Laminate and Package

Abstract

Provided are a laminate and a package that can transport and store a mechanically brittle anisotropic conductive member that is prone to damage or the like. 【Solution means】The laminate includes an insulating base material having electrical insulation properties, and a plurality of conductive paths provided so as to penetrate in the thickness direction of the insulating base material and having protruding portions protruding from at least one surface of the insulating base material, and an anisotropic conductive member. The laminate also includes an organic film disposed on at least one of two surfaces facing each other in the thickness direction of the insulating base material of the anisotropic conductive member. The organic film has a gas permeability of 2.3×10 8 ~4.6×10 9 ml / (m 2 ·day·MPa).

Description

Technical Field

[0001] The present invention relates to a laminate in which an anisotropic conductive member and an organic film are laminated, and a package containing the laminate, and particularly to a laminate and a package in which the anisotropic conductive member has a conduction path provided so as to penetrate in the thickness direction of an insulating base material, and the organic film has gas permeability.

Background Art

[0002] There is an anisotropic conductive member having a conduction path in which a conductive substance such as metal is filled in a plurality of through holes provided in an insulating base material. The anisotropic conductive member is inserted between an electronic component such as a semiconductor element and a circuit board, and an electrical connection between the electronic component and the circuit board can be obtained only by applying pressure. Therefore, it is widely used as an electrical connection member for electronic components such as semiconductor elements and as an inspection connector for performing functional inspections. In particular, electronic components such as semiconductor elements are significantly miniaturized. In conventional methods of directly connecting wiring boards such as wire bonding, flip chip bonding, and thermocompression bonding, the stability of electrical connection of electronic components may not be sufficiently guaranteed in some cases. Therefore, anisotropic conductive members have attracted attention as electronic connection members. When an anisotropic conductive member is used as an electronic connection member, the anisotropic conductive member is arranged on a printed circuit board using a surface mounter such as a chip mounter. In this case, the anisotropic conductive member is transported and stored using a carrier tape or the like.

[0003] For example, Patent Document 1 describes a package having a carrier tape having an electronic component storage portion and a cover tape for sealing the electronic component storage portion. The cover tape has a base material layer provided with antistatic properties on the surface, an adhesive layer, and an electrostatic induction prevention layer provided between the base material layer and the adhesive layer.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

[0005] In Patent Document 1, it is described that a package is obtained by continuously sealing both edge portions in the longitudinal direction of a cover tape with a width of 0.3 to 1.0 mm each, wrapping the tape, and winding it around a reel. It is described that electronic components and the like are stored or transported in the form of this package. Further, in Patent Document 1, the cover tape is peeled off, and the electronic components and the like are taken out while confirming the presence, orientation, and position of the electronic components and the like by a pickup device. Here, the above-mentioned anisotropic conductive member has a configuration having an insulating base material having electrical insulation. The insulating base material is generally known to be mechanically more brittle than a metal material, and when transferring the anisotropic conductive member to a printed circuit board or the like, or during storage, the anisotropic conductive member may vibrate due to an external force and be damaged. However, Patent Document 1 does not consider at all handling of a mechanically brittle material such as one that is easily damaged by vibration or the like. An object of the present invention is to provide a laminate and a package capable of transporting and storing a mechanically brittle anisotropic conductive member that is easily damaged. MEANS FOR SOLVING THE PROBLEM

[0006] In order to achieve the above object, Invention [1] includes an insulating base material having electrical insulation, and a plurality of conductive paths provided through the insulating base material in the thickness direction and having protruding portions protruding from at least one surface of the insulating base material. And an anisotropic conductive member, and an organic film disposed on at least one of two surfaces facing each other in the thickness direction of the insulating base material of the anisotropic conductive member, and the organic film has a gas permeability of 2.3×10 8 ~4.6×10 9 ml / (m 2 ·day·MPa), and is a laminate.

[0007] The invention [2] is the laminate according to invention [1], wherein the organic films are disposed on two opposing surfaces in the thickness direction of the insulating substrate. The invention [3] is the laminate according to invention [1] or [2], wherein the laminate has spacers disposed on the surface where the organic film contacts the anisotropic conductive member. The invention [4] is the laminate according to any one of inventions [1] to [3], which has a core and is wound around the core with the anisotropic conductive member and the organic film laminated. The invention [5] is the laminate according to invention [4], wherein the core is composed of a cylinder, and flanges having a diameter larger than the diameter of the core are provided at both axial ends of the core.

[0008] The invention [6] is the laminate according to any one of inventions [1] to [5], wherein the organic film is a porous film. The invention [7] is the laminate according to any one of inventions [1] to [6], wherein a plurality of anisotropic conductive members are arranged along one direction on at least one surface of the organic film. The invention [8] is the laminate according to any one of inventions [1] to [7], wherein the anisotropic conductive members are respectively disposed on two opposing surfaces in the thickness direction of the organic film.

[0009] The invention [9] has the laminate according to any one of claims [1] to [8] and a storage bag for storing the laminate, and the storage bag has a gas permeability of 1×10 -5 ~1 ml / (m 2 ·day·MPa), and is a package. The invention

[10] is the package according to invention [9], wherein the storage bag has a light transmittance of at most 1% or less in the wavelength range of 100 to 780 nm.

Advantages of the Invention

[0010] According to the present invention, there can be provided a laminate and a package capable of transporting and storing a mechanically brittle anisotropic conductive member that is easily damaged.

