Photosensitive composition, optical filter, image display device and solid-state imaging device

Abstract

To provide a photosensitive composition capable of forming a cured film having excellent pattern formability, excellent flatness and excellent durability even with low temperature curing.SOLUTION: There is provided a photosensitive composition comprising an alkali-soluble resin, a polymerizable compound and a photopolymerization initiator, wherein the polymerizable compound includes a polymerizable compound having three or more (meth)acryloyl groups and an amine structure and the photosensitive composition comprises a photopolymerization initiator represented by the following general formula. (R1 and R2 each independently represents a hydrogen atom or an alkyl group having 1 to 8 carbon atoms.)SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a photosensitive composition and its use. [Background technology]

[0002] Organic EL (Electro-Luminescence) display devices using organic light-emitting diodes (OLEDs) and other devices do not require backlighting, and are therefore lighter, thinner, more energy-efficient, and more flexible than liquid crystal display devices. As a result, they are used in a variety of applications, including smartphones, tablet devices, and televisions.

[0003] Since the heat resistance of the organic light-emitting layer used in an organic EL display device is generally low, it is preferable to cure the photosensitive composition for forming the optical filter used in the organic EL display device at a low temperature, for example, at 150° C. or less. However, when curing is performed at a low temperature, there is a problem that the curing does not proceed sufficiently and the resistance deteriorates.

[0004] Organic electroluminescence (EL) display devices also feature circular polarizers as anti-reflection films to prevent reduced visibility due to reflections of external light. However, circular polarizers are typically thick and lack flexibility, leading to the development of photosensitive compositions capable of forming optical filters in place of circular polarizers. Such photosensitive compositions have low colorant concentrations, which can easily transmit ultraviolet light when used to form optical filters using photolithography, resulting in problems such as increased line widths. Previously, methods to resolve these problems involved adjusting the amount of active radicals generated, i.e., adjusting the type and amount of photopolymerization initiator. For example, in the case of increased line widths, methods have been developed to reduce the amount of active radicals by using a photopolymerization initiator with low sensitivity or by reducing the amount used, thereby achieving an appropriate line width. However, this method has the problem of defects in the pattern shape, such as chipping or peeling of the pattern during the development process. Another problem is that the thickness of the coating film changes during the heating process (hereinafter referred to as the residual film rate). Furthermore, such optical filters are formed on colored patterns such as R (red), G (green), and B (blue), but there is also the problem that the thickness varies between areas with and without the colored patterns (hereinafter referred to as flatness).

[0005] To solve the above problems, for example, Patent Document 1 discloses a coloring composition containing a colorant including a red colorant, a resin having a repeating unit containing a blocked isocyanate group, a polymerizable compound, and a photopolymerization initiator, and in which the ratio of the maximum and minimum absorbance values at a specific wavelength is specified. Patent Document 2 also discloses a coloring composition containing a colorant, a polymer, and a polymerizable compound, in which at least one selected from the group consisting of the colorant, the polymer, and the polymerizable compound has a specific partial structure and a hydroxyl group. Patent Document 3 also discloses a blue photosensitive resin composition containing a blue pigment, a black pigment, an alkali-soluble resin, a photopolymerizable compound, a photopolymerization initiator, and a solvent. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] International Publication No. 2021 / 054248 [Patent Document 2] Patent Publication No. 2021-102759 [Patent Document 3] Japanese Patent Application Laid-Open No. 2017-187765 Summary of the Invention [Problem to be solved by the invention]

[0007] However, the compositions described in Patent Documents 1 to 3 have not been able to satisfy certain levels of pattern formability, flatness, and low-temperature curability.

[0008] An object of the present invention is to provide a photosensitive composition that can form a cured film that has excellent pattern formability and flatness and has excellent resistance even when cured at low temperatures. [Means for solving the problem]

[0009] The present invention provides a photosensitive composition comprising an alkali-soluble resin (A), a polymerizable compound (B), and a photopolymerization initiator (C), the polymerizable compound (B) contains a polymerizable compound (B1) having three or more (meth)acryloyl groups and an amine structure, The photosensitive composition includes the photopolymerization initiator (C) containing a photopolymerization initiator (C1) represented by the following general formula (1): General formula (1) [ka] (In general formula (1), R1 and R2 each independently represent a hydrogen atom or an alkyl group having 1 to 8 carbon atoms. R3 represents a hydrogen atom or a monovalent substituent.) [Effects of the Invention]

[0010] According to the present invention, there is provided a photosensitive composition capable of forming a cured film having excellent pattern formability and flatness, and excellent durability even when cured at low temperature. The present invention also provides an optical filter, an image display device, and a solid-state imaging device. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, embodiments for carrying out the photosensitive composition of the present invention will be described in detail. Note that the present invention is not limited to the following embodiments, and can be modified and carried out within a range that can solve the problems.

[0012] In this specification, unless otherwise specified, "(meth)acryloyl," "(meth)acrylic," "(meth)acrylic acid," "(meth)acrylate," or "(meth)acrylamide" means "acryloyl and / or methacryloyl," "acrylic and / or methacrylic," "acrylic acid and / or methacrylic acid," "acrylate and / or methacrylate," or "acrylamide and / or methacrylamide," respectively. Furthermore, "CI" refers to the Color Index (CI; published by The Society of Dyers and Colourists). The polymerizable unsaturated group is an ethylenically unsaturated double bond. Regarding the molecular weight of a compound in the present invention, for a low molecular weight compound whose molecular weight can be specified, the molecular weight is a calculated value (formula weight) or a molecular weight measured by ESI-MS (electrospray ionization mass spectrometry), and for a compound having a molecular weight distribution, the molecular weight is a weight average molecular weight in terms of polystyrene measured by gel permeation chromatography using tetrahydrofuran as a solvent. A monomer is a compound that polymerizes to form a resin. A monomer is in an unreacted state, and a monomer unit is a monomer that forms a resin after polymerization.

[0013] <Photosensitive composition> A photosensitive composition according to one embodiment of the present invention is a photosensitive composition comprising an alkali-soluble resin (A), a polymerizable compound (B), and a photopolymerization initiator (C), the polymerizable compound (B) contains a polymerizable compound (B1) having three or more (meth)acryloyl groups and an amine structure, The photopolymerization initiator (C) contains a photopolymerization initiator (C1) represented by the following general formula (1).

[0014] General formula (1) [ka]

[0015] In general formula (1), R1 and R2 each independently represent a hydrogen atom or an alkyl group having 1 to 8 carbon atoms, and R3 represents a hydrogen atom or a monovalent substituent.

[0016] The mechanism by which the photosensitive composition having the above-mentioned structure can solve the problems of the present invention is not clear, but is speculated as follows.

[0017] In photosensitive compositions, the photopolymerization initiator decomposes under light to generate active species. These active species then add to the polymerizable compound to generate new active species, which then progress in a chain reaction, resulting in polymerization. However, if these active species are inactivated by an external factor, the polymerization reaction stops. When the active species is a radical, oxygen inhibits polymerization (also known as oxygen inhibition). Oxygen is in a triplet state in the ground state, making it highly reactive with radicals, and it easily reacts with radical active species to form hydroxyperoxy radicals. These hydroxyperoxy radicals have poor reactivity with polymerizable compounds, inhibiting the polymerization reaction. Optical filters are usually manufactured in an atmospheric environment, so polymerization is inhibited by oxygen during the exposure process and does not proceed sufficiently, but polymerization is then promoted by subsequent high-temperature curing. However, in the case of low-temperature curing, it is necessary to allow polymerization to proceed sufficiently during the exposure process in order to obtain sufficient resistance. Polymerizable compounds (B1) containing three or more (meth)acryloyl groups and an amine structure have nitrogen atoms within their molecules, which facilitates the abstraction of hydrogen atoms and the generation of carbon radicals. Therefore, the generated hydroxyperoxy radicals abstract hydrogen atoms from polymerizable compounds (B1) containing three or more (meth)acryloyl groups and an amine structure, resulting in the newly generated carbon radicals initiating polymerization. Furthermore, the generated carbon radicals can capture oxygen, thereby reducing the oxygen concentration. Therefore, we speculate that polymerization inhibition by oxygen is suppressed, allowing the polymerization to proceed smoothly. Furthermore, we speculate that the use of photopolymerization initiator (C1) represented by general formula (1), which has a fluorene skeleton that is rigid, hydrophobic, and heat-resistant despite its low sensitivity, results in a cured film with minimal linewidth change and high durability.

[0018] Components that are or can be included in the photosensitive composition of one embodiment will be described in detail below.

[0019] [Alkali-soluble resin (A)] The photosensitive composition of the present invention contains an alkali-soluble resin (A).

[0020] The alkali-soluble resin (A) may be any resin that dissolves in an alkaline developer, and known resins can be used. The alkali-soluble resin (A) can be classified into photosensitive alkali-soluble resins and non-photosensitive alkali-soluble resins. The alkali-soluble resin (A) has an alkali-soluble group such as a carboxyl group, a phosphate group, a sulfonic acid group, a hydroxyl group, or a phenolic hydroxyl group. Among these, a carboxyl group is preferred. The alkali-soluble resin (A) may also contain a thermosetting group such as an epoxy group, an oxetanyl group, or an isocyanate group.

[0021] From the viewpoint of developability, the weight average molecular weight (Mw) of the alkali-soluble resin (A) is preferably 4,000 to 40,000, more preferably 4,000 to 35,000. The Mw / Mn value is preferably not more than 10. An appropriate weight average molecular weight (Mw) improves adhesion to the substrate and solubility in development.

[0022] The acid value of the alkali-soluble resin (A) is preferably from 30 to 200 mgKOH / g, more preferably from 40 to 180 mgKOH / g. A suitable acid value improves adhesion to a substrate and solubility in development.

[0023] The content of the alkali-soluble resin (A) is preferably from 1 to 80 mass %, more preferably from 5 to 60 mass %, particularly preferably from 10 to 50 mass %, based on 100 mass % of the nonvolatile content of the photosensitive composition.

[0024] The alkali-soluble resin (A) can be used alone or in combination of two or more kinds.

[0025] (photosensitive alkali-soluble resin) The photosensitive alkali-soluble resin is an alkali-soluble resin having a polymerizable unsaturated group. The resin is cured by irradiation with active energy rays, improving its resistance. The photosensitive alkali-soluble resin is not particularly limited, and known resins can be used. Examples include (meth)acrylic resins having a polymerizable unsaturated group, styrene / (meth)acrylic resins, and ethylene / (meth)acrylic acid copolymers.

[0026] From the viewpoint of durability, the photosensitive alkali-soluble resin is preferably a resin having an alicyclic hydrocarbon-containing monomer unit (a1) and a polymerizable unsaturated group-containing monomer unit (a2). It is presumed that the alicyclic hydrocarbon structure, which is highly hydrophobic and has both flexibility and rigidity, has low affinity with the developer and can form a tough cured film.

[0027] The photosensitive alkali-soluble resin may contain a monomer unit other than the alicyclic hydrocarbon-containing monomer unit (a1) and the polymerizable unsaturated group-containing monomer unit (a2). The monomer unit other than the alicyclic hydrocarbon-containing monomer unit (a1) and the polymerizable unsaturated group-containing monomer unit (a2) is not particularly limited and is a unit derived from a copolymerizable monomer. Examples thereof include a carboxyl group-containing monomer unit (a3), an epoxy group-containing monomer unit (a4), a hydroxyl group-containing monomer unit (a5), a blocked isocyanate group-containing monomer unit (a6), and other monomer units (a7).

[0028] [Alicyclic hydrocarbon-containing monomer unit (a1)] Examples of the alicyclic hydrocarbon-containing monomer include isobornyl (meth)acrylate, cyclohexyl (meth)acrylate, dicyclopentanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentanyloxyethyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, adamantyl (meth)acrylate, etc. Among these, dicyclopentanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, and dicyclopentanyloxyethyl (meth)acrylate are preferred.

[0029] [Polymerizable unsaturated group-containing monomer unit (a2)] Examples of the polymerizable unsaturated group-containing monomer unit (a2) include units introduced by the following methods (i) to (iii).

[0030] <Method (i)> There is a method (i) in which an epoxy group-containing monomer is added to the carboxyl group of a resin having a carboxyl group-containing monomer unit (a3) described later.

[0031] Examples of epoxy group-containing monomers include oxiranyl(meth)acrylate, glycidyl(meth)acrylate, 2-methylglycidyl(meth)acrylate, 2-ethylglycidyl(meth)acrylate, 2-oxiranylethyl(meth)acrylate, 2-glycidyloxyethyl(meth)acrylate, 3,4-epoxycyclohexyl(meth)acrylate, 3,4-epoxycyclohexylmethyl(meth)acrylate, 2-(3,4-epoxycyclohexyl)ethyl(meth)acrylate, 2-(3,4-epoxycyclohexylmethyloxy)ethyl(meth)acrylate, and 3-(3,4-epoxycyclohexylmethyloxy)propyl(meth)acrylate.

[0032] <Method (ii)> There is a method (ii) in which a carboxyl group-containing monomer is added to the epoxy group of a resin having an epoxy group-containing monomer unit (a4) described below.

[0033] Examples of the carboxyl group-containing monomer include acrylic acid, methacrylic acid, crotonic acid, itaconic acid, maleic acid, and fumaric acid.

[0034] Furthermore, a unit obtained by further reacting an acid anhydride with the hydroxyl group generated by the reaction of the method (i) or (ii) is also useful as the polymerizable unsaturated group-containing monomer unit (a2).

[0035] Examples of the acid anhydride include tetrahydrophthalic anhydride, phthalic anhydride, hexahydrophthalic anhydride, succinic anhydride, and maleic anhydride.

[0036] <Method (iii)> There is a method (iii) in which the hydroxyl group of a resin having a hydroxyl group-containing monomer unit (a5) described later is reacted with the isocyanate group of an isocyanate group-containing monomer.

[0037] Examples of the isocyanate group-containing monomer include 2-(meth)acryloylethyl isocyanate, 2-(meth)acryloyloxyethyl isocyanate, and 1,1-bis[methacryloyloxy]ethyl isocyanate.

[0038] [Carboxyl group-containing monomer unit (a3)] Examples of the carboxyl group-containing monomer include acrylic acid, methacrylic acid, crotonic acid, itaconic acid, maleic acid, fumaric acid, etc. Among these, acrylic acid and methacrylic acid are preferred.

[0039] [Epoxy group-containing monomer unit (a4)] Examples of epoxy group-containing monomers include oxiranyl(meth)acrylate, glycidyl(meth)acrylate, 2-methylglycidyl(meth)acrylate, 2-ethylglycidyl(meth)acrylate, 2-oxiranylethyl(meth)acrylate, 2-glycidyloxyethyl(meth)acrylate, 3,4-epoxycyclohexyl(meth)acrylate, 3,4-epoxycyclohexylmethyl(meth)acrylate, 2-(3,4-epoxycyclohexyl)ethyl(meth)acrylate, 2-(3,4-epoxycyclohexylmethyloxy)ethyl(meth)acrylate, and 3-(3,4-epoxycyclohexylmethyloxy)propyl(meth)acrylate.

[0040] [Hydroxyl group-containing monomer unit (a5)] Examples of hydroxyl group-containing monomers include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 2,3-hydroxypropyl (meth)acrylate, glycerol mono(meth)acrylate, cyclohexanedimethanol mono(meth)acrylate, 2-hydroxy-3-phenoxypropyl acrylate, and 2-acryloyloxyethyl-2-hydroxyethyl phthalate.

[0041] [Blocked isocyanate group-containing monomer unit (a6)] A blocked isocyanate group-containing monomer is a monomer in which the isocyanate group of an isocyanate group-containing monomer is protected with a compound that is released by heat (hereinafter also referred to as a blocking agent).

[0042] Examples of isocyanate group-containing monomers include 2-isocyanatoethyl (meth)acrylate, 2-isocyanatopropyl (meth)acrylate, 3-isocyanatopropyl (meth)acrylate, 2-isocyanato-1-methylethyl (meth)acrylate, 2-isocyanato-1,1-dimethylethyl (meth)acrylate, 4-isocyanatocyclohexyl (meth)acrylate, and methacryloyl isocyanate. Equimolar reaction products of 2-hydroxyalkyl (meth)acrylate and diisocyanate compounds can also be used. Among these, 2-isocyanatoethyl (meth)acrylate and 2-isocyanatopropyl (meth)acrylate are preferred.

[0043] Examples of the blocking agent include oxime compounds, lactam compounds, phenol compounds, alcohol compounds, amine compounds, active methylene compounds, pyrazole compounds, mercaptan compounds, imidazole compounds, imide compounds, urea compounds, imine compounds, and bisulfite compounds.

[0044] Specific examples of the oxime compound include formaldoxime, acetaldoxime, acetoxime, methyl ethyl ketoxime, methyl isobutyl ketoxime, cyclohexanone oxime, and benzophenone oxime, with methyl ethyl ketoxime being preferred. Examples of lactam compounds include ε-caprolactam, δ-valerolactam, γ-butyrolactam, and β-propiolactam. Examples of phenolic compounds include phenol, cresol, 2,6-xylenol, 3,5-xylenol, ethylphenol, p-tert-butylphenol, nonylphenol, methyl 2-hydroxybenzoate, methyl 4-hydroxybenzoate, p-naphthol, and p-nitrophenol, with 3,5-xylenol, methyl 2-hydroxybenzoate, and methyl 4-hydroxybenzoate being preferred. Examples of the alcohol compound include methanol, ethanol, propanol, butanol, ethylene glycol, methyl cellosolve, butyl cellosolve, methyl carbitol, benzyl alcohol, phenyl cellosolve, and furfuryl alcohol. Examples of the amine compound include diphenylamine, phenylnaphthylamine, aniline, and carbazole. Examples of the active methylene compound include dimethyl malonate, diethyl malonate, methyl acetoacetate, ethyl acetoacetate, and acetylacetone, with diethyl malonate being preferred. Examples of the pyrazole compound include pyrazole, methylpyrazole, and 3,5-dimethylpyrazole, with 3,5-dimethylpyrazole being preferred. Examples of the mercaptan compound include butyl mercaptan, thiophenol, and tert-dodecyl mercaptan. Examples of the imidazole compound include imidazole, 2-methylimidazole, 2-ethylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, and 1-benzyl-2-phenylimidazole. Examples of the imide compound include succinimide, maleimide, maleimide, and phthalimide. Examples of the urea compound include urea, thiourea, and ethylene urea. Examples of the imine compound include ethyleneimine and polyethyleneimine. Examples of bisulfite compounds include sodium bisulfite, potassium bisulfite, etc. These blocking agents can be used alone or in combination of two or more.

