Imprinting apparatus, imprinting method, method for manufacturing an article, and program

Abstract

To provide an imprint device which prevents damage of a mold while preventing decrease in a yield and minimizing decrease in throughput.SOLUTION: An imprint device that brings an imprint material on a substrate into contact with a mold, and forms a pattern on the imprint material on the substrate includes an imprint part for forming the pattern, and a control part for controlling operation of the imprint part, wherein the control part performs control so as to form the pattern in all the shot regions where no foreign matter exists in the plurality of substrates by a first mold on the basis of foreign matter information on the substrate, and then form the pattern in all the shot regions where the foreign matter exists in the plurality of substrates by a second mold different from the first mold.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to an imprint apparatus, an imprint method, a method for manufacturing an article, and a program.

Background Art

[0002] Articles having a fine structure such as semiconductor devices and MEMS can be manufactured using a shaping apparatus such as a projection exposure apparatus or an imprint apparatus. In such a shaping apparatus, if foreign matter is present on the substrate, it causes defects in the manufactured article. Further, in an imprint apparatus, since an imprint material (ultraviolet curable resin) on the substrate is brought into contact with a mold and the imprint material is shaped, foreign matter present on the substrate may damage the mold or shorten the life of the mold.

[0003] Therefore, a substrate inspection apparatus for inspecting foreign matter on the substrate is used. For example, the substrate inspection apparatus disclosed in Patent Document 1 irradiates inspection light (laser light) obliquely onto the substrate and detects foreign matter by receiving scattered light from the foreign matter with a light receiving unit.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in a conventional imprint apparatus, when imprinting a shot region where foreign matter is present, since a dedicated mold is exchanged, the overlay error within the same substrate lot becomes large, and there is a problem that the yield decreases in exchange for preventing damage to the mold. Further, if a plurality of foreign matters are present within the same lot, the number of mold exchanges increases according to the number of shot regions where foreign matter is present, and there is also a problem that the throughput decreases. Therefore, an object of the present invention is to provide an imprint apparatus that prevents a decrease in yield, minimizes a decrease in throughput, and prevents damage to a mold.

Means for Solving the Problems

[0006] In order to achieve the object, an imprint apparatus of the present invention is an imprint apparatus that brings an imprint material on a substrate into contact with a mold to form a pattern on the imprint material, Selectively hold a first mold having a pattern and a second mold having a pattern different from that of the first mold including an imprint unit and a control unit that controls the operation of the imprint unit, A substrate storage unit for storing a plurality of substrates wherein the control unit, based on foreign matter information on the substrate, 、 performs the formation of the pattern using a first mold on a shot area where no foreign matter exists, The and controls to perform, using a second mold, The step of moving to the substrate storage unit is continuously performed for a plurality of substrates, and the substrate is stored in the substrate storage unit on a shot area where the foreign matter exists among a plurality of substrates. The The second mold The step of stamping with is continuously performed for a plurality of substrates It is characterized by being controlled as follows.

Advantages of the Invention

[0007] According to the present invention, it is possible to provide an imprint apparatus that prevents a decrease in yield, minimizes a decrease in throughput, and prevents damage to a mold.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Modes for Carrying Out the Invention

[0009] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Note that the drawings shown below are drawn at scales different from the actual ones in order to facilitate understanding of this embodiment.

[0010] <First Embodiment> FIG. 1 is a diagram of an imprint apparatus according to the first embodiment. Hereinafter, the configuration of the imprint apparatus will be described according to an XYZ orthogonal coordinate system in which a plane parallel to the surface of the substrate is an XY plane. Typically, the XY plane is a horizontal plane, and the Z axis is a vertical direction.

[0011] The imprint apparatus 1 of this embodiment includes an imprint head (imprint unit) 4, a substrate stage 5, a nozzle 6, a substrate inspection unit 7, a substrate storage unit 8, a storage unit 9, and a control unit 10. The substrate stage 5 is a stage that holds the substrate 3 and moves in the horizontal direction. The nozzle 6 discharges an imprint material onto the substrate 3.

