Factory Interface Robot That Can Be Used with an Embedded Load Lock

Abstract

A factory interface for an electronic device manufacturing system can include a load lock disposed within an interior space of the factory interface and a factory interface robot disposed within the interior space of the factory interface. The factory interface robot can be configured to transfer substrates between a first set of substrate carriers and the first load lock. The factory interface robot can include a vertical tower, a plurality of links, and an end effector.

Description

Technical Field

[0001] Embodiments of the present disclosure generally relate to systems and methods for enabling interaction between a load lock incorporated within a factory interface installation area space and a plurality of factory interface robots.

Background Art

[0002] An electronic device manufacturing system can include one or more tools or components for transporting and manufacturing substrates. Such tools or components can include a factory interface connected to a load lock and / or a transfer chamber. In some cases, the load lock is disposed between the transfer chamber and the factory interface. However, such a configuration can be inefficient by using a large operating installation area for the manufacturing system. For example, this configuration can have a long width and / or length, as well as a large section of unused space. Therefore, there is a need for an improved electronic device manufacturing system, apparatus, and method for transporting and manufacturing substrates with high installation area efficiency.

Summary of the Invention

[0003] Some of the embodiments to be described cover a factory interface for an electronic device manufacturing system. The factory interface includes a first load lock disposed within the internal space of the factory interface and a first factory interface robot disposed within the internal space of the factory interface. The first factory interface robot is configured to transfer substrates between a first set of substrate carriers and the first load lock. The factory interface robot includes a vertical tower, a plurality of links, and an end effector.

[0004] In some embodiments, the factory interface robot comprises a vertical tower configured to allow a plurality of robot links to traverse in the z-axis direction. The plurality of links are coupled to the vertical tower and configured to move the end effector along the x-axis and y-axis directions. The end effector is coupled to the plurality of links and configured to process a substrate, where the factory interface robot and the load lock are disposed within the internal space of the factory interface.

[0005] In some embodiments, a method for transporting a substrate from a first factory interface robot to a second factory interface robot includes removing the substrate from a substrate carrier by an end effector of the first factory interface slot. The method further includes adjusting a vertical position of the end effector by a vertical drive mechanism of the factory interface robot. The method further includes transferring the substrate from the first factory interface robot to the second factory interface robot, wherein the first factory interface robot and the second factory interface robot are disposed within the factory interface.

[0006] The present disclosure is shown by way of example and not limitation in the figures of the accompanying drawings in which like reference numerals indicate like elements. Note that different references to "an" or "one" embodiment in the present disclosure are not necessarily references to the same embodiment, and such references mean at least one.

Brief Description of the Drawings

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DETAILED DESCRIPTION OF THE INVENTION

[0008] The embodiments described herein relate to systems and methods for enabling interaction between a load lock incorporated within a factory interface installation area space and a factory interface robot. The embodiments cover multiple different designs for factory interfaces and load locks that reduce the total installation area of an electronic device manufacturing system. The embodiments further cover designs for shortened load ports that reduce the vertical space consumed by an electronic device manufacturing system, as well as factory interface robots configured to interact with the incorporated load lock and the shortened load ports.

[0009] Floor space in a manufacturing facility (fab) for electronic devices is extremely costly, and reducing the installation area of electronic device manufacturing systems can reduce their ownership costs. Also, by reducing the installation area of the system, the owner can install more systems within the limited fab space, thereby enabling the processing of more wafers. In this way, the embodiments described herein provide a factory interface, a load lock, a load port, and a factory interface robot that reduce the installation area and overall ownership cost of an electronic device manufacturing system.

[0010] In some embodiments, a load lock is incorporated inside the factory interface, thereby reducing the floor space that was previously dedicated to the load lock. In some embodiments, the factory interface is divided into two smaller factory interfaces (e.g., a left factory interface and a right factory interface), and one or more load locks are disposed between those two smaller factory interfaces. Each of the two smaller factory interfaces can include a factory interface robot configured to place substrates from a substrate carrier (coupled to a load port) into and out of the load lock and vice versa. The factory interface robot can include a vertical tower structured and configured to allow a plurality of robot links (e.g., arms) to traverse in the Z-direction (e.g., vertically up and down). For example, the vertical tower can include a vertical drive mechanism configured to effect linear movement of the robot links only in the Z-axis direction. The proximal link of the robot link can be coupled to the vertical drive mechanism, while the distal link of the robot link can be coupled to an end effector configured to process a particular object such as a substrate (e.g., a wafer). The robot link can include a link joint configuration (similar to a SCARA robot) that allows the link to move the end effector along the x-axis and y-axis directions. This combination of the vertical drive mechanism and the link joint configuration allows the factory interface robot to operate in a compact space while maintaining the ability to move the end effector in three dimensions. In such a configuration, the combined installed area of the space of the load lock plus the factory interface is reduced compared to the configuration of a conventional load lock factory interface, and on the other hand, it allows the factory interface robot to operate efficiently within the reduced space by including the load lock without increasing the overall size of the factory interface.

[0011] In some embodiments, the load ports of the factory interface each include an actuator (e.g., a pneumatic mechanism, an electromechanically driven device, or a similar mechanism) for opening a load port door that enables reducing the overall height of the load port as compared to a conventional load port. In some embodiments, reducing the vertical space occupied by the load port enables incorporating auxiliary components within the vertical space. The auxiliary components can include, for example, substrate storage containers, measurement equipment, servers, and air conditioning units. For example, the load port can be attached to the wall of the factory interface. The compact size of the wall-mounted load port enables at least one auxiliary component (e.g., a substrate storage container, measurement equipment, server, air conditioning unit, etc.) to be disposed below the load port. Additionally, the load port can be attached to a horizontal plane similar to the horizontal plane of a load lock used to transfer substrates to a process chamber for processing. Thus, attaching the load port to a horizontal plane similar to the horizontal plane of the load lock eliminates or reduces excessive motion (e.g., vertical motion) by a factory interface robot that transfers substrates from a substrate carrier to the load lock. In this way, in such a configuration, by combining the space occupied by the load port and the auxiliary components, the total floor area of the electronic device manufacturing system is further reduced as compared to conventional load ports and auxiliary components.

[0012] By incorporating a load lock and a factory interface into a single space, providing a system that reduces the size of the load port and the factory interface robot, an improved installation area efficiency is provided to the electronic device manufacturing system. In particular, in the conventional design of an electronic device manufacturing system, the load lock is arranged between the transfer chamber and the factory interface, thereby giving the manufacturing system a long profile. In some embodiments of the present disclosure, the load lock and the factory interface are incorporated into a single space, and one or more factory interface robots are disposed on the side of the load lock within the space. Thereby, the manufacturing system has a reduced depth.

[0013] By incorporating the load lock into the factory interface, there may not be enough space for the conventional factory interface robot to perform its operations. This is because the conventional factory interface robot uses links and joints to position the end effector in the z direction, thereby requiring space that may not be available with the incorporated load lock. In some embodiments of the present disclosure, the factory interface robot includes a vertical tower having a vertical drive mechanism configured to achieve a linear movement of the link in the z direction, thereby enabling the factory interface robot to operate within the space reduced by the incorporated load lock.

[0014] Furthermore, conventional electronic device manufacturing systems vertically arrange load ports along the side of the factory interface upward from the floor, whereby most or all of the space available within the vertical space is used. In some embodiments of the present disclosure, the load ports are shortened (e.g., 0.61 m (2 feet)), wall-mounted (not floor-standing), thereby enabling one or more auxiliary components to be placed below the load ports, and the load ports and auxiliary components are incorporated within a single space. Thus, the manufacturing system of the present disclosure has a reduced installation area, enables an increase in throughput per square meter of space, and all of these can improve the overall system yield and / or cost (e.g., manufacturing cost, material cost, packaging cost, delivery cost, etc.).

[0015] Figures 1A - 1D illustrate an electronic device manufacturing system 100 having two factory interface robots 126A - B configured to interact with respective load locks 120A - B, where the load locks 120A - B are incorporated within the space of the factory interface 106. Figure 1A is a top schematic view of an exemplary electronic device manufacturing system 100 according to an aspect of the present disclosure. Figure 1B is a front schematic view of an exemplary electronic device manufacturing system 100 according to an aspect of the present disclosure. Figures 1C and 1D are side schematic views of an exemplary electronic device manufacturing system 100 according to an aspect of the present disclosure. Note that Figures 1A - 1D are used for illustrative purposes and that different components may be arranged in different locations for each figure.

