Wafer container drying device and cleaning system

Abstract

To prevent an increase in the capacity of an internal space of a drying tank.SOLUTION: A wafer storage container dryer according to an embodiment has: a main body that has a storage space for storing a wafer, the storage space communicating with an opening, and has a flange held by a robot; and a drying tank that has a door mounted on the opening in an openable and closable manner, and dries the wafer storage container. The drying tank comprises: a carry-in and carry-out port that can be opened and closed by an opening and closing lid; a main body storage part that stores the main body with the flange facing toward the carry-in and carry-out port; and a door holding part that, with the main body storage part storing the main body, is provided closer to the carry-in and carry-out port in the main body storage part than the main body, and holds the door so as to prevent the sides of the door from becoming orthogonal and parallel to one side forming the carry-in and carry-out port in a plan view of the drying tank.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] Embodiments of the present invention relate to a wafer storage container drying apparatus and a cleaning system.

Background Art

[0002] Conventionally, there has been a cleaning system for cleaning and drying wafer storage containers such as FOUP (Front Opening Unified Pod) and FOSB (Front Opening Shipping Box) that accommodate semiconductor wafers.

[0003] In the cleaning system, the wafer storage container is conveyed into the cleaning system, and the robot conveys the wafer storage container to the cleaning tank while gripping it. Then, the cleaning tank performs a cleaning process on the wafer storage container. And the drying process of the cleaned wafer storage container is performed in the same cleaning tank. Next, the dried wafer storage container is carried out of the cleaning system.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] Here, a flange for the robot hand to grip the wafer storage container body is provided on the upper surface of the wafer storage container body. In the cleaning tank, the flange is disposed in the tank in a state where it faces the side surface of the cleaning tank (that is, in a state where the opening, which is the location where the door of the wafer storage container fits, is downward), and cleaning and drying are performed. This is because, since the flange is provided on a surface intersecting the opening, for the convenience of drainage in the wafer storage space, the flange must be arranged to face the side surface of the cleaning tank. Therefore, when the robot hand transports the wafer storage container body into the cleaning tank, a predetermined space for the robot hand to enter is required between the side surface of the cleaning tank and the flange (for example, corresponding to the "extension part 11" in Patent Document 1). For this reason, the volume of the internal space of the cleaning tank increases.

[0006] The present invention has been made to solve the above-described problems, and an object thereof is to provide a wafer storage container drying device and a cleaning system capable of improving drying efficiency.

Means for Solving the Problems

[0007] In order to solve the above-described problems and achieve the object, a wafer storage container drying device according to an aspect of the present invention includes a drying tank for drying a wafer storage container having a storage space for storing wafers, the storage space communicating with an opening, a main body having a flange gripped by a robot, and a door that is detachably attached to the opening. The drying tank includes a carry-in / carry-out port that can be opened and closed by an opening / closing lid, a main body storage portion that stores the main body in a state where the flange faces the carry-in / carry-out port side, and a door holding portion that is provided on the carry-in / carry-out port side of the main body storage portion with respect to the main body when the main body is stored in the main body storage portion, and holds each side of the door so as not to be orthogonal or parallel to a side forming the carry-in / carry-out port when the drying tank is viewed in plan.

[0008] Also, in order to solve the above-described problems and achieve the object, a cleaning system according to one aspect of the present invention includes the wafer storage container drying device and a cleaning tank for cleaning the wafer storage container, and the drying tank dries the wafer storage container cleaned in the cleaning tank.

Effect of the Invention

[0009] According to one aspect of the present invention, it is possible to provide a wafer storage container drying device and a cleaning system capable of improving the drying efficiency.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

Figure 3

Figure 4

Mode for Carrying Out the Invention

[0011] Hereinafter, embodiments of a wafer storage container drying device and a cleaning system disclosed in the present application will be described in detail with reference to the accompanying drawings. Note that the wafer storage container drying device disclosed in the present application is not limited to the following embodiments. In the following embodiments, a case where the wafer storage container to be cleaned and dried is a FOUP will be described as an example, but the wafer storage container to be cleaned and dried is not limited thereto. For example, the wafer storage container to be cleaned and dried may be a FOSB.

