Titanium copper foil, titanium copper strip and electronic parts

Abstract

To provide a titanium copper foil, a titanium copper strip and an electronic component having reduced foil thickness variation.SOLUTION: There is provided a titanium copper foil comprising 1.5 mass% to 5.0 mass% of Ti and the balance copper with inevitable impurities, wherein the ratio of the standard deviation (μm) of the foil thickness to the average value (μm) of the foil thickness at nine points located in a straight line at intervals of 10 mm in a direction parallel to the rolling direction is 0.0100 or less.SELECTED DRAWING: None

Description

Technical Field

[0001] This specification describes a titanium copper foil, as well as a titanium copper bar and an electronic component including the same.

Background Art

[0002] Among copper alloy foils, titanium copper foil has excellent stress relaxation characteristics and relatively high strength, and thus may be used for switches, connectors, jacks, terminals, relays, and other components of electronic devices. In recent years, with the miniaturization of electronic devices progressing, there has been a demand for a titanium copper foil with a thin foil thickness for use in components for such electronic devices. The foil thickness is, for example, 0.1 mm or less. It is required to exhibit required characteristics with such a thin titanium copper foil.

[0003] In Patent Document 1, for the purpose of "providing a titanium copper foil and a method for producing the same that can be suitably used as a conductive spring material used for electronic device components such as an autofocus camera module, even when the foil thickness is as thin as 0.1 mm or less and has little sag when used as a spring", "a titanium copper foil containing 1.5 to 5.0% by mass of Ti, with the balance being copper and inevitable impurities, having a foil thickness of 0.1 mm or less, and having a variation in foil thickness of 0.0 μm to 1.0 μm at five measurement points arranged at intervals of 60 mm in a direction parallel to the rolling direction" has been proposed.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] When the thickness of the titanium copper foil is non-uniform, for example, when it is used in a connector, variations in the contact pressure of the connector occur, resulting in unstable contact resistance. As a result, poor contact may occur. Alternatively, when the thickness of the titanium copper foil is non-uniform, for example, when it is used as a spring material, the stress applied to the titanium copper foil is less likely to be uniformly distributed. As a result, the fatigue resistance as an electronic component may decrease. From these viewpoints, it is necessary to further uniformize the thickness of the titanium copper foil.

[0006] This specification provides a titanium copper foil, a titanium copper bar, and an electronic component with reduced thickness variations.

Means for Solving the Problems

[0007] The titanium copper foil of the present disclosure contains 1.5 mass% to 5.0 mass% of Ti, the balance being composed of copper and unavoidable impurities, and the ratio of the standard deviation (μm) of the foil thickness to the average value (μm) of the foil thickness at nine points located linearly at intervals of 10 mm in the direction parallel to the rolling direction is 0.0100 or less.

[0008] The titanium copper foil of the present disclosure also contains 1.5 mass% to 5.0 mass% of Ti, the balance being composed of copper and unavoidable impurities, and the standard deviation of the foil thickness at nine points located linearly at intervals of 10 mm in the direction parallel to the rolling direction is 0.500 μm or less.

[0009] The titanium copper bar of the present disclosure includes the above titanium copper foil.

[0010] The electronic component of the present disclosure includes the above titanium copper foil.

Advantages of the Invention

[0011] The titanium copper foil of the present disclosure has reduced variations in foil thickness.

Modes for Carrying Out the Invention

[0012] Hereinafter, embodiments of the above-described titanium copper foil and a method for manufacturing the titanium copper foil will be described in detail.

[0013] In the present disclosure, "A to B" shall mean "A or more and B or less". Both A and B represent numerical values.

[0014] The titanium copper foil of one embodiment contains 1.5 mass% to 5.0 mass% of Ti, the balance being composed of copper and inevitable impurities, and the ratio of the standard deviation (μm) of the foil thickness to the average value (μm) of the foil thickness at nine points located linearly at intervals of 10 mm in the direction parallel to the rolling direction is 0.0100 or less. With the above configuration, since the influence of the variation in the foil thickness on the foil thickness is 1.00% or less, it can be said that the variation is sufficiently reduced.

