Substrate processing apparatus, method for manufacturing semiconductor device, and program

Abstract

To provide a technique capable of rapidly identifying a cause of an occurrence of a failure and supporting a recovery.SOLUTION: A substrate processing apparatus includes: a storage part that stores a recipe defining a processing condition of a substrate, apparatus information reported from the apparatus, and failure information generated at a failure occurrence time of the apparatus; a process vessel that allows the substrate to be processed on the basis of the designated recipe; and a control part. Therein the control part can perform control for, at the failure occurrence time of the apparatus: causing the storage part to store, as failure data, together with the failure occurrence time included in the failure information, the recipe and first apparatus information reported before the failure during a first period defined in advance; and adding, to the failure data, second apparatus information reported after the failure during a second period defined in advance.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present disclosure relates to a substrate processing apparatus, a method for manufacturing a semiconductor device, and a program.

Background Art

[0002] In a substrate processing apparatus, after a device failure occurs, reducing the time from identifying the cause to resolving the failure is an important issue for improving the productivity of the device. In the prior art, device data at the time of failure may be saved as failure information and provided to the user to enable identification of the cause.

[0003] For example, Patent Document 1 describes a technique of displaying a display screen having a region for displaying the generation history of an alarm and a region for displaying monitor data corresponding to analysis items, after detecting a failure.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In the prior art, when a device failure occurs, the information that the user can confirm may be only the device data at the time of failure. For this reason, there is a problem that the information regarding the occurred failure is insufficient and it takes time to identify the cause of the failure.

[0006] The present disclosure provides a configuration that can assist in quickly identifying and recovering the cause of a failure.

Means for Solving the Problems

[0007] According to one aspect of the present disclosure, A storage unit that stores a recipe defining processing conditions of a substrate, device information reported by a device, and failure information generated when a failure occurs in the device; a processing container capable of processing the substrate based on the specified recipe; when a failure occurs in the device, first device information reported in a predefined first period before the failure, and the recipe are stored in the storage unit as failure data together with the failure occurrence time included in the failure information, and a control unit capable of performing control to add second device information reported in a predefined second period from the time of the failure occurrence to the failure data A configuration including the above is provided.

Advantages of the Invention

[0008] According to the present disclosure, it is possible to assist in quickly identifying and recovering the cause of a failure.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

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Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Mode for Carrying Out the Invention

[0010] Hereinafter, one aspect of the present disclosure will be described mainly with reference to FIGS. 1 to 14. Note that the drawings used in the following description are all schematic, and the dimensional relationships and ratios of the respective elements shown in the drawings do not necessarily match the actual ones. Also, the dimensional relationships and ratios of the respective elements do not necessarily match among the plurality of drawings.

[0011] (Outline of the substrate processing apparatus) Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings. First, in FIGS. 1 and 2, a substrate processing apparatus 1 in which the present disclosure is implemented will be described.

[0012] The substrate processing apparatus 1 includes a housing 2. A front maintenance port 4, which is an opening provided so as to be maintainable, is formed in the lower part of the front wall 3 of the housing 2, and the front maintenance port 4 is opened and closed by a front maintenance door 5.

[0013] A pod loading / unloading port 6 is formed in the front wall 3 of the housing 2 so as to communicate the inside and outside of the housing 2. The pod loading / unloading port 6 is opened and closed by a front shutter 7. A load port 8 is installed on the front side directly in front of the pod loading / unloading port 6, and the load port 8 is configured to align the placed pod 9.

[0014] The pod 9 is a sealed substrate transfer container, which is carried onto the load port 8 by an in-process transfer device (not shown) and carried out from the load port 8.

[0015] An upper part at a substantially central portion in the front-rear direction within the housing 2 is provided with a rotary pod shelf 11, which is configured to store a plurality of pods 9.

[0016] The rotary pod shelf 11 includes a column 12 that is vertically erected and intermittently rotated, and a plurality of shelves 13 that are radially supported at upper, middle, and lower positions on the column 12. The shelves 13 are configured to store a plurality of pods 9 in a state where they are placed thereon.

[0017] Below the rotary pod shelf 11, a pod opener 14 is provided. The pod opener 14 has a configuration in which the pod 9 can be placed thereon and the lid of the pod 9 can be opened and closed.

[0018] A pod transfer mechanism (container transfer mechanism) 15 is installed between the load port 8, the rotary pod shelf 11, and the pod opener 14. The pod transfer mechanism 15 is configured to hold the pod 9 and be capable of moving up and down and advancing and retreating in the horizontal direction, and to transfer the pod 9 between the load port 8, the rotary pod shelf 11, and the pod opener 14.

[0019] A sub-housing 16 is provided across the rear end at a lower part in a substantially central portion in the front-rear direction within the housing 2. On the front wall 17 of the sub-housing 16, a pair of substrate loading / unloading ports 19 for loading and unloading a wafer (hereinafter referred to as a substrate) 18 into and from the sub-housing 16 are provided side by side in two vertical rows. Pod openers 14 are respectively provided for the upper and lower substrate loading / unloading ports 19.

[0020] The pod opener 14 includes a mounting table 21 for mounting the pod 9 and an opening / closing mechanism 22 for opening and closing the lid of the pod 9. The pod opener 14 is configured to open and close the substrate entrance / exit of the pod 9 by opening and closing the lid of the pod 9 mounted on the mounting table 21 with the opening / closing mechanism 22.

[0021] The sub-housing 16 forms an airtight transfer chamber 23 from the space (pod transfer space) where the pod transfer mechanism 15 and the rotary pod rack 11 are arranged. A substrate transfer mechanism 24 is installed in the front region of the transfer chamber 23. The substrate transfer mechanism 24 includes substrate mounting plates 25 for mounting a required number (five in the figure) of substrates 18. The substrate mounting plates 25 are linearly movable, rotatable in the horizontal direction, and vertically movable in the horizontal direction. The substrate transfer mechanism 24 is configured to load and unload the substrate 18 with respect to the boat 26.

