connected under module 2030 that can be partially seen in the side view of view 2002. The dashed line is partially unclear behind USMt 2040, not shown at all in view 2002, and shows module 2080 under module 2030.

[0250] System board 2010 represents a board to which an expansion board can be connected, such as a primary system board or a motherboard. System 2000 represents two expansion boards connected to system board 2010. Module 2080 represents a first expansion board having one or more components mounted on a module board. Here, the module board is connected to system board 2010 using USMt connectors (the components and USMt connectors are not specifically labeled). Module 2080 can be connected to system board 2010 according to any description in this specification of a top-mounted connection with a module directly above a carrier board.

[0251] Module 2030 represents a second expansion substrate having one or more components 2032 mounted on a module substrate on a surface including pads or contacts to which a USM connector is connected. Module 2030 is mounted above the upper part of module 2080.

[0252] USMt2040, USMt2050, USMt2060, and USMt2070 connect module 2080 to system substrate 2010. Each connector represents a top - mount connector that connects a section of the pads of module 2030 to system substrate 2010. USMt2040 and USMt2060 are on opposite sides of each other on parallel sides of module 2030, and USMt2050 and USMt2070 are on opposite sides of each other on the other parallel sides of module 2030.

[0253] Screw 2042 represents a screw that fixes USMt2040 to module 2030. Screw 2044 represents a screw that fixes USMt2040 to system substrate 2010. Screw 2052 represents a screw that fixes USMt2050 to module 2030. Screw 2054 represents a screw that fixes USMt2050 to system substrate 2010. Screw 2062 represents a screw that fixes USMt2060 to module 2030. Screw 2064 represents a screw that fixes USMt2060 to system substrate 2010. Screw 2072 represents a screw that fixes USMt2070 to module 2030. Screw 2074 represents a screw that fixes USMt2040 to system substrate 2010.

[0254] In one example, as seen in view 2002, the screws (e.g., screw 2052, screw 2072) that fix the connector to the module substrate have heads that are placed within recesses in the connector associated with the screw holes. In one example, the screws that fix the connector to the module substrate extend into module 2030 but do not extend to the outer side on the opposite side. The same description may apply to screws (i.e., screw 2042, screw 2062) that are not visible in view 2002 and also fix the connector to the module substrate.

[0255] In one example, the screws (e.g., screw 2054, screw 2074) that fix the connector to the system substrate have heads that are placed within recesses in the connector associated with the screw holes, as seen in view 2002. In one example, the screws that fix the connector to the system substrate extend through the connector and into system substrate 2010. They may or may not extend through the system substrate, for example, to connection points on the system housing. The same description may apply to screws (i.e., screw 2044, screw 2064) that are not visible in view 2002 and also fix the connector to the system substrate.

[0256] In one example, USMt2050 includes a footing 2056 that may alternatively be referred to as a base or support. Footing 2056 represents the structure of USMt2050 that provides a structural support to module 2030 when connecting module 2030 to system substrate 2010. Footing 2056 extends USMt2050 under the end or ends of module 2030 that interfaces with USMt2050. Using footing 2056, USMt2050 can contact the surface of module 2030 having pads, and the opposite surface, and the end of the module substrate that connects the two surfaces. Footing 2056 may include a ledge or extension that extends under module 2030 that enables the position of the end of the substrate to be stationary or in contact. A similar description applies to footing 2076 of USMt2070.

[0257] The footings for USMt2040 and the footings for USMt2060 are not visible. In one example, both USMt2040 and USMt2060 include their respective footings, and the foregoing description may apply to these footings or supports. In one example, when four or more USMt connectors are used to connect one substrate to another substrate, the substrate on the longer end of the expansion module may include a footing, but the USMt connectors on the shorter end of the expansion module may or may not include a footing.

[0258] In one example, USMt2040, USMt2050, USMt2060, and USMt2070 have a height sufficient to leave a gap between module 2030 and module 2080. The gap may follow any description of the gap under a module mounted above another module.

[0259] The height (identified as the z1 dimension) of USMt2040, USMt2050, USMt2060, and USMt2070 may be determined by the thickness of the module substrate and how much space to leave under module 2030. For example, for a 0.6 mm PCB for module 2030, USMt2040, USMt2050, USMt2060, and USMt2070 may have a height, z1, of about 4.4 mm, providing a spacing for a component having a height of about 1.4 mm and a module 1920 having a substrate thickness of 0.6 mm.

[0260] FIG. 21 shows an example of a system configuration having an in-line chain USM connector for connecting an expansion substrate to a system substrate having a wider I / O. The USM connectors of system 2100 provide an example of an in-line USM connector that follows any description of the in-line USM connector herein.

[0261] Instead of having only dedicated screw holes on the connector, the connector can share both a set of screw holes, or multiple sets of screw holes, with other USM connectors. Such an inline connector can be referred to as a USM inline chain connector and can be chained with multiple USM connectors for a wider I / O than what is possible with a single connector. Chaining with multiple USM connectors allows for a much wider bandwidth without the need to create connectors of different widths.

[0262] System 2100 shows two types of chain connectors, or connectors with shared screw holes, or three types of chain connectors, depending on the alignment of alignment holes, alignment posts, or other alignment mechanisms. Each example can have the same internal structure as any of the other inline USM connectors described. It will be understood that even a reversible connector can be made reversible if the screw holes on both sides remain open for a shared configuration.

[0263] The I / O board 2110 of the system includes pads that connect to corresponding pads on the component board 2120. The I / O board 2110 of the system can be the system board or motherboard. Specifically, the I / O board 2110 of the system can be a board designed to connect to a wide I / O component board, along with other connections (not shown) to the system board.

[0264] USMic2130 represents an in-line connector having one end with non-shared screw holes and one end for shared screw holes. The shared end is adjacent to another connector. More specifically, the shared end is adjacent to another connector and the two connectors will share a screw on the shared end. The non-shared end is not adjacent to another connector, or not adjacent to another connector with which it shares a screw. USMic2150 is shown as a mirror image of USMic2130. In one example, depending on the alignment structure used in system 2100, USMic2150 is designed identically to USMic2130 and is simply rotated 180 degrees to share the opposite screw holes. In one example, depending on the alignment structure used in system 2100, USMic2150 and USMic2130 are separate connectors and are designed to share the opposite screw holes.

[0265] USMic2130 is shown with an end 2132 having non-shared screw holes. Screw 2162 represents the screw that connects end 2132 of USMic2130 to the I / O board 2110 of the system. Screw 2172 represents the screw that connects end 2132 of USMic2130 to the component board 2120. USMic2130 is shown with an end 2134 having shared screw holes. Screw 2164 represents the screw that connects end 2134 of USMic2130 to the I / O board 2110 of the system. Screw 2174 represents the screw that connects end 2134 of USMic2130 to the component board 2120.

[0266] Furthermore, USMic2150 is oriented to share the opposite ends. USMic2150 is shown with an end 2154 that has unshared screw holes. Screw 2168 represents the screw that connects the end 2154 of USMic2150 to the I / O board 2110 of the system. Screw 2178 represents the screw that connects the end 2154 of USMic2150 to the component board 2120. USMic2150 is shown with an end 2152 that has shared screw holes. Screw 2166 represents the screw that connects the end 2152 of USMic2150 to the I / O board 2110 of the system. Screw 2176 represents the screw that connects the end 2152 of USMic2150 to the component board 2120.

[0267] USMic2140 is shown as having both ends that share screw holes with adjacent connectors. USMic2140 is shown with an end 2142 that has screw holes shared with the end 2134 of USMic2130. Accordingly, screw 2164 connects the end 2134 of USMic2130 and the end 2142 of USMic2140 to the I / O board 2110 of the system. Screw 2174 connects the end 2134 of USMic2130 and the end 2142 of USMic2140 to the component board 2120. USMic2140 is shown with an end 2144 that has screw holes shared with the end 2152 of USMic2150. Accordingly, screw 2166 connects the end 2144 of USMic2140 and the end 2152 of USMic2150 to the I / O board 2110 of the system. Screw 2176 connects the end 2144 of USMic2140 and the end 2152 of USMic2150 to the component board 2120.