[0016] Figures 2A - 2F illustrate an electronic device manufacturing system 200 that also has two factory interface robots 126A - B configured to interact with respective load locks 120A - B, where the load locks 120A - B are incorporated within the space of the factory interface 106. The electronic device manufacturing system 200 can be similar to or the same as the electronic device manufacturing system 100. In particular, FIGS. 1A - 1D show various block diagrams of the electronic device manufacturing system 100, while FIGS. 2A - 2F show various computer - aided design (CAD) diagrams of the electronic device manufacturing system 200. FIG. 2A is an isometric view of the electronic device manufacturing system 200 according to an aspect of the present disclosure. FIG. 2B is an isometric view of the factory interface 106, focusing on the front face of the factory interface 106 according to an aspect of the present disclosure. FIG. 2C is another isometric view of the factory interface 106, focusing on the back face of the factory interface 106 according to an aspect of the present disclosure. FIG. 2D is a side view of the factory interface 106, focusing on the back face of the factory interface 106. FIG. 2E is a front view of the factory interface 106 according to an aspect of the present disclosure. FIG. 2F is a top view of the factory interface 106 according to an aspect of the present disclosure. Note that FIGS. 2A - 2F are used for illustrative purposes and that different components can be arranged in different locations for each figure.

[0017] (Also referred to as an electronics processing system) The electronic device manufacturing systems 100 and 200 are configured to perform one or more processes on a substrate 102. The substrate 102 can be any suitably rigid and dimensionally fixed flat article, such as a silicon - containing disk or wafer, a patterned wafer, a glass plate, etc., that is suitable for manufacturing an electronic device or circuit component thereon.

[0018] Electronic device manufacturing systems 100 and 200 include a process tool (e.g., mainframe) 104 and a factory interface 106 coupled to the process tool 104. The process tool 104 includes a housing 108 having a transfer chamber 110 therein. The transfer chamber 110 includes one or more processing chambers 114, 116, 118 disposed around and coupled to it (also referred to as process chambers). The processing chambers 114, 116, 118 can be coupled to the transfer chamber 110 via respective ports, such as slit valves.

[0019] The processing chambers 114, 116, 118 can be adapted to perform any number of processes on the substrate 102. The same or different substrate processes can be performed in each of the processing chambers 114, 116, 118. Examples of substrate processes include atomic layer deposition (ALD), physical vapor deposition (PVD), chemical vapor deposition (CVD), etching, annealing, curing, pre-cleaning, removal of metal or metal oxide, etc. In one example, a PVD process is performed in one or both of the process chambers 114, an etching process is performed in one or both of the process chambers 116, and an annealing process is performed in one or both of the process chambers 118. Other processes can be performed on the substrate therein. Each of the processing chambers 114, 116, 118 can include a substrate support assembly. The substrate support assembly can be configured to hold the substrate in a predetermined position while the substrate process is being performed.

[0020] The transfer chamber 110 also includes a transfer chamber robot 112. The transfer chamber robot 112 can include one or more arms, and each arm can include one or more end effectors at the end of each arm. The end effector can be configured to process a specific object, such as a wafer. Alternatively or additionally, the end effector is configured to process an object such as a process kit ring. In some embodiments, the transfer chamber robot 112 is a selectively compliant assembly robot arm (SCARA) robot, such as a 2-link SCARA robot, a 3-link SCARA robot, a 4-link SCARA robot, etc.

[0021] Load locks 120A - B can be coupled to the housing 108 and the transfer chamber 110. Load locks 120A - B can be disposed within the internal space of the factory interface 106 and can be configured to interface with the transfer chamber 110 and the factory interface 106. Load locks 120A - B can have an environmentally controlled atmosphere that, in some embodiments, changes from a vacuum environment (where substrates are transferred into and out of the transfer chamber 110) to an atmospheric pressure or near - atmospheric pressure inert gas environment (where substrates are transferred into and out of the internal space of the factory interface 106 outside the load lock). In some embodiments, as shown in FIGS. 1B and 1C, load locks 120A - B are stacked load locks each having one or more (e.g., a pair) of upper inner chambers and one or more (e.g., a pair) of lower inner chambers located at different vertical levels (e.g., vertically overlapping). In some embodiments, one or more upper inner chambers are configured to receive substrates processed from the transfer chamber 110 for removal to the process tool 104, while one or more lower inner chambers are configured to receive substrates from the factory interface 106 for processing in the process tool 104, and vice versa. In some embodiments, as shown in FIG. 1D, load locks 120A - B are batch load locks each configured to hold and / or transfer a plurality of substrates (e.g., 25 substrates). In some embodiments, load locks 120A - B are configured to perform substrate processes (e.g., etch or pre - clean) on one or more substrates 102 received therein. Thus, load locks 120A - B can include one or more heating elements for heating the substrates and / or cooling elements for cooling the substrates.

[0022] The factory interface 106 can be any suitable enclosure, such as, for example, an equipment front-end module (EFEM). The factory interface 106 can be configured to receive substrates 102 from substrate carriers 122A - F (e.g., Front Opening Unified Pods (FOUPs)) docked to various load ports 124 of the factory interface 106. In a first example, as shown in FIG. 1A, the factory interface 106 can include four load ports 124 that can be arranged at one or more heights on the front surface of the factory interface 106. In a second example, as shown in FIGS. 1B, 2A, 2B, 2E, and 2F, the factory interface 106 can include six load ports 124 that can be arranged at one or more heights on the front surface of the factory interface 106. The factory interface 106 can be configured with any number of load ports 124 that can be located at the same or different heights on one or more sides of the factory interface 106.

[0023] As shown in FIGS. 1B, 2A, 2B, and 2E, load ports 124 can be located at different heights along the wall of factory interface 106. By raising load ports 124, placement of one or more auxiliary components 150 onto the base of factory interface 106 becomes possible. Auxiliary components 150 are described in more detail below. In some embodiments, as shown in FIGS. 1B, 2A, 2B, and 2E, one or more load ports 124 can be located on or near the factory interface base and on the front face of factory interface 106, while one or more additional load ports 124 can be located at a higher height (e.g., about 2 meters from the ground). In some embodiments, one or more substrate carrier elevators 113 can be configured to lift substrate carriers 122A - F. In some embodiments, substrate carrier elevator 113 can lift one or more substrate carriers 122A - F to an overhead automation component (not shown). The overhead automation component can deliver one or more substrate carriers 122A - F to one or more raised load ports 124. Further, the overhead automation component can remove one or more substrate carriers 112A - F from one or more raised load ports 124. In one example, a factory operator can load substrate carriers 122A - F onto substrate carrier elevator 113, engage the elevator to lift substrate carriers 122A - F to the overhead automation component, engage the overhead automation component to deliver substrate carriers 122A - F to load port 124, then engage the overhead automation component to remove substrate carriers 122A - F from the load port and empty it once, and engage the elevator to lower substrate carriers 122A - F.

[0024] In some embodiments, at least one load port 124 can be disposed at a lower height that is accessible to a factory operator who can manually load one or more substrate carriers 112A - F onto the load port 124. One or more additional load ports 124 can be disposed at a higher height such that the factory operator can engage the substrate carrier elevator 113 with an overhead automation component to load one or more substrate carriers 112A - F onto the elevated load port 124. Such a configuration can allow for additional space to the base of the front of the factory interface, such that components disposed in that space will not increase the footprint of the electronic device manufacturing system 100. For example, in some embodiments, an auxiliary component 150 can be replaced with a load port 124. For example, four or six load ports 124 can be located on the front face of the factory interface 106 at or near the factory interface base. In some other embodiments, one or more load ports 124 can be loaded on the side walls of the factory interface 106.

[0025] According to aspects of the present disclosure, one or more load ports 124 can be designed to occupy a minimal amount of vertical space above the factory interface 106. These load ports are discussed in more detail in relation to FIGS. 6A - 6B and 7. In some embodiments, the load ports 124 can be located at different heights along the wall of the factory interface 106. As discussed above, raising the load port 124 allows for the placement of one or more auxiliary components 150 below the load port 124 at the base of the factory interface 106.

