Prevention of liquid intrusion into the device

Abstract

In one embodiment, a method 100 of manufacturing is described. The method includes step 102 of providing a first layer defining a first inner surface 203 a and a first outer surface 203 b, a second layer defining a second inner surface 205 a and a second outer surface 205 b, and an electrical component 206 positioned on either the first inner surface or the second inner surface. The method includes step 104 of attaching the first and second layers together to create a device 200 including the first and second layers, the first and second outer surfaces defining an outer surface of the device. The device further includes a seal portion 208 defined by a liquid-tight attachment between the first and second inner surfaces. During use of the device, the seal portion prevents liquid from entering the device between the first and second layers toward the electrical component.

Description

Technical Field

[0001] The present invention relates to a device that prevents liquid from entering the device when the device comes into contact with a liquid, for example, and a method of manufacturing such a device.

Background Art

[0002] Certain electronic devices are constructed in a number of manufacturing steps. For example, in a complex supply chain, the various components used to construct such an electronic device are manufactured by different processes at different locations. At the final stage of manufacturing, the various components are integrated together to form the final device. Since the various components are manufactured at different locations and / or using different processes, the final device may not meet specific specifications regarding device characteristics such as dimensions, flexibility, robustness, and liquid tightness while ensuring the quality and / or cost-effectiveness of the final device.

[0003] Printed electronics offers certain possibilities regarding the integration, miniaturization, and / or quality of final devices such as devices incorporating a flexible printed circuit board assembly (PCBA). However, when other components such as certain optoelectronic components, light rings, sensors, and actuator mechanisms are combined with such a PCBA, the manufacturing process may not meet specifications regarding certain characteristics such as dimensions, flexibility, robustness, and liquid tightness, or may result in a somewhat limited final device. For example, the final device may be bulky, difficult to form into a specific shape, lack the robustness required for certain applications such as consumer devices, and / or have insufficient liquid tightness to meet specific specifications.

Summary of the Invention

Problems to be Solved by the Invention

[0004] Aspects or embodiments described herein relate to improving the manufacture of devices such as electronic devices. The aspects or embodiments described herein address one or more problems associated with the manufacture of a device to meet certain specifications. **Means for Solving the Problems**

[0005] According to a first aspect, a method is described. The method includes providing a first layer that defines a first inner surface and a first outer surface. The method further includes providing a second layer that defines a second inner surface and a second outer surface. The method further includes providing an electrical component positioned on the first inner surface or the second inner surface. The method further includes attaching the first layer and the second layer together to create a device that includes the first layer and the second layer. The first outer surface and the second outer surface define an outer surface of the device. The device further includes a seal portion defined by a liquid-tight attachment between the first inner surface and the second inner surface. During use of the device, the seal portion prevents liquid from entering the device between the first layer and the second layer towards the electrical component.

[0006] According to a second aspect, a method is described. The method includes providing a first layer, a second layer, and an electrical component between the first layer and the second layer. The method further includes attaching the first layer and the second layer together to create a device that includes a seal portion for preventing liquid from entering between the first layer and the second layer towards the electrical component.

[0007] Some embodiments related to the first aspect or the second aspect are described below.

[0008] In some embodiments, the method includes providing an electrical connection on one of the first layer and the second layer before attaching the first layer and the second layer together. The electrical connection is configured to enable electrical communication with the electrical component through the seal portion.

[0009] In some embodiments, the first layer and the second layer are configured such that at least a part of the electrical connection portion is exposed to enable electrical communication with an electrical component through the seal portion.

[0010] In some embodiments, the electrical connection portion extends along the first inner surface or the second inner surface and is exposed at one edge of the first layer and the second layer to enable electrical communication with an electrical component.

[0011] In some embodiments, the method includes positioning an electrical component on one of the first layer and the second layer before attaching the first layer and the second layer together.

[0012] In some embodiments, the electrical component includes an optoelectronic component for generating and / or detecting an optical signal. The method further includes providing an optical element for manipulating the optical signal. The optical element is provided between the first layer and the second layer before attaching the first layer and the second layer together. The seal portion is configured to prevent liquid from entering between the first layer and the second layer towards the optical element.

[0013] In some embodiments, the method includes applying an adhesive to at least one of the first layer and the second layer for at least one of attaching the first layer and the second layer together and / or adhering an electrical component to at least one of the first layer and the second layer.

[0014] In some embodiments, at least one of the first layer and the second layer includes a shape-adaptable portion. The method includes applying a force to the device to cause the device to assume a specific shape.

[0015] In some embodiments, the method includes dispersing electrical components between the first layer and at least one other component between the first layer and the second layer such that a substantially continuous flexibility created by attaching the first layer and the second layer together is provided along the device.

[0016] In some embodiments, at least one of the first layer and the second layer includes a surface of the device. The method includes attaching the other of the first layer and the second layer to the surface of the device to create the device.

[0017] According to a third aspect, a device is provided. The device includes a first layer defining a first inner surface and a first outer surface. The device further includes a second layer defining a second inner surface and a second outer surface. The first outer surface and the second outer surface define an outer surface of the device. The device further includes electrical components positioned on the first inner surface or the second inner surface. The first layer and the second layer are attached together to form a seal portion defined by a liquid-tight attachment between the first inner surface and the second inner surface. During use of the device, the seal portion prevents liquid from entering the device between the first layer and the second layer towards the electrical components.

[0018] According to a fourth aspect, a device is provided. The device includes a first layer, a second layer, and electrical components between the first layer and the second layer. The first layer and the second layer are attached together to form a seal portion for preventing liquid from entering between the first layer and the second layer towards the electrical components.

[0019] Some embodiments related to the third aspect or the fourth aspect are described below.

[0020] In some embodiments, the first layer and the second layer are configured such that at least a portion of the electrical connection is exposed between the first layer and the second layer to enable electrical communication with the electrical components.