[0012] (Embodiment) FIG. 1 is a plan view showing an example of a schematic configuration of a cleaning system 1 according to an embodiment. The cleaning system 1 is provided, for example, in a factory for manufacturing semiconductor wafers, and cleans and dries a wafer storage container.

[0013] As shown in FIG. 1, the cleaning system 1 includes a load port 2, a robot 3, a disassembling / connecting stage 4, a cleaning tank 5, a wafer storage container drying device 6, an unload port 7, and a control unit 8.

[0014] The robot 3, the disassembling / connecting stage 4, the cleaning tank 5, the wafer storage container drying device 6, and the control unit 8 are provided inside the casing 1a of the cleaning system 1. On the other hand, the load port 2 and the unload port 7 are provided straddling the inside and outside of the casing 1a of the cleaning system 1.

[0015] The load port 2 carries the FOUP 20 to be cleaned and dried, which is placed on the external part of the casing 1a of the load port 2, into the casing 1a. The FOUP 20 includes a FOUP main body (shell) 20a and a door (lid) 20b. The FOUP main body 20a has an opening (FOUP main body opening) and a storage space for storing semiconductor wafers. The storage space exists inside the FOUP main body opening and communicates with the FOUP main body opening. The door 20b can be disassembled / connected to the FOUP main body 20a and is mounted in an openable / closable state with respect to the FOUP main body opening when connected to the FOUP main body 20a. The FOUP main body 20a is an example of a main body. A flange 20c is provided on the FOUP main body 20a. The flange 20c is a portion that is gripped (held) when the FOUP 20 is transported by an OHT (Overhead Hoist Transport), a robot 3, or the like, and is provided on a surface that intersects the surface where the FOUP main body opening of the FOUP main body 20a is provided.

[0016] For example, on the external part of the casing 1a of the load port 2, the FOUP 20 conveyed by the OHT is placed. For example, as shown in FIG. 1, the FOUP 20 is placed such that the door 20b of the FOUP 20 faces the shutter 2a provided at the opening 1b of the casing 1a. When the FOUP 20 is placed on the load port 2 in this way, the shutter 2a rises. As a result, the FOUP 20 can be carried into the inside of the casing 1a from the opening 1b. That is, the FOUP 20 can be carried into the inside of the cleaning system 1. Then, the FOUP 20 is slid in the direction of arrow 2b by the slide device of the load port 2. As a result, the FOUP 20 is carried into the inside of the casing 1a.

[0017] The sliding by the slide device will be described. For example, when a pin provided in the slide device is inserted into a hole provided in the bottom (placement surface) of the FOUP 20, the placement surface of the FOUP 20 is fixed to the slide device. In this state, when the slide device is slid in the direction of arrow 2b, the FOUP 20 is also slid along with it. As a result, the FOUP 20 is placed on a predetermined portion inside the casing 1a of the load port 2. When the FOUP 20 is carried into the inside of the casing 1a in this way, the shutter 2a descends and the opening 1b of the casing 1a is closed. The slide device descends together with the pin to a position lower than the lower end of the shutter 2a (the placement surface of the FOUP 20) and returns to the original position outside the casing 1a.

[0018] The robot 3 conveys the FOUP 20 to each part while gripping the flange 20c of the FOUP 20. The robot 3 includes a robot arm 3a and a robot hand 3b (the gripping part of the robot 3). The robot 3 conveys the FOUP 20 to each part by expanding and contracting or rotating the robot arm 3a while the robot hand 3b grips the flange 20c. When the robot 3 conveys the door 20b alone separated (disassembled) from the FOUP main body 20a, it grips both sides of the door 20b and conveys it.

[0019] The disassembling / connecting stage 4 disassembles (separates) the FOUP 20 into the FOUP main body 20a and the door 20b, or connects the FOUP main body 20a and the door 20b. A latch key 4a is provided on the disassembling / connecting stage 4. By rotating the latch key 4a while it is inserted into the keyhole formed in the door 20b of the FOUP 20, the FOUP 20 is disassembled into the FOUP main body 20a and the door 20b, or the FOUP main body 20a and the door 20b are connected. For example, the FOUP 20 carried into the inside of the casing 1a is conveyed by the robot 3 to the disassembling / connecting stage 4. In this case, the disassembling / connecting stage 4 disassembles the FOUP 20 into the FOUP main body 20a and the door 20b. Note that disassembling can be rephrased as unlocking, and connecting can be rephrased as locking.

