Display device, display module, and method for manufacturing the same

Abstract

A display device, a display module, and a manufacturing method thereof are provided. The display module includes a display panel (1) having a display area (101) and a peripheral area located outside the display area (101), a protective layer (2) provided on one side of the display panel (1) and covering at least a part of the peripheral area (102) and the display area (101), and including a conductive heat dissipation layer (21), a cover plate (3) provided on the side of the display panel (1) away from the protective layer (2), and a conductive medium (4), and the cover plate (3) is electrically connected to the heat dissipation layer (21) via the conductive medium (4). The display module of the present invention can prevent display abnormalities.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and more particularly, to a display device, a display module, and a method for manufacturing a display module.

Background Art

[0002] A display module is an essential component of electronic devices such as mobile phones and personal computers. Here, an OLED (organic light-emitting diode) display module that uses an OLED as a light-emitting element is widely used. However, current display modules also have the problem that display abnormalities such as color deviation are likely to occur and need to be solved urgently.

[0003] Note that the information disclosed in the above background art is described to enhance the understanding of the background of the present invention and may include information that does not constitute prior art known to those skilled in the art.

Summary of the Invention

[0004] An object of the present invention is to provide a display device, a display module, and a method for manufacturing the same.

[0005] According to one aspect of the present invention, there is provided a display module, the display module including: a display panel having a display area and a peripheral area located outside the display area; a protective layer provided on one side of the display panel, covering at least a part of the peripheral area and the display area, and including a conductive heat dissipation layer; a cover plate provided on a side of the display panel away from the protective layer; and a conductive medium, wherein the cover plate is electrically connected to the heat dissipation layer via the conductive medium.

[0006] In an exemplary embodiment of the present invention, the cover plate includes a transparent substrate and a conductive layer. The transparent substrate has an intermediate region and an edge region located outside the intermediate region. The intermediate region covers the display region, and the edge region covers the peripheral region. The conductive layer is provided on a surface of the transparent substrate away from the display panel and is electrically connected to the heat dissipation layer through the conductive medium. The conductive layer includes at least an intermediate conductive wire located in at least the intermediate region.

[0007] In an exemplary embodiment of the present invention, the conductive layer further includes an edge conductive wire. The edge conductive wire is located in the edge region and is provided so as to surround the intermediate region. Each of the intermediate conductive wires is connected to the edge conductive wire, and the edge conductive wire is connected to the heat dissipation layer.

[0008] In an exemplary embodiment of the present invention, the number of the intermediate conductive wires is plural, and they intersect with each other to form a mesh structure.

[0009] In an exemplary embodiment of the present invention, the intermediate conductive wire includes a first intermediate conductive wire and a second intermediate conductive wire. The first intermediate conductive wire extends along the row direction and is distributed at intervals along the column direction. The second intermediate conductive wire extends along the column direction and is distributed at intervals along the row direction. The second intermediate conductive wire is provided so as to intersect with the first intermediate conductive wire.

[0010] In an exemplary embodiment of the present invention, holes are provided in the display region. The conductive layer further includes avoidance conductive wires. At least a part of the orthographic projection of the avoidance conductive wires on the display panel is provided so as to surround the outside of the holes. The avoidance conductive wires are connected to at least one of the intermediate conductive wires.

[0011] In an exemplary embodiment of the present invention, the conductive medium connects the conductive layer and the heat dissipation layer from the outside of the edge of the display panel across the edge of the display panel.

[0012] In an exemplary embodiment of the present invention, the boundary of the heat dissipation layer is located inside the boundary of the transparent substrate, and the heat dissipation layer includes a main body region and a connection region located outside the main body region, and the connection region is connected to the main body region.

[0013] The connection region is connected to the conductive layer through the conductive medium.

[0014] In an exemplary embodiment of the present invention, in a direction parallel to the main body region, the distance between the boundary of the orthographic projection of the connection region on the transparent substrate and the boundary of the transparent substrate is a first distance.

[0015] In a direction parallel to the main body region, the distance between the boundary of the orthographic projection of the main body region on the transparent substrate and the boundary of the transparent substrate is a second distance.

[0016] The first distance is smaller than the second distance.

[0017] In an exemplary embodiment of the present invention, the cover plate further includes an isolation layer made of a transparent insulating material that covers at least the intermediate conductor.

[0018] In an exemplary embodiment of the present invention, the edge region of the transparent substrate is curved toward the side close to the protective layer.

[0019] In an exemplary embodiment of the present invention, the protective layer further includes an adhesive layer provided on a side surface of the display panel away from the cover plate, a buffer layer adhered to a surface of the adhesive layer away from the cover plate, and a reinforcing layer provided on a surface of the buffer layer away from the cover plate, and the heat dissipation layer is provided on a surface of the reinforcing layer away from the cover plate. The heat dissipation layer is provided on a surface of the reinforcing layer away from the cover plate.

[0020] In an exemplary embodiment of the present invention, at least a part of the orthographic projection of the connection region on the transparent substrate is located in the edge region. The display module further includes a light-shielding layer which is provided on a surface of the transparent substrate close to the display panel and is made of a conductive material and is located in the edge region. At least a part of the connection region is electrically connected to the light-shielding layer.

[0021] In an exemplary embodiment of the present invention, the display panel includes a driving backplane, a light-emitting layer provided on a side of the driving backplane away from the protective layer, and a back film provided on a surface of the driving backplane away from the light-emitting layer. The adhesive layer is adhered to a surface of the back film away from the light-emitting layer. The boundary of the adhesive layer is located within the boundary of the back film and has a separation region between the boundary of the back film. The conductive layer is electrically connected to the heat dissipation layer through a conductive medium, and the conductive medium connects the conductive layer and the heat dissipation layer from outside the edge of the display panel across the edge of the display panel. The conductive medium is electrically connected to the separation region.

[0022] In an exemplary embodiment of the present invention, the cover plate has a main body region and an outer contour region located outside the main body region. The main body region covers the display region, the outer contour region covers the peripheral region, and the conductive medium is connected to the outer contour region.

[0023] The conductive medium connects the cover plate and the heat dissipation layer from outside the edge of the display panel across the edge of the display panel.

[0024] In an exemplary embodiment of the present invention, the outer contour region includes a plurality of contact regions that are distributed at intervals along the circumferential direction of the main body region, and the conductive medium is connected to the contact regions.

[0025] In an exemplary embodiment of the present invention, the outer peripheral surface of the cover plate is surrounded by a plurality of side surfaces that are distributed in the circumferential direction, the connection location of two adjacent side surfaces is a corner, any one of the corners is located within the contact region, and the conductive medium connected to any one of the contact regions covers the corner within the contact region.

[0026] According to one aspect of the present invention, a method for manufacturing a display module is provided, and the method for manufacturing the display module includes: forming a display panel having a display region and a peripheral region located outside the display region; forming a cover plate on one side of the display panel; forming a protective layer including a conductive heat dissipation layer on a side of the display panel away from the cover plate, and the protective layer covering at least a part of the peripheral region and the display region; electrically connecting the cover plate and the heat dissipation layer through a conductive medium.

[0027] In an exemplary embodiment of the present invention, the step of electrically connecting the cover plate and the heat dissipation layer through a conductive medium includes: forming a conductive material that passes outside the edge of the display panel and straddles the edge of the display panel to be connected to the heat dissipation layer; curing the conductive material to obtain the conductive medium.