[0268] It will be understood that other connection configurations are possible. Any number of inline chain connectors can be chained together with, for example, multiple connectors that share screw holes on both ends. In one example, connectors that are not shared on both ends are used, having one connector that is shared on one end and not shared on one end, and a mirrored connector chained therewith.

[0269] FIG. 22A is an example of a representation of an in-line chain USM connector having one side with a shared screw hole. Connector 2210 provides an example of a connector 600 where the screw holes on one side are open rather than a complete circle. Rather, connector 600 has all screw holes that are complete circles, and connector 2210 includes screw holes on one end that are complete circles and screw holes on the other end that are open and are semi-circular. The dimensions and size of connector 2210 can be the same as those of connector 600, and those having an open shared screw hole on one side can be appropriately adjusted.

[0270] Thus, connector 2210 includes an end 2212 having screw holes 2222 and 2226, both of which are closed circles. Connector 2210 includes an end 2214 having screw holes 2224 and 2228, both of which are open screw holes represented as semi-circles.

[0271] FIG. 22B is an example of a representation of an in-line chain USM connector having both sides with a shared screw hole. Connector 2230 provides an example of a connector 600 where the screw holes on both sides are open rather than a complete circle. Rather, connector 600 has all screw holes that are complete circles, and connector 2230 includes all screw holes that are open and are semi-circular. The dimensions and size of connector 2230 can be the same as those of connector 600, and those having open shared screw holes on both sides can be appropriately adjusted.

[0272] Thus, connector 2230 includes an end 2232 having screw holes 2242 and 2246, both of which are open partial circles. Connector 2230 includes an end 2234 having screw holes 2244 and 2248, both of which are open and are partial circles represented as semi-circles.

[0273] FIG. 23 shows an example of a system configuration having an in-line chain USM connector for connecting substrates together. System 2300 shows other possible combinations of connections with the in-line chain connector. The in-line chain connector can be a USMic connector and can be an in-line connector according to any of the foregoing descriptions.

[0274] System 2300 includes substrate 2312 connected to substrate 2314 using connectors 2320 and 2330 which are chained together. Substrate 2314 is also connected to substrate 2316 using connectors 2340, 2350, and 2360 which are chained together. System 2300 also includes a representation of a side view of substrate 2312 having connectors 2320 and 2330 chained together.

[0275] As shown, connector 2320 includes screw holes 2322 on the non-shared ends of connector 2320. One screw secures the connector to substrate 2312 and the other screw secures the connector to substrate 2314. Similarly, connector 2330 includes screw holes 2332 on the non-shared ends of connector 2330. One screw secures the connector to substrate 2312 and the other screw secures the connector to substrate 2314.

[0276] Screw hole 2372 is a screw hole formed near one shared end of connector 2320 and near one shared end of connector 2330. The screw in the shared screw hole can be referred to as a shared screw and corresponds to the end of the shared connector. One shared screw will secure connectors 2320 and 2330 to substrate 2312 and the other screw will secure the connectors to substrate 2314.

[0277] System 2200 includes an enlarged view of region 2270. In the enlarged view, threaded hole 2372 shows a state where one screw is in a predetermined position and the hole is empty. A threaded hole with a screw may indicate how the screw fixes both connector 2230 and connector 2330. A threaded hole without a screw indicates how two open threaded holes at the shared end of the connectors form a complete threaded hole. There will be one threaded hole in the substrate corresponding to the shared threaded holes of the two connectors.

[0278] The alignment mechanism may ensure proper alignment of the connectors on the substrate and enable the shared screw to fix both connectors on the shared end. The enlarged view shows that the shared end may have a recessed semi - circle 2374 that matches the closed threaded hole, except that the recessed semi - circle 2374 is only a part of a circle. System 2300 does not show other enlarged views, but it may be clear that all shared ends are the same as or substantially the same as region 2270.

[0279] As shown, connector 2340 includes threaded hole 2342 on the non - shared end of connector 2340. One screw fixes the connector to substrate 2314 and the other screw fixes the connector to substrate 2316. Similarly, connector 2360 includes threaded hole 2362 on the non - shared end of connector 2360. One screw fixes the connector to substrate 2314 and the other screw fixes the connector to substrate 2316.

[0280] Connector 2350 includes only the shared end. Threaded hole 2352 is a threaded hole formed near one shared end of connector 2340 and near one shared end of connector 2350. One shared screw will fix connector 2340 and connector 2350 to substrate 2314 and the other screw will fix the connectors to substrate 2316.

[0281] The screw holes 2354 are screw holes formed near one shared end of the connector 2350 and near one shared end of the connector 2360. One shared screw will fix the connectors 2350 and 2360 to the substrate 2314, and the other screw will fix the connectors to the substrate 2316.

[0282] Figure 24 is a block diagram of an example of a substrate layout for use with a USM connector. The system 2400 shows a motherboard 2410 having a row of pads 2412, and the expansion substrate 2420 has a corresponding row of pads 2422. The screw holes 2430 accommodate screws for fixing the substrates to each other using the connector 2450. The connector 2450 includes leads, an alignment mechanism, and a cover according to any of the examples described. The connector 2450 is adapted to the alignment mechanism 2440 within the motherboard 2410 and the expansion substrate 2420.

[0283] The connector 2450 generally has a rectangular profile, with a pair of screw holes 2430 on either end of the conductors, arranged in a row where the conductors extend along the length of the rectangular profile. The leads extend over a short distance of the rectangle, bridging from the pads 2412 to the pads 2422.

[0284] The reference to the motherboard 2410 is a non-limiting example. The motherboard can represent any system substrate. Although the configuration of the system 2400 shows a motherboard 2410 having an end before the expansion substrate 2420, it will be understood that such a configuration is merely an example. In one example, the motherboard 2410 and the expansion substrate 2420 will contact edge-to-edge for use with an in-line connector. In one example, the expansion substrate 2420 can at least partially overlap the motherboard 2410 for use with a top-mount connector.

[0285] FIG. 25 is a block diagram of an example of a board layout for use with a USM connector having two groups of connectors. System 2500 shows a motherboard 2510 having two rows of pads 2512 and pads 2514, and an expansion board 2520 has corresponding two rows of pads 2522 and pads 2524. The screw holes 2532, screw holes 2534, and screw holes 2536 accommodate screws for fixing the boards to each other using connector 2550. Connector 2550 includes two groups of leads, two groups of alignment mechanisms, and a cover according to any of the examples described. Connector 2550 fits into alignment mechanisms 2542 and 2544 within motherboard 2510 and expansion board 2520.

[0286] Connector 2550 has a generally rectangular contour, with the conductors that connect pad 2512 to pad 2522 positioned in columns extending along the length of the rectangular contour, between a pair of screw holes 2532 and a pair of screw holes 2536. Connector 2550 also includes conductors that connect pad 2514 to pad 2524 between a pair of screw holes 2534 and a pair of screw holes 2536. Thus, connector 2550 includes screw holes for screws on either short end, and screw holes for screws at the center of the length of the connector, between the two groups of conductors.

[0287] The reference to motherboard 2510 is a non-limiting example. The motherboard can represent any system board. Although the configuration of system 2500 shows motherboard 2510 edge-to-edge with expansion board 2520, it will be understood that such a configuration is merely an example. In one example, motherboard 2510 and expansion board 2520 will contact edge-to-edge for use with an inline connector. In one example, expansion board 2520 can at least partially overlap motherboard 2510 for use with a top mount connector.