[0045] The blocking agent is preferably at least one selected from the group consisting of oxime compounds, lactam compounds, phenol compounds, alcohol compounds, amine compounds, active methylene compounds, pyrazole compounds, mercaptan compounds, imidazole compounds, and imide compounds, and from the viewpoint of the protection reaction and the deprotection reaction, it is more preferably at least one selected from the group consisting of oxime compounds, phenol compounds, active methylene compounds, and pyrazole compounds.

[0046] Examples of the blocked isocyanate group-containing monomer include the following compounds, but the present invention is not limited to these.

[0047] [ka]

[0048] Commercially available blocked isocyanate group-containing monomers include Karenz MOI-DEM (blocking agent desorption temperature: 85 to 95°C), MOI-BP (blocking agent desorption temperature: 105 to 115°C), and MOI-BM (blocking agent desorption temperature: 125 to 135°C), all manufactured by Showa Denko K.K.

[0049] [Other monomer units (a7)] Examples of other monomers include acrylic acid esters such as methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, lauryl (meth)acrylate, benzyl (meth)acrylate, phenoxyethyl (meth)acrylate, phenoxydiethylene glycol (meth)acrylate, ethylene oxide (EO)-modified (meth)acrylate of phenol, EO- or propylene oxide (PO)-modified (meth)acrylate of nonylphenol, EO- or PO-modified (meth)acrylate of paracumylphenol, dimethylaminoethyl (meth)acrylate, and diethylaminoethyl (meth)acrylate; Aromatic vinyl compounds such as styrene, α-methylstyrene, p-vinyltoluene, p-chlorostyrene, and vinylnaphthalene; (meth)acrylamides such as (meth)acrylamide, N,N-dimethyl(meth)acrylamide, N,N-diethyl(meth)acrylamide, N-isopropyl(meth)acrylamide, diacetone(meth)acrylamide, or acryloylmorpholine; vinyl ethers such as ethyl vinyl ether, n-propyl vinyl ether, isopropyl vinyl ether, n-butyl vinyl ether, or isobutyl vinyl ether; vinyl fatty acid vinyl compounds such as vinyl acetate or vinyl propionate; Phenylmaleimide, methylmaleimide, ethylmaleimide, 1,2-bismaleimidoethane, 1,6-bismaleimidohexane, 3-maleimidopropionic acid, 6,7-methylenedioxy-4-methyl-3-maleimidocoumarin, 4,4'-bismaleimidodiphenylmethane, bis(3-ethyl-5-methyl-4-maleimidophenyl)methane, N,N'-1,3-phenylenedimaleimide, N,N'-1,4-phenylenedimaleimide, N-(1-pyrenyl)maleimide, N-(2,4,6-trichlorophenyl)maleimide N-substituted maleimides such as N-(4-aminophenyl)maleimide, N-(4-nitrophenyl)maleimide, N-benzylmaleimide, N-bromomethyl-2,3-dichloromaleimide, N-succinimidyl-3-maleimidobenzoate, N-succinimidyl-3-maleimidopropionate, N-succinimidyl-4-maleimidobutyrate, N-succinimidyl-6-maleimidohexanoate, N-[4-(2-benzimidazolyl)phenyl]maleimide, and 9-maleimidoacridine; Examples include dimethyl-2,2'-[oxybis(methylene)]bis-2-propenoate, diethyl-2,2'-[oxybis(methylene)]bis-2-propenoate, di(n-propyl)-2,2'-[oxybis(methylene)]bis-2-propenoate, di(isopropyl)-2,2'-[oxybis(methylene)]bis-2-propenoate, di(2-ethylhexyl)-2,2'-[oxybis(methylene)]bis-2-propenoate, etc. These monomers can be used alone or in combination of two or more.

[0050] (Non-photosensitive alkali-soluble resin) The non-photosensitive alkali-soluble resin is not particularly limited, and known resins can be used, such as (meth)acrylic resin, α-olefin / maleic anhydride copolymer, styrene / styrene sulfonic acid copolymer, ethylene / (meth)acrylic acid copolymer, and isobutylene / maleic anhydride copolymer.

[0051] From the viewpoint of durability, the non-photosensitive alkali-soluble resin is preferably a resin having the above-mentioned alicyclic hydrocarbon-containing monomer unit (a1).

[0052] The non-photosensitive alkali-soluble resin may contain a monomer unit other than the alicyclic hydrocarbon-containing monomer unit (a1), such as the above-mentioned monomer units (a3) to (a7).

[0053] The alkali-soluble resin (A) can be produced by any known method without any particular limitation, for example, by the method described in "Experimental Methods of Polymer Synthesis" (written by Takayuki Otsu, published by Kagaku Dojin Co., Ltd. in 1972) and the cited literature.

[0054] [Polymerizable compound (B)] (Polymerizable Compound (B1) Having Three or More (Meth)acryloyl Groups and an Amine Structure) The photosensitive composition of the present invention contains, as the polymerizable compound (B), a polymerizable compound (B1) having three or more (meth)acryloyl groups and an amine structure (hereinafter also simply referred to as polymerizable compound (B1)).

[0055] The amine structure contained in the polymerizable compound (B1) may be any of a primary amine, secondary amine, and tertiary amine structure, but is preferably a tertiary amine, provided that the amine structure contained in the polymerizable compound (B1) does not include an amide structure, an imide structure, or a urethane structure in which a carbonyl group is directly bonded to a nitrogen atom.

[0056] The number of (meth)acryloyl groups in the polymerizable compound (B1) is not particularly limited as long as it is 3 or more, but from the viewpoint of pattern formability, the upper limit is preferably 18 or less.

[0057] The polymerizable compound (B1) can be used alone or in combination of two or more kinds.

[0058] The content of the polymerizable compound (B1) is preferably from 5 to 80 mass %, more preferably from 10 to 60 mass %, in 100 mass % of the polymerizable compound (B) from the viewpoint of pattern formability and resistance.

[0059] The polymerizable compound (B1) may be an appropriately synthesized compound or a commercially available product.

[0060] Specific examples of the polymerizable compound (B1) include tris(acryloyloxyethyl)amine, tris(methacryloyloxyethyl)amine, tris(2-hydroxy-3-methacryloyloxypropyl)amine, and a Michael addition reaction product of a (meth)acrylate compound (X) and an amine compound (Y).

[0061] The (meth)acrylate compound (X) is not particularly limited, and known compounds can be used. For example, glycerin tri(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, ditrimethylolpropane tri(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, dipentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, diglycerin tri(meth)acrylate, acrylate, diglycerin tetra(meth)acrylate, trimethylolpropane alkylene oxide-modified tri(meth)acrylate, ditrimethylolpropane alkylene oxide-modified tri- and tetra(meth)acrylate, pentaerythritol alkylene oxide-modified tri- and tetra(meth)acrylate, diglycerin alkylene oxide-modified tri- and tetra(meth)acrylate, dipentaerythritol alkylene oxide-modified tetra-, penta-, and hexa(meth)acrylate, and the like. Examples of the alkylene oxide unit in the alkylene oxide modification include ethylene oxide, propylene oxide, and butylene oxide. The (meth)acrylate compound (X) also includes a (meth)acrylate compound having an acidic group.

[0062] The (meth)acrylate compound (X) can be used alone or in combination of two or more kinds.

[0063] The amine compound (Y) is not particularly limited, and known compounds can be used, such as primary amines such as n-propylamine, n-butylamine, n-hexylamine, benzylamine, aminocaproic acid, monoethanolamine, 2-(2-aminoethoxy)ethanol, o-aminophenol, m-aminophenol, and p-aminophenol; Examples of the secondary amines include dimethylamine, diethylamine, dipropylamine, diisopropylamine, dibutylamine, cyclohexylamine, morpholine, piperidine, 1-methylpiperazine, proline, N-merylethanolamine, N-acetylethanolamine, diethanolamine, 3-anilinephenol, and 4-anilinephenol.

[0064] The amine compound (Y) can be used alone or in combination of two or more kinds.

[0065] The method for producing the Michael addition reaction product of the (meth)acrylate compound (X) and the amine compound (Y) is not particularly limited, and known methods can be used, such as those described in International Publication No. 2006 / 075754, JP-A No. 2008-545859, and JP-A No. 2017-066347.

[0066] The polymerizable compound (B1) may have an acidic group and / or a hydroxyl group. Examples of a method for introducing the acidic group and / or the hydroxyl group include a method using a compound having an acidic group and / or a hydroxyl group in the (meth)acrylate compound (X) or the amine compound (Y), and a method of adding an acid anhydride after a Michael addition reaction.

[0067] Commercially available polymerizable compounds (B1) include Aronix MT-3041 and MT-3042 manufactured by Toagosei Co., Ltd.

[0068] (Polymerizable compound (B2) other than polymerizable compound (B1) having three or more (meth)acryloyl groups and an amine structure) From the viewpoint of pattern formability, the photosensitive composition of the present invention preferably contains, as the polymerizable compound (B), a polymerizable compound (B2) other than the compound (B1) having three or more (meth)acryloyl groups and an amine structure (hereinafter also simply referred to as polymerizable compound (B2)).

[0069] Examples of the polymerizable compound (B2) include methyl (meth)acrylate, ethyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, cyclohexyl (meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, polyethylene glycol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, triethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, phenoxytetraethylene glycol (meth)acrylate, phenoxyhexaethylene glycol (meth)acrylate, trimethylolpropane PO-modified tri(meth)acrylate, trimethylolpropane EO-modified tri(meth)acrylate, isocyanuric acid EO-modified di(meth)acrylate, isocyanuric acid EO-modified tri(meth)acrylate, ditrimethylolpropane Examples of the acrylic acid ester include tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, 1,6-hexanediol diglycidyl ether di(meth)acrylate, bisphenol A diglycidyl ether di(meth)acrylate, neopentyl glycol diglycidyl ether di(meth)acrylate, dipentaerythritol hexa(meth)acrylate, dipentaerythritol penta(meth)acrylate, tricyclodecanyl (meth)acrylate, (meth)acrylic acid ester of methylolated melamine, and various acrylic acid esters and methacrylic acid esters such as epoxy (meth)acrylate, styrene, vinyl acetate, hydroxyethyl vinyl ether, ethylene glycol divinyl ether, pentaerythritol trivinyl ether, (meth)acrylamide, N-hydroxymethyl (meth)acrylamide, N-vinylformamide, and acrylonitrile. Other examples include polymerizable compounds having an acidic group, polymerizable compounds having a urethane bond, polymerizable compounds having a dendrimer structure or a hyperbranched structure, lactone-modified polymerizable compounds, polymerizable compounds having a fluorene structure, etc. Among these, it is more preferable to include a polymerizable compound having an acidic group.

[0070] Examples of polymerizable compounds having an acidic group include esters of dicarboxylic acids and poly(meth)acrylates containing free hydroxyl groups formed from polyhydric alcohols and (meth)acrylic acid; and esters of polycarboxylic acids and monohydroxyalkyl (meth)acrylates.

[0071] Examples of the polyhydric alcohol include ethylene glycol, propylene glycol, polyethylene glycol, polypropylene glycol, glycerin, trimethylolpropane, ditrimethylolpropane, pentaerythritol, and dipentaerythritol.

[0072] Examples of the dicarboxylic acids include malonic acid, succinic acid, maleic acid, glutaric acid, phthalic acid, itaconic acid, and the like.

[0073] Examples of the polycarboxylic acid include trimellitic acid and pyromellitic acid. Examples of monohydroxyalkyl (meth)acrylates include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, pentaerythritol triacrylate, and 2-hydroxy-3-acryloyloxypropyl methacrylate.

[0074] Commercially available polymerizable compounds having an acidic group include Viscoat #2500P manufactured by Osaka Organic Chemical Industry Co., Ltd., and Aronix M-5300, M-5400, M-5700, M-510, M-520, and M-521 manufactured by Toagosei Co., Ltd.

[0075] Examples of polymerizable compounds having a urethane bond include urethane (meth)acrylates obtained by reacting a (meth)acrylate having a hydroxyl group with a polyfunctional isocyanate, and urethane (meth)acrylates obtained by reacting a polyhydric alcohol with a polyfunctional isocyanate and then reacting the resulting mixture with a (meth)acrylate having a hydroxyl group.

[0076] Examples of the (meth)acrylate having a hydroxyl group include 2-hydroxyethyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, trimethylolpropane di(meth)acrylate, pentaerythritol tri(meth)acrylate, ditrimethylolpropane tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol ethylene oxide-modified penta(meth)acrylate, dipentaerythritol propylene oxide-modified penta(meth)acrylate, dipentaerythritol caprolactone-modified penta(meth)acrylate, glycerol acrylate methacrylate, glycerol dimethacrylate, 2-hydroxy-3-acryloylpropyl methacrylate, a reaction product of an epoxy group-containing compound and a carboxy(meth)acrylate, and a hydroxyl group-containing polyol polyacrylate.

[0077] Examples of the polyfunctional isocyanate include aromatic diisocyanates such as tolylene diisocyanate, diphenylmethylene diisocyanate, and xylene diisocyanate; aliphatic diisocyanates such as trimethylene diisocyanate, tetramethylene diisocyanate, and hexamethylene diisocyanate; alicyclic diisocyanate such as isophorone diisocyanate; and biuret derivatives, isocyanate nurate derivatives, and trimethylolpropane adducts thereof.

[0078] The polymerizable compound having a urethane bond preferably further has an acidic group. Examples of the acidic group include a sulfonic acid group, a carboxyl group, and a phosphate group. Among these, a carboxyl group is preferred.

[0079] The acidic group can be introduced into a polymerizable compound having a urethane bond by, for example, first reacting the (meth)acrylate having a hydroxyl group with the polyfunctional isocyanate, and then adding a mercapto compound having a carboxyl group to the product.

[0080] Examples of the mercapto compound having a carboxyl group include mercaptoacetic acid, 2-mercaptopropionic acid, 3-mercaptopropionic acid, o-mercaptobenzoic acid, 2-mercaptonicotinic acid, and mercaptosuccinic acid.

[0081] Examples of commercially available polymerizable compounds having a urethane bond include AH-600, UA-306H, UA-306T, UA-306I, and UA-510H manufactured by Kyoeisha Chemical Co., Ltd., EBECRYL1290, EBECRYL5129, KRM8904, and KRM8452 manufactured by Daicel-Allnex Corporation, and NK Oligo UA-1100H, UA-33H, U-10HA, and U-15HA manufactured by Shin-Nakamura Chemical Co., Ltd.

[0082] Commercially available polymerizable compounds having a dendrimer structure or a hyperbranched structure include, for example, Viscoat #1000LT (dendrimer structure, average number of acryloyl groups: 14) manufactured by Osaka Organic Chemical Industry Co., Ltd., Miramer SP-1106 (dendrimer structure, average number of acryloyl groups: 18) and Miramer SP-1108 (dendrimer structure, average number of acryloyl groups: 13) manufactured by Miwon Specialty Chemical Co., Ltd., CN2301 (hyperbranched structure, average number of acryloyl groups: 9), CN2302 (hyperbranched structure, average number of acryloyl groups: 16), CN2303 (hyperbranched structure, average number of acryloyl groups: 6), and CN2304 (hyperbranched structure, average number of acryloyl groups: 18) manufactured by SARTOMER Co., Ltd., and Eternal Examples include Etercure 6361-100 (hyperbranched structure, average number of acryloyl groups: 8), Etercure 6362-100 (hyperbranched structure, average number of acryloyl groups: 12), Etercure 6363 (hyperbranched structure, average number of acryloyl groups: 16), and Etercure DR-E522 (hyperbranched structure, average number of acryloyl groups: 15), all manufactured by Materials Corporation.

[0083] Examples of lactone-modified polymerizable compounds include compounds obtained by esterifying polyhydric alcohols such as trimethylolethane, ditrimethylolethane, trimethylolpropane, ditrimethylolpropane, pentaethylthritol, tripentaerythritol, glycerin, diglycerol, and trimetrolmelamine with (meth)acrylic acid and ε-caprolactone or other lactone compounds.

[0084] Commercially available lactone-modified polymerizable compounds include, for example, KAYARAD DPCA-20, DPCA-30, DPCA-60, and DCPA-120 manufactured by Nippon Kayaku Co., Ltd.

[0085] Commercially available polymerizable compounds having a fluorene structure include, for example, OGSOL EA-0200, EA-0300, GA-5060P, and GA-2800 manufactured by Osaka Gas Chemicals Co., Ltd., and Miramer HR6060, HR6100, and HR6200 manufactured by Miwon Specialty Chemical Co., Ltd.

[0086] From the viewpoint of pattern formability and flatness, the content of the polymerizable compound (B) is preferably 40 to 90 mass %, more preferably 50 to 80 mass %, based on 100 mass % of the nonvolatile content of the photosensitive composition.

[0087] [Photopolymerization initiator (C)] (Photopolymerization initiator (C1) represented by general formula (1)) The photosensitive composition of the present invention contains, as the photopolymerization initiator (C), a photopolymerization initiator (C1) represented by general formula (1) (hereinafter, also simply referred to as photopolymerization initiator (C1)).

[0088] General formula (1) [ka]

[0089] R1 and R2 each independently represent a hydrogen atom or an alkyl group having 1 to 8 carbon atoms. The alkyl group having 1 to 8 carbon atoms may be linear, branched, or cyclic, or may be a combination of these, and examples thereof include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a t-butyl group, a pentyl group, an isopentyl group, a hexyl group, a heptyl group, an octyl group, a 2-ethylhexyl group, a cyclopentyl group, a cyclopentylmethyl group, a cyclohexyl group, a cyclohexylmethyl group, a cyclohexylmethyl group, etc. Of these, from the viewpoints of suppressing water stains and pattern shape, a linear alkyl group having 3 to 8 carbon atoms is preferred, and a linear alkyl group having 4 to 6 carbon atoms is more preferred.