[0022] In the rear region of the transfer chamber 23, a standby section 27 for accommodating and waiting the boat 26 is formed, and a vertical processing furnace 28 is provided above the standby section 27. The processing furnace 28 forms a processing chamber 29 inside, and the lower end of the processing chamber 29 is a furnace mouth portion, and the furnace mouth portion is configured to be opened and closed by a furnace mouth shutter 31. Note that the processing furnace 28 is an example of a processing container.

[0023] A boat elevator 32 for raising and lowering the boat 26 is installed between the right end of the housing 2 and the right end of the standby section 27 of the sub-housing 16. A seal cap 34 as a lid is horizontally attached to an arm 33 connected to the lifting platform of the boat elevator 32. The seal cap 34 vertically supports the boat 26 and can airtightly close the furnace mouth portion in a state where the boat 26 is loaded into the processing chamber 29.

[0024] The boat 26 is configured to hold a plurality of substrates 18 in a horizontal posture in multiple stages with the centers thereof aligned.

[0025] A clean unit 35 is arranged at a position facing the boat elevator 32. The clean unit 35 is composed of a supply fan that supplies clean air 36, which is a purified atmosphere or an inert gas, and a dust filter. A notch alignment device (not shown) as a substrate alignment device for aligning the circumferential position of the substrate 18 is installed between the substrate transfer mechanism 24 and the clean unit 35.

[0026] The clean air 36 blown out from the clean unit 35 is circulated through the notch alignment device (not shown), the substrate transfer mechanism 24, and the boat 26, and then sucked by a duct (not shown) and exhausted to the outside of the housing 2, or configured to be blown into the transfer chamber 23 by the clean unit 35.

[0027] Next, the operation of the substrate processing apparatus 1 will be described.

[0028] When the pod 9 is supplied to the load port 8, the pod loading / unloading port 6 is opened by the front shutter 7. The pod 9 on the load port 8 is carried into the housing 2 through the pod loading / unloading port 6 by the pod transfer mechanism 15 and placed on the designated shelf board 13 of the rotary pod shelf 11. After being temporarily stored in the rotary pod shelf 11, the pod 9 is transported from the shelf board 13 to one of the pod openers 14 by the pod transfer mechanism 15 and transferred to the mounting table 21, or directly transferred from the load port 8 to the mounting table 21.

[0029] At this time, the substrate loading / unloading port 19 is closed by the opening / closing mechanism 22, and clean air 36 is circulated and filled in the transfer chamber 23. For example, when the transfer chamber 23 is filled with nitrogen gas as the clean air 36, the oxygen concentration is set to 20 ppm or less, which is much lower than the oxygen concentration inside the housing 2 (atmospheric atmosphere).

[0030] The pod 9 placed on the mounting table 21 has its opening-side end face pressed against the opening edge of the substrate loading / unloading port 19 on the front wall 17 of the sub-housing 16, and the lid is removed by the lid opening / closing mechanism 22, thereby opening the wafer inlet / outlet.

[0031] When the pod 9 is opened by the pod opener 14, the substrate 18 is taken out from the pod 9 by the substrate transfer mechanism 24, transferred to a notch alignment device (not shown), and after the substrate 18 is aligned by the notch alignment device, the substrate transfer mechanism 24 carries the substrate 18 into the standby section 27 behind the transfer chamber 23 and loads (charges) it into the boat 26.

[0032] After delivering the substrate 18 to the boat 26, the substrate transfer mechanism 24 returns to the pod 9 and loads the next substrate 18 into the boat 26.

[0033] During the loading operation of the substrate 18 into the boat 26 by the substrate transfer mechanism 24 in one (upper or lower) pod opener 14, another pod 9 is conveyed and transferred from the rotary pod shelf 11 to the other (lower or upper) pod opener 14 by the pod transfer mechanism 15, and the opening operation of the pod 9 by the other pod opener 14 is carried out simultaneously.

[0034] When a plurality of substrates 18 are loaded into the boat 26, the furnace mouth shutter 31 opens the furnace mouth of the processing furnace 28 that was closed by the furnace mouth shutter 31. Subsequently, the boat 26 is lifted by the boat elevator 32 and carried into (loaded into) the processing chamber 29.

[0035] After loading, the furnace mouth is hermetically sealed by the seal cap 34. In this embodiment, at this timing (i.e., after loading), there is a purge process (pre-purge process) in which the processing chamber 29 is replaced with an inert gas.

[0036] The processing chamber 29 is evacuated to a desired pressure (vacuum degree) by a gas exhaust mechanism (not shown). Also, the processing chamber 29 is heated to a predetermined temperature by a heater drive unit (not shown) so as to have a desired temperature distribution.

[0037] Also, a processing gas controlled to a predetermined flow rate is supplied by a gas supply mechanism (not shown). In the process of the processing gas flowing through the processing chamber 29, it comes into contact with the surface of the substrate 18, and predetermined processing is performed on the surface of the substrate 18. Further, the processing gas after the reaction is exhausted from the processing chamber 29 by a gas exhaust mechanism.

[0038] When a preset processing time elapses, an inert gas is supplied from an inert gas supply source (not shown) by the gas supply mechanism, the processing chamber 29 is replaced with the inert gas, and the pressure in the processing chamber 29 is restored to normal pressure (after purge process). Then, the boat 26 is lowered by the boat elevator 32 via the seal cap 34.

[0039] Regarding the unloading of the processed substrate 18, in the reverse procedure of the above description, the substrate 18 and the pod 9 are discharged to the outside of the housing 2. The unprocessed substrate 18 is further loaded into the boat 26, and the batch processing of the substrate 18 is repeated.

[0040] (Functional Configuration of the Control System) Next, with reference to FIG. 3, the functional configuration of the control system centered on the main controller 201 will be described. As shown in FIG. 3, the control system includes a main controller 201, a process system controller 210, and a transfer system controller 230. Also, the main controller 201 functions as a data collection controller. The main controller 201 collects the device data generated in the substrate processing apparatus 1 and monitors the soundness of the device data.