[0020] The cleaning tank 5 is a tank for cleaning the FOUP 20. For example, the FOUP main body 20a and the door 20b are separately conveyed by the robot 3 to the cleaning tank 5. Then, the cleaning tank 5 performs a cleaning process on the FOUP 20 while separately holding the FOUP main body 20a and the door 20b. For example, the cleaning tank 5 holds the door 20b in the lid portion of the cleaning tank 5 and the FOUP main body 20a in the tank portion of the cleaning tank 5 (the cleaning tank main body of the cleaning tank 5), and rotates these by a rotation mechanism (not shown), and discharges a cleaning liquid (for example, pure water) from a cleaning liquid nozzle to each of the FOUP main body 20a and the door 20b to clean the FOUP 20. Note that the cleaning tank 5 is preferably arranged with the FOUP opening of the FOUP main body 20a facing downward in consideration of the dischargeability of the cleaning liquid.

[0021] When the cleaning of the FOUP 20 is completed in the cleaning tank 5, the FOUP main body 20a and the door 20b in the cleaning tank 5 are subsequently rotated, and dry air is blown onto them for drying. The drying in the cleaning tank 5 here is a process (temporary drying) for generally drying the cleaning liquid adhering to the FOUP 20. When the temporary drying of the FOUP 20 is completed in the cleaning tank 5, the robot 3 separately conveys the FOUP main body 20a and the door 20b in the cleaning tank 5 to the wafer storage container drying device 6.

[0022] The wafer storage container drying apparatus 6 is an apparatus that vacuum dries (mainly dries) the FOUP 20. When the vacuum drying of the FOUP 20 is completed in the wafer storage container drying apparatus 6, the robot 3 separately transports the FOUP body 20a and the door 20b in the wafer storage container drying apparatus 6 to the disassembly / connection stage 4. The disassembly / connection stage 4 then connects the FOUP body 20a and the door 20b together. Details of the wafer storage container drying apparatus 6 will be described later.

[0023] The unload port 7 carries out the cleaned and vacuum-dried FOUP 20 placed by the robot 3 in the portion of the unload port 7 inside the casing 1a to the outside of the casing 1a.

[0024] For example, after vacuum drying, a FOUP 20, in which a FOUP body 20a and a door 20b are connected in the disassembly / connection stage 4, is transported by the robot 3 and placed in the interior of the casing 1a at the unload port 7. When the FOUP 20 is placed in the unload port 7 in this manner, the shutter 7a provided at the opening 1c of the casing 1a rises. This allows the FOUP 20 to be transported out of the casing 1a through the opening 1c. In other words, the FOUP 20 is now in a state where it can be transported out of the cleaning system 1. Then, the slide device of the unload port 7 (having a mechanism similar to that of the slide device of the load port 2) slides the FOUP 20 in the direction of arrow 7b, whereby the FOUP 20 is transported out of the casing 1a. When the FOUP 20 has been transported out of the casing 1a in this manner, the shutter 7a descends, closing the opening 1c of the casing 1a.

[0025] The control unit 8 controls the overall operation of the cleaning system 1. For example, the control unit 8 controls the load port 2, the robot 3, the disassembly / connection stage 4, the cleaning tank 5, the wafer storage container drying device 6, and the unload port 7, thereby operating the load port 2, the robot 3, the disassembly / connection stage 4, the cleaning tank 5, the wafer storage container drying device 6, and the unload port 7 as described above.

[0026] For example, the control unit 8 includes a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), an HDD (Hard Disk Drive), and a communication interface. These are connected via an internal bus.

[0027] The CPU executes various processes while using the storage area of the RAM as a temporary storage area for data used in various processes. The ROM and HDD store programs for executing various processes, various databases used when executing various processes, various tables, and the like. The communication interface is an interface for communicating with the above-described respective parts of the cleaning system 1 and for communicating with an external device connected to the cleaning system 1 via a network. For example, the communication interface is a network interface card.

