Sensor chip, magnetic sensor including same, and method for manufacturing magnetic sensor

Abstract

[Problem] To precisely position an external magnetic body with respect to a sensor chip. [Solution] After a sensor chip 20 is mounted on a substrate 10, an external magnetic body 30 is mounted on the substrate 10 so as to overlap with a magnetic body layer M1 in a view from a Y direction perpendicular to an element formation surface 21. At this time, the position of the external magnetic body 30 in an X direction is adjusted with reference to alignment marks 60, 61 which are provided to the sensor chip 20 and are visible from the upper surface 25 side of the sensor chip 20. Thus, it is possible to achieve a desired positional relation between the sensor chip 20 and the external magnetic body 30 at the time of assembly.

Description

Technical Field

[0001] The present invention relates to a sensor chip, a magnetic sensor including the same, and a method for manufacturing a magnetic sensor. In particular, the present invention relates to a sensor chip configured to detect a magnetic field collected using an external magnetic body, a magnetic sensor including the same, and a method for manufacturing such a magnetic sensor.

Background Art

[0002] Patent Document 1 discloses a magnetic sensor in which magnetic flux is collected on a sensor chip using an external magnetic body to enhance detection sensitivity.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, when mounting a sensor chip and an external magnetic body on a substrate, it has not been easy to position the external magnetic body at a desired position of the sensor chip.

[0005] Therefore, an object of the present invention is to provide a sensor chip, a magnetic sensor including the same, and a method for manufacturing a magnetic sensor that can accurately position an external magnetic body with respect to a sensor chip in an assembly of a magnetic sensor.

Means for Solving the Problems

[0006] The sensor chip according to the present invention comprises a chip body having a mounting surface and a top surface located on opposite sides of each other, and an element forming surface that is approximately perpendicular to the mounting surface and the top surface and includes a lower region located on the mounting surface side, an upper region located on the top surface side, and a central region located between the lower and upper regions; first and second magnetic layers provided on the central region of the element forming surface and facing each other via a magnetic gap; a magnetic sensing element provided on the central region of the element forming surface and located on the magnetic path formed by the magnetic gap; an insulating layer provided on the element forming surface and covering the magnetic sensing element and the first and second magnetic layers; a terminal electrode provided on the surface of the insulating layer covering the lower region of the element forming surface and connected to the magnetic sensing element; and a first alignment mark embedded in the portion of the insulating layer covering the upper region of the element forming surface and visible from the top surface, wherein the first alignment mark overlaps with the first magnetic layer in the extension direction of the edge formed by the element forming surface and the top surface.

[0007] According to the present invention, during assembly, it is possible to adjust the positional relationship between the sensor chip and the external magnetic body using the first alignment mark as a reference.

[0008] The sensor chip according to the present invention may further include a metal cover layer provided on the surface of the insulating layer so as to cover the first alignment mark. This makes it possible to prevent corrosion of the first alignment mark. In this case, the metal cover layer may be made of the same material as the terminal electrodes. This makes it possible to form the metal cover layer and the terminal electrodes in the same process.

[0009] The sensor chip according to the present invention further includes a second alignment mark that is embedded in a portion of the insulating layer that covers an upper region of the element formation surface and is visible from the top surface, and the second alignment mark may be positioned so as to overlap with the second magnetic layer in the direction in which its edge extends. This makes it possible to adjust the positional relationship between the sensor chip and another external magnetic body using the second alignment mark as a reference during assembly.

[0010] In the present invention, the first alignment mark has one end and the other end in the extending direction of the edge. One end of the first alignment mark may have an overlapping position with the first magnetic layer in the extending direction of the edge, and the other end of the first alignment mark may have an overlapping position with the second magnetic layer in the extending direction of the edge. According to this, during assembly, it is possible to adjust the positional relationship between the sensor chip and the two external magnetic bodies with reference to one end and the other end of the first alignment mark.