[0021] In some embodiments, the electrical component includes optoelectronic components for generating and / or detecting optical signals.

[0022] In some embodiments, the device includes optical elements for manipulating optical signals.

[0023] In some embodiments, at least one of the first layer and the second layer includes a transparent portion to enable transmission of an optical signal through at least one of the first layer and the second layer.

[0024] These and other aspects of the invention will become apparent from and be elucidated with reference to the embodiments described hereinafter.

[0025] Next, exemplary embodiments of the invention will be described by way of example only, with reference to the following drawings.

Brief Description of the Drawings

[0026]

Figure 1

Figure 2

Figure 3a

Figure 3b

Figure 3c

Figure 3d

Figure 4

Figure 5

Figure 6

Figure 7

Embodiments for Carrying Out the Invention

[0027] FIG. 1 shows a method 100, which is a method for manufacturing a device such as those described below. Method 100 has, in block 102, the step of providing a first layer, a second layer, and an electrical component (e.g., at least one) between the first layer and the second layer. The first layer defines a first inner surface and a first outer surface. The second layer defines a second inner surface and a second outer surface. The electrical component is positioned on the first inner surface or the second inner surface.

[0028] The manner of providing the first layer, the second layer, and the electrical component depends on the situation or purpose of the device and / or the nature of the first layer, the second layer, and / or the electrical component.

[0029] For example, the first layer is provided (e.g., at a specific location), and then the second layer is provided (e.g., at or near that specific location), so that the electrical component is disposed between the first layer and the second layer before proceeding to the next block of method 100.

[0030] The electrical component is provided at an appropriate time between the first layer and the second layer by positioning the electrical component at an appropriate location on, adjacent to, or within (e.g., embedded or otherwise incorporated into) the first layer or the second layer.

[0031] In one example, the electrical component is provided on-site where the first layer and the second layer are provided (e.g., as part of block 102) before method 100 proceeds to the next block of method 100. For example, the first layer is provided before providing the electrical component, and the electrical component is positioned on the first layer (i.e., the first inner surface) before providing the second layer.

[0032] In another example, the first layer or the second layer already includes electrical components. For example, the electrical components are attached to, integrated within, or otherwise provided as part of one of the first layer and the second layer (e.g., if this layer is manufactured at a different location).

[0033] The term "layer" is not intended to limit the layer to a particular dimension or cross-sectional aspect ratio. For example, both the first layer and the second layer are relatively thin such that their combined thickness is on the order of 1 millimeter or less than 1 millimeter. In another example, one of the first layer and the second layer is relatively thin (e.g., on the order of 100 microns, several hundred microns, or having a thickness less than 1 millimeter), while the other of the first layer and the second layer is relatively thick (e.g., having a thickness greater than 1 millimeter). In another example, both the first layer and the second layer are relatively thick such that their combined thickness is greater than 1 millimeter, e.g., several millimeters and the like.

[0034] Furthermore, the term "layer" is not intended to limit it to a single entity by itself. For example, a layer refers to a part (e.g., a surface) of a larger entity such as a household appliance (e.g., a shaver unit, a toothbrush unit, etc.).

[0035] Method 100 further includes, at block 104, attaching the first layer and the second layer together to create a device that includes the first layer and the second layer. The first outer surface and the second outer surface define an outer surface of the device. The device further includes a seal portion defined by a liquid-tight attachment between the first inner surface and the second inner surface to prevent liquid from entering the device between the first layer and the second layer towards the electrical components.

[0036] Since the electrical component is between the first layer and the second layer, the electrical component (and any other component) is at least partially or completely sealed within the device by attaching the first layer and the second layer together. The sealed portion of the device is such that when the device comes into contact with a liquid or is immersed in a liquid, it prevents a liquid such as water from penetrating between the first layer and the second layer. The electrical component (and any other component) between the first layer and the second layer is protected from the liquid so that the electrical component (and any other component) continues to function as intended even when the device comes into contact with a liquid or is immersed in a liquid. Method 100 is used, for example, to create a relatively compact device by a relatively simple and / or efficient manufacturing process for creating the device (i.e., a single step of attaching the first layer and the second layer together to form the sealed portion). The device created by method 100 is, due to the relatively simple and / or efficient manufacturing process, essentially liquid-tight, robust, and / or relatively compact. For example, compared to an exemplary manufacturing process that first creates the device and then attempts to seal the device by several separate processes, this method 100 creates (e.g., assembles) the device simultaneously and seals the electrical components within the device simultaneously.

[0037] Attachment is achieved, for example, by supplying an adhesive to one or both of the first layer and the second layer and then placing the layers together to attach the layers, joining the layers together by applying heat to one or both of the layers, diffusing a material from one of the layers to another of the layers, thereby attaching the first layer and the second layer together, or otherwise attaching the first layer and the second layer together.

[0038] As a result, method 100 manufactures devices with a single process setup (e.g., using multiple sheet-to-sheet or roll-to-roll production steps on a single production line), thereby creating an essentially liquid-tight device such as those applied to water-robust handheld devices. In some cases, the device is formed as a thin-film mechatronic laminate. Water-robust handheld devices such as shaver units have limited power, occupy a small volume, and / or certain components used in the assembly of the device have a strong curvature (which means that the device needs to be bent to fit within the assembly). Since such handheld devices may be exposed to water during use, the components used in the device need to be essentially waterproof to meet the specifications. As described above, method 100 facilitates the manufacture of devices that meet specific specifications, such as those specified for water-robust handheld devices.

[0039] As will be discussed in more detail below, in addition to electrical components, other components are included in the device. For example, optoelectronic / optical components and / or mechanical components are provided between the first layer and the second layer and sealed therebetween. As a result, the final device meets specific specifications regarding flexibility, robustness, thickness, liquid tightness, etc., and the final device includes electrical, mechanical, and / or optical components for a specific application. Further, the final device is provided in a specific shape, for example, as applied to a shaver unit.

