Method of manufacturing an electronic device

Abstract

To provide a method for manufacturing an electronic device having a hollow structure which has high reliability and can be thinned.SOLUTION: A method for manufacturing an electronic device laminates a first resin layer 2 as a wall part 2a of an electronic device and a second resin layer 3 as a lid part 3a on a substrate 1 in which a plurality of lattice-like cutting regions and a plurality of electronic device formation regions surrounded by the cutting region are arranged, seals the lamination in a hollow shape, and then cuts a cutting region. A support part 8 composed of the first resin layer 2 is provided in the cutting region, which suppresses problem occurrence in a singulation step or a polishing step.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a method for manufacturing an electronic device, and more particularly to a method for manufacturing an electronic device having a hollow structure.

Background Art

[0002] For example, a surface acoustic wave device, which is one type of acoustic wave device, has electrodes formed on a piezoelectric substrate for exciting surface acoustic waves such as comb-shaped electrodes. Since the surface acoustic wave propagates on the surface of the piezoelectric substrate, it is necessary to form a hollow structure on the surface of the piezoelectric substrate and the electrodes where the acoustic wave vibrates.

[0003] In addition, with the miniaturization of electronic devices mounted with electronic devices such as acoustic wave devices, there is a demand for miniaturization and thinning of electronic devices. Therefore, a method of forming a sealing layer on the substrate on which the electronic device is formed and then separating the individual pieces has been adopted (Patent Document 1).

[0004] FIG. 6 is an explanatory diagram of the singulation process of a conventional method for manufacturing an electronic device. A first resin layer 2 and a second resin layer 3 are laminated and sealed on a substrate 1 on which an electronic device such as a surface acoustic wave device is formed. The first resin layer 2 is arranged so as to surround the electronic device formation region of the substrate 1, and a part thereof is further removed along the cutting region. The second resin layer 3 is disposed entirely on the first resin layer 2. By adopting such a configuration, a hollow structure is formed in the electronic device formation region and the cutting region (FIG. 6a). 4 is a protruding electrode formed so as to protrude on the second resin layer 3, and serves as a lead-out electrode connected to an electrode connected to an electronic device (not shown) formed in the electronic device formation region.

[0005] In the singulation process, the dicing saw 5 is run along the cutting regions arranged in a grid pattern around the electronic device formation region. As shown in FIG. 6(b), by cutting and removing a part of the second resin layer 3 and the substrate 1, it is singulated into individual electronic devices. By making the cutting region have a hollow structure and running the dicing saw 5 along this cutting region, the dicing saw 5 does not contact the first resin layer 2 of the electronic device formation region, so the adhesion between the first resin layer 2 and the substrate 1 is not impaired, and a highly reliable electronic device can be formed.

Prior Art Documents

Patent Documents

[0006]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0007] However, in the above method, when cutting and removing the second resin layer 3 using the dicing saw 5, a pressure is applied to push down the second resin layer 3 from the dicing saw 5, causing the second resin layer 3 to peel off from the first resin layer 2 or applying stress to the protruding electrode 4 in its vicinity, thus impairing the reliability of the electronic device.

[0008] Also, with the demand for smaller and thinner electronic devices, when the substrate 1 is thinned (polished), cracks occur in the substrate 1. This is because when attaching the protective sheet 6 to the surface of the substrate 1 (the side where the protruding electrode 4 protrudes) as shown in FIG. 7(a) in the polishing process, a gap remains near the protruding electrode 4, and in a narrow region such as the cutting region, the surface of the second resin layer 3 and the protective sheet 6 do not adhere sufficiently. When a crack 7 occurs as shown in FIG. 7(b), it becomes difficult to perform singulation by peeling off the protective sheet 6 after the polishing process. In view of such a situation, an object of the present invention is to provide a method for manufacturing an electronic device having a hollow structure with high reliability and capable of being thinned.

Means for Solving the Problem

[0009] In order to achieve the above object, the invention according to claim 1 of the present application arranges a lattice-shaped cutting region and an electronic device formation region surrounded by the cutting region on a substrate, and after sealing the electronic device formation region in a hollow shape with a resin constituting a wall portion and a lid portion, the resin in the cutting region and the substrate are cut to individualize into individual electronic devices having a hollow structure sealed with the resin. In the manufacturing method of the electronic device, a step of preparing the substrate on which an electronic device is formed in the electronic device formation region, and the wall portion surrounding the electronic device formation region , and , separated from the wall portion and along the region where the cutting region is cut and removed at the same height as the wall portion continuously around the wall portion A lattice-shaped support portion arranged 、 To form a first resin layer to form And a step of forming a second resin layer serving as the lid portion on the first resin layer, forming a protruding electrode connected to the electronic device and protruding on the second resin layer, and a polishing step of thinning the substrate provided with the protruding electrode, and cutting and removing a part of the support portion, the lid portion, and the substrate in the cutting region using a dicing saw to individualize into individual electronic devices. The step of forming the second resin layer is a step of sealing the electronic device with the wall portion and the lid portion and arranging the support portion between the substrate and the second resin layer. The polishing step is a step of thinning the substrate in which the support portion is arranged between the second resin layer.