[0041] Here, the apparatus data includes the data related to substrate processing such as the processing temperature, processing pressure, and flow rate of the processing gas (e.g., measured values, etc.) when the substrate processing apparatus 1 processes the substrate 18, the data related to the quality of the product substrate (e.g., the film thickness formed and the cumulative value of the film thickness, etc.), and the data related to the components of the substrate processing apparatus 1 (e.g., quartz reaction tube, heater, valve, mass flow controller (MFC), etc.) (e.g., set values, measured values, number of uses, usage time, etc.). That is, it includes the apparatus information generated by operating each component when the substrate processing apparatus 1 processes the substrate 18, and also includes the event data related to various apparatus events occurring in the substrate processing apparatus 1. For example, the alarm information that generates various alarms is included in the event data. The processing temperature in this specification means the temperature of the wafer 18 or the temperature in the processing chamber 29, and the processing pressure means the pressure in the processing chamber 29. Also, the processing gas means the gas that performs a predetermined process on the surface of the wafer 18 in the processing chamber 29. These are the same in the following description.

[0042] Also, the measured value data at specific intervals, for example, the raw waveform data as the data at specific intervals (e.g., 1 second, etc.) from the start to the end of the recipe, and the statistical quantity data created by processing the measured value data at specific intervals in each step within the recipe may be referred to as process data as the data collected during the execution of the recipe. This process data is included in the apparatus data. Note that the statistical quantity data includes the maximum value, minimum value, average value, etc. Also, when the recipe is not being executed, for example, the event data indicating various apparatus events generated during the idle time when no substrate is loaded into the apparatus is also included in the apparatus data. As the event data, for example, the data indicating the maintenance history is included.

[0043] Also, for example, the transfer data generated when transferring the substrate is also included in the apparatus data.

[0044] The main controller 201 is electrically connected to the process controller 210 and the conveyance controller 230 via a LAN (Local Area Network) such as 100BASE-T, etc., enabling transmission and reception of each device data, download and upload of each file, and so on.

[0045] The main controller 201 is provided with an external storage unit 221 as a mounting part where a recording medium (such as a USB memory, etc.) as an external storage device is inserted and removed. Also, the main controller 201 is provided with an external communication unit 229 that can be connected to an external host computer 202 via, for example, a communication network. Therefore, even when the substrate processing apparatus 1 is installed in a clean room, the external host computer 202 can be arranged in an office outside the clean room. Further, the external host computer 202 may be configured to have a function of collecting device data from the main controller 201 by being connected to the substrate processing apparatus 1 via a LAN line.

[0046] The main controller 201 is configured to collect device data, quantify the operating state of the device, and display it on the screen. Also, the main controller 201 is configured to execute each function. A detailed description of the main controller 201 will be given later.

[0047] The process controller 210 reports process data, which is process information including at least any one of the temperature, gas, and pressure information in the processing furnace 28. Specifically, the process controller 210 includes a temperature controller 211, a pressure controller 212, and a gas flow controller 213. These temperature controller 211, pressure controller 212, and gas flow controller 213 constitute sub-controllers and are electrically connected to the process controller 210, enabling the transmission and reception of each device data, the download and upload of each file, etc. Although the process controller 210 and the sub-controllers are shown separately, they may also be integrally configured.

[0048] The transfer controller 230 reports transfer data, which is transfer information for transferring the substrate. The transfer controller 230 includes a transfer controller 231, a rotation controller 232, and a lift controller 233. These transfer controller 231, rotation controller 232, and lift controller 233 constitute sub-controllers and are electrically connected to the transfer controller 230, enabling the transmission and reception of each device data, the download and upload of each file, etc. Although the transfer controller 230 and the sub-controllers are shown separately, they may also be integrally configured.

[0049] A drive sensor for controlling the pod transfer mechanism 15 is connected to the transfer controller 231. The transfer controller 231 is configured to control the operation of the pod transfer mechanism 15.

[0050] A drive sensor for controlling the rotary pod rack 11 is connected to the rotation controller 232. The rotation controller 232 is configured to control the operation of the rotary pod rack 11.

[0051] A drive sensor for controlling the boat elevator 32 is connected to the lifting control controller 233. The lifting control controller 233 is configured to control the operation of the boat elevator 32.

[0052] The temperature control controller 211 is mainly connected to a heater, a temperature sensor, etc. The temperature control controller 211 is configured to adjust the temperature inside the processing furnace 28 by controlling the temperature of the heater in the processing furnace 28. Note that the temperature control controller 211 is configured to perform switching (on / off) control of the thyristor and control the power supplied to the heater element wire.

[0053] The pressure control controller 212 is mainly connected to a pressure sensor, an APC valve (not shown) as a pressure valve, and a vacuum pump (not shown). The pressure control controller 212 is configured to control the opening degree of the APC valve and the switching (on / off) of the vacuum pump so that the pressure in the processing chamber 29 becomes the desired pressure at the desired timing based on the pressure value detected by the pressure sensor.

[0054] The gas flow rate control controller 213 is composed of an MFC and is connected to a gas flow rate sensor.

[0055] Each of the process system controller 210 and the transfer system controller 230 is configured to be able to report to the main controller 201 in real time, as device information, the status, the failure information representing the failure detected based on the sensor information, and the values of the respective connected sensors, in addition to their respective controls.

[0056] Note that the main controller 201, the process system controller 210, and the transfer system controller 230 according to this embodiment can be realized using a normal computer system instead of a dedicated system. For example, each controller that executes the above-described processing can be configured by installing a program for executing the above-described processing from a recording medium (e.g., a flexible disk, a CD-ROM, a USB memory, etc.) storing the program in a general-purpose computer.

[0057] And means for supplying these programs are arbitrary. In addition to being able to be supplied via a predetermined recording medium as described above, for example, they may be supplied via a communication line, a communication network, a communication system, etc. In this case, for example, the program may be posted on a bulletin board of a communication network, and the program may be provided by being superimposed on a carrier wave via the network. Then, by starting the program provided in this way and executing it in the same manner as other application programs under the control of an OS (Operation System), predetermined processing can be executed.