[0028] Next, an example of the wafer storage container drying device 6 according to the present embodiment will be described. FIG. 2 is a side view of the inside of the wafer storage container drying device 6 according to the embodiment in a perspective state. FIG. 2 is a schematic diagram of the wafer storage container drying device 6. In the example of FIG. 2, illustration of a part of the side surface of the wafer storage container drying device 6 is omitted, and the inside of the drying tank 6a of the wafer storage container drying device 6 is shown. Further, in the example of FIG. 2, a state in which the opening (drying tank opening) 6x of the drying tank main body 6c is closed by the opening / closing lid 6d of the drying tank 6a is shown.

[0029] As shown in FIG. 2, the wafer storage container drying device 6 includes a drying tank 6a, a roughing valve (dry pump is connected to ) 6b, an exhaust port 6g connected to the roughing valve 6b, an exhaust pipe 6p, and a main valve (not shown) and a turbo molecular pump connected to the exhaust pipe 6p below the exhaust pipe 6p.

[0030] The drying chamber 6a vacuum-dries the FOUP 20. Specifically, the drying chamber 6a vacuum-dries the FOUP 20 that has been washed in the washing chamber 5. The drying chamber 6a includes a drying chamber main body 6c, an opening / closing lid (lid portion) 6d, a FOUP holding portion 6e, a heater 6f, a reflector 6n, and a FOUP main body holding portion 6k.

[0031] Here, in the drying chamber 6a, since there is no need to consider the drainage of the cleaning liquid as in the washing chamber 5, it is not necessary to arrange the FOUP opening of the FOUP main body 20a downward. Also, in order to perform vacuum exhaust, it is preferable to make the volume of the internal space of the drying chamber 6a as small as possible. Therefore, the drying chamber 6a according to the present embodiment is configured as described below so that the volume of the internal space can be made as small as possible.

[0032] The drying chamber main body 6c has a drying chamber opening 6x at the upper part and a drying space 6y on which the FOUP main body 20a is placed. Specifically, for example, the internal space of the drying chamber main body 6c is a region including the drying chamber opening 6x and the drying space 6y. The opening / closing lid 6d is provided above the drying chamber main body 6c. Specifically, it is provided so as to be openable and closable with respect to the drying chamber opening 6x of the drying chamber main body 6c. The opening / closing lid 6d opens and closes the drying chamber opening 6x of the drying chamber main body 6c, for example, by the operation of an air cylinder. That is, the drying chamber opening 6x can be opened and closed by the opening / closing lid 6d.

[0033] The drying space 6y inside the drying tank body 6c exists inside the drying tank opening 6x and communicates with the drying tank opening 6x. With the opening / closing lid 6d open with respect to the drying tank opening 6x, the FOUP body 20a is carried into the drying space 6y from the drying tank opening 6x by the robot 3. At this time, the robot 3 carries the FOUP body 20a into the drying space 6y with the flange 20c facing upward. And in the drying space 6y of the drying tank body 6c, a FOUP body holding part 6k for holding the carried-in FOUP body 20a is provided. Here, the FOUP body holding part 6k holds the FOUP body 20a with the flange 20c of the FOUP body 20a facing upward. That is, the FOUP body holding part 6k holds the FOUP body 20a with the flange 20c facing the drying tank opening 6x side of the drying tank body 6c. Also, the FOUP body holding part 6k holds the FOUP body 20a with the opening of the FOUP body 20a facing the side wall (side surface) of the drying tank body 6c. In this way, by the FOUP body holding part 6k holding the FOUP body 20a, the FOUP body 20a is accommodated in the drying space 6y of the drying tank body 6c. Such a drying space 6y provided in the drying tank body 6c is an example of a main body accommodating part for accommodating the FOUP body 20a.

[0034] FIG. 3 is a plan view of the FOUP body holding part 6k according to the embodiment. As shown in FIG. 3, the FOUP body holding part 6k is a plate-like member, and a plurality of pins (kinematic pins) 6k1 are provided. These pins 6k1 are provided at positions corresponding to the holes provided in the bottom of the FOUP body 20a (the surface facing the surface where the flange 20c is provided). The positions of the holes provided in the bottom of the FOUP body 20a are determined in advance by the standard.