[0090] R3 represents a hydrogen atom or any monovalent substituent. Examples of the monovalent substituent include alkyl groups having 1 to 20 carbon atoms, such as methyl and ethyl; alkoxy groups having 1 to 20 carbon atoms, such as methoxy and ethoxy; halogen atoms, such as F, Cl, Br, and I; acyl groups having 1 to 20 carbon atoms; alkyl ester groups having 1 to 20 carbon atoms; alkoxycarbonyl groups having 1 to 20 carbon atoms; halogenated alkyl groups having 1 to 20 carbon atoms, aromatic ring groups having 4 to 20 carbon atoms; amino groups; aminoalkyl groups having 1 to 20 carbon atoms; hydroxyl groups; nitro groups; cyano groups; optionally substituted benzoyl groups; and optionally substituted thenoyl groups. Substituents that the benzoyl group or thenoyl group may have include alkyl groups having 1 to 10 carbon atoms, alkoxy groups having 1 to 10 carbon atoms, and alkoxycarbonyl groups having 1 to 10 carbon atoms. Among these, from the viewpoint of radical generation efficiency, a hydrogen atom and a nitro group are preferred, and a hydrogen atom is more preferred.

[0091] Examples of methods for producing the photopolymerization initiator (C1) represented by general formula (1) include those described in JP-A-2019-507108 and JP-A-2019-528331.

[0092] Specific examples of the photopolymerization initiator (C1) represented by general formula (1) are shown below, but the present invention is not limited to these.

[0093] Chemical formula (2) [ka]

[0094] Chemical formula (3) [ka]

[0095] Chemical formula (4) [ka]

[0096] Among the compounds of chemical formulas (2) to (4), the photopolymerization initiator of chemical formula (2) is preferred from the viewpoint of pattern formability.

[0097] The photopolymerization initiator (C1) represented by the general formula (1) can be used alone or in combination of two or more kinds.

[0098] The content of the photopolymerization initiator (C1) represented by general formula (1) is preferably 4 to 12 parts by mass, more preferably 5 to 10 parts by mass, per 100 parts by mass of the polymerizable compound (B) from the viewpoints of pattern formability and resistance. The content of the photopolymerization initiator (C1) represented by the general formula (1) is preferably from 90 to 100 mass %, more preferably from 95 to 100 mass %, in 100 mass % of the photopolymerization initiator (C).

[0099] (Photopolymerization initiator (C2) other than the photopolymerization initiator (C1) represented by general formula (1)) The photosensitive composition of the present invention may contain, as the photopolymerization initiator (C), a photopolymerization initiator (C2) other than the photopolymerization initiator (C1) represented by general formula (1) (hereinafter, also simply referred to as photopolymerization initiator (C2)).

[0100] The photopolymerization initiator (C2) is not particularly limited as long as it is a compound that can initiate polymerization of the polymerizable compound (B) by light, and known photopolymerization initiators can be used.

[0101] Specific examples of the photopolymerization initiator (C2) include acetophenone-based compounds such as 4-phenoxydichloroacetophenone, 4-t-butyl-dichloroacetophenone, diethoxyacetophenone, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-(dimethylamino)-1-[4-(4-morpholino)phenyl]-2-(phenylmethyl)-1-butanone, and 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone; benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, or benzil dimethyl ketal; benzophenone compounds such as benzophenone, benzoylbenzoic acid, methyl benzoylbenzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4-benzoyl-4'-methyldiphenyl sulfide, or 3,3',4,4'-tetra(t-butylperoxycarbonyl)benzophenone; triazine-based compounds such as 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, 2-piperonyl-4,6-bis(trichloromethyl)-s-triazine, 2,4-bis(trichloromethyl)-6-styryl-s-triazine, 2-(naphth-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxy-naphth-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2,4-trichloromethyl-(piperonyl)-6-triazine, or 2,4-trichloromethyl-(4'-methoxystyryl)-6-triazine; acylphosphine oxide compounds such as 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, and diphenyl-2,4,6-trimethylbenzoylphosphine oxide; Oxime compounds such as 1,2-octanedione, 1-[4-(phenylthio)phenyl-, 2-(O-benzoyloxime)], or ethanol, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-, 1-(O-acetyloxime); 2,2'-bis(o-chlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(o-bromophenyl))4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(o,p-dichlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(o-chlorophenyl)-4,4',5,5'-tetra(m-methoxyphenyl)biimidazole, 2,2'-bis( biimidazole compounds such as 2,2'-bis(o-dichlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(o-nitrophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(o-methylphenyl)-4,4',5,5'-tetraphenylbiimidazole, and 2,2'-bis(o-trifluorophenyl)-4,4',5,5'-tetraphenylbiimidazole.

[0102] Examples of commercially available photopolymerization initiators (C2) include Omnirad 907, 369, 379EG, 819, 1312, 1314, 1316, and TPO manufactured by IGM Resins, IRGACURE OXE-01, 02, 03, and 04 manufactured by BASF Japan, Adeka Arcles N-1919, NCI-730, 831, and 930 manufactured by ADEKA, TRONLY TR-PBG-301, 304, 305, 309, 314, 345, 358, 380, 365, 610, 3054, and 3057 manufactured by Changzhou Strong New Materials Co., Ltd., SPI-02, 03, 04, 05, 06, and 07 manufactured by Samyang Corporation, and DFI-020, 306, and EOX-01 manufactured by Daito Chemistry Co., Ltd.

[0103] The photopolymerization initiator (C2) can be used alone or in combination of two or more kinds.

[0104] The content of the photopolymerization initiator (C2) is preferably 10% by mass or less, and more preferably 5% by mass or less, based on 100% by mass of the photopolymerization initiator (C).

[0105] The content of the photopolymerization initiator (C) is preferably from 0.5 to 20 mass %, more preferably from 1 to 10 mass %, based on 100 mass % of the nonvolatile content of the photosensitive composition.

[0106] [Colorant (D)] The photosensitive composition of the present invention may contain a colorant (D), which makes it possible to control the transmittance of each wavelength region of the optical filter and improves color separation.

[0107] The colorant (D) may be a pigment or a dye, and from the viewpoints of light resistance, heat resistance, and solvent resistance, a pigment is preferred.

[0108] (pigment) The pigment is preferably a compound classified as a pigment in the Color Index. Red pigments include, for example, CI Pigment Red 1, 2, 3, 4, 5, 6, 7, 8, 9, 12, 14, 15, 16, 17, 21, 22, 23, 31, 32, 37, 38, 41, 47, 48, 48:1, 48:2, 48:3, 48:4, 49, 49:1, 49:2, 50:1, 52:1, 52:2, 53, 53:1, 53:2, 53:3, 57, 57:1, 57:2, 58:4, 60, 63, 63:1, 63:2, 64, 64:1, 68, 69, 81, 81:1, 81:2, 81:3, 81:4, 83, 88, 90:1, 101, 101:1, 104, 108, 108:1, 109, 112, 113, 114, 122, 123, 144, 146, 147, 149, 151, 166, 168, 169, 170, 172, 173, 174, 175, 176, 177, 178, 179 ,181,184,185,187,188,190,193,194,200,202,206,207,208,209,210,214,216,220,221,224,230,231,232,233,235,236,237,238,239,242,243,245,247,249,250,251,253,254,255,256,257,258,259, 260, 262, 263, 264, 265, 266, 267, 268, 269, 270, 271, 272, 273, 274, 275, 276, 277, 278, 279, 280, 281, 282, 283, 284, 285, 286, 287, 291, 295, 296, JP 2014-134712 A, and the pigments described in Japanese Patent No. 6368844. Among these, from the viewpoints of heat resistance, light fastness, and transmittance, CI Pigment Red 48:1,122,177,224,242,269,254,291,295,296, the pigments described in JP-A-2014-134712, and the pigments described in Japanese Patent No. 6368844 are preferred, and CI Pigment Red 177,254,291,295,296, the pigments described in JP-A-2014-134712, and the pigments described in Japanese Patent No. 6368844 are more preferred.

[0109] Examples of orange pigments include CI Pigment Orange 36, 38, 43, 64, 71, and 73.

[0110] Yellow pigments include, for example, CI Pigment Yellow 1, 2, 3, 4, 5, 6, 10, 12, 13, 14, 15, 16, 17, 18, 24, 31, 32, 34, 35, 35:1, 36, 36:1, 37, 37:1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, 120, 123, 126, 127, 128, 129, 138, 139, 147, 150, 151, 152, 153, 154, 155, 156, 157, 158, 159, 160, 161, 162, 163, 164, 165, 166, 167, 168, 169, 170, 171, 172, 173, 174, 175, 176, 177, 178, 179, 180, 181, 182, 183, 184, 185, 186, 187, 188, 189, 190, 1,152, 153,154,155,156,161,162,164,166,167,168,169,170,171,172,173,174,175,176,177,179,180,181,182,185,187,188,192,193,194,196,198,199,213,214,231,233, JP 2012-226110 A, JP 2017-171912 A, JP 2017-171913 A, JP 2017-171914 A, JP 2017-171915 A, and the like. Among these, CI Pigment Yellows 138, 139, 150, 185, 231, and 233, and the pigments described in JP-A-2012-226110 are preferred.

[0111] Examples of green pigments include CI Pigment Green 1, 2, 4, 7, 8, 10, 13, 14, 15, 17, 18, 19, 26, 36, 37, 45, 48, 50, 51, 54, 55, 58, 59, 62, and 63. Among these, CI Pigment Green 36, 58, 59, 62, and 63 are preferred.

[0112] Examples of blue pigments include CI Pigment Blue 1, 1:2, 9, 14, 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 17, 19, 25, 27, 28, 29, 33, 35, 36, 56, 56:1, 60, 61, 61:1, 62, 63, 66, 67, 68, 71, 72, 73, 74, 75, 76, 78, and 79. Among these, CI Pigment Blue 15, 15:1, 15:2, 15:3, 15:4, and 15:6 are preferred.

[0113] Examples of purple pigments include CI Pigment Violet 1, 1:1, 2, 2:2, 3, 3:1, 3:3, 5, 5:1, 14, 15, 16, 19, 23, 25, 27, 29, 31, 32, 37, 39, 42, 44, 47, 49, and 50. Among these, CI Pigment Violet 19 and 23 are preferred.

[0114] Specific examples of black pigments include CI Pigment Black 1, 6, 7, 12, 20, 31, and 32. Other examples include compounds described in JP-A Nos. 2010-534726, 2012-515233, and 2012-515234, JP-A Nos. 1-170601, and 2-34664.

[0115] When the photosensitive composition of the present invention is used in an antireflection filter, it preferably contains, as colorant (D), two or more pigments selected from the group consisting of red pigments, yellow pigments, blue pigments, green pigments, and violet pigments, and exhibits a gray color.

[0116] Examples of combinations that produce a gray color include the following: (1) Contains green and purple pigments. (2) Contains yellow pigment, blue pigment, and purple pigment. (3) Contains yellow pigment, green pigment, and purple pigment. (4) Contains red pigment, yellow pigment, and blue pigment. (5) Contains yellow pigment, green pigment, blue pigment and purple pigment. (6) Contains red pigment, yellow pigment, blue pigment and purple pigment. (7) Contains red pigment, green pigment, blue pigment, and purple pigment.

[0117] An example of the above embodiment (1) is an embodiment in which the green pigment contains at least one selected from CI Pigment Green 7, 36, 58, 59, and 63, and the purple pigment contains CI Pigment Violet 23. An example of the above embodiment (2) is an embodiment in which the yellow pigment contains at least one selected from CI Pigment Yellow 139, 185, 231, and 233, the blue pigment contains at least one selected from CI Pigment Blue 15:3, 15:4, and 15:6, and the purple pigment contains CI Pigment Violet 23. An example of the above embodiment (3) is an embodiment in which the yellow pigment contains at least one selected from CI Pigment Yellow 139, 185, 231, and 233, the green pigment contains at least one selected from CI Pigment Green 7, 36, 58, 59, and 63, and the purple pigment contains CI Pigment Violet 23. An example of the embodiment (4) above is an embodiment in which the red pigment contains at least one selected from CI Pigment Red 177, 254, 291, 295, and 296, the yellow pigment contains at least one selected from CI Pigment Yellow 139, 185, 231, and 233, and the blue pigment contains at least one selected from CI Pigment Blue 15:3, 15:4, and 15:6. An example of the embodiment (5) above is an embodiment in which the yellow pigment contains at least one selected from CI Pigment Yellow 139, 185, 231, and 233; the green pigment contains at least one selected from CI Pigment Green 7, 36, 58, 59, and 63; the blue pigment contains at least one selected from CI Pigment Blue 15:3, 15:4, and 15:6; and the purple pigment contains CI Pigment Violet 23. An example of the above embodiment (6) is an embodiment in which the red pigment contains at least one selected from CI Pigment Red 177, 254, 291, 295, and 296; the yellow pigment contains at least one selected from CI Pigment Yellow 139, 185, 231, and 233; the blue pigment contains at least one selected from CI Pigment Blue 15:3, 15:4, and 15:6; and the purple pigment contains CI Pigment Violet 23. An example of the above embodiment (7) is an embodiment in which the red pigment contains at least one selected from CI Pigment Red 177, 254, 291, 295, and 296; the green pigment contains at least one selected from CI Pigment Green 7, 36, 58, 59, and 63; the blue pigment contains at least one selected from CI Pigment Blue 15:3, 15:4, and 15:6; and the purple pigment contains CI Pigment Violet 23.

[0118] Table 1 shows the preferred mass ratios (mass %) of each organic pigment in each embodiment.

[0119] [Table 1]

[0120] Inorganic pigments such as titanium oxide, barium sulfate, zinc oxide, lead sulfate, yellow lead, zinc yellow, red iron oxide (red iron (III) oxide), cadmium red, ultramarine, iron blue, chromium oxide green, cobalt green, umber, and synthetic iron black can also be used.

[0121] (dye) Examples of dyes include acid dyes, direct dyes, basic dyes, salt-forming dyes, oil-soluble dyes, disperse dyes, reactive dyes, mordant dyes, vat dyes, sulfur dyes, etc. Also included are derivatives of these dyes and lake pigments obtained by converting dyes into lakes.

[0122] The acid dye preferably has an acidic group such as a sulfonic acid or carboxylic acid. Also preferred are salt-forming compounds that are salts of an acid dye with a nitrogen-containing compound such as a quaternary ammonium salt compound, a tertiary amine compound, a secondary amine compound, or a primary amine compound. Also preferred are salt-forming compounds that are salts of an acid dye with a resin component having these functional groups. Furthermore, the salt-forming compounds can be sulfonamidated to modify them into sulfonic acid amide compounds, which makes it easier to obtain photosensitive compositions with excellent resistance (light resistance, solvent resistance). In addition, a salt-forming compound of an acid dye and a compound having an onium salt group is also preferred because it has excellent resistance (light resistance, solvent resistance). The compound having an onium salt group is preferably a resin having a cationic group.

[0123] Although basic dyes can be used as they are, salt-forming compounds that form salts with organic acids, perchloric acid, or metal salts thereof are preferred. Salt-forming compounds of basic dyes are preferred because they have excellent resistance (lightfastness, solvent resistance) and affinity with pigments. Furthermore, in the salt-forming compounds of basic dyes, the anion component that acts as a counterion is preferably an organic sulfonic acid, organic sulfuric acid, a fluorine-containing phosphorus anion compound, a fluorine-containing boron anion compound, a cyano-containing nitrogen anion compound, an anion compound having a conjugate base of an organic acid with a halogenated hydrocarbon group, or a salt-forming compound formed with an acid dye. Furthermore, the resistance of salt-forming compounds is further improved when the salt-forming compound contains a polymerizable unsaturated group in the molecule.

[0124] The chemical structure of the dye may be, for example, azo dyes, disazo dyes, azomethine dyes (indoaniline dyes, indophenol dyes, etc.), dipyrromethene dyes, quinone dyes (benzoquinone dyes, naphthoquinone dyes, anthraquinone dyes, anthrapyridone dyes, etc.), carbonium dyes (diphenylmethane dyes, triphenylmethane dyes, xanthene dyes, acridine dyes, etc.), quinoneimine dyes (oxazine dyes, thiazine dyes, etc.), azido dyes, ... Examples of the dye structure include dyes derived from dyes selected from the group consisting of quinone dyes, polymethine dyes (oxonol dyes, merocyanine dyes, arylidene dyes, styryl dyes, cyanine dyes, squarylium dyes, croconium dyes, etc.), quinophthalone dyes, phthalocyanine dyes, subphthalocyanine dyes, perinone dyes, indigo dyes, thioindigo dyes, quinoline dyes, nitro dyes, nitroso dyes, rhodamine dyes, and metal complex dyes thereof.

[0125] Among these, from the viewpoint of color properties such as hue, color separation ability, and color unevenness, a dye structure derived from a dye selected from azo dyes, xanthene dyes, cyanine dyes, triphenylmethane dyes, anthraquinone dyes, dipyrromethene dyes, squarylium dyes, quinophthalone dyes, phthalocyanine dyes, and subphthalocyanine dyes is preferred, and a dye structure derived from a dye selected from xanthene dyes, cyanine dyes, triphenylmethane dyes, anthraquinone dyes, dipyrromethene dyes, and phthalocyanine dyes is more preferred.

[0126] The colorant (D) can be used alone or in combination of two or more kinds.

[0127] The content of the colorant (D) is preferably 5% by mass or less, more preferably 0.5 to 3% by mass, based on 100% by mass of the nonvolatile content of the photosensitive composition.

[0128] (Fine pigment particle size) The pigment is preferably micronized before use. The micronization method is not particularly limited, and for example, wet milling, dry milling, or solution precipitation can be used. Among these, salt milling treatment using a kneader method, which is a type of wet milling, is preferred. The average primary particle diameter of the micronized pigment determined by TEM (transmission electron microscope) is preferably 5 to 90 nm. From the viewpoints of dispersibility and contrast ratio, the average primary particle diameter is more preferably 10 to 70 nm.