[0040] Figure 2 shows a device 200 manufactured according to method 100 of Figure 1. The device 200 includes a first layer 202 including a first inner surface 203a and a first outer surface 203b, a second layer 204 defining a second inner surface 205a and a second outer surface 205b, and an electrical component 206 between the first layer 202 and the second layer 204. Figure 2 includes an enlarged view of a portion of the device 200, and the separation between the first layer 202 and the second layer 204 is exaggerated to more clearly show the respective surfaces. In this embodiment, the first layer 202 and the second layer 204 are in contact with each other or at least extremely close to each other. The first outer surface 203b and the second outer surface 205b define the outer surface of the device 200. The first layer 202 and the second layer 204 are attached together (i.e., as part of a manufacturing method such as that described by method 100). Prior to attachment, the electrical component 206 is positioned on, embedded in, or attached to the first inner surface 203a or the second inner surface 205a (i.e., positioned on either the first inner surface 203a or the second inner surface 205a prior to the first layer 202 and the second layer 204 being attached together). The first layer 202 and the second layer 204 are attached together to form a seal portion 208 defined by a liquid-tight attachment between the first inner surface 203a and the second inner surface 205a. During use of the device 200, the seal portion 208 prevents liquid from entering the device 200 between the first layer 202 and the second layer 204 towards the electrical component 206. In this embodiment, the first layer 202 and the second layer 204 completely surround the electrical component 206 such that the seal portion 208 extends entirely around the electrical component 206. Accordingly, liquid is prevented from entering between the first layer 202 and the second layer 204 towards the electrical component 206. Further details of the embodiment of the device 200 are described in more detail below.

[0041] Figures 3a through 3d show various views of a device 300 manufactured according to a particular method (such as method 100 or method 600 described below) described herein. Device 300 is similar to device 200 of FIG. 2, but shows additional details of device 200. The reference numerals of the features of device 300 corresponding to features similar to those of device 200 are increased by only 100 compared to FIG. 2.

[0042] In FIGS. 3a through 3b, device 300 is shown in its pre-manufacture form (i.e., at block 102 of method 100), with a first layer 302, a second layer 304, and an electrical component 306 provided. In FIGS. 3c through 3d, the device is shown in its manufactured form (i.e., at block 104 of method 100), with the first layer 302 and the second layer 304 attached together. FIGS. 3b and 3d are side views of device 300 taken along the direction A-A of FIGS. 3a and 3c.

[0043] Additionally, an electrical connection 310 is provided between the first layer 302 and the second layer 304. The electrical connection 310 is configured to enable electrical communication with the electrical component 306 through a seal portion 308, as shown in FIG. 3c. In this embodiment, the electrical connection 310 includes two electrical connections 310 provided on the inner surface 303a of the first layer 302, as shown by the side views of FIGS. 3b and 3d. Although two electrical connections 310 are shown, a different number of electrical connections 310 may be provided depending on the circuitry required to enable electrical communication with a particular type of electrical component 306.

[0044] In one embodiment, the electrical connection portion 310 includes a printed circuit (e.g., a metal such as silver printed on the surface of the first layer 302). In one example, as part of the particular method described herein, the first layer 302 is provided on-site and then the electrical connection portion 310 is printed on the first layer 302 before the second layer 304 is attached to the first layer 302. In another example, as part of the particular method described herein, the electrical connection portion 310 is printed on the first layer 302 at a separate manufacturing location and then the first layer 302 (including the printed electrical connection portion 310) and the second layer 304 are provided and then attached together.

[0045] As can be seen by looking at FIGS. 3a and 3c, the first layer 302 and the second layer 304 are configured such that at least a portion of the electrical connection portion 310 is exposed between the first layer and the second layer to enable electrical communication with the electrical component 306. In this embodiment, when the first layer 302 and the second layer 304 are attached together, a seal portion 308 (e.g., defined by contact between the first layer 302 and the second layer 304 around the electrical connection portion 310) is provided between the first layer 302 and the second layer 304 and / or along the electrical connection portion 310 between the first layer 302 and the second layer 304 to still reliably prevent liquid from entering while allowing a portion of the electrical connection portion 310 to be exposed. In this embodiment, the electrical connection portion 310 extends along the first inner surface 303a (i.e., where these layers 302, 304 face each other) and the electrical connection portion 310 is exposed at the edge of the second layer 304 to enable electrical communication with the electrical component 306.

[0046] As can be seen by looking at FIGS. 3b and 3d, the first layer 302 and the second layer 304 completely surround the electrical component 306 between the first layer 302 and the second layer 304. Further, the first layer 302 and the second layer 304 surround the electrical connection 310 between the first layer 302 and the second layer 304, and the offset between the edge of the first layer 302 and the edge of the second layer 304 ensures that at least a portion of the electrical connection 310 is exposed to enable electrical communication with the electrical component 306 via the seal portion 308.

[0047] The exposed electrical connection 310 needs to be sealed to the liquid-tight body by a separate process (e.g., by an overmolding process or a thermal lamination process) to make an electrical connection to an external controller of the device 300 (not shown, which is part of the equipment for supplying power to the electrical component 306). Nevertheless, even if this separate process does not sufficiently seal the exposed electrical connection 310, the attachment of the first layer 302 and the second layer 304 is sufficient to prevent liquid from entering towards the electrical component 306 between the first layer 302 and the second layer 304.