[0028] According to one aspect of the present invention, a display device including the display module according to any one of the above items is provided.

[0029] It should be noted that the above general description and the following detailed description are merely exemplary and interpretive descriptions, and do not limit the present invention.

Brief Description of the Drawings

[0030] The following drawings are incorporated into the specification and form a part of this specification, exemplifying embodiments applicable to the present invention and configured to interpret the principles of the present invention together with the specification. Note that the drawings in the following description are only a part of the embodiments of the present invention, and those skilled in the art can obtain other drawings based on these drawings on the premise of not investing creative labor.

[0031]

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Modes for Carrying Out the Invention

[0032] Hereinafter, examples of embodiments will be described in more detail with reference to the drawings. However, these examples of embodiments can be variously modified and should not be understood as being limited to the embodiments described herein. Conversely, these embodiments are provided so that the present invention is comprehensive and complete, and can fully convey the concept of exemplary embodiments to those skilled in the art. Since the same reference numerals in the drawings indicate the same or similar elements, detailed descriptions thereof are omitted. Note that the drawings are only schematic illustrations of the present invention and are not necessarily drawn to scale.

[0033] The terms "one", "a", "said", "the", and "at least one" are used to indicate that one or more elements / components / etc. are present. The terms "comprising" and "including" mean being inclusively included and further including elements / components / etc. other than the recited elements / components, and the terms such as "first", "second", "third", etc. are used as labels and do not limit the number of the objects.

[0034] In the related art, an OLED display module includes a driving backplane and a light-emitting layer distributed in an array on one side of the driving backplane, and the light-emitting layer can include a plurality of light-emitting elements. The display module may be divided into a display area and a peripheral area located outside the display area, and the light-emitting elements are located within the display area.

[0035] The driving backplane can include a base and a driving circuit provided on the base. This driving circuit can include pixel circuits located within the display area and peripheral circuits located within the peripheral area. The peripheral circuits are connected to the pixel circuits and include, for example, a light emission control circuit, a gate driving circuit, and a source driving circuit. Here, the light emission control circuit may be used to output a light emission control signal to the pixel circuit. The gate driving circuit may be used to output a write control signal and a reset control signal to the pixel circuit. The source driving circuit may be used to output a data signal to the pixel circuit. Additionally, the driving circuit may further be used to output a first power signal, a second power signal, and a reset signal to the pixel circuit.

[0036] The light-emitting element of the light-emitting layer may be an OLED, i.e., an organic light-emitting diode, and can have a first end and a second end. The first end may be an anode, and the second end may be a cathode. The first end of the light-emitting element may be connected to the pixel circuit, and the second end is used to input the second power signal.

[0037] By controlling the peripheral circuits to input a light emission control signal, a write control signal, a reset control signal, a data signal, a first power signal, a second power signal, and a reset signal to the pixel circuit and the light-emitting element, the light-emitting element can be made to emit light to display an image.

[0038] In addition, the protection display module can provide a transparent cover plate on the light-emitting side of the display module, i.e., the side away from the driving backplane of the light-emitting layer. In order to ensure that the reliability of the product meets the standards, it is necessary to conduct tests before release. Taking the copper bar test as an example, the test process is as follows. A static screen is normally displayed on the display module, and a scribing device or other similar equipment is used to simulate the operation of sliding by touching with a human finger, and the surface of the cover plate is rubbed continuously for a certain period of time, for example, 8 hours. Before the end of the test, if display abnormalities such as color deviation or a black screen appear on the static screen, the test result is considered a failure.

[0039] Through many studies, the inventor discovered that since the materials of the copper bar and the cover plate are different, the binding force on electrons is different. In the process of repeated friction in the copper bar test, electrons gradually transition from the copper bar to the surface of the cover plate and gradually form random charge accumulations locally. The cover plate is usually made of glass material, has a high resistivity, a large dielectric constant, and it is difficult for both positive and negative charges to move. When charges accumulate locally to a certain extent, it interferes with the underlying drive circuit and affects the display screen.

[0040] Specifically, the charges accumulated on the cover plate cause a potential drop across the entire display module, cause a base potential drop, and further induce a drift in the Vth (threshold voltage) of the transistors in the pixel circuit. For example, negative charges drift the Vth of the driving transistor to the positive side, causing an abnormal increase in the driving current. The emission luminance of the light-emitting element depends on the magnitude of the driving current, and the larger the driving current, the greater the emission luminance. Therefore, the driving current due to charge accumulation increases relative to the predetermined driving current, resulting in brighter local light-emitting elements. For the three-color light-emitting elements of red (R), green (G), and blue (B), the quantum efficiency of the light-emitting material of the green light-emitting element (the efficiency at which excitons transition to low-energy electrons and emit photons) is the highest and it lights up the fastest. So, when the same drift occurs in the transistors of the three-color light-emitting elements, the entire screen is more likely to show green, thereby presenting a locally greenish color.

[0041] To solve the above problems, an embodiment of the present invention provides a display module. As shown in FIGS. 1, 2, and 4, this display module can include a display panel 1, a protective layer 2, a cover plate 3, and a conductive medium 4.

[0042] Here, the display panel 1 has a display area 101 and a peripheral area 102 located outside the display area 101. The protective layer 2 is provided on one side of the display panel 1, and the protective layer 2 covers at least a part of the peripheral area 102 and the display area 101. The protective layer 2 includes a conductive heat dissipation layer 21. The cover plate 3 is provided on the side away from the protective layer 2 of the display panel 1, and the cover plate 3 is electrically connected to the heat dissipation layer 21 via a conductive medium 4.

[0043] In the display module according to the embodiment of the present invention, the heat dissipation layer 21 can be grounded during use. When performing a copper bar test, the charges accumulated on the cover plate 3 due to the friction of the copper bar are conducted along the conductive medium 4 to the heat dissipation layer 21 and grounded, thereby reducing the charges accumulated on the cover plate 3, avoiding the interference of the charges with the pixel circuit, and preventing problems such as color deviation where the screen turns green during testing and other display abnormalities caused by charge accumulation.

[0044] Hereinafter, the basic structure of the display module according to the embodiment of the present invention will be described in detail.

[0045] As shown in FIGS. 1 and 2, the display panel 1 may be used to emit light so as to display an image, and may include a driving backplane 11 and a light emitting layer 12 located on one side of the driving backplane 11.

[0046] The driving backplane 11 can include a base and a driving circuit layer. The base can have a flat plate structure, and its material can be a hard material such as glass or a soft material such as polyimide. The driving circuit layer is provided on one side of the base and can include a driving circuit. The display panel 1 can be divided into at least a display area 101 and a peripheral area 102 located outside the display area 101. Correspondingly, the driving circuit layer can include a pixel circuit at least partially located within the display area 101 and a peripheral circuit located within the peripheral area 102. Here, the pixel circuit can be a pixel circuit such as 7T1C, 7T2C, 6T1C, or 6T2C as long as it can drive the light-emitting element to emit light, but its structure is not particularly limited here. The number of pixel circuits is the same as the number of light-emitting elements and is connected in a one-to-one correspondence with each light-emitting element to facilitate controlling each light-emitting element to emit light. Here, nTmC represents that one pixel circuit includes n transistors (represented by the letter "T" in the alphabet) and m capacitors (represented by the letter "C" in the alphabet).