[0288] FIG. 26 is a block diagram of an example of a substrate layout for a daisy chain expansion substrate having a USM connector. System 2600 shows a piggyback or daisy chain configuration. System 2600 shows a motherboard 2610 having a row of pads 2612, and the expansion substrate 2620 has a corresponding row of pads 2622. The screw holes 2652 accommodate screws for fixing the motherboard 2610 to the expansion substrate 2620 using the connector 2662. The connector 2662 includes leads, an alignment mechanism, and a cover according to any of the examples described. The connector 2662 fits the alignment mechanism 2642 within the motherboard 2610 and the expansion substrate 2620.

[0289] System 2600 also includes an expansion substrate 2630 having a row of pads 2632, and the expansion substrate 2620 has a corresponding row of pads 2624. The screw holes 2654 accommodate screws for fixing the expansion substrate 2620 to the expansion substrate 2630 using the connector 2664. The connector 2664 includes leads, an alignment mechanism, and a cover according to any of the examples described. The connector 2664 fits the alignment mechanism 2644 within the expansion substrate 2620 and the expansion substrate 2630. In one example, the expansion substrate 2630 also includes screw holes 2656 for fixing the expansion substrate 2630 to the system housing. When connecting one expansion substrate to another, the two expansion substrates generally have surfaces with pads that are in the same plane as each other, just as the first expansion substrate is in the same plane as the motherboard.

[0290] The connector 2662 generally has a rectangular contour with a pair of screw holes 2652 at either end of a conductor, arranged in a row where the conductor extends along the long side of the rectangular contour. The leads extend across a short distance of the rectangle and bridge the pads 2612 to the pads 2622.

[0291] Connector 2664 generally has a rectangular contour and is arranged in a row in which the conductive wires extend along the length of a rectangular contour and has a pair of screw holes 2654 at either end of the conductive wire. The leads extend over a short distance of the rectangle and bridge from pad 2624 to pad 2632.

[0292] The reference to motherboard 2610 is a non-limiting example. The motherboard can represent any system board. Although the configuration of system 2600 shows motherboard 2610 that is edge-to-edge with expansion board 2620, it will be understood that such a configuration is merely an example. In one example, motherboard 2610 and expansion board 2620 will be in edge-to-edge contact for use with an in-line connector. In one example, expansion board 2620 can at least partially overlap motherboard 2610 for use with a top-mount connector. Similarly, the connection between expansion board 2620 and expansion board 2630 can be via an in-line connector or a top-mount connector.

[0293] FIG. 27 is a block diagram of an example of a substrate layout for a daisy chain expansion board having USM connectors of different sizes. System 2700 shows another piggyback or daisy chain configuration. System 2700 shows a motherboard 2710 having two rows of pads 2712 and 2714, and expansion board 2720 has corresponding two rows of pads 2722 and 2724. Screw holes 2752 include three pairs of screw holes for fixing motherboard 2710 to expansion board 2720 using corresponding three pairs of screws with connector 2762. Connector 2762 includes two groups of leads, two groups of alignment mechanisms, and a cover according to any of the examples described. Connector 2762 is adapted to alignment mechanisms 2742 and 2744 within motherboard 2710 and expansion board 2720.

[0294] System 2700 also includes an extension substrate 2730 having a row of pads 2732, and the extension substrate 2720 has a corresponding third row of pads 2726. The screw holes 2754 include two pairs of screw holes that accommodate two pairs of screws for fixing the extension substrate 2720 to the extension substrate 2730 using connectors 2764. The connector 2764 includes leads, an alignment mechanism, and a cover according to any of the examples described. The connector 2764 is adapted to the alignment mechanism 2746 within the extension substrate 2720 and the extension substrate 2730. In one example, the extension substrate 2730 also includes screw holes at the other end for fixing the extension substrate 2730 to the system housing.

[0295] Connector 2762 has a generally rectangular profile, with the conductors that connect pad 2712 to pad 2722 between a pair of screw holes, one at one short end and the other at the center, and are aligned in a row extending along the long dimension of the rectangular profile. Connector 2762 also includes conductors that connect pad 2714 to pad 2724 between a pair of screw holes, one at the other short end, and a pair of screw holes at the center. Thus, connector 2762 includes screw holes for screws on either short end and screw holes for screws at the center of the length of the connector between two groups of conductors.

[0296] Connector 2764 has a generally rectangular profile, with a pair of screw holes 2754 at either end of the conductors, and the conductors are arranged in a row extending along the long dimension of the rectangular profile. The leads extend over a short distance of the rectangle and bridge from pad 2726 to pad 2732.

[0297] The configuration of system 2700 is useful for connecting expansion board 2730 to motherboard 2710 via expansion board 2720. In one example, some of the pads for connecting expansion board 2720 to motherboard 2710 are simply via signal lines that connect to expansion board 2730. As shown, expansion board 2730 includes half the signal lines of expansion board 2720 (e.g., N signal lines for expansion board 2730 and 2N signal lines for expansion board 2720). The difference in the signal lines need not be an even multiple, but can be any number of differences. In one example, some of the signal lines connecting between expansion board 2730 and motherboard 2710 are shared with, or divided among, expansion board 2720. Thus, the connection between expansion board 2720 and motherboard 2710 need not include dedicated via signal lines for expansion board 2730.

[0298] The reference to motherboard 2710 is a non-limiting example. The motherboard can represent any system board. Although the configuration of system 2700 shows motherboard 2710 that is edge-to-edge with expansion board 2720, it will be understood that such a configuration is merely an example. In one example, motherboard 2710 and expansion board 2720 will contact edge-to-edge for use with an in-line connector. In one example, expansion board 2720 can at least partially overlap motherboard 2710 for use with a top-mount connector. Similarly, the connection between expansion board 2720 and expansion board 2730 can be via an in-line connector or a top-mount connector.

[0299] FIG. 28 is a block diagram of an example of a board layout for use with a reversible USM connector. The reversible connector will be an in-line connector. System 2800 shows a motherboard (or system board) 2810 having two rows of pads 2812 and pads 2814. System 2800 shows an alternative expansion board for use with motherboard 2810.

[0300] In one example, system 2800 includes an expansion board 2820 having a row of pads 2822 corresponding to pads 2812 on motherboard 2810. Screw holes 2852 accommodate screws for securing expansion board 2820 to motherboard 2810 using connector 2860-1, which represents connector 2860 in a first direction. Connector 2860 includes leads, an alignment mechanism, and a cover according to any example of the reversible connector described. In the first direction, connector 2860 mates with alignment mechanism 2842 within motherboard 2810 and expansion board 2820.

[0301] In one example, system 2800 includes an expansion board 2830 having a row of pads 2832 corresponding to pads 2814 on motherboard 2810. Screw holes 2854 accommodate screws for securing expansion board 2830 to motherboard 2810 using connector 2860-2, which represents connector 2860 in a second direction. In the second direction, connector 2860 mates with alignment mechanism 2844 within motherboard 2810 and expansion board 2830.

[0302] Connector 2860 generally has a rectangular contour, with a pair of screw holes on either end of a conductor, arranged in a row where the conductor extends along the long dimension of the rectangular contour. The leads extend across a short distance of the rectangle, bridging pads on one substrate to pads on the other substrate. The arrow on connector 2860 indicates a difference in the direction of connector 2860. In direction 1, it is observed that the arrow points to the top of the page of system 2800. In direction 2, the arrow points to the bottom of the page of system 2800, indicating that by reversing the connector, it is possible to switch from connecting to one group of pads (2812) to another group of pads (2814). The expansion board will include pads in a configuration for a desired connection with motherboard 2810.