[0048] The methods shown in FIGS. 3a - 3d and other methods described herein are used to create devices having a relatively compact volume and / or thickness compared to devices created by certain other manufacturing processes. Such devices are relatively compact for use in assembling equipment. For example, the device is configured as a light ring or a functional device or laminate in such equipment. The light ring generates light to provide information such as battery charge level, power on / off state, etc., and / or to provide illumination to a user of the equipment. In some examples, the functional device or laminate performs some functions such as detecting user input (e.g., when an electrical component includes a sensor such as a touch sensor), and that function is used to control the equipment and / or to sense some other input from the environment such as temperature, humidity, etc. In some examples, the functional device or laminate includes a communication device (e.g., configured for Bluetooth, WiFi, Near Field Communication (NFC), optical communication, cellular (4G, 5G, etc.) communication, etc.).

[0049] FIG. 4 shows another device 400 manufactured according to a particular method (such as method 100 or method 700 described below) described herein. Device 400 is similar to device 300 of FIG. 3 but shows certain other features. The reference numerals of the features of device 400 corresponding to the similar features of device 300 are incremented by 100 compared to FIG. 3.

[0050] In this embodiment, device 400 is manufactured in a manner similar to that shown by FIGS. 3a through 3d, whereby the first layer 402 and the second layer 404 are first provided in a planar form and then bonded together to form device 400. At least one of the first layer 402 and the second layer 404 includes a shape-adaptable portion. The shape-adaptable portion is flexible, stretchable, compressible, and / or elastic. In other similar terms, the shape-adaptable portion has appropriate mechanical properties for that portion (and / or layer) to be able to change its shape or form. For example, the shape-adaptable portion of the first layer 402 and / or the second layer 404 includes a material such as a flexible polymer, and / or otherwise the shape-adaptable portion is constructed to be less rigid (or in other words flexible or stretchable) than another portion of device 400. In this embodiment, both the first layer 402 and the second layer 404 are made of a polymer and are flexible throughout. The polymer is resistant (e.g., waterproof) to liquids so that the liquid does not penetrate layers 402, 404.

[0051] A force is applied to device 400 to cause device 400 to take on a particular shape, e.g., an arcuate shape or a ring shape (not shown) as shown by FIG. 4. Despite being bent as shown, device 400 retains an essentially liquid-tight and robust structure. Once device 400 can take on a particular shape, device 400 can be easily incorporated into a device in a particular way. For example, a device such as a shaver unit (not shown) has various contours, and device 400 is bent to take on a particular shape that conforms to the contour of the device when incorporated into the device (e.g., embedded within a slot of the device).

[0052] Device 400 includes an electrical component 406 and at least one other component 406. The other component may or may not be an electrical component, and there may be a different number of components (e.g., two or more). In one example, at least one other component 406 includes optical elements such as waveguides, lenses, prisms, reflectors, diffusers, optically transparent portions, optically opaque portions, and the like. In another example, at least one other component 406 includes structural components for imparting specific mechanical properties such as rigidity, flexibility, etc. at a location where the component is provided between the first layer 402 and the second layer 404.

[0053] In this embodiment, the electrical component 406 and the other component 406 are distributed between the first layer 402 and the second layer 404 such that substantially continuous flexibility (in other words, substantially continuous rigidity) is imparted along the device 400 created by bonding the first layer 402 and the second layer 404 together (e.g., along the length or width of the device 400). As can be seen by looking at FIG. 4, the components 406 are evenly spaced between the first layer 402 and the second layer 404 and are of similar size such that the device 400 takes on a shape with a certain bending radius as shown in FIG. 4. By ensuring this even spacing of the components 406 and / or the continuous flexibility is imparted along the device 400, stress peaks at specific locations of the device 400 are reduced when the device is bent to form a specific shape (otherwise delamination of the layers 402, 404 would be caused at that location), and further, the volume required to assemble the device 400 is minimized.

[0054] A component that is a rigid body provides local rigidity within a device 400 that would otherwise include a stretchable and / or flexible layer. Such local rigidity causes difficulties in getting the device 400 to assume a particular shape. By appropriately dispersing the components 406 within the device 400, the flexibility (e.g., between components) along the device 400 becomes substantially the same. In other words, except for where rigid components impede flexibility and introduce local rigidity, the flexibility is substantially continuous along the length or width of the device 400. Further, the distribution of the components is such that it minimizes regions of high stress concentration between the layers when the device 400 is bent. For example, dispersing the components 406 apart from each other minimizes the stress at the location of the components 406 (as opposed to the scenario where the components are adjacent to each other). Such a uniform dispersion of the components 406 reduces the likelihood of delamination (e.g., instantaneously or over time when bent) between the layers that would affect the quality of the seal provided by the two layers 402, 404.

[0055] As shown by FIG. 4, device 400 includes components 406 that are evenly distributed throughout device 400. Device 400 is filled evenly with components 406 to reduce the likelihood that gaps or air pockets between components will cause specific problems associated with device 400. For example, delamination of layers 402, 404 is caused by the expansion of air pockets in device 400 (e.g., under changing (thermal) loads). By evenly dispersing components 406 within device 400, reducing the number and / or size of such spaces or air pockets reduces the risk of compromising the integrity of device 400. When an overmolding process such as injection molding is applied to device 400 (e.g., to integrate device 400 into a device), the molding process applies pressure and / or heat that compresses device 400 in regions where such spaces or air pockets are present in device 400. Again, minimizing the number and / or size of such spaces or air pockets avoids local compression of device 400 that would otherwise adversely affect the expected function of device 400. In some examples, gaps or air pockets are minimized or eliminated by using a vacuum-based lamination technique. In this case, at least one of the first layer 402 and the second layer 404 conforms to the other layer and / or the shape of the components 406 between layers 402 and 404.