[0129] Salt milling is a process in which a mixture of a pigment, a water-soluble inorganic salt, and a water-soluble organic solvent is mechanically kneaded under heat using a kneader, two-roll mill, three-roll mill, ball mill, attritor, sand mill, or other kneading machine, and then the water-soluble inorganic salt and water-soluble organic solvent are removed by washing with water. The water-soluble inorganic salt acts as a crushing aid, and the high hardness of the inorganic salt is used to crush the pigment during salt milling. Optimizing the conditions for salt milling a pigment can produce a pigment with an extremely fine primary particle size, a narrow distribution, and a sharp particle size distribution.

[0130] Examples of water-soluble inorganic salts include sodium chloride, potassium chloride, and sodium sulfate, with sodium chloride (table salt) being preferred from the standpoint of cost. From the standpoint of both treatment efficiency and production efficiency, the amount of water-soluble inorganic salt used is preferably 50 to 2,000 parts by mass, and more preferably 300 to 1,000 parts by mass, per 100 parts by mass of the pigment.

[0131] The water-soluble organic solvent functions to moisten the pigment and water-soluble inorganic salt. It is not particularly limited as long as it is soluble (miscible) in water and does not substantially dissolve the inorganic salt used. However, since the temperature rises during salt milling and the solvent becomes prone to evaporation, a high-boiling solvent with a boiling point of 120°C or higher is preferred for safety reasons. Examples of water-soluble organic solvents that can be used include 2-methoxyethanol, 2-butoxyethanol, 2-(isopentyloxy)ethanol, 2-(hexyloxy)ethanol, diethylene glycol, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, triethylene glycol, triethylene glycol monomethyl ether, liquid polyethylene glycol, 1-methoxy-2-propanol, 1-ethoxy-2-propanol, dipropylene glycol, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, and liquid polypropylene glycol. The amount of water-soluble organic solvent used is preferably 5 to 1,000 parts by weight, more preferably 50 to 500 parts by weight, per 100 parts by weight of the pigment.

[0132] A resin may be added to the salt milling treatment as needed. The type of resin is not particularly limited, and examples include natural resins, modified natural resins, synthetic resins, and synthetic resins modified with natural resins. Among these, resins that are solid at room temperature and insoluble in water are preferred, and those that are partially soluble in the organic solvents are preferred. The amount of resin added is preferably 2 to 200 parts by mass per 100 parts by mass of the pigment.

[0133] [Dye derivative (E)] The photosensitive composition of the present invention may contain a dye derivative (E).

[0134] The dye derivative (E) is not particularly limited, and known compounds can be used. For example, compounds having a structure in which a part of the dye is substituted with an acidic group, a basic group, a neutral group, or the like can be used. Specific examples include compounds having an acidic substituent such as a sulfo group, a carboxy group, or a phosphate group, and amine salts thereof; compounds having a basic substituent such as a sulfonamide group or a terminal tertiary amino group; and compounds having a neutral substituent such as a phenyl group or a phthalimidoalkyl group. Examples of the dye include diketopyrrolopyrrole compounds, phthalocyanine compounds, anthraquinone compounds, quinacridone compounds, dioxazine compounds, perinone compounds, perylene compounds, thiazine indigo compounds, triazine compounds, benzimidazolone compounds, benzoisoindole compounds, isoindoline compounds, isoindolinone compounds, quinophthalone compounds, naphthol compounds, squarylium compounds, threne compounds, and naphthalocyanine compounds.

[0135] Specifically, pyrrolopyrrole dye derivatives are disclosed in JP 2001-220520 A, WO 2009 / 081930 A, WO 2011 / 052617 A, WO 2012 / 102399 A, JP 2017-156397 A, and WO 2018 / 101189 A, phthalocyanine dye derivatives are disclosed in JP 2007-226161 A, WO 2016 / 163351 A, JP 2017-165820 A, and Japanese Patent No. 5753266 A, and anthraquinone dye derivatives are disclosed in JP 63-2 64674, JP-A-09-272812, JP-A-10-245501, JP-A-10-265697, JP-A-2007-079094, WO 2009 / 025325; quinacridone dye derivatives include JP-A-48-54128, JP-A-03-9961, and JP-A-2000-273383; dioxazine dye derivatives include JP-A-2011-162662; thiazine indigo dye derivatives include JP-A-2007-314785; triazine dye derivatives include Examples of benzisoindole dye derivatives include JP-A-61-246261, JP-A-11-199796, JP-A-2003-165922, JP-A-2003-168208, JP-A-2004-217842, and JP-A-2007-314681; examples of benzoisoindole dye derivatives include JP-A-2009-57478; examples of quinophthalone dye derivatives include JP-A-2003-167112, JP-A-2006-291194, JP-A-2008-31281, and JP-A-2012-226110; examples of naphthol dye derivatives include Examples of squarylium dye derivatives include those disclosed in JP 2012-208329 A and JP 2014-5439 A; examples of azo dye derivatives include those disclosed in WO 2020 / 054718; examples of acidic substituents include those disclosed in JP 2004-307854 A; and examples of basic substituents include those disclosed in JP 2002-201377 A, JP 2003-171594 A, JP 2005-181383 A, JP 2005-213404 A, and the like.In these documents, the term "derivative," "pigment derivative," "dispersant," "dispersing aid," "pigment dispersant," or simply "compound" is sometimes used, but these terms are synonymous with the dye derivative (E).

[0136] The dye derivative (E) can be used alone or in combination of two or more kinds.

[0137] The content of the dye derivative (E) is preferably from 1 to 20 parts by mass, more preferably from 2 to 10 parts by mass, relative to 100 parts by mass of the colorant (D).

[0138] [Dispersion resin (F)] The photosensitive composition of the present invention may contain a dispersing resin (F). The dispersing resin (F) is used for the purpose of dispersing the colorant (D), which is a raw material of the photosensitive composition, when producing a dispersion of the colorant (D).

[0139] The dispersing resin (F) is preferably a resin having an adsorptive group that has a high affinity for the colorant (D). The adsorptive group preferably has at least one of a basic group and an acidic group.

[0140] Examples of the basic group include a primary amino group, a secondary amino group, a tertiary amino group, a quaternary ammonium base, and a group containing a nitrogen atom such as a nitrogen-containing heterocycle.

[0141] Examples of the acidic group include a carboxyl group, a phosphoric acid group, and a sulfonic acid group.

[0142] Examples of resin types for the dispersion resin (F) include urethane resins, polycarboxylic acid esters such as polyacrylates, unsaturated polyamides, polycarboxylic acids, polycarboxylic acid (partial) amine salts, polycarboxylic acid ammonium salts, polycarboxylic acid alkylamine salts, polysiloxanes, long-chain polyaminoamide phosphates, hydroxyl group-containing polycarboxylic acid esters, modified products thereof, amides formed by the reaction of poly(lower alkylene imines) with polyesters having free carboxyl groups, and salts thereof, water-soluble resins and water-soluble polymer compounds such as (meth)acrylic acid-styrene copolymers, (meth)acrylic acid-(meth)acrylic acid ester copolymers, styrene-maleic acid copolymers, polyvinyl alcohol, and polyvinylpyrrolidone, polyesters, modified polyacrylates, ethylene oxide / propylene oxide adducts, and phosphate esters.

[0143] Examples of the structure of the dispersing resin (F) include a random structure, a block structure, a graft structure, a comb structure, and a star structure. Among these, the block structure and the comb structure are preferred from the viewpoint of dispersion stability.

[0144] Commercially available dispersion resins (F) include, for example, Disperbyk-101, 103, 107, 108, 110, 111, 116, 130, 140, 154, 161, 162, 163, 164, 165, 166, 167, 168, 170, 171, 174, 180, 181, 182, 183, 184, 185, 190, 2000, 2001, 2009, 2010, 2020, 2025, 2050, 2070, 2095, 2150, 2155, 2163, and 2164 manufactured by BYK-Chemie Japan, or Anti-Terra-U203 and 204, or BYK-P 104, P104S, 220S, or Lactimon, Lactimon-WS, or Bykumen, etc.; SOLSPERSE-3000, 9000, 13000, 13240, 13650, 13940, 16000, 17000, 18000, 20000, 21000, 24000, 26000, 27000, 28000, 31845, 32000, 32500, 32550, 33500, 32600, 34750, 35100, 36600, 38500, 41000, 41090, 53095, 55000, 56000 manufactured by Lubrizol Japan ,76500, etc., EFKA-46, 47, 48, 452, 4008, 4009, 4010, 4015, 4020, 4047, 4050, 4055, 4060, 4080, 4400, 4401, 4402, 4403, 4406, 4408, 4300, 4310, 4320, 4330, 4340, 450, 451, 453, 4540, 4550, 4560, 4800, 5010, 5065, 5066, 5070, 7500, 7554, 1101, 120, 150, 1501, 1502, 1503, etc. manufactured by BASF Japan, and Ajisu manufactured by Ajinomoto Fine-Techno Co., Ltd. Examples include resins described in JP-A-2008-029901, JP-A-2009-155406, JP-A-2010-185934, JP-A-2011-157416, WO 2008 / 007776, JP-A-2008-029901, JP-A-2009-155406, JP-A-2010-185934, JP-A-2011-157416, JP-A-2009-251481, JP-A-2007-23195, JP-A-1996-143651, and the like.

[0145] The dispersing resin (F) can be used alone or in combination of two or more kinds.

[0146] From the viewpoint of dispersion stability, the content of the dispersing resin (F) is preferably from 3 to 200 parts by mass, more preferably from 5 to 100 parts by mass, relative to 100 parts by mass of the colorant (D).

[0147] [Sensitizer (G)] The photosensitive composition of the present invention may contain a sensitizer (G).

[0148] Examples of the sensitizer (G) include chalcone compounds, unsaturated ketones typified by dibenzalacetone, 1,2-diketone compounds typified by benzil and camphorquinone, benzoin compounds, fluorene compounds, naphthoquinone compounds, anthraquinone compounds, xanthene compounds, thioxanthene compounds, xanthone compounds, thioxanthone compounds, coumarin compounds, ketocoumarin compounds, cyanine compounds, merocyanine compounds, and polymethine dyes such as oxonol compounds, acridine compounds, azine compounds, thiazine compounds, oxazine compounds, indoline compounds, azulene compounds, and azulenium compounds. Examples of the compound include compounds, squarylium-based compounds, porphyrin-based compounds, tetraphenylporphyrin-based compounds, triarylmethane-based compounds, tetrabenzoporphyrin-based compounds, tetrapyrazinoporphyrazine-based compounds, phthalocyanine-based compounds, tetraazaporphyrazine-based compounds, tetraquinoxalylporphyrazine-based compounds, naphthalocyanine-based compounds, subphthalocyanine-based compounds, pyrylium-based compounds, thiopyrylium-based compounds, tetraphyrin-based compounds, annulene-based compounds, spiropyran-based compounds, spirooxazine-based compounds, thiospiropyran-based compounds, metal arene complexes, organic ruthenium complexes, and benzophenone-based compounds. Among these, thioxanthone-based compounds and benzophenone-based compounds are preferred from the viewpoint of pattern formability.

[0149] Examples of thioxanthone compounds include 2,4-diethylthioxanthone, 2-chlorothioxanthone, 2,4-dichlorothioxanthone, 2-isopropylthioxanthone, 4-isopropylthioxanthone, 1-chloro-4-propoxythioxanthone, etc. Among these, 2,4-diethylthioxanthone is preferred.

[0150] Examples of benzophenone compounds include 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 2-aminobenzophenone, etc. Among these, 4,4'-bis(diethylamino)benzophenone is preferred.

[0151] The sensitizer (G) can be used alone or in combination of two or more kinds.

[0152] From the viewpoint of pattern formability, the content of the sensitizer (G) is preferably from 10 to 400 parts by mass, more preferably from 20 to 300 parts by mass, relative to 100 parts by mass of the photopolymerization initiator (C).

[0153] [Thermosetting compound (H)] The photosensitive composition of the present invention may contain a thermosetting compound (H), which reacts in the heating step to increase the crosslink density and improve the heat resistance.

[0154] The thermosetting compound (H) may be a low molecular weight compound or a high molecular weight compound such as a resin. Examples of the thermosetting compound (H) include epoxy compounds, oxetane compounds, benzoguanamine compounds, rosin-modified maleic acid compounds, rosin-modified fumaric acid compounds, melamine compounds, urea compounds, and phenol compounds. Among these, epoxy compounds and oxetane compounds are preferred.

[0155] (Epoxy compound (H1)) Examples of the epoxy compound (H1) include polycondensates of bisphenols (bisphenol A, bisphenol F, bisphenol S, biphenol, bisphenol AD, etc.), polycondensates of phenols (phenol, alkyl-substituted phenol, aromatic-substituted phenol, naphthol, alkyl-substituted naphthol, dihydroxybenzene, alkyl-substituted dihydroxybenzene, dihydroxynaphthalene, etc.) and various aldehydes (formaldehyde, acetaldehyde, alkylaldehyde, benzaldehyde, alkyl-substituted benzaldehyde, hydroxybenzaldehyde, naphthaldehyde, glutaraldehyde, phthalaldehyde, crotonaldehyde, cinnamaldehyde, etc.), polycondensates of phenols and various diene compounds (dicyclopentadiene, terpenes, vinylcyclohexene, norbornadiene, vinylnorbornene, tetrahydroindene, divinylbenzene, etc.), and polycondensates of phenols and various diene compounds (dicyclopentadiene, terpenes, vinylcyclohexene, norbornadiene, vinylnorbornene, tetrahydroindene, divinylbenzene, etc.). Examples of suitable epoxy resins include polymers of phenols and ketones (acetone, methyl ethyl ketone, methyl isobutyl ketone, acetophenone, benzophenone, etc.), polycondensates of phenols and aromatic dimethanols (benzenedimethanol, α,α,α',α'-benzenedimethanol, biphenyldimethanol, α,α,α',α'-biphenyldimethanol, etc.), polycondensates of phenols and aromatic dichloromethyls (α,α'-dichloroxylene, bischloromethylbiphenyl, etc.), polycondensates of bisphenols and various aldehydes, glycidyl ether epoxy resins obtained by glycidylating alcohols, alicyclic epoxy resins, heterocyclic epoxy resins, aliphatic epoxy resins, glycidylamine epoxy resins, and glycidyl ester epoxy resins.

[0156] Commercially available products include, for example, Epicoat 807, 815, 825, 827, 828, 190P, and 191P manufactured by Yuka Shell Epoxy Co., Ltd., and TECHMORE manufactured by Mitsui Chemicals, Inc. VG3101L, EPPN-201, 501H, 502H, EOCN-102S, 103S, 104S, 1020 manufactured by Nippon Kayaku Co., Ltd., Epicoat 1004, 1256, JER1032H60, 157S65, 157S70, 152, 154 manufactured by Japan Epoxy Resins Co., Ltd., Celloxide 2021, EHPE-3150 manufactured by Daicel Chemical Industries, Ltd., Denacol EX-211, 212, 252, 313, 314, 321, 411, 421, 512, 521, 611, 612, 614, 614B, 622, 711, 721 manufactured by Nagase ChemteX Corporation, TEPIC-L, H, S manufactured by Nissan Chemical Industries, Ltd., and the like.

[0157] The content of the epoxy compound (H1) is preferably from 0.5 to 50 mass %, more preferably from 1 to 40 mass %, based on 100 mass % of the nonvolatile content of the photosensitive composition.

[0158] (Oxetane Compound (H2)) The oxetane compound (H2) is a known compound having an oxetane group. Examples of the oxetane compound include monofunctional oxetane compounds, bifunctional oxetane compounds, and trifunctional or higher functional oxetane compounds.

[0159] Examples of monofunctional oxetane compounds include (3-ethyloxetan-3-yl)methyl acrylate, (3-ethyloxetan-3-yl)methyl methacrylate, 3-ethyl-3-hydroxymethyloxetane, 3-ethyl-3-(2-ethylhexyloxymethyl)oxetane, 3-ethyl-3-(phenoxymethyl)oxetane, 3-ethyl-3-(2-methacryloxymethyl)oxetane, and 3-ethyl-3-{[3-(triethoxysilyl)propoxy]methyl}oxetane.

[0160] Examples of commercially available products include OXE-10,30 manufactured by Osaka Organic Chemical Industry Co., Ltd. and OXT-101,212 manufactured by Toagosei Co., Ltd.

[0161] Examples of the bifunctional oxetane compound include 4,4'-bis[(3-ethyl-3-oxetanyl)methoxymethyl]biphenyl), 1,4-bis[(3-ethyl-3-oxetanyl)methoxymethyl]benzene, 1,4-bis{[(3-ethyl-3-oxetanyl)methoxy]methyl}benzene, di[1-ethyl(3-oxetanyl)]methyl ether, di[1-ethyl(3-oxetanyl)]methyl ether 3-ethyl-3-hydroxymethyloxetane, 3- Ethyl-3-(2-ethylhexyloxymethyl)oxetane, 3-ethyl-3-(2-phenoxymethyl)oxetane, 3,7-bis(3-oxetanyl)-5-oxa-nonane, 1,2-bis[(3-ethyl-3-oxetanylmethoxy)methyl]ethane, 1,3-bis[(3-ethyl-3-oxetanylmethoxy)methyl]propane, ethyleneglycol bis(3-ethyl-3-oxetanylmethyl)ether, dicyclopentenylbis(3-ethyl- 3-oxetanylmethyl) ether, triethylene glycol bis(3-ethyl-3-oxetanylmethyl) ether, tetraethylene glycol bis(3-ethyl-3-oxetanylmethyl) ether, 1,4-bis(3-ethyl-3-oxetanylmethoxy)butane, 1,6-bis(3-ethyl-3-oxetanylmethoxy)hexane, polyethylene glycol bis(3-ethyl-3-oxetanylmethyl) ether, ethylene oxide (EO)-modified bisphenol A bis(3-ethyl-3-oxetanylmethyl) ether, propylene oxide (PO)-modified bisphenol A bis(3-ethyl-3-oxetanylmethyl) ether, EO-modified hydrogenated bisphenol A bis(3-ethyl-3-oxetanylmethyl) ether, PO-modified hydrogenated bisphenol A bis(3-ethyl-3-oxetanylmethyl) ether, EO-modified bisphenol F(3-ethyl-3-oxetanylmethyl) ether, and the like.