[0011] The magnetic sensor according to the present invention includes a substrate, the above-described sensor chip mounted on the substrate such that the mounting surface faces the substrate, and an external magnetic body mounted on the substrate so as to overlap the first magnetic layer when viewed from a direction perpendicular to the element formation surface. The end surface of the external magnetic body in the extending direction of the edge substantially coincides with the first alignment mark. According to this, it is possible to provide a magnetic sensor in which the sensor chip and the external magnetic body have a desired positional relationship.

[0012] The manufacturing method of the magnetic sensor according to the present invention includes a first step of mounting the above-described sensor chip on a substrate such that the mounting surface faces the substrate, and a second step of mounting an external magnetic body on the substrate so as to overlap the first magnetic layer when viewed from a direction perpendicular to the element formation surface. The second step is characterized by adjusting the position of the external magnetic body in the extending direction of the edge with reference to the first alignment mark. According to this, during assembly, it is possible to make the sensor chip and the external magnetic body have a desired positional relationship.

Advantages of the Invention

[0013] As described above, according to the present invention, it is possible to provide a sensor chip capable of accurately positioning an external magnetic body with respect to the sensor chip in the assembly of the magnetic sensor, a magnetic sensor including the same, and a manufacturing method of the magnetic sensor.

Brief Description of the Drawings

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BEST MODE FOR CARRYING OUT THE INVENTION

[0015] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0016] <First Embodiment> FIG. 1 is a schematic perspective view showing the appearance of the magnetic sensor 1 according to the first embodiment of the present invention. FIG. 2 is a schematic exploded perspective view of the magnetic sensor 1.

[0017] As shown in FIGS. 1 and 2, the magnetic sensor 1 according to the first embodiment includes a substrate 10, a sensor chip 20 mounted on a surface 11 constituting the XZ plane of the substrate 10, and external magnetic bodies 30 and 40. The sensor chip 20 has an element formation surface 21 and a back surface 22 that constitute the XY plane, side surfaces 23 and 24 that constitute the YZ plane, and an upper surface 25 and a mounting surface 26 that constitute the XZ plane, and is mounted on the substrate 10 so that the mounting surface 26 faces the surface 11 of the substrate 10. A magnetosensitive element and magnetic layers M1 to M3, which will be described later, are formed on the element formation surface 21 of the sensor chip 20. Thus, in the present embodiment, the surface 11 of the substrate 10 and the element formation surface 21 of the sensor chip 20 are perpendicular. However, in the present invention, it is not essential that both are completely perpendicular, and they may have a predetermined inclination with respect to the perpendicular.

[0018] The external magnetic bodies 30 and 40 function to collect magnetic flux toward the sensor chip 20 and are made of a highly permeable material such as ferrite. The external magnetic body 30 is a rod-shaped body with its longitudinal direction in the Z direction. It is positioned approximately at the center of the element-forming surface 21 in the X direction so that an end face 31 at one end in the Z direction covers a portion of the magnetic layer M1. The external magnetic body 40 is located on the opposite side of the sensor chip 20 from the external magnetic body 30. The external magnetic body 40 has a longitudinal direction in the Z direction and includes a rod-shaped portion 41 that covers the back surface 22 of the sensor chip 20, and overhanging portions 42 and 43 that protrude from the rod-shaped portion 41 toward the element-forming surface 21 to cover the side faces 23 and 24 of the sensor chip 20, respectively, and are bent to cover a portion of the magnetic layers M2 and M3. This configuration selectively collects magnetic fields in the Z direction, and the collected magnetic fields are applied to the sensor chip 20.

[0019] Fig. 3 is a schematic perspective view for explaining the structure of the sensor chip 20. Fig. 4 is a schematic perspective view showing the sensor chip 20 with the magnetic layers M1 to M3 removed.