[0056] The different components 406 may be of a particular size and / or may have particular mechanical properties that affect how device 400 responds when bent in a particular way. As a result, additional components (not shown) are provided between the first layer 402 and the second layer 404 to impart particular mechanical properties at particular locations between the first layer 402 and the second layer 404 to impart particular flexibility, stretchability, or rigidity along device 400. In some cases, non-continuous flexibility or rigidity is imparted along device 400 due to the mechanical properties of the components 406 between the first layer 402 and the second layer 404 and / or due to the mechanical properties of at least one of the first layer 402 and the second layer 404.

[0057] As can be seen with reference to FIG. 4, the particular method described herein is used to create a device 400 with relatively high geometric flexibility as compared to devices created by certain other manufacturing processes (e.g., including a number of production steps at different locations). For example, due to the flexibility of the device 400 in FIG. 4, a three-dimensional lighting ring or other functional device can be created by first manufacturing the device 400 in a substantially two-dimensional shape and then forming the device 400 to have a three-dimensional shape. The device 400 is then applied or otherwise combined with a device (not shown), such as a handheld device, for which a particular three-dimensional shape is specified, in order to properly apply or otherwise combine the device 400 with the device.

[0058] Furthermore, the particular method described herein enables the efficient generation of three-dimensional (3D) devices. As highlighted by FIGS. 3 - 4, the device is manufactured in a two-dimensional (2D) shape and then shaped to have a particular 3D shape. For example, a 2D device is created using a 2D manufacturing process, such as a sheet-to-sheet or roll-to-roll assembly line, and then the 2D device is directly adapted for 3D assembly component-by-component within the device, thereby obviating the need to use more complex three-dimensional generation processes, such as complex 3D laminations or 3D sealings by assembly.

[0059] FIG. 4 shows the device 400 as being composed of two flexible layers 402, 404, although other device configurations may be used to construct the device 400 in different ways, such as by a particular feature that provides flexibility in the case where at least one of the layers is not flexible and / or the layers 402, 404 do not have such flexibility.

[0060] For example, at least one of layers 402, 404 is stretchable or compressible (e.g., in a direction along at least the length or width of the layer). At least one of the layers includes a foil that contains ink (e.g., for patterning within or on the layer). Such a layer can be made stretchable so that when stretched or compressed, the ink does not crack or otherwise deform. In one example, when polyethylene terephthalate (PET) and / or polyethylene naphthalate (PEN) is used for one or both of layers 402, 404, the combination is relatively rigid. However, the core (e.g., including component 406) between the two layers 402, 404 is flexible, and as a result, the entire device 400 is relatively flexible. There are scenarios where bending of such a device 400 causes delamination and / or breakage of certain portions of the layers. The layers of device 400 are relatively non-stretchable or non-compressible along the length or width of the layer (still being flexible), and as a result, during bending, the layers have a minimum bending radius for the various layers of the device (and do not stretch). In some cases, relatively non-stretchable or non-compressible layers are used to support rigid components (e.g., surface mount devices (SMDs) such as certain electronic components) to reduce the risk of damage or detachment of the components due to the minimum stretching or compression of that layer during bending of device 400.

[0061] FIG. 5 shows an exploded view of another device 500 manufactured in accordance with a particular method (such as method 100 or method 600 described below) described herein. Device 500 is similar to device 400 of FIG. 4 but shows certain other features. The reference numerals of the features of device 500 corresponding to the similar features of device 400 are increased by 100 only as compared to FIG. 4.

[0062] Similarly to the above, device 500 includes a first layer 502 and a second layer 504. The structures of the first layer 502 and the second layer 504 will be described in more detail below. Various components are provided between the first layer 502 and the second layer 504. In this embodiment, these components are provided on the first layer 502, and then the second layer 504 is attached to the first layer 502. Since the attachment points between the first layer 502 and the second layer 504 have already been shown in previous figures, they are not shown in FIG. 5 for the sake of brevity. Rather, FIG. 5 is an enlarged view of the components and the structures of the first layer 502 and the second layer 504. The first layer 502 and the second layer 504 are constructed in situ where the device 500 is manufactured, or at least one of the first layer 502 and the second layer 504 is manufactured at another location and then provided in situ where the device 500 is manufactured. Next, a process for manufacturing the device 500 from the lower layer to the upper layer (i.e., from the first layer 502 to the second layer 504) will be described.

[0063] The first layer 502 consists of a polymer layer, which in this embodiment consists of thermoplastic polyurethane (TPU). The TPU is optically transparent for a specific wavelength or opaque for a specific wavelength (e.g., TPU white or black). In this case, the first layer 502 consists of TPU white, but in other cases, it consists of a different color such as black (e.g., for avoiding light transmission or leakage). In some other embodiments, the first layer 502 consists of a relatively non-stretchable material such as PEN, PET, polyimide (PI), etc. In some scenarios, since the TPU is too stretchable for some SMD type components, specific SMD components are better supported on the first layer 502 when the first layer 502 is relatively non-stretchable. The first layer 502 of this embodiment is used to support components and electrical conductors such as tracks, and can be used to block light from passing through it depending on the color of the first layer 502.

[0064] Next, a circuit 512 (e.g., silver and / or another suitable conductive material) is printed on the first layer 502. The circuit includes the electrical connections referred to in FIGS. 2 to 3 and provides electrical communication to the electrical components within the device 500. In some cases, electrical components other than the electrical connections (e.g., resistors, inductors, capacitors, microprocessors, etc.) are provided as part of and / or printed on the circuit 512.

[0065] A conductive adhesive such as an isotropic conductive adhesive (ICA) 514 is placed at specific locations on the circuit 512. This provides part of the electrical connection to specific electrical components of the device 500. In this embodiment, a polymer portion 516 (e.g., TPU white) is provided on the circuit 516 (e.g., by printing, molding, or otherwise depositing the polymer portion 516). The polymer portion 516 provides specific functions such as providing specific mechanical properties (e.g., support for other components and / or a specific rigidity or flexibility) at that location of the device 500. In this embodiment, the polymer portion 516 is optically opaque (e.g., to prevent light leakage from adjacent components of the device 500 described below).

