Tube joining device

Abstract

To provide a tube joint device capable of preventing a decrease in joint strength and generation of pin holes even when foreign matters remain in a lumen of a tube.SOLUTION: A control part 40 of a tube joint device 1 controls a rolling mechanism 80 so as to rotate a first tube 210 and a second tube 220 within a range of rotation angle that satisfies the following formula (1): rotation angle θ[°]=180+360×n...formula(1), where n is an integer equal to or larger than 1.SELECTED DRAWING: Figure 17

Description

Technical Field

[0001] The present invention relates to a tube joining device.

Background Art

[0002] As a technique for joining tubes having inner cavities, a joining method is conventionally known in which the ends of each tube are cut, and the cut ends are pressed against each other for pressure joining. Such a technique is widely used in various industrial fields, and as an example, its application to medical techniques such as peritoneal dialysis methods has been attempted.

[0003] The peritoneal dialysis method is a method of removing water and waste products that have migrated into the dialysate through the peritoneum after introducing a predetermined dialysate into the body using a tube (catheter) implanted in the patient's abdominal cavity. For example, Patent Document 1 describes a tube joining device that cuts two tubes to be joined using a heated cutting member, and joins them by exchanging the ends of the respective tubes.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] For example, substances containing lipids, proteins, etc. adhering to the inner surface of the tube may remain as foreign matter in the inner cavity of the tube used for the purpose of discharging the above-mentioned dialysate to the outside of the body. When cutting is performed by a cutting member with foreign matter remaining in the inner cavity of the tube, the foreign matter leaks to the outside of the tube and adheres to the surface of the cutting member. Further, in the process of cutting and joining the tubes, if the foreign matter adhering to the cutting member adheres near the ends of the tubes, it may cause a decrease in the joining strength of the tubes and the occurrence of pinholes.

[0006] The present invention aims to solve the above problems and provides a tube joining device that can prevent a decrease in joining strength and the occurrence of pinholes even when foreign matter remains in the inner cavity of the tube.

Means for Solving the Problems

[0007] A tube joining device is a tube joining device that, after cutting a first tube and a second tube, replaces and joins a cut first end of the first tube and a cut second end of the second tube, and includes a tube holding portion that holds the first tube and the second tube, a cutting member that cuts the first tube and the second tube held by the tube holding portion, a rotation mechanism that rotates the first tube and the second tube to replace the relative positions of the cut first end and the cut second end, and a control portion that controls the operation of each part of the device. The control portion controls the rotation mechanism to rotate the first tube and the second tube within a range of rotation angles that satisfy the following formula (1). Rotation angle θ [°]=180 + 360×n ··· Formula (1) However, n is an integer of 1 or more.

Effects of the Invention

[0008] According to the tube joining device of the present invention, it is possible to prevent a decrease in joining strength and the occurrence of pinholes even when foreign matter remains in the inner cavity of the tube.

Brief Description of the Drawings

[0009]

Figure 1

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Figure 17

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Figure 24

Embodiments for Carrying Out the Invention

[0010] Hereinafter, embodiments of the present invention will be described with reference to the attached drawings.

[0011] FIGS. 1 to 5 are diagrams for explaining the overall configuration of the tube joining device 1 and the configuration of each part according to an embodiment of the present invention. FIG. 6 is a diagram for explaining the first tube 210 and the second tube 220 joined by the tube joining device 1. FIGS. 7 to 12 are diagrams showing a simplified cutting-joining operation of the tube joining device 1. FIGS. 13 to 22 are diagrams for explaining the operation and effect of the tube joining device 1 according to the present embodiment and a tube joining device according to a comparative example.

[0012] In each figure, the front-rear direction of the tube joining device 1 is indicated by arrow X, the left-right direction is indicated by arrow Y, and the height direction is indicated by arrow Z. The above-mentioned "left-right direction" is substantially the same direction as the direction in which the tubes 210 and 220 are arranged (the extending direction of the tubes 210 and 220) when the tubes 210 and 220 are set in the tube joining device 1.

[0013] The drawings marked with the character "rotating side" shown in FIGS. 13 to 22 are schematic drawings of the wafer 100 and the tubes 210 and 220 as seen from the "rotating side" attached with an arrow in FIG. 9. Also, the drawings marked with the character "fixed side" shown in FIGS. 13 to 22 are schematic drawings of the wafer 100 and the tubes 210 and 220 as seen from the "fixed side" attached with an arrow in FIG. 9.

[0014] Note that the description of "rotating side" attached to the drawings is for convenience, and the rotating parts of the respective tubes 210 and 220 are not limited based on these descriptions. For example, as described in Modification 2 to be described later, the tube joining device 1 can also be configured to rotatably configure the portions located on the fixed sides of the respective tubes 210 and 220 (see FIG. 24).