[0058] (Configuration of the main controller 201) Next, the configuration of the main controller 201 will be described with reference to FIG. 3.

[0059] The main controller 201 includes a device controller control unit (control unit) 220, a device controller storage unit (storage unit) 222 that is a hard disk, an operation display unit 227 including a display unit that displays various information and an input unit that receives various instructions from an operator, a device controller communication unit (communication unit) 228 that communicates with the inside and outside of the substrate processing apparatus 1, an external communication unit 229 that communicates with the outside, and an external storage unit 221 to which a recording medium can be connected. Here, the operator includes, in addition to the device operator, a device administrator, a device engineer, a maintenance staff, and a worker. The control unit 220 includes a CPU (Central Processing Unit) 224 as a processing unit and a memory (e.g., a RAM, a ROM, etc.) 226 as a temporary storage unit, and is configured as a computer having a clock function (not shown).

[0060] The storage unit 222 stores various recipe files such as recipes in which the processing conditions and procedures of the substrate are defined, control program files for executing these recipe files, parameter files in which parameters for executing the recipes are defined, error processing program files and error processing parameter files, as well as various screen files including input screens for inputting process parameters and various icon files (none of which are shown).

[0061] In addition, the storage unit 222 stores device information including sensor information output from each controller and failure information indicating a failure detected by each controller based on the sensor information. The storage unit 222 also stores failure data and updated device information, which will be described later.

[0062] Also, operation buttons can be provided on the operation screen of the operation display unit 227 as input units for inputting operation instructions to the substrate transfer system and the substrate processing system.

[0063] The operation display unit 227 is configured to display an operation screen for operating the substrate processing apparatus 1. The operation display unit 227 displays information based on device data generated within the substrate processing apparatus 1 on the operation screen via the operation screen. The operation screen of the operation display unit 227 is, for example, a touch panel using liquid crystal. The operation display unit 227 receives input data (input instructions) from the operator on the operation screen and transmits the input data to the main controller 201. In addition, the operation display unit 227 is configured to receive an instruction (control instruction) to execute a recipe developed in a memory (RAM) 226 or an arbitrary substrate processing recipe (also referred to as a process recipe) stored in the storage unit 222 and transmit it to the control unit 220.

[0064] The communication unit 228 is connected to a switching hub or the like. The main controller 201 is configured to transmit and receive various data to and from an external computer or other controllers within the substrate processing apparatus 1 (i.e., the process controller 210, the temperature control controller 211, the pressure control controller 212, the gas flow rate control controller 213, the transfer system controller 230, the transfer control controller 231, the rotation control controller 232, and the lift control controller 233) via a network.

[0065] When a failure occurs, the control unit 220 performs control to store the reported device information, the updated device information reported in a predefined first period before the failure, and the recipe as failure data together with the failure occurrence time in the storage unit 222. The control unit 220 further performs control to add the updated device information reported in a predefined second period from the time of failure occurrence to the failure data. Note that the updated device information in the first period is an example of the first device information, and the updated device information in the second period is an example of the second device information.

[0066] Specifically, when a failure occurs, the control unit 220 creates failure information (FIG. 8) and failure data (FIG. 9) based on the device information reported from the process controller 210 or the transfer system controller 230, which are lower-level controllers.

[0067] Also, after the end time of the predefined second period after the failure occurs is reached, the updated device information (FIG. 10) is added to the failure data (FIG. 9).

[0068] Here, FIG. 8 shows an example in which failure information is stored in the failure information storage area of the storage unit 222. Further, FIG. 8 shows an example in which the failure information is composed of the occurrence time, the identifier, and the recipe information. FIG. 9 shows an example in which failure data is stored in the failure data storage area of the storage unit 222. FIG. 9 shows an example in which the failure data is composed of the acquisition start time, the acquisition end time, the device information which is the initial data, the updated device information of the first period which is the additional data, and the updated device information of the second period which is the additional data. FIG. 10 shows an example in which device information is stored in the updated device information storage area of the storage unit 222. FIG. 10 shows an example in which the updated device information is composed of the device information at each time.

[0069] More specifically, assuming that the failure occurrence time is T, the acquisition start time is T - a, and the acquisition end time is T + a. Also, the device information which is the initial data is all the device information at the time of T - a, and the updated device information which is the additional data is the device information that has changed from T - a to T + a.

[0070] Note that the notation of a numerical range such as "T - a to T + a" in this specification means that the lower limit value and the upper limit value are included in that range. Therefore, for example, "T - a to T + a" means "greater than or equal to T - a and less than or equal to T + a". The same applies to other numerical ranges.

[0071] Also, the control unit 220 always performs a process of storing and arranging all the device information at the time of T - a in the storage unit 222 as the device information which is the initial data. For example, the device information stored in the storage unit 222 is updated using the device information that has exceeded the first period corresponding to a seconds after being reported. Thereby, all the device information at the time of T - a can always be stored in the storage unit 222 as the device information which is the initial data.

[0072] In addition, when the control unit 220 exceeds a second period corresponding to a seconds after the reported update device information as additional data, the control unit 220 adds the device information to the failure data. As a result, the update device information for the second period, which is additional data, can be added to the failure data.

[0073] In this embodiment, the device information includes process system information representing the temperature, gas, and pressure information inside the processing furnace, and conveyance system information for performing conveyance of the substrate. Also, not all of the device information is saved every second, and only the device information with changes is saved. That is, the saved process system information indicates information reported when there is a change in at least any one of the temperature, gas, and pressure. Further, the saved conveyance system information indicates information reported when there is a change in the operation of the mechanical part of the device. Thereby, the amount of data to be saved can be suppressed.

[0074] Also, the operation display unit 227 is configured to be able to display the failure data.