Brief Description of the Drawings

[0011]

Figure 1

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Figure 14

Embodiments for Carrying Out the Invention

[0012] Hereinafter, based on the preferred embodiments shown in the accompanying drawings, the laminate and the package of the present invention will be described in detail. The figures described below are exemplary for explaining the present invention and are simplified for the purpose of explaining the present invention. Therefore, the present invention is not limited to the figures shown below. Note that in the following, "~" indicating a numerical range includes the numerical values described on both sides. For example, if ε is the numerical value ε α ~ numerical value ε β it means that the range of ε is the numerical value ε α and the numerical value ε β and is a range including them. In mathematical symbols, it is ε α ≦ ε ≦ ε β is. Regarding "parallel" and "orthogonal", unless otherwise specified, the error range generally acceptable in the corresponding technical field is included.

[0013] [First Example of Laminated Body] FIG. 1 is a schematic cross-sectional view showing a first example of a laminated body according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view showing an example of the laminated state of the first example of the laminated body according to an embodiment of the present invention. FIG. 3 is a schematic cross-sectional view showing another example of the laminated state of the first example of the laminated body according to an embodiment of the present invention. Note that in FIGS. 1 to 3, a plurality of anisotropic conductive members 12 are shown, but the number of anisotropic conductive members 12 is not particularly limited to the numbers shown in FIGS. 1 to 3. The laminated body 10 shown in FIG. 1 has a configuration in which an anisotropic conductive member 12 and an organic film 14 are laminated. The direction in which the anisotropic conductive member 12 and the organic film 14 are laminated is the lamination direction Ds. In the laminated body 10, the organic film 14 is disposed on at least one of the two surfaces facing each other in the thickness direction of the insulating base material 50 (see FIG. 13) of the anisotropic conductive member 12. In FIG. 1, the organic film 14 is disposed on the surface 12a of the anisotropic conductive member 12. The back surface 14b of the organic film 14 is in contact with the surface 12a of the anisotropic conductive member 12. The organic film 14 is, for example, a long member extending in one direction D1. A plurality of anisotropic conductive members 12 are disposed on the back surface 14b of the organic film 14 at intervals along the one direction D1.

[0014] Note that the surface 12a of the anisotropic conductive member 12 is the surface 50a (see FIG. 13) of the insulating base material 50 (see FIG. 13). The back surface 12b of the anisotropic conductive member 12 is the back surface 50b (see FIG. 13) of the insulating base material 50 (see FIG. 13). The surface 12a and the back surface 12b of the anisotropic conductive member 12 are surfaces facing each other in the thickness direction Dt (see FIG. 13) of the insulating base material 50.

[0015] The anisotropic conductive member 12, which will be described in detail later, includes an insulating base material 50 (see FIG. 13) having electrical insulation and a plurality of conductive paths 52 (see FIG. 13) provided so as to penetrate in the thickness direction Dt (see FIG. 13) of the insulating base material 50 and having protruding portions 52a (see FIG. 13) protruding from at least one surface of the insulating base material 50. As described above, it is generally known that the insulating base material is mechanically more brittle than a metal material.

[0016] The organic film 14 has a gas permeability of 2.3×10 8 ~4.6×10 9 ml / (m 2 ·day·MPa). The gas permeability of the above-described organic film 14 can be obtained by using a hydrodynamic method to measure the flow rate per minute per unit volume under a differential pressure of 0.95166 kg / cm 2 (700 mmHg) and a temperature of 25°C. The hydrodynamic method is a method of obtaining gas permeability by attaching an organic film to be measured to a gas permeation test device, creating an arbitrary pressure difference, and measuring the speed or change in the flow of gas passing through the organic film. When the organic film 14 has a gas permeability of 2.3×10 8 ~4.6×10 9 ml / (m 2 ·day·MPa), for example, when the head 19 is brought into contact with the surface 14a of the organic film 14 using a chip mounter (not shown) to suck the organic film 14, the anisotropic conductive member 12 can be sucked through the organic film 14, and the anisotropic conductive member 12 can be held by the head 19. Therefore, even when the organic film 14 is between the head 19 and the anisotropic conductive member 12, the anisotropic conductive member 12 can be transported.

[0017] By providing the organic film 14 on the surface 12a of the anisotropic conductive member 12, for example, when the organic film 14 is sucked by the head 19 using a chip mounter (not shown) to convey the anisotropic conductive member 12, since the organic film 14 exists between the head 19 and the anisotropic conductive member 12, the organic film 14 serves as a buffer material and suppresses damage to the anisotropic conductive member 12, such as chipping and cracking of the insulating base material. Further, the anisotropic conductive member 12 has a plurality of conductive paths 52 (see FIG. 13) provided with protruding portions 52a (see FIG. 13). Also, regarding the protruding portions 52a (see FIG. 13), since the organic film 14 exists between the head 19 and the anisotropic conductive member 12, damage is suppressed. In this way, the anisotropic conductive member 12 that is mechanically brittle and easily damaged can be conveyed. Note that damage to the anisotropic conductive member 12 includes chipping and cracking of the insulating base material, deformation and loss of the protruding portions of the conductive paths, etc., as described above. For example, if there is chipping or the like in the insulating base material, a part of the insulating base material may peel off and cause contamination. Also, when the anisotropic conductive member is used as an electronic connection member with the protruding portion deformed and in contact with an adjacent protruding portion, there is a possibility that electrical connection cannot be made appropriately. Therefore, it is necessary to suppress damage to the anisotropic conductive member 12.

[0018] Also, in the laminate 10, by providing the organic film 14 on the surface 12a of the anisotropic conductive member 12 as described above, since the organic film 14 serves as a buffer material, even if vibration due to an external force is applied to the anisotropic conductive member 12 during storage, damage to the anisotropic conductive member 12 is suppressed. As a result, the anisotropic conductive member 12 that is mechanically brittle and easily damaged can be stably stored while suppressing damage.