[0162] Examples of commercially available products include OXBP and OXTP manufactured by Ube Industries, Ltd., and OXT-121 and 221 manufactured by Toagosei Co., Ltd.

[0163] Examples of trifunctional or higher oxetane compounds include pentaerythritol tris(3-ethyl-3-oxetanylmethyl) ether, pentaerythritol tetrakis(3-ethyl-3-oxetanylmethyl) ether, dipentaerythritol hexa(3-ethyl-3-oxetanylmethyl) ether, dipentaerythritol pentakis(3-ethyl-3-oxetanylmethyl) ether, dipentaerythritol tetrakis(3-ethyl-3-oxetanylmethyl) ether, and caprolactone-modified dipentaerythritol. Examples of such polymers include erythritol hexa(3-ethyl-3-oxetanylmethyl) ether, caprolactone-modified dipentaerythritol pentakis(3-ethyl-3-oxetanylmethyl) ether, ditrimethylolpropane tetrakis(3-ethyl-3-oxetanylmethyl) ether, resins containing an oxetane group (for example, the oxetane-modified phenol novolac resin described in Japanese Patent No. 3783462), and polymers obtained by radical polymerization of (meth)acrylic monomers such as the above-mentioned OXE-30.

[0164] The content of the oxetane compound (H2) is preferably from 0.5 to 50 mass %, more preferably from 1 to 40 mass %, based on 100 mass % of the nonvolatile content of the photosensitive composition.

[0165] The melamine compound is a compound having a melamine ring structure. The melamine compound is preferably a methylol or ether type compound, and more preferably a melamine compound having an average of 5.0 or more methylol groups and / or ether groups per melamine ring. Having an appropriate number of methylol groups or ether groups makes it easier to obtain just the right amount of heat resistance.

[0166] Examples of commercially available products include Nikalac MW-30HM, MW-390, MW-100LM, MX-750LM, MW-30M, MW-30, MW-22, MS-21, MS-11, MW-24X, MS-001, MX-002, MX-730, MX-750, MX-708, MX-706, MX-042, MX-45, MX-500, MX-520, MX-43, MX-417, and MX-410 manufactured by Sanwa Chemical Co., Ltd., and Cymel 232, 235, 236, 238, 285, 300, 301, 303, 350, and 370 manufactured by Nippon Cytec Industries Co., Ltd.

[0167] Among these, Nikalac MW-30HM, MW-390, MW-100LM, MX-750LM, MW-30M, MW-30, MW-22, MS-21, MS-11, MW-24X, and MX-45 manufactured by Sanwa Chemical Co., Ltd., and Cymel 232, 235, 236, 238, 300, 301, 303, and 350 manufactured by Nippon Cytec Industries Co., Ltd., which have an average of 5.0 or more methylol groups and / or ether groups per melamine ring, are preferred in terms of increasing crosslink density.

[0168] The thermosetting compound (H) can be used alone or in combination of two or more kinds.

[0169] [Curing agent (curing accelerator)] The photosensitive composition of the present invention can be used in combination with a curing agent (curing accelerator) to aid in the curing of the thermosetting compound (H). Examples of the curing agent include amine compounds, acid anhydrides, active esters, carboxylic acid compounds, and sulfonic acid compounds. Examples of the curing agent include amine compounds (e.g., dicyandiamide, benzyldimethylamine, 4-(dimethylamino)-N,N-dimethylbenzylamine, 4-methoxy-N,N-dimethylbenzylamine, 4-methyl-N,N-dimethylbenzylamine, etc.), quaternary ammonium salt compounds (e.g., triethylbenzylammonium chloride, etc.), blocked isocyanate compounds (e.g., dimethylamine, etc.), imidazole derivative bicyclic amidine compounds and their salts (e.g., imidazole, 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, Examples of suitable amines include 2-phenylimidazole, 4-phenylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-(2-cyanoethyl)-2-ethyl-4-methylimidazole, etc., phosphorus compounds (e.g., triphenylphosphine, etc.), and S-triazine derivatives (e.g., 2,4-diamino-6-methacryloyloxyethyl-S-triazine, 2-vinyl-2,4-diamino-S-triazine, 2-vinyl-4,6-diamino-S-triazine-isocyanuric acid adduct, 2,4-diamino-6-methacryloyloxyethyl-S-triazine-isocyanuric acid adduct, etc.).

[0170] The curing agents can be used alone or in combination of two or more.

[0171] The content of the curing agent is preferably 0.01 to 15 parts by mass relative to 100 parts by mass of the thermosetting compound (H).

[0172] [Thiol-based chain transfer agents (I)] The photosensitive composition of the present invention can contain a thiol chain transfer agent (I). When the thiol chain transfer agent (I) is used in combination with a photopolymerization initiator (C), it generates thiyl radicals that are resistant to polymerization inhibition by oxygen during radical polymerization after light irradiation, thereby improving the photosensitivity of the photosensitive composition.

[0173] The thiol chain transfer agent (I) is preferably a polyfunctional thiol having two or more thiol groups (SH groups), more preferably a polyfunctional thiol having four or more thiol groups. As the number of functional groups increases, photocuring becomes easier from the surface to the deepest part of the film.

[0174] Examples of polyfunctional thiols include hexanedithiol, decanedithiol, 1,4-butanediol bisthiopropionate, 1,4-butanediol bisthioglycolate, ethylene glycol bisthioglycolate, ethylene glycol bisthiopropionate, trimethylolpropane tristhioglycolate, trimethylolpropane tristhiopropionate, trimethylolpropane tris(3-mercaptobutyrate), pentaerythritol tetrakisthioglycolate, pentaerythritol tetrakisthioglycolate, Examples of the thiopropionate include erythritol tetrakisthiopropionate, trimercaptopropionic acid tris(2-hydroxyethyl)isocyanurate, 1,4-dimethylmercaptobenzene, 2,4,6-trimercapto-s-triazine, and 2-(N,N-dibutylamino)-4,6-dimercapto-s-triazine. Preferred examples include ethylene glycol bisthiopropionate, trimethylolpropane tristhiopropionate, and pentaerythritol tetrakisthiopropionate.

[0175] The thiol chain transfer agent (I) can be used alone or in combination of two or more kinds.

[0176] The content of the thiol chain transfer agent (I) is preferably 1 to 10 mass %, more preferably 2 to 8 mass %, based on 100 mass % of the nonvolatile content of the photosensitive composition. When an appropriate amount is contained, photosensitivity is improved and wrinkles are less likely to occur on the surface of the cured film.

[0177] [Polymerization inhibitor (J)] The photosensitive composition of the present invention may contain a polymerization inhibitor (J).

[0178] Examples of the polymerization inhibitor (J) include alkyl catechol compounds such as catechol, resorcinol, 1,4-hydroquinone, 2-methyl catechol, 3-methyl catechol, 4-methyl catechol, 2-ethyl catechol, 3-ethyl catechol, 4-ethyl catechol, 2-propyl catechol, 3-propyl catechol, 4-propyl catechol, 2-n-butyl catechol, 3-n-butyl catechol, 4-n-butyl catechol, 2-t-butyl catechol, 3-t-butyl catechol, 4-t-butyl catechol, and 3,5-di-t-butyl catechol; 2-methyl resorcinol, 4-methyl resorcinol, 2-ethyl resorcinol, 4-ethyl resorcinol, 2-propyl resorcinol, 4-propyl resorcinol; alkylresorcinol compounds such as 4-n-butylresorcinol, 4-n-butylresorcinol, 2-t-butylresorcinol, and 4-t-butylresorcinol; alkylhydroquinone compounds such as methylhydroquinone, ethylhydroquinone, propylhydroquinone, t-butylhydroquinone, and 2,5-di-t-butylhydroquinone; phosphine compounds such as tributylphosphine, trioctylphosphine, tricyclohexylphosphine, triphenylphosphine, and tribenzylphosphine; phosphine oxide compounds such as trioctylphosphine oxide and triphenylphosphine oxide; phosphite compounds such as triphenylphosphite and trisnonylphenylphosphite; pyrogallol; and phloroglucin.

[0179] The content of the polymerization inhibitor (J) is preferably 0.01 to 0.4% by mass relative to 100% by mass of the nonvolatile content of the photosensitive composition.

[0180] [Ultraviolet absorber (K)] The photosensitive composition of the present invention may contain an ultraviolet absorber (K).

[0181] The ultraviolet absorber (K) is an organic compound having an ultraviolet absorbing function, and examples thereof include benzotriazole-based organic compounds, triazine-based organic compounds, benzophenone-based organic compounds, salicylic acid ester-based organic compounds, cyanoacrylate-based organic compounds, and salicylate-based organic compounds.

[0182] Benzotriazole compounds include, for example, 2-(5-methyl-2-hydroxyphenyl)benzotriazole, 2-(2-hydroxy-5-t-butylphenyl)-2H-benzotriazole, 2-[2-hydroxy-3,5-bis(α, α-Dimethylbenzyl)phenyl]-2H-benzotriazole, 2-(3-t-butyl-5-methyl-2-hydroxyphenyl)-5-chlorobenzotriazole, 2-(2'-hydroxy-5'-t-octylphenyl)benzotriazole, 5% 2-methoxy-1-methylethyl acetate and 95% benzenepropanoic acid, 3-(2H-benzotriazol-2-yl)-(1,1-dimethylethyl)-4-hydroxy, C7-9 side chain and linear alkyl ester mixture, 2-(2H-benzotriazol-2-yl)-4,6-bis(1-methyl-1-phenylethyl)phenol, 2-(2H-benzotriazol-2-yl)-6-(1-methyl-1-phenylethyl)-4-(1,1,3,3-tetramethylbutyl)phenol, methyl 3-(3-(2H-benzotriazol-2-yl)-5-t-butyl-4-hydroxyphenyl)propionate / polyethylene glycol 300 reaction products, 2-(2H-benzotriazol-2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol, 2,2'-methylenebis[6-(2H-benzotriazol-2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol], 2-(2H-benzotriazol-2-yl)-p-cresol, 2-(5-chloro-2H-benzotriazol-2-yl)-6-t-butyl octyl-4-methylphenol, 2-(3,5-di-t-amyl-2-hydroxyphenyl)benzotriazole, 2-[2-hydroxy-5-[2-(methacryloyloxy)ethyl]phenyl]-2H-benzotriazole, octyl-3-[3-tert-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazol-2-yl)phenyl]propionate, and 2-ethylhexyl-3-[3-tert-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazol-2-yl)phenyl]propionate.

[0183] Examples of commercially available products include TINUVIN P, PS, 234, 326, 329, 384-2, 900, 928, 99-2, and 1130 manufactured by BASF Japan Ltd., ADK STAB LA-29, LA-31RG, LA-32, and LA-36 manufactured by ADEKA Corporation, KEMISORB71, 73, 74, 79, and 279 manufactured by Chemipro Chemical Co., Ltd., and RUVA-93 manufactured by Otsuka Chemical Co., Ltd.

[0184] Examples of triazine compounds include 2,4-bis(2,4-dimethylphenyl)-6-(2-hydroxy-4-n-octyloxyphenyl)-1,3,5-triazine, 2-[4,6-bis(2,4-dimethylphenyl)-1,3,5-triazin-2-yl]-5-[3-(dodecyloxy)-2-hydroxypropoxy]phenol, and the reaction product of 2-(2,4-dihydroxyphenyl)-4,6-bis(2,4-dimethylphenyl)-1,3,5-triazine with (2-ethylhexyl)-glycidic acid ester. Examples of such compounds include 2,4-bis[2-hydroxy-4-butoxyphenyl]-6-(2,4-dibutoxyphenyl)-1,3,5-triazine, 2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-(hexyloxy)phenol, 2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-[2-(2-ethylhexanoyloxy)ethoxy]phenol, and 2,4,6-tris(2-hydroxy-4-hexyloxy-3-methylphenyl)-1,3,5-triazine.

[0185] Examples of commercially available products include KEMISORB102 manufactured by Chemipro Chemicals, TINUVIN 400, 405, 460, 477, 479, and 1577ED manufactured by BASF Japan, ADK STAB LA-46 and LA-F70 manufactured by ADEKA, and CYASORB UV-1164 manufactured by Sun Chemical.

[0186] Examples of benzophenone compounds include 2,4-dihydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-methoxybenzophenone-5-sulfonic acid-3-oxide, 2-hydroxy-4-n-octoxybenzophenone, 2,2'-dihydroxy-4-methoxybenzophenone, 2,2'-dihydroxy-4,4'-dimethoxybenzophenone, 4-dodecyloxy-2-hydroxybenzophenone, 2-hydroxy-4-octadecyloxybenzophenone, 2,2'-dihydroxy-4,4'-dimethoxybenzophenone, 2,2',4,4'-tetrahydroxybenzophenone, and 2-hydroxy-4-methoxy-2'-carboxybenzophenone.

[0187] Examples of commercially available products include KEMISORB10, 11, 11S, 12, and 111 manufactured by Chemipro Chemicals, SEESORB 101 and 107 manufactured by Shipro Chemicals, Adekastab 1413 manufactured by ADEKA, and UV-12 manufactured by Sun Chemical.

[0188] Examples of salicylate compounds include phenyl salicylate, p-octylphenyl salicylate, and p-tert-butylphenyl salicylate.

[0189] The content of the ultraviolet absorber (K) is preferably 5 to 70% by mass relative to 100% by mass of the total of the photopolymerization initiator (C) and the ultraviolet absorber (K).

[0190] [Antioxidant (L)] The photosensitive composition of the present invention may contain an antioxidant (L). The antioxidant (L) prevents the photopolymerization initiator (C) and the thermosetting compound (H) in the photosensitive coloring composition from being oxidized and yellowed by the thermal steps of thermal curing and ITO annealing.

[0191] Examples of the antioxidant (L) include hindered phenol-based, hindered amine-based, phosphorus-based, sulfur-based, and hydroxylamine-based compounds, etc. Among these, hindered phenol-based antioxidants, hindered amine-based antioxidants, phosphorus-based antioxidants, and sulfur-based antioxidants are preferred.

[0192] Examples of hindered phenol antioxidants include 1,3,5-tris(3,5-di-t-butyl-4-hydroxybenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 1,1,3-tris-(2'-methyl-4'-hydroxy-5'-t-butylphenyl)-butane, 4,4'-butylidene-bis-(2-t-butyl-5-methylphenol), 3-(3,5-di-t-butyl-4-hydroxyphenyl)stearyl propionate, pentaerythritol tetrakis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, 3,9-bis[2-[3-(3-t-butyl-4-hydroxy-5-methylphenyl)propionyloxy]-1,1-dimethylethyl]-2,4,8,10-tetraoxaspiro[5.5]undecane, 1,3,5-tris(3,5-di-t-butyl-4-hydroxyphenylmethyl)-2,4,6-trimethylbenzene, 1,3,5-tris(3-hydroxy-4-t-butyl-2,6-dimethylbenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 2,2'-methylenebis(6-t-butyl-4-ethylphenol), 2,2'-thiodiethylbis-(3,5-di -t-butyl-4-hydroxyphenyl)-propionate, N,N-hexamethylenebis(3,5-di-t-butyl-4-hydroxy-hydrocinnamamide), i-octyl-3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, 4,6-bis(dodecylthiomethyl)-o-cresol, calcium salt of 3,5-di-t-butyl-4-hydroxybenzylphosphonic acid monoethyl ester, 4 ,6-bis(octylthiomethyl)-o-cresol, bis[3-(3-methyl-4-hydroxy-5-t-butylphenyl)propionic acid]ethylenebisoxybisethylene, 1,6-hexanediol bis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, 2,4-bis-(n-octylthio)-6-(4-hydroxy-3,5-di-t-butylanilino)-1,3,5-triazine, Examples include 2,2'-thio-bis-(6-t-butyl-4-methylphenol), 2,5-di-t-amyl-hydroquinone, 2,6-di-t-butyl-4-nonylphenol, 2,2'-isobutylidene-bis-(4,6-dimethyl-phenol), 2,2'-methylene-bis-(6-(1-methyl-cyclohexyl)-p-cresol), and 2,4-dimethyl-6-(1-methyl-cyclohexyl)-phenol.

[0193] Examples of commercially available products include ADK STAB AO-20, AO-30, AO-40, AO-50, AO-60, AO-80, and AO-330 manufactured by ADEKA Corporation, KEMINOX 101, 179, 76, and 9425 manufactured by Chemipro Corporation, IRGANOX 1010, 1035, 1076, 1098, 1135, 1330, 1726, 1425WL, 1520L, 245, 259, 3114, 5057, and 565 manufactured by BASF Japan Ltd., and Cyanox CY-1790 and CY-2777 manufactured by Sun Chemical Company.

[0194] Examples of the hindered amine antioxidant include tetrakis(1,2,2,6,6-pentamethyl-4-piperidyl)-1,2,3,4-butanetetracarboxylate, tetrakis(2,2,6,6-tetramethyl-4-piperidyl)1,2,3,4-butanetetracarboxylate, bis(1,2,2,6,6-pentamethyl-4-piperidyl)sebacate, bis(2,2,6,6-tetramethyl-4-piperidyl)sebacate, bis(1-undecanoxy-2,2,6,6-tetramethylpiperidin-4-yl)carbonate, 1,2,2,6,6-pentamethyl-4-piperidyl tetramethyl-4-piperidyl methacrylate, 2,2,6,6-tetramethyl-4-piperidyl methacrylate, polycondensate of dimethyl succinate and 1-(2-hydroxyethyl)-4-hydroxy-2,2,6,6-tetramethylpiperidine, poly[[6-[(1,1,3,3-tetramethylbutyl)amino]-s-triazine-2,4-diyl]-[(2,2,6,6-tetramethyl-4-piperidyl)imino]-hexamethylene-[(2,2,6,6-tetramethyl-4-piperidyl)imino]], 4-hydroxy-2,2,6,6-tetramethyl-1- Ester of piperidineethanol and 3,5,5-trimethylhexanoic acid, N,N'-4,7-tetrakis[4,6-bis{N-butyl-N-(1,2,2,6,6-pentamethyl-4-piperidyl)amino}-1,3,5-triazin-2-yl]-4,7-diazadecane-1,10-diamine, decanedioic acid bis(2,2,6,6-tetramethyl-1-(octyloxy)-4-piperidinyl) ester, reaction products of 1,1-dimethylethyl hydroperoxide with octane, bis(1,2,2,6,6-pentamethyl-4-pyridyl)[[3,5-bi N,N'-bis(2,2,6,6-tetramethyl-4-piperidyl)-1,2,6,6-tetramethyl-4-piperidyl-C12-21 and C18 unsaturated fatty acid esters, N,N'-bis(2,2,6,6-tetramethyl-4-piperidyl)-1,2,6,6-tetramethyl-4-piperidyl ...Examples include 6-hexamethylenediamine and 2-methyl-2-(2,2,6,6-tetramethyl-4-piperidyl)amino-N-(2,2,6,6-tetramethyl-4-piperidyl)propionamide.

