Interdigitated Contact Fingers for Crack Prevention in Thin Substrate Handling

Abstract

A contact for providing a connection to a substrate in a substrate plating system includes a body having an arcuate shape. The arcuate shape of the body is configured to match the shape of a lip seal of the substrate plating system and at least a portion of a cup-shaped substrate. A plurality of first contact fingers extend a first distance from the body. A plurality of second contact fingers extend a second distance from the body. The first distance is greater than the second distance.

Description

[Technical Field]

[0001] [CROSS-REFERENCE TO RELATED APPLICATIONS] This application claims the benefit of U.S. Provisional Patent Application No. 63 / 018,039, filed April 30, 2020. The disclosures of the above applications are incorporated herein by reference in their entireties.

[0002] FIELD OF THE DISCLOSURE The present disclosure relates to electroplating systems, and more particularly to interdigitated contact fingers for electroplating systems. [Background technology]

[0003] The background description provided herein is intended to present the contents of the present disclosure generally. Work by the presently named inventors within the scope of what is described in this Background section, as well as aspects of the description that may not otherwise be considered prior art at the time of filing, are not admitted, expressly or impliedly, as prior art against the present disclosure.

[0004] In some applications, grinding wheels are used to thin substrates, such as semiconductor wafers, to a desired thickness before downstream processing. In some cases, the substrate may be thinned to a thickness that is insufficient to support it during grinding, subsequent handling, and / or downstream processing. In this case, the substrate is bonded to a carrier substrate that acts as a support structure and is then removed from the carrier substrate when processing is complete. Even with the additional support provided by the carrier substrate, the substrate is susceptible to cracking and chipping during downstream processing. Summary of the Invention

[0005] A contact for providing connection to a substrate in a substrate plating system includes a body having an arcuate shape. The arcuate shape of the body is configured to fit the shape of at least a portion of a substrate disposed on a lip seal and cup of the substrate plating system. A plurality of first contact fingers extend a first distance from the body. A plurality of second contact fingers extend a second distance from the body. The first distance is greater than the second distance.

[0006] In other features, the plurality of first contact fingers are configured to contact a seed layer disposed on a substrate bonded to the carrier substrate during a plating process. The plurality of second contact fingers are configured to contact the carrier substrate at a location outward from a radially outer edge of the substrate during a plating process. One of the plurality of first contact fingers alternates with one of the plurality of second contact fingers. P of the plurality of first contact fingers are positioned immediately adjacent to one another and Q of the plurality of second contact fingers are positioned immediately adjacent to one another. P and Q are integers greater than or equal to 1. P and Q are greater than or equal to 1 and less than 20. P is greater than Q. Q is greater than P.

[0007] In other features, the plurality of third contact fingers extend a third distance different from the first distance and the second distance. A plurality of "U"-shaped notches are disposed between the plurality of first contact fingers and the plurality of second contact fingers. The plurality of first contact fingers are joined at their radially outer ends.

[0008] In other features, a radially inner end of at least one of the plurality of first contact fingers has a "V" shaped profile. The first distance is in the range of 0.6 mm to 4.2 mm and the second distance is in the range of 0.2 mm to 1.0 mm. The first contact finger has a thickness in the range of 0.001 inch to 0.0045 inch and the second contact finger has a thickness in the range of 0.0035 inch to 0.007 inch. The body of the contact is annular.

[0009] In other features, the contact includes N bodies, each of which spans 360° / N and which are arranged consecutively around the circumference of the lip seal. The plating system includes the contact, a cup, and a lip seal arranged on the cup. The contact is positioned between the lip seal and the substrate during the plating process.

[0010] The contact configured to rest on the lip seal of the cup includes a first body having an arcuate shape with a plurality of first contact fingers extending a first distance from the first body and a plurality of first spaces disposed between selected ones of the first contact fingers. The second body has an arcuate shape and includes a plurality of second contact fingers extending a second distance from the second body and a plurality of second spaces disposed between selected ones of the first contact fingers. The second distance is greater than the first distance. The first body and the second body are configured to overlap the plurality of first contact fingers aligned with the plurality of second spaces and the plurality of second contact fingers aligned with the plurality of first spaces.

[0011] In other features, the plurality of second contact fingers are configured to contact a seed layer of a substrate bonded to a carrier substrate, the plurality of first contact fingers are configured to contact the carrier substrate radially outward from the substrate, and the plurality of first contact fingers are configured to contact the seed layer outward from a radial outer edge of the substrate.

[0012] The plating system includes a contact, a cup, and a lip seal disposed over the cup.