[0015] When a connector is manufactured using the titanium copper foil of the present disclosure, since the foil thickness of the titanium copper foil is uniform, the variation in the contact pressure of the connector is suppressed, and the contact resistance is stabilized. Thereby, the contact failure of the connector is effectively suppressed.

[0016] In order to manufacture a titanium copper foil with a uniform foil thickness as described above, it is essential to improve the cold rolling process one or more times. Specifically, when performing a cold rolling process on a strip material obtained through melting, casting, and other processes, when passing the strip material between the rolling rolls, the feeding speed of the strip material is measured by a laser velocimeter. Then, based on the measured value of the feeding speed of the strip material measured by the laser velocimeter, the roll gap between the rolling rolls is adjusted. As a result, it becomes possible to control the thickness of the strip material with high accuracy in the cold rolling process. As a result, the variation in the foil thickness in the direction parallel to the rolling direction of the titanium copper foil can be reduced.

[0017] (Composition) The Ti concentration of the titanium copper foil of the present disclosure is 1.5% by mass to 5.0% by mass. Titanium copper increases strength and conductivity by dissolving Ti into the Cu matrix through solution treatment and dispersing fine precipitates in the alloy through aging treatment. When the Ti concentration is less than 1.5% by mass, precipitation of the precipitate becomes insufficient and the desired strength cannot be obtained. When the Ti concentration exceeds 5.0% by mass, workability deteriorates and the material is prone to cracking during rolling. Considering the balance between strength and workability, preferably, the Ti concentration is 2.9% by mass to 4.3% by mass.

[0018] The titanium copper foil of the present disclosure may further contain one or more elements selected from the group consisting of Al, Ag, B, Co, Cr, Fe, Ge, Hf, La, Mg, Mn, Mo, Nb, Ni, P, Si, Sn, Y, and Zr. However, it may not contain such elements. The content of the element in the titanium copper foil may be 0.0% by mass to 1.0% by mass in total. If the content of the element is 1.0% by mass or less, deterioration of workability can be prevented.

[0019] The composition of the titanium copper foil is confirmed by ICP emission spectrometry (internal standard method). As the ICP emission spectrometer (ICP-OES, inductively coupled plasma optical emission spectrometer), measurement is performed using SPS3100 manufactured by Hitachi High-Tech Sciences Corporation or an equivalent device. In the case of ICP emission spectrometry, a sample of the titanium copper foil dissolved in a mixed acid containing hydrochloric acid, nitric acid, and water in a volume ratio of 2:1:2 is diluted and used. Y (yttrium) is used as the internal standard element.

[0020] (Foil thickness) The foil thickness of the titanium copper foil of the present disclosure can be evaluated by measuring the foil thickness at nine points linearly located at intervals of 10 mm in a direction parallel to the rolling direction. In the present disclosure, the average value of the foil thickness at the nine points is also simply referred to as the "average value of the foil thickness". In the present disclosure, the standard deviation of the foil thickness at the nine points is also simply referred to as the "standard deviation of the foil thickness".

[0021] As described above, in the titanium copper foil of the present disclosure, the ratio of the standard deviation σ of the foil thickness to the average foil thickness tave (i.e., the value obtained by dividing the standard deviation σ of the foil thickness by the average foil thickness tave, σ / tave) is 0.0100 or less. The ratio of the standard deviation σ of the foil thickness to the average foil thickness tave may be preferably 0.0050 or less, and more preferably 0.0030 or less.

[0022] In the titanium copper foil of the present disclosure, the average foil thickness tave may be 200 μm or less, or may be 80 μm or less. In the titanium copper foil of the present disclosure, the lower limit of the average foil thickness tave is not particularly limited, but may be 20 μm or more. The average foil thickness tave of the titanium copper foil of the present disclosure may be 20 μm to 100 μm, or may be 40 μm to 80 μm.

[0023] In the titanium copper foil of the present disclosure, the standard deviation σ of the foil thickness may be 0.500 μm or less, or may be 0.200 μm or less.