[0195] Examples of commercially available products include ADK STAB LA-52, LA-57, LA-63P, LA-68, LA-72, LA-77Y, LA-77G, LA-81, LA-82, LA-87, LA-402F, and LA-502XP manufactured by ADEKA CORPORATION; KAMISTAB 29, 62, 77, and 94 manufactured by Chemipro Chemicals; Tinuvin 111FDL, 123, 144, 249, 292, and 5100 manufactured by BASF Japan; and Cyasorb UV-3346, UV-3529, and UV-3853 manufactured by Sun Chemical Company.

[0196] Examples of phosphorus-based antioxidants include di(2,6-di-t-butyl-4-methylphenyl)pentaerythritol diphosphite, distearyl pentaerythritol diphosphite, 2,2'-methylenebis(4,6-di-t-butylphenyl)2-ethylhexyl phosphite, tris(2,4-di-t-butylphenyl)phosphite, tris(nonylphenyl)phosphite, tetra(C12 to C15 alkyl)-4,4'-isopropylidene diphenyl diphosphite, diphenyl mono (2-ethylhexyl) phosphite, diphenyl isodecyl phosphite, tris(isodecyl) phosphite, triphenyl phosphite, tetrakis(2,4-di-t-butylphenyl)-4,4-biphenyl diphosphonate, tris(tridecyl) phosphite, phenyl isooctyl phosphite, phenyl isodecyl phosphite, phenyl di(tridecyl) phosphite, diphenyl isooctyl phosphite, diphenyl tridecyl phosphite, 4,4'-isopropylidene Diphenyl alkyl phosphite, trisnonylphenyl phosphite, trisdinonylphenyl phosphite, tris(biphenyl) phosphite, di(2,4-di-t-butylphenyl)pentaerythritol diphosphite, di(nonylphenyl)pentaerythritol diphosphite, phenyl bisphenol A pentaerythritol diphosphite, tetratridecyl 4,4'-butylidenebis(3-methyl-6-t-butylphenol) diphosphite, hexatridecyl Examples include 1,1,3-tris(2-methyl-4-hydroxy-5-t-butylphenyl)butane triphosphite, 3,5-di-t-butyl-4-hydroxybenzyl phosphite diethyl ester, sodium bis(4-t-butylphenyl)phosphite, sodium-2,2-methylene-bis(4,6-di-t-butylphenyl)-phosphite, 1,3-bis(diphenoxyphosphonyloxy)-benzene, and ethyl bis(2,4-di-t-butyl-6-methylphenyl)phosphite.

[0197] Examples of commercially available products include Adeka Stab PEP-36, PEP-8, HP-10, 2112, 1178, 1500, C, 135A, 3010, and TPP manufactured by ADEKA Corporation, IRGAFOS168 manufactured by BASF Japan, and HostanoxP-EPQ manufactured by Clariant Chemicals.

[0198] Examples of sulfur-based antioxidants include 2,2-bis{[3-(dodecylthio)-1-oxopropoxy]methyl}propane-1,3-diylbis[3-(dodecylthio)propionate], ditridecyl 3,3'-thiobispropionate, 2,2-thio-diethylenebis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], 2,4-bis[(octylthio)methyl]-o-cresol, and 2,4-bis[(laurylthio)methyl]-o-cresol.

[0199] Examples of commercially available products include Adekastab AO-412S and AO-503 manufactured by ADEKA Corporation, and KEMINOXPLS manufactured by Chemipro Chemicals.

[0200] The antioxidant (L) can be used alone or in combination of two or more kinds.

[0201] The content of the antioxidant (L) is preferably 0.5 to 5.0% by mass relative to 100% by mass of the nonvolatile content of the photosensitive composition. When an appropriate amount is contained, the transmittance, spectral characteristics, and sensitivity are improved.

[0202] [Leveling agent (M)] The photosensitive composition of the present invention may contain a leveling agent (M). This further improves the wettability and drying properties of the composition to the substrate during application. Examples of the leveling agent (M) include silicone surfactants, fluorine-based surfactants, nonionic surfactants, cationic surfactants, anionic surfactants, and amphoteric surfactants.

[0203] Examples of silicone surfactants include linear polymers formed from siloxane bonds and modified siloxane polymers in which organic groups have been introduced into the side chains or terminals.

[0204] Commercially available products include, for example, BYK-300, 306, 310, 313, 315N, 320, 322, 323, 330, 331, 333, 342, 345, 346, 347, 348, 349, 370, 377, 378, 3455, UV3510, and 3570 manufactured by BYK-Chemie Co., Ltd., and FZ-7002 and 211 manufactured by Dow Corning Toray Co., Ltd. 0, 2122, 2123, 2191, 5609, and X-22-4952, X-22-4272, X-22-6266, KF-351A, KF-354L, KF-355A, KF-945, KF-640, KF-642, KF-643, X-22-4515, KF-6004, and KP-341 manufactured by Shin-Etsu Chemical Co., Ltd.

[0205] Examples of the fluorine-based surfactant include a surfactant or leveling agent having a fluorocarbon chain.

[0206] Examples of commercially available products include Surflon S-242, 243, 420, 611, 651, and 386 manufactured by AGC Seimi Chemical Co., Ltd.; Megafac F-253, 477, 551, 552, 555, 558, 560, 570, 575, and 576, R-40-LM, R-41, RS-72-K, and DS-21 manufactured by DIC Corporation; FC-4430 and 4432 manufactured by Sumitomo 3M Limited; EF-PP31N09, EF-PP33G1, and EF-PP32C1 manufactured by Mitsubishi Materials Electronic Chemicals Co., Ltd.; and Futergent 602A manufactured by Neos Corporation.

[0207] Examples of nonionic surfactants include polyoxyethylene lauryl ether, polyoxyethylene cetyl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene alkyl ether, polyoxyethylene myrister ether, polyoxyethylene octyldodecyl ether, polyoxyalkylene alkyl ether, polyoxyphenylenedistyrenated phenyl ether, polyoxyethylene tribenzyl phenyl ether, polyoxyethylene polyoxypropylene glycol, polyoxyalkylene alkenyl ether, polyoxyethylene nonylphenyl ether, polyoxyethylene alkyl ether phosphate ester, sorbitan monolaurate, sorbitan monopalmitate, sorbitan monostearate, sorbitan distearate, and sorbitan tristearate. sorbitan monooleate, sorbitan trioleate, sorbitan sesquioleate, polyoxyethylene sorbitan monolaurate, polyoxyethylene sorbitan monopalmitate, polyoxyethylene sorbitan monostearate, polyoxyethylene sorbitan tristearate, polyoxyethylene sorbitan monooleate, polyoxyethylene sorbitan triisostearate, polyoxyethylene sorbitan tetraoleate, glycerol monostearate, glycerol monooleate, polyethylene glycol monolaurate, polyethylene glycol monostearate, polyethylene glycol distearate, polyethylene glycol monooleate, polyoxyethylene hydrogenated castor oil, polyoxyethylene alkylamine, alkyl alkanolamide, alkyl imidazoline, and the like.

[0208] Commercially available products include, for example, Emulgen 103, 104P, 106, 108, 109P, 120, 123P, 130K, 147, 150, 210P, 220, 306P, 320P, 350, 404, 408, 409PV, 420, 430, 705, 707, 709, 1108, 1118S-70, 1135S-70, 1150S-60, 2020G-HA, 2025G, LS-106, and L manufactured by Kao Corporation. S-110, LS-114, MS-110, A-60, A-90, B-66, PP-290, Latemul PD-420, PD-430, PD-430S, PD-450, Leodor SP-L10, SP-P10, SP-S10V, SP-S20, SP-S30V, SP-O10V, SP-O30V, Super SP-L10, AS-10V, AO-10V, AO-15V, TW-L120, TW- L106, TW-P120, TW-S120V, TW-S320V, TW-O120V, TW-O106V, TW-IS399C, Super TW-L120, 430V, 440V, 460V, MS-50, MS-60, MO-60, MS-165V, Emanon 1112, 3199V, 3299V, 3299RV, 4110, CH-25, CH-40, CH-60(K), Amit 102, 105, 105A, 302, 320, Aminone PK-02S, L-02, Homogenol L-95, ADEKA Pluronic (registered trademark) L-23, 31, 44, 61, 62, 64, 71, 72, 101, 121, TR-701, 702, 704, 913R manufactured by ADEKA Corporation, and (meth)acrylic acid (co)polymer Polyflow No. 75, No. 90, No. 95 manufactured by Kyoeisha Chemical Co., Ltd.

[0209] Examples of cationic surfactants include alkylamine salts, alkyl quaternary ammonium salts such as lauryltrimethylammonium chloride, stearyltrimethylammonium chloride, and cetyltrimethylammonium chloride, and ethylene oxide adducts thereof.

[0210] Examples of commercially available products include Acetamine 24, Cortamine 24P, 60W, and 86P Concentrate, manufactured by Kao Corporation.

[0211] Examples of anionic surfactants include polyoxyethylene alkyl ether sulfates, sodium dodecylbenzenesulfonate, alkali salts of styrene-acrylic acid copolymers, sodium alkylnaphthalenesulfonate, sodium alkyldiphenyletherdisulfonate, monoethanolamine lauryl sulfate, triethanolamine lauryl sulfate, ammonium lauryl sulfate, monoethanolamine stearate, sodium stearate, sodium lauryl sulfate, monoethanolamine styrene-acrylic acid copolymers, and polyoxyethylene alkyl ether phosphates.

[0212] Examples of commercially available products include Futergent 100 and 150 manufactured by Neos Corporation, and Adeka Hope YES-25, Adekacol TS-230E, PS-440E, and EC-8600 manufactured by ADEKA Corporation.

[0213] Examples of amphoteric surfactants include alkyl betaines such as lauric acid amidopropyl betaine, lauryl betaine, cocamidopropyl betaine, stearyl betaine, and alkyldimethylaminoacetic acid betaine; and alkylamine oxides such as lauryldimethylamine oxide.

[0214] Commercially available products include Anhithol 20AB, 20BS, 24B, 55AB, 86B, 20Y-B, and 20N manufactured by Kao Corporation.

[0215] The leveling agent (M) can be used alone or in combination of two or more kinds.

[0216] The content of the leveling agent (M) is preferably 0.001 to 2.0 mass%, more preferably 0.005 to 1.0 mass%, based on 100 mass% of the nonvolatile content of the photosensitive composition. When an appropriate amount is contained, the balance between the coatability and adhesion of the photosensitive composition is further improved.

[0217] [Storage stabilizer (N)] The photosensitive composition of the present invention can contain a storage stabilizer (N). This stabilizes the viscosity of the photosensitive composition over time. Examples of the storage stabilizer (N) include quaternary ammonium chlorides such as benzyl trimethyl chloride and diethylhydroxyamine, organic acids such as lactic acid and oxalic acid and their methyl ethers, organic phosphines such as t-butylpyrocatechol, tetraethylphosphine and tetraphenylphosphine, and phosphites.

[0218] The content of the storage stabilizer (N) is preferably 0.05 to 5% by mass relative to 100% by mass of the nonvolatile content of the photosensitive composition.

[0219] [Adhesion improver (O)] The photosensitive composition of the present invention may contain an adhesion improver (O), which improves adhesion and makes it easier to form narrow patterns by photolithography.

[0220] Examples of the adhesion improver (O) include silane coupling agents. Examples of the silane coupling agent include vinyl silanes such as vinyltrimethoxysilane and vinyltriethoxysilane, (meth)acrylic silanes such as 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane and 3-acryloxypropyltrimethoxysilane, epoxy silanes such as 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane and 3-glycidoxypropyltriethoxysilane, N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane, N-2-(aminoethyl) silane coupling agents such as aminosilanes such as 3-aminopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N-(1,3-dimethyl-butylidene)propylamine, N-phenyl-3-aminopropyltrimethoxysilane, and N-(vinylbenzyl)-2-aminoethyl-3-aminopropyltrimethoxysilane hydrochloride; mercapto compounds such as 3-mercaptopropylmethyldimethoxysilane and 3-mercaptopropyltrimethoxysilane; styryl compounds such as p-styryltrimethoxysilane; ureido compounds such as 3-ureidopropyltriethoxysilane; sulfides such as bis(triethoxysilylpropyl)tetrasulfide; and isocyanates such as 3-isocyanatepropyltriethoxysilane.

[0221] The adhesion improver (O) can be used alone or in combination of two or more kinds.

[0222] The content of the adhesion improver (O) is preferably 0.05 to 5% by mass relative to 100% by mass of the nonvolatile content of the photosensitive composition.

[0223] [Organic solvent (P)] The photosensitive composition of the present invention contains an organic solvent (P).

[0224] The organic solvent (P) is not particularly limited as long as it satisfies the solubility of each component of the photosensitive composition of the present invention and the coatability, and any known compound can be used.

[0225] Examples of the organic solvent (P) include 1,2,3-trichloropropane, 1-methoxy-2-propanol, ethyl lactate, 1,3-butanediol, 1,3-butylene glycol, 1,3-butylene glycol diacetate, 1,4-dioxane, 2-heptanone, 2-methyl-1,3-propanediol, 3,5,5-trimethyl-2-cyclohexen-1-one, 3,3,5-trimethylcyclohexanone, ethyl 3-ethoxypropionate, 3-methyl-1,3-butanediol, 3-methoxy-3-methyl-1-butanol, 3-methoxy- 3-Methylbutyl acetate, 3-methoxybutanol, 3-methoxybutyl acetate, 4-heptanone, m-xylene, m-diethylbenzene, m-dichlorobenzene, N,N-dimethylacetamide, N,N-dimethylformamide, n-butyl alcohol, n-butylbenzene, n-propyl acetate, N-methylpyrrolidone, o-xylene, toluene, o-chlorotoluene, benzene, o-diethylbenzene, o-dichlorobenzene, p-chlorotoluene, p-diethylbenzene, sec-butylbenzene, tert-butylbenzene , γ-butyrolactone, isobutyl alcohol, isophorone, ethylene glycol diethyl ether, ethylene glycol dibutyl ether, ethylene glycol monoisopropyl ether, ethylene glycol monoethyl ether, ethylene glycol monoethyl ether acetate, ethylene glycol monotertiary butyl ether, ethylene glycol monobutyl ether, ethylene glycol monobutyl ether acetate, ethylene glycol monopropyl ether, ethylene glycol monohexyl ether, ethylene glycol monomethyl ether, ethylene glycol monomethyl ether acetate, diisobutyl ketone, diethylene glycol diethyl ether, diethylene glycol dimethyl ether, diethylene glycol monoisopropyl ether, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether, diethylene glycol monobutyl ether acetate, diethylene glycol monomethyl ether, cyclohexanol, cyclohexanol acetate, cyclohexanone, dipropylene glycol dimethyl ether,Examples of the alkyl esters include dipropylene glycol methyl ether acetate, dipropylene glycol monoethyl ether, dipropylene glycol monobutyl ether, dipropylene glycol monopropyl ether, dipropylene glycol monomethyl ether, diacetone alcohol, triacetin, tripropylene glycol monobutyl ether, tripropylene glycol monomethyl ether, propylene glycol diacetate, propylene glycol phenyl ether, propylene glycol monoethyl ether, propylene glycol monoethyl ether acetate, propylene glycol monobutyl ether, propylene glycol monopropyl ether, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether propionate, benzyl alcohol, methyl isobutyl ketone, methylcyclohexanol, n-amyl acetate, n-butyl acetate, isoamyl acetate, isobutyl acetate, propyl acetate, and dibasic acid esters. Among these, from the viewpoints of resin solubility and coatability, glycol acetates such as ethyl lactate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, ethylene glycol monomethyl ether acetate, and ethylene glycol monoethyl ether acetate, alcohols such as diacetone alcohol, and ketones such as cyclohexanone are preferred.

[0226] From an environmental viewpoint, the photosensitive composition of the present invention preferably does not substantially contain organic solvents that are aromatic hydrocarbons (toluene, xylene, benzene, chlorobenzene, etc.) "Substantially not containing" means that the content of such organic solvents in the photosensitive composition is 50 ppm by mass or less, preferably 30 ppm by mass or less, and more preferably 10 ppm by mass or less.

[0227] The organic solvent (P) can be used alone or in combination of two or more kinds.

[0228] The content of the organic solvent (P) is preferably an amount such that the nonvolatile content of the photosensitive composition is 5 to 50% by mass.

[0229] [Specific metal element content] The photosensitive composition of the present invention preferably contains Li, Na, K, Mg, Ca, Fe, and Cr (hereinafter also referred to as specific metal elements) in a total content of 500 mass ppm or less.

[0230] When the total amount of the specific metal elements in the photosensitive composition is within the above range, the composition has excellent dispersion stability and sensitivity even after storage over time. The content of the specific metal elements can be measured by inductively coupled plasma atomic emission spectroscopy (ICP).

[0231] [Water content] The photosensitive composition of the present invention preferably contains water in an amount of 2.0% by mass or less.