[0047] The peripheral circuit is located in the peripheral area 102 and is used to input a driving signal to the pixel circuit so as to control the pixel circuit to drive the light-emitting element to emit light. The peripheral circuit is connected to the pixel circuit and includes a light-emitting control circuit, a gate driving circuit, a source driving circuit, a power supply circuit, and the like. Here, the light-emitting control circuit can be used to output a light-emitting control signal to the pixel circuit, the gate driving circuit can be used to output a write control signal and a reset control signal to the pixel circuit, the source driving circuit can be used to output a data signal to the pixel circuit, and the driving circuit can further be used to output a first power supply signal, a second power supply signal, and a reset signal to the pixel circuit.

[0048] Hereinafter, taking the pixel circuit with a 7T1C structure as an example, the structure and driving method of the pixel circuit will be exemplarily described.

[0049] As shown in FIG. 3, the pixel circuit can include seven transistors and one storage capacitor, namely, driving transistor DT, first transistor T1 to sixth transistor T6, and storage capacitor Cst.

[0050] Here, the control terminal of the first transistor T1 may be used to receive a write control signal Scan, the first terminal is used to receive a data signal Vdata, and the second terminal is connected to the first terminal of the driving transistor DT.

[0051] The control terminal of the second transistor T2 is used to receive a write control signal Scan, the first terminal is connected to the second terminal of the driving transistor DT, and the second terminal is connected to the control terminal of the driving transistor DT.

[0052] The control terminal of the third transistor T3 is used to receive a light emission control signal EM, the first terminal is used to receive a first power supply signal VDD, and the second terminal is connected to the first terminal of the driving transistor DT.

[0053] The control terminal of the fourth transistor T4 is used to receive a reset control signal Reset, the first terminal is used to receive a reset signal Vinit, and the second terminal is connected to the control terminal of the driving transistor DT.

[0054] The control terminal of the fifth transistor T5 is used to receive a reset control signal Reset, the first terminal is used to receive a reset signal Vinit, and the second terminal is connected to the first terminal of the light emitting element OLED.

[0055] The control terminal of the sixth transistor T6 is used to receive a light emission control signal EM, the first terminal is connected to the second terminal of the driving transistor DT, and the second terminal is connected to the first terminal of the light emitting element OLED.

[0056] The first terminal of the storage capacitor Cst is connected to the first terminal of the third transistor T3 and is used to input the first power signal VDD. The second terminal is connected to the control terminal of the driving transistor DT.

[0057] The above driving transistor DT and the first transistor T1 to the sixth transistor T6 are all P-type thin film transistors. The first power signal VDD is a high-level signal, and the second power signal VSS is a low-level signal. The light-emitting element OLED is an organic light-emitting diode. Its first terminal is the anode of the organic light-emitting diode, and the second terminal is the cathode of the organic light-emitting diode. The driving transistor DT and the first transistor T1 to the seventh transistor T6 all turn on at a low level and turn off at a high level.

[0058] The driving method of the above pixel circuit includes the following steps.

[0059] In the reset stage, the fourth transistor T4 and the fifth transistor T5 are turned on, the first transistor T1, the second transistor T2, the third transistor T3 and the sixth transistor T6 are turned off, and the reset signal Vinit is transmitted to the control terminal of the driving transistor DT and the first terminal of the light-emitting element OLED.

[0060] In the data writing stage, the first transistor T1 and the second transistor T2 are turned on, and the third transistor T3, the fourth transistor T4, the fifth transistor T5 and the sixth transistor T6 are turned off, so that the data signal Vdata is transmitted to the control terminal of the driving transistor DT through the first transistor T1, the driving transistor DT and the second transistor T2.

[0061] In the light-emitting stage, the third transistor T3 and the sixth transistor T6 are turned on, and the first transistor T1, the second transistor T2, the fourth transistor T4 and the fifth transistor T5 are turned off, so that the signal at the second terminal of the driving transistor DT is transmitted to the first terminal of the light-emitting element OLED, thereby controlling the light-emitting element OLED to emit light.

[0062] The above drive circuit layer may include a plurality of thin film transistors and capacitors. Here, the thin film transistor may be a top gate or bottom gate type thin film transistor, and each thin film transistor may include an active layer, a gate, a source, and a drain. Here, the gate may be a double gate or a single gate. The active layers of each thin film transistor are provided in the same layer, the gates are provided in the same layer, and the sources and drains are both provided in the same layer, thereby simplifying the process.

[0063] Hereinafter, taking the case where the driving transistor is a top gate type thin film transistor as an example, the structure of the driving backplane 11 will be exemplarily described.

[0064] The driving backplane 11 may include a base and a driving circuit layer located on one side of the base. The driving circuit layer may include an active layer, a first gate insulating layer, a gate, a second gate insulating layer, an interlayer dielectric layer, a source-drain layer, and a planarizing layer. The active layer is provided on one side surface of the base, and the first gate insulating layer covers the active layer and the base. The gate is provided on the surface of the first gate insulating layer away from the base and faces the active layer. The second gate insulating layer covers the gate and the first gate insulating layer. The interlayer dielectric layer covers the second gate insulating layer. The source-drain layer is provided on the surface of the interlayer dielectric layer away from the base and includes a source and a drain, and the source and the drain are connected to both ends of the active layer through contact holes. The planarizing layer covers the source-drain layer and the interlayer dielectric layer. Of course, if the driving circuit layer can drive the light emitting element to emit light, it may further include other filter layers, but it will not be described in detail here again.

[0065] As shown in FIG. 1, the light-emitting layer 12 is provided on one side of the driving backplane 11. For example, the light-emitting layer 12 is provided on the surface away from the base of the flat layer. Also, the light-emitting layer 12 is located within the range of the display area 101. The light-emitting layer 12 can include a plurality of light-emitting units distributed in an array, and each light-emitting unit can include a plurality of light-emitting elements.

[0066] In some embodiments of the present invention, the light-emitting element can be an OLED and can include a first electrode, a light-emitting functional layer, and a second electrode sequentially stacked along the direction away from the driving backplane 11.

[0067] The first electrode may be provided on the side away from the base of the flat layer and is connected to the drain of the thin-film transistor of the pixel circuit through a contact hole. This thin-film transistor may be a driving transistor or other transistors, and is specifically determined according to the structure of the pixel circuit, but is not particularly limited here. The light-emitting functional layer can include a hole injection layer, a hole transport layer, a composite light-emitting layer, an electron transport layer, and an electron injection layer sequentially stacked along the direction away from the driving backplane 11. Also, an electron blocking layer may be further provided between the hole transport layer and the composite light-emitting layer. The second electrode extends to the peripheral region 102 and is connected to the power signal terminal to receive a power signal. The specific principle of the light emission of the OLED will not be described in detail again here.

[0068] As shown in FIG. 1, in order to facilitate limiting the range of each light-emitting element, the light-emitting layer 12 can further include a pixel definition layer. The pixel definition layer is provided on the surface of the driving circuit layer away from the base together with the first electrode, and is provided with a plurality of openings for exposing each first electrode in a one-to-one correspondence. The light-emitting functional layer is laminated in the region located within the opening of the first electrode. The light-emitting functional layers of each light-emitting element are distributed at intervals independently of each other. The emission colors of different light-emitting functional layers may be the same or different. The second electrode covers the light-emitting functional layer, so that each light-emitting element can share the same second electrode. Each light-emitting element can be defined by the above-mentioned plurality of openings, and the boundary of any one light-emitting element is the boundary of the light-emitting functional layer within the corresponding opening.