[0013] A contact for providing electrical connection to a substrate in a substrate plating system includes a first body and a second body. The first body has an arcuate shape and includes N first contact fingers extending a first distance from the first body, where N is an integer greater than 1. The second body has an arcuate shape and includes M second contact fingers extending a second distance from the second body, where M is an integer greater than 1. The ratio of N:M is 1:P, where P is a positive integer. The second distance is greater than the first distance. The N first contact fingers and the M second contact fingers have the same width. The first body and the second body are configured to overlap, and the N first contact fingers are aligned with and stacked on top of at least a plurality of the M second contact fingers.

[0014] In another aspect, P=1, P=2, or P=3.

[0015] In another feature, the M second contact fingers are configured to contact a seed layer of a substrate bonded to the carrier substrate.

[0016] In another feature, the N first contact fingers are configured to contact the carrier substrate radially outward from the substrate.

[0017] In another feature, the N first contact fingers are configured to contact the seed layer outward from a radially outer edge of the substrate.

[0018] Further scope of applicability of the present disclosure will become apparent from the detailed description, claims, and drawings. The detailed description and specific examples are for purposes of illustration only and are not intended to limit the scope of the present disclosure. [Brief explanation of the drawings]

[0019] The present disclosure will become more fully understood from the following detailed description and the accompanying drawings.

[0020] [Figure 1A]FIG. 1A illustrates a method for attaching a substrate to a carrier substrate. [Figure 1B] FIG. 1B illustrates a method for attaching a substrate to a carrier substrate. [Figure 1C] FIG. 1C illustrates a method for attaching a substrate to a carrier substrate. [Figure 1D] FIG. 1D illustrates a method for attaching a substrate to a carrier substrate. [Figure 1E] FIG. 1E illustrates a method for attaching a substrate to a carrier substrate. [Figure 1F] FIG. 1F illustrates a method for attaching a substrate to a carrier substrate.

[0021] [Figure 2A] FIG. 2A illustrates a problem that can arise when attaching a substrate to a carrier substrate. [Figure 2B] FIG. 2B illustrates a problem that can arise when attaching a substrate to a carrier substrate. [Figure 2C] FIG. 2C illustrates a problem that can arise when attaching a substrate to a carrier substrate. [Figure 2D] FIG. 2D illustrates a problem that can arise when attaching a substrate to a carrier substrate.

[0022] [Figure 3] FIG. 3 is a side cross-sectional view of a substrate holder used during the plating process of a substrate.

[0023] [Figure 4A] FIG. 4A is an enlarged view showing the contact fingers during the plating process. [Figure 4B] FIG. 4B is an enlarged view showing the contact fingers during the plating process.

[0024] [Figure 5A] FIG. 5A is a plan view showing a contact including an arcuate body. [Figure 5B]FIG. 5B is a plan view showing a contact including contact fingers.

[0025] [Figure 5C] FIG. 5C is a plan view of an example contact including interdigitated contact fingers according to the present disclosure.

[0026] [Figure 5D] FIG. 5D is a side view showing the interdigitated contact fingers in contact with the substrate.

[0027] [Figure 6A] FIG. 6A is a plan view of another example of a contact including interdigitated contact fingers according to the present disclosure. [Figure 6B] FIG. 6B is a plan view of another example of a contact including interdigitated contact fingers according to the present disclosure. [Figure 6C] FIG. 6C is a plan view of another example of a contact including interdigitated contact fingers according to the present disclosure. [Figure 6D] FIG. 6D is a plan view of another example of a contact including interdigitated contact fingers according to the present disclosure. [Figure 6E] FIG. 6E is a plan view of another example of a contact including interdigitated contact fingers according to the present disclosure.

[0028] [Figure 7A] FIG. 7A is a plan view of another example of an overlapping contact including interdigitated contact fingers according to the present disclosure. [Figure 7B] FIG. 7B is a plan view of another example of an overlapping contact including interdigitated contact fingers according to the present disclosure. [Figure 7C] FIG. 7C is a plan view of another example of an overlapping contact including interdigitated contact fingers according to the present disclosure.

[0029] [Figure 7D]FIG. 7D is a side view showing an overlapping contact including interdigitated contact fingers in contact with a substrate.

[0030] [Figure 8A] FIG. 8A is a side view illustrating variations in the contours of interdigitated contact fingers according to the present disclosure. [Figure 8B] FIG. 8B is a side view illustrating a variation in the profile of a multi-component contact finger according to the present disclosure. [Figure 8C] FIG. 8C is a side view illustrating a variation in the profile of a multi-component contact finger according to the present disclosure. [Figure 8D] FIG. 8D is a side view illustrating a variation in the profile of a mated contact finger according to the present disclosure.

[0031] [Figure 9A] FIG. 9A is a diagram showing variations in width of interdigitated contact fingers. [Figure 9B] FIG. 9B shows variations in width of interdigitated contact fingers. [Figure 9C] FIG. 9C shows variations in width of interdigitated contact fingers.