[0019] In the laminate 10, the back surface 12b of the anisotropic conductive member 12 where the organic film 14 is not provided may have a configuration where nothing is provided. In this configuration, for example, when the laminate 10 is placed on a support (not shown), the back surface 12b of the anisotropic conductive member 12 contacts the support. Further, as shown in FIG. 2, the laminate 10 may have a configuration in which the anisotropic conductive members 12 are laminated in the lamination direction Ds. In FIG. 2, the anisotropic conductive members 12 are laminated so as to overlap in the lamination direction Ds. In this case, the anisotropic conductive members 12 are respectively disposed on two opposing surfaces in the thickness direction of the organic film. When laminating the laminate 10, it is not limited to laminating the anisotropic conductive members 12 so as to overlap in the lamination direction Ds. For example, as shown in FIG. 3, the anisotropic conductive member 12 on the lower side in the lamination direction Ds is disposed in the region 13 between the anisotropic conductive members 12 on the upper side in the lamination direction Ds in one direction D1 so that the anisotropic conductive members 12 do not overlap in the lamination direction Ds. As shown in FIG. 3, by adopting a configuration in which the anisotropic conductive members 12 do not overlap, the force acting on the anisotropic conductive members 12 in the lamination direction Ds can be reduced compared to the case where the anisotropic conductive members 12 are laminated in the lamination direction Ds, so that damage to the insulating base material and the protruding portions of the anisotropic conductive members 12 can be further suppressed. The specific configuration for laminating the laminate 10 will be described later.

[0020] [Second Example of Laminate] FIG. 4 is a schematic cross-sectional view showing a second example of the laminate according to the embodiment of the present invention. FIG. 5 is a schematic cross-sectional view showing an example of the laminated state of the second example of the laminate according to the embodiment of the present invention. FIG. 6 is a schematic cross-sectional view showing another example of the laminated state of the second example of the laminate according to the embodiment of the present invention. In addition, in FIGS. 4 to 6, although a plurality of anisotropic conductive members 12 are shown, the number of anisotropic conductive members 12 is not particularly limited to the number shown in FIGS. 4 to 6. In FIGS. 4 to 6, the same components as those of the laminate 10 shown in FIGS. 1 to 3 are denoted by the same reference numerals, and the detailed description thereof is omitted.

[0021] The laminate 10 shown in FIG. 4 is different from the laminate 10 shown in FIG. 1 in that the organic films 14 are disposed on two opposing surfaces in the thickness direction of the insulating base material of the anisotropic conductive member 12, and the other configurations are the same as those of the laminate 10 shown in FIG. 1. The laminate 10 shown in FIG. 4 has organic films 14 provided on the front surface 12a and the back surface 12b of the anisotropic conductive member 12, respectively. With this configuration, the two surfaces of the anisotropic conductive member 12 are protected, and damage to the anisotropic conductive member 12 is further suppressed. For this reason, the anisotropic conductive member 12, which is mechanically brittle and prone to damage, can be stably transported and stored while suppressing damage. Also, when transporting the anisotropic conductive member 12 using a chip mounter (not shown) as described above, since the organic film 14 disposed on either the front surface 12a side or the back surface 12b side of the anisotropic conductive member 12 may be sucked by the head 19, the degree of freedom in transporting the anisotropic conductive member 12 is also high. Further, for example, when unwinding the wound laminate 10, since the organic films 14 are provided on the front surface 12a side and the back surface 12b side of the anisotropic conductive member 12, the degree of freedom in unwinding is also high.

[0022] Also, the laminate 10 may have a configuration in which the anisotropic conductive members 12 are laminated in the lamination direction Ds as shown in FIG. 5. In FIG. 5, the anisotropic conductive members 12 are laminated overlapping each other in the lamination direction Ds. When laminating the laminate 10, it is not limited to laminating the anisotropic conductive members 12 overlapping each other in the lamination direction Ds. For example, as shown in FIG. 6, the anisotropic conductive member 12 on the lower side in the lamination direction Ds may be disposed in the region 13 between the anisotropic conductive members 12 on the upper side in the lamination direction Ds in one direction D1 so that the anisotropic conductive members 12 do not overlap in the lamination direction Ds. As shown in FIG. 6, by adopting a configuration in which the anisotropic conductive members 12 do not overlap, compared with the case where the anisotropic conductive members 12 are laminated in the lamination direction Ds, the force acting on the anisotropic conductive members 12 in the lamination direction Ds can be reduced, and thus damage to the insulating base material and the protruding portions of the anisotropic conductive members 12 can be further suppressed. The specific configuration for laminating the laminate 10 will be described later.

[0023] The laminate 10 shown in Fig. 4 is configured such that the organic films 14 are provided on the front surface 12a side and the back surface 12b side of the anisotropic conductive member 12, but is not limited thereto. Of the organic films 14 on the front surface 12a side and the back surface 12b side of the anisotropic conductive member 12, either one does not have to be the organic film 14. For example, instead of the organic film 14, a tape formed of polystyrene (PS), polyethylene terephthalate (PET), or polypropylene (PP) other than the organic film 14 may be disposed. As the tape replacing the organic film 14, a carrier tape used in an electronic component mounting apparatus can be utilized. Further, as the tape replacing the organic film 14, for example, an embossed carrier tape in which a plurality of recesses for housing the anisotropic conductive member 12 are arranged along one extending direction can also be used. In the embossed carrier tape, since one anisotropic conductive member is disposed in one recess, the anisotropic conductive member 12 can be housed more stably. When using the embossed carrier tape, after placing the anisotropic conductive member 12 in the recess, the organic film 14 may be covered and sealed.

[0024] [Third Example of Laminate] Fig. 7 is a schematic plan view showing a third example of the laminate according to the embodiment of the present invention. Fig. 8 is a schematic cross-sectional view showing a third example of the laminate according to the embodiment of the present invention. Fig. 8 shows a cross-section taken along line A-A of Fig. 7. In addition, in Figs. 7 and 8, a plurality of anisotropic conductive members 12 are shown, but the number of the anisotropic conductive members 12 is not particularly limited to the numbers shown in Figs. 7 and 8. In Figs. 7 and 8, the same components as those of the laminate 10 shown in Figs. 4 to 6 are denoted by the same reference numerals, and detailed description thereof is omitted.