[0066] In this embodiment, the first layer 502 (including the various components described above) is about 0.3 mm thick, although other thicknesses are possible (less than 0.3 mm or greater than 0.3 mm, etc.). For ease of reference, the combination of the first layer 502, the circuit 512, the ICA 514, and the polymer portion 516 is hereinafter simply referred to as the first layer 502.

[0067] Various components are provided on the first layer 502. A first electrical component 506a and a second electrical component 506b are positioned on the ICA 514. In this embodiment, the electrical components 506a, 506b each include optoelectronic components in the form of light-emitting diodes (LEDs). The LEDs generate optical signals emitted from the device 500 as described in more detail below.

[0068] The first electrical component 506a (LED) emits an optical signal 518a in a vertical direction (i.e., toward the second layer 504).

[0069] The second electrical component 506b (LED) emits an optical signal 518b in a horizontal direction (i.e., in a plane parallel to the first layer 502 and the second layer 504). The optical element 520 is provided to manipulate the optical signal 518b. The optical element 520 is disposed adjacent to and optically coupled to the second electrical component 506b. In this embodiment, the optical element 520 includes an optical waveguide that guides the optical signal emitted by the second electrical component 506 along the optical waveguide. During use of the device 500, the optical signal 518b propagates along the optical waveguide. The optical element 520 is configured such that the optical signal 518b changes direction and propagates toward the second layer 504. For example, the optical element 520 can include at least one reflective structure such as for changing the direction of the optical signal 518b.

[0070] An additional polymer portion 522 (e.g., the portion 522 includes a single TPU white or TPU high-concentration white portion, or a multi-layer such as a white layer combined with a black layer (e.g., printed) for blocking light from adjacent optical element 520) is provided between the first electrical component 506a and the optical element 520. Similar to the polymer portion 516, the additional polymer portion 522 provides a specific function, such as providing specific mechanical properties (e.g., support for other components, and / or a specific rigidity or flexibility) at that location of the device 500. In this embodiment, the additional polymer portion 522 is optically opaque (e.g., to prevent light from leaking from the optical element 520 and / or to prevent reflection of the optical signal 518b within the optical element 520). The additional polymer portion 522 is provided, for example, by being formed (e.g., solidified), positioned in place, laminated, or molded in place. As described above, the black layer is provided as part of the additional polymer portion 522 (e.g., extending over the entire upper part of the core / layer shown in FIG. 5 including the electrical component 506). This black layer includes apertures so that light from the first electrical component 506a and the second electrical component 506b can exit this core / layer and then leak out from the second layer 504, as will be described in more detail below.

[0071] In some embodiments, the various components described above, including the electrical components 506a, 506b, the optical element 520, and the additional polymer portion 522, are provided essentially as layers (e.g., these various components are integrated within a layer). In this embodiment, the thickness of these various components is about 0.7 mm, although other thicknesses are possible (less than 0.7 mm or greater than 0.7 mm, etc.).

[0072] After the various components described above are provided, additional components are provided. In this embodiment, an additional optical element in the form of a diffuser layer 524 (e.g., an optical diffuser) is provided over the components described above. The diffuser layer 524 diffuses the optical signals 518a, 518b to provide a more uniform distribution of illumination compared to direct illumination provided by the LED itself. A first additional polymer layer 526 and a second additional polymer layer 528 (e.g., TPU white, TPU black, optically clear TPU, and / or ink) are provided over the diffuser layer 526. In this embodiment, the first additional polymer layer 526 includes a TPU white portion 526a and a clear portion 526b. The second additional polymer layer 528 includes a TPU black portion 528a and a clear portion 528b. The clear portions 526b, 528b are aligned with respect to the first electrical component 506a and the optical element 520 such that the optical signals 518a, 518b pass through the clear portions 526b, 528b and exit the device 500. Although certain components are described as having a particular color (e.g., black or white), other colors may be used where appropriate (e.g., for aesthetic considerations and / or for functional considerations such as light absorption or reflection).

[0073] In this embodiment, the diffuser layer 526, as well as the first additional polymer layer 526 and the second additional polymer layer 528, are considered to be the "second layer 504". However, in some embodiments, the second additional polymer layer 528 is considered to be the "second layer 504", and in other embodiments, a combination of the first additional polymer layer 526 and the second additional polymer layer 528 is considered to be the "second layer 504". In this embodiment, the second layer 504 is about 0.1 mm thick, although other thicknesses are possible (e.g., less than 0.1 mm or greater than 0.1 mm).

[0074] As a result, each of the layers 502, 504 includes at least one layer. Thus, the device 500 is considered to include at least two layers. The overall thickness of the device 500 is on the order of 1 mm, although other thicknesses are possible (e.g., less than 1 mm or greater than 1 mm).

[0075] It has been described that a particular layer is made of a polymer and that a particular component (or a layer containing such a component) is made of various materials such as metal, plastic, etc. In some cases, the functional printed layer of device 500 is dominated by metal, polymer, or ceramic in the dry state.

[0076] In some embodiments, device 500 is substantially liquid-tight (e.g., waterproof) because a first layer 502 and a second layer 504 are adhered together (not shown in FIG. 5 but shown in FIGS. 2 to 3), and as a result, device 500 can potentially be submerged in water (or other conductive liquids) without causing malfunction of device 500 (e.g., due to electrical short circuit or optical performance loss). When the circuit 512 of device 500 is sealed by adhering the first layer 502 and the second layer 504 together (see, for example, FIGS. 3 to 4), water ingress is prevented. Such substantial liquid-tightness is useful for devices such as shaver units that are rinsed under running water during use.