Advantages of the Invention

[0011] According to the method for manufacturing an electronic device of the present invention, when singulating, the dicing saw 5 does not contact the first resin layer 2 in the electronic device formation region, and the second resin layer 3 to be further cut is cut while being supported by the support portion 8, so that the stress applied to the second resin layer 3 can be reduced, and a highly reliable electronic device can be formed. Further, since the support portion 8 has a structure that contacts the substrate 1 and the second resin layer 3, it is possible to prevent stress from concentrating on a part of the substrate 1 during polishing and suppress the occurrence of cracks.

Brief Description of the Drawings

[0012]

Figure 1

Figure 2

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Figure 4

Figure 5

Figure 6

Figure 7

Embodiments for Carrying Out the Invention

[0013] The manufacturing method of the electronic device of the present invention is a method of manufacturing an electronic device having a hollow structure by laminating a first resin layer serving as a wall portion of the electronic device and a second resin layer serving as a lid portion on a substrate on which a lattice-shaped cutting region and a plurality of electronic device formation regions surrounded by this cutting region are arranged, and then sealing them in a hollow shape, and then cutting the cutting region. In particular, in the present invention, the cutting region is provided with a support portion made of the first resin layer. Hereinafter, embodiments of the present invention will be described.

[0014] First, a plurality of electronic devices are formed on the substrate 1. Each individual electronic device is formed in an electronic device formation region surrounded by a cutting region that is cut and removed in a lattice shape for singulation. Next, the first resin layer 2 is formed over the entire surface of the substrate 1 on which the electronic devices are formed, and patterning is performed by a normal photolithography method to form a wall portion 2a and a support portion 8 made of the first resin layer 2 (FIG. 1a). Since the wall portion 2a and the support portion 8 are formed simultaneously, they have the same height.

[0015] FIG. 2 is a plan view for explaining the arrangement of the wall portion 2a and the support portion 8 made of the first resin layer 2, and shows an example in which nine electronic device formation regions are arranged on the substrate 1. The region along the lattice-shaped support portion 8 becomes the cutting region, and the wall portion 2a is arranged in the inner electronic device formation region. Note that a lead electrode 9 for connecting to a protruding electrode described later is arranged on the substrate 1 covered by the wall portion 2a, and electrodes of the electronic device connected to this electrode are not shown.

[0016] Thereafter, by laminating and forming the second resin layer 3 on the wall portion 2a and the support portion 8 (the first resin layer 2), the electronic device formed in the electronic device formation region is sealed by the first resin layer 2 and the second resin layer 3 (FIG. 1b). The second resin layer 3 becomes a lid portion 3a, and after singulation described later, the electronic device will be sealed by the wall portion 2a and the lid portion 3a.

[0017] In order to form the protruding electrode, a part of the wall portion 2a of the second resin layer 3 and the first resin layer 2 is removed to expose a part of the surface of the lead electrode 9 (FIG. 1c).

[0018] Thereafter, a protruding electrode 4 connected to the extraction electrode 9 is formed (Fig. 1d). This protruding electrode 4 can be formed by an ordinary plating method or the like. The protruding electrode 4 is formed in a relatively high convex shape to achieve a desired mounting height when mounting the electronic device on a mounting substrate or the like. For example, it is formed to a height of about 50 μm.

[0019] In order to individualize each electronic device, a dicing saw 5 is run along the cutting region (Fig. 3). Here, the dicing saw 5 runs in the region where the support portion 8 is formed. As a result, the dicing saw 5 cuts and removes the support layer 8 composed of the second resin layer 3 and the first resin layer 2 and the substrate 1. By adopting a configuration including the support portion 8 in this way, the stress for the dicing saw 5 to push down the second resin layer 3 is reduced, and no stress is applied to the nearby protruding electrode 4. Further, since the wall portion 2a formed of the first resin layer 2 does not come into contact with the dicing saw 5, there is no stress on the wall portion 2a. As a result, it becomes possible to form a highly reliable electronic device.

[0020] Next, another embodiment including a step of thinning the substrate 1 will be described. Similar to the above embodiment, a plurality of electronic devices are formed on the substrate 1. Each electronic device is formed in an electronic device formation region surrounded by a cutting region that is cut and removed in a grid pattern for individualization. Next, a first resin layer 2 is formed over the entire surface of the substrate 1 on which the electronic devices are formed, and patterning is performed by an ordinary photolithography method to form a wall portion 2a and a support portion 8 made of the first resin layer 2 (Fig. 1a). Since the wall portion 2a and the support portion 8 are formed simultaneously, they have the same height.

