Photosensitive resin composition for forming partition walls, partition wall structure manufactured using the same, and display device including the partition wall structure

Abstract

To provide a photosensitive resin composition for partition wall formation, a partition wall structure manufactured using the same, and a display device including the partition wall structure.SOLUTION: There are provided a photosensitive resin composition for partition wall formation which contains (A) a coloring agent containing a white pigment, (B) a UV absorber, (C) an alkali-soluble resin, (D) a photopolymerizable compound, (E) a photopolymerization initiator, and (F) a solvent, where the UV absorber and the photopolymerization initiator have values of absorbance ratios by a specific expression at a wavelength of 365 nm of 0.3-1.5; a partition wall structure manufactured from the photosensitive resin composition for partition wall formation; and a display device including the same.SELECTED DRAWING: None

Description

Technical Field

[0001] The present invention relates to a photosensitive resin composition for forming a partition wall, a partition wall structure manufactured using the same, and a display device including the partition wall structure.

Background Art

[0002] In conventional flat or liquid crystal display devices, due to the conventional structure of the display in which a lot of light is lost, in recent years, research has been conducted on displays using color conversion panels. As a simple example, in a structure composed of a color conversion panel together with a backlight that emits blue light, since the blue light of the backlight is used as it is, the light of the backlight can be used completely. Also, in pixels that display red or green, the blue light is color-converted to red or green for display. Therefore, compared with the conventional method of expressing a desired color using absorption and transmission, a lot of light is generated in the pixels.

[0003] A display manufactured by a low-temperature process will have significant features compared to a display manufactured by a previous high-temperature process. Usually, in order to enhance the reliability of materials, it is common to enhance the reliability of patterns by a high-temperature process. However, in recently developed OLEDs, since OLEDs are vulnerable to heat, it is difficult to carry out a high-temperature process. Therefore, in the case of manufacturing a display by separately manufacturing and then joining them later, it is difficult to manufacture a flexible or rollable display. Therefore, it is necessary to form color conversion pixels by a photolithography process on the upper part of the OLED panel, and the requirement for a low-temperature process has been increasing in order to form color conversion pixels.

[0004] Also, in a display device including a color conversion panel, in order to prevent color mixing of each color conversion pixel, a partition wall is formed between each color conversion pixel. However, due to the conversion efficiency of the color conversion pixel, the partition wall between each color conversion pixel is formed with a thickness of 3 to 15 μm.

[0005] Conventional photosensitive resin compositions for black matrices have no problems in pattern formation when the film thickness to be produced is 1 to 1.5 μm as in the past. However, the partition walls of color conversion pixels are not preferable because the film thickness to be produced must be formed at 3 to 15 μm.

[0006] In addition, when forming a thick film partition wall using a conventionally used black matrix, there was a problem that light was not irradiated to the lower end of the pattern due to a decrease in the transmittance of ultraviolet rays during the exposure process. Also, since the lower part of the film was not photocured, an undercut phenomenon was severely induced after the development process progressed, and there was a drawback of being weak in process margin.

[0007] In addition, when manufacturing the partition walls of color conversion pixels and going through a heat process in a subsequent process, if the reliability such as solvent resistance of the partition walls is low, residues or the like are generated inside the partition walls during the heat process through which the partition walls are manufactured, and there is a problem that the efficiency and lifespan of the color conversion pixels are shortened.

[0008] Korean Patent Publication No. 10-2007-0094460 aims to provide a photosensitive resin composition for forming partition walls with excellent shape stability against heat, but it is in a situation where the above-mentioned problems cannot be overcome.

Prior Art Documents

Patent Documents

[0009]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0010] The present invention is for improving the problems of the above-mentioned prior art, and aims to provide a photosensitive resin composition for forming a partition wall that can form a cured film having excellent physical properties even by low-temperature curing, prevent the formation of reverse tapers, and facilitate the formation of forward tapers.

[0011] In addition, the present invention can provide an effect of being excellent in reliability and swelling characteristics, preventing the problem of surface unevenness, being able to form a pattern with a fine mask size, and maintaining a stable color conversion pixel size even against changes in the development process, and aims to provide a photosensitive resin composition for forming a partition wall.

[0012] Furthermore, the present invention aims to provide a partition wall structure and a display device manufactured using the above-mentioned photosensitive resin composition for forming a partition wall.

Means for Solving the Problems

[0013] The present invention provides a photosensitive resin composition for forming a partition wall, comprising (A) a colorant containing a white pigment, (B) a UV absorber, (C) an alkali-soluble resin, (D) a photopolymerizable compound, (E) a photoinitiator, and (F) a solvent, wherein the UV absorber and the photoinitiator have an absorbance ratio value of 0.3 to 1.5 according to a specific mathematical formula at a wavelength of 365 nm.

[0014] In addition, the present invention provides a partition wall structure manufactured from the above-mentioned photosensitive resin composition for forming a partition wall and a display device including the same.

Effects of the Invention

[0015] The photosensitive resin composition for forming a partition wall and the partition wall structure according to the present invention can form a cured film having excellent physical properties even by low-temperature curing, prevent the formation of reverse tapers, and facilitate the formation of forward tapers.

[0016] In addition, the photosensitive resin composition for partition formation and the partition structure according to the present invention can provide the effect of being excellent in reliability and swelling characteristics and preventing the problem of surface unevenness, can form a pattern with a fine mask size, and can maintain a stable size of color conversion pixels even against changes in the development process.

Embodiments for Carrying Out the Invention

[0017] The present invention relates to a photosensitive resin composition for partition formation containing (A) a colorant containing a white pigment, (B) a UV absorber, (C) an alkali-soluble resin, (D) a photopolymerizable compound, (E) a photopolymerization initiator, and (F) a solvent, wherein the UV absorber and the photopolymerization initiator have an absorbance ratio value of 0.3 to 1.5 according to a specific mathematical formula at a wavelength of 365 nm. The present invention relates to a photosensitive resin composition for partition formation, a partition structure produced from the photosensitive resin composition for partition formation, and a display device including the same.

[0018] Hereinafter, the present invention will be described in detail. <Photosensitive Resin Composition for Partition Formation> The photosensitive resin composition for partition formation according to the present invention may contain (A) a colorant containing a white pigment, (B) a UV absorber, (C) an alkali-soluble resin, (D) a photopolymerizable compound, (E) a photopolymerization initiator, and (F) a solvent.

[0019] (A) Colorant The colorant according to the present invention is characterized by containing (a1) a white pigment.

[0020] (a1) White pigment The white pigment is for the reflection characteristics of the partition structure. Specifically, by improving the reflectivity of the partition structure to light of red and / or green wavelength ranges and reflecting light in a specific wavelength range heading towards the partition direction among the light generated from the color conversion element, the luminance can be improved. However, when only using the white pigment, as a scatterer, it can scatter when exposed to the light of the exposure machine and cause the curing of the non-exposed part. In particular, in this case, such a phenomenon occurs more severely with a high-intensity exposure machine, and problems such as reverse taper angle, residual film, and undeveloped areas may occur.

[0021] Also, the average particle size of the white pigment is preferably 150 nm to 300 nm. When the average particle size is less than 150 nm, it exhibits UV light blocking characteristics, and since UV light cannot sufficiently penetrate to the lower part during the exposure process, it causes a problem that pattern formation is not easy, and there is a risk of problems such as the transmittance in the visible light region being improved due to the particle size being too small and the shielding characteristics being reduced. When the average particle size exceeds 300 nm, the dispersibility and storage stability become poor, and there is a risk of problems such as the surface smoothness of the exposed part decreasing and the interface between the exposed part and the non-exposed part not being smooth, and the reflection characteristics not being effective.

