Indicating device

The display device addresses bonding strength issues by using a filling member to support the gap between the window and substrate members, enhancing mechanical strength and reliability through improved sealing and protection against external factors.

JP7716834B2Active Publication Date: 2025-08-01SAMSUNG DISPLAY CO LTD
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Patent Information

Application Number
JP2018239767
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2018-04-05
Filing Date
2018-12-21
Publication Date
2025-08-01
Estimated Expiration
2038-12-21

AI Technical Summary

Technical Problem

Existing display devices face challenges in maintaining reliability due to insufficient bonding strength between components, which can lead to defects from external impacts, moisture, and contamination.

Method used

A display device design that includes a filling member to support the gap between the window and substrate members, with a sealing member to encapsulate the element layer, and a filling member that overlaps and covers the sealing member to enhance bonding strength and protect against external impacts and moisture.

Benefits of technology

The design stabilizes the element layer, improves mechanical strength, and enhances reliability by preventing defects and contamination, thereby improving the overall performance of the display device.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

To provide a display device capable of improving a joining strength between various configurations and with improved reliability in a process.SOLUTION: A display device according to an embodiment includes: a substrate member; a sealing member arranged on the substrate member and hermetically sealing an element layer; a seal member arranged along an edge of the sealing member on a plane and joining the sealing member and the substrate member; an optical member arranged on the sealing member; a window member arranged on the substrate member; an adhesive member arranged between the optical member and the window member and joining the optical member and the window member; and a filling member arranged between the window member and the substrate member, separated from the optical member and the adhesive member, and overlapping the seal member on the plane.SELECTED DRAWING: Figure 5
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Description

Technical Field

[0001] The present invention relates to a display device, and more particularly to a display device with improved reliability.

Background Art

[0002] A variety of display devices used in multimedia devices such as televisions, mobile phones, navigation systems, computer monitors, game consoles, etc. have been developed. The display device is formed by assembling various components. The display device is designed in consideration of reliability during the manufacturing process and during use.

Summary of the Invention

Problems to be Solved by the Invention

[0003] Therefore, an object of the present invention is to provide a display device with improved reliability by improving the bonding strength between various components during the manufacturing process.

Means for Solving the Problems

[0004] A display device according to an embodiment of the present invention includes a base layer including a plane defined by a first direction and a second direction orthogonal to each other, a circuit layer disposed on the base layer, a substrate member including an element layer electrically connected to the circuit layer and generating light, a sealing member disposed on the substrate member and sealing the element layer, a seal member disposed along an edge of the sealing member on a plane and bonding the sealing member and the substrate member, an optical member disposed on the sealing member, a window member disposed on the substrate member, an adhesive member disposed between the optical member and the window member and bonding the optical member and the window member, and a filling member disposed between the window member and the substrate member, separated from the optical member and the adhesive member, and overlapping the seal member on a plane.

[0005] The sealing member includes an inner surface that defines an internal space sealed together with the substrate member and the sealing member, and an outer surface facing the one side surface, and a part of the outer surface may contact the filling member.

[0006] The lower surface of the filling member may contact a part of the upper surface of the sealing member, one side surface of the sealing member adjacent to the filling member, a part of the lower surface of the sealing member adjacent to the one side surface of the sealing member, the outer surface, and a part of the upper surface of the substrate member.

[0007] The width of the filling member in the second direction is larger than the width of the sealing member in the second direction, and the filling member may cover the sealing member on a plane.

[0008] Further includes a drive chip mounted on the substrate member. On the substrate member, a first region exposed from the sealing member, a second region adjacent to the first region and covered by the sealing member are defined. The drive chip is disposed in the first region, and at least a part of the filling member may overlap with the drive chip in the second direction.

[0009] The filling member includes a first filling member overlapping with the drive chip and a second filling member separated from the first filling member and not overlapping with the drive chip. The first filling member may overlap with the drive chip.

[0010] The width of the first filling member in the second direction may be smaller than the width of the second filling member in the second direction.

[0011] A plurality of the first filling members are provided, and the separation distance in the first direction between the first filling members may be larger than the separation distance in the first direction between the first filling member adjacent to the second filling member among the first filling members and the second filling member.

[0012] The filling member includes a first filling member that overlaps with the driving chip and a second filling member that is separated from the first filling member and does not overlap with the driving chip. The first filling member may be separated from the driving chip in a plane.

[0013] It may further include a touch unit disposed between the sealing member and the optical member and a touch flexible circuit board electrically connected to the touch unit.

[0014] A plurality of the filling members are provided. The filling members include a first filling member and a second filling member that are arranged along the first direction via the touch flexible circuit board in a plane. The first filling member and the second filling member may be separated from the touch flexible circuit board.

[0015] The sealing member may include frit.

[0016] The circuit layer includes a thin film transistor including a semiconductor pattern, a control electrode separated from the semiconductor pattern, an input electrode and an output electrode respectively connected to one side and the other side of the semiconductor pattern. The element layer may include an organic light emitting diode including a first electrode connected to the thin film transistor, a second electrode disposed on the first electrode, and a light emitting layer disposed between the first electrode and the second electrode.

[0017] A display device according to an embodiment of the present invention includes a base layer including a plane defined by a first direction and a second direction orthogonal to each other, a circuit layer disposed on the base layer, and an element layer electrically connected to the circuit layer to generate light. It includes a substrate member including a first region and a second region adjacent to the first region along the second direction, a sealing member disposed to cover the second region and expose the first region, including a third region and a fourth region adjacent to the third region along the second direction, a sealing member disposed along the edge of the sealing member on the plane to join the sealing member and the substrate member, an optical member disposed to cover the fourth region and expose the third region, a window member disposed on the substrate member, an adhesive member disposed between the optical member and the window member to join the optical member and the window member, and a plurality of filling members disposed between the window member and the base layer. The filling members are disposed separated from the optical member and the adhesive member, overlap a part of each of the first region and the third region, and cover the sealing member.