[0015] <Tube joining device> As shown in FIG. 6, the tube joining device 1 in the present embodiment is configured as a medical device that cuts and joins the first tube 210 on the peritoneal dialysis fluid bag T11 side and the second tube 220 on the peritoneal catheter T26 side of a patient (user H) who performs peritoneal dialysis.

[0016] As shown in FIG. 1, the tube joining device 1 can be used in combination with a wafer cassette WC including a plurality of wafers 100 (corresponding to "cutting members") used for cutting.

[0017] In the cutting operation of each of the tubes 210 and 220, as shown in FIG. 9, the tube joining device 1 cuts (fuses) the first tube 210 and the second tube 220 set in the tube joining device 1 by pressing and crushing them against each other with a heated wafer 100. After cutting each of the tubes 210 and 220, as shown in FIGS. 10 and 11, the tube joining device 1 switches the relative positions of the cut first end 210a side (corresponding to "one side of the first tube") of the first tube 210 and the cut second end 220a side (corresponding to "one side of the second tube") of the second tube 220, and joins (welds) the respective tubes 210 and 220 while pressing them against each other.

[0018] The tube joining device 1 generally includes, as shown in FIG. 1, a housing 10, a tube holding portion 20 that holds a first tube 210 and a second tube 220, a holder portion 30 (see FIG. 4) that holds a wafer 100 for cutting the first tube 210 and the second tube 220 held by the tube holding portion 20, a control portion 40 (see FIG. 3) that controls the operation of each part of the device, a lid portion 50 attached to the housing 10, and a rotation mechanism 80 (see FIG. 5) that rotates the first tube 210 and the second tube 220 after cutting.

[0019] The housing 10 is constituted by a case including an upper portion of a substantially hexahedron and a lower portion that constitutes a side surface. Each component member of the tube joining device 1 is assembled to the housing 10.

[0020] In addition to the component members described in this specification, the housing 10 may be arbitrarily provided with, for example, a panel on which operation buttons for receiving operation instructions from the user H are arranged, an electric connector or a battery that enables power supply to the tube joining device 1, and other component members necessary for the operation of the tube joining device 1.

[0021] The housing 10 is provided with a storage portion 11a capable of storing a wafer cassette WC and a take-out button 11b that is operated when removing the wafer cassette WC from the storage portion 11a. The user H can set the wafer cassette WC in the housing 10 by inserting the wafer cassette WC into the storage portion 11a.

[0022] The tube joining device 1 has a feeding portion 91 (see FIG. 3) that conveys the wafer 100 set in the wafer cassette WC to the cutting position Y0 of each tube 210, 220, and a heating portion 92 (see FIG. 3) that heats the wafer 100 conveyed to the feeding portion 91. After completing the cutting and joining operation, the feeding portion 91 moves the wafer 100 to a position where it can be taken out from the housing 10 (for example, the gap portion 13 of the housing 10 shown in FIG. 1).

[0023] The feeding unit 91 can be configured by a known conveying member including, for example, a feed screw mechanism that pushes the rear end portion 106 (see FIG. 13) of the wafer 100 toward the holder unit 30 (see FIG. 4). The heating unit 92 can be configured by a known heater that supplies current to the wafer for heating, for example.

[0024] As shown in FIG. 13, the wafer 100 can be configured by a plate-like member made of metal having a first side surface 101, a second side surface 102, an upper end portion 103, a lower end portion 104, a tip end portion 105, and a rear end portion 106. The wafer 100 can be configured by, for example, a copper plate. However, the wafer 100 is not particularly limited with respect to the specific material and shape as long as it is possible to cut each of the tubes 210 and 220.

[0025] As shown in FIG. 4, during the cutting-joining operation, the wafer 100 is conveyed to the holder unit 30 assembled to the housing 10. The lower end portion 104 of the wafer 100 is supported by the main body portion 31 of the holder unit 30. The upper end portion 103 of the wafer 100 is arranged so as to be exposed from the holder unit 30. The upper end portion 103 of the wafer 100 has a function as a cutting portion for cutting each of the tubes 210 and 220 as shown in FIG. 13.

[0026] As shown in FIGS. 1 and 2, the tube holding unit 20 has a first holding unit 21 and a second holding unit 22 arranged at a predetermined interval in the left-right direction Y with respect to the first holding unit 21.

[0027] As shown in FIG. 1, the first holding unit 21 is provided with a first recess 21a into which the first tube 210 can be fitted and a second recess 21b into which the second tube 220 can be fitted.

[0028] As shown in FIG. 1, the second holding unit 22 is provided with a first recess 22a into which the first tube 210 can be fitted and a second recess 22b into which the second tube 220 can be fitted.