[0020] As shown in FIGS. 3 and 4, the element formation surface 21 of the sensor chip 20 belongs to the chip body 20A and has a central region 21A located at the center in the Y direction, a lower region 21B located on the mounting surface 26 side, and an upper region 21C located on the upper surface 25 side. The central region 21A is located between the lower region 21B and the upper region 21C. On the central region 21A of the element formation surface 21, magnetosensitive elements R1 to R4 and magnetic layers M1 to M3 are provided. On the other hand, terminal electrodes 51 to 56 are provided on the lower region 21B of the element formation surface 21, and alignment marks 60 to 63 are provided on the upper region 21C of the element formation surface 21. The positions of the alignment marks 60 to 63 in the X direction are formed to have a predetermined relationship with the positions of the magnetosensitive elements R1 to R4 and the magnetic layers M1 to M3 in the X direction. Here, since a wafer process (thin film process) before singulating the sensor chip 20 is used for forming the magnetosensitive elements R1 to R4, the magnetic layers M1 to M3, and the alignment marks 60 to 63, the relative positional relationship between the alignment marks 60 to 63 and the magnetosensitive elements R1 to R4 and the magnetic layers M1 to M3 can be formed extremely accurately.

[0021] FIG. 5 is a schematic plan view of the sensor chip 20, and FIG. 6 is a schematic cross-sectional view taken along line A-A of FIG. 5.

[0022] As shown in Figures 5 and 6, four magnetic sensing elements R1 to R4 are formed on the element formation surface 21 of the sensor chip 20. The magnetic sensing elements R1 to R4 are not particularly limited as long as they are elements whose electrical resistance changes depending on the direction of magnetic flux, and for example, MR elements can be used. The fixed magnetization directions of the magnetic sensing elements R1 to R4 are aligned in the same direction (for example, the positive side in the X direction). The magnetic sensing elements R1 to R4 are embedded in an insulating layer 27 that covers the chip body 20A, and magnetic layers M1 to M3 made of permalloy or the like are formed on the surface of the insulating layer 27. The magnetic layers M1 to M3 are covered with an insulating layer 28. Of the magnetic layers M1 to M3, if the portions located on one side in the Y direction (upper side in FIG. 5) are defined as magnetic layers M11, M21, and M31, and the portions located on the other side in the Y direction (lower side in FIG. 5) are defined as magnetic layers M12, M22, and M32, then in a plan view (viewed from the Z direction), the magnetic sensitive element R1 is located between the magnetic layer M11 and the magnetic layer M21, the magnetic sensitive element R2 is located between the magnetic layer M12 and the magnetic layer M22, the magnetic sensitive element R3 is located between the magnetic layer M11 and the magnetic layer M31, and the magnetic sensitive element R4 is located between the magnetic layer M12 and the magnetic layer M32. As a result, a magnetic field passing through the magnetic gaps G1 to G4 is applied to the magnetic sensitive elements R1 to R4.

[0023] However, in the present invention, it is not essential that each magnetic-sensing element R1-R4 be located between two magnetic layers in a planar view. It is sufficient for each magnetic-sensing element R1-R4 to be located near the magnetic gap G1-G4, which is formed by two magnetic layers, i.e., on the magnetic path formed by the magnetic gap G1-G4. Furthermore, the width of the magnetic gap G1-G4 does not need to be wider than the width of the magnetic-sensing elements R1-R4; the width of the magnetic gap G1-G4 may be narrower than the width of the magnetic-sensing elements R1-R4. In the example shown in FIG. 7, the width Gx of the magnetic gap G1 in the X direction is narrower than the width Rx of the magnetic-sensing element R1 in the X direction. As a result, the magnetic layers M1 and M2 and the magnetic-sensing element R1 overlap when viewed from the Z direction, creating an OV. The relationship between the magnetic gaps G1-G4 and the magnetic-sensing elements R1-R4 may be as shown in FIG. 7.