[0024] With the recent trend toward miniaturization of electronic devices, titanium copper foils used in these components are required to have thin foil thicknesses. However, when titanium copper foils with thin foil thicknesses are used in electronic device components, even small variations in foil thickness can affect the performance or failure of the electronic device. For example, when titanium copper foils are used for connector terminals, if the foil thickness is not sufficiently uniform in the longitudinal direction of the titanium copper foil (which may correspond to the "direction parallel to the rolling direction"), variations in the contact pressure of each terminal can occur, resulting in concerns about poor contact. Furthermore, when used as a spring material, for example, if the titanium copper foil has a sufficiently uniform foil thickness, stress applied to the spring material can be more easily distributed. As a result, the fatigue resistance of the electronic component is improved. The titanium copper foil of the present disclosure can be used as a spring material in electronic components such as autofocus camera modules. In this case, the electronic component contains titanium copper foil.

[0025] The contact pressure P of each terminal of the connector is calculated using the formula: P = (d × E × w × t 3 ) / (4×L 3) It can be expressed as follows. Here, d represents the displacement amount (mm), E represents the Young's modulus (MPa), w represents the width of the terminal (mm), t represents the thickness of the terminal (mm), and L represents the distance from the fixed end of the terminal to the contact position (mm). According to this formula, it can be understood that the contact pressure P of the connector is proportional to the cube of the thickness t of the terminal (i.e., the foil thickness of the titanium copper foil), and the influence of the foil thickness is significant.

[0026] For a titanium copper foil like that of the present embodiment, where the standard deviation σ of the foil thickness is small in the direction parallel to the rolling direction and the variation is reduced, the contact pressure of each terminal becomes uniform, the contact resistance is stabilized, and contact failure can be suppressed.

[0027] The variation in the contact pressure of the connector may be defined as (Pmax - Pmin) / Pave. Here, Pmax represents the maximum contact pressure, Pmin represents the minimum contact pressure, and Pave represents the average contact pressure. Assuming that the maximum value of the foil thickness can be simplified and expressed as tave + α and the minimum value of the foil thickness as tave - α using a positive number α that is sufficiently smaller than the average value tave of the foil thickness, the above-mentioned variation in the contact pressure can be transformed as shown in the following formula (1). Ignoring the cubic term since α ≪ tave, the variation in the contact pressure can be expressed as 6α / tave.

[0028]

Equation

[0029] To calculate the standard deviation σ of the foil thickness described above, at the central position in the direction perpendicular to the rolling direction of the titanium copper foil, measure the foil thickness at n points located on a straight line at intervals of 10 mm along the direction parallel to the rolling direction of the titanium copper foil to obtain the measured values of the foil thickness (t1, t2 ··· tn). Then, obtain the average value tave from these measured values of the foil thickness (t1, t2 ··· tn) and calculate the standard deviation σ from the following formula (2). The foil thickness can be measured, for example, using a thickness gauge attached to a rolling mill while rolling or while feeding out the titanium copper foil from a strip. In the present disclosure, n = 9.

[0030]

number

[0031] It is preferable that the standard deviation σ (μm) of the foil thickness and the average foil thickness tave (μm) of the titanium copper foil satisfy the relationship σ / tave≦0.0055. The basis for this is as follows.

[0032] Using statistical theory, when foil thickness variation follows a normal distribution, the probability that foil thickness t will deviate from the range of tave ± 3σ is 0.3%. Furthermore, when contact pressure variation is 10%, 6α / tave = 0.1, so α = tave / 60. Therefore, when 3σ ≦ α is satisfied, that is, when σ / tave ≦ 0.0055 according to the following formula (3), the probability that contact pressure variation will exceed 10% when mounted on a connector terminal can be kept below 0.3%. Similarly, when 4σ ≦ α (failure rate ≦ 0.006%) is considered, it is even more preferable that the standard deviation of foil thickness σ (μm) and the average foil thickness tave (μm) satisfy σ / tave ≦ 0.0041. Note that 0.001 ≦ σ / tave ≦ 0.0055 may also be satisfied.

[0033]

number

[0034] In the titanium copper foil of the present disclosure, the difference R between the maximum and minimum foil thickness values measured at the above-mentioned nine points may be 2.00 μm or less, preferably 1.20 μm or less, and more preferably 0.50 or less.

[0035] In the titanium copper foil of the present disclosure, the difference R (μm) and the average foil thickness tave (μm) may satisfy the relationship R / tave≦0.033, which was calculated from the following formula (4) using R≦2α and α (=tave / 60) when the contact pressure variation is 10%.