[0029] When using the tube joining device 1, user H fits and arranges the first tube 210 in the first recess 21a of the first holding part 21 and the first recess 22a of the second holding part 22, and fits and arranges the second tube 220 in the second recess 21b of the first holding part 21 and the second recess 22b of the second holding part 22. By performing such operations, user H can easily set each tube 210, 220 with respect to the housing 10.

[0030] In each holding part 21, 22, for example, a sensor for detecting whether each tube 210, 220 is properly set can be arranged.

[0031] The position where the wafer 100 cuts each tube 210, 220 is a predetermined position between the first holding part 21 and the second holding part 22 (for example, the position of Y0 shown in FIG. 2).

[0032] When the lid part 50 is closed with respect to the housing 10, it shields the vicinity of the tube holding part 20 from the outside. When the lid part 50 of the tube joining device 1 is closed, it prevents the positions where each tube 210, 220 is cut and joined from being exposed to the outside. Thereby, the tube joining device 1 can perform the cutting - joining operation in a sterile state.

[0033] The housing 10 and the lid part 50 can be provided with a locking mechanism for preventing the state where the lid part 50 is closed from being inadvertently released, for example.

[0034] As shown in FIG. 4, the holder part 30 includes a main body part 31 capable of holding the wafer 100, and a bearing part 33 that rotatably holds the main body part 31 of the wafer 100 around a predetermined rotation axis A.

[0035] The holder part 30 is configured to perform ascending and descending operations in conjunction with the operation of the cam C1. In each drawing, the ascending operation of the holder part 30 and the ascending operation of the wafer 100 accompanying the ascending operation of the holder part 30 are indicated by an arrow u, and the descending operation of the holder part 30 and the descending operation of the wafer 100 accompanying the descending operation of the holder part 30 are indicated by an arrow d.

[0036] The holder part 30 is rotatably held via a predetermined rotation axis disposed in the bearing part 33. When the cam C1 is supplied with a rotational driving force from the cam motor M1, the cam C1 executes a rotational operation. The outer peripheral surface of the cam C1 is formed in a non-circular shape. When the rotational position of the cam C1 is changed, the contact position between the outer peripheral surface of the cam C1 and the holder part 30 is changed. The holder part 30 performs ascending and descending operations in accordance with the change in the contact position with the cam C1.

[0037] The tube joining device 1 can be configured such that the arrangement of the holder part 30 and / or the wafer 100 can be changed after the cutting operation. The direction in which the arrangement of the holder part 30 and / or the wafer 100 is changed is, for example, the front-rear direction of the tube joining device 1 (a direction intersecting the extending direction of each of the tubes 210 and 220 set in the tube holding part 20, and the direction of the arrow X1 - X2 shown in FIG. 4).

[0038] As shown in FIG. 5, the rotation mechanism 80 includes a pedestal part 25 installed in the housing 10 and a tube housing part 60.

[0039] As shown in FIG. 1, the pedestal part 25 is disposed between the first holding part 21 and the second holding part 22. As shown in FIG. 1, the tube housing part 60 is disposed in the lid part 50.

[0040] When the lid portion 50 is closed with respect to the housing 10, as shown in FIG. 5, the tubes 210 and 220 are arranged in a state of being pressed against each other between the pedestal portion 25 and the tube housing portion 60. Further, when the lid portion 50 is closed with respect to the housing 10, the holding of the tubes 210 and 220 by the second holding portion 22 is released. Therefore, after the cutting operation, on the side of the second holding portion 22 (one side of the first tube 210 and the second tube 220), the tubes 210 and 220 can be rotated (see FIG. 10).

[0041] As shown in FIG. 5, a first driven gear 25a is formed on the outer peripheral surface of the pedestal portion 25. Further, a second gear follower 60a is formed on the outer peripheral surface of the tube housing portion 60. Each of the driven gears 25a and 60a is configured to mesh with a drive gear G1 for rotationally driving the rotation mechanism 80.

[0042] The tube joining device 1 applies a rotational driving force to the drive gear G1 from the gear motor M2 in a state where the pedestal portion 25 and the tube housing portion 60 are combined. When the drive gear G1 rotates, the pedestal portion 25 and the tube housing portion 60 rotate in conjunction with the rotation of the drive gear G1, and accordingly, the tubes 210 and 220 arranged in the pedestal portion 25 and the tube housing portion 60 rotate. In each drawing, the rotational operations of the tubes 210 and 220 are indicated by arrows r, r1, r2, r3, r4, etc.

[0043] The portion to be rotated in each of the tubes 210 and 220 is the one side (the side of the arrow Y1 in FIG. 2) located on the side of the second holding portion 22 when based on the cutting position Y0 shown in FIGS. 2 and 9. In the tube joining device 1 according to the present embodiment, the other side indicated by the arrow Y2 in FIG. 2 in each of the tubes 210 and 220 is a portion where no rotational operation is performed before and after the cutting-joining operation.