[0232] When the water content of the photosensitive composition is within the above range, the composition has excellent dispersion stability and sensitivity even after storage over time. The water content can be measured by a known method such as the Karl Fischer method.

[0233] [Method for producing photosensitive composition] The photosensitive composition of the present invention can be produced by, for example, adding a colorant (D), a dispersing resin (F), an organic solvent (P), etc., and dispersing the mixture. The dispersion can then be mixed with an alkali-soluble resin (A), a polymerizable compound (B), a photopolymerization initiator (C), etc. The timing of mixing the materials can be arbitrary. The dispersion process can also be performed multiple times.

[0234] Examples of dispersing machines for carrying out the dispersion treatment include a two-roll mill, a three-roll mill, a ball mill, a horizontal sand mill, a vertical sand mill, an annular bead mill, and an attritor.

[0235] The average dispersed particle size (secondary particle size) of the colorant (D) in the dispersion is preferably 30 to 200 nm, more preferably 40 to 200 nm. If the colorant (D) has an appropriate particle size, a photosensitive composition with high dispersion stability is easily obtained.

[0236] The average dispersed particle size (secondary particle size) is measured using, for example, Nikkiso's Microtrac UPA-EX150, which employs dynamic light scattering (FFT power spectrum method), with particle permeability set to absorption mode, particle shape set to non-spherical, and the D50 particle size set to the average size. The dilution solvent used for measurement is the same organic solvent used for dispersion, and it is preferable to measure samples treated with ultrasound immediately after sample preparation, as this tends to provide results with little variation.

[0237] The photosensitive composition is preferably subjected to removal of coarse particles of 5 μm or larger, preferably coarse particles of 1 μm or larger, and more preferably coarse particles of 0.5 μm or larger, as well as any dust particles that have been mixed in, by means of centrifugation, filtration through a sintered filter or membrane filter, etc. The photosensitive composition of the present invention preferably contains substantially no particles of 0.5 μm or larger, and more preferably contains no particles of 0.3 μm or smaller.

[0238] <Optical filters> The optical filter of the present invention comprises a substrate and a cured film formed from a photosensitive composition, and the cured film is preferably patterned by photolithography.

[0239] [Optical filter manufacturing method] The method for producing an optical filter is not particularly limited, and can be, for example, produced by carrying out the following steps: (1) applying a photosensitive composition to a substrate to form a composition layer; (2) exposing the layer to light through a mask in a pattern; (3) developing the unexposed portions with an alkali to form a patterned cured film; and (4) heat-treating (post-baking) the pattern. In the present invention, the optical filter is produced at a temperature of 150°C or less throughout all steps, and more preferably at a temperature of 130°C or less.

[0240] The method for manufacturing the optical filter will now be described in detail.

[0241] (Process (1)) In the step (1) of forming a composition layer, the photosensitive composition is applied onto a substrate by a method such as spin coating, roll coating, slit coating, casting coating, or inkjet coating, and then dried (pre-baked) at a temperature of 50 to 100°C for 10 to 120 seconds using an oven, a hot plate, or the like, as needed. Examples of the substrate include a glass substrate, a resin substrate, and a silicon substrate. Examples of the resin substrate include a polycarbonate substrate, a polyester substrate, an aromatic polyamide substrate, a polyamideimide substrate, and a polyimide substrate. An organic light-emitting layer may be formed on these substrates. For example, an imaging element such as a CCD or a CMOS may be formed on the surface of the silicon substrate. If necessary, an undercoat layer may be provided on the substrate to improve adhesion with upper layers, prevent diffusion of substances, and flatten the substrate surface. The coating is preferably carried out so that the layer has a thickness of 0.05 to 10.0 μm after drying, and more preferably 0.3 to 5.0 μm.

[0242] (Process (2)) In the exposure step, the layer obtained in step (1) is exposed to light in a specific pattern through a mask using an exposure device such as a stepper, thereby obtaining a cured film. Examples of radiation used for exposure include ultraviolet rays such as g-rays (wavelength 436 nm), h-rays (wavelength 405 nm), and i-rays (wavelength 365 nm). Light with a wavelength of 300 nm or less can also be used. Examples of light with a wavelength of 300 nm or less include KrF rays (wavelength 248 nm) and ArF rays (wavelength 193 nm). Furthermore, the exposure may be performed by continuous irradiation with light, or by repeating irradiation and pauses of light in short cycles (for example, milliseconds or less) (pulse exposure).

[0243] (Step (3)) The cured film obtained in step (2) is subjected to an alkali development treatment, whereby the composition layer in the unexposed areas is dissolved in an alkaline aqueous solution, leaving only the cured areas, thereby obtaining a patterned cured film. Examples of the developer include alkaline compounds such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate, aqueous ammonia, ethylamine, diethylamine, dimethylethanolamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, choline, pyrrole, piperidine, and 1,8-diazabicyclo-[5.4.0]-7-undecene. The concentration of the alkaline developer is preferably from 0.001 to 10% by mass, more preferably from 0.01 to 1% by mass. The pH of the alkaline developer is preferably 11 to 13, more preferably 11.5 to 12.5. When used at an appropriate pH, it suppresses pattern roughening and peeling, and improves the remaining film rate after development.

[0244] Examples of the developing method include a dipping method, a spraying method, a puddling method, etc. The developing temperature is preferably 15 to 40° C. After the alkaline development, it is preferable to wash with pure water.

[0245] (Step (4)) In the heat treatment (post-baking), the patterned cured film obtained in step (3) is heated to sufficiently cure. The heating temperature for post-baking is preferably 150°C or lower, more preferably 130°C or lower. There is no particular lower limit to the heating temperature as long as curing can be promoted, but a temperature of 50°C or higher is preferred. The heating time is preferably 5 minutes to 1 hour, more preferably 5 minutes to 30 minutes.

[0246] The optical filter of the present invention can be used for various purposes, such as an anti-reflection filter, a color filter, a black matrix, an infrared transmission filter, a light-shielding filter, and a microlens.

[0247] <Image display device> The image display device of the present invention includes the optical filter of the present invention. Examples of the image display device include a liquid crystal display and an organic EL display. The configuration used for the image display device is not particularly limited as long as it functions as an image display device. For example, the configuration described in "Next Generation Liquid Crystal Display Technology" (by Tatsuo Uchida, published by Kogyo Chosakai Co., Ltd. in 1994) can be mentioned. The definition of image display devices and details of each image display device are described, for example, in "Electronic Display Devices" (written by Sasaki Akio, published by Kogyo Chosakai Co., Ltd. in 1990) and "Display Devices" (written by Ibuki Nobuaki, published by Sangyo Tosho Co., Ltd. in 1989).

[0248] <Solid-state imaging element> The solid-state imaging device of the present invention includes the optical filter of the present invention. The solid-state imaging device may be formed in any suitable form. For example, the solid-state imaging device may include a substrate having a plurality of photodiodes and transfer electrodes made of polysilicon or the like that constitute the light-receiving area of the solid-state imaging device (e.g., CCD image sensor, CMOS image sensor, etc.), a light-shielding film formed on the photodiodes and transfer electrodes with only the light-receiving portions of the photodiodes exposed, a device protection film made of silicon nitride or the like that is formed on the light-shielding film to cover the entire light-shielding film and the light-receiving portions of the photodiodes, and a filter on the device protection film. Furthermore, the device protection film may include a light-focusing means (e.g., a microlens, etc.; the same applies below) below the filter (closer to the substrate) on the device protection film, or a light-focusing means on the filter. The filter may also have a structure in which a cured film forming each color pixel is embedded in spaces partitioned by partition walls, for example, in a grid pattern. In this case, the partition walls preferably have a low refractive index relative to the color pixels. An imaging device including the solid-state imaging element of the present invention can be used for various purposes, such as digital cameras, electronic devices with imaging functions (such as mobile phones and smartphones), vehicle-mounted cameras, surveillance cameras, and optical sensors. [Example]

[0249] The present invention will be described in more detail below with reference to examples. However, the present invention is not limited to these examples. Note that "parts" means "parts by mass" and "%" means "% by mass." In the present invention, the nonvolatile content or nonvolatile content concentration refers to the mass remaining after leaving the sample to stand in an oven at 230°C for 30 minutes.

[0250] Before describing the examples, each measurement method will be explained.

[0251] The weight average molecular weight (Mw), number average molecular weight (Mn), acid value (mgKOH / g), and amine value (mgKOH / g) of the resin are measured as follows.

[0252] (average molecular weight of resin) The number-average molecular weight (Mn) and weight-average molecular weight (Mw) of the resin were measured by gel permeation chromatography (GPC) equipped with an RI detector. The instrument used was an HLC-8220GPC (Tosoh Corporation). Two separation columns were connected in series, and both columns were packed with "TSK-GEL SUPER HZM-N" packing. Measurements were performed at an oven temperature of 40°C, a tetrahydrofuran (THF) solution as the eluent, and a flow rate of 0.35 ml / min. The sample was dissolved in a solvent consisting of 1% by mass of the above eluent, and 20 microliters was injected. The molecular weight is expressed in terms of polystyrene.

[0253] (resin acid value) 80 ml of acetone and 10 ml of water were added to 0.5 to 1 g of resin solution, and the mixture was stirred to dissolve uniformly. The solution was titrated using an automatic titrator ("COM-555" manufactured by Hiranuma Sangyo Co., Ltd.) with a 0.1 mol / L KOH aqueous solution as the titrant to measure the acid value (mg KOH / g). The acid value per unit of nonvolatile content of the resin was calculated from the acid value of the resin solution and the concentration of nonvolatile content of the resin solution.

[0254] (Amine value of resin) The amine value of the resin is the total amine value (mgKOH / g) measured in accordance with the method of ASTM D 2074 and converted into nonvolatile content.

[0255] <Production of alkali-soluble resin (A)> (Alkali-soluble resin (A-1) solution) A separable four-neck flask was equipped with a thermometer, a condenser, a nitrogen gas inlet tube, and a stirrer. Into a reaction vessel, 160 parts of propylene glycol monomethyl ether acetate (hereinafter, PGMAc) was placed, and the vessel was heated to 120°C while nitrogen gas was injected into the vessel. At the same temperature, a mixture of 109.25 parts (62 mol%) of benzyl methacrylate, 24.1 parts (28 mol%) of methacrylic acid, 22.03 parts (10 mol%) of dicyclopentanyl methacrylate, 3.6 parts of azobisisobutyronitrile as a polymerization initiator, and PGMAc was added dropwise from the dropping tube over 2.5 hours. After the dropwise addition, the mixture was stirred for another 2 hours at 120°C. PGMAc was then added to the mixture so that the nonvolatile content was 40% by mass, thereby preparing an alkali-soluble resin (A-1) solution. The alkali-soluble resin (A-1) had an acid value of 98 mgKOH / g and a weight-average molecular weight of 17,000.

[0256] (Alkali-soluble resin (A-2) and (A-3) solutions) Alkali-soluble resins (A-2) and (A-3) were synthesized so as to have the molar ratios of the constituent components shown in Table 1, and PGMAc was added to adjust the nonvolatile content to 40 mass %.

[0257] [Table 2]

[0258] For the malonic acid-2-[[[[(2-methyl-1-oxo-2-propenyl)oxy]ethyl]amino]carbonyl]-1,3-diethyl ester listed in Table 2, Karenz MOI-DEM manufactured by Showa Denko K.K. was used. In Table 2, GMA+AA represents a polymerizable unsaturated group-containing monomer unit (a2) in a state in which, after monomer polymerization, the epoxy group derived from glycidyl methacrylate (GMA) is reacted with the carboxyl group of acrylic acid (AA), and GMA+AA+THPA represents a polymerizable unsaturated group-containing monomer unit (a2) in a state in which the hydroxyl group of the GMA+AA (the epoxy group reacts with the carboxyl group to form a hydroxyl group) is further reacted with tetrahydrophthalic anhydride (THPA) to form a carboxyl group.

[0259] <Production of polymerizable compound (B)> (Polymerizable Compound (B1-3) Having Three or More (Meth)acryloyl Groups and an Amine Structure) A four-neck flask equipped with a thermometer, a stirrer, and a reflux condenser was charged with 250 parts of a mixture of dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate, and 17.3 parts of di-n-butylamine was added at room temperature. The mixture was then reacted at 50°C for 4 hours to obtain polymerizable compound (B1-3). The reaction was carried out in a mixed atmosphere of air and nitrogen.

[0260] (Polymerizable compound (B2-3) having an acidic group and a urethane bond) A five-neck flask equipped with a stirrer, a reflux condenser, a nitrogen inlet tube, a thermometer, and a dropping tube was charged with 400 parts of dipentaerythritol pentaacrylate, 100 parts of PGMAc, and 0.5 parts of N,N-dimethylbenzylamine, and the temperature was raised to 70°C. A mixture of 66 parts of toluene diisocyanate and 66 parts of PGMAc was added dropwise from the dropping tube over 2 hours. After the dropwise addition, the mixture was reacted at a temperature of 50 to 70°C for 8 hours, and the IR reading was 2180 cm. ー1 The disappearance of the isocyanate absorption was confirmed. Next, 35 parts of mercaptoacetic acid and 0.6 parts of 4-methoxyphenol were charged and reacted at a temperature of 50 to 60°C for 6 hours to obtain a polymerizable compound (B2-3) having an acidic group and a urethane bond. PGMAc was added so that the nonvolatile content became 50% by mass.

[0261] <Production of Colorant (D)> (Finely divided blue pigment (D-1)) 100 parts of CI Pigment Blue 15:6, 1,000 parts of sodium chloride, and 100 parts of diethylene glycol were charged into a stainless steel 1-gallon kneader (manufactured by Inoue Seisakusho Co., Ltd.) and kneaded for 12 hours at 50° C. This mixture was poured into 3,000 parts of warm water, and stirred for about 1 hour with a high-speed mixer while heating to about 70° C. to form a slurry. The slurry was filtered and washed repeatedly with water to remove the sodium chloride and diethylene glycol, then dried at 80° C. for 24 hours and pulverized to obtain a finely divided blue pigment (D-1).

[0262] (Finely divided blue pigment (D-2)) 100 parts of CI Pigment Blue 15:3, 1,000 parts of sodium chloride, and 100 parts of diethylene glycol were charged into a stainless steel 1-gallon kneader (manufactured by Inoue Seisakusho Co., Ltd.) and kneaded for 12 hours at 50° C. This mixture was poured into 3,000 parts of warm water, and while heated to about 70° C., the mixture was stirred in a high-speed mixer for about 1 hour to form a slurry. After filtering and repeatedly washing with water to remove the sodium chloride and diethylene glycol, the mixture was dried at 80° C. for 24 hours and pulverized to obtain a finely divided blue pigment (D-2).

[0263] (Finely divided purple pigment (D-3)) 100 parts of CI Pigment Violet 23, 1,000 parts of sodium chloride, and 100 parts of diethylene glycol were charged into a stainless steel 1-gallon kneader (manufactured by Inoue Seisakusho Co., Ltd.) and kneaded for 12 hours at 70° C. This mixture was poured into 3,000 parts of warm water, and stirred for about 1 hour with a high-speed mixer while heating to about 70° C. to form a slurry. The slurry was filtered and washed with water repeatedly to remove the sodium chloride and diethylene glycol, then dried at 80° C. for 24 hours and pulverized to obtain a finely divided purple pigment (D-3).

[0264] (Finely divided red pigment (D-4)) 100 parts of CI Pigment Red 177, 1,200 parts of sodium chloride, and 120 parts of diethylene glycol were charged into a stainless steel 1-gallon kneader (manufactured by Inoue Seisakusho Co., Ltd.) and kneaded for 6 hours at 60° C. Next, this mixture was added to 3,000 parts of warm water, and while heated to approximately 80° C., it was stirred for 1 hour using a high-speed mixer to form a slurry, which was then filtered and washed with water to remove the sodium chloride and diethylene glycol. After that, it was dried at 80° C. for 24 hours and pulverized to obtain a finely divided red pigment (D-4).

[0265] (Finely divided yellow pigment (D-5)) 100 parts of CI Pigment Yellow 139, 800 parts of sodium chloride, and 100 parts of diethylene glycol were charged into a stainless steel 1-gallon kneader (manufactured by Inoue Seisakusho) and kneaded for 12 hours at 70° C. This mixture was poured into 3,000 parts of warm water, and stirred with a high-speed mixer for about 1 hour while heated to about 70° C. to form a slurry. After repeated filtration and washing with water to remove the sodium chloride and diethylene glycol, the slurry was dried at 80° C. for 24 hours and pulverized to obtain a finely divided yellow pigment (D-5).

[0266] (Finely divided green pigment (D-6)) 100 parts of CI Pigment Green 58, 1,200 parts of sodium chloride, and 120 parts of diethylene glycol were charged into a stainless steel 1-gallon kneader (manufactured by Inoue Seisakusho Co., Ltd.) and kneaded for 6 hours at 70° C. This kneaded mixture was poured into 3,000 parts of warm water, and stirred for 1 hour with a high-speed mixer while heated to 70° C. to form a slurry. The slurry was filtered and washed with water repeatedly to remove the sodium chloride and diethylene glycol, then dried overnight at 80° C. and pulverized to obtain a finely divided green pigment (D-6).

[0267] (Finely divided green pigment (D-7)) 100 parts of CI Pigment Green 36, 1,200 parts of sodium chloride, and 120 parts of diethylene glycol were charged into a stainless steel 1-gallon kneader (manufactured by Inoue Seisakusho Co., Ltd.) and kneaded for 6 hours at 70° C. This kneaded mixture was poured into 3,000 parts of warm water, and stirred for 1 hour with a high-speed mixer while heated to 70° C. to form a slurry. The slurry was filtered and washed with water repeatedly to remove the sodium chloride and diethylene glycol, then dried overnight at 80° C. and pulverized to obtain a finely divided green pigment (D-7).