[0036]

number

[0037] The titanium copper strip of the present disclosure is a strip material in which titanium copper foil is wound into a coil shape and includes the titanium copper foil described above. In other words, the titanium copper strip may contain, at least in part, titanium copper foil in which the ratio (σ / tave) of the standard deviation σ (μm) of foil thickness to the average foil thickness tave (μm) at nine points located on a line at 10 mm intervals in a direction parallel to the rolling direction is 0.0100 or less. The titanium copper foil in the remaining part of the titanium copper strip may also have a σ / tave of 0.0100 or less, but it may also have a larger value.

[0038] The titanium copper foil in at least a portion of the titanium copper strip preferably has a σ / tave of 0.0050 or less, and more preferably 0.0030 or less. The titanium copper foil in at least a portion of the titanium copper strip preferably has a standard deviation σ of 0.500 μm or less, and more preferably 0.200 μm or less. The titanium copper foil in at least a portion of the titanium copper strip preferably has an average tave of 200 μm or less, and more preferably 80 μm or less. The titanium copper foil in at least a portion of the titanium copper strip preferably has a difference between the maximum foil thickness and the minimum foil thickness of 2.00 μm or less, and more preferably 1.20 μm or less.

[0039] (tensile strength) The tensile strength of the titanium copper foil may be preferably 900 MPa or more, more preferably 1000 MPa or more. The tensile strength means the tensile strength in the direction parallel to the rolling direction of the titanium copper foil.

[0040] Tensile strength is measured in accordance with JIS Z2241 (2011) (Method of tensile testing for metallic materials). For measurement, a JIS No. 13B test piece is prepared from the titanium copper foil sample using a press. The tensile test conditions are as follows: test piece width: 12.7 mm, room temperature: 15 to 35°C, tensile speed (crosshead displacement speed): 5 mm / min, and gauge length: 50 mm.

[0041] (Manufacturing method) An example of a method for manufacturing the titanium copper foil of the present disclosure is as described below. First, in a melting furnace, a copper raw material such as electrolytic copper is melted together with an additive raw material of Ti and other additive elements to obtain a molten metal having a desired composition. Next, this molten metal is cooled and solidified to cast an ingot. In order to prevent oxidation wear of Ti, it is preferable to perform melting and casting in a vacuum or an inert gas atmosphere.

[0042] For the obtained ingot, for example, a homogenization annealing process and a hot rolling process are sequentially performed to process it into a long strip material having a certain reduced thickness. The homogenization annealing process and the hot rolling process may be performed under conventional conditions used in the manufacture of titanium copper foil.

[0043] Thereafter, a cold rolling process and a heat treatment process are performed on the above strip material. The cold rolling process is performed one or more times, and typically, the cold rolling process and the heat treatment process are repeatedly performed a plurality of times. When the cold rolling process is performed three or more times, it includes a first cold rolling process, a final cold rolling process, and an intermediate cold rolling process between the first cold rolling process and the final cold rolling process. The heat treatment process includes a solution treatment process, an aging treatment process, and the like.

[0044] In many cases, for the cold rolling process, a rolling mill in which a pair of rolling rolls are arranged between an unwinding reel around which a strip material is wound and a winding reel that winds up the strip material unwound from the unwinding reel is used. In this type of rolling mill, the strip material unwound from the unwinding reel is rolled by passing between the rolling rolls and then wound up by the winding reel.

[0045] In the cold rolling process, the roll gap, which is the gap between the paired rolling rolls, is adjusted so that the strip material after rolling has the desired thickness. This roll gap can be adjusted as follows. Detect the thickness of the strip material before rolling at a predetermined location between the pay-off reel and the rolling rolls, and calculate the time it takes for that location to reach between the rolling rolls from the feed speed of the strip material. Then, determine the roll gap according to the above-described thickness of the strip material before rolling.

[0046] Conventionally, as the feed speed of the strip material when adjusting the roll gap, a value calculated from the peripheral speed of the rolling rolls, rather than the actually measured value, has been used. In this case, when slip occurs between the rolling rolls and the strip material, etc., the value of the indirect feed speed calculated from the peripheral speed of the rolling rolls deviates from the actual feed speed. As a result, the roll gap is not properly adjusted, and the accuracy of rolling the strip material decreases. Therefore, it becomes difficult to obtain a strip material having the desired thickness.