[0012] The imprint head 4 holds the mold 2 and performs vertical driving for controlling the posture of the mold 2 and bringing the uneven pattern of the mold 2 into contact with the imprint material to perform imprinting. Thereby, the imprint material (resin) on the substrate 3 is brought into contact with the mold 2 having a pattern formed thereon, and pattern formation is performed on the imprint material on the substrate 3.

[0013] The substrate inspection unit 7 detects foreign matter 11 on the substrate 3 and stores the position information of the detected foreign matter 11 in the storage unit 9.

[0014] Generally, in the substrate inspection unit 7, in order to enable detection of fine foreign matters on the order of several tens of nanometers, a very sensitive light receiver, such as a photomultiplier tube, is used. In a photomultiplier tube, electrons generated at a photocathode by the incidence of light collide with a plurality of stages of dynodes that generate secondary electrons after being accelerated by a high voltage. The current accumulated until passing through the dynode of the final stage is collected at an anode as an amplified signal. Generally in this way, a substrate inspection apparatus that performs foreign matter inspection on a substrate irradiates the substrate with laser light at an oblique incidence and detects the presence or absence of foreign matter by receiving scattered light generated from the foreign matter with a light receiving unit.

[0015] Here, regarding the detection of foreign matters, although the state where minute objects such as particles are present on the surface of the substrate 3 is described as the state where foreign matters are detected, the present invention is not limited thereto. For example, since the substrate inspection unit 7 analyzes the intensity distribution of scattered light from the surface of the substrate 3 to determine an abnormality on the surface of the substrate 3, various states of the surface of the substrate 3 (foreign matters, scratches on the substrate surface, chips, etc.) can be recognized as an abnormality on the surface of the substrate 3, and these are collectively described comprehensively as foreign matter information. The substrate storage unit 8 can store the substrate 3 inside.

[0016] The substrate 3 is carried into the imprint apparatus 1 by a substrate transfer mechanism (not shown) and mounted on the substrate stage 5. The substrate transfer mechanism can also transfer the substrate 3 to the substrate storage unit 8, and the substrate 3 for which the imprint process has been completed is carried out of the imprint apparatus 1.

[0017] The mold 2 is transferred by a mold transfer mechanism (not shown) and held by the imprint head 4. As the imprint material, a curable composition (sometimes also referred to as an uncured resin) that cures when energy for curing is applied is used. As the energy for curing, electromagnetic waves, heat, etc. are used. As the electromagnetic waves, for example, light such as infrared rays, visible light, and ultraviolet rays whose wavelength is selected from the range of 10 nm or more and 1 mm or less is used. The curable composition is a composition that cures by irradiation with light or by heating. The photocurable composition that cures by irradiation with light contains at least a polymerizable compound and a photopolymerization initiator, and may contain a non-polymerizable compound or a solvent as necessary. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal release agent, a surfactant, an antioxidant, a polymer component, and the like. The imprint material may be applied in a film form on a substrate by a spin coater or a slit coater. Further, the imprint material may be applied on the substrate in a droplet form or in an island or film form formed by connecting a plurality of droplets by a liquid injection head. The viscosity of the imprint material (viscosity at 25°C) is, for example, 1 mPa·s or more and 100 mPa·s or less.

Examples

[0018] Hereinafter, with reference to FIGS. 1 and 2, the operation of the imprint apparatus 1 of Example 1 will be exemplarily described. FIG. 2 is a flowchart showing an imprint method for a substrate lot (a plurality of substrates) of Example 1. The substrate processing operation of the imprint apparatus 1 is controlled by the control unit 10. The imprint apparatus 1 starts sequence control of substrate processing from step S201.

