Solid battery module

Abstract

Provided is a solid-state battery module capable of efficiently performing wireless power transmission and the like.　A solid-state battery module (1000) comprises: a first substrate (200A) with wiring (210); a solid-state battery (100) provided on the first substrate (200A); and a second substrate (200B) that is provided above the solid-state battery (100) and that includes therein a coil unit (300) which can be electrically connected to the first substrate (200A).　The top surface of the second substrate (200B) is positioned along the module top surface (1100), or inside of the module top surface (1100).

Description

Technical Field

[0001] The present invention relates to a solid-state battery module. More specifically, the present invention relates to a solid-state battery that is modularized so as to be substrate-mountable.

Background Art

[0002] Conventionally, secondary batteries capable of repeated charge and discharge have been used in various applications. For example, secondary batteries are used as power sources for electronic devices such as smartphones and notebook computers. In secondary batteries, a liquid electrolyte is generally used as a medium for ion movement contributing to charge and discharge. That is, a so-called electrolytic solution is used in secondary batteries. However, in such secondary batteries, safety is generally required in terms of preventing leakage of the electrolytic solution. In addition, since organic solvents and the like used in the electrolytic solution are flammable substances, safety is also required in that regard.

[0003] Therefore, research has been underway on solid-state batteries using solid electrolytes instead of electrolytic solutions. A solid-state battery has a battery element including a positive electrode layer, a negative electrode layer, and a solid electrolyte interposed between the electrode layers of the positive electrode layer and the negative electrode layer.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] A solid-state battery may be used, for example, as a control circuit of a solid-state battery, a sensor, an antenna, a wireless power supply circuit, and a solid-state battery module in which these are combined and integrated together.

[0006] In a solid-state battery module having a wireless power supply mechanism or a wireless communication mechanism, a coil unit for transmitting and receiving electromagnetic waves is required. The coil unit may be arranged separately from the solid-state battery module. For example, the coil unit may be arranged on the solid-state battery module by external attachment. In such an arrangement form, when the coil unit is arranged separately from the solid-state battery module, the total size of the solid-state battery module and the coil unit may increase. Further, depending on the position of the coil unit arranged separately based on the arrangement location of the solid-state battery module, the inductance value of the coil unit is different, and it is necessary to perform matching for each solid-state battery module. From the above, in the mode of arranging the coil unit separately from the solid-state battery module, it is difficult to say that efficient implementation of wireless power supply or the like is achieved.

[0007] The present invention has been made in view of such problems. That is, an object of the present invention is to provide a solid-state battery module capable of efficiently performing wireless power supply or the like.

Means for Solving the Problems

[0008] In the present invention, a first substrate having wiring, a solid-state battery arranged on the first substrate, and a second substrate provided inside with a coil unit arranged above the solid-state battery and electrically connectable to the first substrate are provided, and a solid-state battery module is provided in which the top surface of the second substrate is positioned along the module top surface or inside the module top surface.

Effects of the Invention

[0009] According to the solid-state battery module according to the present invention, it is possible to efficiently perform wireless power supply or the like.

Brief Description of the Drawings

[0010]

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Mode for Carrying Out the Invention

[0011] Hereinafter, a solid-state battery module according to an embodiment of the present invention will be described in detail. Although the description will be made with reference to the drawings as necessary, the illustrated content is only schematically and exemplarily shown for the understanding of the present invention, and the appearance and dimensional ratios may be different from the actual ones.

[0012] As used herein, the "solid-state battery module" broadly refers to a composite device composed of a plurality of components including a solid-state battery, and narrowly refers to a composite device composed of a solid-state battery, a circuit element, a circuit connecting them, and a substrate.

[0013] As used herein, the "cross-sectional view" is based on a form captured from a direction substantially perpendicular to the stacking direction in the stacked structure of the solid-state battery (specifically, the form when cut along a plane parallel to the layer thickness direction). Also, as used herein, the "plan view" is based on a schematic view when the object is viewed from above or below along the thickness direction of such a layer (i.e., the above-mentioned stacking direction).

[0014] The "vertical direction" and "horizontal direction" directly or indirectly used herein correspond to the vertical direction and horizontal direction in the drawing, respectively. Unless otherwise specified, the same reference numerals or symbols indicate the same members, parts, or the same meaning content. In a preferred embodiment, it can be understood that the vertically downward direction (i.e., the direction in which gravity acts) corresponds to the "downward direction" / "bottom surface side", and the opposite direction corresponds to the "upward direction" / "top surface side".

[0015] As used in the present invention, the "solid-state battery" generally refers to a battery whose components are made of solids, and specifically refers to an all-solid-state battery in which all components are made of solids. In a preferred embodiment, the solid-state battery in the present invention is a laminated solid-state battery configured such that each layer forming a battery constituent unit is laminated on top of each other, and preferably each such layer is made of a fired body. The "solid-state battery" includes not only so-called "secondary batteries" capable of repeated charging and discharging, but also "primary batteries" capable of only discharging. According to a preferred embodiment of the present invention, the "solid-state battery" is a secondary battery. The "secondary battery" is not to be overly restricted by its name and may include, for example, energy storage devices. In the present invention, the solid-state battery included in the module may also be referred to as a "solid-state battery element".

[0016] FIG. 1 is a cross-sectional view schematically showing the configuration of a modularized solid-state battery according to an embodiment of the present invention. FIG. 2 schematically shows a cross-sectional view when the solid-state battery module of FIG. 1 is cut along side surface 1300.

[0017] [Basic Configuration of Solid-State Battery] Hereinafter, first, the basic configuration of the solid-state battery 100 will be described. The configuration of the solid-state battery described here is merely an example for understanding the invention and does not limit the invention. The solid-state battery 100 has at least an electrode layer of a positive electrode and a negative electrode and a solid electrolyte. Specifically, the solid-state battery 100 has a battery element including a battery constituent unit composed of a positive electrode layer 110, a negative electrode layer 120, and a solid electrolyte 130 interposed therebetween at least.

[0018] In the solid-state battery 100, each layer that is a component thereof may be formed by firing, and the positive electrode layer, the negative electrode layer, the solid electrolyte, etc. may form a fired layer. Preferably, the positive electrode layer, the negative electrode layer, and the solid electrolyte are integrally fired with each other, and therefore it is preferable that the battery element forms an integrally fired body.

[0019] The positive electrode layer is an electrode layer containing at least a positive electrode active material. The positive electrode layer may further contain a solid electrolyte. In a preferred embodiment, the positive electrode layer may be composed of a fired body containing at least positive electrode active material particles and a solid electrolyte. On the other hand, the negative electrode layer is an electrode layer containing at least a negative electrode active material. The negative electrode layer may further contain a solid electrolyte. In a preferred embodiment, the negative electrode layer may be composed of a sintered body containing at least negative electrode active material particles and a solid electrolyte.

[0020] The positive electrode active material and the negative electrode active material are substances involved in the transfer of electrons in a solid battery. Ions move (conduct) between the positive electrode layer and the negative electrode layer through the solid electrolyte, and charge and discharge are performed by the transfer of electrons. Each of the positive electrode layer and the negative electrode layer is preferably a layer capable of occluding and releasing lithium ions or sodium ions. That is, the solid battery is preferably an all-solid-state secondary battery in which lithium ions or sodium ions move between the positive electrode layer and the negative electrode layer through the solid electrolyte to perform charge and discharge of the battery.

[0021] (Positive electrode active material) Examples of the positive electrode active material contained in the positive electrode layer include at least one selected from the group consisting of lithium-containing phosphate compounds having a NASICON-type structure, lithium-containing phosphate compounds having an olivine-type structure, lithium-containing layered oxides, and lithium-containing oxides having a spinel-type structure. An example of the lithium-containing phosphate compound having a NASICON-type structure is Li3V2(PO4)3. Examples of the lithium-containing phosphate compound having an olivine-type structure include Li3Fe2(PO4)3, LiFePO4, and / or LiMnPO4. An example of the lithium-containing layered oxide is LiCoO2, and / or LiCo 1 / 3 Ni 1 / 3 Mn 1 / 3 Examples of O2 and the like. An example of the lithium-containing oxide having a spinel-type structure is LiMn2O4, and / or LiNi 0.5 Mn 1.5Examples include O4. The type of the lithium compound is not particularly limited, and for example, it may be a lithium transition metal composite oxide or a lithium transition metal phosphate compound. The lithium transition metal composite oxide is a general term for oxides containing lithium and one or more transition metal elements as constituent elements, and the lithium transition metal phosphate compound is a general term for phosphate compounds containing lithium and one or more transition metal elements as constituent elements. The type of the transition metal element is not particularly limited, and for example, it is cobalt (Co), nickel (Ni), manganese (Mn), iron (Fe), etc.

[0022] In addition, examples of the positive electrode active material capable of occluding and releasing sodium ions include at least one selected from the group consisting of a sodium-containing phosphate compound having a NASICON-type structure, a sodium-containing phosphate compound having an olivine-type structure, a sodium-containing layered oxide, and a sodium-containing oxide having a spinel-type structure. For example, in the case of the sodium-containing phosphate compound, at least one selected from the group consisting of Na3V2(PO4)3, NaCoFe2(PO4)3, Na2Ni2Fe(PO4)3, Na3Fe2(PO4)3, Na2FeP2O7, Na4Fe3(PO4)2(P2O7), and NaFeO2 as the sodium-containing layered oxide is included.

[0023] In addition, the positive electrode active material may be, for example, an oxide, a disulfide, a chalcogenide, or a conductive polymer. The oxide may be, for example, titanium oxide, vanadium oxide, or manganese dioxide. The disulfide is, for example, titanium disulfide or molybdenum sulfide. The chalcogenide may be, for example, niobium selenide. The conductive polymer may be, for example, disulfide, polypyrrole, polyaniline, polythiophene, polyparastyrene, polyacetylene, or polyacene.