[0032] [Figure 10A] FIG. 10A illustrates a contact finger having a "V" shaped end profile at the radially inner end of the interdigitated contact finger in accordance with the present disclosure. [Figure 10B] FIG. 10B illustrates a contact finger having a "V" shaped end profile at the radially inner end of the interdigitated contact finger in accordance with the present disclosure.

[0033] [Figure 11A] FIG. 11A is a side view illustrating the effect of different interdigitated contact finger geometries on the spring force against the substrate surface. [Figure 11B]FIG. 11B is a side view illustrating the effect of different interdigitated contact finger geometries on the spring force against the substrate surface. [Figure 11C] FIG. 11C is a side view illustrating the effect of different interdigitated contact finger geometries on the spring force against the substrate surface.

[0034] [Figure 12A] FIG. 12A illustrates different types of contacts according to the present disclosure. [Figure 12B] FIG. 12B illustrates different types of contacts according to the present disclosure. [Figure 12C] FIG. 12C illustrates different types of contacts according to the present disclosure.

[0035] [Figure 13A] FIG. 13A is a plan view of another example of an overlapping contact including interdigitated contact fingers according to the present disclosure. [Figure 13B] FIG. 13B is a plan view of another example of an overlapping contact including interdigitated contact fingers according to the present disclosure. [Figure 13C] FIG. 13C is a plan view of another example of an overlapping contact including interdigitated contact fingers according to the present disclosure.

[0036] [Figure 14A] FIG. 14A is a plan view of another example of an overlapping contact including interdigitated contact fingers according to the present disclosure. [Figure 14B] FIG. 14B is a plan view of another example of an overlapping contact including interdigitated contact fingers according to the present disclosure. [Figure 14C] FIG. 14C is a plan view of another example of an overlapping contact including interdigitated contact fingers according to the present disclosure.

[0037] [Figure 15] FIG. 15 is a side view of the overlapping contact of FIGS. 13A-14C including stacked contact fingers in contact with a substrate.

[0038] Among the drawings, reference numbers may be reused to identify similar and / or identical elements. DETAILED DESCRIPTION OF THE INVENTION

[0039] The present disclosure relates to a contact used during substrate processing, such as plating. The contact according to the present disclosure includes interdigitated contact fingers. A first group of the interdigitated contact fingers is designed to contact a radially outer edge of a substrate bonded to a carrier substrate. The first group of the contact fingers provides electrical connection to a seed layer on the substrate during a plating process. A second group of the interdigitated contact fingers is designed to contact the carrier substrate radially outward of the substrate. The second group of the contact fingers helps break a seal formed on the substrate by a lip seal.

[0040] 1A-1F, a method for attaching a substrate 14, such as an activated Si wafer, to a carrier substrate 10 is shown. In FIG. 1A, an adhesive layer 12 is applied to a first side of one side of the carrier substrate 10. In FIG. 1B, the first side of the substrate 14 is placed in contact with the adhesive layer 12. In FIG. 1C, the second side of the substrate 14 is polished with a grinding wheel to reduce the thickness of the substrate 18 to a desired thickness.

[0041] In Figure 1D, during and after polishing, the thinned substrate 18 is supported by the carrier substrate 10 to prevent damage during handling or other downstream processing. In Figure 1E, handling and / or deposition, etching, patterning, plating and / or other substrate processing occurs (typically on the side of the substrate that was not polished). In Figure 1E, the substrate 18 is finally separated from the carrier substrate 10 to produce the thinned and processed substrate.

[0042] 2A-2D, several challenges can arise when attaching a substrate 14 to a carrier substrate. In the example of FIG. 2A, a bonded substrate assembly 200 includes a carrier substrate 10 and other layers 204, including an adhesion layer 12, a substrate 210, and a seed layer 214. In some examples, the seed layer 214 is a copper (Cu) seed layer. In some examples, the carrier substrate 10 is made of glass or silicon and has a thickness in the range of 400-700 μm, although other thicknesses are also usable. In some examples, the thickness of the substrate 18 after polishing is in the range of 10-150 μm, although other thicknesses are also usable.

[0043] In Figure 2B, the seed layer 214 may cover a portion of the carrier substrate, as shown at 230. In Figure 2C, the adhesion layer 12 may not extend all the way under the substrate 210, which may make the substrate more susceptible to cracking or crazing. In Figure 2D, the adhesion layer 12 may extend beyond the substrate 210, as shown at 250.