[0044] As shown in FIGS. 1 and 8, the tube joining device 1 has a fixed-side tube pressing portion 70 that maintains the state where the tubes 210 and 220 held by the first holding portion 21 are pressed against each other.

[0045] The fixed-side tube pressing portion 70 can be configured to maintain the state in which the tubes 210 and 220 are pressed against each other when the lid portion 50 is closed. The fixed-side tube pressing portion 70 can be disposed, for example, near the first holding portion 21 of the housing 10.

[0046] The control unit 40 can be configured by a microcomputer or the like. The control unit 40 includes a CPU and a storage unit that stores a control program for the entire device and various data executed by the CPU. The storage unit can be configured by a ROM, a RAM, or the like.

[0047] In the tube joining device 1 according to the present embodiment, the control unit 40 executes operation control such as a "cutting operation", a "retreat operation", a "position changing operation", and a "rotation operation", which will be described later.

[0048] The first tube 210 and the second tube 220 can be configured by, for example, resin tubes having lumens 211 and 221 (see FIG. 13) through which a fluid containing a biological component can flow. Each of the tubes 210 and 220 can be configured by, for example, a vinyl chloride tube. However, the material of each of the tubes 210 and 220 is not limited as long as they can be joined to each other by cutting and pressurization. For example, the materials of the tubes 210 and 220 may be different from each other. Also, there are no particular restrictions on the outer diameter, cross-sectional shape, etc. of each of the tubes 210 and 220.

[0049] As shown in FIG. 6, the first tube 210 is configured by a tube on the peritoneal dialysis fluid bag T11 side. A predetermined connector T12 is attached to the tip of the first tube 210. On the side opposite to the tip of the first tube 210, the dialysis fluid tube T14 of the dialysis fluid bag T11 is connected via a branch tube T13. Also, the first tube 210 is connected to the drainage tube T16 of the drainage bag T15 via a branch tube T13.

[0050] The second tube 220 is constituted by a tube disposed on the side of the peritoneal catheter T26 of user H used during peritoneal dialysis. Specifically, the second tube 220 includes an extension tube T21 and a protection tube T22. The extension tube T21 is connected to the peritoneal catheter T26 via a connecting tube T23, a silicone tube T24, and a catheter joint T25. One end side of the peritoneal catheter T26 can be inserted into the abdominal cavity of user H.

[0051] Referring to FIGS. 7 to 12, the flow of the cutting-joining operation performed by the tube joining device 1 will be schematically described.

[0052] When user H starts joining each of the tubes 210 and 220 using the tube joining device 1, as shown in FIG. 7, user H sets each of the tubes 210 and 220 in the first holding portion 21 and the second holding portion 22.

[0053] After user H sets each of the tubes 210 and 220 in each of the holding portions 21 and 22, user H closes the lid portion 50. When the lid portion 50 is closed, as shown in FIG. 8, the fixed-side tube pressing portion 70 and the rotation mechanism 80 press each of the tubes 210 and 220 against each other.

[0054] User H operates various buttons and the like on the operation panel disposed on the housing 10 to instruct the control unit 40 to execute the cutting-joining operation.

[0055] When the control unit 40 receives an instruction from user H, as shown in FIG. 9, the wafer 100 is relatively approached to each of the tubes 210 and 220 to cut each of the tubes 210 and 220.

[0056] After cutting each of the tubes 210 and 220, as shown in FIG. 10, the control unit 40 drives the rotation mechanism 80 to rotate one side of each of the tubes 210 and 220 so that the positions of the cut first end portion 210a of the first tube 210 and the cut second end portion 220a of the second tube 220 are interchanged.

[0057] As shown in FIG. 11, after cutting each of the tubes 210 and 220, the control unit 40 relatively separates the wafer 100 from each of the tubes 210 and 220. The control unit 40 presses and joins one side (each end portion 210a, 220a side) of each of the tubes 210 and 220 in a state where the holding by the second holding unit 22 is released against the other side of each of the tubes 210 and 220 where no rotational movement is performed.

[0058] After the joining is performed with the end portions 210a and 210b of each of the tubes 210 and 220 swapped, the user H can peel off each of the tubes 210 and 220 as shown in FIG. 12 by pulling the joint portion located on the outer peripheral surface of each of the tubes 210 and 220 with a finger or the like.

[0059] When the joining operation is completed, the side connected to the connector T12 of the first tube 210 maintains a joined state with the second tube 220 via the second end portion 220a of the second tube 220. Further, the second tube 220 connected to the peritoneal catheter T26 side maintains a joined state with the side connected to the branch tube T13 of the first tube 210 via the first end portion 210a of the first tube 210.

[0060] Next, with reference to FIGS. 13 to 22, the operation and effect of the present embodiment will be described together with the control content by the control unit 40.