[0022] The white pigment (Pigment White) may be one or more selected from the group consisting of titanium oxide (TiO2), silicon dioxide (SiO2), aluminum oxide (Al2O3), tin oxide (SnO2), iron oxide (Fe2O3), zinc oxide (ZnO), magnesium oxide (MgO), zirconium oxide (ZrO2), cerium oxide (CeO2), lithium oxide (Li2O), silver oxide (AgO), antimony oxide (Sb2O3, Sb2O5), and calcium oxide (CaO). Preferably, it may contain titanium oxide (TiO2) or zirconium oxide (ZrO2), and more preferably it may contain titanium oxide (TiO2).

[0023] As the white pigment, when the above conditions are satisfied, white pigments (C.I. Pigment White) known in this field can be used. Examples of the white pigment include C.I. Pigment White 4, 5, 6, 6:1, 7, 18, 18:1, 19, 20, 22, 25, 26, 27, 28, and 32. From the viewpoints of reflection efficiency and whiteness, it is preferable to contain C.I. Pigment White 6 or 22, and more preferably to contain C.I. Pigment White 6. These may be used alone or in combination of two or more.

[0024] Titanium dioxide (TiO2) contained in C.I. Pigment White 6 is inexpensive, has a high refractive index and excellent reflectivity, and thus can be used as an effective white pigment. From the viewpoints of colorability and whiteness, it preferably has a rutile structure.

[0025] The titanium dioxide (TiO2) may, if necessary, be subjected to surface treatment using resin treatment, pigment derivatives into which acidic groups or basic groups are introduced, graft treatment onto the pigment surface using polymer compounds, micronization treatment using the sulfuric acid micronization method, or cleaning treatment using organic solvents or water for removing impurities, ion impurity removal treatment using the ion exchange method, etc.

[0026] The titanium oxide (TiO₂) can be used after its surface is treated with one or more selected from the group consisting of silicon oxide (SiO₂), aluminum oxide (Al₂O₃), zirconium oxide (ZrO₂), and organic substances. Preferably, those surface-treated in order with silicon oxide (SiO₂), aluminum oxide (Al₂O₃), and zirconium oxide (ZrO₂) can be used. More preferably, those in which the outermost surface of the surface-treated titanium oxide (TiO₂) is surface-treated with an organic substance can be used. As the organic substance, there is no particular limitation as long as it can reduce the energy required for the dispersion of titanium oxide (TiO₂) and prevent the titanium oxide (TiO₂) from being pressed and aggregated by coating and surface-treating the titanium oxide (TiO₂) with a single molecular layer of low polarity. In one or more embodiments, stearic acid, trimethylpropane (TMP), pentaerythritol, etc. can be used.

[0027] By surface-treating the titanium oxide (TiO₂) as described above, the photocatalytic activity of the titanium oxide (TiO₂) can be reduced and the reflection luminance characteristics can be improved. In particular, according to the preferred embodiment of the surface treatment, there are advantages in terms of improving reliability such as heat resistance and chemical resistance. The surface treatment may be a treatment by encapsulation.

[0028] The content of the titanium oxide (TiO₂) core contained in the surface-treated titanium oxide (TiO₂) is preferably  85 to 95% by weight based on the total weight of the surface-treated titanium oxide (TiO₂). When the surface of the titanium oxide (TiO₂) core is treated within the above range, it exhibits excellent whiteness and excellent reflection luminance characteristics.

[0029] Examples of commercially available titanium dioxide (TiO2) include R-101, R-102, R-103, R-104, R-105, R-350, R-706, R-794, R-796, TS-6200, R-900, R-902, R-902+, R-931, R-960 from DuPont, and R-FC5, TR81, TR88 from Huntsman, and CR-57 from ISK, etc.

[0030] The white pigment may be contained in an amount of 1 to 30% by weight based on the total weight of the (A) colorant in the photosensitive resin composition for forming a partition wall of the present invention. When the content of the white pigment is less than 1% by weight, the reflectance in the wavelength regions of red and green pixels is not sufficient, so improvement in light efficiency cannot be expected. When the content exceeds 30% by weight, there is a risk of residual film generation or deterioration of the taper shape during high-intensity exposure.

[0031] (a2) Additional pigment or dye The (A) colorant according to the present invention may further contain organic pigments, inorganic pigments, dyes, etc. commonly used in the art within a range that does not impair the object of the present invention. Preferably, one or more pigments selected from the group consisting of black pigments, red pigments, yellow pigments, and blue pigments may be mixed and used.

[0032] The black pigment can be appropriately selected from black organic pigments or black inorganic pigments.

[0033] As the black organic pigment, one or more selected from the group consisting of lactam black, perylene black, cyanine black, and aniline black can be used. As the black inorganic pigment, one or more selected from the group consisting of carbon black, chromium oxide, iron oxide, and titanium black can be used. Depending on the purpose, the black organic pigment and the black inorganic pigment may be used alone or in combination of two or more.

[0034] The red pigment may be one or more selected from diketopyrrole-based, anthraquinone-based, perylene-based, and azo-based pigments. Preferably, the red pigment is one or more selected from the group consisting of C.I. Pigment Red 9, 81, 97, 105, 122, 123, 144, 149, 150, 155, 166, 168, 171, 175, 176, 177, 179, 180, 185, 192, 202, 208, 209, 214, 215, 216, 220, 222, 224, 242, 254, 255, 264, 269, 270, and 272. More preferably, the red pigment is one or more selected from the group consisting of C.I. Pigment Red 177, 179, 254, 264, and 269.

[0035] The yellow pigment may be one or more selected from anthraquinone-based, isoindolinone-based, and azo-based pigments. Preferably, the yellow pigment is one or more selected from the group consisting of C.I. Pigment Yellow 11, 13, 20, 24, 31, 53, 83, 86, 93, 94, 95, 99, 108, 109, 110, 117, 125, 128, 129, 138, 139, 147, 148, 150, 151, 154, 155, 166, 167, 173, 180, 185, and 199. More preferably, the yellow pigment is one or more selected from the group consisting of C.I. Pigment Yellow 138, 139, 150, and 185.

[0036] The blue pigment may be one or more selected from C.I. Pigment Blue 15, C.I. Pigment Blue 15:3, C.I. Pigment Blue 15:4, and C.I. Pigment Blue 15:6.

[0037] As the dye, any dye that has solubility in an organic solvent or can be dispersed can be used without limitation. Preferably, a dye that has solubility in an organic solvent and can ensure reliability such as solubility in an alkaline developer, heat resistance, and solvent resistance is preferably used.

[0038] As the dye, those selected from acidic dyes having acidic groups such as sulfonic acid and carboxylic acid, salts of acidic dyes and nitrogen-containing compounds, sulfonamide forms of acidic dyes, and their derivatives can be used. In addition to these, azo-based, xanthene-based, phthalocyanine-based acidic dyes and their derivatives can also be selected.

[0039] Preferably, as the dye, compounds classified as dyes in the Color Index (published by The Society of Dyers and Colourists) and known dyes described in Dyeing Notes (Color Dyeing Co., Ltd.) can be mentioned.

[0040] Specific examples of the dye include C.I. Solvent Green 1, 3, 4, 5, 7, 28, 29, 32, 33, 34, 35 C.I. Solvent Yellow 4, 14, 15, 16, 21, 23, 24, 38, 56, 62, 63, 68, 79, 82, 93, 94, 98, 99, 151, 162, 163 C.I. Solvent Blue 18, 35, 36, 45, 58, 59, 59:1, 63, 68, 69, 78, 79, 83, 94, 97, 98, 100, 101, 102, 104, 105, 111, 112, 122, 128, 132, 136, 139 Red dyes such as C.I. Solvent Red 8, 45, 49, 89, 111, 122, 125, 130, 132, 146, 179; Red dyes such as C.I. Acid Red 1, 4, 8, 14, 17, 18, 26, 27, 29, 31, 34, 35, 37, 42, 44, 50, 51, 52, 57, 66, 73, 80, 87, 88, 91, 92, 94, 97, 103, 111, 114, 129, 133, 134, 138, 143, 145, 150, 151, 158, 176, 182, 183, 198, 206, 211, 215, 216, 217, 227, 228, 249, 252, 257, 258, 260, 261, 266, 268, 270, 274, 277, 280, 281, 195, 308, 312, 315, 316, 339, 341, 345, 346, 349, 382, 383, 394, 401, 412, 417, 418, 422, 426 etc. are included.