[0075] In addition, the operation display unit 227 is configured to be able to set the first period and the second period by parameters. Thereby, when a failure occurs, the control unit 220 refers to the first period and the second period set by the parameters, and acquires the update device information for the first period and the update device information for the second period. In this way, the amounts of the update device information for the first period and the update device information for the second period for identifying the cause of the failure can be adjusted.

[0076] Also, the operation display unit 227 is configured to be able to display the recipe, device information, and failure information for the first period before the failure and the second period from the occurrence of the failure on the same screen.

[0077] Specifically, as shown in FIG. 11, the failure data display screen 300 has a failure information display area 302, a recipe information display area 304 for displaying the recipes of the first period and the second period, and an elapsed time information display area 306. Further, the failure data display screen 300 has a temperature information display area 308 for displaying the temperature information of the first period and the second period, a gas information display area 310 for displaying the gas information of the first period and the second period, and a pressure information display area 312 for displaying the pressure information of the first period and the second period. More specifically, the elapsed time information display area 306 has a slider bar, accepts an operation of the slider bar, and is configured to be able to shift the display time of the failure information. Note that the failure data display screen 300 shown in FIG. 11 is an example and is not limited thereto. Also, as shown in FIG. 12, it may be an elapsed time information display area 306A that displays each time. Further, in the gas information display area 310, the gas flow rates detected by the respective gas flow sensors are displayed.

[0078] When the operation of the slider bar in the elapsed time information display area 306 is received, the position of the bar is synchronized with the time of the device information to be displayed. The method of shifting the device information corresponding to the target time is performed by exchanging data between the initial data and the additional data. In this way, the device information at the time for identifying the cause of the failure can be displayed with a simple operation.

[0079] Also, the operation display unit 227 displays a screen of a list of occurrence failure histories so as to be able to accept the selection of a specified failure. When a specified failure is selected, the control unit 220, based on the failure occurrence time of the failure information, selects from the failure data accumulated in the storage unit 222 Acquisition start time <= Failure occurrence time < Acquisition end time corresponding failure data is acquired, and the failure data display screen 300 is displayed.

[0080] In addition, the operation display unit 227 is configured to be able to edit and confirm the setting contents of the recipe being executed at the time of failure from the failure data display screen 300 or the screen of the list of occurred failure histories. This can save the time and effort of searching for the recipe. Also, even if the recipe has been deleted, it can be confirmed. If a recipe setting error is found, it can be edited and saved as it is.

[0081] This function is realized by storing the download history of the recipe (Fig. 13) in the storage unit 222 together with the time stamp. Also, in the download history, the recipe specified at the time of substrate processing execution and the start time of substrate processing execution may be further stored.

[0082] Here, the method of acquiring the execution recipe information will be described. When downloading the execution recipe from the control unit 220 to the lower controller, the setting contents and the download time are accumulated in the storage unit 222.

[0083] When a specified failure is selected from the failure data display screen 300 or the screen of the list of occurred failure histories, based on the failure occurrence time of the failure information, among the recipes accumulated in the storage unit 222, download time < failure occurrence time the latest one among those that meet the criteria is acquired as the execution recipe for that failure. Since the recipe contents and the download time are accumulated in the storage unit 222 as the download history, it is possible to refer to the setting contents at the time of execution even for a recipe that has already been edited or deleted.

[0084] In addition, the operation display unit 227 may be able to switch the display of the failure occurrence site to be targeted. At this time, the operation display unit 227 may preferentially display the failure data at the failure occurrence time. In this way, the information on the failure occurrence site for identifying the cause of the failure and the failure data at the failure occurrence time can be displayed with a simple operation.

[0085] In addition, the control unit 220 identifies the failure occurrence site from the information included in the failure information, and the operation display unit 227 may perform priority display of the identified failure occurrence part and priority display of information related to the identified failure occurrence site. This can further assist in quickly identifying the cause of the failure and restoring it.

[0086] Specifically, the control unit 220 automatically extracts related data based on the identifier of the occurred failure. More specifically, the related data is extracted by pre - defining the individual identifiers of the related device information using the identifier of the occurred failure as a key.

[0087] The extracted data may be displayed in the failure information display area 302 of the failure data display screen 300 of the operation display unit 227 as a trace chart for the 10 minutes before the failure occurred. At this time, at the bottom of the chart, the failures, events, and execution steps that occurred during that period are displayed as icons in chronological order. Selecting an icon links to the detailed information.

[0088] In addition, as shown in FIG. 14, the operation display unit 227 highlights the tabs and lists related to the occurred failure in the failure information display area. This enables abnormal data to be confirmed at a glance, thus supporting ease of analysis.

[0089] This highlight display is realized by using the unique identifier assigned to each failure. In advance, the identifier of the failure related to the data is defined for each monitor screen and the display items within the screen. This is used as the failure definition file. When the failure data is displayed, the identifier of the failure information is obtained and compared with the failure definition file. The screen and the display items within the screen obtained as the result - related items are highlighted.

[0090] FIG. 14 shows an example in which the tab "PM", the tab "Gas", and the item "MFC3" in the list related to the occurred failure are highlighted.

[0091] In addition, the control unit 220 may acquire device information for a third period related to the identified failure occurrence site and display it on the operation display unit 227 in chronological order. Specifically, by defining in advance individual identifiers for the third period related to the identifier of the generated failure occurrence site as a key, the device information for the third period related is extracted. At this time, the operation display unit 227 may accept a time specification from the displayed device information in chronological order and display recipe information related to the specified time. Thereby, it is possible to further assist in quickly identifying and recovering the cause of the failure occurrence.

[0092] Further, the main controller 201 transmits device data such as the state of the substrate processing apparatus 1 to an external host computer via a network (not shown). Note that the substrate processing of the substrate processing apparatus 1 is controlled by a control system based on each recipe file, each parameter file, etc. stored in the storage unit 222.

[0093] (Substrate Processing Method) Next, a substrate processing method having a predetermined processing step, which is performed using the substrate processing apparatus 1 according to the present embodiment, will be described. Here, as an example, the case where a substrate processing step (here, a film forming step), which is one step of a semiconductor device manufacturing process, is performed is taken.