[0018] The sealing member includes an inner surface defining an internal space sealed together with the substrate member and the sealing member, and an outer surface facing the inner surface, and the outer surface may contact the filling member.

[0019] The lower surface of the filling member may contact a part of the upper surface of the sealing member, one side surface of the sealing member adjacent to the filling member, a part of the lower surface of the sealing member adjacent to the one side surface of the sealing member, the outer surface, and a part of the upper surface of the substrate member.

[0020] It further includes a driving chip disposed in the first region and overlapping at least one of the filling members on the plane. The width of the filling member overlapping the driving chip in the second direction may be smaller than the width of the filling member not overlapping the driving chip in the second direction.

[0021] Further comprising a touch unit disposed between the sealing member and the optical member and a touch flexible circuit board electrically connected to the touch unit, the filling member includes a first filling member and a second filling member disposed along the first direction on the plane through the touch flexible circuit board, and the first filling member and the second filling member may be separated from the touch flexible circuit board.

[0022] A display device according to an embodiment of the present invention includes a substrate member including an organic light emitting diode that generates light, a sealing member disposed on the substrate member and sealing the organic light emitting diode, and a sealing member disposed along an edge of the sealing member on a plane. A seal member including an outer surface adjacent to the organic light emitting diode and an inner surface facing the outer surface, a window member disposed on the substrate member, an adhesive member disposed on the sealing member, and disposed between the window member and the substrate member and separated from the adhesive member. And a filling member covering the seal member.

[0023] The filling member may be in direct contact with the outer surface.

Advantages of the Invention

[0024] According to the present invention, by supporting a gap between the window member and the substrate member, the element layer can be stably protected from external impacts. In addition, by protecting the seal member that joins the substrate member and the encapsulation member, it is possible to improve defects caused by external moisture and contamination and improve the reliability in use.

Brief Description of the Drawings

[0025]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11A

Figure 11B

Figure 12A

Figure 12B

Embodiments for Carrying Out the Invention

[0026] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In this specification, when a certain component (or region, layer, part, etc.) is referred to as being "on", "connected to", or "coupled to" another component, it means that it can be directly connected / coupled onto the other component, or a third component can also be disposed therebetween.

[0027] The same reference numerals denote the same components. Also, in the drawings, the thickness, ratio, and dimensions of the components are exaggerated for an effective explanation of the technical content. "And / or" includes all one or more combinations that can define associated configurations.

[0028] The terms "first", "second", etc. are used to describe various components, but the components should not be limited by these terms. These terms are only used for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component can be referred to as the second component, and similarly, the second component can also be referred to as the first component. Singular expressions include plural expressions unless the context clearly indicates otherwise.

[0029] In addition, terms such as "below", "lower side", "above", "upper side", etc. are used to explain the association relationship of the configuration illustrated in the drawings. These terms are explained based on the directions shown in the drawings as relative concepts.

[0030] Terms such as "including" are intended to express the existence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition possibility of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0031] FIG. 1 is an exploded perspective view of a display device according to an embodiment of the present invention. FIG. 2 is a cross-sectional view showing a part of the display device illustrated in FIG. 1. FIG. 3 is an equivalent circuit diagram of a pixel according to an embodiment of the present invention. FIG. 4 is a cross-sectional view showing a part of the display device according to an embodiment of the present invention. Hereinafter, a display device 1000 according to an embodiment of the present invention will be described with reference to FIGS. 1 to 4.

[0032] Referring to FIG. 1, the display device 1000 includes a window member 100, a housing member 150, a substrate member 200, a sealing member 300, a seal member 400, a filling member 500, an optical member 600, an adhesive member 700, a flexible circuit board 800, and a main circuit board 900.

[0033] The window member 100 is divided into a transmissive region AA and a light-shielding region BA in a plane defined by a first direction DR1 and a second direction DR2. The transmissive region AA is optically transparent. For example, the transmittance of the transmissive region AA is 90% or more. The light generated by the substrate member 200 passes through the transmissive region AA and is visually recognized outside. The light-shielding region BA is adjacent to the transmissive region AA. In the present embodiment, the light-shielding region BA has a shape surrounding the transmissive region AA. However, this is shown by way of example, and the light-shielding region BA according to an embodiment of the present invention may have a shape adjacent to only one side of the transmissive region AA. The light-shielding region BA can have various shapes and is not limited to any one embodiment.

[0034] The storage member 150 defines a predetermined internal space. The substrate member 200, the sealing member 300, the sealing member 400, the filling member 500, the optical member 600, the adhesive member 700, the flexible circuit board 800, and the main circuit board 900 are accommodated in the storage member 150 and arranged in the internal space. The storage member 150 is coupled to the window member 100. The storage member 150 and the window member 100 define the appearance of the display device 1000.

[0035] The display device 1000 according to an embodiment of the present invention includes a filling member 500 that supports the window member 100 and the substrate member 200, thereby supporting the gap formed between the window member 100 and the substrate member 200. Therefore, damage due to an external impact applied to the display device 1000 can be prevented.

[0036] The substrate member 200 includes a base layer 210, a circuit layer 220, and an element layer 230. The circuit layer 220 and the element layer 230 are disposed on the base layer 210. The base layer 210 includes a glass substrate, a metal substrate, or an organic / inorganic composite material substrate, etc.