[0026] Factory interface robots 126A - B can be configured to transfer the substrate 102 between substrate carriers 122A - F (also called containers) and load locks 120A - B. In one embodiment, the factory interface 106 includes two or more factory interface robots. For example, the factory interface 106 can include a first factory interface robot 126A disposed on a first side surface (e.g., the left side surface) of the factory interface 106 within the factory interface, and a second factory interface robot 126B disposed on a second side surface (e.g., the right side surface) of the factory interface 106 within the factory interface. In one embodiment, with the load lock 120A being brought closer by the factory interface robot 126A and the load lock 120B being brought closer by the factory interface robot 126B, the first load lock 120A and the second load lock 120B are disposed within the factory interface 106 between the first factory interface robot 126A and the second factory interface robot 126B.

[0027] In one example, the factory interface robot 126A may be configured to transfer the substrate 102 between a first set of substrate carriers (e.g., substrate carriers 122A - B, 122E) and the load lock 120A. In another example, the factory interface robot 126B may be configured to transfer the substrate 102 between a second set of substrate carriers (e.g., substrate carriers 122C - D, 122F) and the load lock 120B. However, it should be noted that the factory interface robots 126A - B may be configured to transfer the substrate 102 between any of the substrate carriers 122A - F and the load locks 120A - B. In other and / or similar embodiments, the factory interface 106 is configured to receive replacement parts from a replacement part storage container, and the factory interface robots 126A - B are configured to transport such replacement parts into and out of one or more of the load locks 120A - B. In some embodiments, the factory interface robot 126A cannot access the load lock 120B, and the factory interface robot 128B cannot access the load lock 120A.

[0028] The factory interface robots 126A - B can include one or more robotic arms, each of which can be a SCARA robot, a mast - type robot, a lift - type (e.g., scissor lift) robot, or any combination thereof, or can include these. In some embodiments, the factory interface robots 126A - B have more links and / or greater degrees of freedom than the transfer chamber robot 112. Each of the factory interface robots 126A - B can include an actuator or assembly that can adjust the height of one or more of the robotic arms of the respective factory interface robots 126A - B, whereby the factory interface robots 126A - B can reach carriers connected to the load ports at different heights. The factory interface robots 126A - B can each include one or more end effectors on the end of each robotic arm. The end effector can be configured to pick up and process a specific object, such as a wafer. Alternatively or additionally, the end effector can be configured to process an object such as a process kit ring. Any conventional robot type can be used for the factory interface robots 126A - B. The transfer can be performed in any order or in any direction. The factory interface robots 126A - B are discussed in more detail in relation to FIGS. 8 and 9A - 9C.

[0029] In some embodiments, the factory interface 106 can be maintained in a slightly positive pressure non-reactive gas environment, for example, using nitrogen as the non-reactive gas. In an embodiment, the factory interface 106 includes an environmental control system having one or more inert gas supply lines, one or more exhaust lines, and one or more sensors that can be used to measure one or more of humidity, O2 level, temperature, pressure, gas flow rate, and / or other parameters. The environmental control system can adjust the gas flowing into the factory interface and / or the gas flow rate and / or the gas flow rate exhausted from the factory interface based on one or more measured parameters. In an embodiment, the factory interface further includes a recirculation system that can filter the gas exhausted from the factory interface and recirculate the filtered gas back inside the factory interface.

[0030] Each of the load locks 120A - B can include one or more slit valves and / or doors configured to open when receiving or releasing substrates to and / or from the factory interface robots 126A - B and the transfer chamber robot 112. The slit valves and / or doors can be used to maintain a vacuum environment, a clean environment, and / or a temperature-controlled environment. For example, the slit valves and / or doors can be used to maintain the vacuum environment inside the transfer chamber 110 and the inert gas environment inside the factory interface 106. The load lock 120A can include one or (as shown in FIG. 1D) more side doors 128A that can permit access to the factory interface robot 126A. The load lock 120B can include one or more side doors 128B that can permit access to the factory interface robot 126B. The load locks 120A - B can include one or more front doors (not shown) that permit access to the transfer chamber robot 112.

[0031] As shown, in one embodiment, side door 128A is substantially perpendicular to the back of factory interface 106 and also substantially perpendicular to door 130. Similarly, in one embodiment, side door 128B is substantially perpendicular to the back of factory interface 106 and also substantially perpendicular to door 130. Side door 128A may face in a direction opposite to side door 128B. Although not shown, one or more additional side doors may be included within load locks 120A, 120B, and the one or more additional side doors are between load lock 120A and load lock 120B and separate load lock 120A from load lock 120B. For example, an additional side door of load lock 120B may be on the opposite side of side door 128B, allowing factory interface robot 126B to place a substrate in load lock 120A, allowing factory interface robot 126A to place a substrate in load lock 120B, and / or allowing a handoff of the substrate between factory interface robot 126A and factory interface robot 126B, and may be opened.

[0032] In some embodiments, the factory interface robots 126A - B can orient the end effector in a first direction that is directed towards the front of the factory interface and is substantially perpendicular to the front of the factory interface when removing a substrate from the containers 122A - F and / or when placing a substrate in the containers 122A - F. In an embodiment, the factory interface robot 126A can orient one or more end effectors in a second direction that can be substantially perpendicular to the first direction when removing a substrate from the load lock 120A and / or when placing a substrate in the load lock 120A. Similarly, the factory interface robot 126B can orient one or more end effectors in a third direction that can be substantially perpendicular to the first direction when removing a substrate from the load lock 120B and / or when placing a substrate in the load lock 120B. In an embodiment, the third direction can be about 180 degrees from the second direction.

[0033] In some embodiments, the transfer chamber 110, the process chambers 114, 116, and 118, and / or the load locks 120A - B are maintained at a vacuum level. The electronic device manufacturing system 100 can include one or more vacuum ports coupled to one or more stations of the electronic device manufacturing system 100. For example, the vacuum ports 130 can be coupled to the load locks 120A - B and disposed between the load locks 120A - B and the transfer chamber 110. In some embodiments, additional vacuum ports can be used. For example, additional vacuum ports (not shown) can couple the factory interface 106 to the load locks 120A - B. In some embodiments, a factory operator can access the load locks 120A - B for maintenance or repair without stopping the factory interface 106. This will be described in more detail below.

[0034] In some embodiments, one or more utility lines (not shown) are configured to provide utilities to the factory interface 106. The utility lines can include a power utility line configured to provide power to the factory interface 106, an air utility line (e.g., a clean dry air (CDA) utility line) configured to provide air to the factory interface 106, a vacuum utility line configured to provide vacuum at the vacuum port 130 and / or inside the chamber of the factory interface 106, and / or a nitrogen utility line configured to provide nitrogen to the factory interface 106.

[0035] One or more utility cables can be configured to protect one or more utility lines. For example, each utility line can be enclosed within a utility cable. Multiple utility lines can be enclosed within the same utility cable, and / or utility lines can be included within separate utility cables. The first end of each utility cable can be attached to the outlet of a utility supply (e.g., a power supply, an air supply, a vacuum pump, a nitrogen supply, etc.). In some embodiments, the outlet of the utility supply is connected to the floor (or wall) of the electronic device manufacturing system 100. Thus, the first end of each utility cable can be attached to the floor of the manufacturing factory (e.g., the floor on which the factory interface 106 is installed). The second end of each utility cable can be attached to the inlet of the factory interface 106. In some embodiments, the inlet is located at the bottom of the factory interface 106. Thus, the second end of each utility cable is attached to the bottom of the factory interface 106.