[0303] FIG. 29 is a block diagram of an example of a computing system in which an extension board connectable to a USM connector can be implemented. System 2900 represents a computing device according to any example herein, and can be a laptop computer, a desktop computer, a tablet computer, a server, a game control system or an entertainment control system, an embedded computing device, or other electronic device. System 2900 provides an example of a system that can implement a motherboard or expansion cards connected to each other using any example of a low-profile connector or USM connector provided.

[0304] In one example, system 2900 includes an extension board 2990 connected to interface 2914 via a connector (CONN) 2992 that represents any example of a low-profile connector or USM connector. The low-profile connector can include a top-mount connector, an in-line connector, or a combination of modules having a top-mount connector and an in-line connector. In one example, extension board 2990 is a card for wireless communication and can thus be an example of network interface 2950 or I / O interface 2960. In one example, extension board 2990 is an SSD and can thus be an example of storage subsystem 2980.

[0305] System 2900 includes a processor 2910 that may include any type of microprocessor, central processing unit (CPU), graphics processing unit (GPU), processing core, or other processing hardware, or a combination thereof, and provides for the processing or execution of instructions of system 2900. Processor 2910 may be a host processor device. Processor 2910 controls the overall operation of system 2900 and may be or include one or more programmable general-purpose or application-specific microprocessors, digital signal processors (DSPs), programmable controllers, application-specific integrated circuits (ASICs), programmable logic devices (PLDs), or combinations of such devices.

[0306] In one example, system 2900 includes interface 2912 coupled to processor 2910, which may represent a faster interface or a high-throughput interface for system components that require a higher bandwidth connection, such as memory subsystem 2920 or graphics interface component 2940. Interface 2912 represents an interface circuit that may be a stand-alone component or integrated on the processor die. Interface 2912 may be integrated as a circuit on the processor die or as a component on the system-on-chip. When present, graphics interface 2940 interfaces to a graphics component to provide a visual display to a user of system 2900. Graphics interface 2940 may be a stand-alone component or integrated on the processor die or system-on-chip. In one example, graphics interface 2940 may drive a high-definition (HD) display or an ultra-high-definition (UHD) display that provides output to a user. In one example, the display may include a touch screen display. In one example, graphics interface 2940 generates a display based on data stored in memory 2930, based on operations performed by processor 2910, or based on both.

[0307] The memory subsystem 2920 represents the main memory of the system 2900 and provides storage for code executed by the processor 2910 or data values used when executing routines. The memory subsystem 2920 may include one or more types of random access memory (RAM), such as read-only memory (ROM), flash memory, DRAM, 3DXP (three-dimensional crosspoint), or other memory devices, or a combination of such devices, such as one or more memory devices 2930. The memory 2930 stores and hosts, among other things, an operating system (OS) 2932 that provides a software platform for executing instructions within the system 2900. Further, an application 2934 may execute on the software platform of the OS 2932 from the memory 2930. The application 2934 represents a program. The program has its own operation logic for performing one or more functions. The process 2936 represents an agent or routine that provides auxiliary functions to the OS 2932, or one or more applications 2934, or a combination thereof. The OS 2932, the application 2934, and the process 2936 provide software logic that provides functions for the system 2900. In one example, the memory subsystem 2920 includes a memory controller 2922 that generates commands and issues them to the memory 2930. It will be understood that the memory controller 2922 can be a physical part of the processor 2910 or a physical part of the interface 2912. For example, the memory controller 2922 can be an integrated memory controller integrated on a circuit having the processor 2910, such as integrated on a processor die or system-on-chip.

[0308] Although not specifically shown, it will be understood that system 2900 may include one or more buses or bus systems between devices, such as a memory bus, a graphics bus, an interface bus, or others. Buses or other signal lines may communicatively or electrically couple components to each other, or may communicatively and electrically couple components. A bus may include physical communication lines, point-to-point connections, bridges, adapters, controllers, or other circuitry, or combinations thereof. A bus may include, for example, a system bus, a Peripheral Component Interconnect (PCI) bus, a HyperTransport or Industry Standard Architecture (ISA) bus, a Small Computer System Interface (SCSI) bus, a Universal Serial Bus (USB), or other buses, or one or more combinations thereof.

[0309] In one example, system 2900 includes interface 2914 that may be coupled to interface 2912. Interface 2914 may be an interface that is slower than interface 2912. In one example, interface 2914 represents an interface circuit that may include stand-alone components and integrated circuits. In one example, a plurality of user interface components, or peripheral components, or both, are coupled to interface 2914. Network interface 2950 provides system 2900 with the ability to communicate with remote devices (e.g., servers or other computing devices) through one or more networks. Network interface 2950 may include an Ethernet® adapter, a wireless interconnect component, a cellular network interconnect component, a USB (universal serial bus), or other wired or wireless standard-based or proprietary interface. Network interface 2950 may exchange data with remote devices, which may include transmitting data stored in memory or receiving data stored in memory.

[0310] In one example, system 2900 includes one or more input / output (I / O) interfaces 2960. The I / O interface 2960 can include one or more interface components through which a user can interact with the system 2900 (e.g., audio, alphanumeric, tactile / touch, or other interfaces). The peripheral interface 2970 can include any hardware interface not specifically described above. A peripheral generally refers to a device that is connected in a subordinate manner to the system 2900. A subordinate connection is a connection through which the system 2900 provides a software platform or a hardware platform, or both, on which operations are executed and with which the user interacts.

[0311] In one example, system 2900 includes a storage subsystem 2980 that stores data in a non-volatile manner. In one example, in a particular system implementation, at least certain components of storage 2980 may overlap with components of memory subsystem 2920. Storage subsystem 2980 includes a storage device 2984 that can be or include any conventional medium for storing large amounts of data in a non-volatile manner, such as one or more magnetic disks, solid state disks, 3DXP disks, or optical-based disks, or combinations thereof. Storage 2984 holds code or instructions, and data 2986 in a persistent state (i.e., the values are retained even if power to system 2900 is interrupted). Storage 2984 can generally be considered "memory", while memory 2930 is typically execution memory or working memory that provides instructions to processor 2910. While storage 2984 is non-volatile, memory 2930 can include volatile memory (i.e., the data values or states are indeterminate if power to system 2900 is interrupted). In one example, storage subsystem 2980 includes a controller 2982 that interfaces with storage 2984. In one example, controller 2982 can be a physical part of interface 2914 or processor 2910, or can include circuitry or logic for both processor 2910 and interface 2914.

[0312] Power supply 2902 provides power to the components of system 2900. More specifically, power supply 2902 typically interfaces with one or more power supply devices 2904 within system 2900 to provide power to the components of system 2900. In one example, power supply device 2904 includes an AC-DC (alternating current - direct current) adapter for plugging into a wall outlet. Such AC power can be from a power supply 2902 of renewable energy (e.g., solar power generation). In one example, power supply 2902 includes a DC power source such as an external AC-DC converter. In one example, power supply 2902 or power supply device 2904 includes wireless charging hardware for charging in proximity to a charging field. In one example, power supply 2902 can include a built-in battery or a fuel cell power source.

[0313] FIG. 30 is a block diagram of an example of a mobile device in which an expansion board connected to a USM connector can be implemented. System 3000 represents a mobile computing device such as a computing tablet, a cellular phone or smartphone, a wearable computing device, or other mobile device, or an embedded computing device. It will be understood that only certain components are generally shown and not all components of such a device are shown within system 3000. System 3000 provides an example of a system that can implement a motherboard or expansion cards connected to each other using any provided example of a low-profile connector or USM connector.

[0314] In one example, system 3000 includes one or more components implemented as an expansion module that connects to a rope profile connector or a USM connector. The rope profile connector can include a top mount connector, an inline connector, or a combination of modules having a top mount connector and an inline connector. In one example, connection function 3070 represents a wireless connection function for system 3000 and is connected to the processor SOC for processor 3010 via connector 3092. Connector 3092 represents an example of a rope profile connector or a USM connector according to any example provided. In one example, one or more peripherals of peripheral device connection 3080 are connected to a rope profile connector, but the connector is not explicitly shown within system 3000. In one example, memory subsystem 3060 includes non-volatile (NV) memory 3066, which can be a non-volatile storage substrate connected to processor 3010 by rope profile connector 3094. Connector 3094 can be an example of a rope profile connector according to any example provided.