[0041] The above pigments and dyes may be used alone or in combination of two or more.

[0042] When the photosensitive resin composition for partition formation according to the present invention contains the additional pigment or dye, one or more selected from the white pigment and the additional pigment or dye are preferably included at a weight ratio of 1:0.050 to 1:18.0, more preferably 1:0.1 to 1:9, and even more preferably 1:0.2 to 1:4. When included at the above weight ratio, there are advantages of high colorability and high brightness, improved process margin, and excellent sensitivity, which is preferable.

[0043] (a3) Pigment dispersant The pigment dispersant is added for deagglomeration of the pigment and maintenance of stability, and those commonly used in the art can be used without limitation. Specific examples of the pigment dispersant include surfactants such as cationic, anionic, nonionic, amphoteric, polyester-based, and polyamine-based surfactants, and these may be used alone or in combination of two or more.

[0044] Also, the pigment dispersant preferably contains an acrylate-based dispersant (hereinafter referred to as acrylate-based dispersant) containing butyl methacrylate (BMA) or N,N-dimethylaminoethyl methacrylate (DMAEMA). It is preferable to use an acrylate-based dispersant produced by a living control method. Examples of commercially available products include DISPER BYK-2000, DISPER BYK-2001, DISPER BYK-2070, or DISPER BYK-2150. The acrylate-based dispersants may be used alone or in combination of two or more.

[0045] In addition to the acrylate-based dispersant, other resin type pigment dispersants may be used as the pigment dispersant. Examples of the other resin type pigment dispersants include known resin type pigment dispersants, particularly polycarboxylic acid esters typified by polyurethane and polyacrylate, unsaturated polyamides, polycarboxylic acids, (partial) amine salts of polycarboxylic acids, ammonium salts of polycarboxylic acids, alkylamine salts of polycarboxylic acids, polysiloxanes, long-chain polyaminoamide phosphate salts, esters of hydroxyl group-containing polycarboxylic acids, and modified products thereof, or oily dispersants such as amides formed by the reaction of polyesters having free carboxyl groups with poly(lower alkyleneimine), or salts thereof; water-soluble resins or water-soluble polymer compounds such as (meth)acrylic acid-styrene copolymers, (meth)acrylic acid-(meth)acrylate ester copolymers, styrene-maleic acid copolymers, polyvinyl alcohol, or polyvinylpyrrolidone; polyesters; modified polyacrylates; addition products of ethylene oxide / propylene oxide; and phosphate esters.

[0046] Examples of commercially available pigment dispersants of the other resin types include, for example, BYK-Chemie products with trade names: DISPER BYK-160, DISPER BYK-161, DISPER BYK-162, DISPER BYK-163, DISPER BYK-164, DISPER BYK-166, DISPER BYK-171, DISPER BYK-182, DISPER BYK-184; BASF products with trade names: EFKA-44, EFKA-46, EFKA-47, EFKA-48, EFKA-4010, EFKA-4050, EFKA-4055, EFKA-4020, EFKA-4015, EFKA-4060, EFKA-4300, EFKA-4330, EFKA-4400, EFKA-4406, EFKA-4510, EFKA-4800; Lubrizol products with trade names: SOLSPERS-24000, SOLSPERS-`32550, NBZ-4204 / 10; Kawaken Fine Chemical products with trade names: HINOACT T-6000, HINOACT T-7000, HINOACT T-8000; Ajinomoto products with trade names: AJISPUR PB-821, AJISPUR PB-822, AJISPUR PB-823; Kyoeisha Chemical products with trade names: FLORENE DOPA-17HF, FLORENE DOPA-15BHF, FLORENE DOPA-33, FLORENE DOPA-44, and the like.

[0047] In addition to the acrylate-based dispersant, the pigment dispersants of other resin types may be used alone or in combination of two or more, and may also be used in combination with the acrylate-based dispersant.

[0048] The pigment dispersant may be contained in an amount of 1 to 50 parts by weight, preferably 5 to 30 parts by weight, based on 100 parts by weight of the solid content of the colorant. When the content of the pigment dispersant is within the above range, it is preferable because pigments with a uniform particle size can be obtained. If the content of the dispersant exceeds 50 parts by weight, the viscosity may increase, and if it is less than 1 part by weight, it may be difficult to atomize the pigment or may cause problems such as gelation after dispersion.

[0049] (B) UV absorber The UV absorber according to the present invention can reduce the CD bias caused by diffraction due to partially absorbing UV by satisfying the values of Mathematical Formula 1 and / or Mathematical Formula 2 of the present invention within a specific range. Thereby, it can play a role of enabling a desired pattern to be realized. CD means the positive etched portion of a pattern, and CD bias means the degree to which the formed pattern size is larger than the mask pattern to be realized.

[0050] In addition, when the photosensitive resin composition containing scattering particles such as the white pigment or metal oxide is exposed at high illuminance (15,000 mW or more), there is a risk of problems with residual film and residue. The UV absorber of the present invention can play a role of preventing problems with residual film and residue that may occur during high-illuminance exposure.

[0051] The UV absorber according to the present invention is not particularly limited as long as it satisfies the values of Mathematical Formula 1 and / or Mathematical Formula 2 of the present invention within a specific range. Preferably, it can be a UV absorber according to the content described in the item of <Absorbance ratio of (B) UV absorber and (D) photoinitiator> described later. Specifically, the UV absorber of the present invention includes a UV absorber having an absorption wavelength at the i-line wavelength (365 nm), and the UV absorber may include one or more selected from the group consisting of benzotriazole-based, triazine-based, hindered amine-based (HALS, Hindered Amine Light Stabilizer), cyanoacrylate-based, and benzophenone-based UV absorbers.

[0052] Examples of the benzotriazole-based UV absorber include octyl 3-[3-tert-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazol-2-yl)phenyl]propionate, 2-ethylhexyl 3-(3-tert-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazol-2-yl)phenyl)propionate, [3-[3-(2H-benzotriazol-2-yl)-5-(1,1-methylethyl)-4-hydroxyphenyl]-1-oxopropyl]-ω-[3-[3-(2H-benzotriazol-2-yl)-5-(1,1-dimethylethyl)-4-hydroxyphenyl]-1-oxopropoxy]poly(oxy-1,2-ethanediyl), (3-(3-(2H-benzotriazol-2-yl)-5-(1,1-dimethylethyl)-4-hydroxyphenyl)-1-oxopropyl)-hydroxypoly(oxo-1,2-ethanediyl), 2-(3-tert-butyl-2-hydroxy-5-methylphenyl)-5-chloro-2H-benzotriazole, 2-(2H-benzotriazol-2-yl)-4,6-di-tert-pentylphenol, octyl 3-(2H-benzotriazolyl)-5-(1,1-dimethylethyl)-4-hydroxy-benzenepropionate, 2-(2H-benzotriazol-2-yl)-4,6-bis(1-methyl-1-phenylethyl)phenol, 2-(2H-benzotriazol-2-yl)-6-(1-methyl-1-phenylethyl)-4-(1,1,3,3-tetramethylbutyl)phenol, etc. Commercially available products include CYASORB UV-2337, CYASORB UV-5411 from Ciba, TINUVIN 99-2, TINUVIN 171, TINUVIN 213, TINUVIN 326, TINUVIN 360, TINUVIN 384-2, TINUVIN 900, TINUVIN 928, TINUVIN 1130 from BASF, SONGSORB 1000, SONGSORB 2340, SONGSORB 3200, SONGSORB 3260, SONGSORB 3270, SONGSORB 3280 from Sunwon Industries, etc.