[0061] In FIGS. 13 to 22, before the cutting-joining operation by the tube joining device 1 is performed, the drainage of peritoneal fluid or the like through the first tube 210 has already been performed, and as a result, a state is illustrated in which a foreign substance derived from a living body (for example, a substance in which a liquid containing lipids, proteins, etc. has solidified) S remains near the cutting position Y0 of the inner cavity 211 of the first tube 210.

[0062] As shown in FIG. 13, when cutting the first tube 210 and the second tube 220, the control unit 40 performs a cutting operation of relatively approaching the wafer 100 to the first tube 210 and the second tube 220.

[0063] Specifically, during the cutting operation, the control unit 40 approaches the wafer 100 along a predetermined first path p1 toward the first tube 210 and the second tube 220. At this time, the control unit 40 performs a raising operation of raising the holder unit 30 along the first path p1 (see FIG. 4).

[0064] When the first tube 210 and the second tube 220 are cut by the wafer 100, as shown in FIG. 14, foreign matter S may leak from the inner cavity 211 of the first tube 210. Further, the leaked foreign matter S may adhere to each side surface 101, 102 of the wafer 100 that contacts the cut surface of the first tube 210 during the cutting operation.

[0065] As shown in FIG. 15, after cutting the first tube 210 and the second tube 220, the control unit 40 rotates one side of each tube 210, 220 in order to swap the positions of the first tube 210 and the second tube 220 (the rotation of each tube 210, 220 is indicated by an arrow r1). When the control unit 40 rotates the first tube 210 and the second tube 220, a part of the foreign matter S adhering to the second side surface 102 located on the side in contact with the cut first end 210a of the first tube 210 and the cut second end 220a of the second tube 220 is removed or thinned by being diffused onto the wafer 100 as the tubes 210, 220 rotate. However, a part of the foreign matter S located outside the range of the rotation operation of each tube 210, 220 (the rear side of the tube joining device 1 and the part adhering to the side of the arrow X1 in FIG. 4) remains on the second side surface 102 of the wafer 100. Further, more foreign matter S remains on the first side surface 101 located on the other side of the first tube 210 and the second tube 220, that is, the side where no rotation operation is performed after cutting, than on the second side surface 102.

[0066] As shown in the comparative proportions of FIGS. 21 and 22, when the wafer 100 is retracted from the respective tubes 210, 220 along the second path p2 that is the same as the first path p1 after the cutting operation with foreign matter S adhering to each side surface 101, 102, the foreign matter S adhering to each side surface 101, 102 will adhere to the outer surfaces of the respective tubes 210, 220. When the respective tubes 210, 220 are joined with foreign matter S adhering to their outer surfaces, the foreign matter S will mix into the joint located at the end faces of the respective tubes 210, 220, or will inhibit the formation of the joint. As a result, the strength of the joint may decrease, or pinholes may occur. In particular, in the portion where the foreign matter S is not removed or thinned (the portion on the rear side of the tube joining device 1) when the first tube 210 is rotated, more foreign matter S that has moved from the first side surface 101 side to the respective tubes 210, 220 and foreign matter S that has moved from the second side surface 102 side to the respective tubes 210, 220 will gather, making it easier for the above-mentioned pinholes to occur.

[0067] In the tube joining device 1 according to the present embodiment, in order to prevent a decrease in joint strength and the occurrence of pinholes due to foreign matter S as described above, the control unit 40 controls the rotation mechanism 80 as follows.

[0068] As described above, when the respective tubes 210, 220 are rotated with the cut ends 210a, 210b of the respective tubes 210, 220 in contact with the second side surface 102 of the wafer 100, a part of the foreign matter S adhering to the second side surface 102 of the wafer 100 can be removed or thinned (FIGS. 15 and 16). In order to enhance the effect of "removing or thinning foreign matter S from the wafer 100 accompanying the rotation of the respective tubes 210, 220", the control unit 40 controls the rotation mechanism 80 to rotate the first tube 210 and the second tube 220 within a range of rotation angles that satisfies the following formula (1). Rotation angle θ [°]=180 + 360×n ··· Formula (1) However, n is an integer of 1 or more.

[0069] The control unit 40 can swap the positions of the first end 210a of the first tube 210 and the second end 220a of the second tube 220 by rotating one side of the first tube 210 and the second tube 220 by 180°. Further, based on the above formula (1), the control unit 40 increases the rotation angle within a certain range so that one side of each of the tubes 210 and 220 becomes 180°, 540° (= 180° + 360°), 900° (= 180° + 360° + 360°), etc. By doing so, the foreign matter S can be effectively removed from or thinned on the wafer 100 through multiple rotations.