[0315] System 3000 includes a processor 3010 that executes the main processing operations of system 3000. Processor 3010 can be a host processor device. Processor 3010 can include one or more physical devices such as a microprocessor, an application processor, a microcontroller, a programmable logic device, or other processing means. The processing operations executed by processor 3010 include the execution of an operating platform or operating system on which applications and device functions are executed. The processing operations include operations related to I / O (input / output) with a human user or other devices, operations related to power management, operations related to connecting system 3000 to other devices, or combinations thereof. The processing operations can also include operations related to audio I / O, display I / O, or other interfaces, or combinations thereof. Processor 3010 can execute data stored in memory. Processor 3010 can write to or edit data stored in memory.

[0316] In one example, system 3000 includes one or more sensors 3012. Sensors 3012 represent embedded sensors, or interfaces to external sensors, or combinations thereof. Sensors 3012 enable system 3000 to monitor or detect one or more states of the environment or device in which system 3000 is implemented. Sensors 3012 can include environmental sensors (temperature sensors, motion detectors, light detectors, cameras, chemical sensors (e.g., carbon monoxide sensors, carbon dioxide sensors, or other chemical sensors), etc.), pressure sensors, accelerometers, gyroscopes, medical sensors or physiological sensors (e.g., biosensors, heart rate monitors or other sensors for detecting physiological attributes), or other sensors, or combinations thereof. Sensors 3012 can also include sensors for biometric systems such as fingerprint recognition systems, face detection or recognition systems, or other systems for detecting or recognizing user characteristics. Sensors 3012 are to be understood broadly and should not be understood as a limitation to many different types of sensors that can be implemented with system 3000. In one example, one or more sensors 3012 are coupled to processor 3010 via a front-end circuit integrated with processor 3010. In one example, one or more sensors 3012 are coupled to processor 3010 via other components of system 3000.

[0317] In one example, system 3000 includes an audio subsystem 3020 that represents hardware (e.g., audio hardware and audio circuits) components and software (e.g., drivers, codecs) components related to providing audio functionality to a computing device. Audio functionality can include output to speakers or headphones, and input from microphones. Devices for such functionality may be integrated with system 3000 or connected to system 3000. In one example, a user interacts with system 3000 by providing audio commands that are received and processed by processor 3010.

[0318] The display subsystem 3030 represents hardware (e.g., a display device) and software components (e.g., a driver) that provide a visual display for presentation to a user. In one example, the display includes a tactile component or a touch screen element for a user to interact with the computing device. The display subsystem 3030 includes a display interface 3032 that includes a specific screen or hardware device used to provide a display to the user. In one example, the display interface 3032 includes logic separated from a processor 3010 (such as a graphics processor) for performing at least some processing related to the display. In one example, the display subsystem 3030 includes a touch screen device that provides both output and input to the user. In one example, the display subsystem 3030 includes a high-definition (HD) display or an ultra-high-definition (UHD) display that provides output to the user. In one example, the display subsystem includes or drives a touch screen display. In one example, the display subsystem 3030 generates display information based on data stored in memory, or based on operations performed by the processor 3010, or both.

[0319] The I / O controller 3040 represents hardware devices and software components related to user interaction. The I / O controller 3040 may operate to manage hardware that is part of the audio subsystem 3020, or the display subsystem 3030, or both. Further, the I / O controller 3040 indicates connection points for additional devices to connect to the system 3000, through which a user can interact with the system. For example, devices that may be attached to the system 3000 can include a microphone device, a speaker or stereo system, a video system or other display device, a keyboard device or keypad device, buttons / switches, or other I / O devices for use with specific applications such as card readers, or other devices.

[0320] As described above, the I / O controller 3040 can interact with the audio subsystem 3020, or the display subsystem 3030, or both. For example, input via a microphone or other audio device can provide input or commands for one or more applications or functions of the system 3000. Further, audio output can be provided instead of, or in addition to, the display output. In other examples, if the display subsystem includes a touch screen, the display device can also serve as an input device that is at least partially managed by the I / O controller 3040. There may also be additional buttons or switches on the system 3000 to provide I / O functions managed by the I / O controller 3040.

[0321] In one example, the I / O controller 3040 manages devices such as accelerometers, cameras, light sensors or other environmental sensors, gyroscopes, global positioning systems (GPS), or other hardware that may be included in system 3000 or sensor 3012. Inputs can be part of direct user interaction and can provide environmental inputs to the system to affect the operation of the system (such as noise filtering, adjusting the display for luminance detection, applying a flash for the camera, or other functions).

[0322] In one example, system 3000 includes a power management 3050 that manages functions related to battery power usage, battery charging, and power saving operations. Power management 3050 manages the power from a power source 3052 that provides power to the components of system 3000. In one example, power source 3052 includes an AC-DC (alternating current - direct current) adapter for plugging into a wall outlet. Such AC power can be renewable energy (e.g., solar power generation, motion-based power). In one example, power source 3052 includes only DC power that can be provided by a DC power source such as an external AC-DC converter. In one example, power source 3052 includes wireless charging hardware for charging in proximity to a charging field. In one example, power source 3052 can include the power of a built-in battery or fuel cell.

[0323] Memory subsystem 3060 includes a memory device for storing information within system 3000. Memory subsystem 3060 may include non-volatile (NV) memory 3066 (which does not change state when power to the memory device is interrupted), or volatile memory 3064 (which has an indeterminate state when power to the memory device is interrupted), or a combination of volatile and non-volatile memory. Memory subsystem 3060 may store application data, user data, music, photos, documents, or other data, and system data (whether long-term or temporary) related to the execution of applications and functions of system 3000. In one example, memory subsystem 3060 includes a controller 3062 (which may be considered part of the control of system 3000 and potentially part of processor 3010). Controller 3062 includes a scheduler that generates and issues commands to control access to a controlled memory device, volatile memory 3064, or NV memory 3066. In one example, the controller represents more than one controller. In one example, memory subsystem 3060 includes different controllers for volatile and non-volatile memory.

[0324] Connectivity function 3070 includes hardware devices (e.g., wireless or wired connectors and communication hardware, or a combination of wired and wireless hardware), as well as software components (e.g., drivers, protocol stacks), and enables system 3000 to communicate with external devices. The external device can be a separate device such as another computing device, a wireless access point, or a base station, and peripheral devices such as a headset, a printer, or other devices. In one example, system 3000 exchanges data with an external device for storage in memory or for display on a display device. The exchanged data may include data stored in memory for reading, writing, or editing, or data already stored in memory.

[0325] The connection function 3070 may include a plurality of different types of connection functions. For generalization purposes, the system 3000 is shown with a cellular connection function 3072 and a wireless connection function 3074. The cellular connection function 3072 generally refers to a cellular network connection function provided by a wireless carrier, such as via GSM (registered trademark) (global system for mobile communications) or its variant or derivative standards, CDMA (code division multiple access) or its variant or derivative standards, TDM (time division multiplexing) or its variant or derivative standards, LTE (long term evolution - also referred to as "4G"), 5G, or other cellular service standards. The wireless connection function 3074 refers to a wireless connection function that is not cellular and may include a personal area network (such as Bluetooth (registered trademark)), a local area network (such as WiFi), or a wide area network (such as WiMax), or other wireless communications, or a combination thereof. Wireless communication refers to the transmission of data through the use of modulated electromagnetic radiation via a non-solid medium. Wired communication occurs via a solid communication medium.