[0047] On the other hand, in this embodiment, the feed speed of the strip material is measured by a laser velocimeter arranged between the pay-off reel and the rolling rolls, and the roll gap between the rolling rolls is adjusted using the measured value of the feed speed. By directly measuring the feed speed of the strip material in this way and adjusting the roll gap using the measured value of the feed speed, it is not affected by the above-described slip, etc. As a result, the strip material can be rolled with high accuracy in its longitudinal direction. Therefore, the foil thickness in the direction parallel to the rolling direction of the manufactured titanium copper foil becomes sufficiently uniform.

[0048] The rolling mill may be provided with an automatic thickness control mechanism that automatically controls the thickness of the strip material. In this case, it is preferable to configure the automatic thickness control mechanism so that the measured value of the feed speed of the strip material obtained by the laser velocimeter is transmitted to the automatic thickness control mechanism, and the roll gap is adjusted based on the measured value. Thereby, the adjustment of the roll gap using the measured value of the laser velocimeter as described above is automatically controlled.

[0049] When the cold rolling process includes a first cold rolling process, an intermediate cold rolling process, and a final cold rolling process, the adjustment of the roll gap using the measured values of the laser velocimeter as described above is preferably performed at least in the intermediate cold rolling process. The above-described adjustment of the high-precision roll gap does not need to be performed in the first cold rolling process, but it is desirable to perform it not only in the intermediate cold rolling process but also in the final cold rolling process. When manufacturing a titanium copper foil, since the intermediate cold rolling process often performs rolling in multiple passes, the variation in the foil thickness during the first cold rolling process can be sufficiently corrected. The degree of working in the final cold rolling process is often smaller than that in the intermediate cold rolling process. If the variation in the foil thickness is sufficiently corrected in the intermediate cold rolling process, the correction effect of the variation in the foil thickness in the final cold rolling process is considered to be relatively small.

[0050] The degree of working in rolling (%) is calculated by (T0 - T1) / T0 × 100, where T0 is the thickness before rolling and T1 is the thickness after rolling. 0、

[0051] The degree of working in the intermediate cold rolling process may be 55% or more, further 60% or more, particularly 65% or more for the purpose of improving strength, etc., and may be less than 99.8%. The degree of working in the intermediate cold rolling process may be 55% or more and less than 99.8%.

[0052] The degree of working in the final cold rolling may be 5% or more, further 10% or more, particularly 15% or more, and may be less than 99.8%. The degree of working in the final cold rolling process may be 5% or more and less than 99.8%. The degree of working in the final cold rolling process may be smaller than that in the intermediate cold rolling process.

[0053] As the conditions of the cold rolling process and the conditions of other processes, conventional conditions can be adopted.

[0054] In the solution heat treatment process, heating may be performed at 700°C to 1000°C, typically 800°C to 950°C, for 5 seconds to 30 minutes, typically 5 seconds to 300 seconds (5 minutes). ​

[0055] After performing each of the above-described steps, if necessary, surface pickling, polishing, etc. may be performed in order to remove the oxide film or oxide layer formed on the surface.

[0056] (Use) The titanium copper foil of the present disclosure can be suitably used as a material for electronic components such as switches, connectors, jacks, terminals, relays, autofocus camera modules, etc. for electronic devices. The titanium copper foil of the present disclosure is particularly suitable as a material for connectors. However, it is not limited to these applications.

Example

[0057] Hereinafter, the titanium copper foil of the present disclosure was actually prototyped and its performance was evaluated, which will be described. However, the description here is for the purpose of mere exemplification and is not intended to be limited thereto.

[0058] First, electrolytic copper and Ti raw materials were melted in a vacuum melting furnace to produce an ingot having a predetermined Ti concentration. Hot rolling was performed on this ingot to obtain a strip material having a thickness of 10 mm. Next, first cold rolling was performed on the above strip material to obtain a strip material having a thickness of 1.5 mm. Next, heat treatment and cold rolling were repeatedly performed to obtain a strip material having a thickness of 0.060 mm. Cold rolling was performed three times: first cold rolling, intermediate cold rolling, and final cold rolling. Thereafter, surface pickling, polishing, etc. were performed to obtain a titanium copper foil.