[0024] In FIGS. 5 and 6, the region indicated by reference numeral 31a is the region covered by the end face 31 of the external magnetic body 30, and the regions indicated by reference numerals 42a and 43a are the regions covered by the overhanging portions 42 and 43 of the external magnetic body 40, respectively. As shown in FIGS. 5 and 6, the end face 31 of the external magnetic body 30 covers the magnetic layer M1, and the overhanging portions 42 and 43 of the external magnetic body 40 cover the magnetic layers M2 and M3, respectively. Also, as shown in FIG. 8, an insulating layer 29 made of alumina or the like is provided on the surface of the insulating layer 28. The insulating layer 29 functions as a passivation layer that covers the magnetic layers M1 to M3 and the magnetic sensing elements R1 to R4. Pillar-shaped via conductors V are embedded in the insulating layer 29, and a metal cover layer P that covers the via conductors V is provided on the surface of the insulating layer 29. The via conductors V are made of a good conductor such as Cu, and the metal cover layer P is made of a highly corrosion-resistant metal material such as Au.

[0025] FIG. 9 is a circuit diagram for explaining the connection relationship between the magnetic sensing elements R1 to R4 and the terminal electrodes 51 to .

[0026] As shown in FIG. 9, magnetic sensing element R1 is connected between terminal electrodes 51 and 53, magnetic sensing element R2 is connected between terminal electrodes 52 and 54, magnetic sensing element R3 is connected between terminal electrodes 52 and 53, and magnetic sensing element R4 is connected between terminal electrodes 51 and 54. Terminal electrodes 51 to 54 are connected to a land pattern (not shown) formed on substrate 10 via solder balls or the like. Terminal electrode 51 is supplied with power supply potential Vcc, and terminal electrode 52 is supplied with ground potential GND. Since magnetic sensing elements R1 to R4 all have the same fixed magnetization direction, a difference occurs between the resistance change of magnetic sensing elements R1 and R2 located on one side of external magnetic body 30 and the resistance change of magnetic sensing elements R3 and R4 located on the other side of external magnetic body 30. As a result, magnetic sensing elements R1 to R4 form a differential bridge circuit, and changes in the electrical resistance of magnetic sensing elements R1 to R4 in response to magnetic flux density appear as a differential signal Va at terminal electrodes 53 and 54.

[0027] The terminal electrodes 55 and 56 are connected to a compensation coil (not shown) provided on the element formation surface 21 of the sensor chip 20. The compensation coil is used to perform so-called closed-loop control by canceling out the magnetic field applied to the magnetic sensing elements R1 to R4. These terminal electrodes 51 to 56 are formed of the metal cover layer P shown in FIG. 8, and are connected to the magnetic sensing elements R1 to R4 or the compensation coil through via conductors V and wiring patterns (not shown).

[0028] 10 , similar to the terminal electrodes 51 to 56, the alignment marks 60 to 63 are composed of via conductors V embedded in the insulating layer 29 and a metal cover layer P covering the via conductors V. The depth in the Y direction of the via conductors V constituting the alignment marks 60 to 63, that is, the distance in the Y direction from the XZ surface of the insulating layer 29, which is flush with the top surface 25 of the chip body 20A, to the XZ end surfaces of the via conductors V constituting the alignment marks 60 to 63, is, for example, 100 μm or less. Furthermore, since the insulating layer 29 is made of a highly light-transmitting material such as alumina, it can be viewed from the XZ surface of the insulating layer 29.

[0029] Here, the alignment marks 60 and 61 overlap the magnetic layer M1 in the X direction and are used as a reference when mounting the external magnetic body 30 on the substrate 10. The alignment marks 62 and 63 overlap the magnetic layers M2 and M3 in the X direction, respectively, and are used as a reference when mounting the external magnetic body 40 on the substrate 10. The X direction is the extension direction of the edge formed by the element forming surface 21 and the top surface 25. The alignment marks 60 and 61 may overlap the magnetic layer M1 over their entire width in the X direction, or their edges in the X direction may overlap the edges of the magnetic layer M1. For example, the edge of the alignment mark 60 on the +X direction may coincide with the edge of the magnetic layer M1 on the −X direction, or the edge of the alignment mark 61 on the −X direction may coincide with the edge of the magnetic layer M1 on the +X direction. The same applies to the alignment marks 62 and 63.