[0326] The connection of peripheral devices 3080 includes a hardware interface and connector for connecting peripheral devices, as well as software components (such as drivers, protocol stacks). It will be understood that the system 3000 may be a peripheral device ("outward" 3082) to other computing devices and may have peripheral devices ("from outside" 3084) connected thereto. The system 3000 generally has a "docking" connector for connecting to other computing devices for purposes such as managing (e.g., downloading, uploading, changing, synchronizing) the content on the system 3000. Further, the docking connector may enable the system 3000 to connect to specific peripheral devices that enable the system 3000 to control, for example, the output of content to an audio system or other system.

[0327] In addition to the dedicated docking connector or other dedicated connection hardware, the system 3000 can connect to the peripheral device 3080 via a general or standard-based connector. General types can include Universal Serial Bus (USB) connectors (which can include any of a plurality of different hardware interfaces), DisplayPort including MiniDisplayPort (MDP), High-Definition Multimedia Interface (HDMI (registered trademark)), or other types.

[0328] Generally, with respect to the description in this specification, in one example, when the surfaces of the first printed circuit board (PCB) and the second PCB are substantially in the same plane, the board-to-board connector includes a lead frame having conductors for bridging from a first pad on the surface of the first PCB to a second pad on the surface of the second PCB, an alignment frame for holding the lead frame and having posts that fit into a first alignment hole of the first PCB and a second alignment hole of the second PCB, and a conductive cover for fixing above the alignment frame. The cover has an opening for accommodating screws for fixing the cover to a first screw hole in the first PCB and a second screw hole in the second PCB, and the cover is electrically connected to a first ground plane of the first PCB and a second ground plane of the second PCB via the screws.

[0329] In an example of the above connector, in one example, the above conductive wire includes an arch-shaped spring, and when the above cover accommodates the above screw, the above conductive wire bends to press the contact points against the above first pad and the above second pad. According to any of the foregoing examples of the above connector, in one example, the above lead frame bridges from the above first pad on the above surface of the above first PCB to the above second pad on the above surface of the above second PCB. Here, the above connector does not connect to the pads on the opposite surface of the above second PCB. According to any of the foregoing examples of the above connector, in one example, the above posts include a first pair of posts that fit into a pair of first alignment holes in the above first PCB and a second pair of posts that fit into a pair of second alignment holes in the above second PCB, and the first pair of posts and the second pair of posts are offset with respect to the center of the above lead frame. According to any of the foregoing examples of the above connector, in one example, the above cover has a corrugation mechanism orthogonal to the above conductive wire. According to any of the foregoing examples of the above connector, in one example, the above cover is supported by a screw-type standoff that fits into the opening of a first through hole in the above first PCB and the opening of a second through hole in the above second PCB to accommodate the above screw. According to any of the foregoing examples of the above connector, in one example, the above cover is supported by a screw-type spacer that matches the opening of a first through hole in the above first PCB and the opening of a second through hole in the above second PCB to accommodate the above screw, enabling the above screw to be fixed to the thread in the system housing. According to any of the foregoing examples of the above connector, in one example, the above connector includes a ground bar that selectively contacts a conductive wire connected to a ground pad, and the ground bar physically contacts the above cover. According to any of the foregoing examples of the above connector, in one example, the above alignment frame has a plastic frame, and the plastic frame includes a gap for the above ground bar to extend through the plastic frame to physically contact the above cover. According to any of the foregoing examples of the above connector, in one example, the above first PCB includes a system motherboard, and the above second PCB includes an expansion board that provides functions to the host system of the above motherboard.

[0330] Generally, with respect to the description in this specification, in one example, a computer system includes a system board having a first pad on a surface of the system board, an expansion board having a second pad on a surface of the expansion board, the surface of the expansion board being substantially coplanar with the surface of the system board, a connector connecting the first pad on the surface of the system board to the second pad on the surface of the expansion board, the connector including a lead frame including a conductive wire for bridging from the first pad to the second pad, an alignment frame for holding the lead frame including a post that fits into a first alignment hole of the system board and a second alignment hole of the expansion board, and a conductive cover for fixing above the alignment frame, and a screw for fixing the cover to a first screw hole in the system board and a second screw hole in the expansion board, the screw electrically connecting the cover to a first ground plane of the system board and a second ground plane of the expansion board.

[0331] In an example of a computer system, in one example, the conductive wire includes an arch-shaped spring, and when the cover houses the screw, the conductive wire bends to press the contact points against the first pad and the second pad. According to any of the foregoing examples of the computer system, in one example, the post includes a first pair of posts that fit into a pair of first alignment holes in the system substrate and a second pair of posts that fit into a pair of second alignment holes in the extension substrate, and the first pair of posts and the second pair of posts are offset with respect to the center of the lead frame. According to any of the foregoing examples of the computer system, in one example, the cover includes a corrugation mechanism orthogonal to the conductive wire. According to any of the foregoing examples of the computer system, in one example, the cover is supported by a screw-type standoff that fits into the opening of a first through hole in the system substrate and the opening of a second through hole in the extension substrate. According to any of the foregoing examples of the computer system, in one example, the connector is a ground bar that selectively contacts a conductive wire connected to a ground pad, and the ground bar physically contacts the cover. According to any of the foregoing examples of the computer system, in one example, the alignment frame includes a plastic frame, and the plastic frame includes a gap for the ground bar to extend through the plastic frame to physically contact the cover. According to any of the foregoing examples of the computer system, in one example, the computer system includes a housing, the system substrate is fixed to the housing, the cover is supported by a spacer that aligns with the opening of a first through hole in the system substrate and the opening of a second through hole in the extension substrate, the system substrate and the screw extend through the cover and the extension substrate but the screw extends through the cover to fix the cover to the system substrate and the extension substrate and to fix the system substrate and the extension substrate to the housing. According to any of the foregoing examples of the computer system, in one example, the extension substrate has a substrate for wireless communication.According to any of the foregoing examples of the computer system, in one example, the expansion board has a board for a solid state drive (SSD). According to any of the foregoing examples of the computer system, the second screw hole in the expansion board includes a screw hole close to the end of the expansion board closest to the system board ("close end"), and a third screw hole on the far end of the expansion board, on the opposite side of the proximal end, for fixing the far end of the expansion board to the housing, and the system board is fixed to the housing. According to any of the foregoing examples of the computer system, in one example, the connector generally has a rectangular contour, the conductors arranged in a row extend along the length of the rectangular contour, and each conductor bridges across the short side of the rectangular contour with a first pair of screw holes at one end of the row and a second pair of screw holes at the other end of the row. According to any of the foregoing examples of the computer system, in one example, the row includes two groups of conductors and includes a third pair of screw holes at the center of the connector between the two groups of conductors. According to any of the foregoing examples of the computer system, in one example, the expansion board has a first expansion board, the connector has a first connector, the computer system includes the first expansion board including the third pad on the surface of the first expansion board, a second expansion board including the fourth pad on the surface of the second expansion board, wherein the surface of the second expansion board is substantially in the same plane as the surface of the first expansion board, and a second connector connecting the third pad on the surface of the first expansion board to the fourth pad on the surface of the second expansion board. According to any of the foregoing examples of the computer system, in one example, the third pad and the fourth pad include fewer pads than the first pad and the second pad, and the second connector includes fewer conductors than the first connector.According to any of the foregoing examples of the computer system, in one example, the first connector includes a first rectangular contour, and the 2N wires are structured as two groups of wires arranged in a row extending along the long side of the first rectangular contour. Each wire bridges across the short side of the first rectangular contour, including a threaded hole between the two groups at opposite ends of the row. The second connector includes a second rectangular contour, and the N wires arranged in a row extend along the long side of the second rectangular contour. Each wire bridges across the short side of the second rectangular contour, including a threaded hole at opposite ends of the row. According to any of the foregoing examples of the computer system, in one example, the system board further has a third pad and a third alignment hole on the surface of the system board. The first alignment hole corresponds to the first pad, the third alignment hole corresponds to the third pad, the expansion board further has a fourth pad and a fourth alignment hole on the surface of the expansion board. The second alignment hole corresponds to the second pad, the fourth alignment hole corresponds to the fourth pad, the connector is reversible between a first direction and a second direction. In the first direction, the wires bridge from the first pad to the second pad, and the post engages with the first alignment hole and the second alignment hole. In the second direction, the wires bridge from the third pad to the fourth pad, and the post engages with the second alignment hole and the fourth alignment hole. The screw aligns with the first screw hole in the system board and the second screw hole in the expansion board in both directions.According to any of the foregoing examples of the computer system, in one example, the extension board has an in-line extension board, the connector has an in-line connector, and the computer system includes the system board having a third pad on the first surface of the system board, and a top-mounted additional board, where the top-mounted additional board includes a fourth pad on the surface of the top-mounted additional board, the surface of the top-mounted additional board does not face the first surface of the system board, and the surface of the top-mounted additional board is not in the same plane as the first surface of the system board, and further includes a top-mounted connector that connects the fourth pad to the third pad. According to any of the foregoing examples of the computer system, in one example, the computer system includes a host processor device mounted on the system board, a display communicably connected to the host processor of the system board, a network interface communicably connected to the host processor of the system board, or a battery that supplies power to the computer system. According to any of the foregoing examples of the computer system, in one example, the system board has a motherboard of a computer. According to any of the foregoing examples of the computer system, in one example, the system board has a ruler board.