[0044] Referring now to FIG. 3 , plating assembly 300 includes a cup 312 and a cone 314. While a particular assembly is illustrated for discussion purposes, other types of assemblies, handling devices, or processing equipment may be used. Cup 312 is supported by a top plate 310 and support posts 316. A bonded substrate 320 typically rests atop cup 312, which supports the substrate. Cup 312 includes an opening through which electrolyte from a plating cell contacts substrate 320. Substrate 320 has a front / working side 322 where plating occurs. The outer periphery of substrate 320 rests on lip seal 330 of cup 312. A spindle 334 presses cone 314 against cone seal 336, securing and sealing substrate 320 against lip seal 330. A contact ring 350, including contact fingers, is positioned between the upward-facing surface of lip seal 330 and the downward-facing surface of substrate 320. The contact ring 350 provides an electrical connection to the substrate 320 during the plating process.

[0045] 4A and 4B, contact fingers of a contact are shown during plating or other substrate processing. In FIG. 4A, contact fingers 414 rest on lip seal 412, which is supported by a cup (not shown). Radially inner ends 416 of contact fingers 414 act as springs as mating substrate 418 is pressed against lip seal 412. In FIG. 4B, pressure from radially inner ends 416 of contact fingers 414 against substrate 210 can cause cracks in substrate 210 and / or crazing of one or more layers, as shown at 204-1.

[0046] The contact fingers serve as the electrical connection from the power supply to the substrate. Several contact fingers are required to make good electrical contact with the seed layer 214 on the substrate 210. Generally, longer and flatter contact fingers allow for better electrical contact. A secondary purpose of the contacts is to provide a lifting force to the substrate after plating, thereby releasing it from adhesion to the lip seal 414. Steeper angled contacts with stronger spring force can provide better lifting force, while flatter contacts are more likely to stick to the lip seal 412. Contact fingers, especially those providing strong lifting force, are a significant factor in wafer cracking / chipping for thin substrates such as active Si wafers.

[0047] The systems and methods described herein provide contact designs that form good electrical contact with a seed layer on a substrate, provide a strong lift force to prevent the wafer from sticking to the lip seal after plating, and prevent cracking or fractures in the substrate. The present disclosure relates to contacts that include interdigitated contact fingers and / or other features that address the aforementioned problems. In some examples, the interdigitated contact fingers include two or more types of contact fingers used to contact a single substrate.

[0048] 5A and 5B, a contact 500 is shown that includes multiple contact fingers. In FIG. 5A, contact 500 has an outer portion 510 and an inner portion 514 that extends radially inward from outer portion 510. Inner portion 514 includes contact fingers that project radially inward (examples are shown in FIGS. 5B, 5C, and 6A-6E). While inner portion 514 of contact 500 includes contact fingers, the contact fingers may also be located on outer portion 510. In FIG. 5B, contact fingers 530 extend radially inward the same distance.

[0049] 5C and 5D, the contact fingers have different lengths and are interleaved. The first contact fingers 540 extend inward further than the second contact fingers 550. In some examples, the first contact fingers 540 and second contact fingers 550 alternate. However, different patterns can be used. For example, F first contact fingers 540 may be interleaved with G second contact fingers, where F and G are integers greater than or equal to 1.

[0050] This interdigitated contact finger arrangement has several advantages: the second contact finger 550 makes physical contact with the carrier substrate rather than the substrate as normal, thereby minimizing the risk of cracking / chipping; the second contact finger 550 provides a lifting force, preventing the substrate from sticking to the lip seal.

[0051] In some examples, the second contact finger 550 has a length in the range of 0.2 mm to 1.0 mm (e.g., 0.4 mm). In some examples, the second contact finger 550 has a steeper angle than the first contact finger 540. In some examples, the angle of the second bend of the second contact finger 550 closest to the substrate is in the range of 45° to 135° (e.g., 105°).

[0052] In some examples, the second contact finger 550 is harder than the first contact finger 540. For example, the second contact finger 550 may use a material having a thickness in the range of 0.0035 inches to 0.007 inches (e.g., 0.004 inches). In some examples, the second contact finger 550 may make electrical contact with the seed layer if the seed layer extends beyond the substrate, as shown in FIG. 2B.

[0053] The first contact fingers 540 form electrical contact with the substrate. Typically, the longer the contact, the better the electrical contact. In some examples, the length is in the range of 0.6 mm to 4.2 mm (e.g., 1.3 mm). In some examples, the second bend of the first contact fingers 540 has a shallower angle in the range of 45° to 135° (e.g., 115°). In some examples, the first contact fingers 540 are made of a thinner material than the second contact fingers 550. In some examples, the thickness of the first contact fingers 540 is in the range of 0.001 inches to 0.0045 inches (e.g., 0.002 inches) to reduce cracking and chipping of thin wafers.

[0054] In some examples, the first contact finger 540 and the second contact finger 550 are made of a conductive material, such as stainless steel (SS), platinum-coated SS, Paliney™ 7, beryllium copper, and / or other alloys or metals.