[0037] In addition, the base layer 210 includes a synthetic resin film. The synthetic resin layer includes a thermosetting resin.

[0038] Although not shown, a barrier layer and / or a buffer layer, which are inorganic layers, are included on the base layer 210. The inorganic layer includes at least one of aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide. The inorganic layer is formed in multiple layers. The multilayer inorganic layer constitutes a barrier layer and / or a buffer layer. The barrier layer and the buffer layer are selectively arranged. The barrier layer prevents foreign substances from flowing in from the outside. The barrier layer includes a silicon oxide layer and a silicon nitride layer. The silicon oxide layer and the silicon nitride layer are alternately laminated.

[0039] The buffer layer improves the bonding strength of the structure arranged above / below the buffer layer. The buffer layer includes a silicon oxide layer and a silicon nitride layer. The silicon oxide and the silicon nitride layer are alternately laminated.

[0040] The circuit layer 220 and the element layer 230 include a driving circuit GDC, a plurality of signal lines SGL (hereinafter referred to as signal lines), a plurality of pixels PX (hereinafter referred to as pixels), and a plurality of signal pads (not shown, hereinafter referred to as signal pads).

[0041] The substrate member 200 includes a display area DA where the pixels PX are displayed and a non-display area NDA adjacent to the display area DA within the substrate member 200. The display area DA overlaps with the transmission area AA shown in FIG. 1. Also, the non-display area NDA overlaps with the light-shielding area BA shown in FIG. 1.

[0042] The driving circuit GDC generates a plurality of scanning signals (hereinafter referred to as scanning signals) and sequentially outputs the scanning signals to a plurality of scanning lines GL (hereinafter referred to as scanning lines) described later. The driving circuit GDC further outputs other control signals to the pixels PX.

[0043] The signal line SGL includes a scanning line GL, a data line DL, a power line PL, and a control signal line CSL. The scanning line GL is respectively connected to the corresponding pixel PX among the pixels PX, and the data line DL is respectively connected to the corresponding pixel PX among the pixels PX. The power line PL is connected to the pixel PX. The control signal line CSL provides a control signal to the scanning drive circuit. It includes signal pads (not shown) connected to the corresponding signal lines among the signal lines SGL.

[0044] FIG. 3 is an equivalent circuit diagram of a pixel according to an embodiment of the present invention. FIG. 3 shows any one scanning line GL, any one data line DL, a power line PL, and a pixel PX connected thereto. The pixel PX according to an embodiment of the present invention includes an organic light-emitting diode or a quantum dot light-emitting diode as a light-emitting element. The light-emitting layer of the organic light-emitting diode contains an organic light-emitting substance. The light-emitting layer of the quantum dot light-emitting diode contains quantum dots and quantum rods, etc. Hereinafter, the pixel PX will be described as an organic light-emitting pixel.

[0045] The pixel PX is divided into a plurality of groups according to the color to be displayed. The pixel PX includes, for example, a red pixel, a green pixel, and a blue pixel. Or, the pixel PX further includes a white pixel.

[0046] The pixel PX includes an organic light-emitting diode OLED and a pixel drive circuit for driving the organic light-emitting diode OLED. In this embodiment, the pixel drive circuit includes a first thin-film transistor T1 (or a driving transistor), a second thin-film transistor T2 (or a switching transistor), and a capacitor Cst. A first power supply voltage ELVDD is provided to the organic light-emitting diode OLED. The second power supply voltage ELVSS is a voltage lower than the first power supply voltage ELVDD.

[0047] The first thin film transistor T1 is connected to the organic light emitting diode OLED. The first thin film transistor T1 controls the drive current flowing through the organic light emitting diode OLED corresponding to the charge amount stored in the capacitor Cst. The second thin film transistor T2 outputs the signal applied to the data line DL in response to the scan signal applied to the scan line GL. The capacitor Cst charges the voltage corresponding to the data signal received from the second transistor TR2.

[0048] The configuration of the pixel PX is not limited to FIG. 3 and can be implemented in a modified form. The pixel circuit for controlling the organic light emitting diode OLED may include three or more thin film transistors, unlike that illustrated in FIG. 3.

[0049] FIG. 4 is a cross-sectional view showing a part of the display device according to an embodiment of the present invention. It will be described with reference to FIGS. 1 and 4. FIG. 4 is a cross-sectional view taken along the line I-I' of one pixel PX illustrated in FIG. 2. In FIG. 4, the first thin film transistor T1 and the organic light emitting diode OLED are illustrated as part of the configuration of the pixel PX. Also, the arrangement relationship of the sealing member 300 and the filling member 500 disposed on the substrate member 200 is illustrated.

[0050] The first thin film transistor T1 includes a semiconductor pattern SP, a control electrode GE, an input electrode SE, and an output electrode DE. The semiconductor pattern SP is disposed on the base layer 210. The semiconductor pattern SP includes a crystalline semiconductor material or amorphous silicon.

[0051] The first insulating layer IL1 is disposed on the substrate member 200. The first insulating layer IL1 commonly overlaps a plurality of pixels PX (see FIG. 2) and covers the semiconductor pattern SP. The first insulating layer IL1 is an inorganic layer and / or an organic layer and has a single-layer or multi-layer structure. The first insulating layer IL1 includes at least one of aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide.

[0052] On the first insulating layer IL1, a control electrode GE is disposed. The control electrode GE overlaps with the semiconductor pattern SP.