[0025] The laminate 10 shown in Figs. 7 and 8 is different from the laminate 10 shown in Fig. 4 in that it has spacers in which the organic film 14 is disposed on the surface in contact with the anisotropic conductive member 12, and the other configurations are the same as those of the laminate 10 shown in Fig. 4. As shown in FIGS. 7 and 8, on the surface 14a of the organic film 14 on the lower side in the lamination direction Ds of the laminate 10, spacers 16 are disposed on both sides in the width direction Dw that is in-plane orthogonal to one direction D1 of the organic film 14. By these spacers 16, the movement of the anisotropic conductive member 12 in the width direction Dw is restricted, and the force acting on the anisotropic conductive member 12 in the lamination direction Ds is reduced. For this reason, damage to the anisotropic conductive member 12 can be further suppressed. The spacer 16 is composed of, for example, a tape formed of polytetrafluoroethylene (PTFE), polystyrene (PS), polyethylene terephthalate (PET), or polypropylene (PP). Also, the thickness of the spacer 16 in the lamination direction Ds is preferably the same as the thickness of the anisotropic conductive member 12 in the lamination direction Ds. Thereby, the movement of the anisotropic conductive member 12 in the lamination direction Ds is restricted, and even if vibration due to an external force is applied to the anisotropic conductive member 12 during conveyance, transportation, or storage, damage is further suppressed.

[0026] [Fourth Example of Laminate] FIG. 9 is a schematic perspective view showing a fourth example of the laminate of the embodiment of the present invention. In FIG. 9, the same components as those of the laminate 10 shown in FIG. 1 are denoted by the same reference numerals, and the detailed description thereof is omitted. The laminate 11 shown in FIG. 9 has a core 22, and is different in that the anisotropic conductive member 12 and the organic film 14 are wound around the core 22 in a laminated state, and other configurations are the same as those of the laminate 10 shown in FIG. 1.

[0027] In the laminate 11 shown in FIG. 9, a laminate in which the anisotropic conductive member 12 and the organic film 14 are laminated is referred to as a laminate material 17. The laminate material 17 is wound around the core 22 of the reel 20. The reel 20 is composed of, for example, a core 22 configured as a cylinder, and flanges 24 having a diameter larger than that of the core 22 are provided at both axial ends of the core 22. The core 22 has a through hole 23. A rotating shaft (not shown) for rotating the reel 20 is inserted into the through hole 23. The flange 24 is composed of, for example, a flat plate and has a circular outer shape. The diameter of the flange 24 is larger than the diameter of the core 22 as described above. When the outer shape of the flange 24 is circular, the diameter of the flange 24 is the diameter. When the outer shape of the core 22 is circular, the diameter of the core 22 is the diameter. One end of the laminate 17 in one direction D1 is connected to the core 22 and wound around the core 22 between the flanges 24.

[0028] The material of the reel 20 is not particularly limited, and for example, it is composed of various plastics. Further, the core 22 is not particularly limited to a cylinder and can have a known core shape. The size of the diameter and the axial length of the core 22 are not particularly limited either and are appropriately determined according to the application and the like. When the curvature of the laminate 17 wound around the core 22 is X (1 / m) and the radius of curvature is R (m), it is preferably 5 ≤ X (1 / m) ≤ 40, that is, 0.025 ≤ R (m) ≤ 0.2. When the core 22 is a cylinder, the diameter; when it is not a cylinder, the equivalent diameter of the circle should be set so that when the laminate 17 is wound around the core 22, the curvature X (1 / m) and the radius of curvature R (m) of the laminate 17 are 5 ≤ X (1 / m) ≤ 40, that is, 0.025 ≤ R (m) ≤ 0.2 as described above. The reel 20 is configured to have the flange 24, but is not limited thereto. For example, it may be configured without the flange 24. However, since the flange 24 regulates the position in the width direction Dw of the organic film 14 and can prevent the anisotropic conductive member 12 from falling off the organic film 14, it is preferable for the reel 20 to have the flange 24. Note that the laminate 17 may have a configuration in which the organic films 14 are disposed on both sides of the anisotropic conductive member 12 as shown in FIG. 4. When the laminate 17 is wound around the core 22, for example, the anisotropic conductive member 12 is in a laminated state as shown in FIGS. 2, 3, 5, and 6.

[0029] [The Fifth Example of the Laminate] FIG. 10 is a schematic cross-sectional view showing the fifth example of the laminate according to the embodiment of the present invention. In addition, in FIG. 10, the same components as those of the laminate 10 shown in FIG. 1 are denoted by the same reference numerals, and detailed descriptions thereof are omitted. The laminate 11a shown in FIG. 10 has a storage container 30, an anisotropic conductive member 12, and an organic film 14, and is different in that the anisotropic conductive member 12 and the organic film 14 are laminated in the storage container 30. Other configurations are the same as those of the laminate 10 shown in FIG. 1. The storage container 30 has a container body 32 and a lid 34. The container body 32 is composed of, for example, a cylindrical member having a bottom 32b. The upper part of the bottom 32b of the container body 32 is open and has an opening 32c. The lid 34 is a member that closes the opening 32c of the container body 32. The container body 32 and the lid 34 are, for example, cylindrical members, and the outer shape of the opening 32c of the container body 32 is circular. For the storage container 30, for example, a silicon wafer case can be used.