[0332] Generally, with respect to the description in this specification, in one example, a board-to-board connector includes a lead frame having conductors for bridging from a first pad on a first surface of a first printed circuit board (PCB) to a second pad on a second surface of a second PCB, where the second surface does not face the first surface and the second PCB does not include pads for the connector on a surface facing the first surface; an alignment frame for holding the lead frame and having posts that fit into a first alignment hole of the first PCB and a second alignment hole of the second PCB; and a conductive case for fixing above the alignment frame, where the case includes an opening for accommodating screws for fixing the case to a first screw hole in the first PCB and a second screw hole in the second PCB, and the case is electrically connected to a first ground plane of the first PCB and a second ground plane of the second PCB via the screws.

[0333] In an example of the above connector, in one example, the above conductive wire includes two arch-shaped arms that are vertically offset from each other on the central post of the above lead frame. The first arch-shaped arm contacts the above first pad, and the second arch-shaped arm contacts the above second pad. According to any of the above examples of the connector, in one example, the above post includes a first pair of posts that fit into a pair of first alignment holes of the above first PCB and a second pair of posts that fit into a pair of second alignment holes of the above second PCB. The first pair of posts and the second pair of posts are offset with respect to the center of the above lead frame. According to any of the above examples of the connector, in one example, the above case has a corrugation mechanism orthogonal to the above conductive wire. According to any of the above examples of the connector, in one example, the above connector includes a ground bar that selectively contacts a conductive wire connected to a ground pad, and the above ground bar physically contacts the above case. According to any of the above examples of the connector, in one example, the above alignment frame has a plastic frame, and the above plastic frame includes a gap for the above ground bar to extend through the above plastic frame and physically contact the above case. According to any of the above examples of the connector, in one example, the above first PCB includes a primary system board, and the above second PCB includes an expansion board for providing functions to the host system of the above primary system board. According to any of the above examples of the connector, in one example, the above system board includes a motherboard of a computer system. According to any of the above examples of the connector, in one example, the above system board includes a router board. According to any of the above examples of the connector, in one example, the above first PCB includes a first expansion board, and the above second PCB includes a second expansion board.

[0334] Generally, with respect to the description in this specification, in one example, a computer system includes a system board having a first pad on a first surface of the system board, an expansion board having a second pad on a second surface of the expansion board, where the second surface of the expansion board does not face the first surface of the system board, a connector connecting the first pad to the second pad, the connector including a lead frame having a conductive wire for bridging from the first pad to the second pad, an alignment frame for holding the lead frame including a post that fits into a first alignment hole of the system board and a second alignment hole of the expansion board, and a conductive case for fixing above the alignment frame, and a screw for fixing the case to a first screw hole in the system board and a second screw hole in the expansion board, the screw electrically connecting the case to a first ground plane of the system board and a second ground plane of the expansion board.

[0335] In an example of the computer system, in one example, the conductive wire includes two arch-shaped arms that are vertically offset from each other on the central post of the lead frame. When the case houses the screw, the first arch-shaped arm bends to press the contact point against the first pad, and the second arch-shaped arm presses the contact point against the second pad. According to any of the foregoing examples of the computer system, in one example, the post includes a first pair of posts that fit into a pair of first alignment holes in the system substrate and a second pair of posts that fit into a pair of second alignment holes in the expansion substrate, and the first pair of posts and the second pair of posts are offset with respect to the center of the lead frame. According to any of the foregoing examples of the computer system, in one example, the case has a corrugation mechanism orthogonal to the conductive wire. According to any of the foregoing examples of the computer system, the connector further has a ground bar that selectively contacts a conductive wire connected to the ground pad, and the ground bar physically contacts the case. According to any of the foregoing examples of the computer system, in one example, the alignment frame has a plastic frame, and the plastic frame includes a gap for the ground bar to extend through the plastic frame and physically contact the case. According to any of the foregoing examples of the computer system, in one example, the expansion substrate has a substrate for wireless communication. According to any of the foregoing examples of the computer system, in one example, the expansion substrate has a substrate for a solid state drive (SSD). According to any of the foregoing examples of the computer system, in one example, when the expansion substrate is on the first surface of the system substrate, the connector contacts the first pad with the second pad. According to any of the foregoing examples of the computer system, in one example, the screw has a connector screw, and the expansion substrate is connected to the system substrate on the opposite end of the connector via a mounting screw that connects the expansion substrate to the system substrate through a standoff.According to any of the foregoing examples of the computer system, in one example, the connector has a footing that contacts the second surface of the extension substrate with the opposite surface of the extension substrate on the opposite side of the second surface and an end of the extension substrate that connects the second surface to the opposite surface. According to any of the foregoing examples of the computer system, in one example, the connector has a height that provides a gap between components mounted between the first surface of the system substrate and the surface of the extension substrate on the opposite side of the second surface. According to any of the foregoing examples of the computer system, in one example, the component is mounted on the first surface of the system substrate, and the gap is between the component and the surface of the extension substrate on the opposite side of the second surface. According to any of the foregoing examples of the computer system, in one example, the component is mounted on the surface of the extension substrate on the opposite side of the second surface, and the gap is between the component and the first surface of the system substrate. According to any of the foregoing examples of the computer system, in one example, the extension substrate has a top-mounted extension substrate, the connector has a top-mounted connector, the computer system includes the system substrate having a third pad on the first surface of the system substrate, and an in-line extension substrate having a fourth pad on the first surface of the system substrate, wherein the surface of the in-line extension substrate is substantially coplanar with the first surface of the system substrate, and the top-mounted extension substrate is mounted above the in-line extension substrate, and further includes an in-line connector that connects the fourth pad to the third pad. According to any of the foregoing examples of the computer system, in one example, the computer system includes one or more of a host processor device mounted on the system substrate, a display communicatively coupled to the host processor of the system substrate, a network interface communicatively coupled to the host processor of the system substrate, or a battery that supplies power to the computer system.

[0336] Flowcharts as shown in this specification provide examples of sequences of various processing operations. A flowchart may represent software or firmware routines, and operations performed by physical actions. A flowchart may represent an example of the implementation of the states of a finite state machine (FSM) that may be implemented in hardware and / or software. Although shown in a particular sequence or order, the order of operations may be modified unless otherwise specified. Accordingly, the diagrams shown should be understood only as exemplary, and the processing may be executed in a different order, and some operations may be executed in parallel. Further, one or more operations may be omitted, and thus not all implementations perform all operations.