[0069] Of course, in some other embodiments of the present invention, the light-emitting functional layers of each light-emitting element can belong to a continuous and identical light-emitting filter layer. This light-emitting filter layer simultaneously covers the surface of each first electrode and the pixel definition layer away from the base. The region located within the opening and laminated on the first electrode in this light-emitting filter layer is the light-emitting functional layer of the light-emitting element, and two adjacent light-emitting functional layers are connected through other regions of this light-emitting filter layer. That is, each light-emitting element can share this light-emitting filter layer.

[0070] In some embodiments of the present invention, each light-emitting unit can include a plurality of light-emitting elements with different emission colors, and each light-emitting element emits monochromatic light or quasi-monochromatic light.

[0071] Also, as shown in FIG. 2, the display panel 1 can further include a sealing layer 13, which covers the surface of the light-emitting layer 12 away from the driving backplane 11 and covers all the light-emitting elements, thereby protecting the light-emitting layer 12 and avoiding the erosion of the light-emitting elements by water and oxygen from the outside. At the same time, the boundary of the sealing layer 13 extends into the peripheral region 102 but does not exceed the peripheral region 102, and can also protect the peripheral circuit in the peripheral region 102.

[0072] In some embodiments of the present invention, encapsulation can be achieved by Thin-Film Encapsulation (TFE). The encapsulation layer 13 can include a first inorganic layer, an organic layer, and a second inorganic layer. The first inorganic layer covers the surface of the driving backplane 11 of the light-emitting layer 12 that is away from the driving backplane 11. The organic layer may be provided on the surface of the first inorganic layer that is away from the driving backplane 11. Moreover, the boundary of the organic layer is limited to the inside of the boundary of the first inorganic layer. The second inorganic layer covers the organic layer and the first inorganic layer that is not covered by the organic layer, preventing the intrusion of water and oxygen, and flattening can be achieved by the flexible organic layer.

[0073] As shown in FIGS. 1 and 2, the protective layer 2 is provided on one side of the display panel 1. For example, the protective layer 2 may be provided on the side of the driving backplane 11 away from the light-emitting layer 12. At the same time, the protective layer 2 can cover at least a part of the peripheral region 102 and the display region 101. For example, the boundary of the protective layer 2 is located within the peripheral region 102 and has a specified distance from the boundary of the peripheral region 102.

[0074] The protective layer 2 can include a heat dissipation layer 21 for dissipating heat for the display panel 1. The material of the heat dissipation layer 21 may be copper or other metals with good heat conduction performance, or may be a non-metallic material, such as graphene. Of course, since a material with high electrical conductivity is used, the heat dissipation layer 21 can conduct electricity at the same time.

[0075] Furthermore, in some embodiments of the present invention, as shown in FIG. 2, the protective layer 2 can further include an adhesive layer 22, a buffer layer 23, and a reinforcing layer 24.

[0076] Here, the buffer layer 23 is adhered by the adhesive layer 22 to the backlight side of the display panel 1, that is, the side away from the light-emitting layer 12 of the driving backplane 11. The adhesive layer 22 may be a mesh adhesive (EMBO), which can realize adhesion, is advantageous for exhaust, and when the display panel 1 is a flexible display panel 1, the mesh adhesive can conform to the bending of the display panel 1. Of course, other adhesives may be used for the adhesive layer 22. The buffer layer 23 may be a foam or other flexible material, which can buffer the display panel 1 and can also play a role in light shielding.

[0077] The reinforcing layer 24 may be provided on the side of the buffer layer 23 away from the display panel 1, and the reinforcing layer 24 may be used to increase the strength of the protective layer 2 and make it difficult to be damaged or destroyed. The material of the reinforcing layer 24 may be polyimide or other flexible materials, but when the display panel 1 is a flexible display panel 1, the reinforcing layer 24 should be a flexible material to enable the display panel 1 to be bent. The heat dissipation layer 21 described above may be provided on the surface of the reinforcing layer 24 away from the display panel 1.

[0078] As shown in FIGS. 1 and 2, the cover plate 3 may be provided on the side away from the protective layer 2 of the display panel 1, that is, the cover plate 3 is provided on the side away from the driving backplane 11 of the light-emitting layer 12 and is used to protect the display panel 1. By making the area of the cover plate 3 larger than the area of the display panel 1, the edge of the cover plate 3 can extend from the edge of the display panel 1. Of course, the boundary of the edge region 312 can also overlap the boundary of the peripheral region 102. The cover plate 3 may be a transparent structure for the light rays emitted by the light-emitting layer 12 to pass through.

[0079] In some embodiments of the present invention, at least a part of the edge region of the cover plate 3 may be curved towards the side closer to the protective layer 2, but both the display panel 1 and the protective layer 2 may have a planar structure. The curved region of the cover plate 3 is located outside the boundary of the display panel 1 and the protective layer 2, or the edges of the display panel 1 and the protective layer 2 are also curved, and the curved region conforms to the curved region of the cover plate 3.

[0080] Furthermore, as shown in FIGS. 1 and 2, the display module may further include a polarizing sheet 5. The polarizing sheet 5 may be provided between the sealing layer 13 and the cover plate 3. This polarizing sheet 5 may be a circular polarizing sheet that reduces the reflection of external light by the display module. An optical adhesive layer 6 may be provided between the polarizing sheet 5 and the cover plate 3. The optical adhesive layer 6 is used to achieve flattening in accordance with the cover plate 3 and may also be used to reduce the optical path difference at different positions.

[0081] In addition, the display module may further include a touch control layer. The touch control layer may be provided between the sealing layer 13 and the cover plate 3, and the orthographic projection of the touch control layer on the display panel 1 covers at least the display area 101. The touch control layer can use a self-capacitance or mutual-capacitance type touch control structure. For example, the touch control layer may be a plug-in type or an on-cell type such as FMLOC (Flexible Multi-Layer On Cell). Here, the specific structure is not particularly limited as long as it can realize the touch function. The user can operate on the side of the cover plate 3 away from the display panel 1 and realize interactivity by sensing the touch control position through the touch control layer.

[0082] The display module may further include a light-shielding layer 8, which may be disposed between the cover plate 3 and the display panel 1, and the material of the light-shielding layer 8 may be ink or non-light-transmitting photoresist, etc., and the orthogonal projection of the light-shielding layer 8 on the display panel 1 is located in the peripheral region 102 and is disposed to surround the display area 101, and the light-shielding layer 8 can shield at least a part of the peripheral region 102 of the display panel 1 from light.

[0083] Hereinafter, a method for improving color shift in a display module according to an embodiment of the present invention will be described in detail.

[0084] As shown in Figures 1 and 2, the heat dissipation layer 21 of the protective layer 2 is made of a metal material and has conductive properties. By electrically connecting the cover plate 3 and the heat dissipation layer 21 via a conductive medium 4, the charge on the cover plate 3 can be dissipated.