[0077] Various components are sealed within device 500 during the manufacturing process according to the particular methods described herein. For example, an optical guide, a sensor, and / or an (e.g., solid state) actuator (e.g., a touch sensor) is provided to perform a particular function of a device such as a shaver unit (e.g., by resonance at a position away from the surface / main board of the device) for touch control and user feedback control.

[0078] A relatively simple manufacturing process facilitates the accurate alignment of components such as LEDs and optical elements within device 500 by placing them in device 500 with a single production mechanism, and the single production mechanism ensures proper alignment of such components, and thus reduces or avoids losses related to the electro-optical signal conversion efficiency within device 500.

[0079] As described above, various types of optical elements 520 are integrated into the device 500 during its manufacture. Certain optical elements 520, such as prisms (used to homogenize the optical signal 518b output by the device 500), are relatively bulky and / or difficult to integrate using certain manufacturing processes. The same applies to any of the other types of optical elements described herein, such as waveguides, lenses, and reflectors. However, the specific methods described herein facilitate the integration of such optical elements 520 and other components into the device 500.

[0080] Although not shown in FIG. 5, a refractive index matching adhesive is provided in the space between the components through which the optical signals 518a, 518b propagate. Such a refractive index matching adhesive avoids or reduces optical losses and / or improves the homogeneity of the optical signal output by the device 500.

[0081] Certain components of the device 500 create a specific illumination compartment within the device 500 that is surrounded by components for preventing any unintentional leakage of the optical signals 518a, 518b (e.g., by using opaque components within the device 500). Such opaque components (e.g., additional polymer portion 522) are used to avoid crosstalk between the different optical signals 518a, 518b. These opaque components are relatively easy to provide in the device 500 and are also fairly effective in avoiding optical losses.

[0082] The devices described herein are integrated into a device as a 2D-shaped device or a 3D-shaped device. In some cases, a polymer (e.g., an adhesive and / or a sealant) is used to thermoform, backform, and / or overmold such a device to create a solid integrated structure that includes the device and the device integrated with the device (e.g., within the enclosure of the device). In one example, a plate (e.g., a "layer") of polycarbonate or polymethyl methacrylate (PMMA) is thermoformed in the presence of device 500. In a further example, a combination of thermoformed devices is molded to create the solid integrated structure described above.

[0083] FIG. 6 shows another device 600 having a similar form to device 300 shown in FIG. 3c. Similar to device 300, device 600 includes a first layer 602 and a second layer 604, an electrical component 606, a seal portion 608, and an electrical connection 610. Additionally, device 600 includes an isolation portion 630 provided in a part of the electrical connection 610 and partially extending into the seal portion 608 of device 600 between the first layer 602 and the second layer 604. The isolation portion 630 also partially extends along the electrical connection 610 (where the second layer 604 is not provided) such that a part of the electrical connection 610 is exposed as described above. In other similar words, the first layer 602 and the second layer 604 are still configured such that at least a part of the electrical connection 610 is exposed between the first layer 602 and the second layer 604 to enable electrical communication with the electrical component 606. However, the isolation portion 630 provides additional protection from the ingress of liquid between the first layer 602 and the second layer 604 because the electrical connection 610 itself is protected (e.g., isolated) at the edge of the second layer 604 offset from the first layer 602.

[0084] The isolation portion 630 is made of a polymer (e.g., bulk or printed) and / or another material to isolate the underlying electrical connection portion 610 from liquid contact. The isolation portion 630 is relatively thin compared to the second layer 604 such that the combination of the first layer 602, the electrical connection portion 610, and the isolation portion 630 is relatively thinner than the combined thickness of the first layer 602 and the second layer 604 (as shown in FIG. 6). This relatively thin portion of the device 600 is referred to as a connection “tail” since this portion is, for example, installed in the power supply of the device.

[0085] FIG. 7 refers to a method 700 of manufacturing a device according to the specific embodiment described above. The method 700 includes at least one of blocks 102 and 104 of the method 100 of FIG. 1 and, for ease of reference, these blocks of the method 100 are also referred to. Where appropriate, a particular block is omitted from the method 700. Further, in some cases, the sequence of the blocks is changed.

[0086] In some embodiments, the method 700 has, at block 702, the step of providing an electrical connection portion on one of the first layer and the second layer before attaching the first layer and the second layer together. The electrical connection portion is configured to enable electrical communication with an electrical component via a seal portion.

[0087] In some embodiments, the method 700 has, at block 704, the step of positioning an electrical component on one of the first layer and the second layer before attaching the first layer and the second layer together (e.g., at block 104).

[0088] In some embodiments, the electrical component includes an optoelectronic component for generating and / or detecting an optical signal. In this regard, method 700 further includes, at block 706, providing an optical element for manipulating the optical signal. The optical element is provided between the first layer and the second layer before the first layer and the second layer are bonded together. The seal portion is configured to prevent liquid from entering between the first layer and the second layer toward the optical element.

[0089] In some embodiments, method 700 includes, at block 708, applying an adhesive to at least one of the first layer and the second layer for at least one of bonding the first layer and the second layer together and adhering an electrical component to at least one of the first layer and the second layer.

[0090] In some embodiments, at least one of the first layer and the second layer includes a flexible portion. In this regard, method 700 includes, at block 710, applying a force to the device to cause the device to assume a particular shape.

[0091] In some embodiments, method 700 includes, as part of block 102, distributing the electrical component and at least one other component between the first layer and the second layer such that substantially continuous rigidity created by bonding the first layer and the second layer together is provided along the device.

[0092] In some embodiments, at least one of the first layer and the second layer includes a surface of a device. In this regard, method 700 includes, at block 712, attaching the other of the first layer and the second layer to the surface of the device to create the device. Accordingly, the device is created and sealed to the surface of the device simultaneously.