[0024] (Negative electrode active material) Examples of the negative electrode active material contained in the negative electrode layer include, for example, oxides containing at least one element selected from the group consisting of titanium (Ti), silicon (Si), tin (Sn), chromium (Cr), iron (Fe), niobium (Nb), and molybdenum (Mo), carbon materials such as graphite, graphite-lithium compounds, lithium alloys, lithium-containing phosphate compounds having a NASICON-type structure, lithium-containing phosphate compounds having an olivine-type structure, and lithium-containing oxides having a spinel-type structure, etc. At least one selected from the group consisting of these is mentioned. As an example of the lithium alloy, Li-Al etc. are mentioned. As an example of the lithium-containing phosphate compound having a NASICON-type structure, Li3V2(PO4)3, and / or LiTi2(PO4)3 etc. are mentioned. As an example of the lithium-containing phosphate compound having an olivine-type structure, Li3Fe2(PO4)3, and / or LiCuPO4 etc. are mentioned. The spinel-type structure As an example of the lithium-containing oxide having, Li4Ti5O 12 etc. are mentioned.

[0025] In addition, examples of the negative electrode active material capable of occluding and releasing sodium ions include at least one selected from the group consisting of sodium-containing phosphate compounds having a NASICON-type structure, sodium-containing phosphate compounds having an olivine-type structure, and sodium-containing oxides having a spinel-type structure, etc.

[0026] Note that in a solid-state battery, the positive electrode layer and the negative electrode layer may be made of the same material.

[0027] The positive electrode layer and / or the negative electrode layer may contain a conductive material. Examples of the conductive material contained in the positive electrode layer and the negative electrode layer include at least one consisting of metal materials such as silver, palladium, gold, platinum, aluminum, copper, and nickel, and carbon etc.

[0028] Furthermore, the positive electrode layer and / or the negative electrode layer may contain a sintering aid. Examples of the sintering aid include at least one selected from the group consisting of lithium oxide, sodium oxide, potassium oxide, boron oxide, silicon oxide, bismuth oxide, and phosphorus oxide.

[0029] The thicknesses of the positive electrode layer and the negative electrode layer are not particularly limited, and for example, they may each independently be 2 μm or more and 50 μm or less, particularly 5 μm or more and 30 μm or less.

[0030] (Positive electrode current collector layer / Negative electrode current collector layer) Although not essential elements of the electrode layer, the positive electrode layer and the negative electrode layer may each include a positive electrode current collector layer and a negative electrode current collector layer. The positive electrode current collector layer and the negative electrode current collector layer may each have a foil form. However, if more importance is attached to viewpoints such as improving electronic conductivity by integral firing, reducing the manufacturing cost of the solid battery, and / or reducing the internal resistance of the solid battery, the positive electrode current collector layer and the negative electrode current collector layer may each have a fired body form. As the positive electrode current collector constituting the positive electrode current collector layer and the negative electrode current collector constituting the negative electrode current collector layer, it is preferable to use a material having a high conductivity, and for example, silver, palladium, gold, platinum, aluminum, copper, and / or nickel may be used. The positive electrode current collector and the negative electrode current collector may each have an electrical connection portion for electrically connecting to the outside, and may be configured to be electrically connectable to an end face electrode. When the positive electrode current collector layer and the negative electrode current collector layer have a fired body form, they may be constituted by a fired body containing a conductive material and a sintering aid. The conductive material contained in the positive electrode current collector layer and the negative electrode current collector layer may be selected from the same materials as the conductive materials that may be contained in the positive electrode layer and the negative electrode layer, for example. The sintering aid contained in the positive electrode current collector layer and the negative electrode current collector layer may be selected from the same materials as the sintering aids that may be contained in the positive electrode layer and the negative electrode layer, for example. As described above, in a solid battery, the positive electrode current collector layer and the negative electrode current collector layer are not essential, and a solid battery without such positive electrode current collector layer and negative electrode current collector layer is also conceivable. That is, the solid battery included in the package of the present invention may be a solid battery without a current collector layer.

[0031] (Solid electrolyte) The solid electrolyte is a material through which lithium ions or sodium ions can conduct. In particular, the solid electrolyte layer that forms a battery constituent unit in a solid battery may form a layer through which lithium ions can conduct between the positive electrode layer and the negative electrode layer. Note that the solid electrolyte layer only needs to be provided at least between the positive electrode layer and the negative electrode layer. That is, the solid electrolyte layer may be present around the positive electrode layer and / or the negative electrode layer so as to protrude from between the positive electrode layer and the negative electrode layer. Examples of the solid electrolyte included in the solid electrolyte layer include any one or two or more of crystalline solid electrolytes, glass-based solid electrolytes, and glass-ceramics-based solid electrolytes, etc.

[0032] The crystalline solid electrolyte is, for example, an oxide-based crystalline material and a sulfide-based crystalline material, etc. Examples of the oxide-based crystalline material include lithium-containing phosphate compounds having a NASICON structure, oxides having a perovskite structure, oxides having a garnet type or a garnet type similar structure, oxide glass-ceramics-based lithium ion conductors, etc. Examples of the lithium-containing phosphate compound having a NASICON structure include Li x M y (PO4)3 (1 ≤ x ≤ 2, 1 ≤ y ≤ 2, M is at least one selected from the group consisting of titanium (Ti), germanium (Ge), aluminum (Al), gallium (Ga), and zirconium (Zr)). An example of the lithium-containing phosphate compound having a NASICON structure is, for example, Li 1.2 Al 0.2 Ti 1.8 (PO4)3, etc. Examples of the oxide having a perovskite structure include La 0.55 Li 0.35 TiO3, etc. Examples of the oxide having a garnet type or a garnet type similar structure include Li7La3Zr2O 12 , etc. Also, examples of the sulfide-based crystalline material include thio-LISICON, for example, Li 3.25 Ge0 .25 P 0.75 S4 and Li 10 GeP2S 12and the like. The crystalline solid electrolyte may contain a polymer material (for example, polyethylene oxide (PEO) or the like).

[0033] Examples of the glass-based solid electrolyte include oxide-based glass materials and sulfide-based glass materials. Examples of the oxide-based glass materials include 50Li4SiO4·50Li3BO3 and the like. Examples of the sulfide-based glass materials include 30Li2S·26B2S3·44LiI, 63Li2S·36SiS2·1Li3PO4, 57Li2S·38SiS2·5Li4SiO4, 70Li2S·30P2S5, and 50Li2S·50GeS2 and the like.

[0034] The glass-ceramics-based solid electrolyte is, for example, an oxide-based glass-ceramics material, a sulfide-based glass-ceramics material, or the like. As the oxide-based glass-ceramics material, for example, a phosphate compound (LATP) containing lithium, aluminum, and titanium as constituent elements, and a phosphate compound (LAGP) containing lithium, aluminum, and germanium as constituent elements can be used. LATP is, for example, Li 1.07 Al 0.69 Ti 1.46 (PO4)3 and the like. Further, LAGP is, for example, Li 1.5 Al 0.5 Ge 1.5 (PO4) and the like. Examples of the sulfide-based glass-ceramics material include Li7P3S 11 and Li 3.25 P 0.95 S4 and the like.

[0035] Examples of the solid electrolyte capable of conducting sodium ions include a sodium-containing phosphate compound having a NASICON structure, an oxide having a perovskite structure, an oxide having a garnet type or a garnet type similar structure, and the like. Examples of the sodium-containing phosphate compound having a NASICON structure include Na x M y (PO4)3 (1 ≦ x ≦ 2, 1 ≦ y ≦ 2, M is at least one selected from the group consisting of Ti, Ge, Al, Ga, and Zr).

[0036] The solid electrolyte layer may contain a sintering aid. The sintering aid contained in the solid electrolyte layer may be selected from, for example, the same materials as the sintering aids that may be contained in the positive electrode layer and the negative electrode layer.

[0037] The thickness of the solid electrolyte layer is not particularly limited. The thickness of the solid electrolyte layer located between the positive electrode layer and the negative electrode layer may be, for example, 1 μm or more and 15 μm or less, particularly 1 μm or more and 5 μm or less.

[0038] (End face electrode) Generally, an end face electrode 140 is provided on the solid battery. In particular, the end face electrode 140 is provided on the side surface of the solid battery. More specifically, a positive electrode side end face electrode connected to the positive electrode layer and a negative electrode side end face electrode connected to the negative electrode layer are provided (see FIG. 1). Such an end face electrode preferably comprises a material having a high conductivity. Specific materials for the end face electrode are not particularly limited, but examples include at least one selected from the group consisting of silver, gold, platinum, aluminum, copper, tin, and nickel.

[0039] (Coating portion) The solid battery module may include a coating portion that covers the solid battery. The coating portion is at least a layer that covers the periphery of the solid battery. As shown in FIGS. 1 and 2, the solid battery 100 may be largely wrapped as a whole by the coating portion 500. In other words, the solid battery 100 may be covered with the coating portion 500 so as to be entirely surrounded.

[0040] The covering portion shields the solid-state battery from the external environment by covering the solid-state battery. By doing so, deterioration of battery characteristics due to water vapor (more specifically, the event where water vapor in the external environment mixes in and degrades the characteristics of the solid-state battery) can be further suppressed. Note that the "water vapor" referred to in this specification is not particularly limited to gaseous water, and also includes water in a liquid state, etc. That is, regardless of the physical state, the term "water vapor" is used to broadly include matters related to water. Thus, "water vapor" can also be referred to as moisture, etc., and particularly as liquid water, it can also include condensed dew water formed by gaseous water.