[0030] In the interior 32a of the container body 32, the anisotropic conductive member 12 and the organic film 14 are repeatedly laminated in this order from the bottom 34b side, and the anisotropic conductive member 12 and the organic film 14 are arranged. In the laminate 11a, for example, the anisotropic conductive member 12 on the lower side in the lamination direction Ds is arranged in the space 18 in the lateral direction Dm orthogonal to the lamination direction Ds of the anisotropic conductive member 12 on the upper side in the lamination direction Ds, so that the anisotropic conductive members 12 do not overlap in the lamination direction Ds. Thereby, the force acting on the anisotropic conductive member 12 in the lamination direction Ds can be reduced, and damage to the insulating base material and the protruding portion of the anisotropic conductive member 12 can be further suppressed.

[0031] In FIG. 11, five layers of the anisotropic conductive member 12 and the organic film 14 are arranged respectively, but the number of layers to be arranged is appropriately determined according to the size of the storage container 30 or the size of the anisotropic conductive member 12, and is not particularly limited to the configuration shown in FIG. 11. As shown in FIG. 11, by laminating and storing the anisotropic conductive members 12 in the storage container 30, many anisotropic conductive members 12 can be stably stored while suppressing damage, and can also be transported as the storage container 30. Even when the storage container 30 is transported, damage to the anisotropic conductive member 12 is suppressed.

[0032] The anisotropic conductive members 12 are laminated so as not to overlap in the stacking direction Ds, but the present invention is not limited to this, and the anisotropic conductive members 12 may be laminated so as to overlap in the stacking direction Ds as shown in FIG. 2. Also, organic films 14 may be disposed on the front surface 12a and the back surface 12b of the anisotropic conductive member 12, respectively, and the anisotropic conductive member 12 and the organic film 14 may be repeatedly laminated in this order in the container body 32.

[0033] Also, the above-described spacer 16 (see FIG. 8) may be provided between the adjacent anisotropic conductive members 12 in the lateral direction Dm orthogonal to the stacking direction Ds. By the spacer 16, the movement of the anisotropic conductive member 12 in the lateral direction Dm is restricted, and the force acting on the anisotropic conductive member 12 in the stacking direction Ds is reduced. Therefore, damage to the anisotropic conductive member 12 can be further suppressed. In the laminate 11a as well, the thickness of the spacer 16 in the stacking direction Ds is preferably the same as the thickness of the anisotropic conductive member 12 in the stacking direction Ds. Thereby, the movement of the anisotropic conductive member 12 in the stacking direction Ds is restricted, and even if vibration due to an external force is applied to the anisotropic conductive member 12 during transportation or storage, damage is further suppressed.

[0034] [First Example of Package] FIG. 11 is a schematic diagram showing a first example of a package according to an embodiment of the present invention. In FIG. 11, the same components as those of the laminate 11 shown in FIG. 9 are denoted by the same reference numerals, and detailed description thereof is omitted. The package 36 shown in FIG. 11 includes a laminate 11 and a storage bag 37 for storing the laminate 11. The laminate 11 is stored in the interior 37a of the storage bag 37. The storage bag 37 has a gas permeability of 1×10 -5 ~1 ml / (m 2 ·day·MPa). The gas permeability of the storage bag 37 is measured, for example, using JIS (Japanese Industrial Standards) K 7126-1:2006 Plastics - Films and Sheets - Test Method for Gas Permeability. The package 36 is provided with a storage bag 37, which suppresses the entry of oxygen into the interior 37a. When the conduction path of the anisotropic conductive member 12 is made of metal, the oxidation of the conduction path is suppressed. Therefore, during the transportation and storage of the anisotropic conductive member 12, the anisotropic conductive member 12 can be transported and stored while being wound around the reel 20 while suppressing the deterioration of performance such as conductivity.

[0035] Note that the package 36 may be provided with an oxygen absorber 38 inside the storage bag 37, and in addition to the oxygen absorber 38, a moisture absorber (not shown) may be provided. Further, the interior 37a of the storage bag 37 may be a non-active gas replacement package in which the interior 37a is replaced with a non-active gas such as argon gas and nitrogen gas, or may be a vacuum package. Further, when suppressing the incidence of light into the interior 37a of the storage bag 37, the storage bag 37 preferably has light-shielding properties. In this case, the light transmittance of the storage bag 37 is preferably at most 1% at maximum in the wavelength range of wavelengths 100 to 780 nm. The light transmittance of the storage bag 37 is measured using a spectrophotometer in the wavelength range of wavelengths 100 nm to 780 nm.

[0036] [Second example of the package] FIG. 12 is a schematic perspective view showing a second example of the package according to the embodiment of the present invention. In FIG. 12, the same components as the laminate 11a shown in FIG. 10 and the package 36 shown in FIG. 11 are denoted by the same reference numerals, and the detailed description thereof is omitted. The package 36a shown in FIG. 12 has a laminate 11a and a storage bag 39 for storing the laminate 11a. The laminate 11a is stored inside the storage bag 39. The package 36a is provided with a storage bag 39, which suppresses the entry of oxygen into the interior 39a. When the conduction path of the anisotropic conductive member 12 is made of metal, the oxidation of the conduction path is suppressed. Therefore, during the transportation and storage of the anisotropic conductive member 12, the anisotropic conductive member 12 can be transported and stored while being stored in the storage container 30 while suppressing the deterioration of performance such as conductivity.

[0037] Note that the package 36a may be provided with an oxygen scavenger 38 inside the storage bag 39, and in addition to the oxygen scavenger 38, a moisture absorbent (not shown) may be provided. Further, the inside 39a of the storage bag 39 may be subjected to inert gas substitution packaging in which it is replaced with an inert gas such as argon gas and nitrogen gas, or may be vacuum packaging. Also, when suppressing the incidence of light into the inside 39a of the storage bag 39, the storage bag 39 preferably has light-shielding properties. In this case, the light transmittance of the storage bag 39 is preferably at most 1% at maximum in the wavelength range of wavelengths 100 to 780 nm. The light transmittance of the storage bag 39 is measured by the same method as the method for measuring the light transmittance of the storage bag 37 described above.