[0036] The electronic device manufacturing system 100 can also include a system controller 140. The system controller 140 is a computing device such as a personal computer, a server computer, a programmable logic controller (PLC), a microcontroller, and / or can include such computing devices. The system controller 140 can include one or more processing devices that can be general-purpose processing devices such as a microprocessor, a central processing unit, etc. More specifically, the processing device can be a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, or a processor implementing other instruction sets, or a processor implementing a combination of instruction sets. The processing device can also be one or more dedicated processing devices such as an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), a digital signal processor (DSP), a network processor, etc. The system controller 140 can include a data storage device (e.g., one or more disk drives and / or solid state drives), main memory, static memory, a network interface, and / or other components. The system controller 140 can execute instructions for performing any one or more of the methods and / or embodiments described herein. The instructions can be stored on a computer-readable storage medium that can include main memory, static memory, secondary storage, and / or the processing device during execution of the instructions. The system controller 140 can include an environmental controller configured to control the environment (e.g., pressure, moisture level, vacuum level, etc.) within the factory interface 106. In an embodiment, execution of the instructions by the system controller 140 causes the system controller to perform one or more of the methods of FIGS. 11 and 12. The system controller 140 can also be configured to permit input and display of data, operating commands, etc. by a human operator.

[0037] Next, referring to FIGS. 1A - 1B, in some embodiments, factory interface robot 126A is configured to transfer one or more substrates to factory interface robot 126B using pass - through areas 115A, 115B, 115C, and vice versa. In a first example, as shown in FIG. 1A, a pass - through area 115A can be disposed between the front surface of the factory interface and the forward - facing side surface of the load lock. In a second example, the pass - through area 115B can be a via or open space disposed above the load locks 120A - B within the internal space of the factory interface 106. In a third example, the pass - through area 115C can be an open space or via disposed between a pair of upper - inner chambers and a pair of lower - inner chambers of the load locks 120A - B (for example, when the load locks 120A - B are stacked load locks respectively) within the internal space of the factory interface 106. In a fourth example, the pass - through area 115D can be an open space or via disposed below the load locks 120A - B within the internal space of the factory interface 106. The factory interface robot 126A can be configured to transfer one or more substrates to the factory interface robot 126B through one or more of the pass - through areas 115A - D in an embodiment.

[0038] In some embodiments, the factory interface robot 126A can hand - off a substrate to the factory interface robot 126B, and vice versa. For example, as shown in FIG. 3, substrates 302A - B can be transferred between factory interface robots 126A - B (not shown) using the pass - through area 310. In some embodiments, the factory interface robot 126A can place a substrate on a shelf in any of the pass - through areas 115A - D included in the factory interface, and the factory interface robot 126B can pick up the substrate from the shelf.

[0039] Referring to FIGS. 1B - 1D, FIGS. 2A - 2B, and FIGS. 2D - 2E, the factory interface 106 can be accessed by a factory interface robot and can include one or more auxiliary components 150 that are part of the factory interface mini - environment. The auxiliary components 150 can include, for example, a substrate wafer storage station, a measurement station, a cooling station, a server, etc. A substrate storage container can store, for example, substrates and / or substrate carriers (e.g., FOUP). Measuring equipment can be used to determine the characteristic data of products generated by the electronic device manufacturing system 100. In some embodiments, the factory interface 106 can include an upper section 160 as seen in FIGS. 1B and 2A - 2E. The upper section 160 can house an electronic system (e.g., a server, an air - conditioning unit, etc.), utility cables, the system controller 140, or other components.

[0040] The factory interface 106 can include one or more access doors 134, 136 that can be used to inspect or perform maintenance on the load locks 120A - B, the factory interface robots 126A - B, or other components. In some embodiments, the factory interface can include a side access door 134. In some embodiments, the factory interface 106 can include a front access door 136. The load locks 120A - B can be isolated from the clean environment created by the factory interface 106 via side doors 128A - B. This allows the factory operator to access the load locks 120A - B without closing the clean environment created by the factory interface 106.

[0041] In the illustrated embodiments of FIGS. 1A, 1C, and 1D, there is an open space (e.g., passage area 115A) between the front face of the factory interface and the front faces of load locks 120A - B. In alternative embodiments, load locks 120A, 120B can extend all the way to the front face of factory interface 106. In such embodiments, the load locks can be accessed without exposing the internal space of factory interface 106 to the external environment. In one embodiment, load locks 120A, 120B include additional access doors (not shown) on the side of the load locks opposite door 130. Such access doors can be opened while doors 130, 128A, 128B are closed to enable maintenance access to load locks 120A - B without exposing the inside of factory interface 106 to the external environment.

[0042] In some embodiments, as shown in FIGS. 1B, 2A - 2B, and 2E, factory interface 106 can include an under - access area 170. The under - access area 170 can be a channel that enables a factory operator to perform maintenance for factory interface 106, load locks 120A - B, factory - interface robots 126A - B, transfer chamber 108, and / or other components of the electronic - device manufacturing system 100. In some embodiments where the factory interface includes an under - access area 170, load locks 120A, 120B include maintenance access doors on the bottom surfaces of load locks 120A, 120B that are accessible from the under - access area 170.

[0043] In the description example, the factory interface 106 includes a plurality of side surfaces including a back surface, a front surface, a right side surface, and a left side surface configured to face the transfer chamber 110 of the electronic device manufacturing system 100. A first factory interface robot (for example, the factory interface robot 126A) is disposed in the internal space close to the left side surface, and a second factory interface robot (for example, the factory interface robot 126B) is disposed in the internal space close to the right side surface. A first load lock (for example, the load lock 120A) and a second load lock (for example, the load lock 120B) are disposed adjacent to the back surface between the first factory interface robot and the second factory interface robot such that the first load lock is closer to the first factory interface robot than the second load lock, and the second load lock is closer to the second factory interface robot than the first load lock. The factory interface 106 includes a first set of load ports (for example, one or more of the load ports 122) for receiving a first set of substrate carriers (for example, one or more of the substrate carriers 122A to 122F), and the first set of load ports is disposed in a first portion of the front surface close to the left side surface. The factory interface 106 also includes a second set of load ports (for example, one or more of the load ports 122) for receiving a second set of substrate carriers (for example, one or more of the substrate carriers 122A to 122F), and the second set of load ports is disposed in a second portion of the front surface close to the right side surface. The factory interface 106 can include at least one of a substrate storage container or a measuring device disposed below the load port 122 among the first set of load ports. The plurality of side surfaces can include a back surface, a right side surface, and a left side surface configured to face the transfer chamber 110, the first factory interface robot is disposed in the internal space close to the left side surface, and the first load lock is disposed adjacent to the back surface between the first factory interface robot and the right side surface.The first load lock can include a first door (e.g., side door 128A) that is substantially perpendicular to the back and accessible by a first factory interface robot, and a second door that is substantially parallel to the back and accessible by transfer chamber robot 112.

[0044] FIG. 4A is a schematic plan view of an electronic device manufacturing system 400 including a process tool 404 and a factory interface 406 coupled to the process tool 404, according to one embodiment of the present disclosure. The components and functions of the process tool 404 and the factory interface 406 can be similar to those of the process tool 104 and the factory interface 406, respectively. FIGS. 4A-4B illustrate an exemplary electronic device manufacturing system 400 similar to that described with respect to FIGS. 1A-1D, but the factory interface 406 includes a bulged section 410 on the front surface of the factory interface 106. FIG. 4A is a schematic plan view of an exemplary electronic device manufacturing system 400, according to aspects of the present disclosure. FIG. 4B is a schematic side view of an exemplary electronic device manufacturing system 400, according to aspects of the present disclosure. The bulged section 410 can provide additional space within the factory interface 406. The bulged section 410 can extend any length away from the load locks 120A-B and can have an upper section (e.g., a ceiling) with a height independent of the remaining height of the factory interface 406. For example, the height of the upper section of the bulged section 410 can be 1 meter, 2 meters, the same height as the upper section of the factory interface 406, a height higher than the upper section of the factory interface 406, or some other height. In some embodiments, the bulged section 410 can extend to the ends of the substrate carriers 122A-D so as not to increase the operating footprint of the factory interface 406. Thus, in an embodiment, the front surface of the bulged section 410 can be substantially coplanar with the front surfaces of the carriers 122A-F. In some embodiments, the bulged section 410 provides additional space within the factory interface 406 for housing various components, such as, but not limited to, substrate storage containers, metrology equipment, servers, air conditioning units, etc. The bulged section 410 can share the clean environment of the factory interface 406.

[0045] In some embodiments, the factory interface robot 126A can be configured to transfer one or more substrates to the factory interface robot 126B using the passage area 115 disposed within the raised section 410, and vice versa. For example, the factory interface robot 126A can hand off a substrate to the factory interface robot 126B using the passage area disposed within the raised section 410. In another example, the factory interface robot 126A can place a substrate on a shelf in the passage area disposed within the raised section 410, and the factory interface robot 126B can retrieve the substrate from the shelf.