[0019] When the substrate processing is started, in step S202, the substrate 3 is mounted on the substrate stage 5 by the substrate transfer mechanism. The substrate 3 may be positioned so as to have a desired rotation angle and center position with respect to the substrate stage 5 by a position detection device or a positioning device (not shown) before and after being mounted on the substrate stage 5. This positioning can be performed by measuring the outer shape of the substrate 3 and the positioning marks provided on the outer peripheral portion.

[0020] After that, when the substrate 3 mounted on the substrate stage 5 passes through the inspection area of the substrate inspection unit 7, the presence or absence of foreign matter 11 existing on the surface of the substrate 3 is inspected by the substrate inspection unit 7. As information regarding the detected foreign matter 11, at least the information regarding the position among the information regarding the position, size, shape, and material of the foreign matter 11 on the substrate 3 is stored in the storage unit 9 (memory) or the control unit 10 (or internal computer) within the imprint apparatus 1. Note that the storage unit 9 functions as a storage means. Further, after storing the information regarding the detected foreign matter 11, the acquired information is notified to the control unit 10 and the like. It may be possible to display the foreign matter information on the operation screen of the computer device so that the user can confirm it through the screen.

[0021] Next, in step S203, based on the substrate inspection result of step S202, if no foreign matter 11 is detected on the surface of the substrate 3, the process proceeds to step S204. On the other hand, if foreign matter 11 is detected, the process proceeds to step S205.

[0022] In step S204, all shot areas on the substrate 3 are imprinted with the first mold 2. That is, an imprint material is supplied to the shot areas on the substrate 3 by the nozzle 6, and the concavo-convex pattern of the first mold 2 is brought into contact with the imprint material on the substrate 3. Then, in that state, the imprint material is irradiated with ultraviolet rays or the like to be photocured to form a pattern. The substrate 3 on which the imprinting of all shot areas is completed is carried out of the imprint apparatus 1 by the substrate transfer mechanism.

[0023] In step S205, the shot areas where foreign matter 11 is detected are not imprinted with the first mold 2, and only the other shot areas where no foreign matter 11 is detected are imprinted with the first mold 2. Subsequently, in step S206, the substrate 3 on which the imprinting other than the shot areas where foreign matter 11 is detected is completed is transported to the substrate storage unit 8 by the substrate transfer mechanism. The substrate storage unit 8 is configured to hold the substrate 3 inside and can store the substrate 3.

[0024] Next, in step S207, it is determined whether all the substrates 3 in the same lot have been processed. If no unprocessed substrate 3 remains, the process proceeds to step S208. If unprocessed substrate 3 remains, the process returns to step S202, and the processes of S202 to S207 are repeated for the next substrate 3.

[0025] In step S208, it is determined whether the substrate 3 is stored in the substrate storage unit 8. If no substrate 3 is stored, the process proceeds to step S213, and the processing for the substrate lot is terminated. On the other hand, if the substrate 3 is stored in the substrate storage unit 8, the process proceeds to step S209. Here, in order to enable the substrate storage unit 8 to store all the substrates 3 on which the foreign matter 11 has been detected, the substrate storage unit 8 is configured to be able to store the same number of substrates 3 as the substrate lot, and preferably, it can store all the substrates 3 of the same lot at most.

[0026] In step S209, the first mold 2 is recovered from the imprint head 4 by a mold transfer mechanism (not shown), and instead, the second mold 2 is transferred and held by the imprint head 4. The second mold 2 is used exclusively for imprinting the shot regions where the foreign matter 11 exists, and is used to avoid the risk of damage to the first mold 2 and the substrate 3 due to contact with the foreign matter 11. Therefore, the second mold 2 does not necessarily have an uneven pattern, as long as imprinting can be performed.

[0027] Subsequently, in step S210, the substrate 3 stored in the substrate storage unit 8 is mounted on the substrate stage 5, and all the shot regions where the unimprinted foreign matter 11 exists are imprinted with the second mold 2. As a result, the imprinting of all the shot regions on the substrate 3 is completed, and the substrate 3 is carried out of the imprint apparatus 1 by the substrate transfer mechanism.