[0038] (organic film) The organic film has a gas permeability of 2.3×10 8 ~4.6×10 9 ml / (m 2 ·day·MPa) as described above. The organic film is preferably a porous film in order to easily attract the anisotropic conductive member. Also, the organic film contains a polymer, and the polymer contains, for example, fluorine atoms. The organic film is composed of, for example, PTFE (polytetrafluoroethylene). More specifically, the Poreflon (registered trademark) membrane FP series manufactured by Sumitomo Electric Fine Polymer, Inc. can be used for the organic film. The organic film has a flexural modulus of elasticity at a temperature of 25°C of, for example, 100 to 10,000 (MPa).

[0039] (storage bag) The storage bag has a gas permeability of 1×10 -5 ~1 ml / (m 2 ·day·MPa) as described above. For the storage bag, for example, gas barrier bags (PTS bag (product name) and aluminum bag (product name)) used in the RP system (registered trademark) manufactured by Mitsubishi Gas Chemical Company, Inc. can be used. In addition, when suppressing the incidence of light as described above, the storage bag preferably has light-shielding properties. In this case, the light transmittance of the storage bag is preferably at most 1% at maximum in the wavelength range of 100 to 780 nm. The method for measuring the light transmittance of the storage bag is as described above. The light transmittance of the storage bag is the light transmittance of the film material forming the storage bag. For example, if the storage bag is produced by sealing a resin film material, the light transmittance of the resin film material becomes the light transmittance of the storage bag.

[0040] (Anisotropic conductive member) FIG. 13 is a schematic cross-sectional view showing an example of the anisotropic conductive member of the laminate according to an embodiment of the present invention. FIG. 14 is a schematic plan view showing an example of the anisotropic conductive member of the laminate according to an embodiment of the present invention. FIG. 14 is a plan view seen from the surface side of the anodic oxide film in FIG. 13 and shows a state without the resin layer 54. The anisotropic conductive member 12 shown in FIG. 13 includes an insulating base material 50 having electrical insulation properties, and a plurality of conductive paths 52 that penetrate the insulating base material 50 in the thickness direction Dt, are provided in a state of being electrically insulated from each other, and have protruding portions protruding from at least one surface. Further, it has a resin layer 54 covering at least one surface of the insulating base material 50. The anisotropic conductive member 12 has conductivity in the thickness direction Dt of the insulating base material 50. In the above-described laminate 10 (see FIG. 1), the anisotropic conductive member 12 is laminated with the organic film 14 in parallel with the thickness direction Dt of the insulating base material 50 and the lamination direction Ds of the laminate 10. Note that in the anisotropic conductive member 12, the resin layer 54 is not necessarily required, and a configuration without the resin layer 54 may be employed.

[0041] The plurality of conductive paths 52 are provided in the insulating base material 50 in a state of being electrically insulated from each other. In this case, for example, the insulating base material 50 has a plurality of pores 51 penetrating in the thickness direction Dt. The conductive paths 52 are provided in the plurality of pores 51. The conductive paths 52 protrude from the surface 50a of the insulating base material 50. Further, the conductive paths 52 protrude from the back surface 50b of the insulating base material 50. The conductive path 52 only needs to protrude from one surface in the thickness direction Dt of the insulating base material 50. For example, a resin layer 54 is provided on the surface of the insulating base material 50 from which the conductive path 52 protrudes. The resin layer 54 covers the protruding portion 52a of the conductive path 52, and the protruding portion 52a is embedded in the resin layer 54. Further, the resin layer 54 covers the protruding portion 52b of the conductive path 52, and the protruding portion 52b is embedded in the resin layer 54. The insulating base material 50 is composed of, for example, an anodized film. The anodized film is formed by anodizing, for example, a valve metal. The front surface 50a and the back surface 50b of the insulating base material 50 are surfaces facing each other in the thickness direction Dt of the insulating base material 50.

[0042] The anisotropic conductive member 12 has anisotropic conductivity. As described above, it has conductivity in the thickness direction Dt, but the conductivity in the direction parallel to the front surface 50a of the insulating base material 50 is sufficiently low. As shown in FIG. 14, the anisotropic conductive member 12 has, for example, a rectangular outer shape. Note that the outer shape and size of the anisotropic conductive member 12 are appropriately determined according to the application and the like. For example, the anisotropic conductive member 12 is joined in a state where there is no resin layer 54, or in a state where there is a resin layer 54 but there is nothing on the surface 54a.

[0043] Hereinafter, the configuration of the anisotropic conductive member will be described more specifically. The anisotropic conductive member has, for example, the same configuration as the structure described in International Publication No. 2022 / 163260, and can also be manufactured in the same manner as the above-described structure.

[0044] <Insulating base material> The insulating base material 50 is a conductor that electrically insulates a plurality of conductive paths 52 from each other. As described above, the insulating base material 50 has electrical insulation. Further, the insulating base material 50 has a plurality of pores 51 in which the conductive paths 52 are formed. The composition and the like of the insulating base material 50 will be described later. The length in the thickness direction Dt of the insulating substrate 50, that is, the thickness ht of the insulating substrate 50, is preferably in the range of 1 to 1000 μm, more preferably in the range of 5 to 500 μm, and even more preferably in the range of 10 to 300 μm. When the thickness ht of the insulating substrate 50 is within this range, the handleability of the insulating substrate 50 becomes good. From the viewpoint of ease of winding, the thickness ht of the insulating substrate 50 is preferably 30 μm or less, and more preferably 5 to 20 μm.