[0059] In Comparative Example 1, in intermediate cold rolling, the feed rate of the strip material was calculated from the peripheral speed of the rolling roll, and the roll gap was adjusted using this calculated value. On the other hand, in Example 1, in intermediate cold rolling, a laser velocimeter was used to directly measure the feed rate of the strip material, and the roll gap was adjusted using the measured value. As described above, except for the method of adjusting the roll gap in intermediate cold rolling, substantially the same manufacturing conditions were set between Comparative Example 1 and Example 1.

[0060] The components of the titanium copper foil were confirmed by ICP emission spectrometry (internal standard method) as described above. Also, for each of the titanium copper foils of Comparative Example 1 and Example 1, the foil thicknesses at 9 points located on a straight line at intervals of 10 mm in the direction parallel to the rolling direction were measured. The results are shown in Table 1.

[0061] For the measurement of the foil thickness, Nikon's Digimicro MH-15M was used, the counter was TC-101A, the measurement stand was MS-5C, and the measuring head was the standard equipped measuring head. After setting the Digimicro so that the measuring head moves in the vertical direction, the zero point was adjusted, the titanium copper foil was placed on the measurement stand, and the foil thickness was measured while applying a measuring force of 0.637 N downward.

[0062] In Table 1, for (tmax 3 -tmin 3 ) / tave 3 ×100, as described above, the contact pressure P of the connector can be expressed by the formula: P = (d × E × w × t 3 ) / (4 × L 3 ). Also, the variation in the contact pressure of the connector can be evaluated by (Pmax - Pmin) / Pave. Here, Pmax represents the maximum contact pressure, Pmin represents the minimum contact pressure, and Pave represents the nominal contact pressure. When P = Pmax, t = tmax; when P = Pmin, t = tmin; when P = Pave, t = tave. By transforming the above formula, (Pmax - Pmin) / Pave = (tmax 3 -tmin 3 ) / tave 3 is obtained. Expressing this as a percentage, it was used as a parameter for evaluating the variation in the contact pressure of the connector. The smaller the value of (tmax 3 -tmin 3 ) / tave 3 ×100 of this parameter, the smaller the variation in the contact pressure of the connector can be considered.

[0063]

Table 1

[0064] As shown in Table 1, in Example 1, since the feeding speed of the strip material was directly measured using a laser velocimeter in the cold rolling process and the roll gap was adjusted with the measured value, the standard deviation σ of the foil thickness and σ / tave were smaller than those in Comparative Example 1 where the roll gap was adjusted using the calculated value of the feeding speed of the strip material from the peripheral speed of the rolling rolls. Also, the difference R between the maximum value and the minimum value of the foil thickness and R / tave became smaller. As a result, the value of (tmax 3 -tmin 3 ) / tave 3 ×100 became smaller.

[0065] From the above, it was found that according to the method for manufacturing a titanium copper foil of the present disclosure, a titanium copper foil with a sufficiently reduced variation in foil thickness can be manufactured. Therefore, the embodiments of the present invention can be the following aspects. [1] A titanium copper foil containing 1.5 mass% to 5.0 mass% of Ti, with the balance being copper and unavoidable impurities, wherein the ratio of the standard deviation (μm) of the foil thickness to the average value (μm) of the foil thickness at nine points located linearly at intervals of 10 mm in the direction parallel to the rolling direction is 0.0100 or less. [2] The titanium copper foil according to [1], wherein the ratio of the standard deviation of the foil thickness to the average value of the foil thickness is 0.0050 or less. [3] The titanium copper foil according to [2], wherein the ratio of the standard deviation of the foil thickness to the average value of the foil thickness is 0.0030 or less. [4] The titanium copper foil according to any one of [1] to [3], wherein the standard deviation of the foil thickness is 0.500 μm or less. [5] The titanium copper foil according to [4], wherein the standard deviation of the foil thickness is 0.200 μm or less. [6] The titanium copper foil according to any one of [1] to [5], wherein the average value of the foil thickness is 200 μm or less. [7] The titanium copper foil according to [6], wherein the average value of the foil thickness is 80 μm or less. [8] The titanium copper foil according to any one of [1] to [7], wherein the difference between the maximum value and the minimum value of the foil thickness is 2.00 μm or less. [9] The difference between the maximum value and the minimum value of the foil thickness is 1.20 μm or less, and the titanium copper foil according to [8].