[0053] Examples of the triazine-based UV absorber include 2-(4,6-dimethyl-1,3,5-triazin-2-yl)-5-((hexyl)oxy)-phenol, 2-(4-(2-hydroxy-3-tridecyloxypropyl)oxy)-2-hydroxyphenyl)-4,6-bis(2,4-dimethylphenyl)-1,3,5-triazine, 2-(4-(2-hydroxy-3-didecyloxypropyl)oxy)-2-hydroxyphenyl)-4,6-bis(2,4-dimethylphenyl)-1,3,5-triazine, 2-(2-hydroxy-4-(3-(2-ethylhexyl-1-oxy)-2-hydroxypropyl)oxy)phenyl)-4,6-bis(2,4-dimethylphenyl)-1,3,5-triazine, 2,2’-[6-(2,4-dibutoxyphenyl)-1,3,5-triazine-2,4-diyl]bis(5-butoxyphenol), 6-methylheptyl 2-{4-[4,6-di(4-biphenylyl)-1,3,5-triazin-2-yl]-3-hydroxyphenoxy}propanoate, etc. Commercially available products include CYASORB UV-1164 from CYTEC, TINUVIN from BASF, TINUVIN P, TINUVIN 234, TINUVIN 328, TINUVIN 329, TINUVIN 400, TINUVIN 479, TINUVIN 571, etc.

[0054] <{ Examples of the hindered amine-based UV absorber include bis(1,2,2,6,6-pentamethyl-4-piperidyl)[[3,5-bis(1,1-dimethylethyl)-4-hydroxyphenyl]methyl]butyl malonate containing a 2,2,4,6-tetramethylpiperazine structure, bis(2,2,6,6-tetramethyl-4-piperidyl) sebacate, and poly[[6-[(1,1,3,3-tetramethylbutyl)amino]-s-triazine-2,4-diyl]-[(2,2,6,6-tetramethyl-4-piperidyl)imino]-hexamethylene-[(2,2,6,6-tetramethyl-4-piperidyl)imino]], etc. Commercially available products include TINUVIN 123, TINUVIN 292, TINUVIN 5100 from BASF, etc.

[0055] Examples of the cyanoacrylate-based UV absorber include alkyl-2-cyanoacrylate, cycloalkyl-2-cyanoacrylate, alkoxyalkyl-2-cyanoacrylate, alkenyl-2-cyanoacrylate, alkynyl-2-cyanoacrylate, and the like.

[0056] Examples of the benzophenone-based UV absorber include 2,4-dihydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-methoxybenzophenone-5-sulfonic acid (anhydrous and trihydrate salts), 2-hydroxy-4-octyloxybenzophenone, 4-dodecyloxy-2-hydroxybenzophenone, 4-benzyloxy-2-hydroxybenzophenone, 2,2’,4,4’-tetrahydroxybenzophenone, 2,2’-dihydroxy-4,4-dimethoxybenzophenone, 2,2’,4,4’-tetrahydroxybenzophenone (SeeSorb 106, manufactured by Shipro Kasei Co., Ltd.), 2,2’-dihydroxy-4-methoxybenzophenone (KEMISORB 111, manufactured by Chemipro Kasei Co., Ltd.), and the like.

[0057] The content of the UV absorber is preferably 0.05 to 10% by weight based on the total weight of the solid content of the photosensitive resin composition for forming a partition wall of the present invention. When the content of the UV absorber is below the above range, it is difficult to achieve the expected effects by using the UV absorber. When the content is above the above range, the sensitivity of the composition becomes excessively low, and there is a risk of problems such as pattern disappearance, film thickness reduction, and deterioration of reliability.

[0058] (C) Alkali-soluble resin The alkali-soluble resin of the present invention is a component that imparts solubility to the alkali developer used in the development process and acts as a dispersion medium for the pigment.

[0059] The alkali-soluble resin can be used without limitation as long as it is soluble in the alkali developer, and preferably may contain a cardo resin, an acrylic resin, or a mixture thereof.

[0060] The caldo resin has reactivity and alkali solubility by the action of light or heat, and as the caldo resin contained in the photosensitive resin composition for forming a partition wall of the present invention, any resin can be used as long as it functions as a binder resin for a colorant containing a white pigment and is soluble in an alkaline developer.

[0061] The caldo resin of the present invention may contain one or more of the compounds represented by Chemical Formula 1-1 and Chemical Formula 1-2.

[0062]

Chemical formula

[0063] In Chemical Formula 1-1 or Chemical Formula 1-2, R1, R2, R3, and R4 are each independently an alkyl group having 1 to 5 carbon atoms, a cycloalkyl group having 4 to 8 carbon atoms, or

Chemical formula

[0064] In the present invention, the compound represented by Chemical Formula 1-1 can be synthesized into the compound represented by the following Chemical Formula 2-1, and the compound represented by Chemical Formula 1-2 can be synthesized using the compound represented by Chemical Formula 2-2.

[0065]

Chemical formula

[0066] Specific examples of the ethylenically unsaturated monomer having a carboxyl group include monocarboxylic acids such as acrylic acid, methacrylic acid, and crotonic acid; dicarboxylic acids such as fumaric acid, mesaconic acid, and itaconic acid; and anhydrides of the dicarboxylic acids; mono(meth)acrylates of polymers having a carboxyl group and a hydroxyl group at both ends such as ω-carboxypolycaprolactone mono(meth)acrylate, etc. Acrylic acid and methacrylic acid are preferred.

[0067] Further, the alkali-soluble resin can be produced by polymerizing an unsaturated monomer copolymerizable with the ethylenically unsaturated monomer having a carboxyl group.

[0068] Specific examples of the copolymerizable unsaturated polymerization monomers include glycidyl methacrylate, which is an unsaturated monomer having a glycidyl group; ethylenically unsaturated monomers having a hydroxyl group such as hydroxyethyl (meth)acrylates like 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, N-hydroxyethylacrylamide; aromatic vinyl compounds such as styrene, vinyltoluene, α-methylstyrene, p-chlorostyrene, o-methoxystyrene, m-methoxystyrene, p-methoxystyrene, o-vinylbenzyl methyl ether, m-vinylbenzyl methyl ether, p-vinylbenzyl methyl ether, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, p-vinylbenzyl glycidyl ether; N-substituted maleimide compounds such as N-cyclohexylmaleimide, N-benzylmaleimide, N-phenylmaleimide, N-o-hydroxyphenylmaleimide, N-m-hydroxyphenylmaleimide, N-p-hydroxyphenylmaleimide, N-o-methylphenylmaleimide, N-m-methylphenylmaleimide, N-p-methylphenylmaleimide, N-o-methoxyphenylmaleimide, N-m-methoxyphenylmaleimide, N-p-methoxyphenylmaleimide; alkyl (meth)acrylates such as methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, i-propyl (meth)acrylate, n-butyl (meth)acrylate, i-butyl (meth)acrylate, sec-butyl (meth)acrylate, t-butyl (meth)acrylate; cyclopentyl (meth)acrylate, cyclohexyl (meth)acrylate, 2-methylcyclohexyl (meth)acrylate, tricyclo[5.2.1.Alicyclic (meth)acrylates such as 2,6-decan-8-yl (meth)acrylate, 2-dicyclopentanyloxyethyl (meth)acrylate, isobornyl (meth)acrylate; Aryl (meth)acrylates such as phenyl (meth)acrylate, benzyl (meth)acrylate; Unsaturated oxetane compounds such as 3-(methacryloyloxymethyl)oxetane, 3-(methacryloyloxymethyl)-3-ethyloxetane, 3-(methacryloyloxymethyl)-2-trifluoromethyloxetane, 3-(methacryloyloxymethyl)-2-phenyloxetane, 2-(methacryloyloxymethyl)oxetane, 2-(methacryloyloxymethyl)-4-trifluoromethyloxetane; and the like, but not limited thereto.

[0069] The copolymerizable unsaturated monomers may be used alone or in combination of two or more thereof.