[0045] Note that the thickness of the insulating substrate can be measured by cutting the insulating substrate using a focused ion beam (FIB) in the thickness direction Dt and obtaining a photographed image at a magnification of 50,000 times using a field emission scanning electron microscope (FE-SEM) for its cross-section. In the photographed image, the length of 10 locations corresponding to the thickness of the insulating substrate is measured, and the average value of the lengths of the 10 measured locations is obtained. This average value is taken as the thickness of the insulating substrate.

[0046] <Average diameter of pores> The average diameter of the pores 51 is preferably 1 μm or less, more preferably 5 to 500 nm, even more preferably 20 to 400 nm, still more preferably 40 to 200 nm, and most preferably 50 to 100 nm. When the average diameter d of the pores 51 is 1 μm or less and within the above range, a conduction path 52 having the above average diameter can be obtained. The average diameter of the pores 51 can be measured by photographing the surface of the insulating substrate 50 directly from above at a magnification of 100 to 10,000 times using a scanning electron microscope (SEM) to obtain a photographed image. In the photographed image, at least 20 pores whose peripheries are continuously connected in an annular shape are extracted, their diameters are measured as the open diameters, and the average value of these open diameters is calculated as the average diameter of the pores. Note that the magnification can be appropriately selected within the range described above so that a photographed image capable of extracting 20 or more pores can be obtained. Also, the aperture diameter is measured as the maximum value of the distance between the ends of the pore portion. That is, since the shape of the opening of the pore is not limited to a substantially circular shape, when the shape of the opening is non-circular, the maximum value of the distance between the ends of the pore portion is defined as the aperture diameter. Therefore, for example, even in the case of pores having a shape in which two or more pores are integrated, this is regarded as one pore, and the maximum value of the distance between the ends of the pore portion is defined as the aperture diameter.

[0047] <Conductive path> As described above, the plurality of conductive paths 52 are provided in an electrically insulated state from each other in the insulating base material 50, for example, an anodic oxide film. The plurality of conductive paths 52 have electrical conductivity. The conductive path is composed of a conductive substance. The conductive substance is not particularly limited, and examples include metals. Specific examples of the metal include gold (Au), silver (Ag), copper (Cu), aluminum (Al), magnesium (Mg), nickel (Ni), zinc (Zn), and cobalt (Co) etc. are preferably exemplified. From the viewpoint of electrical conductivity, copper, gold, aluminum, nickel, and cobalt are preferable, copper and gold are more preferable, and copper is most preferable. Since the metal is superior in ductility etc. compared to an oxide conductor and is easily deformed, and is also easily deformed even by compression during joining, it is preferable that the conductive path is composed of a metal. The height of the conductive path 52 in the thickness direction Dt is preferably 10 to 300 μm, and more preferably 20 to 30 μm.

[0048] <<Shape of conductive path>> The average diameter d of the conductive path 52 is preferably 1 μm or less, more preferably 5 to 500 nm, further preferably 20 to 400 nm, still more preferably 40 to 200 nm, and most preferably 50 to 100 nm. The density of the conductive paths 52 is preferably 20,000 or more per mm 2 and more preferably 2,000,000 or more per mm 2 and even more preferably 10,000,000 or more per mm2 It is more preferable that it is the above, and 50 million pieces / mm 2 It is particularly preferable that it is the above, and 100 million pieces / mm 2 It is most preferable that it is the above. Furthermore, the center - to - center distance p between adjacent conductive paths 52 is preferably 20 nm to 500 nm, more preferably 40 nm to 200 nm, and even more preferably 50 nm to 140 nm.

[0049] The average diameter of the conductive path: Photograph the surface of the insulating substrate directly from above at a magnification of 100 to 10,000 times using a scanning electron microscope to obtain a photographed image. In the photographed image, at least 20 conductive paths whose peripheries are continuously annular are extracted, their diameters are measured and taken as the opening diameters, and the average value of these opening diameters is calculated as the average diameter of the conductive path. Note that the magnification can be appropriately selected within the above - mentioned range so that a photographed image from which 20 or more conductive paths can be extracted is obtained. Also, when the shape of the opening is non - circular, the maximum value of the distance between the ends of the conductive path portion is taken as the opening diameter. Therefore, for example, in the case of a conductive path having a shape such that two or more conductive paths are integrated, this is regarded as one conductive path, and the maximum value of the distance between the ends of the conductive path portion is taken as the opening diameter. The average diameter d of the conductive path 52 is the same as the average diameter of the protruding portion. The center - to - center distance p between adjacent conductive paths 52: In the photographed image of the insulating substrate 50 obtained as described above, the center position (not shown) of the specified conductive path is further specified. The distances between the center positions of adjacent conductive paths are obtained at 10 locations. This average value is taken as the center - to - center distance p between adjacent conductive paths 52. The center position is the center position of the region corresponding to the conductive path 52 in the above - mentioned photographed image. Note that a known image analysis method is used to calculate the center position of the region in the photographed image.

[0050] <<Protruding portion>> The protruding portion is a part of the conductive path and is columnar. Since the protruding portion can increase the contact area with the object to be joined, it is preferably cylindrical. The average protruding length ha of the protruding portion 52a and the average length hb of the protruding portion 52b are preferably from 10 nm to 1000 nm, more preferably from 50 nm to 500 nm. If the average protruding length ha and the average length hb are from 10 nm to 1000 nm, the adhesion between the resin layer 54 and the insulating substrate 50 will be good. The average protruding length ha of the protruding portion 52a and the average length hb of the protruding portion 52b are the average values obtained by acquiring a cross-sectional image of the protruding portion using a scanning electron microscope as described above, measuring the height of the protruding portion at 10 points respectively based on the cross-sectional image.