[0070] In the above formula (1), when the rotation speeds of the first tube 210 and the second tube 220 become excessively high, after joining, the twisting of the first tube 210 and the second tube 220 may cause crushing in the inner cavities 211 and 221 of each of the tubes 210 and 220. Therefore, in the above formula (1), it is preferably n ≤ 4 (the range in which the positions of the first end 210a and the second end 220a are swapped 5 times).

[0071] As shown in FIGS. 17 and 18, the tube joining device 1 can effectively remove or thin the foreign matter S attached to the second side surface 102 of the wafer 100 by rotating each of the tubes 210 and 220 multiple times based on the above formula (1). The multiple rotations of each of the tubes 210 and 220 are indicated by the arrow r2.

[0072] In this embodiment, the control unit 40 performs operation control so as to rotate each of the tubes 210 and 220 in a predetermined first rotation direction (for example, the clockwise direction) in the drawing viewed from the "rotation side". However, there is no particular limitation on the direction in which the control unit 40 rotates each of the tubes 210 and 220. For example, as described in Modification 1 to be described later, the control unit 40 can also perform operation control so as to rotate each of the tubes 210 and 220 in a second rotation direction opposite to the first rotation direction (for example, the counterclockwise direction) (see FIG. 23).

[0073] After controlling the rotation mechanism 80 to perform a rotation operation, the control unit 40 can perform the "position change operation" (the operation indicated by the arrow m1 in the figure) shown in FIG. 19.

[0074] Specifically, the control unit 40 causes at least one of the first tube 210, the second tube 220, the wafer 100, and the holder unit 30 to change its position after cutting the first tube 210 and the second tube 220 so that the first path p1 along which the wafer 100 approaches the first tube 210 and the second tube 220 relatively during the cutting operation and the second path p2 along which the wafer 100 moves away from the first tube 210 and the second tube 220 relatively during the retraction operation are different paths.

[0075] In the present embodiment, in the position change operation, the wafer 100 is moved toward the rear side of the tube bonding device 1 (the side intersecting the extending direction of the first tube 210 and the second tube 220, i.e., the side of the arrow X1 in FIG. 4).

[0076] Note that the member to be moved and the direction of movement during the position change operation are not particularly limited as long as the first path p1 and the second path p2 are different paths. Also, the specific paths of the first path p1 and the second path p2 are not particularly limited as long as they are different from each other.

[0077] As shown in FIG. 20, after performing the position change operation, the control unit 40 performs a retraction operation to relatively separate the wafer 100 from the first tube 210 and the second tube 220.

[0078] Specifically, the control unit 40 separates the wafer 100 from the first tube 210 and the second tube 220 along a predetermined second path p2 different from the first path p1 during the retraction operation. At this time, the control unit 40 performs a lowering operation of lowering the holder unit 30 along the second path p2 (see FIG. 4).

[0079] As shown in FIG. 20, even if the foreign matter S attached to the second side surface 102 of the wafer 100 cannot be removed or thinned by the rotation operations of the respective tubes 210 and 220 over a plurality of times because the first path p1 and the second path p2 are different paths, it is possible to prevent the foreign matter S attached to each side surface 101, 102 of the wafer 100 from coming into contact with the respective tubes 210 and 220 during the retraction operation of the wafer 100. Therefore, it is possible to more reliably prevent the foreign matter S from entering the joint portion located at the end surfaces of the respective tubes 210 and 220 during the joining operation that is continuously performed after the cutting operation. Thereby, it is possible to effectively prevent a decrease in the joining strength and the occurrence of pinholes.

[0080] As described above, the tube joining device 1 according to the present embodiment is a tube joining device 1 that cuts the first tube 210 and the second tube 220 and then joins them by exchanging the cut first end 210a of the first tube 210 and the cut second end 220a of the second tube 220. The tube joining device 1 includes a tube holding portion 20 that holds the first tube 210 and the second tube 220, a wafer 100 that cuts the first tube 210 and the second tube 220 held by the tube holding portion 20, and a rotation mechanism 80 that rotates the first tube 210 and the second tube 220 in order to exchange the relative positions of the cut first end 210a and the cut second end 220a, and a control portion 40 that controls the operation of each part of the device. Then, the control portion 40 controls the rotation mechanism 80 to rotate the first tube 210 and the second tube 220 within a range of rotation angles that satisfies the following formula (1). Rotation angle θ [°]=180 + 360 × n ··· Formula (1) However, n is an integer of 1 or more.

[0081] According to the tube joining device 1 configured as described above, by rotating each of the tubes 210 and 220 a plurality of times, foreign matter S can be effectively removed or thinned, and the positions of the first end 210a of the first tube 210 and the second end 220a of the second tube 220 can be appropriately interchanged. The tube joining device 1 can prevent foreign matter S adhering to each side surface 101, 102 of the wafer 100 from coming into contact with the tubes 210 and 220 during the retraction operation of the wafer 100. Therefore, it is possible to prevent foreign matter S from entering the joint portion located at the end faces of the tubes 210 and 220 during the joining operation that follows the cutting operation. Thereby, it is possible to effectively prevent a decrease in joint strength and the occurrence of pinholes.