[0041] The covering portion may include a covering insulating layer and a covering inorganic layer located outside the covering insulating layer. For example, as shown in FIGS. 1 and 2, the covering insulating layer 510 may be provided so as to cover the solid-state battery 100 and the electronic component 600 on the first substrate. In other words, the solid-state battery 100 and the electronic component 600 may be entirely wrapped by the covering insulating layer 510. The covering inorganic layer 520 may be positioned relatively farther from the solid-state battery 100 than the covering insulating layer 510. In other words, the covering inorganic layer 520 may be provided so as to cover the covering insulating layer 510. Since the covering inorganic layer 520 is positioned outside the covering insulating layer 510, together with the covering insulating layer 510, it has a form of covering the periphery of the solid-state battery 100.

[0042] (Covering insulating layer) The covering insulating layer may be of any type as long as it exhibits insulation. For example, the covering insulating layer preferably corresponds to a resin layer. That is, it is preferable that the covering insulating layer contains resin and that the resin forms the base material of the layer.

[0043] The material of the coating insulating layer may be of any type as long as it exhibits insulation properties. For example, the coating insulating layer may contain resin, and the resin may be either a thermosetting resin or a thermoplastic resin. The coating insulating layer may contain an inorganic filler. However, this is merely an example, and the coating insulating layer may be composed of an epoxy resin containing inorganic fillers such as SiC, SiO2, SiN, etc. The resistivity of the coating insulating layer may be, for example, 10 6 Ω·cm or more.

[0044] (Coated inorganic layer) The coated inorganic layer may have, for example, a film form. Furthermore, the coated inorganic layer can also adopt a form that covers the side surface of the substrate. The coating insulating layer and the coated inorganic layer cooperate to form a suitable water vapor barrier, and the coated inorganic layer also cooperates with the coating insulating layer to form a suitable water vapor barrier.

[0045] As used herein, the "barrier" means having a water vapor permeation blocking property to such an extent that water vapor in the external environment does not pass through the substrate and cause inconvenient characteristic deterioration for the solid battery. Narrowly speaking, it means that the water vapor transmission rate is less than 5×10 -3 g / (m 2 ·Day). Specifically speaking, the water vapor barrier layer preferably has a water vapor transmission rate of 0 or more and less than 5×10 -3 g / (m 2 ·Day).

[0046] The material of the coated inorganic layer is not particularly limited and may be a metal, glass, oxide ceramics, or a mixture thereof, etc. In a certain preferred embodiment, the coated inorganic layer contains a metal component. The thickness of the coated inorganic layer may be 0.1 μm or more and 100 μm or less, and may be, for example, 1 μm or more and 50 μm or less.

[0047] (Metal pad) From the viewpoint of strengthening the bonding between the coated inorganic layer and the substrate, a metal pad may be interposed between the coated portion and the substrate. For example, as shown in FIG. 1, metal pads 523 may be provided on the first substrate 200A and the second substrate 200B, and a coated inorganic layer 520 may be provided so as to cover the metal pads 523. Such metal pads 523 may be provided, for example, at the peripheries on the bottom surface side of the first substrate 200A and the top surface side of the second substrate 200B as shown in FIG. 1. In particular, when the substrate is made of ceramic or the like, it is preferable to provide metal pads.

[0048] [Feature portion of the present invention] Hereinafter, the feature portion of the present invention will be described. The description will be made with reference to the drawings. The illustrated content is merely schematic and exemplary for understanding the present invention, and the appearance and dimensional ratios may be different from the actual ones. In each drawing, members having the same function may be denoted by the same reference numerals. In the embodiments described below, descriptions of matters common to the foregoing may be omitted, and only the different points may be described. Also, the various embodiments described below may be implemented in any combination and are not limited to only the embodiments described in the present application.

[0049] As shown in FIGS. 1 and 2, a solid-state battery module 1000 according to an embodiment includes a first substrate 200A having wiring, a solid-state battery 100 disposed on the first substrate 200A, and a second substrate 200B disposed above the solid-state battery 100 and having a coil portion 300 internally provided that can be electrically connected to the first substrate 200A. The top surface of the second substrate 200B is positioned along the module top surface or inside the module top surface. The second substrate 200B having the coil portion 300 that can be electrically connected to the first substrate is disposed on the side opposite to the first substrate 200A with the solid-state battery 100 interposed therebetween.

[0050] In the solid-state battery module 1000 shown in FIGS. 1 and 2, a first substrate 200A, a solid-state battery 100, and a second substrate 200B are arranged in this order. The coil portion 300 is provided inside the second substrate 200B. When the coil portion 300 receives a magnetic field, an induced current is generated in the coil portion 300. The induced current flows to the solid-state battery 100 through the first substrate 200A having a wiring electrically connected to the coil portion 300, and the solid-state battery 100 is charged. The solid-state battery module 1000 can be mounted on a mounting substrate via the first substrate 200A. In this specification, an alternating magnetic field generated by alternating current may be simply referred to as a "magnetic field".

[0051] The module top surface means the module outer surface on the top surface side of the solid-state battery module among the module outer surfaces forming the outer contour of the solid-state battery module. As shown in FIGS. 1 and 2, the main surface of the solid-state battery module 1000 relatively proximal to the second substrate 200B is the top surface 1100 of the solid-state battery module. In this specification, the top surface 1100 of the solid-state battery module is also simply referred to as the module top surface 1100. On the other hand, the main surface of the solid-state battery module 1000 relatively proximal to the first substrate 200A is the bottom surface 1200 of the solid-state battery module. The surface connecting the top surface 1100 of the solid-state battery module and the bottom surface 1200 of the solid-state battery module is the side surface 1300 of the solid-state battery module. In this specification, the side surface 1300 of the solid-state battery module is also simply referred to as the module side surface 1300. Since the solid-state battery module 1000 can be mounted on a mounting substrate via the first substrate 200A, the bottom surface 1200 of the solid-state battery module can also be said to be a mounting surface.

[0052] "The top surface of the second substrate 200B is along the module top surface" means that the top surface of the second substrate 200B and the module top surface are located on the same plane. Specifically, it means that among the main surfaces of the second substrate, the main surface relatively distal from the solid-state battery and the module top surface are located on the same plane. Note that the top surface of the second substrate 200B means the main surface on the proximal side with respect to the module top surface side among the main surfaces of the second substrate.

[0053] In the embodiments shown in FIGS. 1 and 2, the top surface of the second substrate 200B that houses the coil portion 300 inside is disposed inside the module top surface 1100. "Inside the module top surface" means the direction from the module top surface 1100 toward the inside of the solid-state battery module 1000 (for example, the solid-state battery 100).

[0054] According to the above embodiments, the solid-state battery module of the present disclosure can achieve the following effects.

[0055] In a solid-state battery module having a wireless power supply mechanism or a wireless communication mechanism, a coil portion for transmitting and receiving electromagnetic waves is required. The coil portion may be disposed separately from the solid-state battery module. For example, the coil portion may be disposed on the solid-state battery module by external attachment. When the coil portion is disposed separately from the solid-state battery module, the total size of the solid-state battery module and the coil portion may increase.

[0056] In the solid-state battery module of the present disclosure, the coil portion is positioned inside the second substrate. The top surface of the second substrate that houses the coil portion inside is positioned along the module top surface or inside the module top surface. The module top surface is the outer surface of the solid-state battery module that forms the outer contour of the solid-state battery module. Therefore, the top surface of the second substrate including the coil portion is positioned on the same plane as the outer surface of the solid-state battery module or inside the outer surface of the solid-state battery module. That is, the coil portion is disposed inside the solid-state battery module. In such an arrangement of the coil portion, since there is no need for an arrangement location for disposing the coil portion separately from the solid-state battery module, the total size of the solid-state battery module and the coil portion can be reduced.

[0057] The coil part has a specific inductance value, and the inductance value of the coil part can be affected by other components provided in the solid-state battery module. For example, the wiring provided in the solid-state battery module can have its own specific inductance value. Since the inductance value of the coil part connected to the wiring can be the combined inductance value with the inductance value specific to the wiring, it can deviate from the inductance value specific to the coil part. Also, when the positional relationship between the coil part and other components provided in the solid-state battery module changes, the length from the coil part to other components that can be connected to the coil part changes, so the inductance value of the coil part can change.

[0058] In a conventional solid-state battery module, since the coil part may be arranged separately from the solid-state battery module, the arrangement location of the coil part can vary from one solid-state battery module to another. For example, in a conventional solid-state battery module, the coil part may be provided relatively closer or farther from the solid-state battery module. For such reasons, in a conventional solid-state battery module, it is difficult to stabilize the inductance value of the coil for each solid-state battery module. Therefore, when performing wireless power supply to the solid-state battery module, it is necessary to perform matching for each solid-state battery module.

[0059] Since the solid-state battery module of the present disclosure has a coil part inside, the arrangement location of the coil part can be fixed. Since the arrangement location of the coil part can be fixed, it becomes easier to set the distance between the coil part and other components provided in the solid-state battery module to a predetermined distance. That is, the inductance value of the coil part for each solid-state battery module becomes easier to stabilize. When the inductance value becomes easier to stabilize, in wireless power supply, it becomes easier to achieve LC frequency matching using the coil part and a capacitor, and it becomes easier to efficiently charge the solid-state battery module.

[0060] The solid-state battery module of the present disclosure can further adopt the following aspects.

[0061] (Magnetic body layer) When a solid-state battery module is placed in an alternating magnetic field environment, an induced current can be generated in a coil portion provided in the solid-state battery module. The alternating magnetic field can also be absorbed by components other than the coil portion constituting the solid-state battery module. For example, the solid-state battery module of the present disclosure includes a covering portion that covers the solid-state battery. Since the covering portion is the outermost package of the solid-state battery module, it can absorb an external alternating magnetic field more than other components. In particular, when the covering portion contains a metal component, an external alternating magnetic field is more likely to be absorbed by the covering portion than by the coil portion. Therefore, the alternating magnetic field may be difficult to transmit to the coil portion.