[0094] In carrying out the substrate processing step, a substrate processing recipe (process recipe) corresponding to the substrate processing to be carried out is developed, for example, in a memory such as a RAM in the process controller 210. Then, an operation instruction is given from the main controller 201 to the process controller 210 as necessary. The substrate processing step thus carried out has at least a loading step, a film forming step, an unloading step, and a recovery step.

[0095] (Transfer Step) From the main controller 201, a drive instruction for the transfer system controller 230 is issued for the substrate transfer mechanism 24. Then, while following the instruction from the transfer system controller 230, the substrate transfer mechanism 24 starts the transfer process of the substrate 18 from the pod 9 on the mounting table 21 to the boat 26. This transfer process is performed until the loading of all the scheduled substrates 18 into the boat 26 is completed.

[0096] (Loading process) When the substrate 18 is loaded into the boat 26, the boat 26 is raised by the boat elevator 32 that operates according to the instruction from the transfer system controller 230 and is loaded (boat load) into the processing chamber 29 formed in the processing furnace 28. When the boat 26 is completely loaded, the seal cap 34 of the boat elevator 32 airtightly closes the lower end of the manifold of the processing furnace 28.

[0097] (Film formation process) After that, the inside of the processing chamber 29 is evacuated by a vacuum exhaust device (not shown) to a predetermined film formation pressure (vacuum degree) while following the instruction from the pressure control controller 212. Also, the inside of the processing chamber 29 is heated by a heater to a predetermined temperature while following the instruction from the temperature control controller 211. Subsequently, while following the instruction from the transfer system controller 230, the rotation of the boat 26 and the substrate 18 by the rotation mechanism is started. Then, while maintaining a predetermined pressure and a predetermined temperature, a predetermined gas (processing gas) is supplied to the plurality of substrates 18 held by the boat 26, and a predetermined process (for example, film formation process) is performed on the substrate 18.

[0098] (Unloading process) When the film formation process for the substrate 18 placed on the boat 26 is completed, while following the instruction from the transfer system controller 230, then the rotation of the boat 26 and the substrate 18 by the rotation mechanism is stopped, the seal cap 34 is lowered by the boat elevator 32 to open the lower end of the manifold, and the boat 26 holding the processed substrate 18 is unloaded (boat unload) outside the processing furnace 28.

[0099] (Recovery process) Then, the boat 26 holding the processed substrate 18 is extremely effectively cooled by the clean air 36 blown out from the clean unit 35. Then, when it is cooled to, for example, 150°C or lower, after the processed substrate 18 is removed from the boat 26 and transferred to the pod 9, a new unprocessed substrate 18 is transferred to the boat 26.

[0100] (Fault analysis process) Next, the processing flow of the fault analysis process executed by the main controller 201 will be described mainly with reference to FIG. 4. The fault analysis process is repeatedly executed when the substrate processing apparatus 1 is operating.

[0101] A process of storing device data for a preset number of seconds (the first period and the second period) before and after a fault will be described.

[0102] First, in step S100, the main controller 201 is activated. The control unit 220 of the main controller 201 records all the current device information in an associative array (FIG. 7) at startup. This is used as the initial data. FIG. 7 shows an example in which the associative array of device information is stored in the device information storage area of the storage unit 222.

[0103] Then, in step S110, the main controller 201 performs a device information update process.

[0104] Then, in step S120, the main controller 201 performs a fault information confirmation process.

[0105] In step S130, the main controller 201 is stopped.

[0106] The process of step S110 is realized by the device information update process shown in FIG. 5.

[0107] In step S200, the control unit 220 constantly monitors changes in the device information reported by the lower-level controllers (i.e., the process controller 210 and the transport controller 230), and determines whether there is a change in the device information. If there is no change in the device information, it is determined not to update the device information, and the process proceeds to step S220. On the other hand, if there is a change in the device information, it is determined to update the device information, and the process proceeds to step S210.

[0108] In step S210, the changed device information is added to an array in chronological order (Figure 10). This is used as additional data. Note that the device information reported by the lower-level controller includes a timestamp representing the current time. During normal operation (i.e., when no failure has occurred), the array of additional data stores the device information for a seconds (the first period).

[0109] When the device information for a seconds (the first period) or more has accumulated, surplus data (the device information with the oldest date and time in the first period) is added to the array of initial data (Figure 7) (i.e., overwriting if the same type already exists), and the initial data is always updated to the data a seconds before the current time.

[0110] In step S220, it is determined whether to update the failure data. If a failure has occurred and the updated device information for the second period has not yet been added to the failure data, it is determined to update the failure data, and the process proceeds to step S230. At this time, the failure data stores the initial data (device information) and the additional data (the updated device information for the first period).

[0111] In step S230, it is determined whether the acquisition end time has been reached. If the acquisition end time has been reached, the process proceeds to step S240. On the other hand, if the acquisition end time has not been reached, the device information update process ends. As a result, the updated device information is updated until the acquisition end time for the updated device information for the second period.

[0112] In step S240, update device information for the second period is added to the failure data, and the device information update process ends. At this time, since the failure data is large-sized data, it is compressed and stored in the storage unit 222.

[0113] The process of step S120 is realized by the failure information confirmation process shown in FIG. 6.

[0114] In step S300, it is determined whether a failure has occurred. If no failure has occurred, the failure information confirmation process ends. On the other hand, if a failure has occurred, the process proceeds to step S310.

[0115] In step S310, the control unit 220 creates failure information based on the information reported from the lower controller.

[0116] In step S320, the control unit 220 generates failure data including the failure information created in step S310. At this time, the acquisition start time and the acquisition end time are calculated from the failure occurrence time, and the initial data (device information) and the additional data (update device information for the first period) are stored in the failure data. Then, the failure information confirmation process ends.

[0117] Then, when the operation display unit 227 receives an operation to display the failure data, it displays a screen of the list of occurrence failure history. When a specified failure is selected, the control unit 220 acquires the corresponding failure data from the failure data accumulated in the storage unit 222 based on the failure occurrence time of the failure information, and displays a failure data display screen 300 as shown in FIG. 11.