[0082] Further, the control unit 40 can control the rotation mechanism 80 so as to satisfy n ≤ 4 in the above formula (1). According to the tube joining device 1 configured in this way, while effectively removing or thinning the foreign matter S adhering to the wafer 100 as the tubes 210 and 220 rotate, it is possible to prevent crushing from occurring in the inner cavities 211 and 221 of the tubes 210 and 220 due to the twisting of the first tube 210 and the second tube 220.

[0083] In addition, the tube joining device 1 has a holder unit 30 that holds the wafer 100. The control unit 40 performs a cutting operation of relatively approaching the wafer 100 to the first tube 210 and the second tube 220 when cutting the first tube 210 and the second tube 220, and a retracting operation of relatively separating the wafer 100 from the first tube 210 and the second tube 220 after cutting the first tube 210 and the second tube 220. Then, the control unit 40 changes the position of at least one of the first tube 210, the second tube 220, the wafer 100, and the holder unit 30 after cutting the first tube 210 and the second tube 220 so that the first path p1 along which the wafer 100 relatively approaches the first tube 210 and the second tube 220 during the cutting operation and the second path p2 along which the wafer 100 relatively separates from the first tube 210 and the second tube 220 during the retracting operation are different paths.

[0084] According to the tube joining device 1 configured as described above, since the first path p1 and the second path p2 are different paths, it is possible to prevent foreign matter S attached to each side surface 101, 102 of the wafer 100 from coming into contact with the respective tubes 210, 220 during the retracting operation of the wafer 100. Therefore, it is possible to more reliably prevent the foreign matter S from mixing into the joint portion located at the end faces of the respective tubes 210, 220 during the joining operation that is subsequently performed after the cutting operation. Thereby, it is possible to effectively prevent a decrease in joint strength and the occurrence of pinholes.

[0085] In addition, the wafer 100 is a plate-shaped metal wafer that is heated during cutting, and the first tube 210 and the second tube 220 are resin tubes having inner cavities 211, 221 through which a fluid containing a biological component can flow. Therefore, the tube joining device 1 can prevent a decrease in joint strength and the occurrence of pinholes in tubes for medical use such as those used in peritoneal dialysis.

[0086] Next, a modification of the above-described embodiment will be described. In the following description, duplicate descriptions of the already described content will be omitted. Also, for the content not particularly mentioned in the following description, it can be the same as that of the above-described embodiment.

[0087] <Modification 1> FIG. 23 shows a control example of the rotation operation according to Modification 1.

[0088] As shown in FIG. 23, the control unit 40 can rotate each of the tubes 210 and 220, for example, in a second rotation direction opposite to the first rotation direction (for example, the counterclockwise direction of the drawing as viewed from the rotation side indicated by the arrow r3 in the figure). Even when each of the tubes 210 and 220 is rotated in this way, the tube joining device 1 can effectively diffuse the foreign matter S attached to the wafer 100.

[0089] In a single cutting-joining operation, the control unit 40 may rotate each of the tubes 210 and 220 only in one of the first rotation direction and the second rotation direction, or may rotate each of the tubes 210 and 220 by combining both the first rotation direction and the second rotation direction. By rotating each of the tubes 210 and 220 by combining the first rotation direction and the second rotation direction, it is possible to effectively prevent the occurrence of torsion in each of the tubes 210 and 220 after rotation while removing or thinning the foreign matter S attached to the wafer 100.

[0090] Note that, in any case where the control unit 40 rotates each of the tubes 210 and 220 in either the first rotation direction or the second rotation direction, the control of the operation of the rotation mechanism 80 is performed so that the rotation angle θ (the phase difference between one side and the other side of each of the tubes 210 and 220 after rotation) satisfies the above-described formula (1) so that the positions of the respective end portions 210a and 220a are interchanged after rotation.

[0091] <Modification 2> FIG. 24 shows a control example of the rotation operation according to Modification 2.

[0092] As shown by the arrow r4 in FIG. 24, the control unit 40 can control the rotation mechanism 80 to rotate one side of the first tube 210 and the second tube 220 and the other side of the first tube 210 and the second tube 220.

[0093] In the above-described embodiment, the tube joining device 1 had a configuration capable of rotating one side including the end portions 210a and 210b of the first tube 210 and the second tube 220 (see FIGS. 10, 15, and 17). As shown in this modification, the tube joining device 1 may have a structure in which the other side of the first tube 210 and the second tube 220 is rotatable. Further, the tube joining device 1 may have a configuration capable of rotating both one side and the other side of each of the tubes 210 and 220.