[0028] Next, in step S211, it is determined whether the substrate 3 is stored in the substrate storage unit 8. If the substrate 3 is stored, the process returns to step S210, and the processes of S210 to S211 are repeated for the next stored substrate 3. If the substrate 3 is not stored in the substrate storage unit 8, the process proceeds to step S212. In step S212, the second mold 2 is retrieved by the mold transfer mechanism, and the first mold 2 is held by the imprint head 4. Then, the process proceeds to step S213, and the process for the substrate lot is terminated.

[0029] The components related to substrate processing such as the imprint head 4, substrate stage 5, nozzle 6, and substrate inspection unit 7 of the imprint apparatus 1 in the present embodiment are connected to the control unit 10 shown in FIG. 1 by a wired or wireless communication line. And the control unit 10 controls these operations. The control unit 10 incorporates a CPU that reads a program from a storage unit 9 storing a computer program for controlling various operations and executes the computer program. The control unit 10 may be provided inside the imprint apparatus 1, or may be installed at a location separate from the imprint apparatus 1 to remotely control the imprint apparatus 1.

[0030] With the configuration of the imprint apparatus 1 and the sequence of the process for the substrate lot described above, it is possible to prevent the mold 2 from being damaged by contacting the foreign matter 11 during imprinting.

[0031] Also, in the present embodiment, there is an effect of preventing a decrease in the yield within the same substrate lot while preventing damage to the mold 2. This is because the shot area where there is no foreign matter 11 within the same lot can be imprinted with the mold 2 maintaining the same holding state.

[0032] When the holding of the mold 2 is released, the position and orientation of the mold 2 change, resulting in a change in the transfer accuracy of the concavo-convex pattern and an increase in the overlay error. In the present embodiment, since the mold 2 is replaced after all the imprints in the shot regions where there are no foreign objects 11 within the same lot are completed, the overlay error is not affected by the replacement of the mold 2, except for the shot regions where the foreign objects 11 are present. Although it is necessary to imprint the shot regions where the foreign objects 11 are present in the subsequent processing, the same level of overlay accuracy as that of the shot regions where there are no foreign objects 11 is not required.

[0033] Furthermore, in the present embodiment, even if there are a plurality of substrates 3 including shot regions where foreign objects 11 are present within the same lot, the number of times the mold 2 needs to be replaced is at most 2 times. Therefore, it is possible to obtain the effect of minimizing the reduction in throughput due to the replacement of the mold 2 while preventing damage to the mold 2.

Example

[0034] Hereinafter, with reference to FIGS. 1 and 3, the operation of the imprint apparatus 1 of Example 2 will be exemplarily described. FIG. 3 is a flowchart showing an imprint method for a substrate lot of Example 2.

[0035] In this example, the inspection of the substrate 3 by the substrate inspection unit 7 is performed for each shot region. That is, only the shot regions to be processed on the substrate 3 are inspected, and then the imprint of the corresponding shot region is performed immediately. This process is repeated for all the shot regions within the substrate 3.

[0036] The imprint apparatus 1 starts the sequence control of the substrate processing from step S301. When the substrate processing is started, in step S302, the substrate 3 is mounted on the substrate stage 5 by the substrate transfer mechanism. When the substrate 3 passes through the inspection region of the substrate inspection unit 7, the presence or absence of foreign objects 11 on the surface of the shot region to be imprinted is inspected by the substrate inspection unit 7.

[0037] Next, in step S303, based on the inspection result of the shot area in step S302, if no foreign matter 11 is detected on the surface of the shot area, the process proceeds to step S304. On the other hand, if foreign matter 11 is detected, the process proceeds to step S305. In step S304, the shot area where no foreign matter 11 is detected is imprinted with the first mold 2. On the other hand, in step S305, the shot area where foreign matter 11 is detected is not imprinted.