[0030] In the assembly of the magnetic sensor 1 according to the present embodiment, first, the sensor chip 20 is mounted on the surface 11 of the substrate 10 such that the mounting surface 26 faces the surface 11 of the substrate 10, and then the external magnetic bodies 30 and 40 are mounted on the surface 11 of the substrate 10. Then, as shown in FIG. 11, when mounting the external magnetic body 30, after placing the external magnetic body 30 on the surface 11 of the substrate 10 such that the end face 31 of the external magnetic body 30 overlaps the magnetic layer M1, the position of the external magnetic body 30 in the X direction is adjusted with reference to the alignment marks 60 and 61. In the example shown in FIG. 11, the end portion on the +X direction side of the alignment mark 60 indicates the position of the YZ end face 30A located on the -X direction side of the external magnetic body 30 in the X direction. Also, the end portion on the -X direction side of the alignment mark 61 indicates the position of the YZ end face 30B located on the +X direction side of the external magnetic body 30 in the X direction. In this way, when the position of the external magnetic body 30 in the X direction is adjusted with reference to the alignment marks 60 and 61, the position of the end portion on the +X direction side of the alignment mark 60 in the X direction substantially coincides with the position of the end face 30A of the external magnetic body 30 in the X direction, and the position of the end portion on the -X direction side of the alignment mark 61 in the X direction substantially coincides with the position of the end face 30B of the external magnetic body 30 in the X direction.

[0031] Similarly, when mounting the external magnetic body 40, after placing the external magnetic body 40 on the surface 11 of the substrate 10 so that the overhang portions 42 and 43 of the external magnetic body 40 overlap the magnetic layers M2 and M3 respectively, the position of the external magnetic body 40 in the X direction is adjusted with reference to the alignment marks 62 and 63. In the example shown in FIG. 11, the end portion on the -X direction side of the alignment mark 62 indicates the position in the X direction of the YZ end face 42A located on the +X direction side of the overhang portion 42. Also, the end portion on the +X direction side of the alignment mark 63 indicates the position in the X direction of the YZ end face 43A located on the -X direction side of the overhang portion 43. In this way, when adjusting the position of the external magnetic body 40 in the X direction with reference to the alignment marks 62 and 63, the position in the X direction of the end portion on the -X direction side of the alignment mark 62 substantially coincides with the position in the X direction of the end face 42A of the overhang portion 42, and the position in the X direction of the end portion on the +X direction side of the alignment mark 63 substantially coincides with the position in the X direction of the end face 43A of the overhang portion 43.

[0032] As described above, in the present embodiment, since the alignment marks 60 to 63 are provided on the sensor chip 20, it is possible to accurately position the sensor chip 20 and the external magnetic bodies 30 and 40 in the X direction. Moreover, since the alignment marks 60 to 63 are composed of via conductors V embedded in the insulating layer 29, they can be visually recognized from the upper surface 25 side when the sensor chip 20 is mounted upright on the substrate 10 so that the element formation surface 21 of the sensor chip 20 is substantially perpendicular to the surface 11 of the substrate 10. For this reason, the positioning work of the external magnetic bodies 30 and 40 with reference to the alignment marks 60 to 63 becomes easy. Moreover, the alignment marks 60 to 63 have the same structure as the terminal electrodes 51 to 56, and since both are formed in the same process, there is no need to add a process for forming the alignment marks 60 to 63. Also, since the via conductors V constituting the alignment marks 60 to 63 are covered with the metal cover layer P, corrosion and the like can be prevented even when the via conductors V are made of Cu or the like.