[0093] One or more features described in an embodiment may be combined with or replaced by features described in another embodiment. For example, method 100 or 700 of FIG. 1 or FIG. 7 may be modified based on features described in connection with devices 200, 300, 400, 500, 600 of FIGS. 2, 3, 4, 5, and 6, and vice versa. Further, a particular feature of one of devices 200, 300, 400, 500, 600 may be combined with, replaced by, or otherwise modified from a particular feature of another of devices 200, 300, 400, 500, 600.

[0094] The present disclosure has been described with reference to flowcharts and block diagrams of methods, devices, and systems according to embodiments of the present disclosure. Although the above flowcharts illustrate a particular order of execution, the order of execution may be different from that shown. Blocks described in connection with one flowchart may be combined with those of another flowchart.

[0095] Elements or steps described in connection with an embodiment may be combined with or replaced by elements or steps described in connection with another embodiment. Other modifications to the disclosed embodiments will be understood and attained by those skilled in the art from a consideration of the drawings, the disclosure, and the appended claims in practicing the claimed invention. In the claims, the words "comprising," "including," and "having" do not exclude other elements or steps, and the singular does not exclude the plural. Any reference signs in the claims should not be construed as limiting the scope.

Claims

1. A first layer defining a first inner surface and a first outer surface, A second layer defining a second inner surface and a second outer surface, An electrical component positioned on the first inner surface or the second inner surface, and An electrical connection for the electrical component, the electrical connection being printed on the first layer or the second layer Providing the steps; The electrical component and the electrical connection are positioned between the first layer and the second layer, and thus the electrical component and the electrical connection are in contact with both the first inner surface and the second inner surface, including the first layer and the second layer for creating a device The step of laminating the first layer and the second layer together, The first outer surface and the second outer surface define an outer surface of the device, and the device prevents liquid from entering the device along the electrical connection between the first layer and the second layer toward the electrical component. A seal portion defined by a liquid-tight bond between the first inner surface and the second inner surface around the electrical connection is further included, The electrical connection enables electrical communication with the electrical component through the seal portion, The edge of the first layer is offset from the edge of the second layer such that a portion of the electrical connection printed on the first layer or the second layer is exposed for connection to a power source. Method.

2. The method according to claim 1, wherein the electrical connection extends along the first inner surface or the second inner surface and is exposed at an edge of one of the first layer and the second layer to enable electrical communication with the electrical component.

3. The method according to claim 1 or 2, wherein the exposed portion of the electrical connection extends along the first layer on the same surface of the first layer as the first inner surface or along the second layer on the same surface of the second layer as the second inner surface.

4. The method according to any one of claims 1 to 3, wherein the first layer and the second layer are offset to expose the portion of the electrical connection.

5. Before the step of laminating the first layer and the second layer together, the step of providing an isolation portion in a part of the electrical connection, and when the first layer and the second layer are laminated together to create the device, The electrical connection portion extends between the first layer or the second layer and the isolation portion and is exposed to enable electrical communication with the electrical component through the isolation portion and the seal portion, and the isolation portion extends partially along the electrical connection portion. The isolation portion extends partially into the seal portion of the device between the first layer and the second layer. The method according to any one of claims 1 to 4. **Claim 6**: The method according to claim 5, wherein the isolation portion is relatively thinner than the first layer or the second layer such that the combined thickness of the first layer or the second layer, the electrical connection portion, and the isolation portion is less than the combined thickness of the first layer and the second layer. **Claim 7** The electrical component includes an optoelectronic component for generating and / or detecting an optical signal, the method further comprising providing an optical element for manipulating the optical signal, the optical element being provided between the first layer and the second layer before the first layer and the second layer are bonded together, and the seal portion preventing liquid from entering between the first layer and the second layer towards the optical element. The method according to any one of claims 1 to 6. **Claim 8** The method according to any one of claims 1 to 7, comprising applying an adhesive to at least one of the first layer and the second layer for at least one of bonding the first layer and the second layer together and adhering the electrical component to at least one of the first layer and the second layer. **Claim 9** The method according to any one of claims 1 to 8, wherein at least one of the first layer and the second layer includes a shape-adaptable portion, and the method comprises applying a force to the device to cause the device to assume a specific shape. **Claim 10** The method according to any one of claims 1 to 9, comprising dispersing the electrical component and at least one other component between the first layer and the second layer such that substantially continuous flexibility created by bonding the first layer and the second layer together is imparted along the device. **Claim 11** The method according to any one of claims 1 to 10, wherein at least one of the first layer and the second layer includes a surface of a device, and the method includes the step of attaching the other of the first layer and the second layer to the surface of the device to create the device.

12. A first layer defining a first inner surface and a first outer surface; A second layer defining a second inner surface and a second outer surface; An electrical component positioned between the first layer and the second layer; An electrical connection for the electrical component, the electrical connection being printed on the first layer or the second layer A device comprising: The first outer surface and the second outer surface define an outer surface of the device; The electrical component and the electrical connection are in contact with both the first inner surface and the second inner surface; The first layer and the second layer are attached together to form a seal portion defined by a liquid-tight attachment between the first inner surface and the second inner surface around the electrical connection to prevent liquid from entering the device along the electrical connection between the first layer and the second layer toward the electrical component; The electrical connection enables electrical communication with the electrical component through the seal portion; A device in which an edge of the first layer is offset from an edge of the second layer such that a part of the electrical connection printed on the first layer or the second layer is exposed for connection to a power source.

13. The device according to claim 12, wherein the electrical component includes an optoelectronic component for generating and / or detecting an optical signal.

14. The device according to claim 13, further comprising an optical element for manipulating the optical signal.

15. The device according to claim 13 or 14, wherein at least one of the first layer and the second layer includes a transparent portion for enabling transmission of the optical signal through at least one of the first layer and the second layer.

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