[0038] Subsequently, in step S306, it is determined whether a series of processes of substrate inspection and imprinting have been performed on all the shot areas in the substrate 3. If there is no unprocessed shot area, the process proceeds to step S307. If there is an unprocessed shot area, the process returns to step S302, and the processes of S302 to S306 are repeated for the next shot area.

[0039] In step S307, it is determined whether imprinting has been performed on all the shot areas in the substrate 3. If there is no unimprinted shot area, the process proceeds to step S309. On the other hand, if there is an unimprinted shot area, the process proceeds to step S308. In step S308, the substrate 3 with an unimprinted shot area is transported to and stored in the substrate storage unit 8.

[0040] The subsequent steps S309 to S315 have the same flow as steps S207 to S213 in FIG. 2.

[0041] <Second Embodiment> Next, the second embodiment will be described with reference to FIG. 4. FIG. 4 shows the configuration of a substrate processing apparatus 4000 according to the second embodiment. The substrate processing apparatus 4000 includes an imprint apparatus 400 and a substrate inspection apparatus 401. In the second embodiment, the substrate inspection apparatus 401 is configured as an external apparatus of the imprint apparatus 400, and the foreign matter inspection information is sent from the substrate inspection apparatus 401 to the imprint apparatus 400 by communication between the apparatuses.

[0042] The imprint apparatus 400 includes an imprint head 4, a substrate stage 5, and a nozzle 6. The substrate inspection apparatus 401 can be connected to the imprint apparatus 400.

[0043] The substrate inspection apparatus 401 includes a substrate stage 402, a substrate transfer mechanism 403, a station 404, a substrate inspection unit 7, and a substrate storage unit 8. An auxiliary device 405 such as a coater / developer can be connected to the substrate inspection apparatus 401.

[0044] The auxiliary device 405 is a device for disposing a composition on the substrate 3, and supplies the substrate 3 on which the composition is disposed to the station 404 in the substrate inspection apparatus 401. Subsequently, in the substrate inspection apparatus 401, the substrate 3 supplied to the station 404 is transferred to the substrate stage 402 by the substrate transfer mechanism 403. When the substrate 3 mounted on the substrate stage 402 passes through the inspection region of the substrate inspection unit 7, the presence or absence of foreign matter 11 existing on the surface is inspected by the substrate inspection unit 7.

[0045] The substrate 3 for which the inspection has been completed is mounted on the substrate stage 5 of the imprint apparatus 400 by the substrate transfer mechanism 403. The substrate storage unit 8 stores the substrate 3 for which imprinting has been completed except for the shot region where the foreign matter 11 exists. Here, the substrate storage unit 8 may be configured inside the imprint apparatus 400, or may be configured in both the substrate inspection apparatus 401 and the imprint apparatus 400.

[0046] FIG. 4 shows a substrate processing apparatus 4000 in which one imprint apparatus 400 is connected to one substrate inspection apparatus 401, but a so-called cluster type substrate processing apparatus 4000 in which a plurality of imprint apparatuses 400 are connected may also be used. In this case, the result of the substrate inspection performed by the substrate inspection apparatus 401 is transmitted to the imprint apparatus 400 to which the substrate 3 is transferred. Each imprint apparatus 400 can perform substrate processing by using information such as the position and size of the foreign matter 11 attached to the substrate 3 by acquiring the inspection result obtained by the substrate inspection apparatus 401.

[0047] When processing substrates 3 of different lots for each of the connected imprint apparatuses 400, the number of substrates 3 that can be stored in the substrate storage unit 8 is determined according to the number of substrate lots to be processed simultaneously within the substrate processing apparatus 4000. Specifically, it is preferable that the same number as the substrates 3 in all the substrate lots to be processed simultaneously can be stored. Alternatively, the substrate storage unit 8 may be provided that can store all the substrates 3 of the same lot for each imprint apparatus 400.