[0118] Also, when the operation display unit 227 receives an operation of the slider bar in the elapsed time information display area 306 on the failure data display screen 300, it synchronizes the position of the bar with the time of the device information to be displayed.

[0119] In addition, when the operation display unit 227 receives an operation to edit and confirm the setting content of the recipe being executed at the time of the failure on the failure data display screen 300 or the screen of the list of occurrence failure histories, it displays the setting content of the recipe being executed at the time of the failure so that it can be edited.

[0120] (Example 1) Next, an example of storing the device information for 5 seconds before and after the occurrence of the failure as failure data will be described. In Example 1, an example in which a gas flow rate deviation error of MFC3 is reported from the gas flow rate control controller 213 to the main controller 201 during device operation will be described.

[0121] Assume that this abnormality was directly caused by a flow rate abnormality due to operating the valve on the primary supply source side of MFC3 due to a recipe setting error 3 seconds before the failure report.

[0122] In the prior art, since the device information 3 seconds before cannot be confirmed on the failure data display screen, this cause cannot be identified.

[0123] On the other hand, in the main controller 201 of the substrate processing apparatus 1 according to the present embodiment, on the failure data display screen 300, as shown in FIG. 14, the related screen (gas information display area in this example) is preferentially displayed, and the corresponding location (data of MFC3 in this example) is highlighted, so that the location where the failure occurred can be easily grasped.

[0124] In addition, from the device information 5 seconds before and after the occurrence of the failure, the user can trace and confirm the set value of the valve on the primary supply side to identify the direct cause of the failure (for example, a setting value error). Furthermore, since the execution recipe information can be confirmed and edited within the same screen, this problem can be solved by resetting the corresponding location to the correct value.

[0125] (Example 2) Next, an example in which an R-axis unlock error is reported from the transfer control controller 231 to the main controller 201 during device operation will be described.

[0126] Assume that this abnormality was caused by a misalignment of the mechanism due to insufficient supply air to the locking mechanism. In the main controller 201 of the substrate processing apparatus 1 according to the present embodiment, a related screen (in this example, a display area (not shown) of sensor information of the drive sensor) is preferentially displayed on the failure data display screen 300, and the occurrence location of the failure can be easily grasped by highlighting the corresponding location (in this example, the sensor information of the drive sensor of the R-axis locking mechanism).

[0127] Also, from the device data 5 seconds before and after the occurrence of the failure, it is possible to confirm the extinguishing timing of the sensor and the fluctuation which is a tendency of the abnormality due to insufficient air supply.

[0128] According to the present embodiment, one or more of the following effects can be obtained.

[0129] The substrate processing apparatus according to the present embodiment stores, as failure data together with the failure occurrence time, the first device information reported in a predefined first period before the occurrence of the failure and the recipe in the storage unit 222 at the time of failure. Further, the substrate processing apparatus performs control to add the second device information reported in a predefined second period from the time of failure occurrence to the failure data. Thereby, it is possible to assist in quickly identifying and recovering the cause of the failure.

[0130] In addition, since the device information for the generated failure information is stored for a predefined time before and after the occurrence of the failure, it becomes easy to manage the data for the generated failure information. Also, by displaying the data for a predefined time before and after the occurrence of the failure, it is possible to confirm the change in the device information before and after the occurrence of the failure, and it is possible to assist in identifying the cause of the failure.

[0131] In addition, the stored failure data can be stored in an external host computer 202 via the external communication unit 229 or in a recording medium via the external storage unit 221. Therefore, if it is stored in the external host computer 202 or the recording medium, it is possible to avoid the pressure on the capacity of the storage unit 222 in the main controller.

[0132] Conventionally, since device information related to failure information was obtained from the storage unit 222 during screen display, it took time. According to the present embodiment, since device information related to the time of failure occurrence and after the failure occurrence is collected, it is possible to display the device information within the range of the collected data during screen display, and the waiting time during screen display can be avoided.

[0133] In addition, since the collected failure data has device information for a predefined period before and after the failure occurrence, it is possible to check the state of the device before or after the failure occurrence, and it becomes possible to trace the cause of the occurred failure. As a result, it is possible to shorten the period until the cause of the failure is specified, and it can contribute to the reduction of downtime.

[0134] In addition, after specifying the cause of the failure, it becomes possible to edit the recipe from the failure data display screen for the target item, so that editing errors can be avoided.

[0135] In addition, since it is also possible to display device information in time series related to the failure, it is possible to easily check abnormal points before the failure occurrence.

[0136] In addition, the user can refer to device information and recipe information for several seconds before and after the failure report on the same screen, and can quickly specify the cause of the failure. Also, since the execution recipe can be directly edited from the failure screen, the time required to solve the failure can be reduced, and the effect of reducing the device downtime can be obtained.

[0137] As described above, the substrate processing apparatus according to the embodiment has been exemplified and described. The embodiment may be in the form of a program for causing a computer to execute the functions of the substrate processing apparatus. The embodiment may be in the form of a computer-readable non-transitory storage medium storing these programs.

[0138] In addition, the configuration of the substrate processing apparatus described in the above embodiment is an example, and it may be changed according to the situation without departing from the gist.

[0139] Also, the processing flow of the program described in the above embodiment is merely an example, and within the scope not departing from the gist, unnecessary steps may be deleted, new steps may be added, or the processing order may be changed.

[0140] In the above embodiment, the case where the processing according to the embodiment is realized by software configuration using a computer by executing a program has been described, but it is not limited to this. The embodiment may be realized, for example, by a hardware configuration or a combination of a hardware configuration and a software configuration.

[0141] The substrate processing apparatus in the above embodiment is applicable not only to semiconductor manufacturing apparatuses but also to apparatuses that process glass substrates such as LCD (Liquid Crystal Display) apparatuses. Further, it is applicable to various substrate processing apparatuses such as exposure apparatuses, lithography apparatuses, coating apparatuses, and processing apparatuses using plasma.