[0035] The FOUP body holding part 6k holds the FOUP body 20a so as to form a gap between the bottom of the FOUP body 20a through a plurality of pins 6k1. A hole 6k2 is provided in the FOUP body holding part 6k, and through this hole 6k2, the exhaust port 6m (see FIG. 2) formed in the drying tank body 6c communicates with the space below the bottom of the FOUP body 20a. Specifically, the exhaust port 6m and the exhaust pipe 6p are connected. In this way, by communicating the space below the FOUP body 20a with the exhaust port 6m, a configuration is achieved that does not prevent the exhaust from the exhaust port 6m. As a result, the exhaust efficiency of the drying tank 6a is improved, and thus the drying efficiency of the drying tank 6a is improved.

[0036] As described above, the robot 3 carries the FOUP body 20a into the drying space 6y with the flange 20c facing upward. Therefore, it is not necessary to provide a relatively large space for the robot 3 (more specifically, the robot hand 3b) to enter between the side surface of the drying tank body 6c and the FOUP body 20a, and the gap between the side surface of the drying tank body 6c and the FOUP body 20a can be made narrower compared to the cleaning tank 5. That is, the size of the internal volume of the drying tank body 6c (for example, the volume of the space combining the drying tank opening 6x and the drying space 6y) can be set to the size that the FOUP body 20a can enter and without extra space. Therefore, according to the wafer storage container drying device 6 according to the present embodiment, an increase in the volume of the internal space of the drying tank 6a can be suppressed.

[0037] By suppressing an increase in the volume of the drying tank 6a, the internal space of the drying tank 6a can be exhausted quickly, and the time required to exhaust to the target vacuum degree can be shortened. As a result, the drying processing efficiency of the FOUP 20 can be improved.

[0038] As described above, the FOUP 20 carried into the drying tank 6a has already completed pre-drying in the cleaning tank 5, and the purpose is to perform a more reliable drying process (main drying) in the drying tank 6a.

[0039] The door holding part 6e is provided at the drying tank opening 6x and holds the door 20b conveyed by the robot 3. In the present embodiment, as shown in FIG. 2, two door holding parts 6e are provided, but the number of door holding parts 6e is not limited to this.

[0040] In the present embodiment, with the opening / closing lid 6d open with respect to the drying tank opening 6x, after the FOUP main body 20a is carried into the drying space 6y by the robot 3, the door 20b is carried into the drying tank opening 6x. The door holding part 6e holds the door 20b carried in in this way. After the vacuum drying of the FOUP 20 is completed, the door 20b held by the door holding part 6e is carried out by the robot 3. In this way, the door 20b is carried in and out by the robot 3 through the drying tank opening 6x. Then, the FOUP main body 20a held by the FOUP main body holding part 6k is carried out by the robot 3. Therefore, the drying tank opening 6x is both an inlet and an outlet for carrying in and out the FOUP by the robot. Thus, the drying tank opening 6x is an example of an inlet / outlet.

[0041] Also, in a state where the FOUP main body 20a is held by the FOUP main body holding part 6k, an exhaust port 6g for evacuating the internal space of the drying tank 6a is provided at a position on the side wall (side surface) of the drying tank 6a facing the opening of the FOUP main body 20a. In the present embodiment, the wafer storage container drying device 6 holds the FOUP main body 20a by the FOUP main body holding part 6k, holds the door 20b by the door holding part 6e, and evacuates (rough evacuation) the internal space of the drying tank main body 6c through the exhaust port 6g and the roughing valve 6b with the opening / closing lid 6d closing the drying tank opening 6x, and while evacuating (fine evacuation) with a turbo molecular pump through the exhaust port 6m, the exhaust pipe 6p, and the main valve, heats with the heater 6f to vacuum-dry the FOUP main body 20a and the door 20b. Here, the reflector 6n reflects the heat from the heater 6f so that the heat from the heater 6f spreads throughout the internal space of the drying tank main body 6c. Thereby, the internal space of the drying tank main body 6c can be efficiently heated.