[0062] From the viewpoint of making it easier to transmit the magnetic field to the coil portion, in one embodiment, a magnetic layer may be provided between the solid-state battery and the second substrate. In other words, a magnetic layer may be provided between the solid-state battery and the coil portion. In the embodiments shown in FIGS. 3 and 4, the magnetic layer 700 is provided below the second substrate 200B. Since the magnetic layer 700 has a higher magnetic permeability than other components constituting the solid-state battery module relatively, it can act as a magnetic path for magnetic flux passing through the coil portion 300. By providing the magnetic layer 700 below the second substrate 200B, an external magnetic field is more likely to be attracted relatively more to the coil portion built in the second substrate 200B above the magnetic layer 700. That is, it becomes easier to efficiently convert an external magnetic field into an induced current, and the charging efficiency of the solid-state battery can be improved.

[0063] From the viewpoint of attracting the magnetic field more to the coil portion, the thickness of the magnetic layer may be 50 μm or more, preferably 75 μm or more, more preferably 100 μm or more, and still more preferably 150 μm or more. From the viewpoint of reducing the thickness of the solid-state battery module, the thickness of the magnetic layer may be 500 μm or less, preferably 400 μm or less, more preferably 300 μm or less, and still more preferably 250 μm or less.

[0064] The thickness of the magnetic layer may be greater than the thickness of the electrode layer of the solid-state battery. Specifically, the thickness of the magnetic layer may be greater than the thickness of the positive electrode layer or the negative electrode layer of the solid-state battery. From the perspective of attracting the magnetic field more strongly to the coil portion, the thickness of the magnetic layer may be at least twice, preferably at least three times, more preferably at least five times, and even more preferably at least eight times greater than the positive electrode layer or the negative electrode layer. From the perspective of reducing the thickness of the solid-state battery module, the thickness of the magnetic layer may be at most 25 times, preferably at most 20 times, more preferably at most 15 times, and even more preferably at most 13 times.

[0065] The magnetic layer may be, for example, a layer containing a magnetic material and a resin. The magnetic material may be contained in the magnetic layer in a particulate form. As the resin, a thermoplastic resin or a thermosetting resin may be used.

[0066] As the magnetic material contained in the magnetic layer, a soft magnetic material may be used. For example, as the soft magnetic material, iron, silicon steel, permalloy, sendust alloy, permendur, ferrite, amorphous magnetic alloy, magnetic stainless steel, etc. may be used. As the ferrite, Ni-Zn-Cu-based ferrite, Mn-Zn-based ferrite, etc. may be used.

[0067] As the thermoplastic resin contained in the magnetic layer, at least one selected from the group consisting of polyamide resin, polycarbonate resin, polyphenylene sulfide resin, aromatic polyether ketone resin, and thermoplastic polyimide resin may be used.

[0068] As the thermosetting resin contained in the magnetic layer, one or more selected from the group consisting of epoxy resin, phenol resin, melamine resin, unsaturated polyester resin, silicone resin, and thermosetting polyimide resin may be used.

[0069] The magnetic layer may be, for example, a plate-shaped one formed by rolling a mixture of the above magnetic material and the above resin to an arbitrary thickness. Alternatively, a commercially available magnetic layer containing the above magnetic material and the above resin may be used.

[0070] In one embodiment, a magnetic layer is provided between the solid-state battery and the coil portion, and the magnetic layer may be disposed adjacent to the second substrate side relative to the solid-state battery. Preferably, the magnetic layer may be in contact with the second substrate side. By adopting such an arrangement form of the magnetic layer, the distance between the magnetic layer and the coil portion built in the second substrate becomes shorter, so that an external magnetic field is more easily attracted to the coil portion. That is, it becomes easier to efficiently convert an external magnetic field into an induced current, and the solid-state battery can be charged more efficiently. In the solid-state battery module, as described above, since the magnetic layer attracts an external magnetic field to the coil portion, the magnetic layer can be said to be a magnetic field attraction layer to the coil portion.

[0071] The magnetic layer may have a relatively high magnetic permeability compared to each component constituting the solid-state battery module. Therefore, an external magnetic field can be absorbed more by the magnetic layer than by each component constituting the solid-state battery module. In other words, the magnetic layer can suppress the absorption of an external magnetic field by each component constituting the solid-state battery module. In particular, it can suppress the absorption of an external magnetic field by each component containing a metal component. From this point, it can be said that the magnetic layer is a magnetic field absorption suppression layer to the metal side.

[0072] In one embodiment, the coil portion may be positioned inside the planar contour of the magnetic layer. Specifically, the coil portion may be positioned inside the region formed by the peripheral portion of the magnetic layer. In the aspect shown in FIG. 5, where the planar contour of the magnetic layer 700 is rectangular, the coil portion 300 is positioned inside the rectangular planar contour formed by the magnetic layer 700. By adopting such a positional relationship between the magnetic layer 700 and the coil portion 300, an external magnetic field attracted by the magnetic layer 700 can easily pass through the entire coil portion. That is, it becomes easier to efficiently convert an external magnetic field into an induced current, and the solid-state battery can be charged more efficiently.

[0073] Hereinafter, the first substrate and the second substrate included in the solid-state battery module of the present disclosure will be described.

[0074] (The first substrate and the second substrate) As shown in FIG. 1, a solid-state battery module 1000 according to an embodiment includes a first substrate 200A with wiring, a solid-state battery 100 disposed on the first substrate 200A, and a second substrate 200B disposed on the solid-state battery 100 and having a coil portion 300 therein that can be electrically connected to the first substrate 200A.

[0075] The first substrate includes wiring and electronic components. Specifically, a plurality of electronic components are mounted on the first substrate, and each of the plurality of electronic components is electrically connected to each other by wiring provided on the first substrate. Each of the plurality of electronic components and the wiring provided on the first substrate are fixed by solder or the like. The first substrate may include a control circuit for controlling the solid-state battery module, which is composed of the wiring and the plurality of electronic components.

[0076] The first substrate may be provided with battery terminal connection pins for electrically connecting the first substrate and the solid-state battery. As shown in FIG. 1, one of the battery terminal connection pins 142 is connected to the first substrate 200A, and the other of the battery terminal connection pins 142 is connected to the connection electrode 141. The connection electrode 141 is connected to the end face electrode 140. The battery terminal connection pin 142 enables the transfer of electricity between the first substrate 200A and the solid-state battery 100.

[0077] A resist layer may be disposed on the first substrate. As shown in FIGS. 1 and 2, the resist layer 220 may be provided particularly on the main surface of the first substrate 200A. The resist layer 220 is a layer that at least partially covers the substrate surface so that physical processing or chemical reactions do not reach it. In the aspect shown in FIG. 1, a resist layer 220 is provided on the first substrate 200A, and a plurality of electronic components 600 are provided on the resist layer 220. Wiring 210 is provided in the resist layer 220. The wiring 210 in the resist layer 220 and the electronic components 600 are connected by solder 215 or the like. Through the wiring 210 in the resist layer 220, the plurality of electronic components 600 and the wiring 210 in the first substrate 200A are electrically connected.

[0078] The second substrate includes a coil portion. The coil portion may be provided on the second substrate and may have a portion provided inside the second substrate and a portion exposed on the second substrate. Specifically, the coil portion is mainly disposed inside the second substrate, and a part of it is positioned on the upper surface of the second substrate. In other words, the portion of the coil portion embedded inside the second substrate is relatively larger than the portion exposed on the upper surface of the second substrate. Also, a part of the coil portion does not necessarily have to be positioned on the upper surface of the second substrate, and the entire coil portion may be positioned inside the second substrate. As shown in FIGS. 1 and 2, the coil portion 300 is connected to a wiring 210 provided on the second substrate 200B. The wiring 210 provided on the second substrate 200B is electrically connected to the first substrate 200A.

[0079] The coil portion provided on the second substrate may be provided parallel to the second substrate. For example, the coil portion may be provided laminated on the second substrate. For example, like the module top surface 1100 shown in FIG. 5, the coil portion 300 may be configured to draw a helix in a direction substantially parallel to the module top surface 1100. Since the coil portion 300 is covered by a resist layer 220 to be described later, it is positioned inside the module top surface 1100.

[0080] A resist layer may be disposed on the second substrate. As shown in FIGS. 1 and 2, the resist layer 220 may be particularly provided on the main surface of the second substrate 200B. The resist layer 220 is a layer that at least partially covers the substrate surface so that physical processing or chemical reactions do not reach it. In the aspect shown in FIG. 1, a resist layer 220 is provided on the second substrate 200B. The resist layer 220 provided on the second substrate 200B becomes the outermost layer of the solid battery module 1000 and can at least constitute the module top surface 1100.

[0081] As the first substrate and the second substrate, a printed circuit board can be used. The type thereof is not particularly limited, and it may be a resin substrate or a ceramic substrate. Further, it may be a rigid substrate or a flexible substrate. Note that examples of the ceramic substrate include an alumina substrate, an LTCC substrate, and an HTCC substrate. The resin substrate may be a material in which a resin is impregnated into a base material. Examples of the base material include paper, glass fiber cloth, and resin film. The resin may be a thermoplastic resin and / or a thermosetting resin. For example, a paper phenolic substrate in which a paper base material is impregnated with a phenolic resin, a paper epoxy substrate in which a paper base material is impregnated with an epoxy resin, a glass epoxy substrate in which a glass fiber cloth is impregnated with an epoxy resin, a flexible substrate using polyimide or PET (polyethylene terephthalate) resin, and the like can be mentioned. As the wiring provided on the substrate, at least one or more metals selected from the group consisting of Cu, Ni, Ag, Au, and Pt may be used.