[0053] A second insulating layer IL2 is disposed on the first insulating layer IL1. The second insulating layer IL2 covers the first insulating layer IL1 and the control electrode GE. The second insulating layer IL2 commonly overlaps a plurality of pixels PX (see FIG. 2). The second insulating layer IL2 is an inorganic layer and / or an organic layer and has a single-layer or multi-layer structure. The second insulating layer IL2 contains at least one of aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide.

[0054] An input electrode SE and an output electrode DE are disposed on the second insulating layer IL2. Each of the input electrode SE and the output electrode DE is connected to the semiconductor pattern SP through a plurality of contact holes CH1, CH2 defined in the insulating layers IL1, IL2.

[0055] A third insulating layer IL3 covering the first thin-film transistor T1 is disposed on the second insulating layer IL2. The third insulating layer IL3 is an inorganic layer and / or an organic layer and has a single-layer or multi-layer structure. The third insulating layer IL3 contains at least one of aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide.

[0056] An organic light-emitting diode OLED is disposed on the third insulating layer IL3. The organic light-emitting diode OLED includes a first electrode AE, a first charge control layer HCL, a light-emitting layer EML, a second charge control layer ECL, and a second electrode CE. In this embodiment, the first electrode AE, the first charge control layer HCL, the light-emitting layer EML, the second charge control layer ECL, and the second electrode CE correspond to an anode electrode AE, a hole control layer HCL, a light-emitting layer EML, an electron control layer ECL, and a cathode electrode CE.

[0057] On the one hand, the above configuration is shown by way of example, and the first electrode AE, the first charge control layer HCL, the light-emitting layer EML, the second charge control layer ECL, and the second electrode CE may be a cathode electrode, an electron control layer, a light-emitting layer, a hole control layer, and an anode electrode, respectively.

[0058] The first electrode AE is connected to the output electrode DE through a third contact hole CH3 that penetrates the third insulating layer IL3.

[0059] A pixel definition film PDL is disposed on the third insulating layer IL3. The opening OP of the pixel definition film PDL exposes at least a part of the first electrode AE. The opening OP of the pixel definition film PDL defines the light-emitting region PXA of the pixel PX. The region where a plurality of pixels PX are arranged is defined as a pixel region, and one pixel region includes a light-emitting region PXA and a non-light-emitting region NPXA adjacent to the light-emitting region PXA. The non-light-emitting region NPXA surrounds the light-emitting region PXA. Each of the light-emitting region PXA and the non-light-emitting region NPXA defined for each pixel PX overlaps with the display region DA shown in FIG. 2.

[0060] The first charge control layer HCL is disposed in common on the light-emitting region PXA and the non-light-emitting region NPXA. A common layer such as the first charge control layer HCL is formed in common for a plurality of pixels PX. The first charge control layer HCL controls the movement of holes. For example, the first charge control layer HCL includes a hole transport layer and a hole injection layer.

[0061] A light-emitting layer EML is disposed on the first charge control layer HCL. The light-emitting layer EML is disposed only in the region corresponding to the opening OP. The light-emitting layer EML is formed separately for each of the plurality of pixels PX.

[0062] A second charge control layer ECL is disposed on the light-emitting layer EML. The second charge control layer ECL controls the movement of electrons. For example, the second charge control layer ECL includes an electron transport layer and an electron injection layer.

[0063] A second electrode CE is disposed on the second charge control layer ECL. The second electrode CE is a common electrode or a cathode.

[0064] When the organic light-emitting diode OLED is a front emission type, the first electrode AE is a reflective electrode, and the second electrode CE is a transmissive electrode or a semi-transmissive electrode. When the organic light-emitting diode OLED is a back emission type, the first electrode AE is a transmissive electrode or a semi-transmissive electrode, and the second electrode CE is a reflective electrode.

[0065] A sealing member 300 is disposed on the substrate member 200. The sealing member 300 covers the display area DA. The sealing member 300 is provided on a substrate made of glass or plastic. However, it is not limited thereto, and the sealing member 300 is made of an organic film or an inorganic film.

[0066] The substrate member 200 and the sealing member 300 are joined by a sealing member 400. The sealing member 400 is disposed along an edge defined in the first direction DR1 and the second direction DR2 of the sealing member 300. In an embodiment of the present invention, the edge means an outer shell of the sealing member 300 that overlaps with the non-display area NDA of the substrate member 200 in a plane. The sealing member 400 includes frit. The sealing member 400, together with the sealing member 300, blocks the organic light-emitting diode OLED from being exposed to external moisture, air, etc.

[0067] The sealing member 400 has a predetermined thickness between the substrate member 200 and the sealing member 300. Accordingly, the internal space INR is formed by the substrate member 200, the sealing member 300, and the sealing member 400. The internal space INR is formed as a vacuum. However, it is not limited thereto, and the internal space INR may be filled with nitrogen N2 or an insulating material. According to an embodiment of the present invention, the region where the sealing member 400 is disposed overlaps with the non-display region NDA illustrated in FIG. 2. Accordingly, the sealing member 400 is disposed between the substrate member 200 and the sealing member 300 and is disposed so as to overlap with the non-display region NDA. Although FIG. 4 illustrates that the sealing member is directly disposed on the second electrode CE of the substrate member 200, it is not limited thereto. For example, an insulating layer including an inorganic substance and / or an organic substance covering the second electrode CE may be further included, and the sealing member 400 may be disposed on the insulating layer covering the second electrode CE. Further, as an embodiment, the pixel defining film PDL and the insulating layers IL1, IL2, and IL3 may be omitted from the region corresponding to the non-display region NDA of FIG. 4, and the sealing member 400 may be directly disposed on the base layer 210.