[0142] Also, the case where the failure data and the device information are stored in the storage unit 222 of the main controller 201 has been described as an example, but it is not limited thereto. The failure data and the device information may be stored in a USB, CD, DVD, etc. connected to the external storage unit 221. Further, the failure data and the device information may be transmitted to an external host computer 202 connected to the external communication unit 229 through a network.

[0143] In the above embodiment, an example of forming a film using a batch-type substrate processing apparatus that processes a plurality of substrates at a time has been described. The present disclosure is not limited to the above-described embodiment, and can be preferably applied, for example, also to the case of forming a film using a single-wafer-type substrate processing apparatus that processes one or several substrates at a time. Also, in the above-described embodiment, an example of forming a film using a substrate processing apparatus having a hot-wall type processing furnace has been described. The present disclosure is not limited to the above-described embodiment, and can be preferably applied also to the case of forming a film using a substrate processing apparatus having a cold-wall type processing furnace.

[0144] Even when using these substrate processing apparatuses, each process can be performed with the same processing procedures and processing conditions as in the above-described embodiment, and the same effects as in the above-described embodiment can be obtained.

Industrial Applicability

[0145] It relates to a function for assisting in analyzing the cause of a failure occurring in the apparatus and can be applied to various substrate processing apparatuses.

Explanation of Signs

[0146] 1 Substrate processing apparatus 28 Processing container 201 Main controller 220 Control unit 222 Storage unit

Claims

1. A storage unit that stores a recipe defining processing conditions of a substrate, device information reported by a device, and failure information generated when a failure occurs in the device; A processing container capable of processing the substrate based on the specified recipe; When a failure occurs in the device, the first device information reported in a predefined first period before the failure occurs and the recipe are stored as failure data in the storage unit together with the failure occurrence time included in the failure information, and further control is performed to add second device information reported in a predefined second period from the time of the failure occurrence to the failure data; A control unit capable of An operation display unit capable of displaying the failure data; Including The control unit is configured to be able to acquire the failure data corresponding to the specified failure occurrence time, and control to display the recipe, the first device information, the second device information, and the failure information in the first period and the second period on the same screen of the operation display unit; Furthermore, the operation display unit is configured to be able to edit the setting content of the recipe from the screen on which the recipe is displayed. A substrate processing apparatus.

2. The device information includes at least any one of process system information and transfer system information reported during operation of the device. The substrate processing apparatus according to Claim 1.

3. The process system information includes information reported when there is a change in at least any one of temperature, gas, and pressure. The substrate processing apparatus according to Claim 2.

4. The transfer system information includes information reported when there is a change in the operation of the mechanism part of the device. The substrate processing apparatus according to Claim 2.

5. The first period and the second period can be set by parameters, The control unit refers to the first period and the second period set by the parameters at the time of the failure occurrence, and acquires the first device information and the second device information. The substrate processing apparatus according to Claim 1.

6. The storage unit further stores the recipe specified at the time of executing the processing of the substrate and the start time of executing the processing of the substrate. The substrate processing apparatus according to Claim 1.

7. The device information stored in the storage unit is updated using the first device information that has exceeded the first period since it was reported. The substrate processing apparatus according to Claim 1.

8. When the period exceeding the second period has elapsed since the occurrence of the failure, the control unit adds the second device information to the failure data. The substrate processing apparatus according to claim 1.

9. The operation display unit can specify the date and time, The control unit switches and displays the failure data according to the specified date and time. The substrate processing apparatus according to claim 1.

10. The operation display unit can switch the display of the failure occurrence site to be targeted. The substrate processing apparatus according to claim 1.

11. The operation display unit preferentially displays the failure data at the time of failure occurrence. The substrate processing apparatus according to claim 1.

12. The control unit refers to the information included in the failure information to identify the failure occurrence site, The operation display unit preferentially displays the identified failure occurrence site. The substrate processing apparatus according to claim 1.

13. The control unit refers to the information included in the failure information to identify the failure occurrence site, The operation display unit preferentially displays the information related to the identified failure occurrence site. The substrate processing apparatus according to claim 1.

14. The operation display unit has a recipe editing function and enables editing of the items of the recipe corresponding to the specified part during the display of the failure data. The substrate processing apparatus according to claim 1.

15. The control unit refers to the information included in the failure information to identify the failure occurrence site, The control unit acquires the device information of the third period related to the identified failure occurrence site and displays it in time series on the operation display unit. The substrate processing apparatus according to claim 1.

16. The operation display unit can display the recipe information related to the specified time from the displayed time series information. The substrate processing apparatus according to claim 15.

17. A step of processing the substrate according to a recipe defining the processing conditions of the substrate, A step of storing the recipe, the device information reported during the processing of the substrate, and the failure information reported at the time of failure occurrence, At the time of failure occurrence, a step of storing the first device information of the first period defined in advance before the failure occurrence and the recipe as failure data together with the failure occurrence time included in the failure information, A step of adding the second device information reported in the second period defined in advance from the time of failure occurrence to the failure data. Obtaining the failure data corresponding to the specified failure occurrence time, and displaying the recipe, the first device information, the second device information, and the failure information in the first period and the second period on the same screen; Editing the setting content of the recipe from the screen on which the recipe is displayed in the displaying step; A method for manufacturing a semiconductor device having the above.

18. A procedure for processing the substrate according to a recipe defining the processing conditions of the substrate; A procedure for storing the recipe, the device information reported during the processing of the substrate, and the failure information reported at the time of failure; At the time of failure, storing the first device information in a predefined first period before the failure and the recipe as failure data together with the failure occurrence time included in the failure information; A procedure for adding the second device information reported in a predefined second period from the time of failure to the failure data; Obtaining the failure data corresponding to the specified failure occurrence time, and displaying the recipe, the first device information, the second device information, and the failure information in the first period and the second period on the same screen; Editing the setting content of the recipe from the screen on which the recipe is displayed; A program for causing a substrate processing apparatus to execute the above.

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