[0085] In some embodiments of the present invention, in order to facilitate the conduction of charges, a conductive layer 32 is provided on the cover plate 3, and a conductive path can be established between the conductive layer 32 and the heat dissipation layer 21. When the heat dissipation layer 21 is grounded, the charges collected on the conductive layer 32 are conducted to the heat dissipation layer 21 and finally introduced into a preset ground end connected to the heat dissipation layer 21, so as to avoid interference with the pixel circuit. Specifically, the cover plate 3 can include a transparent substrate 31 and a conductive layer 32.

[0086] Here, the transparent substrate 31 includes an intermediate region 311 and an edge region 312 located outside the intermediate region 311. The intermediate region 311 covers the display region 101, and the boundary of the intermediate region 311 can overlap with the boundary of the display region 101. The edge region 312 can cover the peripheral region 102, and the boundary of the edge region 312 can be located outside the peripheral region 102. That is, by making the area of the transparent substrate 31 larger than the area of the display panel 1, the edge of the transparent substrate 31 can extend from the edge of the display panel 1. Of course, the boundary of the edge region 312 may also overlap with the boundary of the peripheral region 102. The material of the transparent substrate 31 may be a transparent material such as glass, but is not particularly limited here.

[0087] As shown in FIGS. 4 and 5, the conductive layer 32 is provided on the surface of the transparent substrate 31 away from the display panel 1 and is connected to the heat dissipation layer 21. The electrical conductivity of the material of the conductive layer 32 is higher than that of the transparent substrate 31. The electrical conductivity of the conductive layer 32 may be 10 times, 20 times, 100 times, etc. that of the transparent substrate 31, but is not particularly limited here. For example, the material of the conductive layer 32 can include a transparent conductive material such as ITO (indium tin oxide), and while ensuring conductivity, it can prevent blocking light rays. Of course, it can further include other transparent conductive materials such as IZO (indium zinc oxide), but they will not be listed one by one here. Also, the conductive layer 32 only needs to be able to conduct electricity without affecting the display of the image, but other conductive materials may also be used.

[0088] The conductive layer 32 can include an intermediate conductor 321. The intermediate conductor 321 can be located in the intermediate region 311. That is, the orthographic projection of the intermediate conductor 321 on the display panel 1 is located in the display area 101, so as to conduct the charges within the range of the display area 101 to the heat dissipation layer 21. During use, the heat dissipation layer 21 can be grounded, that is, by setting the potential of the heat dissipation layer 21 to 0, the charges of the guide conductive layer 32 are transferred to the heat dissipation layer 21, and finally led to a preset ground terminal. The ground terminal may be grounded through the ground terminal of the electronic device using the display module of the present invention. Of course, the conductive layer 32 may be any that can conduct the charges out, and may also be a continuous planar filter layer.

[0089] In some embodiments of the present invention, as shown in FIG. 1, at least a part of the edge region of the cover plate 3 is curved in a direction approaching the protective layer 2. At this time, at least a part of the edge region 312 of the transparent substrate 31 can be curved in a direction approaching the protective layer 2, but the intermediate region 311 has a planar structure.

[0090] Hereinafter, the structure of the conductive layer 32 will be described.

[0091] As shown in FIGS. 4 and 5, the number of the intermediate conductors 321 is plural, and they intersect with each other to form a mesh structure. In some embodiments of the present invention, the intermediate conductor 321 can include a first intermediate conductor 3211 and a second intermediate conductor 3212 that extend linearly. The first intermediate conductor 3211 can extend along the row direction and be distributed at intervals along the column direction. The second intermediate conductor 3212 extends along the column direction and is distributed at intervals along the row direction. Each second intermediate conductor 3212 is provided to intersect with each first intermediate conductor 3211. Here, the row direction may be the X direction in FIGS. 4 and 5, and the column direction may be the Y direction in FIGS. 4 and 5, and the two are perpendicular to each other.

[0092] Note that the row direction and column direction in FIGS. 4 and 5 are merely exemplary explanations and do not constitute specific limitations on the intermediate conductor 321. However, it is obvious to those skilled in the art that when the row direction and column direction are rotated, they will change accordingly.

[0093] As shown in FIGS. 4 and 5, the distance T1 between two adjacent first intermediate conductors 3211 and the distance T2 between two adjacent second intermediate conductors 3212 may both be 1 cm to 3 cm, for example, 1 cm, 2 cm, or 3 cm, etc., but T1 and T2 may be different. The distance between two adjacent first intermediate conductors 3211 may be the sum of the width of the gap between two adjacent first intermediate conductors 3211 and the line width of the first intermediate conductor 3211, that is, the distance between the center lines of two adjacent first intermediate conductors 3211. Similarly, the distance between two adjacent second intermediate conductors 3212 may be the sum of the width of the gap between two adjacent second intermediate conductors 3212 and the line width of the second intermediate conductor 3212, that is, the distance between the center lines of two adjacent second intermediate conductors 3212.

[0094] In some embodiments of the present invention, for a rectangular display module, when the first direction is the width direction, the second direction is the length direction. When the aspect ratio of the display module is 16:9, eight first intermediate conductors 3211 and four second intermediate conductors 3212 can be provided. The distance between two adjacent intermediate conductors 321 is 2 cm.

[0095] As shown in FIGS. 4 and 5, in order to facilitate connecting the intermediate conductor 321 and the heat dissipation layer 21, in some embodiments of the present invention, the conductive layer 32 further includes an edge conductor 322. The edge conductor 322 is located in the edge region 312 of the transparent substrate 31 and is provided to surround the intermediate region 311. Each intermediate conductor 321 is connected to the edge conductor 322, and the edge conductor 322 may be connected to the heat dissipation layer 21.

[0096] In some embodiments of the present invention, the edge conductor 322 may be in a closed ring structure, provided within the edge region 312 and configured to surround the outside of the intermediate region 311. Both ends of each intermediate conductor 321 are connected to the edge conductor 322. This ring structure may be an annular ring, a rectangular ring, etc., and its shape may be the same as that of the intermediate region 311, specifically determined according to the shape of the intermediate region 311. At the same time, the edge conductor 322 is connected to the heat dissipation layer 21. Of course, in other embodiments of the present invention, the edge conductor 322 may be in a "U" shape or other curved structures that are not completely closed, and may be provided to surround the outside of the intermediate region 311, but does not completely surround the intermediate region 311.

[0097] Also, as shown in FIG. 5, the display area 101 of the display panel 1 may be provided with holes 100. The holes 100 penetrate through the light-emitting layer 12 and the driving circuit layer of the display panel 1 and can be exposed from the base. Of course, they may also penetrate through the base. An imaging device corresponding to the holes 100 is provided on the side of the protective layer 2 away from the display panel 1, so that an image can be captured through the display module. Correspondingly, the conductive layer 32 further includes avoidance conductors 323. At least a part of the orthographic projection of the avoidance conductors 323 on the display panel 1 is provided to surround the outside of the holes 100, and the avoidance conductors 323 are connected to at least the intermediate conductors 321. When the holes 100 are located in the extension path of the intermediate conductors 321, by bypassing the holes 100 through the avoidance conductors 323, the intermediate conductors 321 can be connected to the edge conductors 322 or directly connected to the heat dissipation layer 21.

[0098] In some embodiments of the present invention, as shown in FIG. 5, the avoidance conductors 323 may be in a closed ring structure and are provided to surround the outside of the holes 100. The intermediate conductors 321 are connected to the avoidance conductors 323, and the avoidance conductors 323 can connect the intermediate conductors 321 in two sections. The intermediate conductors 321 may be the first intermediate conductors 3211 or the second intermediate conductors 3212, but are not particularly limited here.