[0051] Regarding the conduction path 52, the distance between adjacent protruding portions is preferably from 20 nm to 200 nm, more preferably from 40 nm to 100 nm. When the distance between adjacent protruding portions is within the above range, the distance between the conduction paths 52 can be maintained on the surface 50a or the back surface 50b of the insulating substrate 50 of the conduction path 52. Thereby, when joining to a connection target such as a semiconductor device, a short circuit of the conduction path 52 is suppressed, and the reliability at the time of joining is further increased.

[0052] <<Resin layer>> The resin layer covers at least one of the front and back surfaces of the insulating substrate as described above, and protects the insulating substrate and the conduction path. For example, if the conduction path has a protruding portion, the resin layer embeds the protruding portion. That is, the resin layer covers the end portion of the conduction path protruding from the insulating substrate and protects the protruding portion. In order to exhibit the above functions, the resin layer preferably shows fluidity in a temperature range of, for example, 50 °C to 200 °C and cures at 200 °C or higher. The resin layer is, for example, a thermoplastic layer composed of a thermoplastic resin or the like, but the resin layer will be described in detail later. The average thickness hm of the resin layer 54 is preferably 10 μm or less, more preferably 5 μm or less, and still more preferably 1 μm or less. If the average thickness hm of the resin layer 54 is 10 μm or less as described above, it can sufficiently protect the protruding portion of the conduction path 52 and fill the periphery of the electrode when joining to a connection target such as a semiconductor device. The average thickness hm of the resin layer 54 is the average distance from the surface 50a of the insulating base material 50 or the average distance from the back surface 50b of the insulating base material 50. The average thickness hm of the resin layer 54 described above is obtained by cutting the resin layer in the thickness direction Dt of the anisotropic conductive member 12 and acquiring a photographed image of the cut cross-section using a scanning electron microscope. In the photographed image, the distance from the surface 50a of the insulating base material 50 corresponding to the resin layer is measured at 10 locations, and the average value of the lengths measured at the 10 locations is obtained. This average value is taken as the average thickness hm of the resin layer 54 on the surface 50a side of the insulating base material 50. Furthermore, the distance from the back surface 50b of the insulating base material 50 is measured at 10 locations. The average value of the lengths measured at the 10 locations is obtained. This average value is taken as the average thickness hm of the resin layer 54 on the back surface 50b side of the insulating base material 50.

[0053] The following composition can also be used for the resin layer. Hereinafter, the composition of the resin layer will be described. For example, the resin layer contains a polymer material and may contain an antioxidant material. Specific examples of the resin material constituting the resin layer include thermoplastic resins such as ethylene copolymers, polyamide resins, polyester resins, polyurethane resins, polyolefin resins, acrylic resins, acrylonitrile resins, and cellulose resins. Polyacrylonitrile can also be used as the resin material constituting the resin layer 54. In addition to the above, as the resin layer, for example, a resin layer containing a main composition including an acrylic polymer, an acrylic monomer, and a maleimide compound described in International Publication No. 2022 / 163260 can be used.

[0054] The present invention is basically configured as described above. Although the laminate and the package of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments, and various improvements or modifications can of course be made without departing from the gist of the present invention.

Explanation of Reference Numerals

[0055] 10, 11, 11a laminate 12 anisotropic conductive member Surfaces of 12a, 14a, 50a, and 54a Inner surfaces of 12b, 14b, and 50b Region 13 Organic film 14 Spacer 16 Laminated material 17 Between 18 Head 19 Reel 20 Bobbin 22 Through-hole 23 Flange 24 Storage container 30 Container body 32 Inside of 32a, 37a, and 39a Bottom 32b Opening 32c Cover 34 Bottom 34b Package 36 Package 36a Storage bag 37 and 39 Oxygen absorber 38 Insulating substrate 50 Pores 51 Conductive path 52 Protrusions 52a and 52b Resin layer 54 Direction D1 (one direction) Direction Dm (lateral direction) Lamination direction Ds Thickness direction Dt Width direction Dw Average diameter d Average thickness hm Thickness ht Center-to-center distance p

Claims

1. An anisotropic conductive member having an insulating base material with electrical insulation properties, and a plurality of conductive paths provided so as to penetrate in the thickness direction of the insulating base material and having protruding portions protruding from at least one surface of the insulating base material, and an organic film directly disposed on at least one of two surfaces facing each other in the thickness direction of the insulating base material of the anisotropic conductive member. The organic film has an oxygen gas permeability of 2.3×10 8 to 4.6×10 9 ml / (m 2 ·day·MPa), and is a laminate containing a polymer containing fluorine atoms.

2. The laminate according to claim 1, wherein the organic film is directly disposed on the two surfaces facing each other in the thickness direction of the insulating base material.

3. The laminate according to claim 2, having a spacer disposed on a surface of the organic film in contact with the anisotropic conductive member.

4. The laminate according to claim 1, having a winding core, and being wound around the winding core in a state where the anisotropic conductive member and the organic film are laminated.

5. The laminate according to claim 4, wherein the winding core is formed of a cylinder, and flanges having a diameter larger than the diameter of the winding core are provided at both axial ends of the winding core, respectively.

6. The laminate according to claim 1, wherein the organic film is a porous film.

7. The laminate according to claim 1, wherein a plurality of the anisotropic conductive members are arranged in one direction on at least one surface of the organic film.

8. The laminate according to claim 2, wherein the anisotropic conductive members are directly disposed on the two surfaces facing each other in the thickness direction of the organic film, respectively.

9. A laminate according to any one of claims 1 to 8, and a storage bag for storing the laminate. The storage bag has an oxygen gas permeability of 1×10 -5 ~1 ml / (m 2 ·day·MPa), and is a packaging body.

10. The package according to claim 9, wherein the storage bag has a light transmittance of at most 1% in a wavelength range of 100 to 780 nm.

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