[0094] As shown in FIG. 24, the control unit 40 can remove or thin the foreign matter S attached to the second side surface 102 of the wafer 100 by rotating one side of each of the tubes 210 and 220. Further, the control unit 40 can remove or thin the foreign matter S attached to the first side surface 101 of the wafer 100 by rotating the other side of each of the tubes 210 and 220. The rotation of the other side of each of the tubes 210 and 220 is indicated by the arrow r4.

[0095] The tube joining device 1 according to this modification can effectively remove or thin the foreign matter S attached to each of the side surfaces 101 and 102 of the wafer 100 by arbitrarily and selectively rotating one side and the other side of each of the tubes 210 and 220 as described above.

[0096] Note that even when the control unit 40 rotates one side and / or the other side of each of the tubes 210 and 220, the control unit 40 performs operation control of the rotation mechanism 80 so that the rotation angle θ (the phase difference between one side and the other side of each of the tubes 210 and 220 after rotation) satisfies the above-described formula (1) so that the positions of the end portions 210a and 220a are interchanged after rotation.

[0097] As described above, the tube joining device according to the present invention has been explained. However, the present invention is not limited to only the above-described embodiments, and various modifications are possible within the scope of the claims.

[0098] For example, the application scope of the present invention is not limited to peritoneal dialysis only. As an example, it can be applied to a device for joining a tube connected to a container (bag) containing a blood product or the like used for blood transfusion and another tube. Also, as another example, it can be applied to a device for joining a tube connected to a container (bag) containing a cell culture solution containing various cells collected and cultured and another tube.

[0099] Also, as long as the tube joining device according to the present invention is configured to prevent a decrease in joining strength and the occurrence of pinholes by performing a rotation operation so as to satisfy the rotation angle defined by the above-described formula (1) after cutting the first tube and the second tube, there are no particular limitations on the specific device configuration, control content, control procedure, etc.

[0100] Also, the tube joining device can arbitrarily combine the configurations described in the embodiments and each modification example. As an example, the configuration shown in Modification Example 1 (operation control for rotating each tube in the first rotation direction and / or the second rotation direction) and the configuration shown in Modification Example 2 (operation control for rotating one side and / or the other side of each tube) can be combined.

Explanation of Reference Numerals

[0101] 1 Tube joining device 10 Housing 20 Tube holding part 21 First holding part 22 Second holding part 30 Holder part 40 Control part 50 Lid part 80 Rotation mechanism 100 Wafer (cutting member) 210 First tube 210a Cut first end Inner cavity of the first tube 211 Second tube 220 Cut second end 220a Inner cavity of the second tube 221 First path p1 Second path p2

Claims

1. A tube joining device that, after cutting a first tube and a second tube, swaps and joins a cut first end of the first tube and a cut second end of the second tube, comprising: a tube holding part for holding the first tube and the second tube; a cutting member for cutting the first tube and the second tube held by the tube holding part; a rotation mechanism for rotating the first tube and the second tube to swap the relative positions of the cut first end and the cut second end; a control part for controlling the operation of each part of the device, wherein the control part controls the rotation mechanism to rotate the first tube and the second tube within a range of rotation angles satisfying the following formula (1): A tube joining device. Rotation angle θ [°] = 180 + 360 × n... Formula (1) However, n is an integer of 1 or more.

2. The tube joining device according to claim 1, wherein the control part controls the rotation mechanism so that n ≤ 4 in the above formula (1).

3. The tube joining device according to claim 1 or claim 2, wherein the control part controls the rotation mechanism to rotate the first tube and the second tube in a first rotation direction and / or a second rotation direction which is the reverse direction of the first rotation direction.

4. The tube joining device according to any one of claims 1 to 3, wherein the control part controls the rotation mechanism to rotate one side of the first tube and the second tube cut by the cutting member and / or the other side of the first tube and the second tube cut by the cutting member.

5. having a holder part for holding the cutting member, wherein the control part performs a cutting operation of relatively approaching the cutting member to the first tube and the second tube when cutting the first tube and the second tube, and a retracting operation of relatively separating the cutting member from the first tube and the second tube after cutting the first tube and the second tube. The control unit performs a position changing operation for changing the position of at least one of the first tube, the second tube, the cutting member, and the holder unit after cutting the first tube and the second tube so that a first path along which the cutting member relatively approaches the first tube and the second tube during the cutting operation and a second path along which the cutting member relatively separates from the first tube and the second tube during the retracting operation are different paths. The tube joining device according to any one of claims 1 to 4.

6. The cutting member is a plate-shaped metal wafer that is heated during cutting, The first tube and the second tube are resin tubes each having a lumen through which a fluid containing biological components can flow. The tube joining device according to any one of claims 1 to 5.

Images