[0055] The interdigitated contact fingers described herein allow for shallower, gentler electrical contact (using longer contact fingers) to minimize the risk of cracking, while also reducing the risk of sticking (using shorter contact fingers), as shown in FIG. 5D.

[0056] 6A-6E, another example of a contact including interdigitated contact fingers is shown. In FIG. 6A, contact 600 is shown including an outer portion 606 and an inner portion 602 including contact fingers 610, 614, 620, each having increasing lengths. Instead of two alternating types of contacts, contact 500 includes three or more radial lengths, circumferential widths, material thicknesses, and / or material types.

[0057] 6B, 6D, and 6E, a contact ring portion 630 is shown including an outer portion 606 and an inner portion 608 including P groups of contact fingers 634 arranged adjacent to one another and having the same first length. The contact ring portion 630 includes Q groups of contact fingers 638 arranged adjacent to one another and having the same second length, the first length being shorter than the second length. The P groups of contact fingers 634 are arranged adjacent to the Q groups of contact fingers 638. P and Q are integers greater than or equal to 1, and at least one of P or Q is greater than or equal to 1. In some examples, P and Q are less than or equal to 30, 20, 10, 8, 6, or 4. In some examples, P and Q are equal. In FIG. 6B, P=Q=6 in contact ring portion 630. In FIG. 6D, P=1 and Q=2 in contact ring finger 670. In FIG. 6E, P=1 and Q=3 in contact ring finger 680. Although specific examples are shown, other combinations are contemplated.

[0058] In FIG. 6C , the contact ring portion 640 includes a “U”-shaped cutout 652 that defines first and second contact fingers 650 and 654. Two or more of the second contact fingers 654 are connected and extend further than the first contact fingers 650. In some examples, two, three, four, or more of the second contact fingers 654 are connected to form a longer circumferential contact, thereby maximizing the contact area on the seed layer. In some examples, additional cutouts (not shown) may be created between selected second contact fingers 654 to separate the second contact fingers 654 into a desired number of connected second contact fingers 654. In other examples, all of the second contact fingers 654 remain connected. This design may be beneficial for thin and / or sparsely dispersed seed layers.

[0059] 7A-7D, overlapping contacts including interdigitated contact fingers are shown. In FIG. 7A, a first contact 710 includes an outer portion 712 and an inner portion 714. The first and second contacts 710 extend radially inward and are separated by spaces 718. The second contact 720 includes an outer portion 712 and an inner portion 714. The contact fingers 724 extend radially inward and are separated by spaces 728. As seen in FIG. 7C, the contact 710 is positioned overlapping the second contact 720, with the contact fingers 716 aligned with the spaces 728 and the contact fingers 724 aligned with the spaces 718. The overlapping contacts may remain separate components, stacked and secured together when assembled into a cup. Alternatively, the overlapping components may be permanently attached to each other using spot welding, adhesive, or other means.

[0060] In Figure 7D, contact fingers 724 provide electrical contact to the seed layer, and contact fingers 716 contact the carrier substrate to help break the seal after plating. Figures 7A-7C show one of the contact fingers 716 of the first contact 710 between each of the contact fingers 724 of the second contact 720. Another possible pattern is one in which groups of C contact fingers of the first contact ring are positioned immediately adjacent to one another and separated by spaces, and groups of D contact fingers of the second contact ring are positioned immediately adjacent to one another and separated by spaces, where C and D are integers greater than 1. In some examples, C = D. In other examples, C <> D, and the widths are variable. For example, C = 2 and D = 1, and the D contact fingers are twice as wide as the C contact fingers.

[0061] 8A-8D, variations in the shape of interdigitated contact fingers are shown. In FIG. 8A, contact finger 810 includes a first downward bend 812, a second upward bend 814, and a radially inner end 816. In FIG. 8B, contact finger 820 includes a first downward bend 822, a second upward bend 824, and a radially inner end 826. The ends of contact finger 820 are more rounded (compared to FIG. 8A) to reduce substrate damage due to digging into the substrate and / or subsequent cracking.

[0062] In Figure 8C, contact finger 830 includes a downward first bend 832, an upward second bend 834, a downward third bend 835, and a radially inner end 816. The third bend 835 provides a smooth contact surface that also reduces substrate damage due to digging into the substrate and / or subsequent cracking. In Figure 8D, contact finger 840 includes a downward first bend 842, an upward second bend 844, and a radially inner end 816. Varying the angle of the bends (particularly first bend 842) varies the load on the contact finger and the pressure on the substrate.

[0063] 9A-9C, the circumferential width of the interdigitated contact fingers can be varied to adjust the load on the contact fingers: a larger circumferential width results in a higher load, while a smaller width results in a lower load (assuming the same material and thickness) compared to the standard circumferential width.