[0070] The acid value of the alkali-soluble resin is preferably 30 to 200 mgKOH / g. When the acid value of the alkali-soluble resin is less than 30 mgKOH / g, it is difficult to ensure sufficient development rate of the photosensitive resin composition for forming a partition wall. When it exceeds 200 mgKOH / g, the adhesion to the substrate decreases, short circuit of the pattern is likely to occur, problems occur in the compatibility with the colorant, the colorant in the photosensitive resin composition is precipitated, the storage stability of the photosensitive resin composition decreases, and the viscosity tends to increase.

[0071] The "acid value" is a value measured as the amount (mg) of potassium hydroxide required to neutralize 1 g of an acrylic polymer, and can usually be determined by titration using an aqueous potassium hydroxide solution.

[0072] Also, a cald-based resin or an acrylic-based alkali-soluble resin having a polystyrene-reduced weight average molecular weight (hereinafter simply referred to as "weight average molecular weight") measured by gel permeation chromatography (GPC; using tetrahydrofuran as an elution solvent) of 2,000 to 20,000, preferably 3,000 to 10,000, is preferred. When within the above molecular weight range, film loss in the development process can be suppressed, and pattern stability can be improved.

[0073] The alkali-soluble resin may be contained in an amount of 5 to 85% by weight, preferably 5 to 60% by weight, based on the total weight of the solid content of the photosensitive resin composition for forming a partition wall according to the present invention. When the alkali-soluble resin is contained within the above range, the solubility in the developer is sufficient, a cured film can be easily formed, it is possible to prevent the film of the pixel portion of the exposed portion from decreasing during development, and the leakage property of the non-exposed portion is improved, which is preferable.

[0074] (D) Photopolymerizable compound The photopolymerizable compound is a compound that can be polymerized by the action of the following (D) photoinitiator, and a monofunctional monomer, a bifunctional monomer, or a polyfunctional monomer can be used, and preferably a polyfunctional monomer having two or more functional groups can be used.

[0075] Specific examples of the monofunctional monomer include, but are not limited to, nonylphenyl carbitol acrylate, 2-hydroxy-3-phenoxypropyl acrylate, 2-ethylhexyl carbitol acrylate, 2-hydroxyethyl acrylate, or N-vinylpyrrolidone.

[0076] Specific examples of the bifunctional monomer include, but are not limited to, 1,6-hexanediol di(meth)acrylate, ethylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, bis(acryloyloxyethyl) ether of bisphenol A, or 3-methylpentanediol di(meth)acrylate.

[0077] Specific examples of the polyfunctional monomer include trimethylolpropane tri(meth)acrylate, ethoxylated trimethylolpropane tri(meth)acrylate, propoxylated trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, ethoxylated dipentaerythritol hexa(meth)acrylate, propoxylated dipentaerythritol hexa(meth)acrylate, or dipentaerythritol hexa(meth)acrylate, etc. However, it is not limited thereto.

[0078] Further, the photopolymerizable compound may be contained in an amount of 5 to 50% by weight, preferably 7 to 45% by weight, based on the total weight of the solid content of the photosensitive resin composition for forming the partition wall. When the photopolymerizable compound is contained within the above range, it is preferable from the viewpoints of strength and smoothness.

[0079] (E) Photoinitiator The photopolymerization initiator according to the present invention is not particularly limited as long as it satisfies the values of Mathematical Formula 1 and / or Mathematical Formula 2 of the present invention within a specific range. Preferably, it is a photopolymerization initiator according to the content described in the item of <Absorbance ratio of (B) UV absorber and (D) photopolymerization initiator> described later. Specifically, it contains a compound that generates radicals capable of initiating the polymerization of the photopolymerizable compound by exposure to radiation such as visible light, ultraviolet light, far ultraviolet light, electron beam, X-ray, etc.

[0080] As the photopolymerization initiator, for example, acetophenone-based compounds, benzophenone-based compounds, biimidazole-based compounds, triazine-based compounds, oxime ester-based compounds, and thioxanthone-based compounds, etc. can be used, and the photopolymerization initiator may be used alone or in a mixture of two or more.

[0081] Specific examples of the acetophenone-based compound include diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, benzyldimethyl ketal, 2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methylpropan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butan-1-one, 2-hydroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]propan-1-one, 2-(4-methylbenzyl)-2-(dimethylamino)-1-(4-morpholinophenyl)butan-1-one, and the like.

[0082] Specific examples of the benzophenone-based compound include benzophenone, methyl O-benzoylbenzoate, 4-phenylbenzophenone, 4-benzoyl-4'-methyldiphenyl sulfide, 3,3',4,4'-tetra(tert-butylperoxycarbonyl)benzophenone, 2,4,6-trimethylbenzophenone, and the like.

[0083] Specific examples of the biimidazole compound include 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(2,3-dichlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetra(alkoxyphenyl)biimidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetra(trialkoxyphenyl)biimidazole, 2,2-bis(2,6-dichlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole, or an imidazole compound in which the phenyl groups at the 4,4',5,5' positions are substituted with carboxyalkoxy groups. Among these, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(2,3-dichlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, and 2,2-bis(2,6-dichlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole are preferably used.

[0084] Specific examples of the triazine compound include 2,4-bis(trichloromethyl)-6-(4-methoxyphenyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(4-methoxynaphthyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-piperonyl-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(4-methoxystyryl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(5-methylfuran-2-yl)ethenyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(furan-2-yl)ethenyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(4-diethylamino-2-methylphenyl)ethenyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(3,4-dimethoxyphenyl)ethenyl]-1,3,5-triazine, and the like.

[0085] Specific examples of the oxime ester compound include o-ethoxycarbonyl-α-oxyimino-1-phenylpropan-1-one, 1,2-octanedione, -1-(4-phenylthio)phenyl, -2-(o-benzoyloxime), ethanone, -1-(9-ethyl)-6-(2-methylbenzoyl-3-yl)-, 1-(o-acetyloxime), etc. Commercially available products include CGI-124 and CGI-224 from Ciba-Geigy, Irgacure® OXE-01, Irgacure® OXE-02, Irgacure® OXE-03 from BASF, N-1919 and NCI-831 from ADEKA, PBG-327 and PBG-345 from TRONLY, etc.

[0086] Specific examples of the thioxanthone compound include 2-isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-dichlorothioxanthone, 1-chloro-4-propoxythioxanthone, etc.

[0087] The photoinitiator may be contained in an amount of 0.01 to 10% by weight, preferably 0.01 to 5% by weight, based on the total weight of the solid content of the photosensitive resin composition for partition formation. When the photoinitiator is contained within the above range, the photopolymerization reaction rate is appropriate, the increase in the total process time is prevented, and the physical properties of the final cured film due to overreaction are prevented from deteriorating, which is preferable.

[0088] The photosensitive resin composition for partition formation according to the present invention may further contain a photoinitiator aid in addition to the photoinitiator. When a photoinitiator aid is used together with the photoinitiator, the photosensitive resin composition becomes more sensitive and the productivity is improved, which is preferable.

[0089] The photoinitiator aid is a compound used to accelerate the polymerization of the polymerizable compound whose polymerization has been initiated by the photoinitiator, and one or more compounds selected from the group consisting of amines and carboxylic acid compounds can preferably be used.

[0090] When the photoinitiator assistant is included, its content is usually more than 0 mol and at most 10 mol, preferably 0.01 mol to 5 mol, relative to 1 mol of the photoinitiator. When the photoinitiator assistant is included within the above range, it is preferable because the photopolymerization efficiency is improved and an improvement effect on productivity is expected.