[0042] Next, the door holding part 6e according to the present embodiment will be described. FIG. 4 is a plan view (top view) of the drying tank 6a according to the embodiment. However, in FIG. 4, the illustration of the opening / closing lid 6d is omitted. Also, in FIG. 4, the door 20b is shown by a two-dot chain line. FIG. 4 is a schematic diagram of the components of the wafer storage container drying device 6. As shown in FIG. 4, when the drying tank 6a is viewed in plan (top view), the shape of the door 20b is a quadrilateral or a substantially quadrilateral formed by four sides 20bA1, 20bA2, 20bB1, and 20bB2. The lengths of the short sides 20bA1 and 20bA2 are about 80% of the lengths of the long sides 20bB1 and 20bB2. Also, when viewed in plan, the shape of the side surface of the drying tank main body 6c that forms the drying tank opening 6x is also a quadrilateral or a substantially quadrilateral formed by four sides 6cA1, 6cA2, 6cB1, and 6cB2.

[0043] Thus, the shape of the door 20b and the shape of the drying tank opening 6x can be regarded as a quadrilateral or a substantially quadrilateral. And in the present embodiment, in a state where the FOUP main body 20a is held by the FOUP main body holding part 6k, the length A of the FOUP main body 20a in the direction parallel to the direction in which the side 6cA1 extends is slightly longer than the length B of the FOUP main body 20a in the direction parallel to the direction in which the side 6cB1 extends. This is because the FOUP main body 20a is provided with two handles 20h in the direction parallel to the direction in which the side 6cB1 extends, as shown in FIG. 4.

[0044] Also, in the present embodiment, the length of the side 20bB1 of the door 20b is about the same as the above-described length A, and the length of the side 20bA1 of the door 20b is about 80% of the side 20bB1 of the door 20b as described above. Therefore, it becomes a length slightly shorter than the length A. For example, the length of the side 20bA1 of the door 20b is 307 mm, and the length of the side 20bB1 is 365 mm.

[0045] In this embodiment, as shown in FIG. 4, when the drying chamber 6a is viewed in plan, the door holding portion 6e holds the door 20b such that each side of the door 20b is neither orthogonal nor parallel to one side forming the drying chamber opening 6x. For example, the door holding portion 6e holds the door 20b such that the side 20bA1 is neither orthogonal nor parallel to the side 6cA1. Further, the door holding portion 6e holds the door 20b such that the side 20bA2 is neither orthogonal nor parallel to the side 6cA2. Further, the door holding portion 6e holds the door 20b such that the side 20bB1 is neither orthogonal nor parallel to the side 6cB1. Further, the door holding portion 6e holds the door 20b such that the side 20bB2 is neither orthogonal nor parallel to the side 6cB2.

[0046] A step 6e1 is formed in the door holding portion 6e along the corners of the door 20b having a square or substantially square shape in plan view. When the step 6e1 is viewed in plan, the step 6e1 is formed in the door holding portion 6e so as to be inclined with respect to the sides 6cA1 and 6cA2. That is, when the step 6e1 of the door holding portion 6e is viewed in plan, the step 6e1 is formed in the door holding portion 6e so as to be neither orthogonal nor parallel to the sides 6cA1 and 6cA2.

[0047] Here, a case will be described where, hypothetically, the door holder 6e holds the door 20b such that each side of the door 20b is orthogonal or parallel to a side forming the drying tank opening 6x. In this case, for example, the door holder 6e holds the door 20b such that the side 20bA1 is parallel to the side 6cA1. Also, the door holder 6e holds the door 20b such that the side 20bA2 is parallel to the side 6cA2. Further, the door holder 6e holds the door 20b such that the side 20bB1 is parallel to the side 6cB1. Additionally, the door holder 6e holds the door 20b such that the side 20bB2 is parallel to the side 6cB2. In this way, when the door holder 6e attempts to hold the door 20b, the position of the door holder 6e will be located more inward than the position of the door holder 6e shown in FIG. 4. In this case, even if the robot 3 attempts to carry the FOUP main body 20a into the drying space 6y, the door holder 6e and the FOUP main body 20a will interfere with each other, making it difficult to carry the FOUP main body 20a into the drying space 6y.