[0064] 10A and 10B, the shape of the radially inner end of the contact finger can be varied. Contact finger 1020 includes a first bend 1022, a second bend 1024, and a radially inner end 1026. Radially inner end 1026 has a "V" shape. The "V" shaped bend increases the contact pressure on the substrate.

[0065] 11A-11C, the effect of different interdigitated contact finger geometries and the forces exerted on a substrate surface are shown. The location and angle of the contact finger's second bend can have a significant effect on the contact force. In FIG. 11A, a cup 1110 includes a bottom surface 1112 and a lip seal 1114. A contact finger 1120 is supported on the lip seal 1114 and includes a first bend 1122, a second bend 1124, and a radially inner end 1126. As can be seen, the contact finger 1120 functions as a spring with an effective length L1 from the second bend 1124 to the radially inner end 1126 of the contact finger 1120.

[0066] 11B, contact finger 1140 is supported on lip seal 1114 and includes a first bend 1142, a second bend 1144, and a radially inner end 1146. As can be seen, contact finger 1140 acts as a spring having an effective length L2 from second bend 1144 to radially inner end 1146 of contact finger 1140. As can be seen, the effective length of the spring varies the impact force on the substrate. More specifically, the position and angle of the second bend of the contact finger varies the contact force.

[0067] 11C, contact fingers 1150 are supported on lip seals 1152 of cups 1154. Contact fingers 1150 include first bends 1152, second bends 1154, and radially inner ends 1156. When contact fingers 1150 make electrical contact with a substrate, the flatter contacts / shallower angles of second bends 1154 reduce the force on the substrate, minimizing the likelihood of cracking. Flatter contacts require less pressure to secure the wafer, thereby reducing the tendency for the wafer to stick to the lip seal.

[0068] 12A-12C, the body of the contact may be a continuous annular ring or a group of arcuate segments that combine to form an annular ring. In other examples, the contact ring may be segmented into A segments, each spanning 360° / A, where A is an integer greater than or equal to 1. In FIG. 12B, A=2 and the contact ring segment spans 180°. In FIG. 12C, A=4 and the contact ring segment spans 90°. In other examples, A=3 and the contact ring segment spans 120°, A=5 and the contact ring segment spans 72°, etc.

[0069] 13A-14C, further configurations of contacts including stacked contact fingers are shown. In Figures 13A-13C, the shorter contact fingers 716 are fewer in number than the longer contact fingers 530 and are aligned with and stacked on top of only some of the longer contact fingers 530. In Figures 14A-14C, the shorter contact fingers 716 are equal in number to the longer contact fingers 530 and are aligned with and stacked on top of the longer contact fingers 530.

[0070] 13A-13C, FIG. 13A is similar to FIG. 7A, and FIG. 13B is similar to FIG. 5B. In FIG. 13A, a first contact 710 includes an outer portion 712 and an inner portion 714. Contact fingers 716 extend inward and are separated by spaces 718. In FIG. 13B, a second contact 500 includes an outer portion 510 and an inner portion 514 extending radially inward from the outer portion 510. The inner portion 514 includes contact fingers 530 protruding radially inward. The inner portion 514 of the second contact 500 includes contact fingers 530, although the contact fingers 530 may be located on the outer portion 510. The contact fingers 716 have a shorter length than the contact fingers 530. The contact fingers 716 and 530 have the same width. The number of contact fingers 716 is less than the number of contact fingers 530. For example, the ratio of the number of contact fingers 716 to the number of contact fingers 530 may be 1:2, 1:3, etc.

[0071] 13C, due to a 1:N ratio between contact fingers 716 and 530 (where N is an integer greater than 1), the shorter contact fingers 716 are aligned with and stacked on top of only a portion of the longer contact fingers 530. The first contact 710 is positioned overlying the second contact 500, with the contact fingers 716 aligned with and stacked on top of the longer contact fingers 530.

[0072] 14A-14C, FIG. 14A differs from FIG. 13A in that first contact 711 includes contact fingers 716 that are not separated by spaces 718. In all other respects, first contact 711 is similar to first contact 710. FIG. 14B is similar to FIG. 13B and will not be described again for brevity. The shorter contact fingers 716 are also shorter in length than the longer contact fingers 530. The contact fingers 716 and 530 also have the same width. However, the number of contact fingers 716 is equal to the number of contact fingers 530. That is, the ratio of the number of contact fingers 716 to the number of contact fingers 530 is 1:1.

[0073] 14C, shorter contact fingers 716 are aligned with and stacked on top of longer contact fingers 530, respectively. First contact 711 is positioned overlying second contact 500, with contact fingers 716 aligned with and stacked on top of longer contact fingers 530, respectively.