[0021] Thereafter, by laminating and forming a second resin layer 3 on the wall portion 2a and the support portion 8 (the first resin layer 2), the electronic devices formed in the electronic device formation region are sealed by the first resin layer 2 and the second resin layer 3 (Fig. 1b). The second resin layer 3 becomes a lid portion 3a, and after individualization described later, the electronic device is sealed by the wall portion 2a and the lid portion 3a.

[0022] To form the protruding electrode, a part of the wall portion 2a of the second resin layer 3 and the first resin layer 2 is removed to expose a part of the surface of the lead-out electrode 9 (Fig. 1c).

[0023] Thereafter, a protruding electrode 4 connected to the lead-out electrode 9 is formed (Fig. 1d). This protruding electrode 4 can be formed by an ordinary plating method or the like. The protruding electrode 4 is formed in a relatively high convex shape to achieve a desired mounting height when mounting the electronic device on a mounting substrate or the like. For example, it is formed to a height of about 50 μm.

[0024] Next, a polishing process for thinning the substrate 1 is performed. Generally, as in the polishing process, a protective sheet 6 is attached to the surface of the substrate 1 as shown in Fig. 4(a). At this time, as in the conventional example, a gap remains in the vicinity of the protruding electrode 4. It is the same as the conventional example that the surface of the second resin layer 3 and the protective sheet 6 do not adhere sufficiently in a narrow region such as a cutting region.

[0025] In such a state, the back surface of the substrate 1 is thinned (Fig. 4b). Here, in this embodiment, there is a support portion 8 between the substrate 1 and the second resin layer 3. Conventionally, when thinning in a state where the surface of the second resin layer 3 and the protective sheet 6 do not sufficiently contact in a narrow region such as a cutting region, a crack 7 occurred in the substrate 1 (Fig. 7b). However, in this embodiment, by arranging the support portion 8, cracks do not occur in the substrate 1, and it becomes possible to thin the substrate.

[0026] Thereafter, as in the above-described embodiment, in order to singulate the individual electronic devices, the dicing saw 5 is run along the cutting region (Fig. 5). As a result, the dicing saw 5 cuts and removes the support portion 8 composed of the second resin layer 3 and the first resin layer 2 and the thinned substrate 1, and the individual pieces are separated. By configuring with such a support portion 8, the stress for the dicing saw 5 to push down the second resin layer 3 is reduced, and no stress is applied to the nearby protruding electrode 4. In addition, since the wall portion 2a formed of the first resin layer 2 does not come into contact with the dicing saw 5, there is no stress on the wall portion 2a. As a result, it becomes possible to form a highly reliable electronic device.

[0027] In addition, in the above embodiment, the case where all of the support portions 8 are removed during singulation has been described. However, if the width of the support portion 8 is set wider than the cutting width by the dicing saw 5, a part of the support portion 8 remains. Even in such a case, there is no problem as long as the support portion 8 is formed so as to be separated from the wall portion 2a. In that case, a part of the support portion 8 remains in the formed electronic device.

[0028] As described above, according to the present invention, it is possible to form a highly reliable electronic device. The present invention is applicable not only to surface acoustic wave devices but also to manufacturing methods of various electronic devices that are required to be sealed in a hollow package.

Explanation of Reference Numerals

[0029] 1: Substrate, 2: First resin layer, 2a: Wall portion, 3: Second resin layer, 3a: Lid portion, 4: Protrusion electrode, 5: Dicing saw, 6: Protective sheet, 7: Crack, 8: Support portion, 9: Lead-out electrode

Claims

【Claim 1】 In a method for manufacturing an electronic device, a lattice-shaped cutting region and an electronic device formation region surrounded by the cutting region are arranged on a substrate. After the electronic device formation region is sealed in a hollow shape with a resin constituting a wall portion and a lid portion, the resin in the cutting region and the substrate are cut to individualize the electronic devices having a hollow structure sealed with the resin. A step of preparing the substrate on which an electronic device is formed in the electronic device formation region; A step of forming a first resin layer that becomes a wall portion surrounding the electronic device formation region and a lattice-shaped support portion continuously arranged around the wall portion along a region where the cutting region is cut and removed and spaced apart from the wall portion and at the same height as the wall portion; A step of forming a second resin layer serving as the lid portion on the first resin layer; A polishing step of forming a projection electrode protruding on the second resin layer by connecting to the electronic device and thinning the substrate provided with the projection electrode; An individualization step of individualizing the electronic devices by cutting and removing a part of the support portion, the lid portion, and the substrate in the cutting region using a dicing saw, and The step of forming the second resin layer is a step of sealing the electronic device with the wall portion and the lid portion and arranging the support portion between the substrate and the second resin layer, The polishing step is a step of thinning the substrate in which the support portion is arranged between the second resin layer. A method for manufacturing an electronic device, characterized by the above.

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