[0046] In some embodiments, the load lock is not included within the factory interface. In such embodiments, the factory interface can be divided into two or more factory interfaces (e.g., a left factory interface and a right factory interface). The load lock can, in that case, be disposed between the left factory interface and the right factory interface. Thereby, the total installation area of the factory interface and the load lock can be reduced in the same manner as described in the embodiments above.

[0047] In the illustrative example, the front surface of the factory interface 406 can include a central portion (e.g., a raised section 410), a left front portion, and a right front portion. The central portion protrudes away from the left front portion, the right front portion, and the back surface. A first load port (e.g., one of the load ports 122) is disposed at a first position on the left front portion, and a second load port (e.g., another one of the load ports 122) is disposed at a second position on the right front portion. A via disposed in the central portion within the internal space of the factory interface 406 can be used by a first factory interface robot (e.g., factory interface robot 126A) configured to transfer a substrate through the via to a second factory interface robot (e.g., factory interface robot 126B).

[0048] Figures 5A - 5B illustrate an electronic device manufacturing system 500 in which a first load lock (e.g., load lock 120A) is connected to a first factory interface (e.g., factory interface 506A), and a second load lock (e.g., load lock 120B) is connected to a second factory interface (e.g., factory interface 506B). Figure 5A is a schematic plan view of an exemplary electronic device manufacturing system 500 according to an aspect of the present disclosure. Figure 5B is a schematic front view of an exemplary electronic device manufacturing system 500 according to an aspect of the present disclosure.

[0049] The electronic device manufacturing system 500 includes a process tool 504, load locks 520A - B coupled to the process tool 504, and factory interfaces 506A - B. The factory interface 506A is coupled to the load lock 520A, and the factory interface 506B is coupled to the load lock 520B. The components and functions of the process tool 504, load locks 520A - B, and factory interfaces 506A - B can be similar to those of the process tool 104, load locks 120A - B, and factory interface 106, respectively.

[0050] Load locks 520A - B can be coupled to the housing 108 and the transfer chamber 110. Load locks 520A - B can be configured to interface with the transfer chamber 110 and the factory interfaces 506A - B. Load locks 520A - B can have an environmentally controlled atmosphere that, in some embodiments, changes from a vacuum environment (where substrates are transferred into and out of the transfer chamber 110) to an atmospheric pressure or near - atmospheric pressure inert gas environment (where substrates are transferred into and out of the factory interfaces 506A - B). In some embodiments, load locks 520A - B are stacked load locks each having a pair of upper inner chambers and a pair of lower inner chambers located at different vertical levels (e.g., vertically overlapping). In some embodiments, load locks 520A - B are each batch load locks. More or fewer load locks than the number shown may be used.

[0051] Similar to the factory interface 106, each of the factory interfaces 506A - B can be any suitable enclosure, such as, for example, an equipment front - end module (EFEM). The factory interface 506A can be configured to receive the substrates 102 from the substrate carriers 122A - B docked at various load ports 124 of the factory interface 506A. Although two substrate carriers 122A - B are shown, it should be noted that more or fewer substrate carriers can be connected to the factory interface 506A. The factory interface 506B can be configured to receive the substrates 102 from the substrate carriers 122C - D docked at various load ports 124 of the factory interface 506B. Although two substrate carriers 122C - D are shown, it should be noted that more or fewer substrate carriers can be connected to the factory interface 506B. The load ports 124 and the attached substrate carriers can be located at different heights along the wall of the factory interface 106. By raising the load ports 124, the placement of one or more auxiliary components (not shown) on the base of the factory interface 106 becomes possible and / or multiple substrate carriers can be stacked vertically.

[0052] Factory interface robots 526A - B can each be similar to factory interface robots 126A - B and can be configured to transfer substrate 102 between substrate carriers 122A - D and load locks 520A - B. For example, factory interface robot 526A can be configured to transfer substrate 102 between substrate carriers 122A - B and load lock 520A, and factory interface robot 526B can be configured to transfer substrate 102 between substrate carriers 122C - D and load lock 520B. In one embodiment, factory interface 506A includes one or more factory interface robots, and factory interface 506B includes one or more factory interface robots. For example, factory interface 506A can include a first factory interface robot 526A disposed within factory interface 506A, and factory interface 506B can include a second factory interface robot 526B disposed within factory interface 506B. In one embodiment, the first load lock 520A and the second load lock 520B are disposed between the first factory interface robot 526A and the second factory interface robot 526B with load lock 520A being closer to factory interface robot 526A and load lock 520B being closer to factory interface robot 526B.

[0053] A first vacuum port (not shown) can couple factory interface 506A to load lock 520A, and a second vacuum port can couple factory interface 506B to load lock 520B. The atmosphere of each load lock 520A - B can be adjusted independently of the other load locks 520A - B. This allows the factory operator to access the other load lock and factory interface for maintenance or repair while one load lock and factory interface remain in operation.

[0054] The factory interface 106 can include one or more auxiliary components 150. The auxiliary components 150 can include a substrate storage container, measuring equipment, a server, an air conditioning unit, etc. The substrate storage container can store substrates and / or substrate carriers (e.g., FOUP). Measuring equipment can be used to determine the characteristic data of the products generated by the electronic device manufacturing system 100.

[0055] In some embodiments, the factory interface 506A can include an upper section 560A as shown in FIG. 5B, the factory interface 506B can include an upper section 560B, and the load locks 520A - B can include an intermediate section 580 and a lower section 570. Each of these sections can house one or more of an electronic system (e.g., a server, an air conditioning unit, etc.), utility cables, the system controller 140, or other components.

[0056] As shown, in one embodiment, side door 128A is substantially perpendicular to the back of factory interface 506A and also substantially perpendicular to door 150. Similarly, in one embodiment, side door 128B is substantially perpendicular to the back of factory interface 506B and also substantially perpendicular to door 150. Side door 128A can face in a direction opposite to side door 128B. Although not shown, one or more additional side doors may be included within load locks 520A - B, and the one or more additional side doors are between load lock 520A and load lock 520B and separate load lock 520A from load lock 520B. For example, an additional side door of load lock 520B can be on the opposite side of side door 528B, enabling factory interface robot 526B to place a substrate in load lock 520A, enabling factory interface robot 526A to place a substrate in load lock 520B, and / or can be opened to enable a handoff of the substrate between factory interface robot 526A and factory interface robot 526B.

[0057] In an embodiment, factory interface robots 526A - B can orient an end effector in a first direction that is substantially perpendicular to the front of the factory interface when removing a substrate from containers 122A - D and / or when placing a substrate in containers 122A - D. In an embodiment, factory interface robot 526A can orient one or more end effectors in a second direction that can be substantially perpendicular to the first direction when removing a substrate from load lock 520A and / or when placing a substrate in load lock 520A. Similarly, factory interface robot 526B can orient one or more end effectors in a third direction that can be substantially perpendicular to the first direction when removing a substrate from load lock 520B and / or when placing a substrate in load lock 320B. The third direction can be approximately 180 degrees from the second direction in an embodiment.

[0058] The load locks 520A - 520B can be accessed without exposing the internal space of the factory interfaces 506A - B to the external environment. In one embodiment, the load locks 520A, 520B include an additional access door (not shown) on the side of the load lock opposite the door 150. Such an access door can be opened while the doors 150, 128A, 128B are closed to allow maintenance access to the load locks 520A - B without exposing the inside of the factory interfaces 506A - B to the external environment.