[0074] Figure 15 is similar to Figure 7D, except that contact fingers 530 provide electrical contact to seed layer 214 and contact fingers 716 contact carrier substrate 418 to help break the seal after plating. As described above with reference to Figure 7D, the overlapping contacts may remain separate components, stacked and fixed on top of each other when assembled into the cup. Alternatively, the overlapping components may be permanently attached to each other using spot welding, adhesive, or other means.

[0075] The foregoing description is merely exemplary in nature and is in no way intended to limit the disclosure, its application, or uses. The broad teachings of the present disclosure can be embodied in a variety of forms. Accordingly, while the present disclosure includes specific examples, the true scope of the present disclosure should not be limited to such examples, as other modifications will become apparent upon review of the drawings, the specification, and the following claims. It should be understood that one or more steps in a method may be performed in a different order (or simultaneously) without altering the principles of the present disclosure. Furthermore, although each embodiment is described above as having particular features, any one or more of these features described with respect to any embodiment of the present disclosure can be implemented in other embodiments and / or combined with any features of the other embodiments (even if such combination is not explicitly described). In other words, the described embodiments are not mutually exclusive, and substituting one or more embodiments for one another is within the scope of the present disclosure.

[0076] Spatial and functional relationships between elements (e.g., between modules, circuit elements, semiconductor layers, etc.) are described using various terms such as "coupled," "engaged," "coupled," "adjacent," "next to," "on top of," "above," "below," and "disposed." Also, in the above disclosure, when a relationship between a first element and a second element is described, unless expressly described as "direct," the relationship may be a direct relationship, with no other intervening elements present between the first and second elements. However, an indirect relationship, with one or more intervening elements (spatial or functional) present between the first and second elements, is also possible. As used herein, the phrase "at least one of A, B, and C" should be interpreted in the sense of a logical (A or B or C) using a non-exclusive logical OR, and not in the sense of "at least one of A, at least one of B, and at least one of C." The present disclosure may be realized in the following forms. [Form 1] 1. A contact for providing an electrical connection to a substrate in a substrate plating system, comprising: a body having an arcuate shape, the arcuate shape of the body configured to conform to the shape of at least a portion of a substrate disposed over a lip seal and cup of the substrate plating system; a plurality of first contact fingers extending a first distance from the body; a plurality of second contact fingers extending a second distance from the body; and Equipped with The first distance is greater than the second distance. [Form 2] The contact according to aspect 1, The contact, wherein the plurality of first contact fingers are configured to contact a seed layer disposed on a substrate bonded to a carrier substrate during a plating process. [Form 3] The contact according to aspect 2, The contact, wherein the plurality of second contact fingers are configured to contact the carrier substrate at locations outward from a radially outer edge of the substrate during a plating process. [Form 4] The contact according to aspect 1, A contact, wherein one of the plurality of first contact fingers alternates with one of the plurality of second contact fingers. [Form 5] The contact according to aspect 1, P of the plurality of first contact fingers are disposed immediately adjacent to one another, and Q of the plurality of second contact fingers are disposed immediately adjacent to one another; P and Q are integers greater than or equal to 1, contacts. [Form 6] The contact according to aspect 5, P and Q are greater than or equal to 1 and less than 20, contact. [Form 7] The contact according to aspect 5, P is greater than Q, contact. [Form 8] The contact according to aspect 5, Q is greater than P, contact. [Form 9] The contact according to aspect 1, The contact further comprises a plurality of third contact fingers extending a third distance different from the first distance and the second distance. [Form 10] The contact according to aspect 1, The contact further comprises a plurality of "U" shaped cutouts disposed between the plurality of first contact fingers and the plurality of second contact fingers. [Form 11] The contact according to aspect 10, A contact, wherein the plurality of first contact fingers are joined at their radially outer ends. [Form 12] The contact according to aspect 1, A contact, wherein a radially inner end of at least one of the plurality of first contact fingers has a "V" shaped profile. [Form 13] The contact according to aspect 1, the first distance is in the range of 0.6 mm to 4.2 mm; The second distance is in the range of 0.2 mm to 1.0 mm. [Form 14] The contact according to aspect 1, the first contact finger has a thickness in the range of 0.001 inches to 0.0045 inches; The second contact finger has a thickness in the range of 0.0035 inches to 0.007 inches. [Form 15] The contact according to aspect 1, The body of the contact is annular. [Form 16] The contact according to aspect 1, N bodies, The N pieces of the angle each span 360° / N, The N contacts are arranged consecutively around the outer periphery of the lip seal. [Form 17] 1. A contact for providing an electrical connection to a substrate in a substrate plating system, comprising: a first body having an arcuate shape, a plurality of first contact fingers extending a first distance from the first body; a plurality of first spaces disposed between selected ones of the plurality of first contact fingers; a first body including: a second body having an arcuate shape, a plurality of second contact fingers extending a second distance from the second body; a plurality of second spaces disposed between selected ones of the plurality of first contact fingers; and a second body including: the second distance is greater than the first distance; A contact, wherein the first body and the second body are configured to overlap the plurality of first contact fingers aligned with the plurality of second spaces and the plurality of second contact fingers aligned with the plurality of first spaces. [Form 18] The contact according to aspect 17, The contact, wherein the plurality of second contact fingers are configured to contact a seed layer of a substrate bonded to a carrier substrate. [Form 19] The contact according to aspect 18, The contact, wherein the plurality of first contact fingers are configured to contact the carrier substrate radially outward from the substrate. [Form 20] The contact according to aspect 17, The contact, wherein the plurality of first contact fingers are configured to contact a seed layer outward from a radially outer edge of the substrate.