[0091] (F) Solvent The solvent can be used without particular limitation as an organic solvent known in this field. Specific examples of the solvent include ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dipropyl ether, diethylene glycol dibutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, dipropylene glycol dimethyl ether, dipropylene glycol diethyl ether, dipropylene glycol dipropyl ether, and dipropylene glycol dibutyl ether; aromatic hydrocarbons such as benzene, toluene, xylene, and mesitylene; ketones such as methyl ethyl ketone, acetone, methyl amyl ketone, methyl isobutyl ketone, and cyclohexanone; alcohols such as ethanol, propanol, butanol, hexanol, cyclohexanol, ethylene glycol, and glycerin; esters such as ethyl 3-ethoxypropionate, methyl 3-methoxypropionate, methyl cellosolve acetate, ethyl cellosolve acetate, ethyl acetate, butyl acetate, amyl acetate, methyl lactate, ethyl lactate, butyl lactate, 3-methoxybutyl acetate, 3-methyl-3-methoxy-1-butyl acetate, methoxypentyl acetate, ethylene glycol monoacetate, ethylene glycol diacetate, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, diethylene glycol monoacetate, diethylene glycol diacetate, diethylene glycol monobutyl ether acetate, propylene glycol monoacetate, propylene glycol diacetate, propylene glycol monoethyl ether acetate, ethylene carbonate, propylene carbonate, and γ-butyrolactone. The solvent may be used by mixing one or more selected from the group of the exemplified solvents.

[0092] Preferably, among these solvents, organic solvents having a boiling point of 100 to 200 ° C. can be used from the viewpoints of coatability and drying properties. More preferably, alkylene glycol alkyl ether acetates, ketones, esters such as ethyl 3-ethoxypropionate and methyl 3-methoxypropionate can be used. Even more preferably, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, cyclohexanone, ethyl 3-ethoxypropionate, methyl 3-methoxypropionate and the like can be used. These solvents may be used alone or in combination of two or more.

[0093] The content of the solvent may be included as the balance so that the total weight of the photosensitive resin composition for forming a partition wall is 100% by weight. Specifically, in the present invention, the “balance” means the balance such that the total weight of the composition further containing the essential components of the present invention and other additional components is 100% by weight. Due to the meaning of the “balance”, it is not limited that no additional components are contained in the photosensitive resin composition for forming a partition wall of the present invention.

[0094] For example, the solvent may be contained in an amount of 60 to 90% by weight, preferably 70 to 85% by weight based on the total weight of the photosensitive resin composition for forming a partition wall, but is not limited thereto. However, when the solvent is contained within the above content range, it is preferable because it provides an effect of improving coatability when coating with a coating device such as a roll coater, a spin coater, a slit and spin coater, a slit coater (sometimes called a die coater), or an inkjet.

[0095] Thiol compound The photosensitive resin composition for forming a partition wall of the present invention may further contain a thiol compound. By containing the thiol compound, the reliability such as heat resistance and solvent resistance of the coating film can be improved, and the characteristics of low-temperature curability can be improved.

[0096] The thiol compound preferably contains a 1-functional group to 4-functional group thiol compound, and more preferably may contain one or more selected from the group consisting of compounds represented by the following chemical formulas 3-1 to 3-4.

[0097]

Chemical formula

[0098] Specific examples of the thiol compound include 2-ethylhexyl 3-mercaptopropionate, 1,4-butanediol bis(thioglycolate), 2-hydroxymethyl-2-methyl-1,3-propanediol tris(3-mercaptopropionate), trimethylolpropane tris(3-mercaptopropionate), and pentaerythritol tetrakis(3-mercaptopropionate).

[0099] The thiol compound may be contained in an amount of 0.05 to 5% by weight based on the total weight of the photosensitive resin composition for forming a partition wall. When the thiol compound is contained within the above range, it is preferable from the viewpoints of low-temperature curability and improvement of reliability.

[0100] Additive The photosensitive resin composition for forming a partition wall according to the present invention may further contain additives such as a filler, other polymer compounds, a surfactant, an antioxidant, an adhesion promoter, and an anti-aggregation agent, if necessary. The additives may be used alone or in combination of two or more.

[0101] Specifically, glass, silica, alumina, etc. can be used as the filler, but it is not limited thereto.

[0102] Specific examples of the other polymer compound include curable resins such as maleimide resins, and thermoplastic resins such as polyvinyl alcohol, polyacrylic acid, polyethylene glycol monoalkyl ether, polyfluoroalkyl acrylate, polyester, and polyurethane. An epoxy compound may preferably be included.

[0103] Examples of the epoxy compound include alicyclic epoxy compounds, bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, novolak type epoxy compounds, polyfunctional amine epoxy compounds, etc. These may be used alone or in combination of two or more. Preferably, an alicyclic epoxy compound is used, and more preferably, a bifunctional alicyclic epoxy compound is used, which is excellent in terms of low-temperature curability and solvent resistance.

[0104] Examples of the surfactant include surfactants such as silicone-based, fluorine-based, ester-based, cationic, anionic, nonionic, and amphoteric surfactants. These may be used alone or in combination of two or more.

[0105] The antioxidant may include one or more selected from the group consisting of phosphorus-based antioxidants, sulfur-based antioxidants, and phenol-based antioxidants. In this case, it is possible to suppress the color change phenomenon that may occur at high temperature during the process, or the occurrence of yellowing that may be caused by a light source after the production of the display. The antioxidant may include one or more selected from the group consisting of phenol-based compounds, phosphorus-based compounds, and sulfur-based compounds, and these may be used as a combination of phenol-based - phosphorus-based compounds, phenol-based - sulfur-based compounds, phosphorus-based - sulfur-based compounds, or phenol-based - phosphorus-based - sulfur-based compounds.

[0106] Specific examples of the adhesion promoter include vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris(2-methoxyethoxy)silane, N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-chloropropylmethyldimethoxysilane, 3-chloropropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-isocyanatopropyltrimethoxysilane, and 3-isocyanatopropyltriethoxysilane. These may be used alone or as a mixture thereof.

[0107] Specific examples of the anti-aggregation agent include sodium polyacrylate, but are not limited thereto.

[0108] The above additives can be appropriately added and used by those skilled in the art as long as the effects of the present invention are not inhibited. For example, the additives may be used in an amount of 0.05 to 10% by weight, preferably 0.1 to 10% by weight, more preferably 0.1 to 5% by weight based on the total weight of the photosensitive resin composition for forming a partition wall, but are not limited thereto.

[0109] <Absorbance ratio of (B) UV absorber to (D) photoinitiator> By adjusting the absorbance ratio of (B) the UV absorber and (D) the photoinitiator contained in the photosensitive resin composition for forming a partition wall of the present invention to satisfy a specific mathematical formula range, it is possible to improve undercut and effectively prevent the formation of reverse taper, and further effectively control CD bias.

[0110] Specifically, based on a wavelength of 365 nm, the UV absorber and the photopolymerization initiator contained in the photosensitive resin composition for forming a partition wall of the present invention may be contained such that the value of the "absorbance ratio based on content" calculated by the following mathematical formula 1 is 0.3 to 1.5.

[0111] [Number] In the above mathematical formula 1, the "weight % of the UV absorber" and the "weight % of the photopolymerization initiator" are the weight % with respect to the total weight of the photosensitive resin composition for forming a partition wall of the present invention, respectively.

[0112] Further, when two or more types of UV absorbers are contained, the "absorbance ratio based on content" can be obtained by the following mathematical formula 1-1. [Mathematical formula 1-1] (Absorbance ratio based on content) = {(Weight % of the first UV absorber) × (Absorbance of the first UV absorber) + (Weight % of the second UV absorber) × (Absorbance of the second UV absorber)…} / {(Weight % of the photopolymerization initiator) × (Absorbance of the photopolymerization initiator)}

[0113] In addition, the UV absorber and the photopolymerization initiator contained in the photosensitive resin composition for forming a partition wall of the present invention may satisfy the value of the "absorbance ratio based on the same content" calculated by the following mathematical formula 2 being 0.2 to 1.0, based on a wavelength of 365 nm. [Mathematical formula 2] (Absorbance ratio based on the same content) = (Absorbance of the UV absorber) / (Absorbance of the photopolymerization initiator) In the above mathematical formula 2, the "absorbance ratio based on the same content" specifically means a value obtained by calculating the absorbance ratio with respect to the intrinsic absorbance values of the UV absorber and the photopolymerization initiator, regardless of the contents of the UV absorber and the photopolymerization initiator contained in the photosensitive resin composition for forming a partition wall of the present invention.