[0059] Next, referring to FIG. 5B, in some embodiments, the factory interface robot 526A may be configured to transfer one or more substrates to the factory interface robot 526B using the passage area 515, and vice versa. In one example, the passage area 515 can be a via between a pair of upper inner chambers and a pair of lower inner chambers of the load locks 520A - B (e.g., when the load locks 120A - B are each stacked load locks). In some embodiments, the passage area 515 can be a part of the environmentally controlled atmosphere that changes from a vacuum environment (where the substrate is transferred in and out of the transfer chamber 110) to an atmospheric pressure or near - atmospheric - pressure inert gas environment (where the substrate is transferred into and out of the internal space of the factory interface 106 outside the load lock). For example, the passage area 515 can be part of one or more environmentally controlled areas of the load lock or can have its own separate environmentally controlled area. In one embodiment where the passage area 515 is between the upper inner chamber and the lower inner chamber, the passage area is contained within the enclosure housing the load lock and includes a slit valve that can be used to seal the passage area 515 from the environment of the factory interface. Alternatively, the passage area 515 can be exposed to the environment of the factory interface and / or can be part of the environment of the factory interface. Alternatively or additionally, vias can be disposed above and / or below the load lock to provide a passage area between the factory interface 506A and the factory interface 506B. In some embodiments, either or both of the vias disposed above and / or below the load lock can be part of the environmentally controlled atmosphere of one or more of the load locks. The factory interface robot 526A can be configured to transfer one or more substrates to the factory interface robot 526B through any of the passage areas, and vice versa.In some embodiments, the factory interface robot 526A can hand off the substrate to the factory interface robot 526B. In some embodiments, the factory interface robot 526A can place the substrate on a shelf in the passage area, and the factory interface robot 526B can pick up the substrate from the shelf.

[0060] In the illustrative example, the electronic device manufacturing system 500 includes a transfer chamber 110, a plurality of processing chambers connected to the transfer chambers 114, 116, 118, and a first load lock (e.g., load lock 520A) having a first side and a second side that is substantially perpendicular to the first side of the first load lock, where the first side of the first load lock is connected to the transfer chamber 110. Further, the electronic device manufacturing system 500 includes a second load lock (e.g., load lock 520B) having a first side and a second side that is substantially perpendicular to the first side of the second load lock, where the first side of the second load lock is connected to the transfer chamber 110. A first factory interface 506A is connected to the second side of the first load lock, and a second factory interface 506B is connected to the second side of the second load lock. The first factory interface 506A can include a first atmospheric environment, and the second factory interface 506B can include a second atmospheric environment.

[0061] Figures 6A-6B illustrate an exemplary load port 600 including an indicator light 610, a load port controller 615, a pneumatic control device 620, a purge kit 625, and a stage 640, according to an embodiment of the present disclosure. The components and functions of the load port 600 can be similar to those of the load port 124. Figure 6A is a front schematic view of an exemplary load port 600 according to an embodiment of the present disclosure. Figure 6B is a side schematic view of an exemplary load port 600 according to an embodiment of the present disclosure.

[0062] As shown in FIG. 6A, the load port door 605 can be positioned at a closed position 630 for fixing a transport opening for the purpose of maintaining an environmentally controlled atmosphere within the factory interface 106. The load port door 605 can be positioned at an open position 635 using a door mechanism, as described in more detail in FIG. 7. While at the open position 635, the transport opening within the load port 600 enables a substrate (e.g., a wafer) to be transferred between a substrate carrier 122 coupled to the load port 600 and the factory interface 106 using the factory interface robot 126. In some embodiments, the load port door 605 can be coupled to a substrate carrier door. Thus, in response to the load port door 605 being positioned at the open position 635, the load port door 605 can remove the substrate carrier door from the substrate carrier. Thus, in response to the load port door 605 being positioned at the closed position 630, the load port door 605 can attach the substrate carrier door to the substrate carrier.

[0063] The load port 600 can be designed to occupy a minimal amount of vertical space on the factory interface 106. In some embodiments, the height of the load port 600 can be related to the vertical space occupied by the load port door 605 at the open position 630 and the closed position 635. In particular, the height of the load port 600 can be approximately twice the height of the load port door 605. By way of illustrative example, the load port door 605 can have a height of approximately 315 millimeters. Thus, the load port 600 can have a height of approximately twice the height of the load port door 605 and be significantly less than the height of a conventional load port of over 1300 millimeters, i.e., 650 millimeters or less. As shown by way of an exemplary embodiment in FIG. 6B, the load port 600 can have a width of 450 millimeters or less. The load port 600 can comply with the standards and requirements of SEMI (Semiconductor Equipment and Materials International).

[0064] The indicator light 610 can indicate whether the load port door 605 is in either the closed position 635 or the open position 630. For example, the indicator light 610 can be turned on in response to the load port door 605 being in the open position 630 and can be turned off in response to the load port door 605 being in the closed position 630. In other embodiments, the indicator light 610 can indicate whether the substrate carrier 122 is properly secured to the load port 600.

[0065] The load port controller 615 can be a computing device, such as a programmable logic controller (PLC) and a microcontroller, and / or can include such a computing device. The load port controller 615 can include one or more processing devices that can be general-purpose processing devices such as a microprocessor or a central processing unit. The load port controller 615 can include a data storage device (e.g., one or more disk drives and / or solid state drives), main memory, static memory, a network interface, and / or other components. The load port controller 615 can execute instructions for performing any one or more of the methods and / or embodiments described herein. For example, the load port controller 615 can operate the load port door (e.g., place the load port door 605 in the open position 635 or place the load port door 605 in the closed position 630), turn the indicator light 610 on / off, start and stop and / or communicate with the pneumatic control device 620, the purge kit 625, the particle capture mechanism 650, etc. The instructions can be stored on a computer-readable storage medium that can include main memory, static memory, secondary storage, and / or the processing device during the execution of the instructions. In an embodiment, the execution of the instructions by the load port controller 615 can at least partially execute the method of FIG. 11. The load port controller 615 can also be configured to permit inputs and displays such as data and operating commands by a human operator or the system controller 140. In some embodiments, the load port controller 615 can include a radio frequency identification (RFID) system for performing automatic lot identification during the substrate loading and unloading process.

[0066] The pneumatic control device 620 can operate a pneumatic device or a similar mechanism by using differential pressure and / or flow rate to push a flexible diaphragm connected to a mechanical valve and similar devices for the purpose of operating a switch, opening or closing a valve, moving a damper, etc. As an example, the pneumatic control device 620 can operate a pneumatic device using compressed air or gas. The pneumatic device can be coupled to the load lock door 605. The pneumatic control device 620 can receive commands from the load port controller 615 and / or can be operated by the load port controller 615. For example, the load port controller 615 can issue commands to the pneumatic control device 620 to position the load port door 605 at the open position 635 and the closed position 630.

[0067] The purge kit 625 enables the cleaning of the substrate carrier 122 using nitrogen (N2) or any other practical inert gas such as argon when the substrate carrier 122 is processed by the electronic device manufacturing system 100. The purge kit 625 can include a purge nozzle array between one or more substrates, one or more curtain nozzle arrays, etc. The combination of gas flows from the nozzle arrays can be controlled by the load port controller 615 to achieve optimal cleaning of the substrate carrier 122. The stage 640 can project horizontally from the load port 600 and can assist in the positioning of the substrate carrier 122.

[0068] The load port 600 can have one or more sets of mounting holes for coupling the load port 600 to the factory interface 106. As an example of an exemplary embodiment, the load port 600 can include two sets of mounting holes. For example, a first pair of mounting holes can be located at the upper front corner of the load port 600, and a second pair of mounting holes can be located at the lower front corner of the load port 600. By comparison, conventional load ports require three sets of mounting holes (a top set, a middle set, and a bottom set). In this way, the load port 600 can be coupled to the wall of the factory interface 106 using fewer fixtures (e.g., bolts, screws, rivets, etc.). In some embodiments, the load port 600 can be mounted on the wall of the factory interface 106 using one or more mounting racks. Mounting the load port 600 can comply with SEMI standards and requirements.

[0069] As shown in FIG. 6B, the load port 600 can include a particle capture mechanism 650. The particle capture mechanism 650 can be any type of component or mechanism designed to capture particles (dust particles) generated by, for example, the motion of the load port door 605, the purge kit 625, etc. In this way, the particle capture mechanism 650 can prevent particles from the substrate carrier 122 from contaminating the factory interface 106. In some embodiments, the particle capture mechanism 650 can be disposed at or around the lower lip of the open load port 600. In some embodiments, the particle capture mechanism 650 can include an exhaust system. The exhaust system can guide the particles collected from the factory interface 106 into, for example, a collection mechanism.

[0070] FIG. 7 is a front schematic view of an exemplary door mechanism 700 according to an embodiment of the present disclosure. The door mechanism 700 can position the load port door 605 at the open position 635 and the closed position 630. The door mechanism 700 can include an actuator 705 and an out trigger 710.