[0033] In the above embodiment, two alignment marks 60 and 61 are used for aligning the external magnetic body 30, and two alignment marks 62 and 63 are used for aligning the external magnetic body 40. However, this is not essential to the present invention. For example, one of the alignment marks 60 and 61 may be omitted, or one of the alignment marks 62 and 63 may be omitted. Furthermore, as shown in FIG. 12 , a single alignment mark 64, which combines the alignment marks 60 and 61, may be used for aligning the external magnetic body 30. The alignment mark 64 shown in FIG. 12 has both ends in the X direction overlapping with the magnetic body layer M1 in the X direction. The end of the alignment mark 64 on the −X direction side indicates the position of the YZ end surface 30A of the external magnetic body 30 in the X direction, and the end of the alignment mark 64 on the +X direction side indicates the position of the YZ end surface 30B of the external magnetic body 30 in the X direction.

[0034] 13 , it is also possible to provide a single alignment mark 65 that integrates the alignment marks 60 and 62, and a single alignment mark 66 that integrates the alignment marks 61 and 63, and use these alignment marks 65 and 66 for aligning the external magnetic bodies 30 and 40. In this case, one end and the other end of the alignment mark 65 in the X direction overlap with the magnetic layers M1 and M2 in the X direction, respectively, and the end of the alignment mark 65 on the +X direction side indicates the position of the YZ end surface 30A of the external magnetic body 30 in the X direction, and the end of the alignment mark 65 on the −X direction side indicates the position of the YZ end surface 42A of the overhang portion 42 in the X direction. Furthermore, one end and the other end of the alignment mark 66 in the X direction overlap with the magnetic layers M1 and M3 in the X direction, respectively, and the end of the alignment mark 66 on the -X direction side indicates the position of the YZ end face 30B of the external magnetic body 30 in the X direction, and the end of the alignment mark 66 on the +X direction side indicates the position of the YZ end face 43A of the overhang portion 43 in the X direction.

[0035] <Second embodiment> Fig. 14 is a schematic perspective view showing the appearance of a magnetic sensor 2 according to the second embodiment of the present invention, and Fig. 15 is a schematic exploded perspective view of the magnetic sensor 2.

[0036] 14 and 15, the magnetic sensor 2 according to the second embodiment includes a substrate 10, a sensor chip 70 mounted on a surface 11 that constitutes the XZ plane of the substrate 10, and external magnetic bodies 81 and 82. The sensor chip 70 has an element forming surface 71 and a back surface 72 that constitute the XY plane, side surfaces 73 and 74 that constitute the YZ plane, and an upper surface 75 and a mounting surface 76 that constitute the XZ plane, and is mounted on the substrate 10 so that the mounting surface 76 faces the surface 11 of the substrate 10. A magnetic sensing element and magnetic material layers M41 and M42, which will be described later, are formed on the element forming surface 71 of the sensor chip 70.

[0037] The external magnetic bodies 81 and 82 serve to collect magnetic flux in the sensor chip 70, and are both made of a high-permeability material such as ferrite. The external magnetic bodies 81 and 82 are both plate-shaped bodies with their longitudinal direction in the X direction. Of these, the external magnetic body 81 covers a portion of the magnetic layer M41, and the external magnetic body 82 covers a portion of the magnetic layer M42.

[0038] Fig. 16 is a schematic perspective view for explaining the structure of the sensor chip 70. Fig. 17 is a schematic perspective view showing the sensor chip 70 with the magnetic layers M11 and M12 removed.

[0039] As shown in FIGS. 16 and 17 , the element forming surface 71 of the sensor chip 70 belongs to the chip body 70A and has a central region 71A located in the center in the Y direction, a lower region 71B located on the mounting surface 76 side, and an upper region 71C located on the upper surface 75 side. The central region 71A is located between the lower region 71B and the upper region 71C. A magnetically sensitive element R5 and magnetic layers M41 and M42 are provided on the central region 71A of the element forming surface 71. Meanwhile, terminal electrodes 91 to 94 are provided on the lower region 71B of the element forming surface 71, and alignment marks 101 and 102 are provided on the upper region 71C of the element forming surface 71. The alignment marks 101 and 102 have a structure similar to the alignment marks 60 to 63 described above, and can be seen from the upper surface 75 when the sensor chip 70 is mounted upright on the substrate 10. The alignment marks 101 and 102 are formed so that their positions in the X direction have a predetermined relationship with the positions of the magnetic sensing element R5 and the magnetic layers M41 and M42 in the X direction.