[0068] The filling member 500 is disposed between the window member 100 and the substrate member 200. The filling member 500 fills the gap between the window member 100 and the substrate member 200. Further, the filling member 500 stably protects the element layer 230 from external impact by supporting the gap between the window member 100 and the substrate member 200. The filling member 500 includes an insulating substance. For example, the filling member 500 includes a thermosetting or photocurable substance. A detailed description of the filling member 500 will be described in detail later.

[0069] The optical member 600 is disposed between the window member 100 and the sealing member 300. The optical member 600 is disposed so as to overlap with the transmission region AA. The optical member 600 can improve the luminance of the video generated by the element layer 230 or can improve the problem of reduced visibility due to external light reflection. For example, the optical member 600 includes at least any one of a polarizing film, an optical compensation film, or a color filter. The adhesive member 700 is disposed between the optical member 600 and the window member 100. The adhesive member 700 joins the optical member 600 and the window member 100. The adhesive member 700 is disposed so as to overlap with the transmission region AA.

[0070] The adhesive member 700 can include a transparent adhesive substance. For example, the adhesive member 700 includes at least any one of an optical clear adhesive (OCA), an optical clear resin (OCR), and a pressure sensitive adhesive (PSA).

[0071] The flexible circuit board 800 includes a flexible film 810 and a driving chip 820. The flexible circuit board 800 is disposed on one side of the substrate member 200 and includes output pads (not shown) corresponding to and connected to signal pads (not shown), thereby electrically connecting a part of the signal line SGL and the main circuit board 900.

[0072] The flexible film 810 has flexibility and can include a plurality of circuit wirings (not shown).

[0073] The driving chip 820 has a Chip On Film (COF) form and is mounted on the flexible film 810. The driving chip 820 includes a driving element for driving the pixel PX, for example, a data driving circuit. In one embodiment of the present invention, although one flexible circuit board 800 is provided and illustrated, the present invention is not limited thereto, and a plurality of flexible circuit boards 800 may be provided and connected to the substrate member 200.

[0074] The main circuit board 900 is connected to an input pad (not shown) of the flexible circuit board 800 and is electrically connected to a part of the signal line SGL. The main circuit board 900 can be composed of a flexible printed circuit board (FPCB).

[0075] The main circuit board 900 includes a timing controller. The timing controller receives an input video signal and converts the input video signal into video data corresponding to the operation of the pixels. Further, the timing controller receives various control signals, such as a vertical synchronization signal, a horizontal synchronization signal, a main clock signal, and a data enable signal, etc., and outputs control signals.

[0076] FIG. 5 is a cross-sectional view of a display device according to an embodiment of the present invention. FIG. 6 is an enlarged cross-sectional view of a partial configuration of the display device according to an embodiment of the present invention. Hereinafter, the display device 1000 will be described with reference to FIGS. 5 and 6. Note that, for simplicity of explanation, the seal member 400 is enlarged and shown.

[0077] In the substrate member 200 according to the present embodiment, a first region A1 and a second region are defined. The first region A1 is exposed by the sealing member 300 and partially overlaps with the filling member 500. The second region A2 is adjacent to the first region A1 along the second direction DR2 and is covered by the sealing member 300.

[0078] In the sealing member 300, a third region A3 and a fourth region are defined. The third region A3 is exposed by the optical member 600 and partially overlaps with the filling member 500. The fourth region A4 is adjacent to the third region A3 along the second direction DR2 and is covered by the optical member 600. In the present embodiment, the filling member 500 overlaps with each of the window member 100 and a part of the substrate member 200. The filling member 500 is disposed at a distance from the optical member 600 and the adhesive member 700.

[0079] In this embodiment, a light-shielding layer BM is disposed in the non-transmissive region BA. The light-shielding layer BM contains a black substance. The light-shielding layer BM is disposed on the lower side of the window member 100 through a printing or vapor deposition process. The filling member 500 according to one embodiment overlaps the light-shielding layer BM and is disposed so as to overlap a part of each of the first region A1 and the third region A3. The width W1 (hereinafter, the first width) of the filling member 500 in the second direction DR2 is larger than the width W2 (hereinafter, the second width) of the seal member 400 in the second direction DR2. The filling member 500 covers the seal member 400.

[0080] Referring to FIG. 6 in which the seal member 400 is enlarged, the lower surface 500C of the filling member 500 is in direct contact with a part of the upper surface 300A of the sealing member 300, one side surface 300B, a part of the lower surface 300C, the outer surface 400A of the seal member 400, and a part of the upper surface 200A of the substrate member 200. In this embodiment, the inner surface 400D facing the outer surface 400A of the seal member 400 defines an internal space INR sealed together with the substrate member 200 and the sealing member 300. Therefore, the inner surface 400D is disposed so as to be adjacent to the organic light-emitting diode OLED (see FIG. 4) rather than the outer surface 400A.

[0081] By disposing the filling member 500 that is in direct contact with the outer surface 400A of the seal member 400 in the display device 1000 according to an embodiment of the present invention, it is possible to prevent a defect in which the adhesive force of the seal member 400 is reduced by an external impact or foreign matter, or a crack occurs in the seal member 400 and the substrate member 200 and the sealing member 300 are separated. Further, by supporting the gap formed between the substrate member 200 and the window member 100 by the filling member 500, it is possible to provide the display device 1000 with improved mechanical strength.