[0114] Further, when two or more types of UV absorbers are contained, the "absorbance ratio based on the same content" can be obtained by the following mathematical formula 2-1.

[0115]

Number

[0116] The UV absorber and the photoinitiator contained in the photosensitive resin composition for forming a partition wall of the present invention are included such that the value of the "absorbance ratio based on content" calculated by the above mathematical formula 1 is 0.3 to 1.5, and the value of the "absorbance ratio based on the same content standard" calculated by the above mathematical formula 2 satisfies 0.2 to 1.0, and including satisfying all of these.

[0117] When the range of the absorbance ratio according to the above mathematical formula 1 is satisfied, the curing level of the surface portion is appropriately maintained, no residual film is generated, the expansion of the line width can be suppressed, which is not only preferable from the viewpoint of chemical resistance, but also excellent characteristics can be provided even when exposed at a high illuminance of 15,000 mW or more.

[0118] On the other hand, when the absorbance ratio according to the mathematical formula 1 is less than 0.3, the sensitivity in the composition becomes high, and as a result, the curing degree of the surface becomes high, and in a pattern of 8 μm or more, a large difference in the curing degree between the upper and lower parts occurs, and the undercut may deteriorate. In addition, when exposed at a high illuminance, the above problems may be further deteriorated, and a problem may occur in which a residual film at a level covering the non-exposed portion is generated. When the absorbance ratio according to the mathematical formula 1 exceeds 1.5, problems such as insufficient curing level, deterioration of chemical resistance, occurrence of swelling, and disappearance of fine patterns may occur.

[0119] In addition to the range of the absorbance ratio according to the above mathematical formula 1, when the range of the absorbance ratio according to the mathematical formula 2 is satisfied, the difference in the curing degree between the upper and lower parts is reduced, the shoulder shape of the taper that may be generated by the scattering of TiO2 is improved, no residual film of the cured film is generated, and since the CD-Bias can be easily adjusted, it is preferable.

[0120] <Partition structure and display device> The present invention provides a partition structure manufactured from the photosensitive resin composition for forming a partition wall, and a display device including the same.

[0121] In a display device including a color conversion panel, since each pixel is driven to form a hue, it is necessary to form a partition structure that can distinguish each pixel from other pixels. A display device including a partition structure formed using the photosensitive resin composition for forming partitions of the present invention can prevent color mixing between pixels, is advantageous for forming fine patterns, and can manufacture partitions with little line width change due to changes in development time in the development process. When the line width change of the partition is small, there is an advantage that the color conversion pixels can secure sufficient space and a high-quality image can be realized.

[0122] Further, it is preferable that the partition structure is formed with a height of 3 to 15 μm, preferably 3 to 10 μm.

[0123] Examples of the display device include, but are not limited to, a liquid crystal display device, an organic light-emitting diode, a flexible display, etc., and all display devices known in this field to which application is possible can be exemplified.

[0124] In order to manufacture a color conversion partition, the method commonly used in the art can be applied to the composition for forming partitions according to the present invention without particular limitation.

[0125] For example, the partition can be formed by applying the aforementioned composition on one surface of a substrate and forming a cured film through a photocuring and development process. The color conversion panel partition structure that distinguishes a color conversion pixel from other pixels can be formed by a photolithography process.

[0126] Specifically, for forming the partition, after applying each photosensitive resin composition on one surface of a substrate, it is dried by heating to remove volatile components such as a solvent, and a smooth cured film can be obtained.

[0127] The coating method of the composition is not particularly limited, and examples thereof include spin coating, casting coating method, roll coating method, slit and spin coating, or slit coating method.

[0128] After applying the composition, heat drying (pre-baking) is performed, or after drying under reduced pressure, heating is carried out to volatilize volatile components such as solvents. The heating temperature is usually 70 to 150 °C, preferably 80 to 130 °C, but is not limited thereto.

[0129] In order to form a target pattern on the coating film thus formed, ultraviolet rays are irradiated through a mask so that the irradiated portion of the ultraviolet rays is cured. At this time, in order to irradiate the entire exposed portion with parallel light rays uniformly and to adjust so that accurate alignment between the mask and the cured film substrate is made, it is preferable to use an apparatus such as a mask aligner or a stepper. As the ultraviolet rays, g-line (wavelength: 436 nm), h-line, i-line (wavelength: 365 nm), etc. can be used, and the irradiation amount of the ultraviolet rays can be appropriately selected as needed.

[0130] By bringing the cured coating film into contact with a developer and dissolving and developing the non-exposed portion, a cured film of the target pattern can be formed.

[0131] The cured film thus formed can be cured harder than the cured product by undergoing an additional heat curing process (post-baking, full baking). At this time, the heating temperature is 90 to 180 °C, and the heating time is 5 to 180 minutes, preferably 15 to 90 minutes, but is not limited thereto.

Example

[0132] Hereinafter, the present invention will be described in more detail with reference to examples. However, the following examples are for more specifically explaining the present invention, and the scope of the present invention is not limited by the following examples. The following examples can be appropriately modified and changed by those skilled in the art within the scope of the present invention. Also, “%” and “parts” indicating the content hereinafter are based on weight unless otherwise specified.

[0133] <Example> <Synthesis Example 1: Synthesis of Alkali-Soluble Resin> Into a flask equipped with a stirrer, thermometer, reflux condenser, dropping funnel, and nitrogen inlet tube, 100 parts by weight of propylene glycol monomethyl ether acetate, 100 parts by weight of propylene glycol monomethyl ether, 5 parts by weight of AIBN, 23.0 parts by weight of 2-ethylhexyl acrylate, 1.6 parts by weight of 4-methylstyrene, 46.0 parts by weight of glycidyl methacrylate, and 3 parts by weight of n-dodecyl mercaptan were charged. After nitrogen substitution, the temperature of the reaction solution was raised to 80 °C with stirring and reacted for 4 hours. Next, the temperature of the reaction solution was lowered to room temperature, and after further replacing the nitrogen inside the flask with air, 0.2 parts by weight of triethylamine, 0.1 parts by weight of 4-methoxyphenol, and 23.3 parts by weight of acrylic acid were charged and reacted at 100 °C for 6 hours. Then, the temperature of the reaction solution was lowered to room temperature, 6.0 parts by weight of succinic anhydride was charged, and then reacted at 80 °C for 6 hours to synthesize the alkali-soluble resin of Synthesis Example 1.

[0134] The alkali-soluble resin of Synthesis Example 1 had a solid content acid value of 32.8 mgKOH / g, a weight average molecular weight measured by GPC of about 6,350, and a glass transition temperature measured by a differential scanning calorimeter of -12 °C.

[0135] <Production of Photosensitive Resin Composition> Referring to the compositions and parts by weight described in Tables 1 to 3 below, colorants and photosensitive resin compositions according to Examples and Comparative Examples were produced. Also, the absorbances of the UV absorber and the photopolymerization initiator were measured with reference to a wavelength of 365 nm after dissolving them in PGMEA at a concentration of 0.05% by weight and calculated by substituting them into Mathematical Formulas 1 to 2 (in the case of two or more kinds, Mathematical Formulas 1-1 to 2-1).