[0048] The flowchart showing the imprint method for the substrate lot of the present embodiment is the same as that of the first embodiment and is shown in FIGS. 2 and 3.

[0049] The difference from the first embodiment is that the substrate inspection unit 7 and the substrate storage unit 8 are configured within the substrate inspection apparatus 401. Therefore, when the substrate 3 moves between the substrate inspection apparatus 401 and the imprint apparatus 400 in the flowchart of FIG. 2, it is realized by the substrate transfer mechanism 403. Also, since the substrate stage 402 is used for substrate inspection and the substrate stage 5 is used for imprinting, both processes can be carried out in parallel. With this configuration, the time required for substrate inspection is shortened, and the throughput of the substrate processing apparatus 4000 is improved.

[0050] Also in the present embodiment, similar to the first embodiment, there is an effect of preventing damage to the mold 2, preventing a decrease in the yield within the same substrate lot, and further minimizing a decrease in the throughput of the substrate processing apparatus 4000.

[0051] <Embodiment of the manufacturing method of an article> The manufacturing method of a device (such as a semiconductor integrated circuit element, a liquid crystal display element, etc.) as an article includes a step of forming a pattern on a substrate (wafer, glass plate, film-like substrate) using the above-described imprint apparatus.

[0052] Furthermore, the manufacturing method may include a step of etching the substrate on which the pattern is formed. In the case of manufacturing other articles such as a patterned medium (recording medium) or an optical element, the manufacturing method may include other processes for processing a substrate on which a pattern is formed instead of etching.

[0053] The method for manufacturing an article according to the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

[0054] (Examples of article manufacturing methods) The pattern of the cured product formed using the imprint apparatus is permanently used for at least a part of various articles or temporarily used when manufacturing various articles. Articles include electric circuit elements, optical elements, MEMS, recording elements, sensors, or molds, etc. Examples of electric circuit elements include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensors, and FPGA. Examples of optical elements include microlenses, light guides, waveguides, antireflection films, diffraction gratings, polarization elements, color filters, light-emitting elements, displays, solar cells, etc. Examples of MEMS include DMD, microfluidic channels, electromechanical conversion elements, etc. Examples of recording elements include optical discs such as CD and DVD, magnetic discs, magneto-optical discs, magnetic heads, etc. Examples of sensors include magnetic sensors, optical sensors, gyro sensors, etc. Examples of molds include molds for imprinting, etc.

[0055] The pattern of the cured product is used as it is as a constituent member of at least a part of the above articles or temporarily used as a resist mask. After etching or ion implantation, etc. are performed in the substrate processing step, the resist mask is removed.

[0056] ​Next, a method for manufacturing the article of the present invention will be described. As shown in FIG. 5(a), a substrate 1z such as quartz glass is prepared, and subsequently, an imprint material 3z is applied to the surface of the substrate 1z having the material to be processed 2z by an inkjet method or the like. If necessary, a layer of another material such as a metal or a metal compound may be provided on the surface of the substrate 1z.

[0057] As shown in FIG. 5(b), an imprint mold 4z is opposed to the substrate 1z with the side on which the concavo-convex pattern is formed facing the imprint material 3z on the substrate 1z. As shown in FIG. 5(c), the substrate 1z to which the imprint material 3z is applied and the mold 4z are brought into contact with each other and pressure is applied. The imprint material 3z is filled in the gap between the mold 4z and the substrate 1z. When light is irradiated through the mold 4z in this state, the imprint material 3z is cured.

[0058] As shown in FIG. 5(d), after the imprint material 3z is cured, when the mold 4z and the substrate 1z are separated from each other, a pattern of the cured product of the imprint material 3z is formed on the substrate 1z. Thus, an article having the pattern of the cured product as a constituent member is obtained. In addition, if the substrate 1z is etched as shown in FIGS. 5(e) and 5(f) with the pattern of the cured product as a mask in the state of FIG. 5(d), an article in which the concave and convex portions are inverted with respect to the mold 4z, for example, an imprint mold can also be obtained.