[0082] Also, during the manufacturing process, a curing difference and a physical property difference may occur between the filling member 500 and the adhesive member 700. At this time, there may be a problem that the contact portion is visually recognized from the outside due to the refractive index difference between the portion where the filling member 500 and the adhesive member 700 are in contact and the portion where they are not in contact. According to an embodiment of the present invention, by disposing the filling member 500 separated from the adhesive member 700, it is possible to prevent the mixing between the filling member 500 and the adhesive member 700 having different physical properties during curing, and since the contact portion is not visually recognized from the outside, a display device 1000 with improved reliability can be provided.

[0083] FIG. 7 is a cross-sectional view of a display device according to an embodiment of the present invention. Similar reference numerals are used as in FIGS. 1 to 6, and redundant descriptions are omitted. According to one embodiment, the filling member 500-1 disposed to overlap with the non-transmissive region BA of the window member 100 and a part of the substrate member 200 and the sealing member 300 covers a part of the upper surface 800A and the side surface 800C of the flexible circuit board 800. In this embodiment, by covering the flexible circuit board 800 with the filling member 500-1, it is possible to prevent the inflow of foreign substances flowing in from the outside and improve the mechanical strength.

[0084] FIG. 8 is a perspective view of a display device according to an embodiment of the present invention. Similar reference numerals are used as in FIGS. 1 to 6, and redundant descriptions are omitted.

[0085] The display device 1000-1 according to an embodiment of the present invention further includes a driving chip DI. In this embodiment, the driving chip DI includes a driving element for driving pixels, for example, a data driving circuit.

[0086] In this embodiment, the filling member 500-2 covers a part of the upper surface DI-A and the side surface DI-C of the driving chip DI. Note that the present invention is not limited thereto, and the filling member 500-2 may cover the entire driving chip DI. At this time, by covering a part or the whole of the sealing member 400 and the driving chip DI with the filling member 500-2, it is possible to provide a display device 1000-1 with improved mechanical strength.

[0087] FIG. 9 is a plan view showing a touch unit among the configurations of a display device according to an embodiment of the present invention.

[0088] The touch unit TU acquires coordinate information of an external input. The touch unit TU is disposed directly on the sealing member 300. In an embodiment of the present invention, the touch unit TU is formed directly on the sealing member 300. At this time, another adhesive layer may be omitted between the touch unit TU and the sealing member 300. Note that the present invention is not limited to this, and the touch unit TU may be provided on an individual panel and connected to the sealing member 300 through another adhesive member.

[0089] The touch unit TU includes a touch sensor including a plurality of conductive layers and a plurality of insulating layers. Each of the plurality of insulating layers has a single-layer structure or a multilayer structure laminated along the third direction DR3.

[0090] The touch unit TU includes an active region AR where an external input corresponding to the transmission region AA illustrated in FIG. 1A is sensed and an inactive region NAR surrounding the active region AR. The active region AR and the inactive region NAR respectively correspond to the transmission region AA and the non-transmission region BA in FIG. 1.

[0091] Any one of the conductive layers in the touch sensor includes a sensing electrode IE1 and a first signal line SL1 connected to the first sensing electrode IE1, and a conductive layer TL2 different from the conductive layer includes a second sensing electrode IE2 and a second signal line SL2 connected to the second sensing electrode IE2.

[0092] The first sensing electrode IE1 and the second sensing electrode IE2 intersect each other. The first sensing electrode IE1 is disposed along the second direction DR2 and extends in the first direction DR1 respectively. An external input can be sensed by a mutual capacitance method and / or a self-capacitance method.

[0093] Each of the first sensing electrodes IE1 includes a first sensor portion SP1 and a first connection portion CP1. Each of the second sensing electrodes IE2 includes a second sensor portion SP2 and a second connection portion CP2.

[0094] In one embodiment of the present invention, the first sensing electrode IE1 and the second sensing electrode IE2 can have a shape (for example, a bar shape) without a distinction between the sensor part and the connection part. In the above, although the first sensor part SP1 and the second sensor part SP2 having an oblique shape are exemplarily illustrated, the present invention is not limited thereto, and the first sensor part SP1 and the second sensor part SP2 may have a polygonal shape.

[0095] The first signal line SL1 and the second signal line SL2 overlap the active region AR and the non-active region NAR. The first signal line SL1 and the second signal line SL2 are connected to the corresponding touch pad TD.

[0096] FIGS. 10 to 12B are plan views showing a part of a display device according to an embodiment of the present invention. Similar reference numerals are used as those in FIGS. 1 to 5, and overlapping descriptions are omitted.

[0097] According to an embodiment of the present invention, a touch flexible circuit board TF connected to the touch pad TD in FIG. 9 is further included. The touch flexible circuit board TF is disposed on one side of the sealing member 300 (the third region A3 in FIG. 5) to electrically connect the touch unit TU and the main circuit board 900 (see FIG. 1). The touch flexible circuit board TF has flexibility and includes a plurality of circuit wirings (not shown). The touch flexible circuit board TF transmits a touch sensing signal provided by the main circuit board 900 to the touch unit TU.

[0098] As illustrated in FIG. 10, a plurality of filling members 500-3 according to one embodiment are provided. The filling member 500-3 includes a first filling member 501 and a second filling member 502 that are spaced apart and disposed via the touch flexible circuit board TF. Each of the first filling member 501 and the second filling member 502 is disposed with a separation space OZ from the touch flexible circuit board TF. Hereinafter, the arrangement relationship between the filling member in FIGS. 11A to 12B and the touch flexible circuit board TF can be applied in the same manner as in FIG. 10, and overlapping descriptions are omitted.

[0099] Therefore, according to the present embodiment, since the touch flexible circuit board TF is not in contact with the filling members 501 and 502, when the filling members 501 and 502 are formed, it is possible to improve the defect that the material forming the filling members penetrates into the space between the touch flexible circuit board TF and the substrate member 200 due to capillary action.