Claims

1. 1. A contact for providing an electrical connection to a substrate in a substrate plating system, comprising: a body having an arcuate shape, the arcuate shape of the body configured to conform to the shape of at least a portion of the substrate disposed over a lip seal and cup of the substrate plating system; a plurality of first contact fingers extending a first distance from the body; a plurality of second contact fingers extending a second distance from the body; and Equipped with the first distance is greater than the second distance; the plurality of first contact fingers are configured to contact a seed layer disposed on a substrate bonded to a carrier substrate during a plating process; The contact, wherein the plurality of second contact fingers are configured to contact the carrier substrate at locations outward from a radially outer edge of the substrate during a plating process.

2. 2. The contact of claim 1, A contact, wherein one of the plurality of first contact fingers alternates with one of the plurality of second contact fingers.

3. 2. The contact of claim 1, P of the plurality of first contact fingers are disposed immediately adjacent to one another, and Q of the plurality of second contact fingers are disposed immediately adjacent to one another; P and Q are integers greater than or equal to 2. Contacts.

4. 4. The contact according to claim 3, P and Q are greater than or equal to 2 and less than 20, contact.

5. 4. The contact according to claim 3, P is greater than Q, contact.

6. 4. The contact according to claim 3, Q is greater than P, contact.

7. 2. The contact of claim 1, The contact further comprises a plurality of third contact fingers extending a third distance different from the first distance and the second distance.

8. A contact for providing an electrical connection to a substrate in a substrate plating system, comprising: a body having an arcuate shape, the arcuate shape of the body configured to conform to the shape of at least a portion of the substrate disposed over a lip seal and cup of the substrate plating system; a plurality of first contact fingers extending a first distance from the body; a plurality of second contact fingers extending a second distance from the body; and Equipped with the first distance is greater than the second distance; The contact further comprises a plurality of "U" shaped cutouts disposed between the plurality of first contact fingers and the plurality of second contact fingers.

9. 9. The contact of claim 8, The contact, wherein the first contact fingers are joined at their radially outer ends.

10. 2. The contact of claim 1, A contact, wherein a radially inner end of at least one of the plurality of first contact fingers has a "V" shaped profile.

11. 2. The contact of claim 1, the first distance is in the range of 0.6 mm to 4.2 mm; The contact, wherein the second distance is in the range of 0.2 mm to 1.0 mm.

12. 2. The contact of claim 1, the first contact finger has a thickness in the range of 0.001 inches to 0.0045 inches; The second contact finger has a thickness in the range of 0.0035 inches to 0.007 inches.

13. 2. The contact of claim 1, The body of the contact is annular.

14. 2. The contact of claim 1, N bodies, The N number of angles each spans 360° / N, The N contacts are arranged consecutively around the outer periphery of the lip seal.

15. A contact according to claim 1, The contact, wherein the plurality of first contact fingers have a different circumferential width than the second contact fingers.

16. 1. A contact for providing an electrical connection to a substrate in a substrate plating system, comprising: a first body having an arcuate shape and including a plurality of first contact fingers extending a first distance from the first body; a second body having an arcuate shape and including a plurality of second contact fingers extending a second distance from the second body; the second distance is greater than the first distance; The first body and the second body are configured to overlap such that the plurality of first contact fingers are aligned with the plurality of second contact fingers.

17. 17. The contact of claim 16, The contact, wherein the plurality of second contact fingers are configured to contact a seed layer of a substrate bonded to a carrier substrate.

18. 18. The contact of claim 17, The contact, wherein the plurality of first contact fingers are configured to contact the carrier substrate radially outward from the substrate.

19. 17. The contact of claim 16, The contact, wherein the first plurality of contact fingers are configured to contact a seed layer outward from a radially outer edge of the substrate.

20. The contact according to claim 16, The contact, wherein the first plurality of contact fingers has fewer contact fingers than the second plurality of contact fingers.

21. The contact according to claim 16, The contacts, wherein the contact fingers of the first plurality of contact fingers are spaced farther apart than the contact fingers of the second plurality of contact fingers.

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