[0136]

Table 1

[0137]

Table 2

[0138]

Table 3

[0139] - White pigment: TiO2 (Ti-Pure R-101, DuPont) - Dispersing resin: the resin of Synthesis Example 1 - Dispersant: DISPERBYK-2000 - B-1: Tinuvin 326 (benzotriazole-based UV absorber, BASF) - B-2: Tinuvin 328 (benzotriazole-based UV absorber, BASF) - B-3: Tinuvin 400 (triazine-based UV absorber, BASF) - B-4: Tinuvin 479 (triazine-based UV absorber, BASF) - B-5: Tinuvin 5100 (non-basic amino ether (NOR) hindered amine light stabilizer (HALS), BASF) - Alkali-soluble resin: the resin of Synthesis Example 1 - Photopolymerizable monomer: ethoxylated dipentaerythritol pentaacrylate (A-DPH-12E, Shin-Nakamura Chemical Co., Ltd.) - Photoinitiator: PBG-345 (TRONLY) - Thiol compound: TMMP-20P (Sakai Chemical Industry Co., Ltd.) - Solvent: PGMEA (propylene glycol monomethyl ether acetate) - Additive: F554 (DIC Corporation)

[0140] <Experimental Example> (1) Production of Partition Pattern Cured Film A 5 cm × 5 cm glass substrate (Corning) was washed with a neutral detergent and water, and then dried. On the glass substrate, each of the photosensitive resin compositions according to the examples and comparative examples was spin-coated so that the final film thickness became 10 μm, pre-baked at 80 °C, dried for 2 minutes, and the solvent was removed. Then, with a mask including a line / space pattern of 1 to 100 μm and a rectangular pattern with a width of 1 to 200 μm having a partition wall of 1 to 100 μm between the patterns, at an illuminance of 25,000 mW and an exposure dose of 100 mJ / cm 2 exposed, and the unexposed portions were removed using an aqueous alkali solution. After the produced cured film was developed for 200% of the development time, it was post-baked at 180 °C for 30 minutes to produce a cured film of a partition wall pattern with a thickness of 10 μm.

[0141] For the produced cured film of the partition wall pattern, the properties were evaluated according to the following evaluation criteria, and the results are shown in Table 4 below.

[0142] (2) Evaluation of taper characteristics Among the cured films of the partition wall patterns produced using the photosensitive resin compositions produced in the above examples and comparative examples, a 20-μm line pattern was cut, and the cross-section was observed. Using a scanning electron microscope (SEM, SU-8200, manufactured by Hitachi), the difference in length between the maximum line width and the minimum line width in the cross-section of the pattern was calculated and evaluated according to the following evaluation criteria.

[0143] <Evaluation criteria for taper characteristics> ◎: 0.5 μm or less ○: More than 0.5 and 2.0 μm or less △: More than 2.0 and 4.0 μm or less X: More than 4.0 μm

[0144] (3) Evaluation of CD-Bias Among the partition patterns produced from the photosensitive resin compositions according to the above Examples and Comparative Examples, a 20-μm pattern was cut, and the cross-section was observed. Using a scanning electron microscope (SEM, SU-8200, manufactured by Hitachi, Ltd.), the height and size of the pattern were measured. CD-bias is a value calculated from the difference between the pattern size of the mask and the actually produced pattern size, and CD-bias = (actual pattern size) - (mask size), and it was evaluated according to the following evaluation criteria.

[0145] <Evaluation Criteria for CD-Bias> ◎: 10 μm or less ○: More than 10 and 15 μm or less △: More than 15 and 20 μm or less X: More than 20 μm

[0146] (4) Evaluation of the Minimum Formation Mask Size The minimum formation mask size of the cured film of the partition pattern produced using the photosensitive resin compositions produced in the above Examples and Comparative Examples was evaluated according to the following evaluation criteria.

[0147] The smaller the size of the mask, the finer the pattern can be formed. However, there is a problem that pattern leakage is likely to occur and it is difficult to form a fine pattern. Therefore, the minimum formation mask size was evaluated by measuring the minimum size of the mask that can form a fine pattern without pattern leakage.

[0148] <Evaluation Criteria for the Minimum Formation Mask Size> ○: Less than 5 μm △: 5 or more and less than 9 μm X: 9 μm or more

[0149] (5) Evaluation of Swelling The baking temperature of the partition pattern produced from the photosensitive resin compositions according to the above Examples and Comparative Examples was changed to 85 °C, white-ink was dropped into the cured film produced, and after leaving it for 30 minutes, the presence or absence of swelling unevenness on the surface of the pattern was confirmed.

[0150] <Evaluation Criteria for Swelling> ○: No swelling occurs △: Weak swelling occurs X: Strong swelling occurs

[0151]

Table 4

[0152] Referring to Table 4 above, the cured film of the partition pattern manufactured using the photosensitive resin composition according to the examples can not only prevent the generation of residual film and residue during exposure at high illuminance, but also shows an excellent taper shape with a small line width difference of the taper, prevents problems such as undercut, is advantageous for the formation of fine patterns, and the effect of showing excellent swelling characteristics even during low-temperature curing can be confirmed.

[0153] In contrast, in the comparative examples where the value of the absorbance ratio according to Mathematical Formula 1 of the present invention does not satisfy 0.3 to 1.5, a large taper line width difference is shown during exposure at high illuminance, there are problems of poor taper shape and undercut generation, and it can be confirmed that the swelling characteristics are also inferior to those of the examples.

Claims

1. A photosensitive resin composition for forming a partition wall, comprising: (A) a colorant containing a white pigment, (B) a UV absorber, (C) an alkali-soluble resin, (D) a photopolymerizable compound, (E) a photopolymerization initiator, and (F) a solvent, wherein the UV absorber and the photopolymerization initiator at a wavelength of 365 nm, the value of the absorbance ratio according to the following Mathematical Formula 1 is 0.3 to 1.5, at a wavelength of 365 nm, the value of the absorbance ratio according to the following Mathematical Formula 2 is 0.2 to 1.0, which is characterized in that it is a photosensitive resin composition for forming a partition wall. 【Number 1】 (In the above Mathematical Formula 1, the weight percentage of the UV absorber and the weight percentage of the photopolymerization initiator each mean the weight percentage with respect to the total weight percentage of the photosensitive resin composition for forming a partition wall.) [Mathematical Formula 2] (Absorbance ratio based on the same content) = (Absorbance of the UV absorber) / (Absorbance of the photopolymerization initiator)

2. The photosensitive resin composition for forming a partition wall according to Claim 1, wherein the average particle size of the white pigment is 150 to 300 nm.

3. The white pigment contains titanium oxide (TiO ２ ), and the photosensitive resin composition for partition formation according to claim 1 is characterized by this.

4. The titanium oxide (TiO ２ ) has its surface treated with one or more selected from the group consisting of silicon oxide (SiO ２ ), aluminum oxide (Al ２ O ３ ), zirconium oxide (ZrO ２ ), and an organic substance. The photosensitive resin composition for partition formation according to claim 3, characterized in that it is so treated.

5. The photosensitive resin composition for forming a partition wall according to Claim 1, wherein the (A) colorant further contains one or more pigments selected from the group consisting of a black pigment, a red pigment, a yellow pigment, and a blue pigment.

6. The photosensitive resin composition for forming a partition wall according to Claim 1, wherein the white pigment is contained in an amount of 1 to 30% by weight based on the total weight of the (A) colorant of the photosensitive resin composition for forming a partition wall.

7. The photosensitive resin composition for forming a partition wall according to Claim 1, wherein the UV absorber contains one or more selected from the group consisting of benzotriazole-based, triazine-based, hindered amine-based (HALS, Hindered Amine Light Stabilizer), cyanoacrylate-based (Cyanoacrylate), and benzophenone-based UV absorbers.

8. The photosensitive resin composition for forming a partition wall according to Claim 1, wherein the UV absorber is contained in an amount of 0.05 to 10% by weight based on the total weight of the solid content of the photosensitive resin composition for forming a partition wall.

9. The photosensitive resin composition for forming a partition wall according to Claim 1, wherein the (C) alkali-soluble resin contains one or more of a cardo resin or an acrylic resin.

10. The photosensitive resin composition for forming a partition wall according to Claim 1, further comprising a thiol compound.

11. The photosensitive resin composition for partition formation according to claim 1, further comprising at least one additive selected from the group consisting of a filler, another polymer compound, a surfactant, an antioxidant, an adhesion promoter, and an anti-aggregation agent.

12. A partition structure produced from the photosensitive resin composition for partition formation according to any one of claims 1 to 11.

13. A display device including the partition structure according to claim 12.

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