[0100] As shown in FIG. 11A, a plurality of filling members 500-4 according to an embodiment are provided. The filling members 500-4 include a third filling member 503, a fourth filling member 504, and a fifth filling member 505 that are arranged at intervals via the touch flexible circuit board TF. The fourth filling member 504 is arranged to overlap with the driving chip DI (see FIG. 8) in the second direction DR2. According to the present embodiment, in a plan view, the fourth filling member 504 and the driving chip DI are separated from each other. The third width W3 of the fourth filling member 504 in the second direction DR2 is smaller than the fourth width W4 of the fifth filling member 505 in the second direction DR2.

[0101] The adhesive member 700 (see FIG. 1) is cured by irradiating ultraviolet light on the side surface of the display device 1000. In this case, the ultraviolet light is incident through the space between the driving chip DI and the window member 100. At this time, the amount of UV transmission is reduced due to the predetermined thickness of the driving chip DI. According to the present embodiment, by relatively reducing the width of the fourth filling member 504 that overlaps with the driving chip DI in the second direction DR2, it is possible to alleviate the phenomenon that the amount of ultraviolet light irradiated from the side is reduced due to the predetermined thickness of the driving chip DI and the curing rate of the adhesive member 700 is reduced. Referring to FIG. 11B, among the plurality of filling members 500-4A, the fourth filling member 504A overlaps at least a part of the driving chip DI. Although not shown, the fourth filling member 504A may cover the entire surface of the driving chip DI. At this time, it is possible to prevent foreign substances from flowing into the driving chip DI, and by covering at least a part of the driving chip DI, the mechanical strength of the driving chip DI can be increased.

[0102] As shown in FIG. 12A, the filling member 500-5 according to one embodiment can have a dot shape arranged via a touch flexible circuit board TF. The dot-shaped filling members 500-5 may have different shapes from each other. According to this embodiment, among the sixth filling members 506 that overlap with the driving chip DI in the second direction DR2, the fifth width W5 in the first direction DR1 between adjacent sixth filling members 506 has a wider distance than the sixth width W6 in the first direction DR1 between the seventh filling member 507 that does not overlap with the driving chip DI in plan view and the sixth filling member 506 adjacent to the seventh filling member 507, and can be arranged. Referring to FIG. 12B, the plurality of filling members 500-5A includes an eighth filling member 506A that at least partially overlaps with the driving chip D1. Although not shown, at least one of the filling members among the eighth filling members 506A may cover the entire surface of the driving chip DI on the plane. Thereby, it is possible to prevent foreign substances from flowing into the driving chip DI, and since at least a part of the driving chip DI is covered, the mechanical strength of the driving chip DI can be increased.

[0103] The adhesive member 700 (see FIG. 1) is cured by irradiating ultraviolet light on the side surface of the display device 1000. In this case, the ultraviolet light is incident through the space between the driving chip DI and the window member 100. At this time, by increasing the separation distance of the filling member 500-5 that overlaps with the driving chip DI, it is possible to alleviate the phenomenon that the transmittance of the ultraviolet light irradiated from the side surface is reduced due to the predetermined thickness of the driving chip DI and the curing rate of the adhesive member 700 is reduced.

[0104] Although the preferred embodiments of the present invention have been described above with reference thereto, those skilled in the relevant technical field or those having ordinary knowledge in the relevant technical field can understand that the present invention can be variously modified and changed without departing from the spirit and technical field of the present invention described in the claims to be described later.

[0105] Therefore, the technical scope of the present invention is not limited to the content described in the detailed description of the specification, but is defined by the claims.

Description of Symbols

[0106] 1000 ··· Display device 100 ··· Window member 150 ··· Storage member 200 ··· Substrate member 210 ··· Base layer 220 ··· Circuit layer 230 ··· Element layer 300 ··· Sealing member 400 ··· Seal member 500 ··· Filling member 600 ··· Optical member 700 ··· Adhesive member 800 ··· Flexible circuit board 810 ··· Flexible film 820 ··· Driving chip 900 ··· Main circuit board AA ··· Transmission region AE ··· First electrode BA ··· Light-shielding region BM ··· Light-shielding layer CE ··· Second electrode CH1, CH2, CH3 ··· Contact hole CSL ··· Control signal line DA ··· Display region DE ··· Output electrode DI ··· Driving chip DL ··· Data line ECL ··· Second charge control layer EML ··· Light-emitting layer GDC ··· Driving circuit GE ··· Control electrode GL ··· Scanning line HCL ··· First charge control layer IL1, IL2, IL3 ··· Insulating layer INR ··· Internal space NDA ··· Non-display region NPXA ··· Non-light-emitting region OLED ··· Organic light-emitting diode OP ··· Opening PDL... Pixel Definition Layer PL... Power Line PX... Pixel PXA... Light Emitting Area SE... Input Electrode SGL... Signal Line SP... Semiconductor Pattern

Claims

1. A substrate member including a base layer including a plane defined by a first direction and a second direction orthogonal to each other, a circuit layer disposed on the base layer, and an element layer electrically connected to the circuit layer to generate light; A sealing member disposed on the substrate member to seal the element layer; A seal member disposed along an edge of the sealing member in plan view to join the sealing member and the substrate member; An optical member disposed on the sealing member; A window member disposed on the optical member and including a transmission region and a light-shielding region surrounding the transmission region; An adhesive member disposed between the optical member and the window member to join the optical member and the window member; A filling member disposed between the window member and the substrate member, separated from the optical member and the adhesive member, and overlapping the seal member in plan view, and The filling member is in contact with a light-shielding layer disposed in the light-shielding region of the window member in a region overlapping the seal member. A display device.