[0082] The first substrate preferably serves as a member for electrically connecting the modularized solid battery to the outside. That is, it can be said that the substrate serves as a terminal substrate for the external terminals of the solid battery. FIG. 10 shows the bottom surface 1200 of the solid battery module. Such a bottom surface 1200 is the main surface of the first substrate. As shown in FIG. 10, a back surface pad (specifically, a metal foil) 211 that can function as an external terminal is provided on the first substrate. The solid battery module including such a substrate can mount the solid battery on another secondary substrate such as a printed wiring board with the substrate interposed therebetween. For example, it can be surface-mounted using solder or a conductive paste. From this, the solid battery module of the present invention is preferably an SMD (SMD: Surface Mount Device) type battery module.

[0083] Hereinafter, modes that the covering portion provided in the solid battery module of the present disclosure can take will be described.

[0084] In one embodiment, a coating inorganic layer is provided on the solid-state battery module, and the coating inorganic layer may be provided along the side surface of the solid-state battery module. In other words, the coating inorganic layer may at least constitute the side surface portion of the module. In the embodiments shown in FIGS. 1 and 2, the coating inorganic layer 520 is provided so as to cover each side surface 1300 of the solid-state battery module 1000. Specifically, the coating inorganic layer 520 covers the coating insulating layer 510 that covers the periphery of the solid-state battery 100, the side surface of the first substrate, and the side surface of the second substrate. By providing the coating inorganic layer 520 along the side surface of the solid-state battery module, the intrusion of water into the solid-state battery module can be further suppressed. In order to preferably exhibit the water vapor barrier of the coating inorganic layer 520, the coating inorganic layer 520 may cover the entire each side surface 1300 of the solid-state battery module 1000.

[0085] In one embodiment, the coating inorganic layer may be provided along the top surface of the solid-state battery module. Specifically, the coating inorganic layer may be provided so as to cover a part of the top surface of the solid-state battery module. In the embodiments shown in FIGS. 1 and 2, the coating inorganic layer 520 is provided so as to cover the periphery (or peripheral portion) of the module top surface 1100. The contour shape of the coating inorganic layer 520 covering the module top surface 1100 corresponds to the contour of the module top surface 1100. In the embodiment shown in FIG. 5, the contour shape of the coating inorganic layer 520 covering the module top surface 1100 is a rectangular and annular contour shape. Since the contour shape of the coating inorganic layer 520 covering the module top surface 1100 is rectangular and annular, it has an outer contour forming the outer contour of the "ring" and an inner contour forming the inner contour of the "ring". By providing the coating inorganic layer so as to cover a part of the top surface of the solid-state battery module, the coil portion provided inside the second substrate is less likely to be covered by the coating inorganic layer. Therefore, the coil portion is more likely to receive an external magnetic field, and the charging efficiency of the solid-state battery can be further improved.

[0086] When the aspects of FIGS. 1, 2, and 5 are captured from another perspective, it can be said that the coating inorganic layer 520 includes a discontinuous region of the coating inorganic layer 520 on the module top surface 1100 side. The "discontinuous region" means a region including a portion covered by the coating inorganic layer 520 and a portion not covered by the coating inorganic layer 520. For example, on the module side surface 1300 side of FIGS. 1, 2, and 5, since the coating inorganic layer 520 covers the entire module side surface 1300, a continuous region of the coating inorganic layer 520 is formed. On the other hand, on the module top surface 1100 side, since the coating inorganic layer 520 does not cover the entire module top surface 1100 but only a part of the top surface, a discontinuous region of the coating inorganic layer is formed. In other words, on the module top surface 1100 side, it can be said that a part of the second substrate 200B is exposed. On the module top surface side, by including the discontinuous region of the coating inorganic layer, it becomes difficult for the coil portion provided inside the second substrate to be covered by the coating inorganic layer. Therefore, the coil portion is more likely to receive an external magnetic field, and the charging efficiency of the solid-state battery can be further improved.

[0087] In one embodiment, the coating inorganic layer may be provided along the bottom surface of the solid-state battery module. The form of the coating inorganic layer provided on the module bottom surface may be the same as the form of the coating inorganic layer provided on the module top surface.

[0088] In one embodiment, where the coating inorganic layer covers the module side surface portion, it may constitute at least a part of one of the module top surface and the module bottom surface continuous with the module side surface portion. In the aspect shown in FIG. 1, the coating inorganic layer 520 covering the periphery of the module top surface 1100 is continuous with the coating inorganic layer 520 covering the module side surface 1300. When captured from another perspective, the coating inorganic layer 520 covers the side surface of the second substrate 200B, and the second It can be said that a part of the upper main surface of the second substrate 200B that is continuous with the side surface of the substrate 200B is further covered. Similarly, the covering inorganic layer 520 covers the side surface of the first substrate 200A, and it can be said that a part of the upper main surface of the first substrate 200A that is continuous with the side surface of the first substrate 200A is further covered. By adopting such a configuration, the coil portion 300 is more likely to receive an external magnetic field, and the charging efficiency of the solid-state battery 100 can be further improved. In addition, it becomes easier to suppress the intrusion of water into the solid-state battery module.

[0089] In one embodiment, in a cross-sectional view, the outer contour of the magnetic layer may be on or inside the inner contour of the covering inorganic layer. In other words, the outer contour of the magnetic layer may overlap the inner contour of the covering inorganic layer, or may be located within the region formed by the inner contour of the covering inorganic layer. Specifically, in the aspect shown in FIG. 5, the outer contour of the magnetic layer 700 is surrounded by the inner contour of the covering inorganic layer 520. In the aspect shown in FIG. 3, the portion corresponding to the outer contour of the magnetic layer 700 in FIG. 5 is inside the portion corresponding to the inner contour of the covering inorganic layer 520 in FIG. 5. That is, in the stacking direction of the solid-state battery, the portion corresponding to the outer contour of the magnetic layer 700 and the portion corresponding to the inner contour of the covering inorganic layer 520 do not overlap each other. By adopting such an aspect, since the covering inorganic layer cannot be positioned on the magnetic layer 700, the magnetic field attracted to the magnetic layer 700 and the magnetic field coming out of the magnetic layer 700 are less likely to be absorbed by the covering inorganic layer. Therefore, it becomes easier to efficiently convert the magnetic field into an induced current, and the charging efficiency of the solid-state battery can be improved.

[0090] In one embodiment, the planar contour of the magnetic layer may be surrounded by a coating inorganic layer. Specifically, the coating inorganic layer may be positioned outside the region formed by the peripheral portion of the magnetic layer. The planar contour of the magnetic layer means the contour shape when the magnetic layer is viewed in plan view. In the embodiment shown in FIG. 5, where the planar contour of the magnetic layer 700 is rectangular, the coating inorganic layer 520 is positioned outside the planar contour of the magnetic layer 700. By adopting such a positional relationship between the magnetic layer 700 and the coating inorganic layer 520, an external magnetic field is more likely to be attracted to the coil portion 300. That is, it becomes easier to efficiently convert an external magnetic field into an induced current, and the solid battery can be charged more efficiently.

[0091] In one embodiment, the coating insulating layer may include a solid battery encapsulation layer that covers the periphery of the solid battery and an electronic component encapsulation layer that covers the periphery of the electronic components provided on the substrate. In the embodiments shown in FIGS. 1 and 2, the solid battery 100 is covered by the solid battery encapsulation layer 511. The electronic components 600 on the first substrate 200A are covered by the electronic component encapsulation layer 512. The materials of the solid battery encapsulation layer 511 and the electronic component encapsulation layer 512 may be the materials of the coating insulating layer exemplified above.

[0092] In one embodiment, the coating inorganic layer may include a metal thin film and a metal plating layer. For example, as shown in FIGS. 1 and 2, the metal thin film 521 may be provided in contact with the coating insulating layer 510. The metal plating layer 522 is provided outside the metal thin film 521, or in other words, may be positioned relatively farther from the solid battery 100 than the metal thin film 521.

[0093] The metal thin film may be a dry plating layer, specifically, a sputtered film. That is, a sputtered film may be provided as the metal thin film in the solid battery module of the present invention. A sputtered film is a thin film obtained by sputtering. That is, a film obtained by sputtering ions onto a target to knock out its atoms and deposit them can be used as a dry plating layer.

[0094] The sputtered film can contribute to preventing water vapor permeation for a solid-state battery because it has a very thin form on the nano- or micro-order scale and yet becomes a relatively dense and / or homogeneous layer. Also, since the sputtered film is formed by atomic deposition, it can adhere more favorably onto the target. Therefore, the sputtered film can be more suitably used as a barrier to prevent water vapor in the external environment from entering the solid-state battery. Therefore, by further having a sputtered film as a dry plating layer in the coating inorganic layer, it becomes possible to further improve the water vapor permeation prevention property for the solid-state battery. Note that the dry plating layer may be formed by other dry plating methods such as vacuum evaporation or ion plating. In a preferred embodiment, the dry plating layer may contain at least one selected from the group consisting of, for example, Al (aluminum), Cu (copper), Ti (titanium), and stainless steel (SUS).

[0095] The thickness of the metal thin film is preferably 1 μm or more and 10 μm or less, more preferably 2 μm or more and 8 μm or less, and even more preferably 3 μm or more and 6 μm or less. By setting the thickness of the metal thin film within the above range, the metal thin film can contribute more suitably to preventing water vapor from entering the solid-state battery.