[0048] On the other hand, according to the present embodiment, as described above, the door holder 6e holds the door 20b such that each side of the door 20b is neither orthogonal nor parallel to a side forming the drying tank opening 6x. The diagonal of the door 20b is longer than the long sides 20bB1, 20bB2 of the door 20b. Therefore, compared with the case where the long sides 20bB1, 20bB2 of the door 20b are arranged parallel to the sides 6cB1, 6cB2 of the drying tank opening 6x, arranging the door 20b obliquely allows for door 20b along the length of long the sides 6cB1, 6cB2. Also, the length of the FOUP main body 20a in the direction along the sides 6cB1, 6cB2 B is the doorIt is approximately the same as the lengths of the sides 20bB1 and 20bB2 of A20b. As a result, as shown in FIG. 4, the corner portions of the door 20b on the sides 6cB1 and 6cB2 can be arranged outside (the side closer to the sides 6cA1 and 6cA2) than the location where the FOUP main body 20a is arranged. When the door holding portions 6e are arranged adjacent to the sides 6cA1 and 6cA2 so as to support the corner portions of the door 20b, a space through which the FOUP main body 20a can pass can be secured between the pair of door holding portions 6e. Since this space can be secured, when the FOUP main body 20a is carried in and out, there is no need to provide a retracting mechanism or the like in the door holding portion 6e for the purpose of avoiding interference between the door holding portion 6e and the FOUP main body 20a, and with a simple configuration, the FOUP main body 20a and the door 20b can be easily carried in and out.

[0049] In addition, in order to prevent the door holding portion 6e from interfering with the FOUP main body 20a to be carried in, it is also conceivable that the drying tank 6a holds the FOUP main body 20a and the door 20b such that the door 20b is arranged below the FOUP main body 20a in the internal space of the drying tank 6a. However, in this case, in order to place the door 20b on the bottom of the drying tank 6a, it is necessary for the robot 3 (more specifically, the robot arm 3a) to enter to the bottom of the drying tank 6a. For this reason, the possibility of the robot 3 (more specifically, the robot arm 3a) coming into contact with the drying tank 6a becomes high, and the risk of damaging the components inside the drying tank 6a by the robot arm 3a becomes high. On the other hand, when the FOUP main body 20a is arranged below the door 20b with the flange 20c facing upward in the internal space of the drying tank 6a as in the present embodiment, the deepest position is the position of the flange 20c at the position where the robot 3 enters the drying tank 6a. Thus, in the present embodiment, since it is only necessary for the robot 3 to move to the flange 20c at a relatively shallow position, the risk of the robot 3 coming into contact with the drying tank 6a can be reduced.

[0050] In addition, in the present embodiment, as shown in FIG. 4, two door holding portions 6e are provided. Then, by engaging the steps of the two door holding portions 6e with two diagonal corners among the four corners of the door 20b, the two door holding portions 6e hold the two diagonal corners of the door 20b. In this way, by holding the two diagonal corners of the door 20b by the door holding portions 6e, the positioning of the door 20b with respect to the drying chamber 6a can be performed.

[0051] Also, as shown in FIG. 4, by arranging the long sides 20bB1 and 20bB2 of the door 20b obliquely with respect to the sides 6cB1 and 6cB2 of the drying chamber opening 6x instead of arranging them in parallel, gaps 60 and 61 are naturally formed between each of the two opposing sides 6cA1 and 6cA2 forming the drying chamber opening 6x and the door 20b held by the door holding portion 6e. The gaps 60 and 61 are spaces (spaces into which the robot arm 3a is inserted) for enabling the robot 3 to hold the door 20b. Therefore, according to the present embodiment, the distance between the sides 6cA1 and 6cA2 can be set to a size that allows the FOUP main body 20a to be carried in and out, and the robot 3 can enter the gaps 60 and 61 to grip the door 20b. Thereby, an increase in the volume of the drying chamber 6a can be suppressed.

[0052] As described above, the two door holding portions 6e according to the present embodiment are respectively provided in the vicinity of two opposing sides (sides 6cA1 and 6cA2) forming the drying chamber opening 6x. And the interval between the two door holding portions 6e is a size that allows the FOUP main body 20a to be carried into the drying space 6y and carried out from the drying space 6y with the flange 20c facing upward (upper side).

[0053] Note that the size of the door 20b may vary depending on the type of the FOUP 20. For this reason, the control unit 8 may automatically adjust the position of the door holding portion 6e according to the type of the FOUP 20. Thereby, the door holding portion 6e can hold doors 20b of various sizes. Also, the position of the door holding portion 6e may be adjusted manually by the user.