[0071] The actuator 705 can include one or more pneumatic devices, electromechanically driven devices, or similar mechanisms. Here, the pneumatic device can use compressed air or gas to slide the actuator 705 vertically along the rod 715. The actuator 705 can be coupled to the load port door 605. In some embodiments, the pneumatic device can slide the actuator 705 upward along the rod 715 to position the load port door 605 at the closed position 630, and slide the actuator 705 downward along the rod 715 to position the load port door 605 at the open position 635. In some embodiments, the actuator 705 can include components that can enable the load port door 605 to be rotated (moved in an arc motion) from the closed position 630 to the open position 635 and vice versa.

[0072] The pneumatic control device 620 can operate the pneumatic device by utilizing differential pressure and / or flow to push a flexible diaphragm connected to a mechanical valve and similar devices for the purpose of operating a switch, opening or closing a valve, moving a damper, etc. By way of example, the pneumatic control device 620 can use compressed air or gas to operate the pneumatic device. The pneumatic device can be coupled to the load port door 605. The pneumatic control device 620 can receive commands from the load port controller 615 and / or can be operated by the load port controller 615. For example, the load port controller 615 can issue commands to the pneumatic control device 620 to position the load port door 605 at the open position 635 and the closed position 630.

[0073] The out-trigger 710 can be any type of structure such as a shelf or bracket to assist in the movement or handling of the load port when the load port is not coupled to the factory interface. In some embodiments, the out-trigger 710 can be an optional removable component.

[0074] In other embodiments, the load port door can be attached to a pivoting mechanism. The pivoting mechanism can be attached to at least one side of the front face of the load port. When the load port is connected to a factory interface (e.g., factory interface 106), a factory interface robot (e.g., factory interface robot 126) or actuator can disengage the load port door and position the load port door from a closed position to an open position by moving the load port door horizontally and / or vertically and / or rotating the load port door about the axis of the pivoting mechanism. The axis can be a vertical axis or a horizontal axis in an embodiment. As an illustrative example, the factory interface robot or actuator can rotate the door approximately 90 degrees about the axis of the pivoting mechanism. Thus, the pivoting mechanism enables the load port to have an overall height that is the approximate height of the load port door and an overall width that is the approximate width of the load port door. In an example, the door can be translated vertically and / or horizontally in parallel to clear a path in front of the opening of the load port. This vertical and / or horizontal parallel translation can be accompanied by a rotation as described above.

[0075] FIG. 8 is a perspective view of a factory interface robot 800 according to an embodiment of the present disclosure. In some embodiments, the factory interface robot 800 may be similar to the factory interface robots 126A - B and may be disposed within a factory interface (e.g., factory interface 106). The factory interface robot 800 can include a vertical tower 810, a link 812, and an end effector 814.

[0076] The vertical tower 810 can be a structure configured to allow the link 812 to traverse in the Z direction (e.g., vertically up and down). The vertical tower 810 can include a vertical drive mechanism configured to effect a linear movement of the link 812 along the z - axis direction. For example, one or more of the links 812 can be configured to be coupled to the vertical drive mechanism. In some embodiments, the vertical drive mechanism can include a belt assembly, a chain assembly, a linear drive assembly, a sliding assembly, an actuator assembly, a piston assembly, any combination thereof, or any other assembly or mechanism capable of allowing the traversal of the link 812 only in the Z - axis direction. In some embodiments, the vertical tower 810 can be coupled to a base configured to allow a lateral movement of the factory interface robot 800. The base can include, for example, a belt assembly, a chain assembly, a linear drive assembly, a sliding assembly, an actuator assembly, a piston assembly, any combination thereof, or any other assembly or mechanism capable of allowing the lateral traversal of the factory interface robot 800 within the factory interface, such as a horizontal drive mechanism.

[0077] Link 812 can include one or more robotic links (e.g., arms) coupled to each other via joints. The proximal link of Link 812 (e.g., Link 812A as can be seen in FIGS. 9A - 9C to be described in more detail later) can be coupled to the vertical drive mechanism, while the distal link of Link 812 (e.g., Link 812C as can be seen in FIGS. 9A - 9C) can be coupled to the end effector 814. In some embodiments, the factory interface robot 800 can include two or more end effectors coupled to the distal link. In some embodiments, one or more additional links (e.g., intermediate link 812B) can connect the proximal link 812A to the distal link 812C. In some embodiments, the proximal link can be fixed (e.g., can only move vertically along the z - axis direction and cannot move along the x - axis direction or y - axis direction). This link - joint configuration can enable Link 812 to traverse the end effector 814 along the x - axis direction and y - axis direction. In some embodiments, Link 812 can be similar to a SCARA robot. This combination of the vertical drive mechanism and the link - joint configuration enables the factory interface robot 800 to operate in three dimensions. For example, the vertical drive mechanism can first lift or lower Link 812 and the end effector 814 to a desired height (e.g., the horizontal plane of the load lock, the horizontal plane of the load port, etc.), and the end effector 814 can be positioned such that Link 812 follows a desired position along the above - mentioned horizontal plane.

[0078] Figures 9A - 9C are top views of a factory interface robot 800 for removing substrates from different substrate carriers 922A - C according to an embodiment of the present disclosure. The factory interface robot 800 includes links 812A - C that connect a vertical tower 810 to an end effector 814. The vertical tower can position the links 812A - C and the end effector 814 at a predetermined height for removing substrates from the substrate carriers 922A - C. The substrate carriers 922A - C can be similar to or the same as the substrate carrier 122. Figure 9A shows the factory interface robot 800 removing a substrate 102 from the leftmost substrate carrier 922A. In particular, the proximal link 812 is fixed, while the intermediate link 812B and the distal link 812C are arranged such that the end effector 814 can remove the substrate 102 from the leftmost substrate carrier 922A. Figure 9B shows the factory interface robot 800 removing a substrate 102 from the central substrate carrier 922B. In particular, the proximal link 812 is fixed, while the intermediate link 812B and the distal link 812C are arranged such that the end effector 814 can remove the substrate 102 from the central substrate carrier 922B. Figure 9C shows the factory interface robot 800 removing a substrate 102 from the rightmost substrate carrier 922C. In particular, the proximal link 812 is fixed, while the intermediate link 812B and the distal link 812C are arranged such that the end effector 814 can remove the substrate 102 from the rightmost substrate carrier 922C. Thus, as shown, the combination of the z - direction motion enabled by the vertical tower 810 and the horizontal motion enabled by the links 812A - C allows the factory interface robot to remove substrates 102 from multiple substrate carriers in a compact environment by including a load lock within the factory interface.

[0079] FIG. 10A is a top view of a factory interface robot 800 in a passing position according to an embodiment of the present disclosure. The vertical tower can dispose links 812A-C and an end effector 814 at a predetermined height to enable the factory interface robot 800 to pass a substrate to another factory interface robot. As shown, the proximal link 812 is fixed, while the intermediate link 812B and the distal link 812C are arranged such that the end effector 814 can pass the substrate 102 from the factory interface robot 800 to another factory interface robot. Thus, as shown, the combination of the z-direction motion enabled by the vertical tower 810 and the horizontal motion enabled by the links 812A-C enables the factory interface robot to perform a pass through operation within the factory interface.

[0080] FIG. 10B is a top view of a factory interface robot 800 removing a substrate from a load lock 1020B according to an embodiment of the present disclosure. The vertical tower can dispose links 812A-C and an end effector 814 at a predetermined height to enable the factory interface robot 800 to remove one or more substrates from (or place one or more substrates in) the load lock 1020B. As shown, the proximal link 812 is fixed, while the intermediate link 812B and the distal link 812C are arranged such that the end effector 814 can remove one or more substrates from (or place one or more substrates in) the load lock 1020B. Thus, as shown, the combination of the z-direction motion enabled by the vertical tower 810 and the horizontal motion enabled by the links 812A-C enables the factory interface robot 800 to remove a substrate from or position a substrate in a load lock within the factory interface.