[0096] The metal plating layer may be a wet plating layer. As shown in FIG. 1, the metal plating layer 522 forms the outermost layer of the coating inorganic layer 520. Since the metal plating layer 522 can be exposed to the external environment, it may have alteration resistance. The metal plating layer 522 preferably contains at least one metal selected from the group consisting of Ni (nickel), Cr (chromium), Pd (palladium), Pt (platinum), and Zn.

[0097] The thickness of the metal plating layer is preferably 1 μm or more and 20 μm or less, more preferably 2 μm or more and 15 μm or less, and particularly preferably 2 μm or more and 10 μm or less. By setting the thickness of the metal plating layer within the above range, alteration of the plating layer can be suitably reduced.

[0098] The possible embodiments of the wiring provided in the solid-state battery module of the present disclosure will be described below.

[0099] (Wiring) In the solid-state battery module of one embodiment, the first substrate and the coil portion are electrically connected to each other. In the embodiments shown in FIGS. 1 and 2, the solid-state battery module 1000 further includes a connection wiring 400 that connects the first substrate 200A and the coil portion 300, whereby the first substrate 200A and the coil portion 300 are electrically connected. The connection wiring 400 is arranged to run along the wall surface of the solid-state battery 100. In the cross-sectional view embodiment of FIG. 1, the connection wiring 400 is provided so as to cross the solid-state battery 100, and the connection wiring 400 is connected to the first substrate 200A via the antenna circuit connection pin 450. Therefore, the coil portion and the solid-state battery are electrically connected via the connection wiring.

[0100] With such an arrangement of the connection wiring 400, the induced current generated in the coil portion 300 can be sent to the first substrate 200A. Also, as shown in FIG. 1, since the electronic component 600 is mounted on the main surface of the first substrate 200A, the induced current generated in the coil portion 300 is supplied to the above-mentioned electronic component. In this regard, it can be said that the coil portion 300 and the electronic component 600 are electrically connected via the connection wiring 400.

[0101] FIG. 6 shows the positional relationship between the coil portion 300 and the connection wiring 400 in FIGS. 1 and 2. As described above, the connection wiring 400 connects the first substrate 200A and the coil portion 300, and the connection wiring 400 and the coil portion 300 are connected via the connection pin 350. As shown in FIG. 6, the connection pin 350 is provided on the coil portion. The connection wiring 400 is connected to the connection pin 350 (not shown). In the embodiment shown in FIG. 6, since four connection pins 350 are provided on the coil portion 300, four connection wirings are provided on the coil portion 300 via the connection pins.

[0102] Note that by changing the installation location of the connection pins 350 provided on the coil portion 300, the installation location of the connection wiring 400 provided on the solid-state battery module 1000 can be changed. Similarly, by changing the number of connection pins 350 provided on the coil portion 300, the number of connection wiring 400 provided on the solid-state battery module 1000 can be changed. For example, as shown in FIG. 8, by setting the number of connection pins provided on the coil portion 300 to two, the number of connection wiring can be set to two.

[0103] In one embodiment, the coil portion and the metal wiring may be connected by connecting pins, and the position where the connection wiring is provided may be adjusted. In the embodiments shown in FIGS. 6 and 7, a metal wiring 370 is provided at the tip of the coil portion 300. Specifically, the coil portion 300 and the metal wiring 370 are fixed by connecting pins 360. In such an embodiment, it can be said that the coil portion 300 is extended by the metal wiring 370. As shown in FIG. 6, another metal wiring 375 may be provided on the metal wiring 370. By connecting the coil portion and the metal wiring, the degree of freedom in the location where the connection wiring is provided can be further improved.

[0104] In one embodiment, two or more connection wirings may be provided in the solid-state battery module. For example, the connection wiring may be provided only along one side surface of the solid-state battery module, or may be provided along two or more side surfaces. For example, one or more connection wirings may be provided along one side surface.

[0105] FIG. 1 shows a cross-sectional view cut along the side surface of the solid-state battery module 1000. The embodiment shown in FIG. 1 has two connection wirings 400 arranged on the side surface of the solid-state battery 100. FIG. 2 shows a cross-sectional view of the solid-state battery module 1000 cut along the module side surface 1300 shown in FIG. 1. The embodiment shown in FIG. 2 has two connection wirings 400 arranged on the side surface of the solid-state battery 100. That is, the solid-state battery module 1000 shown in the embodiments of FIGS. 1 and 2 is provided with a total of four connection wirings 400.

[0106] In one embodiment, the solid-state battery module may be provided with connection wiring in a U-shape (or a U-shaped). In other words, the solid-state battery module may be provided with connection wiring having a plurality of bent portions. FIG. 8 is a cross-sectional view schematically showing the configuration of a solid-state battery module according to one embodiment. FIG. 9 is a cross-sectional view schematically showing a cross-section when the solid-state battery module of FIG. 8 is cut along side surface 1300. In the aspect shown in FIG. 9, two or more connection wirings are arranged in the solid-state battery module 1000. Specifically, the first connection wiring 410 and the second connection wiring 420 extend in a first direction from the first substrate 200A toward the coil portion 300. Further, a third connection wiring 430 connecting the first connection wiring 410 and the second connection wiring 420 is arranged. The third connection wiring 430 extends in a second direction intersecting the first direction.

[0107] As shown in FIG. 9, the first connection wiring 410, the second connection wiring 420, and the third connection wiring 430 form connection wiring whose appearance depicts a U-shape (or a U-shaped). In other words, connection wiring having two bent portions is formed. The connection wiring having such a form is provided so as to straddle the solid-state battery.

[0108] When the connection wiring composed of the first, second, and third connection wirings is provided on the first substrate, the first connection wiring and the second connection wiring can be positioned on the first substrate at the same time. That is, instead of separately providing each of the first connection wiring and the second connection wiring on the first substrate, it becomes easier to provide the first connection wiring and the second connection wiring on the first substrate at the same time, so that the manufacture of the solid-state battery module becomes simpler and the manufacturing efficiency can be improved.

[0109] (Waterproof barrier film) In one embodiment, a water-resistant barrier film may be provided between the substrate and the solid-state battery. As shown in FIG. 1, a water-resistant barrier film 800 may be provided between the first substrate 200A and the solid-state battery 100, and / or a water-resistant barrier film 800 may be provided between the second substrate 200B and the solid-state battery 100. By providing the water-resistant barrier film 800, inconvenient permeation such as water vapor in the external environment reaching the solid-state battery via the substrate can be reduced, so that deterioration of the solid-state battery characteristics can be reduced in the long term.

[0110] In the embodiment shown in FIG. 1, the water-resistant barrier film 800 is provided on the main surface of the first substrate 200A that is proximal to the solid-state battery 100. Similarly, the water-resistant barrier film 800 is provided on the main surface of the second substrate that is proximal to the solid-state battery. The water-resistant barrier films 800 provided on the first substrate 200A and the second substrate 200B are provided along the main surfaces of the respective substrates. The peripheral portion of the water-resistant barrier film 800 may be in contact with the coating inorganic layer 520. Also, the main surface of the water-resistant barrier film 800 is provided so as to be in contact with the coating insulating layer 510. In the case of the embodiment having the magnetic layer 700 shown in FIGS. 3 and 4, the water-resistant barrier film 800 can be provided between the magnetic layer 700 and the second substrate 200B.

[0111] The water-resistant barrier film is not particularly limited as long as it is a material exhibiting insulating properties. Specific examples of such materials include, for example, inorganic insulators such as glass and alumina, organic insulators such as resins, etc. These may be used alone or in combination of two or more.

[0112] The wireless power supply of the solid-state battery module of the present disclosure will be described below.

[0113] The first substrate may include a wireless power supply circuit. The wireless power supply circuit may include wiring, a plurality of electronic components, and a coil portion provided inside the second substrate. Specifically, the wireless power supply circuit is composed of a plurality of circuits. For example, the wireless power supply circuit may include a power receiving circuit, a step-up / down circuit, and a battery charging circuit.

[0114] In the power receiving circuit, power can be wirelessly transmitted from the outside (for example, the power transmission unit). The power receiving circuit may include a coil unit provided on the second substrate, a capacitor, a resistor, and a rectifier circuit. The coil unit provided on the second substrate generates an induced current by receiving electromagnetic waves from the outside.

[0115] The rectifier circuit rectifies the induced current generated in the coil unit and converts alternating current into direct current. The rectifier circuit may be a diode bridge circuit. A smoothing capacitor may be connected to the output of the rectifier circuit, whereby the output voltage output from the rectifier circuit can be smoothed.

[0116] The buck-boost circuit performs voltage conversion of the input voltage. The buck-boost circuit may receive a voltage smoothed after rectification. For the buck-boost circuit, for example, a DC-DC converter, an LDO (Low Dropout regulator), or the like may be used. A smoothing capacitor may be connected to the output of the buck-boost circuit, and the output voltage output from the buck-boost circuit can be smoothed. The smoothed output voltage of the buck-boost circuit is input to a battery charging circuit that controls the charging of the solid-state battery. The output voltage from the battery charging circuit may be smoothed by a smoothing capacitor and the solid-state battery can be charged by being input to the solid-state battery.

[0117] The wireless power supply circuit may further include other circuits. For example, a wireless communication (wi-fi, Bluetooth, NFC, RF-ID, Zig-Bee, and / or specific low-power wireless, etc.) circuit, a protection circuit, a current path circuit, and / or a sensor circuit, etc. may be provided.

[0118] In one embodiment, the solid-state battery module may include a resonant circuit. In other words, the coil portion and the capacitor provided on the first substrate may resonate. Specifically, it is preferable that the capacitor and the coil portion resonate (that is, match) at a predetermined frequency. The connection between the coil portion and the capacitor may be a parallel connection. Since the received current can increase when the capacitor and the coil resonate, the external magnetic field can be more efficiently converted into an induced current, and the charging efficiency of the solid-state battery can be improved.