[10] The total content of at least one element selected from the group consisting of Al, Ag, B, Co, Cr, Fe, Ge, Hf, La, Mg, Mn, Mo, Nb, Ni, P, Si, Sn, Y, and Zr is 0.0 mass% to 1.0 mass%, and the titanium copper foil according to any one of [1] to [9].

[11] Containing 1.5 mass% to 5.0 mass% of Ti, the balance consisting of copper and unavoidable impurities, The standard deviation of the foil thickness at nine points located linearly at intervals of 10 mm in the direction parallel to the rolling direction is 0.500 μm or less, and the titanium copper foil.

[12] The standard deviation of the foil thickness is 0.200 μm or less, and the titanium copper foil according to

[11] .

[13] The total content of at least one element selected from the group consisting of Al, Ag, B, Co, Cr, Fe, La, Mg, Mn, Mo, Nb, Ni, P, Si, Sn, Y, and Zr is 0.0 mass% to 1.0 mass%, and the titanium copper foil according to

[11] or

[12] .

[14] A titanium copper bar including the titanium copper foil according to any one of [1] to

[13] .

[15] An electronic component including the titanium copper foil according to any one of [1] to

[13] .

Claims

1. 1. Containing 1.5% by mass to 5.0% by mass of Ti, with the balance consisting of copper and unavoidable impurities, The ratio of the standard deviation (μm) of the foil thickness to the average value (μm) of the foil thickness at nine points located linearly at intervals of 10 mm in the direction parallel to the rolling direction is 0.0100 or less, a titanium copper foil.

2. The titanium copper foil according to Claim 1, wherein the ratio of the standard deviation of the foil thickness to the average value of the foil thickness is 0.0050 or less.

3. The titanium copper foil according to Claim 2, wherein the ratio of the standard deviation of the foil thickness to the average value of the foil thickness is 0.0030 or less.

4. The titanium copper foil according to Claim 1, wherein the standard deviation of the foil thickness is 0.500 μm or less.

5. The titanium copper foil according to Claim 4, wherein the standard deviation of the foil thickness is 0.200 μm or less.

6. The titanium copper foil according to Claim 1 or 4, wherein the average value of the foil thickness is 200 μm or less.

7. The titanium copper foil according to Claim 6, wherein the average value of the foil thickness is 80 μm or less.

8. The titanium copper foil according to Claim 1 or 4, wherein the difference between the maximum value and the minimum value of the foil thickness is 2.00 μm or less.

9. The titanium copper foil according to Claim 8, wherein the difference between the maximum value and the minimum value of the foil thickness is 1.20 μm or less.

10. The total content of at least one element selected from the group consisting of Al, Ag, B, Co, Cr, Fe, Ge, Hf, La, Mg, Mn, Mo, Nb, Ni, P, Si, Sn, Y, and Zr is 0.0% by mass to 1.0% by mass, the titanium copper foil according to Claim 1 or 4.

11. 1. Containing 1.5% by mass to 5.0% by mass of Ti, with the balance consisting of copper and unavoidable impurities, The standard deviation of the foil thickness at nine points located linearly at intervals of 10 mm in the direction parallel to the rolling direction is 0.500 μm or less, a titanium copper foil.

12. The titanium copper foil according to Claim 11, wherein the standard deviation of the foil thickness is 0.200 μm or less.

13. The total content of at least one element selected from the group consisting of Al, Ag, B, Co, Cr, Fe, Ge, Hf, La, Mg, Mn, Mo, Nb, Ni, P, Si, Sn, Y, and Zr is 0.0% by mass to 1.0% by mass, the titanium copper foil according to Claim 11 or 12.

14. A titanium copper bar containing the titanium copper foil according to Claim 1 or 11.

15. An electronic component containing the titanium copper foil according to Claim 1 or 11.

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