[0040] The magnetic sensing element R5 is disposed at a position overlapping with the magnetic gap G5 formed by the magnetic layers M41 and M42 in a plan view (as viewed from the Z direction). With this configuration, the magnetic field in the X direction is selectively collected, and the collected magnetic field is applied to the magnetic sensing element R5. The magnetic sensing element R5 extends in the Y direction on the element forming surface 71, with one end connected to a terminal electrode 91 and the other end connected to a terminal electrode 92. The terminal electrodes 93 and 94 are connected to a compensation coil (not shown).

[0041] Here, the alignment mark 101 overlaps with the magnetic layer M41 in the X direction and is used as a reference when mounting the external magnetic body 81 on the substrate 10. The alignment mark 102 overlaps with the magnetic layer M42 in the X direction and is used as a reference when mounting the external magnetic body 82 on the substrate 10.

[0042] In the assembly of the magnetic sensor 2 according to this embodiment, first, the sensor chip 70 is mounted on the surface 11 of the substrate 10 so that the mounting surface 76 faces the surface 11 of the substrate 10. Then, the external magnetic bodies 81 and 82 are mounted on the surface 11 of the substrate 10. And as shown in FIG. 18, when mounting the external magnetic body 81, after placing the external magnetic body 81 on the surface 11 of the substrate 10 so that the external magnetic body 81 overlaps the magnetic body layer M41, the position of the external magnetic body 81 in the X direction is adjusted with reference to the alignment mark 101. Similarly, when mounting the external magnetic body 82, after placing the external magnetic body 82 on the surface 11 of the substrate 10 so that the external magnetic body 82 overlaps the magnetic body layer M42, the position of the external magnetic body 82 in the X direction is adjusted with reference to the alignment mark 102.

[0043] In the example shown in FIG. 18, the end on the +X direction side of the alignment mark 101 indicates the position in the X direction of the YZ end face 81A located on the +X direction side of the external magnetic body 81. Thus, when adjusting the position of the external magnetic body 81 in the X direction with reference to the alignment mark 101, the position in the X direction of the end on the +X direction side of the alignment mark 101 substantially coincides with the position in the X direction of the end face 81A of the external magnetic body 81. Similarly, the end on the -X direction side of the alignment mark 102 indicates the position in the X direction of the YZ end face 82A located on the -X direction side of the external magnetic body 82. Thus, when adjusting the position of the external magnetic body 82 in the X direction with reference to the alignment mark 102, the position in the X direction of the end on the -X direction side of the alignment mark 102 substantially coincides with the position in the X direction of the end face 82A of the external magnetic body 82.

[0044] Thus, also in this embodiment, since the alignment marks 101 and 102 are provided on the sensor chip 70, it is possible to accurately position the sensor chip 70 and the external magnetic bodies 81 and 82 in the X direction.

[0045] In the above-described embodiment, alignment marks 101 and 102 are used for aligning the external magnetic bodies 81 and 82, respectively. However, this is not essential in the present invention. For example, as shown in FIG. 19, one alignment mark 103 obtained by integrating the alignment marks 101 and 102 may be used for aligning the external magnetic bodies 81 and 82. The alignment mark 103 shown in FIG. 19 has one end and the other end in the X direction overlapping the magnetic body layers M41 and M42 in the X direction, respectively. The end on the -X direction side of the alignment mark 103 indicates the position in the X direction of the YZ end face 81A of the external magnetic body 81, and the end on the +X direction side of the alignment mark 103 indicates the position in the X direction of the YZ end face 82A of the external magnetic body 82.