[0119] [Method for manufacturing a solid-state battery module] The solid-state battery module of the present disclosure can be obtained by preparing a solid-state battery including a positive electrode layer, a negative electrode layer, and a battery constituent unit having a solid electrolyte between these electrodes, and then going through a process of modularizing the solid-state battery.

[0120] The manufacturing of the solid-state battery of the present invention can be roughly divided into the manufacturing of the solid-state battery itself (hereinafter also referred to as "pre-module battery") corresponding to the pre-module stage, the preparation of the substrate, and the modularization.

[0121] ≪Method for manufacturing a pre-module battery≫ The pre-module battery can be manufactured by a printing method such as a screen printing method, a green sheet method using a green sheet, or a combination thereof. That is, the pre-module battery itself may be manufactured according to a conventional manufacturing method of a solid-state battery (therefore, raw material substances such as the solid electrolyte, organic binder, solvent, optional additives, positive electrode active material, and negative electrode active material described below may be those used in the manufacturing of known solid-state batteries).

[0122] Hereinafter, for better understanding of the present invention, one manufacturing method will be exemplified and described, but the present invention is not limited to this method. Also, matters over time such as the following description order are merely for convenience of explanation and are not necessarily binding thereto.

[0123] (Formation of a laminate block) ·Mix a solid electrolyte, an organic binder, a solvent, and any additives to prepare a slurry. Then, form a sheet containing the solid electrolyte by firing from the prepared slurry. ·Mix a positive electrode active material, a solid electrolyte, a conductive material, an organic binder, a solvent, and any additives to prepare a paste for the positive electrode. Similarly, mix a negative electrode active material, a solid electrolyte, a conductive material, an organic binder, a solvent, and any additives to prepare a paste for the negative electrode. ·Print the paste for the positive electrode on the sheet, and print a current collector layer and / or a negative layer as necessary. Similarly, print the paste for the negative electrode on the sheet, and print a current collector layer and / or a negative layer as necessary. ·Stack the sheet printed with the paste for the positive electrode and the sheet printed with the paste for the negative electrode alternately to obtain a laminate. Regarding the outermost layer (the uppermost layer and / or the lowermost layer) of the laminate, it may be an electrolyte layer, an insulating layer, or an electrode layer.

[0124] (Formation of battery fired body) After integrally pressing the laminate, cut it to a predetermined size. Subject the obtained cut laminate to degreasing and firing. Thereby, a fired laminate is obtained. Note that the laminate may be subjected to degreasing and firing before cutting, and then cutting may be performed.

[0125] (Formation of end face electrodes) The end face electrode on the positive electrode side can be formed by applying a conductive paste to the exposed side surface of the positive electrode in the fired laminate. Similarly, the end face electrode on the negative electrode side can be formed by applying a conductive paste to the exposed side surface of the negative electrode in the fired laminate. The end face electrodes on the positive electrode side and the negative electrode side may be provided so as to extend to the main surface of the fired laminate. As the components of the end face electrode, at least one selected from silver, gold, platinum, aluminum, copper, tin, and nickel can be selected. Note that antimony, bismuth, indium, zinc, aluminum, etc., which form an alloy with tin, may be included.

[0126] Note that the end face electrodes on the positive electrode side and the negative electrode side are not limited to being formed after the firing of the laminate, and may be formed before the firing and subjected to co-firing.

[0127] By going through the above steps, finally, a desired pre-module battery (corresponding to the solid-state battery 100) can be obtained.

[0128] ≪Preparation of Substrate≫ In this step, the substrate is prepared.

[0129] (Preparation of the First Substrate) Although not particularly limited, when using a resin substrate as the substrate, its preparation may be carried out by laminating a plurality of layers and subjecting them to heating and pressure treatment. For example, a resin sheet formed by impregnating a fiber cloth serving as a base material with a resin raw material is used to form a substrate precursor. After the formation of the substrate precursor, this substrate precursor is subjected to heating and pressure using a press machine. On the other hand, when using a ceramic substrate as the substrate, its preparation can be carried out, for example, by thermocompression bonding a plurality of green sheets to form a green sheet laminate, and subjecting the green sheet laminate to firing to obtain a ceramic substrate. The preparation of the ceramic substrate can be carried out, for example, according to the production of an LTCC substrate. The ceramic substrate may have vias and / or lands. In such a case, for example, holes are formed in the green sheet by punch pressing or a carbon dioxide laser, etc., and the holes are filled with a conductive paste material, or precursors of conductive portions such as vias and lands are formed by a printing method or the like using a conductive paste material or solder. Note that lands, etc. can also be formed after the firing of the green sheet laminate.

[0130] Thereafter, a plurality of wirings are formed at predetermined intervals on the main surface of the substrate for electrical connection. Thus, a desired substrate can be obtained.

[0131] (Preparation of the Second Substrate) The method for preparing the second substrate is not particularly limited. For example, the second substrate may be prepared in the same manner as the method for preparing the first substrate. The coil inside the second substrate may be provided inside the second substrate by arranging a conductor material such as wiring in a spiral or helical shape. Specifically, a second substrate including a coil portion inside may be prepared by forming a conductive paste material in a spiral or helical pattern on a substrate by a printing method or the like. The second substrate including a coil portion inside may be a single product or a stacked product of a substrate on which a conductive paste material is formed in a spiral or helical pattern.

[0132] ≪Mounting of Electronic Components etc.≫ Next, at least an electronic component 600 such as a capacitor and a battery terminal connection pin 142 etc. are mounted on a wiring 210 located at a predetermined position of the first substrate 200A (see Fig. 11A). The wiring 210 located at a predetermined position of the first substrate 200A and the electronic component 600 etc. may be fixed by solder 215 etc.

[0133] ≪Modularization≫ First, a covering portion (for example, an electronic component sealing layer 512) is formed on the first substrate 200A on which the electronic component 600 and the battery terminal connection pin 142 etc. are mounted. Specifically, a raw material of a covering insulating layer is supplied so that the electronic components etc. are entirely covered. When the covering insulating layer is made of a resin material, a resin precursor may be provided on the substrate and subjected to curing etc. to mold an electronic component sealing layer. When forming the electronic component sealing layer, at least a part of the battery terminal connection pin 142 is not covered by the electronic component sealing layer and is exposed. A conductive connection electrode 141 is printed on the exposed battery terminal connection pin 142 (see Fig. 11B). Next, a solid-state battery 100 having an end face electrode 140 coated thereon (specifically, a "non-modularized solid-state battery") is mounted on the first substrate 200A so that the end face electrode 140 and the connection electrode 141 are connected (see Fig. 11C).

[0134] After mounting the solid-state battery 100 on the first substrate 200A, the connection wiring 400 is connected to the connection electrode 141 so as to straddle the solid-state battery 100 (see FIG. 11D). After connecting the connection wiring 400, the second substrate 200B is disposed on top of the solid-state battery (see FIG. 11E). Specifically, the second substrate 200B is positioned on top of the solid-state battery, and the second substrate 200B and the connection wiring 400 are connected. More specifically, the second substrate 200B is positioned on top of the solid-state battery so that the wiring 210 provided on the second substrate 200B and the connection wiring 400 are connected.

[0135] After connecting the wiring 210 of the second substrate and the connection wiring 400, a coating insulating layer (for example, the solid-state battery sealing layer 511) is formed (see FIG. 11F). Specifically, the raw material of the coating insulating layer is supplied so as to entirely cover the solid-state battery 100 on the first substrate 200A. When the coating insulating layer is made of a resin material, a resin precursor is provided on the substrate and subjected to curing or the like to mold the coating insulating layer (for example, the solid-state battery sealing layer 511). In a certain preferred embodiment, the solid-state battery sealing layer may be molded by subjecting it to pressure using a mold. By way of example only, the solid-state battery sealing layer that seals the solid-state battery on the substrate may be molded through compression molding. If it is a resin material generally used in a mold, the form of the raw material of the solid-state battery sealing layer may be granular, and its type may be thermoplastic. Note that such molding is not limited to mold molding, and may be performed through polishing, laser processing, and / or chemical treatment or the like. As described above, the solid-state battery is positioned between the first substrate and the second substrate.

[0136] After forming the coating insulating layer (e.g., the solid battery sealing layer), a coating inorganic layer 520 is formed (see FIG. 11F). Specifically, a coating inorganic layer 520 (e.g., a metal thin film 521) is formed on the "precursor for coating in which the solid battery is covered with the solid battery sealing layer on the first substrate". The metal thin film 521 may be formed, for example, by performing dry plating to form a dry plating film as the metal thin film. More specifically, dry plating is performed to form a metal thin film on the exposed surfaces of the precursor for coating and the respective side surfaces (i.e., other than the bottom surface of the first substrate and the top surface of the second substrate) of the first substrate and the second substrate. After forming the metal thin film, a metal plating layer 522 is formed outside the metal thin film 521 (see FIG. 11F). Specifically, the metal plating layer 522 is formed so as to cover the metal thin film 521. The metal plating layer 522 may be formed by performing wet plating. More specifically, wet plating is performed to form a metal plating layer so as to cover the precursor for coating and the metal thin film covering the respective side surfaces of the first substrate and the second substrate. Further, the metal plating layer may be formed so as to cover a part of the bottom surface of the first substrate and / or the top surface of the second substrate. Specifically, the metal plating layer may be formed so as to cover the peripheral portion of the bottom surface of the first substrate and / or the peripheral portion of the top surface of the second substrate.

[0137] Note that, from the viewpoint of making the coil provided inside the second substrate more susceptible to an external magnetic field, a magnetic layer may be provided. The magnetic layer can be obtained, for example, by rolling a mixture of magnetic powder and resin to an arbitrary thickness and forming it into a plate shape. Also, the magnetic layer can be cut to an arbitrary size.