[0099] The connection method between the conductive layer 32 and the heat dissipation layer 21 will be described below.

[0100] As shown in FIGS. 1, 4, 5, and 7, the conductive layer 32 may be electrically connected to the heat dissipation layer 21 via the conductive medium 4. The conductive medium 4 may be electrically connected to the conductive layer 32 on the surface away from the protective layer 2 of the transparent substrate 31, and is electrically connected to the edge of the heat dissipation layer 21 across the edge of the transparent substrate 31 and the edge of the display panel 1 from the outside of the edge of the transparent substrate 31 and the edge of the display panel 1.

[0101] The conductive medium 4 may be a conductive paste or other material that connects the conductive layer 32 and the heat dissipation layer 21, but is not particularly limited here. For example, the conductive paste can include a substrate and a conductive filler. Here, the substrate can include an epoxy resin, an acrylate resin, a polyurethane, etc. The weight part of the substrate in the conductive paste may be 15% - 25%. The conductive filler can include metal powders such as gold, silver, copper, aluminum, zinc, iron, nickel, etc., and can also include graphite or other conductive compounds. The weight part of the conductive filler in the conductive paste may be 30% - 60%. Further, the conductive paste can further include a solvent and an auxiliary agent. The solvent may be a compound such as water, alcohols, etc. The weight part of the solvent in the conductive paste may be 10% - 20%. The auxiliary agent may be a cross-linking agent, a coupling agent, etc.

[0102] In some embodiments of the present invention, as shown in FIGS. 6 and 7, the boundary of the heat dissipation layer 21 is located inside the boundary of the transparent substrate 31, so that the area of the heat dissipation layer 21 is smaller than that of the transparent substrate 31. At the same time, the heat dissipation layer 21 includes a main body region 211 and a connection region 212 located outside the main body region 211, and the number of the connection regions 212 may be one or more. The boundary of the orthographic projection of the main body region 211 on the transparent substrate 31 can be located within the peripheral region 102, that is, the range of the main body region 211 is equal to or larger than the intermediate region 311, and the boundary of the orthographic projection of the connection region 212 on the transparent substrate 31 is also located within the edge region 312. For example, the shape of the main body region 211 may be a rectangular structure with rounded corners at the four corners, and the connection region 212 may be an arc-shaped region located at the four corners of this rectangle and protruding outward.

[0103] The connection region 212 is connected to the main body region 211, and the connection region 212 is connected to the conductive layer 32 via the conductive medium 4. Since the connection region 212 is located outside the main body region 211 and the connection region 212 is closer to the edge of the transparent substrate 31 than the intermediate region 311, without increasing the conductive medium 4, the connection region 212 can increase the contact surface between the conductive medium 4 and the heat dissipation layer 21, shorten the extending path of the conductive medium 4, make the contact more sufficient, make the connection stronger, and can sufficiently conduct the heat dissipation layer 21 and the conductive layer 32.

[0104] Furthermore, as shown in FIG. 6, in a direction parallel to the intermediate region 311, the distance between the boundary of the orthographic projection of the connection region 212 on the transparent substrate 31 and the boundary of the transparent substrate 31 is defined as a first distance S1. The distance between the boundary of the orthographic projection of the main body region 211 on the transparent substrate 31 and the boundary of the transparent substrate 31 is defined as a second distance S2. The first distance S1 is smaller than the second distance S2, that is, the distance between the boundary of the connection region 212 and the transparent substrate 31 is closer than the distance between the boundary of the main body region 211 and the transparent substrate 31. The boundary of the orthographic projection of the connection region 212 on the transparent substrate 31 is in an arc shape, and the first distance S1 is the distance between this arc shape and the point closest to the boundary of the transparent substrate 31. Exemplarily, the first distance S1 may be 0.3 mm to 0.5 mm, such as 0.3 mm, 0.4 mm, or 0.5 mm. The second distance S2 may be 0.9 mm to 1.1 mm, such as 0.9 mm, 1 mm, or 1.1 mm.

[0105] Also, in some embodiments of the present invention, as shown in FIG. 1, the cover plate 3 may further include an isolation layer 33, which can cover at least a part of the conductive layer 32 and the transparent substrate 31. The isolation layer 33 is made of a transparent insulating material and is used to protect the conductive layer 32 and the transparent substrate 31 from wear and corrosion. At the same time, since the user can perform a touch operation on the side of the isolation layer 33 away from the display substrate 1, the isolation layer 33 can use an anti-fingerprint material to avoid the formation of fingerprints. For example, the isolation layer 33 can use an oil-repellent material. When oil stains from a finger contact the isolation layer 33, minute oil balls are formed, and the formation of a fingerprint pattern can be avoided.

[0106] The boundary of the orthographic projection of the isolation layer 33 on the transparent substrate 31 is located within the edge region 312, so that it can completely cover the intermediate region 311 and at least partially cover the edge region 312. Furthermore, by making the boundary of the orthographic projection of the isolation layer 33 on the transparent substrate 31 overlap with the boundary of the transparent substrate 31, the conductive layer 32 and the transparent substrate 31 not covered by the conductive layer 32 can be completely covered.

[0107] When the isolation layer 33 completely covers the intermediate conductor 321 and the edge conductor 322, in order to ensure that the conductive medium 4 can be connected to the edge conductor 322, in some embodiments of the present invention, a via hole for exposing the edge conductor 322 can be provided in the isolation layer 33. The conductive medium 4 may be connected to the edge conductor 322 by extending from the surface of the isolation layer 33 away from the transparent substrate 31 into the via hole. Alternatively, in some embodiments of the present invention, before the isolation layer 33 is formed, first, the edge conductor 322 and the heat dissipation layer 21 are connected through the conductive medium 4, and then the conductive layer 32, the conductive medium 4, and the transparent substrate 31 can be covered through the isolation layer 33.

[0108] Of course, in other embodiments of the present invention, the boundary of the isolation layer 33 overlaps the boundary of the intermediate region 311, so that the edge conductor 322 is not covered by the isolation layer 33. At this time, the edge conductor 322 and the heat dissipation layer 21 can be directly connected through the conductive medium 4.

[0109] Hereinafter, the specific principle by which the display module of the present invention prevents charge accumulation and improves color shift will be described in detail.

[0110] In the process of repeated friction of the copper bar test, electrons gradually transition from the copper bar to the surface of the cover plate 3 and form an accumulation of negative charges locally on the cover plate 3. At the same time, due to friction, electrons are lost locally on the cover plate 3, and correspondingly, positive charges are accumulated locally on the cover plate 3.

[0111] Due to the path formed by the conductive layer 32 and the heat dissipation layer 21, and the characteristic that charges tend to gather in materials with higher conductivity, the charges on the cover plate 3 reach the nearby intermediate conductive wire 321 most quickly by the nearest method. After the charges on the intermediate conductive wire 321 gather, a potential difference is formed with respect to the grounded heat dissipation layer 21, and the charges move along the conductive medium 4 to the heat dissipation layer 21 under the action of the electric field Coulomb force, and are finally conducted from the heat dissipation layer 21 to the ground point of the driving circuit board. In this process, by eliminating the charge accumulation on the cover plate 3 and avoiding interference with the thin film transistors of the pixel circuit, display abnormalities such as color shift can be improved.