[0046] As described above, the preferred embodiments of the present invention have been described. However, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the present invention, and it goes without saying that those are also included in the scope of the present invention.

Explanation of Reference Numerals

[0047] 1, 2 Magnetic sensors 10 Substrate 11 Surface of the substrate 20, 70 Sensor chips 20A, 70A Chip bodies 21, 71 Element formation surfaces 21A, 71A Central regions 21B, 71B Lower regions 21C, 71C Upper regions 22, 72 Back surfaces of the sensor chips 23, 24, 73, 74 Side surfaces of the sensor chips 25, 75 Upper surfaces of the sensor chips 26, 76 Mounting surfaces of the sensor chips 27 to 29 Insulating layers 30, 40, 81, 82 External magnetic bodies 30A, 30B, 31, 42A, 43A, 81A, 82A End faces 31a, 42a, 43a Regions covered with the external magnetic bodies 41 Rod-shaped part 42,43 Overhang 42A,43A end face 51~56, 91~94 terminal electrode 60~66, 101~103 Alignment marks G1~G5 Magnetic gap M1~M3,M11,M12,M21,M22,M31,M32,M41,M42 Magnetic layer P Metal cover layer R1~R5 magnetic sensing elements V via conductor

Claims

1. A chip body having a mounting surface and an upper surface located on opposite sides of each other, and an element formation surface substantially orthogonal to the mounting surface and the upper surface, the element formation surface including a lower region located on the mounting surface side, an upper region located on the upper surface side, and a central region located between the lower region and the upper region; First and second magnetic layers provided on the central region of the element formation surface and facing each other with a magnetic gap therebetween; A magnetosensitive element provided on the central region of the element formation surface and located on a magnetic path formed by the magnetic gap; An insulating layer provided on the element formation surface and covering the magnetosensitive element and the first and second magnetic layers; A terminal electrode provided on a portion of the surface of the insulating layer covering the lower region of the element formation surface and connected to the magnetosensitive element; A first alignment mark embedded in a portion of the insulating layer covering the upper region of the element formation surface and visible from the upper surface; and The first alignment mark is characterized in that a position in an extending direction of an edge formed by the element formation surface and the upper surface overlaps with the first magnetic layer. A sensor chip.

2. The sensor chip according to claim 1, further comprising a metal cover layer provided on the surface of the insulating layer so as to cover the first alignment mark.

3. The sensor chip according to claim 2, wherein the metal cover layer is made of the same material as the terminal electrode.

4. The sensor chip according to any one of claims 1 to 3, further comprising a second alignment mark embedded in a portion of the insulating layer covering the upper region of the element formation surface and visible from the upper surface, The second alignment mark is characterized in that a position in the extending direction of the edge overlaps with the second magnetic layer.

5. The first alignment mark has one end and the other end in the extending direction of the edge, One end of the first alignment mark is characterized in that a position in the extending direction of the edge overlaps with the first magnetic layer, The sensor chip according to any one of claims 1 to 3, wherein the other end of the first alignment mark is characterized in that a position in the extending direction of the edge overlaps with the second magnetic layer.

6. A substrate, The sensor chip according to any one of claims 1 to 5, mounted on the substrate such that the mounting surface faces the substrate; An external magnetic body mounted on the substrate so as to overlap the first magnetic body layer when viewed from a direction perpendicular to the element formation surface; and A magnetic sensor, wherein an end surface of the external magnetic body in the extending direction of the edge substantially coincides with the first alignment mark. **Claim 7** A first step of mounting the sensor chip according to any one of claims 1 to 5 on the substrate such that the mounting surface faces the substrate; A second step of mounting an external magnetic body on the substrate so as to overlap the first magnetic body layer when viewed from a direction perpendicular to the element formation surface; and A method of manufacturing a magnetic sensor, wherein the second step adjusts the position of the external magnetic body in the extending direction of the edge with reference to the first alignment mark.

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