[0054] The wafer storage container drying device 6 and the cleaning system 1 according to the embodiment have been described above. As described above, according to the wafer storage container drying device 6 and the cleaning system 1, an increase in the volume of the internal space of the drying tank 6a can be suppressed, and thereby the drying efficiency can be improved.

[0055] Here, since the FOUP 20 is made of resin and has low heat resistance, for example, it is necessary to keep the temperature setting of the heater 6f at about 90 degrees. That is, since there is an upper limit to the temperature setting of the heater 6f, there is a limit to improving the drying efficiency of the FOUP 20 by increasing the set temperature of the heater 6f. When the volume of the internal space of the drying tank 6a is smaller, the inside of the internal space can be heated faster even in a situation where there is an upper limit to the temperature setting, and thereby the FOUP 20 can be dried faster.

[0056] In addition, when drying the FOUP 20 under vacuum as in the drying tank 6a of the above-described embodiment, the smaller the volume of the internal space of the drying tank 6a, the shorter the time required for exhaust, so the FOUP 20 can be dried faster. That is, by suppressing an increase in the volume of the internal space of the drying tank 6a, the drying efficiency can be improved.

[0057] In the above embodiment, pure water is exemplified as the cleaning liquid, but it is not limited thereto, and a cleaning liquid containing a surfactant, a liquid in which a gas is dissolved, or the like may be used. Two fluids may be supplied as the cleaning liquid using a two-fluid nozzle.

[0058] In the above embodiment, it is exemplified that pre-drying is performed in the cleaning tank 5, but it is not limited thereto, and only the main drying by the drying tank 6a may be performed without performing pre-drying. In addition, pre-drying is exemplified by blowing dry air, but it is not limited thereto, and pre-drying may be performed by rotating the FOUP 20 and blowing off the cleaning liquid by centrifugal force.

Description of Reference Numerals

[0059] 1 Washing System 6 Wafer Storage Container Drying Device 6a Drying Tank 6c Drying Tank Body 6d Opening / Closing Lid 6e Door Holding Part 6x Drying Tank Opening 6y Drying Space 20 FOUP 20a FOUP Body 20b Door 20c Flange

Claims

1. A wafer storage container drying device having a drying chamber for drying a wafer storage container having a storage space for storing wafers, the storage space communicating with an opening, a main body having a flange gripped by a robot, and a door that is openably and closably attached to the opening, wherein the drying chamber includes a loading / unloading port that can be opened and closed by an opening / closing lid, a main body storage portion that stores the main body with the flange facing the loading / unloading port side, a door holding portion that is provided on the loading / unloading port side of the main body storage portion with respect to the main body when the main body is stored in the main body storage portion, and that holds each side of the door so as not to be orthogonal or parallel to one side forming the loading / unloading port when the drying chamber is viewed in plan, and is a wafer storage container drying device including the above.

2. The wafer storage container drying device according to claim 1, wherein the door holding portion is provided so as to hold two diagonal corners out of the four corners of the door.

3. The door is carried in and out by the robot through the loading / unloading port, and a gap into which a gripping portion of the robot is inserted is formed between two opposing sides forming the loading / unloading port where the door holding portion is provided and the door held by the door holding portion. The wafer storage container drying device according to claim 2.

4. The door holding portion is provided near each of two opposing sides forming the loading / unloading port, and the distance between the door holding portions is such that the main body can be loaded into the main body storage portion and unloaded from the main body storage portion with the flange facing the loading / unloading port side. The wafer storage container drying device according to claim 2 or 3, characterized by this.

5. An exhaust portion for exhausting the internal space of the drying chamber, and a heater provided in the drying chamber for heating the drying chamber, and further has while exhausting the internal space of the drying chamber to a predetermined pressure by the exhaust portion, heating by the heater. The wafer storage container drying device according to any one of claims 1 to 3.

6. A wafer storage container drying device according to any one of claims 1 to 3, and a cleaning chamber for cleaning the wafer storage container, and is provided with The drying chamber dries the wafer storage container cleaned in the cleaning chamber. A cleaning system.

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