[0112] Furthermore, in another embodiment of the present invention, as shown in FIG. 8, at least a part of the orthographic projection of the connection region 212 of the heat dissipation layer 21 on the transparent substrate 31 is located in the edge region 312. The display module further includes a light shielding layer 8, and the light shielding layer 8 is provided on the surface of the transparent substrate 31 close to the display panel 1 and can be located in the edge region 312. The light shielding layer 8 is a conductive light shielding material. For example, the light shielding layer 8 can use conductive black ink. Of course, other materials can also be used as long as they can shield light and conduct electricity.

[0113] At least a part of the connection region 212 is electrically connected to the light shielding layer 8, so that the charges on the transparent substrate 31 can be led out. For example, at least a part of the connection region 212 is bent in the direction approaching the transparent substrate 31 and directly joined to the light shielding layer 8, and can be electrically connected through a conductive paste or other medium. The above-mentioned conductive medium 4 may be configured to be connected to both the light shielding layer 8 and the connection region 212, or may be configured to be connected only to the connection region 212 but not to the light shielding layer 8.

[0114] In still another embodiment of the present invention, as shown in FIG. 9, the surface of the driving backplane 11 away from the light-emitting layer 12 can cover a back film 14 for protecting the driving backplane 11, and the boundary of the back film 14 can overlap with the boundary of the driving backplane 11. The material of the back film 14 may be resin or other materials, and may have a multi-layer or single-layer structure. The adhesive layer 22 may be adhered to the surface of the back film 14 away from the light-emitting layer 12, and the boundary of the adhesive layer 22 is located within the boundary of the back film 14, and there is a separation region 141 between the boundary of the adhesive layer 22 and the boundary of the back film 14. The separation region 141 is a region where the back film 14 is not covered by the adhesive layer 22.

[0115] The conductive medium 4 electrically connects the conductive layer 32 and the heat dissipation layer 21, and at the same time extends to the region corresponding to the separation region 141 and is electrically connected to the separation region 141, thereby guiding the charges in the back film 14.

[0116] As shown in FIGS. 10 and 11, in some embodiments of the present invention, it is also possible to conduct charges without passing through the above-mentioned conductive layer 32. For example, the cover plate 3 is made of a transparent material and does not include the above-mentioned conductive layer 32, and can have a main body region 301 and an outer contour region 302 located outside the main body region 301. The main body region 301 covers the display region 101, the outer contour region 302 covers the peripheral region 102, and the conductive medium 4 connects the outer contour region 302 and the heat dissipation layer 21, and can also conduct the charges in the cover plate 3 to the heat dissipation layer 21 through the conductive medium 4.

[0117] Furthermore, there may be a plurality of contact positions between the conductive medium 4 and the outer contour region 302. For example, the outer contour region 302 includes a plurality of contact regions 3021 distributed at intervals along the circumferential direction of the main body region 301, and the conductive medium 4 is connected to the contact regions 3021.

[0118] Furthermore, the outer peripheral surface of the cover plate 3 is surrounded by a plurality of side surfaces 30 distributed in the circumferential direction. The connection point between two adjacent side surfaces 30 is a corner 300. The number of side surfaces 30 is not particularly limited here and may be three, four, five, etc. Two adjacent side surfaces 30 may be directly connected or may be connected transitively via an arc surface. Thereby, the orthographic projection of the cover plate 3 on the display panel 1 is a polygon or a polygon having an arc-shaped corner. Any one of the corners 300 is located within the contact area 3021, and one corner 300 is provided in each contact area 3021. The conductive medium 4 connected to the contact area 3021 covers the corner 300 within the contact area 3021, that is, each corner 300 of the cover plate 3 is covered by the conductive medium 4.

[0119] Embodiments of the present invention provide a method for manufacturing a display module. This display module may be the display module of any one of the above embodiments, and detailed description of its specific structure is omitted here. The manufacturing method of the present invention may include steps S110 to S140.

[0120] Here, in step S110, a display panel having a display area and a peripheral area located outside the display area is formed.

[0121] In step S120, a cover plate is formed on one side of the display panel.

[0122] In step S130, a protective layer is formed on the side of the display panel away from the cover plate. The protective layer covers at least a part of the peripheral area and the display area, and the protective layer includes a conductive heat dissipation layer.

[0123] In step S140, the cover plate and the heat dissipation layer are electrically connected via a conductive medium.

[0124] Details of the structure according to each step of the manufacturing method of the present invention have already been described in detail in the embodiments of the display module, and detailed descriptions are omitted here. Here, step S140 is forming a conductive material that passes outside the edge of the display panel and crosses the edge of the display panel to be connected to the heat dissipation layer; curing the conductive material to obtain the conductive medium. It can include these steps.

[0125] Note that in the drawings, various steps of the manufacturing method in the present invention are described in a specific order, but this does not require or imply that these steps must be executed in this specific order or that all the steps shown must be executed to achieve the desired result. Additionally or alternatively, some steps can be omitted, multiple steps can be combined and executed in one step, and / or one step can be decomposed into multiple steps for execution.

[0126] Embodiments of the present invention further provide a display device, and the display device can include the display module of any one of the above embodiments. The specific structure and beneficial effects of this display module can refer to the embodiments of the above display module, and detailed descriptions are not repeated here.

[0127] Also, as shown in FIG. 12, the display device can further include a frame 7, and the display module may be arranged within the range surrounded by the frame 7, and the display module can be protected through the frame 7.

[0128] The display device can further include a driving circuit board, which may be a flexible circuit board, may be connected to the display panel 1, and is bent on the side away from the cover plate 3 of the protective layer 2. By outputting a driving signal to the display panel 1 through the driving circuit board, an image can be displayed. At the same time, the heat dissipation layer 31 may also be connected to the driving circuit board, and thus, by grounding the heat dissipation layer 31 through the driving circuit board, the charges accumulated in the conductive layer 32 can be conducted away.

[0129] The display device of the present invention may be a mobile phone, a tablet PC, a wearable device (smartwatch, wristwatch), a notebook computer, a television, or other similar devices having an image display function, but these are not listed one by one here.

[0130] Those skilled in the art can easily obtain other embodiments of the present invention through understanding the specification and implementing the invention described in the specification. The present invention includes any modifications, uses, or adaptive changes to the present invention, and such modifications, uses, or adaptive changes follow the general principles of the present invention and include the known knowledge in the technical field not disclosed in the present invention or ordinary technical means. The specification and examples are merely illustrative, and the true scope and gist of the present invention are indicated by the following claims.