[0059] <Other Embodiments> The present invention can also be realized by supplying a program that realizes one or more functions of the above-described embodiments to a system or an apparatus via a network or a storage medium, and causing one or more processors in a computer of the system or the apparatus to read and execute the program. It can also be realized by a circuit (for example, ASIC) that realizes one or more functions.

[0060] As described above, the preferred embodiments of the present invention have been described. However, the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist thereof.

Description of Reference Numerals

[0061] 1 Imprinting device 4 Imprinting head (Imprinting section) 10 Control section

Claims

1. An imprint apparatus that forms a pattern on an imprint material by bringing the imprint material on a substrate into contact with a mold, comprising: an imprint unit that selectively holds a first mold having a pattern and a second mold having a pattern different from that of the first mold; a control unit that controls the operation of the imprint unit; a substrate storage unit that stores a plurality of substrates and wherein the control unit performs, continuously over a plurality of substrates, a step of forming the pattern using the first mold on a shot area where no foreign matter is present based on foreign matter information on the substrate, and moving the substrate to the substrate storage unit, and controls to continuously perform, over a plurality of substrates, a step of pressing with the second mold on a shot area where the foreign matter is present among the plurality of substrates stored in the substrate storage unit. An imprint apparatus characterized by the above.

2. The imprint apparatus according to claim 1, further comprising an inspection unit that inspects for foreign matter on the substrate, wherein the foreign matter information is acquired by the inspection unit.

3. The imprint apparatus according to claim 1, wherein the foreign matter information is information obtained from an external device.

4. The control unit continuously forms the pattern using the first mold on all shot areas where no foreign matter is present among the plurality of substrates, stores the substrate including the shot area where the foreign matter is present in the substrate storage unit, and after forming the pattern with the first mold, controls to continuously form the pattern using the second mold on all the shot areas where the foreign matter is present among the plurality of substrates. An imprint apparatus according to any one of claims 1 to 3, characterized by the above.

5. The imprint apparatus according to any one of claims 1 to 4, wherein the substrate storage unit can store the same number of substrates as the plurality of substrates.

6. The imprint apparatus according to any one of claims 1 to 5, wherein the foreign matter information includes information regarding the position of the foreign matter on the substrate.

7. The imprint apparatus according to claim 6, wherein the foreign matter information includes at least any one of information regarding the size, shape, and material of the foreign matter.

8. The imprinting apparatus according to any one of claims 1 to 7, characterized in that the plurality of substrates are a plurality of substrates included in the same lot.

9. The imprinting apparatus according to any one of claims 1 to 8, characterized in that it includes a storage unit for storing the foreign matter information.

10. The imprinting apparatus according to any one of claims 1 to 9, characterized in that the second mold does not have a concavo-convex pattern.

11. An imprinting method of bringing an imprinting material on a substrate into contact with a mold to form a pattern on the imprinting material on the substrate, An imprinting step of performing an imprinting operation using the imprinting apparatus according to any one of claims 1 to 8 An imprinting method characterized by including.

12. The presence or absence of the foreign matter is determined based on the foreign matter information, The imprinting method according to claim 11, characterized in that the foreign matter information includes information regarding the position of the foreign matter on the substrate.

13. The presence or absence of the foreign matter is determined based on the foreign matter information, The imprinting method according to claim 11 or 12, characterized in that the foreign matter information includes at least any one of information regarding the size, shape, and material of the foreign matter.

14. A program for causing a computer to execute the imprinting method according to any one of claims 11 to 13.

15. A forming step of forming a pattern on an imprinting material on a substrate using the imprinting apparatus according to any one of claims 1 to 10, A step of processing the substrate on which the pattern is formed in the forming step, A method for manufacturing an article, characterized by including.

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