[0337] To the extent that various operations or functions are described herein, they may be described or defined as software code, instructions, configurations, and / or data. The content may be in directly executable (“object” or “executable” form), source code, or delta code (“data” or “patch” code). The software content described herein may be provided by a product in which the content is stored, or by a method of operating a communication interface to transmit data via the communication interface. A machine-readable storage medium can cause a machine to execute the described functions or operations, and includes any mechanism for storing information in a form accessible by a machine (e.g., a computing device, an electronic system, etc.), such as a recordable / non-recordable medium (e.g., read-only memory (ROM), random access memory (RAM), magnetic disk storage medium, optical storage medium, flash memory device, etc.). A communication interface includes any mechanism for interfacing with any of a hardwired, wireless, optical, etc. medium for communicating with other devices, such as a memory bus interface, a processor bus interface, an Internet connection, a disk controller, etc. The communication interface may be configured by providing configuration parameters and / or transmitting signals so as to prepare the communication interface to provide a data signal describing the software content. The communication interface may be accessed via one or more commands or signals transmitted to the communication interface.

[0338] The various components described herein can be means for performing the described operations or functions. Each component described herein includes software, hardware, or a combination thereof. The component may be implemented as a software module, a hardware module, dedicated hardware (e.g., application-specific hardware, application-specific integrated circuit (ASIC), digital signal processor (DSP), etc.), an embedded controller, a hardwired circuit, etc.

[0339] In addition to what has been described in this specification, various modifications can be made to what has been disclosed and to the implementation of the present invention without departing from their scope. Therefore, the description and examples in this specification should be construed in an illustrative rather than a limiting sense. The scope of the present invention should be evaluated only by reference to the following claims.

Claims

1. A board-to-board connector, comprising: a lead frame having conductive traces for bridging from a first pad on a first surface of a first printed circuit board (PCB) to a second pad on a second surface of a second PCB, wherein the second surface does not face the first surface, and the second PCB does not include pads for the board-to-board connector on a surface facing the first surface; an alignment frame for holding the lead frame, the alignment frame having posts that fit into a first alignment hole of the first PCB and a second alignment hole of the second PCB; a conductive case for fixing above the alignment frame, the case having openings for accommodating screws for fixing the case to a first screw hole in the first PCB and a second screw hole in the second PCB, and the case being electrically connected to a first ground plane of the first PCB and a second ground plane of the second PCB through the screws. The board-to-board connector as described above.

2. The conductive traces include two arch-shaped arms that are vertically offset from each other on a central post of the lead frame, a first arch-shaped arm contacting the first pad, and a second arch-shaped arm contacting the second pad. The board-to-board connector according to Claim 1.

3. The posts include a first pair of posts that fit into a pair of first alignment holes of the first PCB and a second pair of posts that fit into a pair of second alignment holes of the second PCB, and the first pair of posts and the second pair of posts are offset with respect to the center of the lead frame. The board-to-board connector according to Claim 1 or 2.

4. The case has a corrugation mechanism perpendicular to the conductive traces. The board-to-board connector according to any one of Claims 1 to 3.

5. A ground bar that selectively contacts a conductive trace connected to a ground pad, the ground bar physically contacting the case. The board-to-board connector according to any one of Claims 1 to 4, further comprising the ground bar.

6. The alignment frame has a plastic frame, and the plastic frame includes a gap for the grounding bar to extend through the plastic frame and physically contact the case, for the board-to-board connector according to claim 5.

7. The first PCB includes a primary system board, and the second PCB includes an expansion board for providing functions to the host system of the primary system board, for the board-to-board connector according to any one of claims 1 to 6.

8. The primary system board includes a motherboard of a computer system, for the board-to-board connector according to claim 7.

9. The primary system board includes a ruler board, for the board-to-board connector according to claim 7.

10. The first PCB includes a first expansion board, and the second PCB includes a second expansion board, for the board-to-board connector according to any one of claims 1 to 9.

11. A computer system, A system board having a first pad on a first surface of the system board, a system board, An expansion board having a second pad on a second surface of the expansion board, and the second surface of the expansion board does not face the first surface of the system board, an expansion board, A connector connecting the first pad to the second pad, the connector includes A lead frame including a conductive wire for bridging from the first pad to the second pad, An alignment frame for holding the lead frame, including posts in a first alignment hole of the system board and a second alignment hole of the expansion board, And a conductive case for fixing above the alignment frame And having, a connector, A screw for fixing the case to a first screw hole in the system board and a second screw hole in the expansion board, and the screw electrically connects the case to a first ground plane of the system board and a second ground plane of the expansion board, a screw And comprising, a computer system.

12. The conducting wire includes two arch-shaped arms that are vertically offset from each other on the central post of the lead frame. When the case houses the screw, the first arch-shaped arm bends to press the contact point against the first pad, and the second arch-shaped arm presses the contact point against the second pad. The computer system according to claim 11.

13. The post includes a first pair of posts that fit into a pair of first alignment holes in the system board and a second pair of posts that fit into a pair of second alignment holes in the expansion board. The first pair of posts and the second pair of posts are offset with respect to the center of the lead frame. The computer system according to claim 11 or 12.

14. The case includes a corrugation mechanism that is orthogonal to the conducting wire. The computer system according to any one of claims 11 to 13.

15. The connector is a ground bar that selectively contacts a conducting wire connected to a ground pad, and the ground bar physically contacts the case. Ground bar further includes. The computer system according to any one of claims 11 to 13.

16. The alignment frame includes a plastic frame. The plastic frame includes a gap for the ground bar to extend through the plastic frame and physically contact the case. The computer system according to claim 15.

17. The expansion board has a board for wireless communication. The computer system according to any one of claims 11 to 16.

18. The expansion board has a board for a solid state drive (SSD). The computer system according to any one of claims 11 to 16.

19. When the expansion board is on the first surface of the system board, the connector contacts the first pad with the second pad. The computer system according to any one of claims 11 to 18.

20. The screw has a connector screw. The expansion board is connected to the system board on the opposite end of the connector via a mounting screw that connects the expansion board to the system board through a standoff. The computer system according to any one of claims 11 to 19.

21. The computer system according to any one of claims 11 to 20, wherein the connector has a footing that contacts the second surface of the extension substrate, the opposite surface of the extension substrate on the side opposite to the second surface, and an end of the extension substrate that connects the second surface to the opposite surface.

22. The computer system according to any one of claims 11 to 21, wherein the connector has a height that provides a gap between components mounted between the first surface of the system substrate and the surface of the extension substrate on the side opposite to the second surface.

23. The computer system according to claim 22, wherein the component is mounted on the first surface of the system substrate, and the gap is between the component and the surface of the extension substrate on the side opposite to the second surface.

24. The computer system according to claim 22, wherein the component is mounted on the surface of the extension substrate on the side opposite to the second surface, and the gap is between the component and the first surface of the system substrate.

25. The extension substrate has a top-mount extension substrate, the connector has a top-mount connector, and the computer system has the system substrate having a third pad on the first surface of the system substrate, an in-line extension substrate having a fourth pad on the first surface of the system substrate, wherein the surface of the in-line extension substrate is substantially coplanar with the first surface of the system substrate, and the top-mount extension substrate is mounted above the in-line extension substrate, and the in-line extension substrate, an in-line connector that connects the fourth pad to the third pad and further comprises a computer system according to any one of claims 11 to 20.

26. A host processor device mounted on the system substrate, A display communicably connected to the host processor of the system substrate, A network interface communicably connected to the host processor of the system substrate, or A battery that supplies power to the computer system The computer system according to any one of claims 11 to 25, further comprising one or more of the above.

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