[0081] Figure 11 is a method for transporting a substrate from a substrate carrier to a factory interface according to an embodiment of the present disclosure. At block 1110, a load port receives a substrate carrier. In an example, the substrate carrier is a FOUP. In some embodiments, the load port includes a frame adapted to connect the load port to a factory interface. The frame includes a transport opening through which one or more substrates can be transported between the substrate carrier and the factory interface. The load port further includes an actuator coupled to the frame and a load port door coupled to the actuator. The load port door can be configured to seal the transport opening. The actuator can position the load port door from a closed position to an open position and from the open position to the closed position.

[0082] At block 1120, the load port door is positioned from a closed position to an open position via a door mechanism operated, for example, by a load port controller. At block 1130, a factory interface robot disposed within the factory interface removes a substrate from the substrate carrier. In some embodiments, prior to positioning the load port door from the closed position to the open position, the load port controller can engage a purge kit to clean the substrate carrier using an inert gas. In some embodiments, the factory interface robot can engage a vertical drive mechanism to position an end effector in a horizontal plane associated with the load port.

[0083] FIG. 12 is a method for transporting a substrate from a first factory interface robot to a second factory interface robot according to an embodiment of the present disclosure. At block 1210, a first factory robot removes a substrate from a substrate carrier. In an example, the substrate carrier is a FOUP. At block 1220, the first factory interface robot transfers the substrate to a second factory robot. In one example, the first factory robot and the second factory robot are disposed within a factory interface. In another example, the first factory robot is disposed within a first factory interface and the second factory robot is disposed within a second factory interface. The first factory robot and / or the second factory robot may be engaged with respective vertical drive mechanisms to adjust the height of the end effector to a predetermined position associated with removing, transporting, or transferring the substrate. The first factory interface robot may be configured to transfer the substrate to the second factory interface robot using a passage area. In a first example, the passage area may be disposed between the front surface of the factory interface and the forward side surface of the load lock. In a second example, the passage area may be a via or open space disposed above one or more load locks within the internal space of the factory interface. In a third example, the passage area may be an open space or via disposed between a pair of upper inner chambers and a pair of lower inner chambers of the load lock (e.g., when the load locks are stacked load locks). In a fourth example, the passage area may be an open space or via disposed below one or more load locks. The first factory interface robot may be configured to transfer the substrate to the second factory interface robot through the passage area.

[0084] In block 1230, the second factory interface robot places the substrate inside the load lock disposed within the factory interface. The load lock cannot be accessed by the first factory interface robot. In one example, the second factory robot can take out the substrate from inside the load lock disposed within the factory interface. In that case, the second factory robot can transfer the substrate to the first factory robot. The second factory interface robot can be configured to transfer the substrate to the first factory interface robot using the passage area. The first factory robot can, in that case, place the substrate within the substrate carrier.

[0085] The foregoing description sets forth numerous specific details, such as examples of particular systems, components, methods, etc., to provide a thorough understanding of some embodiments of the present disclosure. However, it will be apparent to those skilled in the art that at least some embodiments of the present disclosure may be practiced without these specific details. In other instances, well-known components or methods have not been described in detail or are presented in a simple block diagram format to avoid unnecessarily obscuring the present disclosure. Accordingly, the specific details described are merely examples. Specific implementations may differ from these exemplary details but are still intended to be within the scope of the present disclosure.

[0086] References throughout this specification to "one embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Further, the term "or" is intended to mean an inclusive "or" rather than an exclusive "or". When the term "about" or "substantially" is used in this specification, it means that the recited nominal value is accurate within ±10%.

[0087] The processing of the methods in this specification has been illustrated and described in a specific order, but the order of processing of each method can be changed so that some processing can be performed at least partially concurrently with other processing, and some processing can be performed in the reverse order. In another embodiment, the instructions or sub-processes of separate processes can be in an intermittent manner and / or an alternating manner.

[0088] It should be understood that the above description is illustrative and not restrictive. Many other embodiments will become apparent to those of ordinary skill in the art upon reading and understanding the above description. The scope of the present disclosure should, therefore, be determined with reference to the appended claims, along with the full scope of equivalents to which rights are granted.

Claims

1. A factory interface for an electronic device manufacturing system, wherein the factory interface includes: a first load lock disposed within an internal space of the factory interface; a first factory interface robot disposed within the internal space of the factory interface, the first factory interface robot being configured to transfer substrates between a first set of substrate carriers and the first load lock, and comprising a vertical tower, a plurality of links, and an end effector, the vertical tower comprising a vertical drive mechanism configured to realize linear movement of the plurality of links in the z-axis direction, a proximal link of the plurality of links being coupled to the vertical drive mechanism and to the first factory interface robot; a second load lock disposed within the internal space of the factory interface; a second factory interface robot configured to transfer substrates between a second set of substrate carriers and the second load lock; a first set of load ports for receiving the first set of substrate carriers, the first set of load ports being arranged to be accessible by the first factory interface robot; a second set of load ports for receiving the second set of substrate carriers, the second set of load ports being arranged to be accessible by the second factory interface robot; and a factory interface comprising the above components.

2. The factory interface according to claim 1, wherein a distal link of the plurality of links is coupled to the end effector.

3. The factory interface according to claim 1, wherein the first load lock is closer to the first factory interface robot than the second load lock, and the second load lock is closer to the second factory interface robot than the first load lock.

4. Each load port of the first set of load ports and the second set of load ports A transport opening through which one or more substrates can be transported between the substrate carrier and the factory interface. An actuator coupled to the frame. A load port door coupled to the actuator and configured to seal the transport opening. Comprising: The load port door has a first height. The frame has a second height. The factory interface according to claim 1, wherein the second height is at least twice and less than 2.5 times the first height.

5. At least one of a substrate storage container, a measuring instrument, a server, or an air conditioning unit disposed below one of the first set of load ports. The factory interface according to claim 1, further comprising.

6. A via disposed within the internal space of the factory interface above or below the first load lock, wherein the first factory interface robot is configured to transfer a substrate through the via to a second factory interface robot. The factory interface according to claim 1, further comprising.

7. The factory interface is An internal space defined by a bottom, a top, and a plurality of side surfaces, the plurality of side surfaces including a rear surface, a front surface, a right side surface, and a left side surface configured to face a transfer chamber of the electronic device manufacturing system, the first factory interface robot being disposed within the internal space adjacent to the left side surface, the second factory interface robot being disposed within the internal space adjacent to the right side surface, the first load lock being closer to the first factory interface robot than the second load lock, and the second load lock being closer to the second factory interface robot than the first load lock, the first load lock and the second load lock being disposed between the first factory interface robot and the second factory interface robot adjacent to the rear surface. The factory interface according to claim 1, further comprising. Claim 8. The first factory interface robot, The vertical tower configured to enable the plurality of links to cross in the z-axis direction, The plurality of links coupled to the vertical tower and configured to move the end effector along the x-axis and y-axis directions, The end effector coupled to the plurality of links and configured to process a substrate, Comprising: The first factory interface robot and the first load lock are disposed within the internal space of the factory interface, The factory interface according to claim 1.

9. The first factory interface robot is configured to transfer a substrate between a substrate carrier and the first load lock. The factory interface according to claim 8.

10. The factory interface includes a load port for receiving the substrate carrier, and the load port is arranged to be accessible by the first factory interface robot. The factory interface according to claim 9.

11. The proximal link is in a fixed lateral position. The factory interface according to claim 8.

12. The distal link of the plurality of links is coupled to the end effector. The factory interface according to claim 8.

13. A method for transferring a substrate from a first factory interface robot to a second factory interface robot, Removing the substrate from the substrate carrier by the end effector of the first factory interface robot, Adjusting the vertical position of the end effector by the vertical drive mechanism of the first factory interface robot. The vertical drive mechanism is configured to realize linear movement in the z-axis direction of the plurality of links. The proximal link of the plurality of links is coupled to the vertical drive mechanism. Adjusting the vertical position of the end effector, Transferring the substrate from the first factory interface robot to the second factory interface robot, wherein the first factory interface robot and the second factory interface robot are disposed within a factory interface, and transferring the substrate; Placing the substrate inside a load lock disposed within the factory interface via the second factory interface robot; Including that the first factory interface robot cannot access the load lock; Method.

14. The method according to claim 13, wherein the substrate is transferred through a via disposed above or below the load lock within an internal space of the factory interface.

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