[0138] The magnetic layer obtained by the above method can be provided, for example, during the step of disposing the second substrate on top of the solid battery. Specifically, a magnetic layer cut to an arbitrary size may be installed on the second substrate, and the second substrate on which the magnetic layer is installed may be disposed on top of the solid battery. For example, the second substrate on which the magnetic layer is installed may be disposed on top of the solid battery such that the magnetic layer installed on the second substrate and the solid battery face each other. As a method of installing the magnetic layer on the second substrate, the magnetic layer may be attached to the second substrate using an adhesive or the like.

[0139] By going through the steps as described above, a module product in which the solid-state battery on the substrate is covered by the covering portion can be obtained. That is, the "solid-state battery module" according to the present invention can be finally obtained. Since the coil portion is provided inside the second substrate in the solid-state battery module obtained by going through such steps, the total size of the solid-state battery module and the coil portion is likely to be relatively small. In addition, since the position of the coil portion is likely to be fixed, the inductance value of the coil portion is likely to be stable, and the need to perform matching for each solid-state battery module can be reduced. Therefore, it becomes possible to efficiently perform wireless power supply and the like.

[0140] As described above, the embodiments of the present invention have been described, but they are merely illustrative of typical examples. Therefore, it will be easily understood by those skilled in the art that the present invention is not limited thereto and various aspects are conceivable.

[0141] Aspects of the solid-state battery module of the present disclosure are as follows. <1> A solid-state battery module comprising a first substrate having wiring, a solid-state battery disposed on the first substrate, and a second substrate disposed above the solid-state battery and having a coil portion therein that can be electrically connected to the first substrate, wherein the top surface of the second substrate is positioned along the module top surface or inside the module top surface. <2> The solid-state battery module according to <1>, wherein a magnetic layer is provided between the solid-state battery and the second substrate. <3> The solid-state battery module according to <2>, wherein the magnetic layer is disposed adjacent to the second substrate side rather than the solid-state battery side. <4> The solid-state battery module according to <2> or <3>, wherein the magnetic layer is in contact with the second substrate side. <5> The solid-state battery module according to any one of <2> to <4>, wherein the coil portion is positioned inside the planar contour of the magnetic layer. <6>Further comprising a covering portion covering the solid battery, the covering portion including a covering insulating layer and a covering inorganic layer located outside the covering insulating layer, and a planar contour of the magnetic body layer being surrounded by the covering inorganic layer, the solid battery module according to any one of <2> to <5>. <7>In a cross-sectional view, an outer contour of the magnetic body layer is on an inner contour of the covering inorganic layer or inside the inner contour, the solid battery module according to <6>. <8>The solid battery includes an electrode layer, and a thickness of the magnetic body layer is thicker than a thickness of the electrode layer of the solid battery, the solid battery module according to any one of <2> to <7>. <9>The magnetic body layer is a magnetic field attracting layer to the coil portion, the solid battery module according to any one of <2> to <8>. <10>The magnetic body layer is a metal absorption suppression layer, the solid battery module according to any one of <2> to <9>. <11>Further comprising a covering portion covering the solid battery, the covering portion including a covering insulating layer and a covering inorganic layer located outside the covering insulating layer, and including a discontinuous region of the covering inorganic layer on a module top surface side, the solid battery module according to any one of <1> to <5>. <12>The covering inorganic layer constitutes at least a module side surface portion, the solid battery module according to <11>. <13>The covering inorganic layer further constitutes at least a part of a module top surface and a module bottom surface continuous with the module side surface portion, the solid battery module according to <11> or <12>. <14>The covering inorganic layer covers at least a side surface of the second substrate, the solid battery module according to any one of <11> to <13>. <15>The covering inorganic layer further covers at least a part of an upper main surface of the second substrate continuous with the side surface of the second substrate, the solid battery module according to any one of <11> to <14>. <16>Further comprising a connection wiring connecting the first substrate and the coil portion, the solid battery module according to any one of <1> to <115>. <17>Two or more of the connection wirings are arranged, and the first and second connection wirings extend in a first direction from the first substrate toward the coil portion. A third connection wiring connecting the first and second connection wirings is arranged, and the third connection wiring extends in a second direction intersecting the first direction. The solid-state battery module according to <16>. <18>An electronic component is mounted on the upper main surface of the first substrate, and the coil portion and the electronic component are electrically connected via the connection wiring. The solid-state battery module according to <16> or <17>. <19>The coil portion and the solid-state battery are electrically connected via the connection wiring. The solid-state battery module according to any one of <16> to <18>.

Industrial Applicability

[0142] The solid-state battery module of the present invention can be used in various fields where battery use or power storage is assumed. Although it is only an example, the solid-state battery module of the present invention is used in the fields of electricity, information, and communication where mobile devices are used (for example, mobile phones, smartphones, notebook computers, digital cameras, activity meters, arm computers, electronic paper, etc., and small electronic devices such as RFID tags, card-type electronic money, smartwatches, etc., or the fields of mobile devices), home and small industrial applications (for example, the fields of power tools, golf carts, home, care, and industrial robots), large industrial applications (for example, the fields of forklifts, elevators, and port cranes), transportation system fields (for example, the fields of hybrid vehicles, electric vehicles, buses, trains, electric assist bicycles, electric motorcycles, etc.), power system applications (for example, the fields of various power generations, load conditioners, smart grids, general household installation-type power storage systems, etc.), medical applications (the fields of medical devices such as earphone hearing aids), pharmaceutical applications (the fields of medication management systems, etc.), as well as the IoT field, space and deep-sea applications (for example, the fields of space exploration machines, submersible research vessels, etc.).

Explanation of Symbols

[0143] 100 Solid battery 110 Positive electrode layer 120 Negative electrode layer 130 Solid electrolyte 140 End face electrode 141 Connection electrode 142 Battery terminal connection pin 200A First substrate 200B Second substrate 210 Wiring 211 Back pad 215 Solder 220 Resist layer 300 Coil part 350 Connection pin 400 Connection wiring 410 First connection wiring 420 Second connection wiring 430 Third connection wiring 450 Antenna circuit connection pin 500 Coating part 510 Coating insulation layer 511 Solid battery sealing layer 512 Electronic component sealing layer 520 Coating inorganic layer 521 Metal thin film 522 Metal plating layer 523 Metal pad 600 Electronic component 700 Magnetic layer 800 Water-resistant barrier film 1000 Solid battery module 1100 Top surface of solid battery module 1200 Bottom surface of solid battery module 1300 Side surface of solid battery module

Claims

1. A solid-state battery module comprising: a first substrate having wiring; a solid-state battery disposed on the first substrate; and a second substrate disposed on top of the solid-state battery and having a coil portion therein that can be electrically connected to the first substrate, wherein the top surface of the second substrate is positioned along the module top surface or inside the module top surface.

2. The solid-state battery module according to claim 1, wherein a magnetic layer is provided between the solid-state battery and the second substrate.

3. The solid-state battery module according to claim 2, wherein the magnetic layer is disposed adjacent to the second substrate side rather than the solid-state battery side.

4. The solid-state battery module according to claim 2 or 3, wherein the magnetic layer is in contact with the second substrate side.

5. The solid-state battery module according to claim 2 or 3, wherein the coil portion is positioned inside the planar contour of the magnetic layer.

6. The solid-state battery module according to claim 2 or 3, further comprising a covering portion covering the solid-state battery, the covering portion including a covering insulating layer and a covering inorganic layer positioned outside the covering insulating layer, and the planar contour of the magnetic layer being surrounded by the covering inorganic layer.

7. The solid-state battery module according to claim 6, wherein in a cross-sectional view, the outer contour of the magnetic layer is on or inside the inner contour of the covering inorganic layer.

8. The solid-state battery module according to any one of claims 2 or 3, wherein the solid-state battery includes an electrode layer, and the thickness of the magnetic layer is greater than the thickness of the electrode layer of the solid-state battery.

9. The solid-state battery module according to any one of claims 2 or 3, wherein the magnetic layer is a magnetic field attraction layer to the coil portion.

10. The solid-state battery module according to any one of claims 2 or 3, wherein the magnetic layer is a magnetic field absorption suppression layer to the metal side.

11. The solid-state battery module according to claim 1 or 2, further comprising a covering portion covering the solid-state battery, the covering portion including a covering insulating layer and a covering inorganic layer positioned outside the covering insulating layer, and including a discontinuous region of the covering inorganic layer on the module top surface side.

12. The solid-state battery module according to claim 11, wherein the covering inorganic layer constitutes at least the module side surface portion.

13. The solid-state battery module according to claim 12, wherein the coated inorganic layer further constitutes at least a part of at least one of the module top surface and the module bottom surface that is continuous with the module side surface.

14. The solid-state battery module according to claim 11, wherein the coated inorganic layer covers at least the side surface of the second substrate.

15. The solid-state battery module according to claim 11, wherein the coated inorganic layer further covers at least a part of the upper main surface of the second substrate that is continuous with the side surface of the second substrate.

16. The solid-state battery module according to claim 1 or 2, further comprising a connection wiring connecting the first substrate and the coil portion.

17. The solid-state battery module according to claim 16, wherein two or more of the connection wirings are arranged, the first and second connection wirings extend in a first direction from the first substrate toward the coil portion, a third connection wiring connecting the first and second connection wirings is arranged, and the third connection wiring extends in a second direction intersecting the first direction.

18. The solid-state battery module according to claim 16, wherein electronic components are mounted on the upper main surface of the first substrate, and the coil portion and the electronic components are electrically connected via the connection wiring.

19. The solid-state battery module according to claim 16, wherein the coil portion and the solid-state battery are electrically connected via the connection wiring.

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