[0268] <Production of Dispersion Resin (F)> (Dispersion resin (F-1) solution) A reaction vessel equipped with a gas inlet tube, thermometer, condenser, and stirrer was charged with 108 parts of 1-thioglycerol, 174 parts of pyromellitic anhydride, 650 parts of PGMAc, and 0.2 parts of monobutyltin oxide as a catalyst. The atmosphere was purged with nitrogen gas, and the reaction was carried out at 120 °C for 5 hours (Step 1). Measurement of the acid value confirmed that 95% or more of the acid anhydride had been half-esterified. Next, 160 parts (based on nonvolatile content) of the compound obtained in Step 1, 200 parts of 2-hydroxypropyl methacrylate, 200 parts of ethyl acrylate, 150 parts of t-butyl acrylate, 200 parts of 2-methoxyethyl acrylate, 200 parts of methyl acrylate, 50 parts of methacrylic acid, and 663 parts of PGMAc were charged, and the reaction vessel was heated to 80 °C. 1.2 parts of 2,2'-azobis(2,4-dimethylvaleronitrile) was added, and the reaction was carried out for 12 hours (Step 2). Measurement of the nonvolatile content confirmed that 95% had reacted. Finally, 500 parts of a 50% PGMAc solution of the compound obtained in the second step, 27.0 parts of 2-methacryloyloxyethyl isocyanate (MOI), and 0.1 parts of hydroquinone were added, and the reaction was continued until the disappearance of the peak at 2270 cm-1 due to the isocyanate group was confirmed by IR (third step). After confirming the disappearance of the peak, the reaction solution was cooled, and the nonvolatile content was adjusted with PGMAc to obtain a dispersion resin (F-1) solution with a nonvolatile content of 30% by mass. The dispersion resin (F-1) had an acid value of 68 mg KOH / g, an unsaturated double bond equivalent of 1,593, and a weight-average molecular weight of 13,000.

[0269] (Dispersion resin (F-2) solution) A reaction vessel equipped with a gas inlet tube, thermostat, condenser, and stirrer was charged with 10 parts methacrylic acid, 100 parts methyl methacrylate, 70 parts i-butyl methacrylate, 20 parts benzyl methacrylate, and 50 parts PGMAc, and the atmosphere was purged with nitrogen gas. The reaction vessel was heated to 50°C with stirring, and 12 parts 3-mercapto-1,2-propanediol was added. The temperature was raised to 90°C, and a solution of 0.1 parts 2,2'-azobisisobutyronitrile in 90 parts propylene glycol monomethyl ether acetate (PGMAc) was added and the reaction was continued for 7 hours. Measurement of the nonvolatile content confirmed that 95% reaction had occurred. 19 parts pyromellitic anhydride, 50 parts PGMAc, 50 parts cyclohexanone, and 0.4 parts 1,8-diazabicyclo-[5.4.0]-7-undecene as a catalyst were added, and the reaction was continued for 7 hours at 100°C. The reaction was terminated after confirming that 98% or more of the acid anhydride had been half-esterified by measuring the acid value, and the mixture was diluted with PGMAc to a non-volatile content of 30% by mass to obtain a dispersion resin (F-2) solution. The dispersion resin (F-2) had an acid value of 70 mgKOH / g and a weight-average molecular weight of 8,500.

[0270] (Dispersion resin (F-3) solution) A reactor equipped with a gas inlet tube, condenser, stirring blade, and thermometer was charged with 30 parts of methyl methacrylate, 30 parts of n-butyl methacrylate, 20 parts of hydroxyethyl methacrylate, and 13.2 parts of tetramethylethylenediamine. The mixture was stirred at 50°C for 1 hour while flowing nitrogen, and the system was purged with nitrogen. Next, 9.3 parts of ethyl bromoisobutyrate, 5.6 parts of cuprous chloride, and 133 parts of PGMAc were charged, and the temperature was raised to 110°C under a nitrogen stream to initiate polymerization of the first block (B block). After 4 hours of polymerization, a sample of the polymerization solution was taken and the nonvolatile content was measured. Based on the nonvolatile content, it was confirmed that the polymerization conversion was 98% or higher. Next, 61 parts of PGMAc and 20 parts of 1,2,2,6,6-pentamethylpiperidyl methacrylate (Hitachi Chemical Co., Ltd., Fancryl FA-711MM) as the second block (A block) monomer were added to the reactor, and the reaction was continued with stirring while maintaining the temperature at 110°C under a nitrogen atmosphere. Two hours after adding the 1,2,2,6,6-pentamethylpiperidyl methacrylate, a sample of the polymerization solution was taken and the nonvolatile content was measured. Based on the nonvolatile content, it was confirmed that the polymerization conversion rate of the second block (A block) was 98% or higher. The reaction solution was then cooled to room temperature to terminate the polymerization. PGMAc was added to dilute the solution to a nonvolatile content of 30% by mass, yielding a dispersion resin (F-3) solution. The dispersion resin (F-3) had an amine value of 57 mgKOH / g and a number-average molecular weight of 4,500.

[0271] <Preparation of Dispersion> (Dispersion 1) The following raw materials were mixed and stirred until uniform, then dispersed in an Eiger mill (Eiger Japan, "Mini Model M-250 MKII") using zirconia beads with a diameter of 0.5 mm for 3 hours, and then filtered through a filter with a pore size of 1.0 μm to produce Dispersion 1. The organic solvent (P-1) was PGMAc. Finely divided blue pigment (D-1): 10.0 parts Dispersion resin (F-1) solution: 10.0 parts Dispersion resin (F-2) solution: 5.0 parts Organic solvent (P-1): 75.0 parts

[0272] (Dispersion 2~7) Dispersions 2 to 7 were prepared in the same manner as Dispersion 1, except that the raw materials and amounts shown in Table 3 were changed.

[0273] [Table 3]

[0274] <Production of Photosensitive Composition> [Example 1] (Photosensitive composition 1) The following raw materials were mixed and stirred, and then filtered through a filter with a pore size of 1.0 μm to obtain Photosensitive Composition 1. Dispersion 3: 1.6 parts Dispersion 6: 1.6 parts Alkali-soluble resin (A-1) solution: 4.0 parts Alkali-soluble resin (A-3) solution: 10.0 parts Polymerizable compound (B1-1): 4.0 parts Polymerizable compound (B2-2): 8.0 parts Polymerizable compound (B2-4): 1.0 part Photopolymerization initiator (C1-1): 1.0 part Leveling agent (M): 1.0 part Organic solvent (P): 67.8 parts

[0275] [Examples 2 to 24, Comparative Examples 1 and 2] (Photosensitive compositions 2-26) Photosensitive compositions 2 to 26 were prepared in the same manner as in Example 1, except that the raw materials and amounts of photosensitive composition 1 in Example 1 were changed to those shown in Tables 4-1 to 4-3.

[0276] [Table 4-1]

[0277] [Table 4-2]

[0278] [Table 4-3]

[0279] The raw materials listed in Tables 4-1 to 4-3 are as follows:

[0280] [Polymerizable compound (B)] (Polymerizable Compound (B1) Having Three or More (Meth)acryloyl Groups and an Amine Structure) B1-1: Aronix MT-3041 (manufactured by Toagosei Co., Ltd.) B1-2: Aronix MT-3042 (manufactured by Toagosei Co., Ltd.) B1-3: See the manufacturing example above

[0281] (Polymerizable compound (B2)) B2-1: Aronix M-510 (manufactured by Toagosei Co., Ltd., a polymerizable compound having an acidic group) B2-2: Aronix M-520 (manufactured by Toagosei Co., Ltd., a polymerizable compound having an acidic group) B2-3: See the manufacturing example above B2-4: Etercure 6361-100 (Eternal Materials, polymerizable compound with a hyperbranched structure) B2-5: Aronix M-402 (manufactured by Toagosei Co., Ltd., a mixture of dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate)

[0282] [Photopolymerization initiator (C)] (Photopolymerization initiator (C1) represented by general formula (1)) C1-1: Photopolymerization initiator of the above chemical formula (2) C1-2: Photopolymerization initiator of the above chemical formula (3)

[0283] (Photopolymerization initiator (C2)) C2-1: Irgacure OXE-02 (BASF)

[0284] [Leveling agent (M)] M-1: BYK-330 (BYK-Chemie) M-2: Megafac F-554 (DIC) One part each of (M-1) and (M-2) was mixed and dissolved in 98 parts of PGMAc to prepare a mixed solution, which was used as a leveling agent (M).

[0285] [Organic solvent (P)] P-1: 30 parts of propylene glycol monomethyl ether acetate P-2: 30 parts cyclohexanone P-3: 10 parts of ethyl 3-ethoxypropionate P-4: Propylene glycol monomethyl ether 10 parts P-5: Cyclohexanol acetate 10 parts P-6: Dipropylene glycol methyl ether acetate 10 parts The above (P-1) to (P-6) were mixed in the above-mentioned parts by mass to prepare the organic solvent (P).

[0286] <Evaluation of Photosensitive Composition> The pattern formability, solvent resistance, and flatness of the obtained photosensitive compositions 1 to 26 (Examples 1 to 24 and Comparative Examples 1 and 2) were evaluated by the following methods. The evaluation results are shown in Table 5.

[0287] [Pattern Formability Evaluation (1): Developability] The photosensitive composition thus obtained was applied by spin coating to a glass substrate (Corning Eagle 2000) measuring 100 mm in length, 100 mm in width, and 0.7 mm in thickness so that the dried film thickness would be 2.0 μm, and then dried on a hot plate at 70° C. for 1 minute. After cooling the substrate to room temperature, the substrate was irradiated with a high-pressure mercury lamp at an illuminance of 30 mW / cm. 2 , 50mJ / cm 2 The substrate was exposed to ultraviolet light through a photomask with a 100 μm wide stripe pattern at 100°C. After cooling to room temperature, the substrate was spray-developed using an aqueous developer containing 0.12% of a nonionic surfactant and 0.04% of potassium hydroxide at 23°C, washed with ion-exchanged water, and air-dried. The pattern was observed under an optical microscope to evaluate the presence or absence of development residues in the unexposed areas and pattern defects. The evaluation criteria are as follows, with 3 or more being practical. 5: After a development time of 70 seconds, there was no development residue in the unexposed areas and no pattern defects. 4: At a development time of 70 seconds, slight development residue occurred in the unexposed area and / or slight pattern defects occurred. 3: At a development time of 70 seconds, a small amount of development residue was observed in the unexposed area, and / or a small amount of pattern loss occurred. 2: At a development time of 70 seconds, development residue occurred in the unexposed area and / or pattern defects occurred. 1: Pattern defects occurred at a development time of 40 seconds.

[0288] [Pattern Formability Evaluation (2): Line Width] The obtained photosensitive coloring composition was applied by spin coating to a 100mm x 100mm x 0.7mm thick glass substrate (Corning Eagle 2000) so that the dried film thickness was 2.0μm, and then dried on a hot plate at 70°C for 1 minute. The substrate was then cooled to room temperature and exposed to ultraviolet light using a high-pressure mercury lamp through a photomask with a 25μm wide stripe pattern. The exposure dose was adjusted so that the average width of the line portions of the pattern obtained after development was 25μm at 50 locations. The substrate was then spray-developed at 23°C using an aqueous developer containing 0.12% nonionic surfactant and 0.04% potassium hydroxide, washed with ion-exchanged water, and air-dried to obtain an evaluation substrate. The resulting substrate was subjected to measurement of the line width of the pattern at 50 locations using a Nikon ECLIPSE LV100POL Model optical microscope to determine the line width variation (3σ). The evaluation criteria are as follows, with 3 or more being practical. 5: Line width variation is less than 1.0 μm 4: Line width variation is 1.0 μm or more and less than 1.5 μm 3: Line width variation is 1.5 μm or more and less than 3.0 μm 2: Line width variation is 3.0 μm or more and less than 3.5 μm 1: Line width variation is 3.5 μm or more

[0289] [Pattern Formability Evaluation (3): Residual Film Rate] The obtained photosensitive composition was applied by spin coating to a glass substrate (Corning Eagle 2000) measuring 100 mm in length, 100 mm in width, and 0.7 mm in thickness so that the dried film thickness would be 2.0 μm, and then dried on a hot plate at 70° C. for 1 minute. Then, after cooling the substrate to room temperature, the substrate was irradiated with a high-pressure mercury lamp at an illumination intensity of 30 mW / cm through a photomask having a 100 μm-wide stripe pattern. 2 , 50mJ / cm 2 The substrate was then spray-developed using an aqueous developer containing 0.12% nonionic surfactant and 0.04% potassium hydroxide at 23°C, and the coating thickness was measured after washing with ion-exchanged water and air-drying. This film thickness is the post-development film thickness. The substrate was then post-baked in a clean oven at 100°C for 60 minutes, and the film thickness was measured at the same location as the post-development film thickness. This film thickness is the post-baking film thickness. The remaining film ratio was calculated from the two film thicknesses using the following formula (1). The evaluation criteria are as follows, with a score of 3 or higher being considered practical. The film thickness was measured using Dektak 3030 (manufactured by Japan Vacuum Engineering Co., Ltd.). Formula (1): Remaining film rate (%) = film thickness after post-baking ÷ film thickness after development × 100 5: Remaining film rate 85% or more 4: Remaining film rate: 80% or more but less than 85% 3: Remaining film rate: 75% or more but less than 80% 2: Remaining film rate: 70% or more but less than 75% 1: Less than 70% remaining film

[0290] [Solvent resistance evaluation] The photosensitive composition thus obtained was applied by spin coating to a glass substrate (Corning Eagle 2000) measuring 100 mm in length, 100 mm in width, and 0.7 mm in thickness so that the dried film thickness would be 2.0 μm, and then dried on a hot plate at 70° C. for 1 minute. After cooling the substrate to room temperature, the substrate was irradiated with a high-pressure mercury lamp at an illuminance of 30 mW / cm. 2 , 50mJ / cm 2The substrate was exposed to ultraviolet light through a photomask with a 100 μm wide stripe pattern. After cooling to room temperature, the substrate was spray-developed using an aqueous developer containing 0.12% nonionic surfactant and 0.04% potassium hydroxide at 23°C, washed with ion-exchanged water, and air-dried. The resulting substrate was post-baked in a clean oven at 100°C for 60 minutes to obtain a substrate for evaluation of solvent resistance. The obtained evaluation substrate was immersed in propylene glycol monomethyl ether acetate at room temperature for 15 minutes, then washed with ion-exchanged water and air-dried, and the 100 μm wide stripe pattern was observed using an optical microscope. The evaluation criteria are as follows, with a score of 3 or higher being considered practical. 5: No change in appearance or color. 4: Slight wrinkles, etc., occur, but there is no change in color. 3: Some wrinkles or other imperfections occur, but there is no change in color. 2: Wrinkles and other imperfections appear all over the surface, and the color fades slightly. 1: Peeling and fading occur.

[0291] [Flatness evaluation] The obtained photosensitive composition was applied by spin coating to a glass substrate on which a colored pattern with a pattern interval of 100 μm and a thickness of 1.5 μm had been formed so that the film thickness after drying in the areas without the colored pattern would be 3.0 μm, and then dried on a hot plate at 70°C for 1 minute. Then, the coating was dried at an illuminance of 30 mW / cm. 2 , 50mJ / cm 2 The entire surface was exposed to light at 100° C. Furthermore, this substrate was post-baked in a clean oven at 100° C. for 60 minutes to obtain a substrate for flatness evaluation. The thickness (d1) of the portion with the colored pattern and the thickness (d2) of the portion without the colored pattern of the obtained evaluation substrate were measured, and the flatness (d0) was evaluated using the following formula (2). The evaluation criteria are as follows, with a score of 3 or higher being considered practical. The film thickness was measured using Dektak 3030 (manufactured by Japan Vacuum Engineering Co., Ltd.). Formula (2): Flatness (d0)(%)=d2÷d1×100 5: Over 90% 4: 85% or more, less than 90% 3: 80% or more, less than 85% 2: 75% or more, less than 80% 1: Less than 75%

[0292] [ka]

[0293] [Table 5]

Claims

1. A photosensitive composition comprising an alkali-soluble resin (A), a polymerizable compound (B), and a photopolymerization initiator (C), the polymerizable compound (B) contains a polymerizable compound (B1) having three or more (meth)acryloyl groups and an amine structure, the polymerizable compound (B1) having three or more (meth)acryloyl groups and an amine structure comprises a Michael addition reaction product of a (meth)acrylate compound (X) and an amine compound (Y), the (meth)acrylate compound (X) is at least one selected from the group consisting of dipentaerythritol penta(meth)acrylate and dipentaerythritol hexa(meth)acrylate, the amine compound (Y) is at least one selected from the group consisting of dibutylamine and diethanolamine, The photosensitive composition, wherein the photopolymerization initiator (C) comprises a photopolymerization initiator (C1) represented by the following general formula (1): General formula (1) 【Chemical 1】 (In general formula (1), R １ , R ２ R each independently represents a hydrogen atom or an alkyl group having 1 to 8 carbon atoms. ３ represents a hydrogen atom or a nitro group.

2. 2. The photosensitive composition according to claim 1, wherein the polymerizable compound (B) comprises a polymerizable compound (B2) other than the polymerizable compound (B1) having three or more (meth)acryloyl groups and an amine structure.

3. The photosensitive composition according to claim 2 , wherein the polymerizable compound (B2) includes a polymerizable compound having an acidic group.

4. 4. The photosensitive composition according to claim 1, wherein the content of the polymerizable compound (B1) having three or more (meth)acryloyl groups and an amine structure is 5 to 80 mass% relative to 100 mass% of the polymerizable compound (B).

5. The photosensitive composition according to any one of claims 1 to 4, wherein the content of the photopolymerization initiator (C1) represented by the general formula (1) is 4 to 12 parts by mass per 100 parts by mass of the polymerizable compound (B).

6. The photosensitive composition according to any one of claims 1 to 5, further comprising a colorant (D), and the content of the colorant (D) is 5% by mass or less based on 100% by mass of the nonvolatile content of the photosensitive composition.

7. 7. The photosensitive composition according to claim 6, wherein the colorant (D) comprises two or more pigments selected from the group consisting of red pigments, yellow pigments, blue pigments, green pigments and violet pigments.

8. An optical filter comprising a substrate and a cured film formed from the photosensitive composition according to any one of claims 1 to 7.

9. An image display device comprising the optical filter according to claim 8.

10. A solid-state imaging device comprising the optical filter according to claim 8.

Images