Explanation of Reference Numerals

[0131] 1 Display panel 101 Display area 102 Peripheral area 100 Hole 11 Driving backplane 12 Light-emitting layer 13 Encapsulation layer 14 Back film 141 Spacing area 2 Protective layer 21 Heat dissipation layer 22 Adhesive layer 23 Buffer layer 24 Reinforcing layer 211 Body area 212 Connection area 3 Cover plate 31 Transparent substrate 311 Intermediate area 312 Edge area 32 Conductive layer 321 Intermediate conductor 3211 First intermediate conductor 3212 Second intermediate conductor 322 Edge conductor 323 Avoidance conductor 33 Isolation layer 301 Body area 302 Outer contour area 3021 Contact area 30 Side surface 300 Corner 4 Conductive medium 5 Polarizing sheet 6 Optical adhesive layer 7 Frame 8 Light-shielding layer

Claims

1. A display module, comprising: a display panel having a display area and a peripheral area located outside the display area; a protective layer provided on one side of the display panel, covering at least a part of the peripheral area and the display area, and including a conductive heat dissipation layer; a cover plate provided on a side of the display panel away from the protective layer; a conductive medium; wherein the cover plate is electrically connected to the heat dissipation layer through the conductive medium; the cover plate includes a transparent substrate and a conductive layer, the transparent substrate has an intermediate area and an edge area located outside the intermediate area, the intermediate area covers the display area, the edge area covers the peripheral area, the conductive layer is provided on a surface of the transparent substrate away from the display panel, and is electrically connected to the heat dissipation layer through the conductive medium, and the conductive layer includes at least an intermediate conductive wire located in the intermediate area; a boundary of the heat dissipation layer is located inside a boundary of the transparent substrate, and the heat dissipation layer includes a main body area and a connection area located outside the main body area, and the connection area is connected to the main body area; the connection area is connected to the conductive layer through the conductive medium; at least a part of a front projection of the connection area on the transparent substrate is located in the edge area; the display module further includes: a light-shielding layer made of a conductive material provided on a surface of the transparent substrate close to the display panel and located in the edge area; at least a part of the connection area is electrically connected to the light-shielding layer; the display panel includes: a driving backplane; a light-emitting layer provided on a side of the driving backplane away from the protective layer; a back film provided on a surface of the driving backplane away from the light-emitting layer; wherein the protective layer includes an adhesive layer, the adhesive layer is adhered to a surface of the back film away from the light-emitting layer, a boundary of the adhesive layer is located inside a boundary of the back film, and there is a separation area between the boundary of the adhesive layer and the boundary of the back film; the conductive layer is electrically connected to the heat dissipation layer through the conductive medium, and the conductive medium connects the conductive layer and the heat dissipation layer across an edge of the display panel from outside the edge of the display panel; the conductive medium is electrically connected to the separation area; a display module.

2. ​ The conductive layer further includes edge conductors, the edge conductors are located in the edge region and are provided so as to surround the intermediate region, each of the intermediate conductors is connected to the edge conductors, and the edge conductors are connected to the heat dissipation layer. The display module according to claim 1.

3. The display module according to claim 2, wherein the number of the intermediate conductors is plural and they intersect each other to form a mesh structure.

4. The intermediate conductors include a first intermediate conductor and a second intermediate conductor. The first intermediate conductor extends along the row direction and is distributed at intervals along the column direction. The second intermediate conductor extends along the column direction and is distributed at intervals along the row direction. The second intermediate conductor is provided so as to intersect the first intermediate conductor. The display module according to claim 3.

5. Holes are provided in the display area. The conductive layer further includes avoidance conductors. At least a part of the orthographic projection of the avoidance conductors on the display panel is provided so as to surround the outside of the holes. The avoidance conductors are connected to at least one of the intermediate conductors. The display module according to claim 3.

6. The display module according to any one of claims 1 to 5, wherein the conductive medium connects the conductive layer and the heat dissipation layer across the edge of the display panel from the outside of the edge of the display panel.

7. In a plane parallel to the main body region, the distance between the boundary of the orthographic projection of the connection region on the transparent substrate and the boundary of the transparent substrate is a first distance. In a direction parallel to the main body region, the distance between the boundary of the orthographic projection of the main body region on the transparent substrate and the boundary of the transparent substrate is a second distance. The first distance is smaller than the second distance. The display module according to claim 1.

8. The cover plate further includes an isolation layer made of a transparent insulating material that covers at least the intermediate conductors. The display module according to any one of claims 1 to 5.

9. The edge region of the transparent substrate is curved on the side closer to the protective layer. The display module according to any one of claims 1 to 5.

10. The protective layer includes an adhesive layer provided on the side surface of the display panel away from the cover plate, and a buffer layer adhered to the surface of the adhesive layer away from the cover plate. Further comprising a reinforcing layer provided on a surface of the buffer layer away from the cover plate; The heat dissipation layer is provided on a surface of the reinforcing layer away from the cover plate; The display module according to any one of claims 1 to 5.

11. The cover plate has a main body region and an outer contour region located outside the main body region; The main body region covers the display region, the outer contour region covers the peripheral region, and the conductive medium is connected to the outer contour region; The conductive medium connects the cover plate and the heat dissipation layer from outside the edge of the display panel across the edge of the display panel; The display module according to claim 1.

12. The outer contour region includes a plurality of contact regions distributed at intervals along the circumferential direction of the main body region, and the conductive medium is connected to the contact regions. The display module according to claim 11.

13. The outer peripheral surface of the cover plate is surrounded by a plurality of side surfaces distributed in the circumferential direction. The connection portion between two adjacent side surfaces is a corner. Any one of the corners is located within the contact region, and the conductive medium connected to any one of the contact regions covers the corner within the contact region. The display module according to claim 12.

14. A method for manufacturing a display module, comprising: Forming a display panel having a display region and a peripheral region located outside the display region; Forming a cover plate on one side of the display panel; Forming a protective layer including a conductive heat dissipation layer on a side of the display panel away from the cover plate, the protective layer covering at least a part of the peripheral region and the display region; Electrically connecting the cover plate and the heat dissipation layer through a conductive medium; The cover plate includes a transparent substrate and a conductive layer. The transparent substrate has an intermediate region and an edge region located outside the intermediate region. The intermediate region covers the display region, the edge region covers the peripheral region, the conductive layer is provided on a surface of the transparent substrate away from the display panel, and is electrically connected to the heat dissipation layer through the conductive medium. The conductive layer includes at least an intermediate conductive wire located in the intermediate region. The boundary of the heat dissipation layer is located inside the boundary of the transparent substrate, and the heat dissipation layer includes a main body region and a connection region located outside the main body region. The connection region is connected to the main body region, The connection region is connected to the conductive layer through the conductive medium, At least a part of the orthographic projection of the connection region on the transparent substrate is located in the edge region, The display module, Further includes a light shielding layer which is a conductive material provided on the surface of the transparent substrate close to the display panel and located in the edge region, At least a part of the connection region is electrically connected to the light shielding layer, The display panel, A driving backplane, A light emitting layer provided on the side away from the protective layer of the driving backplane, A back film provided on the surface of the driving backplane away from the light emitting layer, Including, The protective layer includes an adhesive layer. The adhesive layer is adhered to the surface of the back film away from the light emitting layer. The boundary of the adhesive layer is located within the boundary of the back film and has a separation region between it and the boundary of the back film, The conductive layer is electrically connected to the heat dissipation layer through the conductive medium, and the conductive medium connects the conductive layer and the heat dissipation layer from the outside of the edge of the display panel across the edge of the display panel, The conductive medium is electrically connected to the separation region A manufacturing method of the display module.

15. The step of electrically connecting the cover plate and the heat dissipation layer through the conductive medium includes: Forming a conductive material that is connected to the heat dissipation layer through the outside of the edge of the display panel and across the edge of the display panel, Curing the conductive material to obtain the conductive medium, The manufacturing method according to claim 14.

16. A display device including the display module according to any one of claims 1 to 13.

Images