2. The seal member includes an inner surface defining an internal space sealed together with the substrate member and the sealing member, and an outer surface facing the inner surface, and a part of the outer surface is in contact with the filling member. The display device according to claim 1.

3. The lower surface of the filling member is in contact with a part of the upper surface of the sealing member, a side surface of the sealing member adjacent to the filling member, a part of the lower surface of the sealing member adjacent to the side surface of the sealing member, the outer surface of the seal member, and a part of the upper surface of the substrate member. The display device according to claim 2.

4. The width of the filling member in the second direction is larger than the width of the seal member in the second direction, The filling member covers the seal member in plan view. The display device according to claim 1.

5. Further including a driving chip mounted on the substrate member, On the substrate member, a first region exposed from the sealing member and a second region adjacent to the first region and covered by the sealing member are defined, The driving chip is disposed in the first region, At least a part of the filling member overlaps the driving chip in the second direction. The display device according to claim 1.

6. The filling member includes a first filling member that overlaps with the driving chip and a second filling member that is separated from the first filling member and does not overlap with the driving chip. The display device according to claim 5, wherein the first filling member overlaps with the driving chip in a plan view.

7. The display device according to claim 6, wherein the width of the first filling member in the second direction is smaller than the width of the second filling member in the second direction.

8. The display device according to claim 6, wherein a plurality of the first filling members are provided, and a separation distance in the first direction between the first filling members is larger than a separation distance in the first direction between the first filling member adjacent to the second filling member among the first filling members and the second filling member.

9. The filling member includes a first filling member that overlaps with the driving chip and a second filling member that is separated from the first filling member and does not overlap with the driving chip. The display device according to claim 5, wherein the first filling member is separated from the driving chip in a plan view.

10. The display device according to claim 1, further comprising a touch unit disposed between the sealing member and the optical member and a touch flexible circuit board electrically connected to the touch unit.

11. A plurality of the filling members are provided. The filling member includes a first filling member and a second filling member that are arranged along the first direction via the touch flexible circuit board in a plan view. The display device according to claim 10, wherein the first filling member and the second filling member are separated from the touch flexible circuit board.

12. The display device according to claim 1, wherein the sealing member includes frit.

13. The circuit layer includes a thin film transistor including a semiconductor pattern, a control electrode separated from the semiconductor pattern, an input electrode connected to one side and the other side of the semiconductor pattern respectively, and an output electrode. The display device according to claim 1, wherein the element layer includes an organic light emitting diode including a first electrode connected to the thin film transistor, a second electrode disposed on the first electrode, and a light emitting layer disposed between the first electrode and the second electrode.

14. A base layer including a plane defined by a first direction and a second direction orthogonal to each other, a circuit layer disposed on the base layer, and an element layer electrically connected to the circuit layer to generate light, and a substrate member including a first region and a second region adjacent to the first region along the second direction, A sealing member that covers the second region and is disposed to expose the first region, and includes a third region and a fourth region adjacent to the third region along the second direction, A seal member disposed along an edge of the sealing member in a plan view to join the sealing member and the substrate member, An optical member that covers the fourth region and is disposed to expose the third region, A window member disposed on the optical member and including a transmission region and a light-shielding region surrounding the transmission region, An adhesive member disposed between the optical member and the window member to join the optical member and the window member, A plurality of filling members disposed between the window member and the base layer, The filling member is Disposed separately from the optical member and the adhesive member, overlapping a part of each of the first region and the third region, and covering the seal member, The filling member is a display device that contacts a light-shielding layer disposed in the light-shielding region of the window member in a region overlapping the seal member.

15. The seal member includes an inner surface defining an internal space sealed together with the substrate member and the sealing member, and an outer surface facing the inner surface, and the outer surface contacts the filling member. The display device according to claim 14.

16. The lower surface of each of the filling members contacts a part of the upper surface of the sealing member, a side surface of the sealing member adjacent to the filling member, a part of the lower surface of the sealing member adjacent to the side surface of the sealing member, the outer surface of the seal member, and a part of the upper surface of the substrate member. The display device according to claim 15.

17. Further includes a driving chip disposed in the first region and overlapping at least one of the filling members in a plan view, The width in the second direction of the filling member overlapping the driving chip among the filling members is smaller than the width in the second direction of the filling member not overlapping the driving chip. The display device according to claim 16.

18. Further comprising a touch unit disposed between the sealing member and the optical member, and a touch flexible circuit board electrically connected to the touch unit. The filling member includes a first filling member and a second filling member disposed along the first direction via the touch flexible circuit board when viewed in plan view. The display device according to claim 15, wherein the first filling member and the second filling member are spaced apart from the touch flexible circuit board.

19. A substrate member including an organic light-emitting diode that generates light; A sealing member disposed on the substrate member to seal the organic light-emitting diode; A seal member disposed along an edge of the sealing member in plan view to join the sealing member and the substrate member, including an inner surface adjacent to the organic light-emitting diode and an outer surface facing the inner surface; A window member disposed on the sealing member and including a transmissive region and a light-shielding region surrounding the transmissive region; An adhesive member disposed on the sealing member; A filling member disposed between the window member and the substrate member, spaced apart from the adhesive member, and covering the seal member. The display device, wherein the filling member contacts a light-shielding layer disposed in the light-shielding region of the window member in a region overlapping the seal member.

20. The display device according to claim 19, wherein the filling member directly contacts the outer